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S680

Lenovo S680 schematic diagram and service manual

电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
4
3
2
1
重要信号线图例说明：
重要
Power line,
重要信号线，需做立体包地处理
D D
次重要信号线，做一般包地处理
差分阻抗信号，做阻抗控制并立体包地处理
射频阻抗信号，做阻抗控制并立体包地处理
C C
Mode[3:0]
0000
0001
Note:
MODE(3:0) pins have internal Pull Downs
P_Jtag = Primary JTAG port, A_Jtag = Auxilliary JTAG port
B B
线宽按要求加粗
ARM9 on P_Jtag; ARM CORTEX A5 on A_Jtag
ARM9 + ARM CORTEX A5 daisy chain on P_Jtag
Note1:
1) MIPI internal regulator is set to Switching mode by default. For LDO mode install 0 ohm instead of 2.2uH inductor
2) MIPI signals should be routed as differential pair of 100 ohm impedance.
VREG_S3
R0103
R0103 DNI
DNI
JTAG_TDI[29] JTAG_TMS[29] JTAG_TCK[29] JTAG_RTCK[29] JTAG_TRST_N[29] MSM_RESIN_N[1]
TP0101TP0101 TP0102TP0102 TP0103TP0103
L0101
L0101
2.2uH
2.2uH
WDOG_EN
MSM_USB_TCXO
1
MODE(3)
1
MODE(2)
1
MODE(1) MODE(0)
Note1
WDOG_EN[29]
SLEEP_CLK_MSM[9]
PMIC_TCXO[9]
VREG_S3
R0101 150KR0101 150K
C0101
C0101
2.2uF
2.2uF
AE7 AG7 AG5
AK30
AJ11
AN1 D22 AD8
AA3
AM8
AM10
AK10
AN11
AK20 AK18
AJ3 AJ5
U0101A
U0101A MSM7227A
MSM7227A
TDI
CONTROL
CONTROL
TMS TCK RTCK TRST RESIN
WDOG_EN SLP_CLK USBPHY_SYSCLK RSVD
TCXO
MODE_3 MODE_2 MODE_1 MODE_0
MIPI_CAL MIPI_LDO
LCD Interface
Front camera
Back camera
USBPHY_VBUS
TDO
USBPHY_REXT
RESOUT
MIPI_DSI_CLK_P MIPI_DSI_CLK_N
MIPI_DSI_LANE1_P MIPI_DSI_LANE1_N
MIPI_DSI_LANE2_P MIPI_DSI_LANE2_N
MIPI_CSI1_CLK_P MIPI_CSI1_CLK_N
MIPI_CSI1_LANE0_P MIPI_CSI1_LANE0_N
MIPI_CSI2_CLK_P MIPI_CSI2_CLK_N
MIPI_CSI2_LANE0_P MIPI_CSI2_LANE0_N
MIPI_CSI2_LANE1_P MIPI_CSI2_LANE1_N
C23 AJ7 C21 AL31
AM18 AN19
AT18 AR19
AR17 AP18
AM22 AN23
AR23 AP24
AM20 AN21
AT20 AR21
AP22 AT22
R0102 4.02KR0102 4.02K
CHG_VALID [9] JTAG_TDO [29]
MSM_RESOUT_N [11]
MIPI_DSI_CLK_P [15] MIPI_DSI_CLK_N [15]
MIPI_DSI_LANE1_P [15] MIPI_DSI_LANE1_N [15]
MIPI_DSI_LANE2_P [15] MIPI_DSI_LANE2_N [15]
MIPI_CSI1_CLK_P [16] MIPI_CSI1_CLK_N [16]
MIPI_CSI1_LANE0_P [16] MIPI_CSI1_LANE0_N [16]
MIPI_CSI2_CLK_P [16] MIPI_CSI2_CLK_N [16]
MIPI_CSI2_LANE0_P [16] MIPI_CSI2_LANE0_N [16]
MIPI_CSI2_LANE1_P [16] MIPI_CSI2_LANE1_N [16]
Note1(layout guideline):
1) 400 MHz clock rate; 800 Mbps/lane data rate;
2) Differential pairs, 100 ? nominal, ± 10%;
3) Total routing length < 305 mm;
4) Intra-pair length matching < 5 ps (0.67 mm);
5) Inter-pair length matching < 20 ps (2.6 mm) ;
6) Inter-pair coupling < 40 dB;
7) Lane-to-lane trace spacing = 2x line width;
8) Spacing to all other signals = 4x line width.
RESET
VREG_S3
R0104
R0104 10K
D0101
A A
5
PON_RESET_N[7]
JTAG_RESOUT_N[29]
4
D0101
RB520S-30CD
RB520S-30CD
D0102
D0102
RB520S-30CD
RB520S-30CD
10K
MSM_RESIN_N [1]
3
MIPI signals should be routed as differential pair of 100 ohm impedance.
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
2
Date: Sheet
Function:
Function:
Function:
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
of
of
of
134Tuesday, April 10, 2012
134Tuesday, April 10, 2012
134Tuesday, April 10, 2012
1
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
D D
PA_RAMP[22] PA_R0[20]
PA_ON_0[20]
TX_ON[23] TRK_LO[7]
C0201
C0201 1pF/DNI
PRX_I_M[23] PRX_I_P[23] PRX_Q_M[23] PRX_Q_P[23]
DRX_GPS_I_M[23]
C C
B B
DRX_GPS_I_P[23] DRX_GPS_Q_M[23] DRX_GPS_Q_P[23]
MIC1_M[17] MIC1_P[17] MIC2_M[14] MIC2_P[14]
C1868 100nfC1868 100nf
1pF/DNI
C0203
C0203 1pF/DNI
1pF/DNI
4
C1867 100nfC1867 100nf
U0101B MSM7227A
U0101B MSM7227A
U5
PA_PWR_CTL
V4
PA_PWR_CTL_M
P8
PA_RANGE0
R5
PA_ON0
R7
TX_ON
P2
TX_AGC_ADJ
AM6
TRK_LO_ADJ
J3
I_IM_CH0
J1
I_IP_CH0
H4
Q_IM_CH0
G3
Q_IP_CH0
K2
I_IM_CH1
L1
I_IP_CH1
K4
Q_IM_CH1
