Kontron COMe-cDC2 User Manual

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COMe-cDC2

Document Revision 130

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» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Modules & Accessories................................................................................................................. 10

3.2 Functional Specification............................................................................................................... 12

3.3 Block Diagram............................................................................................................................ 15

3.4 Electrical Specification................................................................................................................ 16

3.4.1 Supply Voltage........................................................................................................................... 16

3.4.2 Power Supply Rise Time................................................................................................................ 16

3.4.3 Supply Voltage Ripple.................................................................................................................. 16

3.4.4 Power Consumption..................................................................................................................... 16

3.4.5 ATX Mode.................................................................................................................................. 17

3.4.6 Single Supply Mode..................................................................................................................... 17

3.5 Power Control............................................................................................................................ 18

3.6 Environmental Specification......................................................................................................... 19

3.6.1 Temperature Specification............................................................................................................19

3.6.2 Humidity................................................................................................................................... 19

3.7 Standards and Certifications......................................................................................................... 20

3.8 MTBF........................................................................................................................................ 22

3.9 Mechanical Specification.............................................................................................................. 23

3.10 Thermal Management..................................................................................................................24

3.11 Heatspreader............................................................................................................................. 24

3.12 Onboard Fan Connector................................................................................................................ 25

3.12.1 Electrical Characteristics.............................................................................................................. 26

4 Features and Interfaces.......................................................................27

4.1 Onboard SSD.............................................................................................................................. 27

4.2 S5 Eco Mode.............................................................................................................................. 28

4.3 LPC.......................................................................................................................................... 29

www.kontron.com

COMe-cDC2 /

4.4 LPC boot................................................................................................................................... 30

4.5 M.A.R.S.................................................................................................................................... 31

4.6 Fast I2C.................................................................................................................................... 32

4.7 JIDA16 and JIDA32..................................................................................................................... 33

4.8 K-Station 1................................................................................................................................ 34

4.9 K-Station & API Resources for JIDA32.............................................................................................. 35

4.9.1 I2C.......................................................................................................................................... 35

4.9.2 Storage.................................................................................................................................... 35

4.9.3 GPIO........................................................................................................................................ 35

4.9.4 Hardware Monitor....................................................................................................................... 35

4.10 API Ressources for Board Driver.....................................................................................................35

4.10.1 I2C.......................................................................................................................................... 35

4.10.2 Storage.................................................................................................................................... 36

4.10.3 GPIO........................................................................................................................................ 36

4.10.4 Onboard Hardware Monitor...........................................................................................................36

4.10.5 SIO Winbond 83627DHGP............................................................................................................. 36

4.10.6 SIO Winbond 83627HG................................................................................................................. 37

4.11 GPIO - General Purpose Input and Output.........................................................................................38

4.12 Dual Staged Watchdog Timer......................................................................................................... 39

4.13 Flash Backup Feature................................................................................................................... 40

4.14 Speedstep Technology................................................................................................................. 42

4.15 C-States.................................................................................................................................... 43

4.16 Hyper Threading......................................................................................................................... 44

4.17 ACPI Suspend Modes and Resume Events..........................................................................................45

5 System Ressources..............................................................................46

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 46

5.1.1 In 8259 PIC Mode........................................................................................................................ 46

5.1.2 In APIC mode............................................................................................................................. 47

5.2 Direct Memory Access (DMA) Channels............................................................................................. 47

5.3 Memory Area.............................................................................................................................. 47

5.4 I/O Address Map......................................................................................................................... 48

5.5 External Inter-IC (I2C) Bus............................................................................................................48

5.6 System Management (SM) Bus....................................................................................................... 48

5.7 JILI I2C Bus............................................................................................................................... 48

6 Connectors........................................................................................49

6.1 Connector Location..................................................................................................................... 49

6.2 Pinout List................................................................................................................................ 50

6.2.1 General Signal Description............................................................................................................ 50

6.2.2 Connector X1A Row A................................................................................................................... 51

6.2.3 Connector X1A Row B................................................................................................................... 53

6.2.4 Connector X1B Row C................................................................................................................... 55

6.2.5 Connector X1B Row D................................................................................................................... 57

7 BIOS Operation...................................................................................59

7.1 Determining the BIOS Version....................................................................................................... 59

7.2 BIOS Update.............................................................................................................................. 59

7.3 Setup Guide............................................................................................................................... 60

COMe-cDC2 /

7.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 60

7.4 BIOS Setup................................................................................................................................ 62

7.4.1 Main Menu................................................................................................................................ 62

7.4.2 Module Info............................................................................................................................... 63

7.4.3 Advanced Menu.......................................................................................................................... 65

7.4.4 PCIPnP Menu.............................................................................................................................. 86

7.4.5 Boot........................................................................................................................................ 87

7.4.6 Security.................................................................................................................................... 89

7.4.7 Chipset..................................................................................................................................... 90

7.4.8 Exit Menu.................................................................................................................................. 96

COMe-cDC2 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-cDC2 / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe-cDC2 / Introduction

2 Introduction

2.1 Product Description

The COMe-cDC2 brings latest 45 nm performance generations of Intel® Atom™ N270 processor with 1.6 GHz and the Intel® 945GSE and ICH7M chipset to a compact 95 x 95 mm module.

Kontron’s new high-efficient power-off state S5 Eco enables ACPI features and lowest power-consumption in soft-off state – less than 1 mA. Compared to the regular S5 state this means a reduction by at least factor 200! Battery uptime therefore goes up dramatically.

Like all COM Express® compact modules, it is compatible to the COM Express® basic. Therefore, upgrading existing carrier boards originally designed for COM Express® basic gets easy and minimizes redesign efforts.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known

as ETXexpress®

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known

as microETXexpress®

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as

nanoETXexpress

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO

1x optional 1x optional - -

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

COMe-cDC2 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-cDC2. Additional references are are available from your Kontron Support or from PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available from the PIGMG website by filling out the order form.

» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum

flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.

COMe-cDC2 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® compact sized Computer-on-Module COMe-cDC2 (UNP1) follows pin-out Type 2 and is compatible to PICMG specification COM.0 Rev 1.0. The COMe-cDC2 based on Intel's Navy Pear platform is available in different variants:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor Chipset and Features

36005-0000-16-2 COMe-cDC2 N270 Intel® Atom™ N270 DDR2, 945GSE

36005-0040-16-2 COMe-cDC2 N270 4GB Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD

Extended temperature modules (E1, -25°C to +75°C operating)

Product Number Product Name Processor Chipset and Features

36005-0000-16-2EXT COMe-cDC2 N270 E1 Intel® Atom™ N270 DDR2, 945GSE, E1

36005-0040-16-2EXT COMe-cDC2 N270 4GB E1 Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD, E1

COMe-cDC2 / Product Specification

Accessories

Product Number Carr ier Boards

38102-0000-00-1 COM Express® Reference Carrier Type 2 (8mm COMe connector)

38104-0000-00-0 COM Express® Eval Carrier Type 2 (Niles Canyon, 5mm COMe connector)

38104-0000-00-1 COM Express® Eval Carrier Type 2 (Topanga Canyon, 5mm COMe connector)

Product Number Memory

97011-5120-08-0 DDR2-800 SODIMM / 512MB

97011-1024-08-0 DDR2-800 SODIMM / 1GB

97011-2048-08-0 DDR2-800 SODIMM / 2GB

97011-5120-08-2 DDR2-800 SODIMM / 512MB E2

97011-1024-08-2 DDR2-800 SODIMM / 1GB E2

97011-2048-08-2 DDR2-800 SODIMM / 2GB E2

Product Number Cooling & Mounting

36005-0000-99-0 HSP COMe-cDC2 thread

36005-0000-99-1 HSP COMe-cDC2 through

36005-0000-99-0C01 HSK COMe-cDC2 active thread

36005-0000-99-0CO2 HSK COMe-cDC2 passive thread

36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP)

36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP)

38017-0000-00-0 COMe Mount KIT 8mm 1set

38017-0000-00-5 COMe Mount KIT 5mm 1set

38017-0100-00-0 COMe Mount KIT 8mm 100sets

38017-0100-00-5 COMe Mount KIT 5mm 100sets

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect a standard FAN to the module)

96079-0000-00-1 KAB-HSP 40mm (Cable adapter to connect a standard FAN to the module)

COMe-cDC2 / Product Specification

3.2 Functional Specification

Processor

The 45nm Intel® ATOM™ (Diamondville) CPU with 22x22mm package size (PBGA437 socket) supports:

» Intel® Hyper-Threading Technology (HTT)

» Enhanced Intel SpeedStep® Technology (EIST)

» Thermal Monitoring Technologies

» Idle States (C-States)

» Execute Disable Bit

CPU specifications

» Intel® ATOM™

» Codename: Diamondville

» L2-Cache: 512kB

» FSB: 533MHz

» Instruction set: 32bit

Memory

Sockets

1x DDR2 SO-DIMM

Memory Type

DDR2-400/533

Maximum Size

2GB

Technology

Single Channel

Chipset

The Intel® 945GSE Chipset (Codename Calistoga) combined with the Intel® 82801GBM (ICH7M) Southbridge supports:

» PCI Express Revision 1.0

» USB 2.0

» Integrated Graphics with dual display

Graphics Core

The integrated Intel® GMA950 (Gen3.5) supports:

Graphics Core Render Clock

166MHz

Execution Units / Pixel Pipelines

Max Graphics Memory

256MB

GFX Memory Bandwidth (GB/s)

10.7

GFX Memory Technology

DVMT 3.0

API (DirectX/OpenGL)

9.0c / 1.4

Shader Model

2.0

Hardware accelerated Video

Independent/Simultaneous Displays

Display Port

HDCP support

COMe-cDC2 / Product Specification

Monitor output

CRT max Resolution

2048x1536

TV out:

YES

LVDS

LVDS Bits/Pixel

1x18 / 2x18

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1600x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

Digital Display Interface DDI1

SDVOB

Digital Display Interface DDI2

Digital Display Interface DDI3

Maximum Resolution on DDI

1920x1200

Storage

onboard SSD

512MB to 8GB SLC (PATA)

SD Card support

IDE Interface

1x PATA 100

Serial-ATA

2x SATA 1.5Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup

SATA RAID

Variants with onboard SSD flash do not support external IDE due to the missing signals PDIAG# and DASP# master/slave capabilities on COM Express® connector

Connectivity

USB

8x USB 2.0

USB Client

PCI

PCI Rev 2.3 (33MHz/3.3V)

PCI External Masters

PCI Express

3x PCIe x1 Gen1

Max PCI Express

4x PCIe x1 without LAN

PCI Express x2/x4 configuration

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Hartwell)

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

COMe-cDC2 / Product Specification

Misc Interfaces and Features

Audio

AC97 / HD Audio

Onboard Hardware Monitor

ON Semi ADT7475

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT

Miscellaneous

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32 / PICMG EAPI

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 18V

ACPI

ACPI 2.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 2.3

Power Consumption and Performance

Full Load Power Consumption

10W

Kontron Performance Index

1714

Kontron Performance/Watt

172

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The COMe-cDC2 currently supports:

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Microsoft Windows XP x86

» Microsoft Windows 7 x86

» Microsoft Windows Embedded Standard 7 x86 (WES7)

» Linux

» WindRiver VxWorks 6.6 - 6.8

COMe-cDC2 / Product Specification

3.3 Block Diagram

COMe-cDC2 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 18V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.3V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-cDC2 variants is 10W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

COMe-cDC2 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 18V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

COMe-cDC2 / Product Specification

3.5 Power Control

Power Supply

The COMe-cDC2 supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cDC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine does not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.

