Kontron COMe-mCT10 User Manual

COMe-mCT10

Document Revision 130

www.kontron.com

» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 Naming clarification..................................................................................................................... 7

2.3 Understanding COM Express® Functionality.......................................................................................7

2.4 COM Express® Documentation......................................................................................................... 8

2.5 COM Express® Benefits.................................................................................................................. 8

3 Product Specification............................................................................9

3.1 Module definition......................................................................................................................... 9

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 15

3.4 Accessories............................................................................................................................... 16

3.5 Electrical Specification................................................................................................................ 17

3.5.1 Supply Voltage........................................................................................................................... 17

3.5.2 Power Supply Rise Time................................................................................................................17

3.5.3 Supply Voltage Ripple.................................................................................................................. 17

3.5.4 Power Consumption..................................................................................................................... 17

3.5.5 ATX Mode.................................................................................................................................. 18

3.5.6 Single Supply Mode..................................................................................................................... 18

3.6 Power Control............................................................................................................................ 19

3.7 Environmental Specification......................................................................................................... 20

3.7.1 Temperature Specification............................................................................................................ 20

3.7.2 Humidity................................................................................................................................... 20

3.8 Standards and Certifications.........................................................................................................21

3.9 MTBF........................................................................................................................................ 23

3.10 Mechanical Specification.............................................................................................................. 24

3.11 Thermal Management, Heatspreader and Cooling Solutions.................................................................25

3.12 Onboard Fan Connector................................................................................................................ 26

4 Features and Interfaces.......................................................................27

4.1 Onboard SSD.............................................................................................................................. 27

4.2 S5 Eco Mode.............................................................................................................................. 28

4.3 LPC.......................................................................................................................................... 29

4.4 Serial Peripheral Interface (SPI)....................................................................................................30

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COMe-mCT10 /

4.5 SPI boot.................................................................................................................................... 30

4.6 M.A.R.S.................................................................................................................................... 32

4.7 UART........................................................................................................................................ 33

4.8 Fast I2C.................................................................................................................................... 34

4.9 GPIO - General Purpose Input and Output.........................................................................................35

4.10 Dual Staged Watchdog Timer......................................................................................................... 36

4.11 Intel® Fast Flash Standby™ / Rapid Start Technology™.......................................................................37

4.12 Speedstep Technology................................................................................................................. 39

4.13 C-States.................................................................................................................................... 40

4.14 Hyper Threading......................................................................................................................... 41

4.15 Graphics Features....................................................................................................................... 42

4.16 Hardware Configuration............................................................................................................... 42

4.17 Graphics VBIOS and Driver............................................................................................................ 42

4.18 ACPI Suspend Modes and Resume Events..........................................................................................43

4.19 USB......................................................................................................................................... 44

5 System Resources...............................................................................45

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 45

5.2 Memory Area............................................................................................................................. 45

5.3 I/O Address Map......................................................................................................................... 46

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 46

5.5 I2C Bus..................................................................................................................................... 47

5.6 JILI I2C Bus............................................................................................................................... 47

5.7 System Management (SM) Bus....................................................................................................... 47

6 Pinout List.........................................................................................48

6.1 General Signal Description............................................................................................................ 48

6.2 Connector X1A Row A................................................................................................................... 49

6.3 Connector X1A Row B................................................................................................................... 51

7 BIOS Operation...................................................................................53

7.1 Determining the BIOS Version....................................................................................................... 53

7.2 BIOS Update.............................................................................................................................. 53

7.3 Setup Guide............................................................................................................................... 55

7.4 POST Codes................................................................................................................................ 55

7.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 55

7.5 BIOS Setup................................................................................................................................ 57

7.5.1 Main Menu................................................................................................................................. 57

7.5.2 Advanced.................................................................................................................................. 59

7.5.3 Chipset..................................................................................................................................... 89

7.5.4 Boot........................................................................................................................................ 96

7.5.5 Security.................................................................................................................................... 97

7.5.6 Save & Exit................................................................................................................................ 99

4

COMe-mCT10 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

5

COMe-mCT10 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

6

COMe-mCT10 / Introduction

2 Introduction

2.1 Product Description

The first credit card sized (55mm x 84 mm) COM Express® mini COM based on Intel® 32nm Dual Core technology. Three
performance versions are availabe from 2x 1.6 GHz up to 2x 1.86 GHz. With onboard memory and optional flash as well as
divesified graphics interfaces, the Kontron COMe-mCT10 series is optimized for the Industrial Automation, Infotainment
and Medical markets to deliver outstanding graphics performance.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

