Kontron COMe-cCT6 User Manual
COMe-cCT6
Document Revision 130
www.kontron.com
» Table of Contents «
1 User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1.2 Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
2 Introduction........................................................................................8
2.1 Product Description...................................................................................................................... 8
2.2 Naming clarification..................................................................................................................... 8
2.3 Understanding COM Express® Functionality.......................................................................................8
2.4 COM Express® Documentation......................................................................................................... 9
2.5 COM Express® Benefits.................................................................................................................. 9
3 Product Specification..........................................................................10
3.1 Modules definition...................................................................................................................... 10
3.2 Functional Specification............................................................................................................... 11
3.3 Block Diagram............................................................................................................................ 15
3.4 Accessories............................................................................................................................... 16
3.5 Electrical Specification................................................................................................................ 17
3.5.1 Supply Voltage........................................................................................................................... 17
3.5.2 Power Supply Rise Time................................................................................................................17
3.5.3 Supply Voltage Ripple.................................................................................................................. 17
3.5.4 Power Consumption..................................................................................................................... 17
3.5.5 ATX Mode.................................................................................................................................. 18
3.5.6 Single Supply Mode..................................................................................................................... 18
3.6 Power Control............................................................................................................................ 19
3.7 Environmental Specification......................................................................................................... 20
3.7.1 Temperature Specification............................................................................................................ 20
3.7.2 Humidity................................................................................................................................... 20
3.8 Standards and Certifications.........................................................................................................21
3.9 MTBF........................................................................................................................................ 23
3.10 Mechanical Specification.............................................................................................................. 24
3.11 Module Dimensions..................................................................................................................... 25
3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................26
3.13 Onboard Connectors.................................................................................................................... 27
3.13.1 FAN.......................................................................................................................................... 28
3.13.2 CPU Debug & CPLD....................................................................................................................... 28
4 Features and Interfaces.......................................................................29
4.1 Onboard SSD.............................................................................................................................. 29
4.2 S5 Eco Mode.............................................................................................................................. 30
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COMe-cCT6 /
4.3 LPC.......................................................................................................................................... 31
4.4 Serial Peripheral Interface (SPI)....................................................................................................32
4.5 SPI boot.................................................................................................................................... 32
4.6 M.A.R.S.................................................................................................................................... 34
4.7 UART........................................................................................................................................ 35
4.8 Fast I2C.................................................................................................................................... 36
4.9 GPIO - General Purpose Input and Output.........................................................................................37
4.10 Dual Staged Watchdog Timer......................................................................................................... 38
4.11 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 39
4.12 Speedstep Technology.................................................................................................................. 41
4.13 C-States.................................................................................................................................... 42
4.14 Hyper Threading......................................................................................................................... 43
4.15 Display Configuration..................................................................................................................44
4.16 Graphics Features....................................................................................................................... 47
4.17 Hardware Configuration............................................................................................................... 47
4.18 Graphics VBIOS and Driver............................................................................................................ 47
