re-write, Error Handling chapter re-write, several changes made to better
reflect final design
October 2004 1.0 First non-NDA release; Updated IRQ routing diagrams, Updated mBMC
Sensor tables, Updates to Regulatory Information, Updated Sensor data
tables
Modifications
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Intel® Server Board SE7520JR2 Disclaimers
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for
use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and
product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not finalize a
design with this information. Revised information will be published when the product is available. Verify
with your local sales office that you have the latest datasheet before finalizing a design.
The Intel® Server Board SE7520JR2 may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
This document and the software described in it are furnished under license and may only be used or
copied in accordance with the terms of the license. The information in this manual is furnished for
informational use only, is subject to change without notice, and should not be construed as a commitment
by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies
that may appear in this document or any software that may be provided in association with this document.
Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval
system, or transmitted in any form or by any means without the express written consent of Intel
Corporation.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended
thermal requirements of these components when the fully integrated system is used together. It is the
responsibility of the system integrator that chooses not to use Intel developed server building blocks to
consult vendor datasheets and operating parameters to determine the amount of air flow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of their published
operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
This Technical Product Specification (TPS) provides detail to the architecture and feature set of
the Intel
®
Server Board SE7520JR2.
The target audience for this document is anyone wishing to obtain more in depth detail of the
server board than what is generally made available in the board’s Users Guide. It is a technical
document meant to assist people with understanding and learning more about the specific
features of the board.
This is one of several technical documents available for this server board. All of the functional
sub-systems that make up the board are described in this document. However, some low-level
detail of specific sub-systems is not included. Design level information for specific sub-systems
can be obtained by ordering the External Product Specification (EPS) for a given sub-system.
The EPS documents available for this server board include the following:
®
• Intel
• Intel
• mini Baseboard Management Controller (mBMC) Core EPS for IPMI-based Systems
• Sahalee Core BMC EPS for IPMI v1.5
Server Board SE7520JR2 BIOS EPS
®
Server Board SE7520JR2 Baseboard Management Controller EPS
These documents are not publicly available and must be ordered by your local Intel
representative.
1.1 Chapter Outline
This document is divided into the following chapters
• Chapter 1 – Introduction
• Chapter 2 – Product Overview
• Chapter 3 – Board Architecture
• Chapter 4 – System BIOS
• Chapter 5 – Platform Management Architecture
• Chapter 6 – Error Reporting and Handling
• Chapter 7 – Connector Pin-out and Jumper Blocks
• Chapter 8 – Environmental Specifications
• Chapter 9 – Miscellaneous Board Information
• Appendix A – Integration and Usage Tips
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Introduction Intel® Server Board SE7520JR2
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
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Intel® Server Board SE7520JR2 Server Board Overview
2. Server Board Overview
The Intel® Server Board SE7520JR2 is a monolithic printed circuit board with features that were
designed to support the high density 1U and 2U server markets.
2.1 Server Board SE7520JR2 SKU Availability
In this document, the name SE7520JR2 is used to describe the family of boards that are made
available under a common product name. The core features for each board will be common;
however each board will have the following distinctions:
SE7520JR2ATAD2 Onboard SATA (RAID) + DDR2 – 400 MHz
SE7520JR2ATAD1 Onboard SATA (RAID) + DDR – 266/333 MHz
Throughout this document, all references to the Server Board SE7520JR2 will refer to all four
board SKUs unless specifically noted otherwise. The board you select to use, may or may not
have all the features described based on the listed board differences.
2.2 Server Board SE7520JR2 Feature Set
• Dual processor slots supporting 800MHz Front Side Bus (FSB) Intel
• Intel E7520 Chipset (MCH, PXH, ICH5-R)
• Two PCI riser slots
o Riser Slot 1: Supports low profile PCI-X 66/100MHz PCI-X cards
o Riser Slot 2: Using Intel® adaptive slot technology and different riser cards, this
slot is capable of supporting full height PCI-X 66/100/133 or PCI-Express cards.
