Intel SE400BX User Manual

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SE440BX

Motherboard

Product Guide

Order Number: 697967-001

Revision History

Revision

Revision History

Date

 

 

 

-001

First release of the SE440BX Motherboard Product Guide.

February, 1998

 

 

 

If an FCC declaration of conformity marking is present on the board, the following statement applies:

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation

5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

·Reorient or relocate the receiving antenna.

·Increase the separation between the equipment and the receiver.

·Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.

·Consult the dealer or an experienced radio/TV technician for help.

Canadian Department of Communications Compliance Statement:

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Disclaimer

Intel Corporation (Intel) makes no warranty of any kind with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. Intel assumes no responsibility for any errors that may appear in this document. Intel makes no commitment to update nor to keep current the information contained in this document. No part of this document may be copied or reproduced in any form or by any means without prior written consent of Intel.

An Intel product, when used in accordance with its associated documentation, is "Year 2000 Capable" when, upon installation, it accurately stores, displays, processes, provides, and/or receives date data from, into, and between the twentieth and twenty-first centuries, including leap year calculations, provided that all other technology used in combination with said product properly exchanges date data with it.

Third-party brands and trademarks are the property of their respective owners.

†† Wake on LAN is a trademark of IBM Corporation.

Copyright ã 1998, Intel Corporation.

Contents

1

Motherboard Features

 

 

Features Summary...............................................................................................................

7

 

Components.........................................................................................................................

8

 

Back Panel I/O Connectors ..................................................................................................

9

 

Microprocessor....................................................................................................................

10

 

Microprocessor Upgrades ...................................................................................................

10

 

Main Memory ......................................................................................................................

10

 

Second Level Cache Memory .............................................................................................

10

 

PCI Enhanced IDE Interface ...............................................................................................

10

 

Input/Output (I/O) Controller................................................................................................

11

 

Real-Time Clock..................................................................................................................

11

 

Universal Serial Bus (USB) Support ....................................................................................

11

 

A.G.P. .................................................................................................................................

12

 

BIOS ...................................................................................................................................

12

 

BIOS Upgrades ..........................................................................................................

12

 

PCI Auto Configuration ...............................................................................................

12

 

IDE Auto Configuration ...............................................................................................

13

 

ISA Plug and Play Capability ......................................................................................

13

 

Security Passwords ....................................................................................................

13

 

Expansion Slots...................................................................................................................

13

 

Power Management ............................................................................................................

14

 

Advanced Power Management (APM)........................................................................

14

 

Advanced Configuration and Power Interface (ACPI) .................................................

14

 

Battery.................................................................................................................................

14

 

Wake on Ring......................................................................................................................

15

 

Wake on LAN Technology (Optional) ..................................................................................

15

 

Hardware Monitor (Optional) ...............................................................................................

15

 

Audio Subsystem (Optional)................................................................................................

15

 

Crystal Semiconductor CS4236B Audio Codec ..........................................................

16

 

Crystal Semiconductor CS4611 PCI Audio Accelerator ..............................................

16

 

Audio Connectors .......................................................................................................

16

 

Speaker (Optional) ..............................................................................................................

16

2

Installing and Replacing Motherboard Components

 

 

Before You Begin ................................................................................................................

17

 

How to Install and Remove the Motherboard.......................................................................

18

 

How to Install a Processor...................................................................................................

18

 

Install the Retention Mechanism.................................................................................

19

 

Install the Processor ...................................................................................................

20

 

How to Set the Processor Speed ........................................................................................

21

 

How to Upgrade to a Boxed Pentium® II Processor.............................................................

23

 

Remove the Installed Processor .................................................................................

23

 

Remove the Heatsink Support Base ...........................................................................

25

 

Upgrade the Processor...............................................................................................

27

iii

Contents

 

How to Install Memory.........................................................................................................

27

 

How to Remove Memory.....................................................................................................

29

 

How to Replace the Battery.................................................................................................

30

 

How to Clear the Passwords ...............................................................................................

