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Intel® Compute Stick
STCK1A32WFC
STCK1A32FC
STCK1A8LFC
Technical Product Specification
September 2015
Order Number: H91229-001
Page 2
Revision History
Revision Revision History Date
001 First release September 2015
Disclaimer
This product specification applies to only the standard Intel® Compute Stick with BIOS identifier
FCBYT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel Compute Sticks are evaluated as Information Technology Equipment (I.T.E.) for installation in homes, offices,
schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC
applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported
without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, the Intel logo, Intel Compute Stick, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other
countries.
* Other names and brands may be claimed as the property of others.
Copyright 2015 Intel Corporation. All rights reserved.
®
Processor Numbers
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/ComputeStickSupport
for the latest documentation.
Page 3
Preface
1
A description of the hardware used on Intel Compute Stick
2
A map of the resources of the Intel Compute Stick
3
The features supported by the BIOS Setup program
This Technical Product Specification (TPS) specifies the layout, components, connectors, power
and environmental requirements, and the BIOS for Intel Compute Stick STCK1A32WFC,
STCK1A32FC and STCK1A8LFC.
NOTE
In this document, the use of “Intel Compute Stick” will refer to the STCK1A32WFC, STCK1A32FC
and STCK1A8LFC versions of the Intel Compute Stick.
Intended Audience
The TPS is intended to provide detailed technical information about Intel Compute Stick
STCK1A32WFC, STCK1A32FC and STCK1A8LFC and its components to the vendors, system
integrators, and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.
What This Document Contains
Chapter Description
STCK1A32WFC, STCK1A32FC and
STCK1A8LFC
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
Xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
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Contents
Revision History
Errata ............................................................................................................................................................................ ii
Preface
Intended Audience................................................................................................................................................ iii
What This Document Contains ........................................................................................................................ iii
Typographical Conventions .............................................................................................................................. iii
1 Product Description
1.1 Overview ......................................................................................................................................................... 7
1.1.1 Version Summary ..................................................................................................................... 7
1.1.2 Feature Summary ..................................................................................................................... 7
1.1.3 Location of Components ....................................................................................................... 8
1.1.4 Block Diagram ............................................................................................................................ 9
1.2 Online Support .......................................................................................................................................... 10
1.3 Operating System Overview ................................................................................................................ 10
1.4 Processor ..................................................................................................................................................... 10
1.5 System Memory ........................................................................................................................................ 11
1.6 System Storage ......................................................................................................................................... 11
1.7 Processor Graphics Subsystem ......................................................................................................... 11
1.7.1 Integrated Graphics .............................................................................................................. 11
1.8 USB ................................................................................................................................................................. 12
1.9 Wireless LAN Subsystem ...................................................................................................................... 12
1.9.1 Wireless Network Module .................................................................................................. 12
1.10 Hardware Management Subsystem ................................................................................................. 13
1.11 Power Management ................................................................................................................................ 13
1.11.1 ACPI ............................................................................................................................................. 13
1.11.2 Hardware Support ................................................................................................................. 15
2 Technical Reference
2.1 Memory Resources .................................................................................................................................. 17
2.1.1 Addressable Memory ........................................................................................................... 17
2.2 Co
2.3 Reliability ..................................................................................................................................................... 20
2.4 Environmental ........................................................................................................................................... 20
nnectors .................................................................................................................................................. 18
2.2.1 USB 2.0 Connector ................................................................................................................ 18
2.2.2 Micro SD Card Reader .......................................................................................................... 18
2.2.3 Power Adapter Connector ................................................................................................. 19
2.2.4 Power Adapter ........................................................................................................................ 19
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3 Overview of BIOS Features
3.1 Introduction ................................................................................................................................................ 21
3.2 BIOS Flash Memory Organization ..................................................................................................... 21
3.3 System Management BIOS (SMBIOS) .............................................................................................. 21
3.4 BIOS Updates ............................................................................................................................................. 22
3.4.1 Language Support ................................................................................................................. 22
3.5 BIOS Recovery ........................................................................................................................................... 22
3.6 Boot Options .............................................................................................................................................. 23
3.6.1 Booting Without Attached Devices. ............................................................................... 23
3.6.2 Changing the Default Boot Device During POST ..................................................... 23
3.6.3 Power Button Menu .............................................................................................................. 23
3.7 BIOS Error Messages .............................................................................................................................. 24
Figures
1. Left-Side View of Intel Compute Stick ............................................................................................... 8
2. Right-Side View of Intel Compute Stick ............................................................................................ 8
3. Block Diagram ............................................................................................................................................... 9
4. USB 2.0 Connector .................................................................................................................................. 18
5. Micro SD Card Reader ............................................................................................................................ 18
6. Power Adapter Connector .................................................................................................................... 19
7. Power Adapter ........................................................................................................................................... 19
Tables
1. Version Summary ........................................................................................................................................ 7
2. Feature Summary ........................................................................................................................................ 7
3. Effects of Pressing the Power Switch .............................................................................................. 13
4. Power States and Targeted System Power ................................................................................... 14
5. Wake-up Devices and Events ............................................................................................................. 15
6.
