Kontron COMe-bPC2 User Manual

COMe-bPC2

Document Revision 140

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................9

2.4 COM Express® Documentation....................................................................................................... 10

2.5 COM Express® Benefits................................................................................................................ 10

3 Product Specification...........................................................................11

3.1 Modules & Accessories................................................................................................................. 11

3.2 Functional Specification............................................................................................................... 13

3.3 Block Diagram............................................................................................................................ 18

3.4 Electrical Specification................................................................................................................ 19

3.4.1 Supply Voltage........................................................................................................................... 19

3.4.2 Power Supply Rise Time................................................................................................................ 19

3.4.3 Supply Voltage Ripple.................................................................................................................. 19

3.4.4 Power Consumption..................................................................................................................... 19

3.4.5 ATX Mode.................................................................................................................................. 20

3.4.6 Single Supply Mode..................................................................................................................... 20

3.5 Power Control............................................................................................................................ 21

3.6 Environmental Specification......................................................................................................... 22

3.6.1 Temperature Specification............................................................................................................ 22

3.6.2 Humidity................................................................................................................................... 22

3.7 Standards and Certifications......................................................................................................... 23

3.8 MTBF........................................................................................................................................ 25

3.9 Mechanical Specification.............................................................................................................. 26

3.10 Module Dimensions..................................................................................................................... 26

3.10.1 38008-XXXX-XX-X........................................................................................................................ 26

3.10.2 38009-XXXX-XX-X........................................................................................................................ 27

3.11 Thermal Management.................................................................................................................. 28

3.12 Heatspreader............................................................................................................................. 28

3.13 Onboard Fan Connector................................................................................................................ 29

3.13.1 BIOS Settings for Fan Control........................................................................................................ 30

3.13.2 Electrical Characteristics.............................................................................................................. 30

4 Features and Interfaces.......................................................................31

www.kontron.com

COMe-bPC2 /

4.1 S5 Eco Mode.............................................................................................................................. 31

4.2 LPC.......................................................................................................................................... 32

4.3 LPC boot................................................................................................................................... 33

4.4 M.A.R.S.................................................................................................................................... 34

4.5 Fast I2C.................................................................................................................................... 35

4.6 JIDA16 and JIDA32..................................................................................................................... 36

4.7 K-Station 1................................................................................................................................ 37

4.8 K-Station & API Resources............................................................................................................ 38

4.8.1 I2C.......................................................................................................................................... 38

4.8.2 Storage.................................................................................................................................... 38

4.8.3 GPIO........................................................................................................................................ 38

4.8.4 Hardware Monitor....................................................................................................................... 38

4.9 GPIO - General Purpose Input and Output.........................................................................................39

4.10 Watchdog Timer.......................................................................................................................... 40

4.11 Flash Backup Feature................................................................................................................... 41

4.12 Speedstep Technology................................................................................................................. 43

4.13 C-States.................................................................................................................................... 44

4.14 Dynamic FSB Frequency Switching.................................................................................................. 45

4.15 VID-x....................................................................................................................................... 46

4.16 Enhanced Intel Dynamic Acceleration Technology..............................................................................47

4.17 Usage of Different Graphic Interfaces.............................................................................................. 48

4.18 Alternative Pin-out of HDMI.......................................................................................................... 49

4.19 Alternative Pin-out of Display Port.................................................................................................. 49

4.20 Display Configurations.................................................................................................................50

4.21 Hybrid Graphics / Multi-monitor.................................................................................................... 52

4.22 Intel® vPro™ technology.............................................................................................................. 54

4.23 ACPI Suspend Modes and Resume Events..........................................................................................55

5 System Ressources..............................................................................56

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 56

5.1.1 In 8259 PIC Mode........................................................................................................................ 56

5.1.2 In APIC mode............................................................................................................................. 57

5.2 Direct Memory Access (DMA) Channels............................................................................................. 58

5.3 Memory Area............................................................................................................................. 58

5.4 I/O Address Map......................................................................................................................... 58

5.5 External Inter-IC (I2C) Bus............................................................................................................58

5.6 System Management (SM) Bus....................................................................................................... 58

5.7 JILI I2C Bus............................................................................................................................... 58

5.8 SDVO I2C Bus............................................................................................................................. 58

5.9 CRT I2C Bus............................................................................................................................... 58

6 Connectors........................................................................................59

6.1 Connector Location..................................................................................................................... 59

7 Pinout List.........................................................................................60

7.1 General Signal Description............................................................................................................ 60

4

COMe-bPC2 /

7.2 Connector X1A Row A................................................................................................................... 61