• Six DIMM slots supporting DDR2 – 400MHz DIMMs or DDR – 266/333 MHz
• Dual channel LSI* 53C1030 Ultra320 SCSI Controller with integrated RAID 0/1 support
(SCSI SKU only)
• Dual Intel
• On board ATI* Rage XL video controller with 8MB SDRAM
• On-board platform instrumentation using a National* PC87431M mini-BMC
• External IO connectors
1
The use of DDR2 - 400 MHz or DDR - 266/333 MHz DIMMs is dependant on which board SKU is used. DDR-2
DIMMs cannot be used on a board designed to support DDR. DDR DIMMs cannot be used on boards designed to
support DDR-2.
Server Board Overview Intel® Server Board SE7520JR2
o RJ45 Serial B Port
o Two RJ45 NIC connectors
o 15-pin video connector
o Two USB 2.0 ports
o U320 High density SCSI connector (Channel B) (SCSI SKU only)
• Internal IO Connectors / Headers
o Two onboard USB port headers. Each header is capable of supporting two USB
2.0 ports.
o One 10-pin DH10 Serial A Header
o One Ultra320 68-pin SCSI Connector (Channel A) (SCSI SKU only)
o Two SATA connectors with integrated chipset RAID 0/1 support
o One ATA100 connector
o One floppy connector
o SSI-compliant (34-pin) and custom control panel headers (50-pin and 100-pin)
o SSI-compliant 24-pin main power connector. This supports ATX-12V standard in
the first 20 pins
o Intel® Management Module (IMM) connector supporting both Professonal Edition
and Advanced Edition management modules
• Intel
• Port-80 Diagnostic LEDs displaying POST codes
®
Light-Guided Diagnostics on all FRU devices (processors, memory, power)
The following figure shows the board layout of the Server Board SE7520JR2. Each connector
and major component is identified by number and is identified in Table 1.
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Intel® Server Board SE7520JR2 Server Board Overview
1
11
29
19
24
16
20
30
2
21
28
3
12
17
31
25
13
14
4
22
5
26
18
9 8 7
6
15
23
27
10
38
34
36
40
39
35
32
33
37
Figure 1. SE7520JR2 Board Layout
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Server Board Overview Intel® Server Board SE7520JR2
Table 1: Baseboard Layout Reference
Ref # Description Ref # Description
(J1A1) 2-Pin Chassis Intrusion Header
1
2 10-Pin DH10 Serial A Header 23 CPU #1 Fan Header
3 Ext SCSI Channel B Connector 24 5-pin Power Sense Header
16 68-pin SCSI Channel A Connector 37 24-Pin Main Power Connector
17 LSI 53C1030 SCSI Controller 38 SSI System Fan Header
18 MCH – Chipset Component 39 SR1400/SR2400 System Fan Header
19 1x10 USB Header 40 Processor Voltage Regulator Circuitry
20 2x5 USB Header
21 ATI RageXL Video Controller
(J1A2) 2-Pin Hard Drive Act LED Header
(J1A4) Rolling BIOS Jumper
22 CPU #2 Fan Header
(J1H2) Recovery Boot Jumper
(J1H3) Password Clear Jumper
(J1H4) CMOS Clear Jumper
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Intel® Server Board SE7520JR2 Server Board Overview
The following mechanical drawing shows the physical dimensions of the baseboard.
Figure 2. Server Board Dimensions
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Functional Architecture Intel® Server Board SE7520JR2
3. Functional Architecture
This chapter provides a high-level description of the functionality associated with the
architectural blocks that make up the Intel Server Board SE7520JR2.
Note: This document describes the features and functionality of the Server Board SE7520JR2
when using standard on-board platform instrumentation. Some functionality and feature
descriptions change when using either the Professional Edition or Advanced Edition Intel
Management Modules. Functional changes when either of these two options are used are
described in a separate document.
Figure 3. Server Board SE7520JR2 Block Diagram
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Intel® Server Board SE7520JR2 Functional Architecture
3.1 Processor Sub-system
The support circuitry for the processor sub-system consists of the following:
• Dual 604-pin zero insertion force (ZIF) processor sockets
• Processor host bus AGTL+ support circuitry
• Reset configuration logic
• Processor module presence detection logic
• BSEL detection capabilities
• CPU signal level translation
• Common Enabling Kit (CEK) CPU retention support
3.1.1 Processor Voltage Regulators
The baseboard has two VRDs (Voltage Regulator Devices) providing the appropriate voltages
to the installed processors. Each VRD is compliant with the VRD 10.1 specification and is
designed to support Intel
AMPs and peak support of 120A.