Environmental Specifications ............................................................................................................. 20
7. Acceptable Drives/Media Types for BIOS Recovery ................................................................. 22
8. Boot Device Menu Options .................................................................................................................. 23
9. BIOS Error Messages .............................................................................................................................. 24
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Version
Processor
OS Pre-installed
103.4 millimeters by 37.6 millimeters by 12.5 millimeters (4.0709 inches by 1.44803 inches
• Soldered-down Intel® Atom™ processor
•
• Integrated graphics support with Intel® HD Graphics Technology:
―
• 32 GB soldered-down Embedded MultiMediaCard (eMMC) onboard storage on
•
Soldered-down Single Band Wireless-N module
1 Product Description
1.1 Overview
1.1.1 Version Summary
There are three different versions of this model of Intel® Compute Stick available which are
summarized in Table 1. Unless otherwise noted in this document all features are available on all
versions of the Intel Compute Stick.
Table 1. Version Summary
STCK1A32WFC Intel® Atom™ Z3735F Yes, Windows*
STCK1A32FC Intel® Atom™ Z3735F No
STCK1A8LFC Intel® Atom™ Z3735F Yes, Linux*
1.1.2 Feature Summary
Table 2 summarizes the major features of the Intel Compute Stick.
Table 2. Feature Summary
Form Factor
Processor
Memory
Graphics
Audio Intel® High Definition (Intel® HD) Audio via the HDMI v1.4a interface
Peripheral Interfaces One full size USB 2.0 port
Storage
BIOS
Wireless LAN
by 0.4921 inches)
― Integrated graphics
― Integrated memory controller
― Integrated PCH
Soldered-down single-channel DDR3L/L-RS 1.35 V 1333 MHz memory
• 2 GB total memory on STCK1A32WFC and STCK1A32FC
• 1 GB total memory on STCK1A8LFC
High Definition Multimedia Interface* (HDMI*)
STCK1A32WFC and STCK1A32FC
• 8 GB soldered-down Embedded MultiMediaCard (eMMC) onboard storage on
STCK1A8LFC
• One Micro SD card slot (SDXC v3.0 with UHS-I support)
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
System Management BIOS (SMBIOS)
• 802.11g/n, Single Band, 1x1 Wi-Fi + Bluetooth* 4.0
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
1.1.3 Location of Components
Figures 1 and 2 show the location of the components on the Intel Compute Stick.
Item Description
A HDMI Connector
B Power LED
C Micro SD Card Reader Slot
Figure 1. Left-Side View of Intel Compute Stick
Item Description
A Security Loop
B USB 2.0 Connector
C 5 V DC Connector
D Power On/Off Button
Figure 2. Right-Side View of Intel Compute Stick
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1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the Intel Compute Stick.
Product Description
Figure 3. Block Diagram
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Product Code
MM#
SA #
OS Pre-installed
To find information about…
Visit this World Wide Web site:
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Compute Stick http://www.intel.com/computesticksupport
1.3 Operating System Overview
The Intel Compute Stick STCK1A32WFC has Windows pre-installed with all necessary drivers.
BOXSTCK1A32WFCR 943239 H69761-xxx Windows 8.1 with Bing (32-bit)
BOXSTCK1A32WFC 941865 H79551-xxx Windows 8.1 with Bing (32-bit)
BOXSTCK1A32WFCL 944466 H85498-xxx Windows 10 Home (32-bit)
The Intel Compute Stick STCK1A8LFC has Ubuntu 14.04 LTS 64-bit pre-installed with all
necessary drivers.
