Kontron User's Guide
COMe-bCD2
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Table of Contents
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Table of Contents
1 User Information ........................................................................................................ 6
1.1 About This Manual ............................................................................................. 6
1.2 Copyright Notice ............................................................................................... 6
1.3 Trademarks ...................................................................................................... 6
1.4 Standards ........................................................................................................ 6
1.5 Warranty ......................................................................................................... 6
1.6 Technical Support .............................................................................................. 7
2 Introduction .............................................................................................................. 8
2.1 COMe-bCD2 ...................................................................................................... 8
2.2 COMe-bCD2 Release Versions ............................................................................... 9
2.2.1 Single Channel Version ....................................................................................... 9
2.2.2 Dual Channel Version ......................................................................................... 9
2.3 COMe-bCD2 Module Overview ............................................................................... 9
2.4 Understanding COM Express® functionality .......................................................... 11
2.5 COM Express® Documentation ........................................................................... 11
2.6 COM Express® Benefits ..................................................................................... 12
3 Specifications ........................................................................................................... 13
3.1 Functional Specifications .................................................................................. 13
3.1.1 Block diagram ................................................................................................ 16
3.2 Mechanical Specifications ................................................................................. 17
3.3 Electrical Specifications .................................................................................... 17
3.3.1 Power Consumption ......................................................................................... 17
3.4 Environmental Specifications ............................................................................ 18
3.4.1 Temperature ................................................................................................... 18
3.4.2 Humidity ....................................................................................................... 18
3.5 MTBF ............................................................................................................. 18
4 Connector Pinouts ..................................................................................................... 19
4.1 Connector location .......................................................................................... 19
4.2 Pinout tables .................................................................................................. 20
4.2.1 Connector X1A ................................................................................................ 21
4.2.2 Connector X1B ................................................................................................ 25
4.3 Signal description ........................................................................................... 29
4.3.1 PCIexpress x1 lanes ......................................................................................... 29
4.3.2 USB .............................................................................................................. 29
4.3.3 SATA ............................................................................................................. 29
4.3.4 Audio ............................................................................................................ 29
4.3.5 Serial IRQ ...................................................................................................... 29
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4.3.6 VGA Output .................................................................................................... 29
4.3.7 LVDS Flat Panel Interface (JILI) .......................................................................... 30
4.3.8 Digital Flat Panel Interface (JIDI) ....................................................................... 30
4.3.9 Ethernet ........................................................................................................ 30
4.3.10 Power Control ................................................................................................. 31
4.3.11 Power Management ......................................................................................... 31
4.3.12 Miscellaneous Circuits ...................................................................................... 31
4.3.13 PCIexpress Graphics ......................................................................................... 32
4.3.14 PCI Bus .......................................................................................................... 32
4.3.15 IDE Port ......................................................................................................... 32
4.3.16 SDVO Output................................................................................................... 32
5 Special Features ........................................................................................................ 34
5.1 Watchdog Timer .............................................................................................. 34
5.2 General Purpose Input and Output ...................................................................... 34
6 Important Information ............................................................................................... 35
6.1 Cooling Solutions ............................................................................................ 35
7 Design Considerations ................................................................................................ 36
7.1 Thermal Management ....................................................................................... 36
7.2 COMe-bCD2 onboard Fan connector..................................................................... 37
7.2.1 Location and pinout of fan connector J4 .............................................................. 38
7.2.2 BIOS settings for fan control ............................................................................. 39
7.2.3 Electrical Characteristics ................................................................................... 39
8 Important Technology Information .............................................................................. 41
8.1 I/O APIC mode ................................................................................................ 41
8.1.1 Method of interrupts transmission ...................................................................... 41
8.1.2 Interrupt priority ............................................................................................ 41
8.1.3 More interrupts ............................................................................................... 41
8.2 Thermal Monitor and Catastrophic Thermal Protection ............................................ 41
8.2.1 Summary ....................................................................................................... 42
8.3 Processor Performance Control .......................................................................... 42
8.4 Thermal Management ....................................................................................... 43
9 System Ressources .................................................................................................... 44
9.1 Interrupt Request (IRQ) Lines ............................................................................ 44
9.2 Direct Memory Access (DMA) Channels ................................................................. 45
9.3 Memory Area .................................................................................................. 46
9.4 I/O Address Map ............................................................................................. 46
9.5 Peripheeral Component Interconnect (PCI) Devices ................................................ 46
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9.6 Inter IC (I2C) Bus ............................................................................................. 46
9.7 System Managment (SM) Bus ............................................................................. 47
9.8 JILI I2C Bus .................................................................................................... 47
10 BIOS Operation.......................................................................................................... 48
10.1 Determining the BIOS Version ............................................................................ 48
10.2 Setup Guide ................................................................................................... 48
10.2.1 Start Phoenix BIOS Setup Utility ......................................................................... 48
11 BIOS Setup ............................................................................................................... 50
11.1 Info Screen .................................................................................................... 50
11.2 Main Menu ..................................................................................................... 50
11.2.1 IDE Channels Submenu ..................................................................................... 51
11.3 Advanced ....................................................................................................... 52
11.3.1 Keyboard Features Submenu .............................................................................. 53
11.3.2 Cache Memory Submenu ................................................................................... 54
11.3.3 Hardware Monitor Submenu .............................................................................. 56
11.3.4 Watchdog Settings Submenu ............................................................................. 57
11.3.5 Miscellaneous Submenu.................................................................................... 58
11.3.6 Console Redirection Submenu ............................................................................ 59
11.4 Devices ......................................................................................................... 60
11.4.1 CPU Control .................................................................................................... 61
11.5 Chipset Control ............................................................................................... 65
11.6 Integrated Video ............................................................................................. 67
11.6.1 Display Control ............................................................................................... 68
11.7 Chipset Integrated Devices ................................................................................ 68
11.7.1 PCI Express Ports ............................................................................................. 70
11.7.2 PCI/PNP ISA IRQ Ressource Exclusion .................................................................. 71
11.7.3 USB Ports ...................................................................................................... 72
11.8 LAN Options ................................................................................................... 73
11.9 SIO Options .................................................................................................... 74
11.10 Security ......................................................................................................... 76
11.11 Power ........................................................................................................... 77
11.11.1 ACPI Parameter Control .................................................................................... 78
11.12 Boot ............................................................................................................. 79
11.13 Exit .............................................................................................................. 80
1 User Information
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1 User Information
1.1 About This Manual
This document provides information about products from Kontron Embedded Modules GmbH and/or its
subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is
supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-20012 Kontron Embedded Modules GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language or computer language, in any form or by any means
(electronic, mechanical, photocopying, recording, or otherwise), without the express written permission
of Kontron Embedded Modules GmbH.
DIMM-PC®, PISA®, ETX®, COM Express® , X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered
trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business
Machines Corp.
Microsoft is a registered trademark of Microsoft Corp.
Intel is a registered trademark of Intel Corp.
All other products and trademarks mentioned in this manual are trademarks of their
respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
1.5 Warranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During the warranty period, Kontron
Embedded Modules GmbH will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are
observed.
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The warranty does not apply to defects resulting from improper or inadequate maintenance or handling
by the buyer, unauthorized modification or misuse, operation outside of the product‟s environmental
specifications or improper installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products
not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded
Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available
for technical support. We are committed to making our product easy to use and will help you use our
products in your systems. Please consult our Web site at http://www.kontron.com/support for the latest
product documentation, utilities, drivers and support contacts. Consult our customer section
http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications
and additional tools and software. In any case you can always contact your board supplier for technical
support.
2 Introduction
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2 Introduction
2.1 COMe-bCD2
Based on the COM Express standard, Kontron‟s COMe-bCD2, powered by a variety of Intel Pentium core
duo processors, is a next-generation embedded module that brings advanced technology to tomorrow‟s
applications, as well as continuing today‟s legacy devices. Built around serial differential signaling
technologies, COMe-bCD2 modules incorporate the following interfaces into a 95 x 125 small form factor
embedded module:
Core 2 Duo / Core Duo / Celeron M
PCI Express, which provides a high performance I/O infrastructure with transfer rates
starting at 2.5 Giga transfers per second over a x1 PCI Express lane
PCI
Serial ATA (SATA II)
USB 2.0
LVDS
Intel High Definition Audio
Advanced Configuration and Power Interface (ACPI) for optimized power
management
The COMe-bCD2 is built around the Intel Core Duo processors that use the Yonah and Merom Cores and
the Mobile Intel 945GME Express chipset, which is the first mobile platform to offer PCI Express
functionality with extended life cycle support. These modules feature the most current desktop features
such as USB 2.0, SATA, and PCI Express buses.
The COMe-bCD2 delivers up to 2GHz performance and up to 2GB DDR2 RAM. For applications that require
advanced real-time video capabilities, the COMe-bCD2 has integrated graphics based on the Intel®
Graphics Media Accelerator 900 architecture and also supports PCI Express graphics.
Fast communications are possible courtesy of a Gigabit Ethernet port.
The COMe-bCD2 supports 5 PCI Express x1 Lanes and PCI Express cards as well as established hardware
solutions based on current buses such as 32-bit PCI. A Gigabit Ethernet port provides fast connectivity to
LAN/WAN and 8 USB 2.0 ports provide fast and sufficient interfaces for external peripherals.
COMe-bCD2 modules also provide the following interfaces that are always located in the same physical
position on each board:
PCI-express, PCI32, USB, serial ATA (SATA), parallel ATA (PATA), LVDS Multi Media ports, as well as an
ACPI (Advanced Configuration and Power Interface) for optimized power management. Six mounting
holes on the board provide secure mounting to allow the module increased shock and vibration
resistance.
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2.2 COMe-bCD2 Release Versions
The COMe-bCD2 module is available in two different versions. The single channel version has one
memory socket and the dual channel verison has two memory sockets. All statements in this document
are valid for both versions, except they market to be only valid for one version. Statements only valid for
the single channel version are highlighted in a light blue color and statements only valid for the dual
channel version are highlighted in a green color.
The main differences are:
2.2.1 Single Channel Version
Article number ends with a “-0”, “-1”, “-2” or “-3”
One memory socket
5 PCIexpress lanes of the chipset; Onboard LAN uses PCIexpress lane 1
No S3 cold support
Strict 12V supply voltage
Intel® 945GM
Ethernetcontroller: Realtec RTL8111B
Temperature sensor: LM 64
2.2.2 Dual Channel Version
Article number ends with a “-4”, “-5” or “-6”
Two memory sockets
5PCIexpress lanes of the chipset; Onboard LAN uses PCIexpress lane 5 which allows
optionally a x4 lane
S3 cold support
Wide Range power input from 8.5V to 18V
Intel® 945GME
Ethernetcontroller: Realtec RTL8111C
Temperature sensor: LM 87
2.3 COMe-bCD2 Module Overview
The international COM Express standard defines two new form factor sizes: Basic and Extended. The
primary difference between the Basic and Extended size is a larger board size and thermal envelope in
the Extended size. The COMe-bCD2 follows the basic form factor.
Five module Pin-out Type definitions exist for Basic and Extended modules. Pin-out Types 1-5 apply to
Basic and Extended module form factors. Pin-out Types 1-5 offer different functionalities. For a complete
explanation of the features of each of the Pin-out Types 1-5, please see the COM Express® Specification.
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The COMe-bCD2 uses the Pin-out Type 2 architecture, which includes PCI and IDE interfaces. These
modules either use onboard graphics capabilities or may use 16 PEG lanes to connect to an external
video controller. In case of onboard graphics, PEG pins may be alternatively used for two SDVO ports.
Pin-out Type 2 features include:
Dual 220 pin connectors (Primary Connector: Rows A-B and Secondary Connector:
Rows C-D, 440 pins total)
32-bit PCI interface
IDE port (to support legacy ATA devices)
Up to 5 PCI Express general purpose lanes
One, x16 PCI Express Graphics (PEG) slot
SDVO option (pins shared with PCI Express Graphics)
Maximum module input power capability extended to 188W
Up to 8 USB 2.0 ports; 4 shared over-current lines
Up to 4 Serial ATA or SAS ports
Dual 24-bit LVDS channels
Analog VGA and TV Out: Composite Video, S-Video, Component Video (YPbPr)
Intel High Definition Audio (Azalia) and AC '97 digital audio interface (external
CODEC)
Single Ethernet interface with integrated PHY
+12V primary power supply input, +5V standby and 3.3V RTC power supplies
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2.4 Understanding COM Express® functionality
All Kontron COM Express® basic and compact modules contain two connectors, each of which has two
rows. The primary connector has two rows called Row A and Row B. The secondary connector has two
rows called Row C and Row D.
The primary connector (Row A and Row B) feature the following legacy-free functionality:
Ethernet
Serial ATA (SATA)
USB 2.0
LVDS/VGA and dual display video
Intel High Definition Audio (Azalia)
LPC, an Intel proprietary low-pin count (LPC), which supports low-speed devices such
as RS-232 serial and parallel ports.
The secondary connector (Row C and Row D) provides support for the following buses and I/O:
PCI Express
PCI
IDE
2.5 COM Express® Documentation
This product manual serves as one of three principal references for an COM Express® design. It
documents the specifications and features of COMe-bCD2. The other two references, which are available
from your Kontron Support, include:
The COMexpress Specification define the module form factor, pinout, and signals.
The Carrier Board Design Guide serves as a general guide for baseboard design, with a
focus on maximum flexibility to accommodate a wide range of COM Express®
modules.
