Kontron COMe-bHL6 User Manual

COMe-bHL6

Document Revision 111

www.kontron.com

» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Description...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Express® Functionality.......................................................................................9

2.4 COM Express® Documentation....................................................................................................... 10

2.5 COM Express® Benefits................................................................................................................ 10

3 Product Specification...........................................................................11

3.1 Module definition....................................................................................................................... 11

3.2 Functional Specification............................................................................................................... 12

3.3 Block Diagram............................................................................................................................ 21

3.4 Accessories............................................................................................................................... 22

3.5 Electrical Specification................................................................................................................ 23

3.5.1 Supply Voltage........................................................................................................................... 23

3.5.2 Power Supply Rise Time................................................................................................................ 23

3.5.3 Supply Voltage Ripple.................................................................................................................. 23

3.5.4 Power Consumption..................................................................................................................... 23

3.5.5 ATX Mode.................................................................................................................................. 24

3.5.6 Single Supply Mode..................................................................................................................... 24

3.6 Power Control............................................................................................................................ 25

3.7 Environmental Specification......................................................................................................... 26

3.7.1 Temperature Specification............................................................................................................ 26

3.7.2 Humidity................................................................................................................................... 26

3.8 Standards and Certifications.........................................................................................................27

3.9 MTBF........................................................................................................................................ 29

3.10 Mechanical Specification.............................................................................................................. 30

3.11 Module Dimensions..................................................................................................................... 31

3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................32

3.13 Onboard Connectors....................................................................................................................33

3.13.1 FAN Connector J6 - PCB bottom......................................................................................................33

3.13.2 CPU JTAG connector J3 - PCB bottom............................................................................................... 34

3.13.3 CPLD Debug connector J7 - PCB top................................................................................................. 34

4 Features and Interfaces.......................................................................35

4.1 S5 Eco Mode.............................................................................................................................. 35

www.kontron.com

COMe-bHL6 /

4.2 Rapid Shutdown......................................................................................................................... 36

4.3 LPC.......................................................................................................................................... 38

4.4 Serial Peripheral Interface (SPI)....................................................................................................39

4.5 SPI boot.................................................................................................................................... 39

4.6 M.A.R.S..................................................................................................................................... 41

4.7 UART........................................................................................................................................ 42

4.8 Fast I2C.................................................................................................................................... 43

4.9 Dual Staged Watchdog Timer......................................................................................................... 44

4.10 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 45

4.11 Speedstep Technology.................................................................................................................. 47

4.12 C-States.................................................................................................................................... 48

4.13 Hyper Threading......................................................................................................................... 49

4.14 Dynamic FSB Frequency Switching.................................................................................................. 50

4.15 VID-x........................................................................................................................................ 51

4.16 Intel® Turbo Boost Technology and AVX...........................................................................................52

4.17 Display Configuration.................................................................................................................. 53

4.18 Hybrid Graphics / Multi-monitor.................................................................................................... 56

4.19 Intel® Wireless Display................................................................................................................ 57

4.20 Intel® vPro™ technology.............................................................................................................. 59

4.21 ACPI Suspend Modes and Resume Events..........................................................................................60

5 System Resources................................................................................61

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 61

5.2 Memory Area............................................................................................................................. 62

5.3 I/O Address Map......................................................................................................................... 62

5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 63

5.5 Internal I2C Bus......................................................................................................................... 63

5.6 External I2C Bus......................................................................................................................... 63

5.7 System Management (SM) Bus....................................................................................................... 64

6 Connectors........................................................................................65

6.1 Connector Location..................................................................................................................... 65

7 Pinout List.........................................................................................66

7.1 General Signal Description............................................................................................................ 66

7.2 Connector X1A Row A................................................................................................................... 67

7.3 Connector X1A Row B................................................................................................................... 69

7.4 Connector X1B Row C................................................................................................................... 71

7.5 Connector X1B Row D................................................................................................................... 73

8 BIOS Operation...................................................................................75

8.1 Determining the BIOS Version........................................................................................................75

8.2 BIOS Update.............................................................................................................................. 75

8.3 POST Codes................................................................................................................................ 75

4

COMe-bHL6 / User Information

8.4 Setup Guide............................................................................................................................... 75

8.5 BIOS Setup................................................................................................................................ 76

8.5.1 Main........................................................................................................................................ 76

8.5.2 Advanced.................................................................................................................................. 83

8.5.3 Security.................................................................................................................................. 125

8.5.4 Boot....................................................................................................................................... 127

8.5.5 Exit........................................................................................................................................ 128

5

COMe-bHL6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

6

COMe-bHL6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7

COMe-bHL6 / Introduction

2 Introduction

2.1 Product Description

The brand new application-ready COMe-bHL6 offers increased performance density and up to twice the graphics
performance compared to its predecessors. Up to three independent, daisy-chained displays with up to 4K resolution are
supported to create stunning user experiences. Further to this, DirectX® 11.1 and OpenGL 4.0 support paves the way for
compelling visuals when videos, graphics and interactive content are being displayed. By integrating the new Intel® AVX2
and OpenCL 1.2, Kontron’s new Computer-on-Modules additionally not only provide an increase in floating-point
performance they also possess improved parallel processing capacities. Typical application areas can be found in markets
such as digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as
industrial plant and machine line control on shop floor- and control room-level.

Engineers can immediately commence with evaluating these new benchmark Computer-on-Modules on all Kontron COM
Express® pin-out type 6-compliant starter kits.

The Kontron COM Express® pin-out type 6 COMe-bHL6 module is available in several different variants ranging from the
cost-optimized low-power processor versions up to quad-core Intel® Core™ i7 processors with up to 4x 2.4 GHz. The
modules are designed with the Intel® Mobile QM87 chipset, host up to 16 GB DDR3L RAM and support 7 PCI Express x1
lanes and 1 PEG x16 interface which is also compatible to standard PCI Express devices. Less complex peripherals can be
connected via SPI and LPC. Additional dedicated features include 3x SATA 6Gb/s ports, 1 SATA 3Gb/s port, as well as
Gigabit Ethernet, 4 USB 3.0 ports, 4 USB 2.0 and 2 serial ports. The Kontron COMe-bHL6 features comprehensive display
support with 3x dual mode DisplayPort++ which can also output, HDMI, DVI and DisplayPort 1.2. Industrial applications
benefit from the watchdog and real-time clock. The module supports an 8.5-20V wide-range power supply. The support of
smart batteries via MARS and the standardized embedded application programming interface EAPI round off the feature
set and provide engineers with a comprehensive service package that eases system development as well as system
programming.

For customers wanting to instantly leverage the new graphics and computing power in their existing designs based on
individual carrier boards, Kontron also offers standardized migration support services to accelerate the design-in phase
and thus achieve fastest field deployment.

The Kontron COM Express® basic Computer-on-Module COMe-bHL6 supports the full Windows OS portfolio along with
Linux and VxWorks.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.

8

COMe-bHL6 / Introduction

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio

1x 1x 1x 1x

Gbit Ethernet

1x 1x 1x 1x

Serial ATA

4x 4x 4x 4x

Parallel ATA

- - 1x -

PCI

- - 1x -

PCI Express x1

6x 6x 6x 8x

PCI Express x16 (PEG)

- - 1x 1x

USB Client

1x 1x - -

USB 2.0

8x 8x 8x 8x

USB 3.0

- 2x - 4x

VGA

1x - 1x 1x

LVDS

Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI)

1x optional 1x 3x shared with PEG 3x

LPC

1x 1x 1x 1x

External SMB

1x 1x 1x 1x

External I2C

1x 1x 1x 1x

GPIO

8x 8x 8x 8x

SDIO shared w/GPIO

1x optional 1x optional - 1x optional

UART (2-wire COM)

- 2x - 2x

FAN PWM out

- 1x - 1x

9

COMe-bHL6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bHL6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

10

COMe-bHL6 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® basic sized Computer-on-Module COMe-bHL6 (BHL6 / BBL6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-bHL6 based on latest Shark Bay Mobile platform is available in different
variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G

38025-0000-18-7 COMe-bHL6 i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1

38025-0000-16-7 COMe-bHL6 i7-4850EQ Intel® Core™ i7-4850EQ 47W QM87 4 3 1

38025-0000-24-7 COMe-bHL6 i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1

38025-0000-29-5 COMe-bHL6 i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1

38025-0000-27-5 COMe-bHL6 i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1

38025-0000-18-5 COMe-bHL6 i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1

38025-0000-16-5 COMe-bHL6 i5-4402E Intel® Core™ i5-4402E 25W QM87 4 3 1

38025-0000-26-3 COMe-bHL6 i3-4110E Intel® Core™ i3-4110E 37W HM86 2 2 2

38025-0000-24-3 COMe-bHL6 i3-4100E Intel® Core™ i3-4100E 37W HM86 2 2 2

38025-0000-18-3 COMe-bHL6 i3-4112E Intel® Core™ i3-4112E 25W HM86 2 2 2

38025-0000-16-3 COMe-bHL6 i3-4102E Intel® Core™ i3-4102E 25W HM86 2 2 2

38025-0000-22-1 COMe-bHL6 2000E Intel® Celeron 2000E 37W HM86 2 2 2

38025-0000-15-1 COMe-bHL6 2002E Intel® Celeron 2002E 25W HM86 2 2 2

Extended temperature grade modules (E1, -25°C to 75°C operating) and

Industrial temperature grade modules (XT, -40°C to 85°C operating)

The COMe-bHL6 is available for extended and industrial temperature range. General capability was tested for following
options:

» CPU: all

» Memory: E2 DDR3L memory only 97015-xxxx-16-3

» VCC: 12V only, no support for Wide-Range Input

The RXT product line includes modules with following featureset:

» industrial grade temperature range (-40 to +85°C) by screening

» ECC Memory support (97016-xxxx-16-3)

» Kontron Rapid Shutdown support

Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G

38026-0000-18-7 COMe-bHL6RXT i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1

38026-0000-24-7 COMe-bHL6RXT i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1

38026-0000-29-5 COMe-bHL6RXT i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1

38026-0000-27-5 COMe-bHL6RXT i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1

38026-0000-18-5 COMe-bHL6RXT i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1

Please contact your local sales for further information and MOQ for RXT modules

11

COMe-bHL6 / Product Specification

3.2 Functional Specification

Processor

The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell-H (Halo) / Crystal Well) CPU family with

37.5x32mm package size (BGA1364 socket) supports:

» Intel® Turbo Boost Technology 2.01

» Intel® 64

» Intel® Virtualization Technology (VT-x)

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Hyper-Threading Technology

» Enhanced Intel SpeedStep® Technology

» Idle States (C-States)

» Intel® Smart Cache

» Thermal Monitoring Technologies

» Intel® Fast Memory Access

» Intel® Flex Memory Access

» Integrated Intel® HD Graphics with Dynamic Frequency

Optional available (with customized BIOS, Evaluation Copy on request):

» Intel® vPRO™ Technology including:

» Intel® Active Management Technology (AMT)

» Intel® Trusted Execution Technology (TXT)

» Advanced Encryption Standard Instructions (AES-NI)

12

COMe-bHL6 / Product Specification

The integrated Intel® HD Graphics 5200/4600 supports:

» GraphicsTechnology GT3 with 40 Execution Units (HD5200)

» GraphicsTechnology GT2 with 20 Execution Units (HD4600)

» Intel® Quick Sync Video

» Intel® InTru™ 3D Technology

» Intel® Wireless Display

» Intel® Flexible Display Interface (Intel® FDI)

» Intel® Clear Video HD Technology

» Intel® Graphics Render C-State RC6

» Intel® Smart 2D Display Technology (S2DDT)

» 3 simultaneous displays (Win7/8 and Linux)

» Hybrid Multi Monitor with 2 internal and 2 external displays

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback (incl. PAVP)

The integrated Intel® HD Graphics supports:

» GraphicsTechnology GT1 with 10 Execution Units

» Dual Display

» Video Decode for AVC/H.264/VC-1/MPEG-2

» Video Encode for AVC/H.264/MPEG-2

» Blu-ray Playback (incl. PAVP)

13

COMe-bHL6 / Product Specification

CPU Features

Intel® Core™ Core™ Core™ Core™ Core™ Core™ Core™ Celeron@ Celeron@

- i7-4860EQ i7-4850EQ i7-4700EQ i5-4400E i5-4402E i3-4100E i3-4102E 2000E 2002E

# of Cores 4 4 4 2 2 2 2 2 2

# of Threads 8 8 8 4 4 4 4 2 2

TDP Core frequency (HFM)

1800MHz 1600MHz 2400MHz 2700MHz 1600MHz 2400MHz 1600MHz 2200MHz 1500MHz

Max Turbo Frequency 1 core 3200MHz 3200MHz 3400MHz 3300MHz 2700MHz - - - -

Max Turbo all cores 2600MHz 2600MHz 2800MHz 3200MHz 2600MHz - - - -

LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz

Bus/Core Ratio 8 - 20 8 - 16 8 - 24 8 - 27 8 - 16 8 - 24 8 - 16 8 - 22 8 - 15

TjMax 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C

Thermal Design Power
(TDP/PL1)

47W 47W 47W 37W 25W 37W 25W 37W 25W

cTDP-Down - - 37W - - - - - -

cTDP-Down Core frequency - -

1700MHz

- - - - - -

Power Limit 2 (PL2 max) 58.75W 58.75W 58.75/46.25W 46.25W 31.25W 46.25W 31.25W 46.25W 31.25W

C-States C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7

eDRAM 128MB

1.6GHz

128MB

1.6GHz

- - - - - - -

Smart Cache 6MB 6MB 6MB 3MB 3MB 3MB 3MB 2MB 2MB

Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600

Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB

# of Memory Channels 2 2 2 2 2 2 2 2 2

Graphics Model Iris Pro 5200 Iris Pro 5200 HD4600 HD4600 HD4600 HD4600 HD4600 HD HD

GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz

GFX Base Frequency 650MHz 750MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz

GFX Turbo Frequency 1000MHz 1000MHz 1000MHz 1000MHz 900MHz 900MHz 900MHz 900MHz 900MHz

GFX Technology GT3e 40EU GT3e 40EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT1 10EU GT1 10EU

GFX Func/Phys Cores 3/3 3/3 2/2 2/2 2/2 2/2 2/2 1/2 1/2

Quick Sync Video Yes Yes Yes Yes Yes Yes Yes - -

InTru™ 3D Yes Yes Yes Yes Yes Yes Yes - -

Wireless Display Yes Yes Yes Yes Yes Yes Yes - -

Clear Video HD Yes Yes Yes Yes Yes Yes Yes - -

vPRO™ (optional) Yes Yes Yes Yes Yes - - - -

TXT (optional) Yes Yes Yes Yes Yes - - - -

AES-NI (optional) Yes Yes Yes Yes Yes - - - -

VT-x Yes Yes Yes Yes Yes - - - -

VT-d Yes Yes Yes Yes Yes - - - -

PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 2.0 Gen 2.0

14

COMe-bHL6 / Product Specification

Intel® Core™ Core™ Core™ Core™

- i5-4410E i5-4422E i3-4110E i3-4112E

# of Cores 2 2 2 2

# of Threads 4 4 4 4

TDP Core frequency (HFM)

2900MHz 1800MHz 2600MHz 1800MHz

Max Turbo Frequency 1 core Note 1 2900MHz - -

Max Turbo all cores Note 1 2800MHz - -

LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz

Bus/Core Ratio 8 - 29 8 - 16 8 - 24 8 - 16

TjMax 100°C 100°C 100°C 100°C

Thermal Design Power
(TDP/PL1)

37W 25W 37W 25W

cTDP-Down - - - -

cTDP-Down Core frequency - - - -

Power Limit 2 (PL2 max) 46.25W 31.25W 46.25W 31.25W

C-States C0-C7 C0-C7 C0-C7 C0-C7

eDRAM - - - -

Smart Cache 3MB 3MB 3MB 3MB

Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600

Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB

# of Memory Channels 2 2 2 2

Graphics Model HD4600 HD4600 HD4600 HD4600

GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz

GFX Base Frequency 400MHz 400MHz 400MHz 400MHz

GFX Turbo Frequency 1000MHz 900MHz 900MHz 900MHz

GFX Technology GT2 20EU GT2 20EU GT2 20EU GT2 20EU

GFX Func/Phys Cores 2/2 2/2 2/2 2/2

Quick Sync Video Yes Yes Yes Yes

InTru™ 3D Yes Yes Yes Yes

Wireless Display Yes Yes Yes Yes

Clear Video HD Yes Yes Yes Yes

vPRO™ (optional) Yes Yes - -

TXT (optional) Yes Yes - -

AES-NI (optional) Yes Yes Yes Yes

VT-x Yes Yes Yes Yes

VT-d Yes Yes - -

PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0

15

COMe-bHL6 / Product Specification

Memory

Sockets

2x DDR3 SO-DIMM

Memory Type

DDR3L-1600 (ECC on RXT Ver.)

