Kontron COMe-mSP1 User Manual

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COMe-mSP1

Document Revision 160

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» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................9

2.4 COM Express® Documentation....................................................................................................... 10

2.5 COM Express® Benefits................................................................................................................ 10

3 Product Specification...........................................................................11

3.1 Modules & Accessories................................................................................................................. 11

3.2 Functional Specification............................................................................................................... 13

3.3 Block Diagram............................................................................................................................ 17

3.4 Electrical Specification................................................................................................................18

3.4.1 Supply Voltage........................................................................................................................... 18

3.4.2 Power Supply Rise Time................................................................................................................ 18

3.4.3 Supply Voltage Ripple.................................................................................................................. 18

3.4.4 Power Consumption..................................................................................................................... 18

3.4.5 ATX Mode.................................................................................................................................. 19

3.4.6 Single Supply Mode..................................................................................................................... 19

3.5 Power Control............................................................................................................................ 20

3.6 Environmental Specification......................................................................................................... 21

3.6.1 Temperature Specification............................................................................................................ 21

3.6.2 Humidity................................................................................................................................... 21

3.7 Standards and Certifications......................................................................................................... 22

3.8 MTBF........................................................................................................................................ 24

3.9 Mechanical Specification.............................................................................................................. 25

3.9.1 Module Dimension...................................................................................................................... 25

3.9.2 Height on Top............................................................................................................................ 25

3.9.3 Height on Bottom....................................................................................................................... 25

3.9.4 Mechanical Drawing.................................................................................................................... 25

3.10 Thermal Management.................................................................................................................. 26

3.11 Heatspreader............................................................................................................................. 26

4 Features and Interfaces.......................................................................27

4.1 Onboard SSD.............................................................................................................................. 27

4.2 LPC.......................................................................................................................................... 28

www.kontron.com

COMe-mSP1 /

4.3 LPC boot................................................................................................................................... 29

4.4 M.A.R.S.................................................................................................................................... 30

4.5 Fast I2C & SMBus........................................................................................................................ 31

4.6 JIDA16 and JIDA32..................................................................................................................... 32

4.7 K-Station 1................................................................................................................................ 33

4.8 K-Station & API Resources............................................................................................................ 34

4.8.1 I2C.......................................................................................................................................... 34

4.8.2 Storage.................................................................................................................................... 34

4.8.3 GPIO........................................................................................................................................ 34

4.8.4 Hardware Monitor....................................................................................................................... 34

4.9 GPIO - General Purpose Input and Output.........................................................................................35

4.10 Watchdog Timer.......................................................................................................................... 36

4.11 Flash Backup Feature................................................................................................................... 37

4.12 Speedstep Technology................................................................................................................. 39

4.13 C-States.................................................................................................................................... 40

4.14 Hyper Threading......................................................................................................................... 41

4.15 ACPI Suspend Modes and Resume Events..........................................................................................42

4.16 USB......................................................................................................................................... 43

4.17 SDIO........................................................................................................................................ 44

4.18 Graphics Interface...................................................................................................................... 45

4.19 LPC Bus..................................................................................................................................... 47

5 System Resources...............................................................................49

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 49

5.1.1 In 8259 PIC Mode........................................................................................................................ 49

5.1.2 In APIC mode............................................................................................................................. 50

5.2 Memory Area.............................................................................................................................. 51

5.3 I/O Address Map......................................................................................................................... 51

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 52

5.5 Internal I2C Bus......................................................................................................................... 52

5.6 JILI I2C Bus............................................................................................................................... 52

5.7 SDVO I2C Bus............................................................................................................................. 52

5.8 System Management (SM) Bus....................................................................................................... 52

5.9 Pinout List................................................................................................................................ 53

5.9.1 General Signal Description............................................................................................................ 53

5.9.2 Connector X1A Row A................................................................................................................... 54

5.9.3 Connector X1A Row B................................................................................................................... 56

5.9.4 SDVO Connector J1801 (optional)...................................................................................................58

5.9.5 XDP Connector J1400 (optional).................................................................................................... 59

6 BIOS Operation...................................................................................60

6.1 Determining the BIOS Version....................................................................................................... 60

6.2 BIOS Update.............................................................................................................................. 60

6.3 Setup Guide............................................................................................................................... 61

6.3.1 Start AMI® BIOS Setup Utility........................................................................................................61

6.4 BIOS Setup................................................................................................................................ 63

6.4.1 Main Menu................................................................................................................................ 63

6.4.2 Module Info............................................................................................................................... 67

COMe-mSP1 /

6.4.3 Advanced Menu.......................................................................................................................... 71

6.4.4 Advanced PCI/PnP Settings........................................................................................................... 91

6.4.5 Boot........................................................................................................................................ 91

6.4.6 Security.................................................................................................................................... 94

6.4.7 Advanced Chipset Settings............................................................................................................ 94

6.4.8 Exit Menu.................................................................................................................................. 99

COMe-mSP1 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-mSP1 / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe-mSP1 / Introduction

2 Introduction

2.1 Product Description

This credit card sized COM Express® mini module is compatible to COM Express® pin-out Type 1. On 55 mm x 84 mm footprint COMe-mSP1 is a perfect fit for the next generation of low power, ultra-mobile applications that require energy saving x86 processor performance, high-end graphics, PCI Express and Serial ATA combined with longer battery life. These include handheld devices for medical or multi-media applications, small mobile data systems and a host of new applications that have not previously been possible due to size or power consumption limitations.

The Kontron COM Express® mini COM, COMe-mSP1, is based on the highly-efficient Intel® Atom™ Z5xx processor series and Intel® System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single, space saving chipset design. With only one tenth of the Thermal Design Power and one seventh the size of ULV processors at an identical performance, the COMe-mSP1 COM offers an unprecedented power consumption / performance ratio for x86-based ultra-mobile designs.

The COMe-mSP1 with Flash and memory on-board support 1 PCI Express x1 (opt. 2 x1 if no onboard LAN), Serial ATA, High Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity and 8x USB provides fast and sufficient interfaces for external peripherals.

All above mentioned requirements are supported by COM Express® mini - small power - low size - high performance.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known

as ETXexpress®

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known

as microETXexpress®

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as

nanoETXexpress

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.

COMe-mSP1 / Introduction

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO

1x optional 1x optional - -

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

COMe-mSP1 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-mSP1. Additional references are are available from your Kontron Support or from PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available from the PIGMG website by filling out the order form.

» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum

flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.

COMe-mSP1 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® mini sized Computer-on-Module COMe-mSP1 (NOW1) follows pin-out Type 1 and is compatible to PICMG specification COM.0 Rev 1.0. The COMe-mSP1, based on Intel's eMenlow platform, is available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor SCH and Features

34001-2040-16-1 COMe-mSP1 Z530 2GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 2GB DDR2, 4GB SSD

34001-1040-16-1 COMe-mSP1 Z530 1GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 1GB DDR2, 4GB SSD

34001-5120-16-1 COMe-mSP1 Z530 512MB/2GB Intel® Atom™ Z530 US15W, 1xPCIe, 512MB DDR2, 2GB SSD

34001-1020-11-1 COMe-mSP1 Z510 1GB/2GB Intel® Atom™ Z510 US15W, 1xPCIe, 1GB DDR2, 2GB SSD

34001-5151-11-1 COMe-mSP1 Z530 512/512MB Intel® Atom™ Z510 US15W, 1xPCIe, 512MB DDR2, 512MB SSD

Extended temperature modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor SCH and Features

34001-1040-16-1EXT COMe-mSP1 Z530 1GB/4GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 1GB DDR2, 4GB SSD

34001-5120-16-1EXT COMe-mSP1 Z530 512/2GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 512MB DDR2, 2GB SSD

34001-5151-11-1EXT COMe-mSP1 Z510 512/512M E1 Intel® Atom™ Z510 US15W, 1xPCIe, LAN, 512MB DDR2, 512MB SSD

Possible memory and onboard Flash configurations 34001-MMFF-xx-x:

» MM = 51: 512MB DDR2 Memory (4 x 1Gb chips on bottom)

» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chips)

» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chips)

» FF = 00: without PATA SSD

» FF = 51: 512MB onboard PATA SSD

» FF = 10: 1GB onboard PATA SSD

» FF = 20: 2GB onboard PATA SSD

» FF = 40: 4GB onboard PATA SSD

Please contact your local sales for customized Memory and Flash variants or modules with 2xPCIe (no-LAN version)

COMe-mSP1 / Product Specification

Accessories

Product Number Carrier Boards

34101-0000-00-1 COM Express® Eval Carrier Type 10

34100-0000-00-0 COM Express® Reference Carrier HMI Type 1

Product Number Cooling & Mounting

34001-0000-99-0 HSP COMe-mSP1 thread

34001-0000-99-1 HSP COMe-mSP1 through

34001-0000-99-2 HSP COMe-mSP1 slim thread

34001-0000-99-0CO1 HSK COMe-mSP1 slim passive thread

34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs up to 10W)

34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs up to 5W)

34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs up to 3-5W)

34017-0000-00-0 COMe mMount KIT 5/8mm 1set

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)

34120-0000-00-2 ADA-COMe-T10-T2

COMe-mSP1 / Product Specification

3.2 Functional Specification

Processor

The Intel® ATOM™ (Silverthorne) CPU family supports:

» Intel® Hyper-Threading Technology

» Intel® Virtualization Technology (VT-x)

» Idle States

» Enhanced Intel SpeedStep® Technology

» Intel® Demand Based Switching

» Thermal Monitoring Technologies

» Execute Disable Bit

CPU specifications

Processor Cores / Threads CPU Clock L2 Cache Bus Speed VT-x HTT EIST Max TDP

Intel® Atom™ Z510 1 / 1 1100MHz 512KB 400MHz No No Yes 2.0W

Intel® Atom™ Z530 1 / 2 1600MHz 512KB 533MHz YES YES Yes 2.2W

Memory

Sockets

memory down

Memory Type

DDR2-533

Maximum Size

2GB

Technology

Single Channel (64bit)

The total amount of memory available on the module is used for main memory and graphics memory. The Unified Memory Architecture (UMA) manages how the system shares memory between the graphics controller and the processor. The maximum supported memory configuration is 8 x 2Gbit (2GB). Usually modules are equipped with 8 x 1Gbit (1GB) or 4 x 1Gbit (512MB mounted on bottom side of the PCB).

8 memory chips are only supported on hardware revision CE 4.x.x or newer. Former hardware revisions supports up to 4x2Gbit (1GB) system memory.