COMe-cDC2 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

General Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended (E1) -25°C to +75°C -30°C to +85°C

Industrial grade (E2) -40°C to +85°C -40°C to +85°C

Standard modules are available for commercial grade temperature range. Please see chapter Product Specification for available variants for extended or industrial temperate grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» Operating: 10% to 90% (non condensing)

» Non operating: 5% to 95% (non condensing)

COMe-cDC2 / Product Specification

3.7 Standards and Certifications

RoHS

The COMe-cDC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The COMe-cDC2 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

COMe-cDC2 / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cDC2 follows the requirements for electromagnetic

compatibility standards

» EN55022

» EN55011

» EN55024

» FCC15

COMe-cDC2 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 199784 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered for separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

COMe-cDC2 / Product Specification

3.9 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Hight approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

COMe-cDC2 / Product Specification

3.10 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cDC2. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-cDC2. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please see the COM Express® Design Guide for further information on thermal management.

3.11 Heatspreader

Documentation and CAD drawings of COMe-cDC2 heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

COMe-cDC2 / Product Specification

3.12 Onboard Fan Connector

Location and Pinout of Fan Connector

The onboard fan connector (J9) can be found at the left side nearby the DRAM socket and has following specification:

» Part number (Molex) J9: 53261-0390

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

The Pin assignement is:

» Pin1: Tacho

» Pin2: VCC

» Pin3: GND

COMe-cDC2 / Product Specification

BIOS Settings for Fan Control

The fan can be controlled via the BIOS Settings “Advanced Hardware Health”→

In general 4 modes are possible

» Auto Fan Mode: Temperature Values can be selected to control the Fan

» Fan Always On Full: Fan is always full on

» Fan Disable Mode: Fan is disabled

» Fan Manually Mode: A fixed PWM value (0…255) can be entered to run the fan at a selected speed

The used hardware monitor onboard is an ADT7475. For additional information please refer to the regarding datasheet.

3.12.1 Electrical Characteristics

Input Voltage Range

8.5V - 18V

Output Voltage

Only 12V (switch in BIOS without function)

Max. output current

0.3A

The Fan out voltage output is not short circuit proof. If necessary the user has to ensure that the circuit is protected externally, for example by a fuse on the backplane.

To connect a standard FAN with 3pin connector to the module please use adaptor cable KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

COMe-cDC2 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-cDC2 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives are available:

Basic features of the PATA NANDrives

» 16-bit ATA/IDE Bus Interface with PIO Mode-6, Multi-Word DMA Mode-4 and Ultra DMA Mode-4

» RoHS compliant NAND flash type

» Hardware error detection and correction ECC

» Advanced wear leveling

» Bad block management

SLC NANDrive™

Flash Part No. GLS85LP0512P-S-I-LBTE GLS85LP1002P-S-I-FTE GLS85LP1004P-S-I-FTE GLS85LP1008P-S-I-FTE

Temperature Range

-40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C

Flash Size 512MB 2GB 4GB 8GB

NAND Type

SLC NAND SLC NAND SLC NAND SLC NAND

Sustained Read Speed

25 MB/s 28 MB/s 50 MB/s 50 MB/s

Sustained Write Speed

6 MB/s 11 MB/s 20 MB/s 39 MB/s

Total Bytes

456,744,960 2,000,388,096 4,068,384,768 8,136,769,536

Max LBA

892,080 3,907,008 7,946,064 15,892,128

Cylinders/Heads/Sectors

885/16/63 3,876/16/63 7,883/16/63 15,766/16/63

Active Mode Power

200mW 200mW 265mW 365mW

Program/Erase Cycles per Block

100k 100k 100k 100k

(Data based on GLS85LPxxxxP Datasheet Rev. 02.000 from 06-2012)

The NAND Flash types listed above are available on COMe-mSP1 hardware revision CE4.7.0 and COMe-cDC2 hardware revision CE 2.4.1 or newer. Please contact your local sales or support for Flash specifications of SST Flash used on older revisions

COMe-cDC2 / Features and Interfaces

4.2 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current tremendously.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequesites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Powerbutton only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

COMe-cDC2 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

COMe-cDC2 / Features and Interfaces

4.4 LPC boot

The COMe-cDC2 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot

Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot

Device 1

Using an external LPC Firmware Hub

To program an external LPC FWH follow these steps:

» Connect a 1MB LPC FWH to the module's LPC interface

» Open pin A34 to boot from the module BIOS

» Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided

on EMD Customer Section

» Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH

» Execute Flash.bat to flash the BIOS image to the external LPC FWH

» reboot

Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

» Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup

biosname.rom in Windows

Flash Backup should show “Enter new Password” first time saving custom defaults. If it is not possible to set a new password or entering a password shows an error message, please clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available

at Kontron’s Customer Section)

You can download all AMI CORE8 update utilities at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

COMe-cDC2 / Features and Interfaces

4.5 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

COMe-cDC2 / Features and Interfaces

4.6 Fast I2C

The COMe-cDC2 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

COMe-cDC2 / Features and Interfaces

4.7 JIDA16 and JIDA32

JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs running in Real Mode operating systems (i.e. MS DOS) to call certain functions implemented in the BIOS. These functions can be used to get module information, make settings and access the I2C Bus and the Watchdog unit. JIDA16 functions are INT 15h BIOS calls which are only available in 16 Bit Real Mode operating systems.

For 32bit operating systems (i.e. WindowsXP, Windows 7, Windows CE, VxWorks, Linux) a different JIDA implementation called JIDA32 is implemented. The same common driver for all JIDA32 capable modules talks to the JIDA32 part in the BIOS, which is hardware dependent to interact with the hardware.

Please refer to EMD Customer Section for detailed documentation, JIDA utilities and Libraries for DOS, Windows, Linux, VxWorks or QNX.

Usage of JIDA16 and JIDA32

COMe-cDC2 / Features and Interfaces

4.8 K-Station 1

Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example utility Kontron provides K-Station for most 32bit Windows Operating Systems. K-Station 1 is a summary of command line utilities (Shell Tools) for easy access to JIDA32 BIOS implementations. Second part of K-Station is a JAVA based example GUI which gives a view an all available features using the Shell Tools.

Following K-Station Shell Tools are available:

» KSystemSummary.exe (System Information)

» KGenInfo.exe (Module Information)

» KCPUPerf.exe (CPU Throttling control)

» KHWMon.exe (Hardware Monitoring)

» KI2CBus.exe (I2C and SMBus access)

» KIOPort.exe (GPIO control)

» KStorage.exe (JIDA EEPROM access to user bytes)

» KVGATool.exe (LVDS Backlight control)

» KWDog.exe (Watchdog control)

» KAMIMod.exe (AMICore8 BIOS Modification with Bootlogo or Usercode …)

» KFlash.exe (AMICore8 BIOS Update)

The full K-Station package, the stand-alone Shell Tools with drivers, example batch files and documentation is available on EMD Customer Section for free.

COMe-cDC2 / Features and Interfaces

4.9 K-Station & API Resources for JIDA32

Available resources for default JIDA32 BIOS implementation and API:

4.9.1 I2C

BUS Function

I2C 0 Internal / JIDA I2C

I2C 1 SM-Bus

I2C 2 external I2C

I2C 3 JILI DDC

4.9.2 Storage

Device Function

EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use)

4.9.3 GPIO

Port Function

IO-Port 0 GPI 0

IO-Port 1 GPI 1

IO-Port 2 GPI 2

IO-Port 3 GPI 3

IO-Port 4 GPO 0

IO-Port 5 GPO 1

IO-Port 6 GPO 2

IO-Port 7 GPO 3

4.9.4 Hardware Monitor

Sensor Function

Temp 0 CPU temperature

Temp 1 internal HWM temperature (inside ADT7475)

Temp 2 chipset temperature (Northbridge

Temp 3 external carrier board SIO Winbond 83627 Temp Sensor 0

Temp 3 external carrier board SIO Winbond 83627 Temp Sensor 1

Temp 5 external carrier board SIO Winbond 83627 Temp Sensor 2

Temp 6 CPU Temperature (DTS )

Voltage 0 ADT7475 VCC : 3.3V S0

Voltage 1 external SIO Winbond 83627 CPU core voltage sensor: V CoreA

Voltage 2 external SIO Winbond 83627 CPU core voltage sensor: V CoreB

Voltage 3 external SIO Winbond 83627 battery voltage Sensor: VBAT

Voltage 4 external SIO Winbond 83627 Voltage Sensor 3: +3.3V

Voltage 5 external SIO Winbond 83627 Voltage Sensor 4: +5V

Voltage 6 external SIO Winbond 83627 standby Voltage Sensor 5: +5V sb

Voltage 6 external SIO Winbond 83627 Voltage Sensor: +12V

4.10 API Ressources for Board Driver

Available API ressources if Kontron Board Driver for JIDA32 & EAPI is used:

4.10.1 I2C

BUS Type Constant

I2C 0 External JIDA_I2C_TYPE_EXT_I2C

I2C 1 SMBus JIDA_I2C_TYPE_SMB

I2C 2 CRT JIDA_I2C_TYPE_CRT

I2C 3 LVDS/JILI JIDA_I2C_TYPE_JILI

I2C 4 SDVO JIDA_I2C_TYPE_VIDEO

I2C 5 SDVO Channel B DDC1 JIDA_I2C_TYPE_SDVOB_DDC1

I2C 6 SDVO Channel B DDC2 JIDA_I2C_TYPE_SDVOB_DDC2

I2C 7 SDVO Channel C DDC1 JIDA_I2C_TYPE_SDVOC_DDC1

I2C 8 SDVO Channel C DDC2 JIDA_I2C_TYPE_SDVOC_DDC2

I2C 9 Internal JIDA_I2C_TYPE_PRIMARY

COMe-cDC2 / Features and Interfaces

4.10.2 Storage

Device Function

EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use)

4.10.3 GPIO

Port Function

IO-Port 0 GPI0 Port

Bit 0-3: Input Bit 4-7: Output

4.10.4 Onboard Hardware Monitor

Sensor Function

Temp 0 CPU Temperature (measured with ADT7475 HWM)

Temp 1 Board Temperature (internal IC temperature of onboard ADT7475 HWM)

Temp 2 Chipset Temperature

FAN 0 Onboard CPU FAN

Voltage 0 Module RTC Battery input

Voltage 1 Module 3.3V S0 voltage

4.10.5 SIO Winbond 83627DHGP

Sensor is only available if external carrier board SIO Windbond/Nuvoton 83627DHGP is present

Sensor Function

Temp 3 Temp Sensor 1 (SYSTIN)

Temp 4 Temp Sensor 2 (CPUTIN)

Temp 5 Temp Sensor 3 (AUXTIN)

FAN 1 FAN Sensor 0 (SYSFANIN)

FAN 2 FAN Sensor 1 (CPUFANIN0)

FAN 3 FAN Sensor 2 (AUXFANIN0)

FAN 4 FAN Sensor 3 (SYSFANIN1)

