Kontron COMe-cCT6 User Manual

COMe-cCT6

Document Revision 130

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Modules definition...................................................................................................................... 10

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 15

3.4 Accessories............................................................................................................................... 16

3.5 Electrical Specification................................................................................................................ 17

3.5.1 Supply Voltage........................................................................................................................... 17

3.5.2 Power Supply Rise Time................................................................................................................17

3.5.3 Supply Voltage Ripple.................................................................................................................. 17

3.5.4 Power Consumption..................................................................................................................... 17

3.5.5 ATX Mode.................................................................................................................................. 18

3.5.6 Single Supply Mode..................................................................................................................... 18

3.6 Power Control............................................................................................................................ 19

3.7 Environmental Specification......................................................................................................... 20

3.7.1 Temperature Specification............................................................................................................ 20

3.7.2 Humidity................................................................................................................................... 20

3.8 Standards and Certifications.........................................................................................................21

3.9 MTBF........................................................................................................................................ 23

3.10 Mechanical Specification.............................................................................................................. 24

3.11 Module Dimensions..................................................................................................................... 25

3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................26

3.13 Onboard Connectors.................................................................................................................... 27

3.13.1 FAN.......................................................................................................................................... 28

3.13.2 CPU Debug & CPLD....................................................................................................................... 28

4 Features and Interfaces.......................................................................29

4.1 Onboard SSD.............................................................................................................................. 29

4.2 S5 Eco Mode.............................................................................................................................. 30

www.kontron.com

COMe-cCT6 /

4.3 LPC.......................................................................................................................................... 31

4.4 Serial Peripheral Interface (SPI)....................................................................................................32

4.5 SPI boot.................................................................................................................................... 32

4.6 M.A.R.S.................................................................................................................................... 34

4.7 UART........................................................................................................................................ 35

4.8 Fast I2C.................................................................................................................................... 36

4.9 GPIO - General Purpose Input and Output.........................................................................................37

4.10 Dual Staged Watchdog Timer......................................................................................................... 38

4.11 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 39

4.12 Speedstep Technology.................................................................................................................. 41

4.13 C-States.................................................................................................................................... 42

4.14 Hyper Threading......................................................................................................................... 43

4.15 Display Configuration..................................................................................................................44

4.16 Graphics Features....................................................................................................................... 47

4.17 Hardware Configuration............................................................................................................... 47

4.18 Graphics VBIOS and Driver............................................................................................................ 47

4.19 ACPI Suspend Modes and Resume Events..........................................................................................48

4.20 USB......................................................................................................................................... 49

5 System Resources...............................................................................50

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 50

5.2 Memory Area............................................................................................................................. 50

5.3 I/O Address Map......................................................................................................................... 51

5.4 Peripheral Component Interconnect (PCI) Devices..............................................................................51

5.5 I2C Bus..................................................................................................................................... 52

5.6 JILI I2C Bus............................................................................................................................... 52

5.7 System Management (SM) Bus....................................................................................................... 52

6 Connectors........................................................................................53

6.1 Connector Location..................................................................................................................... 53

7 Pinout List.........................................................................................54

7.1 General Signal Description............................................................................................................ 54

7.2 Connector X1A Row A................................................................................................................... 55

7.3 Connector X1A Row B................................................................................................................... 57

7.4 Connector X1B Row C................................................................................................................... 59

7.5 Connector X1B Row D................................................................................................................... 61

8 BIOS Operation...................................................................................63

8.1 Determining the BIOS Version....................................................................................................... 63

8.2 BIOS Update.............................................................................................................................. 63

8.3 Setup Guide............................................................................................................................... 65

8.4 POST Codes................................................................................................................................ 65

8.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 65

4

COMe-cCT6 / User Information

8.5 BIOS Setup................................................................................................................................ 67

8.5.1 Main Menu................................................................................................................................ 67

8.5.2 Advanced.................................................................................................................................. 69

8.5.3 Chipset..................................................................................................................................... 99

8.5.4 Boot....................................................................................................................................... 106

8.5.5 Security.................................................................................................................................. 107

8.5.6 Save & Exit............................................................................................................................... 109

5

COMe-cCT6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

6

COMe-cCT6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-cCT6 / Introduction

2 Introduction

2.1 Product Description

COMe-cCT6 is the energy efficient entry-level multicore module based on next-generation Intel® Atom™ processors with
32 nm technology. The module is available in three multicore performance levels up to 2x 1.86 GHz and offers an
increased performance per watt ratio and offers twice the graphics capability. The COM Express® pin-out type 6 definition
enables the module to provide these increased capabilities via a scalable interface range that offers suitable options for
both cost and power sensitive applications alike.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

8

COMe-cCT6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cCT6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

9

COMe-cCT6 / Product Specification

3 Product Specification

3.1 Modules definition

The COM Express® compact sized Computer-on-Module COMe-cCT6 (UUP6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-cCT6, based on Intel's Cedar Trail platform, is available in different variants
to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor UART Flash USB 3.0 TPM

36011-0040-19-7 COMe-cCT6 D2550 Cedarview-D Intel® Atom™ D2550 2x 4GB SLC 2x Yes

36011-0000-19-6 COMe-cCT6 D2550 Cedarview-D Intel® Atom™ D2550 - - - -

36011-0000-19-2 COMe-cCT6 N2800 Cedar view-M Intel® Atom™ N2800 - - - -

36011-0000-16-3 COMe-cCT6 N2600 SER Cedarview-M Intel® Atom™ N2600 2x - - -

36011-0000-16-2 COMe-cCT6 N2600 Cedar view-M Intel® Atom™ N2600 - - - -

Optional hardware features:

» TPM

» PCI Express USB 3.0 (xHCI) controller TI

» 2x UART

» 2 to 32GB SLC NANDrive

» 2 to 64GB MLC NANDrive

Optional BIOS features:

» Secure Flash Update

» Secure Boot

» CSM OptOut

Extended temperature grade modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor UART Flash USB 3.0 TPM

36011-0000-19-6EXT COMe-cCT6 D2550 E1 Cedarview-D Intel® Atom™ D2550 - - - -

36011-0000-19-2EXT COMe-cCT6 N2800 E1 Cedarview-M Intel® Atom™ N2800 - - - -

36011-0000-16-2EXT COMe-cCT6 N2600 E1 Cedarview-M Intel® Atom™ N2600 - - - -

Optional hardware features:

» PCI Express USB 3.0 (xHCI) controller TI

» 2x UART

» 2 to 32GB SLC NANDrive

» 2 to 64GB MLC NANDrive (industrial grade versions only)

Industrial temperature grade modules (XT, -40°C to 85°C operating)

Modules for E2 temperature range are available by screening on project base, please contact your local sales or support
for further details.

Part Number Product Name Processor UART Flash USB 3.0 TPM

36011-00FF-CC-x COMe-cCT6 XT All optional optional n/a n/a

Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.

10

COMe-cCT6 / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® Atom™ D2000/N2000 (Cedarview-M/D) CPU family supports:

» Intel® Hyper-Threading Technology

» Intel® 64

» Enhanced Intel SpeedStep® Technology (N2xxx only)

» Thermal Monitoring Technologies

» Execute Disable Bit

» 2 Display Pipes for dual independent displays

CPU specifications

CPU Intel® Atom™ D2550 Intel® Atom™ N2800 Intel® Atom™ N2600

Cores

2 2 2

Threads

4 4 4

Clock

1866MHz 1866MHz 1600MHz

Memory Speed

DDR3-1066 DDR3-1066 DDR3-800

Max Memory

up to 4GB up to 4GB up to 2GB

Cache

1MB 1MB 1MB

C-States

C0/C1 C0-C6 / C1E-C4E C0-C6 / C1E-C4E

EIST

- YES YES

CPU Thermal Management

TM1 TM1 & TM2 TM1 & TM2

GFX

GMA3650 GMA3650 GMA3600

GFX core frequency

640MHz 640MHz 400MHz

GFX render clock frequency

200MHz 200MHz 200MHz

Display Core Clock

355MHz 267MHz 200MHz

LVDS

1×18/24bit 1×18/24bit 1×18/24bit

LVDS Resolution

up to 1440x900x60 up to 1366x768x60 up to 1366x768x60

eDP Resolution

up to 1920x1080x60 up to 1366x768x60 up to 1366x768x60

DP Resolution

up to 2560x1600x60 up to 1600x1200x60 up to 1600x1200x60

HDMI/DVI Resolution

up to 1920x1200x60 up to 1920x1200x60 up to 1920x1200x60

VGA Resolution

up to 1920x1200x60 up to 1920x1200x60 up to 1920x1200x60

PAVP

1.1c 1.1c -

HDCP

1.3 1.3 -

Blu-Ray 2.0 Playback

Yes Yes -

TDP

10W 6.5W 3.5W

Memory

Sockets

1x DDR3 SO-DIMM

Memory Type

DDR3-800 / 1066

Maximum Size

1x4GB, 4GB supported by 256Mx16 configuration only

Technology

Single Channel (64bit)

11

COMe-cCT6 / Product Specification

Graphics Core

The integrated SGX545 core based Intel® GMA 3650 / 3600 supports:

Graphics Core Render Clock

640MHz @ GMA3650 (D2700/N2800)

400MHz @ GMA3600 (N2600),

Execution Units / Pixel Pipelines

4

Max Graphics Memory

1024MB

GFX Memory Bandwidth (GB/s)

6.4 / 8.5

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

9.0c / 3.0

Shader Model

3.0

Hardware accelerated Video

H.264,MPEG2,VC1, Blu-ray

Independent/Simultaneous Displays

2

Display Port

DP / eDP 1.1

HDCP support

HDCP 1.3a / PAVP 1.1c

Monitor output

CRT max Resolution

1920x1200

TV out:

-

LVDS

LVDS Bits/Pixel

1x18 / 1x24

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

D: 1440x900, M: 1366x768, 112MHz

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

-

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

DP++

Digital Display Interface DDI3

-

Maximum Resolution on DDI

HDMI: 1920x1200, DP-D: 2560x1600/DP-M: 1600x1200

PCH: Intel® NM10 Express Chipset

The 130nm Intel Platform Controller Hub Tigerpoint supports:

» PCI Express Gen 1.0 Speed

» USB 2.0

» HD Audio

» SATA 3Gb/s

Storage

onboard SSD

2-32GB SLC, 2-64GB MLC (SATA)

SD Card support

-

IDE Interface

-

Serial-ATA

up to 2x SATA 3Gb/s

SATA AHCI

AHCI 1.0 with NCQ and HotPlug

SATA RAID

-

With onboard SATA drive only 1 external SATA interface (SATA 0) is available

12

COMe-cCT6 / Product Specification

Connectivity

USB

8x USB 2.0

USB Client

-

PCI

-

PCI External Masters

-

PCI Express

3x PCIe x1 Gen1

Max PCI Express

4x PCIe x1 without LAN

PCI Express x2/x4 configuration

YES

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82574L (Hartwell)

Any PCIe device connecting to Intel@ Atom Processor D2000 and N2000 based platform
must support No_Snoop attribute

Ethernet

The Intel® 82574L (Hartwell) ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

4MB SPI

Audio

HD Audio

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Infineon SLB9635TT optional

Miscellaneous

2x UART optional / PWM FAN

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI2

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

13

COMe-cCT6 / Product Specification

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 20V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 4.0, iFFS

Power Consumption and Performance

Full Load Power Consumption

7.5 - 13W

Kontron Performance Index

7238 - 9277

Kontron Performance/Watt

736 - 957

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

14

COMe-cCT6 / Product Specification

3.3 Block Diagram

15

USB #0/1

(USB 2.0)

USB #0/1

(USB 3.0)

VGA

DP++

(DDI1)

SATA1

PwrCtrl

SysMgmt

RTC

SATA0
SATA1

SER0
SER1

DMI

PCIe#3

USB #0-7

(USB 2.0)

LPC

GPIO

SMB

PWM
FAN2

I2C

SMB

SPI

HDA

PCIe #0-2

PCIe #3

Intel® NM10

Express Chipset

LID

Sleep

TPM

SLB9635TT

SPI

BIOS Flash

LVDS

DP++

(DDI1)

Connector Option

Standard

component

GB LAN

GPIO

Embedded Controller

(CPLD EPM570/ 1270)

HWM

NCT7802

EEPROM

FAN1

COM Express® connector AB – Pin-out Type 6

GBLan

Intel® 82574L

VCC

5VSB

VBAT

HWM

SMB

Power sequencing

Watchdog

LPC2I2C

GPIO Buffer

Intel® Atom™

D2000 Series
N2000 Series

GMA3650
GMA3600

2x UART

SATA

NANDrive®

S5eco

DDR3 SODIMM

DDR3-800/1066

COM Express® connector CD – Pin-out Type 6

USB 3.0

TI TUSB7320

PCIe #2

COMe-cCT6 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

36011-0000-99-0 HSP COMe-cCT6 thread

-

36011-0000-99-1 HSP COMe-cCT6 through

-

General accessories

Part Number COMe pin-out Type 6 compatible accessories Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPort

96006-0000-00-2 COMe POST T6 NFCB POS T Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6

38114-0000-00-S COMe Ref. Starterkit T6 ADAS Star terkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Battery Kit Star terkit Kontron Mobile Application platform for Rechargeable Systems

Compatible Memory

Product Number Memory

97015-1024-16-0 DDR3-1600 SODIMM 1GB

97015-2048-16-0 DDR3-1600 SODIMM 2GB

97015-4096-16-0 DDR3-1600 SODIMM 4GB

97015-1024-16-2 DDR3-1600 SODIMM 1GB E2

97015-2048-16-2 DDR3-1600 SODIMM 2GB E2

97015-4096-16-2 DDR3-1600 SODIMM 4GB E2

16

COMe-cCT6 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-cCT6 variants is 7.5 - 13W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

17

COMe-cCT6 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

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COMe-cCT6 / Product Specification

3.6 Power Control

Power Supply

The COMe-cCT6 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cCT6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

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COMe-cCT6 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-cCT6

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 4.75 - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

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COMe-cCT6 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-cCT6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

21

COMe-cCT6 / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cCT6 follows the requirements for electromagnetic compatibility

standards

» EN55022

PCB Specification

» IPC-6016 Class 2

» Flammability UL 796 / UL94-V0

22

COMe-cCT6 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 216156 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

23

COMe-cCT6 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in
height for an overall height of 27.3mm from module bottom to Heatsink top.

24

COMe-cCT6 / Product Specification

3.11 Module Dimensions

25

COMe-cCT6 / Product Specification

3.12 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cCT6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-cCT6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cCT6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-cCT6 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

26

COMe-cCT6 / Product Specification

3.13 Onboard Connectors

27

COMe-cCT6 / Product Specification

3.13.1 FAN

The COMe-cCT6 supports an onboard FAN connector for active cooling controlled by the BIOS.

Specification of the FAN Connector:

» Part number (Molex): 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 4.75 - 13V >13V

FAN Output Voltage

4.75 - 13V 13V

Max. FAN Output Current

350mA 150mA

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

3.13.2 CPU Debug & CPLD

The CPU Debug connector J4 (not soldered by default) and the CPLD programming interface J7 are for internal use only
and should not be used.

28

COMe-cCT6 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard SSD

The COMe-cCT6 features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC, 2-64GB MLC (SATA).
Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following SATA
NANDrives are available:

Basic features of the SATA NANDrives

» ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support

» RoHS compliant NAND flash type

» SATA 1.5Gb/s Host transfer rate

» Hardware error detection, correction ECC and advanced wear leveling

» Bad block management

» TRIM support

» SMART support

» 0°C to +70°C temperature range for MLC types A-M-C/B-M-C

» -40°C to +85°C temperature range for MLC types B-M-I

» -40°C to +85°C temperature range for all SLC types

Single-level Cell (SLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No. 1002P-S-I-FZJE-ND104 1004P-S-I-FZJE-ND104 1008P-S-I-FZJE-ND104 1016P-S-I-FZJE-ND104 1032P-S-I-FZJE-ND104

Product Revision

CC1 CC1 CC1 CC1 CC1

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte

Burst Read/Write Speed

35/20 MB/s 70/35 MB/s 70/50 MB/s 70/55 MB/s 120/80 MB/s

Total Bytes

2,000,388,096 4,001,292,288 8,012,390,400 16,013,942,784 32,017,047,552

Active Mode Power

450mW 560mW 750mW 590mW 855mW

Typical P/E Cycles per
block

100,000 100,000 60,000 60,000 60,000

(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)

Multi-level Cell (MLC) NANDrive™

Flash Part No. GLS85LS

Flash Part No.

1002A-M-C-FZJE-ND103
1002A-M-I-FZJE-ND103

1004A-M-C-FZJE-ND103
1004A-M-I-FZJE-ND103

1008B-M-C-FZJE-ND103
1008B-M-I-FZJE-ND103

1016B-M-C-FZJE-ND103
1016B-M-I-FZJE-ND103

1032B-M-C-FZJE-ND103
1032B-M-I-FZJE-ND103

1064B-M-C-FZJE-ND103
1064B-M-I-FZJE-ND103

Product Revision

CB2 CB2 CB2 CB2 CB2 CB2

Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte 64GByte

Burst Read/Write
Speed

35/10 MB/s 35/10 MB/s 35/10 MB/s 70/20 MB/s 70/30 MB/s 110/60 MB/s

Total Bytes

1,941,553,152 3,941,941,248 8,012,390,400 16,013,942,784 32,017,047,552 64,023,257,088

Active Mode Power

360mW 360mW 360mW 440mW 565mW 820mW

Typical P/E Cycles per
block

5,000 5,000 5,000 5,000 5,000 5,000

(Data based on Datasheet S71430 Rev 02.00 from 10-2013)

29

COMe-cCT6 / Features and Interfaces

4.2 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

30

COMe-cCT6 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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COMe-cCT6 / Features and Interfaces

4.4 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.

4.5 SPI boot

The COMe-cCT6 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

32

COMe-cCT6 / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

33

COMe-cCT6 / Features and Interfaces

4.6 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

34

COMe-cCT6 / Features and Interfaces

4.7 UART

The COMe-cCT6 supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for
UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by
default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 450 to 115.2k Baud (except 56000)

» 5, 6, 7 or 8bit characters

» 1 or 2 Stop bit generation

» Even, odd or no-parity generation/detection

» Complete status reporting capabilities

» Line break generation and detection

» Full prioritized interrupt system control

» No FIFO

» One additional shift register for transmit and one for receive

» No Flow Control

» No FCR register due to unavailability of FIFO

» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings

- Due to the protection circuitry required according COM Express® specification the
transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or
support for customized versions without protection circuitry

- Legacy console redirection via onboard serial ports may be restricted in terms of serial
input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream
generated by a program may lose characters. Inputs from a keyboard via terminal program
will be safe.

35

COMe-cCT6 / Features and Interfaces

4.8 Fast I2C

The COMe-cCT6 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from
opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

36

COMe-cCT6 / Features and Interfaces

4.9 GPIO - General Purpose Input and Output

The COMe-cCT6 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital
in- and outputs are available.

Signal Pin Description

GPI0 A54 General Purpose Input 0

GPI1 A63 General Purpose Input 1

GPI2 A67 General Purpose Input 2

GPI3 A85 General Purpose Input 3

GPO0 A93 General Purpose Output 0

GPO1 B54 General Purpose Output 1

GPO2 B57 General Purpose Output 2

GPO3 B63 General Purpose Output 3

Configuration

The GPI and GPO pins can be configured via JIDA32/K-Station. Please refer to the JIDA32/K-Station manual in the driver
download packet on our customer section.

37

COMe-cCT6 / Features and Interfaces

4.10 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a
system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to
regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”,
“feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive
state into normal operation.

The COMe-cCT6 offers a watchdog which works with two stages that can be programmed independently and used one by
one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It
is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst
stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within
time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If
deassertion during runtime is necessary please ask your Kontron technical support for further help.

38

COMe-cCT6 / Features and Interfaces

4.11 Intel® Fast Flash Standby™ / Rapid Start Technology™

The target of Intel® Fast Flash Standby™ (iFFS) (also known as Intel® Rapid Start Technology™ iRST) is to get a wake-up
time from S4 compareable to S3. Normally S4 is caused by OS which stores it's information to the hard disk and does then
a normal shutdown. S4 resume takes quite long as the system does a normal BIOS POST and OS restores it's information
from the hard disk.

IFFS does it in a different way. The Operating System initiates an S3 and stores it's information in memory. After that
BIOS copies this OS information from DRAM to SSD and does a sleep state similar to S4 with nearly zero power. If system is
resumed by power button, BIOS restores memory content from SSD to the DRAM and does an S3 resume which is much
faster.

Requirements

» SATA Solid State Disk in AHCI mode

» Free disk space on the SSD with at least the DRAM size

» Operating System with disk partition tool to allocate the hibernation partition (e.g. Windows 7/8)

» BIOS supporting iFFS feature

How to setup once the operating system is installed

» Prepare a free disk space on your onboard or external SSD with at least the size of DRAM

» Open cmd.exe in Administrator Mode and type diskpart.exe to open the Windows disk partition tool

» DISKPART> list disk

» DISKPART> select disk X (X is disk number where you want to create the store partition. Refer to results from “list

disk” for exact disk number)

» DISKPART> create partition primary

» DISKPART> detail disk

» DISKPART> select Volume X (X is Volume of your store partition. Refer to results from “detail disk” for exact volume

number)

» DISKPART> set id=84 override (ID 84 marks the partition as hibernate partition)

» DISKPART> exit

» Now there should be a Hibernate Partition visible in your disk management

» Reboot and enable iFFS in BIOS

Usage

» Activate Lid / move system to Sleep/Standby ( S3)→

» After configured period of time in Setup the system powers on automatically and information in DRAM moves to

non-volatile memory (Default is 'immediately')

» System switches off again to iFFS ( comparable to S4, Power Supply can now be disconnected)→

» When System is powered on, information moved back to DRAM (No display output during copy process)

» System resumes same as Sleep/Standby S3

Note

» Depending on the platform iFFS enabled may disable the hibernate function in Windows automatically

39

COMe-cCT6 / Features and Interfaces

Benefits

» System transitions from S3 to S4 automatically

» Up to 6x battery life compared to Standby

» Resume time reduced up to 75%

Measured resume times from Power-on to Win7 Log-on Screen on COMe-mCT10:

» 2.5” SATA II HDD 5400rpm: Hibernate: 22s, iFFs on onboard NANDrive: 17s

» 2.5” SATA III SSD: Hibernate: 18s, iFFS on SSD: 10s

40

COMe-cCT6 / Features and Interfaces

4.12 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum
performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to
adapt high performance computing on your applications. When powered by a battery or running in idle mode, the
processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining
a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize
performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup
the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

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COMe-cCT6 / Features and Interfaces

4.13 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or
switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clock s via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance
sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

42

COMe-cCT6 / Features and Interfaces

4.14 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to
improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the
processor—those that store the architectural state but not duplicating the main execution resources. This allows a Hyper­Threading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the
operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies
on the Operating System.

43

COMe-cCT6 / Features and Interfaces

4.15 Display Configuration

The chapter describes possible display configurations and supported features for the integrated Intel® GMA 3650 / 3600
graphics.

Dual Display Configurations in O/S

Display N/A CRT LVDS fix LVDS DID LVDS2DVI DP DP2DVI DP2HDMI DP2CRT

N/A

- S S S S S S S S

CRT

S - A A A A A A A

LVDS fix

S A - - - A A A A

LVDS DID

S A - - - A A A A

LVDS2DVI

S A - - - A A A A

DP

S A A A A A A A A

DP2DVI

S A A A A A A A A

DP2HDMI

S A A A A A A A A

DP2CRT

S A A A A A A A A

eDP

- - - - - - - - -

» S = Single Display

» A = All Modes (Single Display, Clone Mode, Extended Desktop)

» A* = All Modes, but requires a customized BIOS

» - = Not supported

» N/A = Display not attached

44

COMe-cCT6 / Features and Interfaces

Dual Display configurations in Setup and POST

Display N/A CRT LVDS fix LVDS DID LVDS2DVI DP DP2DVI DP2HDMI DP2CRT

N/A

- S S S S S S S S

CRT

S - C C* Twin C C C C

LVDS fix

S C - - - C C C C

LVDS DID

S C* - - - C* C* C* C*

LVDS2DVI

S Twin - - - C C C C

DP

S C C C* C C C C C

DP2DVI

S C C C* C C C C C

DP2HDMI

S C C C* C C C C C

DP2CRT

S C C C* C C C C C

eDP

- - - - - - - - -

» S = Single Display

» C = Clone Mode

» C* = Clone Mode, requires manual display configuration in setup. With Auto detection LVDS only is supported

» Twin = Twin Mode with 2 Displays on Display Pipe 1.

» - = Not supported

» N/A = Display not attached

In Clone Mode Display Pipe 2 only shows VESA Modes in POST, Setup and EFI Shell. DOS,
Windows boot or the Windows Installation is using VGA Mode which is not supported by
Display Pipe 2. With CRT and LVDS with EDID (e.g. LVDS2DVI Adapter) the Twin Mode is
active without VESA mode restrictions

45

COMe-cCT6 / Features and Interfaces

Digital Display Interface Features

The integrated Intel® GMA 3650 / 3600 graphics supports:

» High-bandwidth Digital Content Protection (HDCP)

» One active Protected Audio and Video Path (PAVP) session

» DP and HDMI Hot-plug (low-active)

DDI Design Consideration

» For sufficient signal quality baseboard designs with long signal lanes or impedance leaps may require an Equalicer

or Redriver for the digital display interfaces

» Monitor Hot-plug detection is usually high-active. On COMe-cCT6 the hot-plug is low active and requires conversion

on the baseboard

» SDVO can be used for external conversion to VGA, LVDS, TV-out and requires additional hardware on your baseboard

» DisplayPort can be used directly or with external adapters for HDMI, DVI or VGA

» HDMI or DVI usage on a baseboard requires a level shifter

Find more details for DDI usage as DisplayPort, HDMI or DVI with schematic examples
available on http://emdcustomersection.kontron.com

46

COMe-cCT6 / Features and Interfaces

4.16 Graphics Features

The COMe-cCT6 supports the integrated Intel® GMA 3650 / 3600 graphics based on PowerVR SGX545. Following Operating
System and Software Features are supported:

O/S WEC7 WinXP / XPe Win7 / WES7 Linux Fedora / Yocto

Recommended VBIOS

EMGD* GMA*

Driver

EMGD 1.15 EMGD 1.15 GMA 3600 Linux PowerVR Graphics

Max LVDS Resolution

D2000: 1440×900
N2000: 1366×768

Max VGA Resolution

D2000/N2000: 1920×1200

Max HDMI/DVI Resolution

D2000/N2000: 1920×1200

Max DP Resolution

D2000: 2560×1600
N2000: 1920×1200

D2000: 2560×1600
N2000: 1600×1200

Max eDP Resolution

D2000: 1920×1080 (1080p)

N2000: 1366×768

Dual Independent Display

Yes

2D HW Acceleration

- DirectDraw DirectDraw EXA and XRandR

3D HW Acceleration

- DX9 Direct3D DX9 Direct3D OpenGL ES2.0, HTML5WebGL

HW Media Acceleration

SW only SW only DXVA VA API

HW Codecs supported

- - H.264, MPEG2, VC-1 H.264, MPEG2

Blu-Ray

- - v2.0 -

HDCP

- v1.3 (HDMI only) v1.3 (HDMI/DP) -

Media players

- - Windows Media Player
PowerDVD 10

Total Media Theatre 3

MPlayer

* The Standard BIOS provided with the module supports the GMA VBIOS only. For any issues
of EMGD driver in combination with GMA VBIOS please contact your local sales or support

4.17 Hardware Configuration

The Intel® GMA 3650 / 3600 supports 2 Digital Display Interfaces:

» DDI0 = HDMI-B or DP-B

» DDI1 = HDMI-C or DP-C

On COMe-mCT10 only DDI1 is available while on COMe-cCT6 both DDIs are provided on COM Express connector

4.18 Graphics VBIOS and Driver

The COMe-cCT6 standard BIOS supports the GMA Video-BIOS which is optimized for use with GMA Video Driver
(Win7/WES7). For use with EMGD driver (Linux, WinXP) Intel® recommends to use the EMGD Video-BIOS. The EMGD VBIOS
has to be configured for each System Layout and Display Configuration separately which only allows to use the EMGD
VBIOS within a customized BIOS Version. To prepare a EMG Driver and EMGD VBIOS following software is required:

» Intel® EMGD package: available on EMD Customer Section

» Documentation how to prepare a driver and VBIOS: Inside EMGD Package

» C++ Compiler to create a VBIOS

» AMI MMTool to patch the VBIOS into the Module BIOS

Please contact your local Sales or support for further details or preparing a customized BIOS according your requirements

47

COMe-cCT6 / Features and Interfaces

4.19 ACPI Suspend Modes and Resume Events

The COMe-cCT6 supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with
StBy-Voltage
(2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup
and driver options

48

COMe-cCT6 / Features and Interfaces

4.20 USB

The COMe-cCT6 supports 8x USB 2.0 with following internal EHCI/UHCI configuration inside -. xHCI (USB 3.0) is optional
available with onboard PCI Express USB 3.0 controller TI TUSB7320

With USB3.0 option the COM Express USB Ports #0 and #1 are not connected to the NM10
UHCI/EHCI controller. Therefore BIOS Settings won't have any affects on these ports

49

COMe-cCT6 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

IRQ # Used For Available Comment

0 Timer0 No -

1 Keyboard No -

2 Cascade No -

3 External SIO - COM2 Ext.SIO Dynamic (BIOS default)

4 External SIO - COM1 Ext.SIO Dynamic (BIOS default)

5 External SIO - LPT1 Ext.SIO Dynamic (BIOS default)

6 - Ext.SIO -

7 SMBus No Note(3)

8 RTC No -

9 ACPI No -

10 - Ext.SIO -

11 - Ext.SIO -

12 - Ext.SIO -

13 FPU No -

14 - No -

15 - No -

16 LNK A No PCIe RP 0 + USB UHCI3; Note(3)

17 LNK B No PCIe RP 1; Note(3)

18 LNK C No PCIe RP 2 + USB UHCI2 + xHCI; Note(3)

19 LNK D No PCIe RP 3 + USB UHCI1 + S-ATA; Note(3)

20 LNK E No Note(3)

21 LNK F No Note(3)

22 LNK G No HDA; Note(3)

23 LNK H No USB UHCI0 + USB EHCI; Note(3)

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available
for other device.
(2) Not available if ACPI is used
(3) ACPI OS decides on particular IRQ usage

5.2 Memory Area

The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1MB of memory directly. The memory area
above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and
EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special
textbooks for information about HIMEM.SYS and EMM386.EXE. Other operating systems (Linux or Windows versions) allow
you to address the full memory area directly.

Upper Memory Used for Available Comment

A0000h – BFFFFh VGA Memory No Mainly used by graphic controller

C0000h – CFFFFh VGA BIOS No Used by onboard VGA ROM

D0000h – DFFFFh - Yes Free for shadow RAM in standard

configurations.

E0000h – FFFFFh System BIOS No Fixed

E0000000h–EFFFFFFFh PCIe Config Space No Fixed

FEC00000h-FEC00FFFh APCB No Fixed

FED00000h-FED003FFh HPET No Fixed

FED14000h-FED17FFFh MCH No Fixed

FED18000h-FED18FFFh DMI No Fixed

FED19000h-FED19FFFh EPBA No Fixed

FED1C000h-FED1FFFFh RCBA No Fixed

FED2000h FED8FFFFh Chipset + TPM No Fixed

FF000000h-FFFFFFFFh BIOS Flash No Fixed

50

COMe-cCT6 / System Resources

5.3 I/O Address Map

The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for
compatibility reasons, even if available.

