Kontron COMe-bIP2 User Manual

COMe-bIP2

Document Revision 140

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................8

2.4 COM Express® Documentation......................................................................................................... 9

2.5 COM Express® Benefits.................................................................................................................. 9

3 Product Specification..........................................................................10

3.1 Module definition....................................................................................................................... 10

3.2 Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 18

3.4 Accessories............................................................................................................................... 19

3.5 Electrical Specification................................................................................................................ 20

3.5.1 Supply Voltage........................................................................................................................... 20

3.5.2 Power Supply Rise Time................................................................................................................ 20

3.5.3 Supply Voltage Ripple.................................................................................................................. 20

3.5.4 Power Consumption..................................................................................................................... 20

3.5.5 ATX Mode.................................................................................................................................. 21

3.5.6 Single Supply Mode..................................................................................................................... 21

3.6 Power Control............................................................................................................................ 22

3.7 Environmental Specification......................................................................................................... 23

3.7.1 Temperature Specification............................................................................................................ 23

3.7.2 Humidity................................................................................................................................... 23

3.8 Standards and Certifications.........................................................................................................24

3.9 MTBF........................................................................................................................................ 26

3.10 Mechanical Specification.............................................................................................................. 27

3.11 Module Dimensions..................................................................................................................... 28

3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................29

3.13 Onboard Fan Connector................................................................................................................ 30

4 Features and Interfaces.......................................................................31

4.1 S5 Eco Mode.............................................................................................................................. 31

4.2 LPC.......................................................................................................................................... 32

4.3 Serial Peripheral Interface (SPI)....................................................................................................33

www.kontron.com

COMe-bIP2 /

4.4 SPI boot.................................................................................................................................... 33

4.5 M.A.R.S.................................................................................................................................... 35

4.6 Fast I2C.................................................................................................................................... 36

4.7 GPIO - General Purpose Input and Output.........................................................................................37

4.8 Dual Staged Watchdog Timer......................................................................................................... 38

4.9 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 39

4.10 Speedstep Technology.................................................................................................................. 41

4.11 C-States.................................................................................................................................... 42

4.12 Hyper Threading......................................................................................................................... 43

4.13 Dynamic FSB Frequency Switching.................................................................................................. 44

4.14 VID-x....................................................................................................................................... 45

4.15 Intel® Turbo Boost Technology and AVX...........................................................................................46

4.16 Shared Graphics Interfaces........................................................................................................... 47

4.17 Display Configuration.................................................................................................................. 49

4.18 Hybrid Graphics / Multi-monitor.................................................................................................... 53

4.19 Intel® vPro™ technology.............................................................................................................. 54

4.20 ACPI Suspend Modes and Resume Events..........................................................................................55

5 System Resources...............................................................................56

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 56

5.2 Memory Area.............................................................................................................................. 57

5.3 I/O Address Map......................................................................................................................... 57

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 58

5.5 I2C Bus..................................................................................................................................... 58

5.6 JILI I2C Bus............................................................................................................................... 58

5.7 SDVO I2C Bus............................................................................................................................. 58

5.8 System Management (SM) Bus....................................................................................................... 59

6 Connectors........................................................................................60

6.1 Connector Location..................................................................................................................... 60

7 Pinout List.........................................................................................61

7.1 General Signal Description............................................................................................................ 61

7.2 Connector X1A Row A................................................................................................................... 62

7.3 Connector X1A Row B................................................................................................................... 64

7.4 Connector X1B Row C................................................................................................................... 66

7.5 Connector X1B Row D................................................................................................................... 68

8 BIOS Operation...................................................................................70

8.1 Determining the BIOS Version....................................................................................................... 70

8.2 BIOS Update.............................................................................................................................. 70

8.3 Setup Guide............................................................................................................................... 72

8.4 POST Codes................................................................................................................................ 72

8.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 72

COMe-bIP2 /

8.5 BIOS Setup................................................................................................................................ 74

8.5.1 Main......................................................................................................................................... 74

8.5.2 Advanced.................................................................................................................................. 76

8.5.3 Chipset................................................................................................................................... 107

8.5.4 Boot....................................................................................................................................... 124

8.5.5 Security.................................................................................................................................. 126

8.5.6 Save & Exit............................................................................................................................... 128

COMe-bIP2 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-bIP2 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

COMe-bIP2 / Introduction

2 Introduction

2.1 Product Description

Kontron's Computer-on-Module for COM Express® basic with 3rd Generation of Intel® Core(TM) Series. With support for Pin-out Type 2 and Type 6, Kontron's module covers both the need for latest interface technology and the need to extend life-time for existing baseboard designs.

The 3rd Intel® Core Generation increases efficiency and performance per watt ratio which is a result of the innovative 22nm 3-D Tri-Gate.

With USB 3.0, SATA 6Gb/s and PCI Express Gen 3, COMe-bIP6 offers incredible data transfer. Additionally, note the outstanding visual computing performance with up to 3 independent displays and support for DirectX® 11 and OCL 1.1.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

COMe-bIP2 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-bIP2. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can differentiate products at various price/performance points, or when designing future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

COMe-bIP2 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® basic sized Computer-on-Module COMe-bIP2 (CCR2) follows pin-out Type 2 and is compatible to PICMG specification COM.0 Rev 2.0. The COMe-bIP2 based on latest Chief River platform is available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor PCH Memory Graphics PEG TPM

38020-0000-23-4 COMe-bIP2 i7-3615QE Intel® Core™ i7-3615QE QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-21-4 COMe-bIP2 i7-3612QE Intel® Core™ i7-3612QE QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-25-2 COMe-bIP2 i7-3555LE Intel® Core™ i7-3555LE QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-17-2 COMe-bIP2 i7-3517UE Intel® Core™ i7-3517UE QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-27-2 COMe-bIP2 i5-3610ME Intel® Core™ i5-3610ME QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-24-2 COMe-bIP2 i3-3120ME Intel® Core™ i3-3120ME QM77 2xDDR3-1600 HD4000 YES Inf ineon SLB9635TT

38020-0000-16-2 COMe-bIP2 i3-3217UE Intel® Core™ i3-3217UE QM77 2xDDR3-1600 HD4000 YES Infineon SLB9635TT

38020-0000-22-1 COMe-bIP2 1020E Intel® Celeron® 1020E HM76 2xDDR3-1600 HD YES Infineon SLB9635TT

38020-0000-14-1 COMe-bIP2 1047UE Intel® Celeron® 1047UE HM76 2xDDR3-1600 HD YES Infineon SLB9635TT

38020-0000-15-0 COMe-bIP2 927UE Intel® Celeron® 927UE HM76 2xDDR3-1600 HD YES Infineon SLB9635TT

Extended temperature grade modules (E1, -25°C to 75°C operating)

Product Number Product Name Processor PCH Memory Graphics TPM

38020-0000-21-4EXT COMe-bIP2 i7-3612QE E1 Intel® Core™ i7-3612QE QM77 2xDDR3-1600 HD4000 -

38020-0000-25-2EXT COMe-bIP2 i7-3555LE E1 Intel® Core™ i7-3555LE QM77 2xDDR3-1600 HD4000 -

The COMe-bIP2 is available for extended temperature range. General capability was tested for following options:

» CPU: all

» Memory: E2 memory only 97015-xxxx-16-2

» TPM: Atmel AT97SC3204-U2A1A-10 optional

» VCC: 12V only, no support for Wide-Range Input

Industrial temperature grade modules (XT, -40°C to 85°C operating)

Modules for E2 temperature range are available project based only, please contact your local sales or support for further details.

Product Number Product Name Processor PCH TPM

38020-0000-CC-X COMe-bIP2 All QM77 or HM76 Atmel AT97SC3204

The COMe-bIP2 is available for industrial temperature range by screening. General capability was tested for following options:

» CPU: all

» Memory: E2 memory only 97015-xxxx-16-2

» TPM: Atmel AT97SC3204-U2A1A-10 optional

» VCC: 12V only, no support for Wide-Range Input

COMe-bIP2 / Product Specification

3.2 Functional Specification

Processor

The 22nm Intel® 3rd Gen Core™ i7/i5/i3/Celeron® embedded (Ivy Bridge) CPU family with 31x24mm package size (FCBGA1023 socket) supports:

» Intel® Turbo Boost Technology 2.0

» Intel® 64

» Intel® Virtualization Technology (VT-x)

» Intel® Virtualization Technology for Directed I/O (VT-d)

» AES New Instructions (AES-NI)

» Intel® Hyper-Threading Technology

» Enhanced Intel SpeedStep® Technology

» Idle States (C-States)

» Intel® Smart Cache

» Thermal Monitoring Technologies

» Intel® Fast Memory Access

» Intel® Flex Memory Access

» Integrated Intel® HD Graphics with Dynamic Frequency

» Configurable Thermal Design Power (cTDP)

Optional available (with customized BIOS):

» Intel® vPRO™ Technology including:

» Intel® Active Management Technology (AMT)

» Intel® Trusted Execution Technology (TXT)

COMe-bIP2 / Product Specification

The integrated Intel® HD Graphics 4000 supports:

» GraphicsTechnology GT1 with 6 Execution Units

» GraphicsTechnology GT2 with 16 Execution Units

» Intel® Quick Sync Video

» Intel® InTru™ 3D Technology

» Intel® Wireless Display

» Intel® Flexible Display Interface (Intel® FDI)

» Intel® Clear Video HD Technology

» 3 simultaneous/independent displays in Windows 7 & Linux

» Hybrid Multi Monitor

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback

The integrated Intel® HD2500 Graphics supports:

» GraphicsTechnology GT1 with 6 Execution Units

» Dual Display

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback

COMe-bIP2 / Product Specification

Intel® Core™ Core™ Core™ Core™ Core™ Core™ Core™ Celeron® Celeron® Celeron®

- i7-3615QE i7-3612QE i7-3555LE i7-3517UE i5-3610ME i3-3120ME i3-3217UE 1020E 1047UE 927UE

# of Cores 4 4 2 2 2 2 2 2 2 1

# of Threads 8 8 4 4 4 4 4 2 2 1

TDP Core frequency (HFM)

2300MHz 2100MHz 2500MHz 1700MHz 2700MHz 2400MHz 1600MHz 2200MHz 1400MHz 1500MHz

Max Turbo Frequency 3300MHz 3100MHz 3200MHz 2800MHz 3300MHz - - - - -

LFM/LPM Frequency 1200MHz 1200MHz 800MHz 800MHz 800MHz 800MHz 800MHz 1200MHz 800MHz 800MHz

Bus/Core Ratio 12-23 12-21 8-25 8-17 8-27 8-24 8-16 12-22 8-14 8-15

Nominal TDP 45W 35W 25W 17W 35W 35W 17W 35W 17W 17W

Power Limit 2 (PL2 max)

60W 44W 44W 24W 44W - - - - -

cTDP-Down - - - 14W (800MHz) - - 14W (800MHz) - - -

cTDP-Up - - - 25W (2.2GHz) - - 17W (1.6GHz) - - -

Lithography 22nm 22nm 22nm 22nm 22nm 22nm 22nm 22nm 22nm 22nm

C-States C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C6 C0-C3 C0-C3 C0-C3

Smart Cache 6MB 6MB 4MB 4MB 3MB 3MB 3MB 2MB 2MB 1MB

Min Memory Type DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066 DDR3-1066

Max Memory Type DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600

Max Memory Size 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB 16GB

# of Memory Channels 2 2 2 2 2 2 2 2 2 2

Graphics Model HD4000 HD4000 HD4000 HD4000 HD4000 HD4000 HD4000 HD HD HD

GFX Base Frequency 650MHz 650MHz 550MHz 350MHz 650MHz 650MHz 350MHz 650MHz 350MHz 350MHz

GFX Max Dynamic Frequ.

1000MHz 1000MHz 1000MHz 1000MHz 1100MHz 900MHz 900MHz 1000MHz 900MHz 900MHz

GFX Technology GT2 16EU GT2 16EU GT2 16EU GT2 16EU GT2 16EU GT2 16EU GT2 16EU GT1 6EU GT1 6EU GT1 6EU

Quick Sync Video Yes Yes Yes Yes Yes Yes Yes - - -

InTru™ 3D Yes Yes Yes Yes Yes Yes Yes - - -

Wireless Display Yes Yes Yes Yes Yes Yes Yes - - -

Clear Video HD Yes Yes Yes Yes Yes Yes Yes - - -

vPRO™ (optional) Yes Yes Yes Yes Yes - - - - -

TXT (optional) Yes Yes Yes Yes Yes - - - - -

AES-NI Yes Yes Yes Yes Yes - - - - -

VT-x Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

VT-d Yes Yes Yes Yes Yes - - - - -

PCI Express Graphics Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 2.0 Gen 2.0 Gen 2.0 Gen 2.0 Gen 2.0

