TECHNICAL MANUAL
Of
Intel Q87 Express Chipset
Based Mini-ITX M/B
NO. G03-NF9Q-F
Revision: 1.0
Release date: February 19, 2014
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION .......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM ....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................23
3-2 BIOS MENU SCREEN ................................................................................................24
3-3 FUNCTION KEYS .......................................................................................................24
3-4 GETTING HELP ..........................................................................................................25
3-5 MEMU BARS...............................................................................................................25
3-6 MAIN MENU ................................................................................................................26
3-7 ADVANCED MENU .....................................................................................................27
3-8 CHIPSET MENU..........................................................................................................36
3-9 BOOT MENU ...............................................................................................................40
3-10 SECURITY MENU .......................................................................................................42
3-11 SAVE & EXIT MENU...................................................................................................43
TABLE OF CONTENT
ii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
(s)
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition 2014-02-19
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable
I/O Back panel shield
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® Q87 express chipset
Support Intel® LGA 1150 Socket Intel® Core™ i3, i5, i7 & Pentium Processors in
LAG1150 Package
Support 2 * DDRIII SO-DIMM 1333/1600 MHz up to 16GB and dual channel
function
Integrated with Intel® i211AT and Intel® i217-LM Gigabit Ethernet LAN chip
Integrated ALC662 HD audio codec
Support HDMI and DVI-I video outputs
Support 4* SATAIII 6GB/S ports with RAID 0,1,5,10 function
Support 1*full-size Mini-PCIE slot (Selectable with MSATA)
Support 1*half-size Mini-PCIE slot
Support PCI Express x4 slot
Support USB 3.0 data transport demand
Integrated with 24-bit dual channel LVDS
Support CPU Smart FAN
Supports ACPI S3 Function
Compliance with EuP Standard
Support Watchdog Timer Technology
1
1-2 Specification
Spec Description
Design
Chipset
CPU Socket
Memory Slot
Expansion Slot
Mini-ITX form factor; 6 layers ; PCB size: 17.0x17.0cm
Intel® Q87 Express Chipset
Supports Intel® Core™ i7, Core™ i5, Core™ i3 series,
Pentium® processor in LAG1150 Package
* for detailed CPU support information please visit our website
DDRIII SO-DIMM slot x2
Support DDRIII 1333/1600 MHz DDRIII SO-DIMM
expandable to 16GB
Support dual channel function
1 pcs of PCI Express x 4 slot
1 pcs of full-size Mini-PCIE slot (Selectable with MSATA)
1 pcs of half-size Mini-PCIE slot
Storage
Dual LAN Chip
Audio Chip
BIOS
Multi I/O
4 * SATAIII 6Gb/s ports support RAID 0, 1, 5, 10 function
Integrated Intel® i211AT and i217-LM Gigabit Ethernet LAN
chip that support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Realtek ALC662 Audio Codec integrated
Audio driver and utility included
64M bit DIP Flash ROM
Rear Panel I/O:
1* 9V~24V DC Power In jack
1* HDMI port connector
1* DVI-I port connector
3* COM port connector
4* USB 3.0 port connector
2* RJ-45 LAN connector
2*Audio connector (Line-out, MIC)
2
Internal I/O Connectors& Headers:
MIC-IN
DVI-I Port
HDMI Port
1 *4-pin 9V~24V internal power connector
4* SATAIII connector
1* 4-pin SATA hard disk power connector
1* Front panel audio header
1* HDMI_SPDIF out header
2* LAN port activity indicator LED header
2* Serial port header
1* GPIO header
