JVC AV-20N8VT Schematic

SCHEMATIC DIAGRAMS
COLOUR TELEVISION
AV-20N8(VT)
AV-20N8
AV-20N8
++−
COPYRIGHT 2000 VICTOR COMPANY OF JAPAN, LTD.
No. 56031 2-1
No. 56031
AV-20N8
2-2 No. 56031
STANDARD CIRCUIT DIAGRAM
AV-20N8

NOTE ON USING CIRCUIT DIAGRAMS

1. SAFETY
The components identified by the critical for safety. For continued safety replace safety critical components only with manufactures recommended parts.
2. SPECIFIED VOL T AGE AND W AVEFORM V ALUES
The voltage and waveform values have been measured under the following conditions. (1)Input signal : Colour bar signal (2)Setting positions of each knob/button and variable resistor
(3)Internal resistance of tester : DC 20k/V (4)Oscilloscope sweeping time : H ➞ 20µS/div
(5)Voltage values : All DC voltage values
* Since the voltage values of signal circuit vary to some extent
according to adjustments, use them as reference values.
3. INDICATION OF PARTS SYMBOL [EXAMPLE]
In the PW board : R1209 ➞ R209
4. INDICATIONS ON THE CIRCUIT DIAGRAM
(1)Resistors
Resistance value No unit : [] K: [K] M : [M]
Rated allowable power No indication : 1/4 [W] Others : As specified
Type No indication : Carbon resistor OMR : Oxide metal film resistor MFR : Metal film resistor MPR : Metal plate resistor UNFR : Non-flammable resistor FR : Fusible resistor
* Composition resistor 1/2 [W] is specified as 1/2S or Comp.
(2)Capacitors
Capacitance value 1 or higher : [pF] less than 1 : [µF]
Withstand voltage No indication : DC50 [V] AC indicated : AC withstand voltage [V] Others : DC withstand voltage [V]
* Electrolytic Capacitors
47/50 [Example]: Capacitance value [µF]/withstand voltage [V]
!!
! symbol and shading are
!!
: Original setting position when shipped
: V 5mS/div : Others Sweeping time is
specified.
Type No indication : Ceramic capacitor MY : Mylar capacitor MM : Metalized mylar capacitor PP : Polypropylene capacitor MPP : Metalized polypropylene capacitor MF : Metalized film capacitor TF : Thin film capacitor BP : Bipolar electrolytic capacitor TAN : Tantalum capacitor
(3)Coils
No unit : [µH] Others : As specified
(4)Power Supply
: B1 : 12V : 9V : 5V
* Respective voltage values are indicated.
(5)Test point
: Test point : Only test point display
(6)Connecting method
: Connector : Wrapping or soldering : Receptacle
(7)Ground symbol
# : LIVE side ground " : ISOLATED (NEUTRAL) side ground
: EARTH ground : DIGITAL ground
5. NOTE FOR REPAIRING SERVICE
This model’s power circuit is partly different in the GND. The differ­ence of the GND is shown by the LIVE : (#) side GND and the ISOLATED (NEUTRAL) : (") side GND. Therefore, care must be taken for the following points. (1)Do not touch the LIVE side GND or the LIVE side GND and the
ISOLATED (NEUTRAL) side GND simultaneously. If the above caution is not respected, an electric shock may be caused. Therefore, make sure that the power cord is surely removed from the receptacle when, for example, the chassis is pulled out.
(2)Do not short between the LIVE side GND and ISOLA TED (NEU-
TRAL) side GND or never measure with a measuring apparatus (oscilloscope, etc.) the LIVE side GND and ISOLATED (NEU­TRAL) side GND at the same time. If the above precaution is not respected , a fuse or any parts will be broken.
Since the circuit diagram is a standard one, the circuit and circuit constants may be subject to change for improvement without any notice.
No. 56031 2-3
AV-20N8
CONTENTS
SEMICONDUCTOR SHAPES ........................................................... 2-4
BLOCK DIAGRAM ............................................................................ 2-5
CIRCUIT DIAGRAMS
MAIN PWB CIRCUIT DIAGRAM............................................................................................... 2-7
CRT SOCKET PWB CIRCUIT DIAGRAM .............................................................................. 2-13
PATTERN DIAGRAMS
MAIN PWB PATTERN............................................................................................................. 2-15
CRT SOCKET PWB PATTERN............................................................................................... 2-17

SEMICONDUCTOR SHAPES

TRANSISTOR
BOTTOM VIEW
E C B
IC
BOTTOM VIEW
OUT E IN
CHIP IC
E
CB
IN E OUT
B
(G)C(D)E(S)
FRONT VIEW
1N
TOP VIEW
TOP VIEW
CHIP TR
C
E
CB
E
CB
1N
BE
TOP VIEWFRONT VIEW
1N
N
N
N
1
N
2-4 No. 56031
1
N
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