Intel SSDSCKGW080A401, SSDSCKGW080A4, SSDSCKHW360A401 User Manual

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Intel® Solid-State Drive 530 Series (M.2)

Intel® Solid-State Drive 530 Series (M.2)

 

 

 

 

 

 

Product Specification

Capacities: 80 GB, 120 GB, 180 GB, 360 GB

Power Management

Components:

 

 

3.3 V SATA Supply Rail

 

Intel® 20 nm NAND Flash Memory

 

SATA Link Power Management (LPM)

 

Multi-Level Cell (MLC)

 

 

Device Sleep (DevSleep)

Form Factors: M.2 80 mm (singleand double-

Power

 

sided)

 

 

Active (BAPCo MobileMark* 2007

 

2280-S2-B-M (80 GB and 180 GB)

 

 

Workload): 140 mW

 

2280-D2-B-M (120 GB and 360 GB)

 

Idle3: 55 mW

Thickness: up to 3.58 mm

 

 

DevSleep: 200 µW

 

 

Temperature

Weight: < 10 grams

 

SATA 6 Gb/s Bandwidth Performance

1

 

Operating4: 0o C to 70o C

 

 

Non-Operating: -55o C to 95o C

 

(Iometer* Queue Depth 32)

 

 

 

 

 

Reliability

 

Sustained Sequential Read: up to 540 MB/s

 

Sustained Sequential Write: up to 490

 

Uncorrectable Bit Error Rate (UBER):

 

 

MB/s

 

 

 

<1 sector per 1016 bits read

Read and Write IOPS1

 

 

Mean Time Between Failure (MTBF):

 

(Iometer Queue Depth 32)

 

 

 

1,200,000 hours

 

Random 4 KB Reads: up to 41,000 IOPS

 

Shock (operating and non-operating):

 

Random 4 KB Writes: up to 80,000 IOPS2

 

 

1,000 G/0.5 msec

Data Compression

 

Vibration

 

 

Operating: 2.17 GRMS (5-700 Hz)

AES 256-bit Encryption

 

 

 

 

— Non-operating: 3.13 GRMS (5-800 Hz)

End-to-End Data Protection

 

 

 

Certifications and Declarations:

Compatibility

 

 

 

UL*

 

Intel® SSD Toolbox with Intel® SSD

 

 

 

CE*

 

 

Optimizer

 

 

 

 

 

 

C-Tick*

 

Intel® Data Migration Software

 

 

 

 

 

BSMI*

 

Intel® Rapid Storage Technology

 

 

 

 

 

KCC*

 

SATA Revision 3.0

 

 

 

 

 

Microsoft* WHCK

 

ACS-2 (ATA/ATAPI Command Set 2)

 

 

 

VCCI*

 

SSD Enhanced SMART ATA feature set

 

 

 

SATA-IO*

 

 

 

 

 

 

 

 

 

Product Ecological Compliance

 

 

 

 

 

RoHS*

NOTES:

1.Performance values vary by capacity.

2.Random 4 KB writes measured using out-of-box SSD.

3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4.As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.

September 2013

Product Specification

Order Number: 329213-002US

1

Intel® Solid-State Drive 530 Series (M.2)

Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.html

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Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

Copyright © 2013 Intel Corporation. All rights reserved.

Product Specification

September 2013

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Order Number: 329213-002US

Intel® Solid-State Drive 530 Series (M.2)

Contents

Revision History ....................................................................................................................

4

1

Introduction...............................................................................................................

5

1.1

Terminology .................................................................................................................

6

1.2

Reference Documents....................................................................................................

7

2

Product Specifications................................................................................................

8

2.1

Capacity

......................................................................................................................

8

2.2

Performance.................................................................................................................

8

2.3

Electrical ................................................................................................Characteristics

9

2.4

Environmental .............................................................................................Conditions

10

 

2.4.1 ........................................................................

Temperature, Shock, Vibration

10

 

2.4.2 .........................................................................................................

Altitude

10

2.5

Product Regulatory .....................................................................................Compliance

11

2.6

Reliability...................................................................................................................

12

3

Mechanical ...........................................................................................Information

13

4

Pin and ......................................................................................Signal Descriptions

15

4.1

Pin Locations ..............................................................................................................

15

4.2

Signal Descriptions......................................................................................................

16

4.3

Device Sleep ...................................................................................................Feature

17

5

Supported ........................................................................................Command Sets

18

5.1

ATA General ...............................................................................Feature Command Set

18

5.2

Power Management .....................................................................................................