7.3 Connector X1A Row B................................................................................................................... 63

7.4 Connector X1B Row C................................................................................................................... 65

7.5 Connector X1B Row D................................................................................................................... 67

8 BIOS Operation...................................................................................69

8.1 Determining the BIOS Version....................................................................................................... 69

8.2 BIOS Update.............................................................................................................................. 69

8.3 Setup Guide............................................................................................................................... 70

8.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 70

8.4 BIOS Setup................................................................................................................................ 72

8.4.1 Main Menu................................................................................................................................. 72

8.4.2 Module Info............................................................................................................................... 73

8.4.3 Advanced Menu.......................................................................................................................... 76

8.4.4 PCIPnP Menu............................................................................................................................ 104

8.4.5 Boot....................................................................................................................................... 105

8.4.6 Security.................................................................................................................................. 107

8.4.7 Chipset................................................................................................................................... 108

8.4.8 Exit Menu................................................................................................................................ 114

5

COMe-bPC2 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2012 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

6

COMe-bPC2 / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-bPC2 / Introduction

2 Introduction

2.1 Product Description

The COMe-bPC2 module unifies the 45 nm generations of Intel® Core™ 2 Duo processors with the new SSE4 instruction set
and the chipset Intel® GS45, GM45 and GL40. This combination really sets new standards in many terms: more
performance than ever on COM Express® form factor, outstanding performance-power-ratio, fast DDR3 SO-DIMM memory
up to 8 GB and L2 cache up to 6 MB, the module really opens up new application fields.

COMe-bPC2 is available with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256
mm². Thus, valuable space for further features is gained: among others two stacked SO-DIMM sockets for dual channel
memory. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best
energy-efficiency. The bigger Intel® Performance Package offer high performance for bargain pricing.

Especially, its 4 Serial ATA ports and the native RAID support establishes the COMe-bPC2 perfectly for heavy data sensitive
applications. On top of all that, DirectX® 10 supports Windows® perfectly.

Like all KontronCOM Express® modules, it is strictly compliant to the COM Express® standard. Therefore, upgrading
existing carrier boards gets so easy and minimizes redesign efforts.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known

as ETXexpress®

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known

as microETXexpress®

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as

nanoETXexpress

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

8

COMe-bPC2 / Introduction

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO

1x optional 1x optional - -

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

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COMe-bPC2 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bPC2. Additional references are are available from your Kontron Support or from
PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available from the PIGMG website by filling out the order form.

» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum

flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can
differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade
path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A
properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

10

COMe-bPC2 / Product Specification

3 Product Specification

3.1 Modules & Accessories

The COM Express® basic sized Computer-on-Module COMe-bPC2 (Internal project code CNTG / CNT2 / CNTX) follows pin-out
Type 2 and is compatible to PICMG specification COM.0 Rev 1.0. The COMe-bPC2, based on Intel's Montevina platform is
available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor Socket GMCH IOH

38009-0000-25-2 COMe-bPC2 T9400 Intel® Core™2 Duo T9400 BGA479 GM45 ICH9EM

38009-0000-23-2 COMe-bPC2 P8400 Intel® Core™2 Duo P8400 BGA479 GM45 ICH9EM

38009-0000-19-0 COMe-bPC2 T3100 Intel® Core™2 Duo T3100 PGA478 GL40 ICH9M

38009-0000-20-0 COMe-bPC2 CM575 Intel® Celeron® 575 PGA478 GL40 ICH9M

38008-0000-23-2 COMe-bPC2 SP9300 Intel® Core™2 Duo SP9300 BGA956 GS45 ICH9M-SFF

38008-0000-19-2 COMe-bPC2 SL9400 Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF

38008-0000-12-2 COMe-bPC2 SU9300 Intel® Core™2 Duo SU9300 BGA956 GS45 ICH9M-SFF

38008-0000-12-3 COMe-bPC2 CM723 Intel® Celeron®M ULV 723 BGA956 GS45 ICH9M-SFF

38008-0000-12-1 COMe-bPC2 CM722 Intel® Celeron®M ULV 722 BGA956 GS45 ICH9M-SFF

Extended temperature modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor Socket GMCH IOH

38008-0000-19-2EXT COMe-bPC2 SL9400 E1 Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF

Industrial grade modules (E2, -40°C to 85°C operating)

Product Number Product Name Processor Socket GMCH IOH

38011-0000-19-2 COMe-bPC2 SL9400 XT Intel® Core™2 Duo SL9400 BGA956 GS45 ICH9M-SFF

