Kontron COMe-cBTi6R User Manual

COMe-cBTi6R

Document Revision 020 - preliminary

www.kontron.com

» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 Naming clarification..................................................................................................................... 7

2.3 Understanding COM Express® Functionality.......................................................................................7

2.4 COM Express® Documentation......................................................................................................... 8

2.5 COM Express® Benefits.................................................................................................................. 8

3 Product Specification............................................................................9

3.1 Module definition......................................................................................................................... 9

3.2 Functional Specification............................................................................................................... 10

3.3 Block Diagram............................................................................................................................ 14

3.4 Accessories............................................................................................................................... 15

3.5 Electrical Specification................................................................................................................ 17

3.5.1 Supply Voltage........................................................................................................................... 17

3.5.2 Power Supply Rise Time................................................................................................................17

3.5.3 Supply Voltage Ripple.................................................................................................................. 17

3.5.4 Power Consumption..................................................................................................................... 17

3.5.5 ATX Mode.................................................................................................................................. 18

3.5.6 Single Supply Mode..................................................................................................................... 18

3.6 Power Control............................................................................................................................ 19

3.7 Environmental Specification......................................................................................................... 20

3.7.1 Temperature Specification............................................................................................................ 20

3.7.2 Humidity................................................................................................................................... 20

3.8 Standards and Certifications.........................................................................................................21

3.9 MTBF........................................................................................................................................ 23

3.10 Mechanical Specification.............................................................................................................. 24

3.11 Module Dimensions..................................................................................................................... 25

3.12 Onboard Fan Connector................................................................................................................ 26

3.13 Thermal Management, Heatspreader and Cooling Solutions..................................................................27

4 Features and Interfaces.......................................................................28

4.1 Onboard eMMC Flash.................................................................................................................... 28

4.2 Secure Digital Card...................................................................................................................... 30

4.3 S5 Eco Mode.............................................................................................................................. 31

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COMe-cBTi6R /

4.4 Rapid Shutdown......................................................................................................................... 32

4.5 LPC.......................................................................................................................................... 34

4.6 Serial Peripheral Interface (SPI)....................................................................................................35

4.7 SPI boot.................................................................................................................................... 35

4.8 M.A.R.S.................................................................................................................................... 37

4.9 UART........................................................................................................................................ 38

4.10 Fast I2C.................................................................................................................................... 39

4.11 Dual Staged Watchdog Timer......................................................................................................... 40

4.12 Speedstep Technology.................................................................................................................. 41

4.13 C-States.................................................................................................................................... 42

4.14 Graphics Features....................................................................................................................... 43

4.15 ACPI Suspend Modes and Resume Events.......................................................................................... 44

4.16 USB......................................................................................................................................... 45

5 System Resources...............................................................................46

5.1 Internal I2C Bus......................................................................................................................... 46

5.2 External I2C Bus......................................................................................................................... 46

5.3 System Management (SM) Bus....................................................................................................... 46

6 Connectors........................................................................................47

6.1 Connector Location..................................................................................................................... 47

7 Pinout List.........................................................................................48

7.1 General Signal Description............................................................................................................ 48

7.2 Connector X1A Row A................................................................................................................... 49

7.3 Connector X1A row B.................................................................................................................... 51

7.4 Connector X1B Row C.................................................................................................................. 53

7.5 Connector X1B Row D.................................................................................................................. 55

7.6 Connector J1 micro-SD Card......................................................................................................... 57

7.7 Connector J2 Fan Control.............................................................................................................. 57

7.8 Connector J3 XDP SFF connector..................................................................................................... 57

7.9 Connector J4 JTAG CPLD............................................................................................................... 58

8 BIOS Operation...................................................................................59

8.1 Determining the BIOS Version....................................................................................................... 59

8.2 BIOS Update.............................................................................................................................. 59

8.3 POST Codes................................................................................................................................ 59

8.4 Setup Guide............................................................................................................................... 60

4

COMe-cBTi6R / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

5

COMe-cBTi6R / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

6

COMe-cBTi6R / Introduction

2 Introduction

2.1 Product Description

The Kontron COMe-cBTi6R comes with an especially robust design and is tailored to suit shock- and vibration-proof mobile
and stationary applications as well as the extended temperature range of -40°C to +85°C. It is exclusively equipped with
Intel® Atom™ E3800 family processors and soldered RAM. According to the different requirements of real-time controllers
or memory-hungry HMIs either up to 4GB LPDDR3 with ECC or up to 8GB LPDDR3 without ECC is available. The support of
Rapid Shutdown offers an extremely fast shutdown of a computer system to minimize the risk of system or data tampering
in mission critical applications. Software and application data can be stored on the eMMC Flash and via 2 SATA interfaces.
Any peripherals can be connected via 1x USB 3.0, 1x USB OTG, 8x USB 2.0 or 4x PCIe x1.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

7

COMe-cBTi6R / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cBTi6R. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

8

COMe-cBTi6R / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® compact sized Computer-on-Module COMe-cBTi6R (CVVR (Coyote Hills)) follows pin-out Type 6 and is
compatible to PICMG specification COM.0 Rev 2.1. The COMe-cBTi6R, based on Intel's Bay Trail platform, is available in
different variants to cover the demand of different performance, price and power:
Industrial temperature grade modules (E2: -40°C to +85°C operating)

Part Number Product Name Processor Memory Down eMMC Flash mSD Socket TPM Ethernet PCIe

36016-8016-19-4 COMe-cBTi6R E3845 8GB/16S BayTrail-I Intel® Atom E3845 2x4GB non-ECC 16GB SLC Yes Yes Intel® i210IT 3×1

36016-8000-19-4 COMe-cBTi6R E3845 8GB BayTrail-I Intel® Atom E3845 2x4GB non-ECC - Yes Yes Intel® i210IT 3×1

36016-4032-19-4 COMe-cBTi6R E3845 4GB/32S BayTrail-I Intel® Atom E3845 1x4GB non-ECC 32GB SLC Yes Yes Intel® i210IT 3×1

36016-4000-19-4 COMe-cBTi6R E3845 4E BayTrail-I Intel® Atom E3845 1x4GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-17-2 COMe-cBTi6R E3827 2E BayTrail-I Intel® Atom E3827 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-15-2 COMe-cBTi6R E3826 2E BayTrail-I Intel® Atom E3826 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-13-2 COMe-cBTi6R E3825 2E BayTrail-I Intel® Atom E3825 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-1000-15-1 COMe-cBTi6R E3815 1E BayTrail-I Intel® Atom E3815 1x1GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

Memory configurations (36016-MMxx-xx-x)

» MM = 10: 1024MB DDR3L Memory

» MM = 20: 2048MB DDR3L Memory

» MM = 40: 4096MB DDR3L Memory

» MM = 80: 8192MB DDR3L Memory

Onboard Flash configurations, available on E3800 variants only (36016-xxFF-xx-x)

» FF = 00: without eMMC Flash

» FF = 20: 2GB onboard eMMC Flash

» FF = 40: 4GB onboard eMMC Flash

» FF = 80: 8GB onboard eMMC Flash

» FF = 16: 16GB onboard eMMC Flash

» FF = 32: 32GB onboard eMMC Flash

» FF = 64: 64GB onboard eMMC Flash

Optional hardware features

» ECC memory

» eMMC Flash

» PCIe Intel® i210IT instead of USB SMCS LAN7500i

Optional BIOS/Software features:

» TXE Firmware with Encryption support (AES, PAVP …)

Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.

9

COMe-cBTi6R / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® Atom™ E3800 (BayTrail-I) CPU family supports:

» Intel® 64

» Enhanced Intel SpeedStep® Technology

» Thermal Monitoring Technologies

» Execute Disable Bit

» Virtualization Technology VT-x

» 2 Display Pipes for dual independent displays

CPU specifications

Intel® Atom™ Atom™ Atom™ Atom™ Atom™

- E3845 E3827 E3826 E3825 E3815

# of Cores 4 2 2 2 1

# of Threads 4 2 2 2 1

CPU Nominal frequency

1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz

CPU Burst frequency - - - - -

LFM/LPM Frequency 533MHz 533MHz 533MHz 533MHz 533MHz

Tjunction 110°C 110°C 110°C 110°C 110°C

Thermal Design Power
(TDP)

10W 8W 7W 6W 5W

SDP - - - - -

C-States C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6

Smart Cache 2x1MB 2x512kB 2x512kB 2x512kB 512kB

Memory Type DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Size 2x8GB or 1x8GB ECC 2x8GB or 1x8GB ECC 2x8GB or 1x8GB ECC 8GB 8GB

ECC Memory(optional) Yes Yes Yes Yes Yes

Graphics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD®

GFX Base Frequency 542MHz 542MHz 533MHz 533MHz 400MHz

GFX Max Dynamic Frequ. 792MHz 792MHz 667MHz - -

GFX Technology GT1 4EU GT1 4EU GT1 4EU GT1 4EU GT1 4EU

AEC Q100 automtovie
Qual.

