Kontron COMe-bHL6 User Manual

COMe-bHL6
Document Revision 111
www.kontron.com
» Table of Contents «
1 User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1.2 Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
2 Introduction........................................................................................8
2.1 Product Description...................................................................................................................... 8
2.2 Naming clarification..................................................................................................................... 8
2.3 Understanding COM Express® Functionality.......................................................................................9
2.4 COM Express® Documentation....................................................................................................... 10
2.5 COM Express® Benefits................................................................................................................ 10
3 Product Specification...........................................................................11
3.1 Module definition....................................................................................................................... 11
3.2 Functional Specification............................................................................................................... 12
3.3 Block Diagram............................................................................................................................ 21
3.4 Accessories............................................................................................................................... 22
3.5 Electrical Specification................................................................................................................ 23
3.5.1 Supply Voltage........................................................................................................................... 23
3.5.2 Power Supply Rise Time................................................................................................................ 23
3.5.3 Supply Voltage Ripple.................................................................................................................. 23
3.5.4 Power Consumption..................................................................................................................... 23
3.5.5 ATX Mode.................................................................................................................................. 24
3.5.6 Single Supply Mode..................................................................................................................... 24
3.6 Power Control............................................................................................................................ 25
3.7 Environmental Specification......................................................................................................... 26
3.7.1 Temperature Specification............................................................................................................ 26
3.7.2 Humidity................................................................................................................................... 26
3.8 Standards and Certifications.........................................................................................................27
3.9 MTBF........................................................................................................................................ 29
3.10 Mechanical Specification.............................................................................................................. 30
3.11 Module Dimensions..................................................................................................................... 31
3.12 Thermal Management, Heatspreader and Cooling Solutions.................................................................32
3.13 Onboard Connectors....................................................................................................................33
3.13.1 FAN Connector J6 - PCB bottom......................................................................................................33
3.13.2 CPU JTAG connector J3 - PCB bottom............................................................................................... 34
3.13.3 CPLD Debug connector J7 - PCB top................................................................................................. 34
4 Features and Interfaces.......................................................................35
4.1 S5 Eco Mode.............................................................................................................................. 35
www.kontron.com
COMe-bHL6 /
4.2 Rapid Shutdown......................................................................................................................... 36
4.3 LPC.......................................................................................................................................... 38
4.4 Serial Peripheral Interface (SPI)....................................................................................................39
4.5 SPI boot.................................................................................................................................... 39
4.6 M.A.R.S..................................................................................................................................... 41
4.7 UART........................................................................................................................................ 42
4.8 Fast I2C.................................................................................................................................... 43
4.10 Intel® Fast Flash Standby™ / Rapid Start Technology™....................................................................... 45
4.11 Speedstep Technology.................................................................................................................. 47
4.12 C-States.................................................................................................................................... 48
4.13 Hyper Threading......................................................................................................................... 49
4.14 Dynamic FSB Frequency Switching.................................................................................................. 50
4.15 VID-x........................................................................................................................................ 51
4.16 Intel® Turbo Boost Technology and AVX...........................................................................................52
4.17 Display Configuration.................................................................................................................. 53
4.18 Hybrid Graphics / Multi-monitor.................................................................................................... 56
4.19 Intel® Wireless Display................................................................................................................ 57
4.20 Intel® vPro™ technology.............................................................................................................. 59
4.21 ACPI Suspend Modes and Resume Events..........................................................................................60
5 System Resources................................................................................61
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 61
5.2 Memory Area............................................................................................................................. 62
5.3 I/O Address Map......................................................................................................................... 62
5.4 Peripheral Component Interconnect (PCI) Devices............................................................................. 63
5.5 Internal I2C Bus......................................................................................................................... 63
5.6 External I2C Bus......................................................................................................................... 63
6 Connectors........................................................................................65
6.1 Connector Location..................................................................................................................... 65
7 Pinout List.........................................................................................66
7.1 General Signal Description............................................................................................................ 66
7.2 Connector X1A Row A................................................................................................................... 67
7.3 Connector X1A Row B................................................................................................................... 69
7.4 Connector X1B Row C................................................................................................................... 71
7.5 Connector X1B Row D................................................................................................................... 73
8 BIOS Operation...................................................................................75
8.1 Determining the BIOS Version........................................................................................................75
8.2 BIOS Update.............................................................................................................................. 75
8.3 POST Codes................................................................................................................................ 75
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COMe-bHL6 / User Information
8.4 Setup Guide............................................................................................................................... 75
8.5 BIOS Setup................................................................................................................................ 76
8.5.1 Main........................................................................................................................................ 76
8.5.2 Advanced.................................................................................................................................. 83
8.5.3 Security.................................................................................................................................. 125
8.5.4 Boot....................................................................................................................................... 127
8.5.5 Exit........................................................................................................................................ 128
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COMe-bHL6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.
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COMe-bHL6 / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.
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COMe-bHL6 / Introduction

