Kontron COMe-cBT6 User Manual

COMe-cBT6

Document Revision 110

www.kontron.com

» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 Naming clarification..................................................................................................................... 7

2.3 Understanding COM Express® Functionality.......................................................................................7

2.4 COM Express® Documentation......................................................................................................... 8

2.5 COM Express® Benefits.................................................................................................................. 8

3 Product Specification............................................................................9

3.1 Modules Definition....................................................................................................................... 9

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 15

3.4 Accessories............................................................................................................................... 16

3.5 Electrical Specification................................................................................................................ 17

3.5.1 Supply Voltage........................................................................................................................... 17

3.5.2 Power Supply Rise Time................................................................................................................17

3.5.3 Supply Voltage Ripple.................................................................................................................. 17

3.5.4 Power Consumption..................................................................................................................... 17

3.5.5 ATX Mode.................................................................................................................................. 18

3.5.6 Single Supply Mode..................................................................................................................... 18

3.6 Power Control............................................................................................................................ 19

3.7 Environmental Specification......................................................................................................... 20

3.7.1 Temperature Specification............................................................................................................ 20

3.7.2 Humidity................................................................................................................................... 20

3.8 Standards and Certifications.........................................................................................................21

3.9 MTBF........................................................................................................................................ 23

3.10 Mechanical Specification.............................................................................................................. 24

3.11 Module Dimensions..................................................................................................................... 25

3.12 Onboard Fan Connector................................................................................................................ 26

3.13 Thermal Management, Heatspreader and Cooling Solutions..................................................................27

4 Features and Interfaces.......................................................................28

4.1 Onboard eMMC Flash.................................................................................................................... 28

4.2 Secure Digital Card...................................................................................................................... 30

4.3 S5 Eco Mode.............................................................................................................................. 31

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COMe-cBT6 / User Information

4.4 LPC.......................................................................................................................................... 32

4.5 Serial Peripheral Interface (SPI)....................................................................................................33

4.6 SPI boot.................................................................................................................................... 33

4.7 M.A.R.S.................................................................................................................................... 35

4.8 UART........................................................................................................................................ 36

4.9 Fast I2C.................................................................................................................................... 37

4.10 Dual Staged Watchdog Timer......................................................................................................... 38

4.11 Speedstep Technology................................................................................................................. 39

4.12 C-States.................................................................................................................................... 40

4.13 Graphics Features........................................................................................................................ 41

4.14 ACPI Suspend Modes and Resume Events..........................................................................................42

4.15 USB......................................................................................................................................... 43

5 System Resources...............................................................................44

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 44

5.2 Memory Area............................................................................................................................. 44

5.3 I/O Address Map......................................................................................................................... 45

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 46

5.5 LPC addresses............................................................................................................................ 46

5.6 I2C Bus..................................................................................................................................... 46

5.7 System Management (SM) Bus....................................................................................................... 47

6 Pinout List.........................................................................................48

6.1 General Signal Description............................................................................................................ 48

6.2 Connector X1A Row A................................................................................................................... 49

6.3 Connector X1A Row B................................................................................................................... 51

6.4 Connector X1B Row C................................................................................................................... 53

6.5 Connector X1B Row D................................................................................................................... 55

7 BIOS Operation...................................................................................57

7.1 Determining the BIOS Version........................................................................................................57

7.2 BIOS Update.............................................................................................................................. 57

7.3 POST Codes................................................................................................................................ 58

7.4 Setup Guide............................................................................................................................... 58

7.5 BIOS Setup................................................................................................................................ 59

7.5.1 Main........................................................................................................................................ 59

7.5.2 Advanced.................................................................................................................................. 64

7.5.3 Security.................................................................................................................................... 87

7.5.4 Boot........................................................................................................................................ 88

7.5.5 Exit.......................................................................................................................................... 89

4

COMe-cBT6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

5

COMe-cBT6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

6

COMe-cBT6 / Introduction

2 Introduction

2.1 Product Description

The standard design of the COM Express® compact modules – Kontron COMe-cBT6 – supports the entire portfolio of the
Intel® Atom™ E3800 processors (COMe-cBTi6) and Intel® Celeron® processors N2800/N2900 and J1900 (COMe-cBTc6),
whereby the E3800 variants are designed for the extended temperature range of -40°C to +85°C. The memory of up to 2x
8GB has been laid out as dual-channel DDR3L SODIMM. With eMMC Flash, SD card slot and 2x SATA, ample storage options
for OS and application code are available. Substantial USB support is also offered with 1x USB 3.0 and up to 8x USB 2.0.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

7

COMe-cBT6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cBT6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

8

COMe-cBT6 / Product Specification

3 Product Specification

3.1 Modules Definition

The COM Express® compact sized Computer-on-Module COMe-cBT6 (CVV6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-cBT6, based on Intel's Bay Trail platform, is available in different variants to
cover the demand of different performance, price and power:

Industrial temperature grade modules (E2: -40°C to +85°C operating)

Part Number Product Name Processor Memory eMMC TPM mSD Socket Ethernet USB 2.0

36015-0016-19-4 COMe-cBTi6 E3845 16GB Intel® Atom E3845 2x SODIMM 16GB MLC YES YES Intel® i210IT 8x

36015-0000-19-4 COMe-cBTi6 E3845 Intel® Atom E3845 2x SODIMM - - YES Intel® i210IT 8x

36015-0000-17-2 COMe-cBTi6 E3827 Intel® Atom E3827 2x SODIMM - - YES Intel® i210IT 8x

36015-0000-15-2 COMe-cBTi6 E3826 Intel® Atom E3826 2x SODIMM - - YES Intel® i210IT 8x

36015-0000-13-2 COMe-cBTi6 E3825 Intel® Atom E3825 1x SODIMM - - YES Intel® i210IT 8x

36015-0000-15-1 COMe-cBTi6 E3815 Intel® Atom E3815 1x SODIMM - - YES Intel® i210IT 8x

Commercial temperature grade modules (0°C to +60°C operating)

Part Number Product Name Processor Memor y eMMC TPM mSD Socket Ethernet USB 2.0

36017-0000-20-4 COMe-cBTc6 J1900 Intel® Celeron J1900 2x SODIMM - - - Intel® i211AT 4x

36017-0000-18-4 COMe-cBTc6 N2930 Intel® Celeron N2930 2x SODIMM - - - Intel® i211AT 4x

36017-0000-16-2 COMe-cBTc6 N2807 Intel® Celeron N2807 1x SODIMM - - - Intel® i211AT 4x

36017-0000-15-1 COMe-cBTc6 E3815 Intel® Atom E3815 1x SODIMM - - YES Intel® i211AT 4x

Onboard Flash configurations, available on E3800 variants only (36015-00FF-xx-x)

» FF = 00: without eMMC Flash

» FF = 20: 2GB onboard eMMC Flash

» FF = 40: 4GB onboard eMMC Flash

» FF = 80: 8GB onboard eMMC Flash

» FF = 16: 16GB onboard eMMC Flash

» FF = 32: 32GB onboard eMMC Flash

» FF = 64: 64GB onboard eMMC Flash

Optional hardware features for E3800 Series CPU

» TPM

» eMMC Flash

» eDP on COMe

Optional hardware features for Celeron Series CPU

» TPM

» eDP on COMe

» USB Hub for USB #4-7 support on COMe

9

COMe-cBT6 / Product Specification

Optional BIOS/Software features:

» TXE Firmware with Encryption support (AES, PAVP …)

Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.

10

COMe-cBT6 / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® Atom™ E3800 / Celeron® (BayTrail-I/M/D) CPU family supports:

» Intel® 64

» Enhanced Intel SpeedStep® Technology

» Thermal Monitoring Technologies

» Execute Disable Bit

» Virtualization Technology VT-x

» 2 Display Pipes for dual independent displays

CPU specifications

Intel® Atom™ Atom™ Atom™ Atom™ Atom™ Atom™ Celeron® Celeron® Celeron®

- E3845 E3827 E3826 E3825 E3815 E3805 J1900 N2930 N2807

Stepping D0 D0 D0 D0 D0 D0 C0 C0 C0

# of Cores 4 2 2 2 1 2 4 4 2

# of Threads 4 2 2 2 1 2 4 4 2

CPU Nominal frequency

1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz 1.33GHz 2.00GHz 1.83GHz 1.58GHz

CPU Burst frequency - - - - - - 2.42GHz 2.16GHz 2.16GHz

LFM/LPM Frequency 533MHz 533MHz 533MHz 533MHz 533MHz 533MHz 1333MHz 500MHz 533MHz

Tjunction 110°C 110°C 110°C 110°C 110°C 110°C 105°C 105°C 105°C

Thermal Design Power (TDP) 10W 8W 7W 6W 5W 3W 10W 7.5W 4.3W

SDP - - - - - - - 4.5W 2.5W

C-States C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6/C7 C1/C1E/C6/C7

Smart Cache 2x1MB 2x512kB 2x512kB 2x512kB 512kB 512kB 2x1MB 2x1MB 2x512kB

Memory Type DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1333 DDR3L-1333 DDR3L-1333

Max Memory Size 2x8GB 2x8GB 2x8GB 1x8GB 1x8GB 1x8GB 2x8GB 2x8GB 1x8GB

ECC Memory(optional) Yes Yes Yes Yes Yes Yes No No No

Graphics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD® - Intel HD® Intel HD® Intel HD®

GFX Base Frequency 542MHz 542MHz 533MHz 533MHz 400MHz - 688MHz 313MHz 313MHz

GFX Max Dynamic Frequ. 792MHz 792MHz 667MHz - - - 854MHz 854MHz 750MHz

GFX Technology GT1 4EU GT1 4EU GT1 4EU GT1 4EU GT1 4EU - GT1 4EU GT1 4EU GT1 4EU

SDIO Yes Yes Yes Yes Yes Yes No No No

eMMC Yes Yes Yes Yes Yes Yes No No No

AES-NI (optional) Yes Yes Yes Yes Yes Yes No No No

Memory

Sockets

2x DDR3L SO-DIMM

Memory Type

DDR3L-1066/1333

Maximum Size

2x8GB

Technology

Dual Channel

11

COMe-cBT6 / Product Specification

Graphics Core

The integrated Intel® HD Graphics (Gen 7) supports:

Graphics Core Render Clock

Intel® HD Graphics (Gen 7)

311-542MHz Clock

667-854MHz Turbo

Execution Units / Pixel Pipelines

4

Max Graphics Memory

2048MB

GFX Memory Bandwidth (GB/s)

up to 21.3

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11 / 3.0 + OCL 1.1

Shader Model

3.0

Hardware accelerated Video

H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray

Independent/Simultaneous Displays

2

Display Port

DP 1.1a / eDP 1.3

HDCP support

HDCP / PAVP 2 (optional)

