Kontron COMe-cHL6 User Manual

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COMe-cHL6

Document Revision 110

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» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Module definition....................................................................................................................... 10

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram........................................................................................................................... 18

3.4 Accessories............................................................................................................................... 19

3.5 Electrical Specification................................................................................................................ 20

3.5.1 Supply Voltage........................................................................................................................... 20

3.5.2 Power Supply Rise Time................................................................................................................ 20

3.5.3 Supply Voltage Ripple.................................................................................................................. 20

3.5.4 Power Consumption..................................................................................................................... 20

3.5.5 ATX Mode.................................................................................................................................. 21

3.5.6 Single Supply Mode..................................................................................................................... 21

3.6 Power Control............................................................................................................................ 22

3.7 Environmental Specification......................................................................................................... 23

3.7.1 Temperature Specification............................................................................................................ 23

3.7.2 Humidity................................................................................................................................... 23

3.8 Standards and Certifications.........................................................................................................24

3.9 MTBF........................................................................................................................................ 26

3.10 Mechanical Specification.............................................................................................................. 27

3.11 Module Dimensions..................................................................................................................... 28

3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................29

4 Features and Interfaces.......................................................................30

4.1 S5 Eco Mode.............................................................................................................................. 30

4.2 LPC.......................................................................................................................................... 31

4.3 Serial Peripheral Interface (SPI)....................................................................................................32

4.4 SPI boot.................................................................................................................................... 32

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COMe-cHL6 /

4.5 M.A.R.S.................................................................................................................................... 34

4.6 UART........................................................................................................................................ 35

4.7 Fast I2C.................................................................................................................................... 36

4.8 Dual Staged Watchdog Timer.........................................................................................................37

4.9 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 38

4.10 Speedstep Technology................................................................................................................. 40

4.11 C-States.................................................................................................................................... 41

4.12 Hyper Threading......................................................................................................................... 42

4.13 Intel® Turbo Boost Technology and AVX...........................................................................................43

4.14 Display Configuration..................................................................................................................44

4.15 Hybrid Graphics / Multi-monitor.................................................................................................... 47

4.16 Intel® vPro™ technology.............................................................................................................. 48

4.17 ACPI Suspend Modes and Resume Events..........................................................................................49

5 System Resources...............................................................................50

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 50

5.2 Memory Area.............................................................................................................................. 51

5.3 I/O Address Map......................................................................................................................... 51

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 52

5.5 Internal I2C Bus......................................................................................................................... 52

5.6 External I2C Bus......................................................................................................................... 52

5.7 System Management (SM) Bus....................................................................................................... 53

6 Connectors........................................................................................54

6.1 Connector Location..................................................................................................................... 54

7 Pinout List.........................................................................................55

7.1 General Signal Description............................................................................................................ 55

7.2 Connector X1A Row A................................................................................................................... 56

7.3 Connector X1A Row B................................................................................................................... 58

7.4 Connector X1B Row C................................................................................................................... 60

7.5 Connector X1B Row D................................................................................................................... 62

8 BIOS Operation..................................................................................64

8.1 Determining the BIOS Version....................................................................................................... 64

8.2 BIOS Update.............................................................................................................................. 64

8.3 POST Codes................................................................................................................................ 64

8.4 Setup Guide............................................................................................................................... 65

8.5 BIOS Setup................................................................................................................................ 66

8.5.1 Main........................................................................................................................................ 66

8.5.2 Advanced.................................................................................................................................. 72

8.5.3 Security.................................................................................................................................. 109

8.5.4 Boot....................................................................................................................................... 111

8.5.5 Exit........................................................................................................................................ 112

COMe-cHL6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-cHL6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe-cHL6 / Introduction

2 Introduction

2.1 Product Description

Tailored for most robust and maintenance-free system designs in the high performance class of embedded systems

Kontron is extending the usage model of the 4th generation Intel® Core® processor technology to compact and rugged fanless options with the launch of the Kontron COMe-cHL6 COM Express® compact Computer-on-Modules. The new modules in the compact form factor (95 x 95 mm) are equipped with the ULT versions of the 4th generation Intel® Core™ i7/i5/i3 & Celeron® processor, formerly codenamed ‘Haswell-U’ . ULT stands for ultra-low TDP which limits the power consumption of these new Computer-on-Modules down to options that are tailored for fanless and fully enclosed system designs. The modules also cater for the most robust and maintenance-free system designs in the high performance class of embedded systems, and consequently help engineers to reduce the systems’ bill of materials as well as the customers’ total cost of ownership.

Application areas can be found in all the performance-hungry but power-restricted, multi-touch multi-display systems such as HMIs in automation, medical imaging, digital signage and point of sale as well as surveillance and security. The modules also address the fast-growing, industrial-grade tablet PC market for various industries including logistics, retail and manufacturing.

The Kontron COMe-cHL6 COM Express® compact Computer-on-Modules with pin-out type 6 are highly scalable to cover a broad application range from high-end 1.7 GHz dual-core Intel® Core™ i7 processor performance to cost-optimized Intel® Celeron® designs. With Intel® AVX2 and OpenCL 1.2 they boost floating point performance as well as parallel processing density. Up to 16 GB of energy-efficient DDR3L RAM (8GB memory down + 8GB SODIMM) satisfy even highest memory demands. State-of-the-art multi-display designs are enabled by three independent display outputs, executed via 2x DP++ (DisplayPort, HDMI, DVI) and 1x Dual Channel LVDS. Standard interfaces include 4x SATA 6Gbit/s ports, Gigabit Ethernet, 2x USB 3.0 ports and 8x USB 2.0.Application-specific extensions on the carrier board are connected via 4x PCIe x1 or 1x PCI x4. An additional PCIe x2 interface is possible with disabled GbE functionality. The wide-range (8.5 - 20V) power supply and MARS smart battery support simplify mobile and battery-powered designs.

COMe-cHL6 / Introduction

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

COMe-cHL6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-cHL6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can differentiate products at various price/performance points, or when designing future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

COMe-cHL6 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® compact sized Computer-on-Module COMe-cHL6 (CHL6) follows pin-out Type 6 and is compatible to PICMG specification COM.0 Rev 2.1. The COMe-cHL6 based on latest Shark Bay ULT platform is available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor Memory Down SATA

36014-4000-17-7 COMe-cHL6 i7-4650U 4GB Intel® Core™ i7-4650U 4GB 4x 6Gb/s

36014-0000-17-7 COMe-cHL6 i7-4650U Intel® Core™ i7-4650U - 4x 6Gb/s

36014-4000-19-5 COMe-cHL6 i5-4300U 4GB Intel® Core™ i5-4300U 4GB 4x 6Gb/s

36014-0000-19-5 COMe-cHL6 i5-4300U Intel® Core™ i5-4300U - 4x 6Gb/s

36014-4000-17-3 COMe-cHL6 i3-4010U 4GB Intel® Core™ i3-4010U 4GB 4x 6Gb/s

36014-0000-17-3 COMe-cHL6 i3-4010U Intel® Core™ i3-4010U - 4x 6Gb/s

36014-0000-16-1 COMe-cHL6 2980U Intel® Celeron 2980U - 2x 6Gb/s

Extended temperature grade modules (E1, -25°C to 75°C operating)

The COMe-cHL6 is available for extended temperature grade on request. General capability was tested for following options:

» CPU: all

» Memory: all DDR3L

» VCC: 12V only, no support for Wide-Range Input

Industrial temperature grade modules (XT, -40°C to 85°C operating)

Modules for E2 temperature range are available project based only, please contact your local sales or support for further details. General capability was tested for following options:

» CPU: all

» Memory: E2 DDR3L memory only (97015-xxxx-16-3) and industrial type memory down

» VCC: 12V only, no support for Wide-Range Input

COMe-cHL6 / Product Specification

3.2 Functional Specification

Processor

The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell-U (ULT)) CPU family with 40x24mm package size (BGA1168 socket) supports:

» Intel® Turbo Boost Technology 2.01

» Intel® 64

» Intel® Virtualization Technology (VT-x)

» Intel® Virtualization Technology for Directed I/O (VT-d)

» AES New Instructions (AES-NI)

» Intel® Hyper-Threading Technology

» Enhanced Intel SpeedStep® Technology

» Idle States (C-States)

» Intel® Smart Cache

» Thermal Monitoring Technologies

» Intel® Fast Memory Access

» Intel® Flex Memory Access

» Integrated Intel® HD Graphics with Dynamic Frequency

» Configurable Thermal Design Power (cTDP)

» Intel® Rapid Storage Technology

» Intel® Smart Connect Technology

Optional available (with customized BIOS):

» Intel® vPRO™ Technology including:

» Intel® Active Management Technology (AMT)

» Intel® Trusted Execution Technology (TXT)

» Advanced Encryption Standard Instructions (AES-NI)

COMe-cHL6 / Product Specification

The integrated Intel® HD Graphics xxxx supports:

» GraphicsTechnology GT2 with 20 Execution Units or GT3 with 40 Execution Units

» Intel® Quick Sync Video

» Intel® InTru™ 3D Technology

» Intel® Wireless Display

» Intel® Flexible Display Interface (Intel® FDI)

» Intel® Clear Video HD Technology

» Intel® Graphics Render C-State RC6

» Intel® Smart 2D Display Technology (S2DDT)

» 3 simultaneous displays (Win7/8 and Linux)

» Hybrid Multi Monitor with 2 internal and 2 external displays

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback

The integrated Intel® HD Graphics supports:

» GraphicsTechnology GT1 with 10 Execution Units

» Dual Display

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback

COMe-cHL6 / Product Specification

Intel® Core™ Core™ Core™ Core™

- i7-4650U i5-4300U i3-4010U Celeron 2980U

# of Cores 2 2 2 2

# of Threads 4 4 4 2

TDP Core frequency (HFM)

1700MHz 1900MHz 1700MHz 1600MHz

Max Turbo Frequency 1 core 3300MHz 2900MHz - -

Max Turbo all cores 2900MHz 2500MHz - -

LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz

Bus/Core Ratio 8 - 17 8 - 19 8 - 17 8 - 16

TjMax 100°C 100°C 100°C 100°C

Thermal Design Power (TDP) 15W 15W 15W 15W

cTDP-Down 11.5W (800MHz) 11.5W (800MHz) 11.5W (800MHz) -

cTDP-Up 25W (2.3GHz) 25W (2.5GHz) - -

Power Limit 2 (PL2 max) 31.25W 31.25W 25W 18.75W

C-States C0-C10 C0-C10 C0-C10 C0-C3

Smart Cache 4MB 3MB 3MB 2MB

Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600

Max Memory Size 8+4GB 8+4GB 8+4GB 8+4GB

# of Memory Channels 2 2 2 2

Graphics Model HD5000 HD4400 HD4400 HD

GFX Base Frequency 200MHz 200MHz 200MHz 200MHz

GFX Max Dynamic Frequ. 1100MHz 1100MHz 1000MHz 1000MHz

GFX Technology GT3 40EU GT2 20EU GT2 20EU GT1 10EU

Quick Sync Video Yes Yes Yes -

InTru™ 3D Yes Yes Yes -

Wireless Display Yes Yes Yes -

Clear Video HD Yes Yes Yes -

vPRO™ (optional) Yes Yes - -

TXT (optional) Yes Yes - -

AES-NI (optional) Yes Yes Yes -

VT-x Yes Yes Yes Yes

VT-d Yes Yes Yes -

PCI Express Graphics x16 - - - -

COMe-cHL6 / Product Specification

Memory

Sockets

1x DDR3L SODIMM, 1x memory down

Memory Type

DDR3L-1600

Maximum Size

1-8GB SODIMM, 2-4GB memory down

Technology

Dual Channel

Chipset

The integrated Intel® Platform Controller Hub LynxPoint-LP supports:

» PCI Express Revision 2.0

» PCI Express Configurations x1, x2, x4

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Trusted Execution Technology (TXT)

» Intel® vPro Technology (optional)

» Intel® Active Management Technology 9.0 (optional)

» Intel® Anti-Theft Technology

» Intel® Rapid Storage Technology

» Intel® Smart Response Technology

HighSpeed I/O Port Configuration

Internal Port Usage COMe

Port1

USB3 #1 USB #0 = USB3.0

Port2

USB3 #2 USB #1 = USB3.0

Port3

PCIe #1 or USB3 #3 PCIe #0

Port4

PCIe #2 or USB3 #4 PCIe #1

Port5

PCIe #3 PCIe #2

Port6

PCIe #4 PCIe #3

Port7

PCIe #5L0 PCIe #4

Port8

PCIe #5L1 PCIe #5 (x2 only with #4)

Port9

PCIe #5L2 Ethernet (PCIe #6 w/o LAN)

Port10

PCIe #5L3 not used (PCIe #7 w/o LAN)

Port11

PCIe #6L0 or SATA6 #3 SATA #3 (6Gbps)

Port12

PCIe #6L1 or SATA6 #2 SATA #2 (6Gbps)

Port13

PCIe #6L2 or SATA6 #1 SATA #1 (6Gbps)

Port14

PCIe #6L3 or SATA6 #0 SATA #0 (6Gbps)

x2 Port PCIe #4 + #5 are only available with Softstrap option (modified Flash descriptor) which disables onboard LAN (PCIe #5L2)

COMe-cHL6 / Product Specification

Graphics Core

The integrated Intel® HD/HD4400/HD5000 (Gen7.5) supports:

Graphics Core Render Clock

GT1/GT2; Base clock: 200 MHz; GT Turbo: up to 1100 MHz

Execution Units / Pixel Pipelines

GT2: 20EU / GT1: 10EU

Max Graphics Memory

1720MB

GFX Memory Bandwidth (GB/s)

25.6

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11.1 / 4.0 + OCL 1.2

Shader Model

5.0

Hardware accelerated Video

MPEG2, VC-1, AVC, Blu-ray (+3D)

Independent/Simultaneous Displays

Display Port

DP 1.2 / eDP 1.3

HDCP support

HDCP 1.4a

Monitor output

CRT max Resolution

TV out:

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24 with DP2LVDS

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

DP++

Digital Display Interface DDI3

Maximum Resolution on DDI

HDMI: 4096x2304, DP: 3200x2000

Storage

onboard SSD

SD Card support

IDE Interface

Serial-ATA

4x SATA 6Gb/s

SATA AHCI

AHCI with NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier

SATA RAID

0, 1, 5, 10

If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer rate and Staggered Spin-Up. To configure a RAID enable RAID support in BIOS Chipset/SATA settings, connect at least two hard drives and enter the RAID Option ROM by pressing 'CTRL'+'I'

COMe-cHL6 / Product Specification

Connectivity

USB 2.0

8x USB 2.0

USB 3.0

2x USB 3.0

USB Client

PCI

PCI External Masters

PCI Express

4x PCIe x1 Gen2

Max PCI Express

8x PCIe w/o LAN

PCI Express x2/x4 configuration

YES (Softstrap option)

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® i218-LM (Clarkville)

Due to internal chipset configuration the LynxPoint-LP only supports up to 4 USB Hubs

PCI Express Configuration

By default, the COMe-cHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4 configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.