L3
Q_IP_CH1
C7
LINE_L_IN
C9
LINE_L_IP
A9
LINE_R_IN
B8
LINE_R_IP
E7
AUXIN
D6
AUXIP
A5
MIC1N
C5
MIC1P
B6
MIC2N
A7
MIC2P
D2
TS_LR
E3
TS_LL
E1
TS_UR
F2
TS_UL
ANALOG_RF
ANALOG_RF
3
GSM_BG_REF
DAC_IREF
I_OUT_N
I_OUT_P Q_OUT_N Q_OUT_P
USBPHY_DP USBPHY_DN
HPH_VREF
HPH_L
HPH_R
EAR1_ON EAR1_OP
LINE_ON
LINE_OP
AUXOUT
CCOMP
MIC_BIAS
USBPHY_ID
AA7
AC1
AE3 AF2 AE5 AF4
A21 B22
D14 C11 C13
B12 A13
E9 D8
E11 E5 B4 B20
C0202 100nfC0202 100nf
2
GSM_BANDGAP_REF [9]
TX_IREF [23,5]
TX_I_M [23] TX_I_P [23] TX_Q_M [23] TX_Q_P [23]
USB_HS_DP [17] USB_HS_DN [17]
HPH_L [14,9] HPH_R [14,9]
EAR1_M [14] EAR1_P [14]
LINE_O_RM [9] LINE_O_LP [9]
Note1: Place this cap near GND_A(pin B 10) External CODEC Decoupling CAP
MSM_MICBIAS [17] USB_HS_ID [17]
1
重要信号线图例说明：
重要
Power line,
线宽按要求加粗
重要信号线，需做立体包地处理
A A
次重要信号线，做一般包地处理
差分阻抗信号，做阻抗控制并立体包地处理
射频阻抗信号，做阻抗控制并立体包地处理
5
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
A4
A4
A4
Date: Sheet
Date: Sheet
Date: Sheet
4
3
<Doc> EVT
<Doc> EVT
<Doc> EVT
2
Function:
Function:
Function:
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
234Tuesday, April 10, 2012
234Tuesday, April 10, 2012
234Tuesday, April 10, 2012
of
of
of
1
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
EBI1_WE_N[11] EBI1_RAS_N[11] EBI1_CAS_N[11]
D D
C C
EBI1_A[13:0][11]
EBI1_CLK_EN1[11] EBI1_CLK_EN0[11] EBI1_DCLK_P[11] EBI1_DCLK_M[11]
EBI1_CS1_N[11] EBI1_CS0_N[11]
EBI1_DQS3[11] EBI1_DQS2[11] EBI1_DQS1[11] EBI1_DQS0[11]
EBI1_DQM3[11] EBI1_DQM2[11] EBI1_DQM1[11] EBI1_DQM0[11]
EBI1_BA1[11] EBI1_BA0[11]
EBI1_A14[11]
EBI1_A[13:0]
R0301
R0301
49.9
49.9
EBI1_A13 EBI1_A12 EBI1_A11 EBI1_A10 EBI1_A9 EBI1_A8 EBI1_A7 EBI1_A6 EBI1_A5 EBI1_A4 EBI1_A3 EBI1_A2 EBI1_A1 EBI1_A0
EBI1_CAL
AG29 AD32
AB30 AA29
W29 AB34 AE35 AF36
AB36
AB32
AJ35
AH30
AG33 AD34 AE29
AF30 AH36 AH34 AC29 AF34 AG35 AE33 AD30 AH32
AJ33
AF32
P36
H36 K36 T36 Y36
H30 P32 P34
Y30
4
U0101C
U0101C
EBI1_WE EBI1_RAS EBI1_CAS
EBI1_CS1 EBI1_CS0
EBI1_CKE1 EBI1_CKE0 EBI1_DCLK EBI1_DCLKB
EBI1_CAL
EBI1_DQS_3 EBI1_DQS_2 EBI1_DQS_1 EBI1_DQS_0
EBI1_DM_3 EBI1_DM_2 EBI1_DM_1 EBI1_DM_0
EBI1_BA_1 EBI1_BA_0
EBI1_ADR_14 EBI1_ADR_13 EBI1_ADR_12 EBI1_ADR_11 EBI1_ADR_10 EBI1_ADR_9 EBI1_ADR_8 EBI1_ADR_7 EBI1_ADR_6 EBI1_ADR_5 EBI1_ADR_4 EBI1_ADR_3 EBI1_ADR_2 EBI1_ADR_1 EBI1_ADR_0
MSM7227A
MSM7227A
EBI1
EBI1
EBI1_DQ_31 EBI1_DQ_30 EBI1_DQ_29 EBI1_DQ_28 EBI1_DQ_27 EBI1_DQ_26 EBI1_DQ_25 EBI1_DQ_24 EBI1_DQ_23 EBI1_DQ_22 EBI1_DQ_21 EBI1_DQ_20 EBI1_DQ_19 EBI1_DQ_18 EBI1_DQ_17 EBI1_DQ_16 EBI1_DQ_15 EBI1_DQ_14 EBI1_DQ_13 EBI1_DQ_12 EBI1_DQ_11 EBI1_DQ_10
EBI1_DQ_9 EBI1_DQ_8 EBI1_DQ_7 EBI1_DQ_6 EBI1_DQ_5 EBI1_DQ_4 EBI1_DQ_3 EBI1_DQ_2 EBI1_DQ_1 EBI1_DQ_0
J29 K30 K32 G35 H32 J33 J35 H34 L29 K34 M32 M30 M34 N33 N29 N35 R29 R35 T30 P30 T34 R33 V32 T32 V30 V34 U29 AA33 Y34 Y32 W35 AA35
EBI1_DATA31 EBI1_DATA30 EBI1_DATA29 EBI1_DATA28 EBI1_DATA27 EBI1_DATA26 EBI1_DATA25 EBI1_DATA24 EBI1_DATA23 EBI1_DATA22 EBI1_DATA21 EBI1_DATA20 EBI1_DATA19 EBI1_DATA18 EBI1_DATA17 EBI1_DATA16 EBI1_DATA15 EBI1_DATA14 EBI1_DATA13 EBI1_DATA12 EBI1_DATA11 EBI1_DATA10 EBI1_DATA9 EBI1_DATA8 EBI1_DATA7 EBI1_DATA6 EBI1_DATA5 EBI1_DATA4 EBI1_DATA3 EBI1_DATA2 EBI1_DATA1 EBI1_DATA0
3
EBI1_DATA[0:31]
EBI1_DATA[0:31] [11]
C35 D34
H28
C27
F32 B26
E27 A27 E29
2
U0101D
U0101D
EBI2_OE EBI2_WE EBI2_UB EBI2_LB
EBI2_WAIT
EBI2_CS2 EBI2_CS1 EBI2_CS0
EBI2_CLK
MSM7227A
MSM7227A
EBI2
EBI2
EBI2_ADV
EBI2_BUSY0
EBI2_A_D_15 EBI2_A_D_14 EBI2_A_D_13 EBI2_A_D_12 EBI2_A_D_11 EBI2_A_D_10
EBI2_A_D_9 EBI2_A_D_8 EBI2_A_D_7 EBI2_A_D_6 EBI2_A_D_5 EBI2_A_D_4 EBI2_A_D_3 EBI2_A_D_2 EBI2_A_D_1 EBI2_A_D_0
G29 A25
E33 G33 D36 A33 B34 C33 E31
MSM_UART2DM_RFR
B32