COMe-mSP1 / Product Specification

Graphics Core

The integrated Intel® GMA 500 based on PowerVR SGX535 core supports:

Graphics Core Render Clock

200MHz, ,

Execution Units / Pixel Pipelines

Max Graphics Memory

352MB

GFX Memory Bandwidth (GB/s)

4.2

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

9.0c / 2.0

Shader Model

3.0

Hardware accelerated Video

H.264,MPEG2/4,VC1,WMV9

Independent/Simultaneous Displays

2 (with SDVO option)

Display Port

HDCP support

Monitor output

CRT max Resolution

TV out:

LVDS

LVDS Bits/Pixel

1x18 / 1x24

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1366x768, 112MHz

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

Digital Display Interface DDI1

SDVOB optional

Digital Display Interface DDI2

Digital Display Interface DDI3

Maximum Resolution on DDI

1600x1200

Chipset

The 130nm Intel System Controller Hub Poulsbo supports:

» PCI Express Revision 1.0

» USB 2.0

» USB Client

» SDIO 1.0

Storage

onboard SSD

512MB to 8GB SLC (PATA)

SD Card support

SD 1.1 shared with GPIO

IDE Interface

Serial-ATA

1x SATA 1.5GB/s

SATA AHCI

SATA RAID

When using a hard disk on SATA #0 as primary device for the operating system the boot order should be changed according the usage. Wrong boot order may cause problems writing the MBR during OS installation.

COMe-mSP1 / Product Specification

Connectivity

USB

8x USB 2.0

USB Client

1x USB Client (USB #7)

PCI

PCI External Masters

PCI Express

1x PCIe x1 Gen1

Max PCI Express

2x PCIe x1 without LAN

PCI Express x2/x4 configuration

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Hartwell)

Express Card Hot-plug is not supported by US15W SCH

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Audio

HD Audio

Onboard Hardware Monitor

WINBOND W83L771W

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT optional

Miscellaneous

TPM is only available on customized variants and requires BIOS NOW1R118 or newer. With TPM option booting from external LPC FWH is not supported

Kontron Features

External I2C Bus

Fast I2C

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Single Staged

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 14V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

Misc Power Management

COMe-mSP1 / Product Specification

Power Consumption and Performance

Full Load Power Consumption

4.9 - 6.2W

Kontron Performance Index

1108 - 1687

Kontron Performance/Watt

225 - 273

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The COMe-mSP1 supports:

» Microsoft Windows XP x86

» Microsoft Windows 7 x86

» Microsoft Windows Embedded Standard 7

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Linux

» WindRiver VxWorks

» QNX Neutrino

COMe-mSP1 / Product Specification

3.3 Block Diagram

COMe-mSP1 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 14V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.3V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-mSP1 variants is 4.9 - 6.2W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on EMD Customer Section. Information there is available after registration.

COMe-mSP1 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 4.75 - 14V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

COMe-mSP1 / Product Specification

3.5 Power Control

Power Supply

The COMe-mSP1 supports a power input from 4.75 - 14V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-mSP1 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine does not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.

COMe-mSP1 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

General Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended (E1) -25°C to +75°C -30°C to +85°C

Industrial grade (E2) -40°C to +85°C -40°C to +85°C

Standard modules are available for commercial grade temperature range. Please see chapter Product Specification for available variants for extended or industrial temperate grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» Operating: 10% to 90% (non condensing)

» Non operating: 5% to 95% (non condensing)

COMe-mSP1 / Product Specification

3.7 Standards and Certifications

RoHS

The COMe-mSP1 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The COMe-mSP1 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

COMe-mSP1 / Product Specification

Shock & Vibration

The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-mSP1 follows the requirements for electromagnetic

compatibility standards

» EN55022

COMe-mSP1 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 209423 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered for separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

COMe-mSP1 / Product Specification

3.9 Mechanical Specification

3.9.1 Module Dimension

» 55mm x 84mm (±0.2mm)

3.9.2 Height on Top

» Maximum approx. 3.5mm (withouth printed circuit board)

» Height is depending on (optional) CPU cooler / heat spreader

3.9.3 Height on Bottom

» Maximum approx. 3.5mm (without printed circuit board)

3.9.4 Mechanical Drawing

All dimensions are shown in millimeters. Tolerances should be ± 0.25mm [±0.010”], unless otherwise noted. The tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004”]. The 220 pin module connector shall be mounted on the backside of the PCB and is seen “through” the board in this view. The 4 mounting holes shown in the drawing should use 6mm diameter pads and should have 2.7mm plated holes, for use with

2.5mm hardware. The pads should be tied to the PCB ground plane.

CAD drawings are available at EMD CustomerSection

COMe-mSP1 / Product Specification

3.10 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mSP1. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-mSP1. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please see the COM Express® Design Guide for further information on thermal management.

3.11 Heatspreader

Documentation and CAD drawings of COMe-mSP1 heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

COMe-mSP1 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-mSP1 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives are available:

Basic features of the PATA NANDrives

» 16-bit ATA/IDE Bus Interface with PIO Mode-6, Multi-Word DMA Mode-4 and Ultra DMA Mode-4

» RoHS compliant NAND flash type

» Hardware error detection and correction ECC

» Advanced wear leveling

» Bad block management

SLC NANDrive™

Flash Part No. GLS85LP0512P-S-I-LBTE GLS85LP1002P-S-I-FTE GLS85LP1004P-S-I-FTE GLS85LP1008P-S-I-FTE

Temperature Range

-40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C

Flash Size 512MB 2GB 4GB 8GB

NAND Type

SLC NAND SLC NAND SLC NAND SLC NAND

Sustained Read Speed

25 MB/s 28 MB/s 50 MB/s 50 MB/s

Sustained Write Speed

6 MB/s 11 MB/s 20 MB/s 39 MB/s

Total Bytes

456,744,960 2,000,388,096 4,068,384,768 8,136,769,536

Max LBA

892,080 3,907,008 7,946,064 15,892,128

Cylinders/Heads/Sectors

885/16/63 3,876/16/63 7,883/16/63 15,766/16/63

Active Mode Power

200mW 200mW 265mW 365mW

Program/Erase Cycles per Block

100k 100k 100k 100k

(Data based on GLS85LPxxxxP Datasheet Rev. 02.000 from 06-2012)

The NAND Flash types listed above are available on COMe-mSP1 hardware revision CE4.7.0 and COMe-cDC2 hardware revision CE 2.4.1 or newer. Please contact your local sales or support for Flash specifications of SST Flash used on older revisions

COMe-mSP1 / Features and Interfaces

4.2 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

COMe-mSP1 / Features and Interfaces

4.3 LPC boot

The COMe-mSP1 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

Using an external LPC Firmware Hub

To program an external LPC FWH follow these steps:

» Connect a 1MB LPC FWH to the module's LPC interface

» Open pin A34 to boot from the module BIOS

» Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided

on EMD Customer Section

» Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH

» Execute Flash.bat to flash the BIOS image to the external LPC FWH

» reboot

Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

» Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup

biosname.rom in Windows

Flash Backup should show “Enter new Password” first time saving custom defaults. If it is not possible to set a new password or entering a password shows an error message, please clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available

at Kontron’s Customer Section)

You can download all AMI CORE8 update utilities at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

COMe-mSP1 / Features and Interfaces

4.4 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

COMe-mSP1 / Features and Interfaces

4.5 Fast I2C & SMBus

The COMe-mSP1 integrates two configurable I2C buses. The external I2C provided via US15W GPIOs on COM Express® Connector Pin B33/B34, the LVDS I2C from US15W SCH is available on COM express® connector pin A83/A84. The I2C interface offers full MultiMaster and Clock Stretching support. Fast I2C and SMBus clock speed depends on the CPU performance and differs between ATOM™ Z510 and ATOM™ Z530 modules. See the tables below for measured values on COMe-mSP1 with BIOS NOW1R118.

JIDA/external I2C speed

JIDA/external I2C speed JILI I2C speed SMBus speed

Setup ATOM™ Z510 ATOM™ Z530 ATOM™ Z510 ATOM™ Z530 ATOM™ Z510 ATOM™ Z530

Extra high not suppor ted not supported not supported not supported 375 kHz 418 kHz

Very high 166 kHz 215 kHz 80 kHz 125 kHz 214 kHz 270 kHz

High 80 kHz 110 kHz 55 kHz 80 kHz 57 kHz 86 kHz

Medium 41 kHz 60 kHz 34 kHz 50 kHz 35 kHz 46 kHz

Slow 10 kHz 15 kHz 9.6 kHz 15 kHz 7.4 kHz 10 kHz

Very slow 1 kHz 2 kHz 1.5 kHz 2 kHz 0.7 kHz 1 kHz

Ultra slow 0.7 kHz 1 kHz not supported not suppor ted not supported not suppor ted

COMe-mSP1 / Features and Interfaces

4.6 JIDA16 and JIDA32

JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs running in Real Mode operating systems (i.e. MS DOS) to call certain functions implemented in the BIOS. These functions can be used to get module information, make settings and access the I2C Bus and the Watchdog unit. JIDA16 functions are INT 15h BIOS calls which are only available in 16 Bit Real Mode operating systems.

For 32bit operating systems (i.e. WindowsXP, Windows 7, Windows CE, VxWorks, Linux) a different JIDA implementation called JIDA32 is implemented. The same common driver for all JIDA32 capable modules talks to the JIDA32 part in the BIOS, which is hardware dependent to interact with the hardware.

Please refer to EMD Customer Section for detailed documentation, JIDA utilities and Libraries for DOS, Windows, Linux, VxWorks or QNX.

Usage of JIDA16 and JIDA32

COMe-mSP1 / Features and Interfaces

4.7 K-Station 1

Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example utility Kontron provides K-Station for most 32bit Windows Operating Systems. K-Station 1 is a summary of command line utilities (Shell Tools) for easy access to JIDA32 BIOS implementations. Second part of K-Station is a JAVA based example GUI which gives a view an all available features using the Shell Tools.

Following K-Station Shell Tools are available:

» KSystemSummary.exe (System Information)

» KGenInfo.exe (Module Information)

» KCPUPerf.exe (CPU Throttling control)

» KHWMon.exe (Hardware Monitoring)

» KI2CBus.exe (I2C and SMBus access)

» KIOPort.exe (GPIO control)

» KStorage.exe (JIDA EEPROM access to user bytes)

» KVGATool.exe (LVDS Backlight control)

» KWDog.exe (Watchdog control)

» KAMIMod.exe (AMICore8 BIOS Modification with Bootlogo or Usercode …)

» KFlash.exe (AMICore8 BIOS Update)

The full K-Station package, the stand-alone Shell Tools with drivers, example batch files and documentation is available on EMD Customer Section for free.

