Kontron User's Guide
COMe-bCD2
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Table of Contents
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Table of Contents
1 User Information ........................................................................................................ 6
1.1 About This Manual ............................................................................................. 6
1.2 Copyright Notice ............................................................................................... 6
1.3 Trademarks ...................................................................................................... 6
1.4 Standards ........................................................................................................ 6
1.5 Warranty ......................................................................................................... 6
1.6 Technical Support .............................................................................................. 7
2 Introduction .............................................................................................................. 8
2.1 COMe-bCD2 ...................................................................................................... 8
2.2 COMe-bCD2 Release Versions ............................................................................... 9
2.2.1 Single Channel Version ....................................................................................... 9
2.2.2 Dual Channel Version ......................................................................................... 9
2.3 COMe-bCD2 Module Overview ............................................................................... 9
2.4 Understanding COM Express® functionality .......................................................... 11
2.5 COM Express® Documentation ........................................................................... 11
2.6 COM Express® Benefits ..................................................................................... 12
3 Specifications ........................................................................................................... 13
3.1 Functional Specifications .................................................................................. 13
3.1.1 Block diagram ................................................................................................ 16
3.2 Mechanical Specifications ................................................................................. 17
3.3 Electrical Specifications .................................................................................... 17
3.3.1 Power Consumption ......................................................................................... 17
3.4 Environmental Specifications ............................................................................ 18
3.4.1 Temperature ................................................................................................... 18
3.4.2 Humidity ....................................................................................................... 18
3.5 MTBF ............................................................................................................. 18
4 Connector Pinouts ..................................................................................................... 19
4.1 Connector location .......................................................................................... 19
4.2 Pinout tables .................................................................................................. 20
4.2.1 Connector X1A ................................................................................................ 21
4.2.2 Connector X1B ................................................................................................ 25
4.3 Signal description ........................................................................................... 29
4.3.1 PCIexpress x1 lanes ......................................................................................... 29
4.3.2 USB .............................................................................................................. 29
4.3.3 SATA ............................................................................................................. 29
4.3.4 Audio ............................................................................................................ 29
4.3.5 Serial IRQ ...................................................................................................... 29
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4.3.6 VGA Output .................................................................................................... 29
4.3.7 LVDS Flat Panel Interface (JILI) .......................................................................... 30
4.3.8 Digital Flat Panel Interface (JIDI) ....................................................................... 30
4.3.9 Ethernet ........................................................................................................ 30
4.3.10 Power Control ................................................................................................. 31
4.3.11 Power Management ......................................................................................... 31
4.3.12 Miscellaneous Circuits ...................................................................................... 31
4.3.13 PCIexpress Graphics ......................................................................................... 32
4.3.14 PCI Bus .......................................................................................................... 32
4.3.15 IDE Port ......................................................................................................... 32
4.3.16 SDVO Output................................................................................................... 32
5 Special Features ........................................................................................................ 34
5.1 Watchdog Timer .............................................................................................. 34
5.2 General Purpose Input and Output ...................................................................... 34
6 Important Information ............................................................................................... 35
6.1 Cooling Solutions ............................................................................................ 35
7 Design Considerations ................................................................................................ 36
7.1 Thermal Management ....................................................................................... 36
7.2 COMe-bCD2 onboard Fan connector..................................................................... 37
7.2.1 Location and pinout of fan connector J4 .............................................................. 38
7.2.2 BIOS settings for fan control ............................................................................. 39
7.2.3 Electrical Characteristics ................................................................................... 39
8 Important Technology Information .............................................................................. 41
8.1 I/O APIC mode ................................................................................................ 41
8.1.1 Method of interrupts transmission ...................................................................... 41
8.1.2 Interrupt priority ............................................................................................ 41
8.1.3 More interrupts ............................................................................................... 41
8.2 Thermal Monitor and Catastrophic Thermal Protection ............................................ 41
8.2.1 Summary ....................................................................................................... 42
8.3 Processor Performance Control .......................................................................... 42
8.4 Thermal Management ....................................................................................... 43
9 System Ressources .................................................................................................... 44
9.1 Interrupt Request (IRQ) Lines ............................................................................ 44
9.2 Direct Memory Access (DMA) Channels ................................................................. 45
9.3 Memory Area .................................................................................................. 46
9.4 I/O Address Map ............................................................................................. 46
9.5 Peripheeral Component Interconnect (PCI) Devices ................................................ 46
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9.6 Inter IC (I2C) Bus ............................................................................................. 46
9.7 System Managment (SM) Bus ............................................................................. 47
9.8 JILI I2C Bus .................................................................................................... 47
10 BIOS Operation.......................................................................................................... 48
10.1 Determining the BIOS Version ............................................................................ 48
10.2 Setup Guide ................................................................................................... 48
10.2.1 Start Phoenix BIOS Setup Utility ......................................................................... 48
11 BIOS Setup ............................................................................................................... 50
11.1 Info Screen .................................................................................................... 50
11.2 Main Menu ..................................................................................................... 50
11.2.1 IDE Channels Submenu ..................................................................................... 51
11.3 Advanced ....................................................................................................... 52
11.3.1 Keyboard Features Submenu .............................................................................. 53
11.3.2 Cache Memory Submenu ................................................................................... 54
11.3.3 Hardware Monitor Submenu .............................................................................. 56
11.3.4 Watchdog Settings Submenu ............................................................................. 57
11.3.5 Miscellaneous Submenu.................................................................................... 58
11.3.6 Console Redirection Submenu ............................................................................ 59
11.4 Devices ......................................................................................................... 60
11.4.1 CPU Control .................................................................................................... 61
11.5 Chipset Control ............................................................................................... 65
11.6 Integrated Video ............................................................................................. 67
11.6.1 Display Control ............................................................................................... 68
11.7 Chipset Integrated Devices ................................................................................ 68
11.7.1 PCI Express Ports ............................................................................................. 70
11.7.2 PCI/PNP ISA IRQ Ressource Exclusion .................................................................. 71
11.7.3 USB Ports ...................................................................................................... 72
11.8 LAN Options ................................................................................................... 73
11.9 SIO Options .................................................................................................... 74
11.10 Security ......................................................................................................... 76
11.11 Power ........................................................................................................... 77
11.11.1 ACPI Parameter Control .................................................................................... 78
11.12 Boot ............................................................................................................. 79
11.13 Exit .............................................................................................................. 80
1 User Information
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1 User Information
1.1 About This Manual
This document provides information about products from Kontron Embedded Modules GmbH and/or its
subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is
supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-20012 Kontron Embedded Modules GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language or computer language, in any form or by any means
(electronic, mechanical, photocopying, recording, or otherwise), without the express written permission
of Kontron Embedded Modules GmbH.
