Intel Vig390s User Manual

Vig390s
Motherboard
Manual

C O M P U T E R S N E T W O R K S S O L U T I O N S

..

®

G r e a t
Minds
T h i n k

®

0

Viglen, EMC and the ‘CE’ mark

CE Marking
European standards are being harmonised across borders. If products comply with the same standards in all
European countries, product exporting and importing is made simple - paving our way to a common market. If
you buy a product with a 'CE' mark on it (shown below), on the box, in the manual, or on the guarantee - it
complies with the currently enforced directive(s).

Introduction to EMC
EMC (Electromagnetic Compatibility) is the term used to describe certain issues with RF (Radio Frequency)
energy. Electrical items should be designed so they do not interfere with each other through RF emissions. E.g.
If you turn on your microwave, your television shouldn't display interference if both items are CE marked to the
EMC directive.

If emitted RF energy is not kept low, it can interfere with other electrical circuitry - E.g. Cars Automatic Braking
Systems have been known to activate by themselves while in a strong RF field. As this has obvious
repercussions ALL electrical products likely to cause RF related problems have to be 'CE' marked from 1st
January 1996 onwards.

If a product conforms to the EMC directive, not only should its RF emissions be very low, but its immunity to RF
energy (and other types) should be high. The apparatus has to resist many 'real world' phenomena such as
static shocks and mains voltage transients.

Viglen’s Environment laboratory
To gain a 'CE' mark, the Viglen computer range has had to undergo many difficult tests to ensure it is
Electromagnetically Compatible. These are carried out in the in-house 'Environment lab' at Viglen Headquarters.
We have made every effort to guarantee that each computer leaving our factory complies fully with the correct
standards. To ensure the computer system maintains compliance throughout its functional life, it is essential you
follow these guidelines.

> Install the system according to Viglen’s instructions

> If you open up your Viglen:
> Keep internal cabling in place as supplied.
> Ensure the lid is tightly secured afterwards

> Do not remove drive bay shields unless installing a 'CE' marked peripheral in its place

> The clips or ‘bumps' around the lips of the case increase conductivity - do not remove or damage.
> Do not remove the ferrite ring from the L.E.D cables.
> Only use your Viglen computer with 'CE' marked peripherals

This system has been tested in accordance with European standards for use in residential and light industrial
areas-this specifies a 10 meter testing radius for emissions and immunity. If you do experience any adverse
affects which you think might be related to your computer, try moving it at least 10 meters away from the affected
item. If you still experience problems, contact Viglen’s Technical Support department who will put you straight
through to an EMC engineer - s/he will do everything possible to help. If modifications are made to your Viglen
computer system, it might breach EMC regulations. Viglen take no responsibility (with regards to EMC
characteristics) of equipment which has been tampered with or modified.

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Copyrights and Trademarks

Please note

The material in this manual is subject to change without notice.

Trademarks

Microsoft, Windows, Windows NT, Windows 95,Windows 98, Windows ME,
Windows 2000 Pro, Windows XP Pro and MS-DOS are registered trademarks of
Microsoft Corporation. IBM PC, XT, AT and PS/2 are trademarks of International
Business Machines Corporation. Pentium and Pentium Pro are registered
trademarks of Intel Corporation. AMI BIOS is a registered trademark of American
Megatrends. All other trademarks are acknowledged. JAC-UP, Genie, Contender,
Dossier, Vig, Viglen, and Envy are trademarks of Viglen Limited.

Copyright and Patents

This manual and all accompanying software and documentation are copyrighted and
all rights reserved. This product, including software and documentation, may not, in
whole or in part, be copied, photocopied, translated or reduced to any electronic or
machine-readable form, without prior written consent except for copies retained by
the purchaser for backup.

© Copyright 2005 Viglen Limited
All Rights Reserved
Vig390s Manual Version 1.0
Printed in the United Kingdom

Liability

No warranty or representation, either expressed or implied, is made with respect to
this documentation, its quality, performance, merchantability or fitness for a particular
purpose. As a result the documentation is licensed as is, and you, the licensee, are
assuming the entire risk as to its quality and performance. The vendor reserves the
right to revise this operation manual and all accompanying software and
documentation and to make changes in the content without obligation to notify any
person or organisation of the revision or change.

In no event will the vendor be liable for direct, indirect, special, incidental or
consequential damages arising out of the use or inability to use this product or
documentation, even if advised of the possibility of such damages. In particular, the
vendor shall not have liability for any hardware, software or data stored or used with
the product, including the costs of repairing, replacing or recovering such hardware,
software or data.

