* Specifications and Information contained in this documentation are furnished for information use only, and ar e
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
5.0
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION............................................................................... iv
USER’S NOTICE.................................................................................................................................. v
z Avoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the
main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding spots’
that connect components and PCB. Computer should go through an adaptive phase
before it boots when it is moved from a cold environment to a warmer one to avoid
condensation phenomenon. These water drops attached on PCB or the surface of the
components can bring about phenomena as minor as computer instability resulted from
corrosion and oxidation from components and PCB or as major as short circuit that can
burn the components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer. Using the
close case may decrease the life of other device because the higher temperature in the
inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may decrease
the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND
WE DO ASSURE THIS MANUAL MEETS USE R ’S RE Q UI R E ME N T B UT W I LL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
5.0 Fifth Edition September, 2011
Item Checklist
5
Motherboard
5
Cable(s)
5
CD for motherboard utilities
5
Motherboard User’s Manual
5
Back panel
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
z
Intel GM45+ICH9M Series chipset.
z
Penyn CPU, with low power consumption never denies high performance.
z
Support FSB 1066MHz.
z
Support two DDRII SODIMM 800/667MHz up to 4 GB.
z
Onboard dual REALTEK RTL 8111C Gigabit Ethernet LAN chip.
z
Integrated ALC888 6-channel HD audio CODEC.
z
Support USB2.0 data transport demands.
z
Support RS422/485 and watchdog.
z
Support GPIO function.
z
Support Raid 0, Raid 1 function (only for NF93R).
1
1-2 Specification
Spec Description
Design
Chipset
CPU
Memory Socket
∗ Mini ITX form factor 8 layers PCB size: 17.0x17.0cm
∗ Intel GM45+ICH9M series chipset
∗ Penyn CPU
∗ 200-pin DDRII SO-DIMM slot x2
∗ Support DDRII SODIMM 800/667 MHz system Modules DDRII
SODIMM memory
∗ Expandable to 4GB.
Expansion Slots
Integrate IDE
LAN
Audio
BIOS
Multi I/O
∗ Mini PCI-E slot x1pcs
∗ One PCI IDE controller that supports PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 100/66 functions that deliver
the data transfer rate up to 100 MB/s.
∗ Support Raid 0, Raid 1 function(only for NF93R)
∗ Integrated dual Realtek RTL8111C PCI-E Gigabit LAN chip
∗ Support Fast Ethernet LAN function of providing
10Mb/100Mb/1000Mb Ethernet data transfer rate
∗ ALC888 6-channel audio codec integrated
∗ Audio driver and utility included
∗ Award 8MB Flash DIP ROM
∗ HDMI connector x1
∗ DVI-D connector x1
∗ VGA connector x1
∗ RJ-45 LAN connector x2
∗ USB 2.0 port x 4
∗ COM connector x 2