MSM_UART2DM_CTS B28 G27 D26 C29 D32 A31 H26 C31
1
1
TP0301TP0301
1
TP0302TP0302 MSM_UART2DM_RXD [29] MSM_UART2DM_TXD [29]
B B
EBI1 Layout Guideline:
1) Differential clock layout guidelines - EBI1_DCLK and EBI1_DCLKB
a. Use controlled impedance lines; b. Route the traces in parallel and close to each other; c. Traces must have nearly equal length; d. Both traces must be routed on the same layer;
2) DQ , DQS and data signal are divided into four data byte subclasses. Each data subclasses should be kept the trace-length matching
a. EBI1_DQS[3]/EBI1_DM[3] --> EBI_DQ[31:24] (data subclass 3); b. EBI1_DQS[2]/EBI1_DM[2] --> EBI_DQ[23:16] (data subclass 2); c. EBI1_DQS[1]/EBI1_DM[1] --> EBI_DQ[15:8] (data subclass 1); d. EBI1_DQS[0]/EBI1_DM[0] --> EBI_DQ[7:0] (data subclass 0)
重要信号线图例说明：
重要
Power line,
A A
重要信号线，需做立体包地处理
线宽按要求加粗
次重要信号线，做一般包地处理
差分阻抗信号，做阻抗控制并立体包地处理
射频阻抗信号，做阻抗控制并立体包地处理
5
4
3
2
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
334Tuesday, April 10, 2012
334Tuesday, April 10, 2012
334Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
D D
C0401
C0401 33pf/DNI
33pf/DNI R0407 0RR0407 0R R0408 0RR0408 0R
VREG_S3
R0403
R0403
2.2K
2.2K
C C
For Sensor
For CTP
B B
I2C1_SCL_SENSORS[12] I2C1_SDA_SENSORS[12]
I2C1_SCL[15,18,7] I2C1_SDA[15,18,7]
CAM_MCLK_5MP[16]
CAM_MCLK_0.3MP[16]
R0402 0RR0402 0R R0401 0RR0401 0R
R0404
R0404
2.2K
2.2K
CAM_5MP_SHDN_N[16]
CAP_TS_RESET_N[15]
4
Note: INT------detect an interrupt during MPM shutdown
U0101E
U0101E
PA_R1[20]
MSM_TCXO_EN[9]
PMIC_SSBI[7]
eMMC_D4[11]
UART3_TX
1
TP0406TP0406 TP0407TP0407
AUDIO_PA_EN_A[14] AUDIO_PA_EN_B[14]
CAM_0.3MP_PWDN[16]
TP0404TP0404 TP0403TP0403
CHIP_PWD_L[18]
LCD_RESET_N[15]
SUB_CAM_RESET_N[16]
TP0401TP0401 TP0402TP0402
CAM_5MP_RESET[16]
LCD_ID[15]
LED_GREEN_ENA[17]
ALS_INT_N[12]
eMMC_D7[11] eMMC_D6[11] eMMC_D5[11]
PM_INT_N[7]
PS_HOLD[7]
BAT_FUEL_LOW[7] LCD_BKLIT_CTRL[15]
ACCL_INT1[12]
KEPD_DRV0[17,29]
TP0408TP0408
1
1
1 1
1 1
CAM_MCLK
KEPD_DRV1
UART3_RX
UART1_RX UART1_TX
AG1 AG3 AB4
AP32 AN33 AT34
AT8 B14 C15 E15 B16
G15
D16 H14 B18 A15 C17 H12
AJ1 AH4 AH2
E17
H20
D18 G17
H16
A19
E13 G13
H22
C19
H18
E19 G19
E23
C25
D24 G25
E25 G23
AT32 AM16 AN17 AR15 AR33 AN35 AP36
AJ15 AN25 AM24 AR25
AJ25 AT26 AM26 AK26 AN27 AK24 AM28 AP26 AR27
MPM_GPIO_0 MPM_GPIO_1 MPM_GPIO_2
GPIO_107 GPIO_108 GPIO_109 GPIO_110 GPIO_111 GPIO_112 GPIO_113 GPIO_114 GPIO_115 GPIO_116 GPIO_117 GPIO_118 GPIO_119 GPIO_120 GPIO_121 GPIO_122 GPIO_123 GPIO_124 GPIO_125 GPIO_126 GPIO_127 GPIO_128 GPIO_129 GPIO_130 GPIO_131 GPIO_132
GPIO_4 GPIO_5 GPIO_6 GPIO_7 GPIO_8 GPIO_9 GPIO_10 GPIO_11 GPIO_12 GPIO_13 GPIO_14 GPIO_15 GPIO_16 GPIO_17 GPIO_18 GPIO_19 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_24 GPIO_25 GPIO_26 GPIO_27 GPIO_28 GPIO_29 GPIO_30 GPIO_31 GPIO_32 GPIO_33 GPIO_34
3
GPIO
GPIO
INT
INT Reserved
for LCDC
Reserved for LCDC
Reserved for LCDC
INT
INT
INT
2
AT28
GPIO_35
AK28
GPIO_36
AN29
GPIO_37
AJ27
GPIO_38 GPIO_39 GPIO_40 GPIO_41 GPIO_42 GPIO_43 GPIO_44 GPIO_45 GPIO_46 GPIO_47 GPIO_48 GPIO_49 GPIO_50 GPIO_51 GPIO_52 GPIO_53 GPIO_54 GPIO_55 GPIO_56 GPIO_57 GPIO_58 GPIO_59 GPIO_60 GPIO_61 GPIO_62 GPIO_63 GPIO_64 GPIO_65 GPIO_66 GPIO_67 GPIO_68 GPIO_69 GPIO_70 GPIO_71 GPIO_72 GPIO_73 GPIO_74 GPIO_75 GPIO_76 GPIO_77 GPIO_78 GPIO_79 GPIO_80 GPIO_81 GPIO_82 GPIO_83 GPIO_84 GPIO_85 GPIO_86 GPIO_87 GPIO_88 GPIO_89 GPIO_90 GPIO_91 GPIO_92 GPIO_93 GPIO_94 GPIO_95 GPIO_96 GPIO_97
AR31 AP30
KEYSENSE_N4 AJ29 AM30 AM2 AL3 AL5 AK8 R1 N3 N5 N7 AN3 AP2 AR3 AN5 AT4 AP4
MSM SSBI0 to SSBI1_RTR6500
U3
MSM SSBI1 to SSBI0_RTR6500
Y2
MSM SSBI2 to SSBI_RTR6285A