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Contents

Chapter 1 Overview 5

System Board Components 6
Back Panel Connectors 7
Feature Summary 9
System Processor 10
System Memory 11

Memory Configurations 12

Intel® E7525 chipset (Northbridge) 15
Intel® 6300ESB I/O Controller (Southbridge) 16

Vig390s motherboard block diagram 17

USB Support 18
IDE Support 18
Parallel ATA IDE Interfaces 19
Serial ATA Support 19
Real-Time Clock, CMOS SRAM and Battery 20
I/O Controller 20
Audio Subsystem 22
Audio Connectors 23
LAN Subsystem 24
Hardware Management Subsystem 25
Power Management 26
ACPI 26
Hardware Support 28

Chapter 2 System Board Options 31

Overview of Jumper Settings 33
System Board Jumper Settings 34
Motherboard Connectors 38
Front Panel Connectors 39
Upgrading the CPU 40
Installing & Removing Dual In-Line memory Modules 46
Replacing the Clock/CMOS RAM Battery 48

Chapter 3 Solving Problems 49

Resetting the System 49
Troubleshooting Procedures 50
Problems Operating Add-in Boards 51
Problems and Suggestions 52
Error and Information Messages 54
BIOS Beep Codes 55

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Chapter 4 System BIOS 56

What is the BIOS? 56
The Power-on Sequence 56

AMI BIOS 57

Plug and Play: PCI Auto-configuration 58
PCI IDE Support 58
Desktop Management Interface (DMI) 59

Advanced Power Management (APM) 59

Advanced Configuration and Power Interface (ACPI) 61
Configuring the Motherboard using BIOS Setup 63
Setting the Processor Speed 63
Clearing the Passwords 63
BIOS Setup Program 64
Main Menu 67
Advanced Menu 75
Power Menu 88
Boot Menu 94
Exit Menu 101
Upgrading the BIOS 102

Chapter 5 Technical Information 105

Enhanced IDE 105
Operating Systems and Hard Drives 106
Connector Signal Details 107
Power Supply Connector 110
Motherboard Resources 113
Other Information 115

Chapter 6 Glossary 116

Notes 120

Chapter 7 Suggestions 121

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Chapter 1: Overview

Introduction

This manual describes the Viglen Vig390s motherboard inside your computer. The
motherboard is the most important part of your computer. It contains all of the CPU,
memory and graphics circuitry that make the computer work.

The motherboard contains the very latest CPU design, the Intel Xeon™ processor,
which includes Intel NetBurst® Microarchitecture with 800 MHz system bus, Internet
Streaming SIMD Extensions 3, Intel Hyper-Threading Technology hardware support
for multi-threaded applications and Intel’s Extended Memory 64-bit technology
(EM64T). All of which are designed to vastly improve both multimedia and
communications on your PC. The combination of this technology and Viglen
expertise make this a formidable computer.

This manual contains technical information about the Viglen VIG390S motherboard
and other hardware components inside your computer. If you are new to computers
we recommend that you read the user guide first. If you are an experienced
computer user this manual should provide all the information you will need to
perform simple upgrades and maintenance.

We hope that this manual is both readable and informative. If you have any
comments for suggestions about how we could improve the format then please fill
out the form at the back of the manual and send it to us.

Above all we hope that you enjoy using your Viglen computer.

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System Board Components

Figure 1: Motherboard Layout & Components

Table 1: Motherboard Layout Descriptions

A 8 Mbit Firmware Hub (FWH) BIOS W Front Chassis Fan 2
B Game port header (optional) X Secondary IDE connector
C Motherboard speaker Y Primary IDE connector
D I/O controller Z Southbridge Intel® 6300ESB
E Aux audio connector AA Serial ATA (S-ATA) connectors
F CD audio connector BB Floppy drive connector
G Audio codec AD1980 CC Front panel audio connector
H LAN controller Broadcom BCM5751 DD Front panel USB connectors 5/6

USB controller (VIA VT6212L)

I Front panel audio connector EE
J Rear Chassis Fan 2 connector FF Battery
K Rear I/O back panel connections GG Front panel USB connectors 7/8

L Rear Chassis Fan 1 connector HH
M Memory DIMM slots B2 A2 II Front IEE1394a header connector
N Memory DIMM slots B1 A1 JJ PCI4 PCI-X connector (64bit)

5/6/7/8

IEE1394a controller TiTBS43AB22A
PCI

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O SSI ATX Power connector 24 way KK PCI3 PCI-X connector (64bit)
P CPU1 FAN connector LL PCI5 PCI connector (32bit 5V)
Q Northbridge Intel © E7525 MM PCI2 PCI-Express x 16 connector
R ATX 12V1 connector 6 way NN PCI1 PCI-Express x 4 connector