Voltage 2 Voltage Sensor 0: VCore

Voltage 3 Voltage Sensor 1: VIN0

Voltage 4 Voltage Sensor 2: AVCC

Voltage 5 Voltage Sensor 3: 3VCC

Voltage 6 Voltage Sensor 4: VIN1

Voltage 7 Voltage Sensor 5: VIN2

Voltage 8 Voltage Sensor 6: VIN3

Voltage 9 Voltage Sensor 7: 3VSB

Voltage 10 Voltage Sensor 8: VBAT

COMe-cDC2 / Features and Interfaces

4.10.6 SIO Winbond 83627HG

Sensor is only available if external carrier board SIO Windbond/Nuvoton 83627HG is present

Sensor Function

Temp 3 Temp Sensor 1 (SYSTIN)

Temp 4 Temp Sensor 2 (CPUTIN)

Temp 5 Temp Sensor 3 (AUXTIN)

FAN 1 FAN Sensor 0 (SYSFANIN)

FAN 2 FAN Sensor 1 (CPUFANIN0)

FAN 3 FAN Sensor 2 (AUXFANIN0)

FAN 4 FAN Sensor 3 (SYSFANIN1)

Voltage 2 Voltage Sensor 0: VCoreA

Voltage 3 Voltage Sensor 1: VCoreB

Voltage 4 Voltage Sensor 2: +3.3V VIN

Voltage 5 Voltage Sensor 3: +5V AVCC

Voltage 6 Voltage Sensor 4: +12V VIN

Voltage 7 Voltage Sensor 5: -12V VIN

Voltage 8 Voltage Sensor 6: -5V VIN

Voltage 9 Voltage Sensor 7: VSB

Voltage 10 Voltage Sensor 8: VBAT

The shown resource assignment is valid for Windows operating systems with standard API and hardware configuration only. There may be OS specific and customized assignments that differ from the tables shown in this chapter. Please have a look at the API documentation for additional information.

COMe-cDC2 / Features and Interfaces

4.11 GPIO - General Purpose Input and Output

The COMe-cDC2 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available.

Signal Pin Description

GPI0 A54 General Purpose Input 0

GPI1 A63 General Purpose Input 1

GPI2 A67 General Purpose Input 2

GPI3 A85 General Purpose Input 3

GPO0 A93 General Purpose Output 0

GPO1 B54 General Purpose Output 1

GPO2 B57 General Purpose Output 2

GPO3 B63 General Purpose Output 3

Configuration

The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver download packet on our customer section.

COMe-cDC2 / Features and Interfaces

4.12 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive state into normal operation.

The COMe-cDC2 offers a watchdog which works with two stages that can be programmed independently and used one by one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If deassertion during runtime is necessary please ask your Kontron technical support for further help.

COMe-cDC2 / Features and Interfaces

4.13 Flash Backup Feature

The COMe-cDC2 supports a new functionality called “Flash Backup”. This new feature allows saving custom defaults directly into the Flash. With invalid EEPROM data or without a CMOS EEPROM, the module will start up with these custom defaults. It’s possible to save this BIOS with changed defaults to an image and flash it on other modules.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

at Kontron’s Customer Section)

» Extract the BIOS including custom defaults with afudos or kflash utility for windows

Tool Command

AFUDOS

c:\>afudos.exe biosname.rom /O

KFLASH

c:\>kflash.exe backup biosname.rom

COMe-cDC2 / Features and Interfaces

Flash your BIOS with custom defaults:

To flash a BIOS with customized defaults extracted like described above, use following options

Operating System Command

Windows OS

c:\>kflash.exe flash biosname.rom /bncr

DOS

c:\>afudos.exe biosname.rom /p /b /n /c c:\>jidacmos.exe eep /clean

kflash.exe is a shell tool included in Kontron K-Station System Utility Package. jidacmos utility is included in the BIOS download packages at Kontron's customer section.

COMe-cDC2 / Features and Interfaces

4.14 Speedstep Technology

The Intel® processors offers the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It let you customize high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By disabling the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

COMe-cDC2 / Features and Interfaces

4.15 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

COMe-cDC2 / Features and Interfaces

4.16 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the processor—those that store the architectural state but not duplicating the main execution resources. This allows a HyperThreading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies on the Operating System.

COMe-cDC2 / Features and Interfaces

4.17 ACPI Suspend Modes and Resume Events

The COMe-cDC2 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is not supported by the BIOS (S4_BIOS) but S4_OS is supported by the following operating systems:

» Windows XP

» Windows Vista

» Windows 7

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

(1) OS must support wake up via USB devices and baseboard must power the USB Port with StBy-Voltage

(2) WakeOnLan must be enabled in BIOS setup and driver options

COMe-cDC2 / System Ressources

5 System Ressources

5.1 Interrupt Request (IRQ) Lines

Please be aware that an ACPI OS decides itself on resource usage. The tables below show only an example distribution.

5.1.1 In 8259 PIC Mode

IRQ# Used For Available Comment

0 Timer 0 No -

1 Keyboard No -

2 Slave 8259 No -

3 COM2 Yes Note(1)

4 COM1 Yes Note(1)

5 Free Yes -

6 Floppy Dr ive Controller Yes Note(1)

7 LPT1 Yes Note(1)

8 RTC No -

9 SCI No Note(2)

10 Free Yes -

11 Free Yes -

12 PS/2 Mouse No Note(1)

13 FPU No -

14 IDE0 No Note(1)

15 IDE1 No Note(1)

1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.

2 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control Interrupt (SCI) in ACPI mode. Currently not free in Non-ACPI mode.

COMe-cDC2 / System Ressources

5.1.2 In APIC mode

IRQ# Used For Available Comment

0 Timer 0 No -

1 Keyboard No -

2 Slave 8259 No -

3 COM2 Yes Note (1)

4 COM1 Yes Note (1)

5 PCI/LPT2 Yes -

6 Floppy Dr ive Controller Yes Note (1)

7 LPT1 Yes Note (1)

8 RTC No -

9 SCI No Note (2)

10 COM3 No Note (1)

11 COM4 No Note (1)

12 PS/2 Mouse Yes Note (1)

13 FPU No -

14 IDE0 No Note (1)

15 IDE1 No Note (1)

16 PIRQ[A] For PCI PCI IRQ line 1 + Graphics controller + HD Audio

Controller + secondary IDE

17 PIRQ[B] For PCI PCI IRQ line 2 + AC'97 Audio controller

18 PIRQ[C] For PCI PCI IRQ line 3 + USB UHCI controller #3 + SATA

(native mode)

19 PIRQ[D] For PCI PCI IRQ line 4 + USB UHCI controller #2 + IDE

(native mode)

20 PIRQ[E] No Lan Controller

21 PIRQ[F] No -

22 PIRQ[G] No -

23 PIRQ[H] No USB EHCI controller, USB UCHI controller #1

1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.

2 Unavailable in Advanced Configuration and Power Interface (ACPI) mode. Used as System Control Interrupt (SCI) in ACPI mode. Currently not free in Non-ACPI mode.

5.2 Direct Memory Access (DMA) Channels

DMA# Used For Available Comment

0 No -

1 No -

2 FDC No If the “used-for” device is disabled in

setup, the corresponding DMA channel is avaialble for other devices

3 LPT No Unavailable if LPT is used in ECP mode

4 Cascade No -

5 No -

6 No -

7 No -

5.3 Memory Area

Upper Memory Used For Available Comment

C0000h-CFFFFh VGA BIOS No

D0000h-DFFFFh Yes LPC Bus or Shadow RAM

E0000h-EFFFFh System BIOS No

COMe-cDC2 / System Ressources

5.4 I/O Address Map

Upper Memory Used For Available Comment

480h-4BFh Chipset No Always used by chipset

800h-87Fh Chipset No Always used by chipset

A00h-AFFh Chipset No Always used by chipset

1000h> PCI No

5.5 External Inter-IC (I2C) Bus

I2C Address Used For Available Comment JIDA Bus Nr.

5.6 System Management (SM) Bus

I2C Address Used For Available Comment JIDA Bus Nr.

10h SMB Hoste No Do not use under any

circumstances.

12h SMART_Charger No Only be used by a SMB Charger 1

14h SMART_Selector No Only be used by a SMB Selector

or Manager

16h SMART_Batter y No Only be used by a SMB Battery 1

A0h SPD No 1

D2h Clockgenerator No Do not use ander any

circumstances

5.7 JILI I2C Bus

I2C Address Used For Available Comment JIDA Bus Nr.

A0h DDC No EEPROM for JILI Data 3

62h MAX5362 No DAC for Backlight brightness 3

JIDA Bus Nr. 0 is for internal use only.

COMe-cDC2 / Connectors

6 Connectors

The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express™ Specification and COM Express™ Design Guide for detailed, design-level information.

6.1 Connector Location

COMe-cDC2 / Connectors

6.2 Pinout List

6.2.1 General Signal Description

Type Descr iption

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

Output Analog

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

Pull-Up Resistor

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to withstand the maximum available current the enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950