The baseboard supports the current requirements and processor speed requirements defined in
the Flexible Mother Board (FMB) specification for all 800 MHz FSB Intel Xeon processors. FMB
is an estimation of the maximum values the 800 MHz FSB versions of the Intel Xeon processors
will have over their lifetime. The value is only an estimate and actual specifications for future
processors may differ. At present, the current demand per FMB is a sustained maximum of a
105 Amps and peak support of 120 Amps.
®
Xeon™ processors that require up to a sustained maximum of 105
3.1.2 Reset Configuration Logic
The BIOS determines the processor stepping, cache size, etc through the CPUID instruction. All
processors in the system must operate at the same frequency; have the same cache sizes; and
same VID. No mixing of product families is supported. Processors run at a fixed speed and
cannot be programmed to operate at a lower or higher speed.
3.1.3 Processor Module Presence Detection
Logic is provided on the baseboard to detect the presence and identity of installed processors.
In dual-processor configurations, the on-board mini Baseboard Management Controller (mBMC)
must read the processor voltage identification (VID) bits for each processor before turning on
the VRD. If the VIDs of the two processors are not identical, then the mBMC will not turn on the
VRD. Prior to enabling the embedded VRD, circuitry on the baseboard ensures that the
following criteria are met:
• In a uni-processor configuration, CPU 1 is installed
• Only supported processors are installed in the system to prevent damage to the MCH
• In dual processor configurations, both processors support the same FSB frequency
3.1.4 GTL2006
The GTL2006 is a 13-bit translator designed for 3.3V to GTL/GTL+ translations to the system
bus. The translator incorporates all the level shifting and logic functions required to interface
between the processor subsystem and the rest of the system.
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Functional Architecture Intel® Server Board SE7520JR2
g
3.1.5 Common Enabling Kit (CEK) Design Support
The baseboard has been designed to comply with Intel’s Common Enabling Kit (CEK)
processor mounting and heat sink retention solution. The baseboard will ship with a CEK spring
snapped onto the bottom side of the board beneath each processor socket. The CEK spring is
removable, allowing for the use of non-Intel heat sink retention solutions.
Heatsink assembly with
inte
rated hardware
Thermal Interface
Material (TIM)
Baseboard
CEK Spring
Chassis
Figure 4. CEK Processor Mounting
3.1.6 Processor Support
The Server Board SE7520JR2 is designed to support one or two Intel® Xeon™ processors
utilizing an 800 MHz front side bus with frequencies starting at 2.8 GHz. Previous generations of
Intel Xeon processor are not supported on the Server Board SE7520JR2.
The server board is designed to provide up to 120A peak per processors. Processors with
higher current requirements are not supported.
Note: Only Intel
the Server Board SE7520JR2. See the following table for a list of supported processors and
their operating frequencies.
®
Xeon™ processors that support an 800MHz Front Side Bus are supported on
Table 2: Processor Support Matrix
Processor Family FSB Frequency Frequency Support
Intel® Xeon™ 533 MHz 2.8 GHz No
Intel® Xeon™ 533 MHz 3.06 GHz No
Intel® Xeon™ 533 MHz 3.2 GHz No
Intel® Xeon™ 800 MHz 2.8 GHz Yes
Intel® Xeon™ 800 MHz 3.0 GHz Yes
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Processor Family FSB Frequency Frequency Support
Intel® Xeon™ 800 MHz 3.2 GHz Yes
Intel® Xeon™ 800 MHz 3.4 GHz Yes
Intel® Xeon™ 800 MHz 3.6 GHz Yes
3.1.6.1 Processor Mis-population Detection
The processors must be populated in the correct order for the processor front-side bus to be
correctly terminated. CPU socket 1 must be populated before CPU socket 2. Baseboard logic
will prevent the system from powering up if a single processor is present but it is not in the
correct socket. This protects the logic against voltage swings or unreliable operation that could
occur on an incorrectly terminated front-side bus.
