JBL SG-2020 Service manual

Soundgear Series
SG2020 SG3030
3 CD Changer Hi-Fi System
PRELIMINARY
SERVICE MANUAL
JBL Incorporated, Inc.
250 Crossways Park Dr.
CONTENTS
SERVICING PRECAUTIONS . . . . . . . . . . . . . . . .. . . . . .. . . . . . . . .3
ESD PRECAUTIONS . . . . . . . . . . . . . . . . . . . .
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . .
ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . .
TROUBLESHOOTING GUIDE. . . . . . . . . . . . . . . . .
WAVEFORMS OF MAJOR CHECK POINTS . . . . . .
WIRING DIAGRAM (SG2020). . . . . . . . . . . . . . . . . . . .
WIRING DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . .
BLOCK DIAGRAM (SG2020) . . . . . . . . . . . . . . . . . . . . . . .
BLOCK DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . . . .
SCHEMATIC DIAGRAMS (SG2020/3030). . . . . . . . . . . . . .
PCB BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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PACKAGE PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . . . .40
MECHANICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . .40
ELECTRICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . .43
PACKAGE PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . . . . .54
MECHANICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . .54
ELECTRICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . . .57
-3-
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot­ton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up. Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
NEVER look directly at the laser beam, and don’t let contact fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
Drop impact
-4-
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These compo­nents are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong
magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded. When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
CLEARING MALFUNCTION
You can reset your unit to initial status if malfunction occur(button malfunction, display, etc.). Using a pointed good conductor(such as driver), simply short the RESET jump wire on the inside of the volume knob for more than 3 seconds. If you reset your unit, you must reenter all its settings(stations, clock, timer)
NOTE: 1. To operate the RESET jump wire, pull the volume rotary knob and release it.
2. If you wish to operate the RESET jump wire, it is necessary to unplug the power cord.
Resistor (1 Mohm)
VOLUME
UP
DOWN
VOLUME KNOB
RESET jump wire
Conductive Sheet
Resistor (1 Mohm)
Armband
-5-
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components com­monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir­cuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur­face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen­erate static electricity sufficient to damage an ESD device).
-6-
SPECIFICATIONS
SECTION SG2020 SG3030
AMP
Output Power 65W+65W (6, 2ch, T.H.D 10%) 30W+30W (6, 2ch, T.H.D 10%) Woofer 60W+60W (6, 2ch, T.H.D 10%) Frequency Response(MAIN) 40~25,000 Hz 200~25,000 Hz Frequency Response(Woofer) 45~120 Hz Signal-to-Noise Ratio 83dB 83dB
Tuner
FM
Tuning Range(OPTICAL) 87.5 ~ 108 MHz 87.5 ~ 108 MHz Intermediate Frequency 10.7 MHz 10.7 MHz Signal-to-Noise Ratio 61/58 dBA 61/58 dBA (Mono/Stereo, 98MHz) Frequency Response 60~10,000 Hz 200~10,000 Hz
AM(MW)
Range(OPTICAL) 522~1,611 kHz or 530~1,720 kHz 522~1,611 kHz or 530~1,720 kHz Intermediate Frequency 450 kHz 450 kHz Frequency Response 100~2,000 Hz 200~2,000 Hz
SW(OPTICAL)
Tuning Range 5.8~18.0 MHz 5.8~18.0 MHz Intermediate Frequency 450 kHz 450 kHz Signal-to-Noise Ratio(11MHz) 35 dB 35 dB 3
LW(OPTICAL)
Tuning Range 153~281 kHz 153~281 kHz Intermediate Frequency 450 kHz 450 kHz Signal-to-Noise Ratio(11MHz) 28 dB 28 dB
CASSETTE DECK
FF, REW Time (C-60) 120 sec. 120 sec. Frequency Response 125~8,000 Hz 250~18,000 Hz Signal-to-Noise Ratio 43dB(P/B), 43dB(R/P) 43dB(P/B), 43dB(R/P) Channel Separation 50dB(P/B), 45dB(R/P) 50dB(P/B), 45dB(R/P)
CD
Frequency Response 40~18,000 Hz 200~8,000 Hz Signal-to-Noise Ratio 70 dB 70 dB
GENERAL
Power Requirements Refer to the back panel of the unit. Refer to the back panel of the unit. Net Dimensions(WxHxD) 273 x 326 x 344 mm 273 x 326 x 344 mm Net Weight ? kg ? kg
Speaker System
Type Bass Reflex 2 Way Bi AMP
3 Speaker System (Main Speaker, Super Woofer)
3 Speaker System Impendance 6 6Ω Frequency Response(MAIN) 60~20,000 Hz 140~20,000 Hz Sound Pressure Level(MAIN) 85 dB/W(1m) 90 dB/W(1m) Rated Input Power(MAIN) 65 W 30 W Rated Input Power(SUPER WOOFER) 60 W Max. Input Power(MAIN) 130W 60 W Max. Input Power(SUPER WOOFER) 120 W Net Dimensions(WxHxD) 220 x 326 x 252 mm 220 x 372 x 252 mm Net Weight ? kg ? kg
: EUROPE : UL
NOTE: Designs and specification are subject to change without notice for improvement.
-7-
ADJUSTMENTS
This set has been aligned at the factory and normally will not require further adjustment. As a result, it is not recommended that any attempt is made to modificate any circuit. If any parts are replaced or if anyone tam­pers with the adjustment, realignment may be necessary.
IMPORTANT
1. Check Power-source voltage.
2. Set the function switch to band being aligned.
3. Turn volume control to minimum unless otherwise noted.
4. Connect low side of signal source and output indicator to chassis ground unless otherwise specified.
5. Keep the signal input as low as possible to avoid AGC and AC action.
TAPE DECK ADJUSTMENT
1. AZIMUTH ADJUSTMENT
2. NORMAL SPEED ADJUSTMENT
Deck Mode
A Deck Playback MTT-114 Speaker Out
DECK Screw
Azimuth Screw
Maximum
B Deck Playback MTT-114 Speaker Out Azimuth Screw Maximum
Test Tape Test Point Adjustment Adjust for
Deck Mode
Normal Speed MTT-111 Speaker Out VR201 3kHz ± 1%
Hi-Speed MTT-111 Speaker Out more than 5.4kHz
A Deck
Hi-Speed
Dubbing Mode
Test Tape Test Point Adjustment Adjust for Remark
CH1 CH2
Speaker Out
Playback Mode
Head
Test Tape MTT-114
L ch
R ch
GND
Dual-trace synchroscope
Electronic Voltmeter
L out
R out
Unit
Figure 1. Azimuth Adjustment Connection Diagram
Head
Playback Mode
Unit
Speaker Out
GND
L out
R out
Record/Playback head
Test Tape MTT-111
Frequency Counter
Figure 2. Normal Speed Adjustment Connection Diagram
3. RECORD BIAS ADJUSTMENT
4. TUNER ADJUSTMENT
-8-
Deck Mode
Rec/Pause MTT-5511
ERASE HEAD
WIRE(PN402)
L201
60kHz±5kHz (Auto-stop)
85kHz±5kHz (Auto-Reverse)
Test Tape Test Point Adjustment Adjust for
Item
DC Voltage Checker Pin TP101, 102 0V±50mV
Test Point Adjustment Adjust for
Head
Unit
PN402
GND
Record/Playback head
Test Tape MTT-5511
Record/Playback and Pause Mode
Frequency Counter
Figure 3. Record Bias Adjustment Connection Diagram
Unit
Signal Generator
GND
Electronic OSCILLOSCOPE
FM Antenna Terminal
Speake
Figure 4. Tuner(S curve) Adjustment Connection Diagram
-9-
TROUBLESHOOTING GUIDE
Turn power on.
Is power on?
Does initial read work?
Does it play?
Does it output audio?
Check power supply circuit.
(Check PN 807)
Check laser circuit.
Check focus circuit.
Check disc.
Check tracking servo circuit.
Check audio circuit.
OK
YES
YES
YES
YES
NO
NO
NO
NO
Fails to initial read
-10-
1.3V
A B
YES
YES
YES
YES
YES
YES
YES
YES
NO
NO
NO NO NONO
NO
NO
NO
NO
Does laser light?
Disc motor turns.
Does RF waveform appear?
TP 801(RF)
Does tracking servo work? Lower envelope of TP801(RF) waveform is flat.
Does signal appear at TP801(TEO)?
Does signal appear at IC 803 Pin and Pin ?
Does GFS (IC802 pin ) show as below?
Is rotation normal?
Is there no dropout of RF signal?
Does TE2 signal appear at pin
53
of IC801?
Defective IC 801, pick up and/or open wire.
Detective pattern.
Defective IC 801 and/or IC 803
Defective pick-up and/or connector.
Defective IC 801.