7

COMe-mCT10 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-mCT10. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

8

COMe-mCT10 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® mini sized Computer-on-Module COMe-mCT10 (NUP1) follows pin-out Type 10 and is compatible to
PICMG specification COM.0 Rev 2.0. The COMe-mCT10, based on Intel's Cedar Trail platform, is available in different
variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Part Number Product Name Processor DDR3 Flash UART TPM onboard FAN

34005-4032-19-7 COMe-mCT10 D2550 4/32GB Cedarview-D Intel® Atom™ D2550 4GB 32GB MLC 2 YES YES

34005-2040-19-6 COMe-mCT10 D2550 2GB/4GB Cedarview-D Intel® Atom™ D2550 2GB 4GB SLC - - YES

34005-1040-19-2 COMe-mCT10 N2800 1GB/4GB Cedarview-M Intel® Atom™ N2800 1GB 4GB SLC - - YES

34005-1040-16-2 COMe-mCT10 N2600 1GB/4GB Cedarview-M Intel® Atom™ N2600 1GB 4GB SLC - - -

34005-2040-16-2 COMe-mCT10 N2600 2GB/4GB Cedarview-M Intel® Atom™ N2600 2GB 4GB SLC 2 - -

34005-2000-19-6 COMe-mCT10 D2550 2GB Cedarview-D Intel® Atom™ D2550 2GB - 2 - YES

34005-2000-19-2 COMe-mCT10 N2800 2GB Cedar view-M Intel® Atom™ N2800 2GB - 2 - YES

34005-2000-16-2 COMe-mCT10 N2600 2GB Cedar view-M Intel® Atom™ N2600 2GB - 2 - -

34005-1000-19-6 COMe-mCT10 D2550 1GB Cedarview-D Intel® Atom™ D2550 1GB - - - YES

34005-1000-19-2 COMe-mCT10 N2800 1GB Cedar view-M Intel® Atom™ N2800 1GB - - - YES

34005-1000-16-2 COMe-mCT10 N2600 1GB Cedar view-M Intel® Atom™ N2600 1GB - - - -

Extended temperature grade modules (E1, -25°C to 75°C operating)

Part Number Product Name Processor DDR3 Flash UART TPM onboard FAN

34005-2040-19-6EXT COMe-mCT10 D2550 2/4GB E1 Cedarview-D Intel® Atom™ D2550 2GB 4GB SLC - - YES

34005-1000-19-2EXT COMe-mCT10 N2800 1GB E1 Cedarview-M Intel® Atom™ N2800 1GB - - - YES

34005-2000-16-2EXT COMe-mCT10 N2600 2GB E1 Cedarview-M Intel® Atom™ N2600 2GB - 2 - -

34005-1000-16-2EXT COMe-mCT10 N2600 1GB E1 Cedarview-M Intel® Atom™ N2600 1GB - - - -

Industrial temperature grade modules (XT, -40°C to 85°C operating)

Modules for E2 temperature range are available project based only, please contact your local sales or support for further
details.

Part Number Product Name Processor DDR3 Flash UART TPM onboard FAN

34005-MMFF-CC-X COMe-mCT10 All 1/2GB E2 optional optional n/a YES

The COMe-mCT10 is available for industrial temperature range. General capability was tested for following options:

» CPU: all

» Memory down: 1GB or 2GB industrial temperature grade

» Onboard flash: industrial grade MLC or SLC

» Options: 2x UART, FAN Connector

» Not available: TPM option

9

COMe-mCT10 / Product Specification

Memory and onboard Flash configurations 34005-MMFF-xx-x:

» MM = 10: 1024MB DDR3 Memory (8x1Gbit / 128Mx8)

» MM = 20: 2048MB DDR3 Memory (8x2Gbit / 256Mx8)

» FF = 00: without SATA SSD

» FF = 20: 2GB onboard SATA SSD

» FF = 40: 4GB onboard SATA SSD

» FF = 80: 8GB onboard SATA SSD

» FF = 16: 16GB onboard SATA SSD

» FF = 32: 32GB onboard SATA SSD

» FF = 64: 64GB onboard SATA SSD

Optional hardware features:

» TPM (not for E1/E2 variants)

» 2x UART

» 2 to 32GB SLC NANDrive

» 2 to 64GB MLC NANDrive

Optional BIOS features:

» Secure Flash Update

» Secure Boot

» CSM OptOut

Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.

