Kontron COMe-bSC6 User Manual

COMe-bSC6

Document Revision 150

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Module definition....................................................................................................................... 10

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 17

3.4 Variant Matrix............................................................................................................................ 17

3.5 Accessories............................................................................................................................... 18

3.6 Electrical Specification................................................................................................................ 19

3.6.1 Supply Voltage........................................................................................................................... 19

3.6.2 Power Supply Rise Time................................................................................................................ 19

3.6.3 Supply Voltage Ripple.................................................................................................................. 19

3.6.4 Power Consumption..................................................................................................................... 19

3.6.5 ATX Mode.................................................................................................................................. 20

3.6.6 Single Supply Mode..................................................................................................................... 20

3.7 Power Control............................................................................................................................ 21

3.8 Environmental Specification......................................................................................................... 22

3.8.1 Temperature Specification............................................................................................................ 22

3.8.2 Humidity................................................................................................................................... 22

3.9 Standards and Certifications......................................................................................................... 23

3.10 MTBF........................................................................................................................................ 25

3.11 Mechanical Specification.............................................................................................................. 26

3.12 Module Dimensions..................................................................................................................... 27

3.13 Thermal Management, Heatspreader and Cooling Solutions.................................................................28

3.14 Onboard Fan Connector................................................................................................................ 29

4 Features and Interfaces.......................................................................30

4.1 S5 Eco Mode.............................................................................................................................. 30

4.2 LPC.......................................................................................................................................... 31

www.kontron.com

COMe-bSC6 /

4.3 Serial Peripheral Interface (SPI)....................................................................................................32

4.4 SPI boot.................................................................................................................................... 32

4.5 M.A.R.S.................................................................................................................................... 34

4.6 UART........................................................................................................................................ 35

4.7 Fast I2C.................................................................................................................................... 36

4.8 GPIO - General Purpose Input and Output.........................................................................................37

4.9 Dual Staged Watchdog Timer......................................................................................................... 38

4.10 Speedstep Technology................................................................................................................. 39

4.11 C-States.................................................................................................................................... 40

4.12 Hyper Threading......................................................................................................................... 41

4.13 VID-x....................................................................................................................................... 42

4.14 Intel® Turbo Boost Technology and AVX...........................................................................................43

4.15 Display Configuration..................................................................................................................44

4.16 Hybrid Graphics / Multi-monitor.................................................................................................... 48

4.17 Intel® vPro™ technology.............................................................................................................. 49

4.18 ACPI Suspend Modes and Resume Events..........................................................................................50

4.19 USB......................................................................................................................................... 51

5 System Resources...............................................................................52

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 52

5.2 Memory Area............................................................................................................................. 53

5.3 I/O Address Map......................................................................................................................... 53

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 54

5.5 I2C Bus..................................................................................................................................... 54

5.6 JILI I2C Bus............................................................................................................................... 54

5.7 SDVO I2C Bus............................................................................................................................. 54

5.8 System Management (SM) Bus....................................................................................................... 55

6 Connectors........................................................................................56

6.1 Connector Location..................................................................................................................... 56

7 Pinout List.........................................................................................57

7.1 General Signal Description............................................................................................................ 57

7.2 Connector X1A Row A................................................................................................................... 58

7.3 Connector X1A Row B................................................................................................................... 60

7.4 Connector X1B Row C................................................................................................................... 62

7.5 Connector X1B Row D................................................................................................................... 64

8 BIOS Operation...................................................................................66

8.1 Determining the BIOS Version....................................................................................................... 66

8.2 BIOS Update.............................................................................................................................. 66

8.3 Setup Guide............................................................................................................................... 68

8.4 POST Codes................................................................................................................................ 68

8.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 68

4

COMe-bSC6 /

8.5 BIOS Setup................................................................................................................................ 70

8.5.1 Main........................................................................................................................................ 70

8.5.2 Advanced.................................................................................................................................. 72

8.5.3 Chipset..................................................................................................................................... 96

8.5.4 Boot....................................................................................................................................... 112

8.5.5 Security.................................................................................................................................. 114

8.5.6 Save & Exit............................................................................................................................... 116

5

COMe-bSC6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

6

COMe-bSC6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-bSC6 / Introduction

2 Introduction

2.1 Product Description

In 2011, Intel® introduced its first quad core CPU suitable for the COM Express® platform. With the quad-core CPU Core™
i7-2715QE and the dual-core CPUs Core™ i3/i5/i7, COM Express® reaches ground-breaking performance values: both for
CPU and GPU rankings. With various CPUs COMe-bSC# serves your individual performance needs, starting with a 1.1 GHz
version Celeron® 847E.