I/O Address Used for Available Comment

0000 - 001F System Ressources No Fixed

0020 - 003F Interrupt Controller 1 No Fixed

0040 - 005F Timer, Counter No Fixed

0060 - 006F Keyboard controller No Fixed

0070 - 007F RTC and CMOS Registers No Fixed

0080 BIOS Postcode No Fixed

0081 - 009F DMA Controller No Fixed

00A0 - 00BF Interrupt Controller No Fixed

00C0 - 00DF DMA Controller No Fixed

00F0 - 00FF Math Coprocessor No Fixed

0290 - 029F Ext.SIO No Fixed

03B0 - 03DF VGA No Fixed

0400 - 047F Chipset No Fixed

04D0 - 04D1 Chipset No Fixed

0500 - 057F Chipset No Fixed

0600 - 061F Chipset No Fixed

0680 - 06FF Chipset No Fixed

0A80 - 0A81 CPLD No Fixed

0CF8 - 0CFF Chipset No Fixed

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a
specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

PCI Device B:D:F PCI IRQ Interface Comment

Host Bridge 0:00:0 - internal Chipset

Video Controller 0:02:0 LNK A internal Chipset

HDA 0:1B:0 LNK G PCIe Chipset

PCIe Port 0 0:1C:0 LNK A internal Chipset

PCIe Port 0 Slot - A/B/C/D PCIe Port 0

PCIe Port 1 0:1C:1 LNK A internal Chipset

PCIe Port 1 Slot - B/C/D/A PCIe Port 1

PCIe Port 2 0:1C:2 LNK A internal Chipset

PCIe Port 2 Slot - C/D/A/B PCIe Port 2

PCIe Port 3 0:1C:3 LNK A internal Chipset

PCIe Port 3 Slot - D/A/B/C PCIe Port 3

UHCI0 0:1D:0 LNK H internal Chipset

UHCI1 0:1D:1 LNK D internal Chipset

UHCI2 0:1D:2 LNK C internal Chipset

UHCI3 0:1D:3 LNK A internal Chipset

EHCI 0:1D:7 LNK H internal Chipset

LPC Bridge 0:1F:0 - internal Chipset

SATA 0:1F:2 LNK D internal Chipset

SMBus 0:1F:3 LNK D internal Chipset

GbE X:00:0 LNK D PCIe Slot 3

51

COMe-cCT6 / System Resources

5.5 I2C Bus

I2C Address Used For Available Comment

A0h FRU-EEPROM No Module EEPROM

AEh FRU-EEPROM No Baseboard EEPROM

5.6 JILI I2C Bus

I2C Address Used For Available Comment

A0h LVDS-EEPROM No EEPROM for LVDS Data

5.7 System Management (SM) Bus

Address Device Comment

12h SMART_CHARGER Not to be used with any SM bus deivce except a charger

14h SMART_SELECTOR Not to be used with any SM bus deivce except a selector

16h SMART_BATTERY Not to be used with any SM bus deivce except a battery

58h HWMonitor Do not use under any circumstances

A2h DDR3 Memory Socket Do not use under any circumstances

D2h Clock Generator Do not use under any circumstances

52

COMe-cCT6 / Connectors

6 Connectors

The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express™
Specification and COM Express™ Design Guide for detailed, design-level information.

6.1 Connector Location

53

COMe-cCT6 / Pinout List

7 Pinout List

7.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

OA

Output Analog

OD

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

PU

Pull-Up Resistor

PD

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current the enclosure of the peripheral
device fulfills the fire-protection requirements of IEC/EN60950

54

COMe-cCT6 / Pinout List

7.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND_1 Power Ground PWR - -

A2 GBE0_MDI3- Ethernet Receive Data- DP-I - -

A3 GBE0_MDI3+ Ethernet Receive Data+ DP-I - -

A4 GBE0_LINK100# Ethernet Speed LED 100Mbps OD - -

A5 GBE0_LINK1000# Ethernet Speed LED 1000Mbps OD - -

A6 GBE0_MDI2- Ethernet Receive Data- DP-I - -

A7 GBE0_MDI2+ Ethernet Receive Data+ DP-I - -

A8 GBE0_LINK# LAN Link LED OD - -

A9 GBE0_MDI1- Ethernet Receive Data- DP-I - -

A10 GBE0_MDI1+ Ethernet Receive Data+ DP-I - -

A11 GND_2 Power Ground PWR - -

A12 GBE0_MDI0- Ethernet Transmit Data- DP-O - -

A13 GBE0_MDI0+ Ethernet Transmit Data+ DP-O - -

A14 GBE0_CTREF LAN Reference Voltage O-3.3 100nF to GND -

A15 SUS_S3# Indicates Suspend to RAM state O-3.3 - CPLD I/O

A16 SATA0_TX+ SATA 0 Transmit Data+ DP-O - -

A17 SATA0_TX- SATA 0 Transmit Data- DP-O - -

A18 SUS_S4# Indicates Suspend to Disk state O-3.3 - -

A19 SATA0_RX+ SATA 0 Receive Data+ DP-I - -

A20 SATA0_RX- SATA 0 Receive Data- DP-I - -

A21 GND_3 Power Ground PWR - -

A22 SATA2_TX+ Not Connected nc - -

A23 SATA2_TX- Not Connected nc - -

A24 SUS_S5# Indicates Soft Of f state O-3.3 - CPLD I/O

A25 SATA2_RX+ Not Connected nc - -

A26 SATA2_RX- Not Connected nc - -

A27 BATLOW# Indicates low external battery I-3.3 - -

A28 ATA_ACT# SATA Activity Indicator OD - -

A29 HDA_SYNC HD Audio SYNC O-3.3 PD 20k in NM10 -

A30 HDA_RST# HD Audio Reset O-3.3 - -

A31 GND_4 Power Ground PWR - -

A32 HDA_CLK HD Audio CLK O-3.3 PD 20k in NM10 24MHz

A33 HDA_SDOUT HD Audio Data O-3.3 PD 20k in NM10 -

A34 BIOS_DIS0# Disable Module BIOS. I-3.3 PU 10k 3.3V_S5 -

A35 THRMTRIP# CPU thermal shutdown indicator O-3.3 PU 10k 3.3V_S0 -

A36 USB6- USB Data- Port #6 DP-I/O PD 15k in NM10 -

A37 USB6+ USB Data+ Port #6 DP-I/O PD 15k in NM10 -

A38 USB_6_7_OC# USB Over current Pair 6 / 7 I-3.3 PU 10k 3.3V_S5 -

A39 USB4- USB Data- Port #4 DP-I/O PD 15k in NM10 -

A40 USB4+ USB Data+ Port #4 DP-I/O PD 15k in NM10 -

A41 GND_5 Power Ground PWR - -

A42 USB2- USB Data- Port #2 DP-I/O PD 15k in NM10 -

A43 USB2+ USB Data+ Port #2 DP-I/O PD 15k in NM10 -

A44 USB_2_3_OC# USB Over current Pair 2 / 3 I-3.3 PU 10k 3.3V_S5 -

A45 USB0- USB Data- Port #0 DP-I/O PD 15k in NM10 -

A46 USB0+ USB Data+ Port #0 DP-I/O PD 15k in NM10 -

A47 VCC_RTC RTC Battery Supply +3V PWR - -

A48 EXCD0_PERST# PCI Express Card 0 Reset O-3.3 - -

A49 EXCD0_CPPE# PCI Express Card 0 Request I-3.3 PU 8k25 3.3V_S0 -

A50 LPC_SERIRQ LPC Serial Interrupt Request IO-3.3 PU 10k 3.3V_S0 -

A51 GND_6 Power Ground PWR - -

A52 PCIE_TX5+ Not Connected nc - -

A53 PCIE_TX5- Not Connected nc - -

A54 GPI0 General Purpose Input 0 I/O-3.3 PU 10k/100k to V3.3_S0 -

A55 PCIE_TX4+ Not Connected nc - -

A56 PCIE_TX4- Not Connected nc - -

A57 GND_7 Power Ground PWR - -

A58 PCIE_TX3+ PCIe lane #3 Transmit+ (Optional) DP-O - only available on no-LAN var.

A59 PCIE_TX3- PCIe lane #3 Transmit- (Optional) DP-O - only available on no-LAN var.

A60 GND_8 Power Ground PWR - -

A61 PCIE_TX2+ PCIe lane #2 Transmit+ DP-O - -

A62 PCIE_TX2- PCIe lane #2 Transmit- DP-O - -

A63 GPI1 General Purpose Input 1 I/O-3.3 PU 10k/100k to V3.3_S0 -

A64 PCIE_TX1+ PCIe lane #1 Transmit+ DP-O - -

55

COMe-cCT6 / Pinout List

A65 PCIE_TX1- PCIe lane #1 Transmit- DP-O - -

A66 GND_9 Power Ground PWR - -

A67 GPI2 General Purpose Input 2 I/O-3.3 PU 10k/100k to V3.3_S0 -

A68 PCIE_TX0+ PCIe lane #0 Transmit+ DP-O - -

A69 PCIE_TX0- PCIe lane #0 Transmit- DP-O - -

A70 GND_10 Power Ground PWR - -

A71 LVDS_A0+ LVDS Channel A DAT0+ DP-O - -

A72 LVDS_A0- LVDS Channel A DAT0- DP-O - -

A73 LVDS_A1+ LVDS Channel A DAT1+ DP-O - -

A74 LVDS_A1- LVDS Channel A DAT1- DP-O - -

A75 LVDS_A2+ LVDS Channel A DAT2+ DP-O - -

A76 LVDS_A2- LVDS Channel A DAT2- DP-O - -

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 PD 100k -

A78 LVDS_A3+ LVDS Channel A DAT3+ DP-O - -

A79 LVDS_A3- LVDS Channel A DAT3+ DP-O - -

A80 GND_11 Power Ground PWR - -

A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O - 20-80MHz

A82 LVDS_A_CK- LVDS Channel A Clock- DP-O - 20-80MHz

A83 LVDS_I2C_CK LVDS I2C Clock (DDC) IO-3.3 PU 2k2 3.3V_S0 -

A84 LVDS_I2C_DAT LVDS I2C Data (DDC) IO-3.3 PU 2k2 3.3V_S0 -

A85 GPI3 General Purpose Input 3 I/O-3.3 PU 10k/100k to V3.3_S0 -

A86 RSVD Not Connected nc - -

A87 RSVD Not Connected nc - -

A88 PCIE0_CK_REF+ PCIe Clock (positive) DP-O - 100MHz

A89 PCIE0_CK_REF- PCIe Clock (negative) DP-O - 100MHz

A90 GND_12 Power Ground PWR - -

A91 SPI_POWER Power supply for Carr ier Board SPI PWR - 100mA (max.)