32

3 Using the Setup Program

 

 

Setup Program Modes ........................................................................................................

33

 

Setup Menus .......................................................................................................................

34

 

Function Keys .....................................................................................................................

34

 

Maintenance Menu..............................................................................................................

35

 

Main Menu ..........................................................................................................................

35

 

Advanced Menu ..................................................................................................................

36

 

Peripheral Configuration Submenu .............................................................................

37

 

IDE Configuration .......................................................................................................

38

 

IDE Configuration Submenus .....................................................................................

39

 

Floppy Options ...........................................................................................................

40

 

DMI Event Logging .....................................................................................................

40

 

Video Configuration Submenu ....................................................................................

40

 

Resource Configuration Submenu ..............................................................................

41

 

Security Menu .....................................................................................................................

41

 

Power Menu ........................................................................................................................

42

 

Boot Menu...........................................................................................................................

42

 

Hard Drive Submenu ..................................................................................................

43

 

Removable Devices Submenu....................................................................................

44

 

Exit Menu ............................................................................................................................

44

4

Upgrading the BIOS

 

 

Preparing for the Upgrade ...................................................................................................

45

 

Obtaining the BIOS Upgrade File ...............................................................................

45

 

Recording the Current BIOS Settings .........................................................................

45

 

Creating a Bootable Diskette ......................................................................................

46

 

Creating the BIOS Upgrade Diskette ..........................................................................

46

 

Upgrading the BIOS ............................................................................................................

46

 

Recovering the BIOS...........................................................................................................

47

 

Changing the BIOS Language.............................................................................................

48

5

Technical Reference

 

 

Motherboard Connectors.....................................................................................................

49

 

Front Panel Connectors ......................................................................................................

53

 

Motherboard Resources......................................................................................................

54

 

Memory Map ..............................................................................................................

54

 

DMA Channels ...........................................................................................................

54

 

I/O Map .....................................................................................................................

55

 

PCI Configuration Space Map ....................................................................................

56

 

Interrupts ....................................................................................................................

56

iv

SE440BX Motherboard Product Guide

A

Error Messages

 

 

BIOS Beep Codes ...............................................................................................................

57

 

BIOS Error Messages .........................................................................................................

57

B

Regulatory and Integration Information

 

 

Regulatory Compliance .......................................................................................................

59

 

 

Product Certification Markings ....................................................................................

60

 

Installation Precautions .......................................................................................................

60

 

Installation Instructions........................................................................................................

60

 

 

Ensure Electromagnetic Compatibility (EMC) .............................................................

61

 

 

Ensure Host Computer and Accessory Module Certifications .....................................

61

 

 

Prevent Power Supply Overload.................................................................................

62

 

 

Place Battery Marking on the Computer .....................................................................

62

 

 

Use Only for Intended Applications.............................................................................

62

Figures

 

 

1.

Motherboard Components ...........................................................................................

8

 

2.

Back Panel I/O Connectors .........................................................................................

9

 

3.

Mounting Screw Holes................................................................................................

18

 

4.

Installing the Processor Retention Mechanism ...........................................................

19

 

5.

Installing the Processor ..............................................................................................

20

 

6.

Installing the Heatsink Support Top Bar......................................................................

21

 

7.

Location of the Configuration Jumper Block ...............................................................

21

 

8.

Removing the Heatsink Support Top Bar and the Processor......................................

24

 

9.

Removing the Heatsink Support Retention Pins .........................................................

25

 

10.

Placing the Heatsink Support Base Removal Tool on the Retention Pins...................

26

 

11.

Using the Heatsink Support Base Removal Tool ........................................................

26

 

12.

Location of DIMM Sockets..........................................................................................

28

 

13.

Installing a DIMM........................................................................................................

29

 

14.

Replacing the Battery .................................................................................................

31

 

15.

Motherboard Connectors ............................................................................................

49

 

16.

Front Panel Connectors..............................................................................................

53

Tables

 

 

 

1.