AC3 AA5 AB2 AR5 AP6 AT6 AN7 AR7 AP8 AA1 Y4 U1 W3 AP12 AJ13 AR11 AK14 AN13 AR13 AP14 AM12 AT12 AM14 AN15 AT14 T2 K8 R3
HS_DETECT_N P4
UIM2_MSM_DATA AK32 AM36 AL33 AM34 AM32 AL35
JAM_DET_INT
AP10 AN31
BOOT_SCUR AH28 AK12
1
INT
INT
INT
INT
INT
INT INT
INT
INT
INT
INT
1
TP0405TP0405
KEYSENSE_N0 [17,29] KEYSENSE_N1 [17,29] ACCL_INT2 [12] WAKE_ON_WIRELESS [18] TP0409TP0409 OVP_FLAG_N [7] SDC1_CARD_DET [13] MSM_UART1_RFR_N [18] MSM_UART1_CTS_N [18] MSM_UART1_RXD [18] MSM_UART1_TXD [18] UIM1_MSM_CLK [9] CAP_TS_INT_N [15]
UIM1_MSM_DATA [9] SDC1_CARD_D3 [13] SDC1_CARD_D2 [13] SDC1_CARD_D1 [13] SDC1_CARD_D0 [13] SDC1_CARD_CMD [13] SDC1_CARD_CLK [13]
SSBI_RTR6285A [23]
SDC2_CLK [18] SDC2_CMD [18] SDC2_D3 [18] SDC2_D2 [18] SDC2_D1 [18] SDC2_D0 [18] AUX_PCM_DOUT [18] AUX_PCM_DIN [18] AUX_PCM_SYNC [18] AUX_PCM_CLK [18] ANT_SEL3 [19] ANT_SEL2 [19] ANT_SEL1 [19] ANT_SEL0 [19]
GSM_PA_BAND [22] GSM_PA_EN [22,9] EXT_GPS_LNA_EN [25]
FM_RDS_INT [18] UIM2_MSM_CLK [9] BT_SYS_RESET_N [18] HS_DETECT_N [14] UIM2_MSM_DATA [9] eMMC_CLK [11] eMMC_CMD [11] eMMC_D3 [11] eMMC_D2 [11] eMMC_D1 [11] eMMC_D0 [11]
MDP_VSYNC_P [15]
VREG_S3
R0405
R0405
2.2K
2.2K
R0406
R0406
2.2K
2.2K
I2C0_SCL [16] I2C0_SDA [16]
1
For Camera
MSM7227A
MSM7227A
A A
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
5
4
3
2
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
434Tuesday, April 10, 2012
434Tuesday, April 10, 2012
434Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
4
3
2
1
VREG_L9_MSM_USBVREG_L14
C0504
C0504
C0508
C0508
470nF
470nF
470nF
470nF
VREG_L7
C0515
D D
C C
TX_IREF[2,23]
C0515 2200pF
2200pF
C0511
C0511 470nF
470nF
VREG_L7
VREG_L4
C0512
C0512 470nF
470nF
C0516
C0516 470nF
470nF
C0520
C0520 470nF
470nF
C0513
C0513 470nF
470nF
C0517
C0517 470nF
470nF
C0522
C0522 470nF
470nF
C0514
C0514 470nF/DNI
470nF/DNI
VREG_L3
VREG_L9_MSM_CSI
VREG_S3
VREG_L7
VREG_L2
C0518
C0518 470nF/DNI
470nF/DNI
VREG_L9_MSM_PLL4
C0521
C0521 470nF
470nF
VREG_L9_MSM_USB VREG_L14_MSM_USB
VREG_L7_MSM_A1
VREG_L3_MSM_DSI
VREG_L9_MSM_CSI1 VREG_L9_MSM_CSI2
R0506 0R/DNIR0506 0R/DNI R0501 100KR0501 100K
VREG_L7_MSM_TXDAC
VREG_L2_MSM_PADAC
VREG_L7_MSM_A2
C0519
C0519 470nF/DNI
470nF/DNI
VREG_L9_MSM_PLL4 VREG_L4_MSM_PLLX
C0523
C0523 470nF
470nF
C0561
C0561 470nF
470nF
C0510
C0510 470nF
470nF
C0509
C0509 470nF
470nF C0562
C0562 470nF
470nF
U0101F
U0101F
G21
VDD_USBPHY_1P8
E21
VDD_USBPHY_3P3
G11
VDD_A1
G9
VDD_A1
D10
VDD_A1
D4
VDD_A1
AK16
VDD_A2
AK22
VDD_A3
AJ21
VDD_A3
U7
VDD_EFUSE_PROG
AC5
VDD_A1
W5
VDD_A4
F4
VDD_A1
G5
VDD_A1
L5
VDD_A1
M4
VDD_A1
W9
VDD_A6
U13
VDD_A6
U11
VDD_A6
Y12
VDD_A6
AA9
VDD_A5
AA11
VDD_A6
MSM7227A
MSM7227A
PWR
PWR
VDD_P1 VDD_P1 VDD_P1 VDD_P1 VDD_P1 VDD_P1
VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2 VDD_P2
VDD_P3
VDD_P4 VDD_P4
VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2 VDD_C2
F34 L33 U33 W33 AC33 AK34
D20 D28 D30 T4 AD4 AK4 AN9 AP16 AP28 AP34
AM4
D12 F6
AC9 AC11 AC13 AF8 AF10 AF12 AF14 AG9 AG11 AG13 AG15
VREG_S3_MSM_P1
C0529
C0529 470nF
470nF
VREG_S3_MSM_P2
C0537
C0537 470nF
470nF
VREG_L12_MSM_P3
C0542
C0542 470nF
470nF
VREG_S3_MSM_P4
C0541
C0541 470nF
470nF
VREG_S2_MSM_C2
C0503
C0503 470nF
470nF
C0524
C0524
C0528
C0528
470nF
470nF
470nF
470nF
C0536
C0536
C0538
C0538
470nF
470nF
470nF
470nF
VREG_L12
VREG_S3
C0543
C0543 470nF
470nF
Line Width: 1mm
C0506
C0506
C0505
C0505
470nF
470nF
470nF
470nF
VREG_S3_MSM_P
C0525
C0525
C0526
C0526
470nF
470nF
470nF/DNI
470nF/DNI
C0539
C0539
C0540
C0540
470nF
470nF
470nF
470nF
VREG_S2_MSM_C2
R0502 0RR0502 0R
C0507
C0507
C0501
C0501
470nF
470nF
22uF
22uF
VREG_S3
R05040RR0504 0R
VREG_S3_MSM_P
VFB_S2_MSM_C2 [8]
Note1: Place this Resistor close to 22uF cap.