A92 SPI_MISO Data in to Module from Carrier SPI I-3.3 - -

A93 GPO0 General Purpose Output 0 O-3.3 - / PD 100k -

A94 SPI_CLK Clock from Module to Carr ier SPI O-3.3 - 20MHz

A95 SPI_MOSI Data out from Module to Carrier SPI O-3.3 - -

A96 TPM_PP (TPM) Physical Presence pin I-3.3 PD 100k in TPM -

A97 T YPE10# Indicates TYPE10# to carrier board nc - -

A98 SER0_TX UART transmitter O-3.3 - 14.5V tolerance

A99 SER0_RX UART receiver I-3.3 PU 47k 3.3V_S0 14.5V tolerance

A100 GND_14 Power Ground PWR - -

A101 SER1_TX UART transmitter O-3.3 - 14.5V tolerance

A102 SER1_RX UART receiver I-3.3 PU 47k 3.3V_S0 14.5V tolerance

A103 LID# LID switch I-3.3 PU 47k 3.3V_S5 14.5V tolerance

A104 VCC_12V_7 12V VCC PWR - -

A105 VCC_12V_8 12V VCC PWR - -

A106 VCC_12V_9 12V VCC PWR - -

A107 VCC_12V_10 12V VCC PWR - -

A108 VCC_12V_11 12V VCC PWR - -

A109 VCC_12V_12 12V VCC PWR - -

A110 GND_15 Power Ground PWR - -

56

COMe-cCT6 / Pinout List

7.3 Connector X1A Row B

Pin Signal Description Type Termination Comment

B1 GND_16 Power Ground PWR - -

B2 GBE0_ACT# Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 - -

B4 LPC_AD0 LPC Address / Data Bus IO-3.3 PU 20k in NM10 -

B5 LPC_AD1 LPC Address / Data Bus IO-3.3 PU 20k in NM10 -

B6 LPC_AD2 LPC Address / Data Bus IO-3.3 PU 20k in NM10 -

B7 LPC_AD3 LPC Address / Data Bus IO-3.3 PU 20k in NM10 -

B8 LPC_DRQ0# Not Connected I-3.3 PU 20k in NM10 -

B9 LPC_DRQ1# Not Connected I-3.3 PU 20k in NM10 -

B10 LPC_CLK LPC Clock O-3.3 - 33MHz

B11 GND_17 Power Ground PWR - -

B12 PWRBTN# Power Button Input I-3.3 PU 10k 3.3V_S5 active on falling edge

B13 SMB_CLK SMBus Clock O-3.3 PU 10k in S5 / 5k in S0 3.3V -

B14 SMB_DAT SMBus Data IO-3.3 PU 10k in S5 / 5k in S0 3.3V -

B15 SMB_ALERT# SMBus Interrupt IO-3.3 PU 10k 3.3V_S5 -

B16 SATA1_TX+ SATA 1 Transmit Data+ DP-O - -

B17 SATA1_TX- SATA 1 Transmit Data- DP-O - -

B18 SUS_STAT# Indicates imminent suspend operation O-3.3 - -

B19 SATA1_RX+ SATA 1 Receive Data+ DP-I - -

B20 SATA1_RX- SATA 1 Receive Data- DP-I - -

B21 GND_18 Power Ground PWR - -

B22 SATA3_TX+ Not Connected nc - -

B23 SATA3_TX- Not Connected nc - -

B24 PWR_OK Power OK from power supply I-5T PU 511k 3.3V_S5 CPLD I/O

B25 SATA3_RX+ Not Connected nc - -

B26 SATA3_RX- Not Connected nc - -

B27 WDT Indicator for Watchdog Timeout O-3.3 - CPLD I/O

B28 HDA_SDIN2 Not Connected nc - not supported

B29 HDA_SDIN1 Audio Codec Serial Data in 1 I-3.3 PD 20k in NM10 -

B30 HDA_SDIN0 Audio Codec Serial Data in 0 I-3.3 PD 20k in NM10 -

B31 GND_19 Power Ground PWR - -

B32 SPKR Speaker Interface O-3.3 - -

B33 I2C_CK General Purpose I2C Clock IO-3.3 PU 2k2 3.3V_S5 CPLD I/O

B34 I2C_DAT General Purpose I2C Dat a IO-3.3 PU 2k2 3.3V_S5 CPLD I/O

B35 THRM# Over Temperature Indicator I-3.3 PU 10k 3.3V_S0 -

B36 USB7- USB Data- Por t #7 DP-I/O PD 15k in NM10 -

B37 USB7+ USB Data+ Port #7 DP-I/O PD 15k in NM10 -

B38 USB_4_5_OC# USB Over current Pair 4 / 5 I-3.3 PU 10k 3.3V_S5 -

B39 USB5- USB Data- Por t #5 DP-I/O PD 15k in NM10 -

B40 USB5+ USB Data+ Port #5 DP-I/O PD 15k in NM10 -

B41 GND_20 Power Ground PWR - -

B42 USB3- USB Data- Por t #3 DP-I/O PD 15k in NM10 -

B43 USB3+ USB Data+ Port #3 DP-I/O PD 15k in NM10 -

B44 USB_0_1_OC# USB Over current Pair 0 / 1 I-3.3 PU 10k 3.3V_S5 -

B45 USB1- USB Data- Por t #0 DP-I/O PD 15k in NM10 -

B46 USB1+ USB Data+ Port #0 DP-I/O PD 15k in NM10 -

B47 EXCD1_PERST# PCIe Express Card 1 Reset O-3.3 - -

B48 EXCD1_CPPE# PCIe Express Card 1 Request I-3.3 PU 8k25 3.3V_S0 -

B49 SYS_RESET# Reset button input I-3.3 PU 10k 3.3V_S5 -

B50 CB_RESET# Carrier Board Reset O-3.3 - CPLD I/O

B51 GND_21 Power Ground PWR - -

B52 PCIE_RX5+ Not Connected nc - -

B53 PCIE_RX5- Not Connected nc - -

B54 GPO1 General Purpose Output 1 I/O-3.3 PU 75k V3.3V_S0 / PD 100k -

B55 PCIE_RX4+ Not Connected nc - -

B56 PCIE_RX4- Not Connected nc - -

B57 GPO2 General Purpose Output 2 I-3.3 PU 10k V3.3V_S0 / PD 100k -

B58 PCIE_RX3+ PCIe lane #3 Receive+ (Optional) DP-I - only available on no-LAN var.

B59 PCIE_RX3- PCIe lane #3 Receive- (Optional) DP-I - only available on no-LAN var.

B60 GND_22 Power Ground PWR - -

B61 PCIE_RX2+ PCIe lane #2 Receive+ DP-I - -

B62 PCIE_RX2- PCIe lane #2 Receive- DP-I - -

B63 GPO3 General Purpose Output 3 I-3.3 PU 10k V3.3V_S0 / PD 100k -

B64 PCIE_RX1+ PCIe lane #1 Receive+ DP-I - -

57

COMe-cCT6 / Pinout List

B65 PCIE_RX1- PCIe lane #1 Receive- DP-I - -

B66 WAKE0# PCI Express Wake Event I-3.3 PU 1k 3.3V_S5 -

B67 WAKE1# General Purpose Wake Event I-3.3 PU 10k 3.3V_S5 -

B68 PCIE_RX0+ PCIe lane #0 Receive+ DP-I - -

B69 PCIE_RX0- PCIe lane #0 Receive- DP-I - -

B70 GND_23 Power Ground PWR - -

B71 LVDS_B0+ Not Connected nc - -

B72 LVDS_B0- Not Connected nc - -

B73 LVDS_B1+ Not Connected nc - -

B74 LVDS_B1- Not Connected nc - -

B75 LVDS_B2+ Not Connected nc - -

B76 LVDS_B2- Not Connected nc - -

B77 LVDS_B3+ Not Connected nc - -

B78 LVDS_B3- Not Connected nc - -

B79 LVDS_BKLT_EN Backlight Enable O-3.3 - -

B80 GND_24 Power Ground PWR - -

B81 LVDS_B_CK+ Not Connected nc - -

B82 LVDS_B_CK- Not Connected nc - -

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY +5V Standby PWR - -

B85 VCC_5V_SBY +5V Standby PWR - -

B86 VCC_5V_SBY +5V Standby PWR - -

B87 VCC_5V_SBY +5V Standby PWR - -

B88 BIOS_DIS1# Disable Module BIOS.Enable boot from SPI on Baseboard I-3.3 PU 10k 3.3V_S5 For ext.SPI

B89 CRT_RED CRT_RED / Analog Video RGB-RED OA PD 150R -

B90 GND_25 Power Ground PWR - -

B91 CRT_GREEN CRT_GREEN / Analog Video RGB-GREEN OA PD 150R -

B92 CRT_BLUE CRT_BLUE / Analog Video RGB-BLUE OA PD 150R -

B93 CRT_HS YNC CRT_HSYNC / Analog Video H-Sync O-3,3 - -

B94 CRT_VS YNC CRT_VSYNC / Analog Video V-Sync O-3,3 - -

B95 CRT_DDC_CLK CRT_DDC_CLK / Display Data Channel Clock I/O-5 PU 2k21 5.0V_S0 -

B96 CRT_DDC_DATA CRT_DDC_DATA / Display Data Channel Data I/O-5 PU 2k21 5.0V_S0 -