DIMM-PC®, PISA®, ETX®, COM Express® , X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered
trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business
Machines Corp.
Microsoft is a registered trademark of Microsoft Corp.
Intel is a registered trademark of Intel Corp.
All other products and trademarks mentioned in this manual are trademarks of their
respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
1.5 Warranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During the warranty period, Kontron
Embedded Modules GmbH will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are
observed.
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The warranty does not apply to defects resulting from improper or inadequate maintenance or handling
by the buyer, unauthorized modification or misuse, operation outside of the product‟s environmental
specifications or improper installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products
not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded
Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available
for technical support. We are committed to making our product easy to use and will help you use our
products in your systems. Please consult our Web site at http://www.kontron.com/support for the latest
product documentation, utilities, drivers and support contacts. Consult our customer section
http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications
and additional tools and software. In any case you can always contact your board supplier for technical
support.
2 Introduction
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2 Introduction
2.1 COMe-bCD2
Based on the COM Express standard, Kontron‟s COMe-bCD2, powered by a variety of Intel Pentium core
duo processors, is a next-generation embedded module that brings advanced technology to tomorrow‟s
applications, as well as continuing today‟s legacy devices. Built around serial differential signaling
technologies, COMe-bCD2 modules incorporate the following interfaces into a 95 x 125 small form factor
embedded module:
Core 2 Duo / Core Duo / Celeron M
PCI Express, which provides a high performance I/O infrastructure with transfer rates
starting at 2.5 Giga transfers per second over a x1 PCI Express lane
PCI
Serial ATA (SATA II)
USB 2.0
LVDS
Intel High Definition Audio
Advanced Configuration and Power Interface (ACPI) for optimized power
management
The COMe-bCD2 is built around the Intel Core Duo processors that use the Yonah and Merom Cores and
the Mobile Intel 945GME Express chipset, which is the first mobile platform to offer PCI Express
functionality with extended life cycle support. These modules feature the most current desktop features
such as USB 2.0, SATA, and PCI Express buses.
The COMe-bCD2 delivers up to 2GHz performance and up to 2GB DDR2 RAM. For applications that require
advanced real-time video capabilities, the COMe-bCD2 has integrated graphics based on the Intel®
Graphics Media Accelerator 900 architecture and also supports PCI Express graphics.
Fast communications are possible courtesy of a Gigabit Ethernet port.
The COMe-bCD2 supports 5 PCI Express x1 Lanes and PCI Express cards as well as established hardware
solutions based on current buses such as 32-bit PCI. A Gigabit Ethernet port provides fast connectivity to
LAN/WAN and 8 USB 2.0 ports provide fast and sufficient interfaces for external peripherals.
COMe-bCD2 modules also provide the following interfaces that are always located in the same physical
position on each board:
PCI-express, PCI32, USB, serial ATA (SATA), parallel ATA (PATA), LVDS Multi Media ports, as well as an
ACPI (Advanced Configuration and Power Interface) for optimized power management. Six mounting
holes on the board provide secure mounting to allow the module increased shock and vibration
resistance.
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2.2 COMe-bCD2 Release Versions
The COMe-bCD2 module is available in two different versions. The single channel version has one
memory socket and the dual channel verison has two memory sockets. All statements in this document
are valid for both versions, except they market to be only valid for one version. Statements only valid for
the single channel version are highlighted in a light blue color and statements only valid for the dual
channel version are highlighted in a green color.
The main differences are:
2.2.1 Single Channel Version
Article number ends with a “-0”, “-1”, “-2” or “-3”
One memory socket
5 PCIexpress lanes of the chipset; Onboard LAN uses PCIexpress lane 1
No S3 cold support
Strict 12V supply voltage
Intel® 945GM
Ethernetcontroller: Realtec RTL8111B
Temperature sensor: LM 64
2.2.2 Dual Channel Version
Article number ends with a “-4”, “-5” or “-6”
Two memory sockets
5PCIexpress lanes of the chipset; Onboard LAN uses PCIexpress lane 5 which allows
optionally a x4 lane
S3 cold support
Wide Range power input from 8.5V to 18V
Intel® 945GME
Ethernetcontroller: Realtec RTL8111C
Temperature sensor: LM 87
2.3 COMe-bCD2 Module Overview
The international COM Express standard defines two new form factor sizes: Basic and Extended. The
primary difference between the Basic and Extended size is a larger board size and thermal envelope in
the Extended size. The COMe-bCD2 follows the basic form factor.