Jumper Settings for Setup Program Modes ................................................................

33

 

2.

Setup Menu Bar .........................................................................................................

34

 

3.

Setup Function Keys ..................................................................................................

34

 

4.

Maintenance Menu .....................................................................................................

35

 

5.

Main Menu..................................................................................................................

35

 

6.

Advanced Menu..........................................................................................................

36

 

7.

Peripheral Configuration Submenu.............................................................................

37

 

8.

IDE Configuration .......................................................................................................

38

 

9.

IDE Configuration Submenus .....................................................................................

39

 

10.

Floppy Options ...........................................................................................................

40

 

11.

DMI Event Logging Submenu.....................................................................................

40

 

12.

Video Configuration Submenu ....................................................................................

40

 

13.

Resource Configuration Submenu..............................................................................

41

v

Contents

14.

Security Menu ............................................................................................................

41

15.

Power Menu ...............................................................................................................

42

16.

Boot Menu ..................................................................................................................

42

17.

Hard Drive Submenu ..................................................................................................

43

18.

Removable Devices Submenu....................................................................................

44

19.

Exit Menu ...................................................................................................................

44

20.

Wake on Ring Connector............................................................................................

50

21.

Wake on LAN Technology Connector.........................................................................

50

22.

Fan 3 Connector.........................................................................................................

50

23.

Auxiliary Line In Connector.........................................................................................

50

24.

Telephony Connector .................................................................................................

50

25.

CD Audio Connector...................................................................................................

51

26.

Chassis Intrusion Connector.......................................................................................

51

27.

Fan 2 Connector.........................................................................................................

51

28.

Fan 1 Connector.........................................................................................................

51

29.

Power Supply Connector ............................................................................................

52

30.

SCSI LED Connector..................................................................................................

52

31.

PC/PCI Connector ......................................................................................................

52

32.

Front Panel I/O Connectors ........................................................................................

53

33.

Memory Map ..............................................................................................................

54

34.

DMA Channels ...........................................................................................................

54

35.

I/O Map ......................................................................................................................

55

36.

PCI Configuration Space Map ....................................................................................

56

37.

Interrupts ....................................................................................................................

56

38.

Beep Codes................................................................................................................

57

39.

BIOS Error Messages.................................................................................................

57

40.

Safety Regulations .....................................................................................................

59

41.

EMC Regulations........................................................................................................

59

vi

1 Motherboard Features

This chapter gives an overview of the SE440BX motherboard, including:

·Features

·Components

·Back panel I/O connectors

The remaining chapters explain how to:

·Add or upgrade components like processors or memory

·Use the BIOS Setup program to modify the motherboard’s configuration

·Upgrade the BIOS

Features Summary

·ATX form factor of 12 x 7.75 inches with seven mounting screw holes

·Support for a single Pentiumâ II processor

¾66 MHz and 100 MHz host bus speeds

¾Slot 1 connector

¾Integrated 512 KB second-level cache

·Three DIMM sockets

¾Supports up to 384 MB of synchronous DRAM (SDRAM) memory

·Intel 82440BX AGPset

¾PCI/A.G.P. controller (PAC)

¾PCI ISA IDE Xcelerator (PIIX4E)

·I/O controller

·Two USB ports

·Intel/Phoenix Basic Input/Output System (BIOS)

·Single-jumper configuration

·Onboard Accelerated Graphics Port (A.G.P.) connector

Software drivers and utilities are available from Intel.

NOTE

For information about Intel motherboards, including technical product specifications, BIOS upgrades, and device drivers, see “Products” at the Intel World Wide Web site:

http://developer.intel.com/

7

Motherboard Features

Components

Figure 1 shows the major components on the motherboard.