COMe-cDC2 / Connectors

6.2.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND Power Ground PWR - -

A2 GBE0_MDI3- GBE0_MDI3_N ; Ethernet Receive Data - DP-I - -

A3 GBE0_MDI3+ GBE0_MDI3_P ; Ethernet Receive Data - DP-I - -

A4 GBE0_LINK100# GBE0_LINK100# ; Ethernet Speed LED O-3,3 - -

A5 GBE0_LINK1000# GBE0_LINK1000# ; Ethernet Speed LED O-3,3 - -

A6 GBE0_MDI2- GBE0_MDI2_N ; Ethernet Receive Data - DP-I - -

A7 GBE0_MDI2+ GBE0_MDI2_P ; Ethernet Receive Data - DP-I - -

A8 GBE0_LINK# GBE0_LINK# ; LAN Link LED OD - -

A9 GBE0_MDI1- GBE0_MDI1_N ; Ethernet Receive Data - DP-I - -

A10 GBE0_MDI1+ GBE0_MDI1_P ; Ethernet Receive Data + DP-I - -

A11 GND Power Ground PWR - -

A12 GBE0_MDI0- GBE0_MDI0_N ; Ethernet Transmit Data - DP-O - -

A13 GBE0_MDI0+ GBE0_MDI0_P ; Ethernet Transmit Data + DP-O - -

A14 GBE0_CTREF GBE0_CTREF O-1,8 - -

A15 SUS_S3# PM_SLP_S3_EXT# O-3,3 - -

A16 SATA0_TX+ SATA_TX0_P ; SATA 0 Transmit Data + DP-O - -

A17 SATA0_TX- SATA_TX0_N ; SATA 0 Transmit Data - DP-O - -

A18 SUS_S4# PM_SLP_S4_EXT# O-3,3 - -

A19 SATA0_RX+ SATA_RX0_P ; SATA 0 Receive Data + DP-I - -

A20 SATA0_RX- SATA_RX0_N ; SATA 0 Receive Data - DP-I - -

A21 GND Power Ground PWR - -

A22 SATA2_TX+ SATA_TX2_P ; SATA 2 Transmit Data + DP-O - -

A23 SATA2_TX- SATA_TX2_N ; SATA 2 Transmit Data - DP-O - -

A24 SUS_S5# PM_SLP_S#5 O-3,3 - -

A25 SATA2_RX+ SATA_RX2_P ; SATA 2 Receive Data + DP-I - -

A26 SATA2_RX- SATA_RX2_N ; SATA 2 Receive Data - DP-I - -

A27 BATLOW# PM_BATLOW# ; Battery Low I-3,3 PU 8k25 3,3V (S5) -

A28 ATA_ACT# ATA_LED# ; SATA LED O-3,3 PU 15k in ICH7 -

A29 AC_SYNC HDA_SYNC ; HD Audio Sync O-3,3 PD 20k in ICH7 -

A30 AC_RST# HDA_RST# ; HD Audio Reset O-3,3 - -

A31 GND Power Ground PWR - -

A32 AC_BITCLK HDA_BITCLK ; HD Audio Clock O-3,3 int. PD 20k in ICH7 -

A33 AC_SDOUT HDA_SDOUT ; HD Audio Data O-3,3 int. PD 20k in ICH7 -

A34 BIOS_DISABLE# BIOS_DISABLE# I-3,3 PU 10k 3,3V (S0) -

A35 THRMTRIP# EXT_THRMTRIP# I/O-3,3 PU 10k 3,3V (S0) -

A36 USB6- USB6_N ; USB Data – Port6 DP-I/O PD 15k in ICH7 -

A37 USB6+ USB6_P ; USB Data + Port6 DP-I/O PD 15k in ICH7 -

A38 USB_6_7_OC# USB_67_OC# ; USB OverCurrent Port 6/7 I-3,3 PU 10k 3,3V (S5) -

A39 USB4- USB4_N ; USB Data - Port4 DP-I/O PD 15k in ICH7 -

A40 USB4+ USB4_P ; USB Data + Port4 DP-I/O PD 15k in ICH7 -

A41 GND Power Ground PWR - -

A42 USB2- USB2_N ; USB Data - Port2 DP-I/O PD 15k in ICH7 -

A43 USB2+ USB2_P ; USB Data + Port2 DP-I/O PD 15k in ICH7 -

A44 USB_2_3_OC# USB_23_OC# ; USB OverCurrent Port 2/3 I-3,3 PU 10k 3,3V (S5) -

A45 USB0- USB0_N ; USB Data - Port0 DP-I/O PD 15k in ICH7 -

A46 USB0+ USB0_P ; USB Data + Port0 DP-I/O PD 15k in ICH7 -

A47 VCC_RTC V_BAT PWR 3V - -

A48 EXCD0_PERST# EXCD0_PERST#;Express card reset O-3,3 - -

A49 EXCD0_CPPE# EXCD0_CPPE# ; capable c. request I-3,3 PU 8k25 3,3V (S5) -

A50 LPC_SERIRQ LPC_SERIRQ ; Serial Interrupt Request IO-3,3 PU 8k25 3,3V (S0) -

A51 GND Power Ground PWR - -

A52 PCIE_TX5+ nc Nc - -

A53 PCIE_TX5- nc Nc - -

A54 GPI0 EXT_GPI0 ; General Purpose Input 0 I-3,3 PU 10k 3,3V (S0) -

A55 PCIE_TX4+ nc nc - -

A56 PCIE_TX4- nc nc - -

A57 GND Power Ground PWR - -

A58 PCIE_TX3+ PCI Express lane 3 + Transmit DP-O - Only available if no LAN is

equipped.

A59 PCIE_TX3- PCI Express lane 3 - Transmit DP-O - Only available if no LAN is

equipped.

A60 GND Power Ground PWR - -

A61 PCIE_TX2+ PCI Express lane 2 + Transmit DP-O - -

A62 PCIE_TX2- PCI Express lane 2 - Transmit DP-O - -

A63 GPI1 EXT_GPI1 ; General Purpose Input 1 I-3,3 PU 10k 3,3V (S0) -

COMe-cDC2 / Connectors

A64 PCIE_TX1+ PCI Express lane 1 + Transmit DP-O - -

A65 PCIE_TX1- PCI Express lane 1 - Transmit DP-O - -

A66 GND Power Ground PWR - -

A67 GPI2 EXT_GPI2 ; General Purpose Input 2 I-3,3 PU 10k 3,3V (S0) -

A68 PCIE_TX0+ PCI Express lane 0 + Transmit DP-O - -

A69 PCIE_TX0- PCI Express lane 0 - Transmit DP-O - -

A70 GND Power Ground PWR - -

A71 LVDS_A0+ LVDS_A_DATA0_P ; LVDS Channel A Data0+ DP-O - -

A72 LVDS_A0- LVDS_A_DATA0_N ; LVDS Channel A Data0- DP-O - -

A73 LVDS_A1+ LVDS_A_DATA1_P ; LVDS Channel A Data1+ DP-O - -

A74 LVDS_A1- LVDS_A_DATA1_N ; LVDS Channel A Data1- DP-O - -

A75 LVDS_A2+ LVDS_A_DATA2_P ; LVDS Channel A Data2+ DP-O - -

A76 LVDS_A2- LVDS_A_DATA2_N ; LVDS Channel A Data2- DP-O - -

A77 LVDS_VDD_EN LVDS_VDD_EN ; LVDS Panel Power Control O-3,3 PD 100k -

A78 LVDS_A3+ nc nc - -

A79 LVDS_A3- nc nc - -

A80 GND Power Ground PWR - -

A81 LVDS_A_CK+ LVDS_A_CLK_P ; LVDS Channel A Clock+ DP-O - -

A82 LVDS_A_CK- LVDS_A_CLK_N ; LVDS Channel A Clock- DP-O - -

A83 LVDS_I2C_CK LVDS_DDC_CLK ; JILI I2C Clock I/O-3,3 PU 2k21 3,3V (s0) -

A84 LVDS_I2C_DAT LVDS_DDC_DATA ; JILI I2C Data I/O-3,3 PU 2k21 3,3V (s0) -

A85 GPI3 EXT_GPI3 ; General Purpose Input 3 I-3,3 PU 10k 3,3V (S0) -

A86 KBD_RST# KBD_RST# ; Keyboard Reset I-3,3 PU 10k 3,3V (S0) -

A87 KBD_A20GATE KBD_A20GATE I-3,3 PU 10k 3,3V (S0) -

A88 PCIE0_CK_REF+ CLK_PCIE_CON_P DP-O - -

A89 PCIE0_CK_REF- CLK_PCIE_CON_N DP-O - -

A90 GND Power Ground PWR - -

A91 RSVD n.c. Nc - -

A92 RSVD n.c. Nc - -

A93 GPO0 EXT_GPO0 ; General Purpose Output 0 O-3,3 PD 10k -

A94 RSVD n.c. Nc - -

A95 RSVD n.c. Nc - -

A96 GND Power Ground PWR - -

A97 VCC_12V 12V VCC PWR - 8.5-18V

A98 VCC_12V 12V VCC PWR - 8.5-18V

A99 VCC_12V 12V VCC PWR - 8.5-18V

A100 GND Power Ground PWR - -

A101 VCC_12V 12V VCC PWR - 8.5-18V

A102 VCC_12V 12V VCC PWR - 8.5-18V

A103 VCC_12V 12V VCC PWR - 8.5-18V

A104 VCC_12V 12V VCC PWR - 8.5-18V

A105 VCC_12V 12V VCC PWR - 8.5-18V

A106 VCC_12V 12V VCC PWR - 8.5-18V

A107 VCC_12V 12V VCC PWR - 8.5-18V

A108 VCC_12V 12V VCC PWR - 8.5-18V

A109 VCC_12V 12V VCC PWR - 8.5-18V

A110 GND Power Ground PWR - -

COMe-cDC2 / Connectors

6.2.3 Connector X1A Row B

Pin Signal Description Type Termination Comment

B1 GND Power Ground PWR - -

B2 GBE0_ACT GBE0_ACT# ; Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC_FRAME# ; LPC Frame Indicator I-3,3 - -