- The Driver Default PL2 is 1.25 x cTDP

- Due to onboard PCIe switches to share PEG and DDI the PEG interface on COM Express® only allows up to Gen 2.0 speed even if the CPU supports Gen 3.0

COMe-bIP2 / Product Specification

Memory

Sockets

2x DDR3 SO-DIMM

Memory Type

DDR3-1333/1600

Maximum Size

2x8GB

Technology

Dual Channel

Chipset

The 65nm Intel® 7-Series Platform Controller Hub Panther Point supports:

» PCI Express Revision 2.0

» PCI Express Configurations x1, x2, x4

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Trusted Execution Technology (TXT)

» Intel® vPro Technology (optional)

» Intel® Active Management Technology 8.0 (optional)

» Intel® Anti-Theft Technology

» Intel® Rapid Storage Technology

» Intel® Smart Response Technology

PCH comparison

Feature QM77 HM76

TDP 4.1W 4.1W

Rapid Storage YES YES

USB 3.0 YES YES

Wireless Display YES YES

3 Displays YES YES

VT-d YES NO

vPRO YES NO

AMT 8.0 YES NO

TXT YES NO

SATA RAID YES NO

The Intel® vPro Technology including Trusted Execution Technology (TXT) and Active Management Technology (AMT) is not supported by default on COMe-bIP2. Please contact your local sales or support for custom BIOS variants supporting vPro.

COMe-bIP2 / Product Specification

Graphics Core

The integrated Intel® GMA HD4000 (Gen7) supports:

Graphics Core Render Clock

GT1 /GT2; Base clock: 350/650 MHz; GT Turbo: up to 1000 MHz

Execution Units / Pixel Pipelines

GT2: 16EU / GT1: 6EU

Max Graphics Memory

1720MB

GFX Memory Bandwidth (GB/s)

17.1

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11 / 3.0 + OCL1.1

Shader Model

5.0

Hardware accelerated Video

MPEG2, VC-1, AVC, Blu-ray (+3D)

Independent/Simultaneous Displays

Display Port

DP 1.1a / eDP

HDCP support

HDCP 1.4

Monitor output

CRT max Resolution

2048x1536

TV out:

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

1x PEG 2.0

Digital Display Interface DDI1

DP++/SDVOB

Digital Display Interface DDI2

DP++

Digital Display Interface DDI3

DP++/eDP

Maximum Resolution on DDI

2560x1600

PEG Configuration

The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers. The COMe-bIP2 supports following PEG Port configuration when used as PCI Express Interface:

» 1×16

» 1×8

» 1×4

» 1×2

» 1×1

The internal PCI Express controller can be re-configured to support up to 3 PCIe ports. The following port configurations are available via hardware strap options (customized article):

» 2×8 (lanes #0-7 + #8-15)

» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)

COMe-bIP2 / Product Specification

Storage

onboard SSD

SD Card support

IDE Interface

JMB368 PCIe2PATA

Serial-ATA

2x SATA 6Gb/s, 2x SATA 3Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier

SATA RAID

0, 1, 5, 10, MATRIX (QM77 only)

If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer rate and Staggered Spin-Up. To configure a RAID enable RAID support in BIOS Chipset/SATA settings, connect at least two hard drives and enter the RAID Option ROM by pressing 'CTRL'+'I'

Connectivity

USB 2.0

8x USB 2.0

USB 3.0

USB Client

PCI

PEX8112 PCIe2PCI

PCI External Masters

PCI Express

5x PCIe x1 Gen2

Max PCI Express

6x PCIe without PCIe2PATA Bridge

PCI Express x2/x4 configuration

YES (Softstrap option)

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® 82579LM (Lewisville)

Due to internal chipset configuration the Panther Point only supports up to 4 USB Hubs

PCI Express Configuration

The COMe-bIP2 only supports x1 PCIexpress lane configuration by default. Following x2/x4 configurations are possible via Management Engine Softstrap Options:

PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5* Port #6* Port #7*

Configuration0 x1 x1 x1 x1 x1 x1 x1 x1

Configuration1 x2 x1 x1 x1 x1 x1 x1

Configuration2 x2 x2 x1 x1 x1 x1

Configuration3 x2 x2 x2 x1 x1

Configuration4 x2 x2 x2 x2

Configuration5 x4 x1 x1 x1 x1

Configuration6 x4 x2 x1 x1

Configuration7 x4 x2 x2

Configuration8 x4 x4

- *PCIe Ports #5 to #7 are only available without PCIe2PATA Bridge, PCIe2PCI Bridge and without Ethernet Controller

- Configuration0 (default) and Configuration5 (modified FlashDescriptor) are provided in BIOS download package available on EMD Customer Section

COMe-bIP2 / Product Specification

Ethernet

The Intel® 82579LM (Lewisville) ethernet supports:

» Jumbo Frames

» MACsec IEEE 802.1 AE

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Misc Interfaces and Features

Supported BIOS Size/Type

8MB SPI

Audio

HD Audio + DisplayPort dual stream

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Infineon TPM 1.2 SLB9635TT

Miscellaneous

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

M.A.R.S. support

YES

Embedded API

KEAPI1 / KEAPI2

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 20V

ACPI

ACPI 4.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

cTDP @ 17W i3/i7

Power Consumption and Performance

Full Load Power Consumption

10 - 58W

Kontron Performance Index

18289 - 76117

Kontron Performance/Watt

1319 - 2740

*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0

Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

COMe-bIP2 / Product Specification

3.3 Block Diagram

GPIO Ctrl Mgmt

PCIe #5

PCI

PATA

USB 2.0 (Port #0-3)

PCIe #0 - #4

SATA #2/3 (3Gb/s)

SATA #0/1 (6Gb/s)

VGA

LVDS

PWM FAN Control

PCIe #6

3xDDI

PEG

PwrCtrl / SysMgmt / RTC

DDR3-1333 DDR3-1600

DMI FDI

Intel® 3rd Generation Core

HDAudio

Fast I2C

USB 2.0 (Port #4-7)

PCIe #7

GB LAN

Embedded

Controller

EEPROM

4xGPI / 4xGPO

FAN

Connector

SPI

SMB

DDR3

SODIMM

DDR3

SODIMM

GB PHY

Intel®

Lewisville 82579 LM

Watchdog

HWM

NCT7802Y

PECI

HWM

LPC

TPM

Infineon

SLB9635TT

Connector AB – pin-out T2

BIOS

SPI Flash

Intel® 7-Series PCH

QM77/HM76

Ethernet

MAC

SPD

SMB

CPLD JTAG

GMA HD Gen7

EHCI2

SMB

Connector CD – pin-out T2

EHCI1

XDP Debu g

Connector

Option

Standard

component

S5eco

LPC2I2C

GPIO B uffer

Power seq uencing

Clock

Gen

VBAT 5VSB VCC

VCC

DDI1

DDI2

DDI3

PEG

SDVO/DP/HDM I/DVI

DP/HDMI/DVI

eDP/DP/HDMI/DVI

PEG

PCIe

signal

switch

PCIe2PCI

PEX8112

PCIe2PATA

JMB368

COMe-bIP2 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

38013-0000-99-0 HSP COMe-bSC/IP thread For CPUs up to 25W TDP and commercial temperature grade usage

38013-0000-99-1 HSP COMe-bSC/IP through For CPUs up to 25W TDP and commercial temperature grade usage

38013-0000-99-2 HSP COMe-bSC/IP heatpipe thread For all CPUs and temperature grades

38013-0000-99-3 HSP COMe-bSC/IP heatpipe through For all CPUs and temperature grades

38013-0000-99-0C05 HSK COMe-bSC/IP active setscrew thread For all CPUs and commercial temperature grade usage

38013-0000-99-1C05 HSK COMe-bSC/IP active setscrew through hole For all CPUs and commercial temperature grade usage

38013-0000-99-0C06 HSK COMe-bSC/IP passive setscrew thread For all CPUs and commercial temperature grade usage

38013-0000-99-1C06 HSK COMe-bSC/IP passive setscrew through hole For all CPUs and commercial temperature grade usage

General accessories

Part Number COMe pin-out Type 2 compatible accessories Project Code Comment

38102-0000-00-1 COM Express® Reference Carrier Type 2 ADAE mITX Carr ier with 8mm COMe connector

38104-0000-00-0 COM Express® Eval Carrier Type 2 Niles Canyon ATX Carrier with 5mm COMe connector (EOL)