Five module Pin-out Type definitions exist for Basic and Extended modules. Pin-out Types 1-5 apply to
Basic and Extended module form factors. Pin-out Types 1-5 offer different functionalities. For a complete
explanation of the features of each of the Pin-out Types 1-5, please see the COM Express® Specification.
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The COMe-bCD2 uses the Pin-out Type 2 architecture, which includes PCI and IDE interfaces. These
modules either use onboard graphics capabilities or may use 16 PEG lanes to connect to an external
video controller. In case of onboard graphics, PEG pins may be alternatively used for two SDVO ports.
Pin-out Type 2 features include:
Dual 220 pin connectors (Primary Connector: Rows A-B and Secondary Connector:
Rows C-D, 440 pins total)
32-bit PCI interface
IDE port (to support legacy ATA devices)
Up to 5 PCI Express general purpose lanes
One, x16 PCI Express Graphics (PEG) slot
SDVO option (pins shared with PCI Express Graphics)
Maximum module input power capability extended to 188W
Up to 8 USB 2.0 ports; 4 shared over-current lines
Up to 4 Serial ATA or SAS ports
Dual 24-bit LVDS channels
Analog VGA and TV Out: Composite Video, S-Video, Component Video (YPbPr)
Intel High Definition Audio (Azalia) and AC '97 digital audio interface (external
CODEC)
Single Ethernet interface with integrated PHY
+12V primary power supply input, +5V standby and 3.3V RTC power supplies
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2.4 Understanding COM Express® functionality
All Kontron COM Express® basic and compact modules contain two connectors, each of which has two
rows. The primary connector has two rows called Row A and Row B. The secondary connector has two
rows called Row C and Row D.
The primary connector (Row A and Row B) feature the following legacy-free functionality:
Ethernet
Serial ATA (SATA)
USB 2.0
LVDS/VGA and dual display video
Intel High Definition Audio (Azalia)
LPC, an Intel proprietary low-pin count (LPC), which supports low-speed devices such
as RS-232 serial and parallel ports.
The secondary connector (Row C and Row D) provides support for the following buses and I/O:
PCI Express
PCI
IDE
2.5 COM Express® Documentation
This product manual serves as one of three principal references for an COM Express® design. It
documents the specifications and features of COMe-bCD2. The other two references, which are available
from your Kontron Support, include:
The COMexpress Specification define the module form factor, pinout, and signals.
The Carrier Board Design Guide serves as a general guide for baseboard design, with a
focus on maximum flexibility to accommodate a wide range of COM Express®
modules.
Note: Some of the information contained within this product manual applies only to certain product revisions (CE:
xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the
product revision of your module to see if this information is applicable.
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2.6 COM Express® Benefits
COM Express® basic modules are very compact (125 x 95 mm, 12mm thick), highly integrated
computers. All COM Express® modules feature a standardized form factor and a standardized connector
layout that carry a specified set of signals. Each COM Express® module is based on connector type of the
COMexpress specification. This standardization allows designers to create a single-system baseboard
that can accept present and future COM Express® modules.
COM Express® modules include common personal computer (PC) peripheral functions such as:
Graphics
USB ports
Ethernet
Sound
IDE (and SATA)
The baseboard designer can optimize exactly how each of these functions implements physically.
Designers can place connectors precisely where needed for the application on a baseboard designed to
optimally fit a system‟s packaging.
A peripheral PCI bus can be implemented directly on the baseboard rather than on mechanically
unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one
plug-in component simplifies packaging, eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of COM Express® modules. This flexibility can differentiate
products at various price/performance points, or to design future proof systems that have a built-in
upgrade path. The modularity of an COM Express® solution also ensures against obsolescence as
computer technology evolves. A properly designed COM Express® baseboard can work with several
successive generations of COM Express® modules.
An COM Express® baseboard design has many advantages of a custom, computer-board design but
delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.
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3 Specifications
3.1 Functional Specifications
Processor
Intel® Celeron® M, Core Duo® (Yonah Core)or Core2Duo® (Merom core) processor
Bus
533 / 667 MHz CPU bus
533/667 MHz memory bus
Chipset
Intel® 945GM (see 2.2.1)
Intel® 945GME (see 2.2.2)
ICH7M-DH
Cache, Second level
1MB (Celeron® M)
2x1MB (Core Duo®)
4MB (Core2Duo®)
Memory
One 200-pin DDR2-SO-DIMM (-533 or -667) (see 2.2.1)
Two 200-pin DDR2-SO-DIMM (-533 or -677) (see 2.2.2)
Note: COMe-bCD2 equipped with the CeleronM423 is not able to drive memory modules faster than DDR2-533.
Note: The dual channel version would be theoretically able to support 4GB of RAM. Practically this feature is in the
chipset not supported, therefore that maximum amount of RAM is about 3.3 GByte
PCI Express Graphics (PEG): Intel® 945GM/GME
One 16-lane PCI Express port for external PCI Express based graphics card
Serial Digital Video Output (SDVO): Intel® 945GM/GME
Concurrent Operation of PCI Express Graphics with SDVO
Supports appropriate external SDVO compontents (DVI, LVDS, TV-out)
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PCI Express: Intel® ICH7M-DH
5 PCI Express x1 lanes
Optionally 1 x4 lane and 1 x1 lane is possible by strapping option on the baseboard.