19

5.3

Security ...........................................................................................Mode Feature Set

19

5.4

SMART Command ..................................................................................................Set

20

 

5.4.1 ...........................................................................................

SMART Attributes

20

 

5.4.2 ..................................................................................................

SMART Logs

23

5.5

Device Statistics .........................................................................................................

23

5.6

SMART Command .........................................................................................Transport

24

5.7

Data Set ............................................................................Management Command Set

24

5.8

Host Protected ................................................................................Area Command Set

24

5.9

48-Bit Address .......................................................................................Command Set

24

5.10

General Purpose ...............................................................................Log Command Set

24

5.11

Native Command ............................................................................................Queuing

24

5.12

Software .....................................................................................Settings Preservation

25

5.13

SATA Link .............................................................................Power Management (LPM)

25

6

Certifications ................................................................................and Declarations

26

7

Appendix..................................................................................................................

27

September 2013

Product Specification

Order Number: 329213-002US

3

Intel® Solid-State Drive 530 Series (M.2)

Revision History

Document

Revision

Description

Revision Date

Number

Number

 

 

 

 

 

 

329213

001US

Initial release

July 2013

 

 

 

 

329213

002US

Added 120GB capacity

September 2013

 

 

 

 

Product Specification

September 2013

4

Order Number: 329213-002US

Intel® Solid-State Drive 530 Series (M.2)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD 530 Series).

The Intel® SSD 530 Series is a case-less, M.2, next generation storage solution designed for Ultrabook™. The new M.2 form factor allows ultra-compact solutions which deliver leading performance for Serial Advanced Technology Attachment (SATA)-based computers in capacities ranging up to 360 GB.

The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the DevSleep pin. The drive will consume a mere 200 µW while in this state.

As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:

High I/O and throughput performance

Low power consumption

Increased system responsiveness

High reliability

Enhanced ruggedness

Small form-factor

Minimum weight

The Intel SSD 530 Series also offers additional key features such as:

Advanced Encryption Standard (AES) 256-bit Encryption

AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with an ATA drive password—helps protect user data.

End-to-End Data Protection

End-to-end data protection helps protect data from being corrupted across the data path by using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.

Data Compression

Data compression helps improve performance and endurance by automatically compressing information sent to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed depends on the type of data.

September 2013

Product Specification

Order Number: 329213-002US

5

Intel® Solid-State Drive 530 Series (M.2)

1.1Terminology

Table 1: Terminology

Term

Description

 

 

ATA

Advanced Technology Attachment

 

 

DAS

Device Activity Signal

 

 

DevSleep

Device Sleep, a new addition to the SATA specification

 

 

DIPM

Device Initiated Power Management

 

 

DMA

Direct Memory Access

 

 

EXT

Extended

 

 

FPDMA

First Party Direct Memory Access

 

 

 

Gigabyte (1,000,000,000 bytes)

GB

Note: The total usable capacity of the SSD may be less than the total physical

capacity because a small portion of the capacity is used for NAND flash

 

 

management and maintenance purposes.

 

 

HDD

Hard Disk Drive

 

 

HIPM

Host Initiated Power Management

 

 

I/O

Input/Output

 

 

IOPS

Input/Output Operations Per Second

 

 

KB

Kilobyte (1,024 bytes)

 

 

LBA

Logical Block Address

 

 

LPM

Link Power Management

 

 

MB

Megabyte (1,000,000 bytes)

 

 

MLC

Multi-level Cell

 

 

MTBF

Mean Time Between Failures

 

 

NCQ

Native Command Queuing

 

 

NOP

No Operation

 

 

PIO

Programmed Input/Output

 

 

RDT

Reliability Demonstration Test

 

 

RMS

Root Mean Squared

 

 

SATA

Serial Advanced Technology Attachment

 

 

SMART

Self-Monitoring, Analysis and Reporting Technology

 

 

SSD

Solid-State Drive

 

 

TYP

Typical

 

 

UBER

Uncorrectable Bit Error Rate

 

 

Product Specification

September 2013

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Order Number: 329213-002US

Intel® Solid-State Drive 530 Series (M.2)

1.2Reference Documents

Table 2: Standard References

Date or Rev. #

Title

Location

 

 

 

 

IEC 55022 Information Technology Equipment —

 

Sept 2008

Radio disturbance Characteristics— Limits and

http://www.iec.ch/

methods of measurement CISPR22:2008

 

 

 

(Modified)

 

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

 

 

http://qdms.intel.com/

June 2009

RoHS

Click Search MDDS Database and search

 

 

for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

 

 

 

August 2009

ACS-2- Specification

http://www.t13.org/

 

 

 

 