VREG_S1_MSM_C1
VREG_S1_MSM_C1
J9 K24 K26 L11 L13 L15 L17 L19 L21 L23 L25 L27
N9 N27 P12 P14 P16 P18 P20 P22 P24 P26 R11 R13 R15 R17 R19 R21 R23 R25 V14 V16
C0554
C0554 470nF
470nF
C0548
C0548 470nF
470nF
R0503 0RR0503 0R
C0552
C0552 470nF
470nF
C0547
C0547 470nF
470nF
VFB_S1_MSM_C1[8]
B B
C0502
C0502
C0550
C0550
C0551
C0551
C0553
22uF
22uF
470nF
470nF
C0545
C0545 470nF
470nF
A A
5
470nF
470nF
C0544
C0544 470nF
470nF
C0553 470nF
470nF
C0546
C0546 470nF
470nF
4
Line Width: 1mm
U0101G
U0101G
VDDCX_1
VDDCX_1
VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1
MSM7227A
MSM7227A
VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1 VDD_C1
3
V18 V20 V22 V24 V26 W15 W17 W19 W21 W23 W25 AB14 AB16 AB18 AB20 AB22 AB24 AB26 AC15 AC17 AC19 AC21 AC23 AC25 AF16 AF18 AF20 AF22 AF24 AF26 AH10 AJ9
VREG_S3
VREG_L9 VREG_L9_MSM_USB
VPH_PWR V_CDMA_PA
R05110RR0511 0R
R05070RR0507 0R R05090RR0509 0R R05100RR0510 0R
R05120RR0512 0R
VREG_MSMP
VREG_L9_MSM_CSI VREG_L9_MSM_PLL4
SUPPLY CONFIGURATION
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
2
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
534Tuesday, April 10, 2012
534Tuesday, April 10, 2012
534Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
D D
H10
GND_A
H8
GND_A
B10
GND_A
H2
GND_A
C3
GND_A
AC7
GND_A
W7
GND_A
M2
GND_A
V12
GND_A
AA13
GND_A
Y8
C C
B B
W13 W11
AB12
AJ17
AP20
AJ23 AJ19
AB8
B24
GND_A
V8
GND_A GND_A
U9
GND_A GND_A GND_A GND_A
GND_A
J7
GND_A
G7
GND_A
J5
GND_A
L7
GND_A GND_A
GND_A
GND_A GND_A
U0101H
U0101H
MSM7227A
MSM7227A
GND
GND
4
A1
GND
A3
GND
A11
GND
A17
GND
A23
GND
A29
GND
A35
GND
B2
GND
B30
GND
B36
GND
C1
GND
E35
GND
F36
GND
G1
GND
H24
GND
J11
GND
J13
GND
J15
GND
J17
GND
J19
GND
J21
GND
J23
GND
J25
GND
J27
GND
K28
GND
L9
GND
L35
GND
M8
GND
M12
GND
M14
GND
M16
GND
M18
GND
M20
GND
M22
GND
M24
GND
M26
GND
M28
GND
M36
GND
N1
GND
N11
GND
N13
GND
N15
GND
N17
GND
N19
GND
3
U0101IMSM7227A
U0101IMSM7227A
GND2
GND2
N21
GND
N23
GND
N25
GND
P28
GND
R9
GND
T8
GND
T12
GND
T14
GND
T16
GND
T18
GND
T20
GND
T22
GND
T24
GND
T26
GND
T28
GND
U15
GND
U17
GND
U19
GND
U21
GND
U23
GND
U25
GND
U35
GND
V2
GND
V28
GND
V36
GND
W1
GND
Y14
GND
Y16
GND
Y18
GND
Y20
GND
Y22
GND
Y24
GND
Y26
GND
Y28
GND
AA15
GND
AA17
GND
AA19
GND
AA21
GND
AA23
GND
AA25
GND
AB10
GND
AB28
GND
AC35
GND
AD2
GND
GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
AD10 AD12 AD14 AD16 AD18 AD20 AD22 AD24 AD26 AD28 AD36 AE1 AE9 AE11 AE13 AE15 AE17 AE19 AE21 AE23 AE25 AF28 AH8 AH12 AH14 AH16 AH18 AH20 AH22 AH24 AH26 AK2 AK36 AL1 AR1 AR9 AR29 AR35 AT2 AT10 AT16 AT24 AT30 AT36
2
1
A A
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
5
4
3
2
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
634Tuesday, April 10, 2012
634Tuesday, April 10, 2012
634Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
4
3
2
1
PM8029 INPUT POWER
USB_HS_VBUS_CONN
C0715
C0715 1uF
D D
1uF
VPH_PWR
VBATT
R0706
R0706 0R/DNI
0R/DNI
U0702
U0702
A2
OUT1A1IN1
B1
IN2A3OUT2
B2
IN3
C1
IN4B3OK
C3
ENC2GND
BD6041GUL-E2
BD6041GUL-E2
Line Width:2.0mm
C0704
C0704
4
7
22uF
22uF
5
Line Width:2.0mm
J0701
J0701
WKBAV028-A31P
C C
WKBAV028-A31P
4
1
4
2
5
3
5
667
7
1 2 3
12
+
+
C0703
C0703 22uF
22uF
Q0701
Q0701 FDMA905P
FDMA905P
1
268
C0701
C0701 33pF
33pF
3
R07080RR0708 0R
Line Width:1.0mm
VREG_S3
R0704
R0704 100K
100K
OVP_FLAG_N [4]
12
C0721
C0721
C0705
C0705
+
+
100nf
100nf
22uF/DNI
22uF/DNI
C0702
C0702 10nf
10nf
D0702
D0702
ESD5Z7V-2
ESD5Z7V-2
BAT0701
BAT0701
12
D0701
D0701
BATT_FET_N
C0710
C0710 100nF/DNI
100nF/DNI
EECEP0F333Y
EECEP0F333Y
VBATT_TEMP
ESD5Z7V-2
ESD5Z7V-2
C0714
C0714
4.7uF
4.7uF
VCOIN
R0703
R0703
9.09K
9.09K
R07090RR0709 0R
R0705
R0705 22K
22K
VREF_THERM
BATT_THERM
P16 R15
P12 R11
N11
N13
P14 R13 N15
C0707
C0707 100nF/DNI
100nF/DNI
U0701-1
U0701-1
INPUT_PWR
INPUT_PWR
VCHG VCHG
VPH_PWR VPH_PWR
BATFET_N
VBAT
VCOIN VREF_THERM BATT_THERM
PM8029
PM8029
GND_NCP
GND_S1 GND_S2 GND_S3 GND_S4
K19
A7 A15 E23 A21
R1
GND
A1
GND
A23
GND
F12
GND
G11
GND
G13
GND
H12
GND
Note1: CAD NOTE:The input and output cap ground of each switching regulator should be directly to these pins