CPU 1 socket (mPGA604 pin socket

S

for Intel ® Xeon ™) OO
CPU 2 socket (mPGA604 pin socket

T

for Intel ® Xeon ™) PP SMBus connector
U CPU 2 FAN connector QQ Second serial port header
V Front Chassis Fan 1 RR Power to motherboard LED

WIFI proprietary connector (not
supported)

Note:

1. SATA 1 is to be used for Boot disk SATA 2 for data disk.

2. SATA RAID 0/1 is supported by Windows XP + SP1 and Windows 2000Pro + SP4.

3. Windows XP supports 2 CPU’s with hyperthread enabled, if 2 CPU’s are to be used with
Windows 2000Pro hyperthread must be disabled.

Back Panel Connectors

The motherboard external IO connectors are attached to a metallic I/O shield.
This shield serves several purposes:

• It protects the sensitive motherboard from any external EMC interference.

• It stops the computer from interfering with other electrical devices.

• It allows the motherboard to be easily upgraded in the future without having to

resort to buying a whole new case. Simply change the I/O shield to match the
motherboard.

The I/O shield provides external access to PS/2 keyboard and mouse connectors as
well as one serial port, one parallel port, two USB ports, one LAN Port and the audio
connectors.

Figure 2: I/O shield

Note: Power to the computer should be turned off before a keyboard or mouse is

connected or disconnected.

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Table 2: Back Panel Connectors.

Figure 3: Back Panel Connectors

Item Description Item Description

1 PS/2* mouse port (Green) 7 Mic in (Pink)

2 Parallel port (Burgundy) 8

3 IEE1394a 9 USB ports (two) 1 and 2

4 LAN RJ45 10 Serial port A (Teal)

5 Audio line In (Blue) 11 SP/DIF 5.1 audio out

6

Line Out (Lime green) L and
R audio

12

USB ports (two) 3 and 4

PS/2 keyboard port (Purple)

Note: The back panel audio out connectors are designed to power headphones or

amplified speakers only. Poor audio quality occurs if passive (non-amplified)
speakers are connected to these outputs.

Audio 2/4/6 Channel configurations

The audio ports may be re configured via the audio control panel, default operation is
2 channel audio.

Table 3: Audio 2/4/6 Channel configurations

Port 2 channel 4 channel 6 channel
Audio line In
(Blue)
Line Out (Lime
green)
Mic in (Pink) Mic In Rear Speaker

Line In Line In Bass/Centre

Line out Front Speaker

Out L & R

Out L & R

Front Speaker
Out L & R
Rear Speaker
Out L & R

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Feature Summary

The VIG390S motherboard supports Intel Pentium Xeon™ processors with 1MB of
third-level cache integrated in a micro PGA 604 Socket package operating at speeds
up to 3.6GHz. Single or dual processors are supported but should be identical in
speed and CPU stepping revision.

Table 4: Feature Summary

Form Factor

Processor

Supported CPU
speeds
Memory

Chipset

Video
Audio
I/O Controller
USB
Peripheral Interfaces

LAN Support

BIOS

Instantly Available PC
Technology

Expansion Capabilities

Hardware Monitor
Subsystem

VIG390S: extended ATX (9.8 inches by 12.0 inches [250.00 millimetres
by 305.00 millimetres])

- Single or dual Pentium Xeon CPU

- 800MHz FSB

- Integrated 512MB second and 1MB third level cache

- Socket micro PGA 604 connector
CPU Speed FSB L2 Cache L3 Cache

3.2. to 3.6GHz 800MHz 512K 1M

- Four 204-pin DDR2 SDRAM Dual Inline DIMM sockets.

- Support for up to 8GB of DDR2 400 ECC 72bit

- Northbridge Intel® 7525 Memory Controller Hub (GMCH)

- Southbridge Intel® 6300ESB I/O Controller Hub (ICH5)

- 8 Mbit Firmware Hub (FWH)

- PCI-Express connector supporting x1 ,x4, x8 and x16 lane VGA cards

- Audio subsystem using the ADI AD1980

- Southbridge Intel® 6300ESB I/O Controller Hub (ICH5)

- Support for USB 2.0 devices

- Eight USB Ports

- One Serial Port

- One Parallel Port

- Two Serial ATA IDE interfaces

- Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support

- One diskette drive interface

- PS/2 keyboard port

- PS/2 mouse port

- One IEEE1394a Port
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the
Broadcom BMC5751 PCI Express Gigiabit LAN Controller PCI-E 1.0a
interface

- AMI BIOS (resident in the 8 Mbit FWH)

- Support for Advanced Configuration and Power Interface (ACPI), Plug
and Play SMBIOS 2.3, WfM2.0,DMA2.0a.

- Support for PCI Local Bus Specification Revision 2.2

- Suspended to RAM support

- Wake on PCI, RS-232, front panel, PS/2 devices and USB ports

- One PCI (32bit 5v) bus add-in card connectors

- Two PCI-X (64bit) bus add-in card connector

- One PCI-Express (x16 lane) add-in card connector

- One PCI-Express (x4 lane) add-in card connector

- Hardware monitoring and fan control ASIC

- Voltage sense to detect out of range power supply voltages

- Thermal sense to detect out of range thermal values

- Four chassis fan connectors with activity monitor(two rear and two
front)

- 2 x CPU Heatsink FAN speed activity monitor

- Thermal Fan speed control

604-pin FC-µPGA4

6 channel audio codec.

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System Processor

The VIG390S motherboard supports a single or dual Pentium Xeon™ processor.
The processor’s VID pins automatically program the voltage regulator on the
motherboard to the required processor voltage. In addition, the front side bus speed
is automatically selected. The motherboard currently supports processors that run
internally up to 3.6GHz and have a 512 KB second-level cache and 1MB third-level
cache.

The Intel Xeon™ processor incorporates Intel NetBurst® Microarchitecture with 800
MHz system bus, Internet Streaming SIMD Extensions 3, Intel Hyper-Threading
Technology hardware support for multi-threaded applications and Intel’s Extended
Memory 64-bit technology (EM64T).

The processor also implements MMX™ technology and maintains full backward
compatibility with the 8086, 80286, Intel386 ™, Intel486 ™, Pentium, Pentium Pro,
Pentium II & Pentium III processors. The processor’s numeric coprocessor
significantly increases the speed of floating-point operations and complies with
ANSI/IEEE standard 754-1985.

Microprocessor Packaging

The Xeon™ processor comes in a micro PGA 604 package that connects to the
motherboard through a socket 604 connector. The package consists of:

• Processor card including the processor core and the second-level and third level

cache, burst pipelined synchronous static RAM (BSRAM) and tag RAM.

• Thermal plate.

Second Level Cache

The second-level cache is located on the die of the CPU itself. The cache includes
burst pipelined synchronous static RAM (BSRAM) and tag RAM. All supported
onboard memory can be cached.

Processor Upgrades

The motherboard can be upgraded with an Intel Xeon™ processor that runs at
higher speeds with a maximum of 3.6GHz.

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System Memory

Main Memory

The motherboard has four DDR2 SDRAM Dual Inline Memory Module (DIMM)
sockets. Support for up to a maximum memory size of 8GB. The BIOS automatically
detects memory type, size, and speed.

The motherboard supports the following memory features:

• 240 pin DDR2 400 MHz SDRAM DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMS with x16 organisation are not supported.

• 8 GB maximum total system memory total amount of addressable memory.

• Minimum total system memory: 256 MB

• 72bit registered ECC DIMMs

• Serial Presence Detect

Notes:

To be fully compliant with all applicable DDR2 SDRAM memory specifications, the
board should be populated with DIMMs that support the Serial Presence Detect
(SPD) data structure. This allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If non­SPD memory is installed, the BIOS will attempt to correctly configure the memory
settings, but performance and reliability may be impacted or the DIMMs may not
function under the determined frequency.

Table 5: Supported Memory Configurations

DIMM
Capacity

256 MB SS 256 Mbit 32 M x 8/empty 8

256 MB SS 512 Mbit 32 M x 16/empty 4

512 MB DS 256 Mbit 32 M x 8/32 M x 8 16

512 MB SS 512 Mbit 64 M x 8/empty 8

512 MB SS 1 Gbit 64 M x 16/empty 4

1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16

1024 MB SS 1 Gbit 128 M x 8/empty 8

2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16

Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of

DDR SDRAM) and “SS” refers to single-sided memory modules (containing one row of DDR
SDRAM).

Configuration

SDRAM
Density

SDRAM Organisation
Front-side/Back-side

Number of
SDRAM Devices

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Memory Configurations

The Vig390s with Intel E7525 MCH supports Dual channel (Interleaved) mode
memory organisation:

Dual channel (Interleaved) mode: This mode offers the highest throughput for real
world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.

Single channel (Asymmetric) mode: This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.

