Kontron COMe-mTT10 User Manual
COMe-mTT10
Document Revision 130
www.kontron.com
» Table of Contents «
1 User Information..................................................................................5
1.1 About This Document.................................................................................................................... 5
1.2 Copyright Notice.......................................................................................................................... 5
1.3 Trademarks................................................................................................................................. 5
1.4 Standards................................................................................................................................... 5
1.5 Warranty.................................................................................................................................... 6
1.6 Technical Support......................................................................................................................... 6
2 Introduction........................................................................................7
2.1 Product Description...................................................................................................................... 7
2.2 Naming clarification..................................................................................................................... 7
2.3 Understanding COM Express® Functionality.......................................................................................7
2.4 COM Express® Documentation......................................................................................................... 8
2.5 COM Express® Benefits.................................................................................................................. 8
3 Product Specification............................................................................9
3.1 Modules & Accessories................................................................................................................... 9
3.2 Functional Specification............................................................................................................... 11
3.3 Block Diagram............................................................................................................................ 14
3.4 Electrical Specification................................................................................................................15
3.4.1 Supply Voltage........................................................................................................................... 15
3.4.2 Power Supply Rise Time................................................................................................................ 15
3.4.3 Supply Voltage Ripple.................................................................................................................. 15
3.4.4 Power Consumption..................................................................................................................... 15
3.4.5 ATX Mode.................................................................................................................................. 16
3.4.6 Single Supply Mode..................................................................................................................... 16
3.5 Power Control............................................................................................................................ 17
3.6 Environmental Specification......................................................................................................... 18
3.6.1 Temperature Specification............................................................................................................ 18
3.6.2 Humidity................................................................................................................................... 18
3.7 Standards and Certifications.........................................................................................................19
3.8 MTBF........................................................................................................................................ 21
3.9 Mechanical Specification.............................................................................................................. 22
3.10 Thermal Management, Heatspreader and Cooling Solutions.................................................................23
4 Features and Interfaces.......................................................................24
4.1 Onboard SSD.............................................................................................................................. 24
4.2 S5 Eco Mode.............................................................................................................................. 25
4.3 LPC.......................................................................................................................................... 26