4.19 ACPI Suspend Modes and Resume Events..........................................................................................48
4.20 USB......................................................................................................................................... 49
5 System Resources...............................................................................50
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 50
5.2 Memory Area............................................................................................................................. 50
5.3 I/O Address Map......................................................................................................................... 51
5.4 Peripheral Component Interconnect (PCI) Devices..............................................................................51
5.5 I2C Bus..................................................................................................................................... 52
5.6 JILI I2C Bus............................................................................................................................... 52
5.7 System Management (SM) Bus....................................................................................................... 52
6 Connectors........................................................................................53
6.1 Connector Location..................................................................................................................... 53
7 Pinout List.........................................................................................54
7.1 General Signal Description............................................................................................................ 54
7.2 Connector X1A Row A................................................................................................................... 55
7.3 Connector X1A Row B................................................................................................................... 57
7.4 Connector X1B Row C................................................................................................................... 59
7.5 Connector X1B Row D................................................................................................................... 61
8 BIOS Operation...................................................................................63
8.1 Determining the BIOS Version....................................................................................................... 63
8.2 BIOS Update.............................................................................................................................. 63
8.3 Setup Guide............................................................................................................................... 65
8.4 POST Codes................................................................................................................................ 65
8.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 65
4
COMe-cCT6 / User Information
8.5 BIOS Setup................................................................................................................................ 67
8.5.1 Main Menu................................................................................................................................ 67
8.5.2 Advanced.................................................................................................................................. 69
8.5.3 Chipset..................................................................................................................................... 99
8.5.4 Boot....................................................................................................................................... 106
8.5.5 Security.................................................................................................................................. 107
8.5.6 Save & Exit............................................................................................................................... 109
5
COMe-cCT6 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
6
COMe-cCT6 / User Information
1.5 Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
7
COMe-cCT6 / Introduction
2 Introduction
2.1 Product Description
COMe-cCT6 is the energy efficient entry-level multicore module based on next-generation Intel® Atom™ processors with
32 nm technology. The module is available in three multicore performance levels up to 2x 1.86 GHz and offers an
increased performance per watt ratio and offers twice the graphics capability. The COM Express® pin-out type 6 definition
enables the module to provide these increased capabilities via a scalable interface range that offers suitable options for
both cost and power sensitive applications alike.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO shared w/GPIO
1x optional 1x optional - 1x optional
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
8
COMe-cCT6 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cCT6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9
COMe-cCT6 / Product Specification
3 Product Specification
3.1 Modules definition
The COM Express® compact sized Computer-on-Module COMe-cCT6 (UUP6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-cCT6, based on Intel's Cedar Trail platform, is available in different variants
to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor UART Flash USB 3.0 TPM
36011-0040-19-7 COMe-cCT6 D2550 Cedarview-D Intel® Atom™ D2550 2x 4GB SLC 2x Yes
36011-0000-19-6 COMe-cCT6 D2550 Cedarview-D Intel® Atom™ D2550 - - - -
36011-0000-19-2 COMe-cCT6 N2800 Cedar view-M Intel® Atom™ N2800 - - - -
36011-0000-16-3 COMe-cCT6 N2600 SER Cedarview-M Intel® Atom™ N2600 2x - - -
36011-0000-16-2 COMe-cCT6 N2600 Cedar view-M Intel® Atom™ N2600 - - - -
Optional hardware features:
» TPM
» PCI Express USB 3.0 (xHCI) controller TI
» 2x UART
» 2 to 32GB SLC NANDrive
» 2 to 64GB MLC NANDrive
Optional BIOS features:
» Secure Flash Update
» Secure Boot
» CSM OptOut
Extended temperature grade modules (E1, -25°C to 75°C operating)
Product Number Product Name Processor UART Flash USB 3.0 TPM
36011-0000-19-6EXT COMe-cCT6 D2550 E1 Cedarview-D Intel® Atom™ D2550 - - - -
36011-0000-19-2EXT COMe-cCT6 N2800 E1 Cedarview-M Intel® Atom™ N2800 - - - -
36011-0000-16-2EXT COMe-cCT6 N2600 E1 Cedarview-M Intel® Atom™ N2600 - - - -
Optional hardware features:
» PCI Express USB 3.0 (xHCI) controller TI
» 2x UART
» 2 to 32GB SLC NANDrive
» 2 to 64GB MLC NANDrive (industrial grade versions only)
Industrial temperature grade modules (XT, -40°C to 85°C operating)
Modules for E2 temperature range are available by screening on project base, please contact your local sales or support
for further details.
Part Number Product Name Processor UART Flash USB 3.0 TPM
36011-00FF-CC-x COMe-cCT6 XT All optional optional n/a n/a
Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.