The Intel Compute Stick STCK1A32FC supports the following Operating Systems.
• Windows* 10 Home
• Windows 10 Pro
• Windows 10 Enterprise
• Windows 10 Education
• Windows 8.1 Retail
• Windows 8.1 Pro
• Windows 8.1 Enterprise
Installation of any of the above operating systems will require a wired USB mouse and keyboard
along with a USB flash drive or USB optical drive. The USB flash drive or USB optical drive will
need the operating system installation media.
Intel Compute Stick drivers http://downloadcenter.intel.com
1.4 Processor
The Intel Compute Stick has a soldered-down System-on-a-Chip (SoC), which consists of an Intel
Atom Processor Z3735F.
• Integrated graphics
• Integrated memory controller
• Integrated PCH
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Product Description
1.5 System Memory
The Intel Compute Stick has soldered-down memory and supports the following memory
features:
• DDR3L/L-RS 1.35 V 1333 MHz
• Single-channel memory
• 2 GB memory on STCK1A32WFC and STCK1A32FC
• 1 GB memory on STCK1A8LFC.
Refer to Section 2.1.1 on page 17 for information on the total amount of addressable memory.
1.6 System Storage
The Intel Compute Stick has soldered-down storage using an Embedded MultiMediaCard (eMMC)
component. Storage sizes are as follows:
• STCK1A32WFC and STCK1A32FC have 32 GB of total storage
STCK1A32WFC uses a portion of this total storage for the operating system
• STCK1A8LFC has 8 GB of total storage
A portion of this total storage is used for the operating system
1.7 Processor Graphics Subsystem
The Intel Compute Stick supports graphics through Intel HD Graphics.
1.7.1 Integrated Graphics
The Intel Compute Stick supports integrated graphics via the processor.
1.7.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• HDMI 1.4a
• 3D graphics hardware acceleration supporting DirectX*11, OpenCL 1.1, OGL ES2.0,
OpenGL 3.0
• Video decode hardware acceleration for 1080p60 supporting H.264, VC1, WMV9 and VP8
formats
• Video encode hardware acceleration for 1080p30 supporting H.264, VP8, WMV9and VC1
formats
• High-Bandwidth Digital Content Protection (HDCP) 1.4/2.1 support for content protection
1.7.1.2 Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system
memory for use as graphics memory to balance 2D/3D graphics and system performance. If your
computer is configured to use DVMT, graphics memory is allocated based on system
requirements and application demands (up to the configured maximum amount). When memory
is no longer needed by an application, the dynamically allocated portion of memory is returned to
the operating system for other uses.
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1.7.1.3 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital
audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and
supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum
supported resolution is 1920 x 1080 @ 60 Hz, 24 bpp. The HDMI port is compliant with the
HDMI 1.4a specification.
1.7.1.3.1 Integrated Audio Provided by the HDMI Interfaces
The following audio technologies are supported by the HDMI 1.4a interfaces directly from the
SoC:
• AC3 - Dolby* Digital
• Dolby Digital Plus
• LPCM, 192 kHz/24-bit, 8 Channel
1.8 USB
The Compute Stick has one full size USB 2.0 port with maximum current of 500 mA. The USB port
is high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets
the requirements for full-speed devices.
1.9 Wireless LAN Subsystem
The wireless LAN subsystem consists of the following:
• Single Band Wireless module
• 1216 BGA soldered-down
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.9.1 Wireless Network Module
The Single Band Wireless-N module provides hi-speed wireless connectivity with the following
capabilities:
• 802.11g/n, Single Band, 1x1
• Bluetooth 4.0
For information about Refer to
Obtaining WLAN software and drivers http://downloadcenter.intel.com
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Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the Compute Stick to be compatible with the Wired
for Management (WfM) specification. The Compute Stick has several hardware management
features, including thermal and voltage monitoring.
For information about Refer to
Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power Input
Instantly Available PC technology
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with the Intel Compute Stick requires an operating
system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices
Table 3 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 3. Effects of Pressing the Power Switch
If the system is in this state… …and the power switch is pressed for …the system enters this state
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Note: Depending on power management settings in the operating system.
