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COMe-bKL6
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Kontron COMe-bKL6 User Manual

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USER GUIDE
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Doc. User Guide Rev.1.2
Doc. ID: 1061-1954
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COME
-BKL6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration, particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on the part of Kontron with respect to technical processes described in the user guide or any product characteristics set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these products and makes no representations or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise specified. Applications that are described in this user guide are for illustration purposes only. Kontron makes no representation or warranty that such application will be suitable for the specified use without further testing or modification. Kontron expressly informs the user that this user guide only contains a general description of processes and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron. Kontron points out that the information contained in this user guide is constantly being updated in line with the technical alterations and improvements made by Kontron to the products and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5 86156 Augsburg Germany www.kontron.com
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High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at your risk. To minimize the risks associated with your products and applications, you should provide adequate design and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as device in High Risk Applications. All application and safety related information in this document (including application descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference only
.
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Revision History
Revision Brief Description of Changes Date of Issue
1.0 Initial version 2017-July-05
1.1 Updated BIOS set up option information in Chapters 3.2.2 and 6.5.1 Updated test Information in Chapter Standards and Certifications
2017-Aug-22
1.2 Updated Kontron to Kontron S&T AG, added a GPIO Chapter and Updated the BIOS Setup information in Advanced menu and Chipset menu.
2018-Jan-23
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms­and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions
.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron training academy, and more visit http://www.kontron.com/support-and-services/services
.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact Kontron support
. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.
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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided, will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided, could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided, may result in minor or moderate injury.
Electric Shock! This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products
. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in
damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface! Do NOT touch! Allow to cool before servicing.
Laser! This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.
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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life expectancy of your product can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the product’s main disconnect device.
Warning All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock! Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious electrical shock hazards can exist during all installation, repair, and maintenance operations on this product. Therefore, always unplug the power cable and any other cables which provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain connected. The earth ground cable shall be the last cable to be disconnected or the first cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device! Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices, jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the batteries or conductive circuits on the product.
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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific environmental requirements. This also applies to the operational temperature range of the specific board version that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with environmental laws, regulations, and other environmentally oriented requirements. For more information regarding Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate­responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the components used are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE) Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron. Kontron follows the WEEE directive You are encouraged to return our products for proper disposal.
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Table of Contents
Symbols ................................................................................................................................................................................................................. 6
For Your Safety .................................................................................................................................................................................................... 7
High Voltage Safety Instructions .................................................................................................................................................................. 7
Special Handling and Unpacking Instruction ............................................................................................................................................ 7
Lithium Battery Precautions .......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling .................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ............................................................................................................................................................................................... 9
List of Tables ....................................................................................................................................................................................................... 11
List of Figures .................................................................................................................................................................................................... 12
1/ Introduction .......................................................................................................................................................................................... 13
1.1. Product Description................................................................................................................................................................................... 13
1.2. Product Naming Clarification ................................................................................................................................................................ 13
1.3. COM Express® Documentation ............................................................................................................................................................. 13
1.4. COM Express® Functionality ................................................................................................................................................................. 14
1.5. COM Express® Benefits ........................................................................................................................................................................... 14
2/ Product Specification ........................................................................................................................................................................ 15
2.1. Module Variants ........................................................................................................................................................................................ 15
2.1.1. Commercial Grade Modules (0°C to +60°C) ................................................................................................................................... 15
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C) ................................................................................................... 15
2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C) .............................................................................................. 16
2.2. Accessories ................................................................................................................................................................................................. 16
2.3. Functional Specifications ....................................................................................................................................................................... 19
2.3.1. Block Diagram COMe-bKL6 ................................................................................................................................................................ 19
2.3.2. Processor ................................................................................................................................................................................................ 20
2.3.3. Platform Controller Hub ..................................................................................................................................................................... 21
2.3.4. System Memory .................................................................................................................................................................................... 21
2.3.5. Graphics ................................................................................................................................................................................................... 22
2.3.6. LVDS.......................................................................................................................................................................................................... 22
2.3.7. Audio ......................................................................................................................................................................................................... 23
2.3.8. PCI Express (PCIE) Configuration .................................................................................................................................................... 23
2.3.9. USB ............................................................................................................................................................................................................ 25
2.3.10. SATA........................................................................................................................................................................................................ 25
2.3.11. Ethernet .................................................................................................................................................................................................. 25
2.3.12. COMe High-speed Serial Interfaces Overview ......................................................................................................................... 26
2.3.13. Storage Features ................................................................................................................................................................................ 27
2.3.14. BIOS/Software Features.................................................................................................................................................................. 27
2.3.15. COMe Features .................................................................................................................................................................................... 27
2.3.16. Kontron Features................................................................................................................................................................................ 27
2.4. Electrical Specification .......................................................................................................................................................................... 28
2.4.1. Power Supply Voltage Specifications ............................................................................................................................................ 28
2.4.2. Power Management ........................................................................................................................................................................... 28
2.4.3. Power Supply Control Settings ....................................................................................................................................................... 29
2.4.4. Power Supply Modes .......................................................................................................................................................................... 29
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2.5. Thermal Management ............................................................................................................................................................................ 31
2.5.1. Heatspreader and Active or Passive Cooling Solutions ............................................................................................................ 31
2.5.2. Active or Passive Cooling Solutions ................................................................................................................................................ 31
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly............................................................................................... 31
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly ........................................................................................ 31
2.5.5. On Board Fan Connector .................................................................................................................................................................... 32
2.6. Environmental Specification................................................................................................................................................................ 33
2.6.1. Temperature........................................................................................................................................................................................... 33
2.6.2. Humidity .................................................................................................................................................................................................. 33
2.7. Standards and Certifications ............................................................................................................................................................... 34
2.8. Mechanical Specification ...................................................................................................................................................................... 35
2.8.1. Dimensions ............................................................................................................................................................................................. 35
2.8.2. Height ....................................................................................................................................................................................................... 35
2.8.3. Heatspreader Dimensions ................................................................................................................................................................ 36
3/ Features and Interfaces .................................................................................................................................................................. 37
3.1. LPC ................................................................................................................................................................................................................. 37
3.2. Serial Peripheral Interface (SPI) ......................................................................................................................................................... 37
3.2.1. SPI boot .................................................................................................................................................................................................... 38
3.2.2. Using an External SPI Flash .............................................................................................................................................................. 38
3.2.3. External SPI flash on Modules with Intel® ME ........................................................................................................................... 39
3.3. Fast I2C ........................................................................................................................................................................................................ 39
3.4. UART ............................................................................................................................................................................................................ 39
3.5. Dual Staged Watchdog Timer (WTD) ................................................................................................................................................ 39
3.5.1. WDT Signal .............................................................................................................................................................................................. 40
3.6. Real Time Clock (RTC) ............................................................................................................................................................................ 40
3.7. GPIO .............................................................................................................................................................................................................. 40
3.8. Trusted Platform Module (TPM 2.0) .................................................................................................................................................. 41
3.9. Kontron Security Solution ...................................................................................................................................................................... 41
3.10. SpeedStep® Technology ....................................................................................................................................................................... 41
3.11. Intel® Optane™ Memory ....................................................................................................................................................................... 41
4/ System Resources ............................................................................................................................................................................. 43
4.1. Interrupt Request (IRQ) Lines .............................................................................................................................................................. 43
4.2. Memory Area ............................................................................................................................................................................................ 43
4.3. I/O Address Map ...................................................................................................................................................................................... 44
4.4. Peripheral Component Interconnect (PCI) Devices ..................................................................................................................... 45
4.5. I2C Bus ......................................................................................................................................................................................................... 45
4.6. System Management (SM) Bus .......................................................................................................................................................... 46
5/ COMe Interface Connectors ........................................................................................................................................................... 47
5.1. X1A and X1B Signals ................................................................................................................................................................................. 47
5.2. X1A and X1B Pin Assignment ................................................................................................................................................................ 48
5.2.1. Connector X1A Row A1 - A110 ............................................................................................................................................................ 49
5.2.2. Connector X1A Row B1 - B100 .......................................................................................................................................................... 52
5.2.3. Connector X1B Row C1 - C110 ............................................................................................................................................................ 55
5.2.4. Connector X1B Row D1 - D110 ........................................................................................................................................................... 58
6/ uEFI BIOS ................................................................................................................................................................................................ 61
6.1. Starting the uEFI BIOS .............................................................................................................................................................................. 61
6.2. Setup Menus ............................................................................................................................................................................................. 62
6.2.1. Main Setup Menu .................................................................................................................................................................................. 63
6.2.2. Advanced Setup Menu ........................................................................................................................................................................ 65
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6.2.3. Chipset Setup Menu ............................................................................................................................................................................ 76
6.2.4. Security Setup Menu ........................................................................................................................................................................... 86
6.2.5. Boot Setup Menu .................................................................................................................................................................................. 87
6.2.6. Save and Exit Setup Menu ................................................................................................................................................................. 88
6.3. The uEFI Shell............................................................................................................................................................................................ 90
6.3.1. Basic Operation of the uEFI Shell .................................................................................................................................................... 90
6.4. uEFI Shell Scripting .................................................................................................................................................................................. 91
6.4.1. Startup Scripting .................................................................................................................................................................................... 91
6.4.2. Create a Startup Script ........................................................................................................................................................................ 91
6.4.3. Examples of Startup Scripts ............................................................................................................................................................. 91
6.5. Firmware Update ..................................................................................................................................................................................... 92
6.5.1. Updating Procedure ............................................................................................................................................................................. 92
About Kontron .................................................................................................................................................................................................. 95
List of Tables
Table 1: Pin Assignment of Type 6 and COMe-bKL6 ............................................................................................................................. 14
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating) ................................................................ 15
Table 3: Product Number for Industrial Grade Modules including Rapid Shutdown (R E2S, -40°C to +85°C operating)16
Table 4: Product Accessories - COMe-bKL6 ............................................................................................................................................ 16
Table 5: COMe Type 6 Accessories ............................................................................................................................................................. 16
Table 6: General Accessories........................................................................................................................................................................ 17
Table 7: Memory Modules - COMe-bKL6 .................................................................................................................................................. 18
Table 8: Processor Specifications .............................................................................................................................................................. 20
Table 9: Heatspreader Test Temperature Specifications ................................................................................................................... 31
Table 10: 3-Pin Fan Connector Pin Assignment ..................................................................................................................................... 32
Table 11: Electrical Characteristics of the Fan Connector .................................................................................................................. 32
Table 12: Temperature Grade Specifications ......................................................................................................................................... 33
Table 13: Humidity Specification ................................................................................................................................................................. 33
Table 14: Standards and Certification Compliance .............................................................................................................................. 34
Table 15: Supported BIOS Features ........................................................................................................................................................... 37
Table 16: SPI Boot Pin Configuration ......................................................................................................................................................... 38
Table 17: Supported SPI Boot Flash Types for 8-SOIC Package ....................................................................................................... 38
Table 18: Dual Stage Watchdog Timer- Time-out Events ................................................................................................................. 40
Table 19: Interrupt Requests ........................................................................................................................................................................ 43
Table 20: Designated Memory Locations ................................................................................................................................................ 43
Table 21: Designated I/O Port Address Ranges ..................................................................................................................................... 44
Table 22: I2C Bus Port Addresses .............................................................................................................................................................. 45
Table 23: SMBus Addresses ......................................................................................................................................................................... 46
Table 24: General Signal Description ........................................................................................................................................................ 48
Table 25: Connector X1A Row A Pin Assignment (A1-A110) ............................................................................................................... 49
Table 26: Connector X1A Row B Pin Assignment (B1-B110) ............................................................................................................... 52
Table 27: Connector X1B Row C Pin Assignment (C1-C110) ................................................................................................................ 55
Table 28: Connector X1B Row D Pin Assignment (D1-D110) .............................................................................................................. 58
Table 29: Navigation Hot Keys Available in the Legend Bar............................................................................................................... 61
Table 30: Main Setup Menu Sub-screens ............................................................................................................................................... 64
Table 31: Advanced Setup menu Sub-screens and Functions .......................................................................................................... 65
Table 32: Chipset Set > System Agent Configuration Sub-screens and Functions ................................................................... 76
Table 33: Chipset Set > PCH-IO Configuration Sub-screens and Functions ................................................................................ 80
Table 34: Security Setup Menu Functions ............................................................................................................................................... 86
Table 35: Boot Setup Menu Functions ...................................................................................................................................................... 87
Table 36: Save and Exit Setup Menu Functions ..................................................................................................................................... 88
Table 37: List of Acronyms .......................................................................................................................................................................... 93
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List of Figures
Figure 1: COMe-bKL6 Functional Block Diagram .................................................................................................................................... 19
Figure 2: Module Dimensions ...................................................................................................................................................................... 35
Figure 3: Module Height ................................................................................................................................................................................ 35
Figure 4: Heatspreader Location and Dimensions ............................................................................................................................... 36
Figure 5: X1A and X1B COMe Interface Connectors............................................................................................................................... 47
Figure 6: Main Setup Menu Initial Screens .............................................................................................................................................. 63
Figure 7: Advanced Setup Menu Initial Screen ....................................................................................................................................... 65
Figure 8: System Agent Configuration Menu Initial Screen ............................................................................................................... 76
Figure 9: PCH-IO Configuration Menu Initial Screen ............................................................................................................................ 80
Figure 10: Security Setup Menu Initial Screen ........................................................................................................................................ 86
Figure 11: Boot Setup Menu Initial Screen ................................................................................................................................................ 87
Figure 12: Save and Exit Setup Menu Initial Screen .............................................................................................................................. 88
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1/ Introduction
1.1. Product Description
The COMe-bKL6 is a basic form factor COM Express® type 6 Computer-On-Module based on the Intel® 7th Generation Core™ series family of processors, known as Kaby Lake-H within this user guide. The COMe-bKL6 supports additional communication interfaces via a separate chipset Intel’s® mobile (CM238 or QM175). The Kaby Lake–H combines increased efficiency and performance with TDP as low as 25 W, and no more then 45 W, with Intel’s ® HD Graphics Gen9 capabilities.
Basic COMe-bKL6 features are:
Intel® 7th Generation Core™ series, Kaby Lake-H family with CM238/QM175 Up to 32 GByte with 2 x DDR4-2400 SO-DIMM (non-ECC/ECC) High-speed connectivity 8x PCIe x1, 1x PEG x16, 1x 1 Gb Ethernet, 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 Support for both commercial and Industrial temperature grade environments
1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules consist of:
Short form of the industry standard
COMe-
Module form factor
b=basic (125mm x 95mm) c=compact (95mm x 95mm) m=mini (84mm x 55mm)
Intel’s® processor code name
KL = Kaby Lake
Pinout type
Type 6 Type10
Available temperature variants
Commercial Extended (E1) Industrial (E2) Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)
Processor Identifier Chipset identifier (if chipset assembled)
Memory size
Memory module (#G) / eMMC SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. The COM Express document is available on the PICMG® website.
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1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220 pin connectors. Each connector has two rows called Row A & B on the primary connector and Row C & D on the secondary connector. COM Express® Computer-On­Modules feature the following maximum amount of interfaces according to the PICMG module pinout type.
Table 1: Pin Assignment of Type 6 and COMe-bKL6
Feature Type 6 Pinout COMe-bKL6 Pinout
HD Audio
1x 1x
Gbit Ethernet
1x 1x
Serial ATA
4x 4x
PCI Express x 1
8x 8x
PCI Express x16 (PEG)
1x 1x
USB Client
1x (optional) 1x (optional)
USB
4x USB 3.0 (Incl. USB 2.0) + 4x USB 2.0
4x USB 3.0 (Incl. USB 2.0) + 4x USB 2.0
VGA
1x 1x optional DP to VGA converter
LVDS (eDP)
Dual Channel Dual Channel LVDS with option to
overlay (eDP)
DP++ (DP/HDMI/DVI)
3x 3x
LPC
1x 1x
External SMB
1x 1x
External I2C
1x 1x
GPIO
8x 8x
SDIO shared w/GPIO
UART (2-wire COM)
2x 2x
FAN PWM out
1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility differentiates products at various price and performance points and provides a built-in upgrade path when designing future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
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2/ Product Specification
2.1. Module Variants
The COMe-bKL6 is available in different processor, chipset and temperature variants to cover demands in performance, price and power.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number Product Name Description
38032-0000-30-4 COMe-bKL6 E3-1505M CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505M v6, 4x3.0GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-22-4 COMe-bKL6 E3-1505L CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505L v6, 4x2.2GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-30-7 COMe-bKL6 i7-7820EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i7-7820EQ, 4x3.0GHz, QM175 PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-29-5 COMe-bKL6 i5-7440EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i5-7440EQ, 4x2.9GHz, QM175 PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-21-5 COMe-bKL6 i5-7442EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i5-7442EQ, 4x2.1GHz, QM175 PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-29-3 COMe-bKL6 i3-7100E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7100E, 2x2.9 GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-21-3 COMe-bKL6 i3-7102E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7102E, 2x2.1 GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C)
Extended temperature grade modules (E1, -25°C to +75°C) are available as a standard product number, on request. Contact your local sales representative to find out more about available extended temperature variants.
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2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C)
Industrial temperature grade modules (E2S, -40°C to +85 °C) are available as a project based custom product number. For further information, contact your local sales representative. Alternatively, consider using the R E2S variants.
2.1.3.1. Rapid Shutdown Industrial Temperature Grade Modules (R E2S, -40°C to +85°C)
The following table lists R E2S modules available with Kontron Rapid Shutdown support and E2 industrial temperature grade (-40°C to +85°C) by screening.
For Further information regarding the screening process, contact Kontron Support.
Table 3: Product Number for Industrial Grade Modules including Rapid Shutdown (R E2S, -40°C to +85°C operating)
Product Number Product Name Description
38033-0000-30-4 COMe-bKL6R E2S E3-1505M CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505M v6, 4x3.0GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade
38033-0000-22-4 COMe-bKL6R E2S E3-1505L CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505L v6, 4x2.2GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade
38033-0000-29-3 COMe-bKL6R E2S i3-7100E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7100E, 2x2.9 GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade
38033-0000-21-3 COMe-bKL6R E2S i3-7102E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7102E, 2x2.1 GHz, CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade
2.2. Accessories
Accessories are either COMe-bKL6 product specific, type 6 COMe pinout specific, or general accessories including memory modules. For more information, contact your local Kontron sales representative or Kontron Inside Sales.