COMe-mSP1 / Features and Interfaces

4.8 K-Station & API Resources

4.8.1 I2C

BUS Function

I2C 0 External / JIDA I2C

I2C 1 SM-Bus

I2C 2 SDVO DDC

I2C 3 JILI DDC

4.8.2 Storage

Device Function

EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use)

4.8.3 GPIO

Port Function

IO-Port 0 GPI0 Port, Bit 0-3: Input, Bit 4-7: Output Direction Change possible with NOW1R117 and CE 4.6.0 or newer

4.8.4 Hardware Monitor

Sensor Function

Temp 0 Module Temperature (internal IC temperature of onboard Winbond W839771 HWM)

Temp 1 CPU ACPI Temperature (measured with Winbond W839771 HWM))

Temp 2 External SIO Winbond 83627 Temp Sensor 1)

Temp 3 External SIO Winbond 83627 Temp Sensor 2

Temp 4 External SIO Winbond 83627 Temp Sensor 3

FAN 0 External SIO Winbond 83627 FAN Sensor 0

FAN 1 External SIO Winbond 83627 FAN Sensor 1

FAN 2 External SIO Winbond 83627 FAN Sensor 2

Voltage 0 External SIO Winbond 83627 Voltage Sensor 0: CoreA

Voltage 1 External SIO Winbond 83627 Voltage Sensor 1: CoreB

Voltage 2 External SIO Winbond 83627 Voltage Sensor 2: 3.3V Battery

Voltage 3 External SIO Winbond 83627 Voltage Sensor 3: +3.3V

Voltage 4 External SIO Winbond 83627 Voltage Sensor 4: +5V

Voltage 5 External SIO Winbond 83627 Voltage Sensor 5: +5V_SB

Voltage 6 External SIO Winbond 83627 Voltage Sensor 6: +12V

Voltage 7 External SIO Winbond 83627 Voltage Sensor 7: -5V

Voltage 8 External SIO Winbond 83627 Voltage Sensor 8: -12V

COMe-mSP1 / Features and Interfaces

4.9 GPIO - General Purpose Input and Output

The offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available.

Signal Pin Description

GPI0 A54 General Purpose Input 0

GPI1 A63 General Purpose Input 1

GPI2 A67 General Purpose Input 2

GPI3 A85 General Purpose Input 3

GPO0 A93 General Purpose Output 0

GPO1 B54 General Purpose Output 1

GPO2 B57 General Purpose Output 2

GPO3 B63 General Purpose Output 3

Configuration

The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver download packet on our customer section.

To enable GPIO functionality, modules with HW revision CE 1.x.x must be reworked. Contact your local sales or support for further information. On modules with HW revision CE 4.x.x and BIOS R115 or newer GPIO/SDIO can be switched via BIOS setup option

The General Purpose Inputs and Outputs are not applicable to drive applications faster than 2ms. It’s recommended to use data transfer rates only up to 1 kHz.

General Purpose Outputs are high impedance until first write access

There is one IO Port controlled via onboard CPLD (1 Byte, Port 0) available and the 4 Inputs and 4 Outputs are fixed in direction. To access the GPIOs use the JIDA32 interface. You can write to a General Purpose Output with the upper half byte. To read a General purpose Input use the lower half byte.

Bit of GPIO Port0 Function COM Express Pin

0 GPI0 A54

1 GPI1 A63

2 GPI2 A67

3 GPI3 A85

4 GPO0 A93

5 GPO1 B54

6 GPO2 B57

7 GPO3 B63

COMe-mSP1 / Features and Interfaces

4.10 Watchdog Timer

You can configure the Watchdog Timer (WDT) in BIOS setup to start after a set amount of time after power-on boot. The WDT can also be controlled by the JIDA32 Library API. The application software should strobe the WDT to prevent its timeout. Upon timeout, the WDT resets and restarts the system. This provides a way to recover from program crashes or lockups.

Configuration

You can program the timeout period for the watchdog timer in two ranges:

» 1-second increments from 1 to 255 seconds

» 1-minute increments from 1 to 255 minutes

Contact Kontron Embedded Modules technical support for information on programming and operating the WDT.

COMe-mSP1 / Features and Interfaces

4.11 Flash Backup Feature

The COMe-mSP1 supports a new functionality called “Flash Backup”. This new feature allows saving custom defaults directly into the Flash. With invalid EEPROM data or without a CMOS EEPROM, the module will start up with these custom defaults. It’s possible to save this BIOS with changed defaults to an image and flash it on other modules.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

at Kontron’s Customer Section)

» Extract the BIOS including custom defaults with afudos or kflash utility for windows

Tool Command

AFUDOS

c:\>afudos.exe biosname.rom /O

KFLASH

c:\>kflash.exe backup biosname.rom

COMe-mSP1 / Features and Interfaces

Flash your BIOS with custom defaults:

To flash a BIOS with customized defaults extracted like described above, use following options

Operating System Command

Windows OS

c:\>kflash.exe flash biosname.rom /bncr

DOS

c:\>afudos.exe biosname.rom /p /b /n /c c:\>jidacmos.exe eep /clean

kflash.exe is a shell tool included in Kontron K-Station System Utility Package. jidacmos utility is included in the BIOS download packages at Kontron's customer section.

COMe-mSP1 / Features and Interfaces

4.12 Speedstep Technology

The Intel® processors offers the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It let you customize high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By disabling the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

COMe-mSP1 / Features and Interfaces

4.13 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns of f the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

COMe-mSP1 / Features and Interfaces

4.14 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the processor—those that store the architectural state but not duplicating the main execution resources. This allows a HyperThreading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies on the Operating System.

COMe-mSP1 / Features and Interfaces

4.15 ACPI Suspend Modes and Resume Events

The COMe-mSP1 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is not supported by the BIOS (S4_BIOS) but S4_OS is supported by the following operating systems:

» Windows XP

» Windows Vista

» Windows 7

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

(1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage

(2) WakeOnLan must be enabled in BIOS setup and driver options

COMe-mSP1 / Features and Interfaces

4.16 USB

The USB interface comes with three USB controllers (6 USB ports). The USB configuration of the COMe-mSP1 module is described in the following table:

COM Express Port SCH US15W Port Description

USB0 USB0 USB 2.0 compliant

USB1 USB1 USB 2.0 compliant

USB2 USB4 USB 2.0 compliant

USB3 USB5 USB 2.0 compliant

USB4 USB6 Not USB 2.0 compliant, no UHCI controller (no USB 1.1 / USB 2.0 only)

USB5 USB7 Not USB 2.0 compliant, no UHCI controller (no USB 1.1 / USB 2.0 only)

USB6 USB3 USB 2.0 compliant

USB7 USB2 USB Client or USB 2.0 compliant port (configurable in BIOS Setup)

Internal USB mapping from US15W SCH

USB Client Port

The USB interface supports also one USB client port (USB port 7) that can be activated in setup. If the client function is disabled in the BIOS this port acts as a normal USB 2.0 port. Please be aware that USB power lines may not be connected on the USB client port.

Special USB client and host driver software is needed for USB client function. When this driver and software is installed the client port appears as a mass storage device and NDIS Network device or as NDIS Network device only in the device manager of the operating system. Please refer to the Kontron COMe-mSP1 download page for the driver

COMe-mSP1 / Features and Interfaces

4.17 SDIO

The SD card standard is a standard for removable memory storages designed and licensed by the SD Card Association (http://sdcard.org). The card form factor, electrical interface, and protocol are all part of the SD Card specification. The Intel® System Controller Hub US15W supports up to 3 SDIO interfaces. On nanoETXexpress-SP the first interface SDIO#0 (4-bit wide) is shared with the module GPIO signals. The integrated SDIO 1.1/MMC 4.1 controller in US15W only supports byte-address mode for SDIO storage cards up to 2GB. Sector-addressing and SDHC is not supported.

» MMC 4.1 transfer rates can be up to 48MHz and bus widths of 1, 4 or 8 bits

» SDIO 1.1 supports transfer rates up to 24MHz and bus widths of 1 or 4 bits

The following table shows which GPIO-ports can be used for the SD-card interface:

General purpose Input/output SD card interface signals

GPI0 SLOT0_DATA0

GPI1 SLOT0_DATA1

GPI2 SLOT0_DATA2

GPI3 SLOT0_DATA3

GPO0 SLOT0_CLK

GPO1 SLOT0_CMD

GPO2 SLOT0_WP

GPO3 SLOT0_CD#

The SD_CMD line needs a pull-up resistor that can vary depending on the length of the electrical paths (typical from 10kOhm to 100kOhm).

The maximum length for SDIO signals on the baseboard should be 80mm.

COMe-mSP1 / Features and Interfaces

4.18 Graphics Interface

The COMe-mSP1 uses the graphics accelerator GMA500 with 200MHz GPU clock integrated in the Intel® System Controller Hub (US15W), which delivers shader-based technologies and high-performance 2D, 3D and video capabilities. The GMA500 graphics engine supports a variety of LCD panels with single clock, color depths of 18/24 bit and resolutions up to WXGA (1366×768). The maximum supported pixelclock of the system controller hub is 112 MHz.

Hardware video decode acceleration relieves the decode burden from the processor and reduces the power consumption of the system. Full hardware acceleration of H.264, MPEG2, VC1 and WMV9 eliminates the need of a software codec and offloads the CPU.

The graphic adapter uses the onboard RAM as graphic memory. The preallocated memory is defined through bios settings.

Possible settings are:

» 1MB

» 4MB

» 8MB

The total amount of graphics memory in the operating system depends on the size of system memory and the used driver settings. The graphics media accelerator driver GMA uses DVMT to manage allocating of system memory according to the needs of running applications. The Intel® Embedded Graphics Driver IEGD allocates the maximum of graphics memory depending on system memory and driver settings.

Physical Memory Preallocated Memory in BIOS Setup Maximum Graphics Memor y with GMA Driver Maximum Graphics Memory with IEGD

512MB 1MB 127MB 352MB

512MB 4MB 126MB 352MB

512MB 8MB 125MB 352MB

1024MB 1MB 255MB 352MB

1024MB 4MB 254MB 352MB

1024MB 8MB 253MB 352MB

For memory allocation according to the table above BIOS revision NOW1R112 or newer is recommended

When using 1MB Preallocated Memory an Operating Systems without active GMA or IEGD may have problems to display a screen (e.g. during WinXP installation).

COMe-mSP1 / Features and Interfaces

VGA

The nanoETXexpress-SP graphics subsystem GMA500 integrated in the Intel® System Controller Hub US15W does not support VGA output.

LVDS Flat Panel Interface (JILI)

The user interface for flat panels is the JUMPtec Intelligent LVDS Interface (JILI). The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide. Refer to the documentation for additional information.

SDVO

A Serial DVO connection is supported with hardware revision CE 4.x.x or newer. The digital display channel configured from display Pipe A in GMA500 graphics adapter is capable of driving SDVO adapters that provide interfaces to a variety of external display technologies such as HDMI, DVI, TV-out or CRT (the maximum supported pixel clock is 160MHz). Contact your local sales representative which adapters are available.