Less than four seconds Power-on
(ACPI G0 – working state)
More than six seconds Fail safe power-off
(ACPI G2/G5 – Soft off)
More than six seconds Power-off
(ACPI G2/G5 – Soft off)
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1.11.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 4 lists the power states supported by the Intel Compute Stick along with the associated
system power targets. See the ACPI specification for a complete description of the various system
and power states.
Table 4. Power States and Targeted System Power
Global States
G0 – working
state
G2/S5 S5 – Soft off. Context
G3 – mechanical
off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration and peripherals powered by the system power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
Sleeping States
S0 – working C0 – working D0 – working state. Full power
not saved. Cold boot
is required.
No power to the
system.
Processor
States
No power D3 – no power
No power D3 – no power for
Device States
except for wake-up
logic.
wake-up logic,
except when
provided by battery
or external source.
Targeted System
(Note 1)
Power
Power < 5 W
No power to the system.
Service can be performed
safely.
(Note 2)
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Product Description
1.11.1.2 Wake-up Devices and Events
Table 5 lists the devices or specific events that can wake the Intel Compute Stick from specific
states.
Table 5. Wake-up Devices and Events
Devices/events that wake up the system… …from this sleep state Comments
Power switch S5
RTC alarm N/A Wake from RTC is not supported
Wireless LAN N/A Wake from Wireless LAN is not supported
USB N/A Wake from USB is not supported
Bluetooth N/A Wake from Bluetooth is not supported
1.11.2 Hardware Support
Power management hardware features include:
• Wake from Power Button signal
• Instantly Available PC technology
1.11.2.1 Power Input
When resuming from an AC power failure, the Intel Compute Stick may return to the power state it
was in before power was interrupted (on or off). The Intel Compute Stick’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
1.11.2.2 Intel® Virtualization Technology
Intel Virtualization Technology (Intel VT) is a hardware-assisted technology that, when
combined with software-based virtualization solutions, provides maximum system utilization by
consolidating multiple environments into a single server or client.
NOTE
A processor with Intel VT does not guarantee that virtualization will work on the Intel Compute
Stick. Intel VT requires enabling software and/or operating system, device drivers, and
applications designed for this feature.
For information about Refer to
Intel Virtualization Technology http://www.intel.com/technology/virtualization/technology.htm
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2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
The Intel Compute Stick utilizes up to 4 GB of addressable system memory. Typically the address
space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space,
BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system
memory). On a system that has 8 GB of system memory installed, it is not possible to use all of
the installed memory due to system address space being allocated for other system critical
functions. These functions include the following:
• BIOS/SPI Flash device (64 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• SoC base address registers PCI Express ports (up to 256 MB)
• Integrated graphics shared memory (up to 512 MB; 64 MB by default)
The Intel Compute Stick provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. Physical memory is remapped from the top of usable
DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just
above the 4 GB boundary. All installed system memory can be used when there is no overlap of
system addresses.
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2.2 Connectors
This section describes the connectors available on the Intel Compute Stick.
2.2.1 USB 2.0 Connector
The Intel Compute Stick has a single full size USB 2.0 connector that supports compliant USB
devices. Bootable USB devices are supported.
Figure 4. USB 2.0 Connector
NOTE
It is recommended to only use a powered USB Hub with the Compute Stick’s USB port.
2.2.2 Micro SD Card Reader
The Intel Compute Stick has a microSecure Digital (SD) card reader that supports the Secure
Digital eXtended Capacity (SDXC) format. . Micro SD card 8 GB, 16 GB, 32 GB, 64 GB and 128GB
sizes are supported.
Figure 5. Micro SD Card Reader
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Technical Reference
2.2.3 Power Adapter Connector
The Intel Compute Stick is powered through a 5V DC connector on the side. The maximum
current rating is 2A.
Figure 6. Power Adapter Connector
2.2.4 Power Adapter
The Intel Compute Stick uses a 5V 2A AC to DC power adapter. The power adapter is connected
to the Intel Compute Stick via a three foot USB Type A to B cable.