Maximum Size

2x8GB

Technology

Dual Channel

Chipset

The 32nm Intel® 8-Series Platform Controller Hub Lynx Point supports:

» PCI Express Revision 2.0

» PCI Express Configurations x1, x2, x4

» Intel® Virtualization Technology for Directed I/O (VT-d)

» Intel® Trusted Execution Technology (TXT)

» Intel® vPro Technology (optional)

» Intel® Active Management Technology 9.0 (optional)

» Intel® Anti-Theft Technology

» Intel® Rapid Storage Technology

» Intel® Smart Response Technology

PCH comparison

Feature QM87 HM86

TDP 2.7W 2.7W

USB 3.0 (USB 2.0 compatible) YES (4x on COMe) YES (2x on COMe)

USB 2.0 YES (4x on COMe) YES (6x on COMe)

SATA 6Gb/s (Gen3) YES (3x on COMe) YES (2x on COMe)

SATA 3Gb/s (Gen2) YES (1x on COMe) YES (2x on COMe)

Wireless Display YES YES

3 Displays simultaneously YES YES

Rapid Storage AHCI, RAID 0/1/5/10 AHCI only

VT-d YES NO

vPRO YES with custom BIOS NO

AMT YES with custom BIOS NO

TXT YES with custom BIOS NO

The Intel® vPro Technology including Trusted Execution Technology (TXT), Active
Management Technology (AMT) and Encryption AES-NI is not supported by default on
COMe-bHL6. Please contact your local sales or support for custom BIOS variants supporting
vPro.

16

COMe-bHL6 / Product Specification

HighSpeed I/O Port Configuration

- QM87 I/O HM86 I/O COMe-bHL6 with QM87 COMe-bHL6 with HM86

Port1

USB3 #1 USB3 #1 USB #0 = USB3.0 USB #0 = USB3.0

Port2

USB3 #2 USB3 #2 USB #1 = USB3.0 USB #1 = USB3.0

Port3

USB3 #5 - USB #2 = USB3.0 -

Port4

USB3 #6 - USB #3 = USB3.0 -

-

USB2 USB2 USB #4-7 = USB 2.0 USB #2-7 = USB 2.0

Port5

USB3 #3 or PCIe #1 USB3 #3 or PCIe #1 PCIe #0 PCIe #0

Port6

USB3 #4 or PCIe #2 USB3 #4 or PCIe #2 PCIe #1 PCIe #1

Port7

PCIe #3 PCIe #3 PCIe #2 PCIe #2

Port8

PCIe #4 PCIe #4 PCIe #3 PCIe #3

Port9

PCIe #5 PCIe #5 PCIe #4 PCIe #4

Port10

PCIe #6 PCIe #6 PCIe #5 PCIe #5

Port11

PCIe #7 PCIe #7 PCIe #6 PCIe #6

Port12

PCIe #8 PCIe #8 LAN/PCIe #7 LAN/PCIe #7

Port13

SATA3 #4 or PCIe #1 SATA3 #4 SATA #0 = SATA 6Gb/s SATA #0 = SATA 6Gb/s

Port14

SATA3 #5 or PCIe #2 SATA3 #5 SATA #1 = SATA 6Gb/s SATA #1 = SATA 6Gb/s

Port15

SATA3 #0 SATA2 #0 SATA #2 = SATA 6Gb/s SATA #2 = SATA 3Gb/s

Port16

SATA3 #1 - - -

Port17

SATA2 #2 SATA2 #2 SATA #3 = SATA 3Gb/s SATA #3 = SATA 3Gb/s

Port18

SATA2 #3 - - -

Graphics Core

The integrated Intel® HD/HD4600/HD5200 (Gen7.5) supports:

Graphics Core Render Clock

GT1/GT2/GT3; Base clock: 400/200 MHz; GT Turbo: up to 1000 MHz

Execution Units / Pixel Pipelines

GT3: 40EU / GT2: 20EU / GT1: 10EU

Max Graphics Memory

1720MB

GFX Memory Bandwidth (GB/s)

25.6

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11.1 / 4.0 + OCL 1.2

Shader Model

5.0

Hardware accelerated Video

MPEG2, VC-1, AVC, Blu-ray (+3D)

Independent/Simultaneous Displays

3

Display Port

DP 1.2 / eDP 1.3

HDCP support

HDCP 1.4a

Monitor output

CRT max Resolution

1920x1200

TV out:

-

LVDS

LVDS Bits/Pixel

1x18/24, 2x18/24 with DP2LVDS

LVDS Bits/Pixel with dithering

-

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

JILI2/JILI3/EDID/DID

Display Interfaces

Discrete Graphics

1x PEG 3.0/2.0

Digital Display Interface DDI1

DP++

Digital Display Interface DDI2

DP++

Digital Display Interface DDI3

DP++

Maximum Resolution on DDI

HDMI: 4096x2304, DP: 3840x2160

17

COMe-bHL6 / Product Specification

PEG Configuration

The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers.
The COMe-bHL6 supports following PEG Port configuration when used as PCI Express Interface:

» 1×16

» 1×8

» 1×4

» 1×2

» 1×1

The internal PCI Express controller can be re-configured to support up to 3 PCIe ports on PEG16 interface. The PEG lane
splitting is configurable in setup:

» 1×16 (lanes #0-15)

» 2×8 (lanes #0-7 + #8-15)

» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)

With splitted ports, Port2 (#8-15 or #8-11) and Port3 (#12-15) cannot have more lanes
active as Port1 (#0-7) has

Storage

onboard SSD

-

SD Card support

-

IDE Interface

-

Serial-ATA

up to 3x SATA 6Gb/s, 1x SATA 3Gb/s

SATA AHCI

NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier

SATA RAID

0, 1, 5, 10 (QM87 only)

If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a RAID Setup connect at least two hard drives
and enable RAID support in BIOS Advanced/HDD Settings. After reboot, setup your RAID
configuration in the new setup item “Addon Devices”

18

COMe-bHL6 / Product Specification

Connectivity

USB 2.0

8x USB 2.0

USB 3.0

up to 4x USB 3.0

USB Client

-

PCI

-

PCI External Masters

-

PCI Express

7x PCIe x1 Gen 2.0

Max PCI Express

8x PCIe without LAN

PCI Express x2/x4 configuration

YES (Softstrap option)

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® i218-LM (Clarkville)

PCI Express Configuration

By default, the COMe-bHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.

PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5 Port #6 Port #7*

Configuration 0 x1 x1 x1 x1 x1 x1 x1 x1

Configuration 1 x2 x1 x1 x1 x1 x1 x1

Configuration 2 x2 x2 x1 x1 x1 x1

Configuration 3 x2 x2 x2 x1 x1

Configuration 4 x2 x2 x2 x2

Configuration 5 x4 x1 x1 x1 x1

Configuration 6 x4 x2 x1 x1

Configuration 7 x4 x2 x2

Configuration 8 x4 x4

- *PCIe Port #7 is available without Ethernet Controller only

- Configuration 0 is the default setting

- Configuration 3 & Configuration 5 are available in UEFI download package on EMD
Customer Section

Ethernet

The Intel® i218-LM (Clarkville) ethernet supports:

» Jumbo Frames - 9K

» MACsec IEEE 802.1 AE

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

» IEEE1588

Misc Interfaces and Features

Supported BIOS Size/Type

16MB SPI

Audio

HD Audio + DisplayPort dual stream

Onboard Hardware Monitor

Nuvoton NCT7802Y

Trusted Platform Module

Atmel AT97SC3204-U2A1A-10

Miscellaneous

2x UART / PWM FAN / eDP optional

19

COMe-bHL6 / Product Specification

Kontron Features

External I2C Bus

Fast I2C, MultiMaster capable

Smart Battery (M.A.R.S.) support

YES

Embedded API

KEAPI3

Custom BIOS Settings / Flash Backup

YES

Watchdog support

Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.

» Optimized RTC Battery monitoring to secure highest longevity

» Real fast I2C with transfer rates up to 40kB/s.

» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support

YES

Supply Voltage

8.5V - 20V

ACPI

ACPI 4.0

S-States

S0, S3, S4, S5

S5 Eco Mode

YES

Misc Power Management

cTDP @ i7-4700EQ

Power Consumption and Performance

Full Load Power Consumption

17 - 48W

Kontron Performance Index

32645 - 100815

Kontron Performance/Watt

1723 - 3105

Detailed Power Consumption measurements and benchmarks for CPU, Graphics and Memory
are available in Application Note KEMAP054 at EMD Customer Section.

20

COMe-bHL6 / Product Specification

3.3 Block Diagram

21

SMB

GPIO

Ctrl

Mgmt

LPC HDA VGA SATA#0-3

SPI

Intel® 8-Series PCH

QM87/HM86

GPIO

PCIe #6

PEG x16

USB #0-3

(USB3.0)

PwrCtrl

SysMgmt

RTC

PCIe #7

USB #0-3

(USB2.0)

PWM
FAN2

I2C

SER0
SER1

eDP x2

USB #4-7

(USB 2.0)

PCIe #0-5

Intel® 4th Generation Core

LID

Sleep

SPI

BIOS Flash

LVDS

Connector Option

Standard

component

GB LAN

Embedded Controller

(CPLD EPM1270)

HWM

NCT7802

Gen7.5

iGFX

FAN1

xHCI

EHCI2

eDP2LVDS

NXP3460

COM Express® connector AB – Pin-out Type 6

GBLan

Intel® I218LM

VCC

5VSB

VBAT

HWM

SMB

Power sequencing

Watchdog

LPC2I2C GPIO Buffer

I2C

S5eco

EEPROM

TPM

UART

COM Express® connector CD – Pin-out Type 6

DDR3L SODIMM
DDL3L SODIMM ECC

VCC

DDR3L SODIMM
DDR3L SODIMM ECC

EHCI1

DP++

CONFIG

x16/x8/x4

PEG Config

CPLD

JTAG

SPD

GBE MAC

COMe-bHL6 / Product Specification

3.4 Accessories

Product specific accessories

Product Number Heatspreader and Cooling Solutions Comment

38025-0000-99-2 HSP COMe-bHL6 heatpipe thread For all CPUs and temperature grades

38025-0000-99-3 HSP COMe-bHL6 heatpipe through For all CPUs and temperature grades

38025-0000-99-0C05 HSK COMe-bHL6 active (w/o HSP) For all CPUs and commercial temperature grade usage

38025-0000-99-0C06 HSK COMe-bHL6 passive (w/o HSP) For all CPUs and commercial temperature grade usage

General accessories

Part Number COMe pin-out Type 6 compatible accessories Project Code Comment

38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector

38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector

96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier

96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPor t

96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card

38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

38106-0000-00-S COMe Eval Star terkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6

38114-0000-00-S COMe Ref. Starterkit T6 ADAS Starterkit with COMe Reference Carrier T6

Part Number Mounting Comment

38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors

38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors

38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors

38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors

Part Number Cooling Solutions Comment

36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP

36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP

Part Number Display Adapter Comment

9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter

9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter

96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter

96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable

96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable

96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

Part Number Cables Comment

96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)

96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)

Part Number Miscellaneous Comment

18029-0000-00-0 MARS Smart Battery Kit Starterkit Kontron Mobile Application platform for Rechargeable Systems

For COMe-bHL6 standard (38025-xxxx-xx-x)

Part Number DDR3L SODIMM, commercial temperature grade

97015-1024-16-1 DDR3L-1600 SODIMM 1GB

97015-2048-16-1 DDR3L-1600 SODIMM 2GB

97015-4096-16-1 DDR3L-1600 SODIMM 4GB

97015-8192-16-1 DDR3L-1600 SODIMM 8GB

Part Number DDR3L SODIMM, industrial temperature grade

97015-1024-16-3 DDR3L-1600 SODIMM 1GB E2

97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2

97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2

97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2

For COMe-bHL6RXT (38026-xxxx-xx-x)

Part Number DDR3L ECC SODIMM, industrial temperature grade

97016-1024-16-3 DDR3L-1600 SODIMM 1GB ECC E2

97016-2048-16-3 DDR3L-1600 SODIMM 2GB ECC E2

97016-4096-16-3 DDR3L-1600 SODIMM 4GB ECC E2

97016-8192-16-3 DDR3L-1600 SODIMM 8GB ECC E2

22

COMe-bHL6 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:

VCC:

8.5V - 20V

Standby:

5V DC +/- 5%

RTC:

2.5V - 3.47V

- 5V Standby voltage is not mandatory for operation.

- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-bHL6 variants is 17 - 48W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on

EMD Customer Section. Information there is available after registration.

23

COMe-bHL6 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).

State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC

G3 x x 0V x 0V

S5 high low 5V high 0V

S5 S0 → PWRBTN Event low high → 5V high low → 0 V VCC →

S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 20V.

To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.

State PWRBTN# PWR_OK V5_StdBy VCC

G3 x x x 0

G3 S0 → high open / high x connecting VCC

S5 high open / high x VCC

S5 S0 → PWRBTN Event open / high x reconnecting VCC

Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.

All ground pins have to be tied to the ground plane of the carrier board.

24

COMe-bHL6 / Product Specification

3.6 Power Control

Power Supply

The COMe-bHL6 supports a power input from 8.5V - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).

Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-bHL6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.

Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.

25

COMe-bHL6 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-bHL6

Temperature Specification Operating Non-operating Validated Input Voltage

Commercial grade 0°C to +60°C -30°C to +85°C VCC: 8.5V - 20V

Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V

Industrial grade by Screening (XT)

-40°C to +85°C -40°C to +85°C VCC: 12V

Industrial grade by Design (E2)

-40°C to +85°C -40°C to +85°C VCC: 8.5V - 20V

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade Validation requirements

Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency

Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection

Industrial grade by Screening (XT)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Industrial grade by Design (E2)

at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

26

COMe-bHL6 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-bHL6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances

(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.

Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

27

COMe-bHL6 / Product Specification

Shock & Vibration

The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the COMe-bHL6 follows the requirements for electromagnetic

compatibility standards

» EN55022

28

COMe-bHL6 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 215836 @ 40°C (w/PCB)

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

29

COMe-bHL6 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 125.0 mm

» Height approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from module PCB bottom to heatspreader top:

Cooling solutions provided from Kontron Europe GmbH for basic sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top.

Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of

27.3mm from module bottom to Heatsink top.

30

COMe-bHL6 / Product Specification

3.11 Module Dimensions

4+2 DIE: CPU with GT1 or GT2 graphics
4+3 DIE: CPU with GT3 graphics
OPCM DIE: eDRAM for GT3 graphics

31

COMe-bHL6 / Product Specification

3.12 Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bHL6. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:

» 60°C for commercial grade modules

» 75°C for extended temperature grade modules (E1)

» 85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-bHL6. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-bHL6 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of COMe-bHL6 heatspreader and cooling solutions are provided at

http://emdcustomersection.kontron.com.