NOTE:

The DIMM A2 and B2 sockets of both channels are blue. The DIMM A1and B1
sockets of both channels are black.

Figure 4: Memory Channel and DIMM Configuration

Dual channel mode: Installed modules must be the same therefore for 1GB total
system memory two 512MB modules would be installed in sockets A1 and B1.

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Dual Channel (Interleaved) Mode Configurations

Figure 5 shows a dual channel configuration using two DIMMs. In this example, the
DIMM A1, B1 (black) sockets of both channels are populated with identical DIMMs.

512MB

512MB

Figure 5: Dual Channel (Interleaved) Mode Configuration with Two DIMMs

Figure 6 shows a dual channel configuration using four DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the combined capacity of
the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM1 and
DIMM2 of both channels.

256MB

256MB

512MB

512MB

Figure 6: Dual Channel (Interleaved) Mode Configuration with Four DIMMs

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Single Channel (Asymmetric) Mode Configurations (Illustration only)

Note:

Dual channel (Interleaved) mode configurations provide the highest memory
throughput. Figure 7 shows a single channel configuration using one DIMM. In this

example, only the DIMM1 (black) socket of Channel A is populated. Channel B is not
populated.

256MB

Figure 7: Single Channel (Asymmetric) Mode Configuration with One DIMM

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Intel® E7525 chipset (Northbridge)

Intel® E7525 Memory Controller Hub (MCH) chipset, the next generation Intel® dual­processor (DP) workstation and server chipset technology, offers increased graphics
performance, reduced power consumption, and improved platform reliability and
system manageability.

The Intel® E7525 Chipset MCH is the central hub for all data passing between the
core system elements: processors, memory, PCI Express x16 graphics, PCI Express
I/O and legacy I/O subsystems. It supports dual Intel Xeon processors with 1MB L2
cache over the 800 MHz system bus interface, delivering bandwidth up to 6.4
GB/second. The MCH also supports all of the Intel Xeon processor features, such as
Hyper Threading technology, Enhanced Intel SpeedStep Technology, Intel EM64T
and Streaming SIMD Extensions 3 (SSE3) Instructions.

The PCI Express x16 interface supports a total bandwidth of 8 GB/second (4
GB/second per direction) and directly attaches the MCH to a variety of third-party
graphics adapters. A variety of Intel and third-party I/O solutions communicate
directly with the MCH through the PCI Express x8 interface. The Intel E7525 MCH
has one PCI Express x8 interface that can be bifurcated into two x4 interfaces for
additional configuration flexibility. The bandwidth of the PCI Express x8 is up to 4
GB/second.

The legacy I/O connects to the MCH through the Intel Hub Interface architecture at
256 MB/second. There are two I/O controller hub options: the Intel 82801ER I/O
Controller Hub (ICH5R) and the Intel 6300ESB I/O Controller Hub.

Figure 8: E7525 Block Diagram

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The Intel® 6300ESB I/O Controller (Southbridge)

The Intel® 6300ESB I/O Controller Hub integrates dual independent Serial ATA
controllers, each capable of up to 150 MB/second transfer rate, for the most
demanding storage data transfers and support for optional third party software RAID
0, 1 technology. Four Hi-Speed USB 2.0 ports allow easy I/O connection, while
offering improved bandwidth compared to USB 1.1 devices. The Intel 6300ESB I/O
Controller Hub also includes one PCI-X 64/66 bus supporting up to 4 PCI-X 64/66
MHz interfaces.

Figure 9: 6300 Block Diagram

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Vig390s motherboard block diagram

Figure 10: Vig390s Block Diagram

The Vig390s motherboard integrates both the Intel E7525 MHC and Intel 6300ESB
I/O controller with the following additional components:

- Gigabit LAN BCM5751

- IEEE1394a controller TBS43AB22A

- USB 2.0 controller VT6202

- H/W monitor W83792B

- Supper I/O controller W83627THF-A

Note: The Adaptec S-ATA RAID controller AIC-8130 is an option not incorporated

into the Vig390s.

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USB Support

The motherboard has four rear USB 2.0 ports; note optional front panel USB adaptor
connector is required to use the internal USB headers to provide up to 4 more
additional ports. One USB peripheral can be connected to each port. For more than
four USB devices, an external hub can be connected to either port. The
motherboard fully supports the universal host controller interface (UHCI) and (EHCI)
and uses UHCI-and EHCI- compatible drivers. The ICH5 provides the USB controller
for all ports.