1* PS/2 KB & MS header
1* SM BUS header
1* LVDS Inverter
1* LVDS header
2* USB 2.0 header (support four expansion USB 2.0 ports)
1* USB 3.0 header (support two expansion USB 3.0 ports)
1* Speaker header + PWRLED header
1* Front panel header
3* Fan header
1-3 Layout Diagram
Rear IO Diagram
9V~24V
DC Power-in
Connector
Serial Port
(COM1)
Serial Port
(COM3)
Serial Port
(COM4)
3
RJ-45 LAN Ports
Line-OUT
USB 3.0 Ports
Motherboard Internal Diagram
USB 2.0 Headers
9V～24V Internal
Power Connector
DDRIII SODIMM Slot x 2
DDRIII 1333/1600）
Audio Connectors
GPIO Header
Intel Q87 Chipset
CPUFAN Header
RJ-45 Port over
LVDS Header
SATAIII Ports
Front Panel
Audio Header
Front Panel Header
SYSFAN1Header
Speaker &
Power LED Header
RJ-45 Port over
Serial Ports
Inverter
USB 3.0 Header
LAN2LED Header
SYSFAN2 Header
SM BUS
PS2
9V~24V DC
Connector
HDMI Port
Serial Port over
DVI-I Port
Half-size Mini-PCIE
Serial Port Headers
LAN1LED Header
Hard Disk
Power-in
KB &MS Heade
Power Connector
USB 3.0 Ports
USB 3.0 Ports
HDMI_SPDIF Header
Intel LGA 1150
CPU Socket
r
Header
LVDS
（
Full-size Mini-PCIE / M-SATA Connector
*PCI Express x4 Slot (PCIE1)
Connector
4
JP2
CASE_OPEN
JP5
JP6
JP7
JP1
JP8
AT-MODE
JP4
Motherboard Jumper Position
JBAT
5
Jumper
Jumper Name Description
JP1 COM1 Port Pin9 Function Select 4-pin Block
JP2 COM4 Port Pin9 Function Select 4-pin Block
JP6 LVDS2 PVCC 3.3V/5V/12V Select 4-pin Block
JP8 INVERTER2 Back Light 5V/12V Select 3-pin Block
JP5 MPE Slot VCC3.3V /3VSB Select 3-pin Block
JP7 MMPE Slot VCC3.3V /3VSB Select 3-pin Block
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP4 Security Measure Function Select 2-pin Block
AT-MOED ATX Mode & AT Mode Select 2-pin Block
COPEN Case Open Message Display Function 2-pin Block
Connectors
DCIN 9V~24V Main Power Connector
DCPWRIN 9V~24V Internal Power Connector
SATA1/2/3/4 SATAIII Connector x 4
HDMI High-Definition Multimedia Interface
USB1 USB 3.0 Port Connector x2
CRT-DVI(Bottom) DVI-I Port Connector
COM1(Top) COM1:Serial Port Connector
COM4-COM3( Bottom ) COM4:Serial Port Connector
COM4-COM3(Top) COM3:Serial Port Connector
UL1(Middle & Bottom)
/UL2(Middle & Bottom)
UL1(Top) / UL2(Top) RJ-45 LAN Connector x2
AUDIO( Bottom ) MIC Audio Connector
AUDIO(Top) Line out Audio Connector
Connector Name
USB 3.0 Port Connector x4
6
7
Headers
Front Panel Header(PWR LED/
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
SPDIFOUT HDMI_SPDIF Out Header 2-pin Block
LAN1LED/LAN2LED LAN LED Header 2-pin Block
COM2/5 Serial Port Header 9-pin block
GPIO GPIO Header 10-pin Block
PS2KBMS PS2 KB & MS Header 6-pin Block
SMBUS SM BUS Header 4-pin Block
INVERTER2 LVDS Inverter 8-pin Block
LVDS2 LVDS Header 30-pin Block
USB2/3 USB 2.0 Port Header 9-pin block
USB1 USB 3.0 Port Header 19-pin block
SPK-LED Power LED+ Speaker Header 7-pin Block
FP
SYSFAN1/SYSFAN2
/CPU FAN
HD LED/ /Power Button /Reset)
FAN Headers 4-pin Block
9-pin Block
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JP1 (4-pin): COM1 Connector Pin9 Function Select
JP1→COM1 Port
6 4 2
1
3
5
2-4 Closed:
RI=RS232;
2 4
6
1 3
5
3-4 Closed:
RI= 5V;
2 4 6
1 3
5
4-6 Closed:
RI= 12V.
(2) JP2 (4-pin): COM4 Header Pin9 Function Select
JP2→COM4 Port
6
4
2
2-4 Closed:
RI=RS232;
8
5
3
1
6
4
2
3-4 Closed:
RI= 5V;
5
3
1
6
4
2
4-6 Closed:
RI= 12V.
5
3
1
(3) JP6 (4-pin): LVDS2 PVCC 3.3V/5V/12V Select
JP6→LVDS2
1
3
5
2-4 Closed: LVDS
VCC= 3.3V;
2
4
6
(4) JP8 (3-pin): INVERTER2 VCC 5V/12V Select
JP8→INVERTER2
1-2 Closed: Inverter VCC= 5V;
2-3 Closed: Inverter VCC= 12V.
1
3
5
3-4 Closed: LVDS
VCC= 5V;
1 3
1
2
4
6
1
3
5
4-6 Closed: LVDS
VCC= 12V.
2
4
6
9
(5) JP5 (3-pin): MPE Slot VCC3.3V/ 3VSB Select
JP5→MPE Slot(Half-size Mini-PCIE Slot)
1-2 Closed: MPE Slot VCC= 3.3V;
2-3 Closed: MPE Slot VCC= 3VSB.
1 3
1
(6) JP7 (3-pin): MMPE Slot VCC3.3V/ 3VSB Select
JP7→MMPE Slot(Full-size Mini-PCIE/MSATA Slot)
1 3
1-2 Closed: MMPE Slot VCC= 3.3V;
1
2-3 Closed: MMPE Slot VCC= 3VSB.
10
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