Technical Manual
Of
Intel Bay Trail Series CPU
Based
3.5’’ SBC
NO.G03-NF3A-F
Revision: 2.0
Release date: June 20, 2014
Trademark:
*Specifications and Information contained in this documentation are furnished for information use only, and are subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... |
iv |
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USER’S NOTICE .................................................................................................................. |
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MANUAL REVISION INFORMATION................................................................................... |
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ITEM CHECKLIST ................................................................................................................ |
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CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD |
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1-1 |
FEATURE OF MOTHERBOARD ............................................................................ |
1 |
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1-2 |
SPECIFICATION .................................................................................................... |
2 |
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1-3 |
LAYOUT DIAGRAM ............................................................................................... |
3 |
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CHAPTER 2 |
HARDWARE INSTALLATION |
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2-1 |
JUMPER SETTING................................................................................................. |
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2-2 |
CONNECTORS AND HEADERS ............................................................................ |
14 |
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2-2-1 |
CONNECTORS ......................................................................................... |
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2-2-2 HEADERS................................................................................................. |
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CHAPTER 3 INTRODUCING BIOS |
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3-1 |
ENTERING SETUP................................................................................................. |
22 |
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3-2 |
BIOS MENU SCREEN ............................................................................................ |
23 |
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3-3 |
FUNCTION KEYS................................................................................................... |
24 |
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3-4 |
GETTING HELP...................................................................................................... |
24 |
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3-5 |
MEMU BARS.......................................................................................................... |
25 |
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3-6 |
MAIN MENU ........................................................................................................... |
26 |
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3-7 |
ADVANCED MENU ................................................................................................ |
27 |
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3-8 |
CHIPSET MENU..................................................................................................... |
37 |
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3-9 |
SECURITY MENU .................................................................................................. |
40 |
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3-10 |
BOOT MENU.......................................................................................................... |
41 |
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3-11 |
SAVE & EXIT MENU .............................................................................................. |
42 |
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer. Using the close case may decrease the life of other device because the higher temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion |
Revision History |
Date |
2.0 |
Second Edition |
June 20, 2014 |
Item Checklist
Motherboard
User’s Manual
CD for motherboard utilities Cable(s)
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never denies high performance
Support single channel DDRIIIL 1333 MHz SODIMM, up to 8GB
Support 1 * SATAII device
Onboard one full-size mSATA/ Mini-PCIE slot
Onboard one half-size Mini-PCIE slot
Onboard 2 * RJ-45 gigabit Ethernet LAN port
Integrated with 1 * 24-bit dual channel LVDS header
Support DVI-I output
Support USB 3.0 data transport demand
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
1
1-2 |
Specification |
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Spec |
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Description |
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Design |
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3.5”SBC; 6 layers; PCB size: 14.8x 10.2 cm |
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NF3A-2930 & NF3AB-2930 Series: Intel® Bay Trail-M N2930 |
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SoC CPU |
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Embedded |
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NF3A-2807 & NF3AB-2807 Series: Intel® Bay Trail-M N2807 |
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CPU |
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SoC CPU |
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NF3A-3827 & NF3AB-3827 Series: Intel® Bay Trail-I E3827 |
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SoC CPU |
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Memory Slot |
1 * DDRIIIL SODIMM Slot for un-buffered Single Channel |
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DDRIIIL 1333 MHz SDRAM, up to 8GB |
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Expansion |
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Full-size Mini-PCIE/mSATA slot x1 |
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Slot |
