Kontron COMe-cDC2 User Manual

COMe-cDC2

Document Revision 130

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Modules & Accessories................................................................................................................. 10

3.2 Functional Specification............................................................................................................... 12

3.3 Block Diagram............................................................................................................................ 15

3.4 Electrical Specification................................................................................................................ 16

3.4.1 Supply Voltage........................................................................................................................... 16

3.4.2 Power Supply Rise Time................................................................................................................ 16

3.4.3 Supply Voltage Ripple.................................................................................................................. 16

3.4.4 Power Consumption..................................................................................................................... 16

3.4.5 ATX Mode.................................................................................................................................. 17

3.4.6 Single Supply Mode..................................................................................................................... 17

3.5 Power Control............................................................................................................................ 18

3.6 Environmental Specification......................................................................................................... 19

3.6.1 Temperature Specification............................................................................................................19

3.6.2 Humidity................................................................................................................................... 19

3.7 Standards and Certifications......................................................................................................... 20

3.8 MTBF........................................................................................................................................ 22

3.9 Mechanical Specification.............................................................................................................. 23

3.10 Thermal Management..................................................................................................................24

3.11 Heatspreader............................................................................................................................. 24

3.12 Onboard Fan Connector................................................................................................................ 25

3.12.1 Electrical Characteristics.............................................................................................................. 26

4 Features and Interfaces.......................................................................27

4.1 Onboard SSD.............................................................................................................................. 27

4.2 S5 Eco Mode.............................................................................................................................. 28

4.3 LPC.......................................................................................................................................... 29

www.kontron.com

COMe-cDC2 /

4.4 LPC boot................................................................................................................................... 30

4.5 M.A.R.S.................................................................................................................................... 31

4.6 Fast I2C.................................................................................................................................... 32

4.7 JIDA16 and JIDA32..................................................................................................................... 33

4.8 K-Station 1................................................................................................................................ 34

4.9 K-Station & API Resources for JIDA32.............................................................................................. 35

4.9.1 I2C.......................................................................................................................................... 35

4.9.2 Storage.................................................................................................................................... 35

4.9.3 GPIO........................................................................................................................................ 35

4.9.4 Hardware Monitor....................................................................................................................... 35

4.10 API Ressources for Board Driver.....................................................................................................35

4.10.1 I2C.......................................................................................................................................... 35

4.10.2 Storage.................................................................................................................................... 36

4.10.3 GPIO........................................................................................................................................ 36

4.10.4 Onboard Hardware Monitor...........................................................................................................36

4.10.5 SIO Winbond 83627DHGP............................................................................................................. 36

4.10.6 SIO Winbond 83627HG................................................................................................................. 37

4.11 GPIO - General Purpose Input and Output.........................................................................................38

4.12 Dual Staged Watchdog Timer......................................................................................................... 39

4.13 Flash Backup Feature................................................................................................................... 40

4.14 Speedstep Technology................................................................................................................. 42

4.15 C-States.................................................................................................................................... 43

4.16 Hyper Threading......................................................................................................................... 44

4.17 ACPI Suspend Modes and Resume Events..........................................................................................45

5 System Ressources..............................................................................46

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 46

5.1.1 In 8259 PIC Mode........................................................................................................................ 46

5.1.2 In APIC mode............................................................................................................................. 47

5.2 Direct Memory Access (DMA) Channels............................................................................................. 47

5.3 Memory Area.............................................................................................................................. 47

5.4 I/O Address Map......................................................................................................................... 48

5.5 External Inter-IC (I2C) Bus............................................................................................................48

5.6 System Management (SM) Bus....................................................................................................... 48

5.7 JILI I2C Bus............................................................................................................................... 48

6 Connectors........................................................................................49

6.1 Connector Location..................................................................................................................... 49

6.2 Pinout List................................................................................................................................ 50

6.2.1 General Signal Description............................................................................................................ 50

6.2.2 Connector X1A Row A................................................................................................................... 51

6.2.3 Connector X1A Row B................................................................................................................... 53

6.2.4 Connector X1B Row C................................................................................................................... 55

6.2.5 Connector X1B Row D................................................................................................................... 57

7 BIOS Operation...................................................................................59

7.1 Determining the BIOS Version....................................................................................................... 59

7.2 BIOS Update.............................................................................................................................. 59

7.3 Setup Guide............................................................................................................................... 60