2 Introduction

2.1 Product Description

The brand new application-ready COMe-bHL6 offers increased performance density and up to twice the graphics performance compared to its predecessors. Up to three independent, daisy-chained displays with up to 4K resolution are supported to create stunning user experiences. Further to this, DirectX® 11.1 and OpenGL 4.0 support paves the way for compelling visuals when videos, graphics and interactive content are being displayed. By integrating the new Intel® AVX2 and OpenCL 1.2, Kontron’s new Computer-on-Modules additionally not only provide an increase in floating-point performance they also possess improved parallel processing capacities. Typical application areas can be found in markets such as digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as industrial plant and machine line control on shop floor- and control room-level.
Engineers can immediately commence with evaluating these new benchmark Computer-on-Modules on all Kontron COM Express® pin-out type 6-compliant starter kits.
The Kontron COM Express® pin-out type 6 COMe-bHL6 module is available in several different variants ranging from the cost-optimized low-power processor versions up to quad-core Intel® Core™ i7 processors with up to 4x 2.4 GHz. The modules are designed with the Intel® Mobile QM87 chipset, host up to 16 GB DDR3L RAM and support 7 PCI Express x1 lanes and 1 PEG x16 interface which is also compatible to standard PCI Express devices. Less complex peripherals can be connected via SPI and LPC. Additional dedicated features include 3x SATA 6Gb/s ports, 1 SATA 3Gb/s port, as well as Gigabit Ethernet, 4 USB 3.0 ports, 4 USB 2.0 and 2 serial ports. The Kontron COMe-bHL6 features comprehensive display support with 3x dual mode DisplayPort++ which can also output, HDMI, DVI and DisplayPort 1.2. Industrial applications benefit from the watchdog and real-time clock. The module supports an 8.5-20V wide-range power supply. The support of smart batteries via MARS and the standardized embedded application programming interface EAPI round off the feature set and provide engineers with a comprehensive service package that eases system development as well as system programming.
For customers wanting to instantly leverage the new graphics and computing power in their existing designs based on individual carrier boards, Kontron also offers standardized migration support services to accelerate the design-in phase and thus achieve fastest field deployment.
The Kontron COM Express® basic Computer-on-Module COMe-bHL6 supports the full Windows OS portfolio along with Linux and VxWorks.

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.
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COMe-bHL6 / Introduction

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO shared w/GPIO
1x optional 1x optional - 1x optional
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
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COMe-bHL6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-bHL6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can differentiate products at various price/performance points, or when designing future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
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COMe-bHL6 / Product Specification