需要单点接地
PM8029 CONTROL
JTAG_PS_HOLD[29]
PS_HOLD[4]
PHONE_ON_N[12]
PMIC_SSBI[4]
PMIC_SSBI
R0702
R0702 10K
10K
TP0701TP0701
R0712
R0712 0R/DNI
0R/DNI
1
TP0702TP0702
1
TP0703TP0703
TRK_LO_ADJ TRK_LO
VREG_S3
PON_RESET_N [1]
PM_INT_N [4]
TRK_LO_ADJ [26] TRK_LO [2]
U0701-2
U0701-2
CONTROL
CONTROL
K9
PS_HOLD
K13
CBLPWR_N
R0711
R0711 51K
51K
K11
KPDPWR_N
M10
RESIN_N
K15
OPTION1
C11
SBDT
1
PM8029
PM8029
VDD_MSM_IO
PON_RESET_N
PM_INT_N
PA_THERM
PM_TRK_LO
TRK_LO_ADJ
F4
H8
PON_RESET_N
H10
PM_INT_N
N17
M8 M6
R07140RR0714 0R
R07130RR0713 0R
C0712
C0712 33pf/DNI
33pf/DNI
C0708
C0708 100nf
100nf
C0713
C0713 3300F
3300F
Place close to PMIC
Fuel Gauge
B B
PCB DNI
VBATT
A A
A2 A3
C0706
C0706 100nF/DNI
100nF/DNI
A1 A4
Read address : 0x6D Write address: 0x6C
5
的库需要改
U0703
U0703 MAX17058X+T10/DNI
MAX17058X+T10/DNI
B4
CELL
ALRT
VDD
B1
SDA
B2
SCL
CTG
B3
GND
QSTRT
Slave Address:0x36
R0715 0R/DNIR0715 0R/DNI R0717 0R/DNIR0717 0R/DNI
VREG_S3
R0707
R0707 10K/DNI
10K/DNI
BAT_FUEL_LOW [4] I2C1_SDA [15,18,4]
I2C1_SCL [15,18,4]
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A2
<Doc> EVT
A2
<Doc> EVT
A2
Date: Sheet
Date: Sheet
4
3
2
Date: Sheet
Function:
Function:
Function:
Seoul
Seoul
Seoul
1
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy> 734Tuesday, April 10, 2012
734Tuesday, April 10, 2012
734Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
D D
Line Width: 1mm
VPH_PWR
C C
C0809
C0809
Note1
4.7uF
Note1: The input and output cap ground of each switching regulator should be directly connected to these pins A7, A15, E23, A21
Note2: This is wired for UMTS only. For Multi-mode support the resistor must be swapped
B B
VPH_PWR
VPH_PWR
VREG_S4_PMIC
VREG_S3
VPH_PWR
4.7uF
(GND_S1) (GND_S2) (GND_S3) (GND_S4)
R0801
R0801 0R/DNI
0R/DNI R08020RR0802
Note2
0R
4
Line Width: 0.6mm
Line Width: 0.6mm
Line Width: 0.3mm
Line Width: 0.3mm
C0806
C0806
C0810
C0810
10uf
10uf
4.7uF
4.7uF
C0803
C0803 100nf
100nf
C0835
C0835 100nf
100nf
C0836
C0836 100nf
100nf
C0811
C0811
4.7uF
4.7uF
C0828
C0828 100nf
100nf
C0808 100nfC0808 100nf
C0805
C0805
4.7uF
4.7uF
C0802
C0802
1uF
1uF
C0837
C0837 100nf
100nf
U0701-3
U0701-3
G5
REF_BYP
K5
REF_GND
A11
VDD_S1
B12
VDD_S1
A19
VDD_S2
G23
VDD_S3
C23
VDD_S4
H22
VDD_L7_NCP
C0804
C0804 100nf
100nf
A13
VDD_SMPS
D22
VDD_L1_L2
D4
VDD_L3_L4_L5_L6
D2
VDD_L3_L4_L5_L6
P8
VDD_L8_L9_L10_L11
R7
VDD_L8_L9_L10_L11
H2
VDD_L12_L13_L14_L15_16
H4
VDD_L12_L13_L14_L15_16
A5
VDD_L17_L18_L19
PM8029
PM8029
VREG
VREG
VSW_S1 VSW_S1
VREG_S1
VSW_S2 VSW_S2
VREG_S2
VSW_S3 VSW_S3
VREG_S3
VSW_S4
VREG_S4
NCP_CTC1 NCP_CTC2
VREG_NCP
NCP_FB
VREG_L7
VREG_L1 VREG_L2
VREG_L3 VREG_L4 VREG_L5 VREG_L6
VREG_L8
VREG_L9 VREG_L10 VREG_L11
VREG_L12 VREG_L13 VREG_L14 VREG_L15 VREG_L16
VREG_L17 VREG_L18 VREG_L19
3
L0801
L0801
Line Width: 1mm
2.2uH
2.2uH R0803
R0803 0R/DNI
0R/DNI
L0802
L0802
Line Width: 1mm
2.2uH
A9 B8 B10 A17 B16 B18 F22 F20 G21 B22 B20
K21
C0814 2.2ufC0814 2.2uf
H20 G19
M18
C0813 2.2ufC0813 2.2uf
K23
C21 D20
C1 C3 E3 B2
R5 P6 P10 R9
N1 K1 G3 M2 G1
A3 B4 B6
C0815 1uFC0815 1uF
C0816 1uFC0816 1uF
2.2uH R0804
R0804 0R/DNI
0R/DNI
L0803
L0803
Line Width: 0.3mm
2.2uH
2.2uH
L0804
L0804
2.2uH
2.2uH
C0812
C0812 1uF
1uF
(2.1V 300mA)
C0821 1uFC0821 1uF
C0824 1uFC0824 1uF
C0822 1uFC0822 1uF
C0818 2.2uFC0818 2.2uF
C0817 2.2uFC0817 2.2uF
C0820 1uFC0820 1uF
C0819 2.2uFC0819 2.2uF
C0826 1uFC0826 1uF
C0823 1uFC0823 1uF
C0825 1uFC0825 1uF
C0838
C0838 22uF
22uF
C0807
C0807 22uF
22uF
C0834
C0834 22uF
22uF
2.1V /800mA
C0833
C0833 22uF
22uF
C0827 1uFC0827 1uF
R0806 0RR0806 0R
R0807 0R/DNIR0807 0R/DNI R0808 0RR0808 0R
C0829 1uFC0829 1uF
C0801 1uFC0801 1uF
Processor core1
Processor core2 1.1V /1.2A
Digital pads and EBI
Line Width: 0.3mm
R0810 0RR0810 0R
C0830 1uFC0830 1uF
R08050RR0805 0R
VREG_L7
C0831 1uFC0831 1uF
C0832 1uFC0832 1uF
1.1V /1.2A
1.8V /800mA
RF SMPS DIRECT 146mA
RF SUBREGULATION 422mA
(2.6V 300mA)
(RFRX_1_BACKUP 248mA)
R0812 0R/DNIR0812 0R/DNI
(1.2V, 150mA) MIPI DSI (1.1V, 150mA) Digital PLL
(1.3V, 150mA) (1.2V, 150mA)
(2.85V, 50mA) (1.8V, 150mA) (3.0V, 150mA) (1.8V, 50mA)