38011-0000-12-2 COMe-bPC2 SU9300 XT Intel® Core™2 Duo SU9300 BGA956 GS45 ICH9M-SFF

38011-0000-12-1 COMe-bPC2 CM722 XT Intel® Celeron®M ULV 722 BGA956 GS45 ICH9M-SFF

11

COMe-bPC2 / Product Specification

Accessories

Product Number Carrier Boards

38102-0000-00-1 COM Express® Reference Carrier Type 2 (8mm COMe connector)

38104-0000-00-0 COM Express® Eval Carrier Type 2 (Niles Canyon, 5mm COMe connector)

38104-0000-00-1 COM Express® Eval Carrier Type 2 (Topanga Canyon, 5mm COMe connector)

Product Number Memory

97015-1024-10-0 DDR3-1066 SODIMM 1GB

97015-2048-10-0 DDR3-1066 SODIMM 2GB

97015-4096-10-0 DDR3-1066 SODIMM 4GB

97015-1024-10-2 DDR3-1066 SODIMM 1GB E2

97015-2048-10-2 DDR3-1066 SODIMM 2GB E2

97015-4096-10-2 DDR3-1066 SODIMM 4GB E2

Product Number Cooling & Mounting

38009-0000-99-0 HSP COMe-bPC2 GM45 thread

38009-0000-99-1 HSP COMe-bPC2 GM45 through

38009-0000-99-2 HSP COMe-bPC2 GL40 thread

38009-0000-99-3 HSP COMe-bPC2 GL40 through

38009-0000-99-0C05 HSK COMe-bPC2 GM45 act. setscrew thread

38009-0000-99-0C06 HSK COMe-bPC2 GM45 pas. setscrew thread

38008-0000-99-0 HSP COMe-bPC2 GS45 thread

38008-0000-99-1 HSP COMe-bPC2 GS45 through

38008-0000-99-0C05 HSK COMe-bPC2 GS45 act. setscrew thread

38008-0000-99-0C06 HSK COMe-bPC2 GS45 pas. setscrew thread

36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 20W TDP)

36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP)

38017-0000-00-0 COMe Mount KIT 8mm 1set

38017-0000-00-5 COMe Mount KIT 5mm 1set

38017-0100-00-5 COMe Mount KIT 5mm 100sets

38017-0100-00-0 COMe Mount Kit 8mm 100sets

Product Number Adapter & Cables

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)

96006-0000-00-7 ADA-Type2-DP3 (Adapter Card Type 2 module to 3x DisplayPort)

96006-0000-00-8 ADA-DP-LVDS (DP to LVDS adapter)

96082-0000-00-0 KAB-ADAPT-DP-DVI (DP to DVI adapter cable)

96083-0000-00-0 KAB-ADAPT-DP-VGA (DP to VGA adapter cable)

96084-0000-00-0 KAB-ADAPT-DP-HDMI (DP to HDMI adapter cable)

96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect FAN to module)

96079-0000-00-2 KAB-HSP 40mm (Cable adapter to connect FAN to module)

12

COMe-bPC2 / Product Specification

3.2 Functional Specification

Processor

The Intel® Core™2 Duo / Celeron® (Penryn) CPU family supports:

» Intel® Dynamic Acceleration (Turbo Mode)

» Intel® Virtualization Technology (VT-x)

» Intel® Trusted Execution Technology (TXT)

» Intel® 64

» Idle States

» Enhanced Intel SpeedStep® Technology

» Execute Disable Bit

» Intel® Dynamic FSB Frequency Switching (SuperLFM)

» Thermal Monitoring Technologies

CPU specifications

Processor Cores Core CPU Clock Turbo L2 Cache C-States FSB Speed VT-x TXT Intel® 64 EIST

Intel® Celeron® M722 1 45nm 1200MHz - 1MB C0 - C3 800 MHz No No Yes No

Intel® Celeron® M723 1 45nm 1200MHz - 1MB C0 - C3 800 MHz No No Yes No

Intel® Core™2 Duo SU9300 2 45nm 1200MHz 1400MHz 3MB C0 - C6 800 MHz Yes Yes Yes Yes

Intel® Core™2 Duo SL9400 2 45nm 1866MHz 2000MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes

Intel® Core™2 Duo SP9300 2 45nm 2266MHZ 2400MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes

Intel® Celeron® 575 1 65nm 2000MHz - 1MB C0 - C3 667 MHz No No Yes No

Intel® Celeron® T3100 2 45nm 1900MHz - 1MB C0 - C4 800 MHz No No Yes No

Intel® Core™2 Duo P8400 2 45nm 2266MHz 2400MHz 3MB C0 - C6 1066 MHz Yes Yes Yes Yes