32

COMe-bHL6 / Product Specification

3.13 Onboard Connectors

3.13.1 FAN Connector J6 - PCB bottom

Specification

» Part number (Molex) J8: 53261-0371

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

Pin assignment

» Pin1: Tacho, Pin2: VCC, Pin3: GND

Electrical characteristic

Module Input Voltage 8.5 - 13V 13 - 20V

FAN Output Voltage

8.5 - 13V 13V

Max. FAN Output Current

350mA 150mA

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

33

COMe-bHL6 / Product Specification

3.13.2 CPU JTAG connector J3 - PCB bottom

The XDP connector is for internal use only. Do not use under any circumstances

3.13.3 CPLD Debug connector J7 - PCB top

The CPLD Debug and programming connector is for internal use only. Do not use under any circumstances

34

COMe-bHL6 / Features and Interfaces

4 Features and Interfaces

4.1 S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

» The power button must be pressed at least for 200ms to switch on.

» Wake via Power button only.

» “Power On After Power Fail”/“State after G3”: only “stay off” is possible

35

COMe-bHL6 / Features and Interfaces

4.2 Rapid Shutdown

Overview

For “R” or the “RXT” version of the COMe-bHL6, Kontron has implemented a rapid shutdown function. It works as follows:

1) An active-high shutdown signal is asserted by the COM Express Eval Type 2 carrier board via pin C67 of the COM Express
connector. The characteristics of the shutdown signal are as follows:

» Amplitude 5.0V +/- 5%

» Source impedance < = 50 ohms

» Rise time 1uS⇐

» Duration >= 20uS

The assertion of this signal causes all power regulators to be disabled and the internal power supply rails to be discharged
by crowbar circuits. The shutdown circuitry provides internal energy storage that maintains crowbar activation for at least
2mS following the de-assertion of the shutdown signal. The circuit also incorporates a weak input pulldown resistor so
that the RXT module will operate normally in systems where the rapid shutdown functionality is not used and pin C67 of
the COM Express is left unconnected.

2) Simultaneously with the leading edge of shutdown, the 12V (main) input power to the RXT module is removed and
these input power pins are externally clamped to ground though a crowbar circuit located on the COM Express carrier
board. This external clamping circuit must maintain a maximum resistance of approximately 1 ohm and be activated for a
minimum of 2mS.

3) Simultaneously with the leading edge of shutdown, the 5V (standby) input power to the RXT module is removed, if
present. External clamping on these pins is not necessary.

Crowbar implementation details

As a tool for designing the internal crowbars, Kontron developed tallied the total capacitance present on each of the
internal power rails, and calculates the required discharge resistance in order to achieve the desired voltage decay time
constant. The principal design criteria are that each supply rail must decay to 37% of initial value (equivalent to 1RC)
within 250uS, and to below 1.5V within 2mS. Analysis shows that the power rails fall into four general classes. Each class
of power rails has a corresponding discharge strategy.

1) Power Input Rails: The main 12V power input rail incorporates about 300uF of distributed capacitance. This rail must be
discharged by an external crowbar located on the carrier board, which must provide a shunt resistance of approximately 1
ohm. The peak power dissipation in this crowbar resistance will be relatively high (on the order of 150W when the crowbar
is activated), but will diminish very rapidly as the input capacitors discharge.

2) Low Voltage, High Power Rails: Each of these 5 “major” internal supply rails has an output voltage in the 1.0 V to 1.5V
range, and each rail has between 1500uF and 3300uF of output capacitance. The required discharge resistances for these
rails are in the range of 0.1 to 0.2 ohm, and peak discharge currents are in the range of 8 to 16A.

The discharge circuit for each rail is implemented with a “pulse withstanding” thick-film SMT resistor in series with a low­RDSon MOSFET. The resistor peak powers are in the 8W to 20W range; depending on PCB layout considerations either a
single resistor or multiple smaller resistors may be used to achieve sufficient pulse handling capability.

Because of the relatively high currents in the discharge paths, these crowbar circuits require wide copper traces and
careful component placement adjacent to the output components of the corresponding power supplies.

3) Low Voltage, Low Power Rails: These rails have voltages of 1.8V or less and capacitances under 1000uF, with peak
discharge currents <3A. The discharge circuits for these rails are also implemented with resistor(s) and a low-RDSon

36

COMe-bHL6 / Features and Interfaces

MOSFET. In some cases, the peak pulse power dissipation in the resistor(s) is low enough that specialty “pulse
withstanding” resistors are not required.

4) Medium Voltage Rails: These 3.3V and 5V rails typically have relatively small output capacitances and peak discharge
currents <1A. The discharge circuits for these rails are typically implemented with conventional resistor(s) and a low­RDSon MOSFET.

Shutdown input circuit details

The shutdown input pin to the RXT module is coupled through a series Schottky diode and a small series resistor to the
gates of all crowbar MOSFETs, connected in parallel. All crowbar MOSFETs are N-channel “logic level” parts that have are
specified for operation at Vgs = 4.5V. Three additional components are connected in parallel between the MOSFET gates
and ground:

» A capacitor that provides energy storage to keep the MOSFETs conducting for several mS after the shutdown signal

is de-asserted.

» A high-value resistor that provides a discharge path for the capacitor as well as a pulldown resistance (to insure

that the shutdown circuits remain inactive if the shutdown pin is left floating).

» A 6.2V zener diode that protects the MOSFET gates from damage due to input ESD or input overdrive.

In order to insure that the crowbars do not “fight” active switching regulators while the input capacitors are being
discharged, the shutdown circuit rapidly crowbars the 5V rail, with a time constant <10uS. The 5V rail powers most of the
remaining switching regulators, and as its voltage falls below about 4V those regulators enter under-voltage lockout
mode and cease to operate. Additionally, by using the UVLO mechanism in the design of the RXT module, Kontron
minimizes the risk of inadvertently affecting the standard power sequencing logic for such RXT modules. Two of the
switching regulators do not require the 5V supply for operation, and in those two cases it will be necessary to clamp the
enable inputs to ground when shutdown begins.

37

COMe-bHL6 / Features and Interfaces

4.3 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI / Phoenix EFI

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

38

COMe-bHL6 / Features and Interfaces

4.4 Serial Peripheral Interface (SPI)

The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.

The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.

4.5 SPI boot

The COMe-bHL6 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:

BIOS_DIS0# BIOS_DIS1# Function

open open Boot on-module BIOS

GND open Boot baseboard LPC FWH

open GND Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2

GND GND Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1

By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only

Recommended SPI boot flash types for 8-SOIC package

Size Manufacturer Part Number Device ID

16Mbit Atmel AT26DF161 0x1F4600

16Mbit Atmel AT26DF161A 0x1F4601

16Mbit Atmel AT25DF161 0x1F4602

16Mbit Atmel AT25DQ161 0x1F8600

16Mbit Macronix MX25L1605A(D)(36E)(06E) 0xC22015

16Mbit Macronix MX25L1635D 0xC22415

16Mbit SST/Microchip SST25VF016B 0xBF2541

16Mbit Winbond W25X16BV 0xEF3015

16Mbit Winbond W25Q16BV(CV) 0xEF4015

Size Manufacturer Part Number Device ID

32Mbit Atmel AT25/26DF321 0x1F4700

32Mbit Atmel AT25DF321A 0x1F4701

32Mbit Macronix MX25L3205A(D)(06E) 0xC22016

32Mbit Macronix MX25L3225D(35D)(36D) 0xC25E16

32Mbit SST/Microchip SST25VF032B 0XBF254A

32Mbit Winbond W25X32BV 0xEF3016

32Mbit Winbond W25Q32BV, 0xEF4016

Size Manufacturer Part Number Device ID

64Mbit Atmel AT25DF641(A) 0x1F4800

64Mbit Atmel AT25DQ641 0x1F8800

64Mbit Macronix MX25L6405D(45E)(36E)(06E)(73E) 0xC22017

64Mbit Macronix MX25L6455E 0xC22617

64Mbit Macronix MX25U6435F 0xC22537

64Mbit SST/Microchip SST25VF064C 0xBF254B

64Mbit Winbond W25X64BV 0xEF3017

64Mbit Winbond W25Q64BV(CV)(FV) 0xEF4017

64Mbit Winbond W25Q64DW 0XEF6017

64Mbit Winbond W25Q64FW 0XEF6017

39

COMe-bHL6 / Features and Interfaces

Using an external SPI flash

To program an external SPI flash follow these steps:

» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface

» Open pin A34 and B88 to boot from the module BIOS

» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash

» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash

» reboot

Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.

External SPI flash on Modules with Intel® ME

If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.

To avoid this issue please make sure to conduct a complete flash of the external SPI flash device af ter changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.

40

COMe-bHL6 / Features and Interfaces

4.6 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

41

COMe-bHL6 / Features and Interfaces

4.7 UART

The COMe-bHL6 supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for
UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by
default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.

UART features:

» 450 to 115.2k Baud (except 56000)

» 5, 6, 7 or 8bit characters

» 1 or 2 Stop bit generation

» Even, odd or no-parity generation/detection

» Complete status reporting capabilities

» Line break generation and detection

» Full prioritized interrupt system control

» No FIFO

» One additional shift register for transmit and one for receive

» No Flow Control

» No FCR register due to unavailability of FIFO

» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs

» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO

» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present

The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings

- Due to the protection circuitry required according COM Express® specification the
transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or
support for customized versions without protection circuitry

- Legacy console redirection via onboard serial ports may be restricted in terms of serial
input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream
generated by a program may lose characters. Inputs from a keyboard via terminal program
will be safe.

42

COMe-bHL6 / Features and Interfaces

4.8 Fast I2C

The COMe-bHL6 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from
opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

» Speed up to 400kHz

» Compatible to Philips I2C bus standard

» Multi-Master capable

» Clock stretching support and wait state generation

» Interrupt or bit-polling driven byte-by-byte data-transfers

» Arbitration lost interrupt with automatic transfer cancellation

» Start/Stop signal generation/detection

» Bus busy detection

» 7bit and 10bit addressing

43

COMe-bHL6 / Features and Interfaces

4.9 Dual Staged Watchdog Timer

Basics

A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a
system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to
regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”,
“feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive
state into normal operation.

The COMe-bHL6 offers a watchdog which works with two stages that can be programmed independently and used one by
one.

Time-out events

Reset

A reset will restart the module and starts POST and operating system new.

NMI

A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by st andard interrupt masking techniques in the system. It
is typically used to signal attention for non-recoverable hardware errors.

SCI

A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code

Delay

Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the f irst
stage)

WDT Signal only

This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only

Cascade:

Does nothing, but enables the 2nd stage af ter the entered time-out.

WDT Signal

B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within
time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If
deassertion during runtime is necessary please ask your Kontron technical support for further help.

44

COMe-bHL6 / Features and Interfaces

4.10 Intel® Fast Flash Standby™ / Rapid Start Technology™

The target of Intel® Fast Flash Standby™ (iFFS) (also known as Intel® Rapid Start Technology™ iRST) is to get a wake-up
time from S4 compareable to S3. Normally S4 is caused by OS which stores it's information to the hard disk and does then
a normal shutdown. S4 resume takes quite long as the system does a normal BIOS POST and OS restores it's information
from the hard disk.

IFFS does it in a different way. The Operating System initiates an S3 and stores it's information in memory. After that
BIOS copies this OS information from DRAM to SSD and does a sleep state similar to S4 with nearly zero power. If system is
resumed by power button, BIOS restores memory content from SSD to the DRAM and does an S3 resume which is much
faster.

Requirements

» SATA Solid State Disk in AHCI mode

» Free disk space on the SSD with at least the DRAM size

» Operating System with disk partition tool to allocate the hibernation partition (e.g. Windows 7/8)

» BIOS supporting iFFS feature

How to setup once the operating system is installed

» Prepare a free disk space on your onboard or external SSD with at least the size of DRAM

» Open cmd.exe in Administrator Mode and type diskpart.exe to open the Windows disk partition tool

» DISKPART> list disk

» DISKPART> select disk X (X is disk number where you want to create the store partition. Refer to results from “list

disk” for exact disk number)

» DISKPART> create partition primary

» DISKPART> detail disk

» DISKPART> select Volume X (X is Volume of your store partition. Refer to results from “detail disk” for exact volume

number)

» DISKPART> set id=84 override (ID 84 marks the partition as hibernate partition)

» DISKPART> exit

» Now there should be a Hibernate Partition visible in your disk management

» Reboot and enable iFFS in BIOS

Usage

» Activate Lid / move system to Sleep/Standby ( S3)→

» After configured period of time in Setup the system powers on automatically and information in DRAM moves to

non-volatile memory (Default is 'immediately')

» System switches off again to iFFS ( comparable to S4, Power Supply can now be disconnected)→

» When System is powered on, information moved back to DRAM (No display output during copy process)

» System resumes same as Sleep/Standby S3

Note

» Depending on the platform iFFS enabled may disable the hibernate function in Windows automatically

45

COMe-bHL6 / Features and Interfaces

Benefits

» System transitions from S3 to S4 automatically

» Up to 6x battery life compared to Standby

» Resume time reduced up to 75%

Measured resume times from Power-on to Win7 Log-on Screen on COMe-mCT10:

» 2.5” SATA II HDD 5400rpm: Hibernate: 22s, iFFs on onboard NANDrive: 17s

» 2.5” SATA III SSD: Hibernate: 18s, iFFS on SSD: 10s

46

COMe-bHL6 / Features and Interfaces

4.11 Speedstep Technology

The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum
performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to
adapt high performance computing on your applications. When powered by a battery or running in idle mode, the
processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining
a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize
performance.

In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.

By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup
the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.

47

COMe-bHL6 / Features and Interfaces

4.12 C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or
switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State Description Function

C0 Operating CPU fully turned on

C1 Halt State Stops CPU main internal clocks via software

C1E Enhanced Halt Similar to C1, additionally reduces CPU voltage

C2 Stop Grant Stops CPU internal and external clocks via hardware

C2E Extended Stop Grant Similar to C2, additionally reduces CPU voltage

C3 Deep Sleep Stops all CPU internal and external clocks

C3E Extended Stop Grant Similar to C3, additionally reduces CPU voltage

C4 Deeper Sleep Reduces CPU voltage

C4E Enhanced Deeper Sleep Reduces CPU voltage even more and turns off the memory cache

C6 Deep Power Down Reduces the CPU internal voltage to any value, including 0V

C7 Deep Power Down Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance
sensitive applications or real-time systems.

» Active C6-State may influence data transfer on external Serial Ports

» Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

48

COMe-bHL6 / Features and Interfaces

4.13 Hyper Threading

Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to
improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the
processor—those that store the architectural state but not duplicating the main execution resources. This allows a Hyper­Threading equipped processor to pretend to be two “logical” processors to the host operating system, allowing the
operating system to schedule two threads or processes simultaneously. Hyper Threading Technology support always relies
on the Operating System.

49

COMe-bHL6 / Features and Interfaces

4.14 Dynamic FSB Frequency Switching

Dynamic FSB frequency switching effectively reduces the internal bus clock frequency by half to further decrease the
minimum processor operating frequency from the Enhanced Intel SpeedStep Technology performance states and achieve
the Super Low Frequency Mode (Super LFM). This feature is supported at FSB frequencies of 1066 MHz, 800 MHz and 667
MHz and does not entail a change in the external bus signal (BCLK) frequency. Instead, both the processor and GMCH
internally lower their BCLK reference frequency to 50% of the externally visible frequency. Both the processor and GMCH
maintain a virtual BCLK signal (VBCLK) that is aligned to the external BCLK but at half the frequency.

