Jetway Computer NC9FL User Manual
TECHNICAL MANUAL
Of
Intel H61 Express Chipset
Based Mini-ITX M/B
NO. G03-NC9FL-F
Revision: 1.0
Release date: March 21, 2014
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION .......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM ....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................10
2-2-1 CONNECTORS .............................................................................................10
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................18
3-2 BIOS MENU SCREEN ................................................................................................19
3-3 FUNCTION KEYS .......................................................................................................19
3-4 GETTING HELP ..........................................................................................................20
3-5 MAIN BAR ...................................................................................................................20
3-6 MAIN MENU ................................................................................................................21
3-7 ADVANCED MENU .....................................................................................................22
3-8 CHIPSET MENU..........................................................................................................28
3-9 BOOT MENU ...............................................................................................................31
3-10 SECURITY MENU .......................................................................................................33
3-11 SAVE & EXIT MENU...................................................................................................34
TABLE OF CONTENT
ii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
(s)
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition March 21, 2014
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable
I/O Back panel shield
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® H61 express chipset
Support LGA 1155 CPU socket Intel® Core™ i7 processors / Intel® Core™ i5
processors / Intel® Core™ i3 processors / Intel® Celeron™ processors
Support DDRIII 1066-1333 SO-DIMM up to 16GB and dual channel function
Integrated with Intel 82579LM Gigabit Ethernet LAN chip
Integrated with RealTek ALC662-VD-GR 6 channel HD Audio Codec
Support PCIE 2.0 x1 slot and Mini PCI-E slot
Support CPU Smart FAN
Supports ACPI S3 Function
Compliance with ErP Standard
Support Watchdog Timer Technology
1
1-2 Specification
Spec Description
Design
Chipset
CPU Socket
Memory Slot
Expansion Slot
Storage
Gigabit LAN Chip
Mini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm
Intel H61 Express Chipset
Support Intel® LGA 1155 Socket Core™ i7 Processor, Intel
Core™ i5 Processor, Intel® Core™ i3 Processor, Intel
Celeron™ processors
* for detailed CPU support information please visit our website
DDRIII SO-DIMM slot x 2
Support DDRIII 1066/1333 MHz SO-DIMM up to 16GB
Support dual channel function
1* PCIE x 1 slot
1* Half-size Mini-PCIE slot
2* SATA II 3G/s connector
1* Full-size MSATA slot
Integrated with Intel 82579LM PCI-E Gigabit LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000 Mbps Ethernet data transfer rate
®
®
Audio Chip
BIOS
Multi I/O
Realtek ALC662-VD-GR 6 channel Audio Codec integrated
Audio driver and utility included
32M DIP Flash ROM
Rear Panel I/O:
1* 19V DC-in power jack
4* USB 2.0 port
1* DVI-I port
1* HDMI port
1* RJ-45 port
1*LINE-OUT jack
1* MIC-IN jack
2
Internal I/O Connectors& Headers:
DVI-I Port
Line-OUT
MIC-IN
HDMI Port
1 *2-pin ATX19V internal power connector
1 * SATA power connector
1* CPUFAN header + 1* SYSFAN header
1*LVDS connector + 1*LVDS inverter connector
1*Speaker connector
1*Front panel audio header
1*DMIC header
2 * 9-Pin USB 2.0/1.1 header for four USB 2.0/1.1 ports
1*Front panel header
1*CIR header
1*Mon_SW header
1-3 Layout Diagram
Rear IO Diagram
19V DC
Power-in
Jack
USB 2.0 Ports
RJ-45 LAN Port
3
USB 2.0 Ports
Motherboard Internal Diagram-Front
ATX 19V Power
Intel H61 Chipset
SATAII Ports
Front Panel
Audio Header
Front Panel
Header
SYSFAN Header
CIR Header
RJ-45 LAN Port
USB 2.0 Ports
USB 2.0 Ports
19V DC
Power-in Jack
DVI-I Port
HDMI Port
Line-OUT
MIC-IN
Speaker
Connector
USB 2.0 Header
USB 2.0 Header
SATA Power
48-bit LVDS
LVDS Inverter
DDRIII SODIMM Slots
Mini-PCIE Slot
Slot
DMIC Header
CPUFAN Header
MS_SW Header
Connector
Connector
(SATA_POWER)
Connector
Full-size MSATA
Half-size
Intel LGA1155
CPU Socket
PCI Express x1 slot
4
Motherboard Internal Diagram-Back
LPC_Debug Connector
5
6
Motherboard Jumper Position
JBAT
JP3
JP4
JP1
JP2
JP5
7
Connectors
Front Panel Header(PWR LED/
Connector Name
DC_IN DC Adapter 19V
ATX2P DC19V Power Connector
USB10 USB 2.0 Connector X2
DVI-I DVI-I Connector
HDMI High-Definition Multimedia Interface
LAN RJ-45 LAN Connector
USB20 USB 2.0 Connector X2
FP_HP Front Panel Head Phone Connector
FP_MIC Front Panel MIC Connector
SATA_POWER SATA Power Connector
SATA1/SATA2 SATAII Connector X2
SPEAK_CON Speaker connector
MSATA Full-size MSATA Connector
MINI_HALF Half-size Mini-PCIE Connector
LVDS LVDS Connector
INVERTER Panel Inverter connector
SYSFAN,CPUFAN FAN Connector X2
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin block
DMIC_CON DMIC Header 4-pin Block
USB1/USB2 USB Header 9-pin Block
JW_FP
CIR_CON CIR Header 7-pin Block
MON_SW Monitor Switch Header 2-pin Block
HD LED/ Power Button /Reset)
9-pin Block