Monitor output

CRT max Resolution

2560x1600

TV out:

-

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24 with DP2LVDS

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

EDID/DID

Display Interfaces

Discrete Graphics

-

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

DP++ muxed with LVDS

Digital Display Interface DDI3

-

Maximum Resolution on DDI

2560x1600@60Hz

Storage

onboard SSD

2-64GB eMMC (w/E3800 CPU only)

SD Card support

1x mSD Socket onboard (w/E3800 CPU only)

IDE Interface

-

Serial-ATA

2x SATA 3Gb/s

SATA AHCI

AHCI with NCQ, HotPlug, Staggered Spinup,

SATA RAID

-

Connectivity

USB

up to 8x USB 2.0

USB 3.0

1x USB 3.0

USB Client

-

PCI

-

PCI External Masters

-

PCI Express

3x PCIe x1 Gen2

Max PCI Express

4x PCIe x1 without LAN

PCI Express x2/x4 configuration

YES

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® i210IT / i211AT

12

COMe-cBT6 / Product Specification

Feature OS Support Matrix

- Windows 8 Windows 7 WEC Tizen Fedora/Yocto Android

- E3800 Celeron E3800 Celeron E3800 Celeron E3800 E3800 Celeron E3800 Celeron

eMMC Storage X X - - X - X X - - -

eMMC Boot X X - - X - X X - X X

SD Storage X X X - X - X X - X X

SD Boot - - X - X - X X - X X

MIPI-CSI - - - - - - - X - - -

PCI Express Configuration

By default, the COMe-cBT6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.

PCIe Port #0 Port #1 Port #2 Port #3

Default x1 x1 x1 LAN

Configuration 1 x2 x1 x1

Configuration 2 x1 x1 x1 x1

Configuration 3 x2 x1 x1

Configuration 4 x2 x2

Configuration 5 x4

Configuration 1 - 5 are available with customized BIOS versions only

Ethernet

The Intel® i210IT / i211AT ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

8MB SPI

Audio

HD Audio

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Atmel AT97SC3204 optional

Miscellaneous

2x UART / PWM FAN

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI3

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

13

COMe-cBT6 / Product Specification

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support

YES

Supply Voltage

4.75 - 20V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 4.0, iFFS

Power Consumption and Performance

Full Load Power Consumption

3.5 - 13.5W

Kontron Performance Index

9323 - 27747

Kontron Performance/Watt

1944 - 2986

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

14

COMe-cBT6 / Product Specification

3.3 Block Diagram

15

PwrCtrl

SysMgmt

SER0
SER1

LPC

SPI

DP++

(DDI2)

USB #0

(USB 3.0)

USB #4-7

(USB 2.0)

VGA

DP++

(DDI1)

PCIe#3

PCIe #0-2

PCIe #3

GB LAN

SATA0
SATA1

HDA

eMMC

Intel® Atom™ E3800-Series

Intel® Celeron®

J1900/N29xx/N28xx

Connector Option

Standard

component

eMMC

2-32GB SLC

4-64GB MLC

VCC

5VSB

VBAT

HWM

COM Express® connector CD – Pin-out Type 6

DDR3L

SODIMM

SMB

GBLan

Intel® I210IT

Intel® I211AT

microSD

Socket

USB #1-3

(USB 2.0)

PWM
FAN1

I2C

SMB

USB #0

(USB 2.0)

LID

Sleep

LVDS

GPIO

Embedded Controller

(CPLD EPM1270)

HWM

NCT7802

CPU FAN0

eDP2LVDS

PTN3460

Power sequencing

Watchdog

LPC2I2C

I2C

EEPROM

S5eco

USB 3.0

Host

Gen7

iGFX

USB 2.0

Host

USB Hub

SMSC USB4604

USB HSIC

SPI

BIOS Flash

GPIO
UART

Ctrl

Mgmt

TPM

GPIO Buffer

COM Express® connector AB – Pin-out Type 6

DDR3L

SODIMM

UART

MUX

COMe-cBT6 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

36015-0000-99-0 HSP COMe-cBT6 thread For all CPUs and temperature grades

36015-0000-99-1 HSP COMe-cBT6 through For all CPUs and temperature grades

General accessories

Part Number COMe pin-out Type 6 compatible

accessories

Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPor t

96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6

38114-0000-00-S COMe Ref. Starterkit T6 ADAS Star terkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Battery Kit Star terkit Kontron Mobile Application platform for Rechargeable Systems

Compatible Memory

Part Number DDR3L SODIMM, commercial temperature grade

97015-1024-16-1 DDR3L-1600 SODIMM 1GB

97015-2048-16-1 DDR3L-1600 SODIMM 2GB

97015-4096-16-1 DDR3L-1600 SODIMM 4GB

97015-8192-16-1 DDR3L-1600 SODIMM 8GB

Part Number DDR3L SODIMM, industrial temperature grade

97015-1024-16-3 DDR3L-1600 SODIMM 1GB E2

97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2

97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2

97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2

16

COMe-cBT6 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

4.75 - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-cBT6 variants is 3.5 - 13.5W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.

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COMe-cBT6 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

18

COMe-cBT6 / Product Specification

3.6 Power Control

Power Supply

The COMe-cBT6 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-cBT6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

19

COMe-cBT6 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-cBT6

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 4.75 - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 4.75 - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

20

COMe-cBT6 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-cBT6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

21

COMe-cBT6 / Product Specification

Shock & Vibration

The COM Express® compact form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-cBT6 follows the requirements for electromagnetic

compatibility standards

» EN55022

22

COMe-cBT6 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): tbd

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

23

COMe-cBT6 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 95.0 mm (3.75” x 3.75”)

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for compact sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top. Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in
height for an overall height of 27.3mm from module bottom to Heatsink top.

24

COMe-cBT6 / Product Specification

3.11 Module Dimensions

All dimensions in mm

25

COMe-cBT6 / Product Specification

3.12 Onboard Fan Connector

Specification

» Part number (Molex) J3: 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 4.75 - 13V >13

FAN Output Voltage

4.75 - 13V 13V

Max. FAN Output Current

350mA 150mA

26

COMe-cBT6 / Product Specification

3.13 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-cBT6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-cBT6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-cBT6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-cBT6 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

27

COMe-cBT6 / Features and Interfaces

4 Features and Interfaces

4.1 Onboard eMMC Flash

The COMe-cBT6 features a 12x16mm onboard Kingston NAND Flash drive with capacities of 2-64GB eMMC (w/E3800 CPU
only). The Flash drive supports:

» Compliant to JEDEC/eMMC standard version 4.4, 4.41 & 4.5

» 1 bit, 4 bits or 8 bits data bus width support

» Data transfer rate up to 52Mbyte/s using 8 parallel data lines at 52MHz

» Single data rate up to 200Mbyte/s @ HS200 mode with 200MHz Host clock

» Dual data rate up to 104Mbyte/s @ 52MHz

» Error free memory access (ECC and enhanced data management)

» TRIM support

» Multi-Level-Cell (MLC) technology

» Single-Level-Cell (SLC) technology

» Industrial temperature grade -45 to +85°C

Flash Part No. KE4CN2H5C-xxx KE4CN3H5C-xxx KE4CN4K6C-xxx KE4CN5B6C-xxx KE4CN6C6C-xxx

Nominal Flash Size MLC 4GByte 8GByte 16GByte 32GByte 64GByte

Nominal Flash Size pSLC 2GByte 4GByte 8GByte 16GByte 32GByte

JEDEC Standard

eMMC 4.5 eMMC 4.5 eMMC 4.5 eMMC 4.5 eMMC 4.5

Flash Technology

19nm 19nm 19nm 19nm 19nm

Sequential Read

85 MB/s 160 MB/s 166 MB/s 166 MB/s 166 MB/s

Sequential Write

12 MB/s 25 MB/s 25 MB/s 45 MB/s 25 MB/s

I/O Performance
read/write

5000/1050 IOPS 5000/1350 IOPS 5000/1350 IOPS 4600/1450 IOPS 4600/1450 IOPS

Operating Temperature

-40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C -25 to +85°C

Package

FBGA153 FBGA153 FBGA169 FBGA169 FBGA169

Endurance (# of P/E
cycles)

MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k

28

COMe-cBT6 / Features and Interfaces

» Compliant to JEDEC/eMMC standard version 4.4, 4.41, 4.5 & 5.0

» 1 bit, 4 bits or 8 bits data bus width support

» Data transfer rate up to 52Mbyte/s using 8 parallel data lines at 52MHz

» Single data rate up to 200Mbyte/s @ HS200 mode with 200MHz Host clock

» Dual data rate up to 104Mbyte/s @ 52MHz

» Error free memory access (ECC and enhanced data management)

» TRIM support

» Multi-Level-Cell (MLC) technology

» Single-Level-Cell (SLC) technology

» Industrial temperature grade -45 to +85°C

Flash Part No. eMMC04G-W100-xxx eMMC08G-W100-xxx eMMC16G-W100-xxx eMMC32G-W100-xxx eMMC64G-W100-xxx

Nominal Flash Size MLC 4GByte 8GByte 16GByte 32GByte 64GByte

Nominal Flash Size SLC 2GByte 4GByte 8GByte 16GByte 32GByte

JEDEC Standard

eMMC 4.5+ eMMC 4.5+ eMMC 4.5+ eMMC 4.5+ eMMC 5.0

Flash Technology

A19nm A19nm A19nm A19nm A19nm

Sequential Read

100 MB/s 130 MB/s 135 MB/s 145 MB/s tbd

Sequential Write

12 MB/s 24 MB/s 24 MB/s 45 MB/s tbd

I/O Performance
read/write

6300/1250 IOPS 6300/1250 IOPS 6300/1500 IOPS 5500/1600 IOPS tbd

Operating Temperature

-40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C

Package

FBGA153 FBGA153 FBGA153 FBGA153 FBGA153

Endurance (# of P/E
cycles)

MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k MLC 3k, SLC 30k

Note: the onboard eMMC Flash requires pre-configuration via EFI Shell before OS
installation (e.g. diskpart utility)

29

COMe-cBT6 / Features and Interfaces

4.2 Secure Digital Card

The COMe-cBT6 supports an SDIO Interface to be used for micro/mini/standard SD Card sockets. Following SD Cards are
validated from Kontron and recommended for use:

swissbit® S-200U & S-300U Series Industrial microSD Card

» compliant to SD Card specification 2.0

» Wear Leveling of static and dynamic data

» High reliability (MTBF >3,000,000 hours, > 10,000 insertions)

» Extended or Industrial Temperature range

» up to 25MB/s data transfer speed

Delkin Devices Inc. MicroSD

» compliant to SD Card specification 2.0

» Wear Leveling and ECC

» High reliability (MTBF >2,000,000 hours, > 2,000,000 write/erase cycles)

» Industrial Temperature range

» up to 17MB/s data transfer speed

Order information

Density Manufacturerer & Part.No. Temperature range mSD-SD Adapter

1GB SD1.1 swissbit SFSD1024N1BN1TO-I-DF-151-STD -40°C to 85°C No

2GB SD1.1 swissbit SFSD2048N1BW1MT-E-ME-111-STD -25°C to 85°C No

2GB SD1.1 Delkin SD02GHMSH-S2047-B -40°C to 85°C No

2GB SDHC Delkin SD02GHMSH-S2000-B -40°C to 85°C Yes

4GB SDHC swissbit SFSD4096N1BW1MT-E-DF-111-STD -25°C to 85°C No

4GB SDHC Delkin SD04GHMSH-S2647-B -40°C to 85°C No

4GB SDHC Delkin SD04GHMSH-S2600-B -40°C to 85°C Yes

8GB SDHC Delkin SD08GHMSH-S2647-B -40°C to 85°C No

8GB SDHC Delkin SD08GHMSH-S2600-B -40°C to 85°C Yes

30

COMe-cBT6 / Features and Interfaces

4.3 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

31

COMe-cBT6 / Features and Interfaces

4.4 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

32

COMe-cBT6 / Features and Interfaces

4.5 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.

4.6 SPI boot

The COMe-cBT6 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

33

COMe-cBT6 / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

34

COMe-cBT6 / Features and Interfaces

4.7 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

35

COMe-cBT6 / Features and Interfaces

4.8 UART

The COMe-cBT6 supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for
UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by
default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 450 to 115.2k Baud (except 56000)

» 5, 6, 7 or 8bit characters

» 1 or 2 Stop bit generation

» Even, odd or no-parity generation/detection

» Complete status reporting capabilities

» Line break generation and detection

» Full prioritized interrupt system control

» No FIFO

» One additional shift register for transmit and one for receive

» No Flow Control

» No FCR register due to unavailability of FIFO

» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings

- Due to the protection circuitry required according COM Express® specification the
transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or
support for customized versions without protection circuitry

- Legacy console redirection via onboard serial ports may be restricted in terms of serial
input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream
generated by a program may lose characters. Inputs from a keyboard via terminal program
will be safe.

36

COMe-cBT6 / Features and Interfaces

4.9 Fast I2C

The COMe-cBT6 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from
opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

37

COMe-cBT6 / Features and Interfaces

4.10 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a
system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to
regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”,
“feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive
state into normal operation.

The COMe-cBT6 offers a watchdog which works with two stages that can be programmed independently and used one by
one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It
is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst
stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within
time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If
deassertion during runtime is necessary please ask your Kontron technical support for further help.

38

COMe-cBT6 / Features and Interfaces

4.11 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum
performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to
adapt high performance computing on your applications. When powered by a battery or running in idle mode, the
processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining
a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize
performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup
the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

39

COMe-cBT6 / Features and Interfaces

4.12 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or
switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched of f

C-States are usually enabled by default for low power consumption, but active C-States my influence performance
sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

40

COMe-cBT6 / Features and Interfaces

4.13 Graphics Features

The integrated Intel® HD Graphics (Gen 7) graphics supports following OS dependent featureset:

O/S Win8 / WES8 Win7 / WES7 WEC7 Linux (F18/Yocto1.6) Linux (Tizen IVI 32b) Android 4.2/4.4

DisplayPort

DP 1.1a up to 2560×1600 not supported

HDMI (via external LS)

HDMI 1.4a up to 1920×1200

VGA (COMe-compact only)

up to 2560×1600 not supported

eDP

eDP 1.3 up to 2560×1600 or LVDS up to 1920×1080 via eDP-LVDS Bridge

Dual Independent Display

Yes

2D HW acceleration

DirectDraw X Ser ver Wayland Compositor OpenGL Renderer

3D HW acceleration

OGL4.0, DX11.1/10/9 OGLES 2.0 OGL3.2/OGLES2.0 OGLES 1.1/2.0 in 4.2

OGLES 1.1/2.0/3.0 in 4.4 KitKat

HW Media Acceleration

DXVA 2 DirectShow VAAPI OGL3.2/OGLES2.0 OpenMax

HW Video Decode

H.264,MPEG2,VC1,VP8 H.264,MPEG2,VC1 H.264,MPEG2,VC1,VP8 H.264,MPEG2,VC1,VP8 H.264,H.263,VC1,WMV9,VP8,MPEG4

in 4.2
H.264, VC1 in 4.4

HW Video Encode

H.264,MPEG2 not supported H.264,MPEG2 H.264,MPEG2 H.264

Blu-Ray

v2.0 not supported

Media players

Windows Media Player

PowerDVD

CEPlayer GStreamer - VAAPI Gallery, Widevine

Content Protection*

PAVP HDCP not supported Widevine L1

* Supported with active TXE Engine only (available with custom BIOS only)

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COMe-cBT6 / Features and Interfaces

4.14 ACPI Suspend Modes and Resume Events

The COMe-cBT6 supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with
StBy-Voltage
(2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup
and driver options

42

COMe-cBT6 / Features and Interfaces

4.15 USB

The COMe-cBT6 supports up to 8x USB 2.0/1x USB 3.0 with following internal EHCI/xHCI configuration:

Note: The USB Ports provided by the HSIC USB Hub requires xHCI enabled in Setup and full
USB 3.0 OS Support

43

COMe-cBT6 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

IRQ # Used For

0 Timer0

1 Keyboard

2 Redirected secondary PIC

3 Onboard - COM2

4 Onboard - COM1

5 SIO COM3 or 4

6 SIO COM3 or 4

7 SIO LPT or COM3/4

8 RTC

9 Free for PCI devices

10 Free for PCI devices

11 Free for PCI devices

12 PS/2 mouse or free for PCI devices

13 FPU

14 not used

15 not used

5.2 Memory Area

Address range (hex) Size Usage

00000000-0009FFFF 640 KB DOS- (Real mode-) memory

000A0000-000BFFFF 128 KB Display memory

000C0000-000CBFFF 48 KB VGA BIOS

000CC000-000DFFFF 80 KB Option ROM or XMS

000E0000-000EFFFF 64 KB System BIOS extended space

000F0000-000FFFFF 64 KB System BIOS base segment

0x20000000 00100000-7FFFFFFF 2 GB – 1 MB System memory (Low DRAM)

0x20000000-0x20001000 4KB Minimum mapping for chipset LPE device

80000000-FFF00000 2 GB – 1 MB PCI memory, other extensions (Low MMIO)

FEC00000-FEC00040 64 Bytes IOxAPIC

FED00000-FED003FF 1 KB HPET (Timer)

FED1C000-FED1CFFF 4KB Chipset internal register space

FED40000-FED4B000 44 KB TPM hard coded memory

FFFF0000-FFFFFFFF 64 KB Mapping space for BIOS ROM/Boot vector

100000000-17FFFFFFF 2 GB System memory (High DRAM)

180000000-F00000000 58 GB High MMIO

44

COMe-cBT6 / System Resources

5.3 I/O Address Map

The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for
compatibility reasons, even if available.

I/O Address Usage

0000-000F DMA-Controller Master (8237)

0020-0021
024-025
028-029
02C-02D
030-031
034-035
038-039
03C-03D

Interrupt-Controller Master (8259)

002E-002F External SuperI/O

040-043
050-053

Programmable Interrupt Timer (8253)

04E-04F TPM

060, 064 KBD Interface-Controller (8042)

061, 063, 065, 067 NMI Controller

070-071 RTC CMOS / NMI mask

072-073 RTC Extended CMOS

080-083 Debug port

0A0-0A1
0A4-0A5
0A8-0A9
0AC-0AD
0B0-0B1
0B4-0B5
0B8-0B9
0BC-0BD

Interrupt-Controller Slave (8259)

0B2-0B3 APM control

279 ISA PnP

295-296 External Hardware monitor, optionally used by external SuperIO if present

2E8-2EF Serial por t COM4 (SIO COM2)

2F8-2FF Serial port COM2 (onboard COM2)

370-377 Floppy disk controller, optionally used by external SuperIO if present (370h to 371h)

378-37F Parallel port LPT 1, optionally used by external SuperIO if present

3C0-3CF VGA/EGA

3E8-3EF Serial por t COM3 (SIO COM1)

3F8-3FF Serial Port COM1 (onboard COM1)

400-4FF Chipset internal register I/O area

4D0-4D1 Interrupt-Controller (Slave)

500-5FF Chipset internal register I/O area

A80-A81 Kontron CPLD control port

CF8 PCI configuration address

CF9 Reset control

CFC-CFF PCI configuration data

45

COMe-cBT6 / System Resources

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a
specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

Device Bus/Device/Function VID/DID default Comment

Transaction Router (former host bridge) 0/0/0 8086h/0F00h -

Graphics & display 0/2/0 8086h/0F31h -

Camera image signal processor 0/3/0 8086h/0F38h Not used

eMMC 0/16/0 8086h/0F14h -

SDIO 0/17/0 8086h/0F15h Not used

SD 0/18/0 8086h/0F16h -

SATA 0/19/0 8086h/0F23h -

xHCI 0/20/0 8086h/8C31h -

Low-power Audio 0/21/0 8086h/0F28h -

I2S port 0 0/21/1 - -

I2S port 1 0/21/2 - -

I2S port 2 0/21/3 - -

USB3.0 device 0/22/0 8086h -

SIO I2C DMA Configuration 0/24/0 8086h/0F40h -

I2C1 Configuration 0/24/1 8086h/0F41h -

I2C2 Configuration 0/24/2 8086h/0F42h -

I2C3 Configuration 0/24/3 8086h/0F43h -

I2C4 Configuration 0/24/4 8086h/0F44h -

I2C5 Configuration 0/24/5 8086h/0F45h -

I2C6 Configuration 0/24/6 8086h/0F46h -

I2C7 Configuration 0/24/7 8086h/0F47h -

Trusted Execution engine 0/26/0 8086h/0F18h -

HD Audio 0/27/0 8086h/0F04h -

PCIExpress Root port 0 0/28/0 8086h -

PCIExpress Root port 1 0/28/1 - -

PCIExpress Root port 2 0/28/2 - -

PCIExpress Root port 3 0/28/3 - -

EHCI 0/29/0 8086h/0F34h -

SerialIO HSUART / PWM / SPI DMA 0/30/0 8086h/0F06h -

PWM Port 1 0/30/1 8086h -

PWM Port 2 0/30/2 8086h -

HSUART1 0/30/3 8086h/0F0Ah -

HSUART2 0/30/4 8086h/0F0Ch -

SPI 0/30/5 8086h/0F0Eh -

PCU LPC 0/31/0 8086h/0F1Ch -

5.5 LPC addresses

I/O address Device

2Eh/2Fh external SuperI/O Winbond/Nuvoton 83627

4Eh/4Fh TPM

0A80h/0A81h CPLD

5.6 I2C Bus

8-bit Address 7-bit Address Device Bus

58h 0x2C S5eco resistor internal

5Ah 0x2D USB HSIC Hub internal

C0h 0x60 DP2LVDS bridge internal

A0h 0x50 LVDS EEPROM internal

A0h 0x50 Module / JIDA EEPROM external

AEh 0x57 Carrier EEPROM external

46

COMe-cBT6 / System Resources

5.7 System Management (SM) Bus

8-bit Address 7-bit Address Device Bus

10h 0x08 HSIC internal

30h 0x18 DDR3L 0 Thermal sensor option internal

32h 0x19 DDR3L 1 Thermal sensor option internal

5Ah 0x2D onboard HWMonitor internal

A0h 0x50 DDR3L SPD 0 internal

A2h 0x51 DDR3L SPD 1 internal

C8h 0x64 Ethernet internal

12h 0x09 SMART_CHARGER external

14h 0x0A SMART_SELECTOR external

16h 0x0B SMART_BATTERY external

58h 0x2C SIO HWMonitor external

Do not use any reserved addresses mentioned above for other devices

47

COMe-cBT6 / Pinout List

6 Pinout List

6.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

OA

Output Analog

OD

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

PU

Pull-Up Resistor

PD

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current the enclosure of the peripheral
device fulfills the fire-protection requirements of IEC/EN60950

48

COMe-cBT6 / Pinout List

6.2 Connector X1A Row A

Pin Signal Description Type Termination Comment

A1 GND Power Ground PWR GND - -

A2 GBE0_MDI3- Ethernet Media Dependent Interface 3 - DP-I/O - -

A3 GBE0_MDI3+ Ethernet Media Dependent Interf ace 3 + DP-I/O - -

A4 GBE0_LINK100# Ethernet Speed LED OD - -

A5 GBE0_LINK1000# Ethernet Speed LED OD - -

A6 GBE0_MDI2- Ethernet Media Dependent Interface 2 - DP-I/O - -

A7 GBE0_MDI2+ Ethernet Media Dependent Interf ace 2 + DP-I/O - -

A8 GBE0_LINK# LAN Link LED OD - -

A9 GBE0_MDI1- Ethernet Media Dependent Interface 1 - DP-I/O - -

A10 GBE0_MDI1+ Ethernet Media Dependent Interface 1 + DP-I/O - -

A11 GND Power Ground PWR GND - -

A12 GBE0_MDI0- Ethernet Media Dependent Interf ace 0 - DP-I/O - -

A13 GBE0_MDI0+ Ethernet Media Dependent Interface 0 + DP-I/O - -

A14 GBE0_CTREF Center Tab Reference Voltage O - 100nF capacitor to GND

A15 SUS_S3# Suspend To RAM (or deeper) Indicator O-3.3 PD 10k -

A16 SATA0_TX+ SATA Transmit Pair 0 + DP-O - -

A17 SATA0_TX- SATA Transmit Pair 0 - DP-O - -

A18 SUS_S4# Suspend To Disk (or deeper) Indicator O-3.3 - -

A19 SATA0_RX+ SATA Receive Pair 0 + DP-I - -

A20 SATA0_RX- SATA Receive Pair 0 - DP-I - -

A21 GND Power Ground PWR GND - -

A22 SATA2_TX+ USB 3.0 Receive Pair 0 - DP-I - -

A23 SATA2_TX- USB 3.0 Receive Pair 0 + DP-I - -

A24 SUS_S5# Soft Off Indicator O-3.3 - -

A25 SATA2_RX+ USB 3.0 Receive Pair 1 - DP-I - -

A26 SATA2_RX- USB 3.0 Receive Pair 1 + DP-I - -

A27 BATLOW# Battery Low I-3.3 PU 10k 3.3V (S5) assertion will prevent wake from S3-S5 state

A28 ATA_ACT# Ser ial ATA activity LED OD-3.3 PU 10k 3.3V (S0) can sink 15mA

A29 HDA_SYNC HD Audio Sync O-3.3 PD 20k in CPU -

A30 HDA_RST# HD Audio Reset O-3.3 PD 20k in CPU -

A31 GND Power Ground PWR GND - -

A32 HDA_CLK HD Audio Bit Clock Output O-3.3 PD 20k in CPU -

A33 HDA_SDOUT HD Audio Ser ial Data Out O-3.3 PD 20k in CPU -

A34 BIOS_DIS0# BIOS Selection Strap 0 I-3.3 PU 10k 3.3V (S0) -

A35 THRMTRIP# Thermal Trip O-3.3 PU 10k 3.3V (S0) do not use as this signal does not differ between regular

and over-temperature shutdown

A36 USB6- USB 2.0 Data Pair Port 6 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A37 USB6+ USB 2.0 Data Pair Por t 6 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A38 USB_6_7_OC# USB Overcurrent Indicator Port 6/7 I-3.3 PU 10k 3.3V (S5) -

A39 USB4- USB 2.0 Data Pair Port 4 - DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A40 USB4+ USB 2.0 Data Pair Por t 4 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A41 GND Power Ground PWR GND - -

A42 USB2- USB 2.0 Data Pair Port 2 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A43 USB2+ USB 2.0 Data Pair Por t 2 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A44 USB_2_3_OC# USB Overcurrent Indicator Port 2/3 I-3.3 PU 15k in CPLD (S5) resistor value can range from 5kOhm to 25kOhm

A45 USB0- USB 2.0 Data Pair Port 0 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A46 USB0+ USB 2.0 Data Pair Por t 0 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

A47 VCC_RTC Real-Time Clock Circuit Power Input PWR 3V - voltage range 2.8-3.47V

A48 EXCD0_PERST# Express Card Reset Port 0 O-3.3 - -

A49 EXCD0_CPPE# Express Card Capable Card Request Port 0 I-3.3 PU 10k 3.3V (S0) -

A50 LPC_SERIRQ Serial Interrupt Request I/OD-3.3 PU 20k in CPU -

A51 GND Power Ground PWR GND - -

A52 PCIE_TX5+ Not Connected nc - -

A53 PCIE_TX5- Not Connected nc - -

A54 GPI0 General Purpose Input 0 I-3.3 PU 100k 3.3V (S0) -

A55 PCIE_TX4+ Not Connected nc - -

A56 PCIE_TX4- Not Connected nc - -

A57 GND Power Ground PWR GND - -

49

COMe-cBT6 / Pinout List

A58 PCIE_TX3+ PCI Express Lane 3 Transmit + DP-O - only available on no-LAN var.

A59 PCIE_TX3- PCI Express Lane 3 Transmit - DP-O - only available on no-LAN var.

A60 GND Power Ground PWR GND - -

A61 PCIE_TX2+ PCI Express Lane 2 Transmit + DP-O - -

A62 PCIE_TX2- PCI Express Lane 2 Transmit - DP-O - -

A63 GPI1 General Purpose Input 1 I-3.3 PU 100k 3.3V (S0) -

A64 PCIE_TX1+ PCI Express Lane 1 Transmit + DP-O - -

A65 PCIE_TX1- PCI Express Lane 1 Transmit - DP-O - -

A66 GND Power Ground PWR GND - -

A67 GPI2 General Purpose Input 2 I-3.3 PU 100k 3.3V (S0) -

A68 PCIE_TX0+ PCI Express Lane 0 Transmit + DP-O - -

A69 PCIE_TX0- PCI Express Lane 0 Transmit - DP-O - -

A70 GND Power Ground PWR GND - -

A71 LVDS_A0+ LVDS Channel A DAT0+ DP-O - -

A72 LVDS_A0- LVDS Channel A DAT0- DP-O - -

A73 LVDS_A1+ LVDS Channel A DAT1+ DP-O - -

A74 LVDS_A1- LVDS Channel A DAT1- DP-O - -

A75 LVDS_A2+ LVDS Channel A DAT2+ DP-O - -

A76 LVDS_A2- LVDS Channel A DAT2- DP-O - -

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 PD 100k -

A78 LVDS_A3+ LVDS Channel A DAT3+ DP-O - -

A79 LVDS_A3- LVDS Channel A DAT3+ DP-O - -

A80 GND Power Ground PWR GND - -

A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O - 20-80MHz

A82 LVDS_A_CK- LVDS Channel A Clock- DP-O - 20-80MHz

A83 LVDS_I2C_CK LVDS I2C Clock (DDC) IO-3.3 PU 2k21 3.3V (S0) -

A84 LVDS_I2C_DAT LVDS I2C Data (DDC) IO-3.3 PU 2k21 3.3V (S0) -

A85 GPI3 General Purpose Input 3 I/O-3.3 PU 100k 3.3V (S0) -

A86 RSVD Reserved for future use nc - -

A87 RSVD Reserved for future use nc - -

A88 PCIE0_CK_REF+ Reference PCI Express Clock + DP-O - 100MHz

A89 PCIE0_CK_REF- Reference PCI Express Clock - DP-O - 100MHz

A90 GND Power Ground PWR GND - -

A91 SPI_POWER 3.3V Power Output Pin for external SPI flash O-3.3 - 100mA (max.)

A92 SPI_MISO SPI Master IN Slave OUT I-3.3 PD 20k in CPU (SPI) All SPI signals are tri-stated with 20k ohm CPU internal

weak pull-up until reset is deasserted

A93 GPO0 General Purpose Output 0 O-3.3 PD 100k -

A94 SPI_CLK SPI Clock O-3.3 PD 20k in CPU (SPI) All SPI signals are tri-stated with 20k ohm CPU internal

weak pull-up until reset is deasserted

A95 SPI_MOSI SPI Master Out Slave In O-3.3 PD 20k in CPU (SPI) All SPI signals are tri-stated with 20k ohm CPU internal

weak pull-up until reset is deasserted

A96 TPM_PP TPM Physical Presence nc - TPM_PP not supported by used TPM

A97 TYPE10# Indicates TYPE10# to carrier board nc - -

A98 SER0_TX Serial Port 0 TXD O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

A99 SER0_RX Serial Por t 0 RXD I-5T PU 47k 3.3V (S0) 20V protection circuit implemented on module

A100 GND Power Ground PWR GND - -

A101 SER1_TX Serial Port 1 TXD O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

A102 SER1_RX Serial Port 1 RXD I-5T PU 47k 3.3V (S0) 20V protection circuit implemented on module

A103 LID# LID Switch Input I-3.3 PU 47k 3.3V (S5) 20V protection circuit implemented on module

A104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A110 GND Power Ground PWR GND - -

50

COMe-cBT6 / Pinout List

6.3 Connector X1A Row B

Pin Signal Descr iption Type Termination Comment

B1 GND Power Ground PWR GND - -

B2 GBE0_ACT# Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 PU 20k in CPU (S0) -

B4 LPC_AD0 LPC Multiplexed Command, Address & Data 0 I/O-3.3 PU 20k in CPU (S0) -

B5 LPC_AD1 LPC Multiplexed Command, Address & Data 1 I/O-3.3 PU 20k in CPU (S0) -

B6 LPC_AD2 LPC Multiplexed Command, Address & Data 2 I/O-3.3 PU 20k in CPU (S0) -

B7 LPC_AD3 LPC Multiplexed Command, Address & Data 3 I/O-3.3 PU 20k in CPU (S0) -

B8 LPC_DRQ0# LPC Serial DMA/Master Request 0 I-3.3 PU 15k in CPLD (S5) resistor value can range from 5kOhm to 25kOhm

B9 LPC_DRQ1# LPC Serial DMA/Master Request 1 I-3.3 PU 15k in CPLD (S5) resistor value can range from 5kOhm to 25kOhm

B10 LPC_CLK 33MHz LPC clock O-3.3 PD 20k in CPU 33MHz at E38xx CPUs and 25MHz at other CPUs

B11 GND Power Ground PWR GND - -

B12 PWRBTN# Power Button I-3.3 PU 10k 3.3V (S5eco) -

B13 SMB_CLK SMBUS Clock O-3.3 PU 2k9 3.3V (S5) -

B14 SMB_DAT SMBUS Data I/O-3.3 PU 2k9 3.3V (S5) -

B15 SMB_ALERT# SMBUS Aler t I/O-3.3 PU 10k 3.3V (S5) -

B16 SATA1_TX+ SATA 1 Transmit Pair + DP-O - -

B17 SATA1_TX- SATA 1 Transmit Pair - DP-O - -

B18 SUS_STAT# Suspend Status O-3.3 - -

B19 SATA1_RX+ SATA 1 Receive Pair + DP-I - -

B20 SATA1_RX- SATA 1 Receive Pair - DP-I - -

B21 GND Power Ground PWR GND - -

B22 SATA3_TX+ Not Connected nc - -

B23 SATA3_TX- Not Connected nc - -

B24 PWR_OK Power OK I-5T PU 61k 3.3V pullup voltage is S0 in ATX mode/ S5 in single supply

mode / 5V tolerant

B25 SATA3_RX+ Not Connected nc - -

B26 SATA3_RX- Not Connected nc - -

B27 WDT Watch Dog Time-Out event O-3.3 - -

B28 HDA_SDIN2 Not Connected nc - not supported

B29 HDA_SDIN1 Audio Codec Serial Data in 1 I-3.3 PD 20k in CPU -

B30 HDA_SDIN0 Audio Codec Serial Data in 0 I-3.3 PD 20k in CPU -

B31 GND Power Ground PWR GND - -

B32 SPKR Speaker O-3.3 PU 20k in CPU (S0) -

B33 I2C_CK I2C Clock O-3.3 PU 2k21 3.3V (S5) -

B34 I2C_DAT I2C Data I/O-3.3 PU 2k21 3.3V (S5) -

B35 THRM# Over Temperature Input I-3.3 PU 10k 3.3V (S0) no function implemented

B36 USB7- USB 2.0 Data Pair Port 7 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B37 USB7+ USB 2.0 Data Pair Port 7 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B38 USB_4_5_OC# USB Overcurrent Indicator Port 4/5 I-3.3 PU 10k 3.3V (S5) -

B39 USB5- USB 2.0 Data Pair Port 5 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B40 USB5+ USB 2.0 Data Pair Port 5 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B41 GND Power Ground PWR GND - -

B42 USB3- USB 2.0 Data Pair Port 3 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B43 USB3+ USB 2.0 Data Pair Port 3 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B44 USB_0_1_OC# USB Overcurrent Indicator Port 0/1 I-3.3 PU 15k in CPLD (S5) resistor value can range from 5kOhm to 25kOhm

B45 USB1- USB 2.0 Data Pair Port 1 – DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B46 USB1+ USB 2.0 Data Pair Port 1 + DP-I/O PD/PU in CPU PD 15kOhm +/-5% on Downstream Facing Port; PU

1.5kOhm +/-5% on Upstream Facing Port

B47 EXCD1_PERST# Express Card Reset Port 1 O-3.3 - -

B48 EXCD1_CPPE# Express Card Capable Card Request Port 1 I-3.3 PU 10k 3.3V (S0) -

B49 SYS_RESET# Reset Button Input I-3.3 PU 10k 3.3V (S5) -

B50 CB_RESET# Carrier Board Reset O-3.3 -

B51 GND Power Ground PWR GND - -

B52 PCIE_RX5+ Not Connected nc - -

B53 PCIE_RX5- Not Connected nc - -

B54 GPO1 General Purpose Output 1 O-3.3 PD 100k -

B55 PCIE_RX4+ Not Connected nc - -

B56 PCIE_RX4- Not Connected nc - -

B57 GPO2 General Purpose Output 2 O-3.3 PD 100k -

51

COMe-cBT6 / Pinout List

B58 PCIE_RX3+ PCI Express Lane 3 Receive + DP-I - only available on no-LAN var.

B59 PCIE_RX3- PCI Express Lane 3 Receive - DP-I - only available on no-LAN var.

B60 GND Power Ground PWR GND - -

B61 PCIE_RX2+ PCI Express Lane 2 Receive + DP-I - -

B62 PCIE_RX2- PCI Express Lane 2 Receive - DP-I - -

B63 GPO3 General Purpose Output 3 O-3.3 PD 100k -

B64 PCIE_RX1+ PCI Express Lane 1 Receive + DP-I - -

B65 PCIE_RX1- PCI Express Lane 1 Receive - DP-I - -

B66 WAKE0# PCI Express Wake Event I-3.3 PU 10k 3.3V (S5) -

B67 WAKE1# General Purpose Wake Event I-3.3 PU 10k 3.3V (S5) -

B68 PCIE_RX0+ PCI Express Lane 0 Receive + DP-I - -

B69 PCIE_RX0- PCI Express Lane 0 Receive - DP-I - -

B70 GND Power Ground PWR GND - -

B71 LVDS_B0+ LVDS Channel B DAT0+ DP-O - -

B72 LVDS_B0- LVDS Channel B DAT0- DP-O - -

B73 LVDS_B1+ LVDS Channel B DAT1+ DP-O - -

B74 LVDS_B1- LVDS Channel B DAT1- DP-O - -

B75 LVDS_B2+ LVDS Channel B DAT2+ DP-O - -

B76 LVDS_B2- LVDS Channel B DAT2- DP-O - -

B77 LVDS_B3+ LVDS Channel B DAT3+ DP-O - -

B78 LVDS_B3- LVDS Channel B DAT3- DP-O - -

B79 LVDS_BKLT_EN Panel Backlight On O-3.3 PD 100k -

B80 GND Power Ground PWR GND - -

B81 LVDS_B_CK+ LVDS Channel B Clock+ DP-O - -

B82 LVDS_B_CK- LVDS Channel B Clock- DP-O - -

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B85 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B86 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B87 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B88 BIOS_DIS1# BIOS Selection Strap 1 I-3.3 PU 10k 3.3V (SPI) PU might be powered during suspend

B89 CRT_RED CRT_RED / Analog Video RGB-RED OA PD 150R -

B90 GND Power Ground PWR GND - -

B91 CRT_GREEN CRT_GREEN / Analog Video RGB-GREEN OA PD 150R -

B92 CRT_BLUE CRT_BLUE / Analog Video RGB-BLUE OA PD 150R -

B93 CRT_HSYNC CRT_HSYNC / Analog Video H-Sync O-3.3 - -

B94 CRT_VSYNC CRT_VSYNC / Analog Video V-Sync O-3.3 - -

B95 CRT_DDC_CLK CRT_DDC_CLK / Display Data Channel Clock I/O-5 PU 2k21 5.0V_S0 -

B96 CRT_DDC_DATA CRT_DDC_DATA / Display Data Channel Data I/O-5 PU 2k21 5.0V_S0 -

B97 SPI_CS# SPI Chip Select O-3.3 - -

B98 RSVD Reserved for future use nc - -

B99 RSVD Reserved for future use nc - -

B100 GND Power Ground PWR GND - -

B101 FAN_PWMOUT Fan PWM Output O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

B102 FAN_TACHIN Fan Tach Input I-3.3 PU 47k 3.3V (S0) 20V protection circuit implemented on module

B103 SLEEP# Sleep Button Input I-3.3 PU 47k 3.3V (S5) 20V protection circuit implemented on module

B104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B110 GND Power Ground PWR GND - -

52

COMe-cBT6 / Pinout List

6.4 Connector X1B Row C

Pin Signal Description Type Termination Comment

C1 GND Power Ground PWR GND - -

C2 GND Power Ground PWR GND - -

C3 USB_SSRX0- USB Super Speed Receive - (0) DP-I - -

C4 USB_SSRX0+ USB Super Speed Receive + (0) DP-I - -

C5 GND Power Ground PWR GND - -

C6 USB_SSRX1- Not Connected nc - -

C7 USB_SSRX1+ Not Connected nc - -

C8 GND Power Ground PWR GND - -

C9 USB_SSRX2- Not Connected nc - -

C10 USB_SSRX2+ Not Connected nc - -

C11 GND Power Ground PWR GND - -

C12 USB_SSRX3- Not Connected nc - -

C13 USB_SSRX3+ Not Connected nc - -

C14 GND Power Ground PWR GND - -

C15 DDI1_PAIR6+ Not Connected nc - -

C16 DDI1_PAIR6- Not Connected nc - -

C17 RSVD Reserved for future use nc - -

C18 RSVD Reserved for future use nc - -

C19 PCIE_RX6+ Not Connected nc - -

C20 PCIE_RX6- Not Connected nc - -

C21 GND Power Ground PWR GND - -

C22 PCIE_RX7+ Not Connected nc - -

C23 PCIE_RX7- Not Connected nc - -

C24 DDI1_HPD DDI1 Hotplug Detect I-3.3 PD 100k -

C25 DDI1_PAIR4+ Not Connected nc - -

C26 DDI1_PAIR4- Not Connected nc - -

C27 RSVD Reserved for future use nc - -

C28 RSVD Reserved for future use nc - -

C29 DDI1_PAIR5+ Not Connected nc - -

C30 DDI1_PAIR5- Not Connected nc - -

C31 GND Power Ground PWR GND - -

C32 DDI2_CTRLCLK_AUX+ DDI2 CTRLCLK/AUX+ I/O-3.3 PD 100k -

C33 DDI2_CTRLDATA_AUX- DDI2 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3V (S0) -

