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>> Table of Contents <<
1 User Information ............................................................................ 1
1.1 About This Document ............................................................................................................... 1
1.2 Copyright Notice ..................................................................................................................... 1
1.3 Trademarks ............................................................................................................................ 1
1.4 Standards ............................................................................................................................. 1
1.5 Warranty ............................................................................................................................... 2
1.6 Technical Support ................................................................................................................... 2
2 Introduction .................................................................................. 3
2.1 The COMe-cTH6 Module ............................................................................................................ 3
2.2 Naming Clarifications ............................................................................................................... 3
2.3 Understanding the COM Functionality .......................................................................................... 4
2.4 COM Express® Documentation ................................................................................................... 5
2.5 COM Express® Module Benefits .................................................................................................. 5
3 Specifications ................................................................................ 6
3.1 Functional Specification ........................................................................................................... 6
3.1.4 Processor: AMD R-Series Fusion Accelerated Processing Unit (APU) ................................................... 6
3.1.5 Chipset: AMD Fusion Controller Hub (FCH) ................................................................................... 6
3.1.6 Onboard Devices: ................................................................................................................... 7
3.1.7 Additional Interfaces: ............................................................................................................. 7
3.2 Functional Block Diagram ......................................................................................................... 8
3.3 Mechanical Specifications ......................................................................................................... 9
3.3.1 Module Dimensions ................................................................................................................ 9
3.3.2 Height on Top ....................................................................................................................... 9
3.3.3 Height on Bottom .................................................................................................................. 9
3.4 Electrical Specifications ......................................................................................................... 10
3.5 ATX Power ........................................................................................................................... 10
3.5.1 Single Power Supply ............................................................................................................. 10
3.5.2 Supply Current (Windows) ..................................................................................................... 10
3.6 Environmental Specifications .................................................................................................. 11
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3.6.1 Temperature ....................................................................................................................... 11
3.6.2 Operating: (with Kontron heat spreader plate assembly): ............................................................. 11
3.6.3 Operating: ......................................................................................................................... 11
3.6.4 Humidity ........................................................................................................................... 11
3.7 MTBF .................................................................................................................................. 11
4 COMe-cTH6 Connectors ................................................................... 12
4.1 Pin-Outs ............................................................................................................................. 13
4.1.1 Connectors X1A and X1B: COM Express® Interface (Type 6) ........................................................... 13
4.1.2 Connector J1 – Fan .............................................................................................................. 23
4.1.3 Connectors J2 and J3 – SO-DIMM DDR3 Memory Sockets ............................................................... 23
4.1.4 Connector J4 – JTAG (AMD Embedded Probe) ............................................................................. 24
5 COMe-cTH6 Interfaces .................................................................... 25
5.1 PCI Express Interface ............................................................................................................. 25
5.2 USB Interface ....................................................................................................................... 25
5.2.1 USB 2.0 Interface ................................................................................................................ 25
5.2.2 USB 3.0 Interface ................................................................................................................ 25
5.2.3 Configuration ..................................................................................................................... 26
5.3 SATA Interface ..................................................................................................................... 27
5.3.1 Configuration ..................................................................................................................... 27
5.4 Audio Interface .................................................................................................................... 27
5.4.1 Configuration ..................................................................................................................... 27
5.5 LPC Serial IRQ ...................................................................................................................... 27
5.5.1 Configuration ..................................................................................................................... 27
5.6 Graphics Interface ................................................................................................................. 28
5.6.1 Analog VGA ........................................................................................................................ 28
5.6.2 LVDS Flat Panel Interface ....................................................................................................... 28
5.7 Ethernet Interface ................................................................................................................. 28
5.7.1 Configuration ..................................................................................................................... 28
5.8 SPI Bus Interface .................................................................................................................. 29
5.9 LPC Bus Interface .................................................................................................................. 29
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5.10 Power Control Interface .......................................................................................................... 30
5.10.1 Power Good (PWR_OK) .......................................................................................................... 30
5.10.2 Power Button (PWRBTN#) ...................................................................................................... 30
5.10.3 5.10.3 Reset Button (SYS_RESET#) .......................................................................................... 30
5.11 Power Supply ....................................................................................................................... 31
5.11.1 ATX Mode / Single Supply Mode .............................................................................................. 31
5.12 Miscellaneous Circuits ............................................................................................................ 32
5.12.1 Speaker ............................................................................................................................. 32
5.12.2 Battery .............................................................................................................................. 32
5.12.3 I2C Bus .............................................................................................................................. 32
5.12.4 SMBus ............................................................................................................................... 32
6 Special Features ............................................................................ 33
6.1 Watchdog Timer (WDT) ........................................................................................................... 33
6.2 General Purpose Input and Output (GPIO) .................................................................................. 33
6.3 ACPI Suspend Modes and Resume Events .................................................................................... 34
6.3.1 Events that Resume the System from S3/S4 ............................................................................... 34
6.3.2 Events that Resume the System from S5 .................................................................................... 34
6.3.3 Events that Resume the System from S5 Eco ............................................................................... 34
7 Design Considerations .................................................................... 35
7.1 Thermal Management ............................................................................................................ 35
7.2 Heat Spreader Dimensions ...................................................................................................... 35
7.3 Onboard Fan Connector .......................................................................................................... 36
7.3.1 Fan Connector Electrical Characteristics .................................................................................... 37
8 System Resources .......................................................................... 38
8.1 Interrupt Request (IRQ) Lines .................................................................................................. 38
8.2 Memory Area ........................................................................................................................ 38
8.3 I/O Address Map ................................................................................................................... 38
8.4 Peripheral Component Interconnect (PCI) Devices ........................................................................ 39
8.5 System Management Bus (SMBus) ............................................................................................ 40
9 BIOS Operation ............................................................................. 41
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9.1 Determining the BIOS Version .................................................................................................. 41
9.2 BIOS Setup Guide .................................................................................................................. 41
9.3 BIOS Setup Options ............................................................................................................... 43
9.3.1 Main Menu ......................................................................................................................... 43
9.3.2 Advanced Menu ................................................................................................................... 45
9.3.3 Chipset .............................................................................................................................. 62
9.3.4 Boot Configuration .............................................................................................................. 70
9.3.5 Security ............................................................................................................................. 72
9.3.6 Save and Exit ...................................................................................................................... 73
Appendix A: Architecture Information ...................................................... 74
Document Revision History .................................................................... 76
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1 User Information
1.1 About This Document
This document provides information about products from Kontron and/or its subsidiaries. No warranty of suitability,
purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is
accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.
