Kontron COMe-cTH6 User Manual

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COMe-cTH6

Document Revision 0.83

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>> Table of Contents <<

1 User Information ............................................................................ 1

1.1 About This Document ............................................................................................................... 1

1.2 Copyright Notice ..................................................................................................................... 1

1.3 Trademarks ............................................................................................................................ 1

1.4 Standards ............................................................................................................................. 1

1.5 Warranty ............................................................................................................................... 2

1.6 Technical Support ................................................................................................................... 2

2 Introduction .................................................................................. 3

2.1 The COMe-cTH6 Module ............................................................................................................ 3

2.2 Naming Clarifications ............................................................................................................... 3

2.3 Understanding the COM Functionality .......................................................................................... 4

2.4 COM Express® Documentation ................................................................................................... 5

2.5 COM Express® Module Benefits .................................................................................................. 5

3 Specifications ................................................................................ 6

3.1 Functional Specification ........................................................................................................... 6

3.1.4 Processor: AMD R-Series Fusion Accelerated Processing Unit (APU) ................................................... 6

3.1.5 Chipset: AMD Fusion Controller Hub (FCH) ................................................................................... 6

3.1.6 Onboard Devices: ................................................................................................................... 7

3.1.7 Additional Interfaces: ............................................................................................................. 7

3.2 Functional Block Diagram ......................................................................................................... 8

3.3 Mechanical Specifications ......................................................................................................... 9

3.3.1 Module Dimensions ................................................................................................................ 9

3.3.2 Height on Top ....................................................................................................................... 9

3.3.3 Height on Bottom .................................................................................................................. 9

3.4 Electrical Specifications ......................................................................................................... 10

3.5 ATX Power ........................................................................................................................... 10

3.5.1 Single Power Supply ............................................................................................................. 10

3.5.2 Supply Current (Windows) ..................................................................................................... 10

3.6 Environmental Specifications .................................................................................................. 11

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3.6.1 Temperature ....................................................................................................................... 11

3.6.2 Operating: (with Kontron heat spreader plate assembly): ............................................................. 11

3.6.3 Operating: ......................................................................................................................... 11

3.6.4 Humidity ........................................................................................................................... 11

3.7 MTBF .................................................................................................................................. 11

4 COMe-cTH6 Connectors ................................................................... 12

4.1 Pin-Outs ............................................................................................................................. 13

4.1.1 Connectors X1A and X1B: COM Express® Interface (Type 6) ........................................................... 13

4.1.2 Connector J1 – Fan .............................................................................................................. 23

4.1.3 Connectors J2 and J3 – SO-DIMM DDR3 Memory Sockets ............................................................... 23

4.1.4 Connector J4 – JTAG (AMD Embedded Probe) ............................................................................. 24

5 COMe-cTH6 Interfaces .................................................................... 25

5.1 PCI Express Interface ............................................................................................................. 25

5.2 USB Interface ....................................................................................................................... 25

5.2.1 USB 2.0 Interface ................................................................................................................ 25

5.2.2 USB 3.0 Interface ................................................................................................................ 25

5.2.3 Configuration ..................................................................................................................... 26

5.3 SATA Interface ..................................................................................................................... 27

5.3.1 Configuration ..................................................................................................................... 27

5.4 Audio Interface .................................................................................................................... 27

5.4.1 Configuration ..................................................................................................................... 27

5.5 LPC Serial IRQ ...................................................................................................................... 27

5.5.1 Configuration ..................................................................................................................... 27

5.6 Graphics Interface ................................................................................................................. 28

5.6.1 Analog VGA ........................................................................................................................ 28

5.6.2 LVDS Flat Panel Interface ....................................................................................................... 28

5.7 Ethernet Interface ................................................................................................................. 28

5.7.1 Configuration ..................................................................................................................... 28

5.8 SPI Bus Interface .................................................................................................................. 29

5.9 LPC Bus Interface .................................................................................................................. 29

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5.10 Power Control Interface .......................................................................................................... 30

5.10.1 Power Good (PWR_OK) .......................................................................................................... 30

5.10.2 Power Button (PWRBTN#) ...................................................................................................... 30

5.10.3 5.10.3 Reset Button (SYS_RESET#) .......................................................................................... 30

5.11 Power Supply ....................................................................................................................... 31

5.11.1 ATX Mode / Single Supply Mode .............................................................................................. 31

5.12 Miscellaneous Circuits ............................................................................................................ 32

5.12.1 Speaker ............................................................................................................................. 32

5.12.2 Battery .............................................................................................................................. 32

5.12.3 I2C Bus .............................................................................................................................. 32

5.12.4 SMBus ............................................................................................................................... 32

6 Special Features ............................................................................ 33

6.1 Watchdog Timer (WDT) ........................................................................................................... 33

6.2 General Purpose Input and Output (GPIO) .................................................................................. 33

6.3 ACPI Suspend Modes and Resume Events .................................................................................... 34

6.3.1 Events that Resume the System from S3/S4 ............................................................................... 34

6.3.2 Events that Resume the System from S5 .................................................................................... 34

6.3.3 Events that Resume the System from S5 Eco ............................................................................... 34

7 Design Considerations .................................................................... 35

7.1 Thermal Management ............................................................................................................ 35

7.2 Heat Spreader Dimensions ...................................................................................................... 35

7.3 Onboard Fan Connector .......................................................................................................... 36

7.3.1 Fan Connector Electrical Characteristics .................................................................................... 37

8 System Resources .......................................................................... 38

8.1 Interrupt Request (IRQ) Lines .................................................................................................. 38

8.2 Memory Area ........................................................................................................................ 38

8.3 I/O Address Map ................................................................................................................... 38

8.4 Peripheral Component Interconnect (PCI) Devices ........................................................................ 39

8.5 System Management Bus (SMBus) ............................................................................................ 40

9 BIOS Operation ............................................................................. 41

iii

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9.1 Determining the BIOS Version .................................................................................................. 41

9.2 BIOS Setup Guide .................................................................................................................. 41

9.3 BIOS Setup Options ............................................................................................................... 43

9.3.1 Main Menu ......................................................................................................................... 43

9.3.2 Advanced Menu ................................................................................................................... 45

9.3.3 Chipset .............................................................................................................................. 62

9.3.4 Boot Configuration .............................................................................................................. 70

9.3.5 Security ............................................................................................................................. 72

9.3.6 Save and Exit ...................................................................................................................... 73

Appendix A: Architecture Information ...................................................... 74

Document Revision History .................................................................... 76

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1 User Information

1.1 About This Document

This document provides information about products from Kontron and/or its subsidiaries. No warranty of suitability,

purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is

accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights

of third parties are concerned.

1.2 Copyright Notice

system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,

photocopying, recording, or otherwise), without the express written permission of Kontron.

ETX®, ETXexpress® and microETXexpress® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron

is a trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following components used on this board are trademarked as follows:

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corporation. » Microsoft is a registered trademark of Microsoft Corporation. » Intel is a registered trademark of Intel Corporation. » COM Express is a trademark of PICMG. » All other products and trademarks mentioned in this manual are trademarks of their respective owners and

indicated with an “*”.

1.4 Standards

Kontron America Inc. is certified to ISO 9001-2008 and ISO 13485-2003 standards.

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1.5 Warranty

This Kontron product is warranted against defects in material and workmanship for the warranty period from the date

of shipment. During the warranty period, Kontron will, at its discretion, decide to repair or replace defective

products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,

unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper

installation or maintenance.

Kontron is not responsible for any defects or damages to other products not supplied by Kontron that are caused by a

faulty Kontron product.

1.6 Technical Support

Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed

to making our product easy to use and will help you use our products in your systems.

Please consult our website at http://www.kontron.com/support for the latest product documentation, utilities,

drivers and support contacts. Consult our customer section for the latest BIOS downloads, Product Change

Notifications and additional tools and software. You can also always contact your board supplier for technical

support.

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2 Introduction

2.1 The COMe-cTH6 Module

The Kontron COMe-cTH6 COM module complies with the Rev. 2.0 COM Express® specification that provides for a compact form factor (95 x 95 mm) and new COM Express® Type 6 connector definitions. The COMe-cTH6 module design enables the development of graphics-intensive applications based on the Advanced Micro Devices (AMD) RSeries Advanced Processing Unit (APU) and the AMD M3 Fusion Controller Hub (FCH) using the secure development path of an established, future-proof industry standard, the COM Express® compact form factor and pin-out Type 6.

The AMD processor on the Kontron COMe-cTH6 module has two integrated memory controllers for up to 8 GBytes (2x4GB) per channel of DDR3 memory. Support for the latest 3D graphics is provided by the integrated Radeon graphics controller which also provides four independent display interfaces supported with daisy chaining and a maximum resolution of 2560 x 1600 x 60 Hz (Display Port) or 1920 x 1200 x 60 Hz (HDMI/DVI). With seven PCI Express x1 lanes and 8 PEG lanes for flexible configurations, the COMe-cTH6 module is ideal for multi-interface designs and brings the added benefit of low power consumption. These special features make this 95 x 95 mm compact Computer-on-Module a key solution for applications such as multimedia content delivery, outdoor digital signage, infotainment kiosks, POS/POI devices, panel PCs, and professional gaming systems that require high-level graphics performance and support for the latest APIs like DirectX 11, and where low thermal power design is also an advantage.

All modules in the Kontron COM Express® family are compliant with the COM Express® standard. These modules also take advantage of the Kontron Embedded Application Programming Interface (Kontron EAPI), which is cross-platform middleware that is both form factor and operating system independent. This ensures easy interchangeability as well as design scalability and future migration paths.