Scratch in disc initial read area.
Defective pick-up
adjustment focus offset.
26 27
25
-11-
A
NO
NO
NO
NO
NO
NO
Laser does not light.
Is 3.5V applied to pin of IC 801?
Is power supplied to laser Q801?
(Q 801 collector: about 1.8V)
Does laser current flow?
1.0V across R801
Is data transferred from MICOM IC ?
Does voltage appear at IC 803 pin , ?
Defective MICOM.
Defective MICOM.
Defective connector.
Defective IC 801, 803
Defective slide motor and/or connector.
Defective LMT SW and/or connector.
Defective Q 801 and/or laser.
Defective laser and/or connector.
Did pickup return to
innermost circular?
Does it stop at inner pick circular after shift?
Is defect output from LM SW applied to pin of
PN803?
R801 1.0V
R801 1.0V
YES
YES
YES
YES
OPEN
CLOSE
YES
YES
YES
YES
YES
YES
70
11 12
2
-12-
B
C
Does lens move up/down?
Does IC 801 out focus search signal?
IC 801 pin (FEO)
Is focus search signal applied to pin , of CN801?
Laser lights.
Confirm
initial
read with
disc
Defective IC801
Defective IC803
Defective IC 801.
Open activator and/or connector.
Open connector and/or defective IC 801.
Incorrect turntable height. Degraded laser diode.
Does TP 801 RF signal appear even in low level?
Is laser output adjustment correct?
Does FOK(focus ok) signal appear?
YES
YES
YES
YES
YES
YES
TP801 (RF)
IC801 pin (FOK)
NO NO
NO
NO
NO
NO
48
13 16
40
-13-
FER
ISTAT(SENSE)
C
Start mode
Does FE1 signal appear? IC 801 pin
Does FZC signal (focus zero cross signal) appear at pin of IC 801, ISTAT (SENSE) terminal?
Does SMON signal appear at pin of IC 802?
Does SMPO signal appear at pin of IC 802?
Is drive voltage applied to disk motor?
Defective IC 801.
Open pick diode
Defective IC 801.
Defective Pattern between IC 801 and IC 802.
Defective IC 801, 803 and/or peripheral circuit.
Defective disk motor and/or insulation.
(Focus servo turns ON by FZC signal of FOK mod.)
NO
NO
NO
NO
YES
YES
YES
YES
YES
59
31
73
75
-14-
WAVEFORMS OF MAJOR CHECK POINT
1. HF signal (RF signal ) waveform (Test Point TP801) during normal play
2. EFM signal (pin IC 801)waveform during Normal Play
0V
0V
3. Focus coil drive waveform(Pin NO 1, 2 of IC 803)
When focus search failed or there is no disc on the tray
3. Focus coil drive waveform(Pin NO , of IC 803)
Focus coil drive waveform(pin NO 1, 2 of IC803) and FOK (pin NO 40 of IC 801) when focus search is accomplished
0V
CH1 : FOCUS COIL DRIVE
SIGNAL 2V/Div.
CH2 : FOAK
(
CH1 : TEO(TP801) 1V/Div. CH2 : TRACKING COIL DRIVE
SIGNAL 2V/Div.
(
CH1 : TEO(TP801) 1V/Div. CH2 : TRACK COIL DRIVE
SIGNAL 2V/Div.
(
CH1 : TEO(TP801) 1V/Div. CH2 : TRACK COIL DRIVE
SIGNAL 2V/Div.
(
0V (CH1)
0V (CH2)
4. Tracking coil drive waveform (pin NO 26, 27 of IC 803) and TEO during track traverse (1) When time division is 20nS/div
4. Tracking coil drive waveform (pin NO 26, 27 of IC
803) and TEO during track traverse
(2) When time division 0.5nS/div.
(During forward track traverse)
0V (CH1)
0V (CH2)
0V (CH1)
0V (CH2)
(3) When time division is 0.5nS/div.
(During backward Track Traverse)
5. Feed motor drive waveform(pin NO 11, 12 of IC 803) During normal play
0V
0V (CH2)
0.5V/Div. 500nS/Div.
(
2V/Div. 500nS/Div.
(
0.5V/Div. 500nS/Div.
(
0V
WIRING DIAGRAM
(MODEL : SG2020)
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-16-
WIRING DIAGRAM
(MODEL : SG3030)
BLOCK DIAGRAM
(MODEL : SG2020)
-17-
BLOCK DIAGRAM
(MODEL : SG3030)
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