Kontron COMe Ref T6 User Manual

COMe Reference Carrier Type 6

Document Revision 1.0

If it‟s embedded, it‟s Kontron.

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» Table of Contents «

1 User Information ............................................................................ 1

1.1 About This Document ............................................................................................................... 1

1.2 Copyright Notice ..................................................................................................................... 1

1.3 Trademarks ............................................................................................................................ 1

1.4 Standards .............................................................................................................................. 1

1.5 Warranty ............................................................................................................................... 2

1.6 Technical Support ................................................................................................................... 2

2 Introduction ................................................................................. 3

3 Specification ................................................................................. 4

3.1 Functional Specification ........................................................................................................... 4

3.2 Block Diagram ........................................................................................................................ 5

3.3 Mechanical Specification .......................................................................................................... 6

3.4 Electrical Specification ............................................................................................................. 7

3.5 Environmental Specification ...................................................................................................... 7

3.6 MTBF .................................................................................................................................... 7

4 Connector Layout ........................................................................... 9

4.1 Rear Panel ............................................................................................................................. 9

4.2 Connector Locations .............................................................................................................. 10

4.3 Component overview .............................................................................................................. 12

5 Connectors and Features ................................................................. 14

5.1 Power Supply ....................................................................................................................... 14

5.1.1 ATX Connector and Behavior Control ........................................................................................ 14

5.1.2 Power- and Resetbutton ........................................................................................................ 15

5.1.3 LID# and SLEEP# Header ........................................................................................................ 16

5.2 COM Express® Connector ........................................................................................................ 17

5.3 Status LEDs .......................................................................................................................... 18

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5.4 Serial ATA ............................................................................................................................ 19

5.5 eSATA ................................................................................................................................. 20

5.6 GPIO ................................................................................................................................... 21

5.7 High Definition Audio ............................................................................................................ 22

5.8 Ethernet .............................................................................................................................. 24

5.9 USB .................................................................................................................................... 25

5.10 Mini PCI express .................................................................................................................... 26

5.11 SIM Card.............................................................................................................................. 27

5.12 Kontron Feature Connector ..................................................................................................... 28

5.13 DVI-I, HDMI and Displayport .................................................................................................... 29

5.14 Serial Interface ..................................................................................................................... 30

5.15 FAN .................................................................................................................................... 31

5.16 SMART Battery ...................................................................................................................... 32

5.16.1 Introduction ....................................................................................................................... 32

5.16.2 Possible Smart Batteries ........................................................................................................ 32

5.16.3 Smart Battery System Manager................................................................................................ 32

5.16.4 Smart Battery Connector ....................................................................................................... 33

6 Battery Information ....................................................................... 34

7 Module Single Supply and Wide Range................................................ 36

8 Security Advice ............................................................................. 37

9 Document Revision History .............................................................. 38

COMe Reference Carrier Type 6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Embedded Modules GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Embedded Modules GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp. » Microsoft is a registered trademark of Microsoft Corp. » Intel is a registered trademark of Intel Corp. » All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Embedded Modules GmbH is certified to ISO 9000 standards.

COMe Reference Carrier Type 6 / User Information

1.5 Warranty

This Kontron Embedded Modules GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Embedded Modules GmbH will at its discretion decide to repair or replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,

unauthorized modification or misuse, operation outside of the product‟s environmental specifications or improper

installation or maintenance.

Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe Reference Carrier Type 6 / Introduction

Article

Part-No.

Description

COMe Ref. Carrier T6

38114-0000-00-0

COM Express® Reference Carrier Type 6

2 Introduction

The COMe Reference Carrier Type 6 for Type 6 modules is designed to allow embedded application developers to get up and running quickly on the COM Express® basic platform, giving them a head start on the total system design. Simply select a Type 6 CPU module, then Plug & Go. The COMe Reference Carrier Type 6 is an evaluation backplane for COM Express® Computer-on-Modules following the PICMG COM.0 specification Rev 1.0 or Rev 2.0 with pin-out Type 10.

Ordering Information

COMe Reference Carrier Type 6 / Specification

3 Specification

3.1 Functional Specification

» COM Express® COM.0 Rev 2.0 baseboard compatible to Type 6 pin-out based modules » ATX supply / single supply use » DVI/CRT on DVI-I » Display Port (++) connector » HDMI connector » LVDS » HD audio available on frontpanel, rear panel, S/PDIF » Legacy free (no Super I/O) » PCIe x4 slot (lanes 1-4) » Express Card (lane 5) » mPCIe slot (lane 6) » SPI flash socket » feature connector (I2C, SMB) » POST Code (Port 80h/81h) » Gigabit Ethernet » 3 SATA » eSATA on rear panel » GPIO pin header » 6 USB ports (2x USB 3.0) » SIM Card slot for mPCIe » Serial port connections for module COMs according to COM Express® spec » LID#/SLEEP# pin header » 4 pin FAN header » SMART Battery support for 2 independent batteries

COMe Reference Carrier Type 6 / Specification

3.2 Block Diagram

COMe Reference Carrier Type 6 / Specification

3.3 Mechanical Specification

» Size: mini ITX (170mm x 170mm) » max height on top: 36 mm (rear panel audio connector)

COMe Reference Carrier Type 6 / Specification

3.4 Electrical Specification

Supply Voltage

8,5V – 18V

Power Supply Rise time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms. » There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

Supply Voltage Ripple

» Maximum 100 mV peak to peak 0-20MHz

Maximum Current

The maximum current on the COMe Ref. Carrier T6 inclusive the module and all other connector consumers must not exceed 16A. That leads to a maximum power of 136W at 8.5V input voltage and 288W at 18V input voltage.

3.5 Environmental Specification

Ambient temperature

» Operating: 0°C to +60 °C » Non-operating: -20 to +75 °C

Humidity

» Operating: 10% to 90% (non condensing) » Non operating: 5% to 95% (non condensing)

3.6 MTBF

The following MTBF (Mean Time Between Failures) values were calculated using a combination of manufacturer‟s test data, if the data was available, and a Bellcore calculation for the remaining parts. The Bellcore calculation used is

“Method 1 Case 1”. In that particular method the components are assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is assumed to have not been burned in. Manufacturer‟s data has been used wherever possible. The manufacturer‟s data, when used, is specified at 50° C, so in that sense the following

results are slightly conservative. The MTBF values shown below are for a 40° C in an office or telecommunications