The COMe-cTH6 module is a complete PC with standard interfaces such as USB 2.0 and USB 3.0, Gigabit Ethernet, SATA 3.0, as well as additional features like high-definition audio (HDA) and ACPI 3.0, Fast I2C, SPI, LPC, RTC, 2x serial ports (RX, TX) and S5 Eco.

2.2 Naming Clarifications

The COM Express® standard defines a Computer-On-Module, or COM, with all the components necessary for a bootable host computer, packaged as a super-component. The interfaces provide a smooth transition path from legacy parallel interfaces such as IDE or parallel ATA (PATA) to Low Voltage Differential Signaling (LVDS) interfaces including PCI Express* and Serial ATA (SATA).

» Basic COM Express® modules have a 125mm x 95mm form factor and follow pin-out types 2 or 6. » Compact COM Express® modules have a 95mm x 95mm form factor and follow pin-out types 2 or 6. » Mini COM Express® modules have a 55mm x 84mm form factor and follow pin-out types 1 or 10.

NOTE: The Kontron COMe-cTH6 compact module takes advantage of new features introduced in the PICMG R2.0 COM Express® Specification.

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2.3 Understanding the COM Functionality

All Kontron COM Express® modules contain two COM Express connectors (X1A and X1B), each with two rows. The primary connector rows are Row A and Row B (connector X1A). The secondary connector rows are Row C and Row D (connector X1B). The COMe-cTH6 module uses the PICMG COM Express® pin-out Type 6 definition, which is a recent addition to the PICMG COM Express standard and documented in Revision 2.0 of the PICMG specification. The Type 6 pin-out is based on Type 2 and also supports new features on the secondary connector. The key changes are:

» The PCI interface is no longer supported and the pins are used instead for digital display interfaces (DDI) and two

additional PCI Express lanes

» The IDE (PATA) parallel interface is no longer supported and the pins are used instead for additional transmit and

receive pairs for four USB 3.0 ports.

» Three dedicated DDI ports have been added. Ports 1, 2, and 3 can be configured individually for Display Port (DP),

HDMI, or DVI and port 1 can also be used for SDV0.

» Two optional two-wire RS232 serial ports have been added using pins formerly assigned to 12V signals.

The primary connector (Row A and Row B) on the COMe-cTH6 module features the following functionality:

» Analog VGA graphics » Gigabit Ethernet LAN » Serial ATA (SATA) » PCI Express* » USB 2.0 and USB 3.0 » Express card » Wake » Speaker » Intel® High Definition Audio (HDA) » LPC (Low Pin Count) bus » TTL serial » Watchdog timer (WDT) » GPIO

» I

» Power button » SPI (Serial Peripheral Interface) Bus

The secondary connector (Row C and Row D) supports the following buses and I/O:

» PEG x16 (the COMe-cTH6 is limited to 8 lanes, either the upper 8 or lower 8) » PCI Express » DDI » DP/DVI/HDMI » LVDS 18/24-bit single/dual channel

NOTE: For full descriptions of the COM Express Type 6 pin-outs, refer to the PICMG documentation.

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2.4 COM Express® Documentation

This product manual serves as one of three principal references for this COM Express® module design. It documents the specifications and features of the COMe-cTH6 module. The other two references, which are available from your Kontron support representative or from PICMG, include:

» The

PICMG COM.0 COM Express® Module Base Specification

form factors, pin-outs, and signals. This document can be obtained by filling out the order form on the PIGMG website at http://www.picmg.com .

» The

PICMG COM Express® Design Guide

maximum flexibility to accommodate a wide range of COM Express® modules. This guide is on the PICMG website at http://www.picmg.com.

, which serves as a general guide for baseboard design, with a focus on

2.5 COM Express® Module Benefits

Compact form factor (95 x 95 mm) Computer-on-Module Express (COM Express) modules are very compact, highly integrated computers that use either the Type 2 or Type 6 COM Express® connector pin-outs. All compact COM Express modules feature a standardized form factor and a standardized connector layout for a specified set of signals, as defined in the PICMG COM Express® specification (PICMG COM.0.R2). This standardization lets designers create a single-system baseboard that can accept present and future COM Express modules.

Kontron COM Express® modules include common personal computer (PC) peripheral functions such as:

» Graphics » USB ports » Ethernet » Audio » SATA hard disk drive format

Baseboard designers can optimize exactly how each of these functions is implemented physically for the intended application by placing connectors precisely where they are needed on a baseboard that is designed for an optimal fit in the system packaging.

A peripheral PCI Express bus can be implemented directly on the application-specific baseboard rather than on mechanically unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in super-component simplifies packaging, eliminates cabling, and significantly reduces system-level total cost of ownership.

A single baseboard design can use a range of COM Express modules. This flexibility enables product differentiation at various price/performance points, and the design of future-proof systems with a built-in upgrade path. The modularity of a COM Express solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express baseboard can work with several successive generations of COM Express modules.

A COM Express baseboard design has many of the advantages of a custom, computer-board design, but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.

, Revision 2.0, which defines the COM Express® module

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3 Specifications

3.1 Functional Specification

3.1.4 Processor: AMD R-Series Fusion Accelerated Processing Unit (APU)

» CPU: AMD R-460L quad core 2.0 (2.8) GHz (25W)

AMD R-452L quad core 1.6 (2.4) GHz (19W) AMD R-260H dual core 2.1 (2.6) GHz (17W)

» Cores: Up to four cores » Processor Speed: Up to 4x 2.8 GHz » Memory Controller: Up to 16 GBytes (2x8GB) DDR3 (1066/1333 MT/s) » Graphics Interfaces: Integrated AMD Radeon™ HD 7000 series graphics controller

» Display Support: Four displays with AMD Eyefinity technology (two non-DP plus DP or VGA)

» I/O Interfaces PCI Express 2.0: four PCIe general purpose lanes (Gen 1 and Gen 2) configurable as x1, x2,

» Instruction Set: Kontron Embedded Application Programming Interface (Kontron EAPI) » Package: 27mm x 31mm » Thermal Spec: Operation: 0° to +60°C

Enhanced DirectX®11 graphics multimedia support HD decode for H.264, VC-1, MPEG-2, DivX HW encode for H.264 at 1080p@60fps PEG x8, software-configurable as x1, x2, x4, and x8 Dual channel (18/24-bit) LVDS via Analogix ANX3110 DP-to-LVDS translator

3x DDI interfaces(HDMI/DVI/Display Port) including 1x eDP Additional 3x DP interfaces (multiplexed with PEG) Display Port resolution up to 2560 x 1600 x 60 Hx HDMI/DVI resolution up to 1920 x 1200 x 60 Hz Single analog VGA resolution up to 1960 x 1600 x 60Hz 1x CRT

and x4

Storage: -40° to +85°

3.1.5 Chipset: AMD Fusion Controller Hub (FCH)

» FCH AMD A70M M3 Fusion Controller Hub » Storage 4x SATA 3.0 with 6 Gbits/sec maximum transfer rate » PCI Express: three PCIe general purpose x1 Gen 2 lanes () software-configurable as x3, or as 1 x2 and 1

» LPC LPC bus brought to COM Express connector

x1Express Card: Control signals for two Express Cards Audio: three HDA audio channels mapped to COM Express AC/HDA, Speaker Out USB 2.0: eight ports mapped to two EHCI controllers (5 to one EHCI and 3 to another) USB 3.0: four Super Speed ports

» TPM Atmel AT97SC3204 TPM

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» Watchdog Timer WDT via CPLD » GPIO Four GPIs and four GPOs available on the COM Express connector » SMBus SMBus brought to the COM Express connector via FCH

» I

C I2C master with 7-bit I2C addressing with 100 KHz or 400 KHz operation and controller on

CPLD, for off- and on- module use

» External BIOS ROM Support for carrier board SPI devices (new with COM Express Rev 2) » Suspend Modes Core Sleep States: S0, S3, S4, S5, S5 Eco » Wake WAKE0#, WAKE1# support » TDP: 2.3W » Package: 24.5mmx24.5mm

3.1.6 Onboard Devices:

» Ethernet: Intel® I210-AT GbE Controller 10/100/1000 Mbit » LVDS Analogix ANX3110 18/24-bit single/dual channel DP/LVDS Translator » CPLD Altera EPM1270 CPLD » Watchdog Timer: BIOS enables and configures watchdog in the CPLD » Hardware Monitor Nuvoton NCT7904D chip

» I

C EEPROM AT24HC04B serial EEPROM for module parameter storage

» TPM Trusted Platform Module uses Atmel AT97SC3204 chip » Fan Header Molex 53261-0371 3-pin header for consistency with Kontron Universal Cooling Solution » Power Management: BIOS-enabled ACPI 4.0 power management for supported OSs

3.1.7 Additional Interfaces:

» Passive Cooling: Passive and Critical Trip Point » ACPI: ACPI 4.0 » Input Voltage: Single supply support with wide range power supply input, 4.75V – 20V

5.0V supply is the optional standby power rail.

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3.2 Functional Block Diagram

Figure 1 is the COMe-cTH6 COM Express™ Type 6 module block diagram.

