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Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Thermal/Mechanical Design Guide

July 2008

Revision 003US

Order Number: 318676-003US

July 2008 Order Number: 318676-003US

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

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Contents

1.0

Introduction

..............................................................................................................

6

 

1.1

Design Flow........................................................................................................

6

 

1.2

Definition of Terms ..............................................................................................

7

 

1.3

Related .............................................................................................Documents

8

 

1.4

Thermal .............................................................................................Simulation

9

2.0

Packaging Technology ...............................................................................................

9

 

2.1

Package .......................................................................Mechanical Requirements

11

3.0

Thermal Specifications ............................................................................................

12

 

3.1

Thermal ..............................................................................Design Power (TDP)

12

 

3.2

Case Temperature .............................................................................................

12

4.0

Thermal Solution ...............................................................................Requirements

12

 

4.1

Characterizing ..................................................the Thermal Solution Requirement

12

5.0

Thermal Metrology ..................................................................................................

15

 

5.1

MCH Case .....................................................................................Measurement

15

 

 

5.1.1 ......................................................................

Supporting Test Equipment

15

 

 

5.1.2 ..............................................................

Thermal Calibration and Controls

16

 

 

5.1.3 ...........................................................................................

IHS Groove

16

 

 

5.1.4 ...............................................

Thermocouple Conditioning and Preparation

18

 

 

5.1.5 .............................................................

Thermocouple Attachment to IHS

18

 

 

5.1.6 .......................................................................................

Curing Process

22

 

 

5.1.7 ..............................................................

Thermocouple Wire Management

23

 

5.2

Power Simulation .................................................................................Software

24

6.0

Reference Thermal .....................................................................................Solution

24

 

6.1

AdvancedTCA* ......................................................................Reference Heatsink

25

 

 

6.1.1 ..............................................................................

Thermal Performance

25

 

 

6.1.2 ....................................................................

Mechanical Design Envelope

25

 

 

6.1.3 ............................................

Board - level Components Keepout Dimensions

26

 

 

6.1.4 .....................................

Torsional Clip Heatsink Thermal Solution Assembly

26

 

 

6.1.5 ...............................................................................

Heatsink Orientation

27

 

 

6.1.6 .......................................................................

Extruded Heatsink Profiles

27

 

 

6.1.7 ...................................................................

Mechanical Interface Material

27

 

 

6.1.8 .......................................................................

Thermal Interface Material

27

 

 

.........................................

6.1.8.1 Effect of Pressure on TIM Performance

28

 

 

6.1.9 .........................................................................................

Heatsink Clip

28

 

 

6.1.10 ............................................................................

Clip Retention Anchors

28

 

 

6.1.11 ...............................................................................

Reliability Guidelines

28

 

6.2

CompactPCI* ........................................................................Reference Heatsink

29

 

 

6.2.1 ..............................................................................

Component Overview

29

 

 

6.2.2 ............................................

Thermal Solution Performance Characteristics

30

7.0

Reliability Guidelines...............................................................................................

30

A

Mechanical Drawings...............................................................................................

31

B

Thermal Solution ...................................................................Component Suppliers

40

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Figures

 

1

Thermal Design Process .............................................................................................

7

2

MCH Package Dimensions (Top View) ..........................................................................

10

3

MCH Package Dimensions (Side View) .........................................................................

10

4

MCH Package Dimensions (Bottom View) .....................................................................

11

5

Processor Thermal Characterization Parameter Relationships ..........................................

13

6

IHS Groove Dimensions.............................................................................................

17

7

Orientation of Thermocouple Groove Relative to Package Pin ..........................................

18

8

Bending Tip of Thermocouple .....................................................................................

18

9

Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................

19

10

Thermocouple Bead Placement...................................................................................

20

11

Positioning Bead on Groove .......................................................................................

20

12

Using 3D Micromanipulator to Secure Bead Location......................................................

21

13

Measuring Resistance between Thermocouple and IHS ..................................................

21

14

Applying Adhesive on Thermocouple Bead....................................................................

22

15

Thermocouple Wire Management in Groove..................................................................

23

16

Removing Excess Adhesive from IHS...........................................................................

23

17

Filling Groove with Adhesive ......................................................................................

24

18

Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............

25

19

AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................

26

20

Torsional Clip Heatsink Assembly................................................................................

27

21

Isometric View of the CompactPCI* Reference Heatsink.................................................

29

22

CompactPCI* Reference Heatsink Thermal Performance.................................................

30

23

AdvancedTCA* Heatsink Assembly Drawing .................................................................