10
COMe-cCT6 / Product Specification
3.2 Functional Specification
Processor
The 32nm Intel® Atom™ D2000/N2000 (Cedarview-M/D) CPU family supports:
» Intel® Hyper-Threading Technology
» Intel® 64
» Enhanced Intel SpeedStep® Technology (N2xxx only)
» Thermal Monitoring Technologies
» Execute Disable Bit
» 2 Display Pipes for dual independent displays
CPU specifications
CPU Intel® Atom™ D2550 Intel® Atom™ N2800 Intel® Atom™ N2600
Cores
2 2 2
Threads
4 4 4
Clock
1866MHz 1866MHz 1600MHz
Memory Speed
DDR3-1066 DDR3-1066 DDR3-800
Max Memory
up to 4GB up to 4GB up to 2GB
Cache
1MB 1MB 1MB
C-States
C0/C1 C0-C6 / C1E-C4E C0-C6 / C1E-C4E
EIST
- YES YES
CPU Thermal Management
TM1 TM1 & TM2 TM1 & TM2
GFX
GMA3650 GMA3650 GMA3600
GFX core frequency
640MHz 640MHz 400MHz
GFX render clock frequency
200MHz 200MHz 200MHz
Display Core Clock
355MHz 267MHz 200MHz
LVDS
1×18/24bit 1×18/24bit 1×18/24bit
LVDS Resolution
up to 1440x900x60 up to 1366x768x60 up to 1366x768x60
eDP Resolution
up to 1920x1080x60 up to 1366x768x60 up to 1366x768x60
DP Resolution
up to 2560x1600x60 up to 1600x1200x60 up to 1600x1200x60
HDMI/DVI Resolution
up to 1920x1200x60 up to 1920x1200x60 up to 1920x1200x60
VGA Resolution
up to 1920x1200x60 up to 1920x1200x60 up to 1920x1200x60
PAVP
1.1c 1.1c -
HDCP
1.3 1.3 -
Blu-Ray 2.0 Playback
Yes Yes -
TDP
10W 6.5W 3.5W
Memory
Sockets
1x DDR3 SO-DIMM
Memory Type
DDR3-800 / 1066
Maximum Size
1x4GB, 4GB supported by 256Mx16 configuration only
Technology
Single Channel (64bit)
11
COMe-cCT6 / Product Specification
Graphics Core
The integrated SGX545 core based Intel® GMA 3650 / 3600 supports:
Graphics Core Render Clock
640MHz @ GMA3650 (D2700/N2800)
400MHz @ GMA3600 (N2600),
Execution Units / Pixel Pipelines
4
Max Graphics Memory
1024MB
GFX Memory Bandwidth (GB/s)
6.4 / 8.5
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
9.0c / 3.0
Shader Model
3.0
Hardware accelerated Video
H.264,MPEG2,VC1, Blu-ray
Independent/Simultaneous Displays
2
Display Port
DP / eDP 1.1
HDCP support
HDCP 1.3a / PAVP 1.1c
Monitor output
CRT max Resolution
1920x1200
TV out:
-
LVDS
LVDS Bits/Pixel
1x18 / 1x24
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
D: 1440x900, M: 1366x768, 112MHz
PWM Backlight Control:
YES
Supported Panel Data:
JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
DP++
Digital Display Interface DDI3
-
Maximum Resolution on DDI
HDMI: 1920x1200, DP-D: 2560x1600/DP-M: 1600x1200
PCH: Intel® NM10 Express Chipset
The 130nm Intel Platform Controller Hub Tigerpoint supports:
» PCI Express Gen 1.0 Speed
» USB 2.0
» HD Audio
» SATA 3Gb/s
Storage
onboard SSD
2-32GB SLC, 2-64GB MLC (SATA)
SD Card support
-
IDE Interface
-
Serial-ATA
up to 2x SATA 3Gb/s
SATA AHCI
AHCI 1.0 with NCQ and HotPlug
SATA RAID
-
With onboard SATA drive only 1 external SATA interface (SATA 0) is available
12
COMe-cCT6 / Product Specification
Connectivity
USB
8x USB 2.0
USB Client
-
PCI
-
PCI External Masters
-
PCI Express
3x PCIe x1 Gen1
Max PCI Express
4x PCIe x1 without LAN
PCI Express x2/x4 configuration
YES
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® 82574L (Hartwell)
Any PCIe device connecting to Intel@ Atom Processor D2000 and N2000 based platform
must support No_Snoop attribute
Ethernet
The Intel® 82574L (Hartwell) ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Supported BIOS Size/Type
4MB SPI
Audio
HD Audio
Onboard Hardware Monitor
Nuvoton NCT7802Y
Trusted Platform Module
Infineon SLB9635TT optional
Miscellaneous
2x UART optional / PWM FAN
Kontron Features
External I2C Bus
Fast I2C, MultiMaster capable
M.A.R.S. support
YES
Embedded API
KEAPI2
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
13
COMe-cCT6 / Product Specification
Power Features
Singly Supply Support
YES
Supply Voltage
4.75 - 20V
ACPI
ACPI 3.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
DPST 4.0, iFFS
Power Consumption and Performance
Full Load Power Consumption
7.5 - 13W
Kontron Performance Index
7238 - 9277
Kontron Performance/Watt
736 - 957
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
14
COMe-cCT6 / Product Specification
3.3 Block Diagram
15
USB #0/1
(USB 2.0)
USB #0/1
(USB 3.0)
VGA
DP++
(DDI1)
SATA1
PwrCtrl
SysMgmt
RTC
SATA0
SATA1
SER0
SER1
DMI
PCIe#3
USB #0-7
(USB 2.0)
LPC
GPIO
SMB
PWM
FAN2
I2C
SMB
SPI
HDA
PCIe #0-2
PCIe #3
Intel® NM10
Express Chipset
LID
Sleep
TPM
SLB9635TT
SPI
BIOS Flash
LVDS
DP++
(DDI1)
Connector Option
Standard
component
GB LAN
GPIO
Embedded Controller
(CPLD EPM570/ 1270)
HWM
NCT7802
EEPROM
FAN1
COM Express® connector AB – Pin-out Type 6
GBLan
Intel® 82574L
VCC
5VSB
VBAT
HWM
SMB
Power sequencing
Watchdog
LPC2I2C
GPIO Buffer
Intel® Atom™
D2000 Series
N2000 Series
GMA3650