B4 LPC_AD0 LPC_AD0 ; LPC Adress & DATA Bus I/O-3,3 PU 20k in ICH7 -

B5 LPC_AD1 LPC_AD1 ; LPC Adress & DATA Bus I/O-3,3 PU 20k in ICH7 -

B6 LPC_AD2 LPC_AD2 ; LPC Adress & DATA Bus I/O-3,3 PU 20k in ICH7 -

B7 LPC_AD3 LPC_AD3 ; LPC Adress & DATA Bus I/O-3,3 PU 20k in ICH7 -

B8 LPC_DRQ0# LPC_DRQ#0 ; LPC Request 0 I-3,3 PU 20k in ICH7 -

B9 LPC_DRQ1# LPC_DRQ#1 ; LPC Request 1 I-3,3 PU 20k in ICH7 -

B10 LPC_CLK CLK_LPC_33M_EXT ; 33MHz LPC clock O-3,3 - -

B11 GND Power Ground PWR - -

B12 PWRBTN# EXT_PWRBTN# ; Power Button I-3,3 PU 10k 3,3V (S5) -

B13 SMB_CK SMB_CLK_EXT ; SMBUS Clock O-3,3 PU 2k2 3,3V (S5) -

B14 SMB_DAT SMB_DATA_EXT ; SMBUS Data IO-3,3 PU 2k2 3,3V (S5) -

B15 SMB_ALERT# SMB_ALERT# ; SMBUS Interrupt IO-3,3 PU 1k0 3,3V (S5) -

B16 SATA1_TX+ SATA_TX1_P ; SATA 1 Transmit Data + DP-O - -

B17 SATA1_TX- SATA_TX1_N ; SATA 1 Transmit Data - DP-O - -

B18 SUS_STAT# PM_SUS_ STAT# O-3,3 - -

B19 SATA1_RX+ SATA_RX1_P ; SATA 1 Receive Data + DP-I - -

B20 SATA1_RX- SATA_RX1_N ; SATA 1 Receive Data - DP-I - -

B21 GND Power Ground PWR - -

B22 SATA3_TX+ nc nc - -

B23 SATA3_TX- nc nc - -

B24 PWR_OK EXT_PWR_OK ; Power OK I-3,3 - -

B25 SATA3_RX+ nc nc - -

B26 SATA3_RX- nc nc - -

B27 WDT WDT ; Watch Dog Timer O-3,3 - -

B28 AC_SDIN2 HDA_SDIN2_ICH ; HD Audio Serial Input Data 2 I-3,3 PD 20k in ICH7 -

B29 AC_SDIN1 HDA_SDIN1_ICH ; HD Audio Serial Input Data 1 I-3,3 PD 20k in ICH7 -

B30 AC_SDIN0 HDA_SDIN0_ICH ; HD Audio Serial Input Data 0 I-3,3 PD 20k in ICH7 -

B31 GND Power Ground PWR - -

B32 SPKR HDA_SPKR ; Speaker O-3,3 PD 20k in ICH7 -

B33 I2C_CK I2C_CLK_EXT ; I2C clock O-3,3 PU 2k21 3,3V (S0) -

B34 I2C_DAT I2C_DATA_EXT ; I2C data I/O-3,3 PU 2k21 3,3V (S0) -

B35 THRM# PM_THRM# ; Over Temperature O-3,3 - -

B36 USB7- USB7_N ; USB Data – Por t7 DP-I/O PD 15k in ICH7 -

B37 USB7+ USB7_P ; USB Data + Port7 DP-I/O PD 15k in ICH7 -

B38 USB_4_5_OC# USB_45_OC# ; USB OverCurrent Port 4/5 I-3,3 PU 10k 3,3V (S5) -

B39 USB5- USB5_N ; USB Data – Por t5 DP-I/O PD 15k in ICH7 -

B40 USB5+ USB5_P ; USB Data + Port5 DP-I/O PD 15k in ICH7 -

B41 GND Power Ground PWR - -

B42 USB3- USB3_N ; USB Data – Por t3 DP-I/O PD 15k in ICH7 -

B43 USB3+ USB3_P ; USB Data + Port3 DP-I/O PD 15k in ICH7 -

B44 USB_0_1_OC# USB_01_OC# ; USB OverCurrent Port 0/1 I-3,3 PU 10k 3,3V (S5) -

B45 USB1- USB1_N ; USB Data – Por t1 DP-I/O PD 15k in ICH7 -

B46 USB1+ USB1_P ; USB Data + Port1 DP-I/O PD 15k in ICH7 -

B47 EXCD1_PERST# EXCD1_PERST# ; Express card reset O-3,3 - -

B48 EXCD1_CPPE# EXCD1_CPPE# ; capable c. request I-3,3 PU 8k25 3,3V (S0) -

B49 SYS_RESET# EXT_SYS_RESET# ; Reset Input I-3,3 PU 10k 3,3V (S5) -

B50 CB_RESET# CB_RESET# ; Carrier board Reset O-3,3 - -

B51 GND Power Ground PWR - -

B52 PCIE_RX5+ nc Nc - -

B53 PCIE_RX5- nc Nc - -

B54 GPO1 EXT_GPO1 ; General Purpose Output 1 O-3,3 - -

B55 PCIE_RX4+ nc nc - -

B56 PCIE_RX4- nc nc - -

B57 GPO2 EXT_GPO2 ; General Purpose Output 2 O-3,3 - -

B58 PCIE_RX3+ PCI Express lane 3 + Recieve DP-I - only available if no LAN

B59 PCIE_RX3- PCI Express lane 3 - Recieve DP-I - only available if no LAN

B60 GND Power Ground PWR - -

B61 PCIE_RX2+ PCI Express lane 2 + Recieve DP-I - -

B62 PCIE_RX2- PCI Express lane 2 - Recieve DP-I - -

B63 GPO3 EXT_GPO3 ; General Purpose Output 3 O-3,3 - -

B64 PCIE_RX1+ PCI Express lane 1 + Recieve DP-I - -

COMe-cDC2 / Connectors

B65 PCIE_RX1- PCI Express lane 1 - Recieve DP-I - -

B66 WAKE0# PCIE_WAKE# IO-3,3 PU 1k0 3,3V (S5) -

B67 WAKE1# WAKE1# I-3,3 PU 10k 3,3V (S5) -

B68 PCIE_RX0+ PCI Express lane 0 + Recieve DP-I - -

B69 PCIE_RX0- PCI Express lane 0 - Recieve DP-I - -

B70 GND Power Ground PWR - -

B71 LVDS_B0+ LVDS_B_DATA0_P ; LVDS Channel B Data0+ DP-O - -

B72 LVDS_B0- LVDS_B_DATA0_N ; LVDS Channel B Data0- DP-O - -

B73 LVDS_B1+ LVDS_B_DATA1_P ; LVDS Channel B Data1+ DP-O - -

B74 LVDS_B1- LVDS_B_DATA1_N ; LVDS Channel B Data1- DP-O - -

B75 LVDS_B2+ LVDS_B_DATA2_P ; LVDS Channel B Data2+ DP-O - -

B76 LVDS_B2- LVDS_B_DATA2_N ; LVDS Channel B Data2- DP-O - -

B77 LVDS_B3+ nc nc - -

B78 LVDS_B3- nc nc - -

B79 LVDS_BKLT_EN LVDS_BKLT_CTRL ; Panel Backlight ON O-3,3 PD 100k -

B80 GND Power Ground PWR - -

B81 LVDS_B_CK+ LVDS_B_CLK_P ; LVDS Channel B Clock+ DP-O - -

B82 LVDS_B_CK- LVDS_B_CLK_N ; LVDS Channel B Clock- DP-O - -

B83 LVDS_BKLT_CTRL LVDS_BKLT_CTRL ; Backlight Brightness Contr. O-3,3 PD 100k -

B84 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - -

B85 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - -

B86 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - -

B87 VCC_5V_SBY +V_STBY_ETX ; 5V Standby PWR 5V (S5) - -

B88 RSVD n.c. nc - -

B89 VGA_RED CRT_RED ; Analog Video RGB-RED OA PD 150R -

B90 GND Power Ground PWR - -

B91 VGA_GRN CRT_GREEN ; Analog Video RGB-GREEN OA PD 150R -

B92 VGA_BLU CRT_BLUE ; Analog Video RGB-BLUE OA PD 150R -

B93 VGA_HSYNC CRT_HSYNC ; Analog Video H-Sync O-3,3 - -

B94 VGA_VSYNC CRT_VSYNC ; Analog Video V-Sync O-3,3 - -

B95 VGA_I2C_CK CRT_DDC_CLK ; Display Data Channel Clock I/O-5 PU 2k21 5V (S0) -

B96 VGA_I2C_DAT CRT_DDC_DATA ; Display Data Channel Data I/O-5 PU 2k21 5V (S0) -

B97 TV_DAC_A T V_DACA_CVBS ; Composite CVBS OA PD 150R -

B98 TV_DAC_B TV_DADB_Y ; TV Luminance Signal OA PD 150R -

B99 TV_DAC_C TV_DADC_C ; TV Chrominance Signal OA PD 150R -

B100 GND Power Ground PWR - -

B101 VCC_12V 12V VCC PWR - 8.5-18V

B102 VCC_12V 12V VCC PWR - 8.5-18V

B103 VCC_12V 12V VCC PWR - 8.5-18V

B104 VCC_12V 12V VCC PWR - 8.5-18V

B105 VCC_12V 12V VCC PWR - 8.5-18V

B106 VCC_12V 12V VCC PWR - 8.5-18V

B107 VCC_12V 12V VCC PWR - 8.5-18V

B108 VCC_12V 12V VCC PWR - 8.5-18V

B109 VCC_12V 12V VCC PWR - 8.5-18V

B110 GND Power Ground PWR - -

COMe-cDC2 / Connectors

6.2.4 Connector X1B Row C

Pin Signal Description Type Termination Comment

C1 GND Power Ground PWR - -

C2 IDE_D7 IDE Data Bus I/O-5T - -

C3 IDE_D6 IDE Data Bus I/O-5T - -

C4 IDE_D3 IDE Data Bus I/O-5T - -

C5 IDE_D15 IDE Data Bus I/O-5T - -

C6 IDE_D8 IDE Data Bus I/O-5T - -

C7 IDE_D9 IDE Data Bus I/O-5T - -

C8 IDE_D2 IDE Data Bus I/O-5T - -

C9 IDE_D13 IDE Data Bus I/O-5T - -

C10 IDE_D1 IDE Data Bus I/O-5T - -

C11 GND Power Ground PWR - -

C12 IDE_D14 IDE Data Bus I/O-5T - -

C13 IDE_IORDY IDE I/O Ready I/O-5T PU 4k7 3,3V (S0) -

C14 IDE_IOR# IDE I/O Read I/O-3,3 - -

C15 PCI_PME# PCI Power Management Event I/O-3,3 - -

C16 PCI_GNT2# PCI Bus Grant 2 O-3,3 PU 20k in ICH7 -

C17 PCI_REQ2# PCI Bus Request 2 I-5T PU 8k2 3,3V (S0) -

C18 PCI_GNT1# PCI Bus Grant 1 O-3,3 PU 20k in ICH7 -

C19 PCI_REQ1# PCI Bus Request 1 I-5T PU 8k2 3,3V (S0) -

C20 PCI_GNT0# PCI Bus Grant 0 O-3,3 PU 20k in ICH7 -

C21 GND Power Ground PWR - -

C22 PCI_REQ0# PCI Bus Reqest 0 I-5T PU 8k2 3,3V (S0) -

C23 PCI_RST# PCI Bus Reset O-3,3 - -

C24 PCI_AD0 PCI Adress & Data Bus line I/O-5T - -

C25 PCI_AD2 PCI Adress & Data Bus line I/O-5T - -

C26 PCI_AD4 PCI Adress & Data Bus line I/O-5T - -

C27 PCI_AD6 PCI Adress & Data Bus line I/O-5T - -

C28 PCI_AD8 PCI Adress & Data Bus line I/O-5T - -

C29 PCI_AD10 PCI Adress & Data Bus line I/O-5T - -

C30 PCI_AD12 PCI Adress & Data Bus line I/O-5T - -

C31 GND Power Ground PWR - -

C32 PCI_AD14 PCI Adress & Data Bus line I/O-5T - -

C33 PCI_C/BE1# PCI Bus Cmd Byte enables 1 I/O-5T - -

C34 PCI_PERR# PCI Bus Grant Error I/O-5T PU 8k2 3,3V (S0) -

C35 PCI_LOCK# PCI Bus Lock I/O-5T PU 8k2 3,3V (S0) -

C36 PCI_DEVSEL# PCI Bus Device Select I/O-5T PU 8k2 3,3V (S0) -

C37 PCI_IRDY# PCI Bus Bus Initiator Ready I/O-5T PU 8k2 3,3V (S0) -

C38 PCI_C/BE2# PCI Bus Cmd Byte enables 2 I/O-5T - -

C39 PCI_AD17 PCI Adress & Data Bus line I/O-5T - -

C40 PCI_AD19 PCI Adress & Data Bus line I/O-5T - -

C41 GND Power Ground PWR - -

C42 PCI_AD21 PCI Adress & Data Bus line I/O-5T - -

C43 PCI_AD23 PCI Adress & Data Bus line I/O-5T - -

C44 PCI_C/BE3# PCI Bus Cmd Byte enables 3 I/O-5T - -

C45 PCI_AD25 PCI Adress & Data Bus line I/O-5T - -

C46 PCI_AD27 PCI Adress & Data Bus line I/O-5T - -

C47 PCI_AD29 PCI Adress & Data Bus line I/O-5T - -

C48 PCI_AD31 PCI Adress & Data Bus line I/O-5T - -

C49 PCI_IRQA# PCI Bus Interrupt Request A I-5T PU 8k2 3,3V (S0) -

C50 PCI_IRQB# PCI Bus Interrupt Request B I-5T PU 8k2 3,3V (S0) -

C51 GND Power Ground PWR - -