Table 4: Product Accessories - COMe-bKL6
Part Number Heatspreader Description
38030-0000-99-0 HSP COMe-bSL6/bKL6 Cu-core threaded For all CPUs and temperature grades
38030-0000-99-1 HSP COMe-bSL6/bKL6 Cu-core through For all CPUs and temperature grades
Table 5: COMe Type 6 Accessories
Part Number COMe Carrier Project
Code
Description
38115-0000-00-x COM Express®
Reference Carrier-i Type 6
ADTI Thin-mITX Carrier with 5 mm COMe
connector
38114-0000-00-0 COM Express®
Reference Carrier Type 6
ADAS mITX Carrier with 8 mm COMe connector
38106-0000-00-0 COM Express®
Eval Carrier Type 6
Topanga Canyon
ATX Carrier with 5 mm COMe connector
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Part Number COMe Adapter / Card Project
Code
Description
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation
Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (Sandwich) Adapter Card for 3x
DisplayPort
96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
Part Number COMe Starter kit Project
Code
Description
38114-0000-00-S COMe Ref. Starter kit T6 ADAS Starter kit with COMe Reference Carrier T6
38106-0000-00-S COMe Eval. Starter kit T6 Topanga
Canyon
Starter kit with COMe Evaluation Carrier T6
Table 6: General Accessories
Part Number Cooling Solutions Description
38025-0000-99­0C05
HSK COMe-bHL6/bBL6/bSL6/bKL6 active (w/o HSP)
For all CPUs and commercial temperature grade usage, to be mounted on HSP
38025-0000-99­0C06
HSK COMe-bHL6/bBL6/bSL6/bKL6 passive (w/o HSP)
For all CPUs and commercial temperature grade usage, to be mounted on HSP
Part Number Mounting Description
38017-0000-00-5 COMe Mount KIT 5 mm 1 set Mounting Kit for 1 module including screws
for 5 mm connectors
38017-0100-00-5 COMe Mount KIT 5 mm 100 sets Mounting Kit for 100 modules including
screws for 5 mm connectors
38017-0000-00-0 COMe Mount KIT 8 mm 1 set Mounting Kit for 1 module including screws
for 8 mm connectors
38017-0100-00-0 COMe Mount KIT 8 mm 100 sets Mounting Kit for 100 modules including
screws for 8 mm connectors
Part Number Display Adapter Description
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Description
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect fan to module
(COMe basic/compact)
96079-0000-00-2 KAB-HSP 40 mm Cable adapter to connect fan to module
(COMe basic/compact)
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Table 7: Memory Modules - COMe-bKL6
Part Number Memory (validated reference types)
97017-4096-24-0 DDR4-2400 SODIMM 4 GB_COM DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-8192-24-0 DDR4-2400 SODIMM 8 GB_COM DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-1600-24-0 DDR4-2400 SODIMM 16 GB_COM DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-4096-24-2 DDR4-2400 SODIMM 4 GB E2_COM DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400
SO-DIMM
97017-8192-24-2 DDR4-2400 SODIMM 8 GB E2_COM DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400
SO-DIMM
97017-1600-24-2 DDR4-2400 SODIMM 16 GB E2_COM DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400
SODIMM
Part Number Memory ECC (validated reference types)
97018-4096-24-0 DDR4-2400 SODIMM 4 GB ECC_COM DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-8192-24-0 DDR4-2400 SODIMM 8 GB ECC_COM DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-1600-24-0 DDR4-2400 SODIMM 16 GB ECC_COM DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-4096-24-2 DDR4-2400 SODIMM 4 GB ECC
E2_COM
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4­2400 SO-DIMM
97018-8192-24-2 DDR4-2400 SODIMM 8 GB ECC
E2_COM
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4­2400 SO-DIMM
97018-1600-24-2 DDR4-2400 SODIMM 16 GB ECC
E2_COM
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4­2400 SO-DIMM
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2.3. Functional Specifications
2.3.1. Block Diagram COMe-bKL6
The following figure displays the system block diagram applicable to all COMe-bKL6 modules.
Figure 1: COMe-bKL6 Functional Block Diagram
LVDS
VGA
SMB
GPIO
Ctrl
Mgmt
HDA
USB
SATA#0-3
SPI
Intel® Mobile CM238 / QM175 PCH
GPIO
PCIe #6-7
PEG x16
USB #0-3
(USB3.0)
PwrCtrl
SysMgmt
PCIe
USB #0-3
(USB2.0)
PWM FAN2
I2C
SER0 SER1
eDP x2
USB #4-7
(USB 2.0)
PCIe #0-5
Intel® 7th Generation Core /
Intel® Xeon E3 v6 Family
Kaby Lake-H Series
LID
Sleep
SPI
BIOS Flash
Connector Option
Standard
component
GB LAN
Embedded Controller
HWM
Gen9 iGFX
FAN1
eDP2
LVDS
COM Express® connector AB – Pinout Type 6
GBLan
Intel® I219LM
VCC
5VSB
VBAT
HWM
SMB
Power sequencing
Watchdog
LPC2I2C
GPIO Buffer
I2C
S5eco
EEPROM
TPM
UART
COM Express® connector CD – Pinout Type 6
DDR4 SODIMM
ECC/non-ECC
VCC
DDR4 SODIMM
ECC/non-ECC
xHCI
DP++
CONFIG
x16/x8/x4
PEG Config
CPLD
JTAG
SPD
GBE MAC
Security
Chip
LPC
xHCI
DP2 VGA
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2.3.2. Processor
The Intel® 7th Generation Kaby Lake – H product series of Intel® Xeon® and Core™ processors uses the 14 nm processor technology with 42 mm x 28 mm package size and BGA 1440.
General processor specifications shared by the Intel® Core™ and Celeron® processor variants are:
Intel® 64 Architecture Idle States Intel® Virtualization Technology (VT-x) Virtualization Technology for Directed I/O (VT-d) Enhanced Intel Speedstep® Technology Thermal Monitoring Technology Intel® AES New Instructions (AES-NI) OS Guard Execute Disable Bit
The following table lists the general Intel® Xeon® and Core™ Kaby Lake- H processor specifications.
Not all the items specified in Table 8: Processor Specifications are compatible with the COMe-bKL6 functional specification. For more information on features supported by the COMe-bKL6, see the relevant subheading in Chapter 2.3 Functional Specifications.
Table 8: Processor Specifications
Intel® Kaby lake-H Processor
Xeon® Xeon® Core™ Core™ Core™ Core™ Core™
E3-1505L v6
E3-1505M v6
i7 – 7820EQ
i5­7442EQ
i5­7440EQ
i3­7100E
i3­7102E
# of Cores
4 4 4 4 4 2 2
# of Threads
8 8 8 4 4 4 4
Processor Base Frequency
2.2 GHz 3 GHz 3 GHz 2.1 GHz 2.9 GHz 2.9 GHz 2.1 GHz
Max Turbo Frequency
3 GHz 4 GHz 3.7 GHz 2.9 GHz 3.6 GHz 2.9 GHZ 2.1 GHz
Thermal Design Power (TDP)
25 W 45 W 45 W 25 W 45 W 35 W 25 W
TDP down
35 W 35 W 35 W
Cache
8 MB 8 MB 8 MB 6 MB 6 MB 3 MB 3 MB
Memory Types
DDR4-2400 DDR4-2400
LPDDR-2133 DDR3L-1600
DDR4-2400 DDR4-2400 DDR4-2400 DDR4-2400 DDR4-2400
Max.# Mem. Channels
2 2 2 2 2 2 2
Max. Memory Size
64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB
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Intel® Kaby lake-H Processor
Xeon® Xeon® Core™ Core™ Core™ Core™ Core™
E3-1505L v6
E3-1505M v6
i7 – 7820EQ
i5­7442EQ
i5­7440EQ
i3­7100E
i3­7102E
Max. Memory Bandwidth
34.1 GB/s 34.1 GB/s 34.1 GB/s 34.1 GB/s 34.1 GB/s 34.1 GB/s 34.1 GB/s
ECC Memory
Supported Supported Not
supported
Not supported
Not supported
Supported Supported
HD Graphics
HD Graphic P630
HD Graphics P630
HD Graphics 630
HD Graphics 630
HD Graphics 630
HD Graphics 630
HD Graphics 630
PCIe Express Configuration
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
1x16, 2x8, 1x8+2x4
Max. # PCIe Lanes
16 16 16 16 16 16 16
2.3.3. Platform Controller Hub
The Kaby Lake –H series of processors is a two-chip solution implementing either the mobile Intel® CM238 chipset or mobile Intel® QM175 chipset, for the Platform Controller Hub (PCH). Which chipset is implemented depends on the temperature grade and processor variant:
Intel® QM175 (Commercial temperature grades for all Core™ i5, Core™ i7 processor variants) Intel® CM238 (Commercial temperature grades for all Core™ i3, Xeon® E3 processor variants) Intel® CM238 (Industrial temperature grades for all processor variants)
The following table lists the specific PCH features.
Intel ® Optane™
Supported
Rapid Storage Technology (RST)
Supported
USB
4x USB 3.0 (Incl. USB 2.0) 4x USB 2.0
VT-d
Supported
SATA RAID
Supported
2.3.4. System Memory
The system memory supports two memory channels with DDR4-2400 SO-DIMM sockets for up a maximum of up to 32 GByte (2x 16 GByte) of non ECC/ECC memory modules.
The following table lists the specific system memory features.
Socket
2x DDR4-2400 SO-DIMM
Memory Type
Channel 1: DDR4-2400 SO-DIMM up to 16 GB Channel 2: DDR4-2400 SO-DIMM up to 16 GB
Memory Module Size
4 GBytes, 8 GByte and 16 GByte
Bandwidth
34.1 GB/s at 2400 MT/s
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of the memory modules may occur several times during the lifetime of the motherboard. Kontron guarantees to maintain memory modules by replacing EOL memory modules with another qualified similar module.
As a minimum, it is recommend to use Kontron memory modules for prototype system(s) in order to prove the stability of the system and as a reference.
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For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum of 24 hours.
For a list of Kontron memory modules, see Table 7: Memory Modules.
2.3.5. Graphics
2.3.5.1. Digital Display Interface
Up to three independent Digital Display Interfaces (DDIs) including (eDP) can be used simultaneously and in combination, to implement an independent or cloned display configuration. A VGA option is available that utilizes DDI3.
The standard DDIs are:
3x DP 1.2 (++) on DDI1, DDI2 and DDI3 1x eDP 1.4/LVDS on DDI0 Optional VGA – Display port to VGA converter (DP2VGA) on DDI3
2.3.5.2. Display Resolution
The following table lists the maximum display resolutions at a set frequency and bit per pixel (bpp) for the supported display interfaces.
Display Interfaces Maximum Resolution
eDP 4096 x 2304 (60 Hz, 24 bpp)
DP+ 4096 x 2304 (60 Hz, 24 bpp)
HDMI 1.4 ( native) 4096 x 2160 (24 Hz, 24 bpp)
HDMI 2.0 (via LS-Pcon) 4096 x 2160 (60 Hz, 24 bpp)
VGA 1920 x 1200 (60 Hz, 24 bpp)
At 4K/UHD resolution, a DisplayPort redriver on the carrier is recommended to increase the link margin.
2.3.6. LVDS
The embedded display port to LVDS bridge (eDP2LVDS) supports dual LVDS 18-bit or 24-bit.channels.
The following table lists the basic LVDS features.
LVDS Channels 2x
LVDS Bits / Pixel 18-bit; 24-bit
LVDS Maximum Resolution Up to 1920 x 1200
PWM Backlight Control I2C/PWM backlight support
Supported Panel Data JILI; EDID, VESA DID
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2.3.7. Audio
Three independent HD Audio streams can be supported simultaneously on HDMI and DP. The default for audio support is over the Display Port (DP), with an additional option for baseboard audio via an external HDA codec on the carrier board.
2.3.8. PCI Express (PCIE) Configuration
The COMe-bKL6 supports eight general-purpose PCI Express lanes and one PCI Express Graphic (PEG) port with 16 lanes.
2.3.8.1. General-Purpose PCI-Express Lanes [0-7]
The COMe connector supports eight general-purpose PCIe lanes [PCIE0-PCIE7]. The COMe signals [PCIE0-PCIE3] serve as an additional Intel PCIe Storage Device #1.
The following table lists the supported general-purpose PCI-Express lanes.
COMe Lane PSH
High-speed I/O Port #
PCH I/O Function
Comment
PCIE0 15 PCIe #9 Also serves as an Intel® PCIe Storage
Device #1
PCIE1 16 PCIe #10
PCIE2 17 PCIe #11
PCIE3 18 PCIe #12
PCIE4 7 PCIe #1
PCIE5 8 PCIe #2
PCIE6 9 PCIe #3
PCIE7 10 PCIe #4
2.3.8.2. PCI-Express Graphics x16 (PEG) Port
One PCI Express Graphics x 16 (PEG) port is available on the COMe connector. The PEG port’s default configuration is 1x 16 non-reversed with additional configuration options 1x16, 2x8, and 1x8+2x4 in both non-reversed and reversed directions. The configuration can be changed in the BIOS setup.
If more than one device is connected then the device with the highest lane count should be connected to the lower lanes. For example, connect PEG lane 0 to lane 0 of the device with the highest lane count. For lane reversal, the opposite is true. In this case, connect the device with the highest lane count to the higher lanes. For example, connect PEG lane 15 to lane 0 of the device.
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The following table lists the PCI-Express Graphics x16 (PEG) port bifurcation and non-reversed lane mapping options.
COMe PEG (1 x16) Non-Reversed (2x8 ) Non-Reversed (1x8 + 2x4) Non-Reversed
Lane 0 0 Linked with [0:1:0]
[Segment:Bus:Device]
0
Linked with [0:1:0]
[Segment:Bus:Device]
0 Linked with [0:1:0]
[Segment:Bus:Device]
Lane 1 1
1
1
Lane 2 2 2 2
Lane 3 3
3
3
Lane 4 4 4 4
Lane 5 5 5 5
Lane 6 6 6 6
Lane 7 7 7 7
Lane 8 8 0 Linked with [0:1:1]
[Segment:Bus:Device]
0 Linked with [0:1:1]
[Segment:Bus:Device]
Lane 9 9 1 1
Lane 10 10 2 2
Lane 11 11 3 3
Lane 12 12 4 0 Linked with [0:1:2]
[Segment:Bus:Device]
Lane 13 13 5 1
Lane 14 14 6 2
Lane 15 15 7 3
The following table lists the PCI-Express Graphics x16 (PEG) port bifurcation and reversed lane mapping options.
COMe PEG (1 x16) Reversed (2x8 ) Reversed (1x8 + 2x4) Reversed
Lane 0 15 Linked with 0:1:0
[Segment:Bus:Device]
7
Linked with 0:1:1
[Segment:Bus:Device]
3 Linked with 0:1:2
[Segment:Bus:Device]
Lane 1 14 6 2
Lane 2 13 5 1
Lane 3 12 4 0
Lane 4 11 3 3 Linked with:0:1:1
[Segment:Bus:Device]
Lane 5 10 2 2
Lane 6 9 1 1
Lane 7 8 0 0
Lane 8 7 7 Linked with 0:1:0
[Segment:Bus:Device]
7 Linked with 0:1:0
[Segment:Bus:Device]
Lane 9 6 6 6
Lane 10 5 5 5
Lane 11 4 4 4
Lane 12 3 3 3
Lane 13 2 2 2
Lane 14 1 1 1
Lane 15 0 0 0
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2.3.9. USB
Both USB 3.0 ports and USB 2.0 ports are available, where USB 3.0 ports are backwards compatible with the USB 2.0 specification.
The following table lists the supported USB features.
USB Ports
4x USB 3.0 (Including USB 2.0) 4x USB 2.0
USB Over Current Signals
4x
USB Client Port
1x (optional for all COMe-types)
The following table lists the COMe connector port and PCH port USB 3.0 and USB 2.0 port combinations.
COMe Port USB 3.0
(PCH Port)
USB 2.0 (PCH Port)
Comments
USB0 USB3_1 USB2_1 SuperSpeed USB 3.0 or USB 2.0
USB1 USB3_2 USB2_2
USB2 USB3_3 USB2_3
USB3 USB3_4 USB2_4
USB4 USB2_5 USB 2.0 exclusive
USB5 USB2_6
USB6 USB2_7
USB7 USB2_8
2.3.10. SATA
The SATA high-speed storage interface supports four SATA Gen3 ports with transfer rates of up to 6 Gb/s. The following SATA ports are available at the following COMe connector ports.
The following table lists the COMe connector port and PCH port SATA combinations.
COMe Port PCH High-speed
I/O Port #
PCH I/O Function
Comments
SATA0 19 SATA #0B SATA Gen3, 6Gb/s
SATA1 20 SATA #1B SATA Gen3, 6Gb/s
SATA2 21 SATA #2 SATA Gen3, 6Gb/s
SATA3 22 SATA #3
SATA Gen3, 6Gb/s
2.3.11. Ethernet
Ethernet connectivity is achieved via a single-port integrated physical layer (PHY) supporting Ethernet Media Dependent Interfaces [0-3]. One 10/100/1000 Mbit Ethernet LAN port is available on high-speed I/O port 11.
The following table lists the supported Ethernet features.
Ethernet
10 Base-T/100 Base-TX and 1000 Base-T
Ethernet Controller
Intel® i219LM
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Additional features of the Ethernet controller are:
Intel® vPRO™ Energy Efficient Ethernet (IEEE 802.3az) Intel® SIPP Server Operating System Support Jumbo frames (up to 9 kB) Reduced power consumption during normal operation Integrated Intel® Auto Connect Battery Saver (ACBS)
If the LAN-Cable is disconnected, the ULP (Ultra Low Power) driver featured in Windows 10 can cause undefined LED behavior. To disable ULP use the “Intel ULPenable-Utility 1.3”. For more information refer to the EMD Customer Section or contact Kontron Support.
2.3.12. COMe High-speed Serial Interfaces Overview
The following table provides an overview of the COMe connector’s PCH high-speed serial interface ports.
COMe Port
PCH High-speed I/O Port #
USB 3.0 PCIe 3.0 SATA 3.0 LAN Comments
SATA3 22 SATA#3 SATA Gen3 (6Gb/s)
SATA2 21 SATA #2
SATA1 20 SATA #1B
SATA0 19 SATA #0B
PCIE3 18 PCIe #12 PCI Express lane [0-15]
Also serves as an Intel® PCIe storage device #1
PCIE2 17 PCIe #11
PCIE1 16 PCIe #10
PCIE0 15 PCIe #9
GBE-MDI 11 1 GbE 10/100/1000 Mbit Ethernet
PCIE7 10 PCIe #4 PCI Express lane [0-15]
PCIE6 9 PCIe #3
PCIE5 8 PCIe #2
PCIE4 7 PCIe #1
USB3 4 USB3_4 SuperSpeed USB 3.0
USB3 3 USB3_3
USB1 2 USB3_2
USB0 1 USB3_1
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2.3.13. Storage Features
The following table lists the supported storage features.
Serial-ATA
4x SATA Gen3 6Gb/s
SATA AHCI
NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
2.3.14. BIOS/Software Features
The following table lists the supported BIOS and software features.
BIOS EFI AMI Aptio V UEFI
Software KeAPI 3.0 for all supported OS
EFI Utilities to log and process module information (DMCM tools) BIOS/EFI Flash utility for EFI Shell, Windows, Linux BIOS/EFI utility for customers to implement Boot Logo
Operating System (OS) Windows 10 (64 bit)
Linux 64 bit + LiveCD VxWorks 7.x (64 bit)
2.3.15. COMe Features
The following table lists the supported COM Express® features.
SPI Boot from an external SPI
LPC Supported
UART 2x UART (RX/TX)
LID Signals Supported
Sleep Signals Supported
Audio HD Audio for external HDA codecs
SMBus Speed configurable, default 100 k SMB
2.3.16. Kontron Features
The following table lists the supported Kontron specific product features.
External I2C Bus Fast I2C, Multimaster capable
Embedded API KeAPI 3.0 for all supported OS
Customer BIOS Settings / Flash Backup
Supported
Watchdog Support Dual staged
External SIO Supported on the base board
GPIO Start-up level configurable, GPI interrupt capable
Rapid Shutdown Supported on dedicated variants
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2.4. Electrical Specification
2.4.1. Power Supply Voltage Specifications
The COMe-bKL6 supports operation in both single power supply mode and ATX power supply mode.
Industrial temperature grade modules are validated for 12 V power supply only. Commercial temperature grade modules support the wide range 8.5 V to 20 V power supply.
The following table lists the power supply specifications.
Supply Voltage Range (VCC)
8.5 V – 20 V
Supply Voltage (VCC)
12 V
Standby Voltage
5 V ± 5% ( 5 VSB is not mandatory for operation)
RTC
2.8 V to 3.47 V
2.4.1.1. Power Supply Rise Time
The input voltage rise time is 0.1 ms to 20 ms from input voltage ≤10% to nominal VCC. To comply with the ATX specification there must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of the DC input voltage final set point.
2.4.1.2. Power Supply Voltage Ripple
The maximum power supply voltage ripple is 100 mV peak-to-peak at 0 MHz – 20 MHz.
2.4.2. Power Management
Power management options are available within the BIOS setup.