Figure 1: COMe-cTH6 COM (Type 6) Block Diagram

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3.3 Mechanical Specifications

3.3.1 Module Dimensions

» 95 mm x 95 mm ±0.2 mm (3.47 in. x 3.47 in)

3.3.2 Height on Top

» Approximately 8.0 mm maximum (without the PCB) » Height varies depending on whether an optional cooling solution (either a passive heat sink or a heat spreader

plate) is installed

3.3.3 Height on Bottom

» Approximately 4.06 mm maximum (without the PCB)

Figure 2: COMe-cTH6 Module Mechanical Drawing

All dimensions are shown in millimeters. The COM Express® specification says that these holes should be ± 0.25mm [±0.010"], unless otherwise noted. The tolerances for placement of the COM Express connector with respect to the peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"]. The mounting holes shown in the drawing use 6mm diameter pads and 2.7mm plated holes for use with 2.5mm hardware. The pads are tied to the PCB ground plane. Black circles represent the mounting holes required by the PICMG COM Express® standard.

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Module Power Consumption by Main

Input Supply Voltage

4.75V

12V

20V

Windows Desktop (idle)

5.0W

5.6W

6.0W

TAT at maximum power configuration

33.8W

34.4W

35.0W

S3 with Wake-on-LAN disabled

0.7W

0.8W

0.9W

S5 with Wake-on-LAN disabled

0.4W

0.5W

0.6W

S5 Eco

~0.005W

0.02W

0.05W

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3.4 Electrical Specifications

3.5 ATX Power

Main power is on the COM Express VCC_12V pins and standby power is on the VCC_5V_SBY pins. RTC power is provided on the VCC_RTC pins. VCC_12V may or may not collapse in suspend states S3, S4, and S5.

3.5.1 Single Power Supply

4.75V to +20V main power is on the COM Express VCC_12V pins and standby power, if needed, is also provided on the VCC_12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the carrier board. RTC power is provided on the VCC_RTC pins.

3.5.2 Supply Current (Windows)

The testing performed to capture the supply current data used tested modules mounted on a Kontron evaluation board with a mouse and keyboard connected. The power consumption tests were executed in Windows XP (with SP3) using a tool to stress the CPU at 100 % load. The power measurement values were captured after 15 minutes of full load or a stable CPU core temperature of 90°C. To ensure a stable die temperature, a corresponding heat sink was used to hold the temperature under the critical trip point. The modules were tested using the maximum CPU frequency. For more detailed information, refer to the “Power Consumption” diagrams on the EMD Customer section of the Kontron website.

NOTE: It is impossible to test for all possible applications on the market. There may be an application that draws more power from the CPU than the values measured in the table above. Take this into consideration if you are at the limit of the thermal specification, in which case you should consider improving your thermal solution.

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3.6 Environmental Specifications

3.6.1 Temperature

3.6.2 Operating: (with Kontron heat spreader plate assembly):

» Ambient temperature: 0 to 60°C with an active fan heat sink. » Non-operating: -30 to +85°C

NOTE: The maximum operating temperature with the heat spreader plate installed is the maximum measurable temperature on any spot on the heat spreader surface. You must maintain the temperature according to the specification above.

3.6.3 Operating:

» Maximum operating temperature: 0-60°C » Non operating: -30°C to +85°C

NOTE: The maximum operating temperature is the maximum measurable temperature on any spot on the module

3.6.4 Humidity

» Operating: 10% to 90%, non-condensing » Non operating: 5% to 95%, non-condensing

3.7 MTBF

TBD

surface. You must maintain the temperature according to the specification above.

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Type

Description

Type

Description

I/O-3.3

Bi-directional 3.3 V IO-Signal

O-3,3

3.3V Output

I/O-5T

Bi-dir. 3.3V I/O (5V Tolerance)

O-5

5V Output

I/O-5

Bi-directional 5V I/O-Signal

DP-I/O

Differential Pair Input/Output

I-3,3

3.3V Input

DP-I

Differential Pair Input

I/OD

Bi-directional Input/Output Open Drain

DP-O

Differential Pair Output

I-5T

3.3V Input (5V Tolerance)

Pull-Up Resistor

Output Analog

Pull-Down Resistor

Output Open Drain

PWR

Power Connection

O-1,8

1.8V Output

Not connected, Signal not available

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4 COMe-cTH6 Connectors

The pin-outs for COM Express® interface connectors X1A (primary connector, rows A and B) and X1B (secondary connector, rows C and D) are documented for convenient reference. See the PICMG COM Express® Specification on the PICMG website and COM Express® Design Guide on the Kontron website for detailed, design-level information.

Figure 3: COM Interface Connector Locations

Table 1: Electrical Signal Abbreviation

NOTE: To protect external power lines of peripheral devices, make sure that the wires have the right diameter to withstand the maximum available current and the enclosure of the peripheral device fulfills the fire-protection requirements in IEC/EN60950.

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Signal

Description

Type

Termination

Comment

GND1

Power Ground

PWR - -

GBE0_MDI3-

Ethernet Receive Data-

DP-I

Intel® I210-AT

GBE0_MDI3+

Ethernet Receive Data+

DP-I

Intel® I210-AT

GBE0_LINK100

Ethernet Speed LED 100Mbps

OD -

GBE0_LINK1000

Ethernet Speed LED 1000Mbps

OD -

GBE0_MDI2-

Ethernet Receive Data-

DP-I

Intel® I210-AT

GBE0_MDI2+

Ethernet Receive Data+

DP-I

Intel® I210-AT

GBE0_LINK

LAN Link LED

OD -

GBE0_MDI1-

Ethernet Receive Data-

DP-I

Intel® I210-AT

A10

GBE0_MDI1+

Ethernet Receive Data+

DP-I

Intel® I210-AT

A11

GND2 (Fixed)

Power Ground

PWR - -

A12

GBE0_MDI0-

Ethernet Transmit Data-

DP-O

Intel® I210-AT

A13

GBE0_MDI0+

Ethernet Transmit Data+

DP-O

Intel® I210-AT

A14

GBE0_CTREF

LAN Reference Voltage

O-3.3

A15

SUS_S3

Indicates Suspend to RAM state

O-3.3

A16

SATA0_TX+

SATA 0 Transmit Data+

DP-O -

A17

SATA0_TX-

SATA 0 Transmit Data-

DP-O -

A18

SUS_S4

Indicates Suspend to Disk state

O-3.3

A19

SATA0_RX+

SATA 0 Receive Data+

DP-I

A20

SATA0_RX-

SATA 0 Receive Data-

DP-I -

A21

GND3

Power Ground

PWR -

A22

SATA2_TX+

SATA 2 Transmit Data-

DP-O

A23

SATA2_TX-

SATA 2 Transmit Data+

DP-O

A24

SUS_S5

Indicates Soft Off state

O-3.3

A25

SATA2_RX+

SATA 2 Receive Data+

Not connected

A26

SATA2_RX-

SATA 2 Receive Data-

Not connected

A27

BATLOW

Indicates low external battery

I-3.3

A28

(S)ATA_ACT

SATA, IDE, SD Activity Indicator

OD-3.3

A29

AC/HDA_SYNC

HD Audio Sync

O-3.3

A30

AC/HDA_RST

HD Audio Reset

O-3.3

A31

GND4

Power Ground

PWR - -

A32

AC/HDA_BITCLK

HD Audio Clock

O-3.3

A33

AC/HDA_SDOUT

HD Audio Data

O-3.3

A34

BIOS_DIS0

Disable Module BIOS Enables boot from a BIOS on

Baseboard

I-3.3

A35

THRMTRIP#

CPU thermal shutdown indicator

O-3.3

DRAFT COPY FOR REVIEW ONLY

4.1 Pin-Outs

4.1.1 Connectors X1A and X1B: COM Express® Interface (Type 6)

NOTE: The termination resistors in these tables are already mounted on the COMe-cTH6 module. Refer to the PICMG

COM Express® Design Guide for information about additional termination resistors

DRAFT COPY FOR REVIEW ONLY

Page 20

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

A36

USB6-

USB Data- Port #6

DP-I/O

A37

USB6+

USB Data+ Port #6

DP-I/O

A38

USB_6_7_OC

USB Overcurrent Pair 6/7

I-3.3

A39

USB4-

USB Data- Port #4

DP-I/O

A40

USB4+

USB Data+ Port #4

DP-I/O

- A41

GND5

Power Ground

PWR - -

A42

USB2-

USB Data- Port #2

A43

USB2+

USB Data+ Port #2

DP-I/O

A44

USB_2_3_OC

USB Overcurrent Pair 2/3

I-3.3

A45

USB0-

USB Data- Port #0

DP-I/O

A46

USB0+

USB Data+ Port #0

DP-I/O

A47

VCC_RTC

RTC Power Supply +3V

PWR - -

A48

EXCD0_PERST

PCIe Express Card 0 Reset

O-3.3

A49

EXCD0_CPPE#

PCIe Express Card 0 Request

I-3.3

A50

LPC_SERIRQ

LPC Serial Interrupt Request

IO-3.3

A51

GND6

Power Ground

PWR - -

A52

PCIE_TX5+

PCIe 5 Transmit Data+

DP-O

A53

PCIE_TX5-

PCIe 5 Transmit Data-

DP-O

A54

GPI0

General Purpose Input 0

I-3.3

A55

PCIE_TX4+

PCIe 4 Transmit Data+

DP-O

A56

PCIE_TX4-

PCIe 4 Transmit Data-

DP-O

A57

GND7

Power Ground

PWR - -

A58

PCIE_TX3+

PCIe 3 Transmit Data+

DP-O

A59

PCIE_TX3-

PCIe 3 Transmit Data-

DP-O

A60

GND8

Power Ground

PWR - -

A61

PCIE_TX2+

PCIe 2 Transmit Data+

DP-O

A62

PCIE_TX2-

PCIe 2 Transmit Data-

DP-O

A63

GPI1

General Purpose Input 1

I-3.3

A64

PCIE_TX1+

PCIe 1 Transmit Data+

DP-O

A65

PCIE_TX1-

PCIe 1 Transmit Data-

DP-O

A66

GND9

Power Ground

PWR - -

A67

GPI2

General Purpose Input 2

I-3.3

A68

PCIE_TX0+

PCIe lane #0 Transmit+

DP-O

A69

PCIE_TX0-

PCIe lane #0 Transmit-

DP-O

A70

GND10

Power Ground

PWR - -

A71

LVDS_A0+

LVDS Channel A (positive)