COMe PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5 Port #6 Port #7

Configuration0 x1 x1 x1 x1 - - - -

Configuration1 x1 x1 x1 x1 x1 - - -

Configuration2 x2 x1 x1 - - - -

Configuration3 x2 x2 x2 - -

Configuration4 x2 x1 x1 x2 - -

Configuration5 x4 x4

Configuration0 is default setting. Other configurations are available via modified FlashDescriptor with customized BIOS versions. For configurations 2 to 5 the onboard Ethernet will be disabled.

Ethernet

The Intel® i218-LM (Clarkville) ethernet supports:

» Jumbo Frames - 9K

» MACsec IEEE 802.1 AE

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

» IEEE1588

COMe-cHL6 / Product Specification

Misc Interfaces and Features

Supported BIOS Size/Type

16MB SPI

Audio

HD Audio + DisplayPort dual stream

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Atmel AT97SC3204

Miscellaneous

2x UART / PWM FAN / optional eDP

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

Smart Battery (M.A.R.S.) support

YES

Embedded API

KEAPI3

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 20V

ACPI

ACPI 4.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

cTDP @ i7/i5/i3

Power Consumption and Performance

Full Load Power Consumption

14 - 30W

Kontron Performance Index

41000 - 65269

Kontron Performance/Watt

2009 - 2997

*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0

Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

COMe-cHL6 / Product Specification

3.3 Block Diagram

SMB

GPIO UART

Ctrl

Mgmt

LPC HDA SATA#0-3

SPI

GPIO

USB #0-1

(USB3.0)

PwrCtrl

SysMgmt

RTC

PCIe

USB #0-1

(USB2.0)

PWM FAN2

I2C

SER0 SER1

eDP x2

USB #2-7

(USB 2.0)

PCIe #0-3

PCIe #4/5

Intel® 4th Generation Core

ULT (U-Series) i7/i5/i3/Celeron

With integrated LP-PCH

LID

Sleep

SPI

BIOS Flash

LVDS

Connector Option

Standard

component

GB LAN

Embedded Controller

(CPLD EPM1270)

HWM

NCT7802

Gen7.5

iGFX

FAN1

xHCI

eDP2LVDS

NXP3460

COM Express® connector AB – Pin-out Type 6

GBLan

Intel®

I218LM

VCC

5VSB

VBAT

HWM

SMB

Power sequencing

Watchdog

LPC2I2C GPIO Buffer

I2C

S5eco

EEPROM

TPM

UART

COM Express® connector CD – Pin-out Type 6

DDR3L SODIMM

VCC

EHCI1

DP++

JTAG

SPD

GBE MAC

SPD

DDR3L

COMe-cHL6 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

36014-0000-99-0 HSP COMe-cHL6 thread For all CPUs and temperature grades

36014-0000-99-1 HSP COMe-cHL6 through For all CPUs and temperature grades

General accessories

Part Number COMe pin-out Type 6 compatible

accessories

Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPort

96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6

38114-0000-00-S COMe Ref. Star terkit T6 ADAS Starterkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Battery Kit Starterkit Kontron Mobile Application platform for Rechargeable Systems

Part Number DDR3L SODIMM, commercial temperature grade

97015-1024-16-1 DDR3L-1600 SODIMM 1GB

97015-2048-16-1 DDR3L-1600 SODIMM 2GB

97015-4096-16-1 DDR3L-1600 SODIMM 4GB

97015-8192-16-1 DDR3L-1600 SODIMM 8GB

Part Number DDR3L SODIMM, industrial temperature grade

97015-1024-16-3 DDR3L-1600 SODIMM 1GB E2

97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2

97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2

97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2

COMe-cHL6 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-cHL6 variants is 14 - 30W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

COMe-cHL6 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 20V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

COMe-cHL6 / Product Specification

3.6 Power Control

Power Supply

The COMe-cHL6 supports a power input from 8.5V - 20V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cHL6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.

COMe-cHL6 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the COMe-cHL6

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 8.5V - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 8.5V - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

COMe-cHL6 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-cHL6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

COMe-cHL6 / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cHL6 follows the requirements for electromagnetic

compatibility standards

» EN55022

COMe-cHL6 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 342363 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

COMe-cHL6 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of 27.3mm from module bottom to Heatsink top.

COMe-cHL6 / Product Specification

3.11 Module Dimensions

All dimensions in mm

COMe-cHL6 / Product Specification

3.12 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cHL6. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-cHL6. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cHL6 are usually designed to cover the power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-cHL6 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

COMe-cHL6 / Features and Interfaces

4 Features and Interfaces

4.1 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

COMe-cHL6 / Features and Interfaces

4.2 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

COMe-cHL6 / Features and Interfaces

4.3 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame. Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire” serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the baseboard.

4.4 SPI boot

The COMe-cHL6 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88 (BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

COMe-cHL6 / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

COMe-cHL6 / Features and Interfaces

4.5 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

COMe-cHL6 / Features and Interfaces

4.6 UART

The COMe-cHL6 supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 450 to 115.2k Baud (except 56000)

» 5, 6, 7 or 8bit characters

» 1 or 2 Stop bit generation

» Even, odd or no-parity generation/detection

» Complete status reporting capabilities

» Line break generation and detection

» Full prioritized interrupt system control

» No FIFO

» One additional shift register for transmit and one for receive

» No Flow Control

» No FCR register due to unavailability of FIFO

» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings

- Due to the protection circuitry required according COM Express® specification the transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or support for customized versions without protection circuitry

- Legacy console redirection via onboard serial ports may be restricted in terms of serial input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream generated by a program may lose characters. Inputs from a keyboard via terminal program will be safe.

COMe-cHL6 / Features and Interfaces

4.7 Fast I2C

The COMe-cHL6 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

COMe-cHL6 / Features and Interfaces

4.8 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive state into normal operation.

The COMe-cHL6 offers a watchdog which works with two stages that can be programmed independently and used one by one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If deassertion during runtime is necessary please ask your Kontron technical support for further help.

COMe-cHL6 / Features and Interfaces

4.9 Intel® Fast Flash Standby™ / Rapid Start Technology™

The target of Intel® Fast Flash Standby™ (iFFS) (also known as Intel® Rapid Start Technology™ iRST) is to get a wake-up time from S4 compareable to S3. Normally S4 is caused by OS which stores it's information to the hard disk and does then a normal shutdown. S4 resume takes quite long as the system does a normal BIOS POST and OS restores it's information from the hard disk.

IFFS does it in a different way. The Operating System initiates an S3 and stores it's information in memory. After that BIOS copies this OS information from DRAM to SSD and does a sleep state similar to S4 with nearly zero power. If system is resumed by power button, BIOS restores memory content from SSD to the DRAM and does an S3 resume which is much faster.

Requirements

» SATA Solid State Disk in AHCI mode

» Free disk space on the SSD with at least the DRAM size

» Operating System with disk partition tool to allocate the hibernation partition (e.g. Windows 7/8)

» BIOS supporting iFFS feature

How to setup once the operating system is installed

» Prepare a free disk space on your onboard or external SSD with at least the size of DRAM

» Open cmd.exe in Administrator Mode and type diskpart.exe to open the Windows disk partition tool

» DISKPART> list disk

» DISKPART> select disk X (X is disk number where you want to create the store partition. Refer to results from “list

disk” for exact disk number)

» DISKPART> create partition primary

» DISKPART> detail disk

» DISKPART> select Volume X (X is Volume of your store partition. Refer to results from “detail disk” for exact volume

number)

» DISKPART> set id=84 override (ID 84 marks the partition as hibernate partition)

» DISKPART> exit

» Now there should be a Hibernate Partition visible in your disk management

» Reboot and enable iFFS in BIOS

Usage

» Activate Lid / move system to Sleep/Standby ( S3)→

» After configured period of time in Setup the system powers on automatically and information in DRAM moves to

non-volatile memory (Default is 'immediately')

» System switches off again to iFFS ( comparable to S4, Power Supply can now be disconnected)→

» When System is powered on, information moved back to DRAM (No display output during copy process)

» System resumes same as Sleep/Standby S3

Note

» Depending on the platform iFFS enabled may disable the hibernate function in Windows automatically

COMe-cHL6 / Features and Interfaces

Benefits

» System transitions from S3 to S4 automatically

» Up to 6x battery life compared to Standby

» Resume time reduced up to 75%

Measured resume times from Power-on to Win7 Log-on Screen on COMe-mCT10:

» 2.5” SATA II HDD 5400rpm: Hibernate: 22s, iFFs on onboard NANDrive: 17s

» 2.5” SATA III SSD: Hibernate: 18s, iFFS on SSD: 10s

COMe-cHL6 / Features and Interfaces

4.10 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to adapt high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

COMe-cHL6 / Features and Interfaces

4.11 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via sof tware

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

COMe-cHL6 / Features and Interfaces

4.12 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the processor—those that store the architectural state but not duplicating the main execution resources. This allows a HyperThreading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies on the Operating System.

COMe-cHL6 / Features and Interfaces

4.13 Intel® Turbo Boost Technology and AVX

For applications that are particularly power-hungry, the new processors provide enhanced Intel® Turbo Boost technology. This automatically shifts processor cores and processor graphics resources to accelerate performance, tailoring a workload to give users an immediate performance boost for their applications whenever needed. Another innovation is the enhancement to the 256-bit instruction set, known as Intel® Advanced Vector Extensions (AVX). AVX delivers improved performance, rich functionality and the ability to manage, rearrange and sort data in a better way. The new instruction set accelerates floating-point intensive applications such as “number crunchers” or digital processing of images, videos and audio data. Intel® Turbo Boost Technology 2.0

Intel has optimized Intel® Turbo Boost Technology to provide even more performance when needed on the latestgeneration Intel® microarchitecture. Intel® Turbo Boost Technology 2.0 automatically allows processor cores to run faster than the base operating frequency if it's operating below power, current, and temperature specification limits. Intel Turbo Boost Technology 2.0 is activated when the Operating System (OS) requests the highest processor performance state (P0).

The maximum frequency of Intel Turbo Boost Technology 2.0 is dependent on the number of active cores. The amount of time the processor spends in the Intel Turbo Boost Technology 2.0 state depends on the workload and operating environment. Any of the following can set the upper limit of Intel Turbo Boost Technology 2.0 on a given workload:

» Number of active cores

» Estimated current consumption

» Estimated power consumption

» Processor temperature

When the processor is operating below these limits and the user's workload demands additional performance, the processor frequency will dynamically increase until the upper limit of frequency is reached. Intel Turbo Boost Technology

2.0 has multiple algorithms operating in parallel to manage current, power, and temperature to maximize performance and energy efficiency. Note: Intel Turbo Boost Technology 2.0 allows the processor to operate at a power level that is higher than its rated upper power limit (TDP) for short durations to maximize performance.

