Kontron COMe-cPC2 User Manual
COMe-cPC2
Document Revision 130
www.kontron.com
» Table of Contents «
1 User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1.2 Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
1.7 Naming clarification..................................................................................................................... 7
1.8 Understanding COM Express® Functionality.......................................................................................8
1.9 COM Express® Documentation......................................................................................................... 9
1.10 COM Express® Benefits.................................................................................................................. 9
2 Product Specification..........................................................................10
2.1 Modules & Accessories................................................................................................................. 10
2.2 Functional Specification............................................................................................................... 11
2.3 Block Diagram............................................................................................................................ 15
2.4 Electrical Specification................................................................................................................ 16
2.4.1 Supply Voltage........................................................................................................................... 16
2.4.2 Power Supply Rise Time................................................................................................................ 16
2.4.3 Supply Voltage Ripple.................................................................................................................. 16
2.4.4 Power Consumption..................................................................................................................... 16
2.4.5 ATX Mode.................................................................................................................................. 17
2.4.6 Single Supply Mode..................................................................................................................... 17
2.5 Power Control............................................................................................................................ 18
2.6 Environmental Specification......................................................................................................... 19
2.6.1 Temperature Specification............................................................................................................19
2.6.2 Humidity................................................................................................................................... 19
2.7 Standards and Certifications......................................................................................................... 20
2.8 MTBF........................................................................................................................................ 22
2.9 Mechanical Specification.............................................................................................................. 23
2.10 Module Dimensions..................................................................................................................... 23
2.11 Thermal Management..................................................................................................................24
2.12 Heatspreader............................................................................................................................. 24
2.13 Onboard Fan Connector................................................................................................................ 25
2.13.1 BIOS Settings for Fan Control........................................................................................................ 26
2.13.2 Electrical Characteristics.............................................................................................................. 26
3 Features and Interfaces.......................................................................27
3.1 S5 Eco Mode.............................................................................................................................. 27
3.2 LPC.......................................................................................................................................... 28
3.3 LPC boot................................................................................................................................... 29
3.4 M.A.R.S.................................................................................................................................... 30
3.5 Fast I2C.................................................................................................................................... 31
www.kontron.com
COMe-cPC2 /
3.6 JIDA16 and JIDA32..................................................................................................................... 32
3.7 K-Station 1................................................................................................................................ 33
3.8 K-Station & API Resources............................................................................................................ 34
3.8.1 I2C.......................................................................................................................................... 34
3.8.2 Storage.................................................................................................................................... 34
3.8.3 GPIO........................................................................................................................................ 34
3.8.4 Hardware Monitor....................................................................................................................... 34
3.9 GPIO - General Purpose Input and Output.........................................................................................35
3.10 Watchdog Timer.......................................................................................................................... 36
3.11 Flash Backup Feature................................................................................................................... 37
3.12 Speedstep Technology................................................................................................................. 39
3.13 C-States.................................................................................................................................... 40