Note: Some of the information contained within this product manual applies only to certain product revisions (CE:
xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the
product revision of your module to see if this information is applicable.
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2.6 COM Express® Benefits
COM Express® basic modules are very compact (125 x 95 mm, 12mm thick), highly integrated
computers. All COM Express® modules feature a standardized form factor and a standardized connector
layout that carry a specified set of signals. Each COM Express® module is based on connector type of the
COMexpress specification. This standardization allows designers to create a single-system baseboard
that can accept present and future COM Express® modules.
COM Express® modules include common personal computer (PC) peripheral functions such as:
Graphics
USB ports
Ethernet
Sound
IDE (and SATA)
The baseboard designer can optimize exactly how each of these functions implements physically.
Designers can place connectors precisely where needed for the application on a baseboard designed to
optimally fit a system‟s packaging.
A peripheral PCI bus can be implemented directly on the baseboard rather than on mechanically
unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one
plug-in component simplifies packaging, eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of COM Express® modules. This flexibility can differentiate
products at various price/performance points, or to design future proof systems that have a built-in
upgrade path. The modularity of an COM Express® solution also ensures against obsolescence as
computer technology evolves. A properly designed COM Express® baseboard can work with several
successive generations of COM Express® modules.
An COM Express® baseboard design has many advantages of a custom, computer-board design but
delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.
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3 Specifications
3.1 Functional Specifications
Processor
Intel® Celeron® M, Core Duo® (Yonah Core)or Core2Duo® (Merom core) processor
Bus
533 / 667 MHz CPU bus
533/667 MHz memory bus
Chipset
Intel® 945GM (see 2.2.1)
Intel® 945GME (see 2.2.2)
ICH7M-DH
Cache, Second level
1MB (Celeron® M)
2x1MB (Core Duo®)
4MB (Core2Duo®)
Memory
One 200-pin DDR2-SO-DIMM (-533 or -667) (see 2.2.1)
Two 200-pin DDR2-SO-DIMM (-533 or -677) (see 2.2.2)
Note: COMe-bCD2 equipped with the CeleronM423 is not able to drive memory modules faster than DDR2-533.
Note: The dual channel version would be theoretically able to support 4GB of RAM. Practically this feature is in the
chipset not supported, therefore that maximum amount of RAM is about 3.3 GByte
PCI Express Graphics (PEG): Intel® 945GM/GME
One 16-lane PCI Express port for external PCI Express based graphics card
Serial Digital Video Output (SDVO): Intel® 945GM/GME
Concurrent Operation of PCI Express Graphics with SDVO
Supports appropriate external SDVO compontents (DVI, LVDS, TV-out)
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PCI Express: Intel® ICH7M-DH
5 PCI Express x1 lanes
Optionally 1 x4 lane and 1 x1 lane is possible by strapping option on the baseboard.
(see 2.2.2) To use this feature please pull-up AC_SYNC (A29) and AC_SDOUT (A33) to
3.3V.
PCI 32: Intel® ICH7M-DH
Parallel PCI Bus 32 bit 33 MHz
Low Pincount Bus (LPC): Intel® ICH7M-DH
Enhanced Intelligent Drive Electronics (EIDE): Intel® ICH7M-DH
One PCI Bus Master IDE port
Supports 2 IDE devices
Ultra 100 Direct Memory Access (DMA) mode
Programmed Input/Output (PIO) modes up to Mode 4 timing
Multiword DMA Mode 0,1,2 with independent timing
Serial ATA: Intel® ICH7M-DH
2 Channels Serial ATA
SATA Spec. Rev. 1.0 up to 150 MB/s per channel
SATA II (AHCI)
Supports RAID level 0 and 1
Universal Serial Bus: Intel® ICH7M-DH
8 USB 1.1/2.0 ports (UHCI and EHCI)
USB legacy keyboard support
USB floppy, CD-ROM, Hard drive, and memory stick boot support
Gigabit Ethernet: Realtek RTL8111B/C 10/100/1000
Fully compatible with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Onboard video graphics array (VGA): Intel® 945GM/GME:
Intel® Gen 3.5 Graphics engine
Dynamic Video Memory Technology (DVMT 3.0)
Cathode ray tube (CRT) up do QXGA
low voltage differential signaling (LVDS) liquid-crystal display (LCD) and SDVO
interfaces up to UXGA
Supports DX 9.1
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AC ’97 (Audio): Intel® 945GM/GME;
Up to 20 bit sample resolution
Multiple sample rates up to 48bit
Independent bus master logic for dual Microphone Input, dual PCM audio input, PCM
audio input, modem input, modem output and S/PDIF output.
Television output: Intel® 945GM/GME
3 integrated 10bit DACs
Overscaling
NTSC/PAL
HDTV support: 480p / 780p / 1080i / 1080p
BIOS: Phoenix, 1MB Flash-BIOS in Firmware Hub Flash Memory
NV-EEPROM for CMOS-setup retention without battery
Watchdog timer (WDT): Xilinx Microcontroller
Real-time clock (requires external battery)
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3.1.1 Block diagram
DDR2-
SDRAM
LCD (JILI)
CRT
IDE
USB
0-7
Connector AB
AC’97
Sound
RTC
MISC
Power Control
Speaker
Battery
SMB
I2C
VGA
Controller
SATA 0-1
PEG
TV out
ETXexpress-CD
CPU
Celeron M
Core Duo
Core 2 Duo
Host Bus
North Bridge
Intel 945GM
Hub Interface
South Bridge
Intel ICH7MDH
PCI BUS
Connector CD
LPC BUS
TPM
(optional)
PCIe 1-5
PCIe
Realtek
RTL8111
Gigabit Ethernet
SPI
BIOS
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3.2 Mechanical Specifications
Dimensions
95.0 mm x 125.0 mm
Height approx. 12 mm (0.4”)
3.3 Electrical Specifications
Supply Voltage
12V DC +/- 5%
8.5V DC to 18V DC widerange input (see 2.2.2)
Supply Voltage Ripple
Maximum 100 mV peak to peak 0 – 20 MHz
Supply Current 5 V_SB
0,33 A in S5 mode
0,43 A in S0
Note: S3 cold will drive all the powersupply for memory refreshing and chip supply through the 5V_SB line.
Therefore up to 2A of current is specified for the connectors and should be in mind when the powersupply is
dimenstioned.
The board works also without a 5V_SB line but not the ACPI states S3 and S5.
3.3.1 Power Consumption
The maximum Power Consumption of the different COMe-bCD2 modules is between 18 - 40W (100% CPU
load; 90°C CPU temperature). Further details with measurements and TDP values of the single variants
can be found in our customer section. Information there is available after registration.
All boards were equipped with DDR2 SDRAM. The Modules were tested using maximum CPU frequency.
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3.4 Environmental Specifications
3.4.1 Temperature
Operating: (with Kontron Embedded Modules heat-spreader plate assembly):
Ambient temperature: 0°C to 60°C
Maximum heatspreader-plate temperature: 0°C to 60°C
Non-operating: -30°C to 85°C
Note: The maximum operating temperature with the heatspreader plate is the maximum measurable temperature
on any spot on the heatspreader’s surface. You must maintain the temperature according to the above
specification.
Operating (without Kontron Embedded Modules heat-spreader plate assembly):
Maximum operating temperature: 0°C to 60°C
Non operating: -30 to +85 °C
Note: The maximum operating temperature is the maximum measurable temperature on any spot on a module’s
surface. You must maintain the temperature according to the above specification.
3.4.2 Humidity
Operating: 10% to 90% (non condensing)
Non operating: 5% to 95% (non condensing)
3.5 MTBF
The following MTBF (Mean Time Between Failure) values were calculated using a combination of
manufacturer‟s test data, if the data was available, and a Bellcore calculation for the remaining parts.
The Bellcore calculation used is “Method 1 Case 1”. In that particular method the components are
assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is
assumed to have not been burned in. Manufacturer‟s data has been used wherever possible. The
manufacturer‟s data, when used, is specified at 50° C, so in that sense the following results are slightly
conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt
water exposure, etc.) lower MTBF values.
System MTBF (hours) for single channel memory version: 152941
System MTBF (hours) for dual channel memory version: 191206
Notes: Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour typical operating
life. The above estimates assume no fan, but a passive heat sinking arrangement.
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need
to be considered for separately. Battery life depends on both temperature and operating conditions. When
the Kontron unit has external power; the only battery drain is from leakage paths.
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4 Connector Pinouts
Pin A1
Pin B1
Pin C1
Pin D1
Connector X1AConnector X1B
4.1 Connector location
There are 2 connectors on the basic sized module. Connector X1A and Connector X1B are shown in the
following drawing. It is a top layer view and the connectors are seen "through" the PCB.
Each connector consist s of 2 connector rows. Connector X1A has rows A and B and connector X1B has
rows C and D.
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4.2 Pinout tables
Type
Signal Description
I
Differential Pair Input
IO-2,5
Bi-directional 2,5 V IO-Signal
IO-3,3
Bi-directional 3,3 V IO-Signal
IO-5
Bi-directional 5 V IO-Signal
I-3,3
3,3 V Input
I-5
5 V Input
O
Differential Pair Output
OA
Output Analog
O-2,5
2,5 V Output
O-3,3
3,3 V Output
O-5
5 V Output
DP
Differential Pair Input/Output
PU
Pull-Up Resistor
PD
Pull-Down Resistor
PWR
Power Connection
Nc
Not Connected / Reserved
Notes: To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to
withstand the maximum available current the enclosure of the peripheral device fulfils the fire-protection
requirements of IEC/EN60950
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4.2.1 Connector X1A
Pin
Signal
Description
Type
Termination
Comment
A1
GND
Power Ground
PWR - -
A2
GBE0_MDI3-
LAN_RXD- | Ethernet Receive Data -
I - -
A3
GBE0_MDI3+
LAN_RXD- | Ethernet Receive Data -
I - -
A4
GBE0_LINK100#
LAN_100LED# | Ethernet Speed LED
O-3,3 - On at 100Mb/s
A5
GBE0_LINK1000#
LAN_1000LED# | Ethernet Speed LED
O-3,3 - On at 1000Mb/s
A6
GBE0_MDI2-
LAN_RXD- | Ethernet Receive Data -
I - -
A7
GBE0_MDI2+
LAN_RXD- | Ethernet Receive Data -
I - -
A8
GBE0_LINK#
LAN_LILED# | LAN Link LED
O-3,3 - -
A9
GBE0_MDI1-
LAN_RXD- | Ethernet Receive Data -
I - -
A10
GBE0_MDI1+
LAN_RXD+ | Ethernet Receive Data +
I - -
A11
GND
Power Ground
PWR - -
A12
GBE0_MDI0-
LAN_TXD- | Ethernet Transmit Data -
O - -
A13
GBE0_MDI0+
LAN_TXD+ | Ethernet Transmit Data +
O - -
A14
GBE0_CTREF
ETH_CTREF
O-3,3 - -
A15
SUS_S3#
PM_SLP_S#3
O-3,3 - -
A16
SATA0_TX+
SATA0_TX+ | SATA 0 Transmit Data +
O - -
A17
SATA0_TX-
SATA0_TX- | SATA 0 Transmit Data -
O - -
A18
SUS_S4#
PM_SLP_S#4
O-3,3 - -
A19
SATA0_RX+
SATA0_RX+ | SATA 0 Receive Data +
I - -
A20
SATA0_RX-
SATA0_RX- | SATA 0 Receive Data -
I - -
A21
GND
Power Ground
PWR - -
A22
SATA2_TX+
SATA0_TX+ | SATA 2 Transmit Data +
O - -
A23
SATA2_TX-
SATA0_TX- | SATA 2 Transmit Data -
O - -
A24
SUS_S5#
PM_SLP_S#5
O-3,3 - -
A25
SATA2_RX+
SATA0_RX+ | SATA 2 Receive Data +
O - -
A26
SATA2_RX-
SATA0_RX- | SATA 2 Receive Data -
O - -
A27
BATLOW#
PM_BATLOW# | Battery Low
I-3,3
PU 8k2 3,3V
-
A28
ATA_ACT#
ATA_LED# | SATA LED
O-3,3
PU 10k 3,3V
-
A29
AC_SYNC
AC_SYNC | AC'97 Sync
O-3.3 - int. PD 20k in ICH7–PU to 3.3V f. x4
A30
AC_RST#
AC_RST# | AC'97 Reset
O-3,3 - int. PD 20k in ICH7
A31
GND
Power Ground
PWR - -
A32
AC_BITCLK
AC_BITCLK | AC'97 Clock
I-3,3 - int. PD 20k in ICH7
A33
AC_SDOUT
AC_SDATAOUT | AC'97 Data
O-3,3 - int. PD 20k in ICH7–PU to 3.3V f. x4
A34
BIOS_DISABLE#
BIOS_DISABLE#
I-3,3 - -
A35
THRMTRIP#
PM_THRMTRIP#_CON
IO-3,3
PU 10k 3,3V
-
A36
USB6-
USB_PN6 | USB Data – Port6
DP - int. PD 15k in ICH7
A37
USB6+
USB_PP6 | USB Data + Port6
DP - int. PD 15k in ICH7
A38
USB_6_7_OC#
USB_OC#_6_7 | USB OverCurrent Port 6/7
I-3,3 - -
A39
USB4-
USB_PN4 | USB Data - Port4
DP - int. PD 15k in ICH7
A40
USB4+
USB_PP4 | USB Data + Port4
DP - int. PD 15k in ICH7
A41
GND
Power Ground
PWR - -
A42
USB2-
USB_PN2 | USB Data - Port2
DP - int. PD 15k in ICH7
A43
USB2+
USB_PP2 | USB Data + Port2
DP - int. PD 15k in ICH7
A44
USB_2_3_OC#
USB_OC#_2_3 | USB OverCurrent Port 2/3
I-3,3
PU 10k 3,3V
-
A45
USB0-
USB_PN0 | USB Data - Port0
DP - int. PD 15k in ICH7
A46
USB0+
USB_PP0 | USB Data + Port0
DP - int. PD 15k in ICH7
A47
VCC_RTC
+V_BAT
PWR - -
A48
EXCD0_PERST#
Express Card Support [0]|card reset
O-3,3 - -
A49
EXCD0_CPPE#
Express Card Support [0]| capable c. request
I-3,3 - -
A50
LPC_SERIRQ
INT_SERIRQ | Serial Interrupt Request
IO-3,3
PU 8k2 3,3V
-
A51
GND
Power Ground
PWR - -
A52
PCIE_TX5+
n.c.