GMA3600
2x UART
SATA
NANDrive®
S5eco
DDR3 SODIMM
DDR3-800/1066
COM Express® connector CD – Pin-out Type 6
USB 3.0
TI TUSB7320
PCIe #2
COMe-cCT6 / Product Specification
3.4 Accessories
Product specific accessories
Product Number Heatspreader and Cooling Solutions Comment
36011-0000-99-0 HSP COMe-cCT6 thread
-
36011-0000-99-1 HSP COMe-cCT6 through
-
General accessories
Part Number COMe pin-out Type 6 compatible accessories Project Code Comment
38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector
38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPort
96006-0000-00-2 COMe POST T6 NFCB POS T Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6
38114-0000-00-S COMe Ref. Starterkit T6 ADAS Star terkit with COMe Reference Carrier T6
Part Number Mounting Comment
38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors
38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors
38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors
38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors
Part Number Cooling Solutions Comment
36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP
36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP
Part Number Display Adapter Comment
9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter
9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Comment
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)
96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)
Part Number Miscellaneous Comment
18029-0000-00-0 MARS Smart Battery Kit Star terkit Kontron Mobile Application platform for Rechargeable Systems
Compatible Memory
Product Number Memory
97015-1024-16-0 DDR3-1600 SODIMM 1GB
97015-2048-16-0 DDR3-1600 SODIMM 2GB
97015-4096-16-0 DDR3-1600 SODIMM 4GB
97015-1024-16-2 DDR3-1600 SODIMM 1GB E2
97015-2048-16-2 DDR3-1600 SODIMM 2GB E2
97015-4096-16-2 DDR3-1600 SODIMM 4GB E2
16
COMe-cCT6 / Product Specification
3.5 Electrical Specification
3.5.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC:
4.75 - 20V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.5.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.5.4 Power Consumption
The maximum Power Consumption of the different COMe-cCT6 variants is 7.5 - 13W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on
EMD Customer Section. Information there is available after registration.
17
COMe-cCT6 / Product Specification
3.5.5 ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →
S0 high high 5V low VCC
3.5.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 → high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 → PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
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COMe-cCT6 / Product Specification
3.6 Power Control
Power Supply
The COMe-cCT6 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-cCT6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-cCT6 / Product Specification
3.7 Environmental Specification
3.7.1 Temperature Specification
Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-cCT6
Temperature Specification Operating Non-operating Validated Input Voltage
Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 20V
Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V
Industrial grade by Screening (XT)
-40°C to +85°C -40°C to +85°C VCC: 12V
Industrial grade by Design (E2)
-40°C to +85°C -40°C to +85°C VCC: 4.75 - 20V
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade Validation requirements
Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.7.2 Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
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COMe-cCT6 / Product Specification
3.8 Standards and Certifications
RoHS II
The COMe-cCT6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances
(RoHS II) in electrical and electronic equipment
Component Recognition UL 60950-1
The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
21
COMe-cCT6 / Product Specification
Shock & Vibration
The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-cCT6 follows the requirements for electromagnetic compatibility
standards
» EN55022
PCB Specification
» IPC-6016 Class 2
» Flammability UL 796 / UL94-V0
22
COMe-cCT6 / Product Specification
3.9 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 216156 @ 40°C (w/PCB)
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
23
COMe-cCT6 / Product Specification
3.10 Mechanical Specification
Dimension
» 95.0 mm x 95.0 mm (3.75” x 3.75”)
» Height approx. 12mm (0.4”)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:
Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in
height for an overall height of 27.3mm from module bottom to Heatsink top.
