Technical Manual
Of
Intel Bay Trail Series CPU
Based Mini-ITX M/B
NO.G03-NF9M-F
Revision: 1.0
Release date: March 12, 2014
Trademark:
*Specifications and Information contained in this documentation are furnished for information use only, and are subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION........................................................................... |
iv |
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USER’S NOTICE ....................................................................................................................... |
v |
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MANUAL REVISION INFORMATION ....................................................................................... |
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ITEM CHECKLIST ..................................................................................................................... |
v |
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CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD |
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1-1 |
FEATURE OF MOTHERBOARD................................................................................ |
1 |
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1-2 |
SPECIFICATION ......................................................................................................... |
2 |
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1-3 |
LAYOUT DIAGRAM.................................................................................................... |
3 |
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CHAPTER 2 |
HARDWARE INSTALLATION |
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2-1 |
JUMPER SETTING ..................................................................................................... |
8 |
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2-2 |
CONNECTORS AND HEADERS................................................................................ |
14 |
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2-2-1 |
CONNECTORS ............................................................................................. |
14 |
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2-2-2 HEADERS ..................................................................................................... |
16 |
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CHAPTER 3 INTRODUCING BIOS |
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3-1 |
ENTERING SETUP ..................................................................................................... |
25 |
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3-2 |
BIOS MENU SCREEN ................................................................................................ |
26 |
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3-3 |
FUNCTION KEYS ....................................................................................................... |
26 |
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3-4 |
GETTING HELP .......................................................................................................... |
27 |
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3-5 |
MEMU BARS............................................................................................................... |
27 |
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3-6 |
MAIN MENU ................................................................................................................ |
28 |
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3-7 |
ADVANCED MENU..................................................................................................... |
29 |
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3-8 |
CHIPSET MENU.......................................................................................................... |
39 |
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3-9 |
SECURITY MENU ....................................................................................................... |
42 |
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3-10 |
BOOT MENU............................................................................................................... |
43 |
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3-11 |
SAVE & EXIT MENU................................................................................................... |
44 |
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer. Using the close case may decrease the life of other device because the higher temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion |
Revision History |
Date |
1.0 |
First Edition |
March 12, 2014 |
Item Checklist
Motherboard
User’s Manual
CD for motherboard utilities Cable(s)
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never denies high performance
Support 2 * DDRIIIL SO-DIMM 1066/1333 MHz up to 8GB
Support Mini-PCIE connector
Support m-SATA connector
Support 2 * SATAII device
Integrated with 1 * 24-bit dual channel LVDS header
Support DVI-I output
Support USB 3.0 data transport demand
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
1
1-2 |
Specification |
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Spec |
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Description |
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Design |
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6 layers; PCB size: 17x 17 cm |
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Embedded CPU |
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NF9M-2930 Series: Intel® Bay Trail-M N2930 SoC CPU |
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NF9M-3827 Series: Intel® Bay Trail-I E3827 SoC CPU |
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Memory Slot |
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2 * DDRIIIL SODIMM Slot for un-buffered dual channel DDRIIIL |
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1333 MHz SDRAM, expandable to 8GB |
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Expansion Slot |
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1* |
Half-size Mini-PCIE slot |
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1* |
PCIE x1 slot |
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Integrated with dual Realtek RTL8111G PCI-E Gigabit LAN chips |
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LAN Chip |
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Support Fast Ethernet LAN function of providing |
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10/100/1000Mbps Ethernet data transfer rate |
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Storage |
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2* |
SATAII port |
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1* mSATA slot |
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BIOS |
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AMI 64MB Flash ROM |
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1* |
DC 9V~36V power-in connector |
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1* |
USB 3.0 port |
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3* |
USB 2.0 port |
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Rear I/O |
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1* |
DVI-I port |
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1* COM port |
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1* |
RJ-45 LAN port |