Nc - -
A53
PCIE_TX5-
n.c.
Nc - -
A54
GPI0
GPI0 | General Purpose Input 0
I-3,3
PU 10k 3,3V
-
A55
PCIE_TX4+
PCI Express lane 4 + Transmit
O - -
Connector X1A (Signal Levels A1-A55)
Pin A1-A55 [ LAN | Power | USB | SATA | PCIe | AUDIO]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
22
Connector X1A (Signal Levels A56-A110)
Pin
Signal
Description
Type
Termination
Comment
A56
PCIE_TX4-
PCI Express lane 4 -
O - -
A57
GND
Power Ground
PWR - -
A58
PCIE_TX3+
PCI Express lane 3 +
O - -
A59
PCIE_TX3-
PCI Express lane 3 -
O - -
A60
GND
Power Ground
PWR - -
A61
PCIE_TX2+
PCI Express lane 2 +
O - -
A62
PCIE_TX2-
PCI Express lane 2 -
O - -
A63
GPI1
GPI1 | General Purpose Input 1
I-3,3
PU 10k 3,3V
-
A64
PCIE_TX1+
PCI Express lane 1 +
O - -
A65
PCIE_TX1-
PCI Express lane 1 -
O - -
A66
GND
Power Ground
PWR - -
A67
GPI2
GPI2 | General Purpose Input 2
I-3,3
PU 10k 3,3V
-
A68
PCIE_TX0+
PCI Express lane 0 +
O - -
A69
PCIE_TX0-
PCI Express lane 0 -
O - -
A70
GND
Power Ground
PWR - -
A71
LVDS_A0+
LVDS_YAP0 | LVDS Channel A Data0+
O - -
A72
LVDS_A0-
LVDS_YAM0 | LVDS Channel A Data0-
O - -
A73
LVDS_A1+
LVDS_YAP1 | LVDS Channel A Data1+
O - -
A74
LVDS_A1-
LVDS_YAM1 | LVDS Channel A Data1-
O - -
A75
LVDS_A2+
LVDS_YAP2 | LVDS Channel A Data2+
O - -
A76
LVDS_A2-
LVDS_YAM2 | LVDS Channel A Data2 -
O - -
A77
LVDS_VDD_EN
LVDS_VDDEN | LVDS Panel Power Control
O-2,5 - -
A78
LVDS_A3+
LVDS_YAP3 | LVDS Channel A Data3+
O - -
A79
LVDS_A3-
LVDS_YAM3 | LVDS Channel A Data3-
O - -
A80
GND
Power Ground
PWR - -
A81
LVDS_A_CK+
LVDS_CLKAP | LVDS Channel A Clock+
O - -
A82
LVDS_A_CK-
LVDS_CLKAM | LVDS Channel A Clock-
O - -
A83
LVDS_I2C_CK
LVDS_DDCPCLK | JILI I2C Clock
IO-3,3
PU 4k7 3,3V
-
A84
LVDS_I2C_DAT
LVDS_DDCPDATA | JILI I2C Data
IO-3,3
PU 4k7 3,3V
-
A85
GPI3
GPI3 | General Purpose Input 3
I-3,3
PU 10k 3,3V
-
A86
KBD_RST#
H_RCIN# | Keyboard Reset
I-3,3
PU 10k 3,3V
-
A87
KBD_A20GATE
H_A20GATE
I-3,3
PU 10k 3,3V
-
A88
PCIE0_CK_REF+
CLK_PCIE_REF P
O - -
A89
PCIE0_CK_REF-
CLK_PCIE_REF P
O - -
A90
GND
Power Ground
PWR - -
A91
RSVD
n.c.
Nc - -
A92
RSVD
n.c.
Nc - -
A93
GPO0
GPO0 | General Purpose Output 0
O-3,3
PD 10k
-
A94
RSVD
n.c.
Nc - -
A95
RSVD
n.c.
Nc -
A96
GND
Power Ground
PWR - -
A97
VCC_12V
12V VCC
PWR - -
A98
VCC_12V
12V VCC
PWR - -
A99
VCC_12V
12V VCC
PWR - -
A100
GND
Power Ground
PWR - -
A101
VCC_12V
12V VCC
PWR - -
A102
VCC_12V
12V VCC
PWR - -
A103
VCC_12V
12V VCC
PWR - -
A104
VCC_12V
12V VCC
PWR - -
A105
VCC_12V
12V VCC
PWR - -
A106
VCC_12V
12V VCC
PWR - -
A107
VCC_12V
12V VCC
PWR - -
A108
VCC_12V
12V VCC
PWR - -
A109
VCC_12V
12V VCC
PWR - -
A110
GND
Power Ground
PWR - -
Pin A56-A110 [ Power | LVDS | PCIe ]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
23
Connector X1B (Signal Levels B1-B55)
Pin
Signal
Description
Type
Termination
Comment
B1
GND
Power Ground
PWR - -
B2
GBE0_ACT
LAN_ACTLED# | Ethernet Activity LED
O-3,3 - -
B3
LPC_FRAME#
LPC_FRAME# | LPC Frame Indicator
I-3,3 - -
B4
LPC_AD0
LPC_AD0 | LPC Adress & DATA Bus
IO-3,3
-
-
B5
LPC_AD1
LPC_AD1 | LPC Adress & DATA Bus
IO-3,3
-
-
B6
LPC_AD2
LPC_AD2 | LPC Adress & DATA Bus
IO-3,3
-
-
B7
LPC_AD3
LPC_AD3 | LPC Adress & DATA Bus
IO-3,3
-
-
B8
LPC_DRQ0#
SIO_DRQ#0 | LPC Request 0
I-3,3 - -
B9
LPC_DRQ1#
SIO_DRQ#1 | LPC Request 1
I-3,3 - -
B10
LPC_CLK
CLK_SIOEXTPCI
O-3,3 - -
B11
GND
Power Ground
PWR - -
B12
PWRBTN#
Power Button
I-5 - -
B13
SMB_CK
SMB_CLK | SMBUS Clock
O-3,3
PU 2k2 3,3V
-
B14
SMB_DAT
SMB_DATA | SMBUS Data
IO-3,3
PU 2k2 3,3V
-
B15
SMB_ALERT#
SMB_ALERT#
IO-3,3
PU 2k2 3,3V
-
B16
SATA1_TX+
SATA1_TX+
O - -
B17
SATA1_TX-
SATA1_TX-
O - -
B18
SUS_STAT#
PM_SUS_ STAT#
O-3,3 - -
B19
SATA1_RX+
SATA1_RX+
I - -
B20
SATA1_RX-
SATA1_RX-
I - -
B21
GND
Power Ground
PWR - -
B22
SATA3_TX+
SATA3_TX+
O - -
B23
SATA3_TX-
SATA3_TX-
O - -
B24
PWR_OK
ETX_PWR_OK | Power OK
I-3,3 - -
B25
SATA3_RX+
SATA3_RX+
I - -
B26
SATA3_RX-
SATA3_RX-
I - -
B27
WDT
Watch Dog Timer
O-3,3 - -
B28
AC_SDIN2
AC_SDATAIN2 | AC'97 Serial Input Data 2
I-3,3 - int. PD 20k in ICH7
B29
AC_SDIN1
AC_SDATAIN1 | AC'97 Serial Input Data 1
I-3,3 - int. PD 20k in ICH7
B30
AC_SDIN0
AC_SDATAIN0 | AC'97 Serial Input Data 0
I-3,3 - int. PD 20k in ICH7
B31
GND
Power Ground
PWR - -
B32
SPKR
AC_SPKR | Speaker
O-3,3 - int. PD 20k in ICH7
B33
I2C_CK
I2CLK
O-3,3
PU 2k2 3,3V
-
B34
I2C_DAT
I2DAT
IO-3,3
PU 2k2 3,3V
-
B35
THRM#
PM THRM# CON | Over Temperature
O-3,3
PU 10k 3,3V
-
B36
USB7-
USB_PN7 | USB Data – Port7
DP - int. PD 15k in ICH7
B37
USB7+
USB_PP7 | USB Data + Port7
DP - int. PD 15k in ICH7
B38
USB_4_5_OC#
USB_OC#_4_5 | USB OverCurrent Port 4/5
I-3.3
PU 10k 3,3V
-
B39
USB5-
USB_PN5 | USB Data- Port5
DP - int. PD 15k in ICH7
B40
USB5+
USB_PP5 | USB Data+ Port5
DP - int. PD 15k in ICH7
B41
GND
Power Ground
PWR - -
B42
USB3-
USB_PN3 | USB Data- Port3
DP - int. PD 15k in ICH7
B43
USB3+
USB_PP3 | USB Data+ Port3
DP - int. PD 15k in ICH7
B44
USB_0_1_OC#
USB_OC#_0_1 | USB OverCurrent Port 0/1
I-3.3
PU 10k 3,3V
-
B45
USB1-
USB_PN1 | USB Data- Port1
DP - int. PD 15k in ICH7
B46
USB1+
USB_PP1 | USB Data+ Port1
DP - int. PD 15k in ICH7
B47
EXCD1_PERST#
Express Card Support [1]|card reset
O-3,3 - -
B48
EXCD1_CPPE#
Express Card Support [1]| capable c.
I-3,3 - -
B49
SYS_RESET#
ETX_SYS_RESET# | Reset Input
I-3,3
PU 10k 3,3V
-
B50
CB_RESET#
PCI_RST# | PCI Bus Reset
O-3,3 - -
B51
GND
Power Ground
PWR - -
B52
PCIE_RX5+
n.c.
Nc - -
B53
PCIE_RX5-
n.c.
Nc - -
B54
GPO1
GPO1 | General Purpose Output 1
O-3,3
PD 10k
-
B55
PCIE_RX4+
PCI Express lane 4 + Recieve
I - availlable when ICH7-MDH or
Pin B1-B55 [ LAN | Power | USB | SATA | PCIe | AUDIO | LPC]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
24
Connector X1A (Signal Levels B56-B110)
Pin
Signal
Description
Type
Termination
Comment
B56
PCIE_RX4-
PCI Express lane 4 - Recieve
I - availlable when ICH7-MDH or
B57
GPO2
GPO2 | General Purpose Output 2
O-3,3
PD 10k
B58
PCIE_RX3+
PCI Express lane 3 + Recieve
I - availlable when ICH7-MDH or
B59
PCIE_RX3-
PCI Express lane 3 - Recieve
I - availlable when ICH7-MDH or
B60
GND
Power Ground
PWR - -
B61
PCIE_RX2+
PCI Express lane 2 + Recieve
I - -
B62
PCIE_RX2-
PCI Express lane 2 - Recieve
I - -
B63
GPO3
GPO3 | General Purpose Output 3
O-3,3
PD 10k
-
B64
PCIE_RX1+
PCI Express lane 1 + Recieve
I - -
B65
PCIE_RX1-
PCI Express lane 1 - Recieve
I - -
B66
WAKE0#
PCIE_WAKEI#
IO-3,3
PU 1k 3,3V
-
B67
WAKE1#
WAKE1#
I-3,3
PU 8k2 3,3V
-
B68
PCIE_RX0+
PCI Express lane 0 + Recieve
I - -
B69
PCIE_RX0-
PCI Express lane 0 - Recieve
I - -
B70
GND
Power Ground
PWR - -
B71
LVDS_B0+
LVDS_YBP0 | LVDS Channel B Data0+
O - -
B72
LVDS_B0-
LVDS_YBM0 | LVDS Channel B Data0-
O - -
B73
LVDS_B1+
LVDS_YBP1 | LVDS Channel B Data1+
O - -
B74
LVDS_B1-
LVDS_YBM1 | LVDS Channel B Data1-
O - -
B75
LVDS_B2+
LVDS_YBP2 | LVDS Channel B Data2+
O - -
B76
LVDS_B2-
LVDS_YBM2 | LVDS Channel B Data2 -
O - -
B77
LVDS_B3+
LVDS_YBP2 | LVDS Channel B Data3+
O - -
B78
LVDS_B3-
LVDS_YBM2 | LVDS Channel B Data3 -
O - -
B79
LVDS_BKLT_EN
BLON# | Panel Backlight ON
O-3,3 - -
B80
GND
Power Ground
PWR - -
B81
LVDS_B_CK+
LVDS_CLKBP | LVDS Channel B Clock+
O - -
B82
LVDS_B_CK-
LVDS_CLKBM | LVDS Channel B Clock-
O - -
B83
LVDS_BKLT_CTRL
LVDS BKLTCTL | Backlight Brightness Contr.
