Jetway Computer NC9F User Manual
TECHNICAL MANUAL
Of
Intel H61 Express Chipset
Based Mini-ITX M/B
NO. G03-NC9F-F
Revision: 2.0
Release date: June 14, 2013
Trademark:
* Specifications and Information contained in this documentation are furnished for i nforma tion use only , a nd are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................11
2-2-1 CONNECTORS .............................................................................................11
2-2-2 HEADERS .....................................................................................................16
TABLE OF CONTENT
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................20
3-2 BIOS MENU SCREEN ................................................................................................21
3-3 FUNCTION KEYS .......................................................................................................21
3-4 GETTING HELP ..........................................................................................................22
3-5 MAIN BAR...................................................................................................................22
3-6 MAIN MENU................................................................................................................23
3-7 ADVANCED MENU.....................................................................................................24
3-8 CHIPSET MENU..........................................................................................................29
3-9 BOOT MENU...............................................................................................................32
3-10 SECURITY MENU.......................................................................................................33
3-11 SAVE & EXIT MENU...................................................................................................34
ii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition June 14, 2013
Item Checklist
5
Motherboard
5
DVD for motherboard utilities
5
User’s Manual
5
Cable(s)
5
I/O Back panel shield
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® H61 express chipset
z
Support LGA 1155 CPU socket Intel® Core™ i7 processors / Intel® Core™ i5
z
processors / Intel® Core™ i3 processors / Intel® Celeron™ processors
Support DDRIII 1066-1333 SO-DIMM up to 16GB and dual channel function
z
Integrated with Realtek RTL8111EVL Gigabit Ethernet LAN chip
z
Integrated with RealTek ALC892-GR 7.1 channel HD Audio Codec
z
Support USB 3.0 data transport demands.
z
Support PCIE 2.0 x1 slot and Mini PCI-E slot
z
Support CPU Smart FAN
z
Supports ACPI S3 Function
z
Compliance with ErP Standard
z
Support Watchdog Timer Technology
z
1
1-2 Specification
Spec Description
Design z
Chipset z
z
CPU Socket
z
Memory Slot
Expansion Slot
Gigabit LAN Chip
Audio Chip
BIOS z
Multi I/O z
z
z
z
z
z
z
z
z
z
z
z
z
z
z
z
z
Mini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm
Intel H61 Express Chipset
Support Intel® LGA 1155 Socket Core™ i7 Processor, Intel
Core™ i5 Processor, Intel® Core™ i3 Processor, Intel
®
®
Celeron™ processors
* for detailed CPU support information please visit our website
DDRIII SO-DIMM slot x 2
Support DDRIII 1066/1333 MHz SO-DIMM up to 16GB
Support dual channel function
1* PCIE x 1 slot
1* Full-size Mini-PCIE slot/MSATA slot
1* Half-size Mini-PCIE slot
Integrated with Realtek RTL8111EVL PCI-E Gigabit LAN
chip
Support Fast Ethernet LAN function of providing
10/100/1000 Mbps Ethernet data transfer rate
Realtek ALC892-GR 7.1 channel Audio Codec integrated
Audio driver and utility included
32M DIP Flash ROM
1* 19V DC-in power jack
2* USB 3.0 port +
1* DVI-I port
1* HDMI port
1*E-SATA port
1* RJ-45 port
2* USB 2.0 port
1* MIC-IN jack
2
1*LINE-OUT (S/PDIF) jack
p
z
1*LVDS connector + 1*LVDS inverter connector
z
1*EDP connector
z
1*Speaker connector
z
2* SATAII connector
z
1*Front panel audio header
z
1*DMIC header
z
2*9-pin USB 2.0 header
z
1*Front panel header
z
1*CIR header
z
1*Serial port header
z
1-3 Layout Diagram
Rear IO Diagram
19V DC
Power-in
Jack
USB 3.0 Ports
DVI-I Port
HDMI Port
RJ-45 LAN Port
E-SATA Port
USB 2.0 Ports
Line-OUT
tical SPDIF OUT
/O
MIC-IN
3
Motherboard Internal Diagram-Front
r
r
N
H
r
t
N
H
r
r
r
r
r
(
)
(
)
L
r
SATA Power
PWROUT2
SATA Power
Connector
PWROUT1
Connector
Serial Port Header
SATAII Ports
SODIMM2 Slots
19V DC
Powe
-in Jack
USB 3.0 Ports
ATX 19V Power
Connector
SYSFA
CIR Heade
eader
Front Panel
Heade
48-bit LVDS
Connector
DVI-I Port
HDMI Port over
E-SATA Port
RJ-45 LAN Port
USB 2.0 Por
Line-OUT
/Optical SPDIF OUT
Connecto
Front Panel
Audio Heade
MIC-IN
Speaker
Full-size Mini-PCIE
/MSATA Slot
Intel H61 Chipset
BAT Connector
Half-size
Mini-PCIE Slot
CPUFA
eade
Intel LGA1155
VDS Inverte
USB 2.0 Heade
USB 2.0 Heade
CPU Socket
DMIC Header
PCI Express x1 slot
4
Motherboard Internal Diagram-Back
r
r
EDP Connecto
LPC Debug Connecto
5
6
Motherboard Jumper Position
JP5
JBAT
JP2
JP1
JP3
7
Connectors
Connector Name
DC_IN DC Adapter 19V
ATX2P DC19V Power Connector
USB30 USB3.0 Connector
DVI-I DVI with VGA
HDMI (up) High-Definition Multimedia Interface
eSATA(down) eSATA Connector
RJ-45 LAN RJ-45 LAN Connector
USB20 USB2.0 Connector
FP_HP Front panel head phone with SPDIF
FP_MIC Front panel_MIC
PWROUT1 Mainboard power output 12V/VCC
PWROUT2 Mainboard power output 12V/VCC
SPEAK_CON Speaker connector
INVERTER Panel Inverter connector
LVDS LVDS connector
EDP (Bottom side) EDP connector
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 10-pin block
DMIC_CON DMIC Header 5-pin Block
USB1/USB2 USB Header 10-pin Block
JW_FP
CPU FAN/SYSFAN FAN Speed Header 4-pin Block
CIR_CON CIR Header 8-pin Block
COM1 Serial Port Header 10-pin Block
Front Panel Header(PWR LED/
HD LED/ /Power Button /Reset)
10-pin Block
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