10

COMe-mCT10 / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® Atom™ D2000/N2000 (Cedarview-M/D) CPU family supports:

» Intel® Hyper-Threading Technology

» Intel® 64

» Enhanced Intel SpeedStep® Technology (N2xxx only)

» Thermal Monitoring Technologies

» Execute Disable Bit

» 2 Display Pipes for dual independent displays

CPU specifications

CPU Intel® Atom™ D2550 Intel® Atom™ N2800 Intel® Atom™ N2600

Cores

2 2 2

Threads

4 4 4

Clock

1866MHz 1866MHz 1600MHz

Memory Speed

DDR3-1066 DDR3-1066 DDR3-800

Max Memory

up to 4GB up to 4GB up to 2GB

Cache

1MB 1MB 1MB

C-States

C0/C1 C0-C6 / C1E-C4E C0-C6 / C1E-C4E

EIST

- YES YES

CPU Thermal Management

TM1 TM1 & TM2 TM1 & TM2

GFX

GMA3650 GMA3650 GMA3600

GFX core frequency

640MHz 640MHz 400MHz

GFX render clock frequency

200MHz 200MHz 200MHz

Display Core Clock

355MHz 267MHz 200MHz

LVDS

1×18/24bit 1×18/24bit 1×18/24bit

LVDS Resolution

up to 1440x900x60 up to 1366x768x60 up to 1366x768x60

eDP Resolution

up to 1920x1080x60 up to 1366x768x60 up to 1366x768x60

DP Resolution

up to 2560x1600x60 up to 1600x1200x60 up to 1600x1200x60

HDMI/DVI Resolution

up to 1920x1200x60 up to 1920x1200x60 up to 1920x1200x60

PAVP

1.1c 1.1c -

HDCP

1.3 1.3 -

Blu-Ray 2.0 Playback

Yes Yes -

TDP

10W 6.5W 3.5W

Memory

Sockets

memory down

Memory Type

DDR3-800 / 1066

Maximum Size

2GB

4GB (512Mx8) of ficially not supported by Intel®

Technology

Single Channel (64bit)

11

COMe-mCT10 / Product Specification

Graphics Core

The integrated Intel® GMA 3650 / 3600 based on PowerVR SGX545 core supports:

Graphics Core Render Clock

640MHz @ GMA3650 (D2700/N2800)

400MHz @ GMA3600 (N2600),

Execution Units / Pixel Pipelines

4

Max Graphics Memory

1024MB

GFX Memory Bandwidth (GB/s)

6.4 / 8.5

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

9.0c / 3.0

Shader Model

3.0

Hardware accelerated Video

H.264,MPEG2,VC1, Blu-ray

Independent/Simultaneous Displays

2

Display Port

DP / eDP 1.1

HDCP support

HDCP 1.3a / PAVP 1.1c

Monitor output

CRT max Resolution

-

TV out:

-

LVDS

LVDS Bits/Pixel

1x18 / 1x24

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

D: 1440x900, M: 1366x768, 112MHz

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

-

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

-

Digital Display Interface DDI3

-

Maximum Resolution on DDI

HDMI: 1920x1200, DP-D: 2560x1600/DP-M: 1600x1200

PCH: Intel® NM10 Express Chipset

The 130nm Intel Platform Controller Hub Tigerpoint supports:

» PCI Express Gen 1.0 Speed

» USB 2.0

» HD Audio

» SATA 3Gb/s

Storage

onboard SSD

2-32GB SLC, 2-64GB MLC (SATA)

SD Card support

- instead of GPIO

IDE Interface

-

Serial-ATA

up to 2x SATA 3Gb/s

SATA AHCI

AHCI 1.0 with NCQ and HotPlug

SATA RAID

-

With onboard SATA drive only 1 external SATA interface (SATA 0) is available

12

COMe-mCT10 / Product Specification

Connectivity

USB

8x USB 2.0

USB Client

-

PCI

-

PCI External Masters

-

PCI Express

3x PCIe x1 Gen1

Max PCI Express

4x PCIe x1 without LAN

PCI Express x2/x4 configuration

YES

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Har twell)