The port arrangement is as follows:

• Two ports are implemented with stacked back panel connectors, adjacent to

the PS/2 connectors

• Two ports are implemented with stacked back panel connectors, adjacent to

the audio connectors

• Four ports are routed to two separate front panel USB connectors

Note: USB 2.0 drivers are available for Windows 2000 Pro and Windows XP, and

currently not supported by any other operating system.

USB features include:

• Self-identifying peripherals that can be plugged in while the computer is

running.

• Automatic mapping of function to driver and configuration.

• Supports isochronous and asynchronous transfer types over the same set of

wires.

• Supports up to 127 physical devices.

• Guaranteed bandwidth and low latencies appropriate for telephony, audio,

and other applications.

• Error-handling and fault-recovery mechanisms built into the protocol.

Note: Computer systems that have an unshielded cable attached to a USB port may

not meet FCC Class B requirements, even if no device or a low-speed (sub-channel)
USB device is attached to the cable. Use shielded cable that meets the
requirements for high-speed (fully rated) devices.

IDE Support

The VIG390S motherboard provides four IDE interface connectors:

• Two Parallel ATA (P-ATA) IDE connectors, which support a total of four

devices (two per connector)

• Two Serial ATA (S-ATA) IDE connectors, which support one device per

connector

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Parallel ATA IDE Interfaces

The ICH5’s Parallel ATA IDE controller has two independent bus-mastering Parallel
ATA IDE interfaces that can be independently enabled. The Parallel ATA IDE
interfaces support the following modes:

• Programmed I/O (PIO): processor controls data transfer.

• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up

to 16 MB/sec.

• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and

transfer rates of up to 33 MB/sec.

• ATA-66: DMA protocol on IDE bus supporting host and target throttling and

transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and
is device driver compatible.

• ATA-100: DMA protocol on IDE bus allows host and target throttling. The

ICH5’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and
write transfer rates up to 88 MB/sec.

Serial ATA Support

The ICH5’s Serial ATA controller offers two independent Serial ATA ports with a
theoretical maximum transfer rate of 150 MB/s per port. One device can be installed
on each port for a maximum of two Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI resource steering is used. Native mode is the
preferred mode for configurations using the Windows XP and Windows 2000
operating systems.

LS-120 Support

LS-120 MB Diskette technology enables you to store 120MB of data on a single, 3.5”
removable diskette. LS-120 technology is backward (both read and write)
compatible with 1.44MB and 720KB DOS-formatted diskette and is supported by
Windows 95 and Windows NT operating system.

The VIG390S board allows connection of an LS-120 compatible drive and a standard
3½” floppy drive. The LS-120 drive can be configured as a boot device before a
floppy drive, if selected in the BIOS setup utility.

Note: If you connect an LS-120 drive to an IDE connector and configure it as the “A”

drive and configure a standard 3.5” floppy as “B” drive, the standard floppy must be
connected to the floppy drive cable’s “A” connector (the connector at the end of the
cable).

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The BIOS setup utility can be configured to boot firstly from either the LS120 or
standard 3½” floppy drive.

Real-Time Clock, CMOS SRAM and Battery

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.

Note: If the battery and AC power fail, custom defaults, if previously saved, will be

loaded into CMOS RAM at power-on.

I/O Controller

The I/O controller (Intel® 6300ESB I-O Controller Hub) provides the following
features:

• One serial port (optional second serial port).

• One parallel port with Extended Capabilities Port (ECP) and Enhanced

Parallel Port (EPP) support

• Serial IRQ interface compatible with serialised IRQ support for PCI systems

PS/2-style mouse and keyboard interfaces

• Interface for one 1.44 MB diskette drive

• PCI-X 64/66 ports

• PCI 32/33 ports

• Two P-ATA ports

• Two S-ATA ports with configurable Intel RAID 0 and 1 support

• Intelligent power management, including a programmable wake-up event

interface

• SMBus hardware management support

• Integrated USB hub

By default, the I/O controller interfaces are automatically configured during boot up.
The I/O controller can also be manually configured in the Setup program.

Serial Ports

One 9-pin D-Sub serial port connector is located on the back panel and is compatible
with NS16C550 UARTs.

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Parallel Port

The connector for the multimode bi-directional parallel port is a 25-pin D-Sub
connector located on the back panel. In the Setup program, the parallel port can be
configured for the following:

• Compatible (standard mode).

• Bi-directional (PS/2 compatible).

• Extended Parallel Port (EPP).

• Enhanced Capabilities Port (ECP).

