Kontron COMe-cBT6 User Manual
COMe-cBT6
Document Revision 110
www.kontron.com
» Table of Contents «
1 User Information..................................................................................5
1.1 About This Document.................................................................................................................... 5
1.2 Copyright Notice.......................................................................................................................... 5
1.3 Trademarks................................................................................................................................. 5
1.4 Standards................................................................................................................................... 5
1.5 Warranty.................................................................................................................................... 6
1.6 Technical Support......................................................................................................................... 6
2 Introduction........................................................................................7
2.1 Product Description...................................................................................................................... 7
2.2 Naming clarification..................................................................................................................... 7
2.3 Understanding COM Express® Functionality.......................................................................................7
2.4 COM Express® Documentation......................................................................................................... 8
2.5 COM Express® Benefits.................................................................................................................. 8
3 Product Specification............................................................................9
3.1 Modules Definition....................................................................................................................... 9
3.2 Functional Specification............................................................................................................... 11
3.3 Block Diagram............................................................................................................................ 15
3.4 Accessories............................................................................................................................... 16
3.5 Electrical Specification................................................................................................................ 17
3.5.1 Supply Voltage........................................................................................................................... 17
3.5.2 Power Supply Rise Time................................................................................................................17
3.5.3 Supply Voltage Ripple.................................................................................................................. 17
3.5.4 Power Consumption..................................................................................................................... 17
3.5.5 ATX Mode.................................................................................................................................. 18
3.5.6 Single Supply Mode..................................................................................................................... 18
3.6 Power Control............................................................................................................................ 19
3.7 Environmental Specification......................................................................................................... 20
3.7.1 Temperature Specification............................................................................................................ 20
3.7.2 Humidity................................................................................................................................... 20
3.8 Standards and Certifications.........................................................................................................21
3.9 MTBF........................................................................................................................................ 23
3.10 Mechanical Specification.............................................................................................................. 24
3.11 Module Dimensions..................................................................................................................... 25
3.12 Onboard Fan Connector................................................................................................................ 26
3.13 Thermal Management, Heatspreader and Cooling Solutions..................................................................27
4 Features and Interfaces.......................................................................28
4.1 Onboard eMMC Flash.................................................................................................................... 28
4.2 Secure Digital Card...................................................................................................................... 30
4.3 S5 Eco Mode.............................................................................................................................. 31
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COMe-cBT6 / User Information
4.4 LPC.......................................................................................................................................... 32
4.5 Serial Peripheral Interface (SPI)....................................................................................................33
4.6 SPI boot.................................................................................................................................... 33
4.7 M.A.R.S.................................................................................................................................... 35
4.8 UART........................................................................................................................................ 36
4.9 Fast I2C.................................................................................................................................... 37
4.10 Dual Staged Watchdog Timer......................................................................................................... 38
4.11 Speedstep Technology................................................................................................................. 39
4.12 C-States.................................................................................................................................... 40
4.13 Graphics Features........................................................................................................................ 41
