TECHNICAL MANUAL
Of
Intel Cedar Trail-D & NM10 Chipset
Based
Mini-ITX M/B for ATOM Processor
NO. G03-NC9N-F
Revision: 1.0
Release date: September 14, 2012
Trademark:
*Specifications and Information contained in this documentation are furnished for information use only, and are subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.
i
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION........................................................................... |
iii |
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USER’S NOTICE ....................................................................................................................... |
iv |
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MANUAL REVISION INFORMATION....................................................................................... |
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ITEM CHECKLIST ..................................................................................................................... |
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CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD |
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1-1 |
FEATURE OF MOTHERBOARD................................................................................ |
1 |
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1-2 |
SPECIFICATION ......................................................................................................... |
2 |
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1-3 |
LAYOUT DIAGRAM.................................................................................................... |
3 |
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CHAPTER 2 |
HARDWARE INSTALLATION |
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2-1 |
JUMPER SETTING ..................................................................................................... |
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2-2 |
CONNECTORS AND HEADERS................................................................................ |
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2-2-1 |
CONNECTORS ............................................................................................. |
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2-2-2 HEADERS ..................................................................................................... |
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CHAPTER 3 INTRODUCING BIOS |
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3-1 |
ENTERNING SETUP................................................................................................... |
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3-2 |
BIOS MENU SCREEN ................................................................................................ |
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3-3 |
FUNCTION KEYS ....................................................................................................... |
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3-4 |
GETTING HELP .......................................................................................................... |
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3-5 |
MENU BAR.................................................................................................................. |
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3-6 |
MAIN MENU ................................................................................................................ |
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3-7 |
ADVANCED MENU..................................................................................................... |
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3-8 |
CHIPSET MENU.......................................................................................................... |
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3-9 |
BOOT MENU............................................................................................................... |
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3-10 |
SECURITY MENU ....................................................................................................... |
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3-11 |
SAVE & EXIT MENU................................................................................................... |
36 |
ii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in any area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer. Using the close case may decrease the life of other device because the higher temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion |
Revision History |
Date |
1.0 |
First Edition |
September 14, 2012 |
Item Checklist
5
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5
Motherboard
User’s Manual
DVD for motherboard utilities Cable(s)
I/O Back panel shield
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
zIntel Cedar Trail-D and NM10 chipset, with low power consumption never denies high performance
zSupport two DDRIII 800/1066MHz SO-DIMM up to 4GB
zSupport two Serial ATAII (3Gb/s) Devices
zOnboard dual Realtek RTL 8111EVL Gigabit Ethernet LAN chip
zIntegrated ALC662-GR 6-channel HD audio CODEC
zSupport USB 2.0 data transport demands
zSupport PCI slot and Mini-PCIE slot
zIntegrated with 24-bit single channel LVDS header
zSupport 6 * COM ports (COM2 for RS232/422/485)
zSupport Watchdog function
zSupports ACPI S3 Function
zSupport Smart Fan function
zCompliance with ErP standard
1
1-2 |
Specification |
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Spec |
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Description |
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Design |
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Mini-ITX form factor; PCB size: 17.0x17.0cm |
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Chipset |
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Intel®NM10 Express chipset |
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Embedded CPU |
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Intel Cedar Trail-D Processor |
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z DDRIII SO-DIMM slot x 2 |
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Memory Slot |
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Support two DDRIII 800/1066 MHz SO-DIMM with memory |
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capacity expandable to 4GB |
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Expansion Slot |
z 32-bit PCI slot x 1 |
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Mini-PCIE slot x1 |
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z Integrated with dual Realtek RTL8111EVL PCI-E Gigabit LAN |
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Dual LAN Chip |
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chips |
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z Support Fast Ethernet LAN function of providing |
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10/100/1000Mbps Ethernet data transfer rate |
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Audio Chip |
z Realtek ALC662-GR 6-channel Audio Codec integrated |
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Audio driver and utility included |
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BIOS |
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AMI 16MB DIP Flash ROM |
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z Serial port connector x 2 |
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z VGA port connector x1 |
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z HDMI port connector x1 |
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z USB 2.0 port connector x4 |
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z RJ-45 LAN connector x2 |
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z Audio connector x3 (Line-in/SPDIF-out; Line-out; MIC) |
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z Front panel audio header x1 |
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Multi I/O |
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4-pin USB 2.0 header x1 |
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z 9-pin USB 2.0 header x1 |
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z SM BUS header x1 |
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KBMS header x1 |
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GPIO header x1 |
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z Serial port header x4 |
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RS232/422/RS485 header x1 |
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PWRLED header x1 |
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zSpeaker header x1
zFront panel
zLANLED header x2
z24bit single channel LVDS header x1
zLVDS inverter x1
1-3 Layout Diagram
Rear IO Diagram
Serial Port |
VGA Port |
RJ-45 LAN Ports |
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Line-IN/ |
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Optical SPDIF OUT |
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Line-OUT |
12V DC |
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MIC-IN |
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Power-in Jack |
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Serial Port |
HDMI Port |
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USB 2.0 Ports |
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3
Motherboard Internal Diagram
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SATA Power Out |
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ATX12V Power Connector |
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CPUFAN1 Header |
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SFAN2 Header |
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12V DC
Power-in Jack
TX-RX COM
Header
Serial Ports |
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SODIMM1 Slot |
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Inverter |
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SODIMM2 Slot |
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LVDS Header |
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Intel |
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VGA Port over |
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KBMS |
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CPU |
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Header |
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HDMI Port |
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SFAN1Header |
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GPIO Header |
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Intel NM10 Chipset |
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RJ-45 LAN Port over |
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USB 2.0 Headers |
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USB 2.0 Ports |
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RJ-45 LAN Port over |
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SATAII Ports |
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USB 2.0 Ports |
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(SATA1/SATA2) |
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Serial Port Headers |
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Audio |
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Mini-PCIE Slot |
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(COM3/4/5/6) |
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Connectors |
LANLED Headers |
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Power LED Header |
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Speaker Header |
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PCI Slot |
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SM_BUS Header |
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Front Panel Header |
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Front Panel Audio Header
Notice! When installing only one SODIMM to the board, please always install it in SODIMM2 slot, otherwise system won’t start.