B97 SPI_CS# SPI Chipselect O 3.3V_S5 -

B98 RSVD Not Connected nc - -

B99 RSVD Not Connected nc - -

B100 GND_26 Power Ground PWR - -

B101 FAN_PWMOUT FAN PWM out O-3.3 - 14.5V tolerance

B102 FAN_TACHIN FAN Tacho in I-3.3 PU 47k 3.3V_S0 14.5V tolerance

B103 SLEEP# Sleep button I-3.3 PU 47k 3.3V_S5 14.5V tolerance

B104 VCC_12V_16 12V VCC PWR - -

B105 VCC_12V_17 12V VCC PWR - -

B106 VCC_12V_18 12V VCC PWR - -

B107 VCC_12V_19 12V VCC PWR - -

B108 VCC_12V_20 12V VCC PWR - -

B109 VCC_12V_21 12V VCC PWR - -

B110 GND_27 Power Ground PWR - -

58

COMe-cCT6 / Pinout List

7.4 Connector X1B Row C

Pin Signal Description Type Termination Comment

C1 GND Power Ground PWR - -

C2 GND Power Ground PWR - -

C3 USB_SSRX0- USB Super Speed Receive - (0) DP-I - -

C4 USB_SSRX0+ USB Super Speed Receive + (0) DP-I - -

C5 GND Power Ground PWR - -

C6 USB_SSRX1- USB Super Speed Receive - (1) DP-I - -

C7 USB_SSRX1+ USB Super Speed Receive + (1) DP-I - -

C8 GND Power Ground PWR - -

C9 USB_SSRX2- Not Connected nc - -

C10 USB_SSRX2+ Not Connected nc - -

C11 GND Power Ground PWR - -

C12 USB_SSRX3- Not Connected nc - -

C13 USB_SSRX3+ Not Connected nc - -

C14 GND Power Ground PWR - -

C15 DDI1_PAIR6+ Not Connected nc - -

C16 DDI1_PAIR6- Not Connected nc - -

C17 RSVD Not Connected nc - -

C18 RSVD Not Connected nc - -

C19 PCIE_RX6+ Not Connected nc - -

C20 PCIE_RX6- Not Connected nc - -

C21 GND Power Ground PWR - -

C22 PCIE_RX7+ Not Connected nc - -

C23 PCIE_RX7- Not Connected nc - -

C24 DDI1_HPD DDI1 Hotplug Detect I-3,3 PD 1M -

C25 DDI1_PAIR4+ Not Connected nc - -

C26 DDI1_PAIR4- Not Connected nc - -

C27 RSVD Not Connected nc - -

C28 RSVD Not Connected nc - -

C29 DDI1_PAIR5+ Not Connected nc - -

C30 DDI1_PAIR5- Not Connected nc - -

C31 GND Power Ground PWR - -

C32 DDI2_CTRLCLK_AUX+ DDI2 CTRLCLK/AUX+ I/O-3,3 - -

C33 DDI2_CTRLDATA_AUX- DDI2 CTRLDATA/AUX- I/O-3,3 - -

C34 DDI2_DDC_AUX_SEL DDI2 DDC/AUX select I-3,3 PD 1M -

C35 RSVD n.c. nc - -

C36 DDI3_CTRLCLK_AUX+ Not Connected nc - -

C37 DDI3_CTRLDATA_AUX- Not Connected nc - -

C38 DDI3_DDC_AUX_SEL Not Connected nc - -

C39 DDI3_PAIR0+ Not Connected nc - -

C40 DDI3_PAIR0- Not Connected nc - -

C41 GND Power Ground PWR - -

C42 DDI3_PAIR1+ Not Connected nc - -

C43 DDI3_PAIR1- Not Connected nc - -

C44 DDI3_HPD Not Connected nc - -

C45 RSVD Not Connected nc - -

C46 DDI3_PAIR2+ Not Connected nc - -

C47 DDI3_PAIR2- Not Connected nc - -

C48 RSVD Not Connected nc - -

C49 DDI3_PAIR3+ Not Connected nc - -

C50 DDI3_PAIR3- Not Connected nc - -

C51 GND Power Ground PWR - -

C52 PEG_RX0+ Not Connected nc - -

C53 PEG_RX0- Not Connected nc - -

C54 T YPE0# n.c. for type 6 module nc - -

C55 PEG_RX1+ Not Connected nc - -

C56 PEG_RX1- Not Connected nc - -

C57 T YPE1# n.c. for type 6 module nc - -

C58 PEG_RX2+ Not Connected nc - -

C59 PEG_RX2- Not Connected nc - -

C60 GND Power Ground PWR - -

C61 PEG_RX3+ Not Connected nc - -

C62 PEG_RX3- Not Connected nc - -

C63 RSVD Not Connected nc - -

C64 RSVD Not Connected nc - -

59

COMe-cCT6 / Pinout List

C65 PEG_RX4+ Not Connected nc - -

C66 PEG_RX4- Not Connected nc - -

C67 RSVD Not Connected nc - -

C68 PEG_RX5+ Not Connected nc - -

C69 PEG_RX5- Not Connected nc - -

C70 GND Power Ground PWR - -

C71 PEG_RX6+ Not Connected nc - -

C72 PEG_RX6- Not Connected nc - -

C73 GND Power Ground PWR - -

C74 PEG_RX7+ Not Connected nc - -

C75 PEG_RX7- Not Connected nc - -

C76 GND Power Ground PWR - -

C77 RSVD Not Connected nc - -

C78 PEG_RX8+ Not Connected nc - -

C79 PEG_RX8- Not Connected nc - -

C80 GND Power Ground PWR - -

C81 PEG_RX9+ Not Connected nc - -

C82 PEG_RX9- Not Connected nc - -

C83 RSVD Not Connected nc - -

C84 GND Power Ground PWR - -

C85 PEG_RX10+ Not Connected nc - -

C86 PEG_RX10- Not Connected nc - -

C87 GND Power Ground PWR - -

C88 PEG_RX11+ Not Connected nc - -

C89 PEG_RX11- Not Connected nc - -

C90 GND Power Ground PWR - -

C91 PEG_RX12+ Not Connected nc - -

C92 PEG_RX12- Not Connected nc - -

C93 GND Power Ground PWR - -

C94 PEG_RX13+ Not Connected nc - -

C95 PEG_RX13- Not Connected nc - -

C96 GND Power Ground PWR - -

C97 RSVD Not Connected nc - -

C98 PEG_RX14+ Not Connected nc - -

C99 PEG_RX14- Not Connected nc - -

C100 GND Power Ground PWR - -

C101 PEG_RX15+ Not Connected nc - -

C102 PEG_RX15- Not Connected nc - -

C103 GND Power Ground PWR - -

C104 VCC_12V 12V VCC PWR - -

C105 VCC_12V 12V VCC PWR - -

C106 VCC_12V 12V VCC PWR - -

C107 VCC_12V 12V VCC PWR - -

C108 VCC_12V 12V VCC PWR - -

C109 VCC_12V 12V VCC PWR - -

C110 GND Power Ground PWR - -

60

COMe-cCT6 / Pinout List

7.5 Connector X1B Row D

Pin Signal Description Type Termination Comment

D1 GND Power Ground PWR - -

D2 GND Power Ground PWR - -

D3 USB_SSTX0- USB Super Speed Transmit - (0) DP-O - -

D4 USB_SSTX0+ USB Super Speed Transmit + (0) DP-O - -

D5 GND Power Ground PWR - -

D6 USB_SSTX1- USB Super Speed Transmit - (1) DP-O - -

D7 USB_SSTX1+ USB Super Speed Transmit + (1) DP-O - -

D8 GND Power Ground PWR - -

D9 USB_SSTX2- Not Connected nc - -

D10 USB_SSTX2+ Not Connected nc - -

D11 GND Power Ground PWR - -

D12 USB_SSTX3- Not Connected nc - -

D13 USB_SSTX3+ Not Connected nc - -

D14 GND Power Ground PWR - -

D15 DDI1_CTRLCLK_AUX+ DDI1 CTRLCLK/AUX+ I/O-3,3 - -

D16 DDI1_CTRLDATA_AUX- DDI1 CTRLDATA/AUX- I/O-3,3 - -

D17 RSVD Not Connected nc - -

D18 RSVD Not Connected nc - -

D19 PCIE_TX6+ Not Connected nc - -

D20 PCIE_TX6- Not Connected nc - -

D21 GND Power Ground PWR - -

D22 PCIE_TX7+ Not Connected nc - -

D23 PCIE_TX7- Not Connected nc - -

D24 RSVD Not Connected nc - -

D25 RSVD Not Connected nc - -

D26 DDI1_PAIR0+ DDI1 Pair 0 + DP-O - -

D27 DDI1_PAIR0- DDI1 Pair 0 - DP-O - -

D28 RSVD Not Connected nc - -

D29 DDI1_PAIR1+ DDI1 Pair 1 + DP-O - -

D30 DDI1_PAIR1- DDI1 Pair 1 - DP-O - -

D31 GND Power Ground PWR - -

D32 DDI1_PAIR2+ DDI1 Pair 2 + DP-O - -

D33 DDI1_PAIR2- DDI1 Pair 2 - DP-O - -

D34 DDI1_DDC_AUX_SEL DDI1 DDC/AUX select I-3,3 PD 1M -

D35 RSVD Not Connected nc - -

D36 DDI1_PAIR3+ DDI1 Pair 3 + DP-O - -

D37 DDI1_PAIR3- DDI1 Pair 3 - DP-O - -

D38 RSVD Not Connected nc - -

D39 DDI2_PAIR0+ DDI2 Pair 0 + DP-O - -

D40 DDI2_PAIR0- DDI2 Pair 0 - DP-O - -

D41 GND Power Ground PWR - -

D42 DDI2_PAIR1+ DDI2 Pair 1 + DP-O - -

D43 DDI2_PAIR1- DDI2 Pair 1 - DP-O - -

D44 DDI2_HPD DDI2 Hotplug Detect I-3,3 PD 1M -

D45 RSVD Not Connected nc - -

D46 DDI2_PAIR2+ DDI2 Pair 2 + DP-O - -

D47 DDI2_PAIR2- DDI2 Pair 2 - DP-O - -

D48 RSVD Not Connected nc - -

D49 DDI2_PAIR3+ DDI2 Pair 3 + DP-O - -

D50 DDI2_PAIR3- DDI2 Pair 3 - DP-O - -

D51 GND Power Ground PWR - -

D52 PEG_TX0+ Not Connected nc - -

D53 PEG_TX0- Not Connected nc - -

D54 PEG_LANE_RV# Not Connected nc - -

D55 PEG_TX1+ Not Connected nc - -

D56 PEG_TX1- Not Connected nc - -

D57 T YPE2# GND for type 6 module PWR - -

D58 PEG_TX2+ Not Connected nc - -

D59 PEG_TX2- Not Connected nc - -

D60 GND Power Ground PWR - -

D61 PEG_TX3+ Not Connected nc - -

D62 PEG_TX3- Not Connected nc - -

D63 RSVD Not Connected nc - -

D64 RSVD Not Connected nc - -

61

COMe-cCT6 / Pinout List

D65 PEG_TX4+ Not Connected nc - -

D66 PEG_TX4- Not Connected nc - -

D67 GND Power Ground PWR - -

D68 PEG_TX5+ Not Connected nc - -

D69 PEG_TX5- Not Connected nc - -

D70 GND Power Ground PWR - -

D71 PEG_TX6+ Not Connected nc - -

D72 PEG_TX6- Not Connected nc - -

D73 GND Power Ground PWR - -

D74 PEG_TX7+ Not Connected nc - -

D75 PEG_TX7- Not Connected nc - -

D76 GND Power Ground PWR - -

D77 RSVD Not Connected nc - -

D78 PEG_TX8+ Not Connected nc - -

D79 PEG_TX8- Not Connected nc - -

D80 GND Power Ground PWR - -

D81 PEG_TX9+ Not Connected nc - -

D82 PEG_TX9- Not Connected nc - -

D83 RSVD Not Connected nc - -

D84 GND Power Ground PWR - -

D85 PEG_TX10+ Not Connected nc - -

D86 PEG_TX10- Not Connected nc - -

D87 GND Power Ground PWR - -

D88 PEG_TX11+ Not Connected nc - -

D89 PEG_TX11- Not Connected nc - -

D90 GND Power Ground PWR - -

D91 PEG_TX12+ Not Connected nc - -

D92 PEG_TX12- Not Connected nc - -

D93 GND Power Ground PWR - -

D94 PEG_TX13+ Not Connected nc - -

D95 PEG_TX13- Not Connected nc - -

D96 GND Power Ground PWR - -

D97 RSVD Not Connected nc - -

D98 PEG_TX14+ Not Connected nc - -

D99 PEG_TX14- Not Connected nc - -

D100 GND Power Ground PWR - -

D101 PEG_TX15+ Not Connected nc - -