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COMe-cDC2 /

7.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 60

7.4 BIOS Setup................................................................................................................................ 62

7.4.1 Main Menu................................................................................................................................ 62

7.4.2 Module Info............................................................................................................................... 63

7.4.3 Advanced Menu.......................................................................................................................... 65

7.4.4 PCIPnP Menu.............................................................................................................................. 86

7.4.5 Boot........................................................................................................................................ 87

7.4.6 Security.................................................................................................................................... 89

7.4.7 Chipset..................................................................................................................................... 90

7.4.8 Exit Menu.................................................................................................................................. 96

5

COMe-cDC2 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2012 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

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COMe-cDC2 / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-cDC2 / Introduction

2 Introduction

2.1 Product Description

The COMe-cDC2 brings latest 45 nm performance generations of Intel® Atom™ N270 processor with 1.6 GHz and the
Intel® 945GSE and ICH7M chipset to a compact 95 x 95 mm module.

Kontron’s new high-efficient power-off state S5 Eco enables ACPI features and lowest power-consumption in soft-off
state – less than 1 mA. Compared to the regular S5 state this means a reduction by at least factor 200! Battery uptime
therefore goes up dramatically.

Like all COM Express® compact modules, it is compatible to the COM Express® basic. Therefore, upgrading existing carrier
boards originally designed for COM Express® basic gets easy and minimizes redesign efforts.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known

as ETXexpress®

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known

as microETXexpress®

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as

nanoETXexpress

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO

1x optional 1x optional - -

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

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COMe-cDC2 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cDC2. Additional references are are available from your Kontron Support or from
PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available from the PIGMG website by filling out the order form.

» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum

flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can
differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade
path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A
properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

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COMe-cDC2 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® compact sized Computer-on-Module COMe-cDC2 (UNP1) follows pin-out Type 2 and is compatible to
PICMG specification COM.0 Rev 1.0. The COMe-cDC2 based on Intel's Navy Pear platform is available in different variants:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor Chipset and Features

36005-0000-16-2 COMe-cDC2 N270 Intel® Atom™ N270 DDR2, 945GSE

36005-0040-16-2 COMe-cDC2 N270 4GB Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD

Extended temperature modules (E1, -25°C to +75°C operating)

Product Number Product Name Processor Chipset and Features

36005-0000-16-2EXT COMe-cDC2 N270 E1 Intel® Atom™ N270 DDR2, 945GSE, E1

36005-0040-16-2EXT COMe-cDC2 N270 4GB E1 Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD, E1

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COMe-cDC2 / Product Specification

Accessories

Product Number Carr ier Boards

38102-0000-00-1 COM Express® Reference Carrier Type 2 (8mm COMe connector)

38104-0000-00-0 COM Express® Eval Carrier Type 2 (Niles Canyon, 5mm COMe connector)

38104-0000-00-1 COM Express® Eval Carrier Type 2 (Topanga Canyon, 5mm COMe connector)

Product Number Memory

97011-5120-08-0 DDR2-800 SODIMM / 512MB

97011-1024-08-0 DDR2-800 SODIMM / 1GB

97011-2048-08-0 DDR2-800 SODIMM / 2GB

97011-5120-08-2 DDR2-800 SODIMM / 512MB E2

97011-1024-08-2 DDR2-800 SODIMM / 1GB E2

97011-2048-08-2 DDR2-800 SODIMM / 2GB E2

Product Number Cooling & Mounting

36005-0000-99-0 HSP COMe-cDC2 thread

36005-0000-99-1 HSP COMe-cDC2 through

36005-0000-99-0C01 HSK COMe-cDC2 active thread

36005-0000-99-0CO2 HSK COMe-cDC2 passive thread

36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP)

36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP)

38017-0000-00-0 COMe Mount KIT 8mm 1set

38017-0000-00-5 COMe Mount KIT 5mm 1set

38017-0100-00-0 COMe Mount KIT 8mm 100sets

38017-0100-00-5 COMe Mount KIT 5mm 100sets

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect a standard FAN to the module)

96079-0000-00-1 KAB-HSP 40mm (Cable adapter to connect a standard FAN to the module)

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COMe-cDC2 / Product Specification

3.2 Functional Specification

Processor

The 45nm Intel® ATOM™ (Diamondville) CPU with 22x22mm package size (PBGA437 socket) supports:

