Jetway Computer NF9J User Manual

TECHNICAL MANUAL

Intel Q87 Express Chipset

Based Mini-ITX M/B

NO. G03-NF9J-F

Revision: 2.0

Release date: August 16, 2013

Trademark:

* Specifications and Information contained in this documentation are furnished for i nforma tion use only , a nd are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................12

2-2-1 CONNECTORS .............................................................................................12

2-2-2 HEADERS .....................................................................................................14

TABLE OF CONTENT

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................22

3-2 BIOS MENU SCREEN ................................................................................................23

3-3 FUNCTION KEYS .......................................................................................................23

3-4 GETTING HELP ..........................................................................................................24

3-5 MAIN BARS.................................................................................................................24

3-6 MAIN MENU................................................................................................................25

3-7 ADVANCED MENU.....................................................................................................26

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................38

3-10 SECURITY MENU.......................................................................................................40

3-11 SAVE & EXIT MENU...................................................................................................41

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

2.0 Second Edition 2013-08-16

Item Checklist

Motherboard

DVD for motherboard utilities

User’s Manual

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Intel® Q87 express chipset

Support Intel® LGA 1150 Socket Intel® Core™ i3, i5, i7 & Pentium Processors in

LAG1150 Package

Support 2 * DDRIII SO-DIMM 1066/1333/1600 MHz up to 16GB and dual channel

function

Integrated with Intel® i211AT and Intel® i217-LM Gigabit Ethernet LAN chip

Integrated ALC662 6-channel HD Audio Codec

Support HDMI, DVI-D and VGA Video Outputs

Support 5* SATAIII 6GB/S ports with RAID 0,1,5,10 function

Support Mini-PCIE slot (Selectable with MSATA)

Support PCI Express x16 slot

Support USB 3.0 data transport demand

Integrated with 24-bit dual channel LVDS

Support CPU Smart FAN

Supports ACPI S3 Function

Compliance with EuP Standard

Support Watchdog Timer Technology

1-2 Specification

Spec Description

Design z

Chipset

CPU Socket

Memory Slot

Expansion Slot

z z

Mini-ITX form factor; 6 layers ; PCB size: 17.0x17.0cm Intel® Q87 Express Chipset

Supports Intel® Core™ i7, Core™ i5, Core™ i3 series,

Pentium® processor in LAG1150 Package

* for detailed CPU support information please visit our website

DDRIII SO-DIMM slot x2 Support DDRIII 1066/1333/1600 MHz DDRIII SO-DIMM

expandable to 16GB Support dual channel function 1 pcs of PCI Express x16 slot, support PCI Express 3.0

specification 1 pcs of Mini-PCIE slot (Selectable with MSATA)

Storage

Dual LAN Chip

Audio Chip

BIOS z

Multi I/O

5 * SATAIII 6Gb/s ports support RAID 0, 1, 5, 10 function

Integrated Intel® i211AT and i217-LM Gigabit Ethernet LAN

chip that support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate Realtek ALC662 6-channel Audio Codec integrated

Audio driver and utility included

64M bit DIP Flash ROM

Rear Panel I/O:

COM port connector x 2

USB 3.0 port connector x2

HDMI port connector x1

VGA port connector x1

DVI-D port connector x 1

USB 2.0 port connector x4

RJ-45 LAN connector x2

Audio connector x3(Line-in, Line-out, MIC)

Internal I/O Connectors& Headers:

1 *24-pin main power connector

1 *4-pin 12V Power connector

SATAIII Connector x5

Front panel audio header x1

HDMI_SPDIF header x1

NICLED header x2

Serial port header x2

GPIO header x1

PS/2 KB & MS header x1

SM BUS header x1

LVDS Inverter x1

LVDS header x1

USB 2.0 header x2 (support four expansion USB 2.0 ports)

USB 3.0 header x1 (support two expansion USB 3.0 ports)

Speaker header + PWRLED header x1

Front panel header x1

Fan header x 3

1-3 Layout Diagram

Rear IO Diagram

Serial Port

(COM1)

Serial Port

(COM2)

USB 3.0 Ports

HDMI Port

VGA Port

DVI-D Port

RJ-45 LAN Ports

Line-IN

Line-OUT

MIC-IN

USB 2.0 Ports

Motherboard Internal Diagram

Serial Por

GPIO Heade

Headers

Serial Ports

SYSFAN1

Header

ini-PCIE Slo

SATAIII Ports

(SATA1/2/3/4/5)