IEC 55024 Information Technology Equipment —

 

August 2010

Immunity characteristics— Limits and methods of

http://www.iec.ch/

 

measurement CISPR24:2010

 

Sept 2010

Solid-State Drive (SSD) Requirements and

http://www.jedec.org/standards-

Endurance Test Method (JESD218)

documents/docs/jesd218/

 

Oct 2010

TPR053v11_SATA31_M.2_Card_Format_for_SSDs

http://www.sata-io.org/

 

 

 

September 2013

Product Specification

Order Number: 329213-002US

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Intel® Solid-State Drive 530 Series (M.2)

2 Product Specifications

2.1Capacity

Table 3: User Addressable Sectors

Intel® SSD 530 Series

Unformatted Capacity (Total User Addressable Sectors in LBA mode)

 

 

80 GB

156,301,488

120 GB

234,441,648

180 GB

351,651,888

360 GB

703,282,608

2.2Performance

Table 4: Compressible Performance

Specification

Unit

 

Intel® SSD 530 Series

 

 

 

 

 

 

 

 

 

 

 

80 GB

120 GB

180 GB

360 GB

 

 

 

 

 

 

 

Random 4

KB Read (up to)1

IOPS

24,000

24,000

41,000

41,000

Random 4

KB Write (up to)2

IOPS

80,000

80,000

80,000

37,000

Random 4

KB Write (TYP) 1

IOPS

33,000

37,500

49,000

29,500

Sequential 128 KB Read

MB/s

540

540

540

540

(SATA 6 Gb/s) 1

 

 

 

 

 

Sequential 128 KB Write

MB/s

480

480

490

490

(SATA 6 Gb/s) 1

 

 

 

 

 

Note:

1.Performance measured using Iometer* with Queue Depth 32. Measurements are performed on 8 GB of Logical Block Address (LBA) range on a full SSD

2.Random 4 KB writes measured using out-of-box SSD.

Table 5: Incompressible Performance

Specification

Unit

 

Intel® SSD 530 Series

 

 

 

 

 

 

 

 

 

 

 

80 GB

120 GB

180 GB

 

360 GB

 

 

 

 

 

 

 

Random 4 KB Read (up to)1

IOPS

20,500

18,000

37,500

 

37,500

Random 4 KB Write (up to) 1

IOPS

9,200

15,000

17,000

 

10,000

Sequential 128 KB Read

MB/s

430

450

470

 

525

(SATA 6 Gb/s) 1

 

 

 

 

 

 

 

Sequential 128 KB Write

MB/s

100

130

170

 

240

(SATA 6 Gb/s) 1

 

 

 

 

 

 

 

Note:

 

 

 

 

 

 

Product Specification

 

 

 

 

September 2013

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Order Number: 329213-002US

Intel® Solid-State Drive 530 Series (M.2)

1.Performance measured using Iometer* with Queue Depth 32

Table 6: Latency

Specification

 

Intel® SSD 530 Series

 

 

 

 

 

 

 

 

80 GB

120 GB

 

180 GB

360 GB

 

 

 

 

 

 

Read1

 

 

80 µs (TYP)

 

Write1

 

 

85 µs (TYP)

 

Power On To Ready2

 

 

1 s (TYP)

 

Note:

1.Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compressible (non-random) data pattern. Write Cache enabled.

2.Power On To Ready time assumes proper shutdown

2.3Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

Electrical Characteristics

 

 

Value

 

 

80 GB

120 GB

 

180 GB

360 GB

 

 

 

 

 

 

Operating Voltage for 3.3 V (±5%)

 

 

 

 

 

Min

 

 

3.14 V

 

Max

 

 

3.47 V

 

Rise Time (Max/Min)

 

100 ms / 0.1 ms

 

Fall Time (Max/Min)

 

 

5 s / 1 ms

 

Noise Tolerance

 

50 mV pp (10 Hz – 30 MHz)

 

Min Off Time1

 

 

1 s

 

Power Consumption (TYP)

 

 

 

 

 

Active2

 

 

140 mW

 

Idle3

 

 

55 mW

 

DevSleep4

 

 

200 µW

 

Thermal Power5

2.7 W

3.1 W

 

3.8 W

4.5 W

Regulator Power6

3 W

3.4 W

 

4.1 W

5.5 W

Note:

 

 

 

 

 

1.Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2.Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4.Power consumption during DevSleep state.

5.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 100 ms sample period. This represents power that would be thermal load on system during heavy workloads.

6.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 500 µs sample period. This represents power that system power supply would have to regulate for proper device operation.

September 2013

Product Specification

Order Number: 329213-002US

9

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