DP-O

A72

LVDS_A0-

LVDS Channel A (negative)

DP-O -

A73

LVDS_A1+

LVDS Channel A (positive)

DP-O -

A74

LVDS_A1-

LVDS Channel A (negative)

DP-O

A75

LVDS_A2+

LVDS Channel A (positive)

DP-O

A76

LVDS_A2-

LVDS Channel A (negative)

DP-O

A77

LVDS_VDD_EN

LVDS Panel Power Controller

O-3.3

A78

LVDS_A3+

LVDS Channel A (positive)

DP-O

A79

LVDS_A3-

LVDS Channel A (negative)

DP-O

A80

GND11

Power Ground

PWR - -

A81

LVDS_A_CLK+

LVDS Channel A Clock+

DP-O

A82

LVDS_A_CLK-

LVDS Channel A Clock-

DP-O

DRAFT COPY FOR REVIEW ONLY

Page 21

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

A83

LVDS_I2C_CLK

LVDS I2C Clock

IO-3.3

A84

LVDS_I2C_DAT

LVDS I2C Data

IO-3.3

A85

GPI3

General Purpose Input 3

I-3.3

A86

RSVD1

Reserved

Not connected

A87

RSVD2

Reserved

Not connected

A88

PCIE0_CK_REF+

PCIe Clock (positive)

DP-O

A89

PCIE0_CK_REF-

PCIe Clock (negative)

DP-O

A90

GND12

Power Ground

PWR - -

A91

SPI_Power

Power for off-board SPI flash

O-3.3

A92

SPI_MISO

SPI Master In Slave Out data line

I-3.3

A93

GPO0

General Purpose Output 0

O-3.3

A94

SPI_CLK

SPI clock line for off-board SPI

O-3.3

A95

SPI_MOSI

SPI Master Out Slave In data line

O-3.3

- A96

TPM_PP

Trusted Platform Module Physical Presence pin

I-3.3

A97

TYPE10

Not connected for Type 6 module

Not connected

A98

SER0_TX

Gen. Purpose Serial Port 0 Transmit

Not connected

A99

SER0_RX

Gen. Purpose Serial Port 0 Receive

Not connected

A100

GND13

Power Ground

PWR - -

A101

SER1_TX

General Purpose Serial Port 1 Transmit

Not connected

A102

SER1_RX

General Purpose Serial Port 1 Receive

Not connected

A103

LID

LID Button

I/OP-3.3

A104

VCC_12V1

12V VCC

PWR - -

A105

VCC_12V2

12V VCC

PWR - -

A106

VCC_12V3

12V VCC

PWR - -

A107

VCC_12V4

12V VCC

PWR - -

A108

VCC_12V5

12V VCC

PWR - -

A109

VCC_12V6

12V VCC

PWR - -

A110

GND14

Power Ground

PWR - -

Signal

Description

Type

Termination

Comment

GND15

Power Ground

PWR - -

GBE0_ACT

Ethernet Activity LED

FET PD

LPC_FRAME

LPC Frame Indicator

O-3.3

LPC_AD0

LPC Address/Data Bus

IO-3.3

LPC_AD1

LPC Address/Data Bus

IO-3.3

LPC_AD2

LPC Address/Data Bus

IO-3.3

LPC_AD3

LPC Address/Data Bus

IO-3.3

LPC_DRQ0

LPC Serial DMA Request

I-3.3

LPC_DRQ1

LPC Serial DMA Request

I-3.3

B10

LPC_CLK

LPC Clock

O-3.3

B11

GND16

Power Ground

PWR - -

B12

PWRBTN#

Power Button Input

I-3.3

B13

SMB_CLK

SMBus Clock

O-3.3

B14

SMB_DAT

SMBus Data

IO-3.3

B15

SMB_ALERT

SMBus Interrupt

IO-3.3

DRAFT COPY FOR REVIEW ONLY

Table 2: Connector X1A - Row A

DRAFT COPY FOR REVIEW ONLY

Page 22

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

B16

SATA1_TX+

SATA 1 Transmit Data+

DP-O

B17

SATA1_TX-

SATA 1 Transmit Data-

DP-O

B18

SUS_STAT

Imminent suspend operation; used to notify LPC

devices.

O-3.3

B19

SATA1_RX+

SATA 1 Receive Data+

DP-I

B20

SATA1_RX-

SATA 1 Receive Data-

DP-I

B21

GND17

Power Ground

PWR - -

B22

SATA3_TX+

SATA 3 Transmit Data+

DP-O

B23

SATA3_TX-

SATA 3 Transmit Data-

DP-O

B24

PWR_OK

Power OK from power supply

I-3.3

B25

SATA3_RX+

SATA 3 Receive Data+

DP-I

B26

SATA3_RX-

SATA 3 Receive Data-

DP-I

B27

WDT

Watchdog Timeout

O-3.3

B28

AC/HDA_SDIN2

Audio CODEC Serial Data In 2

I-3.3

B29

AC/HDA_SDIN1

Audio CODEC Serial Data In 1

I-3.3

B30

AC/HDA_SDIN0

Audio CODEC Serial Data In 0

I-3.3

B31

GND18

Power Ground

PWR - -

B32

SPKR

Speaker Interface

O-3.3

B33

I2C_CLK

I2C Clock

IO-3.3

B34

I2C_DAT

I2C Data

IO-3.3

B35

THRM

Over Temperature Indicator

I-3.3

B36

USB7-

USB Data- Port #7

DP-I/O

B37

USB7+

USB Data+ Port #7

DP-I/O

B38

USB_4_5_OC

USB Overcurrent Pair 4/5

I-3.3

B39

USB5-

USB Data- Port #5

DP-I/O

B40

USB5+

USB Data+ Port #5

DP-I/O

B41

GND19

Power Ground

PWR - -

B42

USB3-

USB Data- Port #3

DP-I/O

B43

USB3+

USB Data+ Port #3

DP-I/O

B44

USB_0_1_OC

USB Overcurrent Pair 0/1

I-3.3

B45

USB1-

USB Data- Port #1

DP-I/O

B46

USB1+

USB Data+ Port #1

DP-I/O

B47

EXCD1_PERST

PCIe Express Card 1 Reset

O-3.3

B48

EXCD1_CPPE

PCIe Express Card 1 Request

I-3.3

B49

SYS_RESET

Reset button input

I-3.3

B50

CB_RESET

Carrier Board Reset

O-3.3

B51

GND20

Power Ground

PWR - -

B52

PCIE_RX5+

PCIe 5 Receive Data+

DP-I

B53

PCIE_RX5-

PCIe 5 Receive Data-

DP-I

B54

GPO1

General Purpose Output 1

O-3.3

B55

PCIE_RX4+

PCIe 4 Receive Data+

DP-I

B56

PCIE_RX4-

PCIe 4 Receive Data-

DP-I

B57

GPO2

General Purpose Output 2

O-3.3

B58

PCIE_RX3+

PCIe 3 Receive Data+

DP-I

B59

PCIE_RX3-

PCIe 5 Receive Data-

DP-I

B60

GND21

Power Ground

PWR - -

B61

PCIE_RX2+

PCIe 2 Receive Data+

DP-I

DRAFT COPY FOR REVIEW ONLY

Page 23

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

B62

PCIE_RX2-

PCIe 2 Receive Data-

DP-I

B63

GPO3

General Purpose Output 3

O-3.3

B64

PCIE_RX1+

PCIe 1 Receive Data+

DP-I

B65

PCIE_RX1-

PCIe 1 Receive Data-

DP-I

B66

WAKE0

PCI Express Wake Event

I-3.3

B67

WAKE1

General Purpose Wake Event

I-3.3

B68

PCIE_RX0+

PCIe lane #0 Receive+

DP-I

B69

PCIE_RX0-

PCIe lane #0 Receive-

DP-I

B70

GND22

Power Ground

PWR - -

B71

LVDS_B0+

LVDS Channel B0 (Positive)

DP-O

B72

LVDS_B0-

LVDS Channel B0 (Negative)

DP-O

B73

LVDS_B1+

LVDS Channel B1 (Positive)

DP-O

B74

LVDS_B1-

LVDS Channel B1 (Negative)

DP-O

B75

LVDS_B2+

LVDS Channel B2 (Positive)

DP-O

B76

LVDS_B2-

LVDS Channel B2 (Negative)

DP-O

B77

LVDS_B3+

LVDS Channel B3 (Positive)

DP-O

B78

LVDS_B3-

LVDS Channel B3 (Negative)

DP-O

B79

LVDS_BKLT_EN

Backlight Enable

O-3.3

B80

GND23

Power Ground

PWR - -

B81

LVDS_B_CK+

LVDS Channel B Clock+

DP-O

B82

LVDS_B_CK-

LVDS Channel B Clock-

DP-O

B83

LVDS_BKLT_CTRL

Backlight Brightness Control

O-3.3

B84

VCC_5V_SBY1

+5V Standby

PWR - -

B85

VCC_5V_SBY2

+5V Standby

PWR - -

B86

VCC_5V_SBY3

+5V Standby

PWR - -

B87

VCC_5V_SBY4

+5V Standby

PWR - -

B88

BIOS_DIS1

BIOS Disable 1 (off-board SPI select)