(see 2.2.2) To use this feature please pull-up AC_SYNC (A29) and AC_SDOUT (A33) to
3.3V.
PCI 32: Intel® ICH7M-DH
Parallel PCI Bus 32 bit 33 MHz
Low Pincount Bus (LPC): Intel® ICH7M-DH
Enhanced Intelligent Drive Electronics (EIDE): Intel® ICH7M-DH
One PCI Bus Master IDE port
Supports 2 IDE devices
Ultra 100 Direct Memory Access (DMA) mode
Programmed Input/Output (PIO) modes up to Mode 4 timing
Multiword DMA Mode 0,1,2 with independent timing
Serial ATA: Intel® ICH7M-DH
2 Channels Serial ATA
SATA Spec. Rev. 1.0 up to 150 MB/s per channel
SATA II (AHCI)
Supports RAID level 0 and 1
Universal Serial Bus: Intel® ICH7M-DH
8 USB 1.1/2.0 ports (UHCI and EHCI)
USB legacy keyboard support
USB floppy, CD-ROM, Hard drive, and memory stick boot support
Gigabit Ethernet: Realtek RTL8111B/C 10/100/1000
Fully compatible with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Onboard video graphics array (VGA): Intel® 945GM/GME:
Intel® Gen 3.5 Graphics engine
Dynamic Video Memory Technology (DVMT 3.0)
Cathode ray tube (CRT) up do QXGA
low voltage differential signaling (LVDS) liquid-crystal display (LCD) and SDVO
interfaces up to UXGA
Supports DX 9.1
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AC ’97 (Audio): Intel® 945GM/GME;
Up to 20 bit sample resolution
Multiple sample rates up to 48bit
Independent bus master logic for dual Microphone Input, dual PCM audio input, PCM
audio input, modem input, modem output and S/PDIF output.
Television output: Intel® 945GM/GME
3 integrated 10bit DACs
Overscaling
NTSC/PAL
HDTV support: 480p / 780p / 1080i / 1080p
BIOS: Phoenix, 1MB Flash-BIOS in Firmware Hub Flash Memory
NV-EEPROM for CMOS-setup retention without battery
Watchdog timer (WDT): Xilinx Microcontroller
Real-time clock (requires external battery)
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3.1.1 Block diagram
DDR2-
SDRAM
LCD (JILI)
CRT
IDE
USB
0-7
Connector AB
AC’97
Sound
RTC
MISC
Power Control
Speaker
Battery
SMB
I2C
VGA
Controller
SATA 0-1
PEG
TV out
ETXexpress-CD
CPU
Celeron M
Core Duo
Core 2 Duo
Host Bus
North Bridge
Intel 945GM
Hub Interface
South Bridge
Intel ICH7MDH
PCI BUS
Connector CD
LPC BUS
TPM
(optional)
PCIe 1-5
PCIe
Realtek
RTL8111
Gigabit Ethernet
SPI
BIOS
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3.2 Mechanical Specifications
Dimensions
95.0 mm x 125.0 mm
Height approx. 12 mm (0.4”)
3.3 Electrical Specifications
Supply Voltage
12V DC +/- 5%
8.5V DC to 18V DC widerange input (see 2.2.2)
Supply Voltage Ripple
Maximum 100 mV peak to peak 0 – 20 MHz
Supply Current 5 V_SB
0,33 A in S5 mode
0,43 A in S0
Note: S3 cold will drive all the powersupply for memory refreshing and chip supply through the 5V_SB line.
Therefore up to 2A of current is specified for the connectors and should be in mind when the powersupply is
dimenstioned.
The board works also without a 5V_SB line but not the ACPI states S3 and S5.
3.3.1 Power Consumption
The maximum Power Consumption of the different COMe-bCD2 modules is between 18 - 40W (100% CPU
load; 90°C CPU temperature). Further details with measurements and TDP values of the single variants
can be found in our customer section. Information there is available after registration.
All boards were equipped with DDR2 SDRAM. The Modules were tested using maximum CPU frequency.
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3.4 Environmental Specifications
3.4.1 Temperature
Operating: (with Kontron Embedded Modules heat-spreader plate assembly):
Ambient temperature: 0°C to 60°C
Maximum heatspreader-plate temperature: 0°C to 60°C
Non-operating: -30°C to 85°C
Note: The maximum operating temperature with the heatspreader plate is the maximum measurable temperature
on any spot on the heatspreader’s surface. You must maintain the temperature according to the above
specification.
Operating (without Kontron Embedded Modules heat-spreader plate assembly):
Maximum operating temperature: 0°C to 60°C
Non operating: -30 to +85 °C
Note: The maximum operating temperature is the maximum measurable temperature on any spot on a module’s
surface. You must maintain the temperature according to the above specification.
3.4.2 Humidity
Operating: 10% to 90% (non condensing)
Non operating: 5% to 95% (non condensing)
3.5 MTBF
The following MTBF (Mean Time Between Failure) values were calculated using a combination of
manufacturer‟s test data, if the data was available, and a Bellcore calculation for the remaining parts.
The Bellcore calculation used is “Method 1 Case 1”. In that particular method the components are
assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is
assumed to have not been burned in. Manufacturer‟s data has been used wherever possible. The
manufacturer‟s data, when used, is specified at 50° C, so in that sense the following results are slightly
conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt
water exposure, etc.) lower MTBF values.
