* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
3-14 SAVE & EXIT SETUP/EXIT WITHOUT SAVING........................................................41
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition September 24, 2012
Item Checklist
5
Motherboard
5
User’s Manual
5
CD for motherboard utilities
5
Cable(s)
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Pine Trail D Processor + ICH8M Chipset, with low power
consumption never denies high performance
Support SODIMM DDRIII 800 Single Channel, up to 4GB
Support 1 * SATAII Device
Onboard one CF/CF to SATA card Slot and two Mini PCIE slots
Onboard 4 * RJ-45 gigabit Ethernet LAN ports
Integrated with 1 * 18-bit Single Channel LVDS header
Support USB 2.0 data transport demands
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
1
1-2 Specification
Spec
Design
Chipset
Embedded
CPU
Memory Slot
Expansion
Slots
LAN Chip
BIOS
Rear I/O
Internal I/O
Description
3.5”SBC; 6 layers; PCB size: 14.8x 10.2 cm
z
Intel® ICH8M Express chipset
z
Intel® PineTrail D CPU
z
1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII
z
800 MHz SDRAM, expandable to 4GB
Notice:
*Support Small Outline DIMMs Raw Cards RC-B(1Rx8), and RC-F (2Rx8). Does
not support RC-A (2Rx16), RC-C (1Rx16), RC-D (2Rx16 dual die), and
RC-E(2Rx16)
CF/CF to SATA card slot x1
z
Mini-PCI E slot x2
z
Integrated with four Realtek RTL8111EVL PCI-E Gigabit LAN
z
chips
Support Fast Ethernet LAN function of providing 10/100/1000Mbps
z
Ethernet data transfer rate
AMI 8MB Flash ROM
z
DC12V power-in connector x1
z
Serial port x1
z
USB 2.0 port x 2
z
RJ-45 LAN port x4
z
SATAII 3 Gb/s port & SATA Power connector x1
z
CPU FAN header x1
z
Serial port header x1
z
GPIO header x1
z
CIR header x1
z
9-pin USB 2.0 header x2 (Expansible to 4* USB 2.0 ports)
z
2
Front panel header x1
z
LANLED header x1
z
VGA header x1
z
LVDS connector x1
z
LVDS inverter x1
z
1-3 Layout Diagram
Rear IO Panel Diagram:
DC12V
Power-in
Connector
Serial Port
RJ-45 LAN Ports
USB 2.0 Ports
3
K
r
r
Internal Diagram-Front Side:
INVERTER
LVDS Connector
DC 12V Power-in
Connector
Serial Port
VGA Header
Mini PCIE slot
USB 2.0 Ports
RJ-45 LAN Port
RJ-45 LAN Port
RJ-45 LAN Port
RJ-45 LAN Port
GPIO Header
Serial port Header
Mini PCIE slot
CF Card Slot
SATA II Port
Power Switch Button
Reset Button
SODIMM Slot
CPUFAN Header
Front Panel Heade
LANLED Header
USB 2.0
Header
CIR Header
SATA DIS
Power Connecto
4
Internal Diagram-Back Side:
LPC_Debug Connector
Intel ICH8M Chipset
*SIM Card Slot
Inter CPU
*Note:SIM card slot is optional, depending on the model you purchase.
3-Pin Block
JP4 COM2 Header Pin9 Function Select 6-Pin Block
JBAT CMOS RAM Clear Function Setting 3-Pin Block
Connectors
Connector Name
J1 DC 12V Power –in Connector
COM1 Serial Port COM Connector
USB1 USB 2.0 Port Connectors
LAN1/2/3/4 RJ-45 LAN Connectors
PWOUT SATA Power out Connector
SATA1 SATAII Connector
CPUFAN CPUFAN Connector
INVERTER LVDS Inverter Connector