C52 PEG_RX0+ SDVO_TV_CLKIN_P DP-I - -

C53 PEG_RX0- SDVO_TV_CLKIN_N DP-I - -

C54 T YPE0# n.c. for type 2 module nc - -

C55 PEG_RX1+ SDVO_INT_P DP-I - -

C56 PEG_RX1- SDVO_INT_N DP-I - -

C57 T YPE1# n.c. for type 2 module nc - -

C58 PEG_RX2+ SDVO_FLDSTAL_P DP-I - -

C59 PEG_RX2- SDVO_FLDSTAL_N DP-I - -

C60 GND Power Ground PWR - -

C61 PEG_RX3+ n.c. nc - -

C62 PEG_RX3- n.c. nc - -

C63 RSVD n.c. nc - -

C64 RSVD n.c. nc - -

COMe-cDC2 / Connectors

C65 PEG_RX4+ n.c. nc - -

C66 PEG_RX4- n.c. nc - -

C67 RSVD n.c. nc - -

C68 PEG_RX5+ n.c. nc - -

C69 PEG_RX5- n.c. nc - -

C70 GND Power Ground PWR - -

C71 PEG_RX6+ n.c. nc - -

C72 PEG_RX6- n.c. nc - -

C73 SDVO_DATA SDVO_CTRLDATA I/O-3,3 - -

C74 PEG_RX7+ n.c. nc - -

C75 PEG_RX7- n.c. nc - -

C76 GND Power Ground PWR - -

C77 RSVD n.c. nc - -

C78 PEG_RX8+ n.c. nc - -

C79 PEG_RX8- n.c. nc - -

C80 GND Power Ground PWR - -

C81 PEG_RX9+ n.c. nc - -

C82 PEG_RX9- n.c. nc - -

C83 RSVD n.c. nc - -

C84 GND Power Ground PWR - -

C85 PEG_RX10+ n.c. nc - -

C86 PEG_RX10- n.c. nc - -

C87 GND Power Ground PWR - -

C88 PEG_RX11+ n.c. nc - -

C89 PEG_RX11- n.c. nc - -

C90 GND Power Ground PWR - -

C91 PEG_RX12+ n.c. nc - -

C92 PEG_RX12- n.c. nc - -

C93 GND Power Ground PWR - -

C94 PEG_RX13+ n.c. nc - -

C95 PEG_RX13- n.c. nc - -

C96 GND Power Ground PWR - -

C97 RSVD n.c. nc - -

C98 PEG_RX14+ n.c. nc - -

C99 PEG_RX14- n.c. nc - -

C100 GND Power Ground PWR - -

C101 PEG_RX15+ n.c. nc - -

C102 PEG_RX15- n.c. nc - -

C103 GND Power Ground PWR - -

C104 VCC_12V 12V VCC PWR - 8.5-18V

C106 VCC_12V 12V VCC PWR - 8.5-18V

C105 VCC_12V 12V VCC PWR - 8.5-18V

C107 VCC_12V 12V VCC PWR - 8.5-18V

C108 VCC_12V 12V VCC PWR - 8.5-18V

C109 VCC_12V 12V VCC PWR - 8.5-18V

C110 GND Power Ground PWR - -

COMe-cDC2 / Connectors

6.2.5 Connector X1B Row D

Pin Signal Description Type Termination Comment

D1 GND Power Ground PWR - -

D2 IDE_D5 IDE Data Bus I/O-5T - -

D3 IDE_D10 IDE Data Bus I/O-5T - -

D4 IDE_D11 IDE Data Bus I/O-5T - -

D5 IDE_D12 IDE Data Bus I/O-5T - -

D6 IDE_D4 IDE Data Bus I/O-5T - -

D7 IDE_D0 IDE Data Bus I/O-5T - -

D8 IDE_REQ IDE Data Bus I/O-5T - -

D9 IDE_IOW# IDE IO Wr ite O-3,3 - -

D10 IDE_ACK# IDE DMA Acknowledge O-3,3 - -

D11 GND Power Ground PWR - -

D12 IDE_IRQ IDE Interrupt Request I-5T PD 8k25 -

D13 IDE_A0 IDE Adress Bus O-3,3 - -

D14 IDE_A1 IDE Adress Bus O-3,3 - -

D15 IDE_A2 IDE Adress Bus O-3,3 - -

D16 IDE_CS1# IDE Chip Select Channel 0 O-3,3 - -

D17 IDE_CS3# IDE Chip Select Channel 1 O-3,3 - -

D18 IDE_RESET# IDE Hard Drive Reset O-3,3 - -

D19 PCI_GNT3# PCI Bus Grant 3 O-3,3 PU 20k in ICH7 int. PU 20k in ICH9 (if

PCIRST#=0 AND PWROK=1)

D20 PCI_REQ3# PCI Bus Reqest 0 I-5T PU 8k2 3,3V (S0) -

D21 GND Power Ground PWR - -

D22 PCI_AD1 PCI Adress & Data Bus line I/O-5T - -

D23 PCI_AD3 PCI Adress & Data Bus line I/O-5T - -

D24 PCI_AD5 PCI Adress & Data Bus line I/O-5T - -

D25 PCI_AD7 PCI Adress & Data Bus line I/O-5T - -

D26 PCI_C/BE0# PCI Bus Command and Byte enables 0 I/O-5T - -

D27 PCI_AD9 PCI Adress & Data Bus line I/O-5T - -

D28 PCI_AD11 PCI Adress & Data Bus line I/O-5T - -

D29 PCI_AD13 PCI Adress & Data Bus line I/O-5T - -

D30 PCI_AD15 PCI Adress & Data Bus line I/O-5T - -

D31 GND Power Ground PWR - -

D32 PCI_PAR PCI Bus Par ity I/O-5T - -

D33 PCI_SERR# PCI Bus System Error I/O-5T PU 8k2 3,3V (S0) -

D34 PCI_STOP# PCI Bus Stop I/O-5T PU 8k2 3,3V (S0) -

D35 PCI_TRDY# PCI Bus Target Ready I/O-5T PU 8k2 3,3V (S0) -

D36 PCI_FRAME# PCI Bus Cycle Frame I/O-5T PU 8k2 3,3V (S0) -

D37 PCI_AD16 PCI Adress & Data Bus line I/O-5T - -

D38 PCI_AD18 PCI Adress & Data Bus line I/O-5T - -

D39 PCI_AD20 PCI Adress & Data Bus line I/O-5T - -

D40 PCI_AD22 PCI Adress & Data Bus line I/O-5T - -

D41 GND Power Ground PWR - -

D42 PCI_AD24 PCI Adress & Data Bus line I/O-5T - -

D43 PCI_AD26 PCI Adress & Data Bus line I/O-5T - -

D44 PCI_AD28 PCI Adress & Data Bus line I/O-5T - -

D45 PCI_AD30 PCI Adress & Data Bus line I/O-5T - -

D46 PCI_IRQC# PCI Bus Interrupt Request C I-5T PU 8k2 3,3V (S0) -

D47 PCI_IRQD# PCI Bus Interrupt Request D I-5T PU 8k2 3,3V (S0) -

D48 PCI_CLKRUN# PCI Clock Run I-5T PU 8k25 3,3V (S0) -

D49 PCI_M66EN n.c. nc - -

D50 PCI_CLK CLK_PCI_33M_EXT ; PCI Clock 33MHz O-3,3 - -

D51 GND Power Ground PWR - -

D52 PEG_TX0+ SDVPB_RED_P DP-O - -

D53 PEG_TX0- SDVPB_RED_N DP-O - -

D54 PEG_LANE_RV# n.c. nc - -

D55 PEG_TX1+ SDVPB_GREEN_P DP-O - -

D56 PEG_TX1- SDVPB_GREEN_N DP-O - -

D57 TYPE2# n.c. for type 2 module nc - -

D58 PEG_TX2+ SDVPB_BLUE_P DP-O - -

D59 PEG_TX2- SDVPB_BLUE_N DP-O - -

D60 GND Power Ground PWR - -

D61 PEG_TX3+ SDVPB_CLK_P DP-O - -

D62 PEG_TX3- SDVPB_CLK_N DP-O - -

D63 RSVD - nc - -

COMe-cDC2 / Connectors

D64 RSVD - nc - -

D65 PEG_TX4+ n.c. nc - -

D66 PEG_TX4- n.c. nc - -

D67 GND Power Ground PWR - -

D68 PEG_TX5+ n.c. nc - -

D69 PEG_TX5- n.c. nc - -

D70 GND Power Ground PWR - -

D71 PEG_TX6+ n.c. nc - -

D72 PEG_TX6- n.c. nc - -

D73 SDVO_CLK SDVO_CTRLCLK I O-3,3 - -

D74 PEG_TX7+ n.c. nc - -

D75 PEG_TX7- n.c. nc - -

D76 GND Power Ground PWR - -

D77 IDE_CBLID IDE_CBLID# ; IDE cable type detect I/0-3,3 PD 10k -

D78 PEG_TX8+ n.c. nc - -

D79 PEG_TX8- n.c. nc - -

D80 GND Power Ground PWR - -

D81 PEG_TX9+ n.c. nc - -

D82 PEG_TX9- n.c. nc - -

D83 RSVD n.c. nc - - -

D84 GND Power Ground PWR - -

D85 PEG_TX10+ n.c. nc - -

D86 PEG_TX10- n.c. nc - -

D87 GND Power Ground PWR - -

D88 PEG_TX11+ n.c. nc - -

D89 PEG_TX11- n.c. nc - -

D90 GND Power Ground PWR - -

D91 PEG_TX12+ n.c. nc - -

D92 PEG_TX12- n.c. nc - -

D93 GND Power Ground PWR - -

D94 PEG_TX13+ n.c. nc - -

D95 PEG_TX13- n.c. nc - -

D96 GND Power Ground PWR - -

D97 PEG_ENABLE# n.c. nc PU 10k 3,3V (S0) -

D98 PEG_TX14+ n.c. nc - -

D99 PEG_TX14- n.c. nc - -

D100 GND Power Ground PWR - -

D101 PEG_TX15+ n.c. nc - -

D102 PEG_TX15- n.c. nc - -

D103 GND Power Ground PWR - -

D104 VCC_12V 12V VCC PWR - 8.5-18V

D105 VCC_12V 12V VCC PWR - 8.5-18V

D106 VCC_12V 12V VCC PWR - 8.5-18V

D107 VCC_12V 12V VCC PWR - 8.5-18V

D108 VCC_12V 12V VCC PWR - 8.5-18V

D109 VCC_12V 12V VCC PWR - 8.5-18V

D110 GND Power Ground PWR - -

The termination resistors in these tables are already mounted on the ETXexpress® board. Refer to the design guide for information about additional termination resistors.

COMe-cDC2 / BIOS Operation

7 BIOS Operation

The module is equipped with AMI® CORE8 BIOS, which is located in an onboard SPI/LPC flash memory. You can update the BIOS using a Flash utility.

7.1 Determining the BIOS Version

To determine the AMI® BIOS version, immediately press the Pause key on your keyboard as soon as you see the following text display in the upper left corner of your screen:

» BIOS Date: mm/dd/yyyy hh:mm:ss Ver: xx.xx.xx

» Kontron® BIOS Version <UNP1RXXX

7.2 BIOS Update

Kontron provides continous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with a detailed change description within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the BIOS Region (usually 4-8MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

COMe-cDC2 / BIOS Operation

7.3 Setup Guide

The AMIBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup program uses a number of menus to make changes and turn features on or off.

Functional keystrokes in POST:

Key Function

DEL

Enter Setup

F11

Boot Menu

CTRL+HOME

Initiate BIOS Recovery

7.3.1 Start AMI® BIOS Setup Utility

To start the AMI® BIOS setup utility, press <DEL> when the following string appears during bootup.

Press <DEL> to enter Setup

The Info Menu then appears.

The Setup Screen is composed of several sections:

Setup Screen Location Function

Menu Bar Top Lists and selects all top level menus.

Legend Bar Right side Bottom Lists setup navigation keys.

Item Specific Help Window Right side Top Help for selected item.

Menu Window Left Center Selection fields for current menu.

COMe-cDC2 / BIOS Operation

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates.

Key Function

<F1> or <Alt-H> General Help window.

<Esc> Exit menu.

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select fields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

<F9> Load the default configuration values for this menu.

<F10> Save and exit.

