Kontron COMe-mSP1 User Manual

COMe-mSP1

Document Revision 160

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................9

2.4 COM Express® Documentation....................................................................................................... 10

2.5 COM Express® Benefits................................................................................................................ 10

3 Product Specification...........................................................................11

3.1 Modules & Accessories................................................................................................................. 11

3.2 Functional Specification............................................................................................................... 13

3.3 Block Diagram............................................................................................................................ 17

3.4 Electrical Specification................................................................................................................18

3.4.1 Supply Voltage........................................................................................................................... 18

3.4.2 Power Supply Rise Time................................................................................................................ 18

3.4.3 Supply Voltage Ripple.................................................................................................................. 18

3.4.4 Power Consumption..................................................................................................................... 18

3.4.5 ATX Mode.................................................................................................................................. 19

3.4.6 Single Supply Mode..................................................................................................................... 19

3.5 Power Control............................................................................................................................ 20

3.6 Environmental Specification......................................................................................................... 21

3.6.1 Temperature Specification............................................................................................................ 21

3.6.2 Humidity................................................................................................................................... 21

3.7 Standards and Certifications......................................................................................................... 22

3.8 MTBF........................................................................................................................................ 24

3.9 Mechanical Specification.............................................................................................................. 25

3.9.1 Module Dimension...................................................................................................................... 25

3.9.2 Height on Top............................................................................................................................ 25

3.9.3 Height on Bottom....................................................................................................................... 25

3.9.4 Mechanical Drawing.................................................................................................................... 25

3.10 Thermal Management.................................................................................................................. 26

3.11 Heatspreader............................................................................................................................. 26

4 Features and Interfaces.......................................................................27

4.1 Onboard SSD.............................................................................................................................. 27

4.2 LPC.......................................................................................................................................... 28

www.kontron.com

COMe-mSP1 /

4.3 LPC boot................................................................................................................................... 29

4.4 M.A.R.S.................................................................................................................................... 30

4.5 Fast I2C & SMBus........................................................................................................................ 31

4.6 JIDA16 and JIDA32..................................................................................................................... 32

4.7 K-Station 1................................................................................................................................ 33

4.8 K-Station & API Resources............................................................................................................ 34

4.8.1 I2C.......................................................................................................................................... 34

4.8.2 Storage.................................................................................................................................... 34

4.8.3 GPIO........................................................................................................................................ 34

4.8.4 Hardware Monitor....................................................................................................................... 34

4.9 GPIO - General Purpose Input and Output.........................................................................................35

4.10 Watchdog Timer.......................................................................................................................... 36

4.11 Flash Backup Feature................................................................................................................... 37

4.12 Speedstep Technology................................................................................................................. 39

4.13 C-States.................................................................................................................................... 40

4.14 Hyper Threading......................................................................................................................... 41

4.15 ACPI Suspend Modes and Resume Events..........................................................................................42

4.16 USB......................................................................................................................................... 43

4.17 SDIO........................................................................................................................................ 44

4.18 Graphics Interface...................................................................................................................... 45

4.19 LPC Bus..................................................................................................................................... 47

5 System Resources...............................................................................49

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 49

5.1.1 In 8259 PIC Mode........................................................................................................................ 49

5.1.2 In APIC mode............................................................................................................................. 50

5.2 Memory Area.............................................................................................................................. 51

5.3 I/O Address Map......................................................................................................................... 51

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 52

5.5 Internal I2C Bus......................................................................................................................... 52

5.6 JILI I2C Bus............................................................................................................................... 52

5.7 SDVO I2C Bus............................................................................................................................. 52

5.8 System Management (SM) Bus....................................................................................................... 52

5.9 Pinout List................................................................................................................................ 53

5.9.1 General Signal Description............................................................................................................ 53

5.9.2 Connector X1A Row A................................................................................................................... 54

5.9.3 Connector X1A Row B................................................................................................................... 56

5.9.4 SDVO Connector J1801 (optional)...................................................................................................58

5.9.5 XDP Connector J1400 (optional).................................................................................................... 59

6 BIOS Operation...................................................................................60

6.1 Determining the BIOS Version....................................................................................................... 60

6.2 BIOS Update.............................................................................................................................. 60

6.3 Setup Guide............................................................................................................................... 61

6.3.1 Start AMI® BIOS Setup Utility........................................................................................................61

6.4 BIOS Setup................................................................................................................................ 63

6.4.1 Main Menu................................................................................................................................ 63

6.4.2 Module Info............................................................................................................................... 67

4

COMe-mSP1 /

6.4.3 Advanced Menu.......................................................................................................................... 71

