Kontron COMe-mTT10 User Manual

Download

COMe-mTT10

Document Revision 130

www.kontron.com

» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 Naming clarification..................................................................................................................... 7

2.3 Understanding COM Express® Functionality.......................................................................................7

2.4 COM Express® Documentation......................................................................................................... 8

2.5 COM Express® Benefits.................................................................................................................. 8

3 Product Specification............................................................................9

3.1 Modules & Accessories................................................................................................................... 9

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 14

3.4 Electrical Specification................................................................................................................15

3.4.1 Supply Voltage........................................................................................................................... 15

3.4.2 Power Supply Rise Time................................................................................................................ 15

3.4.3 Supply Voltage Ripple.................................................................................................................. 15

3.4.4 Power Consumption..................................................................................................................... 15

3.4.5 ATX Mode.................................................................................................................................. 16

3.4.6 Single Supply Mode..................................................................................................................... 16

3.5 Power Control............................................................................................................................ 17

3.6 Environmental Specification......................................................................................................... 18

3.6.1 Temperature Specification............................................................................................................ 18

3.6.2 Humidity................................................................................................................................... 18

3.7 Standards and Certifications.........................................................................................................19

3.8 MTBF........................................................................................................................................ 21

3.9 Mechanical Specification.............................................................................................................. 22

3.10 Thermal Management, Heatspreader and Cooling Solutions.................................................................23

4 Features and Interfaces.......................................................................24

4.1 Onboard SSD.............................................................................................................................. 24

4.2 S5 Eco Mode.............................................................................................................................. 25

4.3 LPC.......................................................................................................................................... 26

4.4 Serial Peripheral Interface (SPI).................................................................................................... 27

4.5 SPI boot.................................................................................................................................... 27

4.6 M.A.R.S.................................................................................................................................... 29

www.kontron.com

COMe-mTT10 /

4.7 UART........................................................................................................................................ 30

4.8 CAN......................................................................................................................................... 31

4.9 Fast I2C.................................................................................................................................... 32

4.10 GPIO - General Purpose Input and Output.........................................................................................33

4.11 Dual Staged Watchdog Timer......................................................................................................... 34

4.12 Speedstep Technology................................................................................................................. 35

4.13 C-States.................................................................................................................................... 36

4.14 Hyper Threading......................................................................................................................... 37

4.15 ACPI Suspend Modes and Resume Events..........................................................................................38

4.16 USB......................................................................................................................................... 39

4.17 SDIO........................................................................................................................................ 40

5 System Resources...............................................................................42

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 42

5.1.1 In 8259 PIC mode........................................................................................................................ 42

5.1.2 In APIC mode............................................................................................................................. 43

5.2 Memory Area............................................................................................................................. 43

5.3 I/O Address Map......................................................................................................................... 44

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 45

5.5 I2C Bus..................................................................................................................................... 46

5.6 JILI I2C Bus............................................................................................................................... 46

5.7 SDVO I2C Bus............................................................................................................................. 46

5.8 System Management (SM) Bus....................................................................................................... 46

6 Pinout List.........................................................................................47

6.1 General Signal Description............................................................................................................ 47

6.2 Connector X1A Row A................................................................................................................... 48

6.3 Connector X1A Row B................................................................................................................... 50

7 BIOS Operation...................................................................................52

7.1 Determining the BIOS Version....................................................................................................... 52

7.2 BIOS Update.............................................................................................................................. 52

7.3 Setup Guide............................................................................................................................... 54

7.4 POST Codes................................................................................................................................ 54

7.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 54

7.5 BIOS Setup................................................................................................................................ 56

7.5.1 Main........................................................................................................................................ 56

7.5.2 Advanced.................................................................................................................................. 61

7.5.3 Chipset..................................................................................................................................... 86

7.5.4 Boot........................................................................................................................................ 93

7.5.5 Security.................................................................................................................................... 95

7.5.6 Save & Exit................................................................................................................................ 96

COMe-mTT10 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-mTT10 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe-mTT10 / Introduction

2 Introduction

2.1 Product Description

The credit card size (55mm x 84 mm) COM Express® mini SFF COM, COMe-mTT10, featuring an Intel® Atom™ processor E6xx and is designed according to the PICMG COM Express® R.2.0 pin-out Type 10 specification. The COMe-mTTi10 family is designed with industrial-grade components that are fully functional even at the extended temperature range (E2) from

-40 to +85°C, special build versions for commercial temperature are available as well. With its memory onboard, a robust micro-SD Card socket or optional a SATA Flash memory, it is ideal for use in harsh environments and thus complements the existing portfolio perfectly.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

COMe-mTT10 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-mTT10. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can differentiate products at various price/performance points, or when designing future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

COMe-mTT10 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® mini sized Computer-on-Module COMe-mTT10 (NTC1) follows pin-out Type 10 and is compatible to PICMG specification COM.0 Rev 2.0. The COMe-mTT10, based on Intel's Queens Bay platform, is available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating), COMe-mTTc10

Product Number Product Name Processor PCH and Features

34004-2000-16-1 COMe-mTTc10 E680 2GB/mSD Intel® Atom™ E680 EG20T, 3xPCIe, 2GB DDR2, microSD socket

34004-1000-16-1 COMe-mTTc10 E680 1GB/mSD Intel® Atom™ E680 EG20T, 3xPCIe, 1GB DDR2, microSD socket

34004-1000-13-1 COMe-mTTc10 E660 1GB/mSD Intel® Atom™ E660 EG20T, 3xPCIe, 1GB DDR2, microSD socket

34004-1000-10-1 COMe-mTTc10 E640 512MB/mSD Intel® Atom™ E640 EG20T, 3xPCIe, 1GB DDR2, microSD socket

34004-5100-06-1 COMe-mTTc10 E620 512MB/mSD Intel® Atom™ E620 EG20T, 3xPCIe, 512MB DDR2, microSD socket

Industrial grade modules (E2, -40°C to 85°C operating), COMe-mTTi10

Product Number Product Name Processor PCH and Features

34003-1040-16-1 COMe-mTTi10 E680T 1GB/4GB Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD

34003-1040-13-1 COMe-mTTi10 E660T 1GB/4GB Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD

34003-1040-10-1 COMe-mTTi10 E640T 1GB/4GB Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD

34003-2000-16-1 COMe-mTTi10 E680T 2GB/mSD Intel® Atom™ E680T EG20T, 3xPCIe, 2GB DDR2, microSD socket

34003-1000-16-1 COMe-mTTi10 E680T 1GB/mSD Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, microSD socket

34003-1000-13-1 COMe-mTTi10 E660T 1GB/mSD Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, microSD socket

34003-1000-10-1 COMe-mTTi10 E640T 1GB/mSD Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, microSD socket

34003-5100-06-1 COMe-mTTi10 E620T 512MB/mSD Intel® Atom™ E620T EG20T, 3xPCIe, 512MB DDR2, microSD socket

Possible memory and onboard Flash configurations 3400x-MMFF-xx-x:

» MM = 51: 512MB DDR2 Memory (4 x 1Gb chips on bottom)

» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chips)

» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chips)

» FF = 00: microSD Card onboard

» FF = 20: 2GB onboard SATA SSD

» FF = 40: 4GB onboard SATA SSD

» FF = 80: 8GB onboard SATA SSD

» FF = 16: 16GB onboard SATA SSD

» FF = 32: 32GB onboard SATA SSD

Please contact your local sales for customized Memory/Flash combinations

COMe-mTT10 / Product Specification

Accessories

Product Number Carrier Boards

34101-0000-00-1 COM Express® Eval Carrier Type 10

34104-0000-00-0 COM Express® Reference Carrier-i Type 10

Product Number Cooling & Mounting

34003-0000-99-0 HSP COMe-mTT10 thread (11mm)

34003-0000-99-1 HSP COMe-mTT10 through (11mm)

34003-0000-99-2 HSP COMe-mTT10 slim thread (6.5mm)

34003-0000-99-3 HSP COMe-mTT10 slim though (6.5mm)

34003-0000-99-0CO1 HSK COMe-mTT10 slim passive thread

34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs up to 10W)

34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs up to 5W)

34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs up to 3-5W)

34017-0000-00-0 COMe mMount KIT 5/8mm 1set

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)

34120-0000-00-2 ADA-COMe-T10-T2 (Pin-out Type 10 to Type 2 Adapter)

96006-0000-00-1 COMe POST T10

COMe-mTT10 / Product Specification

3.2 Functional Specification

Processor

The Intel® Atom™ E600 (Tunnel Creek) CPU family supports:

» Intel® Hyper-Threading Technology

» Intel® Virtualization Technology (VT-x)

» Idle States

» Enhanced Intel SpeedStep® Technology

» Thermal Monitoring Technologies

» Execute Disable Bit

CPU specifications

Processor Cores / Threads CPU Clock L2 Cache V T-x HTT EIST Max TDP

Intel® Atom™ E620T/E620 1 / 2 600MHz 512KB Yes Yes Yes 3.3W

Intel® Atom™ E640T/E640 1 / 2 1000MHz 512KB Yes Yes Yes 3.6W

Intel® Atom™ E660T/E660 1 / 2 1300MHz 512KB Yes Yes Yes 3.6W

Intel® Atom™ E680T/E680 1 / 2 1600MHz 512KB Yes Yes Yes 4.5W

Memory

Sockets

memory down

Memory Type

DDR2-800

Maximum Size

2GB

Technology

Single Channel (32bit)

Graphics Core

The integrated Intel® GMA 600 based on PowerVR SGX535 core supports:

Graphics Core Render Clock

400MHz (E680/E660 CPU) 320MHz (E640/E620 CPU)

Execution Units / Pixel Pipelines

Max Graphics Memory

759MB

GFX Memory Bandwidth (GB/s)