D102 PEG_TX15- Not Connected nc - -

D103 GND Power Ground PWR - -

D104 VCC_12V 12V VCC PWR - -

D105 VCC_12V 12V VCC PWR - -

D106 VCC_12V 12V VCC PWR - -

D107 VCC_12V 12V VCC PWR - -

D108 VCC_12V 12V VCC PWR - -

D109 VCC_12V 12V VCC PWR - -

D110 GND Power Ground PWR - -

The termination resistors in this table are already mounted on the module. Refer to the
design guide for information about additional termination resistors.

62

COMe-cCT6 / BIOS Operation

8 BIOS Operation

The module is equipped with AMI® Aptio, which is located in an onboard SPI serial flash memory.

8.1 Determining the BIOS Version

The AMI® Aptio version is displayed in the main menu of the setup utility.

» BIOS Vendor: American Megatrends

» Core Version: x.x.x.x

» BIOS Date: mm/dd/yyyy hh:mm:ss

» BIOS Version: UUP6RXXX

8.2 BIOS Update

Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with a detailed change description within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file
size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the
BIOS Region (usually 4-8MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a
wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch
file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

63

COMe-cCT6 / BIOS Operation

Backup the BIOS / Create a BIOS with custom defaults:

» Change your BIOS settings according your needs

» Save and Exit Setup with option “Save as User Defaults”. Your customized settings are now stored inside the flash in

a second area additional to the manufacturer defaults

» Boot the module to DOS or EFI Shell with access to the update utilities

» Extract the BIOS region including your custom defaults with afuefix64.efi CBIOS.bin /O in EFI Shell or afudos.exe

CBIOS.rom /O in DOS

Now you can clone the BIOS with your customized default settings to other modules or external SPI flashes with above
mention AFU utilites. On modules with Management Engine and Ethernet inside the Flash the same BIOS core version
should already be programmed on the target.

AMI APTIO update utilities for DOS, EFI Shell and Windows are available for free at AMI.com:

http://www.ami.com/support/downloads/amiflash.zip

64

COMe-cCT6 / BIOS Operation

8.3 Setup Guide

The Aptio Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a
number of menus to make changes and turn features on or off.

Functional keystrokes in POST:

Key Function

DEL

Enter Setup

F2

Enter Setup

F7

Boot Menu

8.4 POST Codes

Important POST codes during boot-up

AB

BIOS Setup

AD

EFI Shell

AE

Windows

8.4.1 Start AMI® Aptio Setup Utility

To start the AMI® BIOS setup utility, press <DEL> or <F2> when the following string appears during bootup.
Press <DEL> to enter Setup

The Info Menu then appears.
The Setup Screen is composed of several sections:

Setup Screen Location Function

Menu Bar Top Lists and selects all top level menus.

Legend Bar Right side Bottom Lists setup navigation keys.

Item Specific Help Window Right side Top Help for selected item.

Menu Window Left Center Selection f ields for current menu.

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below
describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select f ields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- Change Option

<Enter> Execute command or select submenu.

<F1> General Help window.

<F2> Previous Values

<F3> Load the optimized default configuration.

<F4> Save and exit.

<Esc> Exit menu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓
Save Value commands in the Exit menu save the values displayed in all the menus.

65

COMe-cCT6 / BIOS Operation

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the
cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press
<Esc> to exit the General Help window.

66

COMe-cCT6 / BIOS Operation

8.5 BIOS Setup

8.5.1 Main Menu

Feature Option Description

System Language

English

Choose the system default language (English only)

System Date [mm-dd-yyyy] <Tab>, <Shift-Tab>, or <Enter> selects field

System Time [hh:mm:ss] <Tab>, <Shift-Tab>, or <Enter> selects field

67

COMe-cCT6 / BIOS Operation

Platform Information

68

COMe-cCT6 / BIOS Operation

8.5.2 Advanced

69

COMe-cCT6 / BIOS Operation

ACPI Settings

Feature Options Description

Enable ACPI Auto Congiguration

Disabled
Enabled

Enables or Disables BIOS ACPI Auto Configuration

Enable Hibernation Disabled

Enabled

Enables or Disables System ability to Hibernate (OS/S4
Sleep State)

ACPI Sleep State Suspend Disabled

S3 (StR)

Select the highest ACPI sleep state the system will enter
when the SUSPEND button is pressed

Lock Legacy Ressources

Disabled
Enabled

Enables or Disables Lock of Legacy Ressources

S3 video Repost

Disabled
Enabled

Enable or Disable S3 Video Repost

70

COMe-cCT6 / BIOS Operation

Trusted Computing

Some setup options are available with TPM option only.

Feature Options Description

Security Device Support

Disable
Enable

Enable or Disable BIOS support for security device. O.S.
will not show Security Device. TCG EFI protocol and
INT1A interface will not be available.

TPM State

Disabled
Enabled

Enable/Disable Security Device. Note: Your Computer
will reboot during restar t in order to change Sate of the
Device

Pending Operation

None
Enable Take Ownership
Disable Take Ownership
TPM Clear

Schedule an Operation for the Security Device. Note:
Your Computer will reboot during restart in order to
change Sate of the Device

71

COMe-cCT6 / BIOS Operation

CPU Configuration

Feature Options Description

Hyper-Threading Disabled

Enabled

Enables/Disables the Intel® Hyper Threading
Technology HTT

Core-Multi Processing Disabled

Enabled

Enables/Disables Core-Multi Processing mode

Execute Disable Bit Disabled

Enabled

XD can prevent certain classes of malicious buf fer
overflow attacks when combined with a supporting OS

Limit CPUID Maximum

Disabled
Enabled

Disabled for Windows XP

Additional setup option for Cedarview-M (N2600/N2800)

Feature Options Description

Speedstep Disabled

Enabled

Enables/Disables Enhanced Intel® Speedstep
Technology EIST

72

COMe-cCT6 / BIOS Operation

Miscellaneous

Feature Options Description

S5 Eco

Disabled
Enabled

Reduce supply current in Soft Off State S5 to less than
1mA. If enabled, power button is the only wakeup
source in S5. See chapter S5 Eco for more details

Reset Button Behavior

Chipset Reset
Power Cycle

Select the behavior of Reset Button. Select Power Cycle
to hold the module in reset while reset button is
pressed

73

COMe-cCT6 / BIOS Operation

Watchdog

Feature Options Description

Auto-reload

Disabled
Enabled

Enable automatic reload of watchdog timers on timeout

Global Lock

Disabled
Enabled

If set to enabled, all Watchdog registers (except
WD_KICK) become read only until the board is reset

Stage 1 Mode

Disabled
Reset
NMI
SCI
Delay
WDT Signal only

Select Action for first Watchdog st age

- Assert WDT Signal

Disabled
Enabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 1 Timout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for first watchdog stage

Stage 2 Mode

Disabled
Reset
NMI
SCI
WDT Signal only

Select Action for second Watchdog stage

- Assert WDT Signal

Disabled
Enabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 2 Timout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for second watchdog stage

74

COMe-cCT6 / BIOS Operation

Clock Control

Feature Options Description

Spread Spectrum Disabled

-0.50% Spread

Enable/Disable Spread Spectrum for CPU, DMI, PCIe

LCD Spread Spectrum

Disabled

-2.50 Spread

Enable/Disable Spread Spectrum for LCD

75

COMe-cCT6 / BIOS Operation

LAN Configuration

Feature Options Description

Onboard LAN Controller

Enabled
Disabled

Enable/Disable onboard LAN Controller

Network OpROMs Disabled

Onboard only
Addon cards only
Both

Enable/Disable Legacy Boot Option for Network Devices

76

COMe-cCT6 / BIOS Operation

Generic LPC Decode Ranges

Feature Options Description

Generic LPC Decode Range 1
Generic LPC Decode Range 2
Generic LPC Decode Range 3

Enabled
Disabled

Enable/Disable Generic LPC Decode Range

Base Address

0100h

Base address of the generic decode range. Valid
between 0100h - FFF0h. Must be 8-byte aligned.

Length

0008h

Length of the generic decode range. Valid between
0008h - 0100h. Must be multiple of 8.