If processor mis-population is detected when using standard on-board platform instrumentation,
the mBMC will log an error against processor 1 to the System Event Log; Configuration Error,
and the baseboard hardware will illuminate both processor error LEDs. If an IMM (Professional
or Advanced editions) is used in systems, the Sahalee BMC will generate a series of beep
codes when this condition is detected and the BMC will illuminate the processor 1 fault LED.
3.1.6.2 Mixed Processor Steppings
For optimum system performance, only identical processors should be installed in a system.
Processor steppings within a common processor family can be mixed in a system provided that
there is no more than a 1 stepping difference between them. If the installed processors are
more than 1 stepping apart, an error is reported. Acceptable mixed steppings are not reported
as errors by the BIOS.
3.1.6.3 Mixed Processor Models
Processor models cannot be mixed in a system. If this condition is detected an error (8196) is
logged in the SEL. An example of a faulty processor configuration may be when one installed
processor supports a 533MHz front side bus while the other supports an 800MHz front side bus.
3.1.6.4 Mixed Processor Families
Processor families cannot be mixed in a system. If this condition is detected an error (8194) is
logged in the SEL.
3.1.6.5 Mixed Processor Cache Sizes
If the installed processors have mixed cache sizes, an error (8192) will be logged in the SEL
and an error (196) is reported to the Management Module. The size of all cache levels must
match between all installed processors. Mixed cache processors are not supported.
3.1.6.6 Jumperless Processor Speed Settings
The Intel
®
XeonTM processor does not utilize jumpers or switches to set the processor
frequency. The BIOS reads the highest ratio register from all processors in the system. If all
processors are the same speed, the Actual Ratio register is programmed with the value read
from the High Ratio register. If all processors do not match, the highest common value between
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Functional Architecture Intel® Server Board SE7520JR2
High and Low Ratio is determined and programmed to all processors. If there is no value that
works for all installed processors, all processors not capable of speeds supported by the BSP
are disabled and an error is displayed.
3.1.6.7 Microcode
IA-32 processors have the capability of correcting specific errata through the loading of an Intelsupplied data block (i.e., microcode update). The BIOS is responsible for storing the update in
non-volatile memory and loading it into each processor during POST. The BIOS allows a
number of microcode updates to be stored in the flash, limited by the amount of free space
available. The BIOS supports variable size microcode updates. The BIOS verifies the
signature prior to storing the update in the flash.
3.1.6.8 Processor Cache
The BIOS enables all levels of processor cache as early as possible during POST. There are no
user options to modify the cache configuration, size or policies. The largest and highest level
cache detected is reported in BIOS Setup.
3.1.6.9 Hyper-Threading Technology
Intel® Xeon
TM
processors support Hyper-Threading Technology. The BIOS detects processors
that support this feature and enables the feature during POST. BIOS Setup provides an option
to selectively enable or disable this feature. The default behavior is “Enabled”.
The BIOS creates additional entries in the ACPI MP tables to describe the virtual processors.
The SMBIOS Type 4 structure shows only the physical processors installed. It does not
describe the virtual processors because some operating systems are not able to efficiently
utilize the Hyper-Threading Technology.
3.1.6.10 Intel® SpeedStep® Technology
Intel® Xeon™ processors support the Geyserville3 (GV3) (whether Geyserville3 is an Intel
internal code name?) feature of the Intel® SpeedStep® Technology. This feature changes the
processor operating ratio and voltage similar to the Thermal Monitor 2 (TM2) feature. It must be
used in conjunction with the TM1 or TM2 feature. The BIOS implements the GV3 feature in
conjunction with the TM2 feature.
3.1.6.11 EM64T Technology Support
The system BIOS on the Server Board SE7520JR2 supports the Intel Extended Memory 64
technology (EM64T) of the Intel® Xeon™ Processors. There is no BIOS setup option to enable
or disable this support. The system will be in IA-32 compatibility mode when booting to an OS.
To utilize this feature, a 64-bit capable OS and OS specific drivers are needed.
3.1.7 Multiple Processor Initialization
IA-32 processors have a microcode-based bootstrap processor (BSP) arbitration protocol. On
reset, all of the processors compete to become the BSP. If a serious error is detected during its
Built-in Self-Test (BIST), that processor does not participate in the initialization protocol. A
single processor that successfully passes BIST is automatically selected by the hardware as the
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