Yes Yes Yes Yes Yes

SDIO Yes Yes Yes Yes Yes

eMMC Yes Yes Yes Yes Yes

AES-NI (optional) Yes Yes Yes Yes Yes

Memory

Sockets

memory down

Memory Type

DDR3L-1066/1333

Maximum Size

1 - 4GB ECC or 1 - 8 GB nECC

Technology

Dual Channel

10

COMe-cBTi6R / Product Specification

Graphics Core

The integrated Intel® HD Graphics (Gen 7) supports:

Graphics Core Render Clock

Intel® HD Graphics (Gen 7)

400-542MHz Clock
667-792MHz Turbo

Execution Units / Pixel Pipelines

4

Max Graphics Memory

2048MB

GFX Memory Bandwidth (GB/s)

up to 21.3

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11 / 3.0 + OCL 1.1

Shader Model

3.0

Hardware accelerated Video

H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray

Independent/Simultaneous Displays

2

Display Port

DP 1.1a / eDP 1.3

HDCP support

HDCP / PAVP 2 (optional)

Monitor output

CRT max Resolution

2560x1600

TV out:

-

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24 with DP2LVDS

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

EDID/DID

Display Interfaces

Discrete Graphics

2x MIPI-CSI on PEG

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

DP++ muxed with LVDS

Digital Display Interface DDI3

-

Maximum Resolution on DDI

2560x1600@60Hz

Storage

onboard SSD

2-64GB eMMC

SD Card support

1x mSD Socket onboard, 1x SDIO for WiFi shared with GPIO

IDE Interface

-

Serial-ATA

2x SATA 3Gb/s

SATA AHCI

AHCI with NCQ, HotPlug, Staggered Spinup,

SATA RAID

-

Connectivity

USB

7x USB 2.0

USB 3.0

1x USB 3.0

USB Client

1x USB Client (USB #7)

PCI

-

PCI External Masters

-

PCI Express

3x PCIe x1 Gen2 w/PCIe LAN

Max PCI Express

4x PCIe x1 Gen2 w/USB LAN

PCI Express x2/x4 configuration

YES

Ethernet

10/100/1000

Ethernet controller

SMSC LAN7500i or Intel i210IT

11

COMe-cBTi6R / Product Specification

Feature OS Support Matrix

- Windows 8 Windows 7 WEC Tizen Fedora/Yocto Android

- E3800 Celeron E3800 Celeron E3800 Celeron E3800 E3800 Celeron E3800 Celeron

eMMC Storage X X - - X - X X - - -

eMMC Boot X X - - X - X X - X X

SD Storage X X X - X - X X - X X

SD Boot - - X - X - X X - X X

MIPI-CSI - - - - - - - X - - -

PCI Express Configuration

By default, the COMe-cBTi6R supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.

PCIe Port #0 Port #1 Port #2 Port #3

Configuration 0 x1 x1 x1 x1

Configuration 1 x2 x1 x1

Configuration 2 x2 x2

Configuration 3 x4

- PCIe Port #3 is available with USB Ethernet Controller Option only

- Configuration 0 is the default setting

- Configuration 1 - 3 are available with customized BIOS versions

Ethernet

The SMSC LAN7500i or Intel i210IT ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

8MB SPI

Audio

HD Audio

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Atmel AT97SC3204

Miscellaneous

2x UART / PWM FAN / MIPI-CSI on PEG

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI3

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

12

COMe-cBTi6R / Product Specification

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 20V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 4.0, iFFS, Rapid Shutdown

Power Consumption and Performance

Full Load Power Consumption

3.5 - 13.5W

Kontron Performance Index

9332 - 23937

Kontron Performance/Watt

1944 - 2986

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

13

COMe-cBTi6R / Product Specification

3.3 Block Diagram

14

USB#7

Client

GPIO

or

SDIO

WiFi

GB LAN

LVDS

PCIe#3

2x MIPI-CSI

PCIe #0-3

GPIO
UART

Ctrl

Mgmt

SER0
SER1

LPC

SPI

USB #0

(USB 3.0)

USB #3-6

(USB 2.0)

VGA

DP++

(DDI1)

SATA0
SATA1

HDA

eMMC

Intel® Atom™ E3800-Series

Connector Option

Standard

component

eMMC

2-32GB SLC
4-64GB MLC

VCC

5VSB

VBAT

HWM

USB #1-2

(USB 2.0)

PWM
FAN2

I2C

SMB

USB #0

(USB 2.0)

LID

Sleep

GPIO

Embedded Controller

(CPLD EPM1270)

PwrCtrl

SysMgmt

HWM

NCT7802

CPU FAN1

Power sequencing

Watchdog

LPC2I2C

I2C

EEPRO M

S5eco

USB 3.0

Host

Gen7

iGFX

USB 2.0

Host

USB Hub

SMSC

USB4604

SPI

BIOS Flash

TPM

GPIO Buffer

DDR3L-1066/1333 memory down

ECC

SPD

SPD

SMB

UART

GB LAN

GBLan

Intel® I210
Springville

COM Express® connector AB – Pin-out Type 6

DP++

(DDI2)

eDP2LVDS

PTN3460

MUX

COM Express® connector CD – Pin-out Type 6

microSD

Socket

GBLan

SMSC

LAN7500i

SDIO

WiFi

GPIO/SDIO

Switch

ULPI

USB Client

TUSB1211

COMe-cBTi6R / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

36016-0000-99-0 HSP COMe-cBTi6R thread For all CPUs and temperature grades

36016-0000-99-1 HSP COMe-cBTi6R through For all CPUs and temperature grades

General accessories

Part Number COMe pin-out Type 6 compatible accessories Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPort

96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carr ier T6

38114-0000-00-S COMe Ref. Starterkit T6 ADAS Starterkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Battery Kit Star terkit Kontron Mobile Application platform for Rechargeable Systems

15

COMe-cBTi6R / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-cBTi6R variants is 3.5 - 13.5W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.

16

COMe-cBTi6R / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

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COMe-cBTi6R / Product Specification

3.6 Power Control

Power Supply

The COMe-cBTi6R supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cBTi6R provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

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COMe-cBTi6R / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-cBTi6R

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 4.75 - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for

thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for
thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for
thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

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COMe-cBTi6R / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-cBTi6R is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

20

COMe-cBTi6R / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cBTi6R follows the requirements for electromagnetic

compatibility standards

» EN55022

21

COMe-cBTi6R / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 414101 @ 40°C (w/o PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

22

COMe-cBTi6R / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in
height for an overall height of 27.3mm from module bottom to Heatsink top.

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COMe-cBTi6R / Product Specification

3.11 Module Dimensions

24

COMe-cBTi6R / Product Specification

All dimensions in mm

3.12 Onboard Fan Connector

Specification

» Part number (Molex) J3: 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 4.75 - 13V >13

FAN Output Voltage

4.75 - 13V 13V

Max. FAN Output Current

350mA 150mA

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COMe-cBTi6R / Product Specification

3.13 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cBTi6R. The heatspreader plate on
top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-cBTi6R. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cBTi6R are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-cBTi6R heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

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COMe-cBTi6R / Features and Interfaces

4 Features and Interfaces

4.1 Onboard eMMC Flash

The COMe-cBTi6R features a 12x16mm onboard Kingston NAND Flash drive with capacities of 2-64GB eMMC. The Flash
drive supports:

» Compliant to JEDEC/eMMC standard version 4.4, 4.41 & 4.5

» 1 bit, 4 bits or 8 bits data bus width support

» Data transfer rate up to 52Mbyte/s using 8 parallel data lines at 52MHz

» Single data rate up to 200Mbyte/s @ HS200 mode with 200MHz Host clock

» Dual data rate up to 104Mbyte/s @ 52MHz

» Error free memory access (ECC and enhanced data management)

» TRIM support

» Multi-Level-Cell (MLC) technology

» Single-Level-Cell (SLC) technology

» Industrial temperature grade -45 to +85°C

Flash Part No. KE4CN2H5C-xxx KE4CN3H5C-xxx KE4CN4K6C-xxx KE4CN5B6C-xxx KE4CN6C6C-xxx