4.14 ACPI Suspend Modes and Resume Events..........................................................................................42
4.15 USB......................................................................................................................................... 43
5 System Resources...............................................................................44
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 44
5.2 Memory Area............................................................................................................................. 44
5.3 I/O Address Map......................................................................................................................... 45
5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 46
5.5 LPC addresses............................................................................................................................ 46
5.6 I2C Bus..................................................................................................................................... 46
5.7 System Management (SM) Bus....................................................................................................... 47
6 Pinout List.........................................................................................48
6.1 General Signal Description............................................................................................................ 48
6.2 Connector X1A Row A................................................................................................................... 49
6.3 Connector X1A Row B................................................................................................................... 51
6.4 Connector X1B Row C................................................................................................................... 53
6.5 Connector X1B Row D................................................................................................................... 55
7 BIOS Operation...................................................................................57
7.1 Determining the BIOS Version........................................................................................................57
7.2 BIOS Update.............................................................................................................................. 57
7.3 POST Codes................................................................................................................................ 58
7.4 Setup Guide............................................................................................................................... 58
7.5 BIOS Setup................................................................................................................................ 59
7.5.1 Main........................................................................................................................................ 59
7.5.2 Advanced.................................................................................................................................. 64
7.5.3 Security.................................................................................................................................... 87
7.5.4 Boot........................................................................................................................................ 88
7.5.5 Exit.......................................................................................................................................... 89
4
COMe-cBT6 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5
COMe-cBT6 / User Information
1.5 Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6
COMe-cBT6 / Introduction
2 Introduction
2.1 Product Description
The standard design of the COM Express® compact modules – Kontron COMe-cBT6 – supports the entire portfolio of the
Intel® Atom™ E3800 processors (COMe-cBTi6) and Intel® Celeron® processors N2800/N2900 and J1900 (COMe-cBTc6),
whereby the E3800 variants are designed for the extended temperature range of -40°C to +85°C. The memory of up to 2x
8GB has been laid out as dual-channel DDR3L SODIMM. With eMMC Flash, SD card slot and 2x SATA, ample storage options
for OS and application code are available. Substantial USB support is also offered with 1x USB 3.0 and up to 8x USB 2.0.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO shared w/GPIO
1x optional 1x optional - 1x optional
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
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COMe-cBT6 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cBT6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
8
COMe-cBT6 / Product Specification
3 Product Specification
3.1 Modules Definition
The COM Express® compact sized Computer-on-Module COMe-cBT6 (CVV6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-cBT6, based on Intel's Bay Trail platform, is available in different variants to
cover the demand of different performance, price and power:
Industrial temperature grade modules (E2: -40°C to +85°C operating)
Part Number Product Name Processor Memory eMMC TPM mSD Socket Ethernet USB 2.0
36015-0016-19-4 COMe-cBTi6 E3845 16GB Intel® Atom E3845 2x SODIMM 16GB MLC YES YES Intel® i210IT 8x
36015-0000-19-4 COMe-cBTi6 E3845 Intel® Atom E3845 2x SODIMM - - YES Intel® i210IT 8x
36015-0000-17-2 COMe-cBTi6 E3827 Intel® Atom E3827 2x SODIMM - - YES Intel® i210IT 8x
36015-0000-15-2 COMe-cBTi6 E3826 Intel® Atom E3826 2x SODIMM - - YES Intel® i210IT 8x
36015-0000-13-2 COMe-cBTi6 E3825 Intel® Atom E3825 1x SODIMM - - YES Intel® i210IT 8x
36015-0000-15-1 COMe-cBTi6 E3815 Intel® Atom E3815 1x SODIMM - - YES Intel® i210IT 8x
Commercial temperature grade modules (0°C to +60°C operating)
Part Number Product Name Processor Memor y eMMC TPM mSD Socket Ethernet USB 2.0
36017-0000-20-4 COMe-cBTc6 J1900 Intel® Celeron J1900 2x SODIMM - - - Intel® i211AT 4x
36017-0000-18-4 COMe-cBTc6 N2930 Intel® Celeron N2930 2x SODIMM - - - Intel® i211AT 4x
36017-0000-16-2 COMe-cBTc6 N2807 Intel® Celeron N2807 1x SODIMM - - - Intel® i211AT 4x
36017-0000-15-1 COMe-cBTc6 E3815 Intel® Atom E3815 1x SODIMM - - YES Intel® i211AT 4x
Onboard Flash configurations, available on E3800 variants only (36015-00FF-xx-x)
» FF = 00: without eMMC Flash
» FF = 20: 2GB onboard eMMC Flash
» FF = 40: 4GB onboard eMMC Flash
» FF = 80: 8GB onboard eMMC Flash
» FF = 16: 16GB onboard eMMC Flash
» FF = 32: 32GB onboard eMMC Flash
» FF = 64: 64GB onboard eMMC Flash
Optional hardware features for E3800 Series CPU
» TPM
» eMMC Flash
» eDP on COMe
Optional hardware features for Celeron Series CPU
» TPM
» eDP on COMe
» USB Hub for USB #4-7 support on COMe
9
COMe-cBT6 / Product Specification
Optional BIOS/Software features:
» TXE Firmware with Encryption support (AES, PAVP …)
Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.