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Half-size Mini-PCIE slot x1 |
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Integrated with dual Realtek RTL8111G PCI-E Gigabit LAN |
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LAN Chip |
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chips |
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Support Fast Ethernet LAN function of providing |
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10/100/1000Mbps Ethernet data transfer rate |
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BIOS |
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AMI 64MB Flash ROM |
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1* DC 9V~24V power-in connector |
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3* USB 2.0 port |
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Rear I/O |
2* RJ-45 LAN port |
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1* DVI-I port |
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1* USB 3.0 port |
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Audio Line Out port x1 |
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1* SATAII 3Gb/s port |
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Internal I/O |
1* SATA Power connector |
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1* CPU FAN header |
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1* LVDS inverter |
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2 |
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1* Front panel audio header
1* SPDIF Out header
4* Serial port header
2* 9-pin USB 2.0 header (Expansible to 4* USB 2.0 ports)
1* GPIO header
1* SM_BUS header
1* PS2KBMS header
1* Front panel header
2* LAN LED activity header
1* LVDS header
1-3 Layout Diagram
Rear IO Panel Diagram:
USB 2.0 Port |
RJ-45 |
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LAN Ports |
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Line-Out Port |
DVI-I Port |
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9V~24V DC |
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Power-in |
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Connector |
USB 3.0 Port |
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USB 2.0 Ports |
3
Internal Diagram-Front Side:
Serial Port Header
INVERTER (COM4/3/2/1)
Front Panel
Audio Header
Line-Out Port
USB 3.0 Port
Over USB 2.0 Port
DVI-I Port
RJ-45 LAN Port
RJ-45 LAN Port
USB 2.0 Ports
9V ~24V DC
Power-in Connector
GPIO Header
USB 2.0 Header
SPDIF Out
Header Half-size
Mini-PCIE Slot
LVDS Header
Full-size
Mini-PCIE/mSATA Slot
DDR3L
SODIMM Slot
LANLED Headers
SATA
Power Connector
SATA II Port
CPUFAN Header
SMBUS Header
PS2KBMS Header
Front Panel Header
Power Switch Button
Reset Button
4
Internal Diagram-Back Side:
Intel CPU
5
Jumper Position:
JP2 |
COPEN |
JP4 |
JP6 |
AT-MODE
JP7
JP5
JP3
JP1
JBAT
6
Jumper
Jumper |
Name |
Description |
JP1 |
LVDS PVCC 5V/3.3V /12V Select |
4-Pin Block |
JP2 |
INVERTER VCC 5V/12V Select |
3-Pin Block |
JP3 |
COM4 Header Pin9 Function Select |
4-Pin Block |
JP4 |
COM3 Header Pin9 Function Select |
4-Pin Block |
JP5 |
COM2 Header Pin9 Function Select |
4-Pin Block |
JP6 |
COM1 Header Pin9 Function Select |
4-Pin Block |
JBAT |
CMOS RAM Clear Function Setting |
2-Pin Block |
COPEN |
Case Open Message Display Function |
2-Pin Block |
AT_MODE |
AT Mode Function Select |
2-Pin Block |
JP7 |
Security Measure Function Select |
2-Pin Block |
Connectors
Connector |
Name |
DCIN |
DC 9V~24V Power–in Connector |
SATA1 |
SATAII Port Connector |
PWOUT1 |
SATA Power out Connector |
CPUFAN |
CPUFAN Connector |
INVERTER |
LVDS Inverter Connector |
USB1/USB3(Top) |
USB 2.0 Port Connector X3 |
USB3(Bottom) |
USB 3.0 Port Connectors X1 |
LAN1/2 |
RJ-45 LAN Port Connector X2 |
DVI |
DVI-I Port Connector |
AUDIO |
Audio Line Out Connector |
7
Headers
Header |
Name |
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Description |
FP_AUDIO |
Front Panel Audio Header |
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9-pin Block |
SPDIFOUT |
SPDIF Out Header |
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2-pin Block |
COM1/2/3/4 |
Serial Port Header X4 |
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9-pin Block |
GPIO |
GPIO Header |
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10-pin Block |
USB3/ USB4 |
USB 2.0 Header |
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9-pin Block |
SMBUS |
SMBUS Header |
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4-pin Block |
PS2KBMS |
PS2KBMS Header |
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6-pin Block |
FP |
Front Panel Header(PWR |
LED/ |
8-pin Block |
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HDD LED/ /Power Button /Reset) |
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LAN1LED/LAN2LED |
LAN Activity LED Headers |
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2-pin Block |
LVDS |
24-bit LVDS Header |
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30-pin Block |
8
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JP1 (4-pin): LVDS PVCC 3.3V/5V/12V Function Select
JP1→LVDS |
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1 |
2 |
1 |
2 |
1 |
2 |
3 |
4 |
3 |
4 |
3 |
4 |
5 |
6 |
5 |
6 |
5 |
6 |
2-4 Closed: LVDS |
3-4 Closed: LVDS |
4-6 Closed: LVDS |
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VCC= 3.3V; |
VCC= 5V; |
VCC= 12V. |
(2) JP2 (3-pin): INVERTER VCC 5V/12V Select
JP2→INVERTER
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1 |
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3 |
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1-2 Closed: Inverter VCC= 5V; |
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1 |
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3 |
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2-3 Closed: Inverter VCC= 12V.
9
(3) JP3 (4-pin): COM4 Header Pin9 Function Select
JP3→COM4 |
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2 |
4 |
6 |
2 |
4 |
6 |
2 |
4 |
6 |
1 |
3 |
5 |
1 |
3 |
5 |
1 |
3 |
5 |
2-4 Closed: |
3-4 Closed: |
4-6 Closed: |
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RI=RS232; |
RI= 5V; |
RI= 12V. |
(4) JP4 (4-pin): COM3 Header Pin9 Function Select
JP4→COM3 |
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2 |
4 |
6 |
2 |
4 |
6 |
2 |
4 |
6 |
1 |
3 |
5 |
1 |
3 |
5 |
1 |
3 |
5 |
2-4 Closed: |
3-4 Closed: |
4-6 Closed: |
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RI=RS232; |
RI= 5V; |
RI= 12V. |
10