Item Description
A 5V 2A Connector
Figure 7. Power Adapter
NOTE
The supplied power adapter and cable is required to power the Intel Compute Stick. Powering the
Intel Compute Stick via any other power source is not supported.
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2.3 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The MTBF prediction is used to estimate repair rates and spare
parts requirements. The MTBF for the Intel Compute Stick, minus the fan, is 65,785 hours. The
Mean Time to Failure (MTTF) for the fan is 46,855 hours.
2.4 Environmental
Table 6 lists the environmental specifications for the Intel Compute Stick.
Table 6. Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +60 °C
Operating 0 °C to +35 °C
The operating temperature of the Intel Compute Stick may be determined by measuring
the air temperature from the outside of the chassis while the system is in operation
Shock
Unpackaged 80cm drop
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
1
Before attempting to operate the Intel Compute Stick, the overall temperature of the Intel Compute Stick must be
above the minimum and below the maximum operating temperatures specified. The operating and non-operating
environment must avoid condensing humidity.
1
.
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3 Overview of BIOS Features
3.1 Introduction
The Intel Compute Stick uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the
BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The
initial production BIOSs are identified as FCBYT10H.86A.
The BIOS Setup program can be used to view and change the BIOS settings for the computer, and
to update the system BIOS. The BIOS Setup program is accessed by pressing the <F2> key after
the Power-On Self-Test (POST) memory test begins and before the operating system boot begins.
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb (8192 KB) flash
memory.
3.3 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a
managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates
for system components. The MIF database defines the data and provides the method for
accessing this information. The BIOS enables applications such as third-party management
software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS
information. The BIOS supports an SMBIOS table interface for such operating systems. Using this
support, an SMBIOS service-level application running on a non-Plug and Play operating system
can obtain the SMBIOS information. Additional information can be found in the BIOS under the
Additional Information header under the Main BIOS page.
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Media Type
(Note)
Can be used for BIOS recovery?
3.4 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
• Intel
• Intel
All utilities verify that the updated BIOS matches the target system to prevent accidentally
installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
BIOS update utilities http://www.intel.com/support/motherboards/desktop/sb/CS-035442.htm
®
Flash Memory Update Utility, which requires booting from DOS. Using this utility, the
BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive),
or a CD-ROM.
F7 switch during POST allows a user to select where the BIOS .bio file is located and
perform the update from that location/device.
3.4.1 Language Support
The BIOS Setup program and help messages are supported in US English. Check the Intel web
site for support.
3.5 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the
BIOS could be damaged. Table 7 lists the drives and media types that can and cannot be used for
BIOS recovery. The BIOS recovery media does not need to be made bootable.
Table 7. Acceptable Drives/Media Types for BIOS Recovery
Hard disk drive (connected to USB) Yes
CD/DVD drive (connected to USB) Yes
USB flash drive Yes
NOTE
Supported file systems for BIOS recovery:
• NTFS (sparse, compressed, or encrypted files are not supported)
• FAT32
• FAT16
• FAT12
• ISO 9660
For information about Refer to
BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/CS-035445.htm
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Regulatory Compliance and Battery Disposal Information
3.6 Boot Options
In the BIOS Setup program, the user can choose to boot from local storage or a removable drive.
The default setting is for the local storage to be the first boot device.
3.6.1 Booting Without Attached Devices.
For use in embedded applications, the BIOS has been designed so that after passing the POST,
the operating system loader is invoked even if the following devices are not present:
• Video Display
• Keyboard
• Mouse
3.6.2 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu
displays the list of available boot devices. Table 8 lists the boot device menu options.
Table 8. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority defined
through BIOS setup
3.6.3 Power Button Menu
The Power Button Menu is accessible via the following sequence:
1. System is in S5 (not G3)
2. User pushes the power button and holds it down for approximately 3 seconds
3. Release immediately
4. User releases the power button before the 4-second shutdown override
If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where
possible.
At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will display the
following prompt and wait for a keystroke:
[ESC] Normal Boot
[F2] Intel BIOS
[F4] BIOS Recovery
[F7] Update BIOS
[F8] Operating System Recovery
[F10] Enter Boot Menu
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
3.7 BIOS Error Messages
Table 9 lists the error messages and provides a brief description of each.
Table 9. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory was
removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
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