O-3,3 - -
B84
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B85
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B86
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B87
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B88
RSVD
n.c.
nc - -
B89
VGA_RED
CRT_RED | Analog Video RGB-RED
O - -
B90
GND
Power Ground
PWR - -
B91
VGA_GRN
CRT_GREEN | Analog Video RGB-GREEN
O - -
B92
VGA_BLU
CRT_BLUE | Analog Video RGB-BLUE
O - -
B93
VGA_HSYNC
CRT_HSYNC | Analog Video H-Sync
O-3,3 - -
B94
VGA_VSYNC
CRT_VSYNC | Analog Video V-Sync
O-3,3 - -
B95
VGA_I2C_CK
CRT_DDCACLK | Display Data Channel Clock
IO-5
PU 4k7 5V
-
B96
VGA_I2C_DAT
CRT_DDCADATA | Display Data Channel Data
IO-5
PU 4k7 5V
-
B97
TV_DAC_A
TV_DACA_CVBS | Composite CVBS
OA - -
B98
TV_DAC_B
TV_DADB_Y | TV Luminance Signal
OA - -
B99
TV_DAC_C
TV_DADC_C | TV Chrominance Signal
OA - -
B100
GND
Power Ground
PWR - -
B101
VCC_12V
12V VCC
PWR - -
B102
VCC_12V
12V VCC
PWR - -
B103
VCC_12V
12V VCC
PWR - -
B104
VCC_12V
12V VCC
PWR - -
B105
VCC_12V
12V VCC
PWR - -
B106
VCC_12V
12V VCC
PWR - -
B107
VCC_12V
12V VCC
PWR - -
B108
VCC_12V
12V VCC
PWR - -
B109
VCC_12V
12V VCC
PWR - -
B110
GND
Power Ground
PWR - -
Pin B56-B110 [ Power | PCIe | LVDS | TV]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
25
4.2.2 Connector X1B
Pin
Signal
Description
Type
Termination
Comment
C1
GND
Power Ground
PWR - -
C2
IDE_D7
IDE Data Bus
IO - -
C3
IDE_D6
IDE Data Bus
IO - -
C4
IDE_D3
IDE Data Bus
IO - -
C5
IDE_D15
IDE Data Bus
IO - -
C6
IDE_D8
IDE Data Bus
IO - -
C7
IDE_D9
IDE Data Bus
IO - -
C8
IDE_D2
IDE Data Bus
IO - -
C9
IDE_D13
IDE Data Bus
IO - -
C10
IDE_D1
IDE Data Bus
IO - -
C11
GND
Power Ground
PWR - -
C12
IDE_D14
IDE Data Bus
IO - -
C13
IDE_IORDY
IDE Ready
I-3,3
PU 8k2 3,3V
-
C14
IDE_IOR#
IDE IO Read
O-3,3 - -
C15
PCI_PME#
PCI Power Management Event
IO-3,3
- - C16
PCI_GNT2#
PCI Bus Grant 2
O-3,3 - -
C17
PCI_REQ2#
PCI Bus Request 2
I-3,3
PU 8k2 3,3V
-
C18
PCI_GNT1#
PCI Bus Grant 1
O-3,3 -
C19
PCI_REQ1#
PCI Bus Request 1
I-3,3
PU 8k2 3,3V
-
C20
PCI_GNT0#
PCI Bus Grant 0
O-3,3 -
C21
GND
Power Ground
PWR - -
C22
PCI_REQ0#
PCI Bus Reqest 0
I-3,3
PU 8k2 3,3V
-
C23
PCI_RESET#
PCI Bus Reset
O-3,3 - -
C24
PCI_AD0
PCI Adress & Data Bus line
IO-3,3
- - C25
PCI_AD2
PCI Adress & Data Bus line
IO-3,3
- - C26
PCI_AD4
PCI Adress & Data Bus line
IO-3,3
- - C27
PCI_AD6
PCI Adress & Data Bus line
IO-3,3
- - C28
PCI_AD8
PCI Adress & Data Bus line
IO-3,3
- - C29
PCI_AD10
PCI Adress & Data Bus line
IO-3,3
- - C30
PCI_AD12
PCI Adress & Data Bus line
IO-3,3
- - C31
GND
Power Ground
PWR - -
C32
PCI_AD14
PCI Adress & Data Bus line
IO-3,3
- - C33
PCI_C/BE1#
PCI Bus Command and Byte enables 1
IO-3,3
- - C34
PCI_PERR#
PCI Bus Grant Error
IO-3,3
PU 8k2 3,3V
-
C35
PCI_LOCK#
PCI Bus Lock
IO-3,3
PU 8k2 3,3V
-
C36
PCI_DEVSEL#
PCI Bus Device Select
IO-3,3
PU 8k2 3,3V
-
C37
PCI_IRDY#
PCI Bus Bus Initiator Ready
IO-3,3
PU 8k2 3,3V
-
C38
PCI_C/BE2#
PCI Bus Command and Byte enables 2
IO-3,3
- - C39
PCI_AD17
PCI Adress & Data Bus line
IO-3,3
- - C40
PCI_AD19
PCI Adress & Data Bus line
IO-3,3
- - C41
GND
Power Ground
PWR - -
C42
PCI_AD21
PCI Adress & Data Bus line
IO-3,3
- - C43
PCI_AD23
PCI Adress & Data Bus line
IO-3,3
- - C44
PCI_C/BE3#
PCI Bus Command and Byte enables 3
IO-3,3
- - C45
PCI_AD25
PCI Adress & Data Bus line
IO-3,3
- - C46
PCI_AD27
PCI Adress & Data Bus line
IO-3,3
- - C47
PCI_AD29
PCI Adress & Data Bus line
IO-3,3
- - C48
PCI_AD31
PCI Adress & Data Bus line
IO-3,3
- - C49
PCI_IRQA#
PCI Bus Interrupt Request A
I-3,3
PU 8k2 3,3V
-
C50
PCI_IRQB#
PCI Bus Interrupt Request B
I-3,3
PU 8k2 3,3V
-
C51
GND
Power Ground
PWR - -
C52
PEG_RX0+
PCIexpress Graphics Recieve + (0)
I - -
C53
PEG_RX0-
PCIexpress Graphics Recieve - (0)
I - -
C54
TYPE0#
n.c.
nc - -
C55
PEG_RX1+
PCIexpress Graphics Recieve + (1)
I - -
Connector X1B (Signal Levels C1-C55)
Pin A1-A55 [ LAN | Power | USB | SATA | PCIe | AUDIO]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
26
Connector X1B (Signal Levels C56-C110)
Pin
Signal
Description
Type
Termination
Comment
C56
PEG_RX1-
PCIexpress Graphics Recieve - (1)
I - -
C57
TYPE1#
n.c.
nc - -
C58
PEG_RX2+
PCIexpress Graphics Recieve + (2)
I - -
C59
PEG_RX2-
PCIexpress Graphics Recieve - (2)
I - -
C60
GND
Power Ground
PWR - -
C61
PEG_RX3+
PCIexpress Graphics Recieve + (3)
I - -
C62
PEG_RX3-
PCIexpress Graphics Recieve - (3)
I - -
C63
RSVD
n.c.
nc - -
C64
RSVD
n.c.
nc - -
C65
PEG_RX4+
PCIexpress Graphics Recieve + (4)
I - -
C66
PEG_RX4-
PCIexpress Graphics Recieve - (4)
I - -
C67
RSVD
n.c.
nc - -
C68
PEG_RX5+
PCIexpress Graphics Recieve + (5)
I - -
C69
PEG_RX5-
PCIexpress Graphics Recieve - (5)
I - -
C70
GND
Power Ground
PWR - -
C71
PEG_RX6+
PCIexpress Graphics Recieve + (6)
I - -
C72
PEG_RX6-
PCIexpress Graphics Recieve - (6)
I - -
C73
SDVO_DATA
SDVO_CTRLDATA
IO-2,5
PU 5k6 2,5V
-
C74
PEG_RX7+
PCIexpress Graphics Recieve + (7)
I - -
C75
PEG_RX7-
PCIexpress Graphics Recieve - (7)
I - -
C76
GND
Power Ground
PWR - -
C77
RSVD
n.c.
nc - -
C78
PEG_RX8+
PCIexpress Graphics Recieve + (8)
I - -
C79
PEG_RX8-
PCIexpress Graphics Recieve - (8)
I - -
C80
GND
Power Ground
PWR - -
C81
PEG_RX9+
PCIexpress Graphics Recieve + (9)
I - -
C82
PEG_RX9-
PCIexpress Graphics Recieve - (9)
I - -
C83
RSVD
n.c.
nc - -
C84
GND
Power Ground
PWR - -
C85
PEG_RX10+
PCIexpress Graphics Recieve + (10)
I - -
C86
PEG_RX10-
PCIexpress Graphics Recieve - (10)
I - -
C87
GND
Power Ground
PWR - -
C88
PEG_RX11+
PCIexpress Graphics Recieve + (11)
I - -
C89
PEG_RX11-
PCIexpress Graphics Recieve – (11)
I - -
C90
GND
Power Ground
PWR - -
C91
PEG_RX12+
PCIexpress Graphics Recieve + (12)
I - -
C92
PEG_RX12-
PCIexpress Graphics Recieve - (12)
I - -
C93
GND
Power Ground
PWR - -
C94
PEG_RX13+
PCIexpress Graphics Recieve + (13)
I - -
C95
PEG_RX13-
PCIexpress Graphics Recieve - (13)
I - -
C96
GND
Power Ground
PWR - -
C97
RSVD
n.c.
nc - -
C98
PEG_RX14+
PCIexpress Graphics Recieve + (14)
I - -
C99
PEG_RX14-
PCIexpress Graphics Recieve - (14)
I - -
C100
GND
Power Ground
PWR - -
C101
PEG_RX15+
PCIexpress Graphics Recieve + (15)
I - -
C102
PEG_RX15-
PCIexpress Graphics Recieve - (15)
I - -
C103
GND
Power Ground
PWR - -
C104
VCC_12V
12V VCC
PWR - -
C105
VCC_12V
12V VCC
PWR - -
C106
VCC_12V
12V VCC
PWR - -
C107
VCC_12V
12V VCC
PWR - -
C108
VCC_12V
12V VCC
PWR - -
C109
VCC_12V
12V VCC
PWR - -
C110
GND
Power Ground
PWR - -
Pin C56-C110 [ Power | LVDS | PCIe ]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
27
Connector X1B (Signal Levels D1-D55)
Pin
Signal
Description
Type
Termination
Comment
D1
GND
Power Ground
PWR - -
D2
IDE_D5
IDE Data Bus
IO - -
D3
IDE_D10
IDE Data Bus
IO - -
D4
IDE_D11
IDE Data Bus
IO - -
D5
IDE_D12
IDE Data Bus
IO - -
D6
IDE_D4
IDE Data Bus
IO - -
D7
IDE_D0
IDE Data Bus
IO - -
D8
IDE_REQ
IDE Data Bus
IO - -
D9
IDE_IOW#
IDE IO Write
O-3,3 - -
D10
IDE_ACK#
IDE DMA Acknowledge
O-3,3 - -
D11
GND
Power Ground
PWR - -
D12
IDE_IRQ
IDE Interrupt Request
I-3,3
PU 8k2 3,3V
-
D13
IDE_A0
IDE Adress Bus
O-3,3 - -
D14
IDE_A1
IDE Adress Bus
O-3,3 - -
D15
IDE_A2
IDE Adress Bus
O-3,3 - -
D16
IDE_CS1#
IDE Chip Select Channel 0
O-3,3 - -
D17
IDE_CS3#
IDE Chip Select Channel 1
O-3,3 - -
D18
IDE_RESET#
IDE Hard Drive Reset
O-3,3 - -
D19
PCI_GNT3#
PCI Bus Grant 3
O-3,3 - -
D20
PCI_REQ3#
PCI Bus Reqest 0
I-3,3
PU 8k2 3,3V
-
D21
GND
Power Ground
PWR - -
D22
PCI_AD1
PCI Adress & Data Bus line
IO-3,3
-
-
D23
PCI_AD3
PCI Adress & Data Bus line
IO-3,3
-
-
D24
PCI_AD5
PCI Adress & Data Bus line
IO-3,3
-
-
D25
PCI_AD7
PCI Adress & Data Bus line
IO-3,3
-
-
D26
PCI_C/BE0#
PCI Bus Command and Byte enables 0
IO-3,3
-
-
D27
PCI_AD9
PCI Adress & Data Bus line
IO-3,3
-
-
D28
PCI_AD11
PCI Adress & Data Bus line
IO-3,3
-
-
D29
PCI_AD13
PCI Adress & Data Bus line
IO-3,3
-
-
D30
PCI_AD15
PCI Adress & Data Bus line
IO-3,3
-
-
D31
GND
Power Ground
PWR - -
D32
PCI_PAR
PCI Bus Parity
IO-3,3
-
-
D33
PCI_SERR#
PCI Bus System Error
IO-3,3
PU 8k2 3,3V
-
D34
PCI_STOP#
PCI Bus Stop
IO-3,3
PU 8k2 3,3V
-
D35
PCI_TRDY#
PCI Bus Target Ready
IO-3,3
PU 8k2 3,3V
-
D36
PCI_FRAME#
PCI Bus Cycle Frame
IO-3,3
PU 8k2 3,3V
-
D37
PCI_AD16
PCI Adress & Data Bus line
IO-3,3
-
-
D38
PCI_AD18
PCI Adress & Data Bus line
IO-3,3
-
-
D39
PCI_AD20
PCI Adress & Data Bus line
IO-3,3
-
-
D40
PCI_AD22
PCI Adress & Data Bus line
IO-3,3
-
-
D41
GND
Power Ground
PWR - -
D42
PCI_AD24
PCI Adress & Data Bus line
IO-3,3
-
-
D43
PCI_AD26
PCI Adress & Data Bus line
IO-3,3
-
-
D44
PCI_AD28
PCI Adress & Data Bus line
IO-3,3
-
-
D45
PCI_AD30
PCI Adress & Data Bus line
IO-3,3
-
-
D46
PCI_IRQC#
PCI Bus Interrupt Request C
I-3,3
PU 8k2 3,3V
-
D47
PCI_IRQD#
PCI Bus Interrupt Request D
I-3,3
PU 8k2 3,3V
-
D48
PCI_CLKRUN#
PCI Clock Run
I-3,3
PU 10k 3,3V
-
D49
PCI_M66EN
n.c.