I-3.3

B89

VGA_RED

Analog Video Red

B90

GND24

Power Ground

PWR - -

B91

VGA_GRN

Analog Video Green

B92

VGA_BLU

Analog Video Blue

B93

VGA_HSYNC

Analog Video Horizontal Sync

O-3.3

B94

VGA_VSYNC

Analog Video Vertical Sync

O-3.3

B95

VGA_I2C_CK

Analog Video I2C Clock

IO/OD-3.3

B96

VGA_I2C_DAT

Analog Video I2C Data

IO/OD-3.3

B97

SPI_CS

SPI Chip Select

O-3.3

B98

RSVD3

Reserved

Not connected

B99

RSVD4

Reserved

Not connected

B100

GND25

Power Ground

PWR - -

B101

FAN_PWMOUT

Fan Speed Control

O/OP-3.3

B102

FAN_TACHIN

Fan Tachometer Input

I/OP-3.3

B103

SLEEP

Sleep Button

I/OP-3.3

B104

VCC_12V7

12V VCC

PWR - -

B105

VCC_12V8

12V VCC

PWR - -

B106

VCC_12V9

12V VCC

PWR - -

B107

VCC_12V10

12V VCC

PWR - -

B108

VCC_12V11

12V VCC

PWR - -

DRAFT COPY FOR REVIEW ONLY

Page 24

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

B109

VCC_12V12

12V VCC

PWR - -

B110

GND26

Power Ground

PWR

Signal

Description

Type

Termination

Comment

GND27

Power Ground

PWR - -

GND28

Power Ground

PWR - -

USB_SSRXO-

SuperSpeed USB Data Receive Path 0-

Not connected

USB_SSRXO+

SuperSpeed USB Data Receive Path 0+

Not connected

GND29

Power Ground

PWR - -

USB_SSRX1-

SuperSpeed USB Data Receive Path 1-

Not connected

USB_SSRX1+

SuperSpeed USB Data Receive Path 1+

Not connected

GND30

Power Ground

PWR - -

USB_SSRX2-

SuperSpeed USB Data Receive Path 2-

Not connected

C10

SUB_SSRX2+

SuperSpeed USB Data Receive Path 2+

Not connected

C11

GND31

Power Ground

PWR

C12

USB_SSRX3-

SuperSpeed USB Data Receive Path 3-

Not connected

C13

USB_SSRX3+

SuperSpeed USB Data Receive Path 3+

Not connected

C14

GND32

Power Ground

PWR - -

C15

DDI1_PAIR6+

Digital Display Interface

Not connected

C16

DDI1_PAIR6-

Digital Display Interface

Not connected

C17

RSVD5

Reserved

Not connected

C18

RSVD6

Reserved

Not connected

C19

PCIE_RX6+

PCI Express Differential Receive Pair 6+

DP-I

C20

PCIE_RX6-

PCI Express Differential Receive Pair 6-

DP-I

C21

GND33

Power Ground

PWR

C22

PCIE_RX7+

PCI Express Differential Receive Pair 7+

Not connected

C23

PCIE_RX7-

PCI Express Differential Receive Pair 7-

Not connected

C24

DDI1_HPD

Digital Display Interface Hot-plug detect

I-3.3

C25

DDI1_PAIR4+

Digital Display Interface

Not connected

C26

DDI1_PAIR4-

Digital Display Interface

Not connected

C27

RSVD7

Reserved

Not connected

C28

RSVD8

Reserved

Not connected

C29

DDI1_PAIR5+

Digital Display Interface

Not connected

C30

DDI1_PAIR5-

Digital Display Interface

Not connected

C31

GND34

Power Ground

PWR - -

C32

DDI2_CRTLCLK_AUX+

HDMI/DVI I2C CRTLCLK

I/O-3.3

C33

DDI2_CRTLDATA_AUX-

HDMI/DVI I2C CRTLDATA

I/O-3.3

C34

DDI2_DDC_AUX_SEL

Selects function of DDI CRTL & DATA Aux

I-3.3

C35

RSVD9

Reserved

Not connected

C36

DDI3_CRTLCLK_AUX+

HDMI/DVI I2C CRTLCLK

I/O-3.3

C37

DDI3_CRTLDATA_AUX-

HDMI/DVI I2C CRTLDATA

I/O-3.3

C38

DDI3_DDC_AUX_SEL

Selects function of DDI CRTL & DATA Aux

I-3.3

C39

DDI3_PAIR0+

Digital Display Interface

DP-O

C40

DDI3_PAIR0-

Digital Display Interface

DP-O

C41

GND35

Power Ground

PWR - -

DRAFT COPY FOR REVIEW ONLY

Table 3: Connector X1A - Row B

DRAFT COPY FOR REVIEW ONLY

Page 25

COMe-cTH6 User’s Guide

www.kontron.com

Signal

Description

Type

Termination

Comment

C42

DDI3_PAIR1+

Digital Display Interface

DP-O

C43

DDI3_PAIR1-

Digital Display Interface

DP-O

C44

DDI3_HPD

Digital Display Interface Hot-plug detect

I-3.3

C45

RSVD10

Reserved

Not connected

C46

DDI3_PAIR2+

Digital Display Interface

DP-O

C47

DDI3_PAIR2-

Digital Display Interface

DP-O

C48

RSVD11

Reserved

Not connected

C49

DDI3_PAIR3+

Digital Display Interface

DP-O

C50

DDI3_PAIR3-

Digital Display Interface

DP-O

C51

GND36

Power Ground

PWR - -

C52

PEG_RX0+

PCI Express Graphics Receive Lane 0 Positive

DP-I

C53

PEG_RX0-

PCI Express Graphics Receive Lane 0 Negative

DP-I

C54

TYPE0

Not connected for Type 6 module

Not connected

C55

PEG_RX1+

PCI Express Graphics Receive Lane 1 Positive

DP-I

C56

PEG_RX1-

PCI Express Graphics Receive Lane 1 Negative

DP-I

C57

TYPE1

Not connected for Type 6 module

Not connected

C58

PEG_RX2+

PCI Express Graphics Receive Lane 2 Positive

DP-I

C59

PEG_RX2-

PCI Express Graphics Receive Lane 2 Negative

DP-I

C60

GND37

Power Ground

PWR - -

C61

PEG_RX3+

PCI Express Graphics Receive Lane 3 Positive

DP-I

C62

PEG_RX3-

PCI Express Graphics Receive Lane 3 Negative

DP-I

C63

RSVD12

Reserved

Not connected

C64

RSVD13

Reserved

Not connected

nc-

C65

PEG_RX4+

PCI Express Graphics Receive Lane 4 Positive

DP-I C66

PEG_RX4-

PCI Express Graphics Receive Lane 4 Negative

DP-I

C67

RSVD14

Reserved

Not connected

C68

PEG_RX5+

PCI Express Graphics Receive Lane 5 Positive

DP-I

C69

PEG_RX5-

PCI Express Graphics Receive Lane 5 Negative

DP-I

C70

GND38

Power Ground

PWR - -

C71

PEG_RX6+

PCI Express Graphics Receive Lane 6 Positive

DP-I

C72

PEG_RX6-

PCI Express Graphics Receive Lane 6 Negative

DP-I

C73

GND39

Power Ground

PWR - -

C74

PEG_RX7+

PCI Express Graphics Receive Lane 7 Positive

DP-I

C75

PEG_RX7-

PCI Express Graphics Receive Lane 7 Negative

DP-I

C76

GND40

Power Ground

PWR - -

C77

RSVD15

Reserved

Not connected

C78

PEG_RX8+

PCI Express Graphics Receive Lane 8 Positive

DP-I

C79

PEG_RX8-

PCI Express Graphics Receive Lane 8 Negative

DP-I

C80

GND41

Power Ground

PWR - -

C81

PEG_RX9+

PCI Express Graphics Receive Lane 9 Positive

DP-I

C82

PEG_RX9-

PCI Express Graphics Receive Lane 9 Negative

DP-I

C83

RSVD16

Reserved

Not connected

C84

GND42

Power Ground

PWR - -

C85

PEG_RX10+

PCI Express Graphics Receive Lane 10 Positive

DP-I

C86

PEG_RX10-

PCI Express Graphics Receive Lane 10 Negative

DP-I

C87

GND43

Power Ground

PWR - -

C88

PEG_RX11+

PCI Express Graphics Receive Lane 11 Positive

DP-I

DRAFT COPY FOR REVIEW ONLY

Page 26

COMe-cTH6 User’s Guide

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Signal

Description

Type

Termination

Comment

C89

PEG_RX11-

PCI Express Graphics Receive Lane 11 Negative

DP-I

C90

GND44

Power Ground

PWR - -

C91

PEG_RX12+

PCI Express Graphics Receive Lane 12 Positive

DP-I

C92

PEG_RX12-

PCI Express Graphics Receive Lane 12 Negative

DP-I

C93

GND45

Power Ground

PWR - -

C94

PEG_RX13+

PCI Express Graphics Receive Lane 13 Positive

DP-I

C95

PEG_RX13-

PCI Express Graphics Receive Lane 13 Negative

DP-I

C96

GND46

Power Ground

PWR - -

C97

RSVD17

Reserved

Not connected

C98

PEG_RX14+

PCI Express Graphics Receive Lane 14 Positive

DP-I

C99

PEG_RX14-

PCI Express Graphics Receive Lane 14 Negative

DP-I

C100

GND47

Power Ground

PWR - -

C101

PEG_RX15+

PCI Express Graphics Receive Lane 15 Positive

DP-I

C102

PEG_RX15-

PCI Express Graphics Receive Lane 15 Negative

DP-I

C103

GND48

Power Ground

PWR - -

C104

VCC_12V13

12V VCC

PWR - -