1.2 Copyright Notice
Copyright © 2013 Kontron America Inc.
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron.
ETX®, ETXexpress® and microETXexpress® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron
is a trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following components used on this board are trademarked as follows:
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corporation.
» Microsoft is a registered trademark of Microsoft Corporation.
» Intel is a registered trademark of Intel Corporation.
» COM Express is a trademark of PICMG.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners and
indicated with an “*”.
1.4 Standards
Kontron America Inc. is certified to ISO 9001-2008 and ISO 13485-2003 standards.
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1.5 Warranty
This Kontron product is warranted against defects in material and workmanship for the warranty period from the date
of shipment. During the warranty period, Kontron will, at its discretion, decide to repair or replace defective
products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron is not responsible for any defects or damages to other products not supplied by Kontron that are caused by a
faulty Kontron product.
1.6 Technical Support
Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed
to making our product easy to use and will help you use our products in your systems.
Please consult our website at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section for the latest BIOS downloads, Product Change
Notifications and additional tools and software. You can also always contact your board supplier for technical
support.
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2 Introduction
2.1 The COMe-cTH6 Module
The Kontron COMe-cTH6 COM module complies with the Rev. 2.0 COM Express® specification that provides for a
compact form factor (95 x 95 mm) and new COM Express® Type 6 connector definitions. The COMe-cTH6 module
design enables the development of graphics-intensive applications based on the Advanced Micro Devices (AMD) RSeries Advanced Processing Unit (APU) and the AMD M3 Fusion Controller Hub (FCH) using the secure development
path of an established, future-proof industry standard, the COM Express® compact form factor and pin-out Type 6.
The AMD processor on the Kontron COMe-cTH6 module has two integrated memory controllers for up to 8 GBytes
(2x4GB) per channel of DDR3 memory. Support for the latest 3D graphics is provided by the integrated Radeon
graphics controller which also provides four independent display interfaces supported with daisy chaining and a
maximum resolution of 2560 x 1600 x 60 Hz (Display Port) or 1920 x 1200 x 60 Hz (HDMI/DVI). With seven PCI
Express x1 lanes and 8 PEG lanes for flexible configurations, the COMe-cTH6 module is ideal for multi-interface
designs and brings the added benefit of low power consumption. These special features make this 95 x 95 mm
compact Computer-on-Module a key solution for applications such as multimedia content delivery, outdoor digital
signage, infotainment kiosks, POS/POI devices, panel PCs, and professional gaming systems that require high-level
graphics performance and support for the latest APIs like DirectX 11, and where low thermal power design is also an
advantage.
All modules in the Kontron COM Express® family are compliant with the COM Express® standard. These modules also
take advantage of the Kontron Embedded Application Programming Interface (Kontron EAPI), which is cross-platform
middleware that is both form factor and operating system independent. This ensures easy interchangeability as well
as design scalability and future migration paths.
The COMe-cTH6 module is a complete PC with standard interfaces such as USB 2.0 and USB 3.0, Gigabit Ethernet,
SATA 3.0, as well as additional features like high-definition audio (HDA) and ACPI 3.0, Fast I2C, SPI, LPC, RTC, 2x
serial ports (RX, TX) and S5 Eco.
2.2 Naming Clarifications
The COM Express® standard defines a Computer-On-Module, or COM, with all the components necessary for a bootable
host computer, packaged as a super-component. The interfaces provide a smooth transition path from legacy parallel
interfaces such as IDE or parallel ATA (PATA) to Low Voltage Differential Signaling (LVDS) interfaces including PCI
Express* and Serial ATA (SATA).
» Basic COM Express® modules have a 125mm x 95mm form factor and follow pin-out types 2 or 6.
» Compact COM Express® modules have a 95mm x 95mm form factor and follow pin-out types 2 or 6.
» Mini COM Express® modules have a 55mm x 84mm form factor and follow pin-out types 1 or 10.
NOTE: The Kontron COMe-cTH6 compact module takes advantage of new features introduced in the PICMG R2.0 COM
Express® Specification.
TM
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2.3 Understanding the COM Functionality
All Kontron COM Express® modules contain two COM Express connectors (X1A and X1B), each with two rows. The
primary connector rows are Row A and Row B (connector X1A). The secondary connector rows are Row C and Row D
(connector X1B). The COMe-cTH6 module uses the PICMG COM Express® pin-out Type 6 definition, which is a recent
addition to the PICMG COM Express standard and documented in Revision 2.0 of the PICMG specification. The Type 6
pin-out is based on Type 2 and also supports new features on the secondary connector. The key changes are:
» The PCI interface is no longer supported and the pins are used instead for digital display interfaces (DDI) and two
additional PCI Express lanes
» The IDE (PATA) parallel interface is no longer supported and the pins are used instead for additional transmit and
receive pairs for four USB 3.0 ports.
» Three dedicated DDI ports have been added. Ports 1, 2, and 3 can be configured individually for Display Port (DP),
HDMI, or DVI and port 1 can also be used for SDV0.
» Two optional two-wire RS232 serial ports have been added using pins formerly assigned to 12V signals.