<Enter> Execute command or select submenu.

<Alt-R> Refresh screen.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The↑ ↓ Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor to each field.

General Help Window

Pressing <F1> or <Alt-F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window.

COMe-cDC2 / BIOS Operation

7.4 BIOS Setup

7.4.1 Main Menu

Feature Option Description

System Time [hh:mm:ss] <Tab>, <Shift-Tab>, or <Enter> selects field

System Date [mm-dd-yyyy] <Tab>, <Shift-Tab>, or <Enter> selects field

COMe-cDC2 / BIOS Operation

7.4.2 Module Info

Module Component Steppings

COMe-cDC2 / BIOS Operation

Module Software Revisions

Current LVDS Configuration

COMe-cDC2 / BIOS Operation

7.4.3 Advanced Menu

COMe-cDC2 / BIOS Operation

CPU Configuration

Feature Option Description

Max CPUID Value Limit

Disabled Enabled

Disabled for WindowsXP

Execute-Disable Bit Capability

Enabled Disabled

When disabled, force the XD feature flag to always return 0

Hyper Threading Technology

Enabled Disabled

Enable/Disable Hyper Threading Feature

DTS-based Thermal Management

Enabled Disabled

Enable/Disable Thermal Management utilizing the CPU’s Digital Thermal Sensor

SpeedStep

Enabled Disabled

Enables and Disables the SpeedStep power management feature

C-States

Enabled Disabled

Enables and Disables the C - States.

Enhanced C-State Modes

Enabled Disabled

CPI idle is set to enhanced C-states, when enabled

CPU Performance

High Middle Low

Select CPU Performance after Post

CPU Performance Table

High

1600MHz

Middle

1200MHz

Low

800MHz

COMe-cDC2 / BIOS Operation

IDE Configuration

Feature Option Description

ATA/IDE Configuration Disabled

Compatible Enhanced

Disables or selects the mode for the ATA/IDE interface

Legacy IDE Channels SATA only

SATA Pri, PATA Sec PATA only

Selects the IDE channel behavior in compatible mode. (Only visible when IDE is configured to Compatible

Configure SATA# as

IDE AHCI

Selects the SATA mode in Enhanced IDE mode

Configure SATA# Channels

Before PATA Behind PATA

Configure when the SATA controller is initialized in Enhanced IDE mode

Hard Disk Write Protect

Disabled Enabled

Disables/enables device write protection. It will be effective only if device is accessed through BIOS functions.

IDE Detect Time Out (Sec.)

[0-35] 35

Selects the time out value for the detection of ATA/ ATAPI devices

ATA(PI) 80Pin Cable Detection Host & Device

Host Device

Selects the mechanism for detecting 80Pin ATA(PI) cables.

COMe-cDC2 / BIOS Operation

IDE Device Submenu

Feature Option Description

Type Not Installed

Auto CD/DVD ARMD

Selects the type of the IDE Devices connected to the system

LBA/Large Mode Disabled

Auto

Disables the LBA mode or enables it, when a device supports it

Block (Multi-Sector Transfer) Disabled

Auto

Disabled: The data transfer from and to the device occurs one sector ata atime Auto: The data transfer from and to the device occurs multiple sectors at a time if the device supports ist

PIO Mode

Auto 0 1 2 3 4

(Auto) Configures the PIO Mode

DMA Mode

Auto SWDMAn MWDMAn UDMAn

SWDMA: Single Word DMA MWDMA: Multi Word DMA UDMA: Ultra DMA

S.M.A.R.T.

Auto Enabled Disabled

Disables, Enables or automatically enables the S.M.A.R.T feature (Self-Monitoring, Analysis and Reporting Technology)

32Bit Data Transfer

Enabled Disabled

Disables and Enables the 32Bit Data Transfer Mode

COMe-cDC2 / BIOS Operation

SuperIO Configuration

Feature Option Description

Onboard Floppy Controller

Disabled Enabled

Enables / Disables the floppy controller in BIOS

Serial Port1 Address Disabled

3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3

Selects the Address of COM Port 1

Serial Port2 Address Disabled

3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3

Selects the Address of COM Port 2

Serial Port2 Mode

Normal IrDA ASK IR

Parallel Port Address Disabled

378 278 3BC

Selects the Address of the LPT Port

Parallel Port Mode

Normal Bi-Directional ECP EPP+SPP ECP+EPP

Allows BIOS to Select Parallel Port Mode. (Only visible when Parallel Port enabled.)

Parallel Port IRQ IRQ5

IRQ7

Allows BIOS to Select Parallel Port IRQ. (Only visible when Parallel Port enabled.)

COMe-cDC2 / BIOS Operation

ACPI Settings

Feature Option Description

ACPI Version

ACPI v.3.0 ACPI v.2.0 ACPI v.1.0

Selects the ACPI version

ACPI APIC support

Enabled Disabled

Include ACPI APIC table pointer to RSDT pointer list.

Repost Video on S3 Resume No

Yes

If yes, Videobios is reinitialized after S3 Resume

Headless Mode

Disabled Enabled

Enables / Disables headless mode through ACPI

USB Device Wakeup From S3/S4

Disabled Enabled

Enables / Disables the possibility to wake up via USB from S3 and S4

High Performance Event Timer

Disabled Enabled

Enables / Disables the High Performance Event Timer

HPET Memory Address

FED00000h FED01000h FED02000h FED03000h

Selects the Address of the High Performance Event Timer, when enabled.

COMe-cDC2 / BIOS Operation

ACPI Cooling Options

Feature Option Description

Active Trip Point Disabled

40°C 45°C 50°C … 110°C

This value controls the temperature of the ACPI Active Trip Point - the point in which the OS will turn the CPU fan on.

Passive Trip Point

Disabled 40°C 45°C 50°C … 110°C

This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin throttling the CPU.

Passive TC1 value

1 2 3 … 16

This value sets the TC1 value for the ACPI Passive Cooling Formula. (Only visible when Passive Trip Point is enabled.)

Passive TC2 value 1

2 … 5 … 16

This value sets the TC2 value for the ACPI Passive Cooling Formula. (Only visible when Passive Trip Point is enabled.)

Passive TSP value 2

4 … 10 … 30

This item sets the TSP value for the ACPI Passive Cooling Formula. It represents in tenths of a second how often the OS will read the temperature when Passive Cooling is Enabled.

Critical Trip Point Disabled

40°C 45°C 50°C … 110°C

This value controls the temperature of the ACPI Critical Trip Point - the point in which the OS will shut off the system.

COMe-cDC2 / BIOS Operation

Passive Cooling

The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation

?P[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt)

?P is the performance delta, Tt is the target temperature = passive cooling trip point. The two coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply. It’s up to the end user to set the cooling preference of the system by setting the appropriate trip points in the BIOS setup.

See chapter 12 of the ACPI specification (www.acpi.info) for more details

COMe-cDC2 / BIOS Operation

PCI Express Configuration

Feature Option Description

Active State Power Management

Disabled Enabled

Enables/Disables PCI Express L0 and L1 link power states.

PCIE Port N

Auto Enabled Disabled

Enables/Disables or autoconfigures the PCIE Port N

PCIE High Priority Por t

Disabled Port 0 Port 1 Port 2 … Port 5

Select the PCIE Port that gets higher priority than the others.

PCIE Port N IOxAPIC Enable

Disabled Enabled

Enables/Disables the APIC Support for the PCIE Port N

COMe-cDC2 / BIOS Operation

USB Configuration

Feature Option Description

Legacy USB Support Auto

Disabled Enabled

Enables support for legacy USB. Auto option disables legacy support if no USB devices are connected.

Port 64/60 Emulation Disabled

Enabled

Enables IO port 60h/64h emuluation support.

USB 2.0 Controller Mode FullSpeed

HiSpeed

Configures the USB 2.0 controller in HiSpeed (480Mbps) or FullSpeed (12Mbps)

BIOS EHCI Hand-Off Disabled

Enabled

This is a workaround for an OS without EHCI hand-off support. The EHCI ownership change should claim by the EHCI driver

USB reset delay

Disabled Enabled

Enables extra delay after reset during USB initialization.

COMe-cDC2 / BIOS Operation

USB Mass Storage Device Configuration

Feature Option Description

USB Mass Storage Reset Delay 10 Sec

20 Sec 30 Sec 40 Sec

Number of seconds POST waits for the USB mass storage device after start unit command.

Emulation Type

Auto Floppy Forced FDD Hard Disk CDROM

If Auto USB devices with less than 530MB will be emulated as floppy and remaining as hard drive. Forced FDD option can be used to force a HDD formatted drive to boot as FDD (Ex. ZIP drive).

COMe-cDC2 / BIOS Operation

Hardware Health

COMe-cDC2 / BIOS Operation

Module Hardware Health

Feature Option Description

H/W Health Function Disabled

Enabled

Enables Hardware Health Monitoring Device.

PWM 1 Mode Setting Auto Fan Mode

Fan Always On Full Fan Disable Mode Fan Manually Mode

PWM Configuration Mode Setting

PWM 1 Ramp Rate

Time Slot 1 Time Slot 2 Time Slot 3 Time Slot 4 Time Slot 8 Time Slot 12 Time Slot 24 Time Slot 48

PWM 1 Control Duty Cycle

[0…255] 200

Controls the length of a PWM duty cycle.

Pulses/Rev

[1…4] 2

COMe-cDC2 / BIOS Operation

Baseboard Hardware Health

Feature Option Description

H/W Health Function

Disabled Enabled

Enables Hardware Health Monitoring Device.

Fan Speed Devisor 1 1

2 4 … 128

Sets the register setting for the baseboard windbond fan speed devisor for fan 1

Fan Speed Devisor 2 1

2 4 … 128

Sets the register setting for the baseboard windbond fan speed devisor for fan 2

Fan Speed Devisor 3 1

2 4 … 128

Sets the register setting for the baseboard windbond fan speed devisor for fan 3

COMe-cDC2 / BIOS Operation

Miscellaneous Settings

Feature Option Description

Restore on AC Power Loss Power Of f

Power On

Controls the behavior after Power Loss in ATX mode

Power Up Delay

Disabled 4 to 5 seconds 3 to 4 seconds 2 to 3 seconds 1 to 2 seconds

Delay after power up, when in an G3 cycle

Keyboard Crisis Recovery Disabled

Enabled

Enables/Disables Keyboard Crisis Recovery function by USB keyboard

External I2C Bus Speed 800Khz

400Khz 200Khz … 1Khz

Selects the Speed of the I2C bus interface

S5 Eco

Disabled Enabled

Enables/Disables S5 Eco Mode to reduce supply current in soft of f (S5). See manual for usage of S5 Eco.

Spread Spectrum

Disabled PCI CPU both

Enalbes/Disables Spread Spectrum for the selected clocks.