10
COMe-cBT6 / Product Specification
3.2 Functional Specification
Processor
The 32nm Intel® Atom™ E3800 / Celeron® (BayTrail-I/M/D) CPU family supports:
» Intel® 64
» Enhanced Intel SpeedStep® Technology
» Thermal Monitoring Technologies
» Execute Disable Bit
» Virtualization Technology VT-x
» 2 Display Pipes for dual independent displays
CPU specifications
Intel® Atom™ Atom™ Atom™ Atom™ Atom™ Atom™ Celeron® Celeron® Celeron®
- E3845 E3827 E3826 E3825 E3815 E3805 J1900 N2930 N2807
Stepping D0 D0 D0 D0 D0 D0 C0 C0 C0
# of Cores 4 2 2 2 1 2 4 4 2
# of Threads 4 2 2 2 1 2 4 4 2
CPU Nominal frequency
1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz 1.33GHz 2.00GHz 1.83GHz 1.58GHz
CPU Burst frequency - - - - - - 2.42GHz 2.16GHz 2.16GHz
LFM/LPM Frequency 533MHz 533MHz 533MHz 533MHz 533MHz 533MHz 1333MHz 500MHz 533MHz
Tjunction 110°C 110°C 110°C 110°C 110°C 110°C 105°C 105°C 105°C
Thermal Design Power (TDP) 10W 8W 7W 6W 5W 3W 10W 7.5W 4.3W
SDP - - - - - - - 4.5W 2.5W
C-States C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6/C7 C1/C1E/C6/C7
Smart Cache 2x1MB 2x512kB 2x512kB 2x512kB 512kB 512kB 2x1MB 2x1MB 2x512kB
Memory Type DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1333 DDR3L-1333 DDR3L-1333
Max Memory Size 2x8GB 2x8GB 2x8GB 1x8GB 1x8GB 1x8GB 2x8GB 2x8GB 1x8GB
ECC Memory(optional) Yes Yes Yes Yes Yes Yes No No No
Graphics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD® - Intel HD® Intel HD® Intel HD®
GFX Base Frequency 542MHz 542MHz 533MHz 533MHz 400MHz - 688MHz 313MHz 313MHz
GFX Max Dynamic Frequ. 792MHz 792MHz 667MHz - - - 854MHz 854MHz 750MHz
GFX Technology GT1 4EU GT1 4EU GT1 4EU GT1 4EU GT1 4EU - GT1 4EU GT1 4EU GT1 4EU
SDIO Yes Yes Yes Yes Yes Yes No No No
eMMC Yes Yes Yes Yes Yes Yes No No No
AES-NI (optional) Yes Yes Yes Yes Yes Yes No No No
Memory
Sockets
2x DDR3L SO-DIMM
Memory Type
DDR3L-1066/1333
Maximum Size
2x8GB
Technology
Dual Channel
11
COMe-cBT6 / Product Specification
Graphics Core
The integrated Intel® HD Graphics (Gen 7) supports:
Graphics Core Render Clock
Intel® HD Graphics (Gen 7)
311-542MHz Clock
667-854MHz Turbo
Execution Units / Pixel Pipelines
4
Max Graphics Memory
2048MB
GFX Memory Bandwidth (GB/s)
up to 21.3
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
11 / 3.0 + OCL 1.1
Shader Model
3.0
Hardware accelerated Video
H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray
Independent/Simultaneous Displays
2
Display Port
DP 1.1a / eDP 1.3
HDCP support
HDCP / PAVP 2 (optional)
Monitor output
CRT max Resolution
2560x1600
TV out:
-
LVDS
LVDS Bits/Pixel
1x18/24, 2x18/24 with DP2LVDS
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
1920x1200
PWM Backlight Control:
YES
Supported Panel Data:
EDID/DID
Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
DP++ muxed with LVDS
Digital Display Interface DDI3
-
Maximum Resolution on DDI
2560x1600@60Hz
Storage
onboard SSD
2-64GB eMMC (w/E3800 CPU only)
SD Card support
1x mSD Socket onboard (w/E3800 CPU only)
IDE Interface
-
Serial-ATA
2x SATA 3Gb/s
SATA AHCI
AHCI with NCQ, HotPlug, Staggered Spinup,
SATA RAID
-
Connectivity
USB
up to 8x USB 2.0
USB 3.0
1x USB 3.0
USB Client
-
PCI
-
PCI External Masters
-
PCI Express
3x PCIe x1 Gen2
Max PCI Express
4x PCIe x1 without LAN
PCI Express x2/x4 configuration
YES
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® i210IT / i211AT
12
COMe-cBT6 / Product Specification
Feature OS Support Matrix
- Windows 8 Windows 7 WEC Tizen Fedora/Yocto Android
- E3800 Celeron E3800 Celeron E3800 Celeron E3800 E3800 Celeron E3800 Celeron
eMMC Storage X X - - X - X X - - -
eMMC Boot X X - - X - X X - X X
SD Storage X X X - X - X X - X X
SD Boot - - X - X - X X - X X
MIPI-CSI - - - - - - - X - - -
PCI Express Configuration
By default, the COMe-cBT6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe Port #0 Port #1 Port #2 Port #3
Default x1 x1 x1 LAN
Configuration 1 x2 x1 x1
Configuration 2 x1 x1 x1 x1
Configuration 3 x2 x1 x1