COMe-cHL6 / Features and Interfaces

4.14 Display Configuration

Maximum supported Resolutions in Single Display Configuration

Port Max Resolution

DP 3200×2000@60Hz, 24bpp

HDMI 4096×2160@24Hz, 24bpp

2560×1600@60Hz, 24bpp 1920×1080@60Hz, 36bpp

DVI 1920×1200@60Hz, 24bpp

WiDi 1920×1080@30Hz, 24bpp

1280×720@60Hz, 24bpp

eDP (x4) 3200×2000@60Hz, 24bpp

LVDS 1920×1200@60Hz

Maximum supported Pixel Clock

Port Max Pixel Clock

DP 414.5 MHz

HDMI 300 MHz

DVI 165 MHz

DDI supported resolutions

Display1 Display2 Display3 Max.Res Display 1 Max.Res Display 2 Max.Res Display 3

HDMI/DP HDMI/DP eDP/LVDS 4096×2160@24Hz

3200×2000@60Hz

4096×2160@24Hz 3200×2000@60Hz

3200×2000@60Hz @ eDP 1920×1200 @ LVDS

DVI DVI/WiDi eDP/LVDS 1920×1200@60Hz 1920×1200@60Hz

1920×1080@30Hz

3200×2000@60Hz @ eDP 1920×1200 @ LVDS

DP/HDMI DVI/WiDi eDP/LVDS 3200×2000@24Hz

4096×2160@24Hz

1920×1200@60Hz 1920×1080@30Hz

3200×2000@60Hz @ eDP 1920×1200 @ LVDS

Link Data Rate

The maximum supported Display Ports resolutions are dependent on the Link Data Rate and the used Lane Count:

Link Data Rate 1 Lane 2 Lanes 4 Lanes

RBR 1024×600 1400×1050 2240×1400

HBR 1280×960 1920×1200 2880×1800

HBR2 1920×1200 2880×1800 3840×2160

(valid for 60Hz refresh rate and 24bpp)

3 independent Display Support

The COMe-cHL6 supports up to 3 independent displays in Windows 7/8 and Linux

COMe-cHL6 / Features and Interfaces

Digital Display Interface Features

The integrated Intel® HD/HD4400/HD5000 (Gen7.5) graphics supports:

» High-bandwidth Digital Content Protection (HDCP) on HDMI and DisplayPort with up to 2 HDCP streams

simultaneously

» One active Protected Audio and Video Path (PAVP) session on HDMI or DisplayPort

» Dual Stream DP/HDMI Audio

» DP/HDMI/DVI Hot-plug (low-active)

Supported Audio Formats on HDMI and DisplayPort

Audio Formats HDMI DisplayPort

AC-3 Dolby Digital YES YES

Dolby Digital Plus YES YES

DTS-HD YES YES

LPCM, 192kHz/24bit, 8 channel YES YES

Dolby True HD, DTS HD Master Audio YES YES

COMe-cHL6 / Features and Interfaces

DDI Design Consideration

» For sufficient signal quality baseboard designs with long signal lanes or impedance leaps may require an Equalizer

or Re-driver for the digital display interfaces

» DDI hot-plug detection is high active

» DisplayPort can be used directly or with external adapters for HDMI, DVI or VGA

» HDMI or DVI usage on a baseboard requires a level shifter

Find more details for DDI usage as DisplayPort, HDMI or DVI with schematic examples available on http://emdcustomersection.kontron.com

DVI-I Design Topology

DVI-I is supported on PCH Digital Display Port B (COM DDI1) only. The implementation involves routing VGA and DVI-D signals to DVI-I connector:

» DVI Data and Clock signals on PCH Digital Display Port B should be routed to TMDS Data 0, 1 and 2 pins and TMDS

Clock pin of DVI-I connector respectively

» DVI HPD signals should be routed to the HPD pin of the DVI-I connector

» DVI DDC Clock and Data signals on PCH Digital Display Port B should be routed to the DDC Clock and Data pins of the

DVI-I connector.

COMe-cHL6 / Features and Interfaces

4.15 Hybrid Graphics / Multi-monitor

The COMe-cHL6 supports Hybrid Multi-monitor function which is one form of Intel's Hybrid Graphics where integrated graphics (in Chipset or CPU) is available to operate simultaneously with external PEG; PCIe or PCI graphics. This feature enables concurrent function of Intel's integrated Graphics Processing Unit (GPU/iGFX) along with a discrete GPU solution, allowing for operability of greater than two independently-driven displays. The O/S will handle control of the multiple GPU display adapters appropriately. For example, WindowsXP supports The Microsoft Windows XP Display Driver Model (XPDM) which allows loading and support of multiple graphics drivers. Windows 7 continues that legacy XPDM support but also adds WDDM v1.1 which, like XPDM, allows for simultaneous multiple graphics drivers (Windows Vista WDDM v1.0 did not allow this capability). Operating system applications will be adapter-unaware through use of the O/S GUI APIs and will utilize the adapter associated with the primary display, regardless of which display the image is located on.

Some applications may be adapter-aware, e.g., full-screen applications and system applications like the compositor. A number of software tools designed to assist multimonitor use are available from third parties. One example is the UltraMon* utility for multimonitor systems, which helps with the position of applications, assists desktop wallpapers and screen savers in multi-monitor configurations.

Hybrid Multi-monitor mode is recommended to be accomplished using a discrete third-party PCI Express graphics card either into the PEG slot of the platform or into an available PCI Express slot routed off of the I/O subsection of the chipset.

Requirements

» Baseboard supporting PEG (alternatively PCIe or PCI)

» Module BIOS which allows switching between iGFX and discrete GPU (iGFX must be set to primary boot display)

» O/S supporting heterogeneous display adapters (Linux / WindowsXP / Windows 7)

Setup a Multi-monitor system

» Start without the discrete GPU seated in the system

» Select IGD as Primary Boot Display in BIOS Setup

» Boot into O/S and install drivers requested for the integrated GPU

» Shut down the system and insert the discrete GPU

» Boot into O/S and install drivers requested for the discrete GPU (if necessary in Safe mode)

» Set the Windows Display properties as referenced below (example: WindowsXP)

In most cases the graphical user interfaces (e.g. ATI Catalyst Control Center) for both GPUs may not run properly. It's recommended to use O/S implemented Display Properties like in screenshot above

Detailed documentation is available in Intel Paper 323214

COMe-cHL6 / Features and Interfaces

4.16 Intel® vPro™ technology

Kontron and Intel® are addressing the security and manageability challenges facing embedded systems today with the implementation of Intel® vPro™ technology to enable: » System integrity » Secure isolation » Remote systems management

First, system integrity is the ability to identify whether the system hardware or system software has been modified without authorization. When a system’s integrity is known, the system can be thought of as a trusted system. Second, secure isolation is the ability to use platform hardware to separate processes, resources, and data on the system such that they cannot interact with each other in unintended ways. By providing hardware-assisted isolation, there is limitless security, privacy, and cost savings that can be realized through consolidation and workload isolation. Finally, remote systems management is the ability to troubleshoot, perform power management or system verification through secure channels. Significant cost savings and efficiencies can be realized through remote management allowing for increased system up time and the ability to manage or diagnose a system, even when powered down.

Intel® vPro™ technology itself is special functionality designed into both, the processor and the chipset. The three technologies that comprise Intel® vPro™ technology are: Intel Virtualization Technology (Intel® VT), Intel Trusted Execution Technology (Intel® TXT) and Intel Active Management Technology (Intel® AMT).

Intel® VT provides hardware-based assists making secure isolation more efficient and decreases the virtualization footprint, lowering the effective attack surface of a solution. This hardware-based technology can help to protect applications and information by running multiple operating systems (OSs) in isolation on the same physical system. A virtual guest OS can be created in an entirely separate space on the physical system to run specialized or critical applications. Virtual environments leverage Intel® VT for memory, CPU, and Directed I/O virtualization. Intel® TXT provides the ability to use hardware-based mechanisms to verify system integrity during the boot process. It also provides system memory scrubbing that protects against soft reset attacks. Virtualized environments take advantage of Intel® TXT launch environment verification to establish a dynamic root of trust providing added security to hypervisor or virtual machine monitor (VMM).

Mechanisms employed by Intel® AMT include domain authentication, session keys, persistent data storage in the Intel® AMT hardware, and access control lists. Only firmware images that are digitally signed by Intel are permitted to load and execute. This set of hardware-based features is targeted for businesses and allows remote access to the system, whether wired or wireless, for management and security tasks. Because of the special hardware capabilities provided by Intel® AMT, out of band access is available even when the OS is not functional or system power is off.

Intel® TXT and Intel® AMT are disabled by default. Please contact your local sales or support for BIOS versions with full vPro™ support

COMe-cHL6 / Features and Interfaces

4.17 ACPI Suspend Modes and Resume Events

The COMe-cHL6 supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage (2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup and driver options

COMe-cHL6 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

IRQ # Used For Available Comment

0 Timer0 No -

1 Keyboard No -

2 Cascade No -

3 COM2 No onboard UART2

4 COM1 No onboard UART1

5 SIO LPT/SD Controller Note(4) external SIO LPT/SD Controller

6 COM3 Note(4) external SIO COM1

7 COM4 Note(4) external SIO COM1

8 RTC No -

9 ACPI No -

10 - Yes -

11 - Yes -

12 PS/2 Mouse Note(4) external SIO

13 - Yes -

14 - Yes -

15 - Yes -

16 LNK A No I.G.D + SA Audio + XHCI + Intel ME + USB

EHCI2 + PCIe RP 0 + PCIe RP 4; Note(3)

17 LNK B No PCIe RP 1; Note(3)

18 LNK C No PCIe RP 2 + SMBus; Note(3)

19 LNK D No PCIe RP 3 + SATA; Note(3)

20 LNK E No Onboard LAN;Note(3)

21 LNK F No Note(3)

22 LNK G No PCH HDA;Note(3)

23 LNK H No USB EHCI#1

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available for other device. (2) Not available if ACPI is used (3) ACPI OS decides on particular IRQ usage (4) Depends on system configuration (onboard COM Port support and external SIO presence)

COMe-cHL6 / System Resources

5.2 Memory Area

The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special textbooks for infor- mation about HIMEM.SYS and EMM386.EXE. Other operating systems (Linux or Windows versions) allow you to address the full memory area directly.

Upper Memory Used for Available Comment

A0000h – BFFFFh VGA Memory No Mainly used by graphic controller

D0000h – DFFFFh - Yes Free for shadow RAM in standard

configurations.

E0000h – FFFFFh System BIOS No Fixed

E0000000h–FEAFFFFFh PCIe/IGFX No Fixed

FEC00000 - FECFFFFF IOAPIC/PCIe No Fixed

FED00000h-FED003FFh HPET No Fixed

FED10000h-FED17FFFh MCH No Fixed

FED18000h-FED18FFFh DMI No Fixed

FED19000h-FED19FFFh EPBA No Fixed

FED1C000h-FED1FFFFh RCBA No Fixed

FED20000h FED3FFFFh TXT No Fixed

FED40000h FED44FFFh TPM No Fixed

FED45000h FED8FFFFh TPM No Fixed

FED90000h-FED93FFFh VT-d No Fixed

FEE00000h-FEEFFFFFh MSI area No Fixed

FF000000h-FFFFFFFFh BIOS Flash No Fixed

5.3 I/O Address Map

The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for compatibility reasons, even if available.

I/O Address Used for Available Comment

0000 - 001F System Ressources No Fixed

0020 - 002D Interrupt Controller No Fixed

002E - 002F LPC SIO No Fixed

0030 - 003D Interrupt Controller No Fixed

0040 - 0042 Timer, Counter No Fixed

0043 Reserved No Fixed

004E - 004F LPC SIO No Fixed

0050 - 0052 Timer, Counter No Fixed

0053 Reserved No Fixed

0060 - 006F Micro-, NMI controller No Fixed

0070 Reserved No Fixed

0071 - 0077 RTC Controller No Fixed

0080 BIOS Postcode No Fixed

0081 - 009F Reserved No Fixed

00A0 - 00BD Interrupt Controller No Fixed

00C0 - 00DF Reserved No Fixed

00F0 Interrupt Controller No Fixed

0170 - 01F7 Sata Controller No Fixed

0200 - 020F Game Port (LPC) No Fixed

0376 Sata Controller No Fixed

03F6 Sata Controller No Fixed

04D0 - 04D1 Interrupt Controller No Fixed

0CF9 Reset Generator No Fixed

0A00 - 0A0F LPC Yes Routed to LPC

0A80 - 0A8F CPLD No Fixed

0A90 - 0AFF LPC Yes Routed to LPC

0CF8 - 0CFF Chipset No Fixed

1000 - 13FF Chipset, GPIO No Fixed

COMe-cHL6 / System Resources

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

PCI Device B:D:F PCI IRQ Interface Comment

Host Bridge 0:0:0 LNK A internal Chipset

Video Controller 0:2:0 LNK A internal Chipset

SA Audio 0:3:0 LNK A internal Chipset

XHCI 0:20:0 LNK A internal Chipset

ME 0:22:0 LNK A internal Chipset

GbE 0:25:0 LNK E internal Chipset

EHCI2 0:26:0 LNK A internal Chipset

PCH HDA 0:27:0 LNK G PCIe Chipset

PCIe Port 0 0:28:0 LNK A internal Chipset

PCIe Port 0 Slot - A/B/C/D PCIe Port 0

PCIe Port 1 0:28:1 LNK A internal Chipset

PCIe Port 1 Slot - B/C/D/A PCIe Port 1

PCIe Port 2 0:28:2 LNK A internal Chipset

PCIe Port 2 Slot - C/D/A/B PCIe Port 2

PCIe Port 3 0:28:3 LNK A internal Chipset

PCIe Port 3 Slot - D/A/B/A PCIe Por t 3

PCIe Port 4 0:28:4 LNK A internal Chipset

PCIe Port 4 Slot - A/B/C/D PCIe Port 4

EHCI1 0:29:0 LNK H internal Chipset

LPC Bridge 0:31:0 LNK F internal Chipset

SATA 0:31:2 LNK D internal Chipset

SMBus 0:31:3 LNK C internal Chipset

5.5 Internal I2C Bus

8-bit Address 7-bit Address Used For Available Comment

58h 0x2C S5 Eco No S5 Eco Resistor

A0h 0x50 JILI-EEPROM No external LVDS EEPROM for JILI

Data

C0h 0x60 LVDS bridge No DP to LVDS Bridge

5.6 External I2C Bus

8-bit Address 7-bit Address Used For Available Comment

A0h 0x50 JIDA-EEPROM No Module EEPROM

AEh 0x57 FRU-EEPROM No Recommended for Baseboard

EEPROM

COMe-cHL6 / System Resources

5.7 System Management (SM) Bus

The 8-bit SMBus addresses uses the LSB (Bit 0) for the direction. Bit0 = 0 defines the write address, Bit0 = 1 defines the read address for the device. The 8-bit addresses listed below shows the write adress for all devices. 7-bit SMBus adresses shows the device address without Bit0.