4.4 Serial Peripheral Interface (SPI).................................................................................................... 27
4.5 SPI boot.................................................................................................................................... 27
4.6 M.A.R.S.................................................................................................................................... 29
www.kontron.com
COMe-mTT10 /
4.7 UART........................................................................................................................................ 30
4.8 CAN......................................................................................................................................... 31
4.9 Fast I2C.................................................................................................................................... 32
4.10 GPIO - General Purpose Input and Output.........................................................................................33
4.11 Dual Staged Watchdog Timer......................................................................................................... 34
4.12 Speedstep Technology................................................................................................................. 35
4.13 C-States.................................................................................................................................... 36
4.14 Hyper Threading......................................................................................................................... 37
4.15 ACPI Suspend Modes and Resume Events..........................................................................................38
4.16 USB......................................................................................................................................... 39
4.17 SDIO........................................................................................................................................ 40
5 System Resources...............................................................................42
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 42
5.1.1 In 8259 PIC mode........................................................................................................................ 42
5.1.2 In APIC mode............................................................................................................................. 43
5.2 Memory Area............................................................................................................................. 43
5.3 I/O Address Map......................................................................................................................... 44
5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 45
5.5 I2C Bus..................................................................................................................................... 46
5.6 JILI I2C Bus............................................................................................................................... 46
5.7 SDVO I2C Bus............................................................................................................................. 46
5.8 System Management (SM) Bus....................................................................................................... 46
6 Pinout List.........................................................................................47
6.1 General Signal Description............................................................................................................ 47
6.2 Connector X1A Row A................................................................................................................... 48
6.3 Connector X1A Row B................................................................................................................... 50
7 BIOS Operation...................................................................................52
7.1 Determining the BIOS Version....................................................................................................... 52
7.2 BIOS Update.............................................................................................................................. 52
7.3 Setup Guide............................................................................................................................... 54
7.4 POST Codes................................................................................................................................ 54
7.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 54
7.5 BIOS Setup................................................................................................................................ 56
7.5.1 Main........................................................................................................................................ 56
7.5.2 Advanced.................................................................................................................................. 61