Configuration 4 x2 x2
Configuration 5 x4
Configuration 1 - 5 are available with customized BIOS versions only
Ethernet
The Intel® i210IT / i211AT ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Supported BIOS Size/Type
8MB SPI
Audio
HD Audio
Onboard Hardware Monitor
Nuvoton NCT7802Y
Trusted Platform Module
Atmel AT97SC3204 optional
Miscellaneous
2x UART / PWM FAN
Kontron Features
External I2C Bus
Fast I2C, MultiMaster capable
M.A.R.S. support
YES
Embedded API
KEAPI3
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged
13
COMe-cBT6 / Product Specification
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support
YES
Supply Voltage
4.75 - 20V
ACPI
ACPI 3.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
DPST 4.0, iFFS
Power Consumption and Performance
Full Load Power Consumption
3.5 - 13.5W
Kontron Performance Index
9323 - 27747
Kontron Performance/Watt
1944 - 2986
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
14
COMe-cBT6 / Product Specification
3.3 Block Diagram
15
PwrCtrl
SysMgmt
SER0
SER1
LPC
SPI
DP++
(DDI2)
USB #0
(USB 3.0)
USB #4-7
(USB 2.0)
VGA
DP++
(DDI1)
PCIe#3
PCIe #0-2
PCIe #3
GB LAN
SATA0
SATA1
HDA
eMMC
Intel® Atom™ E3800-Series
Intel® Celeron®
J1900/N29xx/N28xx
Connector Option
Standard
component
eMMC
2-32GB SLC
4-64GB MLC
VCC
5VSB
VBAT
HWM
COM Express® connector CD – Pin-out Type 6
DDR3L
SODIMM
SMB
GBLan
Intel® I210IT
Intel® I211AT
microSD
Socket
USB #1-3
(USB 2.0)
PWM
FAN1
I2C
SMB
USB #0
(USB 2.0)
LID
Sleep
LVDS
GPIO
Embedded Controller
(CPLD EPM1270)
HWM
NCT7802
CPU FAN0
eDP2LVDS
PTN3460
Power sequencing
Watchdog
LPC2I2C
I2C
EEPROM
S5eco
USB 3.0
Host
Gen7
iGFX
USB 2.0
Host
USB Hub
SMSC USB4604
USB HSIC
SPI
BIOS Flash
GPIO
UART
Ctrl
Mgmt
TPM
GPIO Buffer
COM Express® connector AB – Pin-out Type 6
DDR3L
SODIMM
UART
MUX
COMe-cBT6 / Product Specification
3.4 Accessories
Product specific accessories
Product Number Heatspreader and Cooling Solutions Comment
36015-0000-99-0 HSP COMe-cBT6 thread For all CPUs and temperature grades
36015-0000-99-1 HSP COMe-cBT6 through For all CPUs and temperature grades
General accessories
Part Number COMe pin-out Type 6 compatible
accessories
Project Code Comment
38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector
38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPor t
96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6
38114-0000-00-S COMe Ref. Starterkit T6 ADAS Star terkit with COMe Reference Carrier T6
Part Number Mounting Comment
38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors
38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors
38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors
38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors
Part Number Cooling Solutions Comment
36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP
36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP
Part Number Display Adapter Comment
9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter
9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Comment
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)
96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)
Part Number Miscellaneous Comment
18029-0000-00-0 MARS Smart Battery Kit Star terkit Kontron Mobile Application platform for Rechargeable Systems
Compatible Memory
Part Number DDR3L SODIMM, commercial temperature grade
97015-1024-16-1 DDR3L-1600 SODIMM 1GB
97015-2048-16-1 DDR3L-1600 SODIMM 2GB
97015-4096-16-1 DDR3L-1600 SODIMM 4GB
97015-8192-16-1 DDR3L-1600 SODIMM 8GB
Part Number DDR3L SODIMM, industrial temperature grade
97015-1024-16-3 DDR3L-1600 SODIMM 1GB E2
97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2
97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2
97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2
16
COMe-cBT6 / Product Specification
3.5 Electrical Specification
3.5.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC:
4.75 - 20V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.5.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.5.4 Power Consumption
The maximum Power Consumption of the different COMe-cBT6 variants is 3.5 - 13.5W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
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COMe-cBT6 / Product Specification
3.5.5 ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →
S0 high high 5V low VCC
3.5.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 → high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 → PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
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COMe-cBT6 / Product Specification
3.6 Power Control
Power Supply
The COMe-cBT6 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-cBT6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-cBT6 / Product Specification
3.7 Environmental Specification
3.7.1 Temperature Specification
Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-cBT6
Temperature Specification Operating Non-operating Validated Input Voltage
Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 20V
Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V
Industrial grade by Screening (XT)
-40°C to +85°C -40°C to +85°C VCC: 12V
Industrial grade by Design (E2)
-40°C to +85°C -40°C to +85°C VCC: 4.75 - 20V
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade Validation requirements
Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.7.2 Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
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COMe-cBT6 / Product Specification
3.8 Standards and Certifications
RoHS II
The COMe-cBT6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances
(RoHS II) in electrical and electronic equipment
Component Recognition UL 60950-1
The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
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COMe-cBT6 / Product Specification
Shock & Vibration
The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-cBT6 follows the requirements for electromagnetic
compatibility standards
» EN55022
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COMe-cBT6 / Product Specification
3.9 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): tbd
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
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COMe-cBT6 / Product Specification
3.10 Mechanical Specification
Dimension
» 95.0 mm x 95.0 mm (3.75” x 3.75”)
» Height approx. 12mm (0.4”)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:
Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in
height for an overall height of 27.3mm from module bottom to Heatsink top.
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COMe-cBT6 / Product Specification
3.11 Module Dimensions
All dimensions in mm
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COMe-cBT6 / Product Specification
3.12 Onboard Fan Connector
Specification
» Part number (Molex) J3: 53261-0371
» Mates with: 51021-0300
» Crimp terminals: 50079-8100
Pin assignment
» Pin1: Tacho, Pin2: VCC, Pin3: GND
Electrical characteristic
Module Input Voltage 4.75 - 13V >13
FAN Output Voltage
4.75 - 13V 13V
Max. FAN Output Current
350mA 150mA
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COMe-cBT6 / Product Specification
3.13 Thermal Management, Heatspreader and Cooling Solutions
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cBT6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:
» 60°C for commercial grade modules
» 75°C for extended temperature grade modules (E1)
» 85°C for industrial temperature grade modules (E2/XT)
The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-cBT6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cBT6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.
Documentation and CAD drawings of COMe-cBT6 heatspreader and cooling solutions are provided at
http://emdcustomersection.kontron.com.
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