Floppy Controller

The I/O controller is software compatible with the N82077 floppy drive controllers
and supports both PC-AT and PS/2 modes. In the Setup program, the floppy
interface can be configured for the following floppy drive capacities and sizes:

• 360 KB, 5.25-inch

• 1.2 MB, 5.25-inch

• 720 KB, 3.5-inch

• 1.2 MB, 3.5-inch (driver required)

• 1.25/1.44 MB, 3.5-inch (default configuration)

• 2.88 MB, 3.5-inch

PS/2 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines
to these connectors are protected with a PolySwitch circuit that, like a self-healing
fuse, re-establishes the connection after an over-current condition is removed.

The keyboard controller contains the AMI Megakey keyboard and mouse controller
code, provides the keyboard and mouse control functions, and supports password
protection for power on/reset. A power on/reset password can be specified in Setup.
The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a
software reset. This key sequence resets the computer’s software by jumping to the
beginning of the BIOS code and running the Power-On Self Test (POST).

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Audio Subsystem

The VIG390S motherboard provides a Flex 6 audio subsystem based on the High
Definition Audio subsystem using the ADI AD1980 6 channel audio codec.

The audio subsystem supports the following features:

• Advanced jack sense with Auto Topology Switching that enables the audio codec
to recognise what device is connected to an audio port and alerts the user if the
wrong type of device has been connected.

• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: > 94 dB

The Flex 6 audio subsystem includes the following features:

• Intel 82801EB I/O Controller Hub (ICH5)

• Analog Devices AD1980 audio codec

• Microphone input that supports a single dynamic, condenser, or electrets

microphone

The subsystem has the following connectors:

• ATAPI-style CDROM connector

• Front panel audio connector, including pins for:

o Line In
o Mic in

Audio 2/4/6 Channel configurations

The audio ports may be re configured via the audio control panel, default operation is
2 channel audio.

Table 6: Audio 2/4/6 Channel configurations

Port 2 channel 4 channel 6 channel
Audio line In
(Light Blue)
Line Out
(Lime green)
Mic in
(Pink)

• Back panel audio connectors that are configurable through the audio devices
derivers. The available configurations are shown below:

Line In Line In Bass/Centre

Line out Front Speaker

Out L & R

Mic In Rear Speaker

Out L & R

Front Speaker
Out L & R
Rear Speaker
Out L & R

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Figure 11: Back Panel Audio Connector Options

Note: To access the S/PDIF signal with the 5.1 Digital Shared Jack option, connect

a 1/8-inch stereo phone plug to RCA jack adapter/splitter as shown in Figure 12.

Figure 12: Adapter for S/PDIF Back Panel Connector

Audio Connectors

Front Panel Audio connector

A 2 x 5-pin connector provides mic in and line out signals for front panel audio
connectors.

Auxiliary Line In Connector

A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an
internal audio device to the audio subsystem.

ATAPI CDROM Audio Connector

A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the
audio mixer.

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LAN Subsystem

The Network Interface Controller subsystem consists of the Broadcom NetXtreme™
BMC5751 PCI Express Gigabit LAN controller Supporting PCI Express 1.0a
interface.

Features

• 10/100/100BASE-T Gigabit Ethernet

• PCI-Express bus interface

• IEEE802.3 compliant media access controller (MAC)

• TCP,IP, and UDP checksum

• Microsoft® large Send Offload

• Large burst read

• Interrupt coalescing

• Standard-compliant WOL

• SMBUS 2.0 controller

• Alert Standard Format (ASF) 2.0 support

• Supports RJ-45 connector with status indicator LEDs

• Full driver compatibility

• Advanced Power Management support

• Configuration EEPROM that contains the MAC address

RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. The following table describes the
LED states when the board is powered up and the LAN subsystem is operating.

Figure 13: LAN Connector

Table 7: LAN Connector LEDs

ACT/LINK LED SPEED LED

OFF No link Off 10Mbps
Green Linked Orange 100Mbps
Blinking Data activity Green 1 Gbps

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Hardware Management Subsystem

The hardware management features enable the Desktop Boards to be compatible
with the Wired for Management (WfM) specification. The Desktop Board has several
hardware management features, including the following:

• Fan monitoring and control (through the hardware monitoring and fan control

ASIC)

• Thermal and voltage monitoring

• Chassis intrusion detection

Hardware Monitoring and Fan Control ASIC

The features of the hardware monitoring and fan control ASIC include:

• Internal ambient temperature sensor

• Two remote thermal diode sensors for direct monitoring of processor

temperature and ambient temperature sensing

• Power supply monitoring of voltages (+5 V, +12 V, +3.3 V, Vbat 3.3, Vcore1

and Vcore2) to detect levels above or below acceptable values

• Thermally monitored closed-loop fan control, for all fans, that can adjust the

fan speed as needed.

