TECHNICAL MANUAL
Of
Intel B85 Express Chipset
Based Mini-ITX M/B
NO. G03-NC9S-F
Revision: 1.0
Release date: November 21, 2013
Trademark:
* Specifications and Information contained in this documentation are furnished for i nforma tion use only , a nd are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
TABLE OF CONTENT
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................23
3-2 BIOS MENU SCREEN ................................................................................................24
3-3 FUNCTION KEYS .......................................................................................................24
3-4 GETTING HELP ..........................................................................................................25
3-5 MEMU BARS...............................................................................................................25
3-6 MAIN MENU................................................................................................................26
3-7 ADVANCED MENU.....................................................................................................27
3-8 CHIPSET MENU..........................................................................................................34
3-9 BOOT MENU...............................................................................................................39
3-10 SECURITY MENU.......................................................................................................41
3-11 SAVE & EXIT MENU...................................................................................................42
ii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition 2013-11-21
Item Checklist
5
Motherboard
5
DVD for motherboard utilities
5
User’s Manual
5
Cable(s)
5
I/O Back panel shield
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® B85 express chipset
z
Support Intel® LGA 1150 Socket Intel® Core™ i3, i5, i7 & Pentium Processors in
z
LAG1150 Package
Support 2 * DDRIII SO-DIMM 1333/1600 MHz up to 16GB and dual channel
z
function
Integrated with Intel® i217-LM Gigabit Ethernet LAN chip
z
Integrated ALC662 6-channel HD Audio Codec
z
Support 3* VGA Video Outputs
z
Support 2* SATAIII 6GB/S ports
z
Support Mini-PCIE slot (Selectable with MSATA)
z
Support PCI Express x16 slot
z
Support USB 3.0 data transport demand
z
Integrated with 24-bit dual channel LVDS
z
Support CPU Smart FAN
z
Supports ACPI S3 Function
z
Compliance with EuP Standard
z
Support Watchdog Timer Technology
z
1
1-2 Specification
Spec Description
Design z
Chipset
CPU Socket
Memory Slot
Expansion Slot
z
z
z
z
z
z
z
Mini-ITX form factor; 6 layers ; PCB size: 17.0x17.0cm
Intel® B85 Express Chipset
Supports Intel® Core™ i7, Core™ i5, Core™ i3 series,
Pentium® processor in LAG1150 Package
* for detailed CPU support information please visit our website
DDRIII SO-DIMM slot x2
Support DDRIII 1333/1600 MHz DDRIII SO-DIMM
expandable to 16GB
Support dual channel function
1 pcs of PCI Express x16 slot, support PCI Express 3.0
specification
1 pcs of Mini-PCIE slot (Selectable with MSATA)
Storage
Gigabit LAN Chip
Audio Chip
BIOS z
Multi I/O
2* SATAIII 6Gb/s ports
z
Integrated Intel® i217-LM Gigabit Ethernet LAN chip that
z
support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Realtek ALC662 6-channel Audio Codec integrated
z
Audio driver and utility included
z
64M bit DIP Flash ROM
Rear Panel I/O:
COM port connector x 3
z
VGA port connector x3
z
USB 3.0 port connector x2
z
USB 2.0 port connector x2
z
RJ-45 LAN connector x1
z
Audio connector x3(Line-in, Line-out, MIC)
z
Internal I/O Connectors& Headers:
1 *24-pin main power connector
z
2
1 *4-pin 12V power connector
z
SATAIII connector x2
z
Front panel audio header x1
z
PS/2 KB & MS header x1
z
HDMI_SPDIF out header x1
z
LAN LED header x1