32

24

AdvancedTCA* Heatsink Drawing................................................................................

33

25

AdvancedTCA* Component Keepout Zone....................................................................

34

26

CompactPCI* Heatsink Assembly Drawing ...................................................................

35

27

CompactPCI* Heatsink Drawing..................................................................................

36

28

CompactPCI* Component Keepout Zone......................................................................

37

29

Torsional Clip Heatsink Clip Drawing ...........................................................................

38

30

TIM2 Drawing ..........................................................................................................

39

Tables

 

1

Definition of Terms ....................................................................................................

7

2

Related Documents....................................................................................................

8

3

Intel® 5100 Memory Controller Hub Chipset Thermal Specifications.................................

12

4

Required Heatsink Thermal Performance (ΨCA) .............................................................

15

5

Thermocouple Attach Support Equipment ....................................................................

16

6

Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................

28

7

Reliability Guidelines.................................................................................................

29

8

Reliability Requirements ............................................................................................

30

9

Mechanical Drawing List ............................................................................................

31

10

MCH Torsional Clip Heatsink Thermal Solution ..............................................................

40

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Revision History

Date

Revision

Description

 

 

 

 

 

Added the CompactPCI* reference solution

July 2008

003

Added Figure 26, Figure 27, and Figure 28

 

 

Updated the supplier information

 

 

 

February 2008

002

Updated the TDPMax config value to 25.7 W in Table 3

November 2007

001

Initial release

 

 

 

Revision Number Descriptions

Revision

Associated Life Cycle Milestone

Release Information

 

 

 

0.0

POP L3 Closure

Initial Documentation - Typically Internal Only

 

 

 

0.1–0.4

When Needed

Project Dependent - Typically Internal Only

 

 

 

0.5

Design Win Phase

First, Required Customer Release

0.6–0.7

When Needed

Project Dependent

 

 

 

0.7

Simulations Complete

Second, Recommended Customer Release

 

 

 

0.8–0.9

When Needed

Project Dependent

 

 

 

1.0

First Silicon Samples

Required Customer Release

1.1–1.4

When Needed

Project Dependent (Recommended)

 

 

 

1.5

Qualification Silicon Samples

Project Dependent

 

 

 

1.6–1.9

When Needed

Project Dependent

 

 

 

NDA - 2.0

First SKU Launch

Required Customer Release - Product Launch

Public - XXXXXX-001

 

 

2.1 and up

When Needed

Project Dependent

 

 

 

Note: Rows highlighted in gray are required revisions.

 

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1.0Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

Outline the thermal and mechanical operating limits and specifications for the Intel® 5100 Memory Controller Hub Chipset (Intel® 5100 MCH Chipset)

Describe reference thermal solutions that meet the specification of the Intel® 5100 MCH Chipset

Properly designed thermal solutions provide adequate cooling to maintain the Intel® 5100 MCH Chipset die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel® 5100 MCH Chipset die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel® 5100 MCH Chipset components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the ICH9R, refer to the Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Note: Unless otherwise specified, the term “MCH” refers to the Intel® 5100 MCH Chipset.

1.1Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step.

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Figure 1. Thermal Design Process

Step 1: Thermal Simulation

 

 

 

 

Package Level Thermal Models

 

 

 

 

Thermal Model User’s Guide

Step 2: Heatsink Design

 

 

 

 

and Selection

 

 

 

 

Reference Heatsinks

 

 

 

 

Reference Mounting Hardware

Step 3: Thermal Validation

 

 

Vendor Contacts

 

 

 

 

 

 

 

 

Thermal Testing Software

 

 

 

 

Thermal Test Vehicle

 

 

 

 

User Guides

1.2Definition of Terms

Table 1.

Definition of Terms

 

 

 

 

 

Term

Definition

 

 

 

 

 

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where

 

 

a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)

 

FC-BGA

attach style. The primary electrical interface is an array of solder balls

 

 

attached to the substrate opposite the die.

 

 

Note: The device arrives at the customer with solder balls attached.

 

 

 

 

BLT

Bond line thickness. Final settled thickness of the thermal interface material

 

after installation of heatsink.

 

 

 

 

 

 

ICH9

I/O Controller Hub 9

 

 

 

 

IHS

Integrated Heat Spreader

 

 

 

 

 

Memory controller hub. The chipset component that contains the processor

 

MCH

interface, the memory interface, the PCI Express* interface and the ESI

 

 

interface.