nc - -
D50
PCI_CLK
PCI Clock
O-3,3 - -
D51
GND
Power Ground
PWR - -
D52
PEG_TX0+
PCIexpress Graphics Transmit + (0)
I - DVOBD8
D53
PEG_TX0-
PCIexpress Graphics Transmit - (0)
I - DVOBD9
D54
PEG_LANE_RV#
PCIexpress Graphics Lane Reversal
I - -
D55
PEG_TX1+
PCIexpress Graphics Transmit + (1)
I - -
Pin D1-D55 [ LAN | Power | USB | SATA | PCIe | AUDIO | LPC]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
28
Connector X1B (Signal Levels D56-D110)
Pin
Signal
Description
Type
Termination
Comment
D56
PEG_TX1-
PCIexpress Graphics Transmit - (1)
I - -
D57
TYPE2#
n.c.
nc - -
D58
PEG_TX2+
PCIexpress Graphics Transmit + (2)
I - -
D59
PEG_TX2-
PCIexpress Graphics Transmit - (2)
I - -
D60
GND
Power Ground
PWR - -
D61
PEG_TX3+
PCIexpress Graphics Transmit + (3)
I - -
D62
PEG_TX3-
PCIexpress Graphics Transmit - (3)
I - -
D63
RSVD - nc -
D64
RSVD - nc -
D65
PEG_TX4+
PCIexpress Graphics Transmit + (4)
I - -
D66
PEG_TX4-
PCIexpress Graphics Transmit - (4)
I - -
D67
GND
Power Ground
PWR - -
D68
PEG_TX5+
PCIexpress Graphics Transmit + (5)
I - -
D69
PEG_TX5-
PCIexpress Graphics Transmit - (5)
I - -
D70
GND
Power Ground
PWR - -
D71
PEG_TX6+
PCIexpress Graphics Transmit + (6)
I - -
D72
PEG_TX6-
PCIexpress Graphics Transmit - (6)
I - -
D73
SDVO_CLK
SDVO_CTRLCLK
IO-2,5
PU 5k6 2,5V
-
D74
PEG_TX7+
PCIexpress Graphics Transmit + (7)
I - -
D75
PEG_TX7-
PCIexpress Graphics Transmit - (7)
I - -
D76
GND
Power Ground
PWR - -
D77
IDE_CBLID
IDE Primary ATA Detect
I-3,3
PD 10k
D78
PEG_TX8+
PCIexpress Graphics Transmit + (8)
I - -
D79
PEG_TX8-
PCIexpress Graphics Transmit - (8)
I - -
D80
GND
Power Ground
PWR - -
D81
PEG_TX9+
PCIexpress Graphics Transmit + (9)
I - -
D82
PEG_TX9-
PCIexpress Graphics Transmit - (9)
I - -
D83
RSVD
n.c.
nc - -
D84
GND
Power Ground
PWR - -
D85
PEG_TX10+
PCIexpress Graphics Transmit + (10)
I - -
D86
PEG_TX10-
PCIexpress Graphics Transmit - (10)
I - -
D87
GND
Power Ground
PWR - -
D88
PEG_TX11+
PCIexpress Graphics Transmit + (11)
I - -
D89
PEG_TX11-
PCIexpress Graphics Transmit - (11)
I - -
D90
GND
Power Ground
PWR - -
D91
PEG_TX12+
PCIexpress Graphics Transmit + (12)
I - -
D92
PEG_TX12-
PCIexpress Graphics Transmit - (12)
I - -
D93
GND
Power Ground
PWR - -
D94
PEG_TX13+
PCIexpress Graphics Transmit + (13)
I - -
D95
PEG_TX13-
PCIexpress Graphics Transmit - (13)
I - -
D96
GND
Power Ground
PWR - -
D97
PEG_ENABLE#
PCIexpress Graphics Enable
I-3,3
PU 10k 3,3V
-
D98
PEG_TX14+
PCIexpress Graphics Transmit + (14)
nc - -
D99
PEG_TX14-
PCIexpress Graphics Transmit - (14)
nc - -
D100
GND
Power Ground
PWR - -
D101
PEG_TX15+
PCIexpress Graphics Transmit + (15)
I - -
D102
PEG_TX15-
PCIexpress Graphics Transmit - (15)
I - -
D103
GND
Power Ground
PWR - -
D104
VCC_12V
12V VCC
PWR - -
D105
VCC_12V
12V VCC
PWR - -
D106
VCC_12V
12V VCC
PWR - -
D107
VCC_12V
12V VCC
PWR - -
D108
VCC_12V
12V VCC
PWR - -
D109
VCC_12V
12V VCC
PWR - -
D110
GND
Power Ground
PWR - -
Pin D56-D110 [ LAN | Power | USB | SATA | PCIe | AUDIO | LPC]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
29
4.3 Signal description
4.3.1 PCIexpress x1 lanes
The PCI express x1 lanes is a fast connection interface for many different system devices, such as
network controllers, I/O controllers or express card devices. The implementation of this subsystem
complies with the COM Express® / COMexpress Specification. Implementation information is provided in
the COM Express® Design Guide. Refer to the documentation for additional information.
4.3.2 USB
Eight USB host controllers (EHCI high-speed 2.0 controller) are on the Intel® 82801GB south bridge
device. The USB controllers comply with both versions 1.1 and 2.0 of the USB standard and are backward
compatible.
Configuration
The USB controllers are PCI bus devices. The BIOS allocates required system resources during
configuration of the PCI bus.
4.3.3 SATA
The Intel® 82801GB south bridge device offers the possibility to connect 2 SATA Harddisks according
SATA with 150 MB/s per channel or SATA II with 150 MB/s per channel in AHCI mode.
Configuration
The SATA controller is a PCI bus device. The BIOS allocates required system resources during
configuration of the PCI bus.
4.3.4 Audio
The COMe-bCD2 PCI AC‟97 audio controller is integrated in the Intel® 82801GB Southbridge.
Configuration
The audio controller is a PCI bus device. The BIOS allocates required system resources during
configuration of the PCI device.
4.3.5 Serial IRQ
The serial IRQ pin offers a standardized interface to link interrupt request lines to a single wire.
Configuration
The serial IRQ machine is in “Continuous Mode”
4.3.6 VGA Output
The COMe-bCD2 graphics subsystem is integrated in the Intel® 945GM/GME
northbridge. It has the following features:
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Kontron User's Guide ETXexpress® CD
30
250MHz core render clock and 200 MHz core display clock at 1.05V core voltage
Supports TV-out, LVDS, CRT and SDVO
Dynamic Video Memory Technology (DVMT 3.0)
2D graphics engine
3D graphics engine
3D setup and render engine
Zone rendering
High quality performance texture engine
Viewpoint transform and perspective divide
Max. resolution CRT: QXGA 2048x1536
Max. resolution LCD: UXGA 1600x1200 (4G colors)
Bits/Pixels supported on LCD: 1x18 bit, 2x18 bit, 1x24 bit, 2x24 bit
Note: The 945GM/GME does not support 24 bit LVDS but emulates the missing 2 bits per color and most of the
panels can be used with this limitation. SDVO supports full 24 bit.
Configuration
The graphics controller requires the following resources:
An IRQ
Several I/O addresses
Memory-address blocks in high memory
The BIOS allocates the resources during AGP configuration. Many resources are set for compatibility with
industry-standard settings.
4.3.7 LVDS Flat Panel Interface (JILI)
The user interface for flat panels is the JUMPtec Intelligent LVDS Interface (JILI). The implementation of
this subsystem complies with the COM Express® Specification. Implementation information is provided
in the COM Express® Design Guide. Refer to the documentation for additional information.
4.3.8 Digital Flat Panel Interface (JIDI)
The COMe-bCD2 does not support the JUMPtec Intelligent Digital Interface (JIDI).
4.3.9 Ethernet
The Ethernet interface is based on the Realtek RTL8111b/c Gigabit Ethernet PCIexpress controller. This
PCIexpress controller is a fully integrated 10/100/1000BASE-TX LAN solution.
The Ethernet interface requires an external transformer. See the COM Express® Design Guide for
suggestions on transformer selection.
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Kontron User's Guide ETXexpress® CD
31
Configuration
The Ethernet interface is a PCIexpress device. The BIOS setup automatically configures it during
configuration of the PCI device.
Note: Implementation and limitation information is provided in the COM Express® Design Guide. Refer to the
documentation for additional information.
4.3.10 Power Control
Power Good / Reset Input
The COMe-bCD2 provides an external input for a power-good signal or a manual- reset pushbutton. The
implementation of this subsystem complies with the COM Express® Specification. Implementation
information is provided in the COM Express® Design Guide. Refer to the documentation for additional
information.
4.3.11 Power Management
ATX PS Control
The COMe-bCD2 can control the main power output of an ATX-style power supply. The implementation of
this subsystem complies with the COM Express® Specification. Implementation information is provided
in the COM Express® Design Guide. Refer to the documentation for additional information.
External SMI Interrupt
Contact Kontron Embedded Modules technical support for information on this feature.
4.3.12 Miscellaneous Circuits
Speaker
The implementation of the speaker output complies with the COM Express® Specification.
Implementation information is provided in the COM Express® Design Guide. Refer to the documentation
for additional information.
Battery
The implementation of the battery input complies with the COM Express® Specification. Implementation
information is provided in the COM Express® Design Guide. Refer to the documentation for additional
information.
In compliance with EN60950, there are at least two current-limiting devices (resistor and diode)
between the battery and the consuming component.
I2C Bus
The I2C Bus is implemented by using general purpose I/O.
You also can access the I2C Bus via JUMPtec‟s Intelligent Device Architecture (JIDA) BIOS functions.
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32
For additional information, refer to the COM Express® Design Guide, I2C application notes and JIDA
specifications which are available at the Kontron Web site.
SM Bus
System Management (SM) bus signals are connected to the SM bus controller, which is located in the
Intel 82801GB (ICH7) device. For more information about the SM bus, please see the System
Management (SM) Bus section in the Appendix A: System Resources chapter.
LPC Bus
The Low Pin Count Interface signals are connected to the LPC Bus bridge, which is located in the Intel
82801GB (ICH7). The LPC low speed interface can be used for peripheral circuits such as an external
Super I/O Controller, which typically combine legacy-device support into a single IC. The
implementation of this subsystem complies with the COM Express® Specification. Implementation
information is provided in the COM Express® Design Guide. Refer to the documentation for additional
information.
4.3.13 PCIexpress Graphics
The PCI express Graphics interface allows the connection of high performace graphics chips on an high
bandwidth interface.
The implementation of this subsystem complies with the COM Express® / COMexpress Specification.
Implementation information is provided in the COM Express® Design Guide. Refer to the documentation
for additional information.
4.3.14 PCI Bus
The implementation of this subsystem complies with the COM Express® / COMexpress Specification.
Implementation information is provided in the COM Express® Design Guide. Refer to the documentation
for additional information.
4.3.15 IDE Port
The IDE host adapter is capable of DMA-33/66/100 operation. The implementation of this subsystem
complies with the COM Express® Specification. Implementation information is provided in the COM
Express® Design Guide. Refer to those documents for additional information.
Configuration
The IDE host adapter is a PCI bus device. It is configured by the BIOS during PCI device configuration.
You can disable it in setup. Resources used by the IDE host adapter are compatible with the PC/AT.
4.3.16 SDVO Output
The COMe-bCD2 Serial Digital Video Output port is integrated in the Intel® 945GM northbridge. It has
the following features:
Share it‟s pins with the PEG interface
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Kontron User's Guide ETXexpress® CD
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Serial Digital Video Out Port (DVOB & DVOC) support
Two 12-bit channels
The SDVO B/C ports can drive a variety of SDVO devices (TV-Out Encoders, TMDS and
LVDS transmitters, etc.)
5 Special Features
Kontron User's Guide ETXexpress® CD
34
5 Special Features
Signal
Pin
Description
GPI0
A54
General Purpose Input 0
GPI1
A63
General Purpose Input 1
GPI2
A67
General Purpose Input 2
GPI3
A85
General Purpose Input 3
GPO0
A93
General Purpose Output 0
GPO1
B54
General Purpose Output 1
GPO2
B57
General Purpose Output 2
GPO3
B63
General Purpose Output 3
5.1 Watchdog Timer
This feature is implemented in the Xilinx XC9536XL microcontroller. You can configure the Watchdog
Timer (WDT) in BIOS setup to start after a set amount of time after power-on boot. The WDT can also be
controlled by the JIDA32 Library API (Refer to Appendix F: JIDA Standard). The application software
should strobe the WDT to prevent its timeout. Upon timeout, the WDT resets and restarts the system. This
provides a way to recover from program crashes or lockups.