4.2

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

9.0L / 2.1

Shader Model

3.0

Hardware accelerated Video

H.264,MPEG2/4,VC1,WMV9, DivX

Independent/Simultaneous Displays

Display Port

HDCP support

Monitor output

CRT max Resolution

TV out:

LVDS

LVDS Bits/Pixel

1x18 / 1x24

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1280x768, 80MHz

PWM Backlight Control:

YES

Supported Panel Data:

EDID

COMe-mTT10 / Product Specification

Display Interfaces

Discrete Graphics

Digital Display Interface DDI1

SDVOB

Digital Display Interface DDI2

Digital Display Interface DDI3

Maximum Resolution on DDI

1920x1080

Platform Controller Hub

The 90nm Intel Platform Controller Hub EG20T Topcliff supports:

» PCI Express Revision 1.0

» USB 2.0

» USB Client

» SDIO 2.0

» SATA 3Gb/s

Storage

onboard SSD

2-32GB SLC, 2-64GB MLC (SATA)

SD Card support

1x SD 2.0 shared with GPIO, 1x onboard microSD-Card socket

IDE Interface

Serial-ATA

up to 2x SATA 3Gb/s

SATA AHCI

AHCI 1.1 with NCQ and Port Multiplier

SATA RAID

When the optional SATA onboard drive is used only 1 SATA interface (SATA 0) is available

Connectivity

USB

6x USB 2.0

USB Client

1x USB Client (USB #7)

PCI

PCI External Masters

PCI Express

3x PCIe x1 Gen1

Max PCI Express

4x PCIe x1 without Topcliff

PCI Express x2/x4 configuration

Ethernet

10/100/1000 Mbit

Ethernet controller

Broadcom BCM54610

Ethernet

The Broadcom BCM54610 ethernet supports:

» Jumbo packets up to 10KB

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

COMe-mTT10 / Product Specification

Misc Interfaces and Features

Supported BIOS Size/Type

2MB SPI

Audio

HD Audio

Onboard Hardware Monitor

WINBOND W83L771W

Trusted Platform Module*

Infineon TPM 1.2 SLB9635TT optional

Miscellaneous

1x CAN optional / 2x UART

*The TPM Option is only valid for commercial temperature grade modules

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI1

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 14V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 3.2

Power Consumption and Performance

Full Load Power Consumption

5.2 - 7.5W

Kontron Performance Index

1833 - 4290

Kontron Performance/Watt

349 - 571

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Real Time Clock

The E6xx CPU integrated RTC specifies a battery current up to 24µA. To secure a common longevity for external backup batteries Intel recommends to use following types in combination with E6xx.

Battery Type Capacity Typ. RTC current Worst Case Battery Life*

Panasonic Lithium CR2032 225 mAh 24µA 1.1 yrs

Panasonic Lithium CR2450 620 mAh 24µA 2.9 yrs

Panasonic Lithium CR2477 1000 mAh 24µA 4.8 yrs

*RTC Battery life assuming CPU in S5 state 24/7 for 365 days.

COMe-mTT10 / Product Specification

3.3 Block Diagram

PCIe 0/1/2

optional

6x USB

1x USBC

HD Audio

SATA 0/1

UART 1 or

optional CAN

LPC

SDIO /

GPIO

SMB

Clock

Gen

HWM

PCIe 3

Intel® Atom™

E6xx/E6xxT Series

RTC

LVDS

(1x18/24)

I2C

SDVO

SPI

GPIO

GB LAN

RGMII

Ethernet

PHY

Broadcom

BCM54610

SDIO1

SPI

Flash

CPLD2

I2C, WD

SDIO0

microSD Socket

Switch

SATA 1

SATA SSD

UART 0

PCH

EG20T

GMA600

Graphics

Connector Option

Standard

component

TPM

Infineon

SLB9655TT

EEPROM

(CMOS

Setup Data)

512MB/1GB/2GB

DDR2 Memory

down

CPLD1

PWR-MGMT

Connector AB

COMe-mTT10 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 14V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-mTT10 variants is 5.2 - 7.5W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on EMD Customer Section. Information there is available after registration.

COMe-mTT10 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 4.75 - 14V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

COMe-mTT10 / Product Specification

3.5 Power Control

Power Supply

The COMe-mTT10 supports a power input from 4.75 - 14V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-mTT10 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “Af ter Power Fail” is set to “Stay Off”.

COMe-mTT10 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the COMe-mTT10

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 14V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 4.75 - 14V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

COMe-mTT10 / Product Specification

3.7 Standards and Certifications

RoHS II

The COMe-mTT10 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

COMe-mTT10 / Product Specification

Shock & Vibration

The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-mTT10 follows the requirements for electromagnetic

compatibility standards

» EN55022

PTCRB

The COMe-mTT10 is PTCRB certified within Kontron KM2M800 M2M

COMe-mTT10 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 34003*: 238615 @ 40°C (w/PCB)

34004*: 241971 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

COMe-mTT10 / Product Specification

3.9 Mechanical Specification

Module Dimension

» 55mm x 84mm (±0.2mm)

» Height approx. 3.5mm (withouth printed circuit board)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Kontron provides standard HSP for the specified height of 13mm and slim-line Heatspreader for a reduced height of

8.5mm for mini sized Computer-on-Modules. Universal Cooling solutions to be mounted on the HSP are 14.3mm (340990000-00-0/1) or 8mm (34099-0000-00-2) in height. This allows combinations of a total module height of 8.5mm or 13mm with the Heatspreader and between 16.5mm and 27.3mm with a cooling solution.

COMe-mTT10 / Product Specification

3.10 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mTT10. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-mTT10. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive cooling solutions provided from Kontron Europe GmbH for the COMe-mTT10 are usually designed to cover the power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-mTT10 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

COMe-mTT10 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-mTT10 features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC, 2-64GB MLC (SATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following SATA NANDrives are available:

Basic features of the SATA NANDrives

» ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support

» RoHS compliant NAND flash type

» SATA 1.5Gb/s Host transfer rate

» Hardware error detection, correction ECC and advanced wear leveling

» Bad block management

» TRIM support

» SMART support

» 0°C to +70°C temperature range for MLC types A-M-C/B-M-C

» -40°C to +85°C temperature range for MLC types B-M-I

» -40°C to +85°C temperature range for all SLC types

Single-level Cell (SLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No. 1002P-S-I-FZJE-ND104 1004P-S-I-FZJE-ND104 1008P-S-I-FZJE-ND104 1016P-S-I-FZJE-ND104 1032P-S-I-FZJE-ND104

Product Revision

CC1 CC1 CC1 CC1 CC1

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte

Burst Read/Write Speed

35/20 MB/s 70/35 MB/s 70/50 MB/s 70/55 MB/s 120/80 MB/s

Total Bytes

2,000,388,096 4,001,292,288 8,012,390,400 16,013,942,784 32,017,047,552

Active Mode Power

450mW 560mW 750mW 590mW 855mW

Typical P/E Cycles per block

100,000 100,000 60,000 60,000 60,000

(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)

Multi-level Cell (MLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No.

1002A-M-C-FZJE-ND103 1002A-M-I-FZJE-ND103

1004A-M-C-FZJE-ND103 1004A-M-I-FZJE-ND103

1008B-M-C-FZJE-ND103 1008B-M-I-FZJE-ND103

1016B-M-C-FZJE-ND103 1016B-M-I-FZJE-ND103

1032B-M-C-FZJE-ND103 1032B-M-I-FZJE-ND103

1064B-M-C-FZJE-ND103 1064B-M-I-FZJE-ND103

Product Revision

CB2 CB2 CB2 CB2 CB2 CB2

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte 64GByte

Burst Read/Write Speed

35/10 MB/s 35/10 MB/s 35/10 MB/s 70/20 MB/s 70/30 MB/s 110/60 MB/s

Total Bytes

1,941,553,152 3,941,941,248 8,012,390,400 16,013,942,784 32,017,047,552 64,023,257,088

Active Mode Power

360mW 360mW 360mW 440mW 565mW 820mW

Typical P/E Cycles per block

5,000 5,000 5,000 5,000 5,000 5,000

(Data based on Datasheet S71430 Rev 02.00 from 10-2013)

COMe-mTT10 / Features and Interfaces

4.2 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

COMe-mTT10 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

COMe-mTT10 / Features and Interfaces

4.4 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame. Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire” serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the baseboard.

4.5 SPI boot

The COMe-mTT10 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88 (BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

COMe-mTT10 / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

COMe-mTT10 / Features and Interfaces

4.6 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

COMe-mTT10 / Features and Interfaces

4.7 UART

The COMe-mTT10 supports two Serial RX/TX only UART Ports defined in COM Express® specification on Pins A98/A99 for UART0 and Pins A101/A102 for UART1. The 16550 compatible UARTs are provided from the - and resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 9600 to 115.2k Baud

» 8bit Word length

» 1 Stop bit

» Odd, even or no parity support

» 256byte FIFO Buffer for UART0

» 64byte FIFO Buffer for UART1

» Hardware Flow Control on UART0

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

Due to the protection circuitry required according COM Express® specification the transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or support for customized versions without protection circuitry

COMe-mTT10 / Features and Interfaces

4.8 CAN

The COMe-mTT10 optionally supports the EG20T implemented CAN interface as defined in COM Express® specification on Pins Pins A101/A102 instead of UART1. To connect the CAN interface from the module to the CAN bus, it is necessary to add transceiver hardware on the Carrier Board.

CAN Controller features:

» CAN Protocol Version 2.0B Active

» Supports bit rate up to 1Mbit/second

» Supports 32 message objects

» Programmable FIFO

COMe-mTT10 / Features and Interfaces

4.9 Fast I2C

The COMe-mTT10 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

COMe-mTT10 / Features and Interfaces

4.10 GPIO - General Purpose Input and Output

The COMe-mTT10 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available.

Signal Pin Description

GPI0 A54 General Purpose Input 0

GPI1 A63 General Purpose Input 1

GPI2 A67 General Purpose Input 2

GPI3 A85 General Purpose Input 3

GPO0 A93 General Purpose Output 0

GPO1 B54 General Purpose Output 1

GPO2 B57 General Purpose Output 2

GPO3 B63 General Purpose Output 3

Configuration

The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver download packet on our customer section.

COMe-mTT10 / Features and Interfaces

4.11 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive state into normal operation.

The COMe-mTT10 offers a watchdog which works with two stages that can be programmed independently and used one by one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If deassertion during runtime is necessary please ask your Kontron technical support for further help.

COMe-mTT10 / Features and Interfaces

4.12 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to adapt high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

COMe-mTT10 / Features and Interfaces

4.13 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

COMe-mTT10 / Features and Interfaces

4.14 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the processor—those that store the architectural state but not duplicating the main execution resources. This allows a HyperThreading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies on the Operating System.

COMe-mTT10 / Features and Interfaces

4.15 ACPI Suspend Modes and Resume Events

The COMe-mTT10 supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage (2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup and driver options

COMe-mTT10 / Features and Interfaces

4.16 USB

The available USB configuration of the COMe-mTT10 module is described in the following table:

COM Express Port EG20 Port Comment

USB0 USB0 -

USB1 USB1 -

USB2 USB2 -

USB3 USB3 -

USB4 USB4 -

USB5 USB5 -

USB6 USB5 Optional instead of COMe USB#5

USB7 USB Client USB Client only

Internal USB mapping

COMe-mTT10 / Features and Interfaces

4.17 SDIO

The SD card standard is a standard for removable memory storages designed and licensed by the SD Card Association (http://sdcard.org). The card form factor, electrical interface, and protocol are all part of the SD Card specification. The Intel® Platform Controller Hub EG20T supports 2 SDIO interfaces. On nanoETXexpress-TT the first interface SDIO#0 is shared with the module GPIO signals. On modules without SATA SSD the second EG20T SDIO interface SDIO#1 is available via onboard microSD connector.

The integrated SD Host Controller conforms to SD Host Controller Standard Specification Ver. 1.0.

Features:

» SDHC up to speed class 6

» SDIO Card Specification Ver. 1.10

» MMC System Specification Ver. 4.1

» SD bus transfer mode

» MMC transfer mode

SDIO interface on COM Express connector:

General purpose Input/output SD card interface signals

GPI0 SLOT0_DATA0

GPI1 SLOT0_DATA1

GPI2 SLOT0_DATA2

GPI3 SLOT0_DATA3

GPO0 SLOT0_CLK

GPO1 SLOT0_CMD

GPO2 SLOT0_WP

GPO3 SLOT0_CD#

COMe-mTT10 / Features and Interfaces

onboard microSD connector J3

Pin Pin name Signal

1 DAT2 SDIO1_DAT0

2 CD/DAT3 SDIO1_DAT3

3 CMD SDIO1_CMD

4 VDD 3.3V S0

5 CLK SDIO1_CLK

6 VSS2 GND

7 DAT0 SDIO1_DAT1

8 DAT1 SDIO1_DAT2

9 SWITCH1 SDIO1_CD#

10 SWITCH2 GND

11 SHIELD1 GND

12 SHIELD2 GND

13 SHIELD3 GND

14 SHIELD4 GND

15 SHIELD5 GND

- The SD_CMD line needs a pull-up resistor that can vary depending on the length of the electrical paths (typical from 10kOhm to 100kOhm)

- The maximum length for SDIO signals on the baseboard should be 80mm.

COMe-mTT10 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

5.1.1 In 8259 PIC mode

IRQ # Used For Available Comment

0 Timer0 No -

1 Keyboard No -

2 Cascade No -

3 External SIO - COM2 Yes (No) Note (1)

4 External SIO - COM1 Yes (No) Note (1)

5 PCI for PCI Dynamic (BIOS def ault)

6 PCI Yes (No) Note (1)

7 External SIO - LPT1 for PCI Dynamic (BIOS default)

8 RTC No -

9 ACPI No Note (2)

10 PCI for PCI Dynamic (BIOS default)

11 PCI for PCI Dynamic (BIOS default)

12 PS/2 Mouse Yes (No) Note (1)

13 FPU No -

14 PCI for PCI Dynamic (BIOS default)

15 PCI for PCI Dynamic (BIOS default)

1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices. 2 Not available if ACPI is used

COMe-mTT10 / System Resources

5.1.2 In APIC mode

IRQ # Used For Available Comment

0 Timer0 No -

1 Keyboard No -

2 Cascade No -

3 External SIO - COM2 Yes (No) Note (1)

4 External SIO - COM1 Yes (No) Note (1)

5 PCI for PCI Dynamic (BIOS default)

6 PCI for PCI Dynamic (BIOS default)

7 External SIO - LPT1 Yes (No) Note (1)

8 RTC No -

9 ACPI No Note (2)

10 PCI for PCI Dynamic (BIOS default)

11 PCI for PCI Dynamic (BIOS default)

12 PS/2 Mouse Yes (No) Note (1)

13 FPU No -

14 PCI for PCI Dynamic (BIOS default)

15 PCI for PCI Dynamic (BIOS default)

16 PIRQ[A] No PCI IRQ line 1 + US15W graphics + USB UHCI Controller #1; Note(3)

17 PIRQ[B] No PCI IRQ line 2 + LAN Controller + USB UHCI Controller #2; Note(3)

18 PIRQ[C] No PCI IRQ line 3 + USB UHCI Controller #3; Note(3)

19 PIRQ[D] No PCI IRQ line 4 + USB UHCI Controller #4; Note(3)

20 PIRQ[E] No Note(3)

21 PIRQ[F] No Note(3)

22 PIRQ[G] No Note(3)

23 PIRQ[H] No Note(3)

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available for other device. (2) Not available if ACPI is used (3) ACPI OS decides on particular IRQ usage

5.2 Memory Area

The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special textbooks for infor- mation about HIMEM.SYS and EMM386.EXE. Other operating systems (Linux or Windows versions) allow you to address the full memory area directly.

Upper Memory Used for Available Comment

A0000h – BFFFFh VGA Memory No Mainly used by graphic controller

C0000h – CFFFFh VGA BIOS No Used by onboard VGA ROM

D0000h – DFFFFh - Yes Free for shadow RAM in st andard

configurations.

E0000h – FFFFFh System BIOS No Fixed

E0000000h – F0000000h PCIe Config Space No Fixed

FEC00000h-FEC00040h IOxAPIC No Fixed

FED00000h FED003FFh HPET No Fixed

FED04000 FED4BFFF TPM No Fixed

FFC00000h - FFFFFFFFh BIOS Flash No Fixed

COMe-mTT10 / System Resources

5.3 I/O Address Map

The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for compatibility reasons, even if available.

I/O Address Used for Available Comment

0000 - 001F System Ressources No Fixed

0020 - 003F Interrupt Controller 1 No Fixed

0040 - 005F Timer, Counter No Fixed

0060 - 006F Keyboard controller No Fixed

0070 - 007F RTC and CMOS Regis ter s No Fixed

0080 BIOS Postcode No Fixed

0084 - 008F DMA Page Register No Fixed

0090 - 009F System Control No Fixed

00A0 - 00BF Interrupt Controller No Fixed

00E0 - 00EF System Control No Fixed

00F0 - 00FF Math Coprocessor No Fixed

03B0 - 03DF VGA No Fixed

0400 - 043F Chipset No Fixed

0480 - 04BF Chipset No Fixed

04D0 - 04D1 Chipset No Fixed

0900 - 091F Power Management No Fixed

09C0 - 09FF GPE No Fixed

0A05 – 0A06 WB83627HG Hardware Monitor No Fixed if WB83627HG is in system

0A80 – 0A81 CPLD No Fixed

0CF8 - 0CFF PCI Configuration No Fixed

COMe-mTT10 / System Resources

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

PCI Device B:D:F PCI IRQ Interface Comment

Host Bridge 0:0:0 None internal Chipset (Tunnelcreek)

Video Controller 0:2:0 INTA internal Chipset (Tunnelcreek)

SDVO Controller 0:03:0 INTA internal Chipset (Tunnelcreek)

PCIe Port 0 0:23:0 INTA internal Chipset (Tunnelcreek)

PCIe Port #0 Slot - A/B/C/D PCIe Slot #1

PCIe Port 1 0:24:0 INTA internal Chipset (Tunnelcreek)

PCIe Port #1 Slot - B/C/D/A PCIe Slot #2

PCIe Port 2 0:25:0 INTA internal Chipset (Tunnelcreek)

PCIe Port #2 Slot - C/D/A/B PCIe Slot #3

PCIe Port 3 0:26:0 INTA internal Chipset (Tunnelcreek)

HDA Controller 0:27:0 INTA internal Chipset (Tunnelcreek)

LPC Bridge 0:31:0 - internal Chipset (Tunnelcreek)

PCIe-PORT X:00:0 INTD PCIe Chipset (Topcliff)

Packet Hub Y:00:0 - PCIe Chipset (Topcliff)

GbE Y:00:1 INTD PCIe Chipset (Topcliff)

GPIO Y:00:2 INTD PCIe Chipset (Topcliff)

OHCI00 Y:02:0 INTC PCIe Chipset (Topcliff)

OHCI01 Y:02:1 INTC PCIe Chipset (Topcliff)

OHCI02 Y:02:2 INTC PCIe Chipset (Topcliff)

EHCI0 Y:02:3 INTC PCIe Chipset (Topcliff)

USB Device Y:02:4 INTC PCIe Chipset (Topcliff)

SDIO #0 Y:04:0 INTB PCIe Chipset (Topcliff)

SDIO #1 Y:04:1 INTB PCIe Chipset (Topcliff)

SATA II Y:06:0 INTA PCIe Chipset (Topcliff)

OHCI10 Y:08:0 INTD PCIe Chipset (Topcliff)

OHCI11 Y:08:1 INTD PCIe Chipset (Topcliff)

OHCI12 Y:08:2 INTD PCIe Chipset (Topcliff)

EHCI1 Y:08:3 INTD PCIe Chipset (Topcliff)

DMA0 Y:10:0 INTC PCIe Chipset (Topcliff)

UART #0 Y:10:1 INTC PCIe Chipset (Topcliff)

UART #1 Y:10:2 INTC PCIe Chipset (Topcliff)

UART #2 Y:10:3 INTC PCIe Chipset (Topcliff)

UART #3 Y:10:4 INTC PCIe Chipset (Topcliff)

DMA1 Y:12:0 INTB PCIe Chipset (Topcliff)

SPI Y:12:1 INTB PCIe Chipset (Topcliff)

I2C Y:12:2 INTB PCIe Chipset (Topcliff)

CAN Y:12:3 INTB PCIe Chipset (Topcliff)

IEEE1588 block Y:12:4 INTB PCIe Chipset (Topcliff)

COMe-mTT10 / System Resources

5.5 I2C Bus

I2C Address Used For Available Comment

58h S5 Eco No S5 Eco Resistor

A0h JIDA-EEPROM No Module EEPROM

AEh FRU-EEPROM No Baseboard EEPROM

Do not access the digital potentiometer manually

5.6 JILI I2C Bus

I2C Address Used For Available Comment

A0h JILI-EEPROM No EEPROM for JILI Data

5.7 SDVO I2C Bus

I2C Address Used For Available Comment

- - - -

5.8 System Management (SM) Bus

Address Device Comment

12h SMART_CHARGER Not to be used with any SM bus deivce except a charger

14h SMART_SELECTOR Not to be used with any SM bus deivce except a selector or manager

16h SMART_BATTERY Not to be used with any SM bus deivce except a battery

98h Winbond W83771W HWM Do not use under any circumstances

A0h SPD EEPROM Do not use under any circumstances

D2h Clock Generator Do not use under any circumstances

COMe-mTT10 / Pinout List

6 Pinout List

6.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

Output Analog

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

Pull-Up Resistor

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950

COMe-mTT10 / Pinout List

6.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND_1 Power Ground PWR - -

A2 GBE0_MDI3- Ethernet Receive Data- DP-I - -

A3 GBE0_MDI3+ Ethernet Receive Data+ DP-I - -

A4 GBE0_LINK100# Ethernet Speed LED 100Mbps OD - -

A5 GBE0_LINK1000# Ethernet Speed LED 1000Mbps OD - -

A6 GBE0_MDI2- Ethernet Receive Data- DP-I - -

A7 GBE0_MDI2+ Ethernet Receive Data+ DP-I - -

A8 GBE0_LINK# LAN Link LED OD - -

A9 GBE0_MDI1- Ethernet Receive Data- DP-I - -

A10 GBE0_MDI1+ Ethernet Receive Data+ DP-I - -

A11 GND_2 Power Ground PWR - -

A12 GBE0_MDI0- Ethernet Transmit Data- DP-O - -

A13 GBE0_MDI0+ Ethernet Transmit Data+ DP-O - -

A14 GBE0_CTREF LAN Reference Voltage O-3.3 100nF to GND -

A15 SUS_S3# Indicates Suspend to RAM state O-3.3 - CPLD I/O

A16 SATA0_TX+ SATA 0 Transmit Data+ DP-O - -

A17 SATA0_TX- SATA 0 Transmit Data- DP-O - -

A18 SUS_S4# Indicates Suspend to Disk state; same as SUS_S5# O-3.3 - CPLD I/O

A19 SATA0_RX+ SATA 0 Receive Data+ DP-I - -

A20 SATA0_RX- SATA 0 Receive Data- DP-I - -

A21 GND_3 Power Ground PWR - -

A22 RSVD Not Connected nc - -

A23 RSVD Not Connected nc - -

A24 SUS_S5# Indicates Soft Off state; same function as SUS_S4# O-3.3 - CPLD I/O

A25 RSVD Not Connected nc - -

A26 RSVD Not Connected nc - -

A27 BATLOW# Indicates low external battery (not implemented) I-3.3 - CPLD I/O

A28 ATA_ACT# SATA Activity Indicator OD - -

A29 HDA_SYNC HD Audio SYNC O-3.3 - -

A30 HDA_RST# HD Audio Reset O-3.3 - -

A31 GND_4 Power Ground PWR - -

A32 HDA_CLK HD Audio CLK O-3.3 PD ~10k in TNC 24MHz

A33 HDA_SDOUT HD Audio Data O-3.3 - -

A34 BIOS_DIS0# Disable Module BIOS.Enable boot from a FWH on Baseboard I-3.3 PU ~15k in CPLD 3.3V_S5 For ext.LPC FWH

A35 THRMTRIP# CPU thermal shutdown indicator O-3.3 PU 10k 3.3V_S0 -

A36 USB6- USB Data- Port #6 (optional) DP-I/O PD 12k in Topcliff -

A37 USB6+ USB Data+ Por t #6 (optional) DP-I/O PD 12k in Topcliff -

A38 USB_6_7_OC# USB Over current Pair 4 / 5 / 6 I-3.3 PU 10k 3.3V_S5 -

A39 USB4- USB Data- Port #4 DP-I/O PD 12k in Topcliff -

A40 USB4+ USB Data+ Por t #4 DP-I/O PD 12k in Topcliff -

A41 GND_5 Power Ground PWR - -

A42 USB2- USB Data- Port #2 DP-I/O PD 12k in Topcliff -

A43 USB2+ USB Data+ Por t #2 DP-I/O PD 12k in Topcliff -

A44 USB_2_3_OC# USB Over current Pair 2 / 3 I-3.3 PU 10k 3.3V_S5 -

A45 USB0- USB Data- Port #0 DP-I/O PD 12k in Topcliff -

A46 USB0+ USB Data+ Por t #0 DP-I/O PD 12k in Topcliff -

A47 VCC_RTC RTC Battery Supply +3V PWR - -

A48 EXCD0_PERST# PCI Express Card 0 Reset O-3.3 no PU/PD allowed! -

A49 EXCD0_CPPE# PCI Express Card 0 Request I-3.3 no PU/PD allowed! -

A50 LPC_SERIRQ LPC Serial Interrupt Request IO-3.3 PU 10k 3.3V_S0 -

A51 GND_6 Power Ground PWR - -

A52 RSVD Not Connected nc - -

A53 RSVD Not Connected nc - -

A54 SDIO_D0 / GPI0 SDIO#0 Data0 / General Purpose Input 0 I/O-3.3 PU 10k/100k to V3.3_S0 -

A55 RSVD Not Connected nc - -

A56 RSVD Not Connected nc - -

A57 GND_7 Power Ground PWR - -

A58 PCIE_TX3+ PCIe lane #3 Transmit+ (Optional) DP-O PD ~50R(PU @ reset) in TNC only available on no-TopCliff var.

A59 PCIE_TX3- PCIe lane #3 Transmit- (Optional) DP-O PD ~50R in TNC only available on no-TopCliff var.

A60 GND_8 Power Ground PWR - -

A61 PCIE_TX2+ PCIe lane #2 Transmit+ DP-O PD ~50R(PU @ reset) in TNC -

A62 PCIE_TX2- PCIe lane #2 Transmit- DP-O PD ~50R in TNC -

A63 SDIO_D1 / GPI1 SDIO#0 Data1 / General Purpose Input 1 I/O-3.3 PU 10k/100k to V3.3_S0 -

A64 PCIE_TX1+ PCIe lane #1 Transmit+ DP-O PD ~50R(PU @ reset) in TNC -

COMe-mTT10 / Pinout List

A65 PCIE_TX1- PCIe lane #1 Transmit- DP-O PD ~50R in TNC -

A66 GND_9 Power Ground PWR - -

A67 SDIO_D2 / GPI2 SDIO#0 Data2 / General Purpose Input 2 I/O-3.3 PU 10k/100k to V3.3_S0 -

A68 PCIE_TX0+ PCIe lane #0 Transmit+ DP-O PD ~50R(PU @ reset) in TNC -

A69 PCIE_TX0- PCIe lane #0 Transmit- DP-O PD ~50R in TNC -

A70 GND_10 Power Ground PWR - -

A71 LVDS_A0+ LVDS Channel A DAT0+ DP-O - -

A72 LVDS_A0- LVDS Channel A DAT0- DP-O - -

A73 LVDS_A1+ LVDS Channel A DAT1+ DP-O - -

A74 LVDS_A1- LVDS Channel A DAT1- DP-O - -

A75 LVDS_A2+ LVDS Channel A DAT2+ DP-O - -

A76 LVDS_A2- LVDS Channel A DAT2- DP-O - -

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 buf fered; forced LOW in S5/S3 -

A78 LVDS_A3+ LVDS Channel A DAT3+ DP-O - -

A79 LVDS_A3- LVDS Channel A DAT3+ DP-O - -

A80 GND_11 Power Ground PWR - -

A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O - 20-80MHz

A82 LVDS_A_CK- LVDS Channel A Clock- DP-O - 20-80MHz

A83 LVDS_I2C_CK LVDS I2C Clock (DDC) IO-3.3 PU 10k 3.3V_S0 -

A84 LVDS_I2C_DAT LVDS I2C Data (DDC) IO-3.3 PU 10k 3.3V_S0 -

A85 SDIO_D3 / GPI3 SDIO# Data3 / General Purpose Input 3 I/O-3.3 PU 10k/100k to V3.3_S0 -

A86 RSVD Not Connected nc - -

A87 RSVD Not Connected nc - -

A88 PCIE0_CK_REF+ PCIe Clock (positive) DP-O - 100MHz

A89 PCIE0_CK_REF- PCIe Clock (negative) DP-O - 100MHz

A90 GND_12 Power Ground PWR - -

A91 SPI_POWER Power supply for Carr ier Board SPI PWR - 100mA (max.)

A92 SPI_MISO Data in to Module from Carrier SPI I-3.3 - -

A93 SDIO_Clk / GPO0 SDIO#0 Clock / General Purpose Output 0 O-3.3 - / PD 100k -

A94 SPI_CLK Clock from Module to Carrier SPI O-3.3 - 20MHz

A95 SPI_MOSI Data out from Module to Carrier SPI O-3.3 - -

A96 TPM_PP (TPM) Physical Presence pin I-3.3 PD 4.7k -

A97 TYPE10# Indicates TYPE10# to carrier board O PD 4.7k -

A98 SER0_TX UART transmitter O-3.3 - 14.5V tolerance

A99 SER0_RX UART receiver I-3.3 PU 47k / 10k 3.3V_S0 14.5V tolerance

A100 GND_14 Power Ground PWR - -

A101 SER1_TX UART transmitter / optional CAN-TX O-3.3 - 14.5V / 3.3V tolerance

A102 SER1_RX UART receiver / optional CAN-RX I-3.3 PU 47k / 10k 3.3V_S0 14.5V / 3.3V tolerance

A103 LID# LID button nc - not supported

A104 VCC_12V_7 12V VCC PWR - -

A105 VCC_12V_8 12V VCC PWR - -

A106 VCC_12V_9 12V VCC PWR - -

A107 VCC_12V_10 12V VCC PWR - -

A108 VCC_12V_11 12V VCC PWR - -

A109 VCC_12V_12 12V VCC PWR - -

A110 GND_15 Power Ground PWR - -

COMe-mTT10 / Pinout List

6.3 Connector X1A Row B

Pin Signal Description Type Termination Comment

B1 GND_16 Power Ground PWR - -

B2 GBE0_ACT# Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 - -

B4 LPC_AD0 LPC Address / Data Bus IO-3.3 PU 100k -

B5 LPC_AD1 LPC Address / Data Bus IO-3.3 PU 100k -

B6 LPC_AD2 LPC Address / Data Bus IO-3.3 PU 100k -

B7 LPC_AD3 LPC Address / Data Bus IO-3.3 PU 100k -

B8 LPC_DRQ0# Not Connected nc - -

B9 LPC_DRQ1# Not Connected nc - -

B10 LPC_CLK LPC Clock O-3.3 - up to 33MHz

B11 GND_17 Power Ground PWR - -

B12 PWRBTN# Power Button Input I-3.3 PU 10k 3.3V_S5 active on falling edge

B13 SMB_CLK SMBus Clock O-3.3 PU 10k in S5 / 5k in S0 3.3V -

B14 SMB_DAT SMBus Data IO-3.3 PU 10k in S5 / 5k in S0 3.3V -

B15 SMB_ALERT# SMBus Interrupt IO-3.3 PU 10k 3.3V_S0 -

B16 SATA1_TX+ SATA 0 Transmit Data+ DP-O - -

B17 SATA1_TX- SATA 0 Transmit Data- DP-O - -

B18 SUS_STAT# Indicates imminent suspend operation O-3.3 - CPLD I/O

B19 SATA1_RX+ SATA 0 Receive Data+ DP-I - -

B20 SATA1_RX- SATA 0 Receive Data- DP-I - -

B21 GND_18 Power Ground PWR - -

B22 RSVD Not Connected nc - -

B23 RSVD Not Connected nc - -

B24 PWR_OK Power OK from power supply I-5T PU 511k 3.3V_S5 CPLD I/O

B25 RSVD Not Connected nc - -

B26 RSVD Not Connected nc - -

B27 WDT Indicator for Watchdog Timeout O-3.3 - CPLD I/O

B28 HDA_SDIN2 Not Connected nc - not suppor ted

B29 HDA_SDIN1 Audio Codec Serial Data in 1 I-3.3 PD ~10k in TNC -

B30 HDA_SDIN0 Audio Codec Serial Data in 0 I-3.3 PD ~10k in TNC -

B31 GND_19 Power Ground PWR - -

B32 SPKR Speaker Interf ace O-3.3 - -

B33 I2C_CK General Purpose I2C Clock IO-3.3 PU 2k2 3.3V_S5 CPLD I/O

B34 I2C_DAT General Purpose I2C Data IO-3.3 PU 2k2 3.3V_S5 CPLD I/O

B35 THRM# Over Temperature Indicator I-3.3 PU 10k 3.3V_S0 -

B36 USB7- USB Data- Client (Client Mode) DP-I/O PD 12k in Topcliff -

B37 USB7+ USB Data+ Client (Client Mode) DP-I/O PD 12k in Topcliff -

B38 USB_4_5_OC# USB Over current Pair 4 / 5 / 6 I-3.3 PU 10k 3.3V_S5 -

B39 USB5- USB Data- Port #5 (n.a. if USB6 option is used) DP-I/O PD 12k in Topcliff -

B40 USB5+ USB Data+ Por t #5 (n.a. if USB6 option is used) DP-I/O PD 12k in Topcliff -

B41 GND_20 Power Ground PWR - -

B42 USB3- USB Data- Port #3 DP-I/O PD 12k in Topcliff -

B43 USB3+ USB Data+ Por t #3 DP-I/O PD 12k in Topcliff -

B44 USB_0_1_OC# USB Over current Pair 0 / 1 I-3.3 PU 10k 3.3V_S5 -

B45 USB1- USB Data- Port #0 DP-I/O PD 12k in Topcliff -

B46 USB1+ USB Data+ Por t #0 DP-I/O PD 12k in Topcliff -

B47 EXCD1_PERST# PCIe Express Card 1 Reset O-3.3 - no PU or PD allowed!

B48 EXCD1_CPPE# PCIe Express Card 1 Request I-3.3 - -

B49 SYS_RESET# Reset button input I-3.3 PU 5k-25k 3.3_S5 in CPLD -

B50 CB_RESET# Carrier Board Reset O-3.3 - CPLD I/O

B51 GND_21 Power Ground PWR - -

B52 RSVD Not Connected nc - -

B53 RSVD Not Connected nc - -

B54 SDIO_CMD / GPO1 SDIO#0 Command / General Purpose Output 1 I/O-3.3 PU 75k V3.3V_S0 / PD 100k -

B55 RSVD Not Connected nc - -

B56 RSVD Not Connected nc - -

B57 SDIO_WP / GPO2 SDIO#0 Write Protection /General Purpose Output 2 I-3.3 PU 10k V3.3V_S0 / PD 100k -

B58 PCIE_RX3+ PCIe lane #3 Receive+ (Optional) DP-I PD ~50R(PU @ reset) in TNC only available on no-TopCliff var.

B59 PCIE_RX3- PCIe lane #3 Receive- (Optional) DP-I PD ~50R(PU @ reset) in TNC only available on no-TopCliff var.

B60 GND_22 Power Ground PWR - -

B61 PCIE_RX2+ PCIe lane #2 Receive+ DP-I PD ~50R(PU @ reset) in TNC -

B62 PCIE_RX2- PCIe lane #2 Receive- DP-I PD ~50R(PU @ reset) in TNC -

B63 SDIO_CD# / GPO3 SDIO#0 CardDetect / General Purpose Output 3 I-3.3 PU 10k V3.3V_S0 / PD 100k -

B64 PCIE_RX1+ PCIe lane #1 Receive+ DP-I PD ~50R(PU @ reset) in TNC -

COMe-mTT10 / Pinout List

B65 PCIE_RX1- PCIe lane #1 Receive- DP-I PD ~50R(PU @ reset) in TNC -

B66 WAKE0# PCI Express Wake Event I-3.3 PU 1k 3.3V_S5 -

B67 WAKE1# General Purpose Wake Event I-3.3 PU 1k 3.3V_S5 -

B68 PCIE_RX0+ PCIe lane #0 Receive+ DP-I PD ~50R(PU @ reset) in TNC -

B69 PCIE_RX0- PCIe lane #0 Receive- DP-I PD ~50R(PU @ reset) in TNC -

B70 GND_23 Power Ground PWR - -

B71 DDI0_PAIR0+ SDVOB_RED_P DP-O - SDVO

B72 DDI0_PAIR0- SDVOB_RED_N DP-O - SDVO

B73 DDI0_PAIR1+ SDVOB_GREEN_P DP-O - SDVO

B74 DDI0_PAIR1- SDVOB_GREEN_N DP-O - SDVO

B75 DDI0_PAIR2+ SDVOB_BLUE_P DP-O - SDVO

B76 DDI0_PAIR2- SDVOB_BLUE_N DP-O - SDVO

B77 DDI0_PAIR4+ SDVOB_INT_P DP-I - SDVO

B78 DDI0_PAIR4- SDVOB_INT_N DP-I - SDVO

B79 LVDS_BKLT_EN Backlight Enable O-3.3 buffered; forced LOW in S5/S3 -

B80 GND_24 Power Ground PWR - -

B81 DDI0_PAIR3+ SDVOB_CLKIN_P DP-O 100-200MHz SDVO

B82 DDI0_PAIR3- SDVOB_CLKIN_N DP-O 100-200MHz SDVO

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY +5V Standby PWR - -

B85 VCC_5V_SBY +5V Standby PWR - -

B86 VCC_5V_SBY +5V Standby PWR - -

B87 VCC_5V_SBY +5V Standby PWR - -

B88 BIOS_DIS1# Disable Module BIOS.Enable boot from SPI on Baseboard I-3.3 PU ~15k in CPLD 3.3V_S5 For ext.SPI

B89 DDI0_HPD Not Connected nc - not suppor ted

B90 GND_25 Power Ground PWR - -

B91 DDI0_PAIR5+ SDVOB_TVCLKIN_P DP-I 100-200MHz SDVO

B92 DDI0_PAIR5- SDVOB_TVCLKIN_N DP-I 100-200MHz SDVO

B93 DDI0_PAIR6+ SDVO_STALLP DP-I - SDVO

B94 DDI0_PAIR6- SDVO_STALLN DP-I - SDVO

B95 DDI0_DDC_AUX_SEL nc / SDVOB_CTRLCLK (Optional) nc optional use by COMe Type1 -

B96 RSVD nc / SDVOB_CTRLDATA(Optional) nc optional use by COMe Type1 -

B97 SPI_CS# SPI Chipselect O 3.3V_S5 -

B98 DDI0_AUX+ SDVOB_CTRLCLK O - -

B99 DDI0_AUX- SDVOB_CTRLDATA I/O - -

B100 GND_26 Power Ground PWR - -

B101 FAN_PWMOUT Not connected nc - not supported

B102 FAN_TACHIN Not connected nc - not suppor ted

B103 SLEEP# Not Connected nc - -

B104 VCC_12V_16 12V VCC PWR - -

B105 VCC_12V_17 12V VCC PWR - -

B106 VCC_12V_18 12V VCC PWR - -

B107 VCC_12V_19 12V VCC PWR - -

B108 VCC_12V_20 12V VCC PWR - -

B109 VCC_12V_21 12V VCC PWR - -

B110 GND_27 Power Ground PWR - -

The termination resistors in this table are already mounted on the module. Refer to the design guide for information about additional termination resistors.

COMe-mTT10 / BIOS Operation

7 BIOS Operation

The module is equipped with AMI® Aptio, which is located in an onboard SPI serial flash memory.

7.1 Determining the BIOS Version

The AMI® Aptio version is displayed in the main menu of the setup utility.

» BIOS Vendor: American Megatrends

» Core Version: x.x.x.x

» BIOS Date: mm/dd/yyyy hh:mm:ss

» BIOS Version: NTC1RXXX

7.2 BIOS Update

Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with a detailed change description within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the BIOS Region (usually 4-8MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

COMe-mTT10 / BIOS Operation

Backup the BIOS / Create a BIOS with custom defaults:

» Change your BIOS settings according your needs

» Save and Exit Setup with option “Save as User Defaults”. Your customized settings are now stored inside the flash in

a second area additional to the manufacturer defaults

» Boot the module to DOS or EFI Shell with access to the update utilities

» Extract the BIOS region including your custom defaults with afuefix64.efi CBIOS.bin /O in EFI Shell or afudos.exe

CBIOS.rom /O in DOS

Now you can clone the BIOS with your customized default settings to other modules or external SPI flashes with above mention AFU utilites. On modules with Management Engine and Ethernet inside the Flash the same BIOS core version should already be programmed on the target.

AMI APTIO update utilities for DOS, EFI Shell and Windows are available for free at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

COMe-mTT10 / BIOS Operation

7.3 Setup Guide

The Aptio Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of menus to make changes and turn features on or off.

Functional keystrokes in POST:

Key Function

DEL

Enter Setup

Boot Menu

7.4 POST Codes

Important POST codes during boot-up

BIOS Setup

EFI Shell

Windows

7.4.1 Start AMI® Aptio Setup Utility

To start the AMI® BIOS setup utility, press <DEL> or <F2> when the following string appears during bootup. Press <DEL> to enter Setup

The Info Menu then appears. The Setup Screen is composed of several sections:

Setup Screen Location Function

Menu Bar Top Lists and selects all top level menus.

Legend Bar Right side Bottom Lists setup navigation keys.

Item Specific Help Window Right side Top Help for selected item.

Menu Window Left Center Selection fields for current menu.

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select f ields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- Change Option

<Enter> Execute command or select submenu.

<F1> General Help window.

<F2> Previous Values

<F3> Load the optimized def ault configuration.

<F4> Save and exit.

<Esc> Exit menu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓ Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

COMe-mTT10 / BIOS Operation

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window.

COMe-mTT10 / BIOS Operation

7.5 BIOS Setup

7.5.1 Main

Feature Options Description

System Language

English

Choose the system default language

System Date [mm/dd/yyyy] Set the Date. Use 'Tab' to switch between Date

elements

System Time [hh:mm:ss] Set the Time. Use 'Tab' to switch between Time

elements

COMe-mTT10 / BIOS Operation

Platform Information

COMe-mTT10 / BIOS Operation

7.5.2 Advanced

COMe-mTT10 / BIOS Operation

PCI Subsystem Settings

Feature Options Description

PCI ROM Priority Legacy ROM

EFI Compatible ROM

In case of multiple Option ROMs (Legacy and EFI Compatible), specifies what PCI Option ROM to launch

PCI Latency Timer

32 … 248 PCI Bus Clocks

Value to be programmed into PCI Latency Timer Register

VGA Palette Snoop

Disabled Enabled

Enables or Disables VGA Palette Registers Snooping

PERR# Generation

Disabled Enabled

Enables or Disables PCI Device to Generate PERR#

SERR# Generation

Disabled Enabled

Enables or Disables PCI Device to Generate SERR#

COMe-mTT10 / BIOS Operation

PCI Express Settings

Feature Options Description

Relaxed Ordering

Disabled Enabled

Enables or Disables PCI Express Device Relaxed Ordering

Extended Tag

Disabled Enabled

If Enabled allows device to use 8-bit Tag field as a requester

No Snoop Disabled

Enabled

Enables or Disables PCI Express Device No Snoop option

Maximum Payload

Auto 128 … 4096 Bytes

Set Maximum Payload of PCI Express Device or allow System BIOS to select the value

Maximum Read Request

Auto 128 … 4096 Bytes

Set Maximum Read Request Size of PCI Express Device or allow System BIOS to select the value

ASPM Support

Disabled Auto Force L0s

Set the ASPM Level: Force L0s - Force all links to L0s State. Auto - BIOS auto configure. Disable - Disables ASPM

Extended Sync

Disabled Enabled

If Enabled allows generation of Extended Synchronization patterns

Link Training Retry Disabled

2 3 5

Defines number of Retry Attepmts sof tware will take to retrain the link if previous training attempt was unsuccessful

Link Training Timeout (uS)

100

Defines number of Microseconds software will wait before polling 'Link Training' bit in Link Status register. Value range from 1 to 100uS

Unpopulated Links

Keep Link ON Disable Link

In order to save power, sofware will disable unpopulated PCI Express links, if this option set to 'Disable Link'

COMe-mTT10 / BIOS Operation

ACPI Settings

Feature Options Description

Enable ACPI Auto Configuration

Disabled Enabled

Enables or Disables BIOS ACPI Auto Configuration

Enable Hibernation

Disabled Enabled

Enables or Disables System ability to Hibernate (OS/S4 Sleep State). This option may be not effective with some OS.

ACPI Sleep State Suspend Disabled

S3 (StR)

Select the highest ACPI sleep state the system will enter when the SUSPEND button is pressed

Lock Legacy Resources

Disabled Enabled

Enables or Disables Lock of Legacy Resources

COMe-mTT10 / BIOS Operation

Thermal Configuration

Feature Options Description

Critical Trip Point

POR 30°C … 95°C

This value controls the temperature of the ACPI Critical Trip Point - the point in which the OS will shut the system off. Note: 100°C is the Plan Of Record (POR) for all Intel mobile processors

Passive Trip Point

Disabled 30°C … 100°C

This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin throttling the processor

- Passive TC1 Value

This value sets the TC1 value for the ACPI Passive Cooling Formula. Range 1 - 16

- Passive TC2 Value

This value sets the TC2 value for the ACPI Passive Cooling Formula. Range 1 - 16

- Passive TSP Value

This item sets the TSP value for the ACPI Passive Cooling Formula. It represents in tenth of a second how often the OS will read the temperature when passive cooling is enabled. Range 2 - 32

COMe-mTT10 / BIOS Operation

Passive Cooling

The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation

ΔP[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt)

ΔP is the performance delta, Tt is the target temperature = passive cooling trip point. The two coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply. It’s up to the end user to set the cooling preference of the system by setting the appropriate trip points in the BIOS setup.

See chapter 12 of the ACPI specification (www.acpi.info) for more details

COMe-mTT10 / BIOS Operation

ACPI Wake Event Configuration

Feature Options Description

Wake On Lan

Disable Enable

Enable / Disable WOL

Wake On USB

Disable Enable

Enable / Disable Wake On USB. This works only on ports powered with standby voltage

COMe-mTT10 / BIOS Operation

CPU Configuration

Feature Options Description

Intel SpeedStep Disabled

Enabled

Enables/Disables the Intel Speedstep Technology (E)IST

Hyper-Threading Disabled

Enabled

Enables/Disables the Intel® Hyper Threading Technology HTT

Execute Disable Bit Disabled

Enabled

XD can prevent certain classes of malicious buffer overflow attacks when combined with a supporting OS

Limit CPUID Value Limit

Disabled Enabled

Disabled for Windows XP

Intel Virtualization Technology

Disabled Enabled

When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology

TM support Disabled

Enabled

Enable CPU thermal management

C States Disabled

Enabled

Enable/Disable CPU Power Management. Allows CPU to to Idle States when it's not 100% utilized

Enhanced C1 Disabled

Enabled

Enable or Disable Enhanced C1 State

Enhanced C2 Disabled

Enabled

Enable or Disable Enhanced C2 State

Enhanced C3 Disabled

Enabled

Enable or Disable Enhanced C3 State

Enhanced C4 Disabled

Enabled

Enable or Disable Enhanced C4 State

COMe-mTT10 / BIOS Operation

Miscellaneous

Feature Options Description

S5 Eco

Disabled Enabled

Reduce supply current in Soft Off State S5 to less than 1mA. If enabled, power button is the only wakeup source in S5. See chapter S5 Eco for more details

Network OpROMs Disabled

Onboard only Addon cards only Both

Enable or Disable Legacy Boot Option for Network Devices

Storage OpROMs Disabled

Onboard only Addon cards only Both

Enable or Disable Legacy Boot Option for Mass Storage Controllers

AHCI EFI Driver Disabled

Enabled

Enable or Disable onboard AHCI EFI driver

COMe-mTT10 / BIOS Operation

Trusted Computing

Feature Options Description

TPM Support Disabled

Enabled

Enables or Disables TPM support. O.S. will not show TPM. Reset of platform is required

TPM State

Disabled Enabled

Turn TPM On/Off. NOTE: Your Computer will reboot to change State of TPM

COMe-mTT10 / BIOS Operation

Clock Control

Feature Options Description

Spread Spectrum

Disabled Enabled

Enable/Disable Spread Spectrum

COMe-mTT10 / BIOS Operation

Watchdog

Feature Options Description

Auto-reload

Disabled Enabled

Enable automatic reload of watchdog timers on timeout

Global Lock

Disabled Enabled

If set to enabled, all Watchdog registers (except WD_KICK) become read only until the board is reset

Stage 1 Mode

Disabled Reset Delay

Select Action for first Watchdog stage

- Assert WDT Signal

Disabled Enabled

Enable/Disable assertion of WDT signal to baseboard on stage timeout

- Stage 1 Timout 1s 5s 10s 30s 1m 3m 10m 30m

Select Timeout value for first watchdog stage

Stage 2 Mode

Disabled Reset

Select Action for second Watchdog stage

- Assert WDT Signal

Disabled Enabled

Enable/Disable assertion of WDT signal to baseboard on stage timeout

- Stage 2 Timout 1s 5s 10s 30s 1m 3m 10m 30m

Select Timeout value for second watchdog stage

COMe-mTT10 / BIOS Operation

Smart Battery Configuration

Feature Options Description

M.A.R.S. Disabled

AUTO Charger Manager

Preset M.A.R.S. Smart Battery System mode. System must be restarted to reflect mode changes

SMBAlert Disabled

Enabled

Enable/Disable SMBAlert# handling in chipset

COMe-mTT10 / BIOS Operation

Battery Information

COMe-mTT10 / BIOS Operation

SMBus Speed

Feature Options Description

SMBus Speed

10kHz 50kHz 100kHz

Select SMBus Speed

COMe-mTT10 / BIOS Operation

Onboard I2C Speed

Feature Options Description

Onboard I2C Speed 1kHz

10kHz 50kHz 100kHz 200kHz 400kHz

Select Onboard I2C Bus Speed in kHz, min. 1kHz, max. 400kHz

COMe-mTT10 / BIOS Operation

USB Configuration

Feature Options Description

Legacy USB Support

Enabled Disabled AUTO

Enables Legacy USB support. AUTO option disables legacy support if no USB devices are connected. DISABLE option will keep USB devices available only for EFI applications.

EHCI Hand-off

Enabled Disabled

This is a workaround for OSes without EHCI hand-off Support. The EHCI ownership change should be claimed by EHCI driver

USB Beep

Enabled Disabled

Send speaker beep for device attach / detach

Device transfer time-out 1 sec

5 sec 10 sec 20 sec

The time-out value for Control, Bulk and Interrupt transfers

Device reset time-out 10sec

20sec 30sec 40sec

USB mass storage device Start Unit command time-out

Device power-up delay

Auto Manual

Maximum time the device will take before it properly reports itself to the Host Controller. 'Auto' uses default value: for a Root port it is 100ms, for a Hub port the delay is taken from Hub descriptor

Device power-up delay in seconds

Delay range is 1..40 seconds, in one second increments

COMe-mTT10 / BIOS Operation

SDIO Configuration

Feature Options Description

SDIO Access Mode

Auto DMA PIO

Auto Option: Access SD device in DMA mode if controller supports it, otherwise in PIO mode. DMA Option: Access SD device in DMA mode, PIO Option: Access SD device in PIO mode

External SDIO

Disabled Enabled

Enable/Disable external SDIO slot on Acrrier board. If disabled, the SDIO pins for this Slot will be used as GPIOs

Ext. SDIO Clock

25MHz

12.5MHz

6.25MHz

Select the maximum allowable speed for the slot. Actual speed may be lower depending on controller capabilities

Onboard SDIO Clock

25MHz

12.5MHz

6.25MHz

Select the maximum allowable speed for the slot. Actual speed may be lower depending on controller capabilities

PowerOn Delay 10

50ms 200ms 500ms 1s

Select SDIO PowerOn Delay

COMe-mTT10 / BIOS Operation

Module H/W Monitor

Hardware Monitor measurements and configuration for the onboard WINBOND W83L771W.

Feature Value/Options Description

Local Temperature xx°C Shows the internal temperature of onboard HWM

CPU Temperature xx°C Shows the measured temperature of the CPU Diode with

onboard HWM

COMe-mTT10 / BIOS Operation

Super IO Configuration

This setup option is available if a LPC SuperI/O Nuvoton 83627 is present on the baseboard. By default the COMe-mTT10 supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The hardware monitor is not supported in setup.

COMe-mTT10 / BIOS Operation

Serial Port 0 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or Disable Serial Port (COM) 0

Change Settings

AUTO IO=3F8h; IRQ=4; IO=3F8h, IRQ=3,4,5,6,7,10,11,12; IO=2F8h, IRQ=3,4,5,6,7,10,11,12; IO=3E8h, IRQ=3,4,5,6,7,10,11,12; IO=2E8h, IRQ=3,4,5,6,7,10,11,12;

Select an optimal setting for SuperIO device.

Device Mode

Standard Serial Port Mode IrDA 1.0 (HP SIR) Mode ASKIR Mode

Change the Serial Port mode.

Serial Port 1 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or Disable Serial Port (COM) 1

Change Settings

AUTO IO=2F8h; IRQ=3; IO=3F8h, IRQ=3,4,5,6,7,10,11,12; IO=2F8h, IRQ=3,4,5,6,7,10,11,12; IO=3E8h, IRQ=3,4,5,6,7,10,11,12; IO=2E8h, IRQ=3,4,5,6,7,10,11,12;

Select an optimal setting for SuperIO device.

Device Mode

Standard Serial Port Mode IrDA 1.0 (HP SIR) Mode ASKIR Mode

Change the Serial Port mode.

COMe-mTT10 / BIOS Operation

Parallel Port Configuration

Feature Options Description

Parallel Port Disabled

Enabled

Enable or Disable the Parallel Port (LPT/LPTE)

Change Settings

AUTO IO=378h; IRQ=5; IO=378h, IRQ=5,6,7,10,11,12; IO=278h, IRQ=5,6,7,10,11,12; IO=3BCh, IRQ=5,6,7,10,11,12; IO=378h; IO=278h; IO=3BCh;

Select an optimal setting for SuperIO device.

Device Mode

Standard Parallel Port Mode EPP Mode ECP Mode EPP Mode & ECP Mode

Change the Printer Port mode.

COMe-mTT10 / BIOS Operation

Serial Port Console Redirection

Feature Options Description

Console Redirection

Disabled Enabled

Enable/Disable Serial Port COM0 Console Redirection

Console Redirection

Disabled Enabled

Enable/Disable Serial Port COM1 Console Redirection

Console Redirection

Disabled Enabled

Enable/Disable Serial Port COM2 Console Redirection

Console Redirection

Disabled Enabled

Enable/Disable Serial Port COM3 Console Redirection

Console Redirection Disabled

Enabled

Enable/Disable Serial Port for Out-of-Band Management / Windows EMS

COMe-mTT10 / BIOS Operation

COM0-3 Console Redirection Settings

Feature Options Description

Terminal Type VT100

VT100+ VT_UTF8 ANSI

VT100: ASCII char set. VT100+: Extends VT100 to support color, function keys, etc. VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes ANSI: Extended ASCII char set.

Bits per second 9600

19200 38400 57600 115200

Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds

Data Bits 7

Data Bits

Parity

None Even Odd Mark Space

A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the num of 1's in the data bits is even. Odd: parity bit is 0 if num of 1's in the data bits is odd. Mark: parity bit is always 1. Space: Parity bit is always 0. Mark and Space Parity do not allow for error detection.

Stop Bits

1 2

Stop Bits indicate the end of a serial data packet. (A Start bit indicates the beginning). The standard setting is 1 stop bit. Communication with slow devices may require more than 1 stop bit.

Flow Control

None Hardware RTS/CTS

Flow control can prevent data loss from buffer overf low. When sending data, if the receiving buffers are full, a 'stop' signal can be sent to stop the data flow. Once the buffers are empty, a 'star t' signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop signals

Recorder Mode

Disabled Enabled

With this mode enabled only text will be sent. This is to capture terminal data.

Resolution 100×31

Disabled Enabled

Enables or disables extended terminal resolution

Legacy OS Redirection Resolution

80×24 80×25

On Legacy OS, the Number of Rows and Columns supported redirection

COMe-mTT10 / BIOS Operation

Out-of-Band Management Port Console Redirection Settings

Feature Options Description

Out-of-Band Mgmt Port COM0

COM1 COM2 (PCI Bus10,Dev10,Func2) COM3 (PCI Bus10,Dev10,Func3)

Microsoft Windows Emergency Management Services (EMS) allows for remote management of a Windows Server OS through a serial por t

Terminal Type VT100

VT100+ VT_UTF8 ANSI

VT100: ASCII char set. VT100+: Extends VT100 to support color, function keys, etc. VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes ANSI: Extended ASCII char set.