SDVO is optional available via:

» 30pin onboard flat foil connector

» COM Express connector (recommended solution)

Alternative COM Express Pin-out with SDVO option:

Pin Standard Signal SDVO Option SDVO Option Pin Description Type SDVO Termination

B71 LVDS_B0+ SDVOB_RED_P Serial Digital Video Channel B Red+ DP-O PU 50R inUS15W

B72 LVDS_B0- SDVOB_RED_N Serial Digital Video Channel B Red- DP-O PU 50R inUS15W

B73 LVDS_B1+ SDVOB_GREEN_P Ser ial Digital Video Channel B Green+ DP-O PU 50R inUS15W

B74 LVDS_B1- SDVOB_GREEN_N Serial Digital Video Channel B Green- DP-O PU 50R inUS15W

B75 LVDS_B2+ SDVOB_BLUE_P Serial Digital Video Channel B Blue+ DP-O PU 50R inUS15W

B76 LVDS_B2- SDVOB_BLUE_N Serial Digital Video Channel B Blue- DP-O PU 50R inUS15W

B77 LVDS_B3+ SDVOB_INT_P Serial Digital Video Input Interrupt+ DP-I PD 50R inUS15W

B78 LVDS_B3- SDVOB_INT_N Serial Digit al Video Input Interrupt- DP-I PD 50R inUS15W

.. .. .. .. .. ..

B81 LVDS_B_CK+ SDVOB_CLK_P Serial Digital Video Channel B Clock+ DP-O PU 50R inUS15W

B82 LVDS_B_CK- SDVOB_CLK_N Serial Digital Video Channel B Clock- DP-O PU 50R inUS15W

.. .. .. .. .. ..

B91 VGA_GRN SDVOB_TVCLKIN_P SDVO Channel B TV-Out Sync Clock+ DP-I PD 50R inUS15W

B92 VGA_BLU SDVOB_TVCLKIN_N SDVO Channel B TV-Out Sync Clock- DP-I PD 50R inUS15W

B93 VGA_HSYNC SDVOB_STALL_P Serial Digital Video Field Stall+ DP-I PD 50R inUS15W

B94 VGA_VSYNC SDVOB_STALL_N Serial Digital Video Field Stall- DP-I PD 50R inUS15W

B95 VGA_I2C_CK SDVO_CTRLCLK SDVO Control Clock DP-I/O ..

B96 VGA_I2C_DAT SDVO_CTRLDATA SDVO Control DATA DP-I/O ..

- The SDVO option is not available on standard modules. Please contact your local sales representative for more details or further questions.

- The optional SDVO pinout is similar to Type 10 pin-out except SDVO Control CLK/DAT on B95/B96 (B98/B99 on Type 10)

COMe-mSP1 / Features and Interfaces

4.19 LPC Bus

The Low Pin Count Interface signals are connected to the LPC Bus bridge, which is located in the Intel® US15W system controller hub. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the ETXexpress® Specification. Implementation information is provided in the COM Express® Design Guide by PICMG. Refer to the documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access). This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations. When more than one device is connected to the LPC bus a clock buffer is required!

Due to Power management of the LPC Bus, clock buffers that require synchronization should be used with great care and may prevent the board from booting up.

Active LPC Clock frequency

» with Z530 CPU: 33MHz

» with Z510 CPU: 25MHz

Standard Clock Buffer

When using a standard clock buffer on the baseboard please be aware that the generated delay has to be considered for the length matching of the layout.

Clock Buffer Reference Schematic

The implementation of a clock buffer can be realized as shown in the evaluation schematic below:

COMe-mSP1 / Features and Interfaces

Zero Delay Clock Buffer

Do not use the reference schematic in the COM Express Design Guide. Either use another Clock Buffer solution without a long start up process or use series resistors to double the LPC clock line. Follow the design recommendations in the COM Express Design Guide by PICMG.

COMe-mSP1 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

Please be aware that an ACPI OS decides itself on resource usage. The tables below show only an example distribution.

5.1.1 In 8259 PIC Mode

IRQ# Used For Available Comment

0 Timer 0 No -

1 Keyboard No -

2 Slave 8259 No -

3 External SIO - COM2 Yes (No) Note (1)

4 External SIO - COM1 Yes (No) Note (1)

5 PCI for PCI Dynamic (BIOS default)

6 External SIO Yes (No) Note (1)

7 External SIO - LPT1 Yes (No) Note (1)

8 RTC No -

9 ACPI No -

10 PCI for PCI Dynamic (BIOS default)

11 PCI for PCI Dynamic (BIOS default)

12 PS/2 Mouse Yes (No) Note (1)

13 FPU No -

14 Primary IDE No Note (1)

15 PCI for PCI Dynamic (BIOS default)

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.

COMe-mSP1 / System Resources

5.1.2 In APIC mode

IRQ# Used For Available Comment

0 Timer 0 No -

1 Keyboard No -

2 Slave 8259 No -

3 External SIO - COM2 Yes (No) Note (1)

4 External SIO - COM1 Yes (No) Note (1)

5 PCI for PCI Dynamic (BIOS default)

6 External SIO Yes (No) Note (1)

7 External SIO - LPT1 Yes (No) Note (1)

8 RTC No -

9 ACPI No -

10 PCI for PCI Dynamic (BIOS default)

11 PCI for PCI Dynamic (BIOS default)

12 PS/2 Mouse Yes (No) Note (1)

13 FPU No -

14 primar y IDE No Note (1)

15 PCI for PCI Dynamic (BIOS default)

16 PIRQ[A] For PCI PCI IRQ line 1 + US15W graphics + USB

UHCI Controller #1; Note (2)

17 PIRQ[B] For PCI PCI IRQ line 2 + LAN Controller + USB

UHCI Controller #2; Note (2)

18 PIRQ[C] For PCI PCI IRQ line 3 + USB UHCI Controller #3;

Note (2)

19 PIRQ[D] For PCI PCI IRQ line 4 + USB UHCI Controller #3;

Note (2)

20 PIRQ[E] No Note (2)

21 PIRQ[F] No Note (2)

22 PIRQ[G] No Note (2)

23 PIRQ[H] No Note (2)

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.

(2) ACPI Operating System decides on particular IRQ usage.

COMe-mSP1 / System Resources

5.2 Memory Area

The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special textbooks for information about HIMEM.SYS and EMM386.EXE.

Other operating systems (Linux or Windows versions) allow you to address the full memory area directly.

Upper Memory Used for Available

A0000h – BFFFFh VGA Memory No

C0000h – CFFFFh VGA BIOS No

D0000h – DFFFFh - Yes

E0000h – FFFFFh System BIOS No

5.3 I/O Address Map

I/O Address Used for Available Comment

0000 - 001F System Resources No Fixed

0020 - 003F Interrupt Controller 1 No Fixed

0040 - 005F Timer, Counter No Fixed

0060 - 006F Keyboard controller No Fixed

0070 - 007F RTC and CMOS Registers No Fixed

0080 BIOS Postcode No Fixed

0084 - 008F DMA Page Register No Fixed

0090 - 009F System Control No Fixed

00A0 - 00BF Interrupt Controller 2 No Fixed

00E0 - 00EF System Control No Fixed

00F0 - 00FF Math Coprocessor No Fixed

0170 – 0177; 0376 Fixed Disk No Available if IDE port 1 is disabled

01F0 - 01F7; 03F6 Fixed Disk No Available if IDE por t 1 is disabled

274 - 279 PnP Port No Fixed

03B0 - 03DF VGA No Fixed

0400 - 043F Chipset No Fixed

0480 - 04BF Chipset No Fixed

04D0 - 04D1 Chipset No Fixed

0900 - 091F Power Management No Fixed

09C0 - 09FF GPE No Fixed

0A05 – 0A06 WB83627HG Hardware Monitor No Fixed if WB83627HG is in system

0A80 – 0A81 CPLD No Fixed

0CF8 - 0CFF PCI Configuration No Fixed

D880 - D887 PCI LAN Controller No Dynamic (BIOS default address)

E080 - E09F PCI USB Controller No Dynamic (BIOS default address)

E480 - E49F PCI USB Controller No Dynamic (BIOS default address)

E880 - E887 VGA No Dynamic (BIOS default address)

EF00 - EF1F PCI USB Controller No Dynamic (BIOS default address)

FFA0 - FFAF PCI IDE Controller No Dynamic (BIOS default address)

COMe-mSP1 / System Resources

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectively the PCI Express Base 1.0a specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

PCI Device PCI IRQ Interface Comment

Host Bridge / Memory Controller None - Integrated in chipset

Graphics / Video Controller INTA - Integrated in chipset

USB Client Controller INTA - Integrated in chipset

HD Audio Controller INTA - Integrated in chipset

PCI Express Port (Bridge) INTA - Integrated in chipset

PCI Express Port (Bridge) INTB - Integrated in chipset

UHCI USB Controller 1 INTA - Integrated in chipset

UHCI USB Controller 2 INTB - Integrated in chipset

UHCI USB Controller 3 INTC - Integrated in chipset

EHCI USB Controller INTD - Integrated in chipset

SDIO/MMC Controller 1 INTA - Integrated in chipset

ISA Bridge / LPC Controller None - Integrated in chipset

IDE Controller None - Integrated in chipset

Network Controller INTA PCI Express External i82574

5.5 Internal I2C Bus

I2C Address Used For Available Comment JIDA Bus Nr.

A0h JIDA-EEPROM No EEPROM for CMOS Data 0

A2h JIDA-EEPROM No EEPROM for CMOS Data 0

5.6 JILI I2C Bus

I2C Address Used For Available Comment JIDA Bus Nr.

A0h DDC No Display Data 3

62h MAX6253 No DAC for Backlight brightness 3

5.7 SDVO I2C Bus

I2C Address Used For Available Comment JIDA Bus Nr.

- - - - 2

5.8 System Management (SM) Bus

COMe-mSP1 module:

I2C Address Used For Comment JIDA Bus Nr.

30h/60h STTS424E02 Temp Sensor / SPD - 1

98h Winbond W83L771W HWM - 1

A0h SPD - 1

A2h SPD - 1

D2h Clockgenerator - 1

Additional resources if connected to Evaluation Backplane and MARS

I2C Address Used For Comment JIDA Bus Nr.