ACPI Settings
ACPI 5.0
Miscellaneous Power Management
Supported in BIOS setup menu
Within the BIOS setup, If VCC power is removed, 5 V ±5% can be applied to the V_5V_STBY pins to support the following suspend states:
Suspend to RAM (S3) Suspend-to-disk / Hibernate (S4) Soft-off state (S5)
The Wake-up event (S0) requires VCC power as the board is running.
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2.4.3. Power Supply Control Settings
The power supply control settings are set in the BIOS and enable the module to shut down, rest and wake from standby properly.
The following table lists the implemented power supply control settings.
Power Button (PWRBTN#)
Pin B12
To start the module using the power button, the PWRBTN# signal must be at least 50 ms (50 ms ≤ t < 4 s, typical 400 ms) at low level (Power Button Event). Pressing the power button for at least four seconds turns off power to the module (Power Button Override).
Power Good (PWR_OK)
Pin B24
PWR_OK is internally pulled up to 3.3 V and must be at the high level to power on the module. This can be driven low to hold the module from powering up as long as needed. The carrier needs to release the signal when ready.
Low level prevents the module from entering the S0 state. A falling edge during S0 will cause a direct switch to S5 (Power Failure).
Reset Button (SYS_RESET#)
Pin B49
When the SYS_RESET# pin is detected active (falling edge triggered), it allows the processor to perform a “graceful” reset, by waiting up to 25 ms for the SMBus to go idle before forcing a reset, even though activity is still occurring. Once the reset is asserted, it remains asserted for 5 ms to 6 ms regardless of whether the SYS_RESET# input remains asserted or not.
SM-Bus Alert (SMB_ALERT#)
Pin B15
With an external battery manager present and SMB_ALERT #connected, the module always powers on even if the BIOS switch “After Power Fail” is set to “Stay Off”.
2.4.4. Power Supply Modes
Setting the power supply controls enables the COMe-bKL6 to operating in either ATX power mode or in single power supply mode.
2.4.4.1. ATX Modes
To start the module in ATX mode and power VCC, follow the step below.
1. Connect the ATX PSU with VCC and 5 VSB, to set PWR_OK to low and VCC to 0 V.
2. Press the power button to set the PWR_OK to high and power VCC.
The PS_ON# signal generated by SUS_S3# (A15) indicates that the system is in the Suspend to RAM state. An inverted copy of SUS_S3# on the carrier board may be used to enable non-standby power on a typical ATX supply. The input voltage must always be higher than 5 V standby (VCC > 5 VSB) for Computer-On-Modules supporting a wide input voltage range down to 8.5 V.
The following table lists the ATX mode settings.
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0 V x 0 V
S5 high low 5 V high 0 V
S5 → S0
PWRBTN Event
low → high
5 V
high→ low 0 V→ VCC
S0 high high 5 V low VCC
x – Signals are not relevant for the specific power state. It makes no difference if the signal is connected or open.
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2.4.4.2. Single Supply Mode
In single supply mode, without 5 V standby, the module starts automatically if VCC power is connected and the Power Good input is open or at the high level (internal PU to 3.3 V).
PS_ON# is not used in single supply mode and the input voltage VCC range can be 8.5 V to 20 V.
To power on the module from S5 state, press the power button or reconnect VCC. Suspend/Standby states are not supported in single supply mode.
The following table lists the single supply mode settings.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x / 0 V x / 0 V x / 0 V 0 V
G3 → S0
high open / high open connecting VCC
S5 high open / high open VCC
S5 → S0
PWRBTN Event open / high open reconnecting VCC
x - Signals are not relevant for the specific power state. It makes no difference if the signal is connected or open.
All ground pins must be connected to the carrier board’s ground plane.
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2.5. Thermal Management
2.5.1. Heatspreader and Active or Passive Cooling Solutions
A heatspreader plate assembly is available from Kontron for the COMe-bKL6. The heatspreader plate assembly is NOT a heat sink. The heatspreader works as a COM Express® standard thermal interface to be use with a heat sink or external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst-case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of the heatspreader's surface according to the module’s specifications:
60°C for commercial temperature grade modules 75°C for extended temperature grade modules (E1) 85°C for industrial temperature grade modules by screening (E2S)
2.5.2. Active or Passive Cooling Solutions
Both active and passive thermal management approaches can be used with heatspreader plates. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive cooling solutions provided from Kontron for the COMe-bKL6 are usually designed to cover the power and thermal dissipation for a commercial temperature range used in housing with proper airflow. For more information concerning possible cooling solutions, see Chapter 2.2 Accessories.
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly
The operating temperature defines two requirements:
Maximum ambient temperature with ambient being the air surrounding the module Maximum measurable temperature on any spot on the heatspreader's surface
The heatspreader is tested for the temperature specifications listed in the table below.
Table 9: Heatspreader Test Temperature Specifications
Temperature Specification Validation Requirements
Commercial Grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal
frequency
Extended Grade (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start
speedstepping for thermal protection
Industrial Grade by screening (E2S) at 85°C HSP temperature the CPU @ 50% load is allowed to start
throttling for thermal protection
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
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2.5.5. On Board Fan Connector
The module’s 3-pin fan connector powers, controls and monitors a fan for chassis ventilation.
Table 10: 3-Pin Fan Connector Pin Assignment
Pin Signal Description Type
1
Fan_Tach_IN# Input voltage I
2
V_FAN Limited to a max. 12 V (±10%) across the whole input range PWR
3
GND Power GND PWR
To connect a standard 3-pin connector fan to the module, use one of the following adaptor cables:
KAB-HSP 200 mm (PN 96079-0000-00-0) KAB-HSP 40 mm (PN 96079-0000-00-2)
If the input voltage is below 13 V, the maximum supply current to the on-board fan connector is 350 mA. The maximum supply current is limited to 150 mA if the input voltage is between 13 V and 20 V.
Always check the fan specification according to the limitations of the supply current and supply voltage.
Table 11: Electrical Characteristics of the Fan Connector
Module Input Voltage
< 13 V 13 V to 20 V
FAN Output Voltage
8.5 V to 13 V 12 V (± 10%)
FAN Output Current
350 mA max. 150 mA
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2.6. Environmental Specification
2.6.1. Temperature
Kontron defines the following temperature grades for Computer-On-Modules. For more information on the available temperature grades for the COMe-bKL6, see Chapter 2.1 Module Variants.
Table 12: Temperature Grade Specifications
Temperature Grades Operating Non-operating / Storage
Commercial Grade 0°C to +60°C -30°C to +85°C
Extended Grade E1 (custom)
-25°C to +75°C
-30°C to +85°C
Industrial Grade R E2S (by screening)
-40°C to +85°C -40°C to +85°C
2.6.2. Humidity
Table 13: Humidity Specification
Humidity
Relative Humidity 93% at 40°C non-condensing (according to IEC 60068-2-78)
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2.7. Standards and Certifications
The COMe-bKL6 complies with the following standards and certifications. For more information, contact Kontron Support.
Table 14: Standards and Certification Compliance
Emission (EMC)
EN 55022: Class B Information technology equipment - Radio disturbance characteristics- Limits and methods
of measurement
IEC /EN 61000-6-3 Electromagnetic compatibility (EMC)- Part 6-3: Generic Standards- Emission standard for
residential, commercial and light-industrial environments
IEC/ EN 61000-3-2 Harmonic current emissions
IEC / EN 61000-3-3 Voltage changes, voltage fluctuations and flicker
Immunity (EMI)
IEC / EN 61000-6-2 Electromagnetic compatibility (EMC) – Part 6-2: Generic standards - Immunity for industrial
environments
Immunity tests: IEC / EN 61000-4-2 - Electrostatic discharge (ESD) immunity IEC / EN 61000-4-3 – Radiated, radio frequency, electromagnetic field immunity IEC / EN 61000-4-4 - Electrical fast transient/burst immunity IEC / EN 61000-4-5 - Surge immunity IEC / EN 61000-4-6 - Immunity to conducted disturbances, induced by radio frequency fields IEC / EN 61000-4-8 - Power frequency magnetic field Immunity IEC / EN 61000-4-11 - Voltage dips, short interruptions, and voltage variation immunity
Safety
EN 62368-1 Safety for audio/video and information technology equipment
UL 60950-1 / CSA 60950-1 Information Technology Equipment Including Electrical Business Equipment NWGQ2.E304278 NWGQ8.E304278
Shock
IEC / EN 60068-2-27 Non-operating shock – (half-sinusoidal, 11 ms, 15 g)
Vibration
IEC / EN 60068-2-6 Non-operating vibration – (sinusoidal, 10 Hz – 4000 Hz, +/- 0.15 mm, 2 g)
MTBF
(Theoretical)
System MTBF(hours) = 598847 @ 40°C for the COMe-bKL6 i3-7102E CM238 (Reliability report article number: 38032-0000-21-3)
(RoHS II)
Compliant with the directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
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2.8. Mechanical Specification
2.8.1. Dimensions
The modules dimensions are:
95.0 mm x 125.0 mm (3.75 ” x 4.92 “)
Figure 2: Module Dimensions
*All dimensions shown in mm.
2.8.2. Height
The height of the module depends on the height of the implemented cooling solution. The height of the cooling solution is not specified in the COM Express® specification.
The COM Express® specification defines a module height of approximately 13 mm from module PCB bottom to heatspreader top, as shown in Figure 3: Module Height below.
Figure 3: Module Height
1. Heatspreader
2. Heatspreaader standoff(s)
3. Module PCB
4. Carrier Board PCB
5. Connector standoff(s) 5 mm or 8 mm
6. 13 mm +/- 0.65 mm
2
3 4 5
6
1
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2.8.3. Heatspreader Dimensions
The following figure shows the heatspreader’s dimensions and location on the module.
Figure 4: Heatspreader Location and Dimensions
*All dimensions shown in mm.
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3/ Features and Interfaces
3.1. LPC
The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller that typically combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express® specification. The COM Express® Design Guide maintained by PICMG provides implementation information or refer to the official PICMG documentation for more information.
The LPC bus does not support DMA (Direct Memory Access). When more than one device is used on LPC, a zero delay clock buffer is required. This leads to limitations for ISA bus and SIO (standard I/O(s) like floppy or LPT interfaces) implementations.
All Kontron COM Express® Computer-on-Modules imply BIOS support for the following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 83627DHG-P.
Table 15: Supported BIOS Features
3.3V 83627DHG-P AMI EFI APTIO V
PS/2 Not supported
COM1/COM2 Supported
LPT Not supported
HWM Not supported
Floppy Not supported
GPIO Not supported
Features marked as not supported do not exclude OS support (e.g., HWM is accessible via SMB). If any other LPC Super I/O additional BIOS implementations are necessary, contact Kontron Support.
3.2. Serial Peripheral Interface (SPI)
The Serial Peripheral Interface Bus (SPI bus) is a synchronous serial data link standard. Devices communicate in master/slave mode, where the master device initiates the data frame. Multiple slave devices are allowed with individual slave select (chip select) lines. SPI is sometimes called a four-wire serial bus, contrasting with three, two and one-wire serial buses.
The SPI interface can only be used with a SPI flash device to boot from the external BIOS on the baseboard.
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3.2.1. SPI boot
The COMe-bKL6 supports boot from a 16 MB, 3 V serial external SPI Flash. Pin A34 (BIOS_DIS0#) and pin B88 (BIOS_DIS1#) configure the SPI Flash as follows:
Table 16: SPI Boot Pin Configuration
Configuration BIOS_DIS0# BIOS_DIS1# Function
1 open open Boot on module BIOS
2 GND open Not supported
3 open GND Boot on baseboard SPI
4 GND GND Not supported
BIOS does not support being split between two chips. Booting takes place either from the module SPI or from the baseboard SPI.
Table 17: Supported SPI Boot Flash Types for 8-SOIC Package
Size Manufacturer Part Number Device ID
16MB Maxim MX25L12835F 0x20
16MB Winbond W25Q128FV 0x40
16MB Micron N25Q128A 0xBA
3.2.2. Using an External SPI Flash
Initially, boot on the EFI Shell with an USB key containing the binary used to flash the SPI, plugged in on the system.
Depending on which SPI you would like to flash, you will need to use the (BIOS_DIS1#) jumper located on the COM Express® carrier.
To flash the carrier or module Flash chip:
1. Connect a SPI flash with the correct size (similar to BIOS binary (*.BIN) file size) to the carrier SPI interface.
2. Open pin A34 (BIOS_DIS0#) and pin B88 (BIOS_DIS1#) to boot from the module BIOS.
3. Turn on the system and make sure your USB is connected then start the setup.
4. Check that the following entries are set to their default setting:
Advanced > PCH FW Configuration > Firmware update configuration > ME FW Image Re-Flash > Disabled
Advanced > PCH FW Configuration > Firmware update configuration > Local FW Update > Enabled
Then, change the setup option:
Chipset > PCH-IO Configuration > BIOS Security Configuration > BIOS Lock > Disabled
5. Save and exit setup.
6. Reboot system into EFI shell.
7. Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash.
8. From the EFI shell, enter the name of the partition of your USB Key in this example; Hit FS0: then enter.
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9. Type FPT –SAVEMAC –F <biosname.BIN>
10. Wait until the program ends properly and then power cycle the whole system.
The system is now updated.
Depending on the state of the external SPI flash, the program may display up to two warning messages printed in red. Do not stop the process at this point! After a few seconds of timeout, flashing proceeds. For more information, refer to the EMD Customer Section.
3.2.3. External SPI flash on Modules with Intel® ME
If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another module of the same type will cause the Intel® Management Engine (ME) to fail during the next start. This is due to the design of the ME that bounds itself to every module the ME was flashed to previously. In the case of an external SPI flash, this is the module present at flash time.
To avoid this issue, conduct a complete flash of the external SPI flash device after changing the COM Express® module for another module. If disconnecting and reconnecting the same module again, this step is not necessary.
3.3. Fast I2C
Fast I2C supports transfer between components on the same board. The COMe-bKL6 features an onboard I2C controller connected to the LPC Bus. The I2C controller supports:
Multimaster transfers Clock stretching Collision detection Interruption on completion of an operation
3.4. UART
The UART implements an interface for serial communications and supports up to two serial RX/TX ports defined in the COM Express® specification on pin A98 (SERO_TX) and pin A99 (SERO_RX) for UART0, and pin A101 (SER1_TX) and pin A102 (SER1_RX) for UART1. The UART controller is fully 16550A compatible. UART features are:
On-Chip bit rate ( baud rate) generator No handshake lines Interrupt function to the host FIFO buffer for incoming and outgoing data
3.5. Dual Staged Watchdog Timer (WTD)
A watchdog timer or (computer operating properly (COP) timer) is a computer hardware or software timer. If there is a fault condition in the main program, the watchdog triggers a system reset or other corrective actions. The intention is to bring the system back from the non-responsive state to normal operation.
Possible fault conditions are a hang, or neglecting to service the watchdog regularly. Such as writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”.
The COMe-bKL6 offers a watchdog that works with two stages that can be programmed independently and used stage by stage.
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Table 18: Dual Stage Watchdog Timer- Time-out Events
0000b No action
The stage is off and will be skipped.
0001b Reset
A reset restarts the module and starts a new POST and operating system.
0010b NMI
A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by standard interrupt masking techniques in the system. It is used typically to signal attention for non-recoverable hardware errors.
0011b SMI
A system management interrupt (SMI) makes the processor entering the system management mode (SMM). As such, specific BIOS code handles the interrupt. The current BIOS handler for the watchdog SMI currently does nothing. For special requirements, contact Kontron Support.
0100b SCI
A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code.
0101b Delay -> No
action*
Might be necessary when an operating system must be started and the time for the first trigger pulse must be extended. Only available in the first stage.
1000b WDT Only
This setting triggers the WDT pin on the baseboard connector (COM Express® pin B27) only.
1001b Reset + WDT
1010b NMI + WDT
1011b SMI + WDT
1100b SCI + WDT
1101b DELAY + WDT
-> No action*
3.5.1. WDT Signal
Watchdog time-out event (pin B27) on the COM Express® connector offers a signal that can be asserted when a watchdog timer has not been triggered within a set time. The WDT signal is configurable to either of the two stages. After reset, the signal is automatically deasserted. If deassertion is necessary during runtime, contact Kontron Support for further help.
3.6. Real Time Clock (RTC)
The RTC keeps track of the current time accurately. The RTC’s low power consumption means that the RTC can be powered from an alternate source of power enabling the RTC to continue to keep time while the primary source of power is off or unavailable.
The RTC battery voltage range is 2.8 V - 3.47 V. A typical RTC voltage is 3 V with a current of >10 μA if the module is powered by the mains supply the RTC voltage is generated by on-module regulators to reduce RTC current draw.
3.7. GPIO
Eight GPIO pins are available, with four pins for the in-direction (pin A54 for GPI0, pin A63 for GPI1, pin A67 for GPI2 and pin A85 for GPI3) and four pins for the out-direction (pin A93 for GPO0, pin B54 for GPO1, pin B57 for GPO2 and pin B63 for GPO3). The type of termination resistor on the module sets the direction of the GPIO where GPIs are terminated with pull-up resistors and GPOs are terminated with pull-down resistors.
Due to, the fact that both the pull-up and pull-down termination resistors are weak, it is possible to override the termination resistors using external pull-ups, pull-downs or IOs. Overriding the termination resistors means that the
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eight GPIO pins can be considered as bi-directional since there are no restrictions whether you use the available GPIO pins in the in-direction or out-direction.
3.8. Trusted Platform Module (TPM 2.0)
A Trusted Platform Module (TPM) stores RSA encryption keys specific to the host system for hardware authentication. The term TPM refers to the set of specifications applicable to TPM chips. The LPC bus connects the TPM chip to the CPU.
Each TPM chip contains an RSA key pair called the Endorsement Key (EK). The pair is maintained inside the chip and cannot be accessed by software. The Storage Root Key (SRK) is created when a user or administrator takes ownership of the system. This key pair is generated by the TPM based on the Endorsement Key and an owner-specified password.
A second key, called an Attestation Identity Key (AIK) protects the device against unauthorized firmware and software modification by hashing critical sections of firmware and software before they are executed. When the system attempts to connect to the network, the hashes are sent to a server that verifies that they match the expected values. If any of the hashed components have been modified since the last started, the match fails, and the system cannot gain entry to the network.
3.9. Kontron Security Solution
Kontron Security Solution is a combined hardware and software solution that includes an embedded hardware security module and a software framework to provide full protection for your application.
The COMe-bKL6 includes an integrated security module connected to USB2 port 9, supporting the following features:
Copy protection IP protection License model enforcement
If required, customers can customize the solution to meet specific needs. For more information, contact Kontron Support.
3.10. SpeedStep® Technology
SpeedStep® technology enables you to adapt high performance computing to your applications by switching automatically between maximum performance mode and battery-optimized mode, depending on the needs of the application. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, thus conserving battery life while maintaining a high level of performance. The frequency is automatically set back to the high frequency, allowing you to customize performance.
In order to use the Intel® Enhanced SpeedStep® technology the operating system must support SpeedStep ® technology.
By deactivating the SpeedStep® feature in the BIOS, manual control or modification of the CPU performance is possible. Setup the CPU Performance State in the BIOS Setup or use third party software to control the CPU Performance States.
3.11. Intel® Optane™ Memory
Intel® Optane™ memory is a system accelerator for 7th Gen Intel® Core™ processors. Intel® Optane™ memory combines the non-volatile 3D XPoint™ memory with advanced system controllers, and interface and software enhancements to provide a caching solution for accelerating systems with high capacity workloads.
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Intel® Optane™ is available on the Rapid Storage capable PCIe Ports PCIE [0-3] and supports the x2 and x4 configuration options only. Owing to the fact that the PCIE [0-3] are configured as four times x1, Intel® Optane™ is only possible with a custom BIOS.
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4/ System Resources
4.1. Interrupt Request (IRQ) Lines
The following table specifies the device connected to each Interrupt line or if the line is available for new devices.
