Kontron COMe Ref T10 User Manual

COMe Reference Carrier-i Type 10

Document Revision 1.0

If it‟s embedded, it‟s Kontron.

www.kontron.com

» Table of Contents «

1 User Information ............................................................................ 1

1.1 About This Document ............................................................................................................... 1

1.2 Copyright Notice ..................................................................................................................... 1

1.3 Trademarks ............................................................................................................................ 1

1.4 Standards .............................................................................................................................. 1

1.5 Warranty ............................................................................................................................... 2

1.6 Technical Support ................................................................................................................... 2

2 Introduction ................................................................................. 3

3 Specification ................................................................................. 4

3.1 Functional Specification ........................................................................................................... 4

3.2 Block Diagram ........................................................................................................................ 5

3.3 Mechanical Specification .......................................................................................................... 6

3.4 Electrical Specification ............................................................................................................. 7

3.5 Environmental Specification ...................................................................................................... 8

3.6 MTBF .................................................................................................................................... 8

4 Connector Layout ........................................................................... 9

4.1 Rear Panel ............................................................................................................................. 9

4.2 Connector Locations .............................................................................................................. 10

4.3 Component overview .............................................................................................................. 12

5 Connectors and Features ................................................................. 14

5.1 Power Supply ....................................................................................................................... 14

5.1.1 VCC ................................................................................................................................... 14

5.1.2 Power and Reset Button ........................................................................................................ 15

5.1.3 LID# and SLEEP# Jumper ....................................................................................................... 16

5.2 COM Express® Connector ........................................................................................................ 17

5.3 Status LEDs .......................................................................................................................... 18

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5.4 Serial ATA ............................................................................................................................ 19

5.5 µSD-CARD / Module GPIO ........................................................................................................ 20

5.6 High Definition Audio ............................................................................................................ 22

5.7 Ethernet .............................................................................................................................. 23

5.8 USB .................................................................................................................................... 24

5.9 Mini PCI express .................................................................................................................... 25

5.10 SIM Card.............................................................................................................................. 26

5.11 Kontron Feature Connector ..................................................................................................... 27

5.12 DVI-D and Displayport ............................................................................................................ 28

5.13 Serial Interface ..................................................................................................................... 29

5.14 CAN .................................................................................................................................... 30

5.15 FAN .................................................................................................................................... 31

5.16 SMART Battery ...................................................................................................................... 32

5.16.1 Introduction ....................................................................................................................... 32

5.16.2 Possible Smart Batteries ........................................................................................................ 32

5.16.3 Smart Battery System Manager................................................................................................ 32

5.16.4 Smart Battery Connector ....................................................................................................... 33

6 Battery Information ....................................................................... 34

7 Module Single Supply and Wide Range................................................ 36

8 Compatibility Matrix ....................................................................... 37

9 Security Advice ............................................................................. 38

10 Document Revision History .............................................................. 39

COMe Reference Carrier-i Type 10 / User Information

1

1 User Information

1.1 About This Document

This document provides information about products from Kontron Embedded Modules GmbH and/or its subsidiaries.
No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the
information in this document is accurate, the information contained within is supplied “as-is” and is subject to
change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2010 Kontron Embedded Modules GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron Embedded Modules
GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron
AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Embedded Modules GmbH is certified to ISO 9000 standards.

COMe Reference Carrier-i Type 10 / User Information

2

1.5 Warranty

This Kontron Embedded Modules GmbH product is warranted against defects in material and workmanship for the
warranty period from the date of shipment. During the warranty period, Kontron Embedded Modules GmbH will at its
discretion decide to repair or replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product‟s environmental specifications or improper
installation or maintenance.

Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products not supplied
by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical
support. We are committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest
BIOS downloads, Product Change Notifications and additional tools and software. In any case you can always contact
your board supplier for technical support.

COMe Reference Carrier-i Type 10 / Introduction

3

Article

Part-No.

Description

TBD

TBD

2 Introduction

The TBD carrier board for Type 10 modules is designed to allow embedded application developers to get up and
running quickly on the COM Express® mini platform, giving them a head start on the total system design. Simply
select a Type 10 TBD CPU module, then Plug & Go. The TBD is an evaluation backplane for COM Express® Computer-on­Modules following the PICMG COM.0 specification Rev 1.0 or Rev 2.0 with pin-out Type 10.