3 Product Specification

3.1 Module definition

The COM Express® basic sized Computer-on-Module COMe-bHL6 (BHL6 / BBL6) follows pin-out Type 6 and is compatible to PICMG specification COM.0 Rev 2.1. The COMe-bHL6 based on latest Shark Bay Mobile platform is available in different variants to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G
38025-0000-18-7 COMe-bHL6 i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1
38025-0000-16-7 COMe-bHL6 i7-4850EQ Intel® Core™ i7-4850EQ 47W QM87 4 3 1
38025-0000-24-7 COMe-bHL6 i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1
38025-0000-29-5 COMe-bHL6 i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1
38025-0000-27-5 COMe-bHL6 i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1
38025-0000-18-5 COMe-bHL6 i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1
38025-0000-16-5 COMe-bHL6 i5-4402E Intel® Core™ i5-4402E 25W QM87 4 3 1
38025-0000-26-3 COMe-bHL6 i3-4110E Intel® Core™ i3-4110E 37W HM86 2 2 2
38025-0000-24-3 COMe-bHL6 i3-4100E Intel® Core™ i3-4100E 37W HM86 2 2 2
38025-0000-18-3 COMe-bHL6 i3-4112E Intel® Core™ i3-4112E 25W HM86 2 2 2
38025-0000-16-3 COMe-bHL6 i3-4102E Intel® Core™ i3-4102E 25W HM86 2 2 2
38025-0000-22-1 COMe-bHL6 2000E Intel® Celeron 2000E 37W HM86 2 2 2
38025-0000-15-1 COMe-bHL6 2002E Intel® Celeron 2002E 25W HM86 2 2 2
Extended temperature grade modules (E1, -25°C to 75°C operating) and
Industrial temperature grade modules (XT, -40°C to 85°C operating)
The COMe-bHL6 is available for extended and industrial temperature range. General capability was tested for following options:
» CPU: all
» Memory: E2 DDR3L memory only 97015-xxxx-16-3
» VCC: 12V only, no support for Wide-Range Input
The RXT product line includes modules with following featureset:
» industrial grade temperature range (-40 to +85°C) by screening
» ECC Memory support (97016-xxxx-16-3)
» Kontron Rapid Shutdown support
Product Number Product Name Processor TDP PCH USB 3.0 SATA 6G SATA 3G
38026-0000-18-7 COMe-bHL6RXT i7-4860EQ Intel® Core™ i7-4860EQ 47W QM87 4 3 1
38026-0000-24-7 COMe-bHL6RXT i7-4700EQ Intel® Core™ i7-4700EQ 47W/37W QM87 4 3 1
38026-0000-29-5 COMe-bHL6RXT i5-4410E Intel® Core™ i5-4410E 37W QM87 4 3 1
38026-0000-27-5 COMe-bHL6RXT i5-4400E Intel® Core™ i5-4400E 37W QM87 4 3 1
38026-0000-18-5 COMe-bHL6RXT i5-4422E Intel® Core™ i5-4422E 25W QM87 4 3 1
Please contact your local sales for further information and MOQ for RXT modules
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COMe-bHL6 / Product Specification

3.2 Functional Specification

Processor

The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell-H (Halo) / Crystal Well) CPU family with
37.5x32mm package size (BGA1364 socket) supports:
» Intel® Turbo Boost Technology 2.01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory Access
» Intel® Flex Memory Access
» Integrated Intel® HD Graphics with Dynamic Frequency
Optional available (with customized BIOS, Evaluation Copy on request):
» Intel® vPRO™ Technology including:
» Intel® Active Management Technology (AMT)
» Intel® Trusted Execution Technology (TXT)
» Advanced Encryption Standard Instructions (AES-NI)
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COMe-bHL6 / Product Specification
The integrated Intel® HD Graphics 5200/4600 supports:
» GraphicsTechnology GT3 with 40 Execution Units (HD5200)
» GraphicsTechnology GT2 with 20 Execution Units (HD4600)
» Intel® Quick Sync Video
» Intel® InTru™ 3D Technology
» Intel® Wireless Display
» Intel® Flexible Display Interface (Intel® FDI)
» Intel® Clear Video HD Technology
» Intel® Graphics Render C-State RC6
» Intel® Smart 2D Display Technology (S2DDT)
» 3 simultaneous displays (Win7/8 and Linux)
» Hybrid Multi Monitor with 2 internal and 2 external displays
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback (incl. PAVP)
The integrated Intel® HD Graphics supports:
» GraphicsTechnology GT1 with 10 Execution Units
» Dual Display
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback (incl. PAVP)
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COMe-bHL6 / Product Specification