Configuration
You can program the timeout period for the watchdog timer in two ranges:
1-second increments from 1 to 255 seconds
1-minute increments from 1 to 255 minutes
Contact Kontron Embedded Modules technical support for information on programming and operating
the WDT.
5.2 General Purpose Input and Output
COMe-bCD2 offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a
3.3V level digital in- and outputs are available.
Configuration
The GPI and GPO pins can be configured via JIDA32. Please refer to the JIDA32 manual in the driver
download packet on our website.
6 Important Information
Kontron User's Guide ETXexpress® CD
35
6 Important Information
Kontron Embedded Modules currently offers different variants of the COMe-bCD2 with different
processors: Intel® Celeron® M, or Core Duo® and Core2Duo® processor. These variants utilize a smart
BIOS that is capable of identifying the CPU that the module is equipped with.
6.1 Cooling Solutions
With introduction of higher frequency CPUs into the embedded market the need to design more efficient
cooling solutions is now a necessity. These higher frequency CPUs generate much more heat, which must
be removed from the application. One solution that has become more common in the embedded market
is the use of heat pipes when designing a cooling solution. Kontron Embedded Modules has designed
some cooling solutions that utilize heat pipes in order to perform some tests. Although Kontron
Embedded Modules designed these cooling solutions strictly for test purposes, and not as a standard
COM Express® cooling solution, the knowledge gained from these tests is being made available to
customers in the form of an application note called PM_Thermal_Guidelines_E1xx.pdf. This application
note should be used as a guideline to help evaluate potential thermal designs. It can be found on
Kontron‟s web site at www.kontron.com on the COM Express® product page and in the Tech Support
section.
7 Design Considerations
Kontron User's Guide ETXexpress® CD
36
7 Design Considerations
7.1 Thermal Management
A heat-spreader plate assembly is available from Kontron Embedded Modules for the COMe-bCD2. The
heat-spreader plate on top of this assembly is NOT a heat sink. It works as an ETXexpress®-standard
thermal interface to use with a heat sink or other cooling device.
External cooling must be provided to maintain the heat-spreader plate at proper operating
temperatures. Under worst-case conditions, the cooling mechanism must maintain an ambient air and
heat-spreader plate temperature of 60° C or less.
The aluminum slugs and thermal pads on the underside of the heat-spreader assembly implement
thermal interfaces between the heat spreader plate and the major heat-generating components on the
COMe-bCD2. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.
For 2166MHz modules, the heat dissipated into the plate ranges from 45 to 55 watts. Design a cooling
solution to dissipate the heat load on a heat-spreader plate at a minimum of 55 watts to accommodate
all COMe-bCD2 modules.
You can use many thermal-management solutions with the heat-spreader plates, including active and
passive approaches. The optimum cooling solution varies, depending on the COM Express® application
and environmental conditions. Please see the COM Express® Design Guide for further information on
thermal management.
7 Design Considerations
Kontron User's Guide ETXexpress® CD
37
7.2 COMe-bCD2 onboard Fan connector
This section describes how to connect a fan to the connector located directly on the COMe-bCD2. With
certain BIOS-settings it is possible to control the fan depending on the Active Trip Point temperature.
The fan switches on/off depending on the adjusted Active Trip Point temperature. In order for this
feature to function properly an ACPI compliant OS is necessary.
Note: The COM Express® CD BIOS supports continuous fan control in order to accommodate the CPU temperature
characteristic curve.
Single channel version
Dual channel version
7 Design Considerations
Kontron User's Guide ETXexpress® CD
38
Part number (Molex) J4: 53261-0390
Mates with: 51021-0300
Crimp terminals: 50079-8100
Warning: The VCC_in_FANCON is the output voltage, limited to 12V. Please be aware that in widerange input
situations the fan speed depends on the used voltage level of the board supply and is limited to a
maximum of 12V. (see 2.2.2)
7.2.1 Location and pinout of fan connector J4
Single channel version (see 2.2.1)
Dual channel version (see 2.2.2)
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7.2.2 BIOS settings for fan control
7.2.3 Electrical Characteristics
VCC_in_FANCON = VCC of board, limited to 12V
Imax = 0,40 A
7 Design Considerations
Kontron User's Guide ETXexpress® CD
40
Note: The VCC_in_FANCON output is not short circuit proof. If necessary the user has to ensure that the circuit is
protected externally, for example by a fuse on the backplane.
8 Important Technology Information
Kontron User's Guide ETXexpress® CD
41
8 Important Technology Information
The following technological information is designed to give the reader a better understanding of some of
features of the COMe-bCD2. This information can be referenced when reading the Chapter System
Resources and the Chapter BIOS Operation sections that follow. There are also references to additional
documentation that will help to develop a better understanding of the technical information described
herein.
8.1 I/O APIC mode
The I/O APIC (Advanced Programmable Interrupt Controller) handles interrupts differently then the
8259 PIC. The following information explains these differences.
8.1.1 Method of interrupts transmission
The I/O APIC transmits interrupts through the system bus and interrupts are handled without the needs
for the processor to run an interrupt acknowledge cycle.
8.1.2 Interrupt priority
The priority of interrupts in the I/O APIC is independent of the interrupt number.
8.1.3 More interrupts
The I/O APIC in the chipset of the COMe-bCD2 supports a total of 24 interrupts.
The APIC is not supported by all operating systems. Only Windows Xp, Windows Vista and Linux supports
APIC.
For more information see chapter 8 of the IA-32 Intel Architecture Software Developer‟s Manual, Volume
3.
8.2 Thermal Monitor and Catastrophic Thermal Protection
The Thermal Monitor within the Intel® processor helps to control the processor temperature by
activating the TCC (Thermal Control Circuit) when the processor silicon reaches its maximum operating
temperature. The temperature at which the Intel Thermal Monitor activates the TCC is not userconfigurable and is not software visible.
The Thermal Monitor controls the processor temperature by modulating (starting and stopping) the CPU
core clocks at a 50% duty cycle (TM1) or by initiating an Enhanced Intel SpeedStep technology transition
(TM2) when the processor silicon reaches its maximum operating temperature (selectable in setup).
Note: TM2 is the recommended mode for the used Intel® processors.
Thermal Monitor supports two modes to activate the TCC: Automatic and On-Demand mode. The Intel
Thermal Monitor Automatic Mode must be enabled via BIOS for the processor to be operating within
specification.
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Automatic mode does not require any additional hardware, software drivers, or interrupt handling
routines.
Note: With a properly designed thermal solution, the TCC is only active for very short periods, hence processor
performance impact is expected to be so minor that it would not be detectable.
The Intel® processor supports the THERMTRIP# signal for catastrophic thermal protection.
In the event of a catastrophic cooling failure, the processor will automatically shut down when the
silicon has reached a temperature of approximately 125°C. At this point the system BUS signal
THERMTRIP# will go active.
THERMTRIP# activation is independent of processor activity and does not generate any bus cycles.
8.2.1 Summary
Thermal Control Circuit reduces performance when the processor reaches its max. operating temperature
(100°C). THERMTRIP# shuts down the system in case of catastrophic cooling failure.
8.3 Processor Performance Control
The Intel® processor can run in different performance states (multiple frequency/voltage operating
points). The CPU performance can be altered while the computer is functioning. This allows the
processor to run at different core frequencies and voltages depending on CPU thermal state and OS
policy.
Windows XP includes built-in processor performance control to operate the processor more efficiently
when it is not fully utilized. Win2k, WinME and Win9x do not support processor performance control.
Special software is required for OSes not capable of processor performance control.
In Windows, the processor performance control policy is linked to the Power Scheme setting in the
control panel power option applet.
Note: Windows always runs at the highest performance state when the “Home/Office” or “Always On” power
scheme is selected.
For a more detailed information about processor performance control, see:
Chapter 8 of the ACPI Specification Revision 2.0c available at www.acpi.info Windows platform design note
at: http://www.microsoft.com/whdc/hwdev/tech/onnow/procperfctrl.mspx
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8.4 Thermal Management
ACPI allows the OS to play a role in the thermal management of the system. With the OS in control of the
operating environment, cooling decisions can be made based on the application load on the CPU and the
thermal heuristics of the system.
The ACPI thermal solution on COMe-bCD2 supports three cooling policies:
Active Cooling
The OS is turning the fan on/off. Active cooling devices typically consume power and produce noise, but
are able to cool a thermal zone without limiting system performance. The active cooling trip point
declares the temperature threshold the OS uses to decide when to start/stop active cooling devices.
Passive Cooling
The OS reduces the power consumption of the processor by throttling the processor clock to reduce the
temperature of the thermal zone. Passive cooling devices (processor) produce no noise. The passive
cooling trip point declares the temperature threshold where the OS will start or stop passive cooling.
Critical Trip Point
The OS performs an orderly, but critical, shutdown of the system when the temperature reaches the
critical trip point.
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9 System Ressources
IRQ #
Used For
Available
Comment
0
Timer0
No
1
Keyboard
No 2
Slave 8259
No
3
COM2
No
Note (2)
4
COM1
No
Note (2)
5
-
Yes
6
Reserved for FDC
No
7
LPT1
No
Note (2)
8
RTC
No
9
SCI
No
10 - Yes 11 - Yes
12
PS/2 Mouse
No
Note (2)
13
FPU
No 14
IDE0
No
Note (1)
15
SATA
No
Note (3)
9.1 Interrupt Request (IRQ) Lines
In 8259 PIC mode:
Note: 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.
2 Unavailable if baseboard is equipped with an I/O controller Winbond W627, and the device is enabled in
setup. Always available in legacy free BIOS versions.
3 Unavailable in SATA legacy mode. It cannot be used for PCI, but for ISA bus, when SATA is in enhanced
mode.
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In APIC mode:
IRQ #
Used For
Available
Available for PCI
Comment
0
Timer0
No
No
1
Keyboard
No
No
2
Slave 8259
No
No 3
COM2
No
Yes
Note (2)
4
COM1
No
Yes
Note (2)
5
PCI
Yes
Yes
6
Floppy Drive
Controller
No
Yes
Note (2)
7
LPT1
No
Yes
Note (2)
8
RTC
No
No 9
SCI
No
No
System Control Interrupt
10 - Yes
Yes
11 - Yes
Yes 12
PS/2 Mouse
No
Yes
Note (2)
13
FPU
No
No
14
IDE0
No
No 15
SATA
No
No
Note (3)
16
PIRQ[A]
For PCI
PCI IRQ line 1 + USB UHCI controller #3 + Graphics
controller + PCIE Slot 0 + PCIE Slot 4
17
PIRQ[B]
For PCI
PCI IRQ line 2 + AC97 Audio controller + PCIe Slot 1
+ PCIe Slot 5
18
PIRQ[C]
For PCI
PCI IRQ line 3 + USB UHCI controller #2 + Native
IDE + PCIe Slot 2
19
PIRQ[D]
For PCI
PCI IRQ line 4 + USB UHCI controller #1 + SATA +
SMBus + PCIe Slot 3
20
PIRQ[E]
No
21
PIRQ[F]
No
22
PIRQ[G]
No
23
PIRQ[H]
No USB UHCI Controller #0 + USB EHCI controller
DMA #
Used for
Available
Comment
0 Yes
1 Yes
2 Yes 3
LPT
Yes
Unavailable if LPT is used in ECP mode.
4
Cascade
No
5 Yes 6 Yes
7 Yes
Note: 1 If the “Used For” device is disabled in setup, the corresponding interrupt is available for other devices.
2 Unavailable if baseboard is equipped with an I/O controller Winbond W627, and the device is enabled in
setup. Always available in legacy free versions of the BIOS.
3 Unavailable in SATA legacy mode. It cannot be used for PCI, but for ISA bus, when SATA is in enhanced
mode.
9.2 Direct Memory Access (DMA) Channels
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9.3 Memory Area
Upper Memory
Used for
Available
Comment
C0000h – CFFFFh
VGA BIOS
No D0000h – DDFFFh
Yes
shadow RAM (ISA bus restriction)
DE000h – DFFFFh
USB registers
No
E0000h – FFFFFh
System BIOS
No
I/O Address
Used for
Available
Comment
2e-2fh
Winbond external
I/O controller
No
Available if external I/O controller not used.
4e-4fh
TPM
No
Available if TPM not populated.
2F8-2FFh
COM1
No
Available if device is disabled in setup
3F8-3FFh
COM2
No
Available if device is disabled in setup
1000h >
PCI
No
I/O ports 1000h and above might be allocated by PCI devices or
onboard hardware.
PCI Device
Busmaster
PCI Interrupt
Comment
Audio, USB
and Ethernet
See IRQ
resource tables
above
Integrated in the Intel chipset. No REQx/GNTx
pair needed.
I2C Address
Used For
Available
Comment
JIDA-Bus-Nr.
A0h
JIDA-EEPROM
No
EEPROM for CMOS data.
0
A2h
JIDA-EEPROM
No 0
B0h
WD-PIC
No
Reserved for internal use.
0
9.4 I/O Address Map
The I/O-port addresses of the COMe-bCD2 are functionally identical with a standard PC/AT.