Intel® Core™2 Duo T9400 2 45nm 2400MHz 2533MHz 6MB C0 - C6 1066 MHz Yes Yes Yes Yes

45nm: Penryn Core, 65nm: Merom Core

13

COMe-bPC2 / Product Specification

Chipset

The Intel Gen4 Graphics and Memory Controller Hub Cantiga supports:

» PCI Express Revision 1.1

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Trusted Execution Technology

» Intel® Active Management Technology 4.0

» Intel® ICH9 family IO Controller

GMCH and IOH specifications

Feature GS45/ICH9M-SFF GM45/ICH9EM GL40/ICH9M

TDP 12W + 2.5W 12W + 2.5W 12W + 2.5W

Max Memory 8GB 8GB 4GB

Memory Type DDR3-1066 DDR3-1066 DDR3-800

FSB 800/1066MHz 667/800/1066MHz 667MHz

PCIe x16 (PEG) YES YES NO

VT-d YES YES NO

AMT YES YES NO

iTPM YES YES NO

SATA RAID 0,1 0,1,Matrix -

The Intel® Trusted Execution Technology (TXT) and Active Management Technology (AMT)
are not supported by default on COMe-bPC2. Please contact your local sales or support.

Memory

Sockets

2x DDR3 SO-DIMM

Memory Type

DDR3-667/800/1066

Maximum Size

8GB (GL40: 4GB)

Technology

Dual Channel

Only use non-ECC DDR3 memory modules. Kontron Part.No: 97015-xxxx-xx-x. If only one
RAM module is used, it must be plugged into the lower socket if it is a board with GS45. On
modules with GM45 or GL40 chipset a single RAM module must be plugged in the upper RAM
socket. Otherwise there might be issues with the management engine, which lead to
several problems.

14

COMe-bPC2 / Product Specification

Graphics Core

The integrated Intel® GMA X4500MHD (Gen5.5) supports:

Graphics Core Render Clock

GS45: 533/320MHz,

GM45: 533MHz

GL40: 400MHz

Execution Units / Pixel Pipelines

10

Max Graphics Memory

1720MB

GFX Memory Bandwidth (GB/s)

GS45/GM45: 17, GL40: 12.8

GFX Memory Technology

DVMT 5.0

API (DirectX/OpenGL)

10 / 2.1

Shader Model

4.0

Hardware accelerated Video

MPEG2, VC-1, AVC, Blu-Ray

Independent/Simultaneous Displays

2

Display Port

YES

HDCP support

HDCP 1.2 (Keys optional)

Monitor output

CRT max Resolution

2048x1536

TV out:

YES

LVDS

LVDS Bits/Pixel

1x18 / 2x18

LVDS Bits/Pixel with dithering

1x24 / 2x24

LVDS max Resolution:

1600x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

1x PEG 1.0 (not with GL40)

Digital Display Interface DDI1

DP++/SDVOB

Digital Display Interface DDI2

DP++/SDVOC

Digital Display Interface DDI3

DP++

Maximum Resolution on DDI

2560x1600

The discrete PEG graphics port and the digitial display interfaces are multiplexed and
cannot be used simultaneously. Display Port plus plus (DP++) allows usage as DisplayPort,
HDMI or DVI

PEG Configuration

The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-bPC2 supports following PEG Port configuration when used as PCI Express Interface:

» 1×16

» 1×1

15

COMe-bPC2 / Product Specification

Storage

onboard SSD

-

SD Card support

-

IDE Interface

ETXe-PC: JM20335 USB2IDE / ETXe-PC-XT: JMD330 SATA2PATA

Serial-ATA

4x SATA 3Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier

SATA RAID

0, 1, MATRIX (ICH9M: no RAID)

Connectivity

USB

8x USB 2.0

USB Client

-

PCI

PCI Rev 2.3 (33MHz/3.3V)

PCI External Masters

4

PCI Express

5x PCIe x1 Gen1

Max PCI Express

6x PCIe x1 without LAN

PCI Express x2/x4 configuration

YES (external HW strap otion)

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82567 (Boazman)

It is also possible to run the 1st 4 x1 lanes as 1 x4 lane. For that please pull-up the signal A33 and A29 to 3.3V on the
baseboard.

Express Card hotplug functionality is only available, when in BIOS setup the PCIexpress
lane is switched from [AUTO] which is default setting to [ENABLED]

Ethernet

The Intel® 82567 (Boazman) ethernet supports:

» Jumbo Frames

» MACsec IEEE 802.1 AE

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Audio

HD Audio

Onboard Hardware Monitor

ON Semi ADT7475

Trusted Platform Module

iTPM 1.2 (int. in ICH9M-SFF/M-E)

Miscellaneous

-

Baseboards with AC'97 codec only are not supported.