6.4.4 Advanced PCI/PnP Settings........................................................................................................... 91

6.4.5 Boot........................................................................................................................................ 91

6.4.6 Security.................................................................................................................................... 94

6.4.7 Advanced Chipset Settings............................................................................................................ 94

6.4.8 Exit Menu.................................................................................................................................. 99

5

COMe-mSP1 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2012 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

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COMe-mSP1 / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-mSP1 / Introduction

2 Introduction

2.1 Product Description

This credit card sized COM Express® mini module is compatible to COM Express® pin-out Type 1. On 55 mm x 84 mm
footprint COMe-mSP1 is a perfect fit for the next generation of low power, ultra-mobile applications that require energy
saving x86 processor performance, high-end graphics, PCI Express and Serial ATA combined with longer battery life. These
include handheld devices for medical or multi-media applications, small mobile data systems and a host of new
applications that have not previously been possible due to size or power consumption limitations.

The Kontron COM Express® mini COM, COMe-mSP1, is based on the highly-efficient Intel® Atom™ Z5xx processor series
and Intel® System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single,
space saving chipset design. With only one tenth of the Thermal Design Power and one seventh the size of ULV processors
at an identical performance, the COMe-mSP1 COM offers an unprecedented power consumption / performance ratio for
x86-based ultra-mobile designs.

The COMe-mSP1 with Flash and memory on-board support 1 PCI Express x1 (opt. 2 x1 if no onboard LAN), Serial ATA, High
Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity
and 8x USB provides fast and sufficient interfaces for external peripherals.

All above mentioned requirements are supported by COM Express® mini - small power - low size - high performance.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known

as ETXexpress®

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known

as microETXexpress®

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as

nanoETXexpress

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

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COMe-mSP1 / Introduction

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO

1x optional 1x optional - -

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

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COMe-mSP1 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-mSP1. Additional references are are available from your Kontron Support or from
PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available from the PIGMG website by filling out the order form.

» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum

flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can
differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade
path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A
properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

10

COMe-mSP1 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® mini sized Computer-on-Module COMe-mSP1 (NOW1) follows pin-out Type 1 and is compatible to PICMG
specification COM.0 Rev 1.0. The COMe-mSP1, based on Intel's eMenlow platform, is available in different variants to
cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor SCH and Features

34001-2040-16-1 COMe-mSP1 Z530 2GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 2GB DDR2, 4GB SSD

34001-1040-16-1 COMe-mSP1 Z530 1GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 1GB DDR2, 4GB SSD

34001-5120-16-1 COMe-mSP1 Z530 512MB/2GB Intel® Atom™ Z530 US15W, 1xPCIe, 512MB DDR2, 2GB SSD

34001-1020-11-1 COMe-mSP1 Z510 1GB/2GB Intel® Atom™ Z510 US15W, 1xPCIe, 1GB DDR2, 2GB SSD

34001-5151-11-1 COMe-mSP1 Z530 512/512MB Intel® Atom™ Z510 US15W, 1xPCIe, 512MB DDR2, 512MB SSD

Extended temperature modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor SCH and Features

34001-1040-16-1EXT COMe-mSP1 Z530 1GB/4GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 1GB DDR2, 4GB SSD

34001-5120-16-1EXT COMe-mSP1 Z530 512/2GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 512MB DDR2, 2GB SSD

34001-5151-11-1EXT COMe-mSP1 Z510 512/512M E1 Intel® Atom™ Z510 US15W, 1xPCIe, LAN, 512MB DDR2, 512MB SSD

Possible memory and onboard Flash configurations 34001-MMFF-xx-x:

» MM = 51: 512MB DDR2 Memory (4 x 1Gb chips on bottom)

» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chips)

» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chips)

» FF = 00: without PATA SSD

» FF = 51: 512MB onboard PATA SSD

» FF = 10: 1GB onboard PATA SSD

» FF = 20: 2GB onboard PATA SSD

» FF = 40: 4GB onboard PATA SSD

Please contact your local sales for customized Memory and Flash variants or modules with
2xPCIe (no-LAN version)

11

COMe-mSP1 / Product Specification

Accessories

Product Number Carrier Boards

34101-0000-00-1 COM Express® Eval Carrier Type 10

34100-0000-00-0 COM Express® Reference Carrier HMI Type 1

Product Number Cooling & Mounting

34001-0000-99-0 HSP COMe-mSP1 thread

34001-0000-99-1 HSP COMe-mSP1 through

34001-0000-99-2 HSP COMe-mSP1 slim thread

34001-0000-99-0CO1 HSK COMe-mSP1 slim passive thread

34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs up to 10W)

34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs up to 5W)

34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs up to 3-5W)

34017-0000-00-0 COMe mMount KIT 5/8mm 1set

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)

34120-0000-00-2 ADA-COMe-T10-T2

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COMe-mSP1 / Product Specification

3.2 Functional Specification

Processor

The Intel® ATOM™ (Silverthorne) CPU family supports:

» Intel® Hyper-Threading Technology

» Intel® Virtualization Technology (VT-x)

» Idle States

» Enhanced Intel SpeedStep® Technology

» Intel® Demand Based Switching

» Thermal Monitoring Technologies

» Execute Disable Bit

CPU specifications

Processor Cores / Threads CPU Clock L2 Cache Bus Speed VT-x HTT EIST Max TDP

Intel® Atom™ Z510 1 / 1 1100MHz 512KB 400MHz No No Yes 2.0W

Intel® Atom™ Z530 1 / 2 1600MHz 512KB 533MHz YES YES Yes 2.2W

Memory

Sockets

memory down

Memory Type

DDR2-533

Maximum Size

2GB

Technology

Single Channel (64bit)

The total amount of memory available on the module is used for main memory and graphics memory. The Unified Memory
Architecture (UMA) manages how the system shares memory between the graphics controller and the processor. The
maximum supported memory configuration is 8 x 2Gbit (2GB). Usually modules are equipped with 8 x 1Gbit (1GB) or 4 x
1Gbit (512MB mounted on bottom side of the PCB).

8 memory chips are only supported on hardware revision CE 4.x.x or newer. Former
hardware revisions supports up to 4x2Gbit (1GB) system memory.

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COMe-mSP1 / Product Specification

Graphics Core

The integrated Intel® GMA 500 based on PowerVR SGX535 core supports:

Graphics Core Render Clock

200MHz, ,

Execution Units / Pixel Pipelines

4

Max Graphics Memory

352MB

GFX Memory Bandwidth (GB/s)

4.2

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

9.0c / 2.0

Shader Model

3.0

Hardware accelerated Video

H.264,MPEG2/4,VC1,WMV9

Independent/Simultaneous Displays

2 (with SDVO option)

Display Port

-

HDCP support

-

Monitor output

CRT max Resolution

-

TV out:

-

LVDS

LVDS Bits/Pixel

1x18 / 1x24

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1366x768, 112MHz

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

-

Digital Display Interface DDI1

SDVOB optional

Digital Display Interface DDI2

-

Digital Display Interface DDI3

-

Maximum Resolution on DDI

1600x1200

Chipset

The 130nm Intel System Controller Hub Poulsbo supports:

» PCI Express Revision 1.0

» USB 2.0

» USB Client

» SDIO 1.0

Storage

onboard SSD

512MB to 8GB SLC (PATA)

SD Card support

SD 1.1 shared with GPIO

IDE Interface

-

Serial-ATA

1x SATA 1.5GB/s

SATA AHCI

-

SATA RAID

-

When using a hard disk on SATA #0 as primary device for the operating system the boot
order should be changed according the usage. Wrong boot order may cause problems
writing the MBR during OS installation.

14

COMe-mSP1 / Product Specification

Connectivity

USB

8x USB 2.0

USB Client

1x USB Client (USB #7)

PCI

-

PCI External Masters

-

PCI Express

1x PCIe x1 Gen1

Max PCI Express

2x PCIe x1 without LAN

PCI Express x2/x4 configuration

-

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Hartwell)

Express Card Hot-plug is not supported by US15W SCH

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Audio

HD Audio

Onboard Hardware Monitor

WINBOND W83L771W

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT optional

Miscellaneous

-

TPM is only available on customized variants and requires BIOS NOW1R118 or newer. With
TPM option booting from external LPC FWH is not supported

Kontron Features

External I2C Bus

Fast I2C

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Single Staged

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 14V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

-

Misc Power Management

-

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COMe-mSP1 / Product Specification

Power Consumption and Performance

Full Load Power Consumption

4.9 - 6.2W

Kontron Performance Index

1108 - 1687

Kontron Performance/Watt

225 - 273

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The COMe-mSP1 supports:

» Microsoft Windows XP x86

» Microsoft Windows 7 x86

» Microsoft Windows Embedded Standard 7

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Linux

» WindRiver VxWorks

» QNX Neutrino

16

COMe-mSP1 / Product Specification

3.3 Block Diagram

17

COMe-mSP1 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 14V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.3V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-mSP1 variants is 4.9 - 6.2W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.