System MTBF (hours) for single channel memory version: 152941
System MTBF (hours) for dual channel memory version: 191206
Notes: Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour typical operating
life. The above estimates assume no fan, but a passive heat sinking arrangement.
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need
to be considered for separately. Battery life depends on both temperature and operating conditions. When
the Kontron unit has external power; the only battery drain is from leakage paths.
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4 Connector Pinouts
Pin A1
Pin B1
Pin C1
Pin D1
Connector X1AConnector X1B
4.1 Connector location
There are 2 connectors on the basic sized module. Connector X1A and Connector X1B are shown in the
following drawing. It is a top layer view and the connectors are seen "through" the PCB.
Each connector consist s of 2 connector rows. Connector X1A has rows A and B and connector X1B has
rows C and D.
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4.2 Pinout tables
Type
Signal Description
I
Differential Pair Input
IO-2,5
Bi-directional 2,5 V IO-Signal
IO-3,3
Bi-directional 3,3 V IO-Signal
IO-5
Bi-directional 5 V IO-Signal
I-3,3
3,3 V Input
I-5
5 V Input
O
Differential Pair Output
OA
Output Analog
O-2,5
2,5 V Output
O-3,3
3,3 V Output
O-5
5 V Output
DP
Differential Pair Input/Output
PU
Pull-Up Resistor
PD
Pull-Down Resistor
PWR
Power Connection
Nc
Not Connected / Reserved
Notes: To protect external power lines of peripheral devices, make sure that: the wires have the right diameter to
withstand the maximum available current the enclosure of the peripheral device fulfils the fire-protection
requirements of IEC/EN60950
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4.2.1 Connector X1A
Pin
Signal
Description
Type
Termination
Comment
A1
GND
Power Ground
PWR - -
A2
GBE0_MDI3-
LAN_RXD- | Ethernet Receive Data -
I - -
A3
GBE0_MDI3+
LAN_RXD- | Ethernet Receive Data -
I - -
A4
GBE0_LINK100#
LAN_100LED# | Ethernet Speed LED
O-3,3 - On at 100Mb/s
A5
GBE0_LINK1000#
LAN_1000LED# | Ethernet Speed LED
O-3,3 - On at 1000Mb/s
A6
GBE0_MDI2-
LAN_RXD- | Ethernet Receive Data -
I - -
A7
GBE0_MDI2+
LAN_RXD- | Ethernet Receive Data -
I - -
A8
GBE0_LINK#
LAN_LILED# | LAN Link LED
O-3,3 - -
A9
GBE0_MDI1-
LAN_RXD- | Ethernet Receive Data -
I - -
A10
GBE0_MDI1+
LAN_RXD+ | Ethernet Receive Data +
I - -
A11
GND
Power Ground
PWR - -
A12
GBE0_MDI0-
LAN_TXD- | Ethernet Transmit Data -
O - -
A13
GBE0_MDI0+
LAN_TXD+ | Ethernet Transmit Data +
O - -
A14
GBE0_CTREF
ETH_CTREF
O-3,3 - -
A15
SUS_S3#
PM_SLP_S#3
O-3,3 - -
A16
SATA0_TX+
SATA0_TX+ | SATA 0 Transmit Data +
O - -
A17
SATA0_TX-
SATA0_TX- | SATA 0 Transmit Data -
O - -
A18
SUS_S4#
PM_SLP_S#4
O-3,3 - -
A19
SATA0_RX+
SATA0_RX+ | SATA 0 Receive Data +
I - -
A20
SATA0_RX-
SATA0_RX- | SATA 0 Receive Data -
I - -
A21
GND
Power Ground
PWR - -
A22
SATA2_TX+
SATA0_TX+ | SATA 2 Transmit Data +
O - -
A23
SATA2_TX-
SATA0_TX- | SATA 2 Transmit Data -
O - -
A24
SUS_S5#
PM_SLP_S#5
O-3,3 - -
A25
SATA2_RX+
SATA0_RX+ | SATA 2 Receive Data +
O - -
A26
SATA2_RX-
SATA0_RX- | SATA 2 Receive Data -
O - -
A27
BATLOW#
PM_BATLOW# | Battery Low
I-3,3
PU 8k2 3,3V
-
A28
ATA_ACT#
ATA_LED# | SATA LED
O-3,3
PU 10k 3,3V
-
A29
AC_SYNC
AC_SYNC | AC'97 Sync
O-3.3 - int. PD 20k in ICH7–PU to 3.3V f. x4
A30
AC_RST#
AC_RST# | AC'97 Reset
O-3,3 - int. PD 20k in ICH7
A31
GND
Power Ground
PWR - -
A32
AC_BITCLK
AC_BITCLK | AC'97 Clock
I-3,3 - int. PD 20k in ICH7
A33
AC_SDOUT
AC_SDATAOUT | AC'97 Data
O-3,3 - int. PD 20k in ICH7–PU to 3.3V f. x4
A34
BIOS_DISABLE#
BIOS_DISABLE#
I-3,3 - -
A35
THRMTRIP#
PM_THRMTRIP#_CON
IO-3,3
PU 10k 3,3V
-
A36
USB6-
USB_PN6 | USB Data – Port6
DP - int. PD 15k in ICH7
A37
USB6+
USB_PP6 | USB Data + Port6
DP - int. PD 15k in ICH7
A38
USB_6_7_OC#
USB_OC#_6_7 | USB OverCurrent Port 6/7
I-3,3 - -
A39
USB4-
USB_PN4 | USB Data - Port4
DP - int. PD 15k in ICH7
A40
USB4+
USB_PP4 | USB Data + Port4
DP - int. PD 15k in ICH7
A41
GND
Power Ground
PWR - -
A42
USB2-
USB_PN2 | USB Data - Port2
DP - int. PD 15k in ICH7
A43
USB2+
USB_PP2 | USB Data + Port2
DP - int. PD 15k in ICH7
A44
USB_2_3_OC#
USB_OC#_2_3 | USB OverCurrent Port 2/3
I-3,3
PU 10k 3,3V
-
A45
USB0-
USB_PN0 | USB Data - Port0
DP - int. PD 15k in ICH7
A46
USB0+
USB_PP0 | USB Data + Port0
DP - int. PD 15k in ICH7
A47
VCC_RTC
+V_BAT
PWR - -
A48
EXCD0_PERST#
Express Card Support [0]|card reset
O-3,3 - -
A49
EXCD0_CPPE#
Express Card Support [0]| capable c. request
I-3,3 - -
A50
LPC_SERIRQ
INT_SERIRQ | Serial Interrupt Request
IO-3,3
PU 8k2 3,3V
-
A51
GND
Power Ground
PWR - -
A52
PCIE_TX5+
n.c.