Nominal Flash Size MLC 4GByte 8GByte 16GByte 32GByte 64GByte

Nominal Flash Size pSLC 2GByte 4GByte 8GByte 16GByte 32GByte

JEDEC Standard

eMMC 4.5 eMMC 4.5 eMMC 4.5 eMMC 4.5 eMMC 4.5

Flash Technology

19nm 19nm 19nm 19nm 19nm

Sequential Read

85 MB/s 160 MB/s 166 MB/s 166 MB/s 166 MB/s

Sequential Write

12 MB/s 25 MB/s 25 MB/s 45 MB/s 25 MB/s

I/O Performance
read/write

5000/1050 IOPS 5000/1350 IOPS 5000/1350 IOPS 4600/1450 IOPS 4600/1450 IOPS

Operating Temperature

-40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C -25 to +85°C

Package

FBGA153 FBGA153 FBGA169 FBGA169 FBGA169

Endurance (# of P/E
cycles)

MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k

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COMe-cBTi6R / Features and Interfaces

» Compliant to JEDEC/eMMC standard version 4.4, 4.41, 4.5 & 5.0

» 1 bit, 4 bits or 8 bits data bus width support

» Data transfer rate up to 52Mbyte/s using 8 parallel data lines at 52MHz

» Single data rate up to 200Mbyte/s @ HS200 mode with 200MHz Host clock

» Dual data rate up to 104Mbyte/s @ 52MHz

» Error free memory access (ECC and enhanced data management)

» TRIM support

» Multi-Level-Cell (MLC) technology

» Single-Level-Cell (SLC) technology

» Industrial temperature grade -45 to +85°C

Flash Part No. eMMC04G-W100-xxx eMMC08G-W100-xxx eMMC16G-W100-xxx eMMC32G-W100-xxx eMMC64G-W100-xxx

Nominal Flash Size MLC 4GByte 8GByte 16GByte 32GByte 64GByte

Nominal Flash Size SLC 2GByte 4GByte 8GByte 16GByte 32GByte

JEDEC Standard

eMMC 4.5+ eMMC 4.5+ eMMC 4.5+ eMMC 4.5+ eMMC 5.0

Flash Technology

A19nm A19nm A19nm A19nm A19nm

Sequential Read

100 MB/s 130 MB/s 135 MB/s 145 MB/s tbd

Sequential Write

12 MB/s 24 MB/s 24 MB/s 45 MB/s tbd

I/O Performance read/write

6300/1250 IOPS 6300/1250 IOPS 6300/1500 IOPS 5500/1600 IOPS tbd

Operating Temperature

-40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C

Package

FBGA153 FBGA153 FBGA153 FBGA153 FBGA153

Endurance (# of P/E cycles)

MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k

Note: the onboard eMMC Flash requires pre-configuration via EFI Shell before OS
installation (e.g. diskpart utility)

28

COMe-cBTi6R / Features and Interfaces

4.2 Secure Digital Card

The COMe-cBTi6R supports an SDIO Interface to be used for micro/mini/standard SD Card sockets. Following SD Cards are
validated from Kontron and recommended for use:

swissbit® S-200U & S-300U Series Industrial microSD Card

» compliant to SD Card specification 2.0

» Wear Leveling of static and dynamic data

» High reliability (MTBF >3,000,000 hours, > 10,000 insertions)

» Extended or Industrial Temperature range

» up to 25MB/s data transfer speed

Delkin Devices Inc. MicroSD

» compliant to SD Card specification 2.0

» Wear Leveling and ECC

» High reliability (MTBF >2,000,000 hours, > 2,000,000 write/erase cycles)

» Industrial Temperature range

» up to 17MB/s data transfer speed

Order information

Density Manufacturerer & Part.No. Temperature range mSD-SD Adapter

1GB SD1.1 swissbit SFSD1024N1BN1TO-I-DF-151-STD -40°C to 85°C No

2GB SD1.1 swissbit SFSD2048N1BW1MT-E-ME-111-STD -25°C to 85°C No

2GB SD1.1 Delkin SD02GHMSH-S2047-B -40°C to 85°C No

2GB SDHC Delkin SD02GHMSH-S2000-B -40°C to 85°C Yes

4GB SDHC swissbit SFSD4096N1BW1MT-E-DF-111-STD -25°C to 85°C No

4GB SDHC Delkin SD04GHMSH-S2647-B -40°C to 85°C No

4GB SDHC Delkin SD04GHMSH-S2600-B -40°C to 85°C Yes

8GB SDHC Delkin SD08GHMSH-S2647-B -40°C to 85°C No

8GB SDHC Delkin SD08GHMSH-S2600-B -40°C to 85°C Yes

29

COMe-cBTi6R / Features and Interfaces

4.3 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

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COMe-cBTi6R / Features and Interfaces

4.4 Rapid Shutdown

Overview

For “R” or the “RXT” version of the COMe-cBTi6R, Kontron has implemented a rapid shutdown function. It works as follows:

1) An active-high shutdown signal is asserted by the COM Express Eval Type 2 carrier board via pin C67 of the COM Express
connector. The characteristics of the shutdown signal are as follows:

» Amplitude 5.0V +/- 5%

» Source impedance < = 50 ohms

» Rise time 1uS⇐

» Duration >= 20uS

The assertion of this signal causes all power regulators to be disabled and the internal power supply rails to be discharged
by crowbar circuits. The shutdown circuitry provides internal energy storage that maintains crowbar activation for at least
2mS following the de-assertion of the shutdown signal. The circuit also incorporates a weak input pulldown resistor so
that the RXT module will operate normally in systems where the rapid shutdown functionality is not used and pin C67 of
the COM Express is left unconnected.

2) Simultaneously with the leading edge of shutdown, the 12V (main) input power to the RXT module is removed and
these input power pins are externally clamped to ground though a crowbar circuit located on the COM Express carrier
board. This external clamping circuit must maintain a maximum resistance of approximately 1 ohm and be activated for a
minimum of 2mS.

3) Simultaneously with the leading edge of shutdown, the 5V (standby) input power to the RXT module is removed, if
present. External clamping on these pins is not necessary.

Crowbar implementation details

As a tool for designing the internal crowbars, Kontron developed tallied the total capacitance present on each of the
internal power rails, and calculates the required discharge resistance in order to achieve the desired voltage decay time
constant. The principal design criteria are that each supply rail must decay to 37% of initial value (equivalent to 1RC)
within 250uS, and to below 1.5V within 2mS. Analysis shows that the power rails fall into four general classes. Each class
of power rails has a corresponding discharge strategy.

1) Power Input Rails: The main 12V power input rail incorporates about 300uF of distributed capacitance. This rail must be
discharged by an external crowbar located on the carrier board, which must provide a shunt resistance of approximately 1
ohm. The peak power dissipation in this crowbar resistance will be relatively high (on the order of 150W when the crowbar
is activated), but will diminish very rapidly as the input capacitors discharge.

2) Low Voltage, High Power Rails: Each of these 5 “major” internal supply rails has an output voltage in the 1.0 V to 1.5V
range, and each rail has between 1500uF and 3300uF of output capacitance. The required discharge resistances for these
rails are in the range of 0.1 to 0.2 ohm, and peak discharge currents are in the range of 8 to 16A.

The discharge circuit for each rail is implemented with a “pulse withstanding” thick-film SMT resistor in series with a low­RDSon MOSFET. The resistor peak powers are in the 8W to 20W range; depending on PCB layout considerations either a
single resistor or multiple smaller resistors may be used to achieve sufficient pulse handling capability.

Because of the relatively high currents in the discharge paths, these crowbar circuits require wide copper traces and
careful component placement adjacent to the output components of the corresponding power supplies.

3) Low Voltage, Low Power Rails: These rails have voltages of 1.8V or less and capacitances under 1000uF, with peak
discharge currents <3A. The discharge circuits for these rails are also implemented with resistor(s) and a low-RDSon

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COMe-cBTi6R / Features and Interfaces

MOSFET. In some cases, the peak pulse power dissipation in the resistor(s) is low enough that specialty “pulse
withstanding” resistors are not required.

4) Medium Voltage Rails: These 3.3V and 5V rails typically have relatively small output capacitances and peak discharge
currents <1A. The discharge circuits for these rails are typically implemented with conventional resistor(s) and a low­RDSon MOSFET.

Shutdown input circuit details

The shutdown input pin to the RXT module is coupled through a series Schottky diode and a small series resistor to the
gates of all crowbar MOSFETs, connected in parallel. All crowbar MOSFETs are N-channel “logic level” parts that have are
specified for operation at Vgs = 4.5V. Three additional components are connected in parallel between the MOSFET gates
and ground:

» A capacitor that provides energy storage to keep the MOSFETs conducting for several mS after the shutdown signal

is de-asserted.

» A high-value resistor that provides a discharge path for the capacitor as well as a pulldown resistance (to insure

that the shutdown circuits remain inactive if the shutdown pin is left floating).

» A 6.2V zener diode that protects the MOSFET gates from damage due to input ESD or input overdrive.

In order to insure that the crowbars do not “fight” active switching regulators while the input capacitors are being
discharged, the shutdown circuit rapidly crowbars the 5V rail, with a time constant <10uS. The 5V rail powers most of the
remaining switching regulators, and as its voltage falls below about 4V those regulators enter under-voltage lockout
mode and cease to operate. Additionally, by using the UVLO mechanism in the design of the RXT module, Kontron
minimizes the risk of inadvertently affecting the standard power sequencing logic for such RXT modules. Two of the
switching regulators do not require the 5V supply for operation, and in those two cases it will be necessary to clamp the
enable inputs to ground when shutdown begins.

32

COMe-cBTi6R / Features and Interfaces

4.5 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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COMe-cBTi6R / Features and Interfaces

4.6 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.

4.7 SPI boot

The COMe-cBTi6R supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

34

COMe-cBTi6R / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

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COMe-cBTi6R / Features and Interfaces

4.8 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

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COMe-cBTi6R / Features and Interfaces

4.9 UART

The COMe-cBTi6R supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for
UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by
default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 450 to 115.2k Baud (except 56000)

» 5, 6, 7 or 8bit characters

» 1 or 2 Stop bit generation

» Even, odd or no-parity generation/detection

» Complete status reporting capabilities

» Line break generation and detection

» Full prioritized interrupt system control

» No FIFO

» One additional shift register for transmit and one for receive

» No Flow Control

» No FCR register due to unavailability of FIFO

» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings

- Due to the protection circuitry required according COM Express® specification the
transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or
support for customized versions without protection circuitry

- Legacy console redirection via onboard serial ports may be restricted in terms of serial
input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream
generated by a program may lose characters. Inputs from a keyboard via terminal program
will be safe.

37

COMe-cBTi6R / Features and Interfaces

4.10 Fast I2C

The COMe-cBTi6R supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from
opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

38

COMe-cBTi6R / Features and Interfaces

4.11 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a
system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to
regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”,
“feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive
state into normal operation.

The COMe-cBTi6R offers a watchdog which works with two stages that can be programmed independently and used one by
one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It is
typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within
time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If
deassertion during runtime is necessary please ask your Kontron technical support for further help.

39

COMe-cBTi6R / Features and Interfaces

4.12 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum
performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to
adapt high performance computing on your applications. When powered by a battery or running in idle mode, the
processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining
a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize
performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup
the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

40

COMe-cBTi6R / Features and Interfaces

4.13 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or
switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memor y cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance
sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

41

COMe-cBTi6R / Features and Interfaces

4.14 Graphics Features

The integrated Intel® HD Graphics (Gen 7) graphics supports following OS dependent featureset:

O/S Win8 / WES8 Win7 / WES7 WEC7 Linux (F18/Yocto1.6) Linux (Tizen IVI 32b) Android 4.2/4.4

DisplayPort

DP 1.1a up to 2560×1600 not supported

HDMI (via external
LS)

HDMI 1.4a up to 1920×1200

VGA (COMe-compact
only)

up to 2560×1600 not supported

eDP

eDP 1.3 up to 2560×1600 or LVDS up to 1920×1080 via eDP-LVDS Bridge

Dual Independent
Display

Yes

2D HW acceleration

DirectDraw X Server Wayland Compositor OpenGL Renderer

3D HW acceleration

OGL4.0, DX11.1/10/9 OGLES 2.0 OGL3.2/OGLES2.0 OGLES 1.1/2.0 in 4.2

OGLES 1.1/2.0/3.0 in

4.4 KitKat

HW Media
Acceleration

DXVA 2 DirectShow VAAPI OGL3.2/OGLES2.0 OpenMax

HW Video Decode

H.264,MPEG2,VC1,VP8 H.264,MPEG2,VC1 H.264,MPEG2,VC1,VP8 H.264,MPEG2,VC1,VP8 H.264,H.263,VC1,WMV

9,VP8,MPEG4 in 4.2

H.264, VC1 in 4.4

HW Video Encode

H.264,MPEG2 not supported H.264,MPEG2 H.264,MPEG2 H.264

Blu-Ray

v2.0 not supported

Media players

Windows Media Player

PowerDVD

CEPlayer GStreamer - VAAPI Gallery, Widevine

Content Protection*

PAVP HDCP not supported Widevine L1

* Supported with active TXE Engine only (available with custom BIOS only)

42

COMe-cBTi6R / Features and Interfaces

4.15 ACPI Suspend Modes and Resume Events

The COMe-cBTi6R supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with
StBy-Voltage
(2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup
and driver options

43

COMe-cBTi6R / Features and Interfaces

4.16 USB

The COMe-cBTi6R supports 7x USB 2.0/1x USB 3.0 with following internal EHCI/xHCI configuration:

44

COMe-cBTi6R / System Resources

5 System Resources

5.1 Internal I2C Bus

8-bit Address 7-bit Address Device Comment

58h 0x2C S5eco resistor Do not use under any circumstances

5Ah 0x2D USB HSIC Hub Do not use under any circumstances

C0h 0x60 LVDS bridge Do not use under any circumstances

A0h 0x50 LVDS EEPROM Reserved for external LDVS EEPROM for

Panel Data

5.2 External I2C Bus

8-bit Address 7-bit Address Device Comment

A0h 0x50 Module EEPROM Do not use under any circumstances

AEh 0x57 Carrier EEPROM Not to be used with any SM bus device

except the Baseboard EEPROM
(FRUPROM)

5.3 System Management (SM) Bus

8-bit Address 7-bit Address Device Comment

A0h 0x50 DDR3L SPD DRAM0 Do not use under any circumstances

30h 0x18 DDR3L Thermal sensor option Do not use under any circumstances

A2h 0x51 DDR3L SPD DRAM1 Do not use under any circumstances

32h 0x19 DDR3L Thermal sensor option Do not use under any circumstances

58h 0x2C HWMonitor Do not use under any circumst ances

12h 0x09 SMART_CHARGER Not to be used with any SM bus device

except a charger

14h 0x0A SMART_SELECTOR Not to be used with any SM bus device

except a selector

16h 0x0B SMART_BATTERY Not to be used with any SM bus device

except a battery

45

COMe-cBTi6R / Connectors

6 Connectors

The pinouts for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM Express™
Specification and COM Express™ Design Guide for detailed, design-level information.

6.1 Connector Location

46

COMe-cBTi6R / Pinout List

7 Pinout List

7.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

OA

Output Analog

OD

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

PU

Pull-Up Resistor

PD

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current the enclosure of the peripheral
device fulfills the fire-protection requirements of IEC/EN60950

47

COMe-cBTi6R / Pinout List

7.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND1 Power Ground PWR GND - -

A2 GBE0_MDI3- Ethernet Media Dependent Interface 3 - DP-I/O - -

A3 GBE0_MDI3+ Ethernet Media Dependent Interface 3 + DP-I/O - -

A4 GBE0_LINK100# Ethernet Speed LED OD - -

A5 GBE0_LINK1000# Ethernet Speed LED OD - -

A6 GBE0_MDI2- Ethernet Media Dependent Interface 2 - DP-I/O - -

A7 GBE0_MDI2+ Ethernet Media Dependent Interface 2 + DP-I/O - -

A8 GBE0_LINK# LAN Link LED OD - -

A9 GBE0_MDI1- Ethernet Media Dependent Interface 1 - DP-I/O - -

A10 GBE0_MDI1+ Ethernet Media Dependent Interface 1 + DP-I/O - -

A11 GND Power Ground PWR GND - -

A12 GBE0_MDI0- Ethernet Media Dependent Interface 0 - DP-I/O - -

A13 GBE0_MDI0+ Ethernet Media Dependent Interface 0 + DP-I/O - -

A14 GBE0_CTREF Center Tab Reference Voltage O 3.3V and 110nF cap to GND USB LAN variant only