The primary connector (Row A and Row B) on the COMe-cTH6 module features the following functionality:
» Analog VGA graphics
» Gigabit Ethernet LAN
» Serial ATA (SATA)
» PCI Express*
» USB 2.0 and USB 3.0
» Express card
» Wake
» Speaker
» Intel® High Definition Audio (HDA)
» LPC (Low Pin Count) bus
» TTL serial
» Watchdog timer (WDT)
» GPIO
2
» I
C
» Power button
» SPI (Serial Peripheral Interface) Bus
The secondary connector (Row C and Row D) supports the following buses and I/O:
» PEG x16 (the COMe-cTH6 is limited to 8 lanes, either the upper 8 or lower 8)
» PCI Express
» DDI
» DP/DVI/HDMI
» LVDS 18/24-bit single/dual channel
NOTE: For full descriptions of the COM Express Type 6 pin-outs, refer to the PICMG documentation.
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2.4 COM Express® Documentation
This product manual serves as one of three principal references for this COM Express® module design. It documents
the specifications and features of the COMe-cTH6 module. The other two references, which are available from your
Kontron support representative or from PICMG, include:
» The
PICMG COM.0 COM Express® Module Base Specification
form factors, pin-outs, and signals. This document can be obtained by filling out the order form on the PIGMG
website at http://www.picmg.com .
» The
PICMG COM Express® Design Guide
maximum flexibility to accommodate a wide range of COM Express® modules. This guide is on the PICMG website
at http://www.picmg.com.
, which serves as a general guide for baseboard design, with a focus on
2.5 COM Express® Module Benefits
Compact form factor (95 x 95 mm) Computer-on-Module Express (COM Express) modules are very compact, highly
integrated computers that use either the Type 2 or Type 6 COM Express® connector pin-outs. All compact COM Express
modules feature a standardized form factor and a standardized connector layout for a specified set of signals, as
defined in the PICMG COM Express® specification (PICMG COM.0.R2). This standardization lets designers create a
single-system baseboard that can accept present and future COM Express modules.
Kontron COM Express® modules include common personal computer (PC) peripheral functions such as:
» Graphics
» USB ports
» Ethernet
» Audio
» SATA hard disk drive format
Baseboard designers can optimize exactly how each of these functions is implemented physically for the intended
application by placing connectors precisely where they are needed on a baseboard that is designed for an optimal fit
in the system packaging.
A peripheral PCI Express bus can be implemented directly on the application-specific baseboard rather than on
mechanically unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as
one plug-in super-component simplifies packaging, eliminates cabling, and significantly reduces system-level total
cost of ownership.
A single baseboard design can use a range of COM Express modules. This flexibility enables product differentiation at
various price/performance points, and the design of future-proof systems with a built-in upgrade path. The
modularity of a COM Express solution also ensures against obsolescence as computer technology evolves. A properly
designed COM Express baseboard can work with several successive generations of COM Express modules.
A COM Express baseboard design has many of the advantages of a custom, computer-board design, but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
, Revision 2.0, which defines the COM Express® module
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3 Specifications
3.1 Functional Specification
3.1.4 Processor: AMD R-Series Fusion Accelerated Processing Unit (APU)
» CPU: AMD R-460L quad core 2.0 (2.8) GHz (25W)
AMD R-452L quad core 1.6 (2.4) GHz (19W)
AMD R-260H dual core 2.1 (2.6) GHz (17W)
» Cores: Up to four cores
» Processor Speed: Up to 4x 2.8 GHz
» Memory Controller: Up to 16 GBytes (2x8GB) DDR3 (1066/1333 MT/s)
» Graphics Interfaces: Integrated AMD Radeon™ HD 7000 series graphics controller
» Display Support: Four displays with AMD Eyefinity technology (two non-DP plus DP or VGA)
» I/O Interfaces PCI Express 2.0: four PCIe general purpose lanes (Gen 1 and Gen 2) configurable as x1, x2,
» Instruction Set: Kontron Embedded Application Programming Interface (Kontron EAPI)
» Package: 27mm x 31mm
» Thermal Spec: Operation: 0° to +60°C
Enhanced DirectX®11 graphics multimedia support
HD decode for H.264, VC-1, MPEG-2, DivX
HW encode for H.264 at 1080p@60fps
PEG x8, software-configurable as x1, x2, x4, and x8
Dual channel (18/24-bit) LVDS via Analogix ANX3110 DP-to-LVDS translator
3x DDI interfaces(HDMI/DVI/Display Port) including 1x eDP
Additional 3x DP interfaces (multiplexed with PEG)
Display Port resolution up to 2560 x 1600 x 60 Hx
HDMI/DVI resolution up to 1920 x 1200 x 60 Hz
Single analog VGA resolution up to 1960 x 1600 x 60Hz
1x CRT
and x4
Storage: -40° to +85°
3.1.5 Chipset: AMD Fusion Controller Hub (FCH)
» FCH AMD A70M M3 Fusion Controller Hub
» Storage 4x SATA 3.0 with 6 Gbits/sec maximum transfer rate
» PCI Express: three PCIe general purpose x1 Gen 2 lanes () software-configurable as x3, or as 1 x2 and 1
» LPC LPC bus brought to COM Express connector
x1Express Card: Control signals for two Express Cards
Audio: three HDA audio channels mapped to COM Express AC/HDA, Speaker Out
USB 2.0: eight ports mapped to two EHCI controllers (5 to one EHCI and 3 to another)
USB 3.0: four Super Speed ports
» TPM Atmel AT97SC3204 TPM
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» Watchdog Timer WDT via CPLD
» GPIO Four GPIs and four GPOs available on the COM Express connector
» SMBus SMBus brought to the COM Express connector via FCH
2
» I
C I2C master with 7-bit I2C addressing with 100 KHz or 400 KHz operation and controller on
CPLD, for off- and on- module use
» External BIOS ROM Support for carrier board SPI devices (new with COM Express Rev 2)
» Suspend Modes Core Sleep States: S0, S3, S4, S5, S5 Eco
» Wake WAKE0#, WAKE1# support
» TDP: 2.3W
» Package: 24.5mmx24.5mm
3.1.6 Onboard Devices:
» Ethernet: Intel® I210-AT GbE Controller 10/100/1000 Mbit
» LVDS Analogix ANX3110 18/24-bit single/dual channel DP/LVDS Translator
» CPLD Altera EPM1270 CPLD
» Watchdog Timer: BIOS enables and configures watchdog in the CPLD
» Hardware Monitor Nuvoton NCT7904D chip
2
» I
C EEPROM AT24HC04B serial EEPROM for module parameter storage
» TPM Trusted Platform Module uses Atmel AT97SC3204 chip
» Fan Header Molex 53261-0371 3-pin header for consistency with Kontron Universal Cooling Solution
» Power Management: BIOS-enabled ACPI 4.0 power management for supported OSs
3.1.7 Additional Interfaces:
» Passive Cooling: Passive and Critical Trip Point
» ACPI: ACPI 4.0
» Input Voltage: Single supply support with wide range power supply input, 4.75V – 20V
5.0V supply is the optional standby power rail.
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3.2 Functional Block Diagram
Figure 1 is the COMe-cTH6 COM Express™ Type 6 module block diagram.
Figure 1: COMe-cTH6 COM (Type 6) Block Diagram
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3.3 Mechanical Specifications
3.3.1 Module Dimensions
» 95 mm x 95 mm ±0.2 mm (3.47 in. x 3.47 in)
3.3.2 Height on Top
» Approximately 8.0 mm maximum (without the PCB)
» Height varies depending on whether an optional cooling solution (either a passive heat sink or a heat spreader
plate) is installed
3.3.3 Height on Bottom
» Approximately 4.06 mm maximum (without the PCB)
Figure 2: COMe-cTH6 Module Mechanical Drawing
All dimensions are shown in millimeters. The COM Express® specification says that these holes should be ± 0.25mm
[±0.010"], unless otherwise noted. The tolerances for placement of the COM Express connector with respect to the
peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"]. The mounting holes shown in the drawing use
6mm diameter pads and 2.7mm plated holes for use with 2.5mm hardware. The pads are tied to the PCB ground
plane. Black circles represent the mounting holes required by the PICMG COM Express® standard.
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Module Power Consumption by Main
Input Supply Voltage
4.75V
12V
20V
Windows Desktop (idle)
5.0W
5.6W
6.0W
TAT at maximum power configuration
33.8W
34.4W
35.0W
S3 with Wake-on-LAN disabled
0.7W
0.8W
0.9W
S5 with Wake-on-LAN disabled
0.4W
0.5W
0.6W
S5 Eco
~0.005W
0.02W
0.05W
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3.4 Electrical Specifications
3.5 ATX Power
Main power is on the COM Express VCC_12V pins and standby power is on the VCC_5V_SBY pins. RTC power is provided
on the VCC_RTC pins. VCC_12V may or may not collapse in suspend states S3, S4, and S5.
3.5.1 Single Power Supply
4.75V to +20V main power is on the COM Express VCC_12V pins and standby power, if needed, is also provided on the
VCC_12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the carrier board. RTC power is
provided on the VCC_RTC pins.
3.5.2 Supply Current (Windows)
The testing performed to capture the supply current data used tested modules mounted on a Kontron evaluation
board with a mouse and keyboard connected. The power consumption tests were executed in Windows XP (with SP3)
using a tool to stress the CPU at 100 % load. The power measurement values were captured after 15 minutes of full
load or a stable CPU core temperature of 90°C. To ensure a stable die temperature, a corresponding heat sink was
used to hold the temperature under the critical trip point. The modules were tested using the maximum CPU
frequency. For more detailed information, refer to the “Power Consumption” diagrams on the EMD Customer section
of the Kontron website.
NOTE: It is impossible to test for all possible applications on the market. There may be an application that draws
more power from the CPU than the values measured in the table above. Take this into consideration if you are at the
limit of the thermal specification, in which case you should consider improving your thermal solution.
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3.6 Environmental Specifications
3.6.1 Temperature
3.6.2 Operating: (with Kontron heat spreader plate assembly):
» Ambient temperature: 0 to 60°C with an active fan heat sink.
» Non-operating: -30 to +85°C
NOTE: The maximum operating temperature with the heat spreader plate installed is the maximum measurable
temperature on any spot on the heat spreader surface. You must maintain the temperature according to the
specification above.
3.6.3 Operating:
» Maximum operating temperature: 0-60°C
» Non operating: -30°C to +85°C
NOTE: The maximum operating temperature is the maximum measurable temperature on any spot on the module
3.6.4 Humidity
» Operating: 10% to 90%, non-condensing
» Non operating: 5% to 95%, non-condensing
3.7 MTBF
TBD
surface. You must maintain the temperature according to the specification above.
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Type
Description
Type
Description
I/O-3.3
Bi-directional 3.3 V IO-Signal
O-3,3
3.3V Output
I/O-5T
Bi-dir. 3.3V I/O (5V Tolerance)
O-5
5V Output
I/O-5
Bi-directional 5V I/O-Signal
DP-I/O
Differential Pair Input/Output
I-3,3
3.3V Input
DP-I
Differential Pair Input
I/OD
Bi-directional Input/Output Open Drain
DP-O
Differential Pair Output
I-5T
3.3V Input (5V Tolerance)
PU
Pull-Up Resistor
OA
Output Analog
PD
Pull-Down Resistor
OD
Output Open Drain
PWR
Power Connection
O-1,8
1.8V Output
nc
Not connected, Signal not available
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4 COMe-cTH6 Connectors
The pin-outs for COM Express® interface connectors X1A (primary connector, rows A and B) and X1B (secondary
connector, rows C and D) are documented for convenient reference. See the PICMG COM Express® Specification on the
PICMG website and COM Express® Design Guide on the Kontron website for detailed, design-level information.
Figure 3: COM Interface Connector Locations
Table 1: Electrical Signal Abbreviation
NOTE: To protect external power lines of peripheral devices, make sure that the wires have the right diameter to
withstand the maximum available current and the enclosure of the peripheral device fulfills the fire-protection
requirements in IEC/EN60950.