Nc - -
A53
PCIE_TX5-
n.c.
Nc - -
A54
GPI0
GPI0 | General Purpose Input 0
I-3,3
PU 10k 3,3V
-
A55
PCIE_TX4+
PCI Express lane 4 + Transmit
O - -
Connector X1A (Signal Levels A1-A55)
Pin A1-A55 [ LAN | Power | USB | SATA | PCIe | AUDIO]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
22
Connector X1A (Signal Levels A56-A110)
Pin
Signal
Description
Type
Termination
Comment
A56
PCIE_TX4-
PCI Express lane 4 -
O - -
A57
GND
Power Ground
PWR - -
A58
PCIE_TX3+
PCI Express lane 3 +
O - -
A59
PCIE_TX3-
PCI Express lane 3 -
O - -
A60
GND
Power Ground
PWR - -
A61
PCIE_TX2+
PCI Express lane 2 +
O - -
A62
PCIE_TX2-
PCI Express lane 2 -
O - -
A63
GPI1
GPI1 | General Purpose Input 1
I-3,3
PU 10k 3,3V
-
A64
PCIE_TX1+
PCI Express lane 1 +
O - -
A65
PCIE_TX1-
PCI Express lane 1 -
O - -
A66
GND
Power Ground
PWR - -
A67
GPI2
GPI2 | General Purpose Input 2
I-3,3
PU 10k 3,3V
-
A68
PCIE_TX0+
PCI Express lane 0 +
O - -
A69
PCIE_TX0-
PCI Express lane 0 -
O - -
A70
GND
Power Ground
PWR - -
A71
LVDS_A0+
LVDS_YAP0 | LVDS Channel A Data0+
O - -
A72
LVDS_A0-
LVDS_YAM0 | LVDS Channel A Data0-
O - -
A73
LVDS_A1+
LVDS_YAP1 | LVDS Channel A Data1+
O - -
A74
LVDS_A1-
LVDS_YAM1 | LVDS Channel A Data1-
O - -
A75
LVDS_A2+
LVDS_YAP2 | LVDS Channel A Data2+
O - -
A76
LVDS_A2-
LVDS_YAM2 | LVDS Channel A Data2 -
O - -
A77
LVDS_VDD_EN
LVDS_VDDEN | LVDS Panel Power Control
O-2,5 - -
A78
LVDS_A3+
LVDS_YAP3 | LVDS Channel A Data3+
O - -
A79
LVDS_A3-
LVDS_YAM3 | LVDS Channel A Data3-
O - -
A80
GND
Power Ground
PWR - -
A81
LVDS_A_CK+
LVDS_CLKAP | LVDS Channel A Clock+
O - -
A82
LVDS_A_CK-
LVDS_CLKAM | LVDS Channel A Clock-
O - -
A83
LVDS_I2C_CK
LVDS_DDCPCLK | JILI I2C Clock
IO-3,3
PU 4k7 3,3V
-
A84
LVDS_I2C_DAT
LVDS_DDCPDATA | JILI I2C Data
IO-3,3
PU 4k7 3,3V
-
A85
GPI3
GPI3 | General Purpose Input 3
I-3,3
PU 10k 3,3V
-
A86
KBD_RST#
H_RCIN# | Keyboard Reset
I-3,3
PU 10k 3,3V
-
A87
KBD_A20GATE
H_A20GATE
I-3,3
PU 10k 3,3V
-
A88
PCIE0_CK_REF+
CLK_PCIE_REF P
O - -
A89
PCIE0_CK_REF-
CLK_PCIE_REF P
O - -
A90
GND
Power Ground
PWR - -
A91
RSVD
n.c.
Nc - -
A92
RSVD
n.c.
Nc - -
A93
GPO0
GPO0 | General Purpose Output 0
O-3,3
PD 10k
-
A94
RSVD
n.c.
Nc - -
A95
RSVD
n.c.