8-bit Address 7-bit Address Device Comment SMBus

12h 0x09 SMART_CHARGER Not to be used with any SM bus device except a charger SMB

14h 0x0A SMART_SELECTOR Not to be used with any SM bus device except a selector or manager SMB

16h 0x0B SMART_BATTERY Not to be used with any SM bus device except a battery SMB

30h 0x18 DDR3 Thermal Sensor Chan. A Do not use under any circumstances SMB

34h 0x1A DDR3 Thermal Sensor Chan. B Do not use under any circumst ances SMB

5Ch 0x2C Hardware Monitor Do not use under any circumstances SMB

A0h 0x50 DDR3 channel A SPD Do not use under any circumstances SMB

A4h 0x52 DDR3 channel B SPD Do not use under any circumst ances SMB

C8h 0x64 Ethernet I218-LM Do not use under any circumstances SML0

A JIDA Bus No. like in former Modules cannot be provided because the EAPI driver implementation enumerates the I2C busses dynamically. Please follow the initialisation process like it is provided in the EAPI specification.

COMe-cHL6 / Connectors

6 Connectors

The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express™ Specification and COM Express™ Design Guide for detailed, design-level information.

6.1 Connector Location

COMe-cHL6 / Pinout List

7 Pinout List

7.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

Output Analog

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

Pull-Up Resistor

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950

COMe-cHL6 / Pinout List

7.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND Power Ground PWR - -

A2 GBE0_MDI3- GBE0_MDI3_N / Ethernet Receive Data - DP-I - -

A3 GBE0_MDI3+ GBE0_MDI3_P / Ethernet Receive Data - DP-I - -

A4 GBE0_LINK100# GBE0_LINK100# / Ethernet Speed LED O-3.3 - -

A5 GBE0_LINK1000# GBE0_LINK1000# / Ethernet Speed LED O-3.3 - -

A6 GBE0_MDI2- GBE0_MDI2_N / Ethernet Receive Data - DP-I - -

A7 GBE0_MDI2+ GBE0_MDI2_P / Ethernet Receive Data - DP-I - -

A8 GBE0_LINK# GBE0_LINK# / LAN Link LED OD - -

A9 GBE0_MDI1- GBE0_MDI1_N / Ethernet Receive Data - DP-I - -

A10 GBE0_MDI1+ GBE0_MDI1_P / Ethernet Receive Data + DP-I - -

A11 GND Power Ground PWR - -

A12 GBE0_MDI0- GBE0_MDI0_N / Ethernet Transmit Data - DP-O - -

A13 GBE0_MDI0+ GBE0_MDI0_P / Ethernet Transmit Data + DP-O - -

A14 GBE0_CTREF GBE0_CTREF O-1,8 - n. c. on module, because not needed

A15 SUS_S3# PM_SLP_S3_EXT# O-3.3 PD 10k -

A16 SATA0_TX+ SATA_TX0_P / SATA 0 Transmit Data + DP-O - -

A17 SATA0_TX- SATA_TX0_N / SATA 0 Transmit Data - DP-O - -

A18 SUS_S4# PM_SLP_S4# O-3.3 - -

A19 SATA0_RX+ SATA_RX0_P / SATA 0 Receive Data + DP-I - -

A20 SATA0_RX- SATA_RX0_N / SATA 0 Receive Data - DP-I - -

A21 GND Power Ground PWR - -

A22 SATA2_TX+ SATA_TX2_P / SATA 2 Transmit Data + DP-O - -

A23 SATA2_TX- SATA_TX2_N / SATA 2 Transmit Data - DP-O - -

A24 SUS_S5# PM_SLP_S5# O-3.3 - -

A25 SATA2_RX+ SATA_RX2_P / SATA 2 Receive Data + DP-I - -

A26 SATA2_RX- SATA_RX2_N / SATA 2 Receive Data - DP-I - -

A27 BATLOW# PM_BATLOW# / Battery Low I-3.3 PU 10k 3.3V (S5) -

A28 ATA_ACT# ATA_LED# / SATA LED OD-3.3 PU 10k 3.3V (S0) can pull down 6mA max.

A29 AC/HDA_SYNC HDA_SYNC / HD Audio Sync O-3.3 PD 1MEG -

A30 AC/HDA_RST# HDA_RST# / HD Audio Reset O-3.3 - -

A31 GND Power Ground PWR - -

A32 AC/HDA_BITCLK HDA_BITCLK / HD Audio Clock O-3.3 - -

A33 AC/HDA_SDOUT HDA_SDOUT / HD Audio Data O-3.3 - int. PD 20k in PCH

A34 BIOS_DIS0# BIOS_DIS0# I-3.3 PU 10k 3.3V (S5) -

A35 THRMTRIP# EXT_THRMTRIP# O-3.3 PU 10k 3.3V (S0) -

A36 USB6- USB6_N / USB Data – Port6 DP-I/O - int. PD 15k in PCH / 5V tolerant

A37 USB6+ USB6_P / USB Data + Port6 DP-I/O - int. PD 15k in PCH / 5V tolerant

A38 USB_6_7_OC# USB_67_OC# / USB OverCurrent Port 6/7 I-3.3 PU 10k 3.3V (S5) -

A39 USB4- USB4_N / USB Data - Port4 DP-I/O - int. PD 15k in PCH / 5V tolerant

A40 USB4+ USB4_P / USB Data + Port4 DP-I/O - int. PD 15k in PCH / 5V tolerant

A41 GND Power Ground PWR - -

A42 USB2- USB2_N / USB Data - Port2 DP-I/O - int. PD 15k in PCH / 5V tolerant

A43 USB2+ USB2_P / USB Data + Port2 DP-I/O - int. PD 15k in PCH / 5V tolerant

A44 USB_2_3_OC# USB_23_OC# / USB OverCurrent Port 2/3 I-3.3 PU 10k 3.3V (S5) -

A45 USB0- USB0_N / USB Data - Port0 DP-I/O - int. PD 15k in PCH / 5V tolerant

A46 USB0+ USB0_P / USB Data + Port0 DP-I/O - int. PD 15k in PCH / 5V tolerant

A47 VCC_RTC V_BAT PWR 3V - -

A48 EXCD0_PERST# EXCD0_PERST#/Express card reset O-3.3 - -

A49 EXCD0_CPPE# EXCD0_CPPE#/ capable c. request I-3.3 PU 10k 3.3V (S0) -

A50 LPC_SERIRQ LPC_SERIRQ / Ser ial Interrupt Request I/O-3.3 PU 8k2 3.3V (S0) -

A51 GND Power Ground PWR - -

A52 PCIE_TX5+ PCI Express lane 5 + Transmit DP-O - -

A53 PCIE_TX5- PCI Express lane 5 - Transmit DP-O - -

A54 GPI0 EXT_GPI0 / General Purpose Input 0 I-3.3 PU 10k 3.3V (S0) -

A55 PCIE_TX4+ PCI Express lane 4 + Transmit DP-O - -

A56 PCIE_TX4- PCI Express lane 4 - Transmit DP-O - -

A57 GND Power Ground PWR - -

A58 PCIE_TX3+ PCI Express lane 3 + Transmit DP-O - -

A59 PCIE_TX3- PCI Express lane 3 - Transmit DP-O - -

A60 GND Power Ground PWR - -

A61 PCIE_TX2+ PCI Express lane 2 + Transmit DP-O - -

A62 PCIE_TX2- PCI Express lane 2 - Transmit DP-O - -

A63 GPI1 EXT_GPI1 / General Purpose Input 1 I-3.3 PU 10k 3.3V (S0) -

A64 PCIE_TX1+ PCI Express lane 1 + Transmit DP-O - -

COMe-cHL6 / Pinout List

A65 PCIE_TX1- PCI Express lane 1 - Transmit DP-O - -

A66 GND Power Ground PWR - -

A67 GPI2 EXT_GPI2 / General Purpose Input 2 I-3.3 PU 10k 3.3V (S0) -

A68 PCIE_TX0+ PCI Express lane 0 + Transmit DP-O - -

A69 PCIE_TX0- PCI Express lane 0 - Transmit DP-O - -

A70 GND Power Ground PWR - -

A71 LVDS_A0+/eDP_TX2+ LVDS_A_DATA0_P / eDP_TX2_P DP-O - -

A72 LVDS_A0-/eDP_TX2- LVDS_A_DATA0_N / eDP_TX2_N DP-O - -

A73 LVDS_A1+/eDP_TX1+ LVDS_A_DATA1_P / eDP_TX1_P DP-O - -

A74 LVDS_A1-/eDP_TX1- LVDS_A_DATA1_N / eDP_TX1_N DP-O - -

A75 LVDS_A2+/eDP_TX0+ LVDS_A_DATA2_P / eDP_TX0_P DP-O - -

A76 LVDS_A2-/eDP_TX0- LVDS_A_DATA2_N / eDP_TX0_N DP-O - -

A77 LVDS/eDP_VDD_EN LVDS/eDP_VDD_EN / LVDS/eDP Panel Power

Control

O-3.3 PD 100k -

A78 LVDS_A3+ LVDS_A_DATA3_P / LVDS Channel A Data3+ DP-O - -

A79 LVDS_A3- LVDS_A_DATA3_N / LVDS Channel A Data3- DP-O - -

A80 GND Power Ground PWR - -

A81 LVDS_A_CK+/eDP_TX3+ LVDS_A_CLK_P / eDP_TX3_P / LVDS Ch A Clock+ DP-O - -

A82 LVDS_A_CK-/eDP_TX3- LVDS_A_CLK_N / eDP_TX3_N / LVDS Ch A Clock- DP-O - -

A83 LVDS_I2C_CK/eDP_AUX+ LVDS_DDC_CLK / eDP_AUX_P / LVDS I2C Clock I/O-3.3 PU 2k21 3.3V (S0) -

A84 LVDS_I2C_DAT/eDP_AUX- LVDS_DDC_DATA / eDP_AUX_N / LVDS I2C Data I/O-3.3 PU 2k21 3.3V (S0) -

A85 GPI3 EXT_GPI3 / General Purpose Input 3 I-3.3 PU 10k 3.3V (S0) strapping function (if pulled low till release of

CB_RESET#, LVDS is disabled to enable eDP)

A86 RSVD n.c. Nc - -

A87 RSVD/eDP_HPD n.c. / eDP Hot Plug Detect DP-0 - -

A88 PCIE_CLK_REF+ CLK_PCIE_REF_P / PCIE Reference Clock DP-O - -

A89 PCIE_CLK_REF- CLK_PCIE_REF_N / PCIE Reference Clock DP-O - -

A90 GND Power Ground PWR - -

A91 SPI_POWER V3.3_SPI_POWER O-3.3 - power supply pin for external SPI flash

A92 SPI_MISO SPI_SO / SPI slave output I-3.3 - int. PU 20k in PCH

A93 GPO0 EXT_GPO0 / General Purpose Output 0 O-3.3 PD 10k -

A94 SPI_CLK SPI_CLK / SPI clock O-3.3 - -

A95 SPI_MOSI SPI_SI / SPI slave input O-3.3 - int. PD 20k in PCH

A96 TPM_PP TPM Physical Presence I-3.3 PD 100k -

A97 TYPE10# n.c. for type 2 module Nc - -

A98 SER0_TX serial port 0 TXD O-3.3 - -

A99 SER0_RX serial port 0 RXD I-3.3 PU 47K 3.3V (S0) -

A100 GND Power Ground PWR - -

A101 SER1_TX serial port 1 TXD O-3.3 - -

A102 SER1_RX serial port 1 RXD I-3.3 PU 47K 3.3V (S0) -

A103 LID# LID switch input I-3.3 PU 10K 3.3V (S5) -

A104 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A105 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A106 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A107 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A108 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A109 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

A110 GND Power Ground PWR - -

COMe-cHL6 / Pinout List

7.3 Connector X1A Row B

Pin Signal Description Type Termination Comment

B1 GND Power Ground PWR - -

B2 GBE0_ACT# GBE0_ACT# / Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC_FRAME# / LPC Frame Indicator O-3.3 - -

B4 LPC_AD0 LPC_AD0 / LPC Adress & DATA Bus I/O-3.3 - int. PU 20k in PCH

B5 LPC_AD1 LPC_AD1 / LPC Adress & DATA Bus I/O-3.3 - int. PU 20k in PCH

B6 LPC_AD2 LPC_AD2 / LPC Adress & DATA Bus I/O-3.3 - int. PU 20k in PCH

B7 LPC_AD3 LPC_AD3 / LPC Adress & DATA Bus I/O-3.3 - int. PU 20k in PCH

B8 LPC_DRQ0# LPC_DRQ#0 / LPC Request 0 I-3.3 PU 2k 3.3V (S0) int. PU 20k in PCH

B9 LPC_DRQ1# LPC_DRQ#1 / LPC Request 1 I-3.3 PU 2k 3.3V (S0) int. PU 20k in PCH

B10 LPC_CLK CLK_LPC_33M_EXT /33MHz LPC clock O-3.3 - -

B11 GND Power Ground PWR - -

B12 PWRBTN# EXT_PWRBTN# / Power Button I-3.3 PU 10k 3.3V (S5eco) -

B13 SMB_CK SMB_CLK_EXT / SMBUS Clock O-3.3 PU 3k3 3.3V (S5) -

B14 SMB_DAT SMB_DATA_EXT / SMBUS Data I/O-3.3 PU 3k3 3.3V (S5) -

B15 SMB_ALERT# SMB_ALERT# / SMBUS Interrupt I/O-3.3 PU 1k0 3.3V (S5) -

B16 SATA1_TX+ SATA_TX1_P / SATA 1 Transmit Data + DP-O - -

B17 SATA1_TX- SATA_TX1_N / SATA 1 Transmit Data - DP-O - -

B18 SUS_STAT# PM_SUS_ STAT# O-3.3 - -

B19 SATA1_RX+ SATA_RX1_P / SATA 1 Receive Data + DP-I - -

B20 SATA1_RX- SATA_RX1_N / SATA 1 Receive Data - DP-I - -

B21 GND Power Ground PWR - -

B22 SATA3_TX+ SATA_TX3_P / SATA 3 Transmit Data + DP-O - -

B23 SATA3_TX- SATA_TX3_N / SATA 3 Transmit Data - DP-O - -

B24 PWR_OK EXT_PWR_OK / Power OK I-3.3 PU 511k 3.3V (S5) pullup voltage depends on ATX or single

supply mode / 5V tolerant

B25 SATA3_RX+ SATA_RX3_P / SATA 3 Receive Data + DP-I - -

B26 SATA3_RX- SATA_RX3_N / SATA 3 Receive Data - DP-I - -

B27 WDT WDT / Watch Dog Timer O-3.3 - -

B28 AC/HDA_SDIN2 HDA_SDIN2_ICH/ HD Audio Serial Input Data 2 I-3.3 - int. PD 20k in PCH

B29 AC/HDA_SDIN1 HDA_SDIN1_ICH/ HD Audio Serial Input Data 1 I-3.3 - int. PD 20k in PCH

B30 AC/HDA_SDIN0 HDA_SDIN0_ICH/ HD Audio Serial Input Data 0 I-3.3 - int. PD 20k in PCH

B31 GND Power Ground PWR - -

B32 SPKR HDA_SPKR / Speaker O-3.3 - int. PD 20k in PCH

B33 I2C_CK I2C_CLK_EXT / I2C clock O-3.3 PU 2k21 3.3V (S5) -

B34 I2C_DAT I2C_DATA_EXT / I2C data I/O-3.3 PU 2k21 3.3V (S5) -

B35 THRM# PM_THRM# / Over Temperature I-3.3 PU 10k 3.3V (S0) -

B36 USB7- USB7_N / USB Data – Port7 DP-I/O - int. PD 15k in PCH / 5V tolerant

B37 USB7+ USB7_P / USB Data + Port7 DP-I/O - int. PD 15k in PCH / 5V tolerant

B38 USB_4_5_OC# USB_45_OC# / USB OverCurrent Port 4/5 I-3.3 PU 10k 3.3V (S5) -

B39 USB5- USB5_N / USB Data – Port5 DP-I/O - int. PD 15k in PCH / 5V tolerant

B40 USB5+ USB5_P / USB Data + Port5 DP-I/O - int. PD 15k in PCH / 5V tolerant

B41 GND Power Ground PWR - -

B42 USB3- USB3_N / USB Data – Port3 DP-I/O - int. PD 15k in PCH / 5V tolerant

B43 USB3+ USB3_P / USB Data + Port3 DP-I/O - int. PD 15k in PCH / 5V tolerant

B44 USB_0_1_OC# USB_01_OC# / USB OverCurrent Port 0/1 I-3.3 PU 10k 3.3V (S5) -

B45 USB1- USB1_N / USB Data – Port1 DP-I/O - int. PD 15k in PCH / 5V tolerant

B46 USB1+ USB1_P / USB Data + Port1 DP-I/O - int. PD 15k in PCH / 5V tolerant

B47 EXCD1_PERST# EXCD1_PERST# / Express card reset O-3.3 - -

B48 EXCD1_CPPE# EXCD1_CPPE# / capable c. request I-3.3 PU 10k 3.3V (S0) -

B49 SYS_RESET# EXT_SYS_RESET# / Reset Input I-3.3 PU 10k 3.3V (S5) -

B50 CB_RESET# CB_RESET# / Carrier board Reset O-3.3 PU 10k 3.3V (S5) -

B51 GND Power Ground PWR - -

B52 PCIE_RX5+ PCI Express lane 5 + receive DP-I - -

B53 PCIE_RX5- PCI Express lane 5 - receive DP-I - -

B54 GPO1 EXT_GPO1 / General Purpose Output 1 O-3.3 PD 10k -

B55 PCIE_RX4+ PCI Express lane 4 + receive DP-I - -

B56 PCIE_RX4- PCI Express lane 4 - receive DP-I - -

B57 GPO2 EXT_GPO2 / General Purpose Output 2 O-3.3 PD 10k -

B58 PCIE_RX3+ PCI Express lane 3 + receive DP-I - -

B59 PCIE_RX3- PCI Express lane 3 - receive DP-I - -

B60 GND Power Ground PWR - -

B61 PCIE_RX2+ PCI Express lane 2 + receive DP-I - -

B62 PCIE_RX2- PCI Express lane 2 - receive DP-I - -

B63 GPO3 EXT_GPO3 / General Purpose Output 3 O-3.3 PD 10k -

COMe-cHL6 / Pinout List

B64 PCIE_RX1+ PCI Express lane 1 + receive DP-I - -

B65 PCIE_RX1- PCI Express lane 1 - receive DP-I - -

B66 WAKE0# PCIE_WAKE# I/O-3.3 PU 1k2 3.3V (S5) -

B67 WAKE1# WAKE1# I-3.3 PU 10k 3.3V (S5) -

B68 PCIE_RX0+ PCI Express lane 0 + receive DP-I - -

B69 PCIE_RX0- PCI Express lane 0 - receive DP-I - -

B70 GND Power Ground PWR - -

B71 LVDS_B0+ LVDS_B_DATA0_P / LVDS Channel B Data0+ DP-O - -

B72 LVDS_B0- LVDS_B_DATA0_N / LVDS Channel B Data0- DP-O - -

B73 LVDS_B1+ LVDS_B_DATA1_P / LVDS Channel B Data1+ DP-O - -

B74 LVDS_B1- LVDS_B_DATA1_N / LVDS Channel B Data1- DP-O - -

B75 LVDS_B2+ LVDS_B_DATA2_P/ LVDS Channel B Data2+ DP-O - -

B76 LVDS_B2- LVDS_B_DATA2_N / LVDS Channel B Data2 - DP-O - -

B77 LVDS_B3+ LVDS_B_DATA3_P / LVDS Channel B Data3+ DP-O - -

B78 LVDS_B3- LVDS_B_DATA3_N / LVDS Channel B Data3- DP-O - -

B79 LVDS/eDP_BKLT_EN LVDS_eDP_BKLT_EN / Panel Backlight ON O-3.3 PD 100k -

B80 GND Power Ground PWR - -

B81 LVDS_B_CK+ LVDS_B_CLK_P / LVDS Channel B Clock+ DP-O - -

B82 LVDS_B_CK- LVDS_B_CLK_N / LVDS Channel B Clock- DP-O - -

B83 LVDS/eDP_BKLT_CTRL LVDS_eDP_BKLT_CTRL / Backlight Brightness Contr. O-3.3 - -

B84 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - optional (not neccessary in single supply

mode)

B85 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - optional (not neccessary in single supply

mode)

B86 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - optional (not neccessary in single supply

mode)

B87 VCC_5V_SBY +V_STBY_ETX / 5V Standby PWR 5V (S5) - optional (not neccessary in single supply

mode)

B88 BIOS_DIS1# BIOS_DIS1# I-3.3 PU 10k 3.3V (S5) -

B89 VGA_RED CRT_RED / Analog Video RGB-RED OA PD 150R not available on Haswell ULT

B90 GND Power Ground PWR - -

B91 VGA_GRN CRT_GREEN / Analog Video RGB-GREEN OA PD 150R not available on Haswell ULT

B92 VGA_BLU CRT_BLUE / Analog Video RGB-BLUE OA PD 150R not available on Haswell ULT

B93 VGA_HSYNC CRT_HSYNC / Analog Video H-Sync O-3.3 - not available on Haswell ULT

B94 VGA_VSYNC CRT_VSYNC / Analog Video V-Sync O-3.3 - not available on Haswell ULT

B95 VGA_I2C_CK CRT_DDC_CLK / Display Data Channel Clock I/O-3.3 PU 1k1 3.3V (S0) not available on Haswell ULT

B96 VGA_I2C_DAT CRT_DDC_DATA / Display Data Channel Data I/O-3.3 PU 1k1 3.3V (S0) not available on Haswell ULT

B97 SPI_CS# SPI_CS# / SPI chip select O-3.3 - -

B98 RSVD n. c. nc - -

B99 RSVD n. c. nc - -

B100 GND Power Ground PWR - -

B101 FAN_PWMOUT Fan PWM Output O-3.3 - -

B102 FAN_TACHIN Fan Tach Input I-3.3 PU 10K 3.3V (S0) -

B103 SLEEP# Sleep Button Input I-3.3 PU 10K 3.3V (S5) -

B104 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B105 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B106 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B107 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B108 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B109 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

B110 GND Power Ground PWR - -

COMe-cHL6 / Pinout List

7.4 Connector X1B Row C

Pin Signal Description Type Termination Comment

C1 GND Power Ground PWR - -

C2 GND Power Ground PWR - -

C3 USB_SSRX0- USB Super Speed Receive - (0) DP-I - -

C4 USB_SSRX0+ USB Super Speed Receive + (0) DP-I - -

C5 GND Power Ground PWR - -

C6 USB_SSRX1- USB Super Speed Receive - (1) DP-I - -

C7 USB_SSRX1+ USB Super Speed Receive + (1) DP-I - -

C8 GND Power Ground PWR - -

C9 USB_SSRX2- USB Super Speed Receive - (2) DP-I - not available on cHL6 module

C10 USB_SSRX2+ USB Super Speed Receive + (2) DP-I - not available on cHL6 module

C11 GND Power Ground PWR - -

C12 USB_SSRX3- USB Super Speed Receive - (3) DP-I - not available on cHL6 module

C13 USB_SSRX3+ USB Super Speed Receive + (3) DP-I - not available on cHL6 module

C14 GND Power Ground PWR - -

C15 DDI1_PAIR6+ DDI1 Pair 6 + DP-I - not available on cHL6 module

C16 DDI1_PAIR6- DDI1 Pair 6 + DP-I - not available on cHL6 module

C17 RSVD n.c. Nc - -

C18 RSVD n.c. Nc - -

C19 PCIE_RX6+ PCI Express lane 6 + receive DP-I - not available on cHL6 module

C20 PCIE_RX6- PCI Express lane 6 - receive DP-I - not available on cHL6 module

C21 GND Power Ground PWR - -

C22 PCIE_RX7+ opt. PCI Express lane 7 + Receive DP-I - -

C23 PCIE_RX7- opt. PCI Express lane 7 - Receive DP-I - -

C24 DDI1_HPD DDI1 Hotplug Detect I-3.3 PD 100k -

C25 DDI1_PAIR4+ DDI1 Pair 4 + DP-I - not available on cHL6 module

C26 DDI1_PAIR4- DDI1 Pair 4 - DP-I - not available on cHL6 module

C27 RSVD n.c. Nc - -

C28 RSVD n.c. Nc - -

C29 DDI1_PAIR5+ DDI1 Pair 5 + DP-I - not available on cHL6 module

C30 DDI1_PAIR5- DDI1 Pair 5 - DP-I - not available on cHL6 module

C31 GND Power Ground PWR - -

C32 DDI2_CTRLCLK_AUX+ DDI2 CTRLCLK/AUX+ I/O-3.3 PD 100k -

C33 DDI2_CTRLDATA_AUX- DDI2 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3 (S0) -

C34 DDI2_DDC_AUX_SEL DDI2 DDC/AUX select I-3.3 PD 1M -

C35 RSVD n.c. Nc - -

C36 DDI3_CTRLCLK_AUX+ DDI3 CTRLCLK/AUX+ I/O-3.3 - not available on cHL6 module

C37 DDI3_CTRLDATA_AUX- DDI3 CTRLDATA/AUX- I/O-3.3 - not available on cHL6 module

C38 DDI3_DDC_AUX_SEL DDI3 DDC/AUX select I-3.3 - not available on cHL6 module

C39 DDI3_PAIR0+ DDI3 Pair 0 + DP-O - not available on cHL6 module

C40 DDI3_PAIR0- DDI3 Pair 0 - DP-O - not available on cHL6 module

C41 GND Power Ground PWR - -

C42 DDI3_PAIR1+ DDI3 Pair 1 + DP-O - not available on cHL6 module

C43 DDI3_PAIR1- DDI3 Pair 1 - DP-O - not available on cHL6 module

C44 DDI3_HPD DDI3 Hotplug Detect I-3.3 - not available on cHL6 module

C45 RSVD n.c. Nc - -

C46 DDI3_PAIR2+ DDI3 Pair 2 + DP-O - not available on cHL6 module

C47 DDI3_PAIR2- DDI3 Pair 2 - DP-O - not available on cHL6 module

C48 RSVD n.c. Nc - -

C49 DDI3_PAIR3+ DDI3 Pair 3 + DP-O - not available on cHL6 module

C50 DDI3_PAIR3- DDI3 Pair 3 - DP-O - not available on cHL6 module

C51 GND Power Ground PWR - -

C52 PEG_RX0+ PCIexpress Graphics receive + (0) DP-I - not available on cHL6 module

C53 PEG_RX0- PCIexpress Graphics receive - (0) DP-I - not available on cHL6 module

C54 TYPE0# n.c. for type 6 module nc - -

C55 PEG_RX1+ PCIexpress Graphics receive + (1) DP-I - not available on cHL6 module

C56 PEG_RX1- PCIexpress Graphics receive - (1) DP-I - not available on cHL6 module

C57 TYPE1# n.c. for type 6 module nc - -

C58 PEG_RX2+ PCIexpress Graphics receive + (2) DP-I - not available on cHL6 module

C59 PEG_RX2- PCIexpress Graphics receive - (2) DP-I - not available on cHL6 module

C60 GND Power Ground PWR - -

C61 PEG_RX3+ PCIexpress Graphics receive + (3) DP-I - not available on cHL6 module

C62 PEG_RX3- PCIexpress Graphics receive - (3) DP-I - not available on cHL6 module

C63 RSVD n.c. nc - -

C64 RSVD n.c. nc - -

COMe-cHL6 / Pinout List

C65 PEG_RX4+ PCIexpress Graphics receive + (4) DP-I - not available on cHL6 module

C66 PEG_RX4- PCIexpress Graphics receive - (4) DP-I - not available on cHL6 module

C67 RSVD n.c. nc - -

C68 PEG_RX5+ PCIexpress Graphics receive + (5) DP-I - not available on cHL6 module

C69 PEG_RX5- PCIexpress Graphics receive - (5) DP-I - not available on cHL6 module

C70 GND Power Ground PWR - -

C71 PEG_RX6+ PCIexpress Graphics receive + (6) DP-I - not available on cHL6 module

C72 PEG_RX6- PCIexpress Graphics receive - (6) DP-I - not available on cHL6 module

C73 GND Power Ground PWR - -

C74 PEG_RX7+ PCIexpress Graphics receive + (7) DP-I - not available on cHL6 module

C75 PEG_RX7- PCIexpress Graphics receive - (7) DP-I - not available on cHL6 module

C76 GND Power Ground PWR - -

C77 RSVD n.c. nc - -

C78 PEG_RX8+ PCIexpress Graphics receive + (8) DP-I - not available on cHL6 module

C79 PEG_RX8- PCIexpress Graphics receive - (8) DP-I - not available on cHL6 module

C80 GND Power Ground PWR - -

C81 PEG_RX9+ PCIexpress Graphics receive + (9) DP-I - not available on cHL6 module

C82 PEG_RX9- PCIexpress Graphics receive - (9) DP-I - not available on cHL6 module

C83 RSVD n.c. nc - -

C84 GND Power Ground PWR - -

C85 PEG_RX10+ PCIexpress Graphics receive + (10) DP-I - not available on cHL6 module

C86 PEG_RX10- PCIexpress Graphics receive - (10) DP-I - not available on cHL6 module

C87 GND Power Ground PWR - -

C88 PEG_RX11+ PCIexpress Graphics receive + (11) DP-I - not available on cHL6 module

C89 PEG_RX11- PCIexpress Graphics receive – (11) DP-I - not available on cHL6 module

C90 GND Power Ground PWR - -

C91 PEG_RX12+ PCIexpress Graphics receive + (12) DP-I - not available on cHL6 module

C92 PEG_RX12- PCIexpress Graphics receive - (12) DP-I - not available on cHL6 module

C93 GND Power Ground PWR - -

C94 PEG_RX13+ PCIexpress Graphics receive + (13) DP-I - not available on cHL6 module

C95 PEG_RX13- PCIexpress Graphics receive - (13) DP-I - not available on cHL6 module

C96 GND Power Ground PWR - -

C97 RSVD n.c. nc - -

C98 PEG_RX14+ PCIexpress Graphics receive + (14) DP-I - not available on cHL6 module

C99 PEG_RX14- PCIexpress Graphics receive - (14) DP-I - not available on cHL6 module

C100 GND Power Ground PWR - -

C101 PEG_RX15+ PCIexpress Graphics receive + (15) DP-I - not available on cHL6 module

C102 PEG_RX15- PCIexpress Graphics receive - (15) DP-I - not available on cHL6 module

C103 GND Power Ground PWR - -

C104 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C105 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C106 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C107 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C108 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C109 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

C110 GND Power Ground PWR - -

COMe-cHL6 / Pinout List

7.5 Connector X1B Row D

Pin Signal Descr iption Type Termination Comment

D1 GND Power Ground PWR - -

D2 GND Power Ground PWR - -

D3 USB_SSTX0- USB Super Speed Transmit - (0) DP-O - -

D4 USB_SSTX0+ USB Super Speed Transmit + (0) DP-O - -

D5 GND Power Ground PWR - -

D6 USB_SSTX1- USB Super Speed Transmit - (1) DP-O - -

D7 USB_SSTX1+ USB Super Speed Transmit + (1) DP-O - -

D8 GND Power Ground PWR - -

D9 USB_SSTX2- USB Super Speed Transmit - (2) DP-O - not available on cHL6 module

D10 USB_SSTX2+ USB Super Speed Transmit - (2) DP-O - not available on cHL6 module

D11 GND Power Ground PWR - -

D12 USB_SSTX3- USB Super Speed Transmit - (3) DP-O - not available on cHL6 module

D13 USB_SSTX3+ USB Super Speed Transmit - (3) DP-O - not available on cHL6 module

D14 GND Power Ground PWR - -

D15 DDI1_CTRLCLK_AUX+ DDI1 CTRLCLK/AUX+ I/O-3.3 PD 100k -

D16 DDI1_CTRLDATA_AUX- DDI1 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3 (S0) -

D17 RSVD n.c. Nc - -

D18 RSVD n.c. Nc - -

D19 PCIE_TX6+ PCI Express lane 6 + Transmit DP-O - -

D20 PCIE_TX6- PCI Express lane 6 - Transmit DP-O - -

D21 GND Power Ground PWR - -

D22 PCIE_TX7+ opt. PCI Express lane 7 + Transmit DP-O - -

D23 PCIE_TX7- opt. PCI Express lane 7 - Transmit DP-O - -

D24 RSVD n.c. Nc - -

D25 RSVD n.c. Nc - -

D26 DDI1_PAIR0+ DDI1 Pair 0 + DP-O - -

D27 DDI1_PAIR0- DDI1 Pair 0 - DP-O - -

D28 RSVD n.c. Nc - -

D29 DDI1_PAIR1+ DDI1 Pair 1 + DP-O - -

D30 DDI1_PAIR1- DDI1 Pair 1 - DP-O - -

D31 GND Power Ground PWR - -

D32 DDI1_PAIR2+ DDI1 Pair 2 + DP-O - -

D33 DDI1_PAIR2- DDI1 Pair 2 - DP-O - -

D34 DDI1_DDC_AUX_SEL DDI1 DDC/AUX select I-3.3 PD 1M -

D35 RSVD n.c. Nc - -

D36 DDI1_PAIR3+ DDI1 Pair 3 + DP-O - -

D37 DDI1_PAIR3- DDI1 Pair 3 - DP-O - -

D38 RSVD n.c. Nc - -

D39 DDI2_PAIR0+ DDI2 Pair 0 + DP-O - -

D40 DDI2_PAIR0- DDI2 Pair 0 - DP-O - -

D41 GND Power Ground PWR - -

D42 DDI2_PAIR1+ DDI2 Pair 1 + DP-O - -

D43 DDI2_PAIR1- DDI2 Pair 1 - DP-O - -

D44 DDI2_HPD DDI2 Hotplug Detect I-3.3 PD 100k -

D45 RSVD n.c. Nc - -

D46 DDI2_PAIR2+ DDI2 Pair 2 + DP-O - -

D47 DDI2_PAIR2- DDI2 Pair 2 - DP-O - -

D48 RSVD n.c. Nc - -

D49 DDI2_PAIR3+ DDI2 Pair 3 + DP-O - -

D50 DDI2_PAIR3- DDI2 Pair 3 - DP-O - -

D51 GND Power Ground PWR - -

D52 PEG_TX0+ PCIexpress Graphics Transmit + (0) DP-O - not available on cHL6 module

D53 PEG_TX0- PCIexpress Graphics Transmit - (0) DP-O - not available on cHL6 module

D54 PEG_LANE_RV# PCIexpress Graphics Lane Reversal I-3.3 - not available on cHL6 module

D55 PEG_TX1+ PCIexpress Graphics Transmit + (1) DP-O - not available on cHL6 module

D56 PEG_TX1- PCIexpress Graphics Transmit - (1) DP-O - not available on cHL6 module

D57 TYPE2# GND for type 6 module O-PWR - -

D58 PEG_TX2+ PCIexpress Graphics Transmit + (2) DP-O - not available on cHL6 module

D59 PEG_TX2- PCIexpress Graphics Transmit - (2) DP-O - not available on cHL6 module

D60 GND Power Ground PWR - -

D61 PEG_TX3+ PCIexpress Graphics Transmit + (3) DP-O - not available on cHL6 module

D62 PEG_TX3- PCIexpress Graphics Transmit - (3) DP-O - not available on cHL6 module

D63 RSVD n.c. Nc - -

D64 RSVD n.c. Nc - -

COMe-cHL6 / Pinout List

D65 PEG_TX4+ PCIexpress Graphics Transmit + (4) DP-O - not available on cHL6 module

D66 PEG_TX4- PCIexpress Graphics Transmit - (4) DP-O - not available on cHL6 module

D67 GND Power Ground PWR - -

D68 PEG_TX5+ PCIexpress Graphics Transmit + (5) DP-O - not available on cHL6 module

D69 PEG_TX5- PCIexpress Graphics Transmit - (5) DP-O - not available on cHL6 module

D70 GND Power Ground PWR - -

D71 PEG_TX6+ PCIexpress Graphics Transmit + (6) DP-O - not available on cHL6 module

D72 PEG_TX6- PCIexpress Graphics Transmit - (6) DP-O - not available on cHL6 module

D73 GND Power Ground PWR - -

D74 PEG_TX7+ PCIexpress Graphics Transmit + (7) DP-O - not available on cHL6 module

D75 PEG_TX7- PCIexpress Graphics Transmit - (7) DP-O - not available on cHL6 module

D76 GND Power Ground PWR - -

D77 RSVD n.c. Nc - -

D78 PEG_TX8+ PCIexpress Graphics Transmit + (8) DP-O - not available on cHL6 module

D79 PEG_TX8- PCIexpress Graphics Transmit - (8) DP-O - not available on cHL6 module

D80 GND Power Ground PWR - -

D81 PEG_TX9+ PCIexpress Graphics Transmit + (9) DP-O - not available on cHL6 module

D82 PEG_TX9- PCIexpress Graphics Transmit - (9) DP-O - not available on cHL6 module

D83 RSVD n.c. Nc - -

D84 GND Power Ground PWR - -

D85 PEG_TX10+ PCIexpress Graphics Transmit + (10) DP-O - not available on cHL6 module

D86 PEG_TX10- PCIexpress Graphics Transmit - (10) DP-O - not available on cHL6 module

D87 GND Power Ground PWR - -

D88 PEG_TX11+ PCIexpress Graphics Transmit + (11) DP-O - not available on cHL6 module

D89 PEG_TX11- PCIexpress Graphics Transmit - (11) DP-O - not available on cHL6 module

D90 GND Power Ground PWR - -

D91 PEG_TX12+ PCIexpress Graphics Transmit + (12) DP-O - not available on cHL6 module

D92 PEG_TX12- PCIexpress Graphics Transmit - (12) DP-O - not available on cHL6 module

D93 GND Power Ground PWR - -

D94 PEG_TX13+ PCIexpress Graphics Transmit + (13) DP-O - not available on cHL6 module

D95 PEG_TX13- PCIexpress Graphics Transmit - (13) DP-O - not available on cHL6 module

D96 GND Power Ground PWR - -

D97 RSVD n.c. Nc - -

D98 PEG_TX14+ PCIexpress Graphics Transmit + (14) DP-O - not available on cHL6 module

D99 PEG_TX14- PCIexpress Graphics Transmit - (14) DP-O - not available on cHL6 module

D100 GND Power Ground PWR - -

D101 PEG_TX15+ PCIexpress Graphics Transmit + (15) DP-O - not available on cHL6 module

D102 PEG_TX15- PCIexpress Graphics Transmit - (15) DP-O - not available on cHL6 module

D103 GND Power Ground PWR - -

D104 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D105 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D106 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D107 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D108 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D109 VCC_12V main input voltage (8.5-20V) PWR 8.5-20V - -

D110 GND Power Ground PWR - -

The termination resistors in these tables are already mounted on the module. Refer to the design guide for information about additional termination resistors.