» Intel® Hyper-Threading Technology (HTT)

» Enhanced Intel SpeedStep® Technology (EIST)

» Thermal Monitoring Technologies

» Idle States (C-States)

» Execute Disable Bit

CPU specifications

» Intel® ATOM™

» Codename: Diamondville

» L2-Cache: 512kB

» FSB: 533MHz

» Instruction set: 32bit

Memory

Sockets

1x DDR2 SO-DIMM

Memory Type

DDR2-400/533

Maximum Size

2GB

Technology

Single Channel

Chipset

The Intel® 945GSE Chipset (Codename Calistoga) combined with the Intel® 82801GBM (ICH7M) Southbridge supports:

» PCI Express Revision 1.0

» USB 2.0

» Integrated Graphics with dual display

Graphics Core

The integrated Intel® GMA950 (Gen3.5) supports:

Graphics Core Render Clock

166MHz

Execution Units / Pixel Pipelines

4

Max Graphics Memory

256MB

GFX Memory Bandwidth (GB/s)

10.7

GFX Memory Technology

DVMT 3.0

API (DirectX/OpenGL)

9.0c / 1.4

Shader Model

2.0

Hardware accelerated Video

-

Independent/Simultaneous Displays

2

Display Port

-

HDCP support

-

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COMe-cDC2 / Product Specification

Monitor output

CRT max Resolution

2048x1536

TV out:

YES

LVDS

LVDS Bits/Pixel

1x18 / 2x18

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1600x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

-

Digital Display Interface DDI1

SDVOB

Digital Display Interface DDI2

-

Digital Display Interface DDI3

-

Maximum Resolution on DDI

1920x1200

Storage

onboard SSD

512MB to 8GB SLC (PATA)

SD Card support

-

IDE Interface

1x PATA 100

Serial-ATA

2x SATA 1.5Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup

SATA RAID

-

Variants with onboard SSD flash do not support external IDE due to the missing signals
PDIAG# and DASP# master/slave capabilities on COM Express® connector

Connectivity

USB

8x USB 2.0

USB Client

-

PCI

PCI Rev 2.3 (33MHz/3.3V)

PCI External Masters

4

PCI Express

3x PCIe x1 Gen1

Max PCI Express

4x PCIe x1 without LAN

PCI Express x2/x4 configuration

NO

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Hartwell)

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

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COMe-cDC2 / Product Specification

Misc Interfaces and Features

Audio

AC97 / HD Audio

Onboard Hardware Monitor

ON Semi ADT7475

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT

Miscellaneous

-

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32 / PICMG EAPI

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 18V

ACPI

ACPI 2.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 2.3

Power Consumption and Performance

Full Load Power Consumption

10W

Kontron Performance Index

1714

Kontron Performance/Watt

172

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The COMe-cDC2 currently supports:

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Microsoft Windows XP x86

» Microsoft Windows 7 x86

» Microsoft Windows Embedded Standard 7 x86 (WES7)

» Linux

» WindRiver VxWorks 6.6 - 6.8

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COMe-cDC2 / Product Specification

3.3 Block Diagram

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COMe-cDC2 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 18V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.3V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-cDC2 variants is 10W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

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COMe-cDC2 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 18V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

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COMe-cDC2 / Product Specification

3.5 Power Control

Power Supply

The COMe-cDC2 supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cDC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

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COMe-cDC2 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

General Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended (E1) -25°C to +75°C -30°C to +85°C

Industrial grade (E2) -40°C to +85°C -40°C to +85°C

Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» Operating: 10% to 90% (non condensing)

» Non operating: 5% to 95% (non condensing)

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COMe-cDC2 / Product Specification

3.7 Standards and Certifications

RoHS

The COMe-cDC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The COMe-cDC2 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

20

COMe-cDC2 / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cDC2 follows the requirements for electromagnetic

compatibility standards

» EN55022

» EN55011

» EN55024

» FCC15

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COMe-cDC2 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 199784 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

22

COMe-cDC2 / Product Specification

3.9 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Hight approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

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COMe-cDC2 / Product Specification

3.10 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cDC2. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other
cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the COMe-cDC2. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please
see the COM Express® Design Guide for further information on thermal management.