After a downward shift, it would appear externally as if the bus is running with a 133-MHz base clock in all aspects, except
that the actual external BCLK remains at 266 MHz. See Figure 3 for details. The transition into Super LFM, a “down-shift,”
is done following a handshake between the processor and GMCH. A similar handshake is used to indicate an “up-shift,” a
change back to normal operating mode. Please ensure this feature is enabled and supported in the BIOS.

50

COMe-bHL6 / Features and Interfaces

4.15 VID-x

The processor implements the VID-x feature for improved control of core voltage levels when the processor enters a
reduced power consumption state. VID-x applies only when the processor is in the Intel Dynamic Acceleration Technology
performance state and one or more cores are in low-power state (i.e., CC3/CC4/CC6). VID-x provides the ability for the
processor to request core voltage level reductions greater than one VID tick. The amount of VID tick reduction is fixed and
only occurs while the processor is in Intel Dynamic Acceleration Technology mode. This improved voltage regulator
efficiency during periods of reduced power consumption allows for leakage current reduction which results in platform
power savings and extended battery life.

When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be active under certain internal
conditions. In such a scenario the processor may draw an Instantaneous current (ICC_CORE_INST) for a short duration of
tINST; however, the average ICC current will be lesser than or equal to ICCDES current specification.

51

COMe-bHL6 / Features and Interfaces

4.16 Intel® Turbo Boost Technology and AVX

For applications that are particularly power-hungry, the new processors provide enhanced Intel® Turbo Boost technology.
This automatically shifts processor cores and processor graphics resources to accelerate performance, tailoring a
workload to give users an immediate performance boost for their applications whenever needed. Another innovation is
the enhancement to the 256-bit instruction set, known as Intel® Advanced Vector Extensions (AVX). AVX delivers
improved performance, rich functionality and the ability to manage, rearrange and sort data in a better way. The new
instruction set accelerates floating-point intensive applications such as “number crunchers” or digital processing of
images, videos and audio data.
Intel® Turbo Boost Technology 2.0

Intel has optimized Intel® Turbo Boost Technology to provide even more performance when needed on the latest­generation Intel® microarchitecture. Intel® Turbo Boost Technology 2.0 automatically allows processor cores to run
faster than the base operating frequency if it's operating below power, current, and temperature specification limits.
Intel Turbo Boost Technology 2.0 is activated when the Operating System (OS) requests the highest processor
performance state (P0).

The maximum frequency of Intel Turbo Boost Technology 2.0 is dependent on the number of active cores. The amount of
time the processor spends in the Intel Turbo Boost Technology 2.0 state depends on the workload and operating
environment. Any of the following can set the upper limit of Intel Turbo Boost Technology 2.0 on a given workload:

» Number of active cores

» Estimated current consumption

» Estimated power consumption

» Processor temperature

When the processor is operating below these limits and the user's workload demands additional performance, the
processor frequency will dynamically increase until the upper limit of frequency is reached. Intel Turbo Boost Technology

2.0 has multiple algorithms operating in parallel to manage current, power, and temperature to maximize performance
and energy efficiency. Note: Intel Turbo Boost Technology 2.0 allows the processor to operate at a power level that is
higher than its rated upper power limit (TDP) for short durations to maximize performance.

52

COMe-bHL6 / Features and Interfaces

4.17 Display Configuration

Maximum supported Resolutions in Single Display Configuration

Port Max Resolution

DP 3840×2160@60Hz, 24bpp

4096×2160@24Hz, 24bpp

HDMI 4096×2160@24Hz, 24bpp

2560×1600@60Hz, 24bpp
1920×1080@60Hz, 36bpp

DVI 1920×1200@60Hz, 24bpp

VGA 1920×1200@60Hz, 24bpp

WiDi 1920×1080@30Hz, 24bpp

1280×720@60Hz, 24bpp

eDP (x2) 1920×1200@60Hz

LVDS 1920×1200@60Hz

Maximum supported Pixel Clock

Port Max Pixel Clock

DP 533 MHz

HDMI 300 MHz

DVI 165 MHz

VGA 180 MHz

DDI supported resolutions in 3 Display Configurations

Display1 Display2 Display3 Max.Res Display 1 Max.Res Display 2 Max.Res Display 3

HDMI/DP HDMI/DP DP 4096×2160@24Hz

3840×2160@60Hz

4096×2160@24Hz
3840×2160@60Hz

3840×2160@60Hz

HDMI/DP HDMI/DP eDP/LVDS 4096×2160@24Hz

3840×2160@60Hz

4096×2160@24Hz
3840×2160@60Hz

1920×1200@60Hz

DP DVI/WiDi DVI 3840×2160@60Hz 1920×1200@60Hz

1920×1080@30Hz

1920×1200@60Hz

eDP/LDVS DVI/WiDi DVI 1920×1200@60Hz 1920×1200@60Hz

1920×1080@30Hz

1920×1200@60Hz

VGA/WiDi DP/HDMI DP/HDMI 1920×1200@60Hz

1920×1080@30Hz

3840×2160@60Hz
4096×2160@24Hz

3840×2160@60Hz
4096×2160@24Hz

VGA/WiDi eDP/LVDS DP/HDMI 1920×1200@60Hz

1920×1080@30Hz

1920×1200@60Hz 3840×2160@60Hz

4096×2160@24Hz

DP DP DVI 3840×2160@60Hz 3840×2160@60Hz 1920×1200@60Hz

eDP/LVDS DP DVI 1920×1200@60Hz 3840×2160@60Hz 1920×1200@60Hz

VGA DVI DVI/WiDi 1920×1200@60Hz 1920×1200@60Hz 1920×1200@60Hz

1920×1080@30Hz

VGA DP/HDMI DVI/WiDi 1920×1200@60Hz 3840×2160@60Hz

4096×2160@24Hz

1920×1200@60Hz
1920×1080@30Hz

VGA eDP/LVDS DVI/WiDi 1920×1200@60Hz 1920×1200@60Hz 1920×1200@60Hz

1920×1080@30Hz

DVI DVI WiDi 1920×1200@60Hz 1920×1200@60Hz 1920×1080@30Hz

Link Data Rate

The maximum supported Display Ports resolutions are dependent on the Link Data Rate and the used Lane Count:

Link Data Rate 1 Lane 2 Lanes 4 Lanes

RBR 1024×600 1400×1050 2240×1400

HBR 1280×960 1920×1200 2880×1800

HBR2 1920×1200 2880×1800 3840×2160

53

COMe-bHL6 / Features and Interfaces

3 independent Display Support

The COMe-bHL6 supports up to 3 independent displays in Windows 7/8 and Linux by using the following rules:

» Max of 2 HDMIs

» Max of 2 DVIs

» Max of 1 HDMI and 1DVI

» Any 3 DisplayPort

» One VGA

Digital Display Interface Features

The integrated Intel® HD/HD4600/HD5200 (Gen7.5) graphics supports:

» High-bandwidth Digital Content Protection (HDCP) on HDMI and DisplayPort with up to 2 HDCP streams

simultaneously

» One active Protected Audio and Video Path (PAVP) session on HDMI or DisplayPort

» Dual Stream DP/HDMI Audio

» DP/HDMI/DVI Hot-plug (low-active)

Supported Audio Formats on HDMI and DisplayPort

Audio Formats HDMI DisplayPort

AC-3 Dolby Digital YES YES

Dolby Digital Plus YES YES

DTS-HD YES YES

LPCM, 192kHz/24bit, 8 channel YES YES

Dolby True HD, DTS HD Master Audio YES YES

54

COMe-bHL6 / Features and Interfaces

DDI Design Consideration

» For sufficient signal quality baseboard designs with long signal lanes or impedance leaps may require an Equalizer

or Re-driver for the digital display interfaces

» DDI hot-plug detection is high active

» DisplayPort can be used directly or with external adapters for HDMI, DVI or VGA

» HDMI or DVI usage on a baseboard requires a level shifter

Find more details for DDI usage as DisplayPort, HDMI or DVI with schematic examples
available on http://emdcustomersection.kontron.com

DVI-I Design Topology

DVI-I is supported on PCH Digital Display Port B (COM DDI1) only. The implementation involves routing VGA and DVI-D
signals to DVI-I connector:

» VGA port RGB signals should be routed to Analog RGB pins on the DVI-I connector

» DVI Data and Clock signals on PCH Digital Display Port B should be routed to TMDS Data 0, 1 and 2 pins and TMDS

Clock pin of DVI-I connector respectively

» DVI HPD signals should be routed to the HPD pin of the DVI-I connector

» DVI DDC Clock and Data signals on PCH Digital Display Port B should be routed to the DDC Clock and Data pins of the

DVI-I connector.

55

COMe-bHL6 / Features and Interfaces

4.18 Hybrid Graphics / Multi-monitor

The COMe-bHL6 supports Hybrid Multi-monitor function which is one form of Intel's Hybrid Graphics where integrated
graphics (in Chipset or CPU) is available to operate simultaneously with external PEG; PCIe or PCI graphics. This feature
enables concurrent function of Intel's integrated Graphics Processing Unit (GPU/iGFX) along with a discrete GPU solution,
allowing for operability of greater than two independently-driven displays. The O/S will handle control of the multiple
GPU display adapters appropriately. For example, WindowsXP supports The Microsoft Windows XP Display Driver Model
(XPDM) which allows loading and support of multiple graphics drivers. Windows 7 continues that legacy XPDM support but
also adds WDDM v1.1 which, like XPDM, allows for simultaneous multiple graphics drivers (Windows Vista WDDM v1.0 did
not allow this capability). Operating system applications will be adapter-unaware through use of the O/S GUI APIs and will
utilize the adapter associated with the primary display, regardless of which display the image is located on.

Some applications may be adapter-aware, e.g., full-screen applications and system
applications like the compositor. A number of software tools designed to assist multi­monitor use are available from third parties. One example is the UltraMon* utility for multi­monitor systems, which helps with the position of applications, assists desktop wallpapers
and screen savers in multi-monitor configurations.

Hybrid Multi-monitor mode is recommended to be accomplished using a discrete third-party PCI Express graphics card
either into the PEG slot of the platform or into an available PCI Express slot routed off of the I/O subsection of the chipset.

Requirements

» Baseboard supporting PEG (alternatively PCIe or PCI)

» Module BIOS which allows switching between iGFX and discrete GPU (iGFX must be set to primary boot display)

» O/S supporting heterogeneous display adapters (Linux / WindowsXP / Windows 7)

Setup a Multi-monitor system

» Start without the discrete GPU seated in the system

» Select IGD as Primary Boot Display in BIOS Setup

» Boot into O/S and install drivers requested for the integrated GPU

» Shut down the system and insert the discrete GPU

» Boot into O/S and install drivers requested for the discrete GPU (if necessary in Safe mode)

» Set the Windows Display properties as referenced below (example: WindowsXP)

In most cases the graphical user interfaces (e.g. ATI Catalyst Control Center) for both GPUs
may not run properly. It's recommended to use O/S implemented Display Properties like in
screenshot above

Detailed documentation is available in Intel Paper 323214

56

COMe-bHL6 / Features and Interfaces

4.19 Intel® Wireless Display

Intel® Wireless Display, most commonly known as WiDi, is a wireless display standard developed by Intel, based on the
existing Wi-Fi standard. It allows a portable device or computer to send up to 1080p HD video and 5.1 surround sound to a
compatible display wirelessly.

The COMe-bHL6 supports WiDi in combination with following requirements:

CPU:

» 2nd Generation Intel® Core(TM) i7/i5/i3

» 3rd Generation Intel® Core(TM) i7/i5/i3

» 4th Generation Intel® Core(TM) i7/i5/i3

» Intel® Celeron N28xx / N29xx Series

One of the following Wireless Devices:

» Intel® Centrino® Wireless-N 1000, 1030, 2200, or 2230

» Intel® Centrino® Wireless-N 2200 for Desktop

» Intel® Centrino® Advanced-N 6200, 6205, 6230, or 6235

» Intel® Centrino® Advanced-N 6205 for Desktop

» Intel® Centrino® Wireless-N + WiMAX 6150

» Intel® Centrino® Advanced-N + WiMAX 6250

» Intel® Centrino® Ultimate-N 6300

» Intel® Dual Band Wireless-N 7260

» Intel® Dual Band Wireless-AC 7260

» Intel® Dual Band Wireless-AC 7260 for Desktop

» Intel® Dual Band Wireless-AC 3160

» Intel® Wireless-N 7260

» Broadcom BCM43228*

» Broadcom BCM43241*

» Broadcom BCM4352*

Operating System:

» Windows 7 64-bit, Home Premium, Ultimate or Professional

» Windows 7 32-bit, Home Premium, Ultimate, Professional or Basic

» Windows 8 32-bit and 64-bit editions

» Windows 8.1 32-bit and 64-bit editions

Software:

» Intel® Wireless Display pre-installed and enabled

An Intel® WiDi compatible streaming target such as:

» WiDi Adapter (e.g. Belkin ScreenCast, D-Link DHD-131, NETGEAR Push2TV …)

57

COMe-bHL6 / Features and Interfaces

» HDTV's with built in WiDi Support (e.g. LG Smart TV …)

» Any other WiDi compatible CE Devices (e.g. Netgear Media Player NTV200S …)

More information about Intel® Wireless Display Technology are available on www.intel.com

58

COMe-bHL6 / Features and Interfaces

4.20 Intel® vPro™ technology

Kontron and Intel® are addressing the security and manageability challenges facing embedded systems today with the
implementation of Intel® vPro™ technology to enable: » System integrity » Secure isolation » Remote systems
management

First, system integrity is the ability to identify whether the system hardware or system software has been modified
without authorization. When a system’s integrity is known, the system can be thought of as a trusted system. Second,
secure isolation is the ability to use platform hardware to separate processes, resources, and data on the system such that
they cannot interact with each other in unintended ways. By providing hardware-assisted isolation, there is limitless
security, privacy, and cost savings that can be realized through consolidation and workload isolation. Finally, remote
systems management is the ability to troubleshoot, perform power management or system verification through secure
channels. Significant cost savings and efficiencies can be realized through remote management allowing for increased
system up time and the ability to manage or diagnose a system, even when powered down.

Intel® vPro™ technology itself is special functionality designed into both, the processor and the chipset. The three
technologies that comprise Intel® vPro™ technology are: Intel Virtualization Technology (Intel® VT), Intel Trusted
Execution Technology (Intel® TXT) and Intel Active Management Technology (Intel® AMT).

Intel® VT provides hardware-based assists making secure isolation more efficient and decreases the virtualization
footprint, lowering the effective attack surface of a solution. This hardware-based technology can help to protect
applications and information by running multiple operating systems (OSs) in isolation on the same physical system. A
virtual guest OS can be created in an entirely separate space on the physical system to run specialized or critical
applications. Virtual environments leverage Intel® VT for memory, CPU, and Directed I/O virtualization. Intel® TXT
provides the ability to use hardware-based mechanisms to verify system integrity during the boot process. It also provides
system memory scrubbing that protects against soft reset attacks. Virtualized environments take advantage of Intel® TXT
launch environment verification to establish a dynamic root of trust providing added security to hypervisor or virtual
machine monitor (VMM).

Mechanisms employed by Intel® AMT include domain authentication, session keys, persistent data storage in the Intel®
AMT hardware, and access control lists. Only firmware images that are digitally signed by Intel are permitted to load and
execute. This set of hardware-based features is targeted for businesses and allows remote access to the system, whether
wired or wireless, for management and security tasks. Because of the special hardware capabilities provided by Intel®
AMT, out of band access is available even when the OS is not functional or system power is off.