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Pin
Signal
Description
Type
Termination
Comment
A1
GND1
Power Ground
PWR - -
A2
GBE0_MDI3-
Ethernet Receive Data-
DP-I
Intel® I210-AT
-
A3
GBE0_MDI3+
Ethernet Receive Data+
DP-I
Intel® I210-AT
-
A4
GBE0_LINK100
Ethernet Speed LED 100Mbps
OD -
A5
GBE0_LINK1000
Ethernet Speed LED 1000Mbps
OD -
A6
GBE0_MDI2-
Ethernet Receive Data-
DP-I
Intel® I210-AT
-
A7
GBE0_MDI2+
Ethernet Receive Data+
DP-I
Intel® I210-AT
-
A8
GBE0_LINK
LAN Link LED
OD -
A9
GBE0_MDI1-
Ethernet Receive Data-
DP-I
Intel® I210-AT
-
A10
GBE0_MDI1+
Ethernet Receive Data+
DP-I
Intel® I210-AT
-
A11
GND2 (Fixed)
Power Ground
PWR - -
A12
GBE0_MDI0-
Ethernet Transmit Data-
DP-O
Intel® I210-AT
-
A13
GBE0_MDI0+
Ethernet Transmit Data+
DP-O
Intel® I210-AT
-
A14
GBE0_CTREF
LAN Reference Voltage
O-3.3
-
A15
SUS_S3
Indicates Suspend to RAM state
O-3.3
A16
SATA0_TX+
SATA 0 Transmit Data+
DP-O -
A17
SATA0_TX-
SATA 0 Transmit Data-
DP-O -
A18
SUS_S4
Indicates Suspend to Disk state
O-3.3
A19
SATA0_RX+
SATA 0 Receive Data+
DP-I
A20
SATA0_RX-
SATA 0 Receive Data-
DP-I -
A21
GND3
Power Ground
PWR -
A22
SATA2_TX+
SATA 2 Transmit Data-
DP-O
A23
SATA2_TX-
SATA 2 Transmit Data+
DP-O
A24
SUS_S5
Indicates Soft Off state
O-3.3
A25
SATA2_RX+
SATA 2 Receive Data+
Not connected
nc
nc
A26
SATA2_RX-
SATA 2 Receive Data-
Not connected
nc
nc
A27
BATLOW
Indicates low external battery
I-3.3
A28
(S)ATA_ACT
SATA, IDE, SD Activity Indicator
OD-3.3
A29
AC/HDA_SYNC
HD Audio Sync
O-3.3
A30
AC/HDA_RST
HD Audio Reset
O-3.3
A31
GND4
Power Ground
PWR - -
A32
AC/HDA_BITCLK
HD Audio Clock
O-3.3
A33
AC/HDA_SDOUT
HD Audio Data
O-3.3
A34
BIOS_DIS0
Disable Module BIOS Enables boot from a BIOS on
Baseboard
I-3.3
A35
THRMTRIP#
CPU thermal shutdown indicator
O-3.3
DRAFT COPY FOR REVIEW ONLY
4.1 Pin-Outs
4.1.1 Connectors X1A and X1B: COM Express® Interface (Type 6)
NOTE: The termination resistors in these tables are already mounted on the COMe-cTH6 module. Refer to the PICMG
COM Express® Design Guide for information about additional termination resistors
13
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
A36
USB6-
USB Data- Port #6
DP-I/O
-
A37
USB6+
USB Data+ Port #6
DP-I/O
-
A38
USB_6_7_OC
USB Overcurrent Pair 6/7
I-3.3
A39
USB4-
USB Data- Port #4
DP-I/O
A40
USB4+
USB Data+ Port #4
DP-I/O
- A41
GND5
Power Ground
PWR - -
A42
USB2-
USB Data- Port #2
A43
USB2+
USB Data+ Port #2
DP-I/O
A44
USB_2_3_OC
USB Overcurrent Pair 2/3
I-3.3
A45
USB0-
USB Data- Port #0
DP-I/O
A46
USB0+
USB Data+ Port #0
DP-I/O
A47
VCC_RTC
RTC Power Supply +3V
PWR - -
A48
EXCD0_PERST
PCIe Express Card 0 Reset
O-3.3
A49
EXCD0_CPPE#
PCIe Express Card 0 Request
I-3.3
A50
LPC_SERIRQ
LPC Serial Interrupt Request
IO-3.3
A51
GND6
Power Ground
PWR - -
A52
PCIE_TX5+
PCIe 5 Transmit Data+
DP-O
A53
PCIE_TX5-
PCIe 5 Transmit Data-
DP-O
A54
GPI0
General Purpose Input 0
I-3.3
A55
PCIE_TX4+
PCIe 4 Transmit Data+
DP-O
A56
PCIE_TX4-
PCIe 4 Transmit Data-
DP-O
A57
GND7
Power Ground
PWR - -
A58
PCIE_TX3+
PCIe 3 Transmit Data+
DP-O
A59
PCIE_TX3-
PCIe 3 Transmit Data-
DP-O
A60
GND8
Power Ground
PWR - -
A61
PCIE_TX2+
PCIe 2 Transmit Data+
DP-O
A62
PCIE_TX2-
PCIe 2 Transmit Data-
DP-O
A63
GPI1
General Purpose Input 1
I-3.3
A64
PCIE_TX1+
PCIe 1 Transmit Data+
DP-O
A65
PCIE_TX1-
PCIe 1 Transmit Data-
DP-O
A66
GND9
Power Ground
PWR - -
A67
GPI2
General Purpose Input 2
I-3.3
A68
PCIE_TX0+
PCIe lane #0 Transmit+
DP-O
A69
PCIE_TX0-
PCIe lane #0 Transmit-
DP-O
A70
GND10
Power Ground
PWR - -
A71
LVDS_A0+
LVDS Channel A (positive)
DP-O
A72
LVDS_A0-
LVDS Channel A (negative)
DP-O -
A73
LVDS_A1+
LVDS Channel A (positive)
DP-O -
A74
LVDS_A1-
LVDS Channel A (negative)
DP-O
A75
LVDS_A2+
LVDS Channel A (positive)
DP-O
A76
LVDS_A2-
LVDS Channel A (negative)
DP-O
A77
LVDS_VDD_EN
LVDS Panel Power Controller
O-3.3
A78
LVDS_A3+
LVDS Channel A (positive)
DP-O
A79
LVDS_A3-
LVDS Channel A (negative)
DP-O
A80
GND11
Power Ground
PWR - -
A81
LVDS_A_CLK+
LVDS Channel A Clock+
DP-O
A82
LVDS_A_CLK-
LVDS Channel A Clock-
DP-O
DRAFT COPY FOR REVIEW ONLY
14
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
A83
LVDS_I2C_CLK
LVDS I2C Clock
IO-3.3
A84
LVDS_I2C_DAT
LVDS I2C Data
IO-3.3
A85
GPI3
General Purpose Input 3
I-3.3
A86
RSVD1
Reserved
Not connected
nc
nc
A87
RSVD2
Reserved
Not connected
nc
nc
A88
PCIE0_CK_REF+
PCIe Clock (positive)
DP-O
A89
PCIE0_CK_REF-
PCIe Clock (negative)
DP-O
A90
GND12
Power Ground
PWR - -
A91
SPI_Power
Power for off-board SPI flash
O-3.3
A92
SPI_MISO
SPI Master In Slave Out data line
I-3.3
A93
GPO0
General Purpose Output 0
O-3.3
A94
SPI_CLK
SPI clock line for off-board SPI
O-3.3
A95
SPI_MOSI
SPI Master Out Slave In data line
O-3.3
- A96
TPM_PP
Trusted Platform Module Physical Presence pin
I-3.3
A97
TYPE10
Not connected for Type 6 module
Not connected
nc
nc
A98
SER0_TX
Gen. Purpose Serial Port 0 Transmit
Not connected
nc
nc
A99
SER0_RX
Gen. Purpose Serial Port 0 Receive
Not connected
nc
nc
A100
GND13
Power Ground
PWR - -
A101
SER1_TX
General Purpose Serial Port 1 Transmit
Not connected
nc
nc
A102
SER1_RX
General Purpose Serial Port 1 Receive
Not connected
nc
nc
A103
LID
LID Button
I/OP-3.3
A104
VCC_12V1
12V VCC
PWR - -
A105
VCC_12V2
12V VCC
PWR - -
A106
VCC_12V3
12V VCC
PWR - -
A107
VCC_12V4
12V VCC
PWR - -
A108
VCC_12V5
12V VCC
PWR - -
A109
VCC_12V6
12V VCC
PWR - -
A110
GND14
Power Ground
PWR - -
Pin
Signal
Description
Type
Termination
Comment
B1
GND15
Power Ground
PWR - -
B2
GBE0_ACT
Ethernet Activity LED
OD
FET PD
nc
B3
LPC_FRAME
LPC Frame Indicator
O-3.3
B4
LPC_AD0
LPC Address/Data Bus
IO-3.3
B5
LPC_AD1
LPC Address/Data Bus
IO-3.3
B6
LPC_AD2
LPC Address/Data Bus
IO-3.3
B7
LPC_AD3
LPC Address/Data Bus
IO-3.3
B8
LPC_DRQ0
LPC Serial DMA Request
I-3.3
B9
LPC_DRQ1
LPC Serial DMA Request
I-3.3
B10
LPC_CLK
LPC Clock
O-3.3
B11
GND16
Power Ground
PWR - -
B12
PWRBTN#
Power Button Input
I-3.3
B13
SMB_CLK
SMBus Clock
O-3.3
B14
SMB_DAT
SMBus Data
IO-3.3
B15
SMB_ALERT
SMBus Interrupt
IO-3.3
DRAFT COPY FOR REVIEW ONLY
Table 2: Connector X1A - Row A
15
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
B16
SATA1_TX+
SATA 1 Transmit Data+
DP-O
B17
SATA1_TX-
SATA 1 Transmit Data-
DP-O
B18
SUS_STAT
Imminent suspend operation; used to notify LPC
devices.
O-3.3
B19
SATA1_RX+
SATA 1 Receive Data+
DP-I
B20
SATA1_RX-
SATA 1 Receive Data-
DP-I
B21
GND17
Power Ground
PWR - -
B22
SATA3_TX+
SATA 3 Transmit Data+
DP-O
B23
SATA3_TX-
SATA 3 Transmit Data-
DP-O
B24
PWR_OK
Power OK from power supply
I-3.3
B25
SATA3_RX+
SATA 3 Receive Data+
DP-I
B26
SATA3_RX-
SATA 3 Receive Data-
DP-I
B27
WDT
Watchdog Timeout
O-3.3
B28
AC/HDA_SDIN2
Audio CODEC Serial Data In 2
I-3.3
B29
AC/HDA_SDIN1
Audio CODEC Serial Data In 1
I-3.3
B30
AC/HDA_SDIN0
Audio CODEC Serial Data In 0
I-3.3
B31
GND18
Power Ground
PWR - -
B32
SPKR
Speaker Interface
O-3.3
B33
I2C_CLK
I2C Clock
IO-3.3
B34
I2C_DAT
I2C Data
IO-3.3
B35
THRM
Over Temperature Indicator
I-3.3
B36
USB7-
USB Data- Port #7
DP-I/O
B37
USB7+
USB Data+ Port #7
DP-I/O
B38
USB_4_5_OC
USB Overcurrent Pair 4/5
I-3.3
B39
USB5-
USB Data- Port #5
DP-I/O
B40
USB5+
USB Data+ Port #5
DP-I/O
B41
GND19
Power Ground
PWR - -
B42
USB3-
USB Data- Port #3
DP-I/O
B43
USB3+
USB Data+ Port #3
DP-I/O
B44
USB_0_1_OC
USB Overcurrent Pair 0/1
I-3.3
B45
USB1-
USB Data- Port #1
DP-I/O
B46
USB1+
USB Data+ Port #1
DP-I/O
B47
EXCD1_PERST
PCIe Express Card 1 Reset
O-3.3
B48
EXCD1_CPPE
PCIe Express Card 1 Request
I-3.3
B49
SYS_RESET
Reset button input
I-3.3
B50
CB_RESET
Carrier Board Reset
O-3.3
B51
GND20
Power Ground