A15 SUS_S3# Suspend To RAM (or deeper) Indicator O-3.3 - -

A16 SATA0_TX+ SATA Transmit Pair 0 + DP-O - -

A17 SATA0_TX- SATA Transmit Pair 0 - DP-O - -

A18 SUS_S4# Suspend To Disk (or deeper) Indicator O-3.3 - -

A19 SATA0_RX+ SATA Receive Pair 0 + DP-I - -

A20 SATA0_RX- SATA Receive Pair 0 - DP-I - -

A21 GND Power Ground PWR GND - -

A22 SATA2_TX+ USB 3.0 Receive Pair 0 - DP-I - -

A23 SATA2_TX- USB 3.0 Receive Pair 0 + DP-I - -

A24 SUS_S5# Sof t Off Indicator O-3.3 - -

A25 SATA2_RX+ USB 3.0 Receive Pair 1 - DP-I - -

A26 SATA2_RX- USB 3.0 Receive Pair 1 + DP-I - -

A27 BATLOW# Battery Low I-3.3 PU 10k 3.3V (S5) assertion will prevent wake from S3-S5 state

A28 ATA_ACT# Serial ATA activity LED OD-3.3 - -

A29 HDA_SYNC HD Audio Sync O-3.3 PU in level transalator(U32) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A30 HDA_RST# HD Audio Reset O-3.3 PU in level transalator(U32) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A31 GND Power Ground PWR GND - -

A32 HDA_CLK HD Audio Bit Clock Output O-3.3 PU in level transalator(U32) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A33 HDA_SDOUT HD Audio Serial Data Out O-3.3 PU in level transalator(U32) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A34 BIOS_DIS0# BIOS Selection Strap 0 I-3.3 PU 10k 3.3V (S0) -

A35 THRMTRIP# Thermal Trip O-3.3 PU 10k 3.3V (S0) -

A36 USB6- USB 2.0 Data Pair Port 6 – DP-I/O - -

A37 USB6+ USB 2.0 Data Pair Port 6 + DP-I/O - -

A38 USB_6_7_OC# USB Overcurrent Indicator Port 6/7 I-3.3 PU 10k 3.3V (S5) -

A39 USB4- USB 2.0 Data Pair Port 4 - DP-I/O - -

A40 USB4+ USB 2.0 Data Pair Port 4 + DP-I/O - -

A41 GND Power Ground PWR GND - -

A42 USB2- USB 2.0 Data Pair Port 2 – DP-I/O - -

A43 USB2+ USB 2.0 Data Pair Port 2 + DP-I/O - -

A44 USB_2_3_OC# USB Overcurrent Indicator Port 2/3 I-3.3 PU 10k 3.3V (S5) -

A45 USB0- USB 2.0 Data Pair Port 0 – DP-I/O - -

A46 USB0+ USB 2.0 Data Pair Port 0 + DP-I/O - -

A47 VCC_RTC Real-Time Clock Circuit Power Input PWR 3V - -

A48 EXCD0_PERST# Express Card Reset Port 0 O-3.3 - -

A49 EXCD0_CPPE# Express Card Capable Card Request Port 0 I-3.3 PU 10k 3.3V (S0) -

A50 LPC_SERIRQ Serial Interrupt Request I/OD-3.3 PU in level transalator(U32) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A51 GND Power Ground PWR GND - -

A52 PCIE_TX5+ Not Connected nc - -

A53 PCIE_TX5- Not Connected nc - -

A54 GPI0 General Purpose Input 0 I-3.3 - -

A55 PCIE_TX4+ Not Connected nc - -

A56 PCIE_TX4- Not Connected nc - -

A57 GND Power Ground PWR GND - -

48

COMe-cBTi6R / Pinout List

A58 PCIE_TX3+ PCI Express Lane 3 Transmit + DP-O - only available on USB-LAN var.

A59 PCIE_TX3- PCI Express Lane 3 Transmit - DP-O - only available on USB-LAN var.

A60 GND Power Ground PWR GND - -

A61 PCIE_TX2+ PCI Express Lane 2 Transmit + DP-O - -

A62 PCIE_TX2- PCI Express Lane 2 Transmit - DP-O - -

A63 GPI1 General Purpose Input 1 I-3.3 - -

A64 PCIE_TX1+ PCI Express Lane 1 Transmit + DP-O - -

A65 PCIE_TX1- PCI Express Lane 1 Transmit - DP-O - -

A66 GND Power Ground PWR GND - -

A67 GPI2 General Purpose Input 2 I-3.3 - -

A68 PCIE_TX0+ PCI Express Lane 0 Transmit + DP-O - -

A69 PCIE_TX0- PCI Express Lane 0 Transmit - DP-O - -

A70 GND Power Ground PWR GND - -

A71 LVDS_A0+ LVDS Channel A DAT0+ DP-O - -

A72 LVDS_A0- LVDS Channel A DAT0- DP-O - -

A73 LVDS_A1+ LVDS Channel A DAT1+ DP-O - -

A74 LVDS_A1- LVDS Channel A DAT1- DP-O - -

A75 LVDS_A2+ LVDS Channel A DAT2+ DP-O - -

A76 LVDS_A2- LVDS Channel A DAT2- DP-O - -

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 PD 100k -

A78 LVDS_A3+ LVDS Channel A DAT3+ DP-O - -

A79 LVDS_A3- LVDS Channel A DAT3+ DP-O - -

A80 GND Power Ground PWR GND - -

A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O - 20-80MHz

A82 LVDS_A_CK- LVDS Channel A Clock- DP-O - 20-80MHz

A83 LVDS_I2C_CK LVDS I2C Clock (DDC) IO-3.3 PU 2k21 3.3V (S0) -

A84 LVDS_I2C_DAT LVDS I2C Data (DDC) IO-3.3 PU 2k21 3.3V (S0) -

A85 GPI3 General Purpose Input 3 I/O-3.3 - -

A86 RSVD Reserved for future use nc - -

A87 RSVD Reserved for future use nc - -

A88 PCIE0_CK_REF+ Reference PCI Express Clock + DP-O - -

A89 PCIE0_CK_REF- Reference PCI Express Clock - DP-O - -

A90 GND Power Ground PWR GND - -

A91 SPI_POWER 3.3V Power Output Pin for external SPI flash O-3.3 - -

A92 SPI_MISO SPI Master IN Slave OUT I-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A93 GPO0 General Purpose Output 0 O-3.3 - -

A94 SPI_CLK SPI Clock O-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A95 SPI_MOSI SPI Master Out Slave In O-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

A96 TPM_PP TPM Physical Presence nc - -

A97 TYPE10# Indicates TYPE10# to carrier board nc - -

A98 SER0_TX Serial Port 0 TXD O-3.3 - 20V protection circuit implemented on module

A99 SER0_RX Serial Port 0 RXD I-5T PU 10k (S0) 20V protection circuit implemented on module

A100 GND Power Ground PWR GND - -

A101 SER1_TX Ser ial Port 1 TXD O-3.3 - 20V protection circuit implemented on module

A102 SER1_RX Ser ial Port 1 RXD I-5T PU 10k (S0) 20V protection circuit implemented on module

A103 LID# LID Switch Input I-3.3 PU 10k 3.3V (S5) 20V protection circuit implemented on module

A104 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A105 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A106 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A107 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A108 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A109 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

A110 GND Power Ground PWR GND - -

49

COMe-cBTi6R / Pinout List

7.3 Connector X1A row B

Pin Signal Description Type Termination Comment

B1 GND Power Ground PWR GND - -

B2 GBE0_ACT# Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 PU 20k in CPU (S0) -

B4 LPC_AD0 LPC Multiplexed Command, Address & Data 0 I/O-3.3 PU 20k in CPU (S0) -

B5 LPC_AD1 LPC Multiplexed Command, Address & Data 1 I/O-3.3 PU 20k in CPU (S0) -

B6 LPC_AD2 LPC Multiplexed Command, Address & Data 2 I/O-3.3 PU 20k in CPU (S0) -

B7 LPC_AD3 LPC Multiplexed Command, Address & Data 3 I/O-3.3 PU 20k in CPU (S0) -

B8 LPC_DRQ0# LPC Serial DMA/Master Request 0 I-3.3 - Reserved (not implemented in Bay Trail-I)

B9 LPC_DRQ1# LPC Serial DMA/Master Request 1 I-3.3 - Reserved (not implemented in Bay Trail-I)