C105

VCC_12V14

12V VCC

PWR - -

C106

VCC_12V15

12V VCC

PWR - -

C107

VCC_12V16

12V VCC

PWR - -

C108

VCC_12V17

12V VCC

PWR 8

C109

VCC_12V18

12V VCC

PWR - -

C110

GND49

Power Ground

PWR - -

Signal

Description

Type

Termination

Comment

GND50

Power Ground

PWR - -

GND51

Power Ground

PWR - -

USB_SSTX0-

SuperSpeed USB Data Transmit Path 0-

Not connected

USB_SSTX0+

SuperSpeed USB Data Transmit Path 0+

Not connected

GND52

Power Ground

PWR - -

USB_SSTX1-

SuperSpeed USB Data Transmit Path 1-

Not connected

USB_SSTX1+

SuperSpeed USB Data Transmit Path 1+

Not connected

GND53

Power Ground

PWR - -

USB_SSTX2-

SuperSpeed USB Data Transmit Path 2-

Not connected

D10

USB_SSTX2+

SuperSpeed USB Data Transmit Path 2+

Not connected

D11

GND54

Power Ground

PWR - -

D12

USB_SSTX3-

SuperSpeed USB Data Transmit Path 3-

Not connected

D13

USB_SSTX3+

SuperSpeed USB Data Transmit Path 3+

Not connected

D14

GND55

Power Ground

PWR - -

D15

DDI1_CTRLCLK_AUX+

HDMI/DVI I2C CRTLCLK

I/O-3.3

D16

DDI1_CTRLDATA_AUX-

HDMI/DVI I2C CRTLDATA

I/O-3.3

D17

RSVD18

Reserved

Not connected

D18

RSVD19

Reserved

Not connected

D19

PCIE_TX6+

PCI Express Differential Transmit Pair 6+

DP-O

D20

PCIE_TX6-

PCI Express Differential Transmit Pair 6-

DP-O

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Table 4: Connector X1B - Row C

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Signal

Description

Type

Termination

Comment

D21

GND56

Power Ground

PWR - -

D22

PCIE_TX7+

PCI Express Differential Transmit Pair 7+

Not connected

D23

PCIE_TX7-

PCI Express Differential Transmit Pair 7-

Not connected

D24

RSVD20

Reserved

Not connected

D25

RSVD21

Reserved

Not connected

D26

DDI1_PAIR0+

Digital Display Interface

DP-O

D27

DDI1_PAIR0-

Digital Display Interface

DP-O

D28

RSVD22

Reserved

Not connected

D29

DDI1_PAIR1+

Digital Display Interface1+

DP-O

D30

DDI1_PAIR1-

Digital Display Interface1-

DP-O

D31

GND57

Power Ground

PWR - -

D32

DDI1_PAIR2+

Digital Display Interface2+

DP-O

D33

DDI1_PAIR2-

Digital Display Interface2-

DP-O

D34

DDI1_DDC_AUX_SEL

Selects function of DDI CRTL & DATA Aux

I-3.3

D35

RSVD23

Reserved

D36

DDI1_PAIR3+

Digital Display Interface3+

DP-O

D37

DDI1_PAIR3-

Digital Display Interface3-

DP-O

D38

RSVD24

Reserved

- - -

D39

DDI2_PAIR0+

Digital Display Interface0+

DP-O

D40

DDI2_PAIR0-

Digital Display Interface0-

DP-O

D41

GND58

Power Ground

PWR - -

D42

DDI2_PAIR1+

Digital Display Interface1+

DP-O

D43

DDI2_PAIR1-

Digital Display Interface1-

DP-O

D44

DDI2_HPD

Digital Display Interface Hot-Plug Detect

I-3.3

D45

RSVD25

Reserved

Not connected

D46

DDI2_PAIR2+

Digital Display Interface2+

DP-O

D47

DDI2_PAIR2-

Digital Display Interface2-

DP-O

D48

RSVD26

Reserved

Not connected

D49

DDI2_PAIR3+

Digital Display Interface3+

DP-O

D50

DDI2_PAIR3-

Digital Display Interface3-

DP-O

D51

GND59

Power Ground

PWR - -

D52

PEG_TX0+

PCI Express Graphics Transmit Data Lane 0 Positive

DP-O

D53

PEG_TX0-

PCI Express Graphics Transmit Data Lane 0 Negative

DP-O

D54

PEG_LANE_RV

PCI Express Graphics Lane Reversal Input strap

I-3.3

D55

PEG_TX1+

PCI Express Graphics Transmit Data Lane 1 Positive

DP-O

D56

PEG_TX1-

PCI Express Graphics Transmit Data Lane 1 Negative

DP-O

D57

TYPE2

Not connected for Type 6 module

Not Connected

D58

PEG_TX2+

PCI Express Graphics Transmit Data Lane 2 Positive

DP-O

D59

PEG_TX2-

PCI Express Graphics Transmit Data Lane 2 Negative

DP-O

D60

GND60

Power Ground

PWR - -

D61

PEG_TX3+

PCI Express Graphics Transmit Data Lane 3 Positive

DP-O

D62

PEG_TX3-

PCI Express Graphics Transmit Data Lane 3 Negative

DP-O

D63

RSVD27

Reserved

Not connected

D64

RSVD28

Reserved

Not connected

D65

PEG_TX4+

PCI Express Graphics Transmit Data Lane 4 Positive

DP-O D66

PEG_TX4-

PCI Express Graphics Transmit Data Lane 4 Negative

DP-O

D67

GND61

Power Ground

PWR - -

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Signal

Description

Type

Termination

Comment

D68

PEG_TX5+

PCI Express Graphics Transmit Data Lane 5 Positive

DP-O

D69

PEG_TX5-

PCI Express Graphics Transmit Data Lane 5 Negative

DP-O

D70

GND62

Power Ground

PWR - -

D71

PEG_TX6+

PCI Express Graphics Transmit Data Lane 6 Positive

DP-O

D72

PEG_TX6-

PCI Express Graphics Transmit Data Lane 6 Negative

DP-O

D73

GND63

Power Ground

PWR

D74

PEG_TX7+

PCI Express Graphics Transmit Data Lane 7 Positive

DP-O - -

D75

PEG_TX7-

PCI Express Graphics Transmit Data Lane 7 Negative

DP-O - -

D76

GND64

Power Ground

PWR - -

D77

RSVD29

Reserved

Not connected

D78

PEG_TX8+

PCI Express Graphics Transmit Data Lane 8 Positive

DP-O

D79

PEG_TX8-

PCI Express Graphics Transmit Data Lane 8 Negative

DP-O

D80

GND65

Power Ground

PWR - -

D81

PEG_TX9+

PCI Express Graphics Transmit Data Lane 9 Positive

DP-O

D82

PEG_TX9-

PCI Express Graphics Transmit Data Lane 9 Negative

DP-O

D83

RSVD30

Reserved

Not connected

D84

GND66

Power Ground

PWR - -

D85

PEG_TX10+

PCI Express Graphics Transmit Data Lane 10 Positive

DP-O

D86

PEG_TX10-

PCI Express Graphics Transmit Data Lane 10 Negative

DP-O

D87

GND67

Power Ground

PWR - -

D88

PEG_TX11+

PCI Express Graphics Transmit Data Lane 11 Positive

DP-O

D89

PEG_TX11-

PCI Express Graphics Transmit Data Lane 11 Negative

DP-O

D90

GND68

Power Ground

PWR - -

D91

PEG_TX12+

PCI Express Graphics Transmit Data Lane 12 Positive

DP-O

D92

PEG_TX12-

PCI Express Graphics Transmit Data Lane 12 Negative

DP-O

D93

GND69

Power Ground

PWR - -

D94

PEG_TX13+

PCI Express Graphics Transmit Data Lane 13 Positive

DP-O

D95

PEG_TX13-

PCI Express Graphics Transmit Data Lane 13 Negative

DP-O

D96

GND70

Power Ground

PWR - -

D97

RSV31D

Reserved

D98

PEG_TX14+

PCI Express Graphics Transmit Data Lane 14 Positive

DP-O

D99

PEG_TX14-

PCI Express Graphics Transmit Data Lane 14 Negative

DP-O

D100

GND71

Power Ground

PWR - -

D101

PEG_TX15+

PCI Express Graphics Transmit Data Lane 15 Positive

DP-O

D102

PEG_TX15-

PCI Express Graphics Transmit Data Lane 15 Negative

DP-O

D103

GND72

Power Ground

PWR - -

D104

VCC_12V19

12V VCC

PWR - -

D105

VCC_12V20

12V VCC

PWR - -

D106

VCC_12V21

12V VCC

PWR - -

D107

VCC_12V22

12V VCC

PWR - -

D108

VCC_12V23

12V VCC

PWR - -

D109

VCC_12V24

12V VCC

PWR - -

D110

GND73

Power Ground

PWR - -

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Table 5: Connector X1B - Row D

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Name

CPU_FAN_TACH_C

CPU_FAN_VCC

CPU_FAN_GND

J1 – Fan Connector

J4 – JTAG Connector (AMD Embedded Probe)

J2, J3 – SO-DIMM DDR3 Memory Sockets

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- CP

Figure 4: Onboard Connectors

4.1.2 Connector J1 – Fan

J1 is a connector for 3-wire fan control. See Section 7.3, “Onboard Fan Connector” for more detailed information.