PWR - -
B52
PCIE_RX5+
PCIe 5 Receive Data+
DP-I
B53
PCIE_RX5-
PCIe 5 Receive Data-
DP-I
B54
GPO1
General Purpose Output 1
O-3.3
B55
PCIE_RX4+
PCIe 4 Receive Data+
DP-I
B56
PCIE_RX4-
PCIe 4 Receive Data-
DP-I
B57
GPO2
General Purpose Output 2
O-3.3
B58
PCIE_RX3+
PCIe 3 Receive Data+
DP-I
B59
PCIE_RX3-
PCIe 5 Receive Data-
DP-I
B60
GND21
Power Ground
PWR - -
B61
PCIE_RX2+
PCIe 2 Receive Data+
DP-I
DRAFT COPY FOR REVIEW ONLY
16
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
B62
PCIE_RX2-
PCIe 2 Receive Data-
DP-I
B63
GPO3
General Purpose Output 3
O-3.3
B64
PCIE_RX1+
PCIe 1 Receive Data+
DP-I
B65
PCIE_RX1-
PCIe 1 Receive Data-
DP-I
B66
WAKE0
PCI Express Wake Event
I-3.3
B67
WAKE1
General Purpose Wake Event
I-3.3
B68
PCIE_RX0+
PCIe lane #0 Receive+
DP-I
B69
PCIE_RX0-
PCIe lane #0 Receive-
DP-I
B70
GND22
Power Ground
PWR - -
B71
LVDS_B0+
LVDS Channel B0 (Positive)
DP-O
B72
LVDS_B0-
LVDS Channel B0 (Negative)
DP-O
B73
LVDS_B1+
LVDS Channel B1 (Positive)
DP-O
B74
LVDS_B1-
LVDS Channel B1 (Negative)
DP-O
B75
LVDS_B2+
LVDS Channel B2 (Positive)
DP-O
B76
LVDS_B2-
LVDS Channel B2 (Negative)
DP-O
B77
LVDS_B3+
LVDS Channel B3 (Positive)
DP-O
B78
LVDS_B3-
LVDS Channel B3 (Negative)
DP-O
B79
LVDS_BKLT_EN
Backlight Enable
O-3.3
B80
GND23
Power Ground
PWR - -
B81
LVDS_B_CK+
LVDS Channel B Clock+
DP-O
B82
LVDS_B_CK-
LVDS Channel B Clock-
DP-O
B83
LVDS_BKLT_CTRL
Backlight Brightness Control
O-3.3
B84
VCC_5V_SBY1
+5V Standby
PWR - -
B85
VCC_5V_SBY2
+5V Standby
PWR - -
B86
VCC_5V_SBY3
+5V Standby
PWR - -
B87
VCC_5V_SBY4
+5V Standby
PWR - -
B88
BIOS_DIS1
BIOS Disable 1 (off-board SPI select)
I-3.3
B89
VGA_RED
Analog Video Red
O
B90
GND24
Power Ground
PWR - -
B91
VGA_GRN
Analog Video Green
O
B92
VGA_BLU
Analog Video Blue
O
B93
VGA_HSYNC
Analog Video Horizontal Sync
O-3.3
B94
VGA_VSYNC
Analog Video Vertical Sync
O-3.3
B95
VGA_I2C_CK
Analog Video I2C Clock
IO/OD-3.3
B96
VGA_I2C_DAT
Analog Video I2C Data
IO/OD-3.3
B97
SPI_CS
SPI Chip Select
O-3.3
B98
RSVD3
Reserved
Not connected
nc
nc
B99
RSVD4
Reserved
Not connected
nc
nc
B100
GND25
Power Ground
PWR - -
B101
FAN_PWMOUT
Fan Speed Control
O/OP-3.3
B102
FAN_TACHIN
Fan Tachometer Input
I/OP-3.3
B103
SLEEP
Sleep Button
I/OP-3.3
B104
VCC_12V7
12V VCC
PWR - -
B105
VCC_12V8
12V VCC
PWR - -
B106
VCC_12V9
12V VCC
PWR - -
B107
VCC_12V10
12V VCC
PWR - -
B108
VCC_12V11
12V VCC
PWR - -
DRAFT COPY FOR REVIEW ONLY
17
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
B109
VCC_12V12
12V VCC
PWR - -
B110
GND26
Power Ground
PWR
Pin
Signal
Description
Type
Termination
Comment
C1
GND27
Power Ground
PWR - -
C2
GND28
Power Ground
PWR - -
C3
USB_SSRXO-
SuperSpeed USB Data Receive Path 0-
Not connected
nc
nc
C4
USB_SSRXO+
SuperSpeed USB Data Receive Path 0+
Not connected
nc
nc
C5
GND29
Power Ground
PWR - -
C6
USB_SSRX1-
SuperSpeed USB Data Receive Path 1-
Not connected
nc
nc
C7
USB_SSRX1+
SuperSpeed USB Data Receive Path 1+
Not connected
nc
nc
C8
GND30
Power Ground
PWR - -
C9
USB_SSRX2-
SuperSpeed USB Data Receive Path 2-
Not connected
nc
nc
C10
SUB_SSRX2+
SuperSpeed USB Data Receive Path 2+
Not connected
nc
nc
C11
GND31
Power Ground
PWR
C12
USB_SSRX3-
SuperSpeed USB Data Receive Path 3-
Not connected
nc
nc
C13
USB_SSRX3+
SuperSpeed USB Data Receive Path 3+
Not connected
nc
nc
C14
GND32
Power Ground
PWR - -
C15
DDI1_PAIR6+
Digital Display Interface
Not connected
nc
nc
C16
DDI1_PAIR6-
Digital Display Interface
Not connected
nc
nc
C17
RSVD5
Reserved
Not connected
nc
nc
C18
RSVD6
Reserved
Not connected
nc
nc
C19
PCIE_RX6+
PCI Express Differential Receive Pair 6+
DP-I
C20
PCIE_RX6-
PCI Express Differential Receive Pair 6-
DP-I
C21
GND33
Power Ground
PWR
C22
PCIE_RX7+
PCI Express Differential Receive Pair 7+
Not connected
nc
nc
C23
PCIE_RX7-