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COMe-cCT6 / Product Specification
3.11 Module Dimensions
25
COMe-cCT6 / Product Specification
3.12 Thermal Management, Heatspreader and Cooling Solutions
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cCT6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:
» 60°C for commercial grade modules
» 75°C for extended temperature grade modules (E1)
» 85°C for industrial temperature grade modules (E2/XT)
The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-cCT6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cCT6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.
Documentation and CAD drawings of COMe-cCT6 heatspreader and cooling solutions are provided at
http://emdcustomersection.kontron.com.
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COMe-cCT6 / Product Specification
3.13 Onboard Connectors
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COMe-cCT6 / Product Specification
3.13.1 FAN
The COMe-cCT6 supports an onboard FAN connector for active cooling controlled by the BIOS.
Specification of the FAN Connector:
» Part number (Molex): 53261-0371
» Mates with: 51021-0300
» Crimp terminals: 50079-8100
Pin assignment
» Pin1: Tacho, Pin2: VCC, Pin3: GND
Electrical characteristic
Module Input Voltage 4.75 - 13V >13V
FAN Output Voltage
4.75 - 13V 13V
Max. FAN Output Current
350mA 150mA
To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)
3.13.2 CPU Debug & CPLD
The CPU Debug connector J4 (not soldered by default) and the CPLD programming interface J7 are for internal use only
and should not be used.
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COMe-cCT6 / Features and Interfaces
4 Features and Interfaces
4.1 Onboard SSD
The COMe-cCT6 features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC, 2-64GB MLC (SATA).
Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following SATA
NANDrives are available:
Basic features of the SATA NANDrives
» ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support
» RoHS compliant NAND flash type
» SATA 1.5Gb/s Host transfer rate
» Hardware error detection, correction ECC and advanced wear leveling
» Bad block management
» TRIM support
» SMART support
» 0°C to +70°C temperature range for MLC types A-M-C/B-M-C
» -40°C to +85°C temperature range for MLC types B-M-I
» -40°C to +85°C temperature range for all SLC types
Single-level Cell (SLC) NANDrive™
Flash Part No. GLS85LS
Flash Part No. 1002P-S-I-FZJE-ND104 1004P-S-I-FZJE-ND104 1008P-S-I-FZJE-ND104 1016P-S-I-FZJE-ND104 1032P-S-I-FZJE-ND104
Product Revision
CC1 CC1 CC1 CC1 CC1
Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte
Burst Read/Write Speed
35/20 MB/s 70/35 MB/s 70/50 MB/s 70/55 MB/s 120/80 MB/s
Total Bytes
2,000,388,096 4,001,292,288 8,012,390,400 16,013,942,784 32,017,047,552
Active Mode Power
450mW 560mW 750mW 590mW 855mW
Typical P/E Cycles per
block
100,000 100,000 60,000 60,000 60,000
(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)
Multi-level Cell (MLC) NANDrive™
Flash Part No. GLS85LS
Flash Part No.
1002A-M-C-FZJE-ND103
1002A-M-I-FZJE-ND103
1004A-M-C-FZJE-ND103
1004A-M-I-FZJE-ND103
1008B-M-C-FZJE-ND103
1008B-M-I-FZJE-ND103
1016B-M-C-FZJE-ND103
1016B-M-I-FZJE-ND103
1032B-M-C-FZJE-ND103
1032B-M-I-FZJE-ND103
1064B-M-C-FZJE-ND103
1064B-M-I-FZJE-ND103
Product Revision
CB2 CB2 CB2 CB2 CB2 CB2
Flash Size 2GByte 4GByte 8GByte 16GByte 32GByte 64GByte
Burst Read/Write
Speed
35/10 MB/s 35/10 MB/s 35/10 MB/s 70/20 MB/s 70/30 MB/s 110/60 MB/s
Total Bytes
1,941,553,152 3,941,941,248 8,012,390,400 16,013,942,784 32,017,047,552 64,023,257,088
Active Mode Power
360mW 360mW 360mW 440mW 565mW 820mW
Typical P/E Cycles per
block
5,000 5,000 5,000 5,000 5,000 5,000
(Data based on Datasheet S71430 Rev 02.00 from 10-2013)
29
COMe-cCT6 / Features and Interfaces
4.2 S5 Eco Mode
Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!
In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.
The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.
Following prerequisites and consequences occur when S5 Eco Mode is enabled
» The power button must be pressed at least for 200ms to switch on.
» Wake via Power button only.
» “Power On After Power Fail”/“State after G3”: only “stay off” is possible
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