Table 6: J1 Fan Connector Pin-Out

4.1.3 Connectors J2 and J3 – SO-DIMM DDR3 Memory Sockets

This design supports up to 16 GBytes (two single channels, 8 GBytes each) of non-ECC, unbuffered SO-DIMM DDR3 memory. The R-series CPU has two 204-pin, keyed, SO-DIMM sockets, J2 and J3.

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Name

GND1

DBRDY

GND2

TDO

GND3

TDI

GND4

TMS

GND5

TCK

GND6

DBREQ

PWRBTN

VDDIO

SYSRST#

GND7

RST#

GND8

SCLK

GND9

SDAT

GND10

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4.1.4 Connector J4 – JTAG (AMD Embedded Probe)

J2 is a 22-pin flat foil connector (FFC) used to support the AMD Embedded Probe Header interface definition.

NOTE: A cable adapter must be used to connect a Sage debugger tool to the debug connector.

WARNING: The debug port is for internal use only. Do not connect any devices.

Table 7: J4 AMD Embedded Probe Connector Pin-Out

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5 COMe-cTH6 Interfaces

5.1 PCI Express Interface

The PCI Express* GEN 2.0 general purpose lanes provide a fast connection interface for many different system devices, such as network controllers, I/O controllers, or express card devices. The implementation of this subsystem complies with the COM Express Specification. Refer to the PICMG COM Express® Design Guide for additional implementation information.

The COMe-cTH6 COM supports up to seven general purpose PCI Express lanes; four lanes from the CPU, softwareconfigurable as x4, x2, or x1, and three additional PCIe lanes from the FCH, software-configurable as 3 x1 or 1 x1 and 1 x2.

5.2 USB Interface

The USB interface supports both USB 2.0 and USB 3.0 (new with COM Express Type 6).

5.2.1 USB 2.0 Interface

Eight high-speed USB 2.0 ports are brought from the Fusion Control Hub to the COM Express A-B connector. The FCH uses two EHCI controllers with one serving five COM Express ports (0 – 4) and one serving three COM Express ports (5 – 7).

Figure 5 shows how the eight USB 2.0 ports are mapped in the COMe-cTH6 module.

5.2.2 USB 3.0 Interface

Four super speed USB 3.0 ports are brought from the Fusion Control Hub to COM Express connector C-D, USB connector USB_SS (3:0).

Note: AMD advises adding a provision for a 300-Ω resistor and 15-pF capacitor to ground on each USB negative data

signal that goes to an external USB connector or to any internal USB 2.0 isochronous device. The resistor and capacitor should be located as close as possible to the USB device or connector. See AMD documentation for more details.

Error! Reference source not found. shows the internal USB 3.0 mapping from the AMD FCH.

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Notes: 1) When mapping HS/SS USB lanes to a USB 3.0 connector, they must be mapped as follows

2) Additional USB connections can be added using external USB hubs

HS Port 0 to SS Port 0

HS Port 1 to SS Port 1

HS Port 2 to SS Port 2

HS Port 3 to SS Port 3

Figure 5: USB Mapping

5.2.3 Configuration

The USB controllers are PCIe bus devices

The BIOS allocates the required system resources during configuration of the PCIe bus.

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5.3 SATA Interface

Four of the AMD Fusion Control Hub SATA 3.0 channels are routed to the four COM Express SATA channels. The FCH SATA 0-3 ports map to the COM Express SATA 0-3 pins.

Note: SATA trace lengths on module, which exceed recommended limit for SATA 3.0 traces, and the inclusion of the COM Express connector reduces signal amplitude and increases jitter. No failures have been seen during functional testing.

5.3.1 Configuration

The SATA controller is a PCIe bus device. The BIOS allocates the required system resources during the PCIe device

configuration.

5.4 Audio Interface

The AMD Fusion Control Hub supports High Definition Audio (HDA). This HD audio configuration supports three audio channels. HDA channels 0 – 2 are mapped to COM Express AC/HDA channels 0 – 2.

5.4.1 Configuration

The audio controller is in the AMD FCH. The BIOS allocates the required system resources during configuration.

5.5 LPC Serial IRQ

The LPC serial interrupt request pin (A50) offers a standardized interface to link interrupt request lines to a single I/O wire.

5.5.1 Configuration

The serial IRQ machine is in “Continuous Mode”.

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5.6 Graphics Interface

The COMe-cTH6 uses a graphics controller that is integrated in the AMD APU. The graphics engine supports multiple display types (three digital display interfaces -- DDI-0, DDI-1, and DDI-2 for DP, HDMI, and DVI,), with resolutions up to 2560x1200x60 Hz.

5.6.1 Analog VGA

The analog VGA graphics core, with a maximum resolution of 1920x1600x60Hz, is integrated in the Fusion Controller Hub (FCH) and is connected to the Com Express LVDS connector A-B. The APU DP port 1 is multiplexed to form two BIOS-selectable output options: the analog VGA interface to the COM Express VGA port or the Digital Display Interface (DDI) to COM Express DDI3.

5.6.2 LVDS Flat Panel Interface

The APU Display Port 0 is multiplexed to support either COM Express Digital Display Interface 2 (DDI 2) or COM Express LVDS A and B via an 18/24-bit, single/dual channel Display Port to the LVDS converter (Analogix ANX3110).

5.7 Ethernet Interface

The Ethernet interface on the COMe-cTH6 COM is the Intel® I210-AT GbE controller. As stated in the COM Express specification, the LAN magnetics are not on the module. The GbE controller is located close to the COM Express MDI LAN interconnect pins to keep the MDI path short. The controller supports auto-negotiation of 10/100/1000 Mbit connections.

The hardware supports S0, S3, or S5 power selection under BIOS control for a WOL (WakeOnLAN) option.

For cable lengths and termination on your baseboard, refer to the PICMG website.

COM Express® Design G

uide on the PICMG

5.7.1 Configuration

The Ethernet controller is a PCI Express bus device. The BIOS allocates the required system resources during the configuration of the PCIe device.

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Address (HEX)

Device

0000 - 00FF

IBM PC compatible devices (IRQ-Controller, Keyboard, RTC, etc.)

002E-002F

Optional: Super I/O W83627

004e - 004f

TPM

01F0 - 01F7

Fixed Disk

03C0 - 03CF

VGA/EGA compatible registers

03F6

Fixed Disk

0400 - 043F

SMBus

0480 - 04BF

GPIO ICH

04D0 - 04D1

IRQ Configuration

08F0 - 08FF

Optional

0900 - 091F

Power Management

0A80 - 0A83

Reserved

0CF8 - 0CFF

PCI Configuration

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5.8 SPI Bus Interface

The Serial Peripheral Interface (SPI) signals are connected to the COM Express connector A-B from the AMD Fusion Controller Hub. SPI BIOS is supported at the maximum level the FCH supports, 16 MBytes. Two BIOS disable straps, as defined in the COM Express Rev 2.0 specification, allow the selection of either on-module SPI BIOS or carrier board SPI or LPC BIOS.

The SPI interface can be used to connect two devices, one on the module and one on the carrier board, including external BIOS flash memory. The implementation of this subsystem complies with the COM Express Rev 2.0 specification. Carrier Board SPI boot support is new with COM Express Rev 2.0. For additional implementation information, refer to the

PICMG COM Express® Design Guide

on the PICMG website.

5.9 LPC Bus Interface

The Low Pin Count (LPC) interface signals are connected to the LPC controller in the AMD Fusion Controller Hub. The LPC low-speed interface can be used for peripheral circuits. For example, it can be used to interface to an external super I/O controller to provide a legacy device. The implementation of this subsystem complies with the COM ExpressTM specification. For additional implementation information, refer to the the PICMG website.

PICMG COM Express® Design Guide

Table 8: LPC and Fixed I/O Addresses

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5.10 Power Control Interface

VCC_12V is allowed to range from 4.75V to 20V. This range is above and beyond the requirements of the COM Express specification.

5.10.1 Power Good (PWR_OK)

The COMe-cTH6 COM provides an external input for a Power Good signal (pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be sampled as logic high to power on the module. The module includes a pull-up on Power Good enabling the module to boot if COM Express PWR_OK is not used on the carrier board.

5.10.2 Power Button (PWRBTN#)

The power button (pin B12) is available through the COM Express connector as defined in the pin-out list. The FCH handles the timing.

To power-off the module, press and hold the power button for at least four seconds.

5.10.3 5.10.3 Reset Button (SYS_RESET#)

The reset button (pin B49) is available through the COM Express connector as defined in the pin-out list. The module stays in reset as long as SYS_RESET# is grounded.

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State

PWRBTN#

PWR_OK

V5_StdBy

PS_ON#

VCC

high

low

high

low

high

S5 -> S0

PWRBTN Event

low -> high

high -> low

0V -> VCC

high

low

VCC State

PWRBTN#

PWR_OK

V5_StdBy

VCC12V

high

N/A

4.75V – 20V

S3 -> S0

high

open / high

N/A

4.75V – 20V

high

N/A

N\A

4.75V – 20V

S5 -> S0

PWRBTN Event

open / high

N\A

4.75V – 20V

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5.11 Power Supply

The COMe-cTH6 COM has a wide range of power inputs, from 4.75V to 20V DC. The supply voltage is applied through the VCC_12V pins on the COM Express connector. In ATX mode the 5V standby voltage range is from 4.75V to 5.25V. RTC power is provided on the VCC RTC pins. VCC_12V may or may not collapse in suspend states S3, S4, S5

5.11.1 ATX Mode / Single Supply Mode

ATX Mode

When an ATX power supply is connected, PWR_OK is set to low-level and VCC is off. Pressing the power button enables the ATX PSU to turn on VCC and set PWR_OK to high-level. The ATX PSU is controlled by the PS_ON# signal, which is generated by SUS_S3#.