COMe-cHL6 / BIOS Operation

8 BIOS Operation

The BIOS (Basic Input and Output System) or UEFI (Unified Extensible Firmware Interface) records hardware parameters of the system in the CMOS on the Computer-on-Module. It's major functions include execution of the POST(Power-On-SelfTest) during system start-up, saving system parameters and loading the operating system. The BIOS includes a BIOS Setup programm that allows to modify system configuration settings. The module is equipped with Phoenix SecureCore, which is located in an onboard SPI serial flash memory.

8.1 Determining the BIOS Version

To determine the BIOS version currently used on the Computer-on-Modules please check System Information Page inside Setup

8.2 BIOS Update

Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with detailed change descriptions within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the BIOS Region (usually 4-16MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

8.3 POST Codes

Important POST codes during boot-up

Booted to DOS

Booted to Setup / EFI Shell

Booted to Windows

COMe-cHL6 / BIOS Operation

8.4 Setup Guide

The Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of menus to make changes and turn features on or off.

Functional keystrokes in POST:

[F2]

Enter Setup

[F5]

Boot Menu

[ESC] + [2]

Enter Setup via Remote Keyboard in Console Redirection Mode (depending on console Settings F2 may not be supported)

Functional keystrokes in Setup:

[F1]

Help

[F9]

Load default settings

[F10]

Save and Exit

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select f ields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- or F5/F6 Change Option

<Enter> Execute command or select submenu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓ Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window.

COMe-cHL6 / BIOS Operation

8.5 BIOS Setup

8.5.1 Main

Feature Options Description

System Date [mm/dd/yyyy] Set the Date. Use 'Tab' to switch between Date

elements

System Time [hh:mm:ss] Set the Time. Use 'Tab' to switch between Time

elements

COMe-cHL6 / BIOS Operation

System Information

COMe-cHL6 / BIOS Operation

Boot Features

Feature Options Description

NumLock

On Off

Selects Power-on state for NumLock

Timeout

Number of seconds that P.O.S.T will wait for the user input before booting

CSM Support

Yes No

Enables or Disables the UEFI CSM (Compatibility Support Module)to support legacy PC boot process. Both legacy and UEFI boots are feasible

Quick Boot

Disabled Enabled

Enable or Disable Quick Boot

Dark Boot

Disabled Enabled

Enable or Disable Dark Boot

Diagnostic Splash Screen

Disabled Enabled

Enable or Disable the Diagnostic Splash Screen

Diagnostic Summary Screen

Disabled Enabled

Display the Diagnostic Summary Screen during boot

BIOS Level USB

Enabled Disabled

Enable/Disable all BIOS support for USB in order to reduce boot time. Note that this will prevent using a USB keyboard in setup or a USB biometric scanner such as a fingerpr int reader to control access to setup, but does not prevent the operating system from supporting such hardware

USB Legacy

Enabled Disabled

Enable/Disable USB BIOS SMM support for mouse, keyboard, mass storage, etc, in legacy operating systems such as DOS

Console Redirection

Disabled Enabled

Enable/Disable Universal Console Redirection

- Console Port All Onboard COM1 Onboard COM2 SIO COM1 SIO COM2

Select Port for console redirection. Note: the respective port has to be enabled in setup!

- Terminal Type

ANSI VT100 VT100+ UTF8

Set terminal type of UCR

- Baudrate

9600 19200 38400 57600 115200

Set terminal type of UCR

- Flow Control

None

Set flow control method for UCR. None = No flow

COMe-cHL6 / BIOS Operation

RTS/CTS XON/XOFF

control, RTS/CTS = Hardware flow control, XON/XOFF = Software flow control

- Continue C.R. after POST

Enabled Disabled

Enables Console Redirection after OS has loaded

Allow Hotkey in S4 resume

Enabled Disabled

Enable hotkey detection when system resuming from Hybernate state

UEFI Boot

Enabled Disabled

Enable the UEFI boot

On Shell Exit

Try next Launch Setup\Launch Boot Menu

Select behavior after exit from shell

Legacy Boot

Enabled\Disabled

Enable the Legacy boot

Boot in Legacy Video Mode

Disabled Enabled

Enable to force the display adapter to switch the video mode to Text Mode 3 at the end of BIOS POST for nonUEFI boot mode (Legacy Boot). Some legacy software, such as DUET, requires that the BIOS explicitly enter text video mode prior to boot

Load OPROM

On Demand All

Load all OPROMs or on demand according to the boot device

Boot Priority

UEFI First Legacy First

Select priority of boot option between UEFI and Legacy

COMe-cHL6 / BIOS Operation

Network Stack

Feature Options Description

Network Stack

Enabled Disabled

Enable / Disable UEFI Network Stack

IPv4

Enabled Disabled

Enable / Disable IPv4

UEFI PXE Boot Priority

IPv4 first

Select PXE Boot Priority (IPv4 only)

COMe-cHL6 / BIOS Operation

Platform Information

COMe-cHL6 / BIOS Operation

8.5.2 Advanced

COMe-cHL6 / BIOS Operation

Silicon Information

COMe-cHL6 / BIOS Operation

Processor Configuration

Feature Options Description

Active Processor Cores

All 1 2 3

Number of cores to enable in each processor package

Intel® HT Technology

Enabled Disabled

When Disabled only one thread per enabled core is enabled

CPU Flex Ratio Override

Disabled Enabled

Enable/Disable CPU Flex Ratio Programming. If Disabled, CPU frequency is set to maximum Ratio automatically

- CPU Flex Ratio Settings

This value must be between Max Eff iciency Ratio (LFM / Low Frequency Mode) and Maximum non-turbo ratio set by Hardware (High Frequency Mode). See CPU Featureset in chapter Specifications for possible Bus/Core Ratio Settings. The active nominal CPU frequency is Ratio*100MHz

Enabled XD

Enabled Disabled

Enables/Disables 'Execute Disable functionality', also known as Data Execution Prevention DEP

Intel® Virtualization Technology

Disabled Enabled

When enabled, a VMM can utilize the additional hardware capabilities

Intel® Trusted Execution Technology

Disabled Enabled

Enable/Disable Intel TXT (enabled only in customized BIOS versions)

COMe-cHL6 / BIOS Operation

Processor Power Management

Feature Options Description

Intel® SpeedStep(TM)

Enabled Disabled

Enable/Disable processor performance states (PStates)

Boot Performance Mode

Max Performance Max Battery Auto

Select the performance st ate that the BIOS sets before OS hand-off

Turbo Mode

Enabled Disabled

Enable processor Turbo Mode

- Turbo Mode Power Limit Lock

Disabled Enabled

Enable/Disable Locking of turbo settings. When enabled, Turbo_Power_Limit MSR will be locked and a reset will be required to unlock the register

- Long Power Limit

Turbo Mode Long Duration Power Limit (also known as Power Limit PL1) in Watts. The value may vary from 0 to Fused Value. If the value is 0, the fused value will be programmed. A value greater than fused TDP value will not be programmed

- Long Power Limit Time

Long Duration Time Windows (also known as PL1 Time) value in seconds. The value may vary from 0 to 56. Indicates the time window over which TDP value should be maintained. If the value is 0, the fused value will be programmed

- Short Power Limit

Turbo Mode Short Duration Power Limit (also known as Power Limit PL2) in Watts. The value may vary from 0 to Fused Value. If the value is 0, the fused value will be programmed. A value greater than fused TDP value will not be programmed

- Short Duration Turbo Mode

Enabled Disabled

Enable/Disable Short Duration Turbo Mode for processor

- Energy Efficient Enable

Enabled Disabled

Enable/Disable Energy Efficient for processor

Configure TDP Boot Mode

Nominal Down Up Disabled

Configure TDP Mode (cTDP). Disabled option will skip all cTDP boot configurations

COMe-cHL6 / BIOS Operation

Lock TDP Settings

Disabled Enabled

Lock TDP in MSR_CONFIG_TDP_CONTROL

C-States

Enabled Disabled

Enable processor idle power saving states

- Extend C-States

Enabled Disabled

Enable C-State transitions to occur in combination with P-States

- C3 State

Enabled Disabled

Enable processor idle power saving C3 state

- C6 State

Enabled Disabled

Enable processor idle power saving C6 state

- C6 Latency

Short Long

Configure Short/Long latency

- C7 State Disabled C7 C7s

Enable processor idle power saving C7 state

- C7 Latency

Short Long

Configure Short/Long latency

- C-State Auto Demotion Disabled C1 C3 C1 and C3

Configure C-State Auto Demotion

- C-State Auto UnDemotion Disabled C1 C3 C1 and C3

Configure C-State Auto UnDemotion

- Package C-State Demotion

Disabled Enabled

Enable/Disable Package C-State Demotion

- Package C-State UnDemotion

Disabled Enabled

Enable/Disable Package C-State UnDemotion

- C-State Pre-Wake

Enabled Disabled

Enable/Disable C-State Pre-Wake

COMe-cHL6 / BIOS Operation

Miscellaneous

Feature Options Description

S5 Eco

Disabled Enabled

Enable/Disable Kontron S5 Eco mode. Reduces supply current in Soft Of f (S5) to less than 1mA. If enabled, power button is the only wake-up source in S5! See chapter S5 Eco for further details

Smart Battery Conf iguration

Disabled Auto Charger Manager

Enable/Disable Smart Battery System Support (e.g. Kontron M.A.R.S.)

Reset Button Behavior

Chipset Reset Power Cycle

Select the system behavior on reset button event

COMe-cHL6 / BIOS Operation

I2C Speed

Feature Options Description

I2C Speed

200

Select I2C Bus Speed in kHz from 1kHz to 400kHz

COMe-cHL6 / BIOS Operation

Watchdog

Feature Options Description

Auto-reload

Disabled Enabled

Enable automatic reload of watchdog timers on timeout

Global Lock

Disabled Enabled

If set to enabled, all Watchdog registers (except WD_KICK) become read only until the board is reset

Stage 1 Mode

Disabled Reset NMI SCI

Select Action for first Watchdog st age

- Assert WDT Signal

Enabled Disabled

Enable/Disable assertion of WDT signal to baseboard on stage timeout

- Stage 1 Timeout 1s 5s 10s 30s 1m 3m 10m 30m

Select Timeout value for first watchdog stage

Stage 2 Mode

Disabled Reset NMI SCI

Select Action for first Watchdog st age

- Assert WDT Signal

Disabled Enabled

Enable/Disable assertion of WDT signal to baseboard on stage timeout

- Stage 2 Timeout 1s 5s 10s 30s 1m 3m 10m 30m

Select Timeout value for second watchdog stage

COMe-cHL6 / BIOS Operation

Generic LPC Decode Ranges

Feature Options Description

Generic LPC Decode 1

Disabled Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between 0800h - 0100h. Must be multiple of 8.

Generic LPC Decode 2

Disabled Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between 0800h - 0100h. Must be multiple of 8.

Generic LPC Decode 3

Disabled Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between 0800h - 0100h. Must be multiple of 8.

COMe-cHL6 / BIOS Operation

H/W Monitor

Feature Value/Options Description

CPU Temperature xx°C Shows the measured temperature of the CPU Diode with

onboard HWM

Module Temperature xx°C Shows the internal hardware-monitor temperature

CPU FAN xxxx rpm Shows the fan speed of onboard FAN connector

Fan Pulse

Number of pulses the CPU fan produces during one revolution. Range 1-4

FAN Control Disabled

Manual Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

Manual fan speed in %. Minimum value is 30 (in Manual mode only)

Trip Point Speed

Fan speed at trip point in %. Minimum value is 30. Fan always runs at 100% at Tjmax - 10°C

Reference Temperature

CPU Temperature PCH Temperature Module Temperature

Determines the temperature source which is used for automatic fan control

External FAN xxxx rpm Shows the fan speed of external COMe FAN

Fan Pulse

Select the number of pulses the external fan produces during one revolution. Range 1-4

FAN Control Disabled

Manual Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

Manual fan speed in %. Minimum value is 30 (in Manual mode only)

Trip Point Speed

Fan speed at trip point in %. Minimum value is 30. Fan always runs at 100% at Tjmax - 10°C

Reference Temperature PCH Temperature

Module Temperature CPU Temperature

Determines the temperature source which is used for automatic fan control

COMe-cHL6 / BIOS Operation

Widerange Vcc x.xx V Shows the Module Main Input Voltage

5.0V Standby x.xx V Shows the 5V Standby Voltage input

Batt volt at COMe pin x.xx V Shows the RTC Battery Voltage input measured at COMe

connector

COMe-cHL6 / BIOS Operation

HDD Configuration

Feature Options Description

SATA Device

Enabled Disabled

Enable/Disable SATA Device

Interface Combination IDE

AHCI RAID

Select the SATA controllers operation mode

Aggressive Link Power Disabled

Enabled

If enabled, turns on Aggressive Link Power Management on all HDD ports

SATA Speed Gen1

Gen2 Gen3

Select the supported SATA speed mode

Port Enable

Enabled Disabled

Enable or Disable SATA Port

Hot Plug

Disabled

Designates this port as Hot Pluggable. Requires

COMe-cHL6 / BIOS Operation

Enabled hardware support

SATA Device Type

Hard Disk Drive Solid State Drive

Identify the SATA port is connected to Solid State Drive or Hard Disk Drive

DevSlp

Disabled Enabled

RTD3 Device Sleep Support

DITO Configuration

Disabled Enabled

Enable/Disable Device Sleep Idle Timeout Configuration

DITO Value

625

The Host computes the total idle timeout as a product of DITO Multiplier and Dito Value: DITO actual = DITO + (DM+1)

DITO Multiplier Value

The Host computes the total idle timeout as a product of DITO Multiplier and Dito Value: DITO actual = DITO + (DM+1)

COMe-cHL6 / BIOS Operation

Software Feature Mask Configuration

Feature Options Description

HDD Unlock

Enabled Disabled

If enabled, indicates that the HDD password unlock in the OS is enabled

LED Locate

Enabled Disabled

If enabled, indicates that the LED/SGPIO hardware is attached and ping to locate feature is enabled on the OS

COMe-cHL6 / BIOS Operation

Memory Configuration

Feature Options Description

Memory Frequency Limiter

Auto 2067 1333 1600 1867 2133 2400 2667

Select the memory frequency in MHz

Max TOLUD

Dynamic 1 GB … 3.25GB

Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on largest MMIO length of installed graphic controller. Manual TOLUD setting from 1GB to 3.25GB in 0.25GB steps

NMode Support

Auto 1N Mode 2N Mode

Select the memory supported Command Rate (N-Mode)

Channel A DIMM Control

Enabled Disabled

Enables or disables DIMMs on channel A

Channel B DIMM Control

Enabled Disabled

Enables or disables DIMMs on channel B

Memory Remap

Enabled Disabled

Enable/Disable Memory Remap above 4GB

MRC FastBoot

Enabled Disabled

Enable/Disable MRC FastBoot. Generally, this option only takes effect when doing cold boots/resets

DIMM Profile

Default DIMM profile XMP profile 1 XMP Profile 2

Select Intel Extreme Memory Profile XMP if supported by DIMM SPD

COMe-cHL6 / BIOS Operation

System Agent (SA) Configuration

Feature Options Description

CPU Audio Device (D0:D3:F0)

Enabled Disabled

Enable/Disable CPU Audio Device

COMe-cHL6 / BIOS Operation

Intel® VT for Directed I/O (VT-d)

Feature Options Description

Intel® VT for Directed I/O (VT-d)

Enabled Disabled

Enable/Disable Intel Virtualization Technology for Directed I/O (VT-d) by reporting the I/O device assignment to VMM through DMAR ACPI Tables

COMe-cHL6 / BIOS Operation

Graphics Configuration

Feature Options Description

Graphics Turbo IMON Current

Graphics turbo IMON current value supported (14-31)

Primary Display Selection IGD

PEG PCI Auto

Select the primary display device

Internal Graphics Disabled

Enabled

Auto

Enable/Disable the Internal Graphics Device. This has no effect if external graphics are present

GTT Size 1MB

2MB

Select the GTT Memory Size of IGD

Aperture Size 128MB

256MB 512MB

Select the Graphics Aperture Size

DVMT Pre-Allocated

32MB 64MB 128MB

Select Pre-Allocated Graphics Memory size used by the Internal Graphics device

DVMT Total Gfx Mem 128MB

256MB Max

Select the maximum DVMT5.0 Graphics Memory Size

GFX Low Power Mode

Enabled Disabled

Enable/Disable Gfx Low Power Mode

COMe-cHL6 / BIOS Operation

IGD Configuration

Feature Options Description

IGD - Boot Type

Auto CRT EFP LFP EFP3 EFP2

Select the Integrated Graphics Video Device which will be activated during POST

IGD - Secondary Boot Type

Disabled CRT EFP LFP EFP3 EFP2

Select the second Video Device which will be activated during POST

LFP Type

AUTO VGA 640×480 1×18 WVGA 800×480 1×18 SVGA 800×600 1×18 XGA 1024×768 1×18 XGA 1024×768 1×24 WXGA 1280×768 1×24 WXGA 1280×800 1×18 WXGA 1366×768 1×24 WXGA+ 1440×900 2×18 WXGA+ 1440×900 2×24 SXGA 1280×1024 2×18 SXGA 1280×1024 2×24 WSXGA+ 1680×1050 2×18 WSXGA+ 1680×1050 2×24 UXGA 1600×1200 2×18 UXGA 1600×1200 2×24 WUXGA 1920×1200 2×18 WUXGA 1920×1200 2×24 Custom

Select LFP used by Internal Graphics Device by selecting the appropriate panel setup item

Backlight Control None/External

PWM PWM Inverted I2C

Backlight Control Setting

Backlight Value

128

Set LCD backlight brightness (0-255)

eDP Panel Type

LVDS eDP

Select Panel Type connected to eDP Port (eDP only available with customized hardware)

LVDS Clock Center Spreading

No Spreading

0.5%

1.0%

1.5%

2.0%

2.5%

Select LVDS clock frequency center spreading depth

EFP1 Type DisplayPort Only Integrated HDMI/DisplayPort Configuration with

COMe-cHL6 / BIOS Operation

EFP2 Type

DP with HDMI/DVI DP with DVI HDMI/DVI

External Connectors

Mode Persistence

Disabled Enabled

Enables/Disables Mode Persistence

COMe-cHL6 / BIOS Operation

South Bridge Configuration

Feature Options Description

SMBUS Device Disabled

Enabled

Enable/Disable SMBUS Device

State After G3 State S5

State S0 Last State

Specify what state to switch to when power is re-applied after a power failure (G3 st ate). S5 = Stay Off, S0 = switch on

COMe-cHL6 / BIOS Operation

SB PCI Express Config

Feature Options Description

PCIe Root Port Clock Gating Disabled

Enabled

Enable or Disable PCI Express Clock Gating for each root port

DMI Link ASPM Control Disabled

Enabled

Controls Active State Power Management on both NB side and SB side of the DMI Link

DMI Link Ext Synch

Disabled Enabled

Controls Extended Synch on SB side of the DMI Link

PCIe-USB Glitch W/A Disabled

Enabled

PCIe-USB Glitch W/A for bad USB device(s) connected behind PCIe/PEG Port

PCI ExpressCard 0 PCI ExpressCard 1

Port 1 Port 2 Port 3 Port 4 Port 5 Disabled

Controls PCIe Port for ExpressCard support

COMe-cHL6 / BIOS Operation

PCI Express Root Port 1/2/3/4

Feature Options Description

PCI Express Root Port # Disabled

Enabled

Control the PCI Express Root Port

PCIe Speed

Auto Gen1 Gen2

Select PCIe Speed to Gen1 or Gen2

ASPM Disabled

L0s L1 L0s and L1 Auto

Control PCIe Active State Power Management settings

L1 Substates Disabled

L1.1 L1.2 L1.1 & L1.2

PCI Express L1 Substates setting

HOT PLUG

Disabled Enabled

PCI Express Hot Plug Enabled/Disabled

URR

Disabled Enabled

PCI Express Unsupported Request Reporting

FER

Disabled Enabled

PCI Express Device Fatal Error Reporting

NFER

Disabled Enabled

PCI Express Device Non-Fatal Error Reporting

CER

Disabled Enabled

PCI Express Device Correctable Error Reporting

SEFE

Disabled Enabled

PCI Express System Error on Fatal Error

SENFE

Disabled Enabled

PCI Express System Error on Non-Fatal Error

SECE

Disabled Enabled

PCI Express System Error on Correctable Error

PME Interrupt

Disabled Enabled

Root PCI Express PME Interrupt

PME SCI Disabled

Enabled

PCI Express PME SCI

COMe-cHL6 / BIOS Operation

SB USB Config

Feature Options Description

USB Precondition Disabled

Enabled

Precondition work on USB host controller and root ports for faster enumeration

xHCI Mode Disabled

Enabled Auto Smart Auto

Mode of operation of xHCI controller

Trunk Clock Gating (BTCG) Disabled

Enabled

Enable/Disable BTCG

EHCI1 Disabled

Enabled

Control the USB EHCI (USB2.0) functions

USB Per-Port Disable Control

Disabled Enabled

Controls each of the USB ports (0~13)

- USB Port #0 Enable/Disable

- USB Port #1 Enable/Disable

- USB Port #2 Enable/Disable

- USB Port #3 Enable/Disable

- USB Port #4 Enable/Disable

- USB Port #5 Enable/Disable

- USB Port #6 Enable/Disable

- USB Port #7 Enable/Disable

Disabled Enabled

Enable/Disable USB port

xHCI Idle L1 Disabled

Enabled

Enable/Disable xHCI Idle L1

USB Sensor Hub

Disabled Enabled

Enable/Disable USB Sensor Hub

COMe-cHL6 / BIOS Operation

SB Azalia Config

Feature Options Description

Azalia Disabled

Enabled

Control Detection of the Azalia HD Audio Device

COMe-cHL6 / BIOS Operation

Network Configuration

Feature Options Description

PCH Internal LAN Disabled

Enabled

Enable/Disable PCH internal LAN

LAN OPROM Selection Disabled

Onboard only Addon only Both

This is used to select LAN OPROM for quick boot minimal configuration

Wake on PCH LAN Disabled

Enabled

Enable PCH internal Wake on LAN capability

ASF Support Disabled

Enabled

Enable/Disable Alert Specifications Format

COMe-cHL6 / BIOS Operation

CPLD Configuration

Feature Options Description

Serial Port 0 Disabled

Enabled

Enable or Disable Serial Port (COM) 0

Base Address

3F8 2F8 3E8 2E8

Configure Serial Port Base Address

IRQ 3

4 5 6 7 12

Configure Serial Port IRQ

Serial Port 1 Disabled

Enabled

Enable or Disable Serial Port (COM) 1

Base Address 3F8

2F8 3E8 2E8

Configure Serial Port Base Address

IRQ

3 4 5 6 7 12

Configure Serial Port IRQ

GPIO IRQ

Disabled 14 15

Configure IRQ for GPIO pins

I2C IRQ

Disabled 14 15

Configure IRQ for I2C controller

COMe-cHL6 / BIOS Operation

LPC SIO Configuration

This setup option is only available with LPC SuperI/O Nuvoton 83627 present on the carrier board. By default the COMecHL6 supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The SIO hardware monitor is not supported in setup.

Serial Port 0

Disabled Enabled

Enable or Disable SIO Serial Port

- Base Address 3F8 2F8 3E8 2E8

Configure Serial Port Base Address

- IRQ 3 4 5 6 7 12

Configure Serial Port IRQ

Serial Port 1

Disabled Enabled

Enable or Disable SIO Serial Port

- Base Address 3F8 2F8 3E8 2E8

Configure Serial Port Base Address

- IRQ 3 4 5 6 7 12

Configure Serial Port IRQ

SIO Parallel Port

Disabled Enabled

Enable or Disable SIO Parallel Port

- Device Mode

Standard Parallel Port EPP ECP & EPP 1.9 ECP & EPP 1.7

Configure Parallel Por t Mode

- Base Address

378 278 3BC

Configure Parallel Por t Base Address

COMe-cHL6 / BIOS Operation

ME Configuration

100

Kontron COMe-cHL6 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 Naming clarification

2.3 Understanding COM Express® Functionality

2.4 COM Express® Documentation

2.5 COM Express® Benefits

3 Product Specification

3.1 Module definition

3.2 Functional Specification

Processor

Memory

Chipset

HighSpeed I/O Port Configuration

Graphics Core

Monitor output

LVDS

Display Interfaces

Storage

Connectivity

Ethernet

PCI Express Configuration

Misc Interfaces and Features

Kontron Features

Additional features

Power Features

Power Consumption and Performance

3.3 Block Diagram

3.4 Accessories

3.5 Electrical Specification

3.5.1 Supply Voltage

3.5.2 Power Supply Rise Time

3.5.3 Supply Voltage Ripple

3.5.4 Power Consumption

3.5.5 ATX Mode

3.5.6 Single Supply Mode

3.6 Power Control

Power Supply

Power Button (PWRBTN#)

Power Good (PWR_OK)

Reset Button (SYS_RESET#)

SM-Bus Alert (SMB_ALERT#)

3.7 Environmental Specification

3.7.1 Temperature Specification

3.7.2 Humidity

3.8 Standards and Certifications

RoHS II

Component Recognition UL 60950-1

WEEE Directive

Conformal Coating

Shock & Vibration

3.9 MTBF

3.10 Mechanical Specification

Dimension

Height

3.11 Module Dimensions

3.12 Thermal Management, Heatspreader and Cooling Solutions

4 Features and Interfaces

4.1 S5 Eco Mode

4.2 LPC

4.3 Serial Peripheral Interface (SPI)

4.4 SPI boot

Recommended SPI boot flash types for 8-SOIC package

Using an external SPI flash

External SPI flash on Modules with Intel® ME

4.5 M.A.R.S.

4.6 UART

4.7 Fast I2C

4.8 Dual Staged Watchdog Timer

Basics