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Audio Line Out port x1 |
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2* |
SATAII 3Gb/s port |
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1* |
SATA Power connector |
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Internal I/O |
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1* CPU FAN header |
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2* SYSFAN header |
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1* |
Front panel audio header |
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1* |
SPDIF Out header |
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2 |
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1* SPEAK_CON header
1* Parallel port header
3* Serial port header
1* USB 2.0 header (Expansible to 2* USB 2.0 ports)
1* USB 3.0 header (Expansible to 2* USB 3.0 ports)
1* Power LED & speaker header
1* Front panel header
1* GPIO_CON header
1* PS2KBMS header
1* SMBUS header
1* LAN LED activity header
1* LVDS header
1* LVDS inverter
1-3 Layout Diagram
Rear IO Panel Diagram:
USB 2.0 Port |
USB 2.0 Ports |
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DVI-I Port |
COM1 Port |
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9V~36V |
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Line-Out Port |
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DC Power-in |
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Connector |
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USB 3.0 Port |
RJ-45 LAN Port |
3
Motherboard Internal Diagram
9V~36V Internal
Power connector
SYSFAN1 Header
9V ~36V DC
Power-in Connector
USB 3.0 Port
Over USB 2.0 Port
DVI-I Port
COM1 Port
LVDS Inverter
LVDS Header
RJ-45 LAN Port
USB 2.0 Ports
Line-Out Port
Intel CPU
DDR3L SODIMM Slot (SODIMM1)
Half-size
Mini-PCIE Slot (MPE)
M-SATA Slot
LAN_LED Header
DDR3L SODIMM Slot
(SODIMM2)
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SMBUS Header |
GPIO Header |
CPUFAN Header |
PS2KBMS Header
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SATA Hard Disk |
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Speaker |
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Power-Out Connector |
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Connector |
Serial Port Headers |
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SATAII Ports |
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(COM2/3/4) |
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USB 2.0 Header |
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USB 3.0 Header |
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Power LED Header |
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& Speaker Header |
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Front Panel |
SYSFAN2 Header |
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Audio Header |
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Front Panel Header |
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PCI Express x1 Slot Parallel Port Header |
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4
Jumper Position:
JBAT |
ME_RTC |
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JP1 |
JP2 |
COPEN AT-MODE |
JP3 |
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JP4
SYSFAN-DET
JP5
JP6 JP7
5
Jumper
Jumper |
Name |
Description |
JBAT |
CMOS RAM Clear Function Setting |
2-Pin Block |
ME_RTC |
Clear ME RTC Function Setting |
2-Pin Block |
COPEN |
Case Open Message Display Function |
2-Pin Block |
AT_MODE |
AT Mode Function Select |
2-Pin Block |
SYSFAN_DET |
SYSFAN1/SYSFAN2 R.P.M. Select |
3-Pin Block |
JP1 |
Security Measure Function Select |
2-Pin Block |
JP3 |
LVDS PVCC 5V/3.3V /12V Select |
4-Pin Block |
JP4 |
LCD Back Light 5V/12V/DCIN Select |
4-Pin Block |
JP2 |
COM1 Port Pin9 Function Select |
4-Pin Block |
JP5 |
COM2 Header Pin9 Function Select |
4-Pin Block |
JP6 |
COM3 Header Pin9 Function Select |
4-Pin Block |
JP7 |
COM4 Header Pin9 Function Select |
4-Pin Block |
Connectors
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Connector |
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Name |
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DCIN |
DC 9V~36V Power–in Connector |
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SATA1/SATA2 |
SATAII Port Connector |
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SATAPW |
SATA Power out Connector |
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CPUFAN |
CPUFAN Connector |
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SYSFAN1/SYSFAN2 |
SYSFAN Connector X2 |
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USB20/USB30(Top) |
USB 2.0 Port Connector X3 |
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USB30(Bottom) |
USB 3.0 Port Connector |
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LAN |
RJ-45 LAN Port Connector |
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DVI-I |
DVI-I Port Connector |
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COM1 |
Serial port |
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LINE_OUT |
Audio Line Out Connector |
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6 |
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Headers
Header |
Name |
Description |
FP_AUDIO |
Front Panel Audio Header |
9-pin Block |
SPDIF |
SPDIF Out Header |
2-pin Block |
SPEAK_CON |
Speaker Header |
4-pin Block |
LPT |
Parallel Port Header |
25-pin Block |
COM2/3/4 |
Serial Port Header X3 |
9-pin Block |
GPIO_CON |
GPIO Header |
10-pin Block |
FP_USB20 |
USB 2.0 Header |
9-pin Block |
FP_USB30 |
USB 3.0 Header |
19-pin Block |
SPK-LED |
Power LED & Speaker Header |
7-pin Block |
JW_FP |
Front Panel Header(PWR LED/ |
9-pin Block |
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HDD LED/Power Button /Reset) |
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PS2KBMS |
PS/2 Keyboard & Mouse Header |
6-pin Block |
SMBUS |
SMBUS Header |
4-pin Block |
LAN_LED |
LAN Activity LED Header |
2-pin Block |
LVDS |
LVDS Header |
30-pin Block |
INVERTER |
LVDS Inverter |
8-pin Block |
7
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JBAT (2-pin): Clear CMOS Setting
JBAT
1
1-2 Open: Normal |
1-2 Closed Clear CMOS |
CMOS Clear Setting
(2)ME_RTC (2-pin): Clear ME_RTC Function Setting
ME_RTC
1
1-2 Open: Normal 1-2 Closed Clear ME_RTC.
CMOS ME_RTC Setting
8
(3)COPEN (2-pin): Case Open Message Display Function Select
COPEN
1 2
1-2 Open: Normal;
1 |
2 |
1-2 Closed: Case Open
Function Selected (One Touch).
Pin 1-2 Closed: When Case open function pin short to GND, the Case open function was detected. When Used, needs to enter BIOS and enable ‘Case Open Detect’ function. In this case if your case is removed, next time when you restart your computer, a message will be displayed on screen to inform you of this.
(4)AT_MODE (2-pin): AT Mode Function Select
AT_MODE
1 2
1-2 Open: ATX Mode Selected;
1 |
2 |
1-2 Closed: AT Mode Selected.
9
Pin 1-2 closed: AT_MODE function is enabled. User needs to restart the system for the settings to take effect. In this case your computer will automatically turns on when power supply resumes.
(5) SYSFAN_DET (3-pin): SYSFAN1/SYSFAN2 R.P.M. Select
SYSFAN_DET |
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3 |
3 |
1 |
1 |
1-2 Closed |
2-3 Closed |
SYSFAN1 R.P.M. Selected; SYSFAN2 R.P.M. Selected.
(6)JP1 (2-pin): Security Measure Function Select
JP1
1
1-2 Open:Enable Security Measures
in the Flash Descriptor(Default);
1
1-2 Closed: Disable Security Measures
in the Flash Descriptor(Override).
10