Table 19: Interrupt Requests
IRQ General Usage Project Usage
0 Timer Timer
1 Keyboard Keyboard (SuperIO)
2 Redirected secondary PIC Redirected secondary PIC
3 COM2 COM2
4 COM1 COM1
5 LPT2/PCI devices One of COM3+4
6 FDD One of COM3+4 or not used
7 LPT1 LPT1 or one of COM3+4
8 RTC RTC
9 SCI / PCI devices Free for PCI devices
10 PCI devices Free for PCI devices
11 PCI devices Free for PCI devices
12 PS/2 mouse Free for PCI devices
13 FPU FPU
14 IDE0 Not used
15 IDE1 Not used
4.2. Memory Area
The following table specifies the usage of the address ranges within the memory area.
Table 20: Designated Memory Locations
Address Range (hex) Size Project Usage
00000000-0009FBFF 639 KB Real mode memory
0009FC00-0009FFFF 1 KB Extended BDA
000A0000-000BFFFF 128 KB Display memory (legacy)
000C0000-000CBFFF 48 KB VGA BIOS (legacy)
000CC000-000DFFFF 80 KB Option ROM or XMS (legacy)
000E0000-000EFFFF 64 KB System BIOS extended space (legacy)
000F0000-000FFFFF 64 KB System BIOS base segment (legacy)
00100000-7FFFFFFF 128 MB System memory (Low DRAM)
80000000-FFF00000 2 GB – 1 MB PCI memory, other extensions (Low MMIO)
FEC00000-FEC00FFF 4 KB IOxAPIC
FED00000-FED003FF 1 KB HPET (Timer)
FED40000-FED40FFF 4KB Always reserved for LPC TPM usage
FEE00000-FEEFFFFF 1MB Local APIC region
FFFC0000-FFFFFFFF 256 KB Mapping space for BIOS ROM/Boot vector
100000000-17FFFFFFF 2 GB System memory (High DRAM)
180000000-F00000000 58 GB High MMIO
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4.3. I/O Address Map
The I/O port addresses are functionally identical to a standard PC/AT. All addresses not mentioned in this table should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for compatibility reasons, even if the I/O address is available.
Table 21: Designated I/O Port Address Ranges
I/O Address Range General Usage Project Usage
000-00F DMA-Controller (Master) (8237) DMA-Controller (Master) (8237)
020-021 024-025 028-029 02C-02D 030-031 034-035 038-039 03C-03D
Interrupt-Controller (Master) (8259) Interrupt-Controller (Master) (8259)
02E-02F SuperIO (Winbond) External SuperIO (Winbond)
040-043 050-053
Programmable Interrupt Timer (8253) Programmable Interrupt Timer (8253)
04E-04F
2nd SuperIO, TPM etc. TPM
060, 064 KBD Interface-Controller (8042) KBD Interface-Controller (8042)
061, 063 065, 067
NMI Controller NMI Controller
062, 066 Embedded Microcontroller Not used
070-071 RTC CMOS / NMI mask RTC CMOS / NMI mask
072-073 RTC Extended CMOS RTC Extended CMOS
080-083 Debug port Debug port
0A0-0A1 0A4-0A5 0A8-0A9 0AC-0AD 0B0-0B1 0B4-0B5 0B8-0B9 0BC-0BD
Interrupt-Controller (Slave) (8259) Interrupt-Controller (Slave) (8259)
0B2-0B3 APM control APM control
0C0-0DF DMA-Controller (Slave) (8237)(N/A) Not used
0F0-0FF FPU (N/A) Not used
170-177 HDD-Controller IDE1 Master Not used
1F0-1F7 HDD-Controller IDE0 Master Not used
200-207 Gameport Not used
220-22F Soundblaster® Not used
279 ISA PnP ISA PnP
278-27F Parallel port LPT2 Not used
295-296 Hardware monitor (Winbond default) Reserved (If SuperIO present)
2B0-2BF EGA Not used
2D0-2DF EGA Not used
2E8-2EF Serial port COM 4 Serial port COM4 (optional)
2F8-2FF Serial port COM 2 Serial port COM2 from CPLD
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I/O Address Range General Usage Project Usage
300-301 MIDI Not used
300-31F System specific peripherals Not used
370-377 Floppy disk controller Not used
376-377 HDD-Controller IDE1 Slave Not used
378-37F Parallel port LPT 1 LPT1 (If SuperIO present)
3BC-3BF Parallel port LPT3 Not used
3C0-3CF VGA/EGA VGA/EGA
3D0-3DF CGA Not used
3E0-3E1 PCMCIA ExCA interface Not used
3E8-3EF Serial port COM3 Serial port COM3 (optional)
3F0-3F7 Floppy Disk Controller Not used
3F6-3F7 HDD controller IDE0 Slave Not used
3F8-3FF Serial Port COM1 Serial port COM1
4D0-4D1 Interrupt-Controller (Slave) Interrupt-Controller (Slave)
A80-A81 Kontron CPLD Kontron CPLD control port
CF8 PCI configuration address PCI configuration address
CF9 Reset control Reset control
CFC-CFF PCI configuration data PCI configuration data
Other PCI device I/O addresses are allocated dynamically and not listed here. For more information on how to determine I/O address usage, refer to the OS documentation.
4.4. Peripheral Component Interconnect (PCI) Devices
All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) and PCI Express Base 1.0a specification. The BIOS and Operating Software (OS) control the memory and I/O resources. For more information, refer to the PCI 2.3 specification.
4.5. I2C Bus
The following table provides the I2C address for devices connected the I2C Bus.
Table 22: I2C Bus Port Addresses
I2C Address Used For Available Comment
58h No Internally reserved
A0h JIDA-EEPROM No Module EEPROM
AEh FRU-EEPROM No Recommended for Baseboard EEPROM
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4.6. System Management (SM) Bus
The 8-bit SMBus address uses the LSB (Bit 0) for the direction of the device.
Bit0 = 0 defines the write address Bit0 = 1 defines the read address
The 8-bit address listed below shows the write address for all devices. The7-bit SMBus address shows the device address without Bit0.
Table 23: SMBus Addresses
8-bit Address
7-bit Address
Device Comment SMBus
5Ch 2Eh HWM NCT7802Y Do not use under any circumstances SMB
A0h 50h SPD DDR Channel 1 (SO-DIMM) SMB
A4h 52h SPD DDR Channel 2 (SO-DIMM) SMB
30h 18h SO-DIMM Thermal Sensor If available on the used memory-module SMB
34h 1Ah SO-DIMM Thermal Sensor channel 2 If available on the used memory-module SMB
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5/ COMe Interface Connectors
The COMe-bKL6 is a COM Express® basic module containing two 220-pin connectors; each with two rows called row A & row B on the primary connector and row C & row D on the secondary connector.
The following figure is a view from the bottom of the module showing the position of interface connectors X1A and X1B.
Figure 5: X1A and X1B COMe Interface Connectors.
5.1. X1A and X1B Signals
For description of the terms used within the pin assignment tables, see the General Signals Description table below or Appendix A, List of Acronyms. If a more detailed pin assignment description is required, refer to the PICMG specification COMe Rev 2.1 Type 6 standard.
The information provided under type, module terminations and comments is complimentary to the COM.0 Rev 2.1 Type 6 standard. For more information, contact Kontron Support.
X1A
X1B
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Table 24: General Signal Description
Type Description Type Description
NC Not Connected (on this product) O-1,8 1.8 V Output
I/O-3,3 Bi-directional 3.3 V I/O-Signal O-3,3 3.3 V Output
I/O-5T Bi-dir. 3.3 V I/O (5 V Tolerance) O-5 5 V Output
I/O-5 Bi-directional 5V I/O-Signal DP-I/O Differential Pair Input/Output
I-3,3 3.3 V Input DP-I Differential Pair Input
I/OD Bi-directional Input/Output Open
Drain
DP-O Differential Pair Output
I-5T 3.3 V Input (5 V Tolerance) PU Pull-Up Resistor
OA Output Analog PWR Power Connection
OD Output Open Drain + and - Differential Pair
To protect external power lines of peripheral devices, make sure that the wires have the right diameter to withstand the maximum available current.
The enclosure of the peripheral device fulfills the fire-protection requirements of IEC/EN60950.
5.2. X1A and X1B Pin Assignment
For more information regarding the pin assignment of connector X1A (row A and row B) and connector X1B (row C and row D), see the pin assignment tables:
Table 25: Connector X1A Row A Pin Assignment (A1-A110) Table 26: Connector X1A Row B Pin Assignment (B1-B110) Table 27: Connector X1B Row C Pin Assignment (C1-C110) Table 28: Connector X1B Row D Pin Assignment (D1-D110)
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5.2.1. Connector X1A Row A1 - A110
Table 25: Connector X1A Row A Pin Assignment (A1-A110)
Pin COMe Signal Description Type Termination Comment
A1 GND Power ground PWR GND
A2 GBE0_MDI3- Ethernet media dependent interface 3 DP-I/O
A3 GBE0_MDI3+
A4 GBE0_LINK100# Ethernet speed indicator
OD
A5 GBE0_LINK1000#
A6 GBE0_MDI2- Ethernet media dependent Interface 2 DP-I/O
A7 GBE0_MDI2+
A8 GBE0_LINK# Ethernet link indicator OD
A9 GBE0_MDI1- Ethernet media dependent interface 1 DP-I/O
A10 GBE0_MDI1+
A11 GND Power ground PWR GND
A12 GBE0_MDI0- Ethernet media dependent interface 0 DP-I/O
A13 GBE0_MDI0+
A14 GBE0_CTREF
Reference voltage for Carrier Board Ethernet magnetics center tab. The reference voltage is determined by the requirements of the module PHY and may be as low as 0V and as high as 3.3V.
O 1 uF capacitor to GND
A15 SUS_S3#
Indicates system is in Suspend to RAM (or deeper) state. An inverted copy of SUS_S3# on Carrier Board may be used to enable non-standby power on a typical ATX supply.
O-3.3
PD 10 kΩ
A16 SATA0_TX+ Serial ATA transmit data pair 0 DP-O
A17 SATA0_TX-
A18 SUS_S4#
Indicates system is in Suspend to Disk (or deeper) state.
O-3.3
PD 10 kΩ
A19 SATA0_RX+ Serial ATA receive data pair 0 DP-I
A20 SATA0_RX-
A21 GND Power ground PWR GND
A22 SATA2_TX+ Serial ATA transmit data pair 2 DP-O
A23 SATA2_TX-
A24 SUS_S5# Indicates system is in Soft Off state. O-3.3
A25 SATA2_RX+ Serial ATA receive data pair 2 DP-I
A26 SATA2_RX-
A27 BATLOW#
Provides a battery-low signal to the module to indicate external battery is low
I-3.3
PU 10 kΩ, 3.3 V (S5)
Assertion prevents wake from S3-S5 state
A28 ATA_ACT# Serial ATA activity LED indicator OD-3.3
PU 10 kΩ, 3.3 V (S0)
Can sink 15 mA
A29 HDA_SYNC HD audio sync O-3.3
PD 20 kΩ in PCH
A30 HDA_RST# HD audio reset O-3.3
PD 20 kΩ in PCH
A31 GND Power ground PWR GND
A32 HDA_CLK HD audio bit clock output O-3.3
PD 20 kΩ in PCH
A33 HDA_SDOUT HD audio serial data out O-3.3
PD 20 kΩ in PCH
A34 BIOS_DIS0#
BIOS selection straps to determine the BIOS boot device
I-3.3
PU 10 kΩ,3.3 V (S5)
The Carrier should only float these or pull them low.
A35 THRMTRIP#
Thermal trip Indicates CPU has entered thermal shutdown
O-3.3
PU 10 kΩ, 3.3 V (S0)
Thermal trip event transition to S5 indicator
A36 USB6- USB 2.0 data differential pair port 6 DP-I/O
PD 14.25 kΩ to
24.8 kΩ in PCH
A37 USB6+
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Pin COMe Signal Description Type Termination Comment
A38 USB_6_7_OC# USB overcurrent indicator port 6/7 I-3.3
PU 10 kΩ, 3.3 V (S5)
A39 USB4- USB 2.0 data differential pair port 4 DP-I/O
PD 14.25 kΩ to
24.8 kΩ in PCH
A40 USB4+
A41 GND Power ground PWR GND
A42 USB2- USB 2.0 data differential pair port 2 DP-I/O
PD 14.25 kΩ to
24.8 kΩ in PCH
A43 USB2+
A44 USB_2_3_OC# USB overcurrent indicator port 2/3 I-3.3
PU 10 kΩ 3.3 V (S5)
An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.
A45 USB0- USB 2.0 data differential pairs port 0 DP-I/O
PD 14.25 kΩ to
24.8 kΩ in PCH
A46 USB0+
A47 VCC_RTC Real Time Clock (RTC) circuit power input PWR 3V Voltage 2.8 V to 3.47 V
A48 EXCD0_PERST# ExpressCard reset port 0 O-3.3
PD 10 kΩ
A49 EXCD0_CPPE# ExpressCard capable card request port 0 I-3.3
PU 10 kΩ 3.3 V (S0)
A50 LPC_SERIRQ Serial interrupt request I/OD-3.3
PU 8.2 kΩ,3.3 V (S0)
A51 GND Power ground PWR GND
A52 PCIE_TX5+ PCI Express transmit lane 5 DP-O
A53 PCIE_TX5-
A54 GPI0 General purpose input 0 I-3.3
PU 100 kΩ, 3.3 V (S0)
A55 PCIE_TX4+ PCI Express transmit lane 4 DP-O
A56 PCIE_TX4-
A57 GND Power ground PWR GND
A58 PCIE_TX3+ PCI Express transmit lane 3 DP-O
A59 PCIE_TX3-
A60 GND Power Ground PWR GND
A61 PCIE_TX2+ PCI Express transmit lane 2 DP-O
A62 PCIE_TX2-
A63 GPI1 General purpose input 1 I-3.3
PU 100 kΩ, 3.3 V (S0)
A64 PCIE_TX1+ PCI Express transmit lane 1 DP-O
A65 PCIE_TX1-
A66 GND Power ground PWR GND
A67 GPI2 General purpose input 2 I-3.3
PU 100 kΩ, 3.3 V (S0)
A68 PCIE_TX0+ PCI Express transmit lane 0 DP-O
A69 PCIE_TX0-
A70 GND Power ground PWR GND
A71 LVDS_A0+ LVDS channel A DAT0 or EDP Lane 2 transmit DP-O
A72 LVDS_A0-
A73 LVDS_A1+ LVDS channel A DAT1 or EDP Lane 1 transmit DP-O
A74 LVDS_A1-
A75 LVDS_A2+ LVDS channel A DAT2 or EDP Lane 0 transmit DP-O
A76 LVDS_A2-
A77 LVDS_VDD_EN LVDS or EDP panel power control O-3.3
PD 100 kΩ
A78 LVDS_A3+ LVDS channel A DAT3 transmit DP-O
A79 LVDS_A3-
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Pin COMe Signal Description Type Termination Comment
A80 GND Power ground
PWR GND
A81 LVDS_A_CK+ LVDS Channel A clock or EDP lane 3 transmit DP-O Clock 20 MHz to 80 MHz
A82 LVDS_A_CK-
A83 LVDS_I2C_CK I2C Clock for LVDS display use or eDP AUX + I/O-3.3
PU 2.2 kΩ, 3.3 V (S0)
A84 LVDS_I2C_DAT I2C Data line for LVDS display use or eDP AUX - I/O-3.3
PU 2.2 kΩ, 3.3 V (S0)
A85 GPI3 General purpose input 3 I-3.3
PU 100 kΩ 3.3 V (S0)
A86 RSVD Reserved for future use NC
A87 eDP_HPD Detection of Hot Plug / unplug I-3.3
PD 400 kΩ LVDS / 100 k
Ω
EDP
A88 PCIE_CK_REF+
Reference PCI Express clock for all PCI Express and PCI Express graphics lanes
DP-O 100 MHz
A89 PCIE_CK_REF-
A90 GND Power ground PWR GND
A91 SPI_POWER 3.3 V power output for external SPI Flash
O-3.3 100 mA maximum
Only use to power SPI devices on Carrier Board.
A92 SPI_MISO
Data in to module from carrier SPI (SPI Master IN Slave Out)
I-3.3
PU 15 kΩ to 40 k
Ω
in PCH
All SPI signals tri-stated until reset deasserted.
A93 GPO0 General purpose output 0 O-3.3
PD 100 kΩ
A94 SPI_CLK Clock from module to carrier SPI O-3.3
PU 15 kΩ to 40 kΩ in PCH (S5)
All SPI signals tri-stated with 20 KΩ CPU internal weak pull-up until reset deasserted.
A95 SPI_MO SI Data out from module to carrier SPI O-3.3
PU 15 kΩ to 40 kΩ in PCH (S5)
A96 TPM_PP TPM physical presence I-3.3
PD 10 kΩ
TMP does not use this functionality.
A97 TYPE10#
Indicates to carrier board that Type 10 module is installed
NC
A98 SER0_TX Serial port 0 TXD O-3.3
20 V protection circuit implemented on-module, PD on carrier boards needed for proper operation.
A99 SER0_RX Serial port 0 RXD I-5T
PU 47 kΩ, 3.3 V (S0)
20 V protection circuit implemented on-module.
A100 GND Power ground PWR GND
A101 SER1_TX Serial port 1 TXD O-3.3
20 V protection circuit implemented on-module, PD on carrier board needed for proper operation.
A102 SER1_RX Serial port 1 RXD I-5T
PU 47 kΩ, 3.3 V (S0)
20 V protection circuit implemented on-module.
A103 LID# LID switch input I-3.3
PU 47 kΩ, 3.3 V (S5)
A104 VCC_12V Main input voltage (4.75 V - 20V)
PWR
4.75 V ­20 V
A105 VCC_12V
A106 VCC_12V
A107 VCC_12V
A108 VCC_12V
A109 VCC_12V
A110 GND Power ground PWR GND
+ and - Differential pair differentiator
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5.2.2. Connector X1A Row B1 - B100
Table 26: Connector X1A Row B Pin Assignment (B1-B110)
Pin COMe Signal Description Type Termination Comment
B1 GND Power Ground PWR GND
B2 GBE0_ACT# Ethernet activity LED indicator OD
B3 LPC_FRAME# Indicates the start of an LPC cycle O-3.3
B4 LPC_AD0 LPC multiplexed command, address and data bus I/O-3.3
PU 15 KΩ-40 KΩ in PCH (S5)
B5 LPC_AD1
B6 LPC_AD2
B7 LPC_AD3
B8 LPC_DRQ0# LPC serial DMA master request NC
B9 LPC_DRQ1#
B10 LPC_CLK LPC 24 MHz clock output O-3.3
PD 20 KΩ in PCH
24 MHz
B11 GND Power Ground PWR GND
B12 PWRBTN#
Power Button - a falling edge creates a power button event
I-3.3
PU 10 KΩ, 3.3 V (S5eco)
Power button events can be used to bring a system out of S5 soft-off and other suspend states, as well as powering the system down.
B13 SMB_CLK SMBus clock line O-3.3
PU 2.56 KΩ, 3.3 V (S5)
B14 SMB_DAT SMBus bidirectional data line I/O-3.3
PU 2.56 KΩ, 3.3 V (S5)
B15 SMB_ALERT#
SMBus alert can be used to generate a SMI# or to wake the system
I/O-3.3
PU 2.2 KΩ, 3.3 V (S5)
B16 SATA1_TX+ SATA 1 transmit data pair DP-O
B17 SATA1_TX-
B18 SUS_STAT#
Indicates imminent suspend operation; used to notify LPC devices.
