Jetway Computer NC9R User Manual

TECHNICAL MANUAL

Intel Celeron 847/807 + Intel NM70 Chipset

Based Mini-ITX M/B

NO. G03-NC9R-F

Revision: 1.0

Release date: January 28, 2013

Trademark:

* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................11

2-2-1 CONNECTORS .............................................................................................11

2-2-2 HEADERS .....................................................................................................13

TABLE OF CONTENT

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................18

3-2 BIOS MENU SCREEN ................................................................................................19

3-3 FUNCTION KEYS .......................................................................................................19

3-4 GETTING HELP ..........................................................................................................20

3-5 MAIN BARS.................................................................................................................20

3-6 MAIN MENU................................................................................................................21

3-7 ADVANCED MENU.....................................................................................................22

3-8 CHIPSET MENU..........................................................................................................27

3-9 BOOT MENU...............................................................................................................31

3-10 SECURITY MENU.......................................................................................................33

3-11 SAVE & EXIT MENU...................................................................................................36

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition 2013-01-28

Item Checklist

Motherboard

DVD for motherboard utilities

User’s Manual

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Intel® Celeron 847/807 processor+ Intel® NM70 express chipset

Support 2 * DDRIII SO-DIMM 1066-1333 MHz up to 16GB and dual channel

function

Support PCI Express x16 and Mini-PCIE slot

Integrated with 24-bit dual channel LVDS header

Support 3 * Serial ATAII (3Gb/s) & 1 * Serial ATAIII (6Gb/s) Devices

HDMI, DVI-D and VGA Video Outputs

Support CPU Smart FAN

Supports ACPI S3 Function

Compliance with EuP Standard

Support Watchdog Timer Technology

Support Windows8 OS

1-2 Specification

Spec Description

Design z

z z

Embedded CPU

Chipset

Memory Slot

Expansion Slot

LAN Chip

Audio Chip

BIOS z

Multi I/O

z z

z z z z z

z z

Rear Panel I/O:

z z z z z z

Internal I/O Connectors& Headers

z z

6-layer Mini-ITX form factor ; PCB size: 17.0x17.0cm Intel® Celeron 847 Dual Core Processor (1.1GHz)/Intel

Celeron 807 Single Core Processor (1.0GHz), depending on project

Intel® NM70 Express Chipset DDRIII SO-DIMM slot x2

Support DDRIII 1066/1333 MHz DDRIII SO-DIMM

expandable to 16GB Support dual channel function 1 pcs of PCI Express x16 slot 1 pcs of halt-size Mini-PCIE slot

Integrated with Realtek RTL8111F PCI-E Gigabit LAN chip Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate Realtek ALC662 6-channel Audio Codec integrated

Audio driver and utility included 32M DIP Flash ROM

COM port connector x 2 HDMI port connector x1 DVI-D port connector x 1 VGA port connector x1 USB 2.0 port connector x4 RJ-45 LAN connector x1

Audio connector x3 (Line-in, Line-out, MIC) 24-Pin ATXPWR connector x 1

SATAII Connector x3

SATAIII Connector x1

Front panel audio header x1

Front panel header x1

PWRLED & Speaker header x1

LVDS header x1

LVDS Inverter header x1

4-Pin USB 2.0 header x1 (support one expansion USB 2.0

ports)

9-Pin USB 2.0 header x1 (support two expansion USB 2.0

ports)

1-3 Layout Diagram

Rear IO Diagram

Serial Port

DVI-D Port

HDMI Port

PS2 KB & MS Combo Port

RJ-45 LAN Port

Line-IN Line-OUT

MIC-IN

Serial Port

VGA Port

USB 2.0 Ports

(

)

(

)

Motherboard Internal Diagram

Serial Ports

HDMI Port

DVI-D Port

over VGA Port

RJ-45 Port over

USB 2.0 Ports

PS/2 KB & MS

Combo Port

over USB 2.0 Ports

Audio Connecto

ini-PCIE Slo

LAN Activity

LED Header

SATAIII Port

LVDS Inverte

LVDS Heade

Intel NM70 Chipset

Intel Celeron

SATA1

SATAII Po

SATA2/3/4

CPUFAN Header

Front Panel Heade

SYSFAN1 Header

USB 2.0 Header

PWRLED Header/ Speaker Heade

ATX Power connector

DDRIII SODIMM Slotx 2

（DDRIII 1066/1333）

847/807 CPU

Front Panel

Audio Header

PCI Express x16 Slot

YSFAN2 Header

Motherboard Jumper Position

JP1

COPEN

JP2

JBAT

Connectors

Connector Name

ATXPWR ATX Power Connector SATA1 Serial ATAIII Connectors SATA2/SATA3/SATA4 Serial ATAII Connectors COM1_2 Serial Port Connector x2 HDMI High-Definition Multimedia Interface VGA_DVI-D(Top) DVI-D Port Connector VGA_DVI-D (Bottom) Video Graphic Attach Connector USB1_LAN (Top) RJ-45 LAN Connector USB1_LAN(Bottom) USB 2.0 Port Connector x2 USB2_PS2(Top) PS2 Keyboard/Mouse Combo Connector USB2_PS2(Bottom) USB 2.0 Port Connector x2 AUDIO Line Out /Line In /MIC Audio Connector

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 9-pin block JW_FP

LAN1_LED LAN Activity LED Header 2-pin Block J2 PWRLED & Speaker Header 7-pin Block F_USB1 USB 2.0 Port Header 9-pin Block F_USB2 USB 2.0 Port Header 4-pin Block LVDS LVDS Header 32-pin Block INVERTER LVDS Inverter 8-pin Block CPUFAN/ SYSFAN1/SYSFAN2 SYSFAN1/2 Header 4-pin Block

Front Panel Header(PWR LED/ HD LED/Power Button /Reset)

9-pin Block

Jumper

Jumper Name Description

JBAT CMOS RAM Clear Function Setting 3-pin Block JP1 LCD Panel Backlight 12V/5V Select 3-pin Block JP2 LCD VCC 5V/3.3V Select 3-pin Block JP3 Mini PCI-E Power VCC 3.3V /3.3 VSB Select 3-pin Block JP5 COM2 Pin9 Function Select 6-pin Block COPEN Case Open Message Display Function 2-pin Block

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JBAT (3-pin): Clear CMOS Function Setting

JBAT

1-2 Short： Normal；

CMOS Clear Setti ng

(2) JP1 (3-pin): LCD Panel Backlight 12V/5V Select

JP1

1-2 closed: LCD Panel Backlight = 12 V;

JP1

2-3closed: LCD Panel Backlight = 5 V;

2-3 Short： Clear CMOS

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