3.14 Dynamic FSB Frequency Switching.................................................................................................. 41
3.15 VID-x....................................................................................................................................... 42
3.16 Enhanced Intel Dynamic Acceleration Technology..............................................................................43
3.17 Usage of Different Graphic Interfaces..............................................................................................44
3.18 Alternative Pin-out of HDMI.......................................................................................................... 45
3.19 Alternative Pin-out of Display Port.................................................................................................. 45
3.20 Display Configurations.................................................................................................................46
3.21 Hybrid Graphics / Multi-monitor.................................................................................................... 48
3.22 Intel® vPro™ technology.............................................................................................................. 50
3.23 ACPI Suspend Modes and Resume Events..........................................................................................51
4 System Resources...............................................................................52
4.1 Interrupt Request (IRQ) Lines........................................................................................................ 52
4.1.1 In 8259 PIC Mode........................................................................................................................ 52
4.1.2 In APIC mode............................................................................................................................. 53
4.2 Direct Memory Access (DMA) Channels............................................................................................. 53
4.3 Memory Area............................................................................................................................. 53
4.4 I/O Address Map......................................................................................................................... 54
4.5 External Inter-IC (I2C) Bus............................................................................................................54
4.6 System Management (SM) Bus....................................................................................................... 54
4.7 JILI I2C Bus............................................................................................................................... 54
4.8 SDVO I2C Bus............................................................................................................................. 54
4.9 CRT I2C Bus............................................................................................................................... 54
5 Connectors........................................................................................55
5.1 Connector Location..................................................................................................................... 55
5.2 Pinout List................................................................................................................................ 56
5.2.1 General Signal Description............................................................................................................ 56
5.2.2 Connector X1A Row A................................................................................................................... 57
5.2.3 Connector X1A Row B................................................................................................................... 59
5.2.4 Connector X1B Row C................................................................................................................... 61
5.2.5 Connector X1B Row D................................................................................................................... 63
6 BIOS Operation...................................................................................65
6.1 Determining the BIOS Version....................................................................................................... 65
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COMe-cPC2 /
6.2 BIOS Update.............................................................................................................................. 65
6.3 Setup Guide............................................................................................................................... 66
6.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 66
6.4 BIOS Setup................................................................................................................................ 68
6.4.1 Main Menu................................................................................................................................ 68
6.4.2 Module Info............................................................................................................................... 69
6.4.3 Advanced Menu.......................................................................................................................... 72
6.4.4 PCIPnP Menu.............................................................................................................................. 97
6.4.5 Boot........................................................................................................................................ 98
6.4.6 Security.................................................................................................................................... 99
6.4.7 Chipset................................................................................................................................... 100
6.4.8 Exit Menu................................................................................................................................ 106
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COMe-cPC2 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2012 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
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COMe-cPC2 / User Information
1.5 Warranty
This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
1.7 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known
as ETXexpress®
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known
as microETXexpress®
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXexpress
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
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COMe-cPC2 / User Information
1.8 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO
1x optional 1x optional - -
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
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COMe-cPC2 / User Information
1.9 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cPC2. Additional references are are available from your Kontron Support or from
PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
1.10 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can
differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade
path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A
properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
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COMe-cPC2 / Product Specification
2 Product Specification
2.1 Modules & Accessories
The COM Express® compact sized Computer-on-Module COMe-cPC2 (UNTG) follows pin-out Type 2 and is compatible to
PICMG specification COM.0 Rev 1.0. The COMe-cPC2, based on Intel's Montevina platform, is available in different variants
to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Socket GMCH IOH
36004-0000-23-2 COMe-cPC2 SP9300 Intel® Core™2 Duo SP9300 BGA956 GS45 ICH9M-SFF
36004-0000-19-2 COMe-cPC2 SL9400 Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF
36004-0000-12-2 COMe-cPC2 SU9300 Intel® Core™2 Duo SU9300 BGA956 GS45 ICH9M-SFF
36004-0000-12-3 COMe-cPC2 CM723 Intel® Celeron®M ULV 723 BGA956 GS45 ICH9M-SFF
36004-0000-12-1 COMe-cPC2 CM722 Intel® Celeron®M ULV 722 BGA956 GS45 ICH9M-SFF
Accessories
Product Number Carrier Boards
38102-0000-00-1 COM Express® Reference Carrier Type 2 (8mm COMe connector)
38104-0000-00-0 COM Express® Eval Carr ier Type 2 (Niles Canyon, 5mm COMe connector)
38104-0000-00-1 COM Express® Eval Carr ier Type 2 (Topanga Canyon, 5mm COMe connector)
Product Number Memory
97015-1024-10-0 DDR3-1066 SODIMM 1GB
97015-2048-10-0 DDR3-1066 SODIMM 2GB
97015-4096-10-0 DDR3-1066 SODIMM 4GB
Product Number Cooling & Mounting
36004-0000-99-0 HSP COMe-cPC2 thread
36004-0000-99-1 HSP COMe-cPC2 through
36004-0000-99-0C01 HSK COMe-cPC2 active thread
36004-0000-99-0C02 HSK COMe-cPC2 passive thread
36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP)
36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP)
38017-0000-00-0 COMe Mount KIT 8mm 1set
38017-0000-00-5 COMe Mount KIT 5mm 1set
38017-0100-00-0 COMe Mount KIT 8mm 100sets
38017-0100-00-5 COMe Mount KIT 5mm 100sets
Product Number Adapter & Cables
9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
96006-0000-00-7 ADA-Type2-DP3 (Adapter Card Type 2 module to 3x DisplayPort)
96006-0000-00-8 ADA-DP-LVDS (DP to LVDS adapter)
96082-0000-00-0 KAB-ADAPT-DP-DVI (DP to DVI adapter cable)
96083-0000-00-0 KAB-ADAPT-DP-VGA (DP to VGA adapter cable)
96084-0000-00-0 KAB-ADAPT-DP-HDMI (DP to HDMI adapter cable)
96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect FAN to module)
96079-0000-00-2 KAB-HSP 40mm (Cable adapter to connect FAN to module)
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COMe-cPC2 / Product Specification
2.2 Functional Specification
Processor
The Intel® Core™ Duo / Celeron® (Penryn) CPU family supports:
» Intel® Dynamic Acceleration (Turbo Mode)
» Intel® Virtualization Technology (VT-x)
» Intel® Trusted Execution Technology (TXT)
» Intel® 64
» Idle States
» Enhanced Intel SpeedStep® Technology
» Execute Disable Bit
» Intel® Dynamic FSB Frequency Switching (SuperLFM)
» Thermal Monitoring Technologies
CPU specifications
Processor Cores Core CPU Clock Turbo L2 Cache C-States FSB Speed V T-x TXT Intel® 64 EIST
Intel® Celeron® M722 1 45nm Penryn 1200MHz - 3MB C0 - C3 800 MHz No No Yes No
Intel® Celeron® M723 1 45nm Penryn 1200MHz - 1MB C0 - C3 800 MHz No No Yes No
Intel® Core™2 Duo SU9300 2 45nm Penryn 1200MHz 1400MHz 3MB C0 - C6 800 MHz Yes Yes Yes Yes
Intel® Core™2 Duo SL9400 2 45nm Penryn 1866MHz 2000MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes
Intel® Core™2 Duo SP9300 2 45nm Penryn 2266MHZ 2400MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes
Chipset
The Intel Gen4 Graphics and Memory Controller Hub Cantiga supports:
» PCI Express Revision 1.1
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology
» Intel® Active Management Technology 4.0
» Intel® ICH9 family IO Controller
IOH specifications
» 2.5W TDP
» integrated Trusted Platform Module (iTPM)
» SATA RAID
The Intel® Trusted Execution Technology (TXT) and Active Management Technology (AMT)
are not supported by default on COMe-cPC2. Please contact your local sales or support.
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COMe-cPC2 / Product Specification
Memory
Sockets
1x DDR3 SO-DIMM
Memory Type
DDR3-667/800/1066
Maximum Size
4GB
Technology
Single Channel
Graphics Core
The integrated Intel® GMA X4500MHD (Gen5.5) supports:
Graphics Core Render Clock
533/320MHz, ,
Execution Units / Pixel Pipelines
10
Max Graphics Memory
1700MB
GFX Memory Bandwidth (GB/s)
17
GFX Memory Technology
DVMT 5.0
API (DirectX/OpenGL)
10 / 2.1
Shader Model
4.0
Hardware accelerated Video
MPEG2, VC-1, AVC, Blu-ray
Independent/Simultaneous Displays
2
Display Port
YES
HDCP support
HDCP 1.2 (Keys optional)
Monitor output
CRT max Resolution
2048x1536
TV out:
YES
LVDS
LVDS Bits/Pixel
1x18 / 2x18
LVDS Bits/Pixel with dithering
1x24 / 2x24
LVDS max Resolution:
1600x1200
PWM Backlight Control:
YES
Supported Panel Data:
JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics
1x PEG 1.0
Digital Display Interface DDI1
DP++/SDVOB
Digital Display Interface DDI2
DP++/SDVOC
Digital Display Interface DDI3
DP++
Maximum Resolution on DDI
2560x1600
The discrete PEG graphics port and the digitial display interfaces are multiplexed and
cannot be used simultaneously. Display Port plus plus (DP++) allows usage as DisplayPort,
HDMI or DVI
PEG Configuration
The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-cPC2 supports following PEG Port configuration when used as PCI Express Interface:
» 1×16
» 1×8
» 1×4
» 1×1
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COMe-cPC2 / Product Specification
Storage
onboard SSD
-
SD Card support
-
IDE Interface
JMD330 SATA#3 to PATA
Serial-ATA
3x SATA 3Gb/s
SATA AHCI
NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
SATA RAID
0, 1
Connectivity
USB
8x USB 2.0
USB Client
-
PCI
PCI Rev 2.3 (33MHz/3.3V)
PCI External Masters
4
PCI Express
5x PCIe x1 Gen1
Max PCI Express
6x PCIe x1 without LAN
PCI Express x2/x4 configuration
YES
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® 82567 (Boazman)
It is also possible to run the 1st 4 x1 lanes as 1 x4 lane. For that please pull-up the signal A33 and A29 to 3.3V on the
baseboard.