Any PCIe device connecting to Intel@ Atom Processor D2000 and N2000 based platform
must support No_Snoop attribute

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

4MB SPI

Audio

HD Audio

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Infineon SLB9635TT optional

Miscellaneous

2x UART optional / PWM FAN

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI2

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

13

COMe-mCT10 / Product Specification

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 14(20)V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 4.0, iFFS

Power Consumption and Performance

Full Load Power Consumption

6.2 - 11.6W

Kontron Performance Index

7523 - 9554

Kontron Performance/Watt

821 - 1206

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

14

COMe-mCT10 / Product Specification

3.3 Block Diagram

15

SATA1

PwrCtrl

SysMgmt

RTC

SATA0
SATA1

SER0
SER1

DMI

PCIe#3

USB #0-7

(USB 2.0)

LPC

GPIO

SMB

PWM
FAN2

I2C

SMB

SPI

HDA

PCIe #0-2

PCIe #3

Intel® NM10

Express Chipset

LID

Sleep

TPM

SLB9635TT

SPI

BIOS Flash

LVDS

DP++

Connector Option

Standard

component

GB LAN

GPIO

Embedded Controller

(CPLD EPM570/ 1270)

HWM

NCT7802

EEPRO M

FAN1

COM Express® connector AB – Pin-out Type 10

GBLan

Intel® 82574L

VCC

5VSB

VBAT

HWM

SMB

Power sequencing

Watchdog

LPC2I2C

GPIO Buffer

SPD

DDR3-800/1066 memory down

Intel® Atom™

D2000 Series
N2000 Series

GMA3650
GMA3600

2x UART

SATA

NANDrive®

S5eco

COMe-mCT10 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

34005-0000-99-0 HSP COMe-mCT10 thread (11mm) For all CPUs and temperature grades

34005-0000-99-1 HSP COMe-mCT10 through (11mm) For all CPUs and temperature grades

34005-0000-99-2 HSP COMe-mCT10 slim thread (6.5mm) For all CPUs and temperature grades

34005-0000-99-3 HSP COMe-mCT10 slim though (6.5mm) For all CPUs and temperature grades

General accessories

Part Number COMe pin-out Type 10 compatible accessor ies Project Code Comment

34104-0000-00-0 COM Express® Reference Carrier-i Type 10 ADAP nITX Carrier with 8mm COMe connector

34101-0000-00-1 COM Express® Eval Carrier Type 10 ADAN ATX Eval Carrier with 8mm COMe connector

To be used in combination with ADA-Type10-Mezzanine only

34101-0000-00-2 COM Express® Eval Carrier Type 10 Gen2 ADAN ATX Eval Carrier with 8mm COMe connector

96007-0000-00-8 ADA-Type10-Mezzanine AMVV COMe basic sized stand-alone carrier or Adapter Card for Eval Carr ier

Gen1

96006-0000-00-1 COMe POST T10 NFCB POST Code / Debug Card

38019-0000-00-1 ADA-COMe-Height-single EERC Height Adapter

34104-0000-00-S COMe Ref. Starterkit T10 ADAP Starterkit with COMe Reference Carrier T10

Part Number Mounting Comment

34017-0000-00-0 COMe mMount Kit 5/8mm 1set Mounting Kit for 1 module including screws for 5mm & 8mm connectors

Part Number Cooling Solutions Comment

34099-0000-99-0 COMe mini Active Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

34099-0000-99-1 COMe mini Passive Uni Cooler for CPUs up to 5W TDP, to be mounted on HSP

34099-0000-99-2 COMe mini Passive Uni Cooler Slim for CPUs with 3-5W TDP, to be mounted on HSP

16

COMe-mCT10 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 14(20)V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-mCT10 variants is 6.2 - 11.6W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.