CPU Features

Intel® Core™ Core™ Core™ Core™ Core™ Core™ Core™ Celeron@ Celeron@
- i7-4860EQ i7-4850EQ i7-4700EQ i5-4400E i5-4402E i3-4100E i3-4102E 2000E 2002E
# of Cores 4 4 4 2 2 2 2 2 2
# of Threads 8 8 8 4 4 4 4 2 2
TDP Core frequency (HFM)
1800MHz 1600MHz 2400MHz 2700MHz 1600MHz 2400MHz 1600MHz 2200MHz 1500MHz
Max Turbo Frequency 1 core 3200MHz 3200MHz 3400MHz 3300MHz 2700MHz - - - -
Max Turbo all cores 2600MHz 2600MHz 2800MHz 3200MHz 2600MHz - - - -
LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz
Bus/Core Ratio 8 - 20 8 - 16 8 - 24 8 - 27 8 - 16 8 - 24 8 - 16 8 - 22 8 - 15
TjMax 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C 100°C
Thermal Design Power (TDP/PL1)
47W 47W 47W 37W 25W 37W 25W 37W 25W
cTDP-Down - - 37W - - - - - -
cTDP-Down Core frequency - -
1700MHz
- - - - - -
Power Limit 2 (PL2 max) 58.75W 58.75W 58.75/46.25W 46.25W 31.25W 46.25W 31.25W 46.25W 31.25W
C-States C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7 C0-C7
eDRAM 128MB
1.6GHz
128MB
1.6GHz
- - - - - - -
Smart Cache 6MB 6MB 6MB 3MB 3MB 3MB 3MB 2MB 2MB
Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066
Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600
Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB 2x8GB
# of Memory Channels 2 2 2 2 2 2 2 2 2
Graphics Model Iris Pro 5200 Iris Pro 5200 HD4600 HD4600 HD4600 HD4600 HD4600 HD HD
GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz
GFX Base Frequency 650MHz 750MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz 400MHz
GFX Turbo Frequency 1000MHz 1000MHz 1000MHz 1000MHz 900MHz 900MHz 900MHz 900MHz 900MHz
GFX Technology GT3e 40EU GT3e 40EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT2 20EU GT1 10EU GT1 10EU
GFX Func/Phys Cores 3/3 3/3 2/2 2/2 2/2 2/2 2/2 1/2 1/2
Quick Sync Video Yes Yes Yes Yes Yes Yes Yes - -
InTru™ 3D Yes Yes Yes Yes Yes Yes Yes - -
Wireless Display Yes Yes Yes Yes Yes Yes Yes - -
Clear Video HD Yes Yes Yes Yes Yes Yes Yes - -
vPRO™ (optional) Yes Yes Yes Yes Yes - - - -
TXT (optional) Yes Yes Yes Yes Yes - - - -
AES-NI (optional) Yes Yes Yes Yes Yes - - - -
VT-x Yes Yes Yes Yes Yes - - - -
VT-d Yes Yes Yes Yes Yes - - - -
PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0 Gen 2.0 Gen 2.0
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COMe-bHL6 / Product Specification
Intel® Core™ Core™ Core™ Core™
- i5-4410E i5-4422E i3-4110E i3-4112E
# of Cores 2 2 2 2
# of Threads 4 4 4 4
TDP Core frequency (HFM)
2900MHz 1800MHz 2600MHz 1800MHz
Max Turbo Frequency 1 core Note 1 2900MHz - -
Max Turbo all cores Note 1 2800MHz - -
LFM/LPM Frequency 800MHz 800MHz 800MHz 800MHz
Bus/Core Ratio 8 - 29 8 - 16 8 - 24 8 - 16
TjMax 100°C 100°C 100°C 100°C
Thermal Design Power (TDP/PL1)
37W 25W 37W 25W
cTDP-Down - - - -
cTDP-Down Core frequency - - - -
Power Limit 2 (PL2 max) 46.25W 31.25W 46.25W 31.25W
C-States C0-C7 C0-C7 C0-C7 C0-C7
eDRAM - - - -
Smart Cache 3MB 3MB 3MB 3MB
Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066
Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1600
Max Memory Size 2x8GB 2x8GB 2x8GB 2x8GB
# of Memory Channels 2 2 2 2
Graphics Model HD4600 HD4600 HD4600 HD4600
GFX LFM Frequency 200MHz 200MHz 200MHz 200MHz
GFX Base Frequency 400MHz 400MHz 400MHz 400MHz
GFX Turbo Frequency 1000MHz 900MHz 900MHz 900MHz
GFX Technology GT2 20EU GT2 20EU GT2 20EU GT2 20EU
GFX Func/Phys Cores 2/2 2/2 2/2 2/2
Quick Sync Video Yes Yes Yes Yes
InTru™ 3D Yes Yes Yes Yes
Wireless Display Yes Yes Yes Yes
Clear Video HD Yes Yes Yes Yes
vPRO™ (optional) Yes Yes - -
TXT (optional) Yes Yes - -
AES-NI (optional) Yes Yes Yes Yes
VT-x Yes Yes Yes Yes
VT-d Yes Yes - -
PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0
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COMe-bHL6 / Product Specification

Memory

Sockets
2x DDR3 SO-DIMM
Memory Type
DDR3L-1600 (ECC on RXT Ver.)
Maximum Size
2x8GB
Technology
Dual Channel

Chipset

The 32nm Intel® 8-Series Platform Controller Hub Lynx Point supports:
» PCI Express Revision 2.0
» PCI Express Configurations x1, x2, x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® Active Management Technology 9.0 (optional)
» Intel® Anti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
PCH comparison
Feature QM87 HM86
TDP 2.7W 2.7W
USB 3.0 (USB 2.0 compatible) YES (4x on COMe) YES (2x on COMe)
USB 2.0 YES (4x on COMe) YES (6x on COMe)
SATA 6Gb/s (Gen3) YES (3x on COMe) YES (2x on COMe)
SATA 3Gb/s (Gen2) YES (1x on COMe) YES (2x on COMe)
Wireless Display YES YES
3 Displays simultaneously YES YES
Rapid Storage AHCI, RAID 0/1/5/10 AHCI only
VT-d YES NO
vPRO YES with custom BIOS NO
AMT YES with custom BIOS NO
TXT YES with custom BIOS NO
The Intel® vPro Technology including Trusted Execution Technology (TXT), Active Management Technology (AMT) and Encryption AES-NI is not supported by default on COMe-bHL6. Please contact your local sales or support for custom BIOS variants supporting vPro.
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COMe-bHL6 / Product Specification
HighSpeed I/O Port Configuration
- QM87 I/O HM86 I/O COMe-bHL6 with QM87 COMe-bHL6 with HM86
Port1
USB3 #1 USB3 #1 USB #0 = USB3.0 USB #0 = USB3.0
Port2
USB3 #2 USB3 #2 USB #1 = USB3.0 USB #1 = USB3.0
Port3
USB3 #5 - USB #2 = USB3.0 -
Port4
USB3 #6 - USB #3 = USB3.0 -
-
USB2 USB2 USB #4-7 = USB 2.0 USB #2-7 = USB 2.0
Port5
USB3 #3 or PCIe #1 USB3 #3 or PCIe #1 PCIe #0 PCIe #0
Port6
USB3 #4 or PCIe #2 USB3 #4 or PCIe #2 PCIe #1 PCIe #1
Port7
PCIe #3 PCIe #3 PCIe #2 PCIe #2
Port8
PCIe #4 PCIe #4 PCIe #3 PCIe #3
Port9
PCIe #5 PCIe #5 PCIe #4 PCIe #4
Port10
PCIe #6 PCIe #6 PCIe #5 PCIe #5
Port11
PCIe #7 PCIe #7 PCIe #6 PCIe #6
Port12
PCIe #8 PCIe #8 LAN/PCIe #7 LAN/PCIe #7
Port13
SATA3 #4 or PCIe #1 SATA3 #4 SATA #0 = SATA 6Gb/s SATA #0 = SATA 6Gb/s
Port14
SATA3 #5 or PCIe #2 SATA3 #5 SATA #1 = SATA 6Gb/s SATA #1 = SATA 6Gb/s
Port15
SATA3 #0 SATA2 #0 SATA #2 = SATA 6Gb/s SATA #2 = SATA 3Gb/s
Port16
SATA3 #1 - - -
Port17
SATA2 #2 SATA2 #2 SATA #3 = SATA 3Gb/s SATA #3 = SATA 3Gb/s
Port18
SATA2 #3 - - -

