Jetway Computer NF9E User Manual

TECHNICAL MANUAL

Intel Q77 Express Chipset

Based Mini-ITX M/B

NO.

G03-NF9E-R11-F

Revision: 1.1

Release date: September 27, 2012

Trademark:

* Specifications and Information contained in this documentation are furnished for i nforma tion use only , a nd are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................15

TABLE OF CONTENT

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................23

3-2 BIOS MENU SCREEN ................................................................................................24

3-3 FUNCTION KEYS .......................................................................................................24

3-4 GETTING HELP ..........................................................................................................25

3-5 MAIN BARS.................................................................................................................25

3-6 MAIN MENU................................................................................................................26

3-7 ADVANCED MENU.....................................................................................................27

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................39

3-10 SECURITY MENU.......................................................................................................40

3-11 SAVE & EXIT MENU...................................................................................................41

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERI ES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Date

1.1 2012-09-27

Item Checklist

Motherboard

DVD for motherboard utilities

User’s Manual

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Intel® Q77 express chipset

Supports 3rd and 2nd Generation Intel® Core™ i7, Core™ i5, Core™ i3 series

processor in LAG1155 Package

Support 2 * DDRIII SO-DIMM 1066-1333 MHz up to 16GB and dual channel

function

Integrated with Intel® 82574L and Intel® 82579LM Gigabit Ethernet LAN chip

Integrated ALC662 6-channel HD Audio Codec

Support USB 3.0 data transport demands.

Support PCI Express x16 and Mini-PCIE slot

Integrated with 24-bit dual channel LVDS

4* SATAII ports and 2* SATAIII ports

HDMI, DVI-D and VGA Video Outputs

Support CPU Smart FAN

Supports ACPI S3 Function

Compliance with EuP Standard

Support Watchdog Timer Technology

1-2 Specification

Spec Description

Design z

Chipset

CPU Socket

Memory Slot

Expansion Slot

Dual LAN Chip

Audio Chip

BIOS z

Multi I/O

z z

z z z

z z

z z z z z z z

z z z z

Mini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm Intel Q77 Express Chipset

Supports 3rd and 2nd Generation Intel® Core™ i7,

Core™ i5, Core™ i3 series processor in LAG1155 Package

* for detailed CPU support information please visit our website

DDRIII SO-DIMM slot x2 Support DDRIII 1066/1333 MHz DDRIII SO-DIMM

expandable to 16GB Support dual channel function 1 pcs of PCI Express x16 slot 1 pcs of Mini-PCIE slot

Integrated Intel® 82574L and 82579LM Gigabit Ethernet

LAN chip that supportFast Ethernet LAN function of

providing 10/100/1000Mbps Ethernet data transfer rate Realtek ALC662 6-channel Audio Codec integrated

Audio driver and utility included 64M DIP Flash ROM

HDMI port connector x1 VGA port connector x1 DVI-D port connector x 1 COM port connector x 2 USB 3.0 port connector x2 USB 2.0 port connector x4 RJ-45 LAN connector x2

Audio connector x1 (Line-in, Line-out, MIC)

USB 2.0 header x1 (support two expansion USB 2.0 ports) USB 3.0 header x1 (support two expansion USB 3.0 ports) SATAII Connector x4 SATAIII Connector x2 Front panel audio header x1

KBMS header x1

LVDS header x1

LVDS Inverter header x1

HDMI_SPDIF header x1

GPIO header x1

TX-RXCOM header x1

CIR header x1

NICLED header x2

Speaker header x1

PWRLED header x1

Front panel header x1

1-3 Layout Diagram

Rear IO Diagram

USB 3.0 Ports

HDMI Port

Serial Port

DVI-D Port

VGA Port

RJ-45 LAN Ports

Line-IN

Line-OUT

MIC-IN

USB 2.0 Ports

(

)

Motherboard Internal Diagram

SATAIII Ports

USB 3.0 Ports

over HDMI Port

LVDS Header

Serial Ports

KBMS Header

SYSFAN2

Header

Inverte

SATA1/2

SATAII Ports

(SATA3/4/5/6)

ATX Powerconnector

ini-PCIE Slo

USB 3.0 Heade

USB 2.0 Heade

PWRLED Header

Front Panel Heade

GPIO Header

DVI-D Port over

VGA Port

RJ-45 Port over

USB 2.0 Ports

RJ-45 Port over

USB 2.0 Ports

Audio Connecto

HDMI_SPDIF

Note: PE1

supports

Header

slot supports

PCI-Express 2.0 x16

PCI-Express 3.0 x1

TX-RX COM

Header

Intel

77 Chipset

ATX 12V

Power Connecto

Intel LGA1155

CPU Socket

attery Connector

Front Panel

Audio Heade

*PCI Express x16 Slot (PE1)

specification when using Intel® Sandy Bridge CPU and

6 specification when using Intel

CPUFAN Header

Ivy Bridge CPU.