Bits per second 9600

19200 38400 57600 115200

Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds

Flow Control

None Hardware RTS/CTS Software Xon/Xoff

COMe-mTT10 / BIOS Operation

7.5.3 Chipset

COMe-mTT10 / BIOS Operation

North Bridge Chipset Configuration

Feature Options Description

IGD Mode Select Disabled

Enabled, 1MB Enabled, 4MB Enabled, 8MB Enabled, 16MB Enabled, 32MB Enabled, 48MB Enabled, 64MB

Select the amount of system memory used by the Integrated Graphics Device

MSAC Mode Select Enabled, 512MB

Enabled, 256MB Enabled, 128MB

Select the size of the graphics memory aper ture and untrusted space. Used by the Integrated Graphics Device

Video Driver

EMGD VBIOS EMGD GOP

Select VBIOS if legacy support is required, GOP to speed up POST

Flat Panel Type

AUTO LVDS 800×600 18Bit

AUTO configuration supports SDVO. If no monitor attached, LVDS will be activated. Use VESA EDID to auto-configure LVDS Panels

Panel Color Depth

18 Bit 24 Bit

For internal LVDS EDID detection, select the Panel Color Depth

Backlight Control None/External

PWM I2C

Backlight Control Setting

Backlight Value

128

Set LCD backlight brighness

Auto detection is only working with EDID panel data. Set Flat Panel Type to SVGA if your panel is not detected automatically or when using a LVDStoDVI solution with DVI Monitor resolution over 1280x768, 80MHz.

COMe-mTT10 / BIOS Operation

Due to space limitations due to simultaneous SDVO and LVDS support only one manual LVDS resolutions is supported in setup. With Intel® EMGD you can change this resolution and create a new VideoBIOS according your requirements. Please contact your local support to implement your customized VBIOS into the BIOS

COMe-mTT10 / BIOS Operation

South Bridge Chipset Configuration

Feature Options Description

Audio Controller Disabled

Enabled Auto

Control Detection of the High definition audio (Azalia) device. Disabled = HDaudio will be unconditionally disabled. Enabled = HDaudio will be unconditionally enabled. Auto = HDaudio will be enabled if present, disabled otherwise

- Azalia PME Enable

Disabled Enabled

Enable/Disable Power Management capability of Audio Controller

- Azalia Vci Enable

Disabled Enabled

Enable/Disable Azalia Vci

SMBUS Controller Disabled

Enabled

SMBus Controller options

Serial IRQ Mode Disabled

Enabled

SMBus Controller options

High Precision Timer

Continuous Quiet

Set the Serial IRQ Mode

COMe-mTT10 / BIOS Operation

PCI Express Ports Configuration

Feature Options Description

BIOS Hot-Plug Support Disabled

Enabled

If ENABLED allows BIOS build in Hot-Plug Support. Use this feature if OS does not support PCI Express and SHPC hot-plug natively

I/O Resources Padding

Disabled 4 K 8 K 16 K 32 K

Padd PCI I/O Resources bihing the bridge for Hot-Plug

MMIO 32 bit Resources Padding Disabled

1 M 2 M 4 M 8 M 16 M 32 M 64 M 128 M

Padd PCI MMIO 32-bit Resources behind the bridge for Hot-Plug

PFMMIO 32 bit Resources Padding Disabled

1 M 2 M 4 M 8 M 16 M 32 M 64 M 128 M

Padd PCI MMIO 32-bit Prefetchable Resources behind the bridge for Hot-Plug

PCI Express Card 0 Port 0

Port 1 Port 2 Disabled

Controls PCIe Port for ExpressCard support

PCI Express Card 1 Port 0

Port 1 Port 2 Disabled

Controls PCIe Port for ExpressCard support

COMe-mTT10 / BIOS Operation

PCI Express Root Port 0/1/2

Feature Options Description

PCI Express Root Port Disabled

Enabled

Control the PCI Express Root Port

COMe-mTT10 / BIOS Operation

PPM Config

Feature Options Description

C-State POPUP Disabled

Enabled

Enable/Disable C-state POPUP

COMe-mTT10 / BIOS Operation

7.5.4 Boot

Feature Options Description

Setup Prompt Timeout

Number of seconds to wait for setup activation key. 65535 (0xFFFF) means idefinite waiting. 0 means no wait (not recommended)

Bootup NumLock State

On Off

Select the keyboard NumLock state

Quiet Boot

Disabled Enabled

Enables/Disables Quiet Boot option (Boot logo)

New HDD Priority

Low High

Boot priority for new connected HDD

GateA20 Active

Upon Request Always

Upon Request: GA20 can be disabled using BIOS services. Always: do not allow disabling GA20; this option is useful when any RT code is executed above 1MB

Option ROM Messages

Force BIOS Keep Current

Set display mode for Option ROM

Interrupt 19 Capture

Disabled Enabled

Enabled: Allows Option ROMs to trap INT19

Boot Option #1 Boot Option #2 Boot Option #3 …

Boot Device Disabled

Set the system boot order by device group

Hard Drive BBS Prior ities - Set the order of the legacy devices in this group

CD/DVD ROM Drive BBS Priorities - Set the order of the legacy devices in this group

Floppy Drive BBS Prior ities - Set the order of the legacy devices in this group

COMe-mTT10 / BIOS Operation

Boot Option Priority

By default, AMI APTIO uses following boot priority if at least on device of a group is connected:

» Boot Option #1: Prio 1 Hard Disk

» Boot Option #2: Built-in EFI Shell

» Boot Option #3: Prio 1 HDD UEFI boot option

» Boot Option #4: Prio 1 CD/DVD ROM Drive

» Boot Option #5: Prio 1 Floppy UEFI boot option

» Boot Option #6: Prio 1 Floppy Drive

HDD and CD/DVD-ROM group internal drive priority

The internal device priority for Hard Disks and Optical drives is:

» 1. SATA #0/#1

» 2. USB

COMe-mTT10 / BIOS Operation

7.5.5 Security

Feature Options Description

Administrator Password - Set the Administrator Password for Setup Access

User Password - Set User Password

COMe-mTT10 / BIOS Operation

7.5.6 Save & Exit

Feature Options Description

Save Changes and Exit - Exit system setup after saving the changes

Discard Changes and Exit - Exit system setup without saving any changes

Save Changes and Reset - Reset system after saving the changes

Discard Changes and Reset - Reset system without saving any changes

Save Changes - Save changes made so far to any of the setup options

Discard Changes - Discard changes made so far to any of the setup options

Restore Defaults - Restore/Load Default values for all the setup options

Save as User Defaults - Save the changes made so far as User Defaults

Restore User Defaults - Restore the User Defaults to all the setup options

Boot Override List of all boot options Boot directly from selected device

. . . . . . . . .. . . . . . . . . . .

COMe-mTT10 / BIOS Operation

. . . . . . . . . . . . . . . . . . . .

. . . . . . .

Corporate Offices

Europe, Middle East & Africa Oskar-von-Miller-Str. 1 85386 Eching/Munich Germany Tel.: +49 (0)8165/ 77 777 Fax: +49 (0)8165/ 77 219

info@kontron.com

North America 14118 Stowe Drive Poway, CA 92064-7147 USA Tel.: +1 888 294 4558 Fax: +1 858 677 0898

info@us.kontron.com

Asia Pacific 17 Building,Block #1,ABP. 188 Southern West 4th Ring Beijing 100070, P.R.China Tel.: + 86 10 63751188 Fax: + 86 10 83682438

info@kontron.cn

Kontron COMe-mTT10 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 Naming clarification

2.3 Understanding COM Express® Functionality

2.4 COM Express® Documentation

2.5 COM Express® Benefits

3 Product Specification

3.1 Modules & Accessories

3.2 Functional Specification

Processor

CPU specifications

Memory

Graphics Core

Monitor output

LVDS

Display Interfaces

Platform Controller Hub

Storage

Connectivity

Ethernet

Misc Interfaces and Features

Kontron Features

Additional features

Power Features

Power Consumption and Performance

Real Time Clock

3.3 Block Diagram

3.4 Electrical Specification

3.4.1 Supply Voltage

3.4.2 Power Supply Rise Time

3.4.3 Supply Voltage Ripple

3.4.4 Power Consumption

3.4.5 ATX Mode

3.4.6 Single Supply Mode

3.5 Power Control

Power Supply

Power Button (PWRBTN#)

Power Good (PWR_OK)

Reset Button (SYS_RESET#)

SM-Bus Alert (SMB_ALERT#)

3.6 Environmental Specification

3.6.1 Temperature Specification

3.6.2 Humidity

3.7 Standards and Certifications

RoHS II

Component Recognition UL 60950-1

WEEE Directive

Conformal Coating

Shock & Vibration

PTCRB

3.8 MTBF

3.9 Mechanical Specification

Module Dimension

Height

3.10 Thermal Management, Heatspreader and Cooling Solutions

4 Features and Interfaces

4.1 Onboard SSD

Basic features of the SATA NANDrives

Single-level Cell (SLC) NANDrive™

Multi-level Cell (MLC) NANDrive™

4.2 S5 Eco Mode

4.3 LPC

4.4 Serial Peripheral Interface (SPI)

4.5 SPI boot

Recommended SPI boot flash types for 8-SOIC package

Using an external SPI flash

External SPI flash on Modules with Intel® ME

4.6 M.A.R.S.

4.7 UART