Nc -
A96
GND
Power Ground
PWR - -
A97
VCC_12V
12V VCC
PWR - -
A98
VCC_12V
12V VCC
PWR - -
A99
VCC_12V
12V VCC
PWR - -
A100
GND
Power Ground
PWR - -
A101
VCC_12V
12V VCC
PWR - -
A102
VCC_12V
12V VCC
PWR - -
A103
VCC_12V
12V VCC
PWR - -
A104
VCC_12V
12V VCC
PWR - -
A105
VCC_12V
12V VCC
PWR - -
A106
VCC_12V
12V VCC
PWR - -
A107
VCC_12V
12V VCC
PWR - -
A108
VCC_12V
12V VCC
PWR - -
A109
VCC_12V
12V VCC
PWR - -
A110
GND
Power Ground
PWR - -
Pin A56-A110 [ Power | LVDS | PCIe ]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
23
Connector X1B (Signal Levels B1-B55)
Pin
Signal
Description
Type
Termination
Comment
B1
GND
Power Ground
PWR - -
B2
GBE0_ACT
LAN_ACTLED# | Ethernet Activity LED
O-3,3 - -
B3
LPC_FRAME#
LPC_FRAME# | LPC Frame Indicator
I-3,3 - -
B4
LPC_AD0
LPC_AD0 | LPC Adress & DATA Bus
IO-3,3
-
-
B5
LPC_AD1
LPC_AD1 | LPC Adress & DATA Bus
IO-3,3
-
-
B6
LPC_AD2
LPC_AD2 | LPC Adress & DATA Bus
IO-3,3
-
-
B7
LPC_AD3
LPC_AD3 | LPC Adress & DATA Bus
IO-3,3
-
-
B8
LPC_DRQ0#
SIO_DRQ#0 | LPC Request 0
I-3,3 - -
B9
LPC_DRQ1#
SIO_DRQ#1 | LPC Request 1
I-3,3 - -
B10
LPC_CLK
CLK_SIOEXTPCI
O-3,3 - -
B11
GND
Power Ground
PWR - -
B12
PWRBTN#
Power Button
I-5 - -
B13
SMB_CK
SMB_CLK | SMBUS Clock
O-3,3
PU 2k2 3,3V
-
B14
SMB_DAT
SMB_DATA | SMBUS Data
IO-3,3
PU 2k2 3,3V
-
B15
SMB_ALERT#
SMB_ALERT#
IO-3,3
PU 2k2 3,3V
-
B16
SATA1_TX+
SATA1_TX+
O - -
B17
SATA1_TX-
SATA1_TX-
O - -
B18
SUS_STAT#
PM_SUS_ STAT#
O-3,3 - -
B19
SATA1_RX+
SATA1_RX+
I - -
B20
SATA1_RX-
SATA1_RX-
I - -
B21
GND
Power Ground
PWR - -
B22
SATA3_TX+
SATA3_TX+
O - -
B23
SATA3_TX-
SATA3_TX-
O - -
B24
PWR_OK
ETX_PWR_OK | Power OK
I-3,3 - -
B25
SATA3_RX+
SATA3_RX+
I - -
B26
SATA3_RX-
SATA3_RX-
I - -
B27
WDT
Watch Dog Timer
O-3,3 - -
B28
AC_SDIN2
AC_SDATAIN2 | AC'97 Serial Input Data 2
I-3,3 - int. PD 20k in ICH7
B29
AC_SDIN1
AC_SDATAIN1 | AC'97 Serial Input Data 1
I-3,3 - int. PD 20k in ICH7
B30
AC_SDIN0
AC_SDATAIN0 | AC'97 Serial Input Data 0
I-3,3 - int. PD 20k in ICH7
B31
GND
Power Ground
PWR - -
B32
SPKR
AC_SPKR | Speaker
O-3,3 - int. PD 20k in ICH7
B33
I2C_CK
I2CLK
O-3,3
PU 2k2 3,3V
-
B34
I2C_DAT
I2DAT
IO-3,3
PU 2k2 3,3V
-
B35
THRM#
PM THRM# CON | Over Temperature
O-3,3
PU 10k 3,3V
-
B36
USB7-
USB_PN7 | USB Data – Port7
DP - int. PD 15k in ICH7
B37
USB7+
USB_PP7 | USB Data + Port7
DP - int. PD 15k in ICH7
B38
USB_4_5_OC#
USB_OC#_4_5 | USB OverCurrent Port 4/5
I-3.3
PU 10k 3,3V
-
B39
USB5-
USB_PN5 | USB Data- Port5
DP - int. PD 15k in ICH7
B40
USB5+
USB_PP5 | USB Data+ Port5
DP - int. PD 15k in ICH7
B41
GND
Power Ground
PWR - -
B42
USB3-
USB_PN3 | USB Data- Port3
DP - int. PD 15k in ICH7
B43
USB3+
USB_PP3 | USB Data+ Port3
DP - int. PD 15k in ICH7
B44
USB_0_1_OC#
USB_OC#_0_1 | USB OverCurrent Port 0/1
I-3.3
PU 10k 3,3V
-
B45
USB1-
USB_PN1 | USB Data- Port1
DP - int. PD 15k in ICH7
B46
USB1+
USB_PP1 | USB Data+ Port1
DP - int. PD 15k in ICH7
B47
EXCD1_PERST#
Express Card Support [1]|card reset
O-3,3 - -
B48
EXCD1_CPPE#
Express Card Support [1]| capable c.