Graphics Core

The integrated Intel® HD/HD4600/HD5200 (Gen7.5) supports:
Graphics Core Render Clock
GT1/GT2/GT3; Base clock: 400/200 MHz; GT Turbo: up to 1000 MHz
Execution Units / Pixel Pipelines
GT3: 40EU / GT2: 20EU / GT1: 10EU
Max Graphics Memory
1720MB
GFX Memory Bandwidth (GB/s)
25.6
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
11.1 / 4.0 + OCL 1.2
Shader Model
5.0
Hardware accelerated Video
MPEG2, VC-1, AVC, Blu-ray (+3D)
Independent/Simultaneous Displays
3
Display Port
DP 1.2 / eDP 1.3
HDCP support
HDCP 1.4a
Monitor output
CRT max Resolution
1920x1200
TV out:
-
LVDS
LVDS Bits/Pixel
1x18/24, 2x18/24 with DP2LVDS
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
1920x1200
PWM Backlight Control:
YES
Supported Panel Data:
JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics
1x PEG 3.0/2.0
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
DP++
Digital Display Interface DDI3
DP++
Maximum Resolution on DDI
HDMI: 4096x2304, DP: 3840x2160
17
COMe-bHL6 / Product Specification
PEG Configuration
The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or RAID controllers. The COMe-bHL6 supports following PEG Port configuration when used as PCI Express Interface:
» 1×16
» 1×8
» 1×4
» 1×2
» 1×1
The internal PCI Express controller can be re-configured to support up to 3 PCIe ports on PEG16 interface. The PEG lane splitting is configurable in setup:
» 1×16 (lanes #0-15)
» 2×8 (lanes #0-7 + #8-15)
» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)
With splitted ports, Port2 (#8-15 or #8-11) and Port3 (#12-15) cannot have more lanes active as Port1 (#0-7) has

Storage

onboard SSD
-
SD Card support
-
IDE Interface
-
Serial-ATA
up to 3x SATA 6Gb/s, 1x SATA 3Gb/s
SATA AHCI
NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
SATA RAID
0, 1, 5, 10 (QM87 only)
If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer rate and Staggered Spin-Up. To configure a RAID Setup connect at least two hard drives and enable RAID support in BIOS Advanced/HDD Settings. After reboot, setup your RAID configuration in the new setup item “Addon Devices”
18
COMe-bHL6 / Product Specification

Connectivity

USB 2.0
8x USB 2.0
USB 3.0
up to 4x USB 3.0
USB Client
-
PCI
-
PCI External Masters
-
PCI Express
7x PCIe x1 Gen 2.0
Max PCI Express
8x PCIe without LAN
PCI Express x2/x4 configuration
YES (Softstrap option)
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® i218-LM (Clarkville)
PCI Express Configuration
By default, the COMe-bHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4 configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5 Port #6 Port #7*
Configuration 0 x1 x1 x1 x1 x1 x1 x1 x1
Configuration 1 x2 x1 x1 x1 x1 x1 x1
Configuration 2 x2 x2 x1 x1 x1 x1
Configuration 3 x2 x2 x2 x1 x1
Configuration 4 x2 x2 x2 x2
Configuration 5 x4 x1 x1 x1 x1
Configuration 6 x4 x2 x1 x1
Configuration 7 x4 x2 x2
Configuration 8 x4 x4
- *PCIe Port #7 is available without Ethernet Controller only
- Configuration 0 is the default setting
- Configuration 3 & Configuration 5 are available in UEFI download package on EMD Customer Section
Ethernet
The Intel® i218-LM (Clarkville) ethernet supports:
» Jumbo Frames - 9K
» MACsec IEEE 802.1 AE
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
» IEEE1588

Misc Interfaces and Features

Supported BIOS Size/Type
16MB SPI
Audio
HD Audio + DisplayPort dual stream
Onboard Hardware Monitor
Nuvoton NCT7802Y
Trusted Platform Module
Atmel AT97SC3204-U2A1A-10
Miscellaneous
2x UART / PWM FAN / eDP optional
19
COMe-bHL6 / Product Specification