4
Motherboard Jumper Position
JP7
JP8
JP4
JP1 |
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JP2 |
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CASE_OPEN
JBAT1
JP9
JP5
5
Jumper
Jumper |
Name |
Description |
JBAT1 |
CMOS RAM Clear Function Setting |
3-Pin Block |
JP1 |
UL1/UL2 USB Ports Power On Function Select |
3-Pin Block |
JP2 |
LVDS PVCC 5V/3.3V Select |
3-Pin Block |
JP4 |
INVERTER VCC 12V/5V Select |
3-Pin Block |
JP5 |
USB 1/2 Header Power On Function Select |
3-Pin Block |
JP7 |
COM1 Port Pin9 Function Select |
6-Pin Block |
JP8 |
COM2 Header RS232/485/422 Function Select |
6-Pin Block |
JP9 |
MINIPCIE Power 3.3V/ 3VSB Select |
3-Pin Block |
COPEN |
Case Open Message Display Function |
2-Pin Block |
Connectors
Connector |
Name |
DC12V_IN |
DC 12V Power –in Connector |
COM(COM1/COM2) |
Serial Port Connector x 2 |
VGA1 |
Video Graphic Attach Connector |
HDMI1 |
High-Definition Multimedia Interface |
UL1(Top); UL2(Top) |
RJ-45 LAN Connector x 2 |
UL1(Middle & Bottom); |
USB 2.0 Port Connector x 4 |
UL2(Middle & Bottom) |
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AUDIO1 |
Line-in with SPDIF/Line-out/MIC |
ATX12V1 |
ATX 12V Power Connector |
SATA1/2 |
Serial ATAII Connector x 2 |
PWR2 |
SATA Power out Connector |
6
Headers
Header |
Name |
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Description |
AUDIO2 |
Front Panel Audio Header |
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9-pin block |
USB1 |
USB 2.0 Header |
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9-pin Block |
USB2 |
USB 2.0 Header |
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4-pin Block |
SM_BUS |
SM Bus Header |
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4-pin Block |
KBMS |
PS2 Keyboard & Mouse Header |
6-pin Block |
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GPIO1 |
GPIO Header |
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10-pin Block |
COM3/4/5/6 |
Serial Port Header x4 |
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9-pin Block |
TX_RX |
RS 422/485 Header |
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4-pin block |
PWR LED1 |
Power LED |
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3-pin Block |
SPEAK1 |
Speaker Header |
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4-pin Block |
JW_FP1 |
Front Panel Header(PWR |
LED/ |
9-pin Block |
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HD LED/ /Power Button /Reset) |
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LANLED1;LANLED2 |
LANLED Header x2 |
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2-pin Block |
CPUFAN1;SFAN1;SFAN2 |
FAN Speed Headers |
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3-pin Block |
LVDS1 |
24-bit single channel |
LVDS |
35-pin Block |
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Header |
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Inverter |
LVDS Inverter |
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8-pin Block |
7
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JBAT1 (3-pin): Clear CMOS
JBAT1
1 |
3 |
1-2 closed: Normal;
JBAT1
1 |
3 |
2-3 closed : Clear CMOS
(2) JP1 (3-pin): UL1/UL2 USB Ports Power on Function Select
JP1
1 3
1-2 closed : UL1/UL2 USB Ports Power on Function Disabled(default); JP1
1 3
2-3 closed: UL1/UL2 USB Ports Power on Function Enabled
8