I-3,3 - -
B49
SYS_RESET#
ETX_SYS_RESET# | Reset Input
I-3,3
PU 10k 3,3V
-
B50
CB_RESET#
PCI_RST# | PCI Bus Reset
O-3,3 - -
B51
GND
Power Ground
PWR - -
B52
PCIE_RX5+
n.c.
Nc - -
B53
PCIE_RX5-
n.c.
Nc - -
B54
GPO1
GPO1 | General Purpose Output 1
O-3,3
PD 10k
-
B55
PCIE_RX4+
PCI Express lane 4 + Recieve
I - availlable when ICH7-MDH or
Pin B1-B55 [ LAN | Power | USB | SATA | PCIe | AUDIO | LPC]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
4 Connector Pinouts
Kontron User's Guide ETXexpress® CD
24
Connector X1A (Signal Levels B56-B110)
Pin
Signal
Description
Type
Termination
Comment
B56
PCIE_RX4-
PCI Express lane 4 - Recieve
I - availlable when ICH7-MDH or
B57
GPO2
GPO2 | General Purpose Output 2
O-3,3
PD 10k
B58
PCIE_RX3+
PCI Express lane 3 + Recieve
I - availlable when ICH7-MDH or
B59
PCIE_RX3-
PCI Express lane 3 - Recieve
I - availlable when ICH7-MDH or
B60
GND
Power Ground
PWR - -
B61
PCIE_RX2+
PCI Express lane 2 + Recieve
I - -
B62
PCIE_RX2-
PCI Express lane 2 - Recieve
I - -
B63
GPO3
GPO3 | General Purpose Output 3
O-3,3
PD 10k
-
B64
PCIE_RX1+
PCI Express lane 1 + Recieve
I - -
B65
PCIE_RX1-
PCI Express lane 1 - Recieve
I - -
B66
WAKE0#
PCIE_WAKEI#
IO-3,3
PU 1k 3,3V
-
B67
WAKE1#
WAKE1#
I-3,3
PU 8k2 3,3V
-
B68
PCIE_RX0+
PCI Express lane 0 + Recieve
I - -
B69
PCIE_RX0-
PCI Express lane 0 - Recieve
I - -
B70
GND
Power Ground
PWR - -
B71
LVDS_B0+
LVDS_YBP0 | LVDS Channel B Data0+
O - -
B72
LVDS_B0-
LVDS_YBM0 | LVDS Channel B Data0-
O - -
B73
LVDS_B1+
LVDS_YBP1 | LVDS Channel B Data1+
O - -
B74
LVDS_B1-
LVDS_YBM1 | LVDS Channel B Data1-
O - -
B75
LVDS_B2+
LVDS_YBP2 | LVDS Channel B Data2+
O - -
B76
LVDS_B2-
LVDS_YBM2 | LVDS Channel B Data2 -
O - -
B77
LVDS_B3+
LVDS_YBP2 | LVDS Channel B Data3+
O - -
B78
LVDS_B3-
LVDS_YBM2 | LVDS Channel B Data3 -
O - -
B79
LVDS_BKLT_EN
BLON# | Panel Backlight ON
O-3,3 - -
B80
GND
Power Ground
PWR - -
B81
LVDS_B_CK+
LVDS_CLKBP | LVDS Channel B Clock+
O - -
B82
LVDS_B_CK-
LVDS_CLKBM | LVDS Channel B Clock-
O - -
B83
LVDS_BKLT_CTRL
LVDS BKLTCTL | Backlight Brightness Contr.
O-3,3 - -
B84
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B85
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B86
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B87
VCC_5V_SBY
+V_STBY_ETX | 5V Standby
PWR - -
B88
RSVD
n.c.
nc - -
B89
VGA_RED
CRT_RED | Analog Video RGB-RED
O - -
B90
GND
Power Ground
PWR - -
B91
VGA_GRN
CRT_GREEN | Analog Video RGB-GREEN
O - -
B92
VGA_BLU
CRT_BLUE | Analog Video RGB-BLUE
O - -
B93
VGA_HSYNC
CRT_HSYNC | Analog Video H-Sync
O-3,3 - -
B94
VGA_VSYNC
CRT_VSYNC | Analog Video V-Sync
O-3,3 - -
B95
VGA_I2C_CK
CRT_DDCACLK | Display Data Channel Clock
IO-5
PU 4k7 5V
-
B96
VGA_I2C_DAT
CRT_DDCADATA | Display Data Channel Data
IO-5
PU 4k7 5V
-
B97
TV_DAC_A
TV_DACA_CVBS | Composite CVBS
OA - -
B98
TV_DAC_B
TV_DADB_Y | TV Luminance Signal
OA - -
B99
TV_DAC_C
TV_DADC_C | TV Chrominance Signal
OA - -
B100
GND
Power Ground
PWR - -
B101
VCC_12V
12V VCC
PWR - -
B102
VCC_12V
12V VCC
PWR - -
B103
VCC_12V
12V VCC
PWR - -
B104
VCC_12V
12V VCC
PWR - -
B105
VCC_12V
12V VCC
PWR - -
B106
VCC_12V
12V VCC
PWR - -
B107
VCC_12V
12V VCC
PWR - -
B108
VCC_12V
12V VCC
PWR - -
B109
VCC_12V
12V VCC
PWR - -
B110
GND
Power Ground
PWR - -
Pin B56-B110 [ Power | PCIe | LVDS | TV]
Note: The termination resistors in this table are already mounted on the COM Express® board. Refer to the design
guide for information about additional termination resistors.
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