 

 

 

 

Tcase_max

Maximum allowed component temperature. This temperature is measured at

 

the geometric center of the top of the package IHS.

 

Tcase_min

Minimum allowed component temperature. This temperature is measured at

 

the geometric center of the top of the package IHS.

 

 

Thermal design power. Thermal solutions should be designed to dissipate

 

TDP

this target power level. TDP is not the maximum power that the chipset can

 

 

dissipate.

 

 

 

 

TIM

Thermal Interface Material

 

 

 

 

ΨCA

Case-to-ambient thermal characterization parameter. A measure of the

 

thermal solution thermal performance including TIM using the thermal

 

 

design power. Defined as (TCASE - TLA) / TDP

 

ΨCS

Case-to-sink thermal characterization parameter. A measure of the TIM

 

thermal performance using the thermal design power. Defined as (TCASE -

 

 

TLA) / TDP

 

ΨSA

Sink-to-ambient thermal characterization parameter. A measure of heatsink

 

thermal performance using the thermal design power. Defined as (TCASE -

 

 

TLA) / TDP

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1.3Related Documents

Intel® Electronic Design Kits (EDKs) provide online, real-time collateral updates. The following links take you to the EDK server and require you to log into Intel® Business Link (IBL).

Quad-Core and Dual-Core Intel® Xeon® Processor 5000 Sequence with Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel® Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory Controller Hub Chipset for Communications and Embedded Applications

The reader of this specification should also be familiar with material and concepts presented in the documents listed in Table 2.

Table 2.

Related Documents (Sheet 1 of 2)

 

 

 

 

 

Document

Document Number/URL

 

 

 

 

BGA/OLGA Assembly Development Guide

Note 1

 

 

 

 

Dual-Core Intel® Xeon® Processor 5100 Series Datasheet

http://www.intel.com/ (313355)

 

Dual-Core Intel® Xeon® Processor 5100 Series Specification

http://www.intel.com/ (313356)

 

Update

 

 

 

 

 

 

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/

http://www.intel.com/ (313357)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Dual-Core Intel® Xeon® Processor 5200 Series Datasheet

http://www.intel.com/ (318590)

 

Dual-Core Intel® Xeon® Processor 5200 Series Specification

http://www.intel.com/ (318586)

 

Update

 

 

 

 

 

 

Dual-Core Intel® Xeon® Processor 5200 Series Thermal/

http://www.intel.com/ (318675)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Dual-Core Intel® Xeon® Processor LV 5138 in Embedded

http://www.intel.com/ (315225)

 

Applications Thermal/Mechanical Design Guidelines

 

 

 

 

 

 

Intel® 5000 Series Chipset Memory Controller Hub (MCH)

http://www.intel.com/ (313067)

 

Thermal/Mechanical Design Guide

 

 

 

 

 

 

Intel® 5100 Memory Controller Hub Chipset (embedded) –

Note 1

 

External Design Specification (EDS) Addendum

 

 

 

 

 

 

Intel® 5100 Memory Controller Hub Chipset (embedded) –

Note 1

 

Maximum Power Application

 

 

 

 

 

 

Intel® 5100 Memory Controller Hub Chipset Datasheet

http://www.intel.com/ (318378)

 

Intel® 5100 Memory Controller Hub Chipset Specification Update

http://www.intel.com/ (318385)

 

Intel® Core™2 Duo Processor, Intel® Core™2 Solo Processor and

http://www.intel.com/ (320120)

 

Intel® Core™2 Extreme Processor on 45-nm Process Datasheet

 

Intel® Core™2 Duo Processor, Intel® Core™2 Solo Processor and

 

 

Intel® Core™2 Extreme Processor on 45-nm Process

http://www.intel.com/ (320121)

 

Specification Update

 

 

 

 

 

Intel® Core™2 Duo Processors on 45-nm process for Embedded

http://www.intel.com/ (320028)

 

Applications Thermal Design Guide

 

 

 

 

 

 

Intel® Core™2 Duo Processors T9400 and SL9400 and Intel®

 

 

5100 Memory Controller Hub Chipset for Communications and

Note 1

 

Embedded Applications – Platform Design Guide

 

 

 

 

 

Intel® I/O Controller Hub 9 (ICH9) Family Datasheet

http://www.intel.com/ (316972)

 

Intel® I/O Controller Hub 9 (ICH9) Family Specification Update

http://www.intel.com/ (316973)

Notes:

1.Contact your Intel sales representative. Some documents may not be available at this time.

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Table 2.