B10 LPC_CLK 33MHz LPC clock O-3.3 PD 20k in CPU -

B11 GND Power Ground PWR GND - -

B12 PWRBTN# Power Button I-3.3 PU 10k 3.3V (S5eco) -

B13 SMB_CLK SMBUS Clock O-3.3 PU 2k1 3.3V (S5) -

B14 SMB_DAT SMBUS Data I/O-3.3 PU 2k1 3.3V (S5) -

B15 SMB_ALERT# SMBUS Alert I/O-3.3 PU 2k1 3.3V (S5) -

B16 SATA1_TX+ SATA 1 Transmit Pair + DP-O - -

B17 SATA1_TX- SATA 1 Transmit Pair - DP-O - -

B18 SUS_STAT# Suspend Status O-3.3 PU 10k 3.3V (S5) -

B19 SATA1_RX+ SATA 1 Receive Pair + DP-I - -

B20 SATA1_RX- SATA 1 Receive Pair - DP-I - -

B21 GND Power Ground PWR GND - -

B22 SATA3_TX+ Not Connected nc - -

B23 SATA3_TX- Not Connected nc - -

B24 PWR_OK Power OK I-5T PU 10k 3.3V (S5) -

B25 SATA3_RX+ Not Connected nc - -

B26 SATA3_RX- Not Connected nc - -

B27 WDT Watch Dog Time-Out event O-3.3 PD 1k -

B28 HDA_SDIN2 Not Connected nc - not supported

B29 HDA_SDIN1 Audio Codec Serial Data in 1 I-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

B30 HDA_SDIN0 Audio Codec Serial Data in 0 I-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

B31 GND Power Ground PWR GND - -

B32 SPKR Speaker O-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

B33 I2C_CK I2C Clock O-3.3 PU 2k21 3.3V (S5) -

B34 I2C_DAT I2C Data I/O-3.3 PU 2k21 3.3V (S5) -

B35 THRM# Over Temperature Input I-3.3 PU 10k 3.3V (S0) -

B36 USB7- USB 2.0 Data Pair Port 7 – DP-I/O - -

B37 USB7+ USB 2.0 Data Pair Port 7 + DP-I/O - -

B38 USB_4_5_OC# USB Overcurrent Indicator Port 4/5 I-3.3 PU 10k 3.3V (S5) -

B39 USB5- USB 2.0 Data Pair Port 5 – DP-I/O - -

B40 USB5+ USB 2.0 Data Pair Port 5 + DP-I/O - -

B41 GND Power Ground PWR GND - -

B42 USB3- USB 2.0 Data Pair Port 3 – DP-I/O - -

B43 USB3+ USB 2.0 Data Pair Port 3 + DP-I/O - -

B44 USB_0_1_OC# USB Overcurrent Indicator Port 0/1 I-3.3 PU 10k 3.3V (S5) -

B45 USB1- USB 2.0 Data Pair Port 1 – DP-I/O - -

B46 USB1+ USB 2.0 Data Pair Port 1 + DP-I/O - -

B47 EXCD1_PERST# Express Card Reset Port 1 O-3.3 - -

B48 EXCD1_CPPE# Express Card Capable Card Request Port 1 I-3.3 PU 10k 3.3V (S0) -

B49 SYS_RESET# Reset Button Input I-3.3 PU 10k 3.3V (S5) 100nF capacitor to GND

B50 CB_RESET# Carr ier Board Reset O-3.3 - -

B51 GND Power Ground PWR GND - -

B52 PCIE_RX5+ Not Connected nc - -

B53 PCIE_RX5- Not Connected nc - -

B54 GPO1 General Purpose Output 1 O-3.3 - -

B55 PCIE_RX4+ Not Connected nc - -

B56 PCIE_RX4- Not Connected nc - -

B57 GPO2 General Purpose Output 2 O-3.3 - -

B58 PCIE_RX3+ PCI Express Lane 3 Receive + DP-I - only available on USB-LAN var.

B59 PCIE_RX3- PCI Express Lane 3 Receive - DP-I - only available on USB-LAN var.

B60 GND Power Ground PWR GND - -

50

COMe-cBTi6R / Pinout List

B61 PCIE_RX2+ PCI Express Lane 2 Receive + DP-I - -

B62 PCIE_RX2- PCI Express Lane 2 Receive - DP-I - -

B63 GPO3 General Purpose Output 3 O-3.3 - -

B64 PCIE_RX1+ PCI Express Lane 1 Receive + DP-I - -

B65 PCIE_RX1- PCI Express Lane 1 Receive - DP-I - -

B66 WAKE0# PCI Express Wake Event I-3.3 PU 10k 3.3V (S5) -

B67 WAKE1# General Purpose Wake Event I-3.3 PU 10k 3.3V (S5) -

B68 PCIE_RX0+ PCI Express Lane 0 Receive + DP-I - -

B69 PCIE_RX0- PCI Express Lane 0 Receive - DP-I - -

B70 GND Power Ground PWR GND - -

B71 LVDS_B0+ LVDS Channel B DAT0+ DP-O - -

B72 LVDS_B0- LVDS Channel B DAT0- DP-O - -

B73 LVDS_B1+ LVDS Channel B DAT1+ DP-O - -

B74 LVDS_B1- LVDS Channel B DAT1- DP-O - -

B75 LVDS_B2+ LVDS Channel B DAT2+ DP-O - -

B76 LVDS_B2- LVDS Channel B DAT2- DP-O - -

B77 LVDS_B3+ LVDS Channel B DAT3+ DP-O - -

B78 LVDS_B3- LVDS Channel B DAT3- DP-O - -

B79 LVDS_BKLT_EN Panel Backlight On O-3.3 PD 100k -

B80 GND Power Ground PWR GND - -

B81 LVDS_B_CK+ LVDS Channel B Clock+ DP-O - -

B82 LVDS_B_CK- LVDS Channel B Clock- DP-O - -

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY 5V Standby PWR 5V (S5) - -

B85 VCC_5V_SBY 5V Standby PWR 5V (S5) - -

B86 VCC_5V_SBY 5V Standby PWR 5V (S5) - -

B87 VCC_5V_SBY 5V Standby PWR 5V (S5) - -

B88 BIOS_DIS1# BIOS Selection Strap 1 I-3.3 PU 10k 3.3V (S5) -

B89 CRT_RED CRT_RED / Analog Video RGB-RED OA PD 150R -

B90 GND Power Ground PWR GND - -

B91 CRT_GREEN CRT_GREEN / Analog Video RGB-GREEN OA PD 150R -

B92 CRT_BLUE CRT_BLUE / Analog Video RGB-BLUE OA PD 150R -

B93 CRT_HSYNC CRT_HSYNC / Analog Video H-Sync O-3.3 - -

B94 CRT_VSYNC CRT_VSYNC / Analog Video V-Sync O-3.3 - -

B95 CRT_DDC_CLK CRT_DDC_CLK / Display Data Channel Clock I/O-5 PU 2k2 3.3V_S0 -

B96 CRT_DDC_DATA CRT_DDC_DATA / Display Data Channel Data I/O-5 PU 2k2 3.3V_S0 -

B97 SPI_CS# SPI Chip Select O-3.3 PU in level transalator(U55) Level transalator provides 4k PU when signal is

driving high and 40k pull up when signal is
driving low

B98 RSVD Reserved for future use nc - -

B99 RSVD Reserved for future use nc - -

B100 GND Power Ground PWR GND - -

B101 FAN_PWMOUT Fan PWM Output O-3.3 - 20V protection circuit implemented on module

B102 FAN_TACHIN Fan Tach Input I-3.3 PU 10k 3.3V (S0) 20V protection circuit implemented on module

B103 SLEEP# Sleep Button Input I-3.3 PU 10k 3.3V (S5) 20V protection circuit implemented on module

B104 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B105 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B106 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B107 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B108 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B109 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

B110 GND Power Ground PWR GND - -

51

COMe-cBTi6R / Pinout List

7.4 Connector X1B Row C

Pin Signal Description Type Termination Comment

C1 GND Power Ground PWR GND - -

C2 GND Power Ground PWR GND - -

C3 USB_SSRX0- USB Super Speed Receive - (0) DP-I - -

C4 USB_SSRX0+ USB Super Speed Receive + (0) DP-I - -

C5 GND Power Ground PWR GND - -

C6 USB_SSRX1- Not Connected nc - -

C7 USB_SSRX1+ Not Connected nc - -

C8 GND Power Ground PWR GND - -

C9 USB_SSRX2- Not Connected nc - -

C10 USB_SSRX2+ Not Connected nc - -

C11 GND Power Ground PWR GND - -

C12 USB_SSRX3- Not Connected nc - -

C13 USB_SSRX3+ Not Connected nc - -

C14 GND Power Ground PWR GND - -

C15 DDI1_PAIR6+ Not Connected nc - -

C16 DDI1_PAIR6- Not Connected nc - -

C17 RSVD Reserved for future use nc - -

C18 RSVD Reserved for future use nc - -

C19 PCIE_RX6+ Not Connected nc - -

C20 PCIE_RX6- Not Connected nc - -

C21 GND Power Ground PWR GND - -

C22 PCIE_RX7+ Not Connected nc - -

C23 PCIE_RX7- Not Connected nc - -

C24 DDI1_HPD DDI1 Hotplug Detect I-3.3 PD 100k -

C25 DDI1_PAIR4+ Not Connected nc - -

C26 DDI1_PAIR4- Not Connected nc - -

C27 RSVD Reserved for future use nc - -

C28 RSVD Reserved for future use nc - -

C29 DDI1_PAIR5+ Not Connected nc - -

C30 DDI1_PAIR5- Not Connected nc - -

C31 GND Power Ground PWR GND - -

C32 DDI2_CTRLCLK_AUX+ DDI2 CTRLCLK/AUX+ I/O-3.3 PD 100k -

C33 DDI2_CTRLDATA_AUX- DDI2 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3V (S0) -