7.5.3 Chipset..................................................................................................................................... 86
7.5.4 Boot........................................................................................................................................ 93
7.5.5 Security.................................................................................................................................... 95
7.5.6 Save & Exit................................................................................................................................ 96
4
COMe-mTT10 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5
COMe-mTT10 / User Information
1.5 Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6
COMe-mTT10 / Introduction
2 Introduction
2.1 Product Description
The credit card size (55mm x 84 mm) COM Express® mini SFF COM, COMe-mTT10, featuring an Intel® Atom™ processor
E6xx and is designed according to the PICMG COM Express® R.2.0 pin-out Type 10 specification. The COMe-mTTi10 family is
designed with industrial-grade components that are fully functional even at the extended temperature range (E2) from
-40 to +85°C, special build versions for commercial temperature are available as well. With its memory onboard, a robust
micro-SD Card socket or optional a SATA Flash memory, it is ideal for use in harsh environments and thus complements the
existing portfolio perfectly.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO shared w/GPIO
1x optional 1x optional - 1x optional
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
7
COMe-mTT10 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-mTT10. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
8
COMe-mTT10 / Product Specification
3 Product Specification
3.1 Modules & Accessories
The COM Express® mini sized Computer-on-Module COMe-mTT10 (NTC1) follows pin-out Type 10 and is compatible to
PICMG specification COM.0 Rev 2.0. The COMe-mTT10, based on Intel's Queens Bay platform, is available in different
variants to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating), COMe-mTTc10
Product Number Product Name Processor PCH and Features
34004-2000-16-1 COMe-mTTc10 E680 2GB/mSD Intel® Atom™ E680 EG20T, 3xPCIe, 2GB DDR2, microSD socket
34004-1000-16-1 COMe-mTTc10 E680 1GB/mSD Intel® Atom™ E680 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-1000-13-1 COMe-mTTc10 E660 1GB/mSD Intel® Atom™ E660 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-1000-10-1 COMe-mTTc10 E640 512MB/mSD Intel® Atom™ E640 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-5100-06-1 COMe-mTTc10 E620 512MB/mSD Intel® Atom™ E620 EG20T, 3xPCIe, 512MB DDR2, microSD socket
Industrial grade modules (E2, -40°C to 85°C operating), COMe-mTTi10
Product Number Product Name Processor PCH and Features
34003-1040-16-1 COMe-mTTi10 E680T 1GB/4GB Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-1040-13-1 COMe-mTTi10 E660T 1GB/4GB Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-1040-10-1 COMe-mTTi10 E640T 1GB/4GB Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-2000-16-1 COMe-mTTi10 E680T 2GB/mSD Intel® Atom™ E680T EG20T, 3xPCIe, 2GB DDR2, microSD socket
34003-1000-16-1 COMe-mTTi10 E680T 1GB/mSD Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-1000-13-1 COMe-mTTi10 E660T 1GB/mSD Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-1000-10-1 COMe-mTTi10 E640T 1GB/mSD Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-5100-06-1 COMe-mTTi10 E620T 512MB/mSD Intel® Atom™ E620T EG20T, 3xPCIe, 512MB DDR2, microSD socket
Possible memory and onboard Flash configurations 3400x-MMFF-xx-x:
» MM = 51: 512MB DDR2 Memory (4 x 1Gb chips on bottom)
» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chips)
» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chips)
» FF = 00: microSD Card onboard
» FF = 20: 2GB onboard SATA SSD
» FF = 40: 4GB onboard SATA SSD
» FF = 80: 8GB onboard SATA SSD
» FF = 16: 16GB onboard SATA SSD
» FF = 32: 32GB onboard SATA SSD
Please contact your local sales for customized Memory/Flash combinations
9
COMe-mTT10 / Product Specification
Accessories
Product Number Carrier Boards
34101-0000-00-1 COM Express® Eval Carrier Type 10
34104-0000-00-0 COM Express® Reference Carrier-i Type 10
Product Number Cooling & Mounting
34003-0000-99-0 HSP COMe-mTT10 thread (11mm)
34003-0000-99-1 HSP COMe-mTT10 through (11mm)
34003-0000-99-2 HSP COMe-mTT10 slim thread (6.5mm)
34003-0000-99-3 HSP COMe-mTT10 slim though (6.5mm)
34003-0000-99-0CO1 HSK COMe-mTT10 slim passive thread
34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs up to 10W)
34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs up to 5W)
34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs up to 3-5W)
34017-0000-00-0 COMe mMount KIT 5/8mm 1set
Product Number Adapter & Cables
9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
34120-0000-00-2 ADA-COMe-T10-T2 (Pin-out Type 10 to Type 2 Adapter)
96006-0000-00-1 COMe POST T10
10
COMe-mTT10 / Product Specification