(2.85V, 300mA) (2.85V, 300mA) (3.075V, 150mA) (1.8V/2.85V, 150mA) (1.8V/2.85V, 150mA)
(3.0V, 300mA) (2.7V, 150mA) (1.2V, 150mA)
R0811 0RR0811 0R
2
VREG_S1_MSM_C1
VFB_S1_MSM_C1 [5] VREG_S2_MSM_C2
VFB_S2_MSM_C2 [5] VREG_S3
VREG_S4_RF
VREG_S4_PMIC
VREG_L7
VREG_RFRX_1_BACKUP VREG_L2
1
TP0801TP0801 VREG_RFRX_1 VREG_S4_RF
VREG_L3 VREG_L4 VREG_L5
VREG_L8_TCXO VREG_L9 VREG_L10
For Bluetooth For RF Analog For WLAN
Need special PDN care
Need special PDN care
On Port
R0812
R0807 R0808
VREG_L6
VREG_L11
VREG_L12 VREG_L13 VREG_L14 VREG_L15_UIM2 VREG_L16_UIM1
VREG_L17 VREG_L18 VREG_L19
VREG_RF2V7
UG34 UCG124
0ohm
DNI
1
DNI
0ohm
A A
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A2
<Doc> EVT
A2
<Doc> EVT
A2
Date: Sheet
Date: Sheet
5
4
3
2
Date: Sheet
Function:
Function:
Function:
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
of
of
of
834Tuesday, April 10, 2012
834Tuesday, April 10, 2012
1
834Tuesday, April 10, 2012
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
4
3
2
1
PM8029 CLOCK
U0701-4
U0701-4
C0906
C0906 1uF
1uF
P2
TCXO_IN
R3
GND_XTAL19M_OUT
F2
XTAL_32K_IN
E1
XTAL_32K_OUT
H6
GND_XOADC
PM8029
PM8029
U0701-5
U0701-5
E13
MPP1
D14
MPP2
E15
MPP3
D16
MPP4
C15
MPP5
C17
MPP6
C19
MPP7
D18
MPP8(XO_THERM)
M14
HSED_BIAS1
M16
HSED_BIAS2
R17
LED_ATC
E19
EXT_IN_LP
E21
EXT_IN_RM
F14
HPA_IN_LP
H14
HPA_IN_RM
F16
HPA_GNDREF
N23
VDDANA_SPKR
M20
VDDIN_SPKR
M22
VDDIN_SPKR
R21
GND_SPKR
R23
GND_SPKR
P18
SPKR_IN_M
N19
SPKR_IN_P
PM8029
PM8029
TCXO_A0_EN
TCXO_OUT_A0
TCXO_D0_EN
TCXO_OUT_D0
TCXO_D1_EN
TCXO_OUT_D1
SLEEP_CLK0
D D
C C
TCXO[26]
Y0701
Y0701
1 2
Q13FC1350000400
Q13FC1350000400
C0911
C0911 10pF/DNI
10pF/DNI
PMIC_XTAL32K_IN PMIC_XTAL32K_OUT
C0912
C0912 10pF/DNI
10pF/DNI
PM8029 GPIOS AND MPPS
UIM1_MSM_DATA[4] UIM1_DATA[13,29] UIM2_MSM_DATA[4] UIM2_DATA[13,29] MB_IN[14]
GSM_BANDGAP_REF[2]
HSED_BIAS1[14]
B B
LINE_IN_L_P[18] LINE_IN_R_P[18]
LINE_O_LP[2] LINE_O_RM[2]
Note1: Route back to MSM GND_A(pin B10)
VPH_PWR
A A
5
R09050RR0905 0R
HPH_L[14,2] HPH_R[14,2]
R0901 0RR0901 0R
C0903
C0903 100nf
100nf
C0909 1uFC0909 1uF C0910 1uFC0910 1uF
C0907 1uFC0907 1uF C0908 1uFC0908 1uF
R09030RR0903 0R
R0904
R0904 0R/DNI
0R/DNI
VPH_PWR_VDDIN_SPKR
C0901 10nf/DNIC0901 10nf/DNI C0902 10nf/DNIC0902 10nf/DNI
LED_RED_EN[17] LED_BLUE_EN[17]
4
GSM_BANDGAP_REF_IN
HPH_EXT_IN_IP HPH_EXT_IN_RM
HPH_IN_LP HPH_IN_RM
HPA_GNDREF
C0905
C0905
4.7uF
4.7uF
SPKR_IN_M SPKR_IN_P
GND_TCXO
GPIO_10 GPIO_11
VIB_DRV_N
GND_DRV
HPA_CM_SNS
HPA_OUT_L
HPA_OUT_R
SPKR_BYP_M SPKR_BYP_P
SPKR_OUT_M
SPKR_OUT_P
3
GPIO1 GPI_O2 GPI_O3
GPIO4 GPIO_5 GPI_O6 GPIO_7 GPIO_8 GPIO_9
N3 M4
K3 N9
N5 N7
E5
P4
PMIC_TCXO_ST
R0909 0RR0909 0R R0910 0RR0910 0R
D6 E9 C9 C7 E11 D10 F6 F8 F10 C5 D8
B14 C13
H16
H18 F18
P20 N21
R19 P22
R0908 0RR0908 0R
BT_CLK_REQ [18] SYS_CLK [18]
C0913
C0913 33pf/DNI
33pf/DNI
SLEEP_CLK_BT_WLAN_1 SLEEP_CLK_BT_WLAN_2
R0911 0R/DNIR0911 0R/DNI R0912 0R/DNIR0912 0R/DNI
L0901
L0901
1nH/DNI
1nH/DNI
SLEEP_CLK_MSM
LED_GREEN_ENB [17] CHG_VALID [1] UIM1_MSM_CLK [4] UIM1_CLK [13,29] UIM2_MSM_CLK [4] UIM2_CLK [13,29] UIM1_RESET [13,29] UIM2_RESET [13,29]
GSM_PA_EN [22,4]
VIB_DRV_N [17]
HPA_CM_SNS [14]
PMIC_HPH_L [14] PMIC_HPH_R [14]
SPKR_OUT_M [14,17] SPKR_OUT_P [14,17]
2
C0904
C0904 22pF/DNI
22pF/DNI
WLAN_CLK_PWR_REQ [18] TCXO_A0 [18]
MSM_TCXO_EN [4] PMIC_TCXO [1]
SLEEP_CLK_MSM [1] SLEEP_CLK_BT_WLAN [18,9]
R0906 0R/DNIR0906 0R/DNI R0907 0R/DNIR0907 0R/DNI
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
Date: Sheet
SLEEP_CLK_BT_WLAN [18,9]
Function:
Function:
Function:
Seoul
Seoul
Seoul
1
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
934Tuesday, April 10, 2012
934Tuesday, April 10, 2012
934Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
D D
C C
4
3
2
1
B B
A A
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
5
4
3
2
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
10 34Tuesday, April 10, 2012
10 34Tuesday, April 10, 2012
10 34Tuesday, April 10, 2012
of
of
of
电子工程师俱乐部-10万份高端产品PCB文件和原理图共享 手机原理图更新最快的网站-不断更新。。。 www.dianzi168.net
5
4
3
2
1
VCCQ is used for the controller and the e-MMC interface voltage.