77

COMe-cCT6 / BIOS Operation

Smart Battery Configuration

Feature Options Description

M.A.R.S. Disabled

AUTO
Charger
Manager

Preset M.A.R.S. Smart Battery System mode. System
must be restarted to reflect mode changes

78

COMe-cCT6 / BIOS Operation

Battery Information

79

COMe-cCT6 / BIOS Operation

GPIO Configuration

Feature Options Description

GPO0 Level
GPO1 Level
GPO2 Level
GPO3 Level

High
Low

Set GPO Level High/Low

80

COMe-cCT6 / BIOS Operation

Onboard I2C Speed

Feature Options Description

Onboard I2C Speed 1kHz

10kHz
50kHz
100kHz
200kHz
400kHz

Select Onboard I2C Bus Speed in kHz, min 1kHz, max
400kHz

81

COMe-cCT6 / BIOS Operation

Thermal Configuration

82

COMe-cCT6 / BIOS Operation

CPU Thermal Configuration

Feature Options Description

DTS SMM Disabled

Enabled

Thermal management uses DTS SMM mechanism to
optain CPU temperature values. Active/Passive Cooling
is not working if disabled

83

COMe-cCT6 / BIOS Operation

Platform Thermal Configuration

Feature Options Description

Critical Trip Point

POR
15 .. 127

This value controls the temperature of the ACPI Critical
Trip Point - the point in which the OS will shut the
system off. Note: 100C is the Plan Of Record (POR) for
all Intel mobile processors

84

COMe-cCT6 / BIOS Operation

IDE Configuration

Feature Options Description

SATA Controller(s) Disabled

Enabled

Enable/Disable the SATA controller

Configure SATA as IDE

AHCI

Select a configuration for SATA controller

Port0 Speed Limitation
Port1 Speed Limitation

No Limit
GEN1 Rate
GEN2 Rate

Select AHCI Speed Limit

SATA Port 0
SATA Port 1

Disabled
Enabled

Enable/Disable the SATA Port

SATA Port 0 Hot Plug
SATA Port 1 Hot Plug

Disabled
Enabled

Enable/Disable SATA Hot Plug Support

85

COMe-cCT6 / BIOS Operation

Intel Fast Flash Standby

Feature Options Description

iFFS

Disabled
Enabled

Enable/Disable Intel Fast Flash Standby / Intel Rapid
Start Technology

Entry on S3 RTC Wake Disabled

Enabled

iFFS invocation upon S3 RTC wake

Entry After

Immediately
1 minute
2 minutes
5 minutes
10 minutes
15 minutes
30 minutes
1 hour
2 hours

Enable RTC wake timer at S3 entry

Please read chapter Intel Fast Flash Standby before enabling

86

COMe-cCT6 / BIOS Operation

USB Configuration

Feature Options Description

Legacy USB Support

Enabled
Disabled
AUTO

Enables Legacy USB support. AUTO option disables
legacy support if no USB devices are connected.
DISABLE option will keep USB devices available only for
EFI applications.

USB3.0 Support

Enabled
Disabled

Enable/Disable USB3.0 (xHCI) EFI support. Does not
affect OS support.

XHCI Hand-off

Enabled
Disabled

This is a workaround for OSes without XHCI hand-off
Support. The XHCI ownership change should be claimed
by XHCI driver

EHCI Hand-off Enabled

Disabled

This is a workaround for OSes without EHCI hand-off
Support. The EHCI ownership change should be claimed
by EHCI driver

USB Beep Enabled

Disabled

Send speaker beep for device attach / detach

USB transfer time-out 1sec

5sec
10sec
20sec

The time-out value for Control, Bulk and Interrupt
transfers

Device reset time-out 10sec

20sec
30sec
40sec

USB mass storage device Start Unit command time-out

Device power-up delay

AUTO
Manual

Maximum time the device will take before it properly
reports itself to the Host controller. 'AUTO' uses default
value: for a Root port it is 100ms, for a Hub port the
delay is taken from Hub descriptor

87

COMe-cCT6 / BIOS Operation

SMART Settings

Feature Options Description

SMART Self Test

Disabled
Enabled

Run SMART Self Test on all HDDs during POST

88

COMe-cCT6 / BIOS Operation

W83627H Super IO Configuration

This setup option is only available with LPC SuperI/O Nuvoton 83627 present on the baseboard. By default the COMe-cCT6
supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The SIO hardware monitor is not
supported in setup.

89

COMe-cCT6 / BIOS Operation

Serial Port 0 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or Disable Serial Port (COM) 0

Change Settings

AUTO
IO=3F8h; IRQ=4;
IO=3F8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=2F8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=3E8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=2E8h, IRQ=3,4,5,6,7,9,10,11,12;

Select an optimal setting for SuperIO device.

Device Mode

Standard Serial Port Mode
IrDA 1.0 (HP SIR) Mode
ASKIR Mode

Change the Serial Port mode.

90

COMe-cCT6 / BIOS Operation

Serial Port 1 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or Disable Serial Port (COM) 1

Change Settings

AUTO
IO=2F8h; IRQ=3;
IO=3F8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=2F8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=3E8h, IRQ=3,4,5,6,7,9,10,11,12;
IO=2E8h, IRQ=3,4,5,6,7,9,10,11,12;

Select an optimal setting for SuperIO device.

Device Mode

Standard Serial Port Mode
IrDA 1.0 (HP SIR) Mode
ASKIR Mode

Change the Serial Port mode.

91

COMe-cCT6 / BIOS Operation

Parallel Port Configuration

Feature Options Description

Parallel Port Disabled

Enabled

Enable or Disable the Parallel Port (LPT/LPTE)

Change Settings

AUTO
IO=378h; IRQ=5;
IO=378h, IRQ=5,6,7,9,10,11,12;
IO=278h, IRQ=5,6,7,9,10,11,12;
IO=3BCh, IRQ=5,6,7,9,10,11,12;
IO=378h;
IO=278h;
IO=3BCh;

Select an optimal setting for SuperIO device.

Device Mode

STD Printer Mode
EPP Mode
ECP Mode
EPP Mode & ECP Mode

Change the Printer Port mode.

92

COMe-cCT6 / BIOS Operation

Module COM port Configuration

This setup option is only available with UART Option.

93

COMe-cCT6 / BIOS Operation

Serial Port 3 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or disable module based Serial Port (COMx)

Change Settings

Auto
IO=3F8h; IRQ=4;
IO=3F8h; IRQ=3,4,5,6,7,10,11,12;
IO=2F8h; IRQ=3,4,5,6,7,10,11,12;
IO=3E8h; IRQ=3,4,5,6,7,10,11,12;
IO=2E8h; IRQ=3,4,5,6,7,10,11,12; \

Select an optimal setting

94

COMe-cCT6 / BIOS Operation

Serial Port 4 Configuration

Feature Options Description

Serial Port Disabled

Enabled

Enable or disable module based Serial Port (COMx)

Change Settings

Auto
IO=3F8h; IRQ=4;
IO=3F8h; IRQ=3,4,5,6,7,10,11,12;
IO=2F8h; IRQ=3,4,5,6,7,10,11,12;
IO=3E8h; IRQ=3,4,5,6,7,10,11,12;
IO=2E8h; IRQ=3,4,5,6,7,10,11,12; \

Select an optimal setting

95

COMe-cCT6 / BIOS Operation

H/W Monitor

Feature Options Description

CPU (DTS) xx°C Shows the calculated temperature of Tcasemax - Digital

Thermal Sensor

PCB (LTD) xx°C Shows the internal hardwaremonitor temperature

CPU FAN xxxx RPM Shows the fan speed of onboard FAN connector

- CPU Fan Pulse 1
2
3
4

Select the number of pulses the CPU fan produces
during one revolution

- FAN Control Disabled
Manual
Auto

Set fan control mode

- FAN Trip Point

20 … 50 … 80

CPU Temperature where onboard fan starts

- Trip Point Speed

30 … 50 … 100

FAN speed at trip point in %. Minimum is 30%. Fan
always runs at 100% at TJmax - 10C

- FAN Speed

30 … 50 … 100

Manual Fan Speed in % in manual mode. Minimum is
30%

External FAN xxxx RPM Shows the fan speed of external COMe FAN

- CPU Fan Pulse 1
2
3
4

Select the number of pulses the CPU fan produces
during one revolution

- FAN Control Disabled
Manual
Auto

Set fan control mode

- FAN Trip Point

20 … 50 … 80

CPU Temperature where onboard fan starts

- Trip Point Speed

30 … 50 … 100

FAN speed at trip point in %. Minimum is 30%. Fan
always runs at 100% at TJmax - 10C

- FAN Speed

30 … 50 … 100

Manual Fan Speed in % in manual mode. Minimum is
30%

3.3V x.xx V Shows the onboard 3.3V supply voltage

VBAT x.xx V Shows the RTC Battery Voltage at the COMe Connector

VCC x.xx V Shows the Module Main Input Voltage

5.0V Standby x.xx V Shows the 5V Standby Voltage

96

COMe-cCT6 / BIOS Operation

Serial Port Console Redirection

Screenshot shows configuration with onboard UART option but without external SIO

Feature Options Description

Console Redirection

Disabled
Enabled

Enable/Disable Serial Port COM0 Console Redirection

Console Redirection

Disabled
Enabled

Enable/Disable Serial Port COM1 Console Redirection

Console Redirection

Disabled
Enabled

Enable/Disable Serial Port COM2 Console Redirection

Console Redirection

Disabled
Enabled

Enable/Disable Serial Port COM3 Console Redirection

Serial Port Console Redirection is not allowed to activate at more than one port
simultaneously

COM Port allocation

Console Redirection Port With onboard UART option With external SIO With onboard UART Option and external SIO

COM0

Onboard Serial Port 0 (SER0) External SIO COM1 External SIO COM1

COM1

Onboard Serial Port 1 (SER1) External SIO COM2 External SIO COM2

COM2

not available not available Onboard Serial Port 0 (SER0)

COM3

not available not available Onboard Serial Port 1 (SER1)

97

COMe-cCT6 / BIOS Operation

Console Redirection Settings

Feature Options Description

Terminal Type VT100

VT100+
VT_UTF8
ANSI

VT100: ASCII char set.
VT100+: Extends VT100 to support color, function keys,
etc.
VT-UTF8: Uses UTF8 encoding to map Unicode chars
onto 1 or more bytes
ANSI: Extended ASCII char set.

Bits per second 9600

19200
38400
57600
115200

Selects serial port transmission speed. The speed must
be matched on the other side. Long or noisy lines may
require lower speeds

Data Bits 7

8

Data Bits

Parity

None
Even
Odd
Mark
Space

A parity bit can be sent with the data bits to detect
some transmission errors. Even: parity bit is 0 if the
num of 1's in the data bits is even. Odd: parity bit is 0 if
num of 1's in the data bits is odd. Mark: parity bit is
always 1. Space: Parity bit is always 0. Mark and Space
Parity do not allow for error detection.

Stop Bits

1
2

Stop Bits indicate the end of a serial data packet. (A
Start bit indicates the beginning). The st andard setting
is 1 stop bit. Communication with slow devices may
require more than 1 stop bit.

Flow Control

None
Hardware RTS/CTS

Flow control can prevent data loss from buffer overflow.
When sending data, if the receiving buffers are full, a
'stop' signal can be sent to stop the data f low. Once the
buffers are empty, a 'star t' signal can be sent to re­start the flow. Hardware flow control uses two wires to
send start/stop signals

Recorder Mode

Disabled
Enabled

With this mode enabled only text will be sent. This is to
capture terminal data.

Resolution 100×31

Disabled
Enabled

Enables or disables extended terminal resolution

Legacy OS Redirection Resolution

80×24
80×25

On Legacy OS, the Number of Rows and Columns
supported redirection

98

COMe-cCT6 / BIOS Operation

8.5.3 Chipset

99

COMe-cCT6 / BIOS Operation

Host Bridge

100