Kontron Features

External I2C Bus
Fast I2C, MultiMaster capable
Smart Battery (M.A.R.S.) support
YES
Embedded API
KEAPI3
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged

Additional features

» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability

Power Features

Singly Supply Support
YES
Supply Voltage
8.5V - 20V
ACPI
ACPI 4.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
cTDP @ i7-4700EQ

Power Consumption and Performance

Full Load Power Consumption
17 - 48W
Kontron Performance Index
32645 - 100815
Kontron Performance/Watt
1723 - 3105
Detailed Power Consumption measurements and benchmarks for CPU, Graphics and Memory are available in Application Note KEMAP054 at EMD Customer Section.
20
COMe-bHL6 / Product Specification

3.3 Block Diagram

21
SMB
GPIO
Ctrl
Mgmt
LPC HDA VGA SATA#0-3
SPI
Intel® 8-Series PCH
QM87/HM86
GPIO
PCIe #6
PEG x16
USB #0-3
(USB3.0)
PwrCtrl
SysMgmt
RTC
PCIe #7
USB #0-3
(USB2.0)
PWM FAN2
I2C
SER0 SER1
eDP x2
USB #4-7
(USB 2.0)
PCIe #0-5
Intel® 4th Generation Core
LID
Sleep
SPI
BIOS Flash
LVDS
Connector Option
Standard
component
GB LAN
Embedded Controller
(CPLD EPM1270)
HWM
NCT7802
Gen7.5
iGFX
FAN1
xHCI
EHCI2
eDP2LVDS
NXP3460
COM Express® connector AB – Pin-out Type 6
GBLan
Intel® I218LM
VCC
5VSB
VBAT
HWM
SMB
Power sequencing
Watchdog
LPC2I2C GPIO Buffer
I2C
S5eco
EEPROM
TPM
UART
COM Express® connector CD – Pin-out Type 6
DDR3L SODIMM DDL3L SODIMM ECC
VCC
DDR3L SODIMM DDR3L SODIMM ECC
EHCI1
DP++
CONFIG
x16/x8/x4
PEG Config
CPLD
JTAG
SPD
GBE MAC
COMe-bHL6 / Product Specification

3.4 Accessories

Product specific accessories
Product Number Heatspreader and Cooling Solutions Comment
38025-0000-99-2 HSP COMe-bHL6 heatpipe thread For all CPUs and temperature grades
38025-0000-99-3 HSP COMe-bHL6 heatpipe through For all CPUs and temperature grades
38025-0000-99-0C05 HSK COMe-bHL6 active (w/o HSP) For all CPUs and commercial temperature grade usage
38025-0000-99-0C06 HSK COMe-bHL6 passive (w/o HSP) For all CPUs and commercial temperature grade usage
General accessories
Part Number COMe pin-out Type 6 compatible accessories Project Code Comment
38114-0000-00-0 COM Express® Reference Carrier Type 6 ADAS mITX Carrier with 8mm COMe connector
38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga Canyon ATX Carrier with 5mm COMe connector
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x DisplayPor t
96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
38106-0000-00-S COMe Eval Star terkit T6 Topanga Canyon Starterkit with COMe Evaluation Carrier T6
38114-0000-00-S COMe Ref. Starterkit T6 ADAS Starterkit with COMe Reference Carrier T6
Part Number Mounting Comment
38017-0000-00-5 COMe Mount KIT 5mm 1set Mounting Kit for 1 module including screws for 5mm connectors
38017-0100-00-5 COMe Mount KIT 5mm 100sets Mounting Kit for 100 modules including screws for 5mm connectors
38017-0000-00-0 COMe Mount KIT 8mm 1set Mounting Kit for 1 module including screws for 8mm connectors
38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm connectors
Part Number Cooling Solutions Comment
36099-0000-99-0 COMe Active Uni Cooler for CPUs up to 20W TDP, to be mounted on HSP
36099-0000-99-1 COMe Passive Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP
Part Number Display Adapter Comment
9-5000-0352 ADA-LVDS-DVI 18bit LVDS to DVI converter
9-5000-0353 ADA-LVDS-DVI 24bit LVDS to DVI converter
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Comment
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module (COMe basic/compact)
96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to module (COMe basic/compact)
Part Number Miscellaneous Comment
18029-0000-00-0 MARS Smart Battery Kit Starterkit Kontron Mobile Application platform for Rechargeable Systems
For COMe-bHL6 standard (38025-xxxx-xx-x)
Part Number DDR3L SODIMM, commercial temperature grade
97015-1024-16-1 DDR3L-1600 SODIMM 1GB
97015-2048-16-1 DDR3L-1600 SODIMM 2GB
97015-4096-16-1 DDR3L-1600 SODIMM 4GB
97015-8192-16-1 DDR3L-1600 SODIMM 8GB
Part Number DDR3L SODIMM, industrial temperature grade
97015-1024-16-3 DDR3L-1600 SODIMM 1GB E2
97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2
97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2
97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2
For COMe-bHL6RXT (38026-xxxx-xx-x)
Part Number DDR3L ECC SODIMM, industrial temperature grade
97016-1024-16-3 DDR3L-1600 SODIMM 1GB ECC E2
97016-2048-16-3 DDR3L-1600 SODIMM 2GB ECC E2
97016-4096-16-3 DDR3L-1600 SODIMM 4GB ECC E2
97016-8192-16-3 DDR3L-1600 SODIMM 8GB ECC E2
22
COMe-bHL6 / Product Specification