Intel® TXT and Intel® AMT are disabled by default. Please contact your local sales or
support for BIOS versions with full vPro™ support

59

COMe-bHL6 / Features and Interfaces

4.21 ACPI Suspend Modes and Resume Events

The COMe-bHL6 supports the S-states S0, S3, S4, S5. S5eco Support: YES

The following events resume the system from S3:

» USB Keyboard (1)

» USB Mouse (1)

» Power Button

» WakeOnLan (2)

The following events resume the system from S4:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5:

» Power Button

» WakeOnLan (2)

The following events resume the system from S5Eco:

» Power Button

(1) OS must support wake up via USB devices and baseboard must power the USB Port with
StBy-Voltage
(2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup
and driver options

60

COMe-bHL6 / System Resources

5 System Resources

5.1 Interrupt Request (IRQ) Lines

IRQ # Used For Available Comment

0 Timer0 No -

1 Keyboard No -

2 Cascade No -

3 COM2 No onboard UART2

4 COM1 No onboard UART1

5 SIO LPT Note(4) external SIO LPT

6 COM3 Note(4) external SIO COM1

7 COM4 Note(4) external SIO COM2

8 RTC No -

9 ACPI No -

10 - Yes -

11 - Yes -

12 PS/2 Mouse Note(4) external SIO

13 FPU No -

14 - Yes -

15 - Yes -

16 LNK A No P.E.G + I.G.D + SA Audio + XHCI + Intel ME

+ USB EHCI2 + PCIe RP 0 + PCIe RP 4;
Note(3)

17 LNK B No PCIe RP 1 + PCIe RP 5; Note(3)

18 LNK C No PCIe RP 2 + PCIe RP 6 + SMBus; Note(3)

19 LNK D No PCIe RP 3 + SATA; Note(3)

20 LNK E No Onboard LAN;Note(3)

21 LNK F No Note(3)

22 LNK G No PCH HDA;Note(3)

23 LNK H No USB EHCI#1

(1) If the “Used For” device is disabled in setup, the corresponding interrupt is available
for other device.
(2) Not available if ACPI is used
(3) ACPI OS decides on particular IRQ usage
(4) Depends on system configuration (onboard COM Port support and external SIO
presence)

61

COMe-bHL6 / System Resources

5.2 Memory Area

The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area
above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and
EMM386.EXE, which are part of the operating system. Please refer to the operating system documentation or special
textbooks for information about HIMEM.SYS and EMM386.EXE. Other operating systems (Linux or Windows versions) allow
you to address the full memory area directly.

Upper Memory Used for Available Comment

A0000h – BFFFFh VGA Memory No Mainly used by graphic controller

C0000h – CFFFFh VGA BIOS No Used by onboard VGA ROM

D0000h – DFFFFh - Yes Free for shadow RAM in standard

configurations.

E0000h – FFFFFh System BIOS No Fixed

20000000h-201FFFFFh IGFX No Fixed

40000000h-401FFFFFh IGFX No Fixed

E0000000h–FEAFFFFFh PCIe Conf ig Space No Fixed

FEC00000 - FECFFFFF Local APIC/IOAPIC(s) No Fixed

FED00000h-FED003FFh HPET No Fixed

FED10000h-FED17FFFh MCH No Fixed

FED18000h-FED18FFFh DMI No Fixed

FED19000h-FED19FFFh EPBA No Fixed

FED1C000h-FED1FFFFh RCBA No Fixed

FED20000h FED3FFFFh TXT No Fixed

FED40000h FED44FFFh TPM No Fixed

FED45000h FED8FFFFh TPM No Fixed

FED90000h-FED93FFFh V T-d No Fixed

FEE00000h-FEEFFFFFh MSI area No Fixed

FF000000h-FFFFFFFFh BIOS Flash No Fixed

5.3 I/O Address Map

The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for
compatibility reasons, even if available.

I/O Address Used for Available Comment

0000 - 001F System Resources No Fixed

0020 - 003F Interrupt Controller 1 No Fixed

002E - 002F Ext. SIO No Fixed

0040 - 005F Timer, Counter No Fixed

004E - 004F TPM No Fixed

0060 - 006F Keyboard controller No Fixed

0070 - 007F RTC and CMOS Registers No Fixed

0080 BIOS Postcode No Fixed

0081 - 009F DMA Controller No Fixed

00A0 - 00BF Interrupt Controller No Fixed

00C0 - 00DF DMA Controller No Fixed

00F0 - 00FF Math Coprocessor No Fixed

03B0 - 03DF VGA No Fixed

0400 - 047F Chipset No Fixed

04D0 - 04D1 Chipset No Fixed

0800 - 087F Chipset No Fixed

0A00 - 0A0F LPC Yes Routed to LPC

0A80 - 0A8F CPLD No Fixed

0A90 - 0AFF LPC Yes Routed to LPC

0CF8 - 0CFF Chipset No Fixed

62

COMe-bHL6 / System Resources

5.4 Peripheral Component Interconnect (PCI) Devices

All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectively the PCI Express Base 1.0a
specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

PCI Device B:D:F PCI IRQ Interface Comment

Host Bridge 0:0:0 None internal Chipset

P.E.G. Root Port 0:1:0 LNK A internal Chipset

Video Controller 0:2:0 LNK A internal Chipset

SA Audio 0:3:0 LNK A internal Chipset

XHCI 0:20:0 LNK A internal Chipset

ME 0:22:0 LNK A internal Chipset

GbE 0:25:0 LNK E internal Chipset

EHCI2 0:26:0 LNK A internal Chipset

PCH HDA 0:27:0 LNK G PCIe Chipset

PCIe Port 0 0:28:0 LNK A internal Chipset

PCIe Port 0 Slot - A/B/C/D PCIe Port 0

PCIe Port 1 0:28:1 LNK A internal Chipset

PCIe Port 1 Slot - B/C/D/A PCIe Port 1

PCIe Port 2 0:28:2 LNK A internal Chipset

PCIe Port 2 Slot - C/D/A/B PCIe Port 2

PCIe Port 3 0:28:3 LNK A internal Chipset

PCIe Port 3 Slot - D/A/B/A PCIe Port 3

PCIe Port 4 0:28:4 LNK A internal Chipset

PCIe Port 4 Slot - A/B/C/D PCIe Port 4

PCIe Port 5 0:28:5 LNK A internal Chipset

PCIe Port 5 Slot - B/C/D/A PCIe Port 5

PCIe Port 6 0:28:6 LNK A internal Chipset

PCIe Port 6 Slot - C/D/A/B PCIe Port 6

EHCI1 0:29:0 LNK H internal Chipset

LPC Bridge 0:31:0 - internal Chipset

SATA 0:31:2 LNK D internal Chipset

SMBus 0:31:3 LNK C internal Chipset

5.5 Internal I2C Bus

I2C Address Used For Available Comment

58h S5 Eco No S5 Eco Resistor

A0h JILI-EEPROM No external LVDS EEPROM for JILI Data

C0h LVDS bridge No DP to LVDS Bridge

5.6 External I2C Bus

I2C Address Used For Available Comment

A0h JIDA-EEPROM No Module EEPROM

AEh FRU-EEPROM No Recommended for Baseboard EEPROM

63

COMe-bHL6 / System Resources

5.7 System Management (SM) Bus

The 8-bit SMBus addresses uses the LSB (Bit 0) for the direction. Bit0 = 0 defines the write address, Bit0 = 1 defines the
read address for the device. The 8-bit addresses listed below shows the write address for all devices. 7-bit SMBus
addresses shows the device address without Bit0.

8-bit Address 7-bit Address Device Comment SMBus

12h 0x09 SMART_CHARGER Not to be used with any SM bus

device except a charger

SMB

14h 0x0A SMART_SELECTOR Not to be used with any SM bus

device except a selector or
manager

SMB

16h 0x0B SMART_BATTERY Not to be used with any SM bus

device except a battery

SMB

30h 0x18 DDR3 Thermal Sensor Chan. A Do not use under any

circumstances

SMB

34h 0x1A DDR3 Thermal Sensor Chan. B Do not use under any

circumstances

SMB

5Ch 0x2C Hardware Monitor Do not use under any

circumstances

SMB

A0h 0x50 DDR3 channel A SPD Do not use under any

circumstances

SMB

A4h 0x52 DDR3 channel B SPD Do not use under any

circumstances

SMB

C8h 0x64 Ethernet I218-LM Do not use under any

circumstances

SML0

A JIDA Bus No. like in former Modules cannot be provided because the EAPI driver
implementation enumerates the I2C busses dynamically. Please follow the initialization
process like it is provided in the EAPI specification.

64

COMe-bHL6 / Connectors

6 Connectors

The pin-outs for Interface Connectors X1A and X1B are documented for convenient reference. Please see the COM
Express® Specification and COM Express® Design Guide for detailed, design-level information.

6.1 Connector Location

65

COMe-bHL6 / Pinout List

7 Pinout List

7.1 General Signal Description

Type Description

I/O-3,3

Bi-directional 3,3 V IO-Signal

I/O-5T

Bi-dir. 3,3V I/O (5V Tolerance)

I/O-5

Bi-directional 5V I/O-Signal

I-3,3

3,3V Input

I/OD

Bi-directional Input/Output Open Drain

I-5T

3,3V Input (5V Tolerance)

OA

Output Analog

OD

Output Open Drain

O-1,8

1,8V Output

O-3,3

3,3V Output

O-5

5V Output

DP-I/O

Differential Pair Input/Output

DP-I

Differential Pair Input

DP-O

Differential Pair Output

PU

Pull-Up Resistor

PD

Pull-Down Resistor

PWR

Power Connection

To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current the enclosure of the peripheral
device fulfills the fire-protection requirements of IEC/EN60950

66

COMe-bHL6 / Pinout List

7.2 Connector X1A Row A

Pin Signal Descr iption Type Termination Comment

A1 GND Power Ground PWR GND - -

A2 GBE0_MDI3- Ethernet Media Dependent Interf ace 3 - DP-I/O - -

A3 GBE0_MDI3+ Ethernet Media Dependent Interface 3 + DP-I/O - -

A4 GBE0_LINK100# Ethernet 100 Mbit Link Indicator OD - -

A5 GBE0_LINK1000# Ethernet 1000 Mbit Link Indicator OD - -

A6 GBE0_MDI2- Ethernet Media Dependent Interf ace 2 - DP-I/O - -

A7 GBE0_MDI2+ Ethernet Media Dependent Interface 2 + DP-I/O - -

A8 GBE0_LINK# Ethernet Link Indicator OD - -

A9 GBE0_MDI1- Ethernet Media Dependent Interf ace 1 - DP-I/O - -

A10 GBE0_MDI1+ Ethernet Media Dependent Interf ace 1 + DP-I/O - -

A11 GND Power Ground PWR GND - -

A12 GBE0_MDI0- Ethernet Media Dependent Inter face 0 - DP-I/O - -

A13 GBE0_MDI0+ Ethernet Media Dependent Interf ace 0 + DP-I/O - -

A14 GBE0_CTREF Center Tab Reference Voltage O - 1µF capacitor to GND

A15 SUS_S3# Suspend To RAM (or deeper) Indicator O-3.3 PD 10k -

A16 SATA0_TX+ SATA 0 Transmit Pair + DP-O - -

A17 SATA0_TX- SATA 0 Transmit Pair - DP-O - -

A18 SUS_S4# Suspend To Disk (or deeper) Indicator O-3.3 - -

A19 SATA0_RX+ SATA 0 Receive Pair + DP-I - -

A20 SATA0_RX- SATA 0 Receive Pair - DP-I - -

A21 GND Power Ground PWR GND - -

A22 SATA2_TX+ SATA 2 Transmit Pair + DP-O - -

A23 SATA2_TX- SATA 2 Transmit Pair - DP-O - -

A24 SUS_S5# Soft Off Indicator O-3.3 - -

A25 SATA2_RX+ SATA 2 Receive Pair + DP-I - -

A26 SATA2_RX- SATA 2 Receive Pair - DP-I - -

A27 BATLOW# Battery Low I-3.3 PU 10k 3.3V (S5) assertion will prevent wake from S3-S5 state

A28 (S)ATA_ACT# Serial ATA LED OD-3.3 PU 10k 3.3V (S0) can pull down 3mA

A29 AC/HDA_SYnc HD Audio Sync O-3.3 PD 15k in PCH resistor value can range from 9kOhm to 50kOhm

A30 AC/HDA_RST# HD Audio Reset O-3.3 - -

A31 GND Power Ground PWR GND - -

A32 AC/HDA_BITCLK HD Audio Bit Clock Output O-3.3 - -

A33 AC/HDA_SDOUT HD Audio Ser ial Data Out O-3.3 PD 15k in PCH resistor value can range from 9kOhm to 50kOhm

A34 BIOS_DIS0# BIOS Selection Strap 0 I-3.3 PU 10k 3.3V (SPI) PU might be powered during suspend

A35 THRMTRIP# Thermal Trip O-3.3 PU 10k 3.3V (S0) do not use for over temperatur detection (because this

signal is a S0 signal, it's not possible to see if module
shuts down regular or caused by CPU overtemperatur)

A36 USB6- USB 2.0 Data Pair Por t 6 – DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A37 USB6+ USB 2.0 Data Pair Port 6 + DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A38 USB_6_7_OC# USB Overcurrent Indicator Port 6/7 I-3.3 PU 10k 3.3V (S5) -

A39 USB4- USB 2.0 Data Pair Por t 4 - DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A40 USB4+ USB 2.0 Data Pair Port 4 + DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A41 GND Power Ground PWR GND - -

A42 USB2- USB 2.0 Data Pair Por t 2 – DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A43 USB2+ USB 2.0 Data Pair Port 2 + DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A44 USB_2_3_OC# USB Overcurrent Indicator Port 2/3 I-3.3 PU 10k 3.3V (S5) -

A45 USB0- USB 2.0 Data Pair Por t 0 – DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A46 USB0+ USB 2.0 Data Pair Port 0 + DP-I/O PD 15k in PCH resistor value can range from 14kOhm to 25kOhm

A47 VCC_RTC Real-Time Clock Circuit Power Input PWR 3V - -

A48 EXCD0_PERST# Express Card Reset Port 0 O-3.3 - -

A49 EXCD0_CPPE# Express Card Capable Card Request Port 0 I-3.3 PU 10k 3.3V (S0) -

A50 LPC_SERIRQ Serial Interrupt Request I/OD-3.3 PU 8k25 3.3V (S0) -

A51 GND Power Ground PWR GND - -

A52 PCIE_TX5+ PCI Express Lane 5 Transmit + DP-O - -

A53 PCIE_TX5- PCI Express Lane 5 Transmit - DP-O - -

A54 GPI0 General Purpose Input 0 I-3.3 PU 10k 3.3V (S0) -

A55 PCIE_TX4+ PCI Express Lane 4 Transmit + DP-O - -

A56 PCIE_TX4- PCI Express Lane 4 Transmit - DP-O - -

A57 GND Power Ground PWR GND - -

A58 PCIE_TX3+ PCI Express Lane 3 Transmit + DP-O - -

A59 PCIE_TX3- PCI Express Lane 3 Transmit - DP-O - -

A60 GND Power Ground PWR GND - -

A61 PCIE_TX2+ PCI Express Lane 2 Transmit + DP-O - -

A62 PCIE_TX2- PCI Express Lane 2 Transmit - DP-O - -

67

COMe-bHL6 / Pinout List

A63 GPI1 General Purpose Input 1 I-3.3 PU 10k 3.3V (S0) -

A64 PCIE_TX1+ PCI Express Lane 1 Transmit + DP-O - -

A65 PCIE_TX1- PCI Express Lane 1 Transmit - DP-O - -

A66 GND Power Ground PWR GND - -

A67 GPI2 General Purpose Input 2 I-3.3 PU 10k 3.3V (S0) -

A68 PCIE_TX0+ PCI Express Lane 0 Transmit + DP-O - -

A69 PCIE_TX0- PCI Express Lane 0 Transmit - DP-O - -

A70 GND Power Ground PWR GND - -

A71 LVDS_A0+ LVDS Channel A Data0 + DP-O - -

A72 LVDS_A0- LVDS Channel A Data0 - DP-O - -

A73 LVDS_A1+ LVDS Channel A Data1 + DP-O - configuration as eDP_TX1+ in customised article version

possible

A74 LVDS_A1- LVDS Channel A Data1 - DP-O - configuration as eDP_TX1- in customised article version

possible

A75 LVDS_A2+ LVDS Channel A Data2 + DP-O - configuration as eDP_TX0+ in customised article version

possible

A76 LVDS_A2- LVDS Channel A Data2 - DP-O - configuration as eDP_TX0- in customised article version

possible

A77 LVDS_VDD_EN LVDS Panel Power Control O-3.3 PD 100k configuration as eDP_VDD_EN in customised article

version possible

A78 LVDS_A3+ LVDS Channel A Data3 + DP-O - -

A79 LVDS_A3- LVDS Channel A Data3 - DP-O - -

A80 GND Power Ground PWR GND - -

A81 LVDS_A_CK+ LVDS Channel A Clock + DP-O - -

A82 LVDS_A_CK- LVDS Channel A Clock - DP-O - -

A83 LVDS_I2C_CK LVDS Data Channel Clock I/O-3.3 PU 2k21 3.3V (S0) conf iguration as eDP_AUX+ in customised article version

possible

A84 LVDS_I2C_DAT LVDS Data Channel Data I/O-3.3 PU 2k21 3.3V (S0) configur ation as eDP_AUX- in customised article version

possible

A85 GPI3 General Purpose Input 3 I-3.3 PU 10k 3.3V (S0) -

A86 RSVD Reserved for future use nc - -

A87 RSVD Reserved for future use nc - configuration as eDP_HPD in customised article version

possible

A88 PCIE_CLK_REF+ Reference PCI Express Clock + DP-O - -

A89 PCIE_CLK_REF- Reference PCI Express Clock - DP-O - -

A90 GND Power Ground PWR GND - -

A91 SPI_POWER 3.3V Power Output Pin for external SPI f lash O-3.3 - might be powered dur ing suspend

A92 SPI_MISO SPI Master IN Slave OUT I-3.3 PU 20k in PCH (SPI) resistor value can range from 15kOhm to 40kOhm and

might be powered during suspend

A93 GPO0 General Purpose Output 0 O-3.3 PD 10k -

A94 SPI_CLK SPI Clock O-3.3 - -

A95 SPI_MOSI SPI Master Out Slave In O-3.3 PD 20k in PCH resistor value can range from 15kOhm to 40kOhm

A96 TPM_PP TPM Physical Presence I-3.3 PD 100k -

A97 TYPE10# No Connect for type 6 modules nc - -

A98 SER0_TX Ser ial Port 0 TXD O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

A99 SER0_RX Serial Port 0 RXD I-5T PU 47k 3.3V (S0) 20V protection circuit implemented on module

A100 GND Power Ground PWR GND - -

A101 SER1_TX Serial Port 1 TXD O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

A102 SER1_RX Serial Por t 1 RXD I-5T PU 47k 3.3V (S0) 20V protection circuit implemented on module

A103 LID# LID Switch Input I-3.3 PU 47k 3.3V (S5) 20V protection circuit implemented on module

A104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

A110 GND Power Ground PWR GND - -

68

COMe-bHL6 / Pinout List

7.3 Connector X1A Row B

Pin Signal Description Type Termination Comment

B1 GND Power Ground PWR GND - -

B2 GBE0_ACT Ethernet Activity LED OD - -

B3 LPC_FRAME# LPC Frame Indicator O-3.3 - -

B4 LPC_AD0 LPC Multiplexed Command, Address & Data 0 I/O-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B5 LPC_AD1 LPC Multiplexed Command, Address & Data 1 I/O-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B6 LPC_AD2 LPC Multiplexed Command, Address & Data 2 I/O-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B7 LPC_AD3 LPC Multiplexed Command, Address & Data 3 I/O-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B8 LPC_DRQ0# LPC Ser ial DMA/Master Request 0 I-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B9 LPC_DRQ1# LPC Ser ial DMA/Master Request 1 I-3.3 PU 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm

B10 LPC_CLK 33MHz LPC clock O-3.3 - -

B11 GND Power Ground PWR GND - -

B12 PWRBTN# Power Button I-3.3 PU 10k 3.3V (S5eco) -

B13 SMB_CK SMBUS Clock O-3.3 PU 3k3 3.3V (S5) -

B14 SMB_DAT SMBUS Data I/O-3.3 PU 3k3 3.3V (S5) -

B15 SMB_ALERT# SMBUS Alert I/O-3.3 PU 10k0 3.3V (S5) -

B16 SATA1_TX+ SATA 1 Transmit Pair + DP-O - -

B17 SATA1_TX- SATA 1 Transmit Pair - DP-O - -

B18 SUS_STAT# Suspend Status O-3.3 - -

B19 SATA1_RX+ SATA 1 Receive Pair + DP-I - -

B20 SATA1_RX- SATA 1 Receive Pair - DP-I - -

B21 GND Power Ground PWR GND - -

B22 SATA3_TX+ SATA 3 Transmit Pair + DP-O - -

B23 SATA3_TX- SATA 3 Transmit Pair - DP-O - -

B24 PWR_OK Power OK I-5T PU 511k 3.3V pullup voltage depends on ATX or single supply mode / 5V

tolerant

B25 SATA3_RX+ SATA 3 Receive Pair + DP-I - -

B26 SATA3_RX- SATA 3 Receive Pair - DP-I - -

B27 WDT Watch Dog Time-Out event O-3.3 - -

B28 AC/HDA_SDIN2 HD Audio Serial Data In 2 I-3.3 PD 15k in PCH resistor value can range from 9kOhm to 50kOhm

B29 AC/HDA_SDIN1 HD Audio Serial Data In 1 I-3.3 PD 15k in PCH resistor value can range from 9kOhm to 50kOhm

B30 AC/HDA_SDIN0 HD Audio Serial Data In 0 I-3.3 PD 15k in PCH resistor value can range from 9kOhm to 50kOhm

B31 GND Power Ground PWR GND - -

B32 SPKR Speaker O-3.3 PD 20k in PCH (S0) resistor value can range from 15kOhm to 40kOhm, PCH

strap function

B33 I2C_CK I2C Clock O-3.3 PU 2k21 3.3V (S5) -

B34 I2C_DAT I2C Data I/O-3.3 PU 2k21 3.3V (S5) -

B35 THRM# Over Temperature Input I-3.3 PU 10k 3.3V (S0) no function implemented

B36 USB7- USB 2.0 Data Pair Por t 7 – DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B37 USB7+ USB 2.0 Data Pair Port 7 + DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B38 USB_4_5_OC# USB Overcurrent Indicator Port 4/5 I-3.3 PU 10k 3.3V (S5) -

B39 USB5- USB 2.0 Data Pair Por t 5 – DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B40 USB5+ USB 2.0 Data Pair Port 5 + DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B41 GND Power Ground PWR GND - -

B42 USB3- USB 2.0 Data Pair Por t 3 – DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B43 USB3+ USB 2.0 Data Pair Port 3 + DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B44 USB_0_1_OC# USB Overcurrent Indicator Port 0/1 I-3.3 PU 10k 3.3V (S5) -

B45 USB1- USB 2.0 Data Pair Por t 1 – DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B46 USB1+ USB 2.0 Data Pair Port 1 + DP-I/O PD 15K in PCH resistor value can range from 14kOhm to 25kOhm

B47 EXCD1_PERST# Express Card Reset Port 1 O-3.3 - -

B48 EXCD1_CPPE# Express Card Capable Card Request Port 1 I-3.3 PU 10k 3.3V (S0) -

B49 SYS_RESET# Reset Button Input I-3.3 PU 10k 3.3V (S5) -

B50 CB_RESET# Carrier Board Reset O-3.3 -

B51 GND Power Ground PWR GND - -

B52 PCIE_RX5+ PCI Express Lane 5 Receive + DP-I - -

B53 PCIE_RX5- PCI Express Lane 5 Receive - DP-I - -

B54 GPO1 General Purpose Output 1 O-3.3 PD 10k -

B55 PCIE_RX4+ PCI Express Lane 4 Receive + DP-I - -

B56 PCIE_RX4- PCI Express Lane 4 Receive - DP-I - -

B57 GPO2 General Purpose Output 2 O-3.3 PD 10k -

B58 PCIE_RX3+ PCI Express Lane 3 Receive + DP-I - -

B59 PCIE_RX3- PCI Express Lane 3 Receive - DP-I - -

B60 GND Power Ground PWR GND - -

B61 PCIE_RX2+ PCI Express Lane 2 Receive + DP-I - -

B62 PCIE_RX2- PCI Express Lane 2 Receive - DP-I - -

69

COMe-bHL6 / Pinout List

B63 GPO3 General Purpose Output 3 O-3.3 PD 10k -

B64 PCIE_RX1+ PCI Express Lane 1 Receive + DP-I - -

B65 PCIE_RX1- PCI Express Lane 1 Receive - DP-I - -

B66 WAKE0# PCI Express Wake Event I-3.3 PU 10k 3.3V (S5) -

B67 WAKE1# General Purpose Wake Event I-3.3 PU 10k 3.3V (S5) -

B68 PCIE_RX0+ PCI Express Lane 0 Receive + DP-I - -

B69 PCIE_RX0- PCI Express Lane 0 Receive - DP-I - -

B70 GND Power Ground PWR GND - -

B71 LVDS_B0+ LVDS Channel B Data0 + DP-O - -

B72 LVDS_B0- LVDS Channel B Data0 - DP-O - -

B73 LVDS_B1+ LVDS Channel B Data1 + DP-O - -

B74 LVDS_B1- LVDS Channel B Data1 - DP-O - -

B75 LVDS_B2+ LVDS Channel B Data2 + DP-O - -

B76 LVDS_B2- LVDS Channel B Data2 - DP-O - -

B77 LVDS_B3+ LVDS Channel B Data3 + DP-O - -

B78 LVDS_B3- LVDS Channel B Data3 - DP-O - -

B79 LVDS_BKLT_EN Panel Backlight On O-3.3 PD 100k configuration as eDP_BKLT_EN in customised article

version possible

B80 GND Power Ground PWR GND - -

B81 LVDS_B_CK+ LVDS Channel B Clock + DP-O - -

B82 LVDS_B_CK- LVDS Channel B Clock - DP-O - -

B83 LVDS_BKLT_CTRL Backlight Brightness Control O-3.3 - -

B84 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B85 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B86 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B87 VCC_5V_SBY 5V Standby PWR 5V (S5) - optional (not neccessary in single supply mode)

B88 BIOS_DIS1# BIOS Selection Strap 1 I-3.3 PU 10k 3.3V (SPI) PU might be powered during suspend

B89 VGA_RED Red Analog Video Output OA PD 150R -

B90 GND Power Ground PWR GND - -

B91 VGA_GRN Green Analog Video Output OA PD 150R -

B92 VGA_BLU Blue Analog Video Output OA PD 150R -

B93 VGA_HSYnc VGA Horizontal Synchronisation O-3.3 - -

B94 VGA_VSYnc VGA Vertical Synchronization O-3.3 - -

B95 VGA_I2C_CK VGA Data Channel Clock I/O-3.3 PU 1k1 3.3V (S0) -

B96 VGA_I2C_DAT VGA Data Channel Data I/O-3.3 PU 1k1 3.3V (S0) -

B97 SPI_CS# SPI Chip Select O-3.3 - -

B98 RSVD Reserved for future use nc - -

B99 RSVD Reserved for future use nc - -

B100 GND Power Ground PWR GND - -

B101 FAN_PWMOUT Fan PWM Output O-3.3 - 20V protection circuit implemented on module, PD on

carrier board needed for proper operation

B102 FAN_TACHIN Fan Tach Input I-3.3 PU 47k 3.3V (S0) 20V protection circuit implemented on module

B103 SLEEP# Sleep Button Input I-3.3 PU 47k 3.3V (S5) 20V protection circuit implemented on module

B104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

B110 GND Power Ground PWR GND - -

70

COMe-bHL6 / Pinout List

7.4 Connector X1B Row C

Pin Signal Descr iption Type Termination Comment

C1 GND Power Ground PWR GND - -

C2 GND Power Ground PWR GND - -

C3 USB_SSRX0- USB Super Speed Receive Port 0 - DP-I - -

C4 USB_SSRX0+ USB Super Speed Receive Port 0 + DP-I - -

C5 GND Power Ground PWR GND - -

C6 USB_SSRX1- USB Super Speed Receive Port 1 - DP-I - -

C7 USB_SSRX1+ USB Super Speed Receive Port 1 + DP-I - -

C8 GND Power Ground PWR GND - -

C9 USB_SSRX2- USB Super Speed Receive Port 2 - DP-I - -

C10 USB_SSRX2+ USB Super Speed Receive Port 2 + DP-I - -

C11 GND Power Ground PWR GND - -

C12 USB_SSRX3- USB Super Speed Receive Port 3 - DP-I - -

C13 USB_SSRX3+ USB Super Speed Receive Port 3 + DP-I - -

C14 GND Power Ground PWR GND - -

C15 DDI1_PAIR6+ DDI1 Pair 6 + DP-I - -

C16 DDI1_PAIR6- DDI1 Pair 6 + DP-I - -

C17 RSVD Reserved for future use nc - -

C18 RSVD Reserved for future use nc - -

C19 PCIE_RX6+ PCI Express Lane 6 Receive + DP-I - -

C20 PCIE_RX6- PCI Express Lane 6 Receive - DP-I - -

C21 GND Power Ground PWR GND - -

C22 PCIE_RX7+ No Connect (opt. PCI Express Lane 7 Receive +) nc (opt. DP-I) - configuration as PCIE_RX7+ in customised article version

without LAN controller possible

C23 PCIE_RX7- No Connect (opt. PCI Express Lane 7 Receive -) nc (opt. DP-I) - conf iguration as PCIE_RX7- in customised article version

without LAN controller possible

C24 DDI1_HPD DDI1 Hotplug Detect I-3.3 PD 100k -

C25 DDI1_PAIR4+ DDI1 Pair 4 + DP-I - -

C26 DDI1_PAIR4- DDI1 Pair 4 - DP-I - -

C27 RSVD Reserved for future use nc - -

C28 RSVD Reserved for future use nc - -

C29 DDI1_PAIR5+ DDI1 Pair 5 + DP-I - -

C30 DDI1_PAIR5- DDI1 Pair 5 - DP-I - -

C31 GND Power Ground PWR GND - -

C32 DDI2_CTRLCLK_AUX+ Multiplexed DDI2 Data Channel Clock & AUX + I/O-3.3 PD 100k 2k21 PU (S0) when DDI2_DDC_AUX_SEL is high

C33 DDI2_CTRLDATA_AUX- Multiplexed DDI2 Data Channel Data & AUX - I/O-3.3 PU 100k (S0) 2k21 PU (S0) when DDI2_DDC_AUX_SEL is high

C34 DDI2_DDC_AUX_SEL DDI2 DDC/AUX Select I-3.3 PD 1M -

C35 RSVD Reserved for future use nc - -

C36 DDI3_CTRLCLK_AUX+ Multiplexed DDI3 Data Channel Clock & AUX + I/O-3.3 PD 100k 2k21 PU (S0) when DDI3_DDC_AUX_SEL is high

C37 DDI3_CTRLDATA_AUX- Multiplexed DDI3 Data Channel Data & AUX - I/O-3.3 PU 100k (S0) 2k21 PU (S0) when DDI3_DDC_AUX_SEL is high

