3-11 SAVE & EXIT MENU .............................................................................................. 32
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition November 20, 2014
Item Checklist
Motherboard
User’s Manual
CD for motherboard utilities
Cable(s)
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never
denies high performance
Onboard 1* mSATA slot
Onboard 1* half-size Mini-PCIE slot
Onboard 2 * RJ-45 gigabit Ethernet LAN port
Support dual HDMI outputs
Support USB 3.0 data transport demand
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
1
ease refer
1-2 Specification
Spec
Design
Embedded CPU
Memory Slot
Expansion Slot
Storage
LAN Chip
Audio Chip
BIOS
Rear Panel I/O
Front Panel I/O
Internal I/O
Description
8-layer SBC; PCB size: 10.1 cm x 10.1 cm
Integrated with Intel® Bay Trail-D/M/I series CPU
1 * DDR3L SODIMM Slot for un-buffered Single Channel
DDRIIIL 1066~1333* MHz SDRAM, expandable to 8GB
*DDR3L 1333 Mhz is optional for model with specific CPU. Pl
to the actual product you purchase and consult your dealer for more
information.
1* Half-size Mini-PCIE slot
1* SATAII 3Gb/s port
1* MSATA slot
Integrated with Intel 82583V PCI-E Gigabit LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
2-CH ALC887 HD audio chip
AMI 64MB Flash ROM
2* RJ-45 LAN port
2* USB 2.0 port
2* HDMI port
1* Audio Line-Out / SPDIF-Out jack
1* DC 9V~24V power-in connector
1* COM port
1* USB 2.0 port
1* USB 3.0 port
1* Internal DC 9V~24V power-in connector
1* SATA Power connector
1* SPEAK_CON header
1* Front panel header
2
USB 3.0 Port
COM Port
HDMI Port
HDMI Port
/Optical SPDIF OUT
1* CPU FAN header
1-3 Layout Diagram
Rear IO Panel Diagram:
RJ-45 LAN Ports
9V~24V DC
Power-in
Connector
USB 2.0 Ports
Front IO Panel Diagram:
USB 2.0 Port
Line-OUT
3
JBAT
Speaker
Connector
SATA Hard Disk
Power-Out Connector
JPCOM1
JME
JP1
Internal Diagram-Front Side:
MSATA Slot
AT-MODE1
RJ-45 LAN Port
Over USB 2.0 Port
RJ-45 LAN Port
Over USB 2.0 Port
HDMI Ports
Line-Out
/Optical SPDIF Out
9V ~24V DC
Power-in Connector
Half-size
Mini-PCIE Slot
Serial Port (COM1)
USB 2.0 Port over
USB 3.0 Port
SATAII Port
USB 2.0 Port
Header
DDR3L SODIMM Slot
4
Front Panel Header
Internal Diagram-Back Side:
Intel CPU
CPUFAN1 Header
5
Jumper
Jumper Name Description
JBAT CMOS RAM Clear Function Setting 2-Pin Block
JME Clear ME RTC Function Setting 2-Pin Block
JP1 Security Measure Function Select 2-Pin Block
AT-MODE1 AT Mode Function Select 2-Pin Block
JPCOM1 COM1 Port Pin9 Function Select 4-Pin Block
Connectors
UL1(Top)/ UL2(Top) RJ-45 LAN Port Connector x2
UL1(Bottom)/ UL2(Bottom) USB 2.0 Port Connector x2
HDMI1 HDMI Connector x2
HP_SPDIF1 Line Out Connector
USB1(Top) USB 2.0 Port Connector
USB1(Bottom) USB 3.0 Port Connector
COM1 Serial Port Connector
DCIN DC 9V~24V Power–in Connector
ATX2P Internal 9V~24V Power–in Connector
SATA1 SATA Port Connector
PWOUT1 SATA Power out Connector
Headers
F_USB1 USB 2.0 Port Header 9-pin Block
SPEAK_CON Speaker Header 4-pin Block
FP_CON1 Front Panel Header 4-pin Block
CPUFAN1 CPUFAN Header 3-pin Block
Connector
Name
/SPDIF Out Connector
Header Name Description
6
Chapter 2
Hardware Installation
2-1 Jumper Setting
JBAT (2-pin): Clear CMOS Setting
JBAT
1
1
1-2 Open: Normal;
JME (2-pin): Clear ME_RTC Function Setting
JME
1-2 Open: Normal;
1
7
1-2 Closed:Clear CMOS
CMOS Clear Setting
1-2 Closed:Clear ME_RTC.
1
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