3.2 Functional Specification
Processor
The Intel® Atom™ E600 (Tunnel Creek) CPU family supports:
» Intel® Hyper-Threading Technology
» Intel® Virtualization Technology (VT-x)
» Idle States
» Enhanced Intel SpeedStep® Technology
» Thermal Monitoring Technologies
» Execute Disable Bit
CPU specifications
Processor Cores / Threads CPU Clock L2 Cache V T-x HTT EIST Max TDP
Intel® Atom™ E620T/E620 1 / 2 600MHz 512KB Yes Yes Yes 3.3W
Intel® Atom™ E640T/E640 1 / 2 1000MHz 512KB Yes Yes Yes 3.6W
Intel® Atom™ E660T/E660 1 / 2 1300MHz 512KB Yes Yes Yes 3.6W
Intel® Atom™ E680T/E680 1 / 2 1600MHz 512KB Yes Yes Yes 4.5W
Memory
Sockets
memory down
Memory Type
DDR2-800
Maximum Size
2GB
Technology
Single Channel (32bit)
Graphics Core
The integrated Intel® GMA 600 based on PowerVR SGX535 core supports:
Graphics Core Render Clock
400MHz (E680/E660 CPU)
320MHz (E640/E620 CPU)
Execution Units / Pixel Pipelines
4
Max Graphics Memory
759MB
GFX Memory Bandwidth (GB/s)
4.2
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
9.0L / 2.1
Shader Model
3.0
Hardware accelerated Video
H.264,MPEG2/4,VC1,WMV9, DivX
Independent/Simultaneous Displays
2
Display Port
-
HDCP support
-
Monitor output
CRT max Resolution
-
TV out:
-
LVDS
LVDS Bits/Pixel
1x18 / 1x24
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
1280x768, 80MHz
PWM Backlight Control:
YES
Supported Panel Data:
EDID
11
COMe-mTT10 / Product Specification
Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
SDVOB
Digital Display Interface DDI2
-
Digital Display Interface DDI3
-
Maximum Resolution on DDI
1920x1080
Platform Controller Hub
The 90nm Intel Platform Controller Hub EG20T Topcliff supports:
» PCI Express Revision 1.0
» USB 2.0
» USB Client
» SDIO 2.0
» SATA 3Gb/s
Storage
onboard SSD
2-32GB SLC, 2-64GB MLC (SATA)
SD Card support
1x SD 2.0 shared with GPIO, 1x onboard microSD-Card socket
IDE Interface
-
Serial-ATA
up to 2x SATA 3Gb/s
SATA AHCI
AHCI 1.1 with NCQ and Port Multiplier
SATA RAID
-
When the optional SATA onboard drive is used only 1 SATA interface (SATA 0) is available
Connectivity
USB
6x USB 2.0
USB Client
1x USB Client (USB #7)
PCI
-
PCI External Masters
-
PCI Express
3x PCIe x1 Gen1
Max PCI Express
4x PCIe x1 without Topcliff
PCI Express x2/x4 configuration
-
Ethernet
10/100/1000 Mbit
Ethernet controller
Broadcom BCM54610
Ethernet
The Broadcom BCM54610 ethernet supports:
» Jumbo packets up to 10KB
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
12
COMe-mTT10 / Product Specification
Misc Interfaces and Features
Supported BIOS Size/Type
2MB SPI
Audio
HD Audio
Onboard Hardware Monitor
WINBOND W83L771W
Trusted Platform Module*
Infineon TPM 1.2 SLB9635TT optional
Miscellaneous
1x CAN optional / 2x UART
*The TPM Option is only valid for commercial temperature grade modules
Kontron Features
External I2C Bus
Fast I2C, MultiMaster capable
M.A.R.S. support
YES
Embedded API
KEAPI1
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support
YES
Supply Voltage
4.75 - 14V
ACPI
ACPI 3.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
DPST 3.2
Power Consumption and Performance
Full Load Power Consumption
5.2 - 7.5W
Kontron Performance Index
1833 - 4290
Kontron Performance/Watt
349 - 571
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
Real Time Clock
The E6xx CPU integrated RTC specifies a battery current up to 24µA. To secure a common longevity for external backup
batteries Intel recommends to use following types in combination with E6xx.
Battery Type Capacity Typ. RTC current Worst Case Battery Life*
Panasonic Lithium CR2032 225 mAh 24µA 1.1 yrs
Panasonic Lithium CR2450 620 mAh 24µA 2.9 yrs
Panasonic Lithium CR2477 1000 mAh 24µA 4.8 yrs
*RTC Battery life assuming CPU in S5 state 24/7 for 365 days.
13
COMe-mTT10 / Product Specification
3.3 Block Diagram
14
PCIe 0/1/2
optional
6x USB
1x USBC
HD Audio
SATA 0/1
UART 1 or
optional CAN
LPC
SDIO /
GPIO
SMB
Clock
Gen
HWM
PCIe 3
Intel® Atom™
E6xx/E6xxT Series
RTC
LVDS
(1x18/24)
I2C
SDVO
SPI
GPIO
GB LAN
RGMII
Ethernet
PHY
Broadcom
BCM54610
SDIO1
SPI
Flash
CPLD2
I2C, WD
SDIO0
microSD Socket
Switch
SATA 1
SATA SSD
UART 0
PCH
EG20T
GMA600
Graphics
Connector Option
Standard
component
TPM
Infineon
SLB9655TT
EEPROM
(CMOS
Setup Data)
512MB/1GB/2GB
DDR2 Memory
down
CPLD1
PWR-MGMT
Connector AB
COMe-mTT10 / Product Specification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC:
4.75 - 14V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consumption of the different COMe-mTT10 variants is 5.2 - 7.5W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
15
COMe-mTT10 / Product Specification
3.4.5 ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →
S0 high high 5V low VCC
3.4.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 → high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 → PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
16
COMe-mTT10 / Product Specification
3.5 Power Control
Power Supply
The COMe-mTT10 supports a power input from 4.75 - 14V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-mTT10 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “Af ter Power Fail” is set to “Stay Off”.