The following I/O ports are additionally used:
9.5 Peripheeral Component Interconnect (PCI) Devices
Note: You can use REQ0/GNT0, REQ1/GNT1, REQ2/GNT2, and REQ3/GNT3 pairs for external PCI devices.
9.6 Inter IC (I
2
C) Bus
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9.7 System Managment (SM) Bus
SM Bus Address
SM Device
Comment
JIDA-Bus-Nr.
10h
SMB Host
Do not use under any circumstances.
1
12h
SMART_CHARGER
Not to be used with any SM bus device except a charger
1
14h
SMART_SELECTOR
Not to be used with any SM bus device except a selector
1
16h
SMART_BATTERY
Not to be used with any SM bus device except a battery
1
30h
HW-Monitor
Can be used when there is no external SuperI/O
1
5Ch
HW-Monitor
Can be used when there is no external SuperI/O
1
A0h
SPD
SDRAM EEPROM
1
D2h
Clock generator
Do not use under any circumstances.
1
D4
Clockgenerator
Do not use under any circumstances
1
I2C Address
Used For
Available
Comment
JIDA-Bus-Nr.
A0h
JILI-EEPROM
No
EEPROM for JILI-Data
2
62h
Brightness control
No
MAX536262
2
Following SM bus addresses are reserved.
The standard COMe-bCD2 Power management BIOS supports the Smart Battery System M.A.R.S. If you
require further information about this topic, please contact Kontron Embedded Modules GmbH Technical
Support.
9.8 JILI I
2
C Bus
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10 BIOS Operation
Setup Screen
Location
Function
Menu Bar
Top
Lists and selects all top level menus.
Legend Bar
Bottom
Lists setup navigation keys.
Item Specific Help Window
Right
Help for selected item.
Menu Window
Left Center
Selection fields for current menu.
General Help Window
Overlay (center)
Help for selected menu.
The module is equipped with a Phoenix BIOS, which is located in an onboard Flash EEPROM. The device
has 8-bit access. Faster access (16 bit) is provided by the shadow RAM feature. You can update the BIOS
using a Flash utility.
10.1 Determining the BIOS Version
To determine the PhoenixBIOS version, immediately press the Pause key on your keyboard as soon as you
see the following text display in the upper left corner of your screen:
PhoenixBIOS 4.0 Release 6.1
Copyright 1985-2003 Phoenix Technology Ltd
All Rights Reserved
Kontron® BIOS Version <CCALR418>
© Copyright 2002-2010 Kontron Embedded Modules GmbH
For legacy and legacy free systems please use BIOS files called CCALR2XX. (See 2.2.1)
For legacy and legacy free systems please use BIOS files called CCALR4xx. (See 2.2.2)
10.2 Setup Guide
The PhoenixBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup
program uses a number of menus to make changes and turn features on or off.
Note: Selecting incorrect values may cause system boot failure. Load setup default values to recover by pressing
<F9>. It might also be necessary to use the “reset configuration data” option in the BIOS setup and set it to
“yes”. In certain circumstances this may also help to recover from system boot failure or a resource conflict.
10.2.1 Start Phoenix BIOS Setup Utility
To start the PhoenixBIOS setup utility, press <F2> when the following string appears during bootup.
Press <F2> to enter Setup
The Main Menu then appears.
The Setup Screen is composed of several sections:
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Menu Bar
Key
Function
<F1> or <Alt-H>
General Help window.
<Esc>
Exit menu.
or Arrow key
Select a menu.
or Arrow key
Select fields in current menu.
<Tab> or <Shift-Tab>
Cycle cursor up and down.
<Home> or <End>
Move cursor to top or bottom of current window.
<PgUp> or <PgDn>
Move cursor to next or previous page.
<F5> or <->
Select previous value for the current field.
<F6> or <+> or
<Space>
Select next value for the current field.
<F9>
Load the default configuration values for this menu.
<F10>
Save and exit.
<Enter>
Execute command or select submenu.
<Alt-R>
Refresh screen.
The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a
selection.
Legend Bar
Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The
table below describes the legend keys and their alternates.
Selecting an Item
Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value
for that field. The Save Value commands in the Exit menu save the values displayed in all the menus.
Displaying Submenus
Use the or key to move the cursor to the submenu you want. Then press <Enter>. A pointer ()
marks all submenus.
Item Specific Help Window
The Help window on the right side of each menu displays the Help text for the selected item. It updates
as you move the cursor to each field.
General Help Window
Pressing <F1> or <Alt-F1> on a menu brings up the General Help window that describes the legend keys
and their alternates. Press <Esc> to exit the General Help window.
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11 BIOS Setup
Feature
Option
Description
System Time
[hh:mm:ss]
<Tab>, <Shift-Tab>, or <Enter> selects field
System Date
[mm-dd-yyyy]
<Tab>, <Shift-Tab>, or <Enter> selects field
SMART Device Monitoring
Enabled
Disabled
Enables and disables the harddisk error
prediction tool
11.1 Info Screen
11.2 Main Menu
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11.2.1 IDE Channels Submenu
Feature
Option
Description
Type
User
Auto
CD-ROM
ATAPI Removable
Multi-Sector Transfers
Disabled
2 Sectors
4 Sectors
8 Sectors
16 Sectors
Specify the number of sectors per block for
multiple sector transfers
LBA Mode Control
Disabled
Enabled
Enabled LBA causes Logical Block
Addressing to be used in place of Cylinders,
Heads _Sectors.
32 Bit I/O
Disabled
Enabled
This setting enables or disables 32 bit data
transfers.
Transfer Mode
Standard
Fast PIO 1
Fast PIO 2
Fast PIO 3
Fast PIO 4
FPIO 3 / DMA 1
FPIO 4 / DMA 2
Selects the method for moving data to/from
the drive. Autotype the drive to select the
optimum transfer mode.
Ultra DMA Mode
Disabled
Selects the Ultra DMA mode used for moving
data to/from the drive. Autotype the drive
to select the optimum transfer mode.
SMART Monitoring
Shows if the device is capable of using the
error prediction tool
Note: Menu appearing depends on the connection of device
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11.3 Advanced
Feature
Option
Description
PNP OS installed
Other
Win95
Win98
WinME
Win2000
WinXP
Select the operating system installed on
your system which you will use most
commonly.
Reset Configuration Data
No
Yes
Select „Yes‟ if you want to clear the Extended
System Configuration Data (ESCD) area.
Large Disk Access Mode
Other
DOS
UNIX, Novell Netware, or other operating
systems, select „Other‟. If you are installing
new software and the drive fails, change this
selection and try again. Different operating
systems require different representations of
drive geometries.
Local Bus IDE adapter
Disabled
Primary
Secondary
Both
Enable the integrated local bus IDE adapter
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11.3.1 Keyboard Features Submenu
Feature
Option
Description
NumLock
Auto
On
Off
Selects Power-on state for NumLock
Key Click
Disabled
Enabled
Enables Key Click
Keyboard auto-repeat rate
30/sec
26.7/sec
21.8/sec
18.5/sec
13.3/sec
10/sec
6/sec
2/sec
Selects key repeat rate
Keyboard auto-repeat delay
¼ sec
½ sec
¾ sec
1 sec
Selects delay before key repeat
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11.3.2 Cache Memory Submenu
Feature
Option
Description
Memory Cache
Disabled
Enabled
Sets the state of the memory cache
Cache System BIOS area
Uncached
Write Protect
Controls caching of system BIOS area
Cache Video BIOS area
Uncached
Write Protect
Controls caching of video BIOS area
Cache Base 0-512k
Uncached
Write Through
Write Protect
Write Back
Controls caching of 512k base memory
Cache Base 512k-640k
Uncached
Write Through
Write Protect
Write Back
Controls caching of 512k 640k base memory
Cache Extended Memory Area
Uncached
Write Through
Write Protect
Write Back
Controls caching of system memory above
one megabyte
Cache A000-AFFF
Disabled
USWC caching
Write Through
Write Protect
Write Back
Disabled – This block is not cached.
USWC – Uncached Speculative Write
Combined.
Write Through – Writes are cached and sent
to main memory at once.
Write Protect – Writes are ignored.
Write Back – Writes are cached but not sent
to main memory until necessary
Cache B000-BFFF
Disabled
USWC caching
Write Through
Write Protect
Write Back
Cache C800-CBFF
Disabled
Write Through
Write Protect
Write Back
Disabled – This block is not cached.
Write Through – Writes are cached and sent
to main memory at once.
Write Protect – Writes are ignored.
Write Back – Writes are cached but not sent
to main memory until necessary
Cache CC00-CFFF
Disabled
Write Through
Write Protect
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Feature
Option
Description
Write Back
Cache D000-D3FF
Disabled
Write Through
Write Protect
Write Back
Cache D400-D7FF
Disabled
Write Through
Write Protect
Write Back
Cache D800-DBFF
Disabled
Write Through
Write Protect
Write Back
Cache DC00-DFFF
Disabled
Write Through
Write Protect
Write Back
Cache E000-E3FF
Disabled
Write Through
Write Protect
Write Back
Cache E400-E7FF
Disabled
Write Through
Write Protect
Write Back
Cache E800-EBFF
Disabled
Write Through
Write Protect
Write Back
Cache EC00-EFFF
Disabled
Write Through
Write Protect
Write Back
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11.3.3 Hardware Monitor Submenu
Feature
Option
Description
Edges Per Fan Revolution
0 … 15
This is used to configure the pulses per
revolution for you rfan
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11.3.4 Watchdog Settings Submenu
Feature
Option
Description
Mode
Disabled
Reset
NMI
Watchdog action
Timeout
1sec
5sec
10sec
30sec
1min
5.5min
10.5min
30.5min
Max. trigger periode
Delay
1sec
5sec
10sec
30sec
1min
5.5min
10.5min
30.5min
Time until watchdog timer starts to count
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11.3.5 Miscellaneous Submenu
Feature
Option
Description
Enabled memory gap
Disabled
Extended
If enabled, turn system RAM off to free
address space for use with an option card.
Either a 128KB conventional memory gap,
starting at 512KB, or a 1MB extended
memory gap, starting at 15MB, will be
created in system RAM.
Summary screen
Disabled
Enabled
Display system configuration on boot
Dark Boot
Disabled
Enabled
Prevent diagnostic screen output during
boot
Dark Boot Logo
0
1
Use -/+ to select the Dark Boot logo
0 – Vendor Logo
1 – Blank screen
Halt On Errors
No
Yes
Determines if errors cause the system to halt
QuickBoot Mode
Disabled
Enabled
Allows the system to skip certain tests while
booting. This will decrease the time needed
to boot the system.
Extended Memory Testing
Normal
Just zero it
None
Determines which type of tests will be
performed on extended memory (above
1MB).
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11.3.6 Console Redirection Submenu
Feature
Option
Description
Console
Disabled
UCR, COM A
UCR, COM B
JRC, Auto
Select the console redirection method
Baud Rate
300
1200
2400
9600
19.2k
38.4k
57.6k
115.2k
Enables the specified baud rate
Console Type
VT100
VT100, 8bit
PC-ANSI
PC-ANSI, 7bit
VT100+
VT-UTF8
ASCII
Enables the specified console type
Flow Control
None
XON/XOFF
CTS/RTS
Enables Flow Control
Console connection
Direct
Via modem
Indicate whether the console is connected
directly to the system or a modem is used to
connect
Continue C.R. after POST
Off
On
Enables Console Redirection after OS has
loaded
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11.4 Devices
Feature
Option
Description
Clock generator
Default
Program
Controls programming of the clock chip.
Default = Uses PowerOn defaults. No chip
access via SMBus needed.
Program = Allows to change spread spectrum
and FSB speed settings.
PS/2 Mouse
Disabled
Enabled
Auto Detect
„Disabled‟ prevents any installed PS/2 mouse
from functioning, but frees up IRQ12.
„Enabled‟ forces the PS/2 port to be enabled
regardless if a mouse is present.
„Auto Detect‟ will enable the PS/2 mouse
only if present.
„OS controlled‟ only displayed if the OS
controls the mouse.
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11.4.1 CPU Control
Feature
Option
Description
Core Mutli-Processing
Enabled
Disabled
Disables or enables the second CPU core
Processor Power Management
Disabled
GV3 only
C-States only
Enabled
Selects the Processor Power Management
desired:
Disabled = C-States and GV3 are disabled.
GV3 only = C-States are disabled.
C-States only = GV3 is disabled.
Enabled = C-States and GV3 are enabled
No Execute Mode Mem Protection
Disabled
Enabled
Intel® Virtualization Technology
Disabled
Enabled
When enabled, a VMM can utilize the
additional hardware virtualization
capabilities provides by this technology
Set Max Ext CPUID = 3
Disabled
Enabled
Sets Max CPUID extended function value to 3
CPU control detects which processor core is used and displays an additional submenu with the detected
processor core (yonah, merom, etc.).
Note: when a Pentium M C423 is in use, then GV3 is not possible and C-States only is the default setting of
Processor Power Management
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CPU Thermal Control
Feature
Option
Description
Thermal Control Circuit
Disabled
TM1
TM2
TM1 and TM2
Setting this bit enables the thermal control
circuit (TCC) portion of the Thermal Monitor
feature of the CPU.
Intel ® Thermal Monitor
TM1 = 50% duty cycle
TM2 = Geyserville III
PROCHOT# Enable
Disabled
Enabled
Enables the processors‟ PROCHOT# signal. If
asserted, TMx circuit will be engaged.