38104-0000-00-1 COM Express® Eval Carrier Type 2 Topanga Canyon ATX Carrier with 5mm COMe connector

96006-0000-00-7 ADA-Type2-DP3 DVOD (sandwich) Adapter Card for 3x DisplayPort

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

36100-0000-00-S COMe Ref. Starterkit T2 ADAE Starterkit with COMe Reference Carrier T2

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smar t Battery Kit Starterkit Kontron Mobile Application platform for Rechargeable Systems

Part Number DDR3 SODIMM, commercial temperature grade

97015-1024-16-0 DDR3-1600 SODIMM 1GB

97015-2048-16-0 DDR3-1600 SODIMM 2GB

97015-4096-16-0 DDR3-1600 SODIMM 4GB

97015-8192-16-0 DDR3-1600 SODIMM 8GB

Part Number DDR3 SODIMM, industrial temperature grade

97015-1024-16-2 DDR3-1600 SODIMM 1GB E2

97015-2048-16-2 DDR3-1600 SODIMM 2GB E2

97015-4096-16-2 DDR3-1600 SODIMM 4GB E2

97015-8192-16-2 DDR3-1600 SODIMM 8GB E2

COMe-bIP2 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-bIP2 variants is 10 - 58W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

COMe-bIP2 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 20V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

COMe-bIP2 / Product Specification

3.6 Power Control

Power Supply

The COMe-bIP2 supports a power input from 8.5V - 20V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-bIP2 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.

COMe-bIP2 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the COMe-bIP2

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 8.5V - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 8.5V - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

COMe-bIP2 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-bIP2 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

COMe-bIP2 / Product Specification

Shock & Vibration

The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-bIP2 follows the requirements for electromagnetic

compatibility standards

» EN55022

COMe-bIP2 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 205482 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

COMe-bIP2 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 125.0 mm

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from module PCB bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for basic sized Computer-on-Modules are 27mm in height from module bottom to Heatsink top.

Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of

27.3mm from module bottom to Heatsink top.

COMe-bIP2 / Product Specification

3.11 Module Dimensions

COMe-bIP2 / Product Specification

3.12 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bIP2. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the COMe-bIP2. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive cooling solutions provided from Kontron Europe GmbH for the COMe-bIP2 are usually designed to cover the power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-bIP2 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

COMe-bIP2 / Product Specification

3.13 Onboard Fan Connector

Location of the FAN Connector

Specification of the FAN Connector:

» Part number (Molex) J8: 53261-0371, Mates with: 51021-0300, Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 8.5 - 13V >13V

FAN Output Voltage

8.5 - 13V 13V

Max. FAN Output Current

350mA 150mA

To connect a standard FAN with 3pin connector to the module please use adaptor cable KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

Please check the FAN specifications when using the onboard FAN connector at input voltages above 13V according the output current limitation

+ 98 hidden pages

Kontron COMe-bIP2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 Naming clarification

2.3 Understanding COM Express® Functionality

2.4 COM Express® Documentation

2.5 COM Express® Benefits

3 Product Specification

3.1 Module definition

3.2 Functional Specification

Processor

Memory

Chipset

PCH comparison

Graphics Core

Monitor output

LVDS

Display Interfaces

PEG Configuration

Storage

Connectivity

PCI Express Configuration

Ethernet

Misc Interfaces and Features

Kontron Features

Additional features

Power Features

Power Consumption and Performance

3.3 Block Diagram

3.4 Accessories

3.5 Electrical Specification

3.5.1 Supply Voltage

3.5.2 Power Supply Rise Time

3.5.3 Supply Voltage Ripple

3.5.4 Power Consumption

3.5.5 ATX Mode

3.5.6 Single Supply Mode

3.6 Power Control

Power Supply

Power Button (PWRBTN#)

Power Good (PWR_OK)

Reset Button (SYS_RESET#)

SM-Bus Alert (SMB_ALERT#)

3.7 Environmental Specification

3.7.1 Temperature Specification

3.7.2 Humidity

3.8 Standards and Certifications

RoHS II

Component Recognition UL 60950-1

WEEE Directive

Conformal Coating

Shock & Vibration

3.9 MTBF

3.10 Mechanical Specification

Dimension

Height

3.11 Module Dimensions

3.12 Thermal Management, Heatspreader and Cooling Solutions

3.13 Onboard Fan Connector