U1101B
VREG_S3
D D
C C
VREG_S3_EMMC
VREG_S3
VREG_S3_LPDDR1
C1112
C1112 10uf
10uf
R11010RR1101 0R
R11030RR1103 0R
VREG_S3_EMMC
C1107
C1107 10uf
10uf
VREG_S3_LPDDR1
C1109
C1109 10uf
10uf
C1111
C1111 470nF
470nF
Line Width: 0.25mm
C1106
C1106
C1105
C1105
470nF
470nF
470nF
470nF
Line Width: 0.25mm
C1110
C1110
C1108
C1108
470nF
470nF
470nF
470nF
Line Width: 0.25mm
C1114
C1114
C1113
C1113
470nF
470nF
470nF
470nF
C1115
C1115 470nF
470nF
U1101B H9DP32A4JJMCGR-KEM
H9DP32A4JJMCGR-KEM
N4
VCCQ_0
C6
VCCQ_1
M4
VCCQ_2
P5
VCCQ_3
P3
VCCQ_4
F1
VDD_0
P11
VDD_1
A11
VDD_2
M2
VDD_3
G14
VDD_4
A8
VDDQ_0
B13
VDDQ_1
C14
VDDQ_2
G13
VDDQ_3
H1
VDDQ_4
N13
VDDQ_5
H13
VDDQ_6
M14
VDDQ_7
P8
VDDQ_8
F14
VSSQd_8
P9
VSSQd_7
P12
VSSQd_6
A9
VSSQd_5
A12
VSSQd_4
L14
VSSQd_3
N6
VSSQd_2
J14
VSSQd_1
D14
VSSQd_0
G5
VSSm_8
P4
VSSm_7
P6
VSSm_6
E7
VSSm_5
N5
VSSm_4
N2
VSSm_3
C4
VSSm_2
K8
VSSm_1
H10
VSSm_0
1.7~1.95V
1.7~1.95V
1.7~1.95V
1.7~1.95V
1.7~1.95V
1.7~1.95V
eMMC
eMMC
2.7~3.6V2.7~3.6V
2.7~3.6V2.7~3.6V
TQ(KMS_for_NC)
VCC is used for the NAND flash
Line Width: 0.25mm
J10
VCC_3
K9
VCC_2
E6
VCC_1
F5
VCC_0
C2
VDDI
A2
NC_0
A6
NC_1
A7
NC_2
A13
NC_3
B1
NC_4
B14
NC_5
C5
NC_6
E5
NC_7
E8
NC_8
E9
NC_9
E10
NC_10
F10
NC_11
G3
NC_12
G10
NC_13
H5
NC_14
J5
NC_15
K6
NC_16
K7
NC_17
K10
NC_18
N1
NC_19
N14
NC_20
P2
NC_21
P7
NC_22
P10
NC_23
P13
NC_24
P1
DNU_0
A14
DNU_1
A1
DNU_2
P14
DNU_3
D4
temprature sensor output
A10
VSSd_0
C1
VSSd_1
M1
VSSd_2
K2
VSSd_3
H14
VSSd_4
C1116
C1116 1uf
1uf
C1102
C1102 470nF
470nF
VREG_L10_EMMC VREG_L10
C1103
C1103
C1104
C1104
470nF
470nF
470nF
470nF
EBI1_A14 [3]
TP1101TP1101
1
C1101
C1101 10uf
10uf
R11020RR1102 0R
U1101A
R1105
R1105
R1104
R1104
51K/DNI
51K/DNI
51K/DNI
eMMC_D[7:0][4]
B B
A A
5
eMMC_D0 eMMC_D1 eMMC_D2 eMMC_D3 eMMC_D4 eMMC_D5 eMMC_D6 eMMC_D7
51K/DNI
eMMC_CMD[4] eMMC_CLK[4] MSM_RESOUT_N[1]
R1106
R1106 51K/DNI
51K/DNI
EBI1_A[13:0][3]
R1107
R1107 51K/DNI
51K/DNI
R1109
R1109
R1108
R1108
51K/DNI
51K/DNI
51K/DNI
51K/DNI
eMMC_CMD eMMC_CLK
MSM_RESOUT_N
EBI1_A[13:0]
EBI1_DCLK_P[3] EBI1_DCLK_M[3]
EBI1_CS0_N[3]
EBI1_CS1_N[3] EBI1_CLK_EN0[3] EBI1_CLK_EN1[3]
EBI1_RAS_N[3]
EBI1_CAS_N[3]
EBI1_BA0[3] EBI1_BA1[3]
EBI1_WE_N[3]
4
R1111
R1111
R1110
R1110
51K/DNI
51K/DNI
51K/DNI
51K/DNI
R1114 27RR1114 27R R1113 0RR1113 0R
EBI1_A0 EBI1_A1 EBI1_A2 EBI1_A3 EBI1_A4 EBI1_A5 EBI1_A6 EBI1_A7 EBI1_A8 EBI1_A9 EBI1_A10 EBI1_A11 EBI1_A12 EBI1_A13
EBI1_DCLK_P EBI1_DCLK_M EBI1_CS0_N EBI1_CS1_N EBI1_CLK_EN0 EBI1_CLK_EN1 EBI1_RAS_N EBI1_CAS_N EBI1_BA0 EBI1_BA1 EBI1_WE_N
U1101A
R1112
R1112
H9DP32A4JJMCGR-KEM
H9DP32A4JJMCGR-KEM
5.1K
5.1K A3
I/O0
A4
I/O1
A5
I/O2
B2
I/O3
B3
I/O4
B4
I/O5
B5
I/O6
B6
I/O7
M5
CMD
M6
CLK_eMMC
K5
RST_n
L2
A0
L3
A1
M3
A2
N3
A3
C3
A4
D1
A5
D2
A6
D3
A7
E3
A8
F3
A9
K3
A10
E2
A11
E1
A12
F2
A13
G12
CLK
H12
CLK_n
G2
CS0_n
J3
CS1_n
G1
CKE0
J1
CKE1
H2
RAS_n
J2
CAS_n
L1
BA0
K1
BA1
H3
WE_n
eMMC
eMMC
DDR
DDR
DQ31 DQ30 DQ29 DQ28 DQ27 DQ26 DQ25 DQ24 DQ23 DQ22 DQ21 DQ20 DQ19 DQ18 DQ17 DQ16 DQ15 DQ14 DQ13 DQ12 DQ11 DQ10
DQS0 DQS1 DQS2 DQS3
3
DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
DM0 DM1 DM2 DM3
C7 B7 C8 B8 C9 B9 C10 B10 B12 C12 C13 D13 D12 E12 E13 E14 K14 K13 K12 L13 L12 M13 M12 N12 M10 N10 M9 N9 M8 N8 M7 N7
M11 J13 F13 C11 N11 J12 F12 B11
EBI1_DATA31 EBI1_DATA30 EBI1_DATA29 EBI1_DATA28 EBI1_DATA27 EBI1_DATA26 EBI1_DATA25 EBI1_DATA24 EBI1_DATA23 EBI1_DATA22 EBI1_DATA21 EBI1_DATA20 EBI1_DATA19 EBI1_DATA18 EBI1_DATA17 EBI1_DATA16 EBI1_DATA15 EBI1_DATA14 EBI1_DATA13 EBI1_DATA12 EBI1_DATA11 EBI1_DATA10 EBI1_DATA9 EBI1_DATA8 EBI1_DATA7 EBI1_DATA6 EBI1_DATA5 EBI1_DATA4 EBI1_DATA3 EBI1_DATA2 EBI1_DATA1 EBI1_DATA0
EBI1_DATA[0:31] [3]
EBI1_DQM0 [3] EBI1_DQM1 [3] EBI1_DQM2 [3] EBI1_DQM3 [3] EBI1_DQS0 [3] EBI1_DQS1 [3] EBI1_DQS2 [3] EBI1_DQS3 [3]
MIDH, Lenovo Group
MIDH, Lenovo Group
MIDH, Lenovo Group Smart Phone BU
Smart Phone BU
Smart Phone BU Hardware developemt
Hardware developemt
Hardware developemt
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
<Doc> EVT
A3
<Doc> EVT
A3
<Doc> EVT
A3
Date: Sheet
Date: Sheet
2
Date: Sheet
Function:
Function:
Function:
1
Seoul
Seoul
Seoul
Modified by:
Modified by:
Modified by:
<ModifiedBy>
<ModifiedBy>
<ModifiedBy>
11 34Tuesday, April 10, 2012
11 34Tuesday, April 10, 2012
11 34Tuesday, April 10, 2012
of
of
of
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