PROCHOT# is in addition to the TCC and
Enhanced TCC circuitry inside the processor
and either may engage TMx
DTS Enable
Disabled
Enabled
Enables the Yonah DTS to be used for
platform Thermal Management
Active Trip Point
Disabled
15 C
23 C
31 C
39 C
47 C
55 C
63 C
71 C
79C
87 C
95 C
103 C
111 C
119 C
This value controls the temperature of ACPI
Active Trip Point – the point in which the OS
will turn the CPU fan on
Passive Cooling Trip Point
Disabled
15 C
23 C
31 C
39 C
47 C
55 C
63 C
71 C
This value controls the temperature of ACPI
Passive Trip Point – the point in which the
OS will begin throttling the CPU
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Feature
Option
Description
79C
87 C
95 C
103 C
111 C
119 C
Passive TC1 Value
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
This value sets the TC1 value for the ACPI
Passive Cooling Formula
Passive TC2 Value
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
This value sets the TC2 value for the ACPI
Passive Cooling Formula
Passive TSP Value
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
This item sets the TSP value for the ACPI
Passive Cooling Formula. It represents the
tenth of a second how often the OS will read
the temperature when Passive Cooling is
Enabled
Critical Trip Point
POR
15 C
23 C
31 C
39 C
This value controls the temperature of the
ACPI Critical Trip Point – the point in which
the OS will shut the system off.
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Feature
Option
Description
47 C
55 C
63 C
71 C
79C
87 C
85 C
103 C
111 C
119 C
127 C
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11.5 Chipset Control
Feature
Option
Description
PCI Express Graphics Port
Disabled
Auto
Disabled – Port always disabled
Auto – Only enable if card found
Port ASPM Support
Disabled
Auto
Controls ASPM support for the PEG Device.
Auto = will set ASPC to the highest common
supported ASPM between the Port and
Endpoint
PCI Clock Run
Disabled
Enabled
If Enabled, the CLKRUN# logic will stop the
PCI Clocks
Serial IRQ Quiet Mode
Disabled
Enabled
Enabled: The Serial IRQ will be placed in
“Quiet” mode. Disabled: The Serial IRQ will
be placed in “Continuous” mode
Pop Up Mode Enable
Disabled
Enabled
If enabled, ICH will observe a bus master
request and it will take the system from a
C3/C4 state to a C2 state and auto enable
bus masters.
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Feature
Option
Description
If disabled, bus master traffic is a break
event and it will return from C3/C4 to C0
based on break events
Pop Down Mode Enable
Disabled
Enabled
If enabled, ICH will observe a NO bus master
request and it can to a previous C3 or C4
state.
If disabled, ICH will NOT attempt to
automatically return
Port 80h Cycles
LPC Bus
PCI Bus
Control where the Port 80h cycles are sent
Feature
Option
Description
Decode Range x Base
0h - FFFFh
Select I/O base address for generic decode
range
Decode Range x Size
Disabled
4
8
16
32
64
128
258
Select generic decode range size
LPC decode Ranges
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11.6 Integrated Video
Feature
Option
Description
Default Video Priority
IGD or PEG
PEG or IGD
both
Chossing 'IGD or PEG' will force the internal
graphics to be used as a boot display device
if it's enabled. With 'PEG or IGD' the
PCIexpress graphics will be used if present.
'Both' will initialize PEG AND IGD to allow
both being used in an OS. The option 'Both'
is not supported by Intel and may not work
in all configurations.
Default Primary Video Adapter
IGD
PEG
This entry allows to select the display device
used by the BIOS during POST and as the
basic graphics device for the OS. Only
devices that are ready to be used are listed
here. If 'Auto' is selected, the priority of the
primary display device is PEG>PCI>IGD
Integrated Graphics <IGD>
Disabled
Auto
Enable or Disable the Internal Graphics
Device by setting item to the desired value
DVMT 3.0 Mode
Fixed
DVMT
Combo
Select the configuration of the DVMT 3.0
Graphics Memory that Driver will allocate for
use by the Internal Graphics Device.
1.Fixed
2. DVMT
3. Combo
Pre-Allocated Memory Size
1MB
8MB
Select the amount of Pre-Allocated Graphics
Memory for use by the Internal Graphics
Device
Total Graphics Memory
64MB
128MB
MaxDVMT
Select the amount of Total Graphics Memory
– Pre-Allocated + Fixed + DVMT for use by the
Internal Graphics Device
DVMT Graphics Memory
Shows the current DVMT Graphics Memory
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11.6.1 Display Control
Feature
Option
Description
Display Mode
CRT only
TV only
LVDS only
CRT+LVDS
LVDS+SDVO
Select the enabled graphics output during
POST
JDA Revision
Shows the current revision of JDA
Flat Panel Type
VGA 1x18
SVGA 1x18
XGA 1x18
XGA 1x24
SXGA 2x18
SXGA 2x24
UXGA 2x18
Enter PAID
Enter FPID
Auto
Select [Auto] for JILI or one of the
predefined LCD‟s
Use [Enter PAID] or [Enter FPID] to manually
enter panel adapter ID or flat panel ID.
Flat Panel Scaling
Centered
Stretched
Brightness setting
0 … 255
This option allows to set the level of
brightness of a connected LCD. Values may
range from 0 to 255.
11.7 Chipset Integrated Devices
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Feature
Option
Description
HD Audio device
Disabled
Auto
Control Detection of the HD Audio Device.
Auto = HD Audio will be enabled if present,
disabled otherwise
Disabled = HD Audio will be unconditionally
disabled, regardless of precense.
AC97 Audio
Disabled
Auto
Control Detection of the AC97 Audio Device.
Auto = AC97 Audio will be enabled if
present, disabled otherwise
Disabled = AC97 Audio will be
unconditionally disabled, regardless of
presence.
SATA Controller Mode Option
Compatible
Enhanced
Compatible mode: SATA and PATA drives are
auto-detected and placed in Legacy mode
Enhanced (non-AHCI) mode: SATA and PATA
drives are auto-detected and placed in their
native modes
Disable Vacant Ports
Disabled
Enabled
Controls automatic disabling of vacant SATA
ports
Express Card #1/#2
Disabled
Auto
Enabled
'Auto' enables Express Card slot if card is
inserted. 'Enabled' or 'Disabled'
permanently enables/disables the slot.
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11.7.1 PCI Express Ports
Feature
Option
Description
PCI Express – Root Port 1
Disabled
Enabled
Auto
Control the PCI Express Port via this setup
option.
Disabled – Port always disabled.
Auto – Only enable if card found
Note that if Root Port 1 is disabled, Root
Ports 2-4 will be disabled as well.
PCI Express – Root Port 2
Disabled
Enabled
Auto
PCI Express – Root Port 3
Disabled
Enabled
Auto
PCI Express – Root Port 4
Disabled
Enabled
Auto
PCI Express – Root Port 5
Disabled
Enabled
Auto
PCI Express – Root Port 6
Disabled
Enabled
Auto
PCI Hot-Plug Resources
Disabled
Enabled
Enabled/Disable Hot-Plug support
Root Port ASPM Support
Disabled
Auto
Control ASPM support for all the enabled
Root Ports.
Auto = will set ASPM to the highest common
supported ASPM between the Port and
Endpoint.
Monitor PCIExpress Init
Disabled
Enabled
If enabled this control enables the watchdog
during PCIexpress init.
Delay before PCIe Init
Disabled
Enabled
If enabled this control activates a short
delay just before initializing PCIexpress
devices
Renew LAN regs from EEPROM
Disabled
Enabled
If enabled the LAN registers are re-read from
EEPROM during POST
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11.7.2 PCI/PNP ISA IRQ Ressource Exclusion
Feature
Option
Description
PCI IRQ line 1 - 8
Disabled
Auto Select
3
4
5
7
9
10
11
12
14
15
PCI devices can use hardware interrupts
called IRQs. A PCI device cannot use IRQs
already in use by ISA or EISA devices. Use
„Auto‟ only if no ISA or Eisa legacy cards are
installed.
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11.7.3 USB Ports
Feature
Option
Description
USB Controller
Disabled
Enabled
Controls the whole USB controller. If
disabled, no USB will be available.
USB UHCI Port 3
Disabled
Enabled
Controls USB Port 3 with two connectors.
Port 1 and 2 will always be active.
USB EHCI
Disabled
Enabled
Controls USB 2.0 functionality for all the
ports set to active state.
Legacy USB Support
Disabled
Enabled
Enable support for Universal Serial Bus
EHCI Legacy Support
Disabled
Enabled
This switch enables or disables EHCI support
in legacy mode.
EHCI Handoff Patch
Disabled
Enabled
This patch must be allied if OSes before
WinXP SP2 have problems gaining control
over USB EHCI ports. It should not be
necessary for newer OSes.
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11.8 LAN Options
Feature
Option
Description
LAN MAC address
LAN Controller #1
Disabled
Enabled
Enable/Disable the LAN controller on the
CPU module.
Onboard LAN PXE ROM
Disabled
Enabled
Enables the remote boot BIOS extension for
the onboard LAN controller.
Enable WOL
Disabled
Enabled
Enables the LAN device to wake the system
from a sleep state (wake-on-LAN).
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11.9 SIO Options
Feature
Option
Description
Serial port A
Disabled
Enabled
Auto
Configure using these options:
[Disabled] No Configuration
[Enabled] User Configuration
[Auto] BIOS or OS chooses configuration
Base I/O address
3F8
2F8
3E8
2E8
Set the base I/O address for serial port A
Interrupt
IRQ 3
IRQ 4
Set the interrupt for serial port A
Serial port B
Disabled
Enabled
Auto
Configure using these options:
[Disabled] No Configuration
[Enabled] User Configuration
[Auto] BIOS or OS chooses configuration
Mode
Normal
IR
ASK-IR
Set the mode for serial port B
Base I/O address
3F8
2F8
3E8
2E8
Set the base I/O address for serial port B
Interrupt
IRQ 3
IRQ 4
Set the interrupt for serial port B
Onboard LPT
Disabled
Enabled
Auto
Configures the onboard LPT controller
[Disabled] No Configuration
[Enabled] User Configuration
[Auto] BIOS or OS chooses configuration
Mode
Output only
Bi-directional
EPP
ECP
Set the mode for the parallel port using
options
Output only
Bi-directional
EPP
ECP
Base I/O address
378
278
Set the base I/O address for the parallel port
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Feature
Option
Description
3BC
Interrupt
IRQ 5
IRQ 7
Set the interrupt for the parallel port
DMA channel
DMA 1
DMA 3
Set the DMA channel for the parallel port
PS/2 Keyboard
Disabled
Enabled
Enables or disables PS/2 Keyboard
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11.10 Security
Feature
Option
Description
TPM Support
Disabled
Enabled
Enable Trusted Platform Module support
Set User Password
User Password to control access to the
system at boot
Set Supervisor Password
Supervisor Password to control acces to the
BIOS setup
Note: This menu only appears, when a TPM device is available on the board
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11.11 Power
Feature
Option
Description
After Power Failure
Stay Off
Last State
Power On
Sets the mode of operation if an AC/Power
Loss occurs. The two modes are:
Enabled restores the previous power state
before loss occurred,
Disabled keep the power off until the power
button is pressed.
The Disabled choice turns off Resume on
Modem Ring.
Power button legacy function
Disabled
Enabled
This switch dis- and enables power button
functions during POST and DOS
Wake On External Signal
Disabled
Enabled
This option allows to enable or disable
external wake-up via COM Express line
WAKE1#
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11.11.1 ACPI Parameter Control
Feature
Option
Description
Enable ACPI
No
Yes
En/Disable ACPI BIOS (Advance
Configuration and Power Interface)
Enable ACPI _Sx state
None
S1
S3
S1+S3
This option allows to selectively enable Sx
standby states for ACPI OS. Choosing „Nono‟
will force the OS to have only S1, S4 and S5
states.
Route S3 signal to baseboard
Disabled
Enabled
If S3_SUS is not routed to the baseboard
then switching off main power is prevented.
This will achieve shorter recovery time but
higher power consumption. Please be sure
your board supports the appropriate S3
state when making this choice
M.A.R.S.
Disabled
Enabled
Enable/Disable support for the Kontron
M.A.R.S. Smart Battery system. if enabled,
the Smart Battery system will appear as an
ACPI device and allow an ACPI aware OS to
display and handle battery related
information.
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11.12 Boot
Feature
Option
Descpription
Boot priority order
1:USB Key
2:USB CDROM
3:IDE CD
4:IDE 0
5:IDE 1
6:IDE 2
7:IDE 3
8:
Keys used to view or configure devices:
Up and Down arrows select a device.
<+> and <-> moves the device up or down.
<f> and <r> specifies the device fixed or
removable.
<x> exclude or include the device to boot.
<Shift + 1> enables or disables a device.
<1 – 4> Loads default boot sequence.
Excluded from boot order
IDE 4
IDE5
USB FDC
USB HDD
USB ZIP
USB LS120
PCI SCSI
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11.13 Exit
Feature
Description
Exit Saving Changes
Exit System Setup and save your changes to
CMOS.
Exit Discarding Changes
Exit utility without saving Setup data to
CMOS.
Load Optimized Defaults
Load customer specific default values
Save Optimized Defaults
Save customer specific default values
Load Setup Defaults
Load default values for all SETUP items
Discard Changes
Load previous values from CMOS for all
SETUP items
Save Changes
Save Setup Data to CMOS
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