C34 DDI2_DDC_AUX_SEL DDI2 DDC/AUX select I-3.3 PD 1M -

C35 RSVD Reserved for future use nc - -

C36 DDI3_CTRLCLK_AUX+ Not Connected nc - -

C37 DDI3_CTRLDATA_AUX- Not Connected nc - -

C38 DDI3_DDC_AUX_SEL Not Connected nc - -

C39 DDI3_PAIR0+ Not Connected nc - -

C40 DDI3_PAIR0- Not Connected nc - -

C41 GND Power Ground PWR GND - -

C42 DDI3_PAIR1+ Not Connected nc - -

C43 DDI3_PAIR1- Not Connected nc - -

C44 DDI3_HPD Not Connected nc - -

C45 RSVD Reserved for future use nc - -

C46 DDI3_PAIR2+ Not Connected nc - -

C47 DDI3_PAIR2- Not Connected nc - -

C48 RSVD Reserved for future use nc - -

C49 DDI3_PAIR3+ Not Connected nc - -

C50 DDI3_PAIR3- Not Connected nc - -

C51 GND Power Ground PWR GND - -

C52 PEG_RX0+ MCSI1_D0_ P DP-I - -

C53 PEG_RX0- MCSI1_D0_ N DP-I - -

C54 TYPE0# n.c. for type 6 module nc - -

C55 PEG_RX1+ MCSI1_D1_ P DP-I - -

C56 PEG_RX1- MCSI1_D1_ N DP-I - -

C57 TYPE1# n.c. for type 6 module nc - -

C58 PEG_RX2+ MCSI1_D2_ P DP-I - -

C59 PEG_RX2- MCSI1_D2_ N DP-I - -

C60 GND Power Ground PWR GND - -

C61 PEG_RX3+ MCSI1_D3_ P DP-I - -

C62 PEG_RX3- MCSI1_D3_ N DP-I - -

C63 RSVD Reserved for future use nc - -

C64 RSVD Reserved for future use nc - -

52

COMe-cBTi6R / Pinout List

C65 PEG_RX4+ MCSI2_D0_ P DP-I - -

C66 PEG_RX4- MCSI2_D0_ N DP-I - -

C67 RSVD RAPID_SHUTDOWN I-5 PD 100k 100nF capacitor to GND

C68 PEG_RX5+ Not Connected nc - -

C69 PEG_RX5- Not Connected nc - -

C70 GND Power Ground PWR GND - -

C71 PEG_RX6+ Not Connected nc - -

C72 PEG_RX6- Not Connected nc - -

C73 GND Power Ground PWR GND - -

C74 PEG_RX7+ Not Connected nc - -

C75 PEG_RX7- Not Connected nc - -

C76 GND Power Ground PWR GND - -

C77 RSVD Reserved for future use nc - -

C78 PEG_RX8+ Not Connected nc - -

C79 PEG_RX8- Not Connected nc - -

C80 GND Power Ground PWR GND - -

C81 PEG_RX9+ Not Connected nc - -

C82 PEG_RX9- Not Connected nc - -

C83 RSVD Reserved for future use nc - -

C84 GND Power Ground PWR GND - -

C85 PEG_RX10+ Not Connected nc - -

C86 PEG_RX10- Not Connected nc - -

C87 GND Power Ground PWR GND - -

C88 PEG_RX11+ Not Connected nc - -

C89 PEG_RX11- Not Connected nc - -

C90 GND Power Ground PWR GND - -

C91 PEG_RX12+ MCSI_GPIO1 NC - -

C92 PEG_RX12- MCSI_GPIO3 I/O 3.3 - -

C93 GND Power Ground PWR GND - -

C94 PEG_RX13+ MCSI_GPIO5 I/O 3.3 - -

C95 PEG_RX13- MCSI_GPIO7 I/O 3.3 - -

C96 GND Power Ground PWR GND - -

C97 RSVD Reserved for future use nc - -

C98 PEG_RX14+ MCSI_GPIO9 I/O 3.3 - -

C99 PEG_RX14- MCSI_GPIO11 I/O 3.3 - -

C100 GND Power Ground PWR GND - -

C101 PEG_RX15+ Not Connected nc - -

C102 PEG_RX15- Not Connected nc - -

C103 GND Power Ground PWR GND - -

C104 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C105 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C106 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C107 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C108 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C109 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

C110 GND Power Ground PWR GND - -

53

COMe-cBTi6R / Pinout List

7.5 Connector X1B Row D

Pin Signal Description Type Termination Comment

D1 GND Power Ground PWR GND - -

D2 GND Power Ground PWR GND - -

D3 USB_SSTX0- USB Super Speed Transmit - (0) DP-O - -

D4 USB_SSTX0+ USB Super Speed Transmit + (0) DP-O - -

D5 GND Power Ground PWR GND - -

D6 USB_SSTX1- Not Connected nc - -

D7 USB_SSTX1+ Not Connected nc - -

D8 GND Power Ground PWR GND - -

D9 USB_SSTX2- Not Connected nc - -

D10 USB_SSTX2+ Not Connected nc - -

D11 GND Power Ground PWR GND - -

D12 USB_SSTX3- Not Connected nc - -

D13 USB_SSTX3+ Not Connected nc - -

D14 GND Power Ground PWR GND - -

D15 DDI1_CTRLCLK_AUX+ DDI1 CTRLCLK/AUX+ I/O-3.3 PD 100k -

D16 DDI1_CTRLDATA_AUX- DDI1 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3V (S0) -