C34 DDI2_DDC_AUX_SEL DDI2 DDC/AUX select I-3.3 PD 1M -

C35 RSVD Reserved for future use nc - -

C36 DDI3_CTRLCLK_AUX+ Not Connected nc - -

C37 DDI3_CTRLDATA_AUX- Not Connected nc - -

C38 DDI3_DDC_AUX_SEL Not Connected nc - -

C39 DDI3_PAIR0+ Not Connected nc - -

C40 DDI3_PAIR0- Not Connected nc - -

C41 GND Power Ground PWR GND - -

C42 DDI3_PAIR1+ Not Connected nc - -

C43 DDI3_PAIR1- Not Connected nc - -

C44 DDI3_HPD Not Connected nc - -

C45 RSVD Reserved for future use nc - -

C46 DDI3_PAIR2+ Not Connected nc - -

C47 DDI3_PAIR2- Not Connected nc - -

C48 RSVD Reserved for future use nc - -

C49 DDI3_PAIR3+ Not Connected nc - -

C50 DDI3_PAIR3- Not Connected nc - -

C51 GND Power Ground PWR GND - -

C52 PEG_RX0+ Not Connected nc - -

C53 PEG_RX0- Not Connected nc - -

C54 TYPE0# n.c. for type 6 module nc - -

C55 PEG_RX1+ Not Connected nc - -

C56 PEG_RX1- Not Connected nc - -

C57 TYPE1# n.c. for type 6 module nc - -

C58 PEG_RX2+ Not Connected nc - -

C59 PEG_RX2- Not Connected nc - -

C60 GND Power Ground PWR GND - -

C61 PEG_RX3+ Not Connected nc - -

C62 PEG_RX3- Not Connected nc - -

C63 RSVD Reserved for future use nc - -

C64 RSVD Reserved for future use nc - -

53

COMe-cBT6 / Pinout List

C65 PEG_RX4+ Not Connected nc - -

C66 PEG_RX4- Not Connected nc - -

C67 RSVD Reserved for future use nc - -

C68 PEG_RX5+ Not Connected nc - -

C69 PEG_RX5- Not Connected nc - -

C70 GND Power Ground PWR GND - -

C71 PEG_RX6+ Not Connected nc - -

C72 PEG_RX6- Not Connected nc - -

C73 GND Power Ground PWR GND - -

C74 PEG_RX7+ Not Connected nc - -

C75 PEG_RX7- Not Connected nc - -

C76 GND Power Ground PWR GND - -

C77 RSVD Reserved for future use nc - -

C78 PEG_RX8+ Not Connected nc - -

C79 PEG_RX8- Not Connected nc - -

C80 GND Power Ground PWR GND - -

C81 PEG_RX9+ Not Connected nc - -

C82 PEG_RX9- Not Connected nc - -

C83 RSVD Reserved for future use nc - -

C84 GND Power Ground PWR GND - -

C85 PEG_RX10+ Not Connected nc - -

C86 PEG_RX10- Not Connected nc - -

C87 GND Power Ground PWR GND - -

C88 PEG_RX11+ Not Connected nc - -

C89 PEG_RX11- Not Connected nc - -

C90 GND Power Ground PWR GND - -

C91 PEG_RX12+ Not Connected nc - -

C92 PEG_RX12- Not Connected nc - -

C93 GND Power Ground PWR GND - -

C94 PEG_RX13+ Not Connected nc - -

C95 PEG_RX13- Not Connected nc - -

C96 GND Power Ground PWR GND - -

C97 RSVD Reserved for future use nc - -

C98 PEG_RX14+ Not Connected nc - -

C99 PEG_RX14- Not Connected nc - -

C100 GND Power Ground PWR GND - -

C101 PEG_RX15+ Not Connected nc - -

C102 PEG_RX15- Not Connected nc - -

C103 GND Power Ground PWR GND - -

C104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C110 GND Power Ground PWR GND - -

54

COMe-cBT6 / Pinout List

6.5 Connector X1B Row D

Pin Signal Description Type Termination Comment

D1 GND Power Ground PWR GND - -

D2 GND Power Ground PWR GND - -

D3 USB_SSTX0- USB Super Speed Transmit - (0) DP-O - -

D4 USB_SSTX0+ USB Super Speed Transmit + (0) DP-O - -

D5 GND Power Ground PWR GND - -

D6 USB_SSTX1- Not Connected nc - -

D7 USB_SSTX1+ Not Connected nc - -

D8 GND Power Ground PWR GND - -

D9 USB_SSTX2- Not Connected nc - -

D10 USB_SSTX2+ Not Connected nc - -

D11 GND Power Ground PWR GND - -

D12 USB_SSTX3- Not Connected nc - -

D13 USB_SSTX3+ Not Connected nc - -

D14 GND Power Ground PWR GND - -

D15 DDI1_CTRLCLK_AUX+ DDI1 CTRLCLK/AUX+ I/O-3.3 PD 100k -

D16 DDI1_CTRLDATA_AUX- DDI1 CTRLDATA/AUX- I/O-3.3 PU 100k 3.3V (S0) -

D17 RSVD Reserved for future use nc - -

D18 RSVD Reserved for future use nc - -

D19 PCIE_TX6+ Not Connected nc - -

D20 PCIE_TX6- Not Connected nc - -

D21 GND Power Ground PWR GND - -

D22 PCIE_TX7+ Not Connected nc - -

D23 PCIE_TX7- Not Connected nc - -

D24 RSVD Reserved for future use nc - -

D25 RSVD Reserved for future use nc - -

D26 DDI1_PAIR0+ DDI1 Pair 0 + DP-O - -

D27 DDI1_PAIR0- DDI1 Pair 0 - DP-O - -

D28 RSVD Reserved for future use nc - -

D29 DDI1_PAIR1+ DDI1 Pair 1 + DP-O - -

D30 DDI1_PAIR1- DDI1 Pair 1 - DP-O - -

D31 GND Power Ground PWR GND - -

D32 DDI1_PAIR2+ DDI1 Pair 2 + DP-O - -

D33 DDI1_PAIR2- DDI1 Pair 2 - DP-O - -

D34 DDI1_DDC_AUX_SEL DDI1 DDC/AUX select I-3,3 PD 1M -

D35 RSVD Reserved for future use nc - -

D36 DDI1_PAIR3+ DDI1 Pair 3 + DP-O - -

D37 DDI1_PAIR3- DDI1 Pair 3 - DP-O - -

D38 RSVD Reserved for future use nc - -

D39 DDI2_PAIR0+ DDI2 Pair 0 + DP-O - -

D40 DDI2_PAIR0- DDI2 Pair 0 - DP-O - -

D41 GND Power Ground PWR GND - -

D42 DDI2_PAIR1+ DDI2 Pair 1 + DP-O - -

D43 DDI2_PAIR1- DDI2 Pair 1 - DP-O - -

D44 DDI2_HPD DDI2 Hotplug Detect I-3,3 PD 100k -

D45 RSVD Reserved for future use nc - -

D46 DDI2_PAIR2+ DDI2 Pair 2 + DP-O - -

D47 DDI2_PAIR2- DDI2 Pair 2 - DP-O - -

D48 RSVD Reserved for future use nc - -

D49 DDI2_PAIR3+ DDI2 Pair 3 + DP-O - -

D50 DDI2_PAIR3- DDI2 Pair 3 - DP-O - -

D51 GND Power Ground PWR GND - -

D52 PEG_TX0+ Not Connected nc - -

D53 PEG_TX0- Not Connected nc - -

D54 PEG_LANE_RV# Not Connected nc - -

D55 PEG_TX1+ Not Connected nc - -

D56 PEG_TX1- Not Connected nc - -

D57 TYPE2# GND for type 6 module PWR - -

D58 PEG_TX2+ Not Connected nc - -

D59 PEG_TX2- Not Connected nc - -

D60 GND Power Ground PWR GND - -

D61 PEG_TX3+ Not Connected nc - -

D62 PEG_TX3- Not Connected nc - -

D63 RSVD Reserved for future use nc - -

D64 RSVD Reserved for future use nc - -

55

COMe-cBT6 / Pinout List

D65 PEG_TX4+ Not Connected nc - -

D66 PEG_TX4- Not Connected nc - -

D67 GND Power Ground PWR GND - -

D68 PEG_TX5+ Not Connected nc - -

D69 PEG_TX5- Not Connected nc - -

D70 GND Power Ground PWR GND - -

D71 PEG_TX6+ Not Connected nc - -

D72 PEG_TX6- Not Connected nc - -

D73 GND Power Ground PWR GND - -

D74 PEG_TX7+ Not Connected nc - -

D75 PEG_TX7- Not Connected nc - -

D76 GND Power Ground PWR GND - -

D77 RSVD Reserved for future use nc - -

D78 PEG_TX8+ Not Connected nc - -

D79 PEG_TX8- Not Connected nc - -

D80 GND Power Ground PWR GND - -

D81 PEG_TX9+ Not Connected nc - -

D82 PEG_TX9- Not Connected nc - -

D83 RSVD Reserved for future use nc - -

D84 GND Power Ground PWR GND - -

D85 PEG_TX10+ Not Connected nc - -

D86 PEG_TX10- Not Connected nc - -

D87 GND Power Ground PWR GND - -

D88 PEG_TX11+ Not Connected nc - -

D89 PEG_TX11- Not Connected nc - -

D90 GND Power Ground PWR GND - -

D91 PEG_TX12+ Not Connected nc - -

D92 PEG_TX12- Not Connected nc - -

D93 GND Power Ground PWR GND - -

D94 PEG_TX13+ Not Connected nc - -

D95 PEG_TX13- Not Connected nc - -

D96 GND Power Ground PWR GND - -

D97 RSVD Reserved for future use nc - -

D98 PEG_TX14+ Not Connected nc - -

D99 PEG_TX14- Not Connected nc - -

D100 GND Power Ground PWR GND - -

D101 PEG_TX15+ Not Connected nc - -

D102 PEG_TX15- Not Connected nc - -

D103 GND Power Ground PWR GND - -

D104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D110 GND Power Ground PWR GND - -

The termination resistors in these tables are already mounted on the module. Refer to the
design guide for information about additional termination resistors.