O-3.3
B19 SATA1_RX+ SATA 1 receive data pair DP-I
B20 SATA1_RX-
B21 GND Power Ground PWR GND
B22 SATA3_TX+ SATA 3 transmit data pair DP-O
B23 SATA3_TX-
B24 PWR_OK Power OK from main power supply. I-5T
PU 61 KΩ, 3.3 V
20 V protection circuit implemented on module
B25 SATA3_RX+ SATA 3 receive data pair DP-I
B26 SATA3_RX-
B27 WDT Watchdog time-out event has occurred O-3.3
PD 10 KΩ
B28 HDA_SDIN2 Audio Codec Serial data input 2 NC Not supported
B29 HDA_SDIN1 Audio Codec Serial data input 1 I-3.3
PD 20 KΩ in PCH
B30 HDA_SDIN0 Audio Codec Serial data input 0
B31 GND Power Ground PWR GND
B32 SPKR
Speaker output provides the PC beep signal and is mainly intended for debugging purposes
O-3.3
PD 20 KΩ in PCH
PD is enabled until reset is deasserted
B33 I2C_CK General purpose I2C port clock output O-3.3
PU 2.21 KΩ, 3.3 V (S5)
B34 I2C_DAT General purpose I2C port data I/O line I/O-3.3
PU 2.21 KΩ, 3.3 V (S5)
B35 THRM#
Input from off-Module temp sensor indicating an over-temp situation
I-3.3
PU 10 KΩ to 3.3 V (S0)
No function implemented
B36 USB7- USB 2.0 differential data pairs port 7 DP-I/O
PD 14.25 KΩ to
24.8 KΩ in PCH
B37 USB7+
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Pin COMe Signal Description Type Termination Comment
B38 USB_4_5_OC# USB overcurrent indicator port 4/5 I-3.3
PU 10 KΩ, 3.3 V (S5)
B39 USB5- USB 2.0 differential data pairs port 5 DP-I/O
PD 14.25 KΩ to
24.8 KΩ in PCH
B40 USB5+
B41 GND Power Ground PWR GND
B42 USB3- USB 2.0 differential data pairs port 3 DP-I/O
PD 14.25 KΩ to
24.8 KΩ in PCH
B43 USB3+
B44 USB_0_1_OC# USB overcurrent indicator port 0/1 I-3.3
PU 10 KΩ, 3.3 V (S5)
B45 USB1- USB 2.0 differential data pairs port 1 DP-I/O
PD 14.25 KΩ to
24.8 KΩ in PCH
B46 USB1+
B47 EXCD1_PERST# ExpressCard expansion, reset port 1 O-3.3
PD 10 KΩ
B48 EXCD1_CPPE#
ExpressCard expansion, capable card request port 1
I-3.3
PU 10KΩ, 3.3 V (S0)
B49 SYS_RESET# Reset button input I-3.3
PU 10 KΩ, 3.3 V (S5)
B50 CB_RESET# Reset output from module to carrier board O-3.3
PU 10 KΩ, 3.3 V (S5)
B51 GND Power Ground PWR GND
B52 PCIE_RX5+ PCI Express receive lane 5 DP-I
B53 PCIE_RX5-
B54 GPO1 General purpose output 1 O-3.3
PD 100 KΩ
B55 PCIE_RX4+ PCI Express receive lane 4 DP-I
B56 PCIE_RX4-
B57 GPO2 General purpose output 2 O-3.3
PD 100 KΩ
B58 PCIE_RX3+ PCI Express receive lane 3 DP-I
B59 PCIE_RX3-
B60 GND Power Ground PWR
B61 PCIE_RX2+ PCI Express receive lane 2 DP-I
B62 PCIE_RX2-
B63 GPO3 General purpose output 3 O-3.3
PD 100 KΩ
B64 PCIE_RX1+ PCI Express receive lane 1 DP-I
B65 PCIE_RX1-
B66 WAKE0# PCI Express Wake Event wake up signal I-3.3
PU 10 KΩ, 3.3 V (S5)
B67 WAKE1#
General purpose Wake Event wake up signal, to implement wake-up on PS2 keyboard or mouse
I-3.3
PU 10 KΩ, 3.3 V (S5)
B68 PCIE_RX0+ PCI Express receive lane 0 DP-I
B69 PCIE_RX0-
B70 GND Power Ground PWR GND
B71 LVDS_B0+ LVDS Channel B DAT0 DP-O
B72 LVDS_B0-
B73 LVDS_B1+ LVDS Channel B DA T1 DP-O
B74 LVDS_B1-
B75 LVDS_B2+ LVDS Channel B DAT2 DP-O
B76 LVDS_B2-
B77 LVDS_B3+ LVDS Channel B DAT3 DP-O
B78 LVDS_B3-
B79 LVDS/BKLT_EN LVDS or EDP panel backlight enable (ON) 0-3.3
PD 100 KΩ
B80 GND Power Ground PWR GND
B81 LVDS_B_CK+ LVDS Channel B Clock DP-O 20 MHz -80 MHz
B82 LVDS_B_CK-
B83 LVDS_BKLT_CTRL LVDS or EDP panel backlight brightness control O-3.3
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Pin COMe Signal Description Type Termination Comment
B84 VCC_5V_SBY 5V Standby
PWR 5 V (S5)
Optional, not necessary in single supply mode
B85 VCC_5V_SBY
B86 VCC_5V_SBY
B87 VCC_5V_SBY
B88 BIOS_DIS1#
BIOS selection strap to determine BIOS boot device
I-3.3
PU 10 KΩ, 3.3 V (S0)
PU might be powered during suspend
B89 VGA_RED CRT Red/ Analog Video RGB-RED OA
PD 150 Ω
Only on VGA option
B90 GND Power Ground PWR GND
B91 VGA_GREEN VGA Green/ Analog Video RGB-Green OA
PD 150 Ω
Only on VGA option
B92 VGA_BLUE VGA Blue/ Analog Video RGB-Blue OA
PD 150 Ω
B93 VGA_HSYNC Analog horizontal sync output to VGA monitor O-3.3
B94 VGA_VSYNC Analog vertical sync output to VGA monitor O-3.3
B95 VGA_DDC_CLK Display Data Channel (DDC) clock line I/O-5
PU 2.4 KΩ, 3.3 V (S0)
B96 VGA_DCC_DATA Display Data Channel (DDC) data line I/O-5
PU 2.4 KΩ, 3.3 V (S0)
B97 SPI_CS# Chip select for carrier board SPI 0 3.3
B98 RSVD Reserved for future use NC
B99 RSVD
B100 GND Power Ground PWR GND
B101 FAN_PWMOUT Fan speed control by PWM Output O-3.3
20 V protection circuit implemented on module,
PD on carrier board needed for proper operation
B102 FAN_TACHIN
Fan tachometer input for fan with a two-pulse output
I-3.3
PU 47 KΩ, 3.3 V (S0)
20 V protection circuit implemented on module
B103 SLEEP#
Sleep button signal used by ACPI operating system to bring system to sleep state or wake it up again
I-3.3
PU 47 KΩ, 3.3 V (S5)
B104 VCC_12V Main input voltage (4.75 V - 20 V) PWR
4.75 V­20 V
B105 VCC_12V
B106 VCC_12V
B107 VCC_12V
B108 VCC_12V
B109 VCC_12V
B110 GND Power Ground PWR GND
+ and - Differential pair differentiator
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5.2.3. Connector X1B Row C1 - C110
Table 27: Connector X1B Row C Pin Assignment (C1-C110)
Pin COMe Signal Description Type Termination Comment
C1 GND Power Ground PWR GND
C2 GND
C3 USB_SSRX0- USB SuperSpeed receive data pair 0 DP-I
C4 USB_SSRX0+
C5 GND Power Ground PWR GND
C6 USB_SSRX1- USB SuperSpeed receive data pair 1
DP-I
C7 USB_SSRX1+
C8 GND Power Ground PWR GND
C9 USB_SSRX2- USB SuperSpeed receive data pair 2
DP-I
C10 USB_SSRX2+
C11 GND Power Ground PWR GND
C12 USB_SSRX3- USB SuperSpeed receive data pair3
DP-I
C13 USB_SSRX3+
C14 GND Power Ground PWR GND
C15 DDI1_PAIR6+ DDI1 data pair 6
NC
C16 DDI1_PAIR6-
C17 RSVD Reserved for future use NC
C18 RSVD
C19 PCIE_RX6+ PCI Express receive lane 6 DP-I
C20 PCIE_RX6-
C21 GND Power Ground PWR GND
C22 PCIE_RX7+ PCI Express receive lane 7 DP-I
C23 PCIE_RX7-
C24 DDI1_HPD DDI1 Hotplug Detect I-3.3
PD 100 KΩ
C25 DDI1_PAIR4+ DDI1 data pair 4
NC
C26 DDI1_PAIR4-
C27 RSVD Reserved for future use NC
C28 RSVD
C29 DDI1_PAIR5+ DDI1 data pair 5
NC
C30 DDI1_PAIR5-
C31 GND Power Ground PWR GND
C32 DDI2_CTRLCLK_AUX+ DDI2 clock I/O-3.3
PD 100 KΩ
C33 DDI2_CTRLDATA_AUX- DDI2 date I/O-3.3
PU 100 KΩ, 3.3 V (S0)
C34 DDI2_DDC_AUX_SEL DDI2 select I-3.3
PD 1 MΩ
C35 RSVD Reserved for future use NC
C36 DDI3_CTRLCLK_AUX+ DDI3 clock I/O-3.3
PD 100 KΩ
C37 DDI3_CTRLDATA_AUX- DDI3 date I/O-3.3
PD 100 KΩ, 3.3 V (S0)
C38 DDI3_DDC_AUX_SEL DDI3 select I-3.3
PD 1 MΩ
C39 DDI3_PAIR0+ DDI3 data pair 0 DP-O
C40 DDI3_PAIR0-
C41 GND Power Ground PWR GND
C42 DDI3_PAIR1+ DDI3 data pair 1 DP-O
C43 DDI3_PAIR1-
C44 DDI3_HPD DDI3 Hotplug Detect I-3.3
PD 100 KΩ
C45 RSVD Reserved for future use NC
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Pin COMe Signal Description Type Termination Comment
C46 DDI3_PAIR2+ DDI3 data pair 2
DP-O
C47 DDI3_PAIR2-
C48 RSVD Reserved for future use NC
C49 DDI3_PAIR3+ DDI3 data pair DP-O
C50 DDI3_PAIR3-
C51 GND Power Ground PWR GND
C52 PEG_RX0+ PCI Express Graphics (PEG) receive lane 0 DP-I
C53 PEG_RX0-
C54 TYPE0#
Indicates the Carrier Board the pinout type and is not connected for type 6.
NC NC for Type 6 module
C55 PEG_RX1+ PCI Express Graphics (PEG) receive lane 1 DP-I
C56 PEG_RX1-
C57 TYPE1#
Indicates the Carrier Board the pinout type and is not connected for type 6.
NC NC for Type 6 module
C58 PEG_RX2+ PCI Express Graphics (PEG) receive lane 2 DP-I
C59 PEG_RX2-
C60 GND Power Ground PWR GND
C61 PEG_RX3+ PCI Express Graphics (PEG) receive lane 3 DP-I
C62 PEG_RX3-
C63 RSVD Reserved for future use NC
C64 RSVD
C65 PEG_RX4+ PCI Express Graphics (PEG) receive lane 4 DP-I
C66 PEG_RX4-
C67 RSDN Rapid Shutdown Trigger Input I-5
Used for rapid shutdown option
C68 PEG_RX5+ PCI Express Graphics (PEG) receive lane 5 DP-I
C69 PEG_RX5-
C70 GND Power Ground PWR GND
C71 PEG_RX6+ PCI Express Graphics (PEG) receive lane 6 DP-I
C72 PEG_RX6-
C73 GND Power Ground PWR GND
C74 PEG_RX7+ PCI Express Graphics(PEG) receive lane 7 DP-I
C75 PEG_RX7-
C76 GND Power Ground PWR GND
C77 RSVD Reserved for future use NC
C78 PEG_RX8+ PCI Express Graphics (PEG) receive lane 8 DP-I
C79 PEG_RX8-
C80 GND Power Ground PWR GND
C81 PEG_RX9+ PCI Express Graphics(PEG) receive lane 9 DP-I
C82 PEG_RX9-
C83 RSVD Reserved for future use NC
C84 GND Power Ground PWR GND
C85 PEG_RX10+ PCI Express Graphics (PEG) receive lane 10 DP-I
C86 PEG_RX10-
C87 GND Power Ground PWR GND
C88 PEG_RX11+ PCI Express Graphics (PEG) receive lane 11 DP-I
C89 PEG_RX11-
C90 GND Power Ground PWR GND
C91 PEG_RX12+ PCI Express Graphics (PEG) receive lane 12 DP-I
C92 PEG_RX12-
C93 GND Power Ground
PWR GND
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Pin COMe Signal Description Type Termination Comment
C94 PEG_RX13+ PCI Express Graphics (PEG) receive lane 13 DP-I
C95 PEG_RX13-
C96 GND Power Ground PWR GND
C97 RSVD Reserved for future use NC
C98 PEG_RX14+ PCI Express Graphics (PEG) receive lane 14 DP-I
C99 PEG_RX14-
C100 GND Power Ground PWR GND
C101 PEG_RX15+ PCI Express Graphics(PEG) receive lane 15 DP-I
C102 PEG_RX15-
C103 GND Power Ground PWR GND
C104 VCC_12V Main input voltage (4.75 V - 20 V) PWR
4.75 V- 20 V
C105 VCC_12V
C106 VCC_12V
C107 VCC_12V
C108 VCC_12V
C109 VCC_12V
C110 GND Power Ground PWR GND
+ and - Differential pair differentiator
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5.2.4. Connector X1B Row D1 - D110
Table 28: Connector X1B Row D Pin Assignment (D1-D110)
Pin COMe Signal Description Type Termination Comment
D1 GND Power Ground PWR GND
D2 GND
D3 USB_SSTX0- USB SuperSpeed transmit pair 0 DP-O
D4 USB_SSTX0+
D5 GND Power Ground PWR GND
D6 USB_SSTX1- USB SuperSpeed transmit pair 1 DP-O
D7 USB_SSTX1+
D8 GND Power Ground PWR GND
D9 USB_SSTX2- USB SuperSpeed transmit pair 2 DP-O
D10 USB_SSTX2+
D11 GND Power Ground PWR GND
D12 USB_SSTX3- USB SuperSpeed transmit pair 3 DP-O
D13 USB_SSTX3+
D14 GND Power Ground PWR GND
D15 DDI1_CTRLCLK_AUX+ DDI1 clock I/O-3.3
PD 100 KΩ
D16 DDI1_CTRLDATA_AUX- DDI1 date I/O-3.3
PU 100 KΩ, 3.3 V (S0)
D17 RSVD Reserved for future use NC
D18 RSVD
D19 PCIE_TX6+ PCI Express transmit lane 6 DP-O
D20 PCIE_TX6-
D21 GND Power Ground PWR GND
D22 PCIE_TX7+ PCI Express transmit lane 7 DP-O
D23 PCIE_TX7-
D24 RSVD Reserved for future use NC
D25 RSVD
D26 DDI1_PAIR0+ DDI1 data pair 0 DP-O
D27 DDI1_PAIR0-
D28 RSVD Reserved for future use NC
D29 DDI1_PAIR1+ DDI1 data pair 1 DP-O
D30 DDI1_PAIR1-
D31 GND Power Ground PWR GND
D32 DDI1_PAIR2+ DDI1 data pair 2 DP-O
D33 DDI1_PAIR2-
D34 DDI1_DDC_AUX_SEL DDI1 select I-3.3
PD 1 MΩ
D35 RSVD Reserved for future use NC
D36 DDI1_PAIR3+ DDI1 data pair 3 DP-O
D37 DDI1_PAIR3-
D38 RSVD Reserved for future use NC
D39 DDI2_PAIR0+ DDI2 data pair 0 DP-O
D40 DDI2_PAIR0-
D41 GND Power Ground PWR GND
D42 DDI2_PAIR1+ DDI2 data pair 1 DP-0
D43 DDI2_PAIR1-
D44 DDI2_HPD DDI2 Hotplug Detect I-3.3
PD 100 KΩ
D45 RSVD Reserved for future use NC
D46 DDI2_PAIR2+ DDI2 data pair 2
DP-O
D47 DDI2_PAIR2-
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Pin COMe Signal Description Type Termination Comment
D48 RSVD Reserved for future use NC
D49 DDI2_PAIR3+ DDI2 data pair 3
DP-0
D50 DDI2_PAIR3-
D51 GND Power Ground PWR GND
D52 PEG_TX0+ PCI Express Graphics (PEG) transmit lane 0 DP-O
D53 PEG_TX0-
D54 PEG_LANE_RV# PCI Express Graphics (PEG) Lane Reversal NC
D55 PEG_TX1+ PCI Express Graphics (PEG) transmit lane 1 DP-O
D56 PEG_TX1-
D57 TYPE2#
Indicates the Carrier Board the pinout type and is Ground for type 6 modules
PWR GND for Type 6 module
D58 PEG_TX2+ PCI Express Graphics (PEG) transmit lane 2 DP-O
D59 PEG_TX2-
D60 GND Power Ground PWR GND
D61 PEG_TX3+ PCI Express Graphics (PEG) transmit lane 3 DP-O
D62 PEG_TX3-
D63 RSVD Reserved for future use NC
D64 RSVD
D65 PEG_TX4+ PCI Express Graphics (PEG) transmit lane 4 DP-O
D66 PEG_TX4-
D67 GND Power Ground PWR GND
D68 PEG_TX5+ PCI Express Graphics (PEG) transmit lane 5 DP-O
D69 PEG_TX5-
D70 GND Power Ground PWR GND
D71 PEG_TX6+ PCI Express Graphics (PEG) transmit la ne 6 DP-O
-
D72 PEG_TX6-
D73 GND Power Ground PWR GND
D74 PEG_TX7+ PCI Express Graphics (PEG) transmit lane 7 DP-O
D75 PEG_TX7-
D76 GND Power Ground PWR GND
D77 RSVD Reserved for future use NC
D78 PEG_TX8+ PCI Express Graphics (PEG) transmit lane 8 DP-O
D79 PEG_TX8-
D80 GND Power Ground PWR GND
D81 PEG_TX9+ PCI Express Graphics (PEG) transmit lane 9 DP-O
D82 PEG_TX9-
D83 RSVD Reserved for future use NC
D84 GND Power Ground PWR GND
D85 PEG_TX10+ PCI Express Graphics (PEG) transmit lane 10 DP-O
D86 PEG_TX10-
D87 GND Power Ground PWR GND
D88 PEG_TX11+ PCI Express Graphics (PEG) transmit lane 11 DP-O
D89 PEG_TX11-
D90 GND Power Ground PWR GND
D91 PEG_TX12+ PCI Express Graphics (PEG) transmit lane 12 DP-O
D92 PEG_TX12-
D93 GND Power Ground PWR GND
D94 PEG_TX13+ PCI Express Graphics (PEG) transmit lane 13 DP-O
D95 PEG_TX13-
D96 GND Power Ground PWR GND
D97 RSVD Reserved for future use
NC
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Pin COMe Signal Description Type Termination Comment
D98 PEG_TX14+ PCI Express Graphics (PEG) transmit lane 14 DP-O
D99 PEG_TX14-
D100 GND Power Ground PWR GND
D101 PEG_TX15+ PCI Express Graphics (PEG) transmit lane 15 DP-O
D102 PEG_TX15-
D103 GND Power Ground PWR GND
D104 VCC_12V Main input voltage (4.75 V - 20 V)
PWR
4.75 V-20V
D105 VCC_12V
D106 VCC_12V
D107 VCC_12V
D108 VCC_12V
D109 VCC_12V
D110 GND Power Ground PWR GND
+ and - Differential pair differentiator
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6/ uEFI BIOS
6.1. Starting the uEFI BIOS
The COMe-bKL6 uses a Kontron-customized, pre-installed and configured version of Aptio ® V uEFI BIOS based on the Unified Extensible Firmware Interface (uEFI) specification and the Intel® Platform Innovation Framework for EFI. This uEFI BIOS provides a variety of new and enhanced functions specifically tailored to the hardware features of the COMe-bKL6.
The BIOS version covered in this document might not be the latest version. The latest version might have certain differences to the BIOS options and features described in this chapter.