12h SMART_Charger Only be used by a SMB Charger 1

14h SMART_Selector Only be used by a SMB Selector or Manager 1

16h SMART_Battery Only be used by a SMB Battery 1

7Eh PLX PEX8606AA PCIe Switch - 1

DCh ICS9DB8801C PCIe Clock Buffer - 1

COMe-mSP1 / System Resources

5.9 Pinout List

5.9.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

Output Analog

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

Pull-Up Resistor

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950

COMe-mSP1 / System Resources

5.9.2 Connector X1A Row A

Pin Signal Description Type Termination (CE 4.x.x) Comment

A1 GND_1 Power Ground PWR - -

A2 GBE0_MDI3- Ethernet Receive Data- DP-I - -

A3 GBE0_MDI3+ Ethernet Receive Data+ DP-I - -

A4 GBE0_LINK100# Ethernet Speed LED 100Mbps O-3.3 - -

A5 GBE0_LINK1000# Ethernet Speed LED 1000Mbps O-3.3 - -

A6 GBE0_MDI2- Ethernet Receive Data- DP-I - -

A7 GBE0_MDI2+ Ethernet Receive Data+ DP-I - -

A8 GBE0_LINK# LAN Link LED OD - -

A9 GBE0_MDI1- Ethernet Receive Data- DP-I - -

A10 GBE0_MDI1+ Ethernet Receive Data+ DP-I - -

A11 GND_2 Power Ground PWR - -

A12 GBE0_MDI0- Ethernet Transmit Data- DP-O - -

A13 GBE0_MDI0+ Ethernet Transmit Data+ DP-O - -

A14 GBE0_CTREF LAN Reference Voltage O-1.8 - -

A15 SUS_S3# Indicates Suspend to RAM state O-3.3 - CPLD I/O

A16 SATA0_TX+ SATA 0 Transmit Data+ DP-O - -

A17 SATA0_TX- SATA 0 Transmit Data- DP-O - -

A18 SUS_S4# Indicates Suspend to Disk state O-3.3 - CPLD I/O

A19 SATA0_RX+ SATA 0 Receive Data+ DP-I - -

A20 SATA0_RX- SATA 0 Receive Data- DP-I - -

A21 GND_3 Power Ground PWR - -

A22 SATA2_TX+ Not Connected nc - not suppor ted

A23 SATA2_TX- Not Connected nc - not supported

A24 SUS_S5# Indicates Soft Off state; same function as SUS_S4# O-3.3 - CPLD I/O

A25 SATA2_RX+ Not Connected nc - -

A26 SATA2_RX- Not Connected nc - -

A27 BATLOW# Indicates low external batter y I-3.3 PU 5k-25k in CPLD CPLD I/O

A28 ATA_ACT# SATA Activity Indicator O-3.3 PU 10k 3.3V -

A29 AC_SYNC HD Audio Sync O-3.3 PD 22k in US15W -

A30 AC_RST# HD Audio Reset O-3.3 PD 22k in US15W -

A31 GND_4 Power Ground PWR - -

A32 AC_BITCLK HD Audio Clock O-3.3 PD 22k in US15W 24MHz

A33 AC_SDOUT HD Audio Data O-3.3 PD 22k in US15W -

A34 BIOS_DISABLE# Disable Module BIOS. Enables boot from a BIOS on

Baseboard

I-3.3 PU 10k 3.3V For external LPC FWH

A35 THRMTRIP# CPU thermal shutdown indicator O-3.3 PU 2k 3.3V not supported on CE 1.x.x

A36 USB6- USB Data- Port #6 DP-I/O PD 15k in US15W -

A37 USB6+ USB Data+ Port #6 DP-I/O PD 15k in US15W -

A38 USB_6_7_OC# USB Over current Pair 6 / 7 I-3.3 PU 10k 3.3V -

A39 USB4- USB Data- Port #4 DP-I/O PD 15k in US15W -

A40 USB4+ USB Data+ Port #4 DP-I/O PD 15k in US15W -

A41 GND_5 Power Ground PWR - -

A42 USB2- USB Data- Port #2 DP-I/O PD 15k in US15W -

A43 USB2+ USB Data+ Port #2 DP-I/O PD 15k in US15W -

A44 USB_2_3_OC# USB Over current Pair 2 / 3 I-3.3 PU 10k 3.3V -

A45 USB0- USB Data- Port #0 DP-I/O PD 15k in US15W -

A46 USB0+ USB Data+ Port #0 DP-I/O PD 15k in US15W -

A47 VCC_RTC RTC Power Supply +3V PWR - -

A48 EXCD0_PERST# PCI Express Card 0 Reset O-3.3 - -

A49 EXCD0_CPPE# PCI Express Card 0 Request I-3.3 PU 8k2 3.3V -

A50 LPC_SERIRQ LPC Serial Interrupt Request IO-3.3 PU 10k 3.3V -

A51 GND_6 Power Ground PWR - -

A52 PCIE_TX5+ Not Connected nc - not suppor ted

A53 PCIE_TX5- Not Connected nc - not supported

A54 SDIO_D0 / GPI0 SDIO#0 Data0 / General Purpose Input 0 I/O-3.3 / I-3.3 PU 75k in US15W / PU 100k

3.3V

- / CPLD I/O

A55 PCIE_TX4+ Not Connected nc - not suppor ted

A56 PCIE_TX4- Not Connected nc - not supported

A57 GND_7 Power Ground PWR - -

A58 PCIE_TX3+ Not Connected nc - not suppor ted

A59 PCIE_TX3- Not Connected nc - not supported

A60 GND_8 Power Ground PWR - -

A61 PCIE_TX2+ Not Connected nc - not suppor ted

A62 PCIE_TX2- Not Connected nc - not supported

A63 SDIO_D1 / GPI1 SDIO#0 Data1 / General Purpose Input 1 I/O-3.3 /I-3.3 PU 75k in US15W / PU 100k - / CPLD I/O

COMe-mSP1 / System Resources

3.3V

A64 PCIE_TX1+ PCIe lane #1 Transmit+ DP-O PU 50R inUS15W only available on no-LAN var.

A65 PCIE_TX1- PCIe lane #1 Transmit- DP-O PU 50R inUS15W only available on no-LAN var.

A66 GND_9 Power Ground PWR - -

A67 SDIO_D2 / GPI2 SDIO#0 Data2 / General Purpose Input 2 I/O-3.3 / I-3.3 PU 75k in US15W / PU 100k

3.3V

- / CPLD I/O

A68 PCIE_TX0+ PCIe lane #0 Transmit+ DP-O PU 50R inUS15W -

A69 PCIE_TX0- PCIe lane #0 Transmit- DP-O PU 50R inUS15W -

A70 GND_10 Power Ground PWR - -

A71 LVDS_A0+ LVDS Channel A (positive) DP-O PU 50R inUS15W -

A72 LVDS_A0- LVDS Channel A (negative) DP-O PU 50R inUS15W -

A73 LVDS_A1+ LVDS Channel A (positive) DP-O PU 50R inUS15W -

A74 LVDS_A1- LVDS Channel A (negative) DP-O PU 50R inUS15W -

A75 LVDS_A2+ LVDS Channel A (positive) DP-O PU 50R inUS15W -

A76 LVDS_A2- LVDS Channel A (negative) DP-O PU 50R inUS15W -

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 PD 100k -

A78 LVDS_A3+ LVDS Channel A (positive) DP-O PU 50R inUS15W -

A79 LVDS_A3- LVDS Channel A (negative) DP-O PU 50R inUS15W -

A80 GND_11 Power Ground PWR - -

A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O PU 50R inUS15W -

A82 LVDS_A_CK- LVDS Channel A Clock- DP-O PU 50R inUS15W -

A83 LVDS_I2C_CK LVDS I2C Clock (DDC) IO-3.3 PU 10k 3.3V -

A84 LVDS_I2C_DAT LVDS I2C Data (DDC) IO-3.3 PU 10k 3.3V -

A85 SDIO_D3 / GPI3 SDIO# Data3 / General Purpose Input 3 I/O-3.3 / I-3.3 PU 75k in US15W / PU 100k

3.3V

- / CPLD I/O

A86 KBD_RST# Keyboard Reset I-5T PU 1M 3.3V not supported on CE 1.x.x

A87 KBD_A20GATE A20 gate I-5T PU 10k 3.3V -

A88 PCIE0_CK_REF+ PCIe Clock (positive) DP-O - 100MHz

A89 PCIE0_CK_REF- PCIe Clock (negative) DP-O - 100MHz

A90 GND_12 Power Ground PWR - -

A91 RSVD1 Reserved nc - -

A92 RSVD2 Reserved nc - -

A93 SDIO_Clk / GPO0 SDIO#0 Clock / General Purpose Output 0 O-3.3 / O-3.3 - / PD 100k 24/48MHz / CPLD I/O

A94 RSVD3 Reserved nc - -

A95 RSVD4 Reserved nc - -

A96 GND_13 Power Ground PWR - -

A97 VCC_12V_1 12V VCC PWR - -

A98 VCC_12V_2 12V VCC PWR - -

A99 VCC_12V_3 12V VCC PWR - -

A100 GND_14 Power Ground PWR - -

A101 VCC_12V_4 12V VCC PWR - -

A102 VCC_12V_5 12V VCC PWR - -

A103 VCC_12V_6 12V VCC PWR - -

A104 VCC_12V_7 12V VCC PWR - -

A105 VCC_12V_8 12V VCC PWR - -

A106 VCC_12V_9 12V VCC PWR - -

A107 VCC_12V_10 12V VCC PWR - -

A108 VCC_12V_11 12V VCC PWR - -

A109 VCC_12V_12 12V VCC PWR - -

A110 GND_15 Power Ground PWR - -

COMe-mSP1 / System Resources

5.9.3 Connector X1A Row B

Pin Signal Description Type Termination (CE 4.x.x) Comment

B1 GND_16 Power Ground PWR - -

B2 GBE0_ACT# Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 - -

B4 LPC_AD0 LPC Address / Data Bus IO-3.3 PU 20k in US15W -

B5 LPC_AD1 LPC Address / Data Bus IO-3.3 PU 20k in US15W -

B6 LPC_AD2 LPC Address / Data Bus IO-3.3 PU 20k in US15W -

B7 LPC_AD3 LPC Address / Data Bus IO-3.3 PU 20k in US15W -

B8 LPC_DRQ0# Not Connected nc - -

B9 LPC_DRQ1# Not Connected nc - -

B10 LPC_CLK LPC Clock O-3.3 - up to 33MHz

B11 GND_17 Power Ground PWR - -

B12 PWRBTN# Power Button Input I-3.3 PU 1k 3.3V active on rising edge

B13 SMB_CLK SMBus Clock O-3.3 PU 2k8 3.3V -

B14 SMB_DAT SMBus Data IO-3.3 PU 2k8 3.3V -

B15 SMB_ALERT# SMBus Interrupt IO-3.3 PU 5k 3.3V -

B16 SATA1_TX+ Not Connected nc - not supported

B17 SATA1_TX- Not Connected nc - not supported

B18 SUS_STAT# Indicates imminent suspend operation; used to notify

LPC devices.