Table 9: Power Supply States in ATX Mode

Single Supply Mode:

Main power (4.75V – 20V) is provided on the COM Express VCC_12V pins. Standby power, if needed, is also provided on the VCC_12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the Carrier. RTC power is provided on the VCC_RTC pins.

To power on the module from the S5 state, press the power button.

Table 10: Power Supply States in Single Supply Mode

NOTES: 1) Columns marked “N/A” are not applicable for the specified power mode.

2) All ground pins have to be tied to the ground plane of the carrier board.

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5.12 Miscellaneous Circuits

5.12.1 Speaker

The implementation of this subsystem complies with the COM Express® Specification. For additional implementation information, refer to the PICMG COM Express® Design Guide.

5.12.2 Battery

The implementation of this subsystem complies with the COM Express® specification. For additional implementation information, refer to the

The COM Express® Rev 2.0 specification requires the carrier board and the module to have two current-limiting devices (resistor and diode) between the battery and the consuming component.

5.12.3 I

C Bus

The I2C bus implementation supports on- and off-module use. The I2C controller is implemented within the CPLD. The I2C implementation is an I2C master with 7- bit I2C addressing, capable of 100 KHz or 400 KHz operation.

COM Express Rev 2 specifies I2C on the standby rail now, so in the S5 state a carrier board I2C master can query the module. The COMe cTH6 I2C bus is multi-master capable.

For additional information, refer to the notes, which are available on the Kontron website at http://emdcustomersection.kontron.com/.

See Chapter 9, “BIOS Operation” for supported I2C features.

5.12.4 SMBus

System Management Bus (SMBus) signals are connected to the SMBus controller, which is located on the AMD Fusion Controller Hub. The SMBus is a 2-wire, bi-directional bus (clock and serial data) used for system management tasks such as reading parameters from a memory card or reading temperatures and voltages of system components.

The implementation complies with the COM Express® specification. For additional implementation information, refer to the

PICMG COM Express® Design Guide

on the PICMG website

on the PICMG website.

on the PICMG website and I2C application

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Bit of GPIO Port0

Function

COM Express Pin

GPI0

A54

GPI1

A63

GPI2

A67 3 GPI3

A85

GPO0

A93

GPO1

B54

GPO2

B57

GPO3

B63

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6 Special Features

6.1 Watchdog Timer (WDT)

The watchdog timer is managed via the CPLD component, the Altera EPM1270 CPLD. The implementation complies with the COM Express® specification. Timer modes 1, 2, and 3 are supported. For additional implementation information, refer to the

PICMG COM Express® Module Base Specification.

6.2 General Purpose Input and Output (GPIO)

The COMe-cTH6 COM provides four interrupt-capable general purpose inputs and four general purpose outputs that can be accessed through the COM Express connector as defined in the pin-out lists, in Section 4.1. The GPIO controller is in the CPLD and the interface can be enabled in the BIOS setup.

Table 11: COM Express GPIO Pin-Outs

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6.3 ACPI Suspend Modes and Resume Events

The COMe-cTH6 COM supports the following suspend modes:

» S0 (Normal on) » S3 (Suspend to RAM) » S4 (Suspend to HDD/SSD) » S5 /WOL(soft-off, WOL enabled) » S5 (soft-off, WOL disabled) » S5 ECO deep soft-off

NOTES: 1) The S5 ECO state is an ultra-low power state in which the typical power consumption is 50mW @ 20V,

2) Wake from S5 Eco is only activated by pressing the power button.

20mW @ 12V, 5mW @ 5V.

3) All AMD “C” states for power saving are supported in this design.

6.3.1 Events that Resume the System from S3/S4

» USB keyboard (1) » USB mouse (1) » Power button » WakeOnLan (2)

6.3.2 Events that Resume the System from S5

» Power button » WakeOnLan

6.3.3 Events that Resume the System from S5 Eco

» Power button

NOTES: 1) The OS must support wake-up via USB devices and the baseboard must power the USB port with

StandBy-Voltage

2) WakeOnLan must be enabled in the driver options.

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7 Design Considerations

7.1 Thermal Management

An optional heat spreader plate assembly is available from Kontron for the COMe-cTH6 module. The heat spreader plate that fits on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to be used with a heat sink or other cooling device.

External cooling must be provided to maintain the heat spreader plate at proper operating temperatures. Under worst-case conditions, the cooling mechanism must maintain an ambient air and heat spreader plate temperature of 60 C or less.

The aluminum slugs and thermal pads on the underside of the heat spreader assembly implement thermal interfaces between the heat spreader plate and the major heat-generating components on the COMe-cTH6 module. About 80 percent of the power dissipated within the module is conducted to the heat spreader plate and can be removed by the cooling solution.

Kontron also has defined a passive heat sink that can be used in place of the heat spreader plate to provide additional cooling. You can use many thermal-management solutions with the heat spreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Drawings for both the heat spreader plate and the passive heat sink are available on request. Also, see the management.

NOTE: The COMe-cTH6 module comes with mounting holes for securing the heat spreader or the heat sink to the

module.

PICMG COM Express® Design Guide

on the PICMG website for further information about thermal

7.2 Heat Spreader Dimensions

Documentation for the COMe-cTH6 COM heat spreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

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Description

CPU_FAN_TACH

FAN_12V_VCC

FAN_GND

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7.3 Onboard Fan Connector

This section describes how to connect an optional fan for active cooling to a header located directly on the COMecTH6 COM.

The onboard fan connector (J1) is on the left top side of the PCB. The bubble in the above fixture shows the pin enumeration as viewed from the PCB edge.

Figure 6: Fan Connector (J1) Location and Pin Numbering

Connector J1 specifications and Kontron part numbers for the components are:

» Part number: (Molex) 53261-0371

Table 5: Fan Connector (J1) Pinout

» Mates with: (Molex) 51021-0300 » Crimp terminals: (Molex) 50079-80000 (26-28 AWG)

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7.3.1 Fan Connector Electrical Characteristics

The fan connector supply pin is supported by a buck switching regulator that is set to limit the fan supply voltage at

approximately 12V. The maximum duty cycle of the regulator is 90%, so the maximum output of the regulator will be

approximately 90% of the supply voltage input to the regulator.

CAUTION: Be aware of the wide range of input voltages and acceptable fan voltages and ensure that the fan you

select supports the applied voltage.

The maximum current supported on that output is 125mA @ 60°C ambient because it is current limited by a

resettable fuse.

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Upper Memory

Used for

Available

Comment

A0000h – BFFFFh

VGA Memory

C0000h – CFFFFh

VGA BIOS

Used by onboard VGA ROM

D0000h – DFFFFh

Yes

Free for shadow RAM in standard configurations.

E0000h – FFFFFh

System BIOS

Fixed

I/O Address

Used for

Available

Comment

0000 - 001F

System Resources

Fixed

0020 - 003F

Interrupt Controller 1

Fixed

002E - 002F

Winbond driver

Fixed if W83627HG is in system

0040 - 005F

Timer, Counter

Fixed

004E - 004F

TPM

Fixed if TPM is in system

0060 - 006F

Keyboard Controller

Fixed

0070 - 007F

RTC and CMOS Registers

Fixed

0080

BIOS Postcode

Fixed

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8 System Resources

8.1 Interrupt Request (IRQ) Lines

Tables showing IRQ number assignments will be supplied in a future version of this manual.

8.2 Memory Area

The first 640 KBytes of DRAM are used as main memory. With DOS, you can address 1 MByte of memory directly. The memory area above 1 MByte (high memory, extended memory) is accessed under DOS with special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system. See the operating system documentation or special textbooks for information about HIMEM.SYS and EMM386.EXE

Other operating systems (Linux or Windows versions) allow you to address the full memory area directly.

8.3 I/O Address Map

The I/O-port addresses of the COMe-cTH6 COM are functionally identical to those of a standard PC/AT system. All addresses not mentioned in the table below should be available. For compatibility reasons, we recommend that you do not use I/O addresses below 0100h for additional hardware, even if they are available.

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I/O Address

Used for

Available

Comment

0081 - 008F

DMA Page Register

Fixed

00A0 - 00BF

Interrupt Controller 2

Fixed

00C0 - 00DF

DMA Controller 2

Fixed

00E0 - 00EF

System Control

Fixed

00F0 - 00FF

Math Coprocessor

Fixed

0170 – 0177 0376

Fixed Disk

Available if IDE port 1 is disabled

01F0 - 01F7 03F6

Fixed Disk

Available if IDE port 1 is disabled

0290-0295

SIO HWM

Fixed if NCT5577D SIO is in system

03B0 - 03DF

VGA

Fixed

0400 - 043F

SMBus

Fixed

0480 - 04BF

GPIO

Fixed

04D0 - 04D1

PIC Extension

Fixed

0900 - 091F

Power Management

Fixed

09C0 - 09FF

GPE

Fixed

0A05 – 0A06

Hardware Monitor

Fixed if HWM is in system

0A80 – 0A81

CPLD

in Future versions

C000 - CFFF

PCIe-to-PCI Bridge