3.11 Heatspreader

Documentation and CAD drawings of COMe-cDC2 heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

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COMe-cDC2 / Product Specification

3.12 Onboard Fan Connector

Location and Pinout of Fan Connector

The onboard fan connector (J9) can be found at the left side nearby the DRAM socket and has following specification:

» Part number (Molex) J9: 53261-0390

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

The Pin assignement is:

» Pin1: Tacho

» Pin2: VCC

» Pin3: GND

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COMe-cDC2 / Product Specification

BIOS Settings for Fan Control

The fan can be controlled via the BIOS Settings “Advanced Hardware Health”→

In general 4 modes are possible

» Auto Fan Mode: Temperature Values can be selected to control the Fan

» Fan Always On Full: Fan is always full on

» Fan Disable Mode: Fan is disabled

» Fan Manually Mode: A fixed PWM value (0…255) can be entered to run the fan at a selected speed

The used hardware monitor onboard is an ADT7475. For additional information please refer to the regarding datasheet.

3.12.1 Electrical Characteristics

Input Voltage Range

8.5V - 18V

Output Voltage

Only 12V (switch in BIOS without function)

Max. output current

0.3A

The Fan out voltage output is not short circuit proof. If necessary the user has to ensure
that the circuit is protected externally, for example by a fuse on the backplane.

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

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COMe-cDC2 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-cDC2 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to
performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives
are available:

Basic features of the PATA NANDrives

» 16-bit ATA/IDE Bus Interface with PIO Mode-6, Multi-Word DMA Mode-4 and Ultra DMA Mode-4

» RoHS compliant NAND flash type

» Hardware error detection and correction ECC

» Advanced wear leveling

» Bad block management

SLC NANDrive™

Flash Part No. GLS85LP0512P-S-I-LBTE GLS85LP1002P-S-I-FTE GLS85LP1004P-S-I-FTE GLS85LP1008P-S-I-FTE

Temperature Range

-40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C

Flash Size 512MB 2GB 4GB 8GB

NAND Type

SLC NAND SLC NAND SLC NAND SLC NAND

Sustained Read Speed

25 MB/s 28 MB/s 50 MB/s 50 MB/s

Sustained Write Speed

6 MB/s 11 MB/s 20 MB/s 39 MB/s

Total Bytes

456,744,960 2,000,388,096 4,068,384,768 8,136,769,536

Max LBA

892,080 3,907,008 7,946,064 15,892,128

Cylinders/Heads/Sectors

885/16/63 3,876/16/63 7,883/16/63 15,766/16/63

Active Mode Power

200mW 200mW 265mW 365mW

Program/Erase Cycles per Block

100k 100k 100k 100k

(Data based on GLS85LPxxxxP Datasheet Rev. 02.000 from 06-2012)

The NAND Flash types listed above are available on COMe-mSP1 hardware revision CE4.7.0
and COMe-cDC2 hardware revision CE 2.4.1 or newer. Please contact your local sales or
support for Flash specifications of SST Flash used on older revisions

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COMe-cDC2 / Features and Interfaces

4.2 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current tremendously.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequesites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Powerbutton only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

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COMe-cDC2 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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COMe-cDC2 / Features and Interfaces

4.4 LPC boot

The COMe-cDC2 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated
with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot

Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot

Device 1

Using an external LPC Firmware Hub

To program an external LPC FWH follow these steps:

» Connect a 1MB LPC FWH to the module's LPC interface

» Open pin A34 to boot from the module BIOS

» Boot the module to DOS with access to the BIOS image and Firmware Update Utility aufdos.exe / batch file provided

on EMD Customer Section

» Connect pin A43 (BIOS_DIS0#) to ground to enable the external LPC FWH

» Execute Flash.bat to flash the BIOS image to the external LPC FWH

» reboot

Your module will now boot from the external LPC FWH when BIOS_DIS0# is grounded.

To create a BIOS with custom defaults:

» Change your BIOS settings

» Save as custom defaults to RTC/Flash and Exit (module will now always start with these settings)

» Extract the BIOS including custom defaults with afudos.exe biosname.rom /O in DOS or kflash.exe backup

biosname.rom in Windows

Flash Backup should show “Enter new Password” first time saving custom defaults. If it is
not possible to set a new password or entering a password shows an error message, please
clean up CMOS data with DOS command: jidacmos rtc /clean (jidacmos utility is available

at Kontron’s Customer Section)

You can download all AMI CORE8 update utilities at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

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