18

COMe-mSP1 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

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COMe-mSP1 / Product Specification

3.5 Power Control

Power Supply

The COMe-mSP1 supports a power input from 4.75 - 14V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-mSP1 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

20

COMe-mSP1 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

General Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended (E1) -25°C to +75°C -30°C to +85°C

Industrial grade (E2) -40°C to +85°C -40°C to +85°C

Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» Operating: 10% to 90% (non condensing)

» Non operating: 5% to 95% (non condensing)

21

COMe-mSP1 / Product Specification

3.7 Standards and Certifications

RoHS

The COMe-mSP1 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The COMe-mSP1 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

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COMe-mSP1 / Product Specification

Shock & Vibration

The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-mSP1 follows the requirements for electromagnetic

compatibility standards

» EN55022

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COMe-mSP1 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 209423 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

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COMe-mSP1 / Product Specification

3.9 Mechanical Specification

3.9.1 Module Dimension

» 55mm x 84mm (±0.2mm)

3.9.2 Height on Top

» Maximum approx. 3.5mm (withouth printed circuit board)

» Height is depending on (optional) CPU cooler / heat spreader

3.9.3 Height on Bottom

» Maximum approx. 3.5mm (without printed circuit board)

3.9.4 Mechanical Drawing

All dimensions are shown in millimeters. Tolerances should be ± 0.25mm [±0.010”], unless otherwise noted. The
tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004”]. The
220 pin module connector shall be mounted on the backside of the PCB and is seen “through” the board in this view. The 4
mounting holes shown in the drawing should use 6mm diameter pads and should have 2.7mm plated holes, for use with

2.5mm hardware. The pads should be tied to the PCB ground plane.

CAD drawings are available at EMD CustomerSection

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COMe-mSP1 / Product Specification

3.10 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mSP1. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other
cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the COMe-mSP1. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please
see the COM Express® Design Guide for further information on thermal management.

3.11 Heatspreader

Documentation and CAD drawings of COMe-mSP1 heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

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COMe-mSP1 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-mSP1 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to
performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives
are available:

Basic features of the PATA NANDrives

» 16-bit ATA/IDE Bus Interface with PIO Mode-6, Multi-Word DMA Mode-4 and Ultra DMA Mode-4

» RoHS compliant NAND flash type

» Hardware error detection and correction ECC

» Advanced wear leveling

» Bad block management

SLC NANDrive™

Flash Part No. GLS85LP0512P-S-I-LBTE GLS85LP1002P-S-I-FTE GLS85LP1004P-S-I-FTE GLS85LP1008P-S-I-FTE

Temperature Range

-40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C

Flash Size 512MB 2GB 4GB 8GB

NAND Type

SLC NAND SLC NAND SLC NAND SLC NAND

Sustained Read Speed

25 MB/s 28 MB/s 50 MB/s 50 MB/s

Sustained Write Speed

6 MB/s 11 MB/s 20 MB/s 39 MB/s

Total Bytes

456,744,960 2,000,388,096 4,068,384,768 8,136,769,536

Max LBA

892,080 3,907,008 7,946,064 15,892,128

Cylinders/Heads/Sectors

885/16/63 3,876/16/63 7,883/16/63 15,766/16/63

Active Mode Power

200mW 200mW 265mW 365mW

Program/Erase Cycles per Block

100k 100k 100k 100k

(Data based on GLS85LPxxxxP Datasheet Rev. 02.000 from 06-2012)

The NAND Flash types listed above are available on COMe-mSP1 hardware revision CE4.7.0
and COMe-cDC2 hardware revision CE 2.4.1 or newer. Please contact your local sales or
support for Flash specifications of SST Flash used on older revisions

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COMe-mSP1 / Features and Interfaces

4.2 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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COMe-mSP1 / Features and Interfaces

4.3 LPC boot

The COMe-mSP1 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be
activated with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

Using an external LPC Firmware Hub

To program an external LPC FWH follow these steps:

» Connect a 1MB LPC FWH to the module's LPC interface

» Open pin A34 to boot from the module BIOS

» Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided

on EMD Customer Section

» Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH

» Execute Flash.bat to flash the BIOS image to the external LPC FWH

» reboot

Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

» Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup

biosname.rom in Windows

Flash Backup should show “Enter new Password” first time saving custom defaults. If it is
not possible to set a new password or entering a password shows an error message, please
clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available

at Kontron’s Customer Section)

You can download all AMI CORE8 update utilities at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

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COMe-mSP1 / Features and Interfaces

4.4 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

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