O-3.3 - CPLD I/O

B19 SATA1_RX+ Not Connected nc - not suppor ted

B20 SATA1_RX- Not Connected nc - not supported

B21 GND_18 Power Ground PWR - -

B22 SATA3_TX+ Not Connected nc - not supported

B23 SATA3_TX- Not Connected nc - not supported

B24 PWR_OK Power OK from power supply I-5T PU 1M 3.3V CPLD I/O

B25 SATA3_RX+ Not Connected nc - not suppor ted

B26 SATA3_RX- Not Connected nc - not supported

B27 WDT Indicator for Watchdog Timeout O-3.3 - not suppor ted

B28 AC_SDIN2 Not Connected nc - not supported

B29 AC_SDIN1 Audio Codec Ser ial Data in 1 I-3.3 PD 22k in US15W -

B30 AC_SDIN0 Audio Codec Ser ial Data in 0 I-3.3 PD 22k in US15W -

B31 GND_19 Power Ground PWR - -

B32 SPKR Speaker Interface O-3.3 - -

B33 I2C_CK General Purpose I2C Clock IO-3.3 PU 2k2 3.3V CPLD I/O

B34 I2C_DAT General Purpose I2C Data IO-3.3 PU 2k2 3.3V CPLD I/O

B35 THRM# Over Temperature Indicator I-3.3 - CPLD I/O

B36 USB7- USB Data- Port #7 (USB Mode) / USB Data- Client

(Client Mode)

DP-I/O / DP-I/O PD 15k in US15W / PU 1k5

in US15W

- / -

B37 USB7+ USB Data+ Port #7 (USB Mode) / USB Data+ Client

(Client Mode)

DP-I/O / DP-I/O PD 15k in US15W / PU 1k5

in US15W

- / -

B38 USB_4_5_OC# USB Over current Pair 4 / 5 I-3.3 PU 10k 3.3V -

B39 USB5- USB Data- Port #5 DP-I/O PD 15k in US15W -

B40 USB5+ USB Data+ Port #5 DP-I/O PD 15k in US15W -

B41 GND_20 Power Ground PWR - -

B42 USB3- USB Data- Port #3 DP-I/O PD 15k in US15W -

B43 USB3+ USB Data+ Port #3 DP-I/O PD 15k in US15W -

B44 USB_0_1_OC# USB Over current Pair 0 /1 I-3.3 PU 10k 3.3V -

B45 USB1- USB Data- Port #1 DP-I/O PD 15k in US15W -

B46 USB1+ USB Data+ Port #1 DP-I/O PD 15k in US15W -

B47 EXCD1_PERST# PCIe Express Card 1 Reset O-3.3 - -

B48 EXCD1_CPPE# PCIe Express Card 1 Request I-3.3 PU 8k2 3.3V -

B49 SYS_RESET# Reset button input I-3.3 PU 5k-25k in CPLD -

B50 CB_RESET# Carrier Board Reset O-3.3 - CPLD I/O

B51 GND_21 Power Ground PWR - -

B52 PCIE_RX5+ Not Connected nc - not supported

B53 PCIE_RX5- Not Connected nc - not supported

B54 SDIO_CMD / GPO1 SDIO#0 Command / General Purpose Output 1 I/O-3.3 / O-3.3 PU 75k 3.3V / PD 100k - / CPLD I/O

B55 PCIE_RX4+ Not Connected nc - not supported

B56 PCIE_RX4- Not Connected nc - not supported

B57 SDIO_WP / GPO2 SDIO#0 Write Protection /General Purpose Output 2 I-3.3 / O-3.3 PU 100k 3.3V / PD 100k - / -

B58 PCIE_RX3+ Not Connected nc - not supported

B59 PCIE_RX3- Not Connected nc - not supported

B60 GND_22 Power Ground PWR - -

B61 PCIE_RX2+ Not Connected nc - not supported

B62 PCIE_RX2- Not Connected nc - not supported

COMe-mSP1 / System Resources

B63 SDIO_CD# / GPO3 SDIO#0 CardDetect / General Purpose Output 3 I-3.3 / O-3.3 PU 10k 3.3V / PD 100k - / -

B64 PCIE_RX1+ PCIe lane #1 Receive+ DP-I PD 50R inUS15W only available on no-LAN var.

B65 PCIE_RX1- PCIe lane #1 Receive- DP-I PD 50R inUS15W only available on no-LAN var.

B66 WAKE0# PCI Express Wake Event I-3.3 PU 1k 3.3V CPLD I/O

B67 WAKE1# General Purpose Wake Event I-3.3 PU 10k 3.3V CPLD I/O

B68 PCIE_RX0+ PCIe lane #0 Receive+ DP-I PD 50R inUS15W -

B69 PCIE_RX0- PCIe lane #0 Receive- DP-I PD 50R inUS15W -

B70 GND_23 Power Ground PWR - -

B71 LVDS_B0+ Not Connected nc - not suppor ted

B72 LVDS_B0- Not Connected nc - not supported

B73 LVDS_B1+ Not Connected nc - not suppor ted

B74 LVDS_B1- Not Connected nc - not supported

B75 LVDS_B2+ Not Connected nc - not suppor ted

B76 LVDS_B2- Not Connected nc - not supported

B77 LVDS_B3+ Not Connected nc - not suppor ted

B78 LVDS_B3- Not Connected nc - not supported

B79 LVDS_BKLT_EN Backlight Enable O-3.3 PD 100k -

B80 GND_24 Power Ground PWR - -

B81 LVDS_B_CK+ Not Connected nc - not supported

B82 LVDS_B_CK- Not Connected nc - not suppor ted

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY +5V Standby PWR - -

B85 VCC_5V_SBY +5V Standby PWR - -

B86 VCC_5V_SBY +5V Standby PWR - -

B87 VCC_5V_SBY +5V Standby PWR - -

B88 RSVD5 Reser ved - - -

B89 VGA_RED Not Connected nc - not supported

B90 GND_25 Power Ground PWR - -

B91 VGA_GRN Not Connected nc - not supported

B92 VGA_BLU Not Connected nc - not suppor ted

B93 VGA_HSYNC Not Connected nc - not suppor ted

B94 VGA_VSYNC Not Connected nc - not supported

B95 VGA_I2C_CK Not Connected nc - not supported

B96 VGA_I2C_DAT Not Connected nc - not supported

B97 TV_DAC_A Not Connected nc - not supported

B98 TV_DAC_B Not Connected nc - not suppor ted

B99 TV_DAC_C Not Connected nc - not supported

B100 GND_26 Power Ground PWR - -

B101 VCC_12V_13 12V VCC PWR - -

B102 VCC_12V_14 12V VCC PWR - -

B103 VCC_12V_15 12V VCC PWR - -

B104 VCC_12V_16 12V VCC PWR - -

B105 VCC_12V_17 12V VCC PWR - -

B106 VCC_12V_18 12V VCC PWR - -

B107 VCC_12V_19 12V VCC PWR - -

B108 VCC_12V_20 12V VCC PWR - -

B109 VCC_12V_21 12V VCC PWR - -

B110 GND_27 Power Ground PWR - -

The termination resistors in this table are already mounted on the module. Refer to the design guide for information about additional termination resistors.

COMe-mSP1 / System Resources

5.9.4 SDVO Connector J1801 (optional)

With hardware revision CE 4.x.x or newer the COMe-mSP1 provides an optional Serial DVO graphics output via onboard flat foil connector J1801.

Pin Signal Description Type Termination Comment

1 GND#1 Ground PWR - -

2 SDVOB_CLK_N Serial Digital Video Channel B Clock- DP-O PU 50R inUS15W -

3 SDVOB_CLK_P Serial Digital Video Channel B Clock+ DP-O PU 50R inUS15W -

4 GND#2 Ground PWR - -

5 SDVOB_GREEN_N Ser ial Digital Video Channel B Green- DP-O PU 50R inUS15W -

6 SDVOB_GREEN_P Serial Digital Video Channel B Green+ DP-O PU 50R inUS15W -

7 GND#3 Ground PWR - -

8 SDVOB_INT_N Serial Digital Video Input Interrupt- DP-I PU 50R inUS15W -

9 SDVOB_INT_P Serial Digital Video Input Interrupt+ DP-I PU 50R inUS15W -

10 GND#4 Ground PWR - -

11 SDVOB_BLUE_N Ser ial Digital Video Channel B Blue- DP-O PU 50R inUS15W -

12 SDVOB_BLUE_P Ser ial Digital Video Channel B Blue+ DP-O PU 50R inUS15W -

13 GND#5 Ground PWR - -

14 SDVOB_RED_N Serial Digital Video Channel B Red- DP-O PU 50R inUS15W -

15 SDVOB_RED_P Serial Digital Video Channel B Red+ DP-O PU 50R inUS15W -

16 GND#6 Ground PWR - -

17 SDVOB_STALL_N Serial Digital Video Field Stall- DP-I PD 50R inUS15W -

18 SDVOB_STALL_P Serial Digit al Video Field Stall+ DP-I PD 50R inUS15W -

19 GND#7 Ground PWR - -

20 SDVO_CTRLCLK SDVO Control Clock DP-I/O - -

21 SDVO_CTRLDATA SDVO Control DATA DP-I/O - -

22 RESET# Module Reset - - -

23 VCC#1 V3.3_S0 PWR - -

24 VCC#2 V2.5_S0 PWR - -

25 VCC#3 V5.0_S0 PWR - -

26 GND#8 Ground PWR - -

27 SDVOB_TVCLKIN_N SDVO Channel B TV-Out Sync Clock- DP-I PD 50R inUS15W -

28 SDVOB_TVCLKIN_P SDVO Channel B TV-Out Sync Clock+ DP-I PD 50R inUS15W -

29 VCC#4 V3.3_S0 PWR - -

30 VCC#5 V5.0_S0 PWR - -

COMe-mSP1 / System Resources

5.9.5 XDP Connector J1400 (optional)

The COMe-mSP1 provides the XDP debug port of Silverthorne CPU optionally with connector J1400.

The debug port is for internal use only. Do not connect any devices.

COMe-mSP1 / BIOS Operation

6 BIOS Operation

The module is equipped with AMI® CORE8 BIOS, which is located in an onboard SPI/LPC flash memory. You can update the BIOS using a Flash utility.

6.1 Determining the BIOS Version

To determine the AMI® BIOS version, immediately press the Pause key on your keyboard as soon as you see the following text display in the upper left corner of your screen:

» BIOS Date: mm/dd/yyyy hh:mm:ss Ver: xx.xx.xx

» Kontron® BIOS Version <NOW1RXXX

6.2 BIOS Update

Kontron provides continous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with a detailed change description within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the BIOS Region (usually 4-8MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

COMe-mSP1 / BIOS Operation

6.3 Setup Guide

The AMIBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup program uses a number of menus to make changes and turn features on or off.