z
Front panel header x1
z
Speaker + PWRLED header x1
z
Serial port header x3
z
USB 2.0 header x2 (support four expansion USB 2.0 ports)
z
TPM header x1
z
GPIO header x1
z
SM BUS header x1
z
LVDS header x1
z
LVDS Inverter x1
z
Fan header x 3
z
1-3 Layout Diagram
Rear IO Diagram
Serial Ports (COM1/2/3)
RJ-45 LAN Port
Line-IN
Line-OUT
MIC-IN
VGA Ports (CRT1/2/3)
USB 2.0 Ports
USB 3.0 Ports
3
Motherboard Internal Diagram
r
H
r
r
(
)
r
r
r
r
t
r
r
r
Serial Port over
VGA Port
Serial Port over
VGA Port
PS2 KB &MS Header
Serial Port over
VGA Port
USB 2.0 Ports
RJ-45 Port over
USB 3.0 Ports
Audio Connectors
HDMI_SPDIF Header
TPM Heade
Full-size
Mini-PCIE/MSATA
Selectable Slo
ATX 12V
Power Connecto
LANLED Heade
Intel LGA 1150
CPU Socket
SATAIII Ports
SATA1/2
Serial Port Headers
GPIO
eade
Intel B85 Chipset
LVDS Heade
SM BUS Heade
Front Panel
Audio Heade
Main Power connector
SYSFAN1 Header
LVDS Inverte
USB 2.0
Headers
CPUFAN Header
Speaker &
Power LED Heade
Front Panel Heade
SYSFAN2 Header
DDRIII SODIMM Slot x 2
（DDRIII 1333/1600）
*PCI Express x16 Slot
4
Motherboard Jumper Position
JP
JP5J
JP7 J
JP
JP
AT-M
4
COPEN
P13
P12
JP9
JP8
JBAT
3
6
ODE
5
Jumper
Jumper Name Description
JP4 COM1 Port Pin9 Function Select 4-pin Block
JP7 COM2 Port Pin9 Function Select 4-pin Block
JP12 COM4 Header Pin9 Function Select 4-pin Block
JP13 COM6 Header Pin9 Function Select 4-pin Block
JP8 Inverter Back Light 5V/12V Select 3-pin Block
JP9 LVDS PVCC 3.3V/5V/12V Select 4-pin Block
JP5 MMPE Slot 3.3V /3VSB Select 3-pin Block
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP3 Security Measures Function Select 2-pin Block
AT-MODE ATX Mode & AT Mode Select 2-pin Block
COPEN Case Open Message Display Function 2-pin Block
Connectors
ATXPWR Main Power Connector
ATX12V 12V Power Connector
SATA1/2 SATAIII Connector x 2
CRT1_COM1 (Top)/
CRT2_COM2 (Top)/
CRT3_COM3 (Top)
CRT1_COM1 (Bottom)/
CRT2_COM2 (Bottom)/
CRT3_COM3 (Bottom)
USB3 USB 2.0 Port Connector x2
UL1(Top) RJ-45 LAN Connector
UL1(Middle & Bottom)
AUDIO Line Out /Line In /MIC Audio Connector
Connector Name
Serial Port Connector x3
Video Graphic Attach Connector x3
USB 3.0 Port Connector x2
6
7
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
PS2KBMS PS2 KB & MS Header 6-pin Block
SPDIFOUT HDMI_SPDIF Out Header 2-pin Block
LANLED LAN LED Header 2-pin Block
FP
SPK-LED Power LED+ Speaker Header 7-pin Block
COM4/5/6 Serial Port Headers 9-pin Block
USB1/2 USB 2.0 Port Headers 9-pin Block
TPM TPM Header 19-pin Block
GPIO GPIO Header 10-pin Block
SMBUS SM BUS Header 4-pin Block
LVDS2 LVDS Header 30-pin Block
INVERTER2 LVDS Inverter 8-pin Block
SYSFAN1/SYSFAN2
/CPUFAN
Front Panel Header(PWR LED/ HD
LED/ /Power Button /Reset)
FAN Headers 4-pin Block
9-pin Block
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JP4 (4-pin): COM1 Port Pin9 Function Select
JP4→COM1 Port
642
1
3
5
2-4 Closed:
RI=RS232
24
6
13
5
3-4 Closed:
RI= 5V;
2 4 6
1 3
5
4-6 Closed:
RI= 12V ;
(2) JP7 (4-pin): COM2 Port Pin9 Function Select
JP7→COM 2 Po rt
642
1
3
5
2-4 Closed:
RI=RS232
8
24
6
13
5
3-4 Closed:
RI= 5V;
2 4 6
1 3
5
4-6 Closed:
RI= 12V ;
(3) JP12 (4-pin): COM4 Header Pin9 Function Select
JP12→COM4 Header
642
1
3
5
24
13
6
5
2 4 6
1 3
5
2-4 Closed:
RI=RS232
(4) JP13 (4-pin): COM6 Header Pin9 Function Select
JP13→COM6 Header
642
1
3
5
2-4 Closed:
RI=RS232
3-4 Closed:
RI= 5V;
24
6
13
5
3-4 Closed:
RI= 5V;
4-6 Closed:
RI= 12V ;
2 4 6
1 3
5
4-6 Closed:
RI= 12V ;
9
(5) JP8 (3-pin): INVERTER2 Back Light 5V/12V Select
JP8→INVERTER2
1
1-2 Closed: INVERT ER2 Back Light 5V Selected;
2-3 Closed: INVERTER2 Back Light 12V Selected.
(6) JP9 (4-pin): LVDS PVCC 3.3V/5V/12V Select
JP9→ LVDS2
642
1
3
5
2-4 Closed: LVDS
PVCC= 3.3V
1
3
24
6
13
5
3-4 Closed: LVDS
PVCC= 5V;
2 4 6
1 3
5
4-6 Closed: LVDS
PVCC= 12V.
10
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