56

COMe-cBT6 / BIOS Operation

7 BIOS Operation

The BIOS (Basic Input and Output System) or UEFI (Unified Extensible Firmware Interface) records hardware parameters
of the system in the CMOS on the Computer-on-Module. It's major functions include execution of the POST(Power-On-Self­Test) during system start-up, saving system parameters and loading the operating system. The BIOS includes a BIOS
Setup programm that allows to modify system configuration settings. The module is equipped with Phoenix SecureCore,
which is located in an onboard SPI serial flash memory.

7.1 Determining the BIOS Version

To determine the BIOS version currently used on the Computer-on-Modules please check System Information Page inside
Setup

7.2 BIOS Update

Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with detailed change descriptions within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file
size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the
BIOS Region (usually 4-16MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a
wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch
file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

57

COMe-cBT6 / BIOS Operation

7.3 POST Codes

Important POST codes during boot-up

8B

Booted to DOS

68

Booted to Setup / EFI Shell

00

Booted to Windows

7.4 Setup Guide

The Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of
menus to make changes and turn features on or off.

Functional keystrokes in POST:

[F2]

Enter Setup

[F5]

Boot Menu

[ESC] + [2]

Enter Setup via Remote Keyboard in Console Redirection Mode (depending on console Settings F2 may not be supported)

Functional keystrokes in Setup:

[F1]

Help

[F9]

Load default settings

[F10]

Save and Exit

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below
describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select fields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- or F5/F6 Change Option

<Enter> Execute command or select submenu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓
Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the
cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press
<Esc> to exit the General Help window.

58

COMe-cBT6 / BIOS Operation

7.5 BIOS Setup

7.5.1 Main

Feature Options Description

System Date [mm/dd/yyyy] Set the Date. Use 'Tab' to switch between Date

elements

System Time [hh:mm:ss] Set the Time. Use 'Tab' to switch between Time

elements

59

COMe-cBT6 / BIOS Operation

System Information

60

COMe-cBT6 / BIOS Operation

Boot Features

Feature Options Description

NumLock

On
Off

Selects Power-on state for NumLock

Timeout

1

Number of seconds that P.O.S.T will wait for the user
input before booting

CSM Support

Yes
No

Enables or Disables the UEFI CSM (Compatibility
Support Module)to support legacy PC boot process.
Both legacy and UEFI boots are feasible

Quick Boot

Disabled
Enabled

Enable or Disable Quick Boot

Dark Boot

Disabled
Enabled

Enable or Disable Dark Boot

Diagnostic Splash Screen

Disabled
Enabled

Enable or Disable the Diagnostic Splash Screen

Diagnostic Summary Screen

Disabled
Enabled

Display the Diagnostic Summary Screen during boot

BIOS Level USB

Enabled
Disabled

Enable/Disable all BIOS support for USB in order to
reduce boot time. Note that this will prevent using a
USB keyboard in setup or a USB biometric scanner such
as a fingerprint reader to control access to setup, but
does not prevent the operating system from supporting
such hardware

USB Legacy

Enabled
Disabled

Enable/Disable USB BIOS SMM support for mouse,
keyboard, mass storage, etc, in legacy operating
systems such as DOS

Console Redirection

Disabled
Enabled

Enable/Disable Universal Console Redirection

- Console Port

All
Onboard COM1
Onboard COM2
SIO COM1
SIO COM2

Select Port for console redirection. Note: the respective
port has to be enabled in setup!

- Terminal Type

ANSI
VT100
VT100+
UTF8

Set terminal type of UCR

- Baudrate 9600
19200
38400
57600
115200

Set terminal type of UCR

- Flow Control

None

Set flow control method for UCR. None = No flow

61

COMe-cBT6 / BIOS Operation

RTS/CTS
XON/XOFF

control, RTS/CTS = Hardware flow control, XON/XOFF =
Software flow control

- Continue C.R. after POST

Enabled
Disabled

Enables Console Redirection after OS has loaded

Allow Hotkey in S4 resume

Enabled
Disabled

Enable hotkey detection when system resuming from
Hybernate state

UEFI Boot

Enabled
Disabled

Enable the UEFI boot

Legacy Boot

Enabled\Disabled

Enable the Legacy boot

Boot in Legacy Video Mode

Disabled
Enabled

Enable to force the display adapter to switch the video
mode to Text Mode 3 at the end of BIOS POST for non­UEFI boot mode (Legacy Boot). Some legacy software,
such as DUET, requires that the BIOS explicitly enter
text video mode prior to boot

Load OPROM

On Demand
All

Load all OPROMs or on demand according to the boot
device

Boot Priority

UEFI First
Legacy First

Select priority of boot option between UEFI and Legacy

62

COMe-cBT6 / BIOS Operation

Platform Information

63

COMe-cBT6 / BIOS Operation

7.5.2 Advanced

Feature Options Description

OS Selection

Windows
Linux
Android

Select the Operating System family to be booted

64

COMe-cBT6 / BIOS Operation

Miscellaneous

Feature Options Description

I2C Speed

100

Select I2C Bus Speed in kHz from 1kHz to 400kHz

S5 Eco

Disabled
Enabled

Enable/Disable Kontron S5 Eco mode. Reduces supply
current in Soft Of f (S5) to less than 1mA. If enabled,
power button is the only wake-up source in S5! See
chapter S5 Eco for further details

Smart Battery Conf iguration

Disabled
Auto
Charger
Manager

Enable/Disable Smart Battery Sys tem Support (e.g.
Kontron M.A.R.S.)

Reset Button Behavior

Chipset Reset
Power Cycle

Select the system behavior on reset button event

65

COMe-cBT6 / BIOS Operation

Watchdog

Feature Options Description

Auto-reload

Disabled
Enabled

Enable automatic reload of watchdog timers on timeout

Global Lock

Disabled
Enabled

If set to enabled, all Watchdog registers (except
WD_KICK) become read only until the board is reset

Stage 1 Mode

Disabled
Reset
NMI
SCI
Delay

Select Action for first Watchdog stage

- Assert WDT Signal

Enabled
Disabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 1 Timeout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for first watchdog stage

Stage 2 Mode

Disabled
Reset
NMI
SCI

Select Action for second Watchdog stage

- Assert WDT Signal

Disabled
Enabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 2 Timeout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for second watchdog stage

66

COMe-cBT6 / BIOS Operation

H/W Monitor

Feature Value/Options Description

CPU Temperature (Analog) xx°C Shows the measured temperature of the CPU Diode with

onboard HWM

CPU Temperature (DTS) xx°C Shows the internal digital CPU temperature (DTS)

Module Temperature xx°C Shows the internal hardware-monitor temperature

CPU FAN xxxx rpm Shows the fan speed of onboard FAN connector

Fan Pulse

2

Number of pulses the CPU fan produces during one
revolution. Range 1-4

FAN Control Disabled

Manual
Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

45

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

70

Manual fan speed in %. Minimum value is 30 (in Manual
mode only)

Trip Point Speed

50

Fan speed at trip point in %. Minimum value is 30. Fan
always runs at 100% at Tjmax - 10°C

Reference Temperature

CPU Temperature (Analog)
Module Temperature

Determines the temperature source which is used for
automatic fan control

External FAN xxxx rpm Shows the fan speed of external COMe FAN

Fan Pulse

2

Select the number of pulses the external fan produces
during one revolution. Range 1-4

FAN Control Disabled

Manual
Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

45

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

70

Manual fan speed in %. Minimum value is 30 (in Manual
mode only)

Trip Point Speed

50

Fan speed at trip point in %. Minimum value is 30. Fan

67

COMe-cBT6 / BIOS Operation

always runs at 100% at Tjmax - 10°C

Reference Temperature

CPU Temperature (Analog)
Module Temperature

Determines the temperature source which is used for
automatic fan control

Widerange Vcc x.xx V Shows the Module Main Input Voltage

5.0V Standby x.xx V Shows the 5V Standby Voltage input

Batt volt at COMe pin x.xx V Shows the RTC Battery Voltage input measured at COMe

connector

68

COMe-cBT6 / BIOS Operation

CPU Configuration

Feature Options Description

Execute Disable Bit

Enable
Disable

Execute Disable Bit prevent certain classes of malicious
buffer overf low attacks when combined with a
supporting OS

Limit CPUID Maximum Enable

Disable

Disabled for Windows XP

Bi-directional PROCHOT#

Enable
Disable

When a processor thermal sensor trips (either core), the
PROCHOT# will be driven. If bi-direction is enabled,
external agents can drive PROCHOT# to throttle the
processor

VTX-2

Enable
Disable

Enables or Disables the VT-x2 Mode support

TM1

Enable
Disable

Enables or Disables the Thermal Management 1 support

DTS

Enable
Disable

Enables or Disables the Digital Thermal Sensor

69

COMe-cBT6 / BIOS Operation

CPU Power Management

Feature Options Description

Intel® SpeedStep(TM)

Enabled
Disabled

Enable/Disable processor performance states (P­States)

Boot Performance Mode

Max Performance
Max Battery

Select the performance state that the BIOS sets before
OS hand-off

Intel® Turbo Boost Technology

Enabled
Disabled

Enable to automatically allow processor cores to run
faster then the base operating frequency if it's
operating below power, current, and temperature
specification limits. This option is only valid for CPUs
supporting Intel® Turbo Boost Technology

C-States

Enabled
Disabled

Enable processor idle power saving states

Enhanced C-States

Enabled
Disabled

Enables or Disables C1E/C2E/C4E. When enabled, CPU
will switch to minimum speed when all cores enter C­State

Max C-State

C7
C6
C1

Controls the maximum C-State allowed for the processor

70

COMe-cBT6 / BIOS Operation

Uncore Configuration

Feature Options Description

Integrated Graphics Device Disable

Enable

Enable: enable Integrated Graphics Device (IGD) when
selected as the Primary Video Adaptor. Disable: Always
disable IGD

Primary Display

Auto
IGD
PCIe
SG

Select which of IGD/PCIe Graphics Devices should be
Primary Display or select SG for Switchable/Hybr id
Graphics

RC6 (Render Standby) Disable

Enable

Enable or Disable Render Standby support

GTT Size 1MB

2MB

Select the GTT Memory Size of IGD

Aperture Size 128MB

256MB
512MB

Select the Graphics Aperture Size

DVMT Pre-Allocated

64M
96M
128M
160M
192M
224M
256M
288M
320M
352M
384M
416M
448M
480M
512M

Select DVMT 5.0 Pre-Allocated (fixed) Graphics Memory
size used by the Internal Graphics device

IGD Turbo

Auto
Enable
Disable

Select the IGD Turbo feature

Spread Spectrum clock

Disable
Enable

Enable or Disable clock chip Spread Spectrum feature

71

COMe-cBT6 / BIOS Operation

IGD - LCD Control

Feature Options Description

IGD - Boot Type

Auto
CRT
EFP
LFP
EFP2

Select the Integrated Graphics Video Device activated
during POST. LFP = Local Flat Panel (LVDS/eDP). EFP =
External Flat Panel (Display Port 1), EFP2 = External Flat
Panel 2 (Display Port 2)

IGD - Secondary Boot Type

Disabled
CRT
EFP
LFP
EFP2

Select Secondary Display Device

LFP Type

AUTO
VGA 640×480 1×18
WVGA 800×480 1×18
SVGA 800×600 1×18
XGA 1024×768 1×18
XGA 1024×768 1×24
WXGA 1280×768 1×24
WXGA 1280×800 1×18
WXGA 1366×768 1×24
WSVGA 1024×600 1×18
WSVGA 1024×600 1×24
Custom
PAID

Select LFP used by Internal Graphics Device by selecting
the appropriate panel setup item

Backlight Control None/External

PWM
PWM Inverted
I2C
I2C Inverted

Backlight Control Setting

Backlight Value

128

Set LCD backlight brightness (0-255)

Module switch LVDS-DDI2

Activate LVDS
Activate DDI2

Choose between LVDS and DDI2 display option

LVDS Clock Center Spreading

No Spreading

0.5%

1.0%

1.5%

2.0%

2.5%

Select LVDS clock frequency center spreading depth

EFP1 Type DisplayPort Only

DP with HDMI/DVI
HDMI/DVI

Integrated HDMI/DisplayPort Configuration with
External Connectors

EFP2 Type DisplayPort Only

DP with HDMI/DVI
HDMI/DVI

Integrated HDMI/DisplayPort Configuration with
External Connectors

72

COMe-cBT6 / BIOS Operation

Mode Persistence

Disabled
Enabled

Enables/Disables Mode Persistence

Center Mode

Disabled
EFP

Select the Display Device that should be centered

73

COMe-cBT6 / BIOS Operation

System Component

Feature Options Description

PNP Setting Disable

Power & Performance

Ax Stepping
Bx Stepping

Select PNP setting mode, Disable, Performance, Power
or Power&Performance mode

74

COMe-cBT6 / BIOS Operation

LAN Configuration

Feature Options Description

PXE ROM

Disabled
Onboard only
Addon only
Both

Enable/Disable PXE Option ROM execution for onboard
LAN

75

COMe-cBT6 / BIOS Operation

South Cluster Configuration

76

COMe-cBT6 / BIOS Operation

PCI Express Configuration

Feature Options Description

PCIe Speed

Auto
Gen1
Gen2

Select PCIe Speed to Gen1 or Gen2

PCI Express Root Port Disable

Enable

Control the PCI Express Root Port

77

COMe-cBT6 / BIOS Operation

USB Configuration

Feature Options Description

xHCI Mode

Smart Auto
Enable
Disable

Mode of operation of xHCI controller. This will also
influence EHCI controller settings since certain
combinations of those modes are not allowed. 'SMART
Auto' Mode is requied for OS with external Driver (e.g.
Windows 7), 'Enabled' is recommended for OS with
integrated USB 3.0 Support (e.g. Windows 8). Please
note, the USB HSIC Hub for COMe USB Ports #4-7 is
linked to xHCI controller which allows operation of
these USB ports in OS with USB 3.0 driver only (no
support in DOS or EFI Shell)

USB Per-Port Control Disable

Enable

Controls each of the CPU USB ports (COMe USB #0-3)

- USB Port #0

- USB Port #1

- USB Port #2

- USB Port #3

Disabled
Enabled

Enable/Disable USB port

78

COMe-cBT6 / BIOS Operation

Audio Configuration

Feature Options Description

Audio Controller

Enable
Disable

Enable / Disable High Definition Audio interface

- HDAudio VCi Enable

Enable
Disable

Enable / Disable Virtual Channel 1 of Audio Controller

- HDAudio Docking Support Enable

Enable
Disable

Enable / Disable HDAudio Docking Support of Audio
Controller

- HDAudio PMCE Enable

Enable
Disable

Enable / Disable Power Management capability of Audio
Controller

- HDAudio HDMI Codec

Enable
Disable

Enable / Disable internal HDMI codec for HDAudio

HDA_SDI0

HDA_SDI0
Disable

HDAudio Codec connected on HDA_SDI0 signal

HDA_SDI1 HDA_SDI1

Disable

HDAudio Codec connected on HDA_SDI1 signal

79

COMe-cBT6 / BIOS Operation

SATA Drives

Feature Options Description

Chipset SATA

Enable
Disable

Enables or Disables the Chipset SATA Controller. The
Chipset SATA controller supports the 2 internal SATA
ports (up to 3Gb/s supported per port)

SATA Test Mode

Disable
Enable

Enables or Disables the SATA Test Mode

Chipset SATA Mode IDE

AHCI

IDE: compatibility mode, disables AHCI. AHCI: supports
advanced SATA features such as NCQ. Warning: do not
change after OS install

SATA Port 0 Hot Plug Capability Enable

Disable

If enabled, SATA port will be reported as HotPlug
capable

SATA Port 1 Hot Plug Capability Enable

Disable

If enabled, SATA port will be reported as HotPlug
capable

80

COMe-cBT6 / BIOS Operation

LPSS & SCC Configuration

Feature Options Description

LPSS & SCC Devices Mode ACPI Mode

PCI Mode

Select operation mode for Low Power Super Speed LPSS
devices eMMC/SDCard. For eMMC full speed operation
the LPSS mode should be set to “ACPI”

SCC eMMC Boot Controller Disable

Auto Detect
eMMC 4.41
eMMC 4.5

Disable or select eMMC Boot mode

eMMC 4.5 support Disable

Enable

Enabled: eMMC 4.5, Disabled: eMMC 4.41

eMMC DDR50 Support

Disable
Enable

Enable / Disable DDR50 speed mode for eMMC

eMMC HS200 Support

Disable
Enable

Enable / Disable HS200 speed mode for eMMC. For
eMMC full speed operation the HS200 mode should be
enabled.

- eMMC retune timer value

8

Select the retune timer in HS200 mode

SCC SD Card Support Disable

Enable

Enable/Disable onboard SD Card socket

SD SDR 25 Support Disable

Enable

Enable bus speed operation up to 25MB/s for SDCard
(High Speed). Disable limits bus speed to 12.5MB/s
(normal speed)

SD SDR 50 Support Disable

Enable

Enable bus speed operation up to 50MB/s for SDCard
(Ultra High Speed). Disabled activates SDR25 mode
setting

81

COMe-cBT6 / BIOS Operation

Miscellaneous Configuration

Feature Options Description

High Precision Timer Disable

Enable

Enables or Disables the High Precision Event Timer

Boot Time with HPET Timer

Disable
Enable

Boot time calculation with High Precision Event Timer
enabled

State After G3

S0 State
S5 State

Specify what state to go to when power is re-applied
after a power failure (G3 state). S0 = Power on, S5 =
Stay off

SMM LOCK Disable

Enable

Enables or Disables the SMM Lock feature. It will lock
the SMRAM and unable load SMM driver any more

Pci Mmio Size

2GB

1.5GB

1.25GB
1GB

Select PCI MMIO Size

82

COMe-cBT6 / BIOS Operation

SMBIOS Event Log

Feature Options Description

Event Log

Disable
Enable

Enables or Disables the SMBIOS Event Log

Mark SMBIOS events as read

Enter

Mark SMBIOS events as read. Marked SMBIOS events
won't be displayed

Clears SMBIOS events

Enter

Clear SMBIOS events

83

COMe-cBT6 / BIOS Operation

View SMBIOS event log

84

COMe-cBT6 / BIOS Operation

SuperIO Configuration

This setup option is only available with LPC SuperI/O Nuvoton 83627 present on the carrier board. By default the COMe­cBT6 supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The SIO hardware monitor is
not supported in setup.

Feature Options Description

SIO Serial Port 0

Disabled
Enabled

Enable or Disable SIO Serial Port

- Base Address 3F8
2F8
3E8
2E8

Configure Serial Por t Base Address

- IRQ 3
4
5
6
7
12

Configure Serial Por t IRQ

SIO Serial Port 1

Disabled
Enabled

Enable or Disable SIO Serial Port

- Base Address 3F8
2F8
3E8
2E8

Configure Serial Por t Base Address

- IRQ 3
4
5
6
7
12

Configure Serial Por t IRQ

SIO Parallel Port

Disabled
Enabled

Enable or Disable SIO Parallel Port

- Device Mode

Standard Parallel Port
EPP
EPP & ECP

Configure Parallel Port Mode

- Base Address

378
278
3BC

Configure Parallel Port Base Address

85

COMe-cBT6 / BIOS Operation

Onboard UART Configuration

Feature Options Description

Serial Port 0 Disabled

Enabled

Enable or Disable Serial Port (COM) 0

Base Address

3F8
2F8
3E8
2E8

Configure Serial Por t Base Address

IRQ 3

4
5
6
7
12

Configure Serial Por t IRQ

Serial Port 1 Disabled

Enabled

Enable or Disable Serial Port (COM) 1

Base Address 3F8

2F8
3E8
2E8

Configure Serial Por t Base Address

IRQ

3
4
5
6
7
12

Configure Serial Por t IRQ

86

COMe-cBT6 / BIOS Operation

7.5.3 Security

Feature Options Description

Set Supervisor Password

Enter

Set or clear the Supervisor account's password

Supervisor Hint String

-

Press Enter to type Supervisor Hint String

Min. password length

1

Set the minimum number of characters for password (1-

20)

TPM Support Disabled

Enabled

This is used to decide whether TPM support should be
enabled or disabled

TPM Options

Feature Options Description

TPM Action

No Change
Enable
Disable
Activate
Deactivate
Clear
Enable and Activate
Disable and Deactivate
Set Owner Install, with state=True
Set Owner Install, with state=False
Enable, Activate, and Set Owner Install with state=True
Disable, Deactivate, and Set Owner Install with
state=False
Clear, Enable, and Activate
Require PP for provisioning
Do not require PP for provisioning
Require PP for clear
Do not require PP for clear
Enable, Activate, and clear
Enable, Activate, Clear, Enable, and Activate

Enact TPM Action

Omit Boot Measurements Disabled

Enabled

Enabling this option causes the system to omit
recording boot device attempts in PCR[4]

87

COMe-cBT6 / BIOS Operation

7.5.4 Boot

88

COMe-cBT6 / BIOS Operation

7.5.5 Exit

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89

COMe-cBT6 / BIOS Operation

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Corporate Offices

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Oskar-von-Miller-Str. 1
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[e-mail]

90