Express Card hotplug functionality is only available, when in BIOS setup the PCIexpress
lane is switched from [AUTO] to [ENABLED]
Ethernet
The Intel® 82567 (Boazman) ethernet supports:
» Jumbo Frames
» MACsec IEEE 802.1 AE
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Audio
HD Audio
Onboard Hardware Monitor
ON Semi ADT7475
Trusted Platform Module
iTPM 1.2 (integrated in ICH9M)
Miscellaneous
-
Kontron Features
External I2C Bus
Fast I2C
M.A.R.S. support
YES
Embedded API
JIDA16 / JIDA32 / PICMG EAPI
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Single Staged
Power Features
Singly Supply Support
YES
Supply Voltage
8.5V - 18V
ACPI
ACPI 3.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
DPST 4.3
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COMe-cPC2 / Product Specification
Power Consumption and Performance
Full Load Power Consumption
13.5 - 43W
Kontron Performance Index
2899 - 5769
Kontron Performance/Watt
133 - 214
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
Supported Operating Systems
The COMe-cPC2 supports:
» Microsoft Windows XP x86/x64
» Microsoft Windows Vista x86/x64
» Microsoft Windows 7 x86/x64
» Microsoft Windows CE 6.0
» Microsoft Windows XP embedded
» Linux
» WindRiver VxWorks
» QNX Neutrino
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COMe-cPC2 / Product Specification
2.3 Block Diagram
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COMe-cPC2 / Product Specification
2.4 Electrical Specification
2.4.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC:
8.5V - 18V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.3V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
2.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
2.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
2.4.4 Power Consumption
The maximum Power Consumption of the different COMe-cPC2 variants is 13.5 - 43W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
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COMe-cPC2 / Product Specification
2.4.5 ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →
S0 high high 5V low VCC
2.4.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 18V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 → high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 → PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
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COMe-cPC2 / Product Specification
2.5 Power Control
Power Supply
The COMe-cPC2 supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-cPC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-cPC2 / Product Specification
2.6 Environmental Specification
2.6.1 Temperature Specification
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade
With Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
2.6.2 Humidity
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
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COMe-cPC2 / Product Specification
2.7 Standards and Certifications
RoHS
The COMe-cPC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances
(RoHS) in electrical and electronic equipment.
CE marking
The COMe-cPC2 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950
Component Recognition UL 60950-1
The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
20
COMe-cPC2 / Product Specification
Shock & Vibration
The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-cPC2 follows the requirements for electromagnetic
compatibility standards
» EN55022
» EN55011
» EN55024
» FCC15
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COMe-cPC2 / Product Specification
2.8 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 175488 @ 40°C
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
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COMe-cPC2 / Product Specification
2.9 Mechanical Specification
Dimension
» 95.0 mm x 95.0 mm (3.75” x 3.75”)
» Hight approx. 12mm (0.4”)
CAD drawings are available at EMD CustomerSection
2.10 Module Dimensions
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COMe-cPC2 / Product Specification
2.11 Thermal Management
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cPC2. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other
cooling device.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.
The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the COMe-cPC2. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please
see the COM Express® Design Guide for further information on thermal management.