D17 RSVD Reser ved for future use nc - -

D18 RSVD Reser ved for future use nc - -

D19 PCIE_TX6+ Not Connected nc - -

D20 PCIE_TX6- Not Connected nc - -

D21 GND Power Ground PWR GND - -

D22 PCIE_TX7+ Not Connected nc - -

D23 PCIE_TX7- Not Connected nc - -

D24 RSVD Reser ved for future use nc - -

D25 RSVD Reser ved for future use nc - -

D26 DDI1_PAIR0+ DDI1 Pair 0 + DP-O - -

D27 DDI1_PAIR0- DDI1 Pair 0 - DP-O - -

D28 RSVD Reser ved for future use nc - -

D29 DDI1_PAIR1+ DDI1 Pair 1 + DP-O - -

D30 DDI1_PAIR1- DDI1 Pair 1 - DP-O - -

D31 GND Power Ground PWR GND - -

D32 DDI1_PAIR2+ DDI1 Pair 2 + DP-O - -

D33 DDI1_PAIR2- DDI1 Pair 2 - DP-O - -

D34 DDI1_DDC_AUX_SEL DDI1 DDC/AUX select I-3,3 PD 1M -

D35 RSVD Reser ved for future use nc - -

D36 DDI1_PAIR3+ DDI1 Pair 3 + DP-O - -

D37 DDI1_PAIR3- DDI1 Pair 3 - DP-O - -

D38 RSVD Reser ved for future use nc - -

D39 DDI2_PAIR0+ DDI2 Pair 0 + DP-O - -

D40 DDI2_PAIR0- DDI2 Pair 0 - DP-O - -

D41 GND Power Ground PWR GND - -

D42 DDI2_PAIR1+ DDI2 Pair 1 + DP-O - -

D43 DDI2_PAIR1- DDI2 Pair 1 - DP-O - -

D44 DDI2_HPD DDI2 Hotplug Detect I-3,3 - -

D45 RSVD Reser ved for future use nc - -

D46 DDI2_PAIR2+ DDI2 Pair 2 + DP-O - -

D47 DDI2_PAIR2- DDI2 Pair 2 - DP-O - -

D48 RSVD Reser ved for future use nc - -

D49 DDI2_PAIR3+ DDI2 Pair 3 + DP-O - -

D50 DDI2_PAIR3- DDI2 Pair 3 - DP-O - -

D51 GND Power Ground PWR GND - -

D52 PEG_TX0+ MCSI1_CLK_P CLK - -

D53 PEG_TX0- MCSI1_CLK_N CLK - -

D54 PEG_LANE_RV# Not Connected nc - -

D55 PEG_TX1+ Not Connected nc - -

D56 PEG_TX1- Not Connected nc - -

D57 TYPE2# GND for type 6 module PWR - -

D58 PEG_TX2+ Not Connected nc - -

D59 PEG_TX2- Not Connected nc - -

D60 GND Power Ground PWR GND - -

D61 PEG_TX3+ Not Connected nc - -

D62 PEG_TX3- Not Connected nc - -

D63 RSVD Reser ved for future use nc - -

D64 RSVD Reser ved for future use nc - -

54

COMe-cBTi6R / Pinout List

D65 PEG_TX4+ MCSI2_CLK_P CLK - -

D66 PEG_TX4- MCSI2_CLK_N CLK - -

D67 GND Power Ground PWR GND - -

D68 PEG_TX5+ Not Connected nc - -

D69 PEG_TX5- Not Connected nc - -

D70 GND Power Ground PWR GND - -

D71 PEG_TX6+ Not Connected nc - -

D72 PEG_TX6- Not Connected nc - -

D73 GND Power Ground PWR GND - -

D74 PEG_TX7+ Not Connected nc - -

D75 PEG_TX7- Not Connected nc - -

D76 GND Power Ground PWR GND - -

D77 RSVD Reser ved for future use nc - -

D78 PEG_TX8+ MCSI3_CLK_P CLK - -

D79 PEG_TX8- MCSI3_CLK_N CLK - -

D80 GND Power Ground PWR GND - -

D81 PEG_TX9+ Not Connected nc - -

D82 PEG_TX9- Not Connected nc - -

D83 RSVD Reser ved for future use nc - -

D84 GND Power Ground PWR GND - -

D85 PEG_TX10+ Not Connected nc - -

D86 PEG_TX10- Not Connected nc - -

D87 GND Power Ground PWR GND - -

D88 PEG_TX11+ Not Connected nc - -

D89 PEG_TX11- Not Connected nc - -

D90 GND Power Ground PWR GND - -

D91 PEG_TX12+ MCSI_GPIO0 I/O 3.3 - -

D92 PEG_TX12- MCSI_GPIO2 I/O 3.3 - -

D93 GND Power Ground PWR GND - -

D94 PEG_TX13+ MCSI_GPIO4 I/O 3.3 - -

D95 PEG_TX13- MCSI_GPIO6 I/O 3.3 - -

D96 GND Power Ground PWR GND - -

D97 RSVD Reser ved for future use nc - -

D98 PEG_TX14+ MCSI_GPIO8 I/O 3.3 - -

D99 PEG_TX14- MCSI_GPIO10 I/O 3.3 - -

D100 GND Power Ground PWR GND - -

D101 PEG_TX15+ Not Connected nc - -

D102 PEG_TX15- Not Connected nc - -

D103 GND Power Ground PWR GND - -

D104 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D105 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D106 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D107 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D108 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D109 VCC_12V Main Input Voltage (4.75-20V) PWR 4.75-20V - -

D110 GND Power Ground PWR GND - -

55

COMe-cBTi6R / Pinout List

7.6 Connector J1 micro-SD Card

Pin Signal Description Type Termination Comment

1 DAT2 - PU 20k in CPU (S0) -

2 CD/DAT3 - PU 20k in CPU (S0) -

3 CMD - PU 20k in CPU (S0 -

4 VDD - - -

5 CLK - PD 20k in CPU -

6 VSS GND PWR GND - -

7 DAT0 - PU 20k in CPU (S0) -

8 DAT1 - PU 20k in CPU (S0) -

9 C_DETECT - PU 4.7k 3.3V (S0) -

10 CD_GND GND GND - -

11 SH_11 GND GND - -

12 SH_12 GND GND - -

13 SH_13 GND GND - -

14 SH_14 GND GND - -

7.7 Connector J2 Fan Control

Pin Signal Description Type Termination Comment

1 CPU_FAN_TACH_C TACH PU 10k 3.3V (S0) -

2 CPU_FAN_VCC CPU FAN VCC - -

3 CPU_FAN_GND CPU FAN GND - -

7.8 Connector J3 XDP SFF connector

Pin Signal Description Type Termination Comment

1 PREQ# XDP_PREQ# PU 200 ohm (S5) -

2 PRDY# XDP_PRDY# PU 2K in CPU (S5) -

3 GND GDN GND - -

4 BPM3# XDP_OBSDATA_A0 PD 20k in CPU -

5 BPM2# XDP_OBSDATA_A1 PD 20k in CPU -

6 GND GND GND - -

7 BPM1# XDP_OBSDATA_A2 PD 20k in CPU -

8 BPM0# XDP_OBSDATA_A3 PD 20k in CPU -

9 GND GND GND - -

10 HOOK0 XDP_HOOK0 - -

11 HOOK1 XDP PWRBTN# PU 10k 3.3V (S5eco) -

12 HOOK2 XDP_COREPWROK - -

13 HOOK3 XDP_RTEST# - 100nF capacitor to GND

14 BCLK1 NOT CONNECTED NC - -

15 BCLK0 NOT CONNECTED NC - -

16 PROC_VTT V_1V8_S5 - -

17 RESET# XDP_PLTRST# - -

18 DRB# XDP_RESET# PU 10k 3.3V (S5) 100nF capacitor to GND

19 GND GND GND - -

20 TDO XDP_TDO_RES PU 51.1 ohm (S5) -

21 TRST# XDP_TRST# PD 51.1 ohm -

22 TDI XDP_TDI PU 51.1 ohm (S5) -

23 TMS XDP_TMS PU 51.1 ohm (S5) -

24 TCK1 NOT CONNECTED NC - -

25 GND GND GND - -

26 TCK0 XDP_CLK_FIL PD 51.1 ohm -

27 SHLD1 NOT CONNECTED NC - -

28 SHLD2 NOT CONNECTED NC - -

56

COMe-cBTi6R / Pinout List

7.9 Connector J4 JTAG CPLD

Pin Signal Description Type Termination Comment

1 v_3V3_S5 V 3.3 s5 - -

2 JTAG TDI PU 1k 3.3V (S5) -

3 JTAG_TCK PU 1k 3.3V (S5) -

4 JTAG_TMS PD 1k -

5 JTAG TDO PU 1k 3.3V (S5) -

6 GND GND GND - -

7 DBG_DATA_OUT - -

8 GND GND GND - -

The termination resistors in these tables are already mounted on the module. Refer to the
design guide for information about additional termination resistors.

57

COMe-cBTi6R / BIOS Operation

8 BIOS Operation

The BIOS (Basic Input and Output System) or UEFI (Unified Extensible Firmware Interface) records hardware parameters
of the system in the CMOS on the Computer-on-Module. It's major functions include execution of the POST(Power-On-Self­Test) during system start-up, saving system parameters and loading the operating system. The BIOS includes a BIOS
Setup programm that allows to modify system configuration settings. The module is equipped with Phoenix SecureCore,
which is located in an onboard SPI serial flash memory.

8.1 Determining the BIOS Version

To determine the BIOS version currently used on the Computer-on-Modules please check System Information Page inside
Setup

8.2 BIOS Update

Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with detailed change descriptions within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file
size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the
BIOS Region (usually 4-16MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a
wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch
file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

8.3 POST Codes

Important POST codes during boot-up

8B

Booted to DOS

68

Booted to Setup / EFI Shell

00

Booted to Windows

58

COMe-cBTi6R / BIOS Operation

8.4 Setup Guide

The Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of
menus to make changes and turn features on or off.

Functional keystrokes in POST:

[F2]

Enter Setup

[F5]

Boot Menu

[ESC] + [2]

Enter Setup via Remote Keyboard in Console Redirection Mode (depending on console Settings F2 may not be supported)

Functional keystrokes in Setup:

[F1]

Help

[F9]

Load default settings

[F10]

Save and Exit

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below
describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select fields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- or F5/F6 Change Option

<Enter> Execute command or select submenu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓
Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the
cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press
<Esc> to exit the General Help window.

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59

COMe-cBTi6R / BIOS Operation

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Corporate Offices

Europe, Middle East & Africa
Oskar-von-Miller-Str. 1
85386 Eching/Munich
Germany
Tel.: [phone]
Fax: [phone]

[e-mail]

North America
14118 Stowe Drive
Poway, CA 92064-7147
USA
Tel.: [phone]
Fax: [phone]

[e-mail]

Asia Pacific
17 Building,Block #1,ABP.
188 Southern West 4th Ring
Beijing 100070, P.R.China
Tel.: + 86 10 63751188
Fax: + 86 10 83682438

[e-mail]

60