Functional keystrokes in POST:

Key Function

DEL

Enter Setup

F11

Boot Menu

CTRL+HOME

Initiate BIOS Recovery

6.3.1 Start AMI® BIOS Setup Utility

To start the AMI® BIOS setup utility, press <DEL> when the following string appears during bootup.

Press <DEL> to enter Setup

The Info Menu then appears.

The Setup Screen is composed of several sections:

Setup Screen Location Function

Menu Bar Top Lists and selects all top level menus.

Legend Bar Right side Bottom Lists setup navigation keys.

Item Specific Help Window Right side Top Help for selected item.

Menu Window Left Center Selection fields for current menu.

COMe-mSP1 / BIOS Operation

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates.

Key Function

<F1> or <Alt-H> General Help window.

<Esc> Exit menu.

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select fields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

<F9> Load the default conf iguration values for this menu.

<F10> Save and exit.

<Enter> Execute command or select submenu.

<Alt-R> Refresh screen.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The↑ ↓ Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field.

General Help Window

Pressing <F1> or <Alt-F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window.

COMe-mSP1 / BIOS Operation

6.4 BIOS Setup

6.4.1 Main Menu

Feature Option Description

System Time [hh:mm:ss] <Tab>, <Shift-Tab>, or <Enter> selects field

System Date [mm-dd-yyyy] <Tab>, <Shift-Tab>, or <Enter> selects field

COMe-mSP1 / BIOS Operation

6.4.2 Module Info

Module Component Steppings

COMe-mSP1 / BIOS Operation

Module Software Revisions

Memory Module Information

COMe-mSP1 / BIOS Operation

Slot 1

Current Memory Configuration SLOT1 shows information of onboard system memory stored in SPD. The SPD EEPROM is supported with CE 4.x.x (PCB L140) or newer.

Current LVDS Configuration

COMe-mSP1 / BIOS Operation

6.4.3 Advanced Menu

COMe-mSP1 / BIOS Operation

CPU Configuration

Feature Option Description

Max CPUID Value Limit

Disabled Enabled

Disabled for WindowsXP

Intel® Virtualization Tech

Enabled Disabled

When enabled, a VMM can utilize the additional HW Caps, provided by Intel® Virtualization Tech. Note: A full reset is required to change the setting.

CPU TM Functionality

Enabled Disabled

Enables or disables both TM1 and TM2 simultaneously.

CPU Performance Low

Middle High

Sets the CPU ratio for Z510/Z530 CPU Low: 600MHz / 800MHz Middle: 800MHz / 1200MHz High: 1100MHz / 1600MHz Note: Disable Speedstep to use fixed CPU speed to the selected performance state. With BIOS NOW1R113 or newer EIST is automatically disabled if set to low or middle.

Execute-Disable Bit Capability

Enabled Disabled

When disabled, force the XD feature flag to always return 0

Hyper Threading Technology

Enabled Disabled

Enable/Disable Intel® Hyper Threading Technology

DTS-based Thermal Management

Enabled Disabled

Enable/Disable Thermal Management utilizing the CPU’s Digital Thermal Sensor

Intel® SpeedStep™

Enabled Disabled

Enables and Disables the SpeedStep power management feature

Intel® C-State Technology

Enabled Disabled

Enables and Disables the C - States. If enabled, the CPU is set to C2 - C4 state in idle mode

C6 state

Enabled Disabled

Enables and Disables the C6 - State.

Enhanced C-State Modes

Enabled Disabled

CPU idle is set to enhanced C-states, when enabled

COMe-mSP1 / BIOS Operation

IDE Configuration

Feature Option Description

IDE Controller

Enabled Disabled

Enables or disables the IDE interface of US15W SCH. This concerns the onboard SSD and PATA2SATA brdige.

Hard Disk Write Protect

Disabled Enabled

Disables/enables device write protection. It will be effective only if device is accessed through BIOS functions.

IDE Detect Time Out (Sec.)

[0-35] 35

Selects the time out value for the detection of ATA/ ATAPI devices

COMe-mSP1 / BIOS Operation

IDE Device Submenu

Feature Option Description

Type Not Installed

Auto CD/DVD ARMD

Selects the type of the IDE Devices connected to the system

LBA/Large Mode Disabled

Auto

Disables the LBA mode or enables it, when a device supports it

Block (Multi-Sector Transfer) Disabled

Auto

Disabled: The data transfer from and to the device occurs one sector ata atime Auto: The data transfer from and to the device occurs multiple sectors at a time if the device supports ist

PIO Mode

Auto 0 1 2 3 4

(Auto) Configures the PIO Mode

DMA Mode

Auto SWDMAn MWDMAn UDMAn

SWDMA: Single Word DMA MWDMA: Multi Word DMA UDMA: Ultra DMA

S.M.A.R.T.

Auto Enabled Disabled

Disables, Enables or automatically enables the S.M.A.R.T feature (Self-Monitoring, Analysis and Reporting Technology)

32Bit Data Transfer

Enabled Disabled

Disables and Enables the 32Bit Data Transfer Mode

COMe-mSP1 / BIOS Operation

SDIO Configuration

Feature Option Description

Select SDIO or GPIO

SD Card GPIO

The SD card interface is shared with module GPIO signals. To use GPIO with this module it is necessary to set this switch to GPIO.

Data Access Mode

Auto DMA PIO

Auto: Access SD device in DMA mode if controller supports it, otherwise in PIO mode. DMA: Access SD device in DMA mode. PIO: Access SD device in PIO mode.

SDIO Clock

Auto 24 MHz

Limit SDIO Clock to 24MHz. Auto setting enables 48MHz clock if supported by the SDIO device.

The SDIO/GPIO switch is only supported on hardware revisions CE 4.x.x or newer. Modules with revision CE 1.x.x must be reworked to enable GPIO functionality.

COMe-mSP1 / BIOS Operation

LPC I/O Controller Configuration

Feature Option Description

Serial Port1 Address Disabled

3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3

Selects the Address of COM Port 1

Serial Port2 Address Disabled

3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3

Selects the Address of COM Port 2

Serial Port2 Mode

Normal IrDA ASKIR

Selects the mode for serial Port 2

Parallel Port Address Disabled

378 278 3BC

Selects the Address of the LPT Port

Parallel Port Mode

Normal Bi-Directional ECP EPP ECP+SPP

Allows BIOS to Select Parallel Port Mode. (Only visible when Parallel Port enabled.)

Parallel Port IRQ IRQ5

IRQ7

Allows BIOS to Select Parallel Port IRQ. (Only visible when Parallel Port enabled.)

COMe-mSP1 / BIOS Operation

ACPI Configuration

Feature Option Description

ACPI Version

ACPI v.3.0 ACPI v.2.0

Selects the ACPI version

ACPI APIC support

Enabled Disabled

Include ACPI APIC table pointer to RSDT pointer list.

Repost Video on S3 Resume

No Yes

If yes, Videobios is reinitialized after S3 Resume

AMI OEMB Table

Enabled Disabled

Includes the AMI OEMB table pointer. The OEMB table is used to fill in POST data in AML code during ACPI OS operations. This option should only be disabled if ACPI

1.0 is used

Headless Mode

Disabled Enabled

Enables / Disables headless mode through ACPI

COMe-mSP1 / BIOS Operation

ACPI Cooling Options

Feature Option Description

Passive Trip Point

Disabled 40°C 45°C 50°C … 110°C

This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin throttling the CPU.

Passive TC1 value

1 2 3 … 16

This value sets the TC1 value for the ACPI Passive Cooling Formula. (Only visible when Passive Trip Point is enabled.)

Passive TC2 value 1

2 … 5 … 16

This value sets the TC2 value for the ACPI Passive Cooling Formula. (Only visible when Passive Trip Point is enabled.)

Passive TSP value 2

4 … 10 … 30

This item sets the TSP value for the ACPI Passive Cooling Formula. It represents in tenths of a second how often the OS will read the temperature when Passive Cooling is Enabled.

Critical Trip Point Disabled

40°C 45°C 50°C … 110°C

This value controls the temperature of the ACPI Critical Trip Point - the point in which the OS will shut off the system.

COMe-mSP1 / BIOS Operation

Passive Cooling

The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation

?P[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt)

?P is the performance delta, Tt is the target temperature = passive cooling trip point. The two coeff icients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply. It’s up to the end user to set the cooling preference of the system by setting the appropriate trip points in the BIOS setup.

See chapter 12 of the ACPI specification (www.acpi.info) for more details

COMe-mSP1 / BIOS Operation

Miscellaneous Settings

Feature Option Description

Spread Spectrum

Disabled LVDS Core Both

Enables or Disables spread spectrum for the selected Clocks. LVDS: Enables LVDS Spread Spectrum Core: Enables CPU, PCIe, Chipset Spread Spectrum

A20 line controlled by

Auto Detection Legacy Keyb Ctrl. Port 92h emul

This setting allows choosing how address line A20 is controlled for legacy systems. If Keyb. controller is chosen an active KBC is needed

Keyboard Crisis Recovery Disabled

Enabled

Enables/Disables Keyboard Crisis Recovery function by USB keyboard

Smbios Smi Support

Enabled Disabled

SMBIOS SMI Wrapper support for PnP Functions 50h54h

COMe-mSP1 / BIOS Operation

I2C Buses

Feature Option Description

JIDA I2C Bus Speed

Very high High Medium Slow Very slow Ultra Slow

Select speed for JIDA/external I2C bus. See speed table in chapter Fast I2C.

Multi Master support

Enabled Disabled

Enables / disables I2C multi master support

Clock Stretching support

Enabled Disabled

Enables / disables I2C clock stretching support

Slow Device support

Enabled Disabled

Enables / disables I2C clock stretching support

SMBus SPeed Extra high

Very high High Medium Slow Very Slow

Select speed for external SMBus. See speed table in chapter Fast I2C.

JILI I2C Bus Speed Very high

High Medium Slow Very Slow

Select speed for external JILI I2C bus. See speed table in chapter Fast I2C.

Multi Master support

Enabled Disabled

Enables / disables I2C multi master support

Clock Stretching support

Enabled Disabled

Enables / disables I2C clock stretching support

Slow Device support

Enabled Disabled

Enables / disables I2C clock stretching support

COMe-mSP1 / BIOS Operation

Watchdog

Feature Option Description

Mode Reset

Disabled

Selects the mode of the watchdog

Timeout 1s

5s 10s 30s 1:00m 5:00m 10:00m

Set the timout for Watchdog

COMe-mSP1 / BIOS Operation

MARS Interface Configuration

Feature Option Description

MARS

Disabled Auto SMB Charger SMB Manager

Enables the MARS function

COMe-mSP1 / BIOS Operation

Ethernet Configuration

Feature Option Description

Onboard Gigabit Ethernet Disabled

Enabled

Disables / Enables the onboard Ethernet interface

PXE ROM

Disabled Enabled

Disables / Enables the PXE Boot ROM

COMe-mSP1 / BIOS Operation

PCIExpress Configuration

Feature Option Description

PCIe Ports

Both Disabled Port 0 Port 1

Disables or enables according PCI Express lanes. Onboard Gigabit Ethernet is connected to Port 1. Port 0/1: enables specific PCI Express Lane Both: Both PCI Express lanes from US15W SCH are enabled Disabled: US15W SCH PCI Express is completely disabled

PCIE Base Spec Compliance Disabled

Enabled

Allows to choose between strict PCIE base specif ication compliance and power saving mode. Warning: Disabling PCIE compliance might influence the PCIE lane throughput.