Register for the EMD Customer Section to get access to BIOS downloads and Product Change Notification (PCN) service.
The uEFI BIOS comes with a Setup program that provides quick and easy access to the individual function settings for control or modification of the uEFI BIOS configuration. The Setup program allows for access to various menus that provide functions or access to sub-menus with further specific functions of their own.
To start the uEFI BIOS Setup program, follow the steps below:
1. Power on the board.
2. Wait until the first characters appear on the screen (POST messages or splash screen).
3. Press the <DEL> key.
4. If the uEFI BIOS is password-protected, a request for password will appear. Enter either the User Password or the
Supervisor Password (see Security Setup Menu), press <RETURN>, and proceed with step 5.
5. A Setup menu appears.
The COMe-bKL6 uEFI BIOS Setup program uses a hot key navigation system. The hot key legend bar is located at the bottom of the Setup screens. The following table provides a list of navigation hot keys available in the legend bar.
Table
29: Navigation Hot Keys Available in the Legend Bar
Sub-screen Description
<F1> <F1> key invokes the General Help window
<-> <Minus> key selects the next lower value within a field
<+> <Plus> key selects the next higher value within a field
<F2> <F2> key loads previous values
<F3> <F3> key loads optimized defaults
<F4> <F4> key Saves and Exits
<→> or <←>
<Left/Right> arrows selects major Setup menus on menu bar, for example, Main or Advanced
<↑> or <↓>
<Up/Down> arrows select fields in the current menu, for example, Setup function or sub-screen
<ESC> <ESC> key exits a major Setup menu and enters the Exit Setup menu
Pressing the <ESC> key in a sub-menu displays the next higher menu level
<RETURN> <RETURN> key executes a command or selects a submenu
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6.2. Setup Menus
The Setup utility features a selection bar at the top of the screen that lists the available menus:
Main Advanced Chipset Security Boot Save & Exit
The currently active menu and the currently active uEFI BIOS Setup item are highlighted in white. Use the left and right arrow keys to select the Setup menus.
Each Setup menu provides two main frames. The left frame displays all available functions. Configurable functions are displayed in blue. Functions displayed in grey provide information about the status or the operational configuration. The right frame displays a Help window providing an explanation of the respective function.
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6.2.1. Main Setup Menu
On entering the uEFI BIOS, the Setup program displays the Main Setup menu. This screen lists basic system information.
Figure 6: Main Setup Menu Initial Screens
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The following table shows Main sub-screens and functions, and describes the content. Default settings are in
bold
.
Table 30: Main Setup Menu Sub-screens
Sub-Screen Description
Board Information>
Read only field
Displays Board Information:
Board ID, Fab ID, and LAN PHY revision
Processor Information>
Read only field
Displays Processor Information:
Name, Type, Speed, ID, Stepping, Number of Processors, Microcode Revision, and GT Info
Displays BIOS Version and Memory RC Version Information:
IGFX VBIOS Version, IGFX GOP Version, Memory RC Version Total Memory and Memory Frequency.
PCH Information>
Read only field
Displays PCH information:
Name, PCH SKU, Stepping, and Hsio Revision
Displays SPI Clock Information:
Read ID/Status Clock Frequency, Write and Erase Clock Frequency, and Fast Read Clock Frequency, Read Clock Frequency
Displays Firmware Information:
ME FWVersion and ME Firmware SKU
System Language>
Selects system default language [
English
]
Platform Information>
Read only field
Displays Module Information
Product Name, Revision, Serial # ‚MAC Address, Boot Counter, and CPLD Rev
Additional information for MAC Address
The MAC address entry is the value used by the Ethernet controller and may contain the entry’ Inactive’ - Ethernet chip is inactive.
To activate the Ethernet chip set the following: Advanced > Network Stack Configuration > Network Stack > Enable
88:88:88:88:87:88 is a special pattern that will be filled in by the Ethernet firmware if there is no valid entry in the firmware block of the BIOS SPI (i.e. the MAC address has been overwritten during the last attempt to flash the system). For more information, see Chapter 6.5 Firmware Update.
System Date> Displays the system date
[Week Day mm/dd/yyyy]
System Time> Displays the system time
[hh:mm:ss]
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6.2.2. Advanced Setup Menu
The Advanced Setup menu provides sub-screens and second level sub-screens with functions, for advanced configuration and Kontron specific configurations.
Setting items, on this screen, to incorrect values may cause system malfunctions.
Figure 7: Advanced Setup Menu Initial Screen
The following table shows the Advanced sub-screens and functions and described the content. Default settings are in bold
and some functions include additional information.
Table 31: Advanced Setup menu Sub-screens and Functions
Sub-Screen Function Second level Sub-Screen / Description
CPU Configuration>
Read only field
Displays CPU Information
Type, ID, Speed, L1 Data Cache, L1 Instruction Cache, L2 Cache, L3 Cache, L4 Cache, VMX, and SMX/TXT
Intel (VMX) Virtualization Technology>
Enables VMM to utilize additional hardware capabilities provided by Vanderpool Technology
[
Enabled
, Disabled]
Active Processor Cores>
Displays number of cores to be enabled in each processor package [
All
, 1, 2, 3]
Power and Performance>
CPU Power Management Control>
Boot Performance Mode>
Selects the performance state the BIOS sets before OS handoff
[
Max. Non-Turbo Perf
., Max. Battery, Turbo Perf.]
Intel® Speedstep ™>
Allows support for more than two frequency ranges [
Enabled
, Disabled]
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Sub-Screen Function Second level Sub-Screen / Description
Power and Performance>
(continued)
CPU Power management Control>
(continued)
Intel® Speed Shift Technology>
Intel Speed Shift Technology support. Enable exposes CPPC v2 interface to allow for hardware controlled P-states.
[
Enabled
, Disabled]
Turbo Mode> Enables or disables Processor Turbo mode. Note:
EMTTM must also be enabled. Auto means enabled unless the max. turbo ratio is
bigger than 16-SKL A0 W/A. [
Enabled
, Disabled]
Config TDP Configurations>
Configurable TDP Boot Mode>
Selects the TDP Mode, where the deactivate option sets the MSR to nominal and MMIO to zero.
[
Nominal
, Up, Down, Deactivate]
Configurable TDP Lock>
[
Disabled
]
CTDP BIOS Control>
[
Disabled
]
Config, TDP levels>
States the number of TDP levels (3)
ConfigTDP Turbo Activation Ratio>
Actual value for Turbo activation ratio
(25 (unlocked))
Power Limit 1> Displays power limit value in milli
Watts (mW). Note: Value will be rounded to the next 1/8 W. Zero means: no custom override.
(15.0 W (MSR:25.0))
Power Limit 2> Displays power limit value in milli
Watts (mW) (25.0 W (MSR: 15.0)
Customer Settings Nominal Config TDP Nominal>
Ratio:26, TAR:25, PL1:15.0 W
Power Limit 1> Displays power limit value in mili
Watts (mW). Note: . Value will be rounded to the next 1/8 W. Zero means: no custom override. (0)
Power Limit 2> Displays power limit value in milli
Watts (mW). Note: . Value will be rounded to the next 1/8 W. Zero means: no custom override. (0)
Power Limit 1 Time Window>
Sets the time window for power limit 1.
[0]
ConfigTDP Turbo Activation Ratio>
Custom value for Turbo activation ratio. This needs to be configured with valid values from LFM to Max Turbo.
(0)
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Sub-Screen Function Second level Sub-Screen / Description
Power and Performance>
(continued)
CPU Power management Control>
(continued)
Config TDP Configurations>
(continued)
Customer Settings Down ConfigTDP level 1>
Ratio:8, TAR:7, PL1:7.500 W
Power Limit 1> Displays power limit value in mili
Watts (mW). Note: Value will be rounded to the next 1/8 W. Zero means: no custom override (0)
Power Limit 2> Displays power limit value in milli
Watts (mW). Note: Value will be rounded to the next 1/8 W. Zero means: no custom override (0)
Power Limit 1 Time Window>
Sets the time window for power limit 1
[0]
Customer Settings UP ConfigTDP level 2>
Ratio:27, TAR:26, PL1:25.0 W
Power Limit 1> Displays power limit value in
Watts. Note: . The value will be rounded to the next 1/8W. Zero means: no custom override.
(0)
Power Limit 2> Displays power limit value in Watts
Note: . The value will be rounded to the next 1/8W. Zero means: no custom override.
(0)
Power Limit 1 Time Window>
Sets the time window for power limit 1
[0]
ConfigTDP Turbo Activation Ratio>
Custom value for Turbo activation ratio. This needs to be configured with valid values from LFM to Max Turbo. (0)
Additional Information
The system allows for cTDP (=configurable thermal design power) to be set dynamically. This option is only available for processors that really support this feature. The menu item will disappear for any other CPU. The menu screen will also be different according to the options the CPU supports.
Usually there are three levels to support: nominal, down and up. For each level the power limits, their time window and the activation ratio may be chosen. A value of zero for the activation ratio means that this level is not being used.
NOTE: Take care to create valid configurations to avoid unexpected behavior of the system.
C-states> Enables or disables CPU power management to allow
CPU to enter C-Sates when not 100% utilized. [
Enabled,
Disabled]
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Sub-Screen Function Second level Sub-Screen / Description
Power and Performance>
(continued)
CPU Power management Control>
(continued)
Enhanced C­state>
Enables or disables C1E. If enabled CPU switches to minimum speed when all cores enter C-state.
[
Enabled
, Disabled]
Packaged C­state Limit>
Maximum Package C-State limit setting. Default: leaves the factory default value. Auto initializes to deepest available package c-state
limit. [Auto, CPU Default, C10, C9, C8, C7S, C7, C6, C3, C2, C0/C1]
Thermal Monitor>
Enable/disable thermal monitor [
Enabled
, Disabled]
GT Power management Control>
RC6 (Render standby)>
Check to enable render standby support. [
Enabled
, Disabled]
Maximum GT Frequency>
Maximum GT frequency limited by user. Choose from range 350 MHz (RPN) to 1000 MHz (RPO).
Out of range values are clipped to the minimum and maximum range values above.
[
Default Max Frequency
, 100 MHz, – 1200 MHz]
PCH-FW Configuration>
Read only fields ME FW Version, ME Firmware Mode, ME Firmware SKU, ME File System Integrity Value,
ME Firmware Status 1, ME Firmware Status 2, NFC Support and ME State.
ME State> If disabled, ME enters ME temporarily disabled mode.
[
Enabled
, Disabled]
ME Unconfig ON RTC Clear>
If disabled, ME is not unconfigured on RTC clear. [
Enabled
, Disabled]
Comms Hub Support>
Support for Comms hub [Enabled,
Disabled
]
JHI Support> Enables or disables Intel® DAL Host Interface Service (JHI)
[Enabled,
Disabled
]
Core BIOS Done Message>
Enables or disables core BIOS done message sent to ME [
Enabled
, Disabled]
Firmware Update Configuration>
ME FW Image Re-Flash>
Enables or disables ME FW Image RE-Flash function [Enabled,
Disabled
]
Local FW Update>
Read only field [
Enabled
]
Thermal Configuration>
CPU Thermal Configuration>
DTS SMM> ACPI thermal management uses either HWM reported
values when disabled or DTS SMM mechanism to obtain CPU temperatures values when enabled.
Note: enabling DTS might deteriorate the system’s real time behavior through handling the necessary SMMs.
[Enabled,
Disabled
, Critical Temp Reporting]
Tcc Activation Offset>
Displays the offset from the factory TCC (Thermal Control Circuit) activation temperature. Note: this values is subtracted from the TCC threshold, i.e. ‘0’ means maximum allowed temperature.
[0]
ACPI T-states> ACPI T-States
[Enabled ,
Disabled
]
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Sub-Screen Function Second level Sub-Screen / Description
Thermal Configuration>
(continued)
Platform Thermal Configuration>
Automatic Thermal Reporting>
Enable -configures ACPI thresholds according to INTEL thermal management settings and disable allows for manual configuration.
[Enabled,
Disabled
]
Critical Trip Point>
Controls the temperature of the ACPI Critical Trip Point at which OS shuts off the system. Note: The plan of record (POR) for Intel® Mobile Processors is 119°.
[127°C,
119°C
, 111°C, 103°C, 100°C, 95°C, 87°C, 79°C, 71°C,
63°C, 55°C, 47°C, 39°C, 31°C, 23°C, 15°C]
Passive Trip Point>
Controls temperature of ACPI Passive Trip Point at which OS begins to throttle the processor.
[119°C, 111°C, 103°C, 100°C,
95°C
, 87°C, 79°C, 71°C, 63°C,
55°C, 47°C, 39°C, 31°C, 23°C, 15°C, Disabled]
Passive TC1 Value>
Sets TC1 values for ACPI passive cooling formula (Range: 1-16)
[1]
Passive TC2 Value>
Sets TC2 values for ACPI passive cooling formula (Range: 1-16)
[5]
Passive TSP Value>
Sets TSP value for ACPI passive cooling formula. TSP value represents how often OS reads the temperature when passive cooling is enabled. (Range: 2-32)
[10]
Passive Trip Points>
Passive Trip Points [Enabled,
Disabled
]
Critical Trip Points>
Critical Trip Points [
Enabled
, Disabled]
Intel ICC> ICC/OC
Watchdog Timer>
Enabling exposes the ICC/OC watchdog timer to OS as ACPI device. BIOS always uses WDT HW when changing clock setting. [Enabled,
Disabled]
ICC Locks After EOP>
Read only field Specifies the ICC registers to write to, after end of post. [
Default
]
ICC Profile> Read only field
Specified the ICC profile [1]
Trusted Computing>
Security Device Support>
Enables or disables BIOS support for security device. Operating system will not show security device. TCG EFI protocol and INT1A interface are not available.
[
Enabled,
Disabled]
Active PCR Banks>
Read only field Displays active PCR Banks [
SHA-1,SHA256
]
Available PCR Banks>
Read only field Displays available PCR Banks [
SHA-1,SHA256
]
SHA-1 PCR Bank>
SHA-1 PCR Bank [
Enabled
, Disabled]
SHA256 PCR Bank>
SHA256 PCR Bank [
Enabled
, Disabled]
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Sub-Screen Function Second level Sub-Screen / Description
Trusted Computing>
(continued)
Pending Operation>
Schedules operation for Security Device Note: Computer reboots on restart in order to change the state of the security device.
[
None
, TPM Clear]
Platform Hierarchy>
Platform Hierarchy [
Enabled
, Disabled]
Storage Hierarchy>
Storage Hierarchy [
Enabled
, Disabled]
Endorsement Hierarchy>
Endorsement Hierarchy [
Enabled
, Disabled]
TPM2.0 UEFI Spec Version>
Selects TCG2 Spec Version support. TCG_1_2 is compatible mode for Win8/Win10 and TCG_2 supports TCG2 protocol + event format Win 10 or later. [TCG_1_2,
TCG_2
]
Physical Presence Spec Version>
Select to tell OS to support either PPI Spec 1.2 or 1.3 Note: Some HCK tests might not support 1.3.
[1.2,
1.3]
TPM 20 InterfaceType>
Read only field [
TIS
]
Device Select> BIOS support for security devices. Auto supports both TPM 1.2 and TPM
2.0. TPM 1.2 restricts support to TPM 1.2 devices and TPM 2.0 restricts support to TPM 2.0. devices.
[TPM 1.2, TPM 2.0,
Auto
]
ACPI settings> Enable ACPI
Auto Configuration>
Enables or disables BIOS ACPI auto configuration. If enabled, the system uses generic ACPI settings that may not fit the system best.
[Enabled,
Disabled
]
Enable Hibernation>
Enables or disables systems ability to hibernate (OS/S4 Sleep State) This option may not be effective with some operating systems.
[
Enabled
, Disabled]
ACPI Sleep State>
Selects highest ACPI sleep state that the system enters when SUSPEND button is pressed
[Suspend Disabled,
S3 (Suspend to Ram)
]
Lock Legacy Resources>
Enables or disable lock of legacy resources [Enabled,
Disabled
]
S3 Video Repost>
Enables or disables S3 video repost [Enabled,
Disabled]
Miscellaneous>
Watchdog>
Auto Reload>
Enables automatic reload of watchdog timers on timeout [Enabled,
Disabled
]
Global Lock>
Enable sets all Watchdog registers (except for WD_KICK) to read only, until board is reset. [Enabled,
Disabled
]
Stage 1 Mode>
Selects action for this Watchdog stage [
Disabled
, Reset, NMI, SCI, Delay, WDT Signal only]
Additional Information two-staged watchdog
Programmable stages to trigger different actions - If one stage is disabled, then the next stage is also disabled.
Common actions for a watchdog trigger events ‘Delay’, ‘Reset’ and ‘Watchdog signal only’
CPLD code allows for triggering NMI or SCI. This needs programming of a predefined action
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Sub-Screen Function Second level Sub-Screen / Description
Miscellaneous> (continued)
inside the BIOS and therefore can only be used in a customized BIOS solution. Timeouts that can be set to eight different fixed values between 1 second and 30 minutes.
Reset Button Behavior>
Selects reset button behavior [
Chipset Reset
, Power cycle]
I2C Speed> Selects internal I2C bus speed between (1 kHz and 400 kHz)
[
200 kHz
]
On-board I2C Mode>
Keep ‘Multimaster’ setting unless otherwise noted [
MultiMaster
, BusClear]
Manufacturing Mode>
Read only field [
Disabled
]
LID Switch Mode>
Shows or hides Lid Switch Inside ACPI OS. The default setting is disabled. [
Disabled
, Active normal, Active inverse]
Sleep Button Mode>
Shows or hides Sleep Button inside ACPI OS. Default setting is disabled. [Enabled,
Disabled]
ACPI Temperature Polling>
Sets mode used for temperature polling through the OSPM (0 is disabled and 1 enabled9. [
Enabled
, Disabled]
TZ00 Temperature Polling>
Displays the time interval in seconds, between two attempts to measure temperature in ACPI thermal zone 00 (Ambient temperature)
[30]
TZ01 Temperature Polling>
Displays the time interval in seconds, between two attempts to measure temperature in ACPI thermal zone 01 (CPU temperature)
[30]
PCI ExpressCard 0>
Controls PCIe port for ExpressCard support If not used, keep in the disabled state.
[Port 1, Port 2, Port 3, Port4,
Disabled
]
PCI ExpressCard 1>
Controls PCIe port for ExpressCard support If not used, keep in the disabled state. [Port 1, Port 2, Port 3, Port4,
Disabled
]
SMART Settings>
Smart Self Test> Run Smart Self Test on all HDDs during POST
[Enabled,
Disabled
]
H/W Monitor>
CPU Temperature>
Read only field Displays CPU temperature in °C
Module Temperate>
Read only field Displays module temperature in °C
CPU Fan – Fan Control>
Sets Fan Control mode for CPU fan Disable - stops fan. Manual – manually sets the fan Auto – Hardware monitor controls cooling, similar to ACPI based ‘Active
Cooling’, without producing a software load to the system. [Disable, Manual,
Auto
]
CPU Fan – Fan Pulse>
Displays number of pulses fan produces during 1 revolution. (Range: 1-4) [2]
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Sub-Screen Function Second level Sub-Screen / Description
H/W Monitor> (continued)
CPU Fan – Fan Trip Point>
Displays temperature at which the fan accelerates. (Range: 20°C – 80°) [
50
]
CPU Fan – Trip Point Speed>
Displays Fan speed at trip point in %. Minimum value is 30 %. Fan always runs at 100 % at TJmax (-10°C). [50]
CPU Fan – Ref. Temperature>
Determines temperature source used for automatic fan control [PCH Temperature, Module Temperature,
CPU Temperature
]
External Fan- Fan Control>
Sets Fan Control mode for external fan Disable - stops the fan Manual – manually set the fan Auto - hardware monitor controls cooling, similar to ACPI based ‘Active
Cooling’, without producing a software load to the system. [Disable, Manual,
Auto
]
External Fan– Fan Pulse>
Displays number of pulse fan produces during 1 revolution (Range: 1-4) [
2
]
External Fan­Fan Trip point>
Displays temperature at which fan accelerates. (Range: 20°C to 80°C) [50]
External Fan­Trip Point
Speed>
Displays Fan speed at trip point in %. Minimum value is 30% Fan always runs at 100% at TJmax (-10°C) [50]
External Fan Reference Temperature>
Determines temperature source used for automatic fan control [PCH Temperature, Module Temperature,
CPU Temperature
]
Additional information External Fan
An external fan can be connected to baseboard. The external fan’s control lines are routed via the COMe connector.