USB 2.0 Headers

Front Panel Heade

Speaker &

Power LED Heade

USB 3.0 Heade

USB 3.0 Ports

over HDMI Port

DVI-D Port over

VGA Port

RJ-45 Port over

USB 2.0 Ports

RJ-45 Port over

USB 2.0 Ports

Audio Connecto

LVDS Heade

SM BUS Heade

PS2 KB &MS Header

LVDS Inverter

ATX 12V

Power Connecto

Intel LGA 1150

CPU Socket

Front Panel

Audio Heade

*PCI Express x16 Slot (PE1)

Intel Q87 Chipset

HDMI_SPDIF Header

SYSFAN2 Heade

CPUFAN Heade

Main Power connector

DDRIII SODIMM Slot x 2

（DDRIII 1066/1333/1600）

ICLED Headers

JP6 J

JP7

Motherboard Jumper Position

P10

CASE_OPEN Heade

LAN Chip

JBAT

Audio Chip

Jumper

Jumper Name Description

JP2 COM1 Connector Pin9 Function Select 4-pin Block JP7 COM4 Header Pin9 Function Select 4-pin Block JP4 LVDS VCC 3.3V/5V/12V Select 4-pin Block JP5 Inverter 5V/12V Select 3-pin Block JP6 MSATA Slot VCC3.3V /3VSB Select 3-pin Block JBAT CMOS RAM Clear Function Setting 3-pin Block JP1 ME_Features Select 2-pin Block JP10 ATX Mode & AT Mode Select 2-pin Block CASE_OPEN Case Open Message Display Function 2-pin Block

Connectors

ATXPWR Main Power Connector ATX12V 12V Power Connector SATA1/2/3/4/5 SATAIII Connector x 5 COM1_2 Serial Port Connector x2 USB1 USB 3.0 Port Connector x2 HDMI High-Definition Multimedia Interface CRT+DVI1(Top) (Bottom) Video Graphic Attach Connector CRT+DVI1(Bottom) DVI-D Port Connector UL1(Middle & Bottom)

/UL2(Middle & Bottom) UL1(Top) / UL2(Top) RJ-45 LAN Connector x2 AUDIO Line Out /Line In /MIC Audio Connector

Connector Name

USB 2.0 Port Connector x4

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 9-pin Block HDMI_SPDIF HDMI_SPDIF Out Header 2-pin Block NIC_LED1/NIC_LED2 LANLED Header 2-pin Block COM3/4 Serial Port Header 9-pin block GPIO_CON GPIO Header 10-pin Block KBMS PS2 KB & MS Header 6-pin Block SM_BUS SM BUS Header 4-pin Block INVERTER LVDS Inverter 8-pin Block LVDS LVDS Header 30-pin Block USB2/3 USB 2.0 Port Header 9-pin block USB4 USB 3.0 Port Header 19-pin block JP3 Power LED+ Speaker Header 7-pin Block JW_FP

SYSFAN1/SYSFAN2 /CPU FAN

Front Panel Header(PWR LED/ HD LED/ /Power Button /Reset)

FAN Headers 4-pin Block

9-pin Block

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JP2 (4-pin): COM1 Connector Pin9 Function Select

JP2

642

2 4 6

1 3

2-4 Closed:

RI=RS232

(2) JP7 (4-pin): COM4 Header Pin9 Function Select

JP7

642

2-4 Closed:

RI=RS232

3-4 Closed:

RI= 5V;

3-4 Closed:

RI= 5V;

4-6 Closed:

RI= 12V ;

2 4 6

1 3

4-6 Closed:

RI= 12V ;

(3) JP4 (4-pin): LVDS VCC 3.3V/5V/12V Select

JP4

642

2-4 Closed: LVDS

VCC= 3.3V

3-4 Closed: LVDS

VCC= 5V ;

2 4 6

1 3

4-6 Closed: LVDS

VCC= 12V;

(4) JP5 (3-pin): Inverter 5V/12V Select

JP5

1 3

1-2 Closed: Inverter 5V Selected;

1 3

2-3 Closed: Inverter 12V Selected

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