Speaker Header

CIR Heade

SYSFA

1 Heade

DDRIII SODIMM Slotx 2

（DDRIII 1066/1333）

ICLED Heade

Motherboard Jumper Position

CASE_OPEN

JP1

JP4

JP2

JP3

JBAT

LAN Chi

LAN Chip

Audio Chip

Connectors

Connector Name

ATXPWR ATX Power Connector ATX12V ATX 12V Power Connector SATA1/SATA2 Serial ATAIII Connectors SATA3/SATA4/SATA5/SATA6 Serial ATAII Connectors HDMI High-Definition Multimedia Interface USB3 USB 3.0 Port Connector x2 KB(from UK1) PS2 Keyboard/Mouse Connector COM1_2 Serial Port Connector x2 DVI(Top) DVI-D Port Connector DVI(Bottom) Video Graphic Attach Connector UL1(Middle & Bottom) /UL2(Middle & Bottom) UL1(Top) / UL2(Top) RJ-45 LAN Connector x2 AUDIO1 Line Out /Line In /MIC Audio Connector

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 10-pin block KBMS PS/2 Keyboard & Mouse Header 6-pin block INVERTER LVDS Inverter 7-pin Block LVDS LVDS Header 36-pin Block HDMI_SPDIF HDMI_SPDIF Out Header 2-pin Block GPIO GPIO Header 10-pin Block TX-RX RS 422/485 port header 4-pin block CIR CIR Header 8-pin Block NIC_LED1/NIC_LED2 LANLED Header 2-pin Block USB1 USB 3.0 Port Header 20-pin Block USB2 USB 2.0 Port Header 10-pin Block PWR LED Power LED 3-pin Block SPEAK Speaker Header 4-pin Block

USB 2.0 Port Connector x4

JW_FP CPU FAN CPU FAN Header 4-pin Block

SYSFAN1/SYSFAN2 SYSFAN1/2 Header 3-pin Block

Front Panel Header(PWR LED/ HD LED/ /Power Button /Reset)

10-pin Block

Jumper

Jumper Name Description

JBAT CMOS RAM Clear Function Setting 3-pin Block JP1 KB/MS/USB 3.0 Port Power On Function Setting 3 pin Block JP9 USB Port 2.0 Power On Function Setting 3-pin Block JP3 USB1/2 Header Power On Function Setting 3-pin Block JP2 Mini PCI-E Power VCC3.3V /3VSB Select 3-pin Block JP4 LVDS PVCC 5V/3.3V Select 3-pin Block JP5 Inverter 12V/5V Select 3-pin Block JP6 COM2 Header RS232/485/422 Function Select 6-pin Block COPEN Case Open Message Display Function 2-pin Block

Hardware Installation

2-1 Jumper Setting

(1) JBAT (3-pin): Clear CMOS

Chapter 2

JBAT

1-2 Short： Normal；

CMOS Clear Set ti ng

2-3 Short： Clear CMOS

(2) JP1 (3-pin): KB/MS/Rear Panel USB3.0 Port Power On Function Setting

JP1

1-2 closed : KB/MS/Rear Panel USB 3.0 Port Power-on Disabled (Default)；

JP1

2-3 closed: KB/MS/ Rear Panel USB 3.0 Port Power-on Power-on Enabled

(3) JP9 (3-pin): Rear Panel USB 2.0 Port Power On Function Setting

JP9

1-2 closed : Rear Panel USB 2.0 Port Power-on Disabled (Default);

JP9

1 3

2-3 closed: Rear Panel USB 2.0 Port Power-on Enabled

(4) JP3(3-pin): USB 1/2 Header Power On Function Setting

JP3

1-2 closed : USB1/2 Header Power-on Disabled (Default);

JP3

2-3 closed: USB1/2 Header Power-on Enabled

(5) JP2 : Mini PCI-E Power VCC3.3V/ 3VSB Function Select

JP2

113

1-2 closed: MINI PCI-E VCC= VCC3.3V;

JP2

2-3 closed: MINI PCI-E VCC=3 VSB

(6) JP4 (3-pin): LVDS PVCC 5V / 3.3V Function Select

JP4

1-2 cl o se d: LVDS PV CC = 5V

JP4

2-3 closed : LVDS PVCC= 3.3V

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Jetway Computer NF9E User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual