* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.
ii
TABLE OF CONTENT
SAFETY ENVIRONMENTAL INSTRUCTION............................................................................... iv
USER’S NOTICE.................................................................................................................................. v
MANUAL REVISION INFORMATION............................................................................................ v
ITEM CHECKLIST.............................................................................................................................. v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD..................................................................................... .1
z Avoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the
main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding spots’
that connect components and PCB. Computer should go through an adaptive phase
before it boots when it is moved from a cold environment to a warmer one to avoid
condensation phenomenon. These water drops attached on PCB or the surface of the
components can bring about phenomena as minor as computer instability resulted from
corrosion and oxidation from components and PCB or as major as short circuit that can
burn the components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer. Using the
close case may decrease the life of other device because the higher temperature in the
inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may decrease
the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE INTEL 945GC CHIPSET
MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER ’S R EQ UI RE ME N T BU T WI LL
CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMA GES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF
BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition January, 2009
Item Checklist
5
Motherboard
5
Cable(s)
5
CD for motherboard utilities
5
Motherboard User’s Manual
5
Back panel
v
Chapter 1
Introduction of the Motherboard
1-1 Features of motherboard
*
Intel 945GC chipset and ICH7 chipset.
*
Onboard Intel ATOM CPU, with low power consumption never denies high performance.
*
Support FSB 533MHz.
*
Support DDRII 400/533MHz up to 2GB.
*
Onboard RTL 8102E Megabit Ethernet LAN Chip (dep ending on the model).
*
Onboard RTL 8111C Gigabit Ethernet LAN Chip (depending on the model).
*
Integrated Realtek ALC662 6-Channel Audio CODEC.
*
Support USB2.0 data transport demands.
1
1-2 Specification
Spec Description
Design
Chipset
Embedded CPU
Memory Socket
∗ Mini-ITX form factor 4 layers PCB size: 17.0x17.0cm
∗ Intel 945GC Northbridge chipset
∗ Intel 82801G Southbridge chipset
∗ Support FSB533
∗ Low Power Consumption
∗ ATOM CPU
∗ 240-pin DDRII DIMM socket x1
∗ Support DDRII 400MHz /DDRII 533MHz system Module
DDRII memory
∗ Expandable to 2GB.
Expansion Slots
Integrate IDE
Optional LAN
Audio
BIOS
∗ 32-bit PCI slot x 1pcs
∗ One PCI IDE controller that supports PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 100/66 functions that deliver
the data transfer rate up to 100 MB/s;
∗ Integrated Realtek RTL8111C PCI-E LAN that supports Fast
Ethernet LAN function of providing 10Mb/100Mb/1000Mb
Ethernet data transfer rate (optional)
∗ Integrated Realtek RTL8102E PCI-E LAN that supports Fast
Ethernet LAN function of providing 10Mb/100Mb Ethernet data
transfer rate (optional)
∗ Realtek ALC662 6-channel Audio Codec integrated
∗ Audio driver and utility included