C38 DDI3_DDC_AUX_SEL DDI3 DDC/AUX Select I-3.3 PD 1M -

C39 DDI3_PAIR0+ DDI3 Pair 0 + DP-O - -

C40 DDI3_PAIR0- DDI3 Pair 0 - DP-O - -

C41 GND Power Ground PWR GND - -

C42 DDI3_PAIR1+ DDI3 Pair 1 + DP-O - -

C43 DDI3_PAIR1- DDI3 Pair 1 - DP-O - -

C44 DDI3_HPD DDI3 Hotplug Detect I-3.3 PD 100k -

C45 RSVD Reserved for future use nc - -

C46 DDI3_PAIR2+ DDI3 Pair 2 + DP-O - -

C47 DDI3_PAIR2- DDI3 Pair 2 - DP-O - -

C48 RSVD Reserved for future use nc - -

C49 DDI3_PAIR3+ DDI3 Pair 3 + DP-O - -

C50 DDI3_PAIR3- DDI3 Pair 3 - DP-O - -

C51 GND Power Ground PWR GND - -

C52 PEG_RX0+ PCI Express Graphics Lane 0 Receive + DP-I - -

C53 PEG_RX0- PCI Express Graphics Lane 0 Receive - DP-I - -

C54 TYPE0# No Connect for type 6 module nc - -

C55 PEG_RX1+ PCI Express Graphics Lane 1 Receive + DP-I - -

C56 PEG_RX1- PCI Express Graphics Lane 1 Receive - DP-I - -

C57 TYPE1# No Connect for type 6 module nc - -

C58 PEG_RX2+ PCI Express Graphics Lane 2 Receive + DP-I - -

C59 PEG_RX2- PCI Express Graphics Lane 2 Receive - DP-I - -

C60 GND Power Ground PWR GND - -

C61 PEG_RX3+ PCI Express Graphics Lane 3 Receive + DP-I - -

C62 PEG_RX3- PCI Express Graphics Lane 3 Receive - DP-I - -

71

COMe-bHL6 / Pinout List

C63 RSVD Reserved for future use nc - -

C64 RSVD Reserved for future use nc - -

C65 PEG_RX4+ PCI Express Graphics Lane 4 Receive + DP-I - -

C66 PEG_RX4- PCI Express Graphics Lane 4 Receive - DP-I - -

C67 RSVD Reserved for future use nc - -

C68 PEG_RX5+ PCI Express Graphics Lane 5 Receive + DP-I - -

C69 PEG_RX5- PCI Express Graphics Lane 5 Receive - DP-I - -

C70 GND Power Ground PWR GND - -

C71 PEG_RX6+ PCI Express Graphics Lane 6 Receive + DP-I - -

C72 PEG_RX6- PCI Express Graphics Lane 6 Receive - DP-I - -

C73 GND Power Ground PWR GND - -

C74 PEG_RX7+ PCI Express Graphics Lane 7 Receive + DP-I - -

C75 PEG_RX7- PCI Express Graphics Lane 7 Receive - DP-I - -

C76 GND Power Ground PWR GND - -

C77 RSVD Reserved for future use nc - -

C78 PEG_RX8+ PCI Express Graphics Lane 8 Receive + DP-I - -

C79 PEG_RX8- PCI Express Graphics Lane 8 Receive - DP-I - -

C80 GND Power Ground PWR GND - -

C81 PEG_RX9+ PCI Express Graphics Lane 9 Receive + DP-I - -

C82 PEG_RX9- PCI Express Graphics Lane 9 Receive - DP-I - -

C83 RSVD Reserved for future use nc - -

C84 GND Power Ground PWR GND - -

C85 PEG_RX10+ PCI Express Graphics Lane 10 Receive + DP-I - -

C86 PEG_RX10- PCI Express Graphics Lane 10 Receive - DP-I - -

C87 GND Power Ground PWR GND - -

C88 PEG_RX11+ PCI Express Graphics Lane 11 Receive + DP-I - -

C89 PEG_RX11- PCI Express Graphics Lane 11 Receive – DP-I - -

C90 GND Power Ground PWR GND - -

C91 PEG_RX12+ PCI Express Graphics Lane 12 Receive + DP-I - -

C92 PEG_RX12- PCI Express Graphics Lane 12 Receive - DP-I - -

C93 GND Power Ground PWR GND - -

C94 PEG_RX13+ PCI Express Graphics Lane 13 Receive + DP-I - -

C95 PEG_RX13- PCI Express Graphics Lane 13 Receive - DP-I - -

C96 GND Power Ground PWR GND - -

C97 RSVD Reserved for future use nc - -

C98 PEG_RX14+ PCI Express Graphics Lane 14 Receive + DP-I - -

C99 PEG_RX14- PCI Express Graphics Lane 14 Receive - DP-I - -

C100 GND Power Ground PWR GND - -

C101 PEG_RX15+ PCI Express Graphics Lane 15 Receive + DP-I - -

C102 PEG_RX15- PCI Express Graphics Lane 15 Receive - DP-I - -

C103 GND Power Ground PWR GND - -

C104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

C110 GND Power Ground PWR GND - -

72

COMe-bHL6 / Pinout List

7.5 Connector X1B Row D

Pin Signal Description Type Termination Comment

D1 GND Power Ground PWR GND - -

D2 GND Power Ground PWR GND - -

D3 USB_SSTX0- USB Super Speed Transmit Port 0 - DP-O - -

D4 USB_SSTX0+ USB Super Speed Transmit Port 0 + DP-O - -

D5 GND Power Ground PWR GND - -

D6 USB_SSTX1- USB Super Speed Transmit Port 1 - DP-O - -

D7 USB_SSTX1+ USB Super Speed Transmit Port 1 + DP-O - -

D8 GND Power Ground PWR GND - -

D9 USB_SSTX2- USB Super Speed Transmit Port 2 - DP-O - -

D10 USB_SSTX2+ USB Super Speed Transmit Port 2 + DP-O - -

D11 GND Power Ground PWR GND - -

D12 USB_SSTX3- USB Super Speed Transmit Port 3 - DP-O - -

D13 USB_SSTX3+ USB Super Speed Transmit Port 3 + DP-O - -

D14 GND Power Ground PWR GND - -

D15 DDI1_CTRLCLK_AUX+ Multiplexed DDI1 Data Channel Clock & AUX + I/O-3.3 PD 100k 2k21 PU (S0) when DDI1_DDC_AUX_SEL is high

D16 DDI1_CTRLDATA_AUX- Multiplexed DDI1 Data Channel Data & AUX - I/O-3.3 PU 100k (S0) 2k21 PU (S0) when DDI1_DDC_AUX_SEL is high

D17 RSVD Reserved for future use nc - -

D18 RSVD Reserved for future use nc - -

D19 PCIE_TX6+ PCI Express Lane 6 Transmit + DP-O - -

D20 PCIE_TX6- PCI Express Lane 6 Transmit - DP-O - -

D21 GND Power Ground PWR GND - -

D22 PCIE_TX7+ No Connect (opt. PCI Express Lane 7 Transmit +) nc (opt. DP-O) - configuration as PCIE_RX7+ in customised article

version without LAN controller possible

D23 PCIE_TX7- No Connect (opt. PCI Express Lane 7 Transmit -) nc (opt. DP-O) - configuration as PCIE_RX7- in customised article

version without LAN controller possible

D24 RSVD Reserved for future use nc - -

D25 RSVD Reserved for future use nc - -

D26 DDI1_PAIR0+ DDI1 Pair 0 + DP-O - -

D27 DDI1_PAIR0- DDI1 Pair 0 - DP-O - -

D28 RSVD Reserved for future use nc - -

D29 DDI1_PAIR1+ DDI1 Pair 1 + DP-O - -

D30 DDI1_PAIR1- DDI1 Pair 1 - DP-O - -

D31 GND Power Ground PWR GND - -

D32 DDI1_PAIR2+ DDI1 Pair 2 + DP-O - -

D33 DDI1_PAIR2- DDI1 Pair 2 - DP-O - -

D34 DDI1_DDC_AUX_SEL DDI1 DDC/AUX Select I-3.3 PD 1M -

D35 RSVD Reserved for future use nc - -

D36 DDI1_PAIR3+ DDI1 Pair 3 + DP-O - -

D37 DDI1_PAIR3- DDI1 Pair 3 - DP-O - -

D38 RSVD Reserved for future use PWR GND - pin might change to Not Connect (nc) in later

product revision

D39 DDI2_PAIR0+ DDI2 Pair 0 + DP-O - -

D40 DDI2_PAIR0- DDI2 Pair 0 - DP-O - -

D41 GND Power Ground PWR GND - -

D42 DDI2_PAIR1+ DDI2 Pair 1 + DP-O - -

D43 DDI2_PAIR1- DDI2 Pair 1 - DP-O - -

D44 DDI2_HPD DDI2 Hotplug Detect I-3.3 PD 100k -

D45 RSVD Reserved for future use nc - -

D46 DDI2_PAIR2+ DDI2 Pair 2 + DP-O - -

D47 DDI2_PAIR2- DDI2 Pair 2 - DP-O - -

D48 RSVD Reserved for future use nc - -

D49 DDI2_PAIR3+ DDI2 Pair 3 + DP-O - -

D50 DDI2_PAIR3- DDI2 Pair 3 - DP-O - -

D51 GND Power Ground PWR GND - -

D52 PEG_TX0+ PCI Express Graphics Lane 0 Transmit + DP-O - -

D53 PEG_TX0- PCI Express Graphics Lane 0 Transmit - DP-O - -

D54 PEG_Lane_RV# PCI Express Graphics Lane Reversal I-3.3 PU 10k 3.3V (S0) -

D55 PEG_TX1+ PCI Express Graphics Lane 1 Transmit + DP-O - -

D56 PEG_TX1- PCI Express Graphics Lane 1 Transmit - DP-O - -

D57 TYPE2# GND for type 6 module O-PWR - -

D58 PEG_TX2+ PCI Express Graphics Lane 2 Transmit + DP-O - -

D59 PEG_TX2- PCI Express Graphics Lane 2 Transmit - DP-O - -

D60 GND Power Ground PWR GND - -

D61 PEG_TX3+ PCI Express Graphics Lane 3 Transmit + DP-O - -

D62 PEG_TX3- PCI Express Graphics Lane 3 Transmit - DP-O - -

73

COMe-bHL6 / Pinout List

D63 RSVD Reserved for future use nc - -

D64 RSVD Reserved for future use nc - -

D65 PEG_TX4+ PCI Express Graphics Lane 4 Transmit + DP-O - -

D66 PEG_TX4- PCI Express Graphics Lane 4 Transmit - DP-O - -

D67 GND Power Ground PWR GND - -

D68 PEG_TX5+ PCI Express Graphics Lane 5 Transmit + DP-O - -

D69 PEG_TX5- PCI Express Graphics Lane 5 Transmit - DP-O - -

D70 GND Power Ground PWR GND - -

D71 PEG_TX6+ PCI Express Graphics Lane 6 Transmit + DP-O - -

D72 PEG_TX6- PCI Express Graphics Lane 6 Transmit - DP-O - -

D73 GND Power Ground PWR GND - -

D74 PEG_TX7+ PCI Express Graphics Lane 7 Transmit + DP-O - -

D75 PEG_TX7- PCI Express Graphics Lane 7 Transmit - DP-O - -

D76 GND Power Ground PWR GND - -

D77 RSVD Reserved for future use nc - -

D78 PEG_TX8+ PCI Express Graphics Lane 8 Transmit + DP-O - -

D79 PEG_TX8- PCI Express Graphics Lane 8 Transmit - DP-O - -

D80 GND Power Ground PWR GND - -

D81 PEG_TX9+ PCI Express Graphics Lane 9 Transmit + DP-O - -

D82 PEG_TX9- PCI Express Graphics Lane 9 Transmit - DP-O - -

D83 RSVD Reserved for future use nc - -

D84 GND Power Ground PWR GND - -

D85 PEG_TX10+ PCI Express Graphics Lane 10 Transmit + DP-O - -

D86 PEG_TX10- PCI Express Graphics Lane 10 Transmit - DP-O - -

D87 GND Power Ground PWR GND - -

D88 PEG_TX11+ PCI Express Graphics Lane 11 Transmit + DP-O - -

D89 PEG_TX11- PCI Express Graphics Lane 11 Transmit - DP-O - -

D90 GND Power Ground PWR GND - -

D91 PEG_TX12+ PCI Express Graphics Lane 12 Transmit + DP-O - -

D92 PEG_TX12- PCI Express Graphics Lane 12 Transmit - DP-O - -

D93 GND Power Ground PWR GND - -

D94 PEG_TX13+ PCI Express Graphics Lane 13 Transmit + DP-O - -

D95 PEG_TX13- PCI Express Graphics Lane 13 Transmit - DP-O - -

D96 GND Power Ground PWR GND - -

D97 RSVD Reserved for future use nc - -

D98 PEG_TX14+ PCI Express Graphics Lane 14 Transmit + DP-O - -

D99 PEG_TX14- PCI Express Graphics Lane 14 Transmit - DP-O - -

D100 GND Power Ground PWR GND - -

D101 PEG_TX15+ PCI Express Graphics Lane 15 Transmit + DP-O - -

D102 PEG_TX15- PCI Express Graphics Lane 15 Transmit - DP-O - -

D103 GND Power Ground PWR GND - -

D104 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D105 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D106 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D107 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D108 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D109 VCC_12V Main Input Voltage (8.5-20V) PWR 8.5-20V - -

D110 GND Power Ground PWR GND - -

The termination resistors in these tables are already mounted on the module. Refer to the
design guide for information about additional termination resistors.

74

COMe-bHL6 / BIOS Operation

8 BIOS Operation

The BIOS (Basic Input and Output System) or UEFI (Unified Extensible Firmware Interface) records hardware parameters
of the system in the CMOS on the Computer-on-Module. It's major functions include exectution of the POST(Power-On­Self-Test) during system start-up, saving system parameters and loading the operating system. The BIOS includes a BIOS
Setup programm that allows to modify system configuration settings. The module is equipped with Phoenix SecureCore,
which is located in an onboard SPI serial flash memory.

8.1 Determining the BIOS Version

To determine the BIOS version currently used on the Computer-on-Modules please check System Information Page inside
Setup

8.2 BIOS Update

Kontron provides continous BIOS updates for Computer-on-Modules. The updates are provided for download on

http://emdcustomersection.kontron.com with detailed change descriptions within the according Product Change

Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file
size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the
BIOS Region (usually 4-16MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a
wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch
file inside the BIOS download package available on EMD Customer Section.

» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD

Customer Section

» Execute Flash.bat in DOS or Flash.nsh in EFI Shell

Any modification of the update process may damage your module!

8.3 POST Codes

Important POST codes during boot-up

8B

Booted to DOS

68

Booted to Setup / EFI Shell

00

Booted to Windows

8.4 Setup Guide

The Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of
menus to make changes and turn features on or off.

Functional keystrokes in POST:

[F2]

Enter Setup

[F5]

Boot Menu

[ESC] + [2]

Enter Setup via Remote Keyboard in Console Redirection Mode

Functional keystrokes in Setup:

[F1]

Help

[F9]

Load default settings

[F10]

Save and Exit

75

COMe-bHL6 / BIOS Operation

Menu Bar

The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.

Legend Bar

Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below
describes the legend keys and their alternates.

Key Function

or Arrow key ← → Select a menu.

or Arrow key ↑ ↓ Select fields in current menu.

<Home> or <End> Move cursor to top or bottom of current window.

<PgUp> or <PgDn> Move cursor to next or previous page.

+/- or F5/F6 Change Option

<Enter> Execute command or select submenu.

Selecting an Item

Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The ↑ ↓
Save Value commands in the Exit menu save the values displayed in all the menus.