Kontron Features

External I2C Bus

Fast I2C

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32 / PICMG EAPI

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Single Staged

16

COMe-bPC2 / Product Specification

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 18V

ACPI

ACPI 3.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

DPST 4.0

Power Consumption and Performance

Full Load Power Consumption

13 - 50W

Kontron Performance Index

2942 - 6347

Kontron Performance/Watt

124 - 225

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The COMe-bPC2 supports:

» Microsoft Windows XP x86/x64

» Microsoft Windows Vista x86/x64

» Microsoft Windows 7 x86/x64

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Linux

» WindRiver VxWorks

» QNX Neutrino 6.5

17

COMe-bPC2 / Product Specification

3.3 Block Diagram

18

COMe-bPC2 / Product Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 18V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.3V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different COMe-bPC2 variants is 13 - 50W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

19

COMe-bPC2 / Product Specification

3.4.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.4.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 18V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

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COMe-bPC2 / Product Specification

3.5 Power Control

Power Supply

The COMe-bPC2 supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-bPC2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

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COMe-bPC2 / Product Specification

3.6 Environmental Specification

3.6.1 Temperature Specification

General Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended (E1) -25°C to +75°C -30°C to +85°C

Industrial grade (E2) -40°C to +85°C -40°C to +85°C

Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.6.2 Humidity

» Operating: 10% to 90% (non condensing)

» Non operating: 5% to 95% (non condensing)

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COMe-bPC2 / Product Specification

3.7 Standards and Certifications

RoHS

The COMe-bPC2 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The COMe-bPC2 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

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COMe-bPC2 / Product Specification

Shock & Vibration

The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-bPC2 follows the requirements for electromagnetic

compatibility standards

» EN55022

» EN55011

» EN55024

» FCC15

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COMe-bPC2 / Product Specification

3.8 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): GS45 variant: 166409 @ 40°C

GM45 variant: 166443 @ 40°C
XT variant: 184428 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

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COMe-bPC2 / Product Specification

3.9 Mechanical Specification

Dimension

» 95.0 mm x 125.0 mm

» Hight approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

3.10 Module Dimensions

3.10.1 38008-XXXX-XX-X

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COMe-bPC2 / Product Specification

3.10.2 38009-XXXX-XX-X

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COMe-bPC2 / Product Specification

3.11 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bPC2. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other
cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the COMe-bPC2. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please
see the COM Express® Design Guide for further information on thermal management.

3.12 Heatspreader

Documentation and CAD drawings of COMe-bPC2 heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

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COMe-bPC2 / Product Specification

3.13 Onboard Fan Connector

Location and Pinout of Fan Connector

The onboard fan connector (J1) can be found near the CPU at the shorter edge of the module. Use adaptor KAB-HSP
(96079-0000-00-0) to connect a standard FAN.

Connector J1 has following specification:

» Part number (Molex) J8: 53261-0390

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

The Pin assignement is:

» Pin1: Tacho

» Pin2: VCC

» Pin3: GND

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COMe-bPC2 / Product Specification

3.13.1 BIOS Settings for Fan Control

The fan can be controlled via the BIOS Settings “Advanced Hardware Health Module Hardware Health”→ →

In general 4 modes are possible

» Auto Fan Mode: Temperature Values can be selected to control the Fan

» Fan Always On Full: Fan is always full on

» Fan Disable Mode: Fan is disabled

» Fan Manually Mode: A fixed PWM value (0…255) can be entered to run the fan at a selected speed

The used hardware monitor onboard is an ADT7475. For additional information please refer to the regarding datasheet.

3.13.2 Electrical Characteristics

Starting with revision 2.0 there are 2 version of onboard fan control possible. Our standard modules have the simple
version populated. For custom projects it is possible to populate a more sophisticated one. The differences are:

Features Premium Fan Base Fan

Input Voltage Range

8.5V - 18V 8.5V - 18V

Output Voltage

5V / 12V Only 12V (switch in BIOS without function)

Max. output current

1A 0.3A

The premium fan option is only available on moldules with GS45 MCH.

The fan voltage is in both versions VCC of the board and limited to 12V max.

The Fan out voltage output is not short circuit proof. If necessary the user has to ensure
that the circuit is protected externally, for example by a fuse on the backplane.

With premium fan solution it is recommended to select the correct fan voltage first in BIOS
setup and then connect the fan.

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

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