3.5 Electrical Specification

3.5.1 Supply Voltage

Following supply voltage is specified at the COM Express® connector:
VCC:
8.5V - 20V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only

3.5.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification

3.5.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.5.4 Power Consumption

The maximum Power Consumption of the different COMe-bHL6 variants is 17 - 48W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on
EMD Customer Section. Information there is available after registration.
23
COMe-bHL6 / Product Specification

3.5.5 ATX Mode

By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 8.5V - 20V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 PWRBTN Event low high 5V high low 0 V VCC
S0 high high 5V low VCC

3.5.6 Single Supply Mode

In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 8.5V - 20V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
24
COMe-bHL6 / Product Specification

3.6 Power Control

Power Supply

The COMe-bHL6 supports a power input from 8.5V - 20V. The supply voltage is applied through the VCC pins (VCC) of the module connector.

Power Button (PWRBTN#)

The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).

Power Good (PWR_OK)

The COMe-bHL6 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.

Reset Button (SYS_RESET#)

The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically

SM-Bus Alert (SMB_ALERT#)

With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-bHL6 / Product Specification

3.7 Environmental Specification

3.7.1 Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the COMe-bHL6
Temperature Specification Operating Non-operating Validated Input Voltage
Commercial grade 0°C to +60°C -30°C to +85°C VCC: 8.5V - 20V
Extended Temperature (E1) -25°C to +75°C -30°C to +85°C VCC: 12V
Industrial grade by Screening (XT)
-40°C to +85°C -40°C to +85°C VCC: 12V
Industrial grade by Design (E2)
-40°C to +85°C -40°C to +85°C VCC: 8.5V - 20V
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade Validation requirements
Commercial grade at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1) at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.7.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
26
COMe-bHL6 / Product Specification

3.8 Standards and Certifications

RoHS II

The COMe-bHL6 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances
(RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The COM Express® basic form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.
27
COMe-bHL6 / Product Specification

Shock & Vibration

The COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-bHL6 follows the requirements for electromagnetic
compatibility standards
» EN55022
28
COMe-bHL6 / Product Specification

3.9 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts. The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in. Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 215836 @ 40°C (w/PCB)
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.
29
COMe-bHL6 / Product Specification

3.10 Mechanical Specification

Dimension

» 95.0 mm x 125.0 mm
» Height approx. 12mm (0.4”)
CAD drawings are available at EMD CustomerSection

Height

The COM Express® specification defines a module height of 13mm from module PCB bottom to heatspreader top:
Cooling solutions provided from Kontron Europe GmbH for basic sized Computer-on-Modules are 27mm in height from module bottom to Heatsink top.
Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of
27.3mm from module bottom to Heatsink top.
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