Displaying Submenus

Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ) marks all submenus. ← → ►

Item Specific Help Window

The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the
cursor to each field.

General Help Window

Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press
<Esc> to exit the General Help window.

8.5 BIOS Setup

8.5.1 Main

76

COMe-bHL6 / BIOS Operation

Feature Options Description

System Date [mm/dd/yyyy] Set the Date. Use 'Tab' to switch between Date

elements

System Time [hh:mm:ss] Set the Time. Use 'Tab' to switch between Time

elements

77

COMe-bHL6 / BIOS Operation

System Information

78

COMe-bHL6 / BIOS Operation

Boot Features

Feature Options Description

NumLock

On
Off

Selects Power-on state for NumLock

Timeout

1

Number of seconds that P.O.S.T will wait for the user
input before booting

CSM Support

Yes
No

Enables or Disables the UEFI CSM (Compatibility
Support Module)to support legacy PC boot process.
Both legacy and UEFI boots are feasible

Quick Boot

Disabled
Enabled

Enable or Disable Quick Boot

Dark Boot

Disabled
Enabled

Enable or Disable Dark Boot

Diagnostic Splash Screen

Disabled
Enabled

Enable or Disable the Diagnostic Splash Screen

Diagnostic Summary Screen

Disabled
Enabled

Display the Diagnostic Summary Screen during boot

BIOS Level USB

Enabled
Disabled

Enable/Disable all BIOS support for USB in order to
reduce boot time. Note that this will prevent using a
USB keyboard in setup or a USB biometric scanner such
as a fingerprint reader to control access to setup, but
does not prevent the operating system from supporting
such hardware

USB Legacy

Enabled
Disabled

Enable/Disable USB BIOS SMM support for mouse,
keyboard, mass storage, etc, in legacy operating
systems such as DOS

Console Redirection

Disabled
Enabled

Enable/Disable Universal Console Redirection

- Console Port All
Onboard COM1
Onboard COM2
SIO COM1
SIO COM2

Select Port for console redirection. Note: the respective
port has to be enabled in setup!

- Terminal Type

ANSI
VT100
VT100+
UTF8

Set terminal type of UCR

- Baudrate

9600
19200
38400
57600
115200

Set terminal type of UCR

- Flow Control

None

Set flow control method for UCR. None = No flow

79

COMe-bHL6 / BIOS Operation

RTS/CTS
XON/XOFF

control, RTS/CTS = Hardware flow control, XON/XOFF =
Software flow control

- Continue C.R. after POST

Enabled
Disabled

Enables Console Redirection after OS has loaded

Allow Hotkey in S4 resume

Enabled
Disabled

Enable hotkey detection when system resuming from
Hybernate state

UEFI Boot

Enabled
Disabled

Enable the UEFI boot

On Shell Exit

Try next
Launch Setup\Launch Boot Menu

Select behavior after exit from shell

Legacy Boot

Enabled\Disabled

Enable the Legacy boot

Boot in Legacy Video Mode

Disabled
Enabled

Enable to force the display adapter to switch the video
mode to Text Mode 3 at the end of BIOS POST for non­UEFI boot mode (Legacy Boot). Some legacy software,
such as DUET, requires that the BIOS explicitly enter
text video mode prior to boot

Load OPROM

On Demand
All

Load all OPROMs or on demand according to the boot
device

Boot Priority

UEFI First
Legacy First

Select priority of boot option between UEFI and Legacy

80

COMe-bHL6 / BIOS Operation

Network Stack

Feature Options Description

Network Stack

Enabled
Disabled

Enable / Disable UEFI Network Stack

IPv4

Enabled
Disabled

Enable / Disable IPv4

UEFI PXE Boot Priority

IPv4 first

Select PXE Boot Priority (IPv4 only)

81

COMe-bHL6 / BIOS Operation

Platform Information

82

COMe-bHL6 / BIOS Operation

8.5.2 Advanced

83

COMe-bHL6 / BIOS Operation

Silicon Information

84

COMe-bHL6 / BIOS Operation

Processor Configuration

Feature Options Description

Active Processor Cores

All
1
2
3

Number of cores to enable in each processor package

Intel® HT Technology

Enabled
Disabled

When Disabled only one thread per enabled core is
enabled

CPU Flex Ratio Override

Disabled
Enabled

Enable/Disable CPU Flex Ratio Programming. If
Disabled, CPU frequency is set to maximum Ratio
automatically

- CPU Flex Ratio Settings

24

This value must be between Max Eff iciency Ratio (LFM /
Low Frequency Mode) and Maximum non-turbo ratio set
by Hardware (High Frequency Mode). See CPU
Featureset in chapter Specifications for possible
Bus/Core Ratio Settings. The active nominal CPU
frequency is Ratio*100MHz

Enabled XD

Enabled
Disabled

Enables/Disables 'Execute Disable functionality', also
known as Data Execution Prevention DEP

Intel® Virtualization Technology

Disabled
Enabled

When enabled, a VMM can utilize the additional
hardware capabilities

Intel® Trusted Execution Technology

Disabled
Enabled

Enable/Disable Intel TXT (enabled only in customized
BIOS versions)

85

COMe-bHL6 / BIOS Operation

Processor Power Management

Feature Options Description

Intel® SpeedStep(TM)

Enabled
Disabled

Enable/Disable processor performance states (P­States)

Boot Performance Mode

Max Performance
Max Battery
Auto

Select the performance state that the BIOS sets before
OS hand-off

Turbo Mode

Enabled
Disabled

Enable processor Turbo Mode

- Turbo Mode Power Limit Lock

Disabled
Enabled

Enable/Disable Locking of turbo settings. When
enabled, Turbo_Power_Limit MSR will be locked and a
reset will be required to unlock the register

- Long Power Limit

0

Turbo Mode Long Duration Power Limit (also known as
Power Limit PL1) in Watts. The value may vary from 0 to
Fused Value. If the value is 0, the fused value will be
programmed. A value greater than fused TDP value will
not be programmed

- Long Power Limit Time

28

Long Duration Time Windows (also known as PL1 Time)
value in seconds. The value may vary from 0 to 56.
Indicates the time window over which TDP value should
be maintained. If the value is 0, the fused value will be
programmed

- Short Power Limit

0

Turbo Mode Short Duration Power Limit (also known as
Power Limit PL2) in Watts. The value may vary from 0 to
Fused Value. If the value is 0, the fused value will be
programmed. A value greater than fused TDP value will
not be programmed

- Short Duration Turbo Mode

Enabled
Disabled

Enable/Disable Short Duration Turbo Mode for
processor

- Energy Eff icient Enable

Enabled
Disabled

Enable/Disable Energy Efficient for processor

Configure TDP Boot Mode

Nominal
Down
Up
Disabled

Configure TDP Mode (cTDP). Disabled option will skip all
cTDP boot configurations

86

COMe-bHL6 / BIOS Operation

Lock TDP Settings

Disabled
Enabled

Lock TDP in MSR_CONFIG_TDP_CONTROL

C-States

Enabled
Disabled

Enable processor idle power saving states

- Extend C-States

Enabled
Disabled

Enable C-State transitions to occur in combination with
P-States

- C3 State

Enabled
Disabled

Enable processor idle power saving C3 state

- C6 State

Enabled
Disabled

Enable processor idle power saving C6 state

- C6 Latency

Short
Long

Configure Short/Long latency

- C7 State Disabled
C7
C7s

Enable processor idle power saving C7 state

- C7 Latency

Short
Long

Configure Short/Long latency

- C-State Auto Demotion Disabled
C1
C3
C1 and C3

Configure C-State Auto Demotion

- C-State Auto UnDemotion Disabled
C1
C3
C1 and C3

Configure C-State Auto UnDemotion

- Package C-State Demotion

Disabled
Enabled

Enable/Disable Package C-State Demotion

- Package C-State UnDemotion

Disabled
Enabled

Enable/Disable Package C-State UnDemotion

- C-State Pre-Wake

Enabled
Disabled

Enable/Disable C-State Pre-Wake

87

COMe-bHL6 / BIOS Operation

Miscellaneous

Feature Options Description

S5 Eco

Disabled
Enabled

Enable/Disable Kontron S5 Eco mode. Reduces supply
current in Soft Of f (S5) to less than 1mA. If enabled,
power button is the only wake-up source in S5! See
chapter S5 Eco for further details

Smart Battery Conf iguration

Disabled
Auto
Charger
Manager

Enable/Disable Smart Battery Sys tem Support (e.g.
Kontron M.A.R.S.)

Reset Button Behavior

Chipset Reset
Power Cycle

Select the system behavior on reset button event

88

COMe-bHL6 / BIOS Operation

I2C Speed

Feature Options Description

I2C Speed

200

Select I2C Bus Speed in kHz from 1kHz to 400kHz

89

COMe-bHL6 / BIOS Operation

Watchdog

Feature Options Description

Auto-reload

Disabled
Enabled

Enable automatic reload of watchdog timers on timeout

Global Lock

Disabled
Enabled

If set to enabled, all Watchdog registers (except
WD_KICK) become read only until the board is reset

Stage 1 Mode

Disabled
Reset
NMI
SCI

Select Action for first Watchdog stage

- Assert WDT Signal

Enabled
Disabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 1 Timeout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for first watchdog stage

Stage 2 Mode

Disabled
Reset
NMI
SCI

Select Action for first Watchdog stage

- Assert WDT Signal

Disabled
Enabled

Enable/Disable assertion of WDT signal to baseboard on
stage timeout

- Stage 2 Timeout 1s
5s
10s
30s
1m
3m
10m
30m

Select Timeout value for second watchdog stage

90

COMe-bHL6 / BIOS Operation

Generic LPC Decode Ranges

Feature Options Description

Generic LPC Decode 1

Disabled
Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid
between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between
0800h - 0100h. Must be multiple of 8.

Generic LPC Decode 2

Disabled
Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid
between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between
0800h - 0100h. Must be multiple of 8.

Generic LPC Decode 3

Disabled
Enabled

Enable generic LPC decode range

- Base Address

0100h

Base address of the generic decode range. Valid
between 0100h - FFF0h. Must be 8-byte aligned

- Length

0008h

Length of the generic decode range. Valid between
0800h - 0100h. Must be multiple of 8.

91

COMe-bHL6 / BIOS Operation

H/W Monitor

Feature Value/Options Description

CPU Temperature xx°C Shows the measured temperature of the CPU Diode with

onboard HWM

PCH Temperature xx°C Shows the internal Platform Controller Hub temperature

Module Temperature xx°C Shows the internal hardware-monitor temperature

CPU FAN xxxx rpm Shows the fan speed of onboard FAN connector

Fan Pulse

2

Number of pulses the CPU fan produces during one
revolution. Range 1-4

FAN Control Disabled

Manual
Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

45

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

70

Manual fan speed in %. Minimum value is 30 (in Manual
mode only)

Trip Point Speed

50

Fan speed at trip point in %. Minimum value is 30. Fan
always runs at 100% at Tjmax - 10°C

Reference Temperature

CPU Temperature
PCH Temperature
Module Temperature

Determines the temperature source which is used for
automatic fan control

External FAN xxxx rpm Shows the fan speed of external COMe FAN

Fan Pulse

2

Select the number of pulses the external fan produces
during one revolution. Range 1-4

FAN Control Disabled

Manual
Auto

Set fan control mode. 'Disable' will totally stop the fan

Fan Trip Point

45

Temperature where fan accelerates. Range 20 - 80°C

Fan Speed

70

Manual fan speed in %. Minimum value is 30 (in Manual
mode only)

Trip Point Speed

50

Fan speed at trip point in %. Minimum value is 30. Fan
always runs at 100% at Tjmax - 10°C

92

COMe-bHL6 / BIOS Operation

Reference Temperature PCH Temperature

Module Temperature
CPU Temperature

Determines the temperature source which is used for
automatic fan control

Widerange Vcc x.xx V Shows the Module Main Input Voltage

5.0V Standby x.xx V Shows the 5V Standby Voltage input

Batt volt at COMe pin x.xx V Shows the RTC Batter y Voltage input measured at COMe

connector

93

COMe-bHL6 / BIOS Operation

HDD Configuration

Feature Options Description

SATA Device

Enabled
Disabled

Enable/Disable SATA Device

Interface Combination IDE

AHCI
RAID

Select the SATA controllers operation mode

Aggressive Link Power Disabled

Enabled

If enabled, turns on Aggressive Link Power Management
on all HDD ports

SATA Speed Gen1

Gen2
Gen3

Select the supported SATA speed mode

Port Enable

Enabled
Disabled

Enable or Disable SATA Port

Hot Plug

Disabled
Enabled

Designates this port as Hot Pluggable. Requires
hardware support

SATA Device Type

Hard Disk Drive
Solid State Drive

Identify the SATA port is connected to Solid State Drive
or Hard Disk Drive

94

COMe-bHL6 / BIOS Operation

Software Feature Mask Configuration

Feature Options Description

HDD Unlock

Enabled
Disabled

If enabled, indicates that the HDD password unlock in
the OS is enabled

LED Locate

Enabled
Disabled

If enabled, indicates that the LED/SGPIO hardware is
attached and ping to locate feature is enabled on the
OS

95

COMe-bHL6 / BIOS Operation

Memory Configuration

Feature Options Description

Memory Frequency Limiter

Auto
2067
1333
1600
1867
2133
2400
2667

Select the memory frequency in MHz

Max TOLUD

Dynamic
1 GB … 3.25GB

Maximum Value of TOLUD. Dynamic assignment would
adjust TOLUD automatically based on largest MMIO
length of installed graphic controller. Manual TOLUD
setting from 1GB to 3.25GB in 0.25GB steps

NMode Support

Auto
1N Mode
2N Mode

Select the memory supported Command Rate (N-Mode)

Channel A DIMM Control

Enabled
Disabled

Enables or disables DIMMs on channel A

Channel B DIMM Control

Enabled
Disabled

Enables or disables DIMMs on channel B

Memory Remap

Enabled
Disabled

Enable/Disable Memory Remap above 4GB

MRC FastBoot

Enabled
Disabled

Enable/Disable MRC FastBoot. Generally, this option
only takes effect when doing cold boots/resets

DIMM Profile

Default DIMM profile
XMP profile 1
XMP Profile 2

Select Intel Extreme Memory Profile XMP if suppor ted
by DIMM SPD

96

COMe-bHL6 / BIOS Operation

System Agent (SA) Configuration

Feature Options Description

CPU Audio Device (D0:D3:F0)

Enabled
Disabled

Enable/Disable CPU Audio Device

97

COMe-bHL6 / BIOS Operation

Intel® VT for Directed I/O (VT-d)

Feature Options Description

Intel® VT for Directed I/O (VT-d)

Enabled
Disabled

Enable/Disable Intel Virtualization Technology for
Directed I/O (VT-d) by reporting the I/O device
assignment to VMM through DMAR ACPI Tables

98

COMe-bHL6 / BIOS Operation

Graphics Configuration

99

COMe-bHL6 / BIOS Operation

Feature Options Description

Graphics Turbo IMON Current

31

Graphics turbo IMON current value supported (14-31)

Primary Display Selection IGD

PEG
PCI
Auto

Select the primary display device

Internal Graphics Disabled

Enabled

Auto

Enable/Disable the Internal Graphics Device. This has
no effect if external graphics are present

GTT Size 1MB

2MB

Select the GTT Memory Size of IGD

Aperture Size 128MB

256MB
512MB

Select the Graphics Aperture Size

DVMT Pre-Allocated

32MB
64MB
128MB

Select Pre-Allocated Graphics Memory size used by the
Internal Graphics device

DVMT Total Gfx Mem 128MB

256MB
Max

Select the maximum DVMT5.0 Graphics Memory Size

GFX Low Power Mode

Enabled
Disabled

Enable/Disable Gfx Low Power Mode

100