5.0V Standby> Read only field Displays standby voltage
Batt Volt. at COMe Pin>
Read only field Displays battery voltage at COMe pin
Widerange Vcc> Read only field
Displays wide range VCC
Serial Port Console Redirection>
COM0 Console
Redirection>
Console redirection via COMe module’s COM1. If redirection is enabled then the port settings such as Terminal type, Bits
per second, Data bits, Parity etc. can be adjusted here. Note: on-module COM ports do not support flow control.
[Enabled,
Disabled
]
COM1 Console
Redirection>
Console redirection via COMe module’s COM2. If redirection is enabled, then the port settings such as Terminal type, Bits
per second, Data bits, Parity etc. can be adjusted here. Note: On-module COM ports do not support flow control.
[Enabled,
Disabled
]
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Sub-Screen Function Second level Sub-Screen / Description
Serial Port Console Redirection>
(continued)
COM2 Console
Redirection>
Console redirection via COM3, available with an optional Winbond SuperIO on the baseboard. (Default is disabled)
If redirection is enabled, then the port settings such as Terminal type, Bits per second, Data bits, Parity etc. can be adjusted here.’
[Enabled,
Disabled
]
COM3 Console
Redirection Settings>
Console redirection via COM4, available with an optional Winbond SuperIO on the baseboard. (Default is disabled)
If redirection is enabled, then the port settings such as Terminal type, Bits per second, Data bits, Parity etc. can be adjusted in ‘Settings’.
[Enabled,
Disabled
]
Legacy Console Redirection>
Legacy Serial Redirection Port>
Selects a COM port to display redirection of legacy OS and legacy OPROM messages
[
COM0
, COM1, COM2, COM3]
Serial Port for Out-of-Band Management / Windows EMS
Console Redirection>
Console redirection [Enabled,
Disabled
]
SIO Configuration>
Serial Port 0> Use This Device> Enables or disables the use of this logical device.
[
Enabled
, Disabled]
Logical Device Settings: Current>
Read only field IO=3F8h; IRQ=4
Logical Device Settings: Possible>
Allows the user to change the device’s resource settings. New settings are reflected on the Setup page after system restarts.
[
Use Automatic Settings
, IO=3F8h; IRQ=4, IO=3F8h; IRQ=3,4,5,7,9,10,11,1, IO=2F8h; IRQ=3,4,5,7,9,10,11,12, IO=3E8h; IRQ=3,4,5,7,9,10,11,12, IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
Serial Port 1>
Use This Device> Enables or disables the use of this logical device.
[
Enabled
, Disabled]
Logical Device Settings: Current>
Read only field IO=2F8h; IRQ=3
Logical device settings:
Possible>
Allows the user to change the device’s resource settings. New settings are reflected on the Setup page after system restart.
[
Use Automatic Settings
, IO=2F8h; IRQ=3, IO=3F8h; IRQ=3,4,5,7,9,10,11,1, IO=2F8h; IRQ=3,4,5,7,9,10,11,12, IO=3E8h; IRQ=3,4,5,7,9,10,11,12, IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
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Sub-Screen Function Second level Sub-Screen / Description
SIO Configuration>
(continued)
Additional Information SIO:
If they exist, additional interfaces such as Serial Port 2, Serial Port 3 and Parallel Port will be included within the SIO Configuration setup page.
The SIO Configuration menu enables all available serial interfaces to be configured. The module-based serial interfaces always appear as COM1 and COM2. COM 1 and COM 2 can be treated as 16550-compatible legacy COM interfaces at the standard I/O addresses and are based in the on-module CPLD. Note: Hardware flow control is not supported.
Optionally, If the baseboard contains an activated SuperIO of the type Winbond 83627, then its serial interfaces are added to the system as COM3 and COM4. COM3 and COM4 IRQ and I/O addresses are configurable in this menu, too.
Although the chipset internal COMs are not supported due to technical constraints their driver must be installed. Installing the driver does not mean that these serial interfaces are useable.
Warning: Logical Devices state on the left side of the control reflects the current logical device state. Changes made during the setup session are shown after restarting the system.
PCI Subsystem Settings>
PCI Latency Timer>
Displays value to be programmed into the PCI latency timer register [32, 64, 96, 128, 160, 192, 224, 248]
PCI-X Latency Timer>
Displays value to be programmed into the PCI latency timer register [32, 64, 96, 128, 160, 192, 224, 248]
VGA Palette Snoop>
Enables or disables VGA palette register snooping [Enabled,
Disabled]
PERR# Generation>
Enables or disables PCI device to generate PERR# [Enabled,
Disabled
]
SERR# Generation>
Enables or disables PCI device to generate SERR# [Enabled,
Disabled
]
Above 4G Decoding>
Enables or disables decoding in Address Space above ‘4G’ for 64 bit capable devices. Note: Only if system supports 64 bit PCI decoding.
[Enabled,
Disabled
]
PCI Hot-Plug Settings>
BIOS Hot Plug Support>
Enable – allows BIOS built in hot-plug support Note: Use if OS does not support PCIe and SHPC hot-plug
natively. [
Enabled
, Disabled]
PCI Buses Padding>
Padd PCI Buses behind the bridge for hot-plug [Disabled, 1, 2, 3, 4, 5]
I/O Resources Padding>
Padd PCI resources behind the bridge for hot-plug [Disabled,
4 k,
8 k, 16 k, 32 k]
MMIO 32 bit Resources Padding>
Padd PCI MMIO 32 bit resources behind the bridge for hot-plug.
[Disabled, 1 M, 2 M, 4 M, 8 M,
16, M
, 32 M, 64 M, 128 M]
PFMMIO 32 bit Resources Padding>
Padd PCI MMIO 32 bit pre-fetchable resources behind the bridge for hot-plug.
[Disabled, 1 M, 2 M, 4 M, 8 M,
16, M
, 32 M, 64 M, 128 M]
Network Stack Configuration>
Network Stack> If UEFI network stack is enabled, the Ethernet chip is active.
[Enabled,
Disabled
]
CSM Configuration>
CSM Support>
Enables or disables CSM Support If enabled, the CSM details can be changed. Below ‘Option ROM Execution’
are ‘Network, ‘Storage’, ’Video’ and ‘Other PCI devices’.
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Sub-Screen Function Second level Sub-Screen / Description
CSM Configuration>
(continued)
CSM Support> (continued)
Note: ‘Network’ must be changed to’ Legacy’ for legacy boot. (Default setting is ‘Do not launch’).
[Enabled,
Disabled
]
Additional Information CSM:
Compatibility Support Module (CSM) configuration is important for legacy operating systems By default, CSM is disabled for modern OS such as Windows 8, 10 and Linux. If a legacy OS is used or a Windows or Linux system is run in legacy mode then this menu
allows for detailed option settings.Note, a change in settings only come into effect after the next restart. Therefore, to be able to use the actualized settings, it is recommended to save and exit the setup and re-enter.
The ‘Optional ROM Execution’ settings requires special care. Any OS using an INT10 based display output needs the ‘Video’ option set to ‘Legacy’, in the same way that PXE boot needs ‘Network’ ‘Optional ROM’ to be set to ‘Legacy’.
NVMe Configuration>
Read only field Acts as a message showing NVMe (Non-Volatile memory PCIe) devices connected to the
system. [
NO NVME Device Found
]
Switchable Graphics>
SG Mode Select> Read only field
Switchable graphics selection [
Muxless
]
USB Configuration>
Read only fields USB Configuration, UBS Module Version, USB Controllers, and USB devices
Legacy USB Support>
Enable- Supports legacy USB Auto– disables legacy support, if no USB devices are connected Disable-keeps USB devices available for EFI applications only [
Enabled
, Disabled, Auto]
XHCI Hand-off> XHCI ownership change claimed by XHCI driver. Note: this is a work around
for OS(s) without XHCI hand-off support. [
Enabled
, Disabled]
USB Mass Storage Driver Support>
Enables or disables USB mass storage driver support [
Enabled
, Disabled]
Port 60/64 Emulation>
Enables I/O port 60h/64h emulation support Note: Enable for USB keyboard legacy support for non-USB aware OS(s). [Enabled,
Disabled
]
USB Transfer Time-out>
Displays timeout value for control, bulk and interrupt transfers [1 sec, 5 sec, 10 sec,
20 sec
]
Device Reset Time-out>
Displays USB mass storage device start unit command time-out [10 sec,
20 sec
, 30 sec, 40 sec]
Device Power­up Delay>
Displays maximum time taken for the device to report itself to the host properly. Auto uses the default :root port 100 ms /hub port delay from hub port descriptor.
[
Auto
, Manual]
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6.2.3. Chipset Setup Menu
On entering the Chipset Setup menu, the screen lists two sub-screen options:
System Agent (previously Northbridge) PCH-IO (previously Southbridge)
6.2.3.1. Chipset > System Agent Configuration
Figure 8: System Agent Configuration Menu Initial Screen
The following table shows System Agent Configuration sub-screens and functions, and describes the content. Default settings are in
bold
.
Table 32: Chipset Set > System Agent Configuration Sub-screens and Functions
Function Second level Sub-Screen / Description
SA PCIe Code Version>
Read only field States versions of the code
VT-d > Read only field
States if virtualization is supported
Graphics Configuration>
Graphics Turbo IMON Current>
Displays supported Graphics turbo IMON current values range: (14-31) [31]
Skip Scanned for External GfX Card>
If enabled, no scan is made for external Gfx cards on PEG or PCH PCIE ports. Default setting is disabled.
[Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
Graphics Configuration >
(continued)
Internal Graphics> To keep IGFX enabled, based on setup options
[
Auto
, Enabled, Disabled]
GTT Size> Select GTT size
[2 MB, 4 MB,
8 MB
]
Aperture Size> Select Aperture size. Note: above 4GB MMIO, BIOS assignment is
automatically enabled when selecting 2048 MB aperture. Note:To use this feature disable CSM support.
[128 MB,
256 MB
, 512 MB, 1024 MB, 2048 MB]
DVMT Pre-Allocated>
Select DVMT 5.0 pre-allocated (fixed) graphics memory size used by internal graphics device.
[0 M,
32 M
, 64 M, 4 M, 8 M, 12 M, 16 M 20 M 24 M, 28 M 32 M/F7, 36 M,
40 M, 44 M, 48 M, 52 M 56 M 60 M]
DVMT Total Gfx Mem>
Select DVMT 5.0 graphics memory size used by internal graphics device [
256M,
128M, MAX.]
Gfx Low Power Mode>
Used for SFF only [
Enabled
, Disabled]
VDD Enable> Enables or disables VDD forcing in BIOS
[
Enabled
, Disabled]
HDCP Support> HDCP provisioning BIOS support
[
Enabled
, Disabled]
Algorithm> HDCP re-encryption flow
[
One-time
, Periodic]
PM Support> Enables or disables PM support
[
Enabled
, Disabled]
PAVP Enable> Enables or disables PAVP
[
Enabled
, Disabled]
Cdynmax Clamping Enable>
Enables or disabled cdynmax clamping [
Enabled
, Disabled]
Cd Clock Frequency> Select highest Cd clock frequency supported by platform
[337.5 MHz, 450 MHz, 540 MHz,
675 MHz
]
IGD Configuration>
Read Only field LVS EEPROM data, Data format, Resolution; Colour depth, and Channel
count. Note : Optionally visible if a LVS display is use in auto mode or if LFP has been set manually
IGD- Boot Type> Selects the video device activated during post.
If external graphics are present, this has no effect.
[
Auto
, EFP, LFP, EFP3, EFP2]
LFP Panel Type> Selects panel type connected to eDP port as
native eDP or LVDS via a bridge. Note: Depends on hardware option of the module.
[
LVDS
, eDP ]
Backlight Control> Backlight control settings options
[None external,
PWM
, PWM Inverted, I2C]
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Function Second level Sub-Screen / Description
Graphics Configuration >
(continued)
IGD Configuration> (continued)
PWM Frequency> Set LCD backlight PWM frequency
[
200 Hz
, 400 Hz, 1 kHz, 2 kHz, 4 kHz, 8kHz, 20 kHz,
40 KHz ]
Backlight Value> Sets LCD backlight brightness range: (0-255)
[
128
]
LVDS Clock Center Spreading>
Selects the LVDS clock frequency center spreading depth
[
No Spreading
, 0.5%, 1.0%, 1.5%, 2.0%, 2.5 %]
EFP1 Type> Integrated HDMI/DisplayPort configuration with
external connectors [DisplayPort Only,
DP with HDMI/DVI
, HDMI/DVI]
EFP1 LSPCON> HDMI2.0 feature Level shifter/protocol converter
[Enabled,
Disabled
]
EFP2 Type> Integrated HDMI/DisplayPort configuration with
external connectors [DisplayPort Only,
DP with HDMI/DVI
, HDMI/DVI]
EFP2 LSPCON> HDMI2.0 feature Level shifter/protocol converter
[Enabled,
Disabled
]
EFP3 Type> Integrated HDMI/DisplayPort configuration with
external connectors [DisplayPort Only,
DP with HDMI/DVI
, HDMI/DVI]
EFP3 LSPCON> HDMI2.0 feature Level shifter/protocol converter
[Enabled,
Disabled
]
Mode Persistence> Mode persistence
[Enabled,
Disabled
]
Center Mode> Selects the display device that should be centered
[Enabled,
Disabled
]
PEG Port Configuration>
PEG Configuration> Sets PEG configuration in both normal and reversed modes
[
1x16
, 1x16 rev, 2x8, 2x8 rev, 1x8+2x4, 1x8+2x4 rev]
PEG 0:1:0 – PEG0 or PEG 0:1:1 - PEG1 or PEG 0:1:2 - PEG2
Enable Root Port> Enables or disables the root port
[Enabled, Disabled,
Auto
]
Max Link Speed> Configure PEG #:#:# maximum speed
[
Auto
, Gen1, Gen2, Gen3]
PEG0 Slot Power Limit Value>
Sets power supply upper limit by slot. Power limit (watts) is calculated by multiplying this value by the Slot Power Limit scale. (0 - 255)
[75]
PEG0 Slot Power Limit Scale>
Selects scale used for the slot power limit value [
1.0x
, 0.1x, 0.01x, 0.001X]
PEG0 Physical Slot Number>
Sets the port’s slot number. This number must be globally unique within the chassis (0 - 8191).
Peg Port Feature Configuration>
Detect Non­Compliance device>
Detects non-compliance PCIe device in PEG [Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
PEG Port Configuration>
(continued)
PCIe Spread Spectrum Clocking>
Allows spreader clocking to be disabled for compliance testing [
Enabled
, Disabled]
Memory Configuration>
Read only field Memory RC version, Memory frequency, Memory timings (tCL, tRCD, tRP, tRAS), Channel 0 slot 0,
Size, Channel 0 slot 1, Channel 1 slot 0 and Channel 1, slot 1.
ECC Support> Enables or disables DDR ECC support
[
Enabled
, Disabled]
Max TOLUD> Sets the maximum TOLUD value. Dynamic assignment adjustsTOLUD
automatically, based on largest MMIO length of the installed graphic controller.
[
Dynamic
, 1 GB, 1.25 GB, 1.5 GB, 1.75 GB, 2 GB, 2.25 GB, 2.5 GB, 2.75 GB,
3 GB, 3.25 GB, 3.5 GB]
VT-d> VT-d capability
[
Enabled
/Disabled]
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6.2.3.2. Chipset > PCH-IO Configuration
Figure 9: PCH-IO Configuration Menu Initial Screen
The following table shows the PCH-IO sub-screens and functions, and describes the content. Default settings are in bold
and some functions include additional information.
Table 33: Chipset Set > PCH-IO Configuration Sub-screens and Functions
Function Second level Sub-Screen / Description
PCI Express Configuration>
PCI Express Clock Gating>
PCI Express clock gating for each root port
[Enabled
, Disabled]
Legacy IO Low Latency>
Enables low latency of legacy I/O as some systems require lower I/O latency irrespective of power. This is a tradeoff between power and I/O latency.
[Enabled,
Disabled
]
DMI Link ASPM Control>
Control of Active State Power Management on SA side of DMI link [Enabled,
Disabled
]
PCIE Port Assigned toLAN>
Read Only file This port is always 5. [5]
Port8xh Decode> PCI express port 8xh decode
[Enabled, Disabled]
PCI Express Clock Gating>
PCI Express clock gating for each root port [Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
PCI Express Configuration>
(continued)
Compliance Test Mode>
Enable when using compliance load board [Enabled,
Disabled
]
PCIe-USB Glitch W/A
For bad USB device(s) connected behind PCIE/PEG Port [Enabled,
Disabled
]
PCIe Function Swap
If disables, prevents PCIE root port function swap. If any function other than 0
th
is enabled, 0th will become visible.
[Enabled,
Disabled
]
PCI Root Port 1 (COMe PCIe#4)> or PCI Root Port 2 (COMe PCIe#5)> or PCI Root Port 3 (COMe PCIe#6)> or PCI Root Port 4 (COMe PCIe#7)> or PCI Root Port 9 (COMe PCIe#0)> or PCI Root Port 10 (COMe PCIe#1)> or PCI Root Port 11 (COMe PCIe#2)> or PCI Root Port 12 (COMe PCIe#3)>
PCIe Root port[#]> Controls the PCI Express root ports [1, 2, 3, 4, 9, 10,
11, 12] Note: Uses the CPU enumeration [
Enabled
, Disabled]
Topology> Identifies the SATA Topology
[
Unknown
, x1, x4, SATA Express, M.2.]
ASPM> Sets ASPM level
[Auto, LOsL1, L1, LOs,
Disabled
]
L1 Substates> PCI Express L1 substrates settings.
[Disabled, L1.1, L1.2,
L1.1 &L1.2
]
Gen3 Eq Phase3 method>
PCIe Gen3 Equalization phase 3 method [Hardware, Static Coeff.,
Software Search
]
UPTP> Upstream Port Transmitter Preset
[5]
DPTP> Downstream Port Transmitter Preset
[7]
ACS> Access Control Service Extended Capability
[
Enabled
, Disabled]
URR> PCI Express unsupported request reporting
[Enabled,
Disabled
]
FER> PCI Express device fatal error reporting
[Enabled,
Disabled
]
NFER> PCI Express device non-fatal error reporting
[Enabled,
Disabled
]
CER> PCI Express device correction error reporting
[Enabled,
Disabled
]
CT0> PCIe Express Completion timer (T0)
[Enabled,
Disabled
]
SEFE> Root PCI Express System Error on Fatal Error
[Enabled,
Disabled
]
SENFE> Root PCI Express System Error on non-Fatal Error
[Enabled,
Disabled
]
SECE> Root PCI Express System Error on correctable
error [Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
PCI Express Configuration>
(continued)
PCI Root Port 1 (COMe PCIe#4)> or PCI Root Port 2 (COMe PCIe#5)> or PCI Root Port 3 (COMe PCIe#6)> or PCI Root Port 4 (COMe PCIe#7)> or PCI Root Port 9 (COMe PCIe#0)> or PCI Root Port 10 (COMe PCIe#1)> or PCI Root Port 11 (COMe PCIe#2)> or PCI Root Port 12 (COMe PCIe#3) (continued)
PME SCI> PCI Express PME SCI
[
Enabled
, Disabled]
Hot Plug> PCI Express hot plug
[Enabled,
Disabled
]
Advanced Error reporting>
Advanced –error reporting [
Enabled
, Disabled]
PCIe Speed> Configures PCIe speed
[
Auto
, Gen 1, Gen 2, Gen3]
Transmitter Half Swing>
Transmitter half swing [Enabled,
Disabled
]
Detector Timeout> Number of mSeconds the reference code waits
for a link to exit detect state for enabled ports before assuming there is no device and potentially disabling the port.