PCI Express Differential Receive Pair 7-
Not connected
nc
nc
C24
DDI1_HPD
Digital Display Interface Hot-plug detect
I-3.3
C25
DDI1_PAIR4+
Digital Display Interface
Not connected
nc
nc
C26
DDI1_PAIR4-
Digital Display Interface
Not connected
nc
nc
C27
RSVD7
Reserved
Not connected
nc
nc
C28
RSVD8
Reserved
Not connected
nc
nc
C29
DDI1_PAIR5+
Digital Display Interface
Not connected
nc
nc
C30
DDI1_PAIR5-
Digital Display Interface
Not connected
nc
nc
C31
GND34
Power Ground
PWR - -
C32
DDI2_CRTLCLK_AUX+
HDMI/DVI I2C CRTLCLK
I/O-3.3
C33
DDI2_CRTLDATA_AUX-
HDMI/DVI I2C CRTLDATA
I/O-3.3
C34
DDI2_DDC_AUX_SEL
Selects function of DDI CRTL & DATA Aux
I-3.3
C35
RSVD9
Reserved
Not connected
nc
nc
C36
DDI3_CRTLCLK_AUX+
HDMI/DVI I2C CRTLCLK
I/O-3.3
C37
DDI3_CRTLDATA_AUX-
HDMI/DVI I2C CRTLDATA
I/O-3.3
C38
DDI3_DDC_AUX_SEL
Selects function of DDI CRTL & DATA Aux
I-3.3
C39
DDI3_PAIR0+
Digital Display Interface
DP-O
C40
DDI3_PAIR0-
Digital Display Interface
DP-O
C41
GND35
Power Ground
PWR - -
DRAFT COPY FOR REVIEW ONLY
Table 3: Connector X1A - Row B
18
DRAFT COPY FOR REVIEW ONLY
COMe-cTH6 User’s Guide
www.kontron.com
Pin
Signal
Description
Type
Termination
Comment
C42
DDI3_PAIR1+
Digital Display Interface
DP-O
C43
DDI3_PAIR1-
Digital Display Interface
DP-O
C44
DDI3_HPD
Digital Display Interface Hot-plug detect
I-3.3
C45
RSVD10
Reserved
Not connected
nc
nc
C46
DDI3_PAIR2+
Digital Display Interface
DP-O
C47
DDI3_PAIR2-
Digital Display Interface
DP-O
C48
RSVD11
Reserved
Not connected
nc
nc
C49
DDI3_PAIR3+
Digital Display Interface
DP-O
C50
DDI3_PAIR3-
Digital Display Interface
DP-O
C51
GND36
Power Ground
PWR - -
C52
PEG_RX0+
PCI Express Graphics Receive Lane 0 Positive
DP-I
C53
PEG_RX0-
PCI Express Graphics Receive Lane 0 Negative
DP-I
C54
TYPE0
Not connected for Type 6 module
Not connected
nc
nc
C55
PEG_RX1+
PCI Express Graphics Receive Lane 1 Positive
DP-I
C56
PEG_RX1-
PCI Express Graphics Receive Lane 1 Negative
DP-I
C57
TYPE1
Not connected for Type 6 module
Not connected
nc
nc
C58
PEG_RX2+
PCI Express Graphics Receive Lane 2 Positive
DP-I
C59
PEG_RX2-
PCI Express Graphics Receive Lane 2 Negative
DP-I
C60
GND37
Power Ground
PWR - -
C61
PEG_RX3+
PCI Express Graphics Receive Lane 3 Positive
DP-I
C62
PEG_RX3-
PCI Express Graphics Receive Lane 3 Negative
DP-I
C63
RSVD12
Reserved
Not connected
nc
nc
C64
RSVD13
Reserved
Not connected
nc
nc-
C65
PEG_RX4+
PCI Express Graphics Receive Lane 4 Positive
DP-I C66
PEG_RX4-
PCI Express Graphics Receive Lane 4 Negative
DP-I
C67
RSVD14
Reserved
Not connected
nc
nc
C68
PEG_RX5+
PCI Express Graphics Receive Lane 5 Positive
DP-I
C69
PEG_RX5-
PCI Express Graphics Receive Lane 5 Negative
DP-I
C70
GND38
Power Ground
PWR - -
C71
PEG_RX6+
PCI Express Graphics Receive Lane 6 Positive
DP-I
C72
PEG_RX6-
PCI Express Graphics Receive Lane 6 Negative
DP-I
C73
GND39
Power Ground
PWR - -
C74
PEG_RX7+
PCI Express Graphics Receive Lane 7 Positive
DP-I
C75
PEG_RX7-
PCI Express Graphics Receive Lane 7 Negative
DP-I
C76
GND40
Power Ground
PWR - -
C77
RSVD15
Reserved
Not connected
nc
nc
C78
PEG_RX8+
PCI Express Graphics Receive Lane 8 Positive
DP-I
C79
PEG_RX8-
PCI Express Graphics Receive Lane 8 Negative
DP-I
C80
GND41
Power Ground
PWR - -
C81
PEG_RX9+
PCI Express Graphics Receive Lane 9 Positive
DP-I
C82
PEG_RX9-
PCI Express Graphics Receive Lane 9 Negative
DP-I
C83
RSVD16
Reserved
Not connected
nc
nc
C84
GND42
Power Ground
PWR - -
C85
PEG_RX10+
PCI Express Graphics Receive Lane 10 Positive
DP-I
C86
PEG_RX10-
PCI Express Graphics Receive Lane 10 Negative
DP-I
C87
GND43
Power Ground
PWR - -
C88
PEG_RX11+
PCI Express Graphics Receive Lane 11 Positive
DP-I
DRAFT COPY FOR REVIEW ONLY
19
DRAFT COPY FOR REVIEW ONLY
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