NO.G03-NF94-F
Rev 4.0
Release date: December, 2009
TECHNICAL MANUAL
Of
Intel 945GSE Express Chipset
&
Intel FW82801GBM ICH Chipset
Based
Mini-ITX M/B For ATOM Processor
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION .................................................................. iv
USER’S NOTICE ...................................................................................................................... v
MANUAL REVISION INFORMATION ............................................................................... v
ITEM CHECKLIST ................................................................................................................. v
CHAPTER 1 INTRODUCTION OF VIA CHIPSET MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD .............................................................................. 1
1-2 SPECIFICATION ......................................................................................................... 2
1-3 LAYOUT DIAGRAM & JUMPER SETTING ........................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING ...................................................................................................... 7
2-2 CONNECTORS AND HEADERS ............................................................................... 11
2-2-1 CONNECTORS .............................................................................................. 11
2-2-2 HEADERS ....................................................................................................... 12
CHAPTER 3
3-1 ENTERING SETUP ........................................................................................................ 20
3-2 GETTING HELP ............................................................................................................. 20
3-3 THE MAIN MENU .......................................................................................................... 20
3-4 ADVANCED BIOS FEATURES .................................................................................... 23
3-4-1 CPU FEATURE ....................................................................................................... 26
3-5 INTERGRATED PERIPHERALS ................................................................................ 27
3-5-1 ONBOARD SUPERIO IO FUNCTION ................................................................ 28
3-6 PC HEALTH STATUS ................................................................................................... 30
3-7 ADVANCED CHIPSET FEATURES ............................................................................ 31
3-8 POWER MANAGEMENT SETUP ............................................................................... 32
3-9 PnP/PCI CONFIGURATION ........................................................................................ 34
3-10 MISCELLANEOUS CONFIGURATION ...................................................................... 34
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the
main chipset)
Generally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding spots’
that connect components and PCB. Computer should go through an adaptive phase
before it boots when it is moved from a cold environment to a warmer one to avoid
condensation phenomenon. These water drops attached on PCB or the surface of the
components can bring about phenomena as minor as computer instability resulted from
corrosion and oxidation from components and PCB or as major as short circuit that can
burn the components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer. Using the
close case may decrease the life of other device because the higher temperature in the
inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may decrease
the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS INTEL CHIPSET
MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL
CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF
BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
4.0 Fourth Edition December, 2009
Item Checklist
Motherboard
Cable(s)
CD for motherboard utilities
Motherboard User’s Manual
Back panel
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of motherboard
*
Intel 945GSE+ICH7M chipset.
*
Onboard ATOM CPU, with low power consumption never denies high performance.
*
Support FSB 533MHz.
*
Support DDRII 400/533 up to 2GB.
*
Onboard REALTEK RTL 8111C Gigabit Ethernet LAN.
*
Integrated ALC662 6-channel HD audio CODEC
*
Support USB2.0 data transport demands.
*
Support RS232/422/485 and watchdog.
Mini ITX form factor 6 layers PCB size: 17.0x17.0cm
Intel 945GSE+ICH7M Chipset
200-pin DDRII SO-DIMM socket x1
Support DDRII 400/533MHz system Modules DDRII memory
Expandable to 2GB.
One PCI IDE controller that supports PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 100/66 functions that deliver
the data transfer rate up to 100 MB/s.
Integrated Realtek RTL8111C PCI-E Gigabit LAN.
Support Fast Ethernet LAN function of providing
10Mb/100Mb/1000Mb Ethernet data transfer rate
ALC662 6 channel Audio Codec integrated
Audio driver and utility included
PS/2 keyboard
IDE1 x1
SATAII x2
USB2.0 port x 4 and headers x2
RJ45 LAN connector x1
Audio connector x1 (Line-in, Line-out, MIC,SPDIF 0UT)
COM port connector x 2
COM Header x2
LVDS Connector x1
1-2 Specification
VGA Connector x1
HDTV OUT Connector x1
DVI Connector x1
Parallel Connector x1
1-3 Layout Diagram
Keyboard/ USB Power (JP1)
VGA and DVI-D an
d Parallel Connector
SATAII Connector (1,2)
HDTV OUT Connector
RealtekRTL8111C
Gigabit Lan
KB/USB Power On Function Setting
CMOS RAM Clear Function Setting
USB Power On Function Setting
Power RS232 Function Select
Power RS232 Function Select
Power RS232 Function Select
Power RS232 Function Select
COM4 RS232/422/485 Function Select
Video Graphic Attach Connector
Line-Out /MIC/Line-In Audio Connector
Serial Port COM Connector
Jumper
Connectors
Front panel audio Headers
Serial Port COM3/4 Connector
JW_FP1
(PWR LED/ HD LED/ /Power
Button /Reset)
Front Panel Header
(PWR LED/ HD LED/ /Power Button
/Reset)
Serial ATAII IDE Connector
Headers
2-3 K.B& USB POWER-ON Enabled
1-2 K.B&USB POWER-ON Disabled
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JP1: KB/USB Power On Function Setting
(2) Clear CMOS (3-pin): JBAT1
2-3 closed : LVDS VCC 3.3V
(3) JP3: Inverter backlights select (3-pin)
(4) JP4: LVDS 5V/3.3V Function setting (3-pin)