Kontron's COMe-bSC# is available as COM Express® basic form factor (125x95mm) for Pin-out Type 2 (COMe-bSC2) and
Pin-out Type 6 (COMe-bSC6).

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

8

COMe-bSC6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bSC6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

9

COMe-bSC6 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® basic sized Computer-on-Module COMe-bSC6 (CHR6) follows pin-out Type 6 and is compatible to PICMG
specification COM.0 Rev 2.0. The COMe-bSC6 based on latest Huron River platform is available in different variants to
cover the demand of different performance, price and power:

Commercial grade ECC modules (0°C to 60°C operating)

Product Number Product Name Processor PCH Memory Graphics PEG TPM USB 2.0 USB 3.0

38014-0000-21-4 COMe-bSC6 i7-2715QE ECC Intel® Core™ i7-2715QE QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-22-2 COMe-bSC6 i7-2655LE ECC Intel® Core™ i7-2655LE QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-15-2 COMe-bSC6 i7-2610UE ECC Intel® Core™ i7-2610UE QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-25-2 COMe-bSC6 i5-2515E ECC Intel® Core™ i5-2515E QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-21-2 COMe-bSC6 i3-2310E ECC Intel® Core™ i3-2310E QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-13-2 COMe-bSC6 i3-2340UE ECC Intel® Core™ i3-2340UE QM67 2x DDR3-ECC HD3000 YES YES 8x 2x

38014-0000-16-1 COMe-bSC6 B810E ECC Intel® Celeron® B810E HM65 2x DDR3-ECC HD YES YES 6x optional

38014-0000-11-1 COMe-bSC6 847E ECC Intel® Celeron® 847E HM65 2x DDR3-ECC HD YES YES 6x optional

38014-0000-14-0 COMe-bSC6 827E ECC Intel® Celeron® 827E HM65 2x DDR3-ECC HD YES YES 6x optional

38014-0000-10-0 COMe-bSC6 807UE ECC Intel® Celeron® 807UE HM65 1x DDR3-ECC HD - YES 6x optional

Commercial grade non-ECC modules (0°C to 60°C operating)

Product Number Product Name Processor PCH Memory Graphics PEG TPM USB 2.0 USB 3.0

38023-0000-16-1 COMe-bSC6 B810E Intel® Celeron® B810E HM65 2x DDR3 HD YES YES 8x -

38023-0000-11-1 COMe-bSC6 847E Intel® Celeron® 847E HM65 2x DDR3 HD YES YES 8x -

38023-0000-14-0 COMe-bSC6 827E Intel® Celeron® 827E HM65 2x DDR3 HD YES YES 8x -

38023-0000-10-0 COMe-bSC6 807UE Intel® Celeron® 807UE HM65 1x DDR3 HD - YES 8x -

Extended temperature ECC modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor PCH Memory Graphics PEG TPM USB 2.0 USB 3.0

38014-0000-22-2EXT COMe-bSC6 i7-2655LE ECC E1 Intel® Core™ i7-2655LE QM67 2x DDR3-ECC HD3000 YES - 8x 2x

38014-0000-15-2EXT COMe-bSC6 i7-2610UE ECC E1 Intel® Core™ i7-2610UE QM67 2x DDR3-ECC HD3000 YES - 8x 2x

38014-0000-11-1EXT COMe-bSC6 847E ECC E1 Intel® Celeron® 847E HM65 2x DDR3-ECC HD YES - 6x optional

38014-0000-14-0EXT COMe-bSC6 827E ECC E1 Intel® Celeron® 827E HM65 2x DDR3-ECC HD YES - 6x optional

38014-0000-10-0EXT COMe-bSC6 807UE ECC E1 Intel® Celeron® 807UE HM65 1x DDR3-ECC HD - - 6x optional

10

COMe-bSC6 / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® 2nd Gen Core™ i7/i5/i3/Celeron® embedded (Sandy Bridge) CPU family with 31x24mm package size
(FCBGA1023 socket) supports:

» Intel® Turbo Boost Technology 2.0

» Intel® 64

» Intel® Virtualization Technology (VT-x)

» Intel® Virtualization Technology for Directed I/O (VT-d)

» AES New Instructions (AES-NI)

» Intel® Anti-Theft Technology

» Intel® Hyper-Threading Technology

» Enhanced Intel SpeedStep® Technology

» Idle States (C-States)

» Intel® Smart Cache

» Thermal Monitoring Technologies

» Intel® Fast Memory Access

» Intel® Flex Memory Access

» Integrated Intel® HD Graphics with Dynamic Frequency

Optional available (with customized BIOS):

» Intel® vPRO™ Technology including:

» Intel® Active Management Technology (AMT)

» Intel® Trusted Execution Technology (TXT)

The integrated Intel® HD3000 Graphics supports:

» GraphicsTechnology GT2 with 12 Execution Units

» Intel® Quick Sync Video

» Intel® InTru™ 3D Technology

» Intel® Wireless Display

» Intel® Flexible Display Interface (Intel® FDI)

» Intel® Clear Video HD Technology

» Dual Display

The integrated Intel® HD Graphics supports:

» GraphicsTechnology GT1 with 6 Execution Units

» Dual Display

11

COMe-bSC6 / Product Specification

Intel® Core™ Core™ Core™ Core™ Core™ Core™ Celeron® Celeron® Celeron® Celeron®

- i7-2715QE i7-2655LE i7-2610UE i5-2515E i3-2310E i3-2340UE B810E 847E 827E 807UE

# of Cores 4 2 2 2 2 2 2 2 1 1

# of Threads 8 4 4 4 4 4 2 2 1 1

Clock Speed 2100MHz 2200MHz 1500MHz 2500MHz 2100MHz 1300MHz 1600MHz 1100MHz 1400MHz 1000MHz

Max Turbo Frequency 3000MHz 2900MHz 2400MHz 3100MHz - - - - - -

TDP 45W 25W 17W 35W 35W 17W 35W 17W 17W 10W

C-States C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C3 C0-C3 C0-C3 C0-C3

Smart Cache 6MB 4MB 4MB 3MB 3MB 3MB 2MB 2MB 1.5MB 1MB

Bus/Core Ratio 12-21 8-22 8-15 8-25 8-21 8-13 8-16 8-11 8-14 8-10

Min Memory Type DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066

Max Memory Type DDR3-1600 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333 DDR3-1333

Max Memory Size 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 4GB

# of Memory Channels 2 2 2 2 2 2 2 2 2 1

Graphics Model HD3000 HD3000 HD3000 HD3000 HD3000 HD3000 HD HD HD HD

GFX Base Frequency 650MHz 650MHz 350MHz 650MHz 650MHz 350MHz 650MHz 350MHz 350MHz 350MHz

GFX Max Dynamic Frequ. 1200MHz 1000MHz 850MHz 1100MHz 1050MHz 800MHz 1000MHz 800MHz 800MHz 800MHz

Quick Sync Video Yes Yes Yes Yes Yes Yes - - - -

InTru™ 3D Yes Yes Yes Yes Yes Yes - - - -

Wireless Display Yes Yes Yes Yes Yes Yes - - - -

Clear Video HD Yes Yes Yes Yes Yes Yes - - - -

PCI Express Graphics Yes Yes Yes Yes Yes Yes Yes Yes Yes -

vPRO™ (optional) Yes Yes Yes Yes - - - - - -

TXT (optional) Yes Yes Yes Yes - - - - - -

AES-NI Yes Yes Yes Yes - - - - - -

VT-x Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

VT-d Yes Yes Yes Yes - - - - - -

Anti-Theft Yes Yes Yes Yes Yes Yes - - - -

The Bus/Core Ratio shows the possible CPU Performance settings (CPU Ratio) from the max
Efficiency Ratio (LFM = Lowest Frequency Mode) to the maximum non-turbo Ratio (HFM =
Highest Frequency Mode). If enabled in Setup, CPU Clock is fixed to Ratio*100MHz. This
feature is not supported with updated EFI Core available with BIOS CHR6R111 or newer.

Memory

Sockets

2x DDR3 SO-DIMM

Memory Type

DDR3-1066/1333 ECC/nonECC

Maximum Size

2x8GB

Technology

Dual Channel

Chipset

The Intel® 6-Series Platform Controller Hub Cougar Point supports:

» PCI Express Revision 2.0

» PCI Express Configurations x1, x2, x4

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Trusted Execution Technology (TXT)

» Intel® vPro Technology

» Intel® Active Management Technology 7.0

» Intel® Anti-Theft Technology

» Intel® Rapid Storage Technology

12

COMe-bSC6 / Product Specification

PCH comparison

Feature QM67 HM65

TDP 3.9W 3.9W

VT-d YES NO

TXT YES NO

vPRO YES NO

AMT YES NO

Rapid Storage YES NO

SATA RAID YES NO

The Intel® vPro Technology including Trusted Execution Technology (TXT) and Active
Management Technology (AMT) is not supported by default on COMe-bSC6. Please contact
your local sales or support for custom BIOS variants supporting vPro. A test version is
available on EMD Customer Section.

Graphics Core

The integrated Intel® HD/HD3000 (Gen6) supports:

Graphics Core Render Clock

GT1 /GT2, Base clock: 350/650 MHz, GT Turbo: up to 1200 MHz

Execution Units / Pixel Pipelines

GT2: 12EU / GT1: 6EU

Max Graphics Memory

1720MB

GFX Memory Bandwidth (GB/s)

21.3

GFX Memory Technology

DVMT 5.0

API (DirectX/OpenGL)

10.1 / 3.0

Shader Model

4.0

Hardware accelerated Video

MPEG2, VC-1, AVC, Blu-ray (+3D)

Independent/Simultaneous Displays

2

Display Port

DP 1.1a / eDP

HDCP support

HDCP 1.4

Monitor output

CRT max Resolution

2048x1536

TV out:

-

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

1x PEG 2.0 (not on Cel. 807UE)

Digital Display Interface DDI1

DP++/SDVOB

Digital Display Interface DDI2

DP++

Digital Display Interface DDI3

DP++/eDP

Maximum Resolution on DDI

2560x1600

13

COMe-bSC6 / Product Specification

PEG Configuration

The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-bSC6 supports following PEG Port configuration when used as PCI Express Interface:

» 1×16

» 1×8

» 1×4

» 1×2

» 1×1

The internal PCI Express controller can be re-configured to support up to 3 PCIe ports. The following port configurations
are available via hardware strap options (customized article):

» 2×8 (lanes #0-7 + #8-15)

» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)

Storage

onboard SSD

-

SD Card support

-

IDE Interface

-

Serial-ATA

2x SATA 6Gb/s, 2x SATA 3Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier

SATA RAID

0, 1, 5, 10, MATRIX (QM67 only)

If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a RAID enable RAID support in BIOS Chipset/SATA
settings, connect at least two hard drives and enter the RAID Option ROM by pressing
'CTRL'+'I'

Connectivity

USB 2.0

up to 8x USB 2.0

USB 3.0

up to 2x USB 3.0

USB Client

-

PCI

-

PCI External Masters

-

PCI Express

6x PCIe x1 Gen2

Max PCI Express

7x PCIe without USB 3.0

PCI Express x2/x4 configuration

YES (Softstrap option)

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82579LM (Lewisville)

- Due to internal chipset configuration the Cougar Point only supports up to 4 USB Hubs

- On Type6 modules with USB3.0 legacy support is disabled in POST for the USB 3.0 Ports
0/1

14

COMe-bSC6 / Product Specification

PCI Express Configuration

The COMe-bSC6 only supports x1 PCIexpress lane configuration by default. Following x2/x4 configurations are available
via Management Engine Softstrap Options with a customized BIOS version.

PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5* Port #6* Port #7*

Configuration0 x1 x1 x1 x1 x1 - - -

Configuration1 x2 x1 x1 x1 x1 x1 x1

Configuration2 x2 x2 x1 x1 x1 x1

Configuration3 x2 x2 x2 x1 x1

Configuration4 x2 x2 x2 x2

Configuration5 x4 x1 x1 x1 x1

Configuration6 x4 x2 x1 x1

Configuration7 x4 x2 x2

Configuration8 x4 x4

- *PCIe Port #6 is only available on variants without Renesas USB 3.0 Controller and Port #7
is available without Ethernet Controller

- Configuration0 (default) and Configuration5 (modified FlashDescriptor) are provided in
BIOS download package available on EMD Customer Section

Ethernet

The Intel® 82579LM (Lewisville) ethernet supports:

» Jumbo Frames

» MACsec IEEE 802.1 AE

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

8MB SPI

Audio

HD Audio + DisplayPort dual stream

Onboard Hardware Monitor

Analog Devices ADT7490

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT

Miscellaneous

2x UART / PWM FAN

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI1 / KEAPI2

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

15

COMe-bSC6 / Product Specification

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 18V (20V@nonECC)

ACPI

ACPI 4.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 6.0

Power Consumption and Performance

Full Load Power Consumption

10 - 73W

Kontron Performance Index

11571 - 63719

Kontron Performance/Watt

878 - 1612

*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0

Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

16

COMe-bSC6 / Product Specification

3.3 Block Diagram

3.4 Variant Matrix

The COMe-bSC6 is available with different PCB and featureset. The following table shows major differences of available
standard modules:

Product Name COMe-bSC6 ECC COMe-bSC6 ECC E1 COMe-bSC6

Part.No.

38014-xxxx-xx-x 38014-xxxx-xx-xEXT 38023-xxxx-xx-x

Temperature Grade

commercial extended commercial

PCB/Project Code

CHR6 CHR6 CCR6

BIOS/UEFI

CHR6Rxxx CHR6Rxxx CHR6Rxxx

HW Revision

CE 1.x.x CE 1.x.x CE 1.x.x

DDR3 Memory

ECC ECC non-ECC

USB #6/#7 Support

with QM67 PCH only with QM67 PCH only Yes

USB 3.0 Support

Yes Yes No

eDP Support on DDI3

No No Yes

TPM

Infineon FW 1.02 No Infineon FW 3.17

HWM

ADT7490 ADT7490 NCT7802Y

17

FAN Control

PwrCtrl / Battery

DDR3-1333

DDR3-1333

X4 DMIFDI

PCIe #0 - #5

Intel® 2nd Generation Core

GMA HD3000

SATA #0/1 (6Gb/s)

HDAudio

I2C

Connector CD

USB #2 - #7

PCIe #7GB LAN

CPLD

(Embedded

Controller)

JIDA

EEPROM

8 GPIO

FAN

Connector

SPI

SMB

DDR3 SODIMM

ECC or nonECC

DDR3 SODIMM

ECC or nonECC

CRT

LVDS

PEG

DDI1 (SDVO/DP/HDMI/DVI)

DDI2 (DP/HDMI/DVI)

DDI3 (eDP/DP /HDMI/DVI)

SATA #2/3 (3Gb/s)

PCIe #6

Ethernet

Intel® 82579

PCIe2USB 3.0

Renesas

USB 3.0 (#0/#1)

Watchdog

HWM

ADT7490

PECISMB

HWM

LPC

TPM

Infineon

SLB9635TT

Connector AB

BIOS

SPI Flash

Intel® 6-Series PCH

Intel® QM67
Intel® HM65

USB #0 - #1

2 x UART (RX/TX)

Ethernet

MAC

PCIe #6

optional

DDIB

DDIC

DDID

COMe-bSC6 / Product Specification

3.5 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

38013-0000-99-0 HSP COMe-bSC/IP thread For CPUs up to 25W TDP and commercial temperature grade usage

38013-0000-99-1 HSP COMe-bSC/IP through For CPUs up to 25W TDP and commercial temperature grade usage

38013-0000-99-2 HSP COMe-bSC/IP heatpipe thread For all CPUs and temperature grades

38013-0000-99-3 HSP COMe-bSC/IP heatpipe through For all CPUs and temperature grades

38013-0000-99-0C05 HSK COMe-bSC/IP active setscrew thread For all CPUs and commercial temperature grade usage

38013-0000-99-1C05 HSK COMe-bSC/IP active setscrew through hole For all CPUs and commercial temperature grade usage

38013-0000-99-0C06 HSK COMe-bSC/IP passive setscrew thread For all CPUs and commercial temperature grade usage