Related Documents (Sheet 2 of 2)

 

 

 

 

 

Document

Document Number/URL

 

 

 

 

Intel® I/O Controller Hub 9 (ICH9) Family Thermal and

http://www.intel.com/ (316974)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core and Dual-Core Intel® Xeon® Processor 5000

 

 

Sequence with Intel® 5100 Memory Controller Hub Chipset for

Note 1

 

Communications, Embedded, and Storage Applications –

 

 

 

Platform Design Guide

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

http://www.intel.com/ (315569)

 

Quad-Core Intel® Xeon® Processor 5300 Series Specification

http://www.intel.com/ (315338)

 

Update

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/

http://www.intel.com/ (315794)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet

http://www.intel.com/ (318589)

 

Quad-Core Intel® Xeon® Processor 5400 Series Specification

http://www.intel.com/ (318585)

 

Update

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5400 Series Thermal/

http://www.intel.com/ (318611)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor L5318 in Embedded

http://www.intel.com/ (318474)

 

Applications Thermal and Mechanical Design Guidelines

 

 

 

 

 

 

Various system thermal design suggestions

http://www.formfactors.org

 

 

 

Notes:

1.Contact your Intel sales representative. Some documents may not be available at this time.

1.4Thermal Simulation

Intel provides thermal simulation models of the Intel® 5100 MCH Chipset and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative to order the thermal models and user’s guides.

2.0Packaging Technology

Intel® 5100 MCH Chipset-based platforms consist of two individual components: the Intel® 5100 MCH Chipset and the ICH9R. The Intel® 5100 MCH Chipset uses a 42.5 mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and Figure 4). For information on the ICH9R package, refer to the Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.

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Figure 2. MCH Package Dimensions (Top View)

Handling

Exclusion

Area

38.5 mm,

MCH

38.5 mm. 42.5 mm. IHS

42.5 mm.

Figure 3.

MCH Package Dimensions (Side View)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4.23 ± 0.146 mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3.79 ± 0.144 mm

 

 

IHS

Substrate

 

 

 

 

 

2.44 ± 0.071 mm

 

 

 

 

 

 

 

See note 4.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.20 –C–

Seating Plane

0.435 ± 0.025 mm

See note 3 See note 1.

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

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Intel® 5100 MCH Chipset

Figure 4.

MCH Package Dimensions (Bottom View)

 

 

AV

 

 

AU

 

 

AT

 

 

AR

 

 

AP

 

 

AN

 

 

AM

 

 

AL

 

 

AK

 

 

AJ

 

 

AH

 

 

AG

 

 

AF

 

 

AE

 

 

AD

 

 

AC

 

 

AB

 

 

AA

42.5 + 0.05

 

Y

- A -

 

W

 

 

V

U

T

R

P

N

M

L

20.202 K

J

H

G

F

E

37X 1.092 D

C

B

A

2

 

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

 

36

38

 

 

 

1

3

5

7

9

11

 

13

15

17

19

21

23

25

27

29

31

33

35

37

 

 

A

37X 1.092

20.202

42.5 + 0.05 B

0.2

C

A

Notes:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The Intel® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note: The heatsink attach solutions must not include continuous stress to the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

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Note: These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

Note: These specifications are based on limited testing for design characterization. Loading limits are for the package only.

3.0Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level to which the thermal solutions should be designed. TDP is not the maximum power that the chipset can dissipate.

FC-BGA packages have a poor heat transfer capability into the board and have a minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel® 5100 MCH Chipset.

3.2Case Temperature

To ensure proper operation and reliability of the Intel® 5100 MCH Chipset, the case temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5.0, “Thermal Metrology” on page 15 for guidelines on accurately measuring package case temperatures.

Table 3. Intel® 5100 Memory Controller Hub Chipset Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105 °C

 

Tcase_min

5 °C

 

TDPMax config

25.7 W

DP FSB 1333, 2 channel DDR2 667, 3 x8 PCI Express*

TDPTypical ATCA config

23.0 W

DP FSB 1067, 2 channel DDR2 533, 3 x8 PCI Express*

TDPTypical UP config

19.5 W

UP FSB 1067, 1 channel DDR2 533, 1 x8 PCI Express*

4.0Thermal Solution Requirements

4.1Characterizing the Thermal Solution Requirement

The idea of a “thermal characterization parameter” Ψ (the Greek letter Psi) is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (in other words, heating source, local ambient conditions, and so forth). The thermal characterization parameter is calculated using total package power; whereas, actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, because some of the power is dissipated through a heat transfer into the package and board.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG

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