Extra Bus Reserved>
Extra bus reseved (0-7) for bridges behind this root bridge.
[0]
Reserved Memory> Reserved memory for this root bridge
Range: (1MB-20MB) [10]
Reserved I/O> Reserved IO for this root bridge
Range: (4 k, 8 k, 16 k, 20 k) [4]
PCH PCIE1 LTR> PCH PCIE latency reporting
[
Enabled
, Disabled]
Snoop latency Override>
Snoop latency override or Non Snoop Override for PCH PCIE.
Disabled: to disable override Manual: to manually enter override values and Auto (default): maintain default BIOS flow. [Disabled, Manual,
Auto
]
Non Snoop latency Override>
Force LTR Override> Force LTR override for PCH PCIE.
Disabled: LTR override not forced Enable: LTR overrides values forced and LTR
messages from device are ignored. [Enabled, Disabled]
PCIE1 LTR Lock> PCIE LTR configuration lock
[Enabled,
Disabled
]
PCIE CLKREQ Mapping Override>
PCIE CLKREQ Override for default platform mapping
[
Default
, No CLKREQ, Custom number]
Extra Options>
Detect Non­Compliance Device>
Detects non-compliance PCI express device. If enabled, It takes more time at post time.
[Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
PCI Express Configuration>
(continued)
Extra Options> (continued)
Prefetch Memory> Prefetchable memory range for this root bridge
[10]
Reserved Memory Alignment>
Reserved memory alignments Range:(0-31)bits [1]
Prefetchable Memory Alignment>
Prefetchable memory alignments Range:(0-31) bits
[1]
Additional Information PCI port
The PCIe menu refers to the different PCIe lanes using their chipset based numbers. For every lane, the number used on the COMe connector is mentioned. Take care to select the PCIe lane you require as numbering varies strongly.
The standard layout for PCIe consists of 8 PCIe x 1 lanes. Other layouts may be programmed by flashing a different descriptor to the Intel firmware on the BIOS SPI flash. Contact Kontron Support if you require a different PCIe layout with your project.
The PCIe BIOS layout for COMe PCIe lanes consists of a default BIOS built to fit most customer applications and offers two additional BIOS binaries for further common PCIe layouts.
PCIe [0..3] PCIe [4..7] Name Extension
Default 4x1 4x1 (8x1)
Alternative 1 1x4 4x1 1x4_4x1
Alternative 2 1x4 1x4 2x4
Other layouts are available on customer request, contact Kontron Support if you require a different PCIe layout for your project.
SATA and RST Configuration>
SATA Controller> SATA device
[
Enabled,
Disabled]
SATA Mode Selection> Determines SATA controllers operation
[
AHCI
, Intel RST Premium]
SATA Test Mode> Test mode enable/disable (loop back)
[Enabled,
Disabled
]
Software Feature Mask Configuration>
HDD Unlock>
Enable indicates HDD password unlock in OS enabled. [
Enabled
, Disabled]
LED Locate>
Enable indicated that LED/SGPIO hardware is attached and ping to locate feature is enabled in OS.
[
Enabled
, Disabled]
Aggressive LPM Support>
Enable PCH to aggressively enter link power state [Enabled,
Disabled
]
SATA Controller Speed>
Displays the maximum support supported by SATA controller [
Default
, Gen1, Gen2, Gen3]
Serial ATA Port 0 or Serial ATA Port 1 or Serial ATA Port 2 or Serial ATA Port 3
Software Preserve> Read only field
Port #> SATA port #
[
Enabled
, Disabled]
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Function Second level Sub-Screen / Description
SATA and RST Configuration>
(continued)
Serial ATA Port 0 or Serial ATA Port 1 or Serial ATA Port 2 or Serial ATA Port 3 (continued)
Hot Plug> Designates port as Hot plug
[Enabled,
Disabled
]
Configured as eSATA> Read only field
Spin Up Device> If enabled staggered spin-up is
performed and only drives with this option enabled will spin up at boot. Otherwise all drives spin up at boot spin up device.
[Enabled,
Disabled
]
SATA Device Type> Identifies if SATA port is connected to a
solid-state drive or hard disk drive. [
Hard Disk Drive
, Solid State Drive]
Topology> Identify the SATA Topology
[
Unknown
, ISATA, Direct Connect, FLEX,
M2]
SATA Port# DevSlp> SATA Port# DevSlp
[Enabled,
Disabled
]
DITO Configuration> DITO configuration
[Enabled,
Disabled
]
DITO Value> Read only field
[625]
DM Value> Read only field
[15]
USB Configuration>
XHCI Disable Compliance Mode>
Option to disable compliance mode Default is false and compliance mode is not disabled. True disables compliance mode
[
False
, True]
xDCI Support> xDCI (USB OTG device)
[Enabled,
Disabled
]
USB Port Disable Override>
Selectively enables or disables the corresponding USB port from reporting a device connection to the controller
[
Disabled
, Select Per-Pin]
Security Configuration>
RTC Lock> Enable locks bytes 38h-3Fh in lower/upper 128 byte bank of RTC
RAM [Enabled,
Disabled
]
BIOS Lock> Enables or disables PCH BIOS lock enable feature. Required to be
enabled to ensure SMM protection of flash. [
Enabled
, Disabled]
HD Audio Configuration>
HD Audio> Controls detection of the HD-Audio device
Auto enables HD if present or disables if not present otherwise HD Audio is unconditionally enabled or disabled
[Enabled, Disabled,
Auto
]
Audio DSP> Enables or disables audio DSP
[Enabled,
Disabled
]
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Function Second level Sub-Screen / Description
HD Audio Configuration>
(continued)
HDA-Link Codec Select> Selects the codec
Platform on-board codec (single verb table) or External codec kit (multiple verb table ) [
Platform Onboard
, External Kit]
iDisplay Audio Disconnect>
Disconnects SDI2 signal to hide/disable iDisplay audio codec [Enabled,
Disabled
]
PME Enable> Enables PM wake of HD audio controller during post.
[Enabled,
Disabled
]
HD Audio Advanced Configuration>
I/O Buffer Ownership>
Selects the ownership of the I/O buffer between Intel HD audio link and I2S port (for bilingual codecs).
[
HD-Audio Link
, HD-Audio Link/I2S Port,
I2S Port]
I/O Buffer Voltage Select>
Selects the voltage operation mode of the I/O buffer
[
3.3 V
, 1.8 V]
HD Audio Link> Selects HD audio link frequency
Applicable only if HDA codec supports selected frequency.
[6 MHz, 12 MHz,
24 MHz
]
iDisplay Link Frequnecy >
Selects iDisplay Link frequency. Applicable only if iDisp codec supports selected
frequency. [48 MHz,
96 MHz
]
PCH LAN Controller>
On-board NICs [
Enabled
, Disabled]
Wake on LAN> Integrated LAN to wake the system
If ME is on in the Sx state, Wake On Lan cannot be disabled. [
Enabled
, Disabled]
Serial IRQ Mode> Configure serial IRQ mode
[Quiet,
Continuous
]
Port 61h Bit-4 Emulation>
Emulates Port 61h bit-4 toggling in SMM [
Enabled
, Disabled]
State After G3> Specifies state to go to when power is re-applied after power failure (G3 State).
[
S0 State
, S5 State]
Port 80h Redirection>
Controls where Port 80h cycles are sent [
LPC Bus
, PCIE Bus]
Enhanced Port 80h LPC Decoding>
Supports word/dword decoding of port 80h behind LPC. [
Enabled
, Disabled]
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6.2.4. Security Setup Menu
The Security Setup menu provides information about the passwords and functions for specifying the security settings. The passwords are case-sensitive.
Figure 10: Security Setup Menu Initial Screen
The following table shows Security sub-screens and functions.
Table 34: Security Setup Menu Functions
Function Description
Administrator Password> Set administrator password
User Password> Set user password
If only the administrator’s password is set, then only access to the setup is limited and is requested when entering the setup.
If only the user’s password is set, then the password is a power on password and must be entered to boot or enter setup. In the setup the user has administrator rights.
The required password length in characters is max. 20 and min. 3.
6.2.4.1. Remember the Password
It is highly recommended to keep a record of all passwords in a safe place. Forgotten passwords results in the user being locked out of the system.
If the system cannot be booted because the User Password or the Supervisor Password are not known, clear the uEFI BIOS settings, or contact Kontron Support for further assistance.
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HDD security passwords cannot be cleared using the above method.
6.2.5. Boot Setup Menu
The Boot Setup menu lists dynamically generated boot device priority order.
Figure 11: Boot Setup Menu Initial Screen
The following table shows Boot sub-screens and functions, and describes the content. Default settings are in
bold
.
Table 35: Boot Setup Menu Functions
Function Description
Setup Prompt Timeout> Displays number of seconds to wait for the setup activation key.
65535(OXFFF) means indefinite waiting
Bootup NumLock State> Selects keyboard NumLock state
[On, Off]
Quiet Boot> Enables or disables Quiet Boot
[
Enabled
, Disabled]
Boot Option #1> Sets the system boot order (option 1)
[
UEFI kingstonDataTraveler 3.0PMAP partition 1
, UEFI Built-in
EFI shell, Disabled]
Boot Option 2 Sets the system boot order (option 2)
[UEFI kingstonDataTraveler 3.0 PMAP partition 1,
UEFI Built-in EFI
shell
, Disabled]
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Function Description
Fast Boot> Enables or disables boot with initialization of a minimal set of
devices required to launch active boot option. This has no effect for BBS boot options.
[Enabled,
Disabled
]
New Boot Option Policy> Controls placement of newly detected UEFI boot options
[
Default
, Place First, Place Last]
6.2.6. Save and Exit Setup Menu
The Save and Exit Setup menu provides functions for handling changes made to the uEFI BIOS settings and exiting the Setup program.
Figure 12: Save and Exit Setup Menu Initial Screen
The following table shows Save & Exit sub-screens and functions, and describes the content.
Table 36: Save and Exit Setup Menu Functions
Function Description
Save Changes and Exit> Exits system after saving changes
Discard Changes and Exit> Exits system setup without saving changes
Save Changes and Reset> Reset system after saving changes
Discard Changes and Reset> Resets system setup without saving changes
Save Changes> Saves changes made so far for any setup options
Discard Changes> Discards changes made so far for any setup options
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Function Description
Restore Defaults> Restores/loads standard default values for all setup options
Save as User Defaults> Saves changes made so far as user defaults
Restore User Defaults> Restores user defaults to all setup options
UEFI Built-in EFI shell> Attempts to launch the built in EFI Shell
Launch EFI Shell from File System Device>
Attempts to launch EFI Shell application (Shell.efi) from one of the available file system devices
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6.3. The uEFI Shell
The Kontron uEFI BIOS features a built-in and enhanced version of the uEFI Shell. For a detailed description of the available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available standard shell commands, refer to the EFI Shell Command Manual. Both documents can be downloaded from the EFI and Framework Open Source Community homepage (http://sourceforge.net/projects/efi-shell/files/documents/).
AMI APTIO update utilities for DOS, EFI Shell and Windows are available at AMI.com: http://www.ami.com/support/downloads/amiflash.zip.
Kontron uEFI BIOS does not provide all shell commands described in the EFI Shell Command Manual.
6.3.1. Basic Operation of the uEFI Shell
The uEFI Shell forms an entry into the uEFI boot order and is the first boot option by default.
6.3.1.1. Entering the uEFI Shell
To enter the uEFI Shell, follow the steps below:
To enter the uEFI Shell, follow the steps below:
1. Power on the board.
2. Press the <F7> key (instead of <DEL>) to display a choice of boot devices.
3. Choose ‘UEFI: Built-in EFI shell’.
EFI Shell version 2.40 [5.11]
Current running mode 1.1.2 Device mapping table Fs0 :HardDisk - Alias hd33b0b0b fs0
Acpi(PNP0A03,0)/Pci(1D|7)/Usb(1, 0)/Usb(1, 0)/HD(Part1,Sig17731773)
Press the ESC key within 5 seconds to skip startup.nsh, and any other key to continue.
4. The output produced by the device-mapping table can vary depending on the board’s configuration.
5. If the ESC key is pressed before the 5 second timeout elapses, the shell prompt is shown:
Shell>
6.3.1.2. Exiting the uEFI Shell
To exit the uEFI Shell, follow one of the steps below:
1. Use the exit uEFI Shell command to select the boot device, in the Boot menu, that the OS will boot from.
2. Reset the board using the reset uEFI Shell command.
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6.4. uEFI Shell Scripting
6.4.1. Startup Scripting
If the ESC key is not pressed and the timeout has run out then the uEFI Shell tries to execute some startup scripts automatically. It searches for scripts and executes them in the following order:
1. Initially searches for Kontron flash-stored startup script.
2. If there is no Kontron flash-stored startup script present then the uEFI-specified startup.nsh script is used. This
script must be located on the root of any of the attached FAT formatted disk drive.
3. If none of the startup scripts are present or the startup script terminates then the default boot order is
continued.
6.4.2. Create a Startup Script
Startup scripts can be created using the uEFI Shell built-in editor edit or under any OS with a plain text editor of your choice. To create a startup shell script, simply save the script on the root of any FAT-formatted drive attached to the system. To copy the startup script to the flash, use the kBootScript uEFI Shell command.
In case there is no mass storage device attached, the startup script can be generated in a RAM disk and stored in the SPI boot flash using the kRamdisk uEFI Shell command.
6.4.3. Examples of Startup Scripts
6.4.3.1. Execute Shell Script on other Harddrive
This example (startup.nsh) executes the shell script named bootme.nsh located in the root of the first detected disc drive (fs0).
fs0: bootme.nsh
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6.5. Firmware Update
Firmware updates are typically delivered as a ZIP archive containing only the firmware images. The content of the archive with the directory structure must be copied onto a data storage device with FAT partition.
6.5.1. Updating Procedure
BIOS can be updated with the Intel tool fpt.efi using the procedure below:
1. Copy these files to an USB stick.
flash.nsh (if available) fpt.efi fparts.txt bkl6r<xxx>.bin (where xxx stands for the version #)
2. Start the system into setup (see Chapter 6.1 Starting the uEFI BIOS).
3. Check that the following entries are set to their default setting:
Advanced > PCH FW Configuration > Firmware update configuration > ME FW Image Re-Flash > Disabled Advanced > PCH FW Configuration > Firmware update configuration > Local FW Update > Enabled Then, change the setup option: Chipset > PCH-IO Configuration > BIOS Security Configuration > BIOS Lock > Disabled
4. Save and Exit BIOS setup.
5. On the next start, boot into shell (see Chapter 6.3.1.1 Entering the uEFI Shell).
6. Change to the drive representing the USB stick.
fsx: (x = 0,1,2,etc. represents the USB stick)
Change to the directory where you copied the flash tool.
cd <your_directory>
7. Start flash.nsh (if available)
OR type
fpt –SAVEMAC –F bkl6r<xxx>.bin
8. Wait until flashing is successful and then power cycle the board.
Do not switch off the power during the flash process! Doing so leaves your module unrecoverable.
Changes under point 3 are only effective during the first boot after the changes were applied. If you fail to flash during the next boot then you might have to repeat steps 3.
Do not forget to apply –SAVEMAC. If SAVEMAC is not applied then your system will lose it’s system MAC address. If the MAC address is accidentally deleted, contact Kontron Support.
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Appendix A: List of Acronyms
Table 37: List of Acronyms
ACPI
Advanced Configuration Power Interface
API
Application Programming Interface
Basic Module
COM Express® 125 x 95 Module form factor
BIOS
Basic Input Output System
BMC
Base Management Controller
BSP
Board Support Package
BPP
Bit Per Pixel
CAN
Controller-area network
Carrier Board
Application specific circuit board that accepts a COM Express ® module
COM
Computer-on-Module
Compact Module
COM Express® 95x95 Module form factor
CNTG
Computer Network Transaction Group
DDC
Display Data Control
DDI
Digital Display Interface –
DIMM
Dual In-line Memory Module
Display Port
DisplayPort (digital display interface standard)
DMA
Direct Memory Access
DRAM
Dynamic Random Access Memory
DVI
Digital Visual Interface
EAPI
Embedded Application Programming Interface
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable Read-Only Memory
eDP
Embedded Display Port
EMC
Electromagnetic Compatibility (EMC)
ESD
Electro Sensitive Device
Extended Module
COM Express® 155mm x 110mm Module form factor.
FIFO
First In First Out
FRU
Field Replaceable Unit
Gb
Gigabit
GBE
Gigabit Ethernet
GPI
General Purpose Input
GPIO
General Purpose Input Output
GPO
General Purpose Output
GPU
Graphics Processing Unit
HBR2
High Bitrate 2
HDA
High Definition Audio (HD Audio)
HD/HDD
Hard Disk /Drive
HDMI
High Definition Multimedia Interface
HPM
PICMG Hardware Platform Management specification family
I2C
Inter integrated Circuit Communications
IOL
IPMI-Over-LAN
IOT
Internet of Things
IPMI
Intelligent Platform Management Interface
KCS
Keyboard Controller Style
KVM
Keyboard Video Mouse
LAN
Local Area Network
LPC
Low Pin-Count Interface:
LVDS
Low Voltage Differential Signaling –
M.A.R.S.
Mobile Application for Rechargeable Systems
MDI
Media Dependent Interface
MEI
Management Engine Interface
Mini Module
COM Express® 84x55mm Module form factor
MTBF
Mean Time Before Failure
NA
Not Available
NC
Not Connected
NCSI
Network Communications Services Interface
PATA
Parallel AT Attachment
PCI
Peripheral Component Interface
PCIe
PCI-Express
PCN
Product Change Notification
PECI
Platform Environment Control Interface
PEG
PCI Express Graphics
PICMG®
PCI Industrial Computer Manufacturers Group
PHY
Ethernet controller physical layer device
Pin-out Type
COM Express® definitions for signals on COM Express® Module connector pins.
PS2
Personal System 2 ( keyboard & mouse)
PSU
Power Supply Unit
RoHS
Restriction of Hazardous Substances
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RTC
Real Time Clock
SAS
Serial Attached SCSI – high speed serial version of SCSI
SATA
Serial AT Attachment:
SCSI
Small Computer System Interface
SEL
System Event Log
ShMC
Shelf Management Controller
SMBus
System Management Bus
SO-DIMM
Small Outline Dual in-line Memory Module
SOIC
Small Outline Integrated Circuit
SOL
Serial Over LAN
SPI
Serial Peripheral Interface
SSH
Secure Shell
TPM
Trusted Platform Module
UART
Universal Asynchronous Receiver Transmitter
UEFI
Unified Extensible Firmware Interface
UHD
Ultra High Definition
ULP
Ultra Low Power
USB
Universal Serial Bus
VGA
Video Graphics Adapter
VLP
Very Low Profile
WDT
Watch Dog Timer
WEEE
Waste Electrical and Electronic Equipment ( directive)
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About Kontron
Kontron is a global leader in embedded computing technology (ECT). As a part of technology group S&T, Kontron offers a combined portfolio of secure hardware, middleware and services for Internet of Things (IoT) and Industry 4.0 applications. With its standard products and tailor-made solutions based on highly reliable state-of-the-art embedded technologies, Kontron provides secure and innovative applications for a variety of industries. As a result, customers benefit from accelerated time-to-market, reduced total cost of ownership, product longevity and the best fully integrated applications overall.
For more information, please visit:
www.kontron.com
CORPORATE OFFICE
GLOBAL HEADQUARTERS
Kontron S&T AG Lise
-Meitner-Str. 3-5
86156 Augsburg Germany Tel.: +
 49 821 4086-0
Fax: + 
49 821 4086-111
info@kontron.com
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