• SMBus interface

Thermal Monitoring

Table 8: Hardware Monitor Options

Item Description

A Thermal diode, located on processor die
B Remote ambient temperature sensor
C MB ambient temperature sensor
D Processor fan speed
E Rear chassis fan speed
F Front chassis fan speed

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Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:

o Power connector
o Fan connectors
o LAN wake capabilities
o Instantly Available PC technology
o Resume on Ring
o Wake from USB
o Wake from PS/2 devices
o Power Management Event signal (PME#) wake-up support

ACPI

ACPI gives the operating system direct control over the power management and
Plug and Play functions of a computer. The use of ACPI with the VIG390S
motherboard requires an operating system that provides full ACPI support. ACPI
features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power­on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events

• Support for a front panel power and sleep mode switch

Table 9 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.

Table 9: Effects of Pressing the Power Switch

If the system is in this
state…

Off
(ACPI G2/G5 – soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)

…and the power switch is
pressed for

Less that four seconds Power-on

Less than four seconds Soft off/Standby

More than four seconds Fail safe power-off

Less that four seconds Wake-up

More than fore seconds Power-off

…the system enters this state

(ACPI G0 – working)

(ACPI G1 – sleeping state)

(ACPI G2/G5 – soft-off)

(ACPI G0 – working state)

(ACPI G2/G5 – Soft off)

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System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.

Table 10 lists the power states supported by the VIG390S motherboard along with
the associated system power targets. See the ACPI specification for a complete
description of the various system and power states.

Table 10: Power States and Targeted System Power

Global States Sleeping States Processor

States

G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G1 – Sleeping
state
G2/S5 S5 – Soft off.

G3 –
Mechanical off
AC power is
disconnected
for the
computer

S0 – working C0 – working D0 – working state Full Power > 30W

S1 – Processor
stopped
S3 – Suspend to
RAM.
S4 – Suspended
to disk.

saved
No power to the
system

C1 – stop grant D1, D2, D3 – device

No power D3 – no power except

No power D3 – no power except

No power D3 – no power except

No power D3 – no power for

Device States Targeted System

Power

5W < power <

specification specific

for wake-up logic

for wake-up logic

for wake-up logic

wake-up logic, except
when provided by
battery or external
source

52.5W
Power < 5W

Power < 5W

Power < 5W

No power to the
system. Service
can be performed
safely.

Wake-up Devices and Events

Table 11 lists the devices or specific events that can wake the computer from
specific states.

Table 11: Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

LAN S1, S3, S4, S5
Modem (Back panel Serial Port A) S1, S3
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3

Note: The use of these wake-up events from an ACPI state requires an operating

system that provides full ACPI support. In addition, software, drivers, and peripherals
must fully support ACPI wake events.

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Hardware Support

CAUTION!

Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required
depends on the wake devices supported and manufacturing options.

The VIG390S motherboard provides several power management hardware features,
including:

• Power connector

• Fan connectors

• LAN wake capabilities

• Instantly Available PC technology

• Resume on Ring

• Wake from USB

• Wake from PS/2 keyboard

• PME# signal wake-up support

LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line. The sections discussing these features describe the incremental
standby power requirements for each.

Resume on Ring enables telephony devices to access the computer when it is in a
power-managed state. The method used depends on the type of telephony device
(external or internal).

Note: The use of Resume on Ring and Wake from USB technologies from an ACPI

state requires an operating system that provides full ACPI support.

Power Connector

SSI ATX 12V compliant power supplies can turn off the system power through
system control. When an ACPI-enabled system receives the correct command, the
power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

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LAN wake Capabilities

CAUTION!

For LAN wake capabilities, the +5 V standby line for the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.

LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the VIG390S motherboard supports LAN wake capabilities with
ACPI in the following ways:

• The PCI bus PME# signal for PCI 2.2 compliant LAN designs

• The onboard LAN subsystem

Instantly Available PC Technology

CAUTION!

For Instantly Available PC technology, the +5 V standby line for the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.

Instantly Available PC technology enables the VIG390S motherboard to enter the
ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer
will appear to be off (the power supply is off, and the front panel LED is amber if dual
coloured, or off if single coloured.) When signalled by a wake-up device or event, the
system quickly returns to its last known wake state.

The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards and drivers.

Resume on Ring

The operation of Resume on Ring can be summarised as follows:

• Resumes operation from ACPI S1 or S3 states

• Detects incoming call similarly for external and internal modems

• Requires modem interrupt be unmasked for correct operation

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