17
COMe-mTT10 / Product Specification
3.6 Environmental Specification
3.6.1 Temperature Specification
Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-mTT10
Temperature Specification Operating Non-operating Validated Input Voltage
Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 14V
Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V
Industrial grade by Screening (XT)
-40°C to +85°C -40°C to +85°C VCC: 12V
Industrial grade by Design (E2)
-40°C to +85°C -40°C to +85°C VCC: 4.75 - 14V
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade Validation requirements
Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.6.2 Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
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COMe-mTT10 / Product Specification
3.7 Standards and Certifications
RoHS II
The COMe-mTT10 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances
(RoHS II) in electrical and electronic equipment
Component Recognition UL 60950-1
The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
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COMe-mTT10 / Product Specification
Shock & Vibration
The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-mTT10 follows the requirements for electromagnetic
compatibility standards
» EN55022
PTCRB
The COMe-mTT10 is PTCRB certified within Kontron KM2M800 M2M
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COMe-mTT10 / Product Specification
3.8 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 34003*: 238615 @ 40°C (w/PCB)
34004*: 241971 @ 40°C (w/PCB)
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
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COMe-mTT10 / Product Specification
3.9 Mechanical Specification
Module Dimension
» 55mm x 84mm (±0.2mm)
» Height approx. 3.5mm (withouth printed circuit board)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:
Kontron provides standard HSP for the specified height of 13mm and slim-line Heatspreader for a reduced height of
8.5mm for mini sized Computer-on-Modules. Universal Cooling solutions to be mounted on the HSP are 14.3mm (340990000-00-0/1) or 8mm (34099-0000-00-2) in height. This allows combinations of a total module height of 8.5mm or
13mm with the Heatspreader and between 16.5mm and 27.3mm with a cooling solution.
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COMe-mTT10 / Product Specification
3.10 Thermal Management, Heatspreader and Cooling Solutions
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mTT10. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:
» 60°C for commercial grade modules
» 75°C for extended temperature grade modules (E1)
» 85°C for industrial temperature grade modules (E2/XT)
The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-mTT10. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-mTT10 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.
Documentation and CAD drawings of COMe-mTT10 heatspreader and cooling solutions are provided at
http://emdcustomersection.kontron.com.
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COMe-mTT10 / Features and Interfaces
4 Features and Interfaces
4.1 Onboard SSD
The COMe-mTT10 features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC, 2-64GB MLC
(SATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following
SATA NANDrives are available:
Basic features of the SATA NANDrives
» ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support
» RoHS compliant NAND flash type
» SATA 1.5Gb/s Host transfer rate
» Hardware error detection, correction ECC and advanced wear leveling
» Bad block management
» TRIM support
» SMART support
» 0°C to +70°C temperature range for MLC types A-M-C/B-M-C
» -40°C to +85°C temperature range for MLC types B-M-I
» -40°C to +85°C temperature range for all SLC types
Single-level Cell (SLC) NANDrive™
Flash Part No. GLS85LS
Flash Part No. 1002P-S-I-FZJE-ND104 1004P-S-I-FZJE-ND104 1008P-S-I-FZJE-ND104 1016P-S-I-FZJE-ND104 1032P-S-I-FZJE-ND104
Product Revision
CC1 CC1 CC1 CC1 CC1
Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte
Burst Read/Write Speed
35/20 MB/s 70/35 MB/s 70/50 MB/s 70/55 MB/s 120/80 MB/s
Total Bytes
2,000,388,096 4,001,292,288 8,012,390,400 16,013,942,784 32,017,047,552
Active Mode Power
450mW 560mW 750mW 590mW 855mW
Typical P/E Cycles per
block
100,000 100,000 60,000 60,000 60,000
(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)
Multi-level Cell (MLC) NANDrive™
Flash Part No. GLS85LS
Flash Part No.
1002A-M-C-FZJE-ND103
1002A-M-I-FZJE-ND103
1004A-M-C-FZJE-ND103
1004A-M-I-FZJE-ND103
1008B-M-C-FZJE-ND103
1008B-M-I-FZJE-ND103
1016B-M-C-FZJE-ND103
1016B-M-I-FZJE-ND103
1032B-M-C-FZJE-ND103
1032B-M-I-FZJE-ND103
1064B-M-C-FZJE-ND103
1064B-M-I-FZJE-ND103
Product Revision
CB2 CB2 CB2 CB2 CB2 CB2
Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte 64GByte
Burst Read/Write
Speed
35/10 MB/s 35/10 MB/s 35/10 MB/s 70/20 MB/s 70/30 MB/s 110/60 MB/s
Total Bytes
1,941,553,152 3,941,941,248 8,012,390,400 16,013,942,784 32,017,047,552 64,023,257,088
Active Mode Power
360mW 360mW 360mW 440mW 565mW 820mW
Typical P/E Cycles per
block
5,000 5,000 5,000 5,000 5,000 5,000
(Data based on Datasheet S71430 Rev 02.00 from 10-2013)
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COMe-mTT10 / Features and Interfaces
4.2 S5 Eco Mode
Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!
In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.
The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.
Following prerequisites and consequences occur when S5 Eco Mode is enabled
» The power button must be pressed at least for 200ms to switch on.
» Wake via Power button only.
» “Power On After Power Fail”/“State after G3”: only “stay off” is possible
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COMe-mTT10 / Features and Interfaces
4.3 LPC
The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.
The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.
All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:
83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI
PS/2 YES YES YES
COM1/COM2 YES YES YES
LPT YES YES YES
HWM YES YES NO
Floppy NO NO NO
GPIO NO NO NO
83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI
PS/2 YES YES YES
COM1/COM2 YES YES YES
LPT YES YES YES
HWM NO NO NO
Floppy NO NO NO
GPIO NO NO NO
Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.
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COMe-mTT10 / Features and Interfaces
4.4 Serial Peripheral Interface (SPI)
The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.
The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.
4.5 SPI boot
The COMe-mTT10 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:
BIOS_DIS0# BIOS_DIS1# Function
open open Boot on-module BIOS
GND open Boot baseboard LPC FWH
open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2
GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1
By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only
Recommended SPI boot flash types for 8-SOIC package
Size Manufacturer Part Number Device ID
16Mbit Atmel AT26DF161 0x1F4600
16Mbit Atmel AT26DF161A 0x1F4601
16Mbit Atmel AT25DF161 0x1F4602
16Mbit Atmel AT25DQ161 0x1F8600
16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015
16Mbit Macronix MX25L1635D 0xC22415
16Mbit SST/Microchip SST25VF016B 0xBF2541
16Mbit Winbond W25X16BV 0xEF3015
16Mbit Winbond W25Q16BV(CV) 0xEF4015
Size Manufacturer Part Number Device ID
32Mbit Atmel AT25/26DF321 0x1F4700
32Mbit Atmel AT25DF321A 0x1F4701
32Mbit Macronix MX25L3205A(D)(06E) 0xC22016
32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16
32Mbit SST/Microchip SST25VF032B 0XBF254A
32Mbit Winbond W25X32BV 0xEF3016
32Mbit Winbond W25Q32BV, 0xEF4016
Size Manufacturer Part Number Device ID
64Mbit Atmel AT25DF641(A) 0x1F4800
64Mbit Atmel AT25DQ641 0x1F8800
64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017
64Mbit Macronix MX25L6455E 0xC22617
64Mbit Macronix MX25U6435F 0xC22537
64Mbit SST/Microchip SST25VF064C 0xBF254B
64Mbit Winbond W25X64BV 0xEF3017
64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017
64Mbit Winbond W25Q64DW 0XEF6017
64Mbit Winbond W25Q64FW 0XEF6017
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COMe-mTT10 / Features and Interfaces
Using an external SPI flash
To program an external SPI flash follow these steps:
» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface
» Open pin A34 and B88 to boot from the module BIOS
» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD
Customer Section
» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash
» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash
» reboot
Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.
External SPI flash on Modules with Intel® ME
If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.
To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.
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COMe-mTT10 / Features and Interfaces
4.6 M.A.R.S.
The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems
is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.
Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:
8-bit Address 7-bit Address Device
12h 0x09 SMART_CHARGER
14h 0x0A SMART_SELECTOR
16h 0x0B SMART_BATTERY
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