2.12 Heatspreader
Documentation and CAD drawings of COMe-cPC2 heatspreader and cooling solutions is provided at
http://emdcustomersection.kontron.com.
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COMe-cPC2 / Product Specification
2.13 Onboard Fan Connector
Location and Pinout of Fan Connector
The onboard fan connector (J1) can be found at the right side nearby the DRAM socket. Use adaptor KAB-HSP (960790000-00-0) to connect a standard FAN.
Connector J1 has following specification:
» Part number (Molex) J8: 53261-0390
» Mates with: 51021-0300
» Crimp terminals: 50079-8100
The Pin assignement is:
» Pin1: Tacho
» Pin2: VCC
» Pin3: GND
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COMe-cPC2 / Product Specification
2.13.1 BIOS Settings for Fan Control
The fan can be controlled via the BIOS Settings “Advanced Hardware Health Module Hardware Health”→ →
In general 4 modes are possible
» Auto Fan Mode: Temperature Values can be selected to control the Fan
» Fan Always On Full: Fan is always full on
» Fan Disable Mode: Fan is disabled
» Fan Manually Mode: A fixed PWM value (0…255) can be entered to run the fan at a selected speed
The used hardware monitor onboard is an ADT7475. For additional information please refer to the regarding datasheet.
2.13.2 Electrical Characteristics
There are 2 version of onboard fan control possible. Our standard modules have the simple version populated. For custom
projects it is possible to populate a more sophisticated one. The differences are:
Features Premium Fan Base Fan
Input Voltage Range
8.5V - 18V 8.5V - 18V
Output Voltage
5V / 12V Only 12V (switch in BIOS without function)
Max. output current
1A 0.3A
The fan voltage is in both versions VCC of the board and limited to 12V max.
The Fan out voltage output is not short circuit proof. If necessary the user has to ensure
that the circuit is protected externally, for example by a fuse on the backplane.
With premium fan solution it is recommended to select the correct fan voltage first in BIOS
setup and then connect the fan.
To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)
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COMe-cPC2 / Features and Interfaces
3 Features and Interfaces
3.1 S5 Eco Mode
Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!
In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current tremendously.
The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.
Following prerequesites and consequences occur when S5 Eco Mode is enabled
» The power button must be pressed at least for 200ms to switch on.
» Wake via Powerbutton only.
» “Power On After Power Fail”/“State after G3”: only “stay off” is possible
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COMe-cPC2 / Features and Interfaces
3.2 LPC
The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.
The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.
All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:
83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio
PS/2 YES YES YES
COM1/COM2 YES YES YES
LPT YES YES YES
HWM YES YES NO
Floppy NO NO NO
GPIO NO NO NO
83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio
PS/2 YES YES YES
COM1/COM2 YES YES YES
LPT YES YES YES
HWM NO NO NO
Floppy NO NO NO
GPIO NO NO NO
Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.
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COMe-cPC2 / Features and Interfaces
3.3 LPC boot
The COMe-cPC2 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated
with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration:
BIOS_DIS0# BIOS_DIS1# Function
open open Boot on-module BIOS
GND open Boot baseboard LPC FWH
open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2
GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1
Using an external LPC Firmware Hub
To program an external LPC FWH follow these steps:
» Connect a 1MB LPC FWH to the module's LPC interface
» Open pin A34 to boot from the module BIOS
» Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided
on EMD Customer Section
» Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH
» Execute Flash.bat to flash the BIOS image to the external LPC FWH
» reboot
Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded.
To create a BIOS with custom defaults:
» Change your BIOS settings
» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)
» Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup
biosname.rom in Windows
Flash Backup should show “Enter new Password” first time saving custom defaults. If it is
not possible to set a new password or entering a password shows an error message, please
clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available
at Kontron’s Customer Section)
You can download all AMI CORE8 update utilities at AMI.com:
http://www.ami.com/support/downloads/amiflash.zip
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COMe-cPC2 / Features and Interfaces
3.4 M.A.R.S.
The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems
is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.
Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:
8-bit Address 7-bit Address Device
12h 0x09 SMART_CHARGER
14h 0x0A SMART_SELECTOR
16h 0x0B SMART_BATTERY
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