17

COMe-mCT10 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14(20)V in ATX Mode. On Computer-on-Modules
supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14(20)V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

18

COMe-mCT10 / Product Specification

3.6 Power Control

Power Supply

The COMe-mCT10 supports a power input from 4.75 - 14(20)V. The supply voltage is applied through the VCC pins (VCC) of
the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-mCT10 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

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COMe-mCT10 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-mCT10

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 14(20)V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 4.75 - 14(20)V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

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COMe-mCT10 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-mCT10 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

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COMe-mCT10 / Product Specification

Shock & Vibration

The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-mCT10 follows the requirements for electromagnetic

compatibility standards

» EN55022

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COMe-mCT10 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 209259 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

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COMe-mCT10 / Product Specification

3.10 Mechanical Specification

Module Dimension

» 55mm x 84mm (±0.2mm)

» Height approx. 3.5mm (withouth printed circuit board)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Kontron provides standard HSP for the specified height of 13mm and slim-line Heatspreader for a reduced height of

8.5mm for mini sized Computer-on-Modules. Universal Cooling solutions to be mounted on the HSP are 14.3mm (34099­0000-00-0/1) or 8mm (34099-0000-00-2) in height. This allows combinations of a total module height of 8.5mm or
13mm with the Heatspreader and between 16.5mm and 27.3mm with a cooling solution.

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COMe-mCT10 / Product Specification

3.11 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mCT10. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-mCT10. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-mCT10 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-mCT10 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

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COMe-mCT10 / Product Specification

3.12 Onboard Fan Connector

Variants with D2550 and N2800 are equipped with an onboard FAN connector for active cooling controlled by the BIOS.

Location of the FAN Connector on top

Specification of the FAN Connector:

» Part number (Molex) J3: 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 4.75 - 13V >13

FAN Output Voltage

4.75 - 13V 13V

Max. FAN Output Current

350mA 150mA

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COMe-mCT10 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-mCT10 features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC, 2-64GB MLC
(SATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following
SATA NANDrives are available:

Basic features of the SATA NANDrives

» ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support

» RoHS compliant NAND flash type

» SATA 1.5Gb/s Host transfer rate

» Hardware error detection, correction ECC and advanced wear leveling

» Bad block management

» TRIM support

» SMART support

» 0°C to +70°C temperature range for MLC types A-M-C/B-M-C

» -40°C to +85°C temperature range for MLC types B-M-I

» -40°C to +85°C temperature range for all SLC types

Single-level Cell (SLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No. 1002P-S-I-FZJE-ND104 1004P-S-I-FZJE-ND104 1008P-S-I-FZJE-ND104 1016P-S-I-FZJE-ND104 1032P-S-I-FZJE-ND104

Product Revision

CC1 CC1 CC1 CC1 CC1

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte

Burst Read/Write Speed

35/20 MB/s 70/35 MB/s 70/50 MB/s 70/55 MB/s 120/80 MB/s

Total Bytes

2,000,388,096 4,001,292,288 8,012,390,400 16,013,942,784 32,017,047,552

Active Mode Power

450mW 560mW 750mW 590mW 855mW

Typical P/E Cycles per
block

100,000 100,000 60,000 60,000 60,000

(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)

Multi-level Cell (MLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No.

1002A-M-C-FZJE-ND103
1002A-M-I-FZJE-ND103

1004A-M-C-FZJE-ND103
1004A-M-I-FZJE-ND103

1008B-M-C-FZJE-ND103
1008B-M-I-FZJE-ND103

1016B-M-C-FZJE-ND103
1016B-M-I-FZJE-ND103

1032B-M-C-FZJE-ND103
1032B-M-I-FZJE-ND103

1064B-M-C-FZJE-ND103
1064B-M-I-FZJE-ND103

Product Revision

CB2 CB2 CB2 CB2 CB2 CB2

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte 64GByte

Burst Read/Write
Speed

35/10 MB/s 35/10 MB/s 35/10 MB/s 70/20 MB/s 70/30 MB/s 110/60 MB/s

Total Bytes

1,941,553,152 3,941,941,248 8,012,390,400 16,013,942,784 32,017,047,552 64,023,257,088

Active Mode Power

360mW 360mW 360mW 440mW 565mW 820mW

Typical P/E Cycles per
block

5,000 5,000 5,000 5,000 5,000 5,000

(Data based on Datasheet S71430 Rev 02.00 from 10-2013)

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COMe-mCT10 / Features and Interfaces

4.2 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

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COMe-mCT10 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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COMe-mCT10 / Features and Interfaces

4.4 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.

4.5 SPI boot

The COMe-mCT10 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

30