SDVO PCIE Base Spec Compliance

Disabled Enabled

Allows to choose between strict PCIE base specif ication compliance and power saving mode. Warning: Disabling SDVO compliance might influence the PCIE lane throughput.

Active State Power Management

Disabled Enabled

Enables/Disables PCI Express L0 and L1 link power states.

COMe-mSP1 / BIOS Operation

Trusted Computing

Feature Option Description

TCG/TPM SUPPORT

No Yes

Enable/Disable TPM TCG (TPM 1.1/1.2) support in BIOS

COMe-mSP1 / BIOS Operation

USB Configuration

Feature Option Description

Legacy USB Support Disabled

Enabled

Enables / disables support for legacy USB.

USB 2.0 Controller Mode FullSpeed

HiSpeed

Configures the USB 2.0 controller in HiSpeed (480Mbps) or FullSpeed (12Mbps)

BIOS EHCI Hand-Off Disabled

Enabled

This is a workaround for an OS without EHCI hand-off support. The EHCI ownership change should claim by the EHCI driver

COMe-mSP1 / BIOS Operation

USB Mass Storage Device Configuration

Feature Option Description

USB Mass Storage Reset Delay 10 Sec

20 Sec 30 Sec 40 Sec

Number of seconds POST waits for the USB mass storage device after start unit command.

Emulation Type

Auto Floppy Forced FDD Hard Disk CDROM

If Auto USB devices with less than 20MB will be emulated as floppy and remaining as hard drive. Forced FDD option can be used to force a HDD formatted drive to boot as FDD (Ex. ZIP drive).

COMe-mSP1 / BIOS Operation

Hardware Health Configuration

Feature Option Description

Module HWM: H/W Health Function

Disabled Enabled

Enables the onboard Hardware Health Monitoring Device

CPU Temperature: CPU ACPI temperature Module Temperature: Internal temperature of HWM Chipset Sensor #1 / Chipset Sensor #2: Internal

thermal sensors of US15W SCH to cause main memory throttling and display refresh throttling. See JIDA32/K-Station resource list for more details

Baseboard HWM: H/W Health Function

Disabled Enabled

Enables the Hardware Health Monitoring suppor t for external LPC I/O Winbond 83627

Fan Speed Selector 1

2 4 … 128

Select the FAN Speed Divisor according to nominal revolutions per minute of used FAN:

Divisor 1: 8800 rpm, Divisor 2: 4400 rpm Divisor 4: 2200 rpm, Divisor 8: 1100 rpm Divisor 16: 550 rpm, Divisor 32: 275 rpm Divisor 64: 137 rpm, Divisor 128: 68 rpm

Fan Ticks per Rev 1

2 4 8

Number of Ticks per Revolution

COMe-mSP1 / BIOS Operation

6.4.4 Advanced PCI/PnP Settings

Feature Option Description

Clear NVRAM

No Yes

Clear NVRAM once during next system boot.

PCI Latency Timer 32

64 … 248

Value in units of PCI clocks for PCI device latency register

PCI IDE BusMaster Disabled

Enabled

Disables and enables PCI IDE Busmaster

IRQ3 … IRQ15

Available Reserved

Available: IRQ useable by PCI/PnP devices Reserved: IRQ is reserved for ISA devices

Reserved Memory Size

Disabled 16k 32k 64k

Size of memory block to reserve for legacy ISA devices

COMe-mSP1 / BIOS Operation

6.4.5 Boot

COMe-mSP1 / BIOS Operation

Boot Setting Configuration

Feature Option Description

Dark Boot

Disabled Enabled

Disabled: Shows normal POST messages Enabled: Shows OEM Logo during boot up

AddOn ROM Display Mode

Force BIOS Keep Current

Set Display Mode for Option ROM

Bootup Num-Lock

On Off

Select Power-On state for Num-Lock

PS/2 Mouse Support

Auto Disabled Enabled

Disables and enables or auto selects PS/2 Mouse Support

Wait For 'F1' If Error

Disabled Enabled

Wait for F1 key to be pressed, if error

“Press DEL” Message Display

Enabled Disabled

Enabled allows the BIOS to display the message Press DEL to run Setup after memor y initialization. Disabled suppresses this message

Boot USB HDD first

Disabled Enabled

If enabled, boots new attached USB HDD always first

Interrupt 19 Capture

Disabled Enabled

Allows option ROMs to trap INT19h if enabled

COMe-mSP1 / BIOS Operation

USB Bootable Port Configuration

Feature Option Description

Port 0 - 7 Disabled

Enabled

Enables/Disables a specific port to be bootable

COMe-mSP1 / BIOS Operation

6.4.6 Security

Feature Option Description

Change Supervisor Password

Type in

Change User Password

Type in

Boot Sector Virus Protection

Disabled Enabled

Enables or disables boot sector virus protection.

COMe-mSP1 / BIOS Operation

6.4.7 Advanced Chipset Settings

COMe-mSP1 / BIOS Operation

Graphic Controller Configuration

Feature Option Description

Primary Graphic Adapter

PCIe/Onboard Onboard

Selects which graphics controller is used as primary boot device (boot sequence)

Onboard Graphic Mode Disabled

Enabled, 1MB Enabled, 4MB Enabled, 8MB

Selects the amount of pre-allocated system memory used by the onboard graphics controller

Aperture Size

256MB 128MB

Configures the size of the aper ture space. Needs IEGD driver.

COMe-mSP1 / BIOS Operation

Display Control

Feature Option Description

Boot Display Device

Auto LVDS SDVO-CRT SDVO-DVI/HDMI

Select the Boot Display Device. Note: SDVO is not supported on HW Rev CE 1.x.x (PCB L130)

COMe-mSP1 / BIOS Operation

Internal LVDS Configuration

Feature Option Description

Flat Panel Mode

Auto Fixed Mode PAID FPID

Selects the Mode for the flat panel detection

Auto Fallback Disabled

Fixed Mode

Selects what happens, when there is no EEPROM detected (only when FPM: Auto)

Flat Panel Type VGA 640×480

SVGA 800×600 … WXGA 1280×800

Selects the resolution of the LVDS display (only in FMP: Fixed Mode)

PAID/FPID [X] Selects the number of the PAID/FPID

Color Depth

18bit 24bit

Selects the Color Depth of the connected LVDS display (only in FPM: Fixed Mode)

Local Flat Panel Scaling Centered

Stretched Disabled

Selects the Scaling Options for the LVDS panel (only in FPM: Fixed Mode)

LVDS DVI ID → 5

Select the type of used LVDStoDVI converter 5 = 1x18bit Adapter, 7 = 1x24bit Adapter

Backlight Control Type None/External

I2C PWM

Selects the mode for Backlight Control

Backlight Brightness [0…255] Selects the default setting for Backlight Brightness

COMe-mSP1 / BIOS Operation

System Controller Hub Configuration

Feature Option Description

USB UHCI Controller Disabled

2 USB Ports 4 USB Ports … 8 USB Ports

Enables / Disables USB ports

USB EHCI Controller

Enabled Disabled

Controls EHCI (USB 2.0) functionality for all the UHCI ports set to active state

USB Client Controller Enabled

Disabled

This enables the USB client functionality on COM Express USB Port #7

Audio Controller

HDAudio Disabled

Enables / Disables the HDA audio controller

Serial IRQ Mode

Continuous Quiet

Defines the serial IRQ mode (Quiet = the chipset communicates only if an IRQ is triggered) for the LPC interface

COMe-mSP1 / BIOS Operation

6.4.8 Exit Menu

Feature Description

Save To RTC/EEPROM and Exit Saving system setup to RTC and EEPROM and exit setup. F10 key can be used for this

operation

Save As Custom Defaults To RTC/Flash and Exit Saving system setup as custom defaults to RTC and Flash and exit setup. F11 key can

be used for this operation. Refer to Flash Backup Feature for more details

Discard Changes and Exit Exit system setup without saving any changes. ESC key can be used for this operation

Discard Changes Discards changes done so far to any of the setup questions. F7 key can be used for

this operation

Load Manufacturing Defaults Load manufacturing default values for all the setup questions. F9 key can be used for

this operation

Load Custom Defaults Load custom default values for all the setup questions.

. . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . .

COMe-mSP1 / BIOS Operation

. . . . . . . . . . .

. . .

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info@kontron.com

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Kontron COMe-mSP1 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 Naming clarification

2.3 Understanding COM Express® Functionality

2.4 COM Express® Documentation

2.5 COM Express® Benefits

3 Product Specification

3.1 Modules & Accessories

3.2 Functional Specification

Processor

CPU specifications

Memory

Graphics Core

Monitor output

LVDS

Display Interfaces

Chipset

Storage

Connectivity

Ethernet

Misc Interfaces and Features

Kontron Features

Power Features

Power Consumption and Performance

Supported Operating Systems

3.3 Block Diagram

3.4 Electrical Specification

3.4.1 Supply Voltage

3.4.2 Power Supply Rise Time

3.4.3 Supply Voltage Ripple

3.4.4 Power Consumption

3.4.5 ATX Mode

3.4.6 Single Supply Mode

3.5 Power Control

Power Supply

Power Button (PWRBTN#)

Power Good (PWR_OK)

Reset Button (SYS_RESET#)

SM-Bus Alert (SMB_ALERT#)

3.6 Environmental Specification

3.6.1 Temperature Specification

3.6.2 Humidity

3.7 Standards and Certifications

RoHS

CE marking

Component Recognition UL 60950-1

WEEE Directive

Conformal Coating

Shock & Vibration

3.8 MTBF

3.9 Mechanical Specification

3.9.1 Module Dimension

3.9.2 Height on Top

3.9.3 Height on Bottom

3.9.4 Mechanical Drawing

3.10 Thermal Management

3.11 Heatspreader

4 Features and Interfaces

4.1 Onboard SSD

Basic features of the PATA NANDrives

SLC NANDrive™

4.2 LPC

4.3 LPC boot

Using an external LPC Firmware Hub

To create a BIOS with custom defaults:

4.4 M.A.R.S.

4.5 Fast I2C & SMBus

4.6 JIDA16 and JIDA32

4.7 K-Station 1