Post User Delay None

1 Sec 2 Sec … 10 Min

Delay during POST

COMe-cDC2 / BIOS Operation

MARS Interface Configuration

Feature Option Description

MARS

Disabled Auto SMB Charger SMB Manager

Enables the MARS function

COMe-cDC2 / BIOS Operation

Watchdog

Feature Option Description

Global Lock

Disabled Enabled

If set to enabled all Watchdog registers (except WD_KICK) become read only

Auto-reload

Disabled Enabled

If set to enable the watchdog timers will be automatically reloaded at timeout

Stage 1 Mode

Disabled Reset NMI Delay Cascade

Selects the mode of the first stage Reset: resets the module NMI: activates an non maskable interrupt Delay: set a time to wait once during boot up Cascade: without action, used every retrigger

Assert WDT

Disabled Enabled

Enable/disable assertion of WDT signal to baseboard on stage timeout

Stage 1 Timeout

0.4s 1s 5s 10s 30s 1:00m 5:00m 10:00m

Controls the timeout of the 1st watchdog stage

Stage 2 Mode

Disabled Reset NMI

Selects the mode of the 2nd stage Reset: resets the module NMI: activates an non maskable interrupt

Assert WDT

Disabled Enabled

Enable/disable assertion of WDT signal to baseboard on stage timeout

Stage 2 Timeout

0.4s 1s 5s 10s 30s 1:00m 5:00m 10:00m

Controls the timeout of the 1st watchdog stage

COMe-cDC2 / BIOS Operation

Remote Access Configuration

Feature Option Description

Remote Access

Enabled Disabled

Enables Remote Access via AMI Console Redirection

Serial port number COM1 Select serial port for console redirection, selectable

ports must be enabled

Serial port Mode

115200 8,n,1 57600 8,n,1 28400 8,n,1 19200 8,2,1 09600 8,n,1

Select serial port mode for console redirection

Flow Control

none Hardware Software

Selects the flow control for serial connection

Redirection After BIOS POST

Always Disabled Bootloader

Always: Redirection is always active Disabled: Turns off after POST Bootloader: Turns off after bootloader

Terminal Type

ANSI VT100 VT-UTF8

Select the target terminal type

VT-UTF8 Combo Key Support

Enabled Disabled

Enables VT-UTF8 Combination Key Support for ANSI/VT100 terminals

Sredir Memory Display Delay

No Delay Delay 1 Sec Delay 2 Sec Delay 4 Sec

Enables Remote Access via AMI Console Redirection

COMe-cDC2 / BIOS Operation

LAN Controller

Feature Option Description

Ethernet Controller Disabled

Enabled

Disables / Enables the onboard Ethernet interf ace

Ethernet Boot

Disabled Enabled

Disables / Enables the PXE Boot ROM

COMe-cDC2 / BIOS Operation

GPIO Level Configuration

Feature Option Description

GPO0 Level GPO1 Level GPO2 Level GPO3 Level

Low High

Configure initial level of GPOs

COMe-cDC2 / BIOS Operation

Trusted Computing

Feature Option Description

TCG/TPM Support Yes

Enables / Disables Trusted Computing and Trusted Platform Module

COMe-cDC2 / BIOS Operation

7.4.4 PCIPnP Menu

Feature Option Description

Plug & Play O/S

No Yes

No: all devices are initialized by BIOS Yes: OS has to initialize some devices

PCI Latency Timer 32

64 … 248

Value in units of PCI clocks for PCI device latency register

Allocate IRQ to PCI VGA

Yes No

Decided if PCI VGA card does get an IRQ assigned if requested

PCI IDE BusMaster Disabled

Enabled

Disables and enables PCI IDE Busmaster

OffBoard PCI/ISA IDE Card

Auto PCISlot 1 PCISlot 2 … PCISlot 6

Some IDE Cards needs this , with set to Auto it works with most cards

IRQ3 … IRQ15

Available Reserved

Available: IRQ useable by PCI/PnP devices Reserved: IRQ is reserved for ISA devices

COMe-cDC2 / BIOS Operation

7.4.5 Boot

COMe-cDC2 / BIOS Operation

Boot Setting Configuration

Feature Option Description

Quick Boot

Enabled Disabled

Disables or enables the quick boot feature

Quiet Boot

Disabled Enabled

Disabled: Shows normal POST messages Enabled: Shows OEM Logo during boot up

AddOn ROM Display Mode

Force BIOS Keep Current

Set Display Mode for Option ROM

Bootup Num-Lock

On Off

Select Power-On state for Num-Lock

PS/2 Mouse Support

Auto Disabled Enabled

Disables and enables or auto selects PS/2 Mouse Support

Wait For 'F1' If Error

Disabled Enabled

Wait for F1 key to be pressed, if error

Hit 'DEL' Message Display

Enabled Disabled

Displays: “Hit 'DEL' to run setup” during POST, if enabled

Boot USB HDD first

Disabled Enabled

If enabled, boots new attached USB HDD always first

Interrupt 19 Capture

Disabled Enabled

Allows option ROMs to trap INT19h if enabled

COMe-cDC2 / BIOS Operation

7.4.6 Security

Feature Option Description

Change Supervisor Password

Type in

Change User Password

Type in

Boot Sector Virus Protection

Disabled Enabled

Enables or disables boot sector virus protection.

COMe-cDC2 / BIOS Operation

7.4.7 Chipset

COMe-cDC2 / BIOS Operation

North Bridge Configuration

Feature Option Description

DRAM Frequency

Auto 400Mhz 533Mhz

Selects the DRAM frequency

Configure DRAM Timing by SPD Disabled

Enabled

Disables and Enables automatic DRAM configuration via SPD EEPROM

Memory Hole

Disabled 15MB-16MB

Disables and Enables the incredible useless extended memory hole

Graphic Device Priority IGD

PCI/IGD

Selects which graphics adapter is initialized during boot up and gets priority

Internal Graphics Mode Select Disabled

Enabled, 1MB Enabled, 8MB

Select the mode for the interal graphicdevice

Chipset Thermal Throttling

Disabled Enabled

Disables and Enables Chipset Thermal Throttling.

DT in SPD

Disabled Enabled

The GMCH supports the Delta Temperature (DT) in SPD thermal managmeent algorithm as specif ied by JEDEC.

TS on DIMM

Disabled Enabled

Disables and Enables the Thermal Sensor on DIMM.

DMI PM Disabled

Enabled

Disables or Enables DMI/FSB power management. If disabled, PCI performance will improve slightly.

COMe-cDC2 / BIOS Operation

Display Control

Feature Option Description

DVMT Mode Select Fixed Mode

DVMT Mode Combo Mode

Selects the Mode for Dynamic Video Memory Technology

DVMT/FIXED Memory 64MB

128MB \Max DVMT

Configures the amount of memory for the Dynamic Video Memory Technology

Boot Display Device CRT

TV SDVO CRT+SDVO LVDS CRT+LVDS

Selects the Boot Display Devices

TV Connector

Auto Composite Component Composite & RGB S-Video SCART Composite SCART Compos. & RGB SCART Compos. & S-Video SMPTE253 Compon. RGB

Selects the TV Connector Type

HDTV Output

Auto 480i60 … 1080p60

Selects the HDTV Output Mode

TV Standard

NTSC PAL SECAM SMPTE240M ITU-R television SMPTE295M SMPTE296M EIA-770.2 EIA-770.3

Selects the regarding TV standard for TV out interf ace

TV Sub-Type Depending on TV Standard Selects the regarding TV Sub-Type

COMe-cDC2 / BIOS Operation

Internal LVDS Configuration

Feature Option Description

Flat Panel Mode

Auto Fixed Mode PAID FPID

Selects the Mode for the flat panel detection

Auto Fallback

Disabled Fixed Mode

Selects what happens, when there is no EEPROM detected (only when FPM: Auto)

Flat Panel Type

VGA 640×480 … WXGA 1280×800

Selects the resolution of the LVDS display (only in FMP: Fixed Mode)

PAID/FPID [X] Selects the number of the PAID/FPID

Channels

Single Channel Dual Channel

Selects, if 1x or 2x LVDS signals are used (only in FPM: Fixed Mode)

Color Depth

18bit

Selects the Color Depth of the connected LVDS display (only in FPM: Fixed Mode)

Dithering

Enabled

Selects what happens, when there is no EEPROM detected (only when FPM: Auto)

Local Flat Panel Scaling Centered

Stretched Disabled

Selects the Scaling Options for the LVDS panel (only in FPM: Fixed Mode)

LVDS DVI ID → 5

Please Type In! 5 = 1×18 8 = 2×18

Backlight Control Type None/External

I2C PWM

Selects the mode for Backlight Control

Backlight Brightness [0…255] Selects the default setting for Backlight Br ightness

COMe-cDC2 / BIOS Operation

Southbridge Configuration

Feature Option Description

USB Functions Disabled

2 USB Ports 4 USB Ports … 8 USB Ports

Enables / Disables USB ports

USB 2.0 Controller

Enabled Disabled

Enables / Disables the USB 2.0 controller.

Audio Controller

Auto Azalia AC'97 Audio und Modem All Disable

Selects the mode for Audio Controller

SMBUS Controller

Enabled Disabled

Enables / Disables the SMBus controller

Port 80h Output

LPC PCI

Selects the Inteface for Port 80h output during POST

COMe-cDC2 / BIOS Operation

LPC Decode Range

Feature Option Description

LPC Decode Range 1 Base [0…FFFF] Enter the Base Adress of the LPC decode range

LPC Decode Range 1 Size

Disabled 4 8 … 256

Size of the decode range in kB

LPC Decode Range 2 Base [0…FFFF] Enter the Base Adress of the LPC decode range

LPC Decode Range 2 Size

Disabled 4 8 … 256

Size of the decode range in kB

LPC Decode Range 4Eh/4Fh

Enabled Disabled

Enables disables the LPC decode range at 4Eh/4Fh

LPC Decode Range 62h/66h

Disabled Enabled

Enables disables the LPC decode range at 62h/66h

COMe-cDC2 / BIOS Operation

7.4.8 Exit Menu

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COMe-cDC2 / BIOS Operation

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Kontron COMe-cDC2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 Naming clarification

2.3 Understanding COM Express® Functionality

2.4 COM Express® Documentation

2.5 COM Express® Benefits

3 Product Specification

3.1 Modules & Accessories

3.2 Functional Specification

Processor

CPU specifications

Memory

Chipset

Graphics Core

Monitor output

LVDS

Display Interfaces

Storage

Connectivity

Ethernet

Misc Interfaces and Features

Kontron Features

Power Features

Power Consumption and Performance

Supported Operating Systems

3.3 Block Diagram

3.4 Electrical Specification

3.4.1 Supply Voltage

3.4.2 Power Supply Rise Time

3.4.3 Supply Voltage Ripple

3.4.4 Power Consumption

3.4.5 ATX Mode

3.4.6 Single Supply Mode

3.5 Power Control

Power Supply

Power Button (PWRBTN#)

Power Good (PWR_OK)

Reset Button (SYS_RESET#)

SM-Bus Alert (SMB_ALERT#)

3.6 Environmental Specification

3.6.1 Temperature Specification

3.6.2 Humidity

3.7 Standards and Certifications

RoHS

CE marking

Component Recognition UL 60950-1

WEEE Directive

Conformal Coating

Shock & Vibration

3.8 MTBF

3.9 Mechanical Specification

Dimension

3.10 Thermal Management

3.11 Heatspreader

3.12 Onboard Fan Connector

3.12.1 Electrical Characteristics

4 Features and Interfaces

4.1 Onboard SSD

Basic features of the PATA NANDrives

SLC NANDrive™

4.2 S5 Eco Mode

4.3 LPC

4.4 LPC boot

Using an external LPC Firmware Hub

To create a BIOS with custom defaults:

4.5 M.A.R.S.

4.6 Fast I2C

4.7 JIDA16 and JIDA32

4.8 K-Station 1