38013-0000-99-1C06 HSK COMe-bSC/IP passive setscrew through hole For all CPUs and commercial temperature grade usage

General accessories

Part Number COMe pin-out Type 6 compatible accessories Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carr ier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPort

96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Starterkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6

38114-0000-00-S COMe Ref. Starterkit T6 ADAS Starterkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Batter y Kit Starterkit Kontron Mobile Application platform for Rechargeable Systems

For COMe-bSC6 ECC (38014-xxxx-xx-x)

Part Number DDR3 ECC SODIMM, commercial temperature grade

97016-1024-16-0 DDR3-1600 SODIMM 1GB ECC

97016-2048-16-0 DDR3-1600 SODIMM 2GB ECC

97016-4096-16-0 DDR3-1600 SODIMM 4GB ECC

97016-8192-16-0 DDR3-1600 SODIMM 8GB ECC

Part Number DDR3 ECC SODIMM, industrial temperature grade

97016-1024-16-2 DDR3-1600 SODIMM 1GB ECC E2

97016-2048-16-2 DDR3-1600 SODIMM 2GB ECC E2

97016-4096-16-2 DDR3-1600 SODIMM 4GB ECC E2

97016-8192-16-2 DDR3-1600 SODIMM 8GB ECC E2

For COMe-bSC6 non-ECC (38023-xxxx-xx-x)

Part Number DDR3 SODIMM, commercial temperature grade

97015-1024-16-0 DDR3-1600 SODIMM 1GB

97015-2048-16-0 DDR3-1600 SODIMM 2GB

97015-4096-16-0 DDR3-1600 SODIMM 4GB

97015-8192-16-0 DDR3-1600 SODIMM 8GB

Part Number DDR3 SODIMM, industrial temperature grade

97015-1024-16-2 DDR3-1600 SODIMM 1GB E2

97015-2048-16-2 DDR3-1600 SODIMM 2GB E2

97015-4096-16-2 DDR3-1600 SODIMM 4GB E2

97015-8192-16-2 DDR3-1600 SODIMM 8GB E2

18

COMe-bSC6 / Product Specification

3.6 Electrical Specification

3.6.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 18V (20V@nonECC)

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.6.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.6.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.6.4 Power Consumption

The maximum Power Consumption of the different COMe-bSC6 variants is 10 - 73W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

19

COMe-bSC6 / Product Specification

3.6.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V (20V@nonECC) in ATX Mode. On Computer-on­Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC >
5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.6.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 18V (20V@nonECC).

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

20

COMe-bSC6 / Product Specification

3.7 Power Control

Power Supply

The COMe-bSC6 supports a power input from 8.5V - 18V (20V@nonECC). The supply voltage is applied through the VCC pins
(VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-bSC6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

21

COMe-bSC6 / Product Specification

3.8 Environmental Specification

3.8.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-bSC6

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 8.5V - 18V (20V@nonECC)

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 8.5V - 18V (20V@nonECC)

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.8.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

22

COMe-bSC6 / Product Specification

3.9 Standards and Certifications

RoHS II

The COMe-bSC6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

23

COMe-bSC6 / Product Specification

Shock & Vibration

The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-bSC6 follows the requirements for electromagnetic

compatibility standards

» EN55022

24

COMe-bSC6 / Product Specification

3.10 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 225998 @ 40°C (w/PCB)

453913 @ 40°C (w/o PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

25

COMe-bSC6 / Product Specification

3.11 Mechanical Specification

Dimension

» 95.0 mm x 125.0 mm

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from module PCB bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for basic sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top.

Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of

27.3mm from module bottom to Heatsink top.

26

COMe-bSC6 / Product Specification

3.12 Module Dimensions

27

COMe-bSC6 / Product Specification

3.13 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bSC6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-bSC6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-bSC6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-bSC6 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

28

COMe-bSC6 / Product Specification

3.14 Onboard Fan Connector

Location of the FAN Connector

Specification of the FAN Connector:

» Part number (Molex) J8: 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 8.5 - 13V 13 - 18V

FAN Output Voltage

8.5 - 13V 13V

Max. FAN Output Current

350mA 200mA

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

29

COMe-bSC6 / Features and Interfaces

4 Features and Interfaces

4.1 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

30