Ordering Information

COMe Reference Carrier-i Type 10 / Specification

4

3 Specification

3.1 Functional Specification

» COM Express® COM.0 Rev 2.0 baseboard compatible to Type 10 pin-out based modules
» Designed for extended temperature
» Single supply industrial or commercial power connector (5.5 – 20V)
» 2 x miniPCIexpress
» SIM Card Slot connected to miniPCIexpress
» 2x SATA
» LVDS (40pin JILI FFC40 connector)
» 1 x DDI (either DVI-D (SIL1364 SDVOtoDVI) or Display Port, depends on module capability)
» 1x Ethernet RJ45
» 4 x USB 2.0/1.1 (2x front panel, 2x pin header)
» 1 x USB Client
» Kontron feature connector
» Front panel connectors (HDD Act., Reset and Power Switch)
» Status LED
» µSD-Card Socket
» GPIO pin header for module GPIO (muliplexed with SD-Card)
» LID and SLEEP support
» Power Control functions (Power Button override, module single supply, power consumption measurements)
» Analo Devices AD1882AJCIZHDAudio Codec

- Front panel audio

- Optical S/PDIF output

- Digital S/PDIF output

» Serial COM port on SER0
» CAN on SER1
» Smart Battery Connector for batteries between 7.2V to 14.4V

COMe Reference Carrier-i Type 10 / Specification

5

C
O
N
N
E
C
T
O
R

A
B

SATA#0

(J10)

SATA#1

(J11)

DVI-D

(J19)

Feature

Connector (J12)

USB #0-1

(J15)

Ethernet RJ45

(J9)

FrontPanel

Audio (J25)

LVDS/JILI

(J20)

AD1882 AJCIZ

SIL1364

SDVOtoDVI

SATA

HD Audio

PCIe #0

LVDS

DVI

DDI

SMB

RST/PWR Control/MISC

GB-LAN

GPIO2

USB #4

RTC

Battery (B1)

FAN Control

Status LED

J2

DC IN

(J34, optional J35)

VCC 5.5 – 20V

USB Client #7

(J18)

µSD-Card

(J47)

Optical S/PDIF

(J22)

S/PDIF out

(J23)

USB

FET Switch

GPIO

(J38)

GPIO/SDIO

SDIO

COM

(J13)

CAN

(J33)

RX0/TX0

RX1/TX1

4 pin FAN1 12V

(J37)

MAX
3311

TJA
1040

I2C

J40

LID

J41

SLEEP

LAN LED

SUS_STAT/S3/S4/S5

VCC

SIM Card Slot

(J48)

PCIe #1

HDD ACT

J39

USB #5

WLAN LEDs

miniPCIexpress 0

(J26)

miniPCIexpress 1

(J29)

12V DC/DC

12V

MARS / Power

Smart Battery

(J36)

USB #2-3

(J44)

SMB

switch

Display Port

(J49)

DP

SDVO

Power Connector

for HDD

(J51)

3.2 Block Diagram

COMe Reference Carrier-i Type 10 / Specification

6

3.3 Mechanical Specification

» Size: 120mm x 120mm
» max height on top: 15.4mm (Connector J15)

COMe Reference Carrier-i Type 10 / Specification

7

3.4 Electrical Specification

Supply Voltage

» Single Power Supply (5.5V – 20V DC)

When external devices are supplied by the COMe Reference Carrier-I Type 10 (via HDD power and LVDS connector) and
the temperature is below 0°C the carrier board supply voltage shall be > 6.5V.

Power Supply Rise time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

Supply Voltage Ripple

» Maximum 100 mV peak to peak 0-20MHz

Power Connector

» Pin / Ring Type with 2,1mm pin diameter

COMe Reference Carrier-i Type 10 / Specification

8

1

1

3.5 Environmental Specification

Ambient temperature

» Operating: -40°C to +85 °C
» Non-operating: -40 to +85 °C

Humidity

» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)

3.6 MTBF

The following MTBF (Mean Time Between Failures) values were calculated using a combination of manufacturer‟s test
data, if the data was available, and a Bellcore calculation for the remaining parts. The Bellcore calculation used is

“Method 1 Case 1”. In that particular method the components are assumed to be operating at a 50 % stress level in a
40° C ambient environment and the system is assumed to have not been burned in. Manufacturer‟s data has been
used wherever possible. The manufacturer‟s data, when used, is specified at 50° C, so in that sense the following

results are slightly conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt water
exposure, etc.) lower MTBF values.

» System MTBF: tbd hours

The whole carrier board was designed to accomplish industrial temperature range. This was not possible for all

connectors and chips. Following devices have a different temperature rating:

» Audio Codec: -20°C to +85°C
» DVI Connector: 0°C to 60°C

COMe Reference Carrier-i Type 10 / Connector Layout

9

4 Connector Layout

4.1 Rear Panel

COMe Reference Carrier-i Type 10 / Connector Layout

10

4.2 Connector Locations