A

B

C E

F

G

H

 

 

 

 

D

 

 

 

 

 

X

 

 

 

 

 

 

I

 

 

 

 

 

 

 

W

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K

V

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

U

S

R

 

Q

P O

N

M

 

 

 

 

 

 

 

OM07065

A

Wake on Ring connector

M

Power supply connector

B

Wake on LAN††technology connector (optional)

N

Diskette drive connector

C

Fan 3 connector

O

SCSI LED connector

D

Telephony connector (optional)

P

IDE connectors

E

CD-ROM audio connector (optional)

Q

Front panel connectors

F

Auxiliary Line In connector (optional)

R

Accelerated Graphics Port (A.G.P.) connector

G

Chassis intrusion connector (optional)

S

PC/PCI connector

H

Back panel connectors

T

Battery

I

Slot 1 connector

U

Configuration jumper block

J

Fan 2 connector

V

Speaker (optional)

K

DIMM sockets

W

PCI slots

L

Fan 1 connector

X

ISA slots

 

 

 

 

Figure 1. Motherboard Components

NOTE

Components labeled optional do not come on all SE440BX motherboards.

8

SE440BX Motherboard Product Guide

Back Panel I/O Connectors

Figure 2 shows the back panel I/O connectors on the motherboard.

A

C

 

F

 

H

 

 

 

 

 

 

 

B

D

E

G

I

J

K

 

 

 

 

 

 

OM06985

A

PS/2keyboard or mouse

G

Serial Port B

B

PS/2 keyboard or mouse

H

MIDI/game Port (optional)

C

USB Port 1

I

Audio Line Out (optional)

D

USB Port 0

J

Audio Line In (optional)

E

Serial Port A

K

Audio Mic In (optional)

F

Parallel Port

 

 

 

 

 

 

Figure 2. Back Panel I/O Connectors

9

Motherboard Features

Microprocessor

The motherboard supports a single Pentium II processor operating at any of the Pentium II processor speeds, voltages, and bus frequencies. Processors are not included with the SE440BX motherboard and must be purchased separately.

The processor is packaged in a Single Edge Contact (S.E.C.) cartridge. The cartridge includes the processor core, second-level cache subsystem, thermal plate, and back cover.

The processor connects to the motherboard through the Slot 1 connector, a 242-pin edge connector. When mounted in Slot 1, the processor is secured by a retention mechanism attached to the motherboard. A passive heatsink is stabilized by the heatsink support.

Microprocessor Upgrades

The motherboard can be upgraded with Pentium II processors that run at higher speeds. To upgrade the processor, use the BIOS configuration mode to change the processor speed, see Chapter 2.

Main Memory

The motherboard has three sockets for installing dual inline memory modules (DIMMs). Minimum memory size is 8 MB; maximum memory size is 384 MB. To install memory, see Chapter 2.

Second Level Cache Memory

The second-level cache is located in the S.E.C. cartridge. The cache includes synchronous pipelined burst static RAM (PBSRAM) and tag RAM. There are four PBSRAM components totaling 512 KB in size. All supported onboard memory is cacheable.

PCI Enhanced IDE Interface

The PCI enhanced IDE interface handles the exchange of information between the processor and peripheral devices like hard disks and add-in boards inside the computer. The interface supports:

Up to four IDE devices such as hard drives

ATAPI devices

PIO mode 3 and PIO mode 4 devices

Up to four PCI cards or up to two ISA cards and three PCI cards

Logical block addressing (LBA) of hard drives larger than 528 MB and extended cylinder head sector (ECHS) translation modes

Support for laser servo (LS-120) drives

10

SE440BX Motherboard Product Guide

Input/Output (I/O) Controller

The I/O controller handles the exchange of information between the processor and external devices like the mouse and keyboard or a printer that are connected to the computer. The controller features the following:

·Integrated keyboard and mouse controller

·Industry standard diskette drive controller

·One multimode bi-directional parallel port

¾Standard mode: Centronics-compatible operation

¾High speed mode: support for enhanced capabilities port (ECP) and enhanced parallel port (EPP)

·Two serial ports

·Flexible IRQ and DMA mapping for Windows95

Real-Time Clock

The motherboard has a time-of-day clock and 100-year calendar that will rollover to 2000 at the turn of the century. A battery on the motherboard keeps the clock current when the computer is turned off.

NOTE

The recommended method of accessing the date in systems with Intel motherboards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel motherboards and baseboards contains a century checking and maintenance feature that checks the least two significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For more information on proper date access in systems with Intel motherboards please see http://support.intel.com/support/year2000/paper.htm

Universal Serial Bus (USB) Support

The motherboard has two USB ports. You can connect two USB peripheral devices directly to the computer without an external hub. To attach more than two devices, connect an external hub to either of the built-in ports. The motherboard supports the standard universal host controller interface (UHCI) and takes advantage of standard software drivers written to be compatible with UHCI. The USB features the following:

·Support for hot swapping Plug and Play devices

·Support for self-identifying peripherals

11

Motherboard Features

Support for up to 127 physical devices

Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other applications

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC

Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use a shielded cable that meets the requirements for a high-speed USB device.

A.G.P.

The A.G.P. is a high-performance interconnect for graphics-intensive applications, such as 3D graphics. A.G.P. is independent of the PCI bus and is intended for exclusive use with graphical display devices. A.G.P. provides these features:

Pipelined memory read and write operations that hide memory access latency

Demultiplexing of address and data on the bus for near 100 percent bus efficiency

AC timing for 133 MHz data transfer rates, allowing real data throughput in excess of 500 MB/sec

BIOS

The motherboard’s system BIOS is contained in a flash memory device on the motherboard. The BIOS provides the power-on self test (POST), the BIOS Setup program, and the PCI and IDE autoconfiguration utilities.

The BIOS is always shadowed. Shadowing allows BIOS routines to be executed from fast 64-bit onboard DRAM instead of from the slower 8-bit flash memory device.

BIOS Upgrades

Because the BIOS is stored in a flash memory device, you can upgrade the BIOS by using a software utility on a diskette or hard disk, or over a network. For information on upgrading the BIOS, see Chapter 4.

PCI Auto Configuration

If you install a PCI add-in board in your computer, the PCI auto-configuration utility in the BIOS automatically detects and configures the resources (IRQs, DMA channels, and I/O space) for that add-in board. You do not need to run the BIOS Setup program after you install a PCI add-in board.

However, PCI add-in boards use the same IRQ resources as ISA add-in boards. If you install both a PCI and an ISA add-in board, you must specify the IRQ used by the ISA card. The PCI auto configuration program complies with version 2.1 of the PCI BIOS specification.

12

SE440BX Motherboard Product Guide

IDE Auto Configuration

If you install an IDE device (e.g., a hard drive) in your computer, the IDE auto-configuration utility in the BIOS automatically detects and configures the device for your computer. You do not need to run the BIOS Setup program after installing an IDE device.

ISA Plug and Play Capability

The motherboard provides auto configuration of Plug and Play ISA cards and resource management for legacy (non-Plug and Play) ISA cards when used with the ISA Configuration Utility (ICU) or a Plug and Play compatible operating system like Windows 95. To obtain the ICU, contact your computer supplier.

Security Passwords

The BIOS includes security features that restrict whether the BIOS Setup program can be accessed and who can boot the computer. A supervisor password and a user password can be set for the Setup program and for booting the computer, with the following restrictions:

The supervisor password gives unrestricted access to view and change all the Setup options in the Setup program. This is supervisor mode.

The user password gives restricted access to view and change Setup options in the Setup program. This is user mode.

If only the supervisor password is set, pressing the <Enter> key at the password prompt of the Setup program gives the user restricted access to Setup.

If both the supervisor and user passwords are set, you must enter either the supervisor password or the user password to access Setup.

Setting a user password restricts who can boot the computer. The password prompt is displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, you can enter either password to boot the computer.

Expansion Slots

The motherboard has five expansion slots for installing add-in boards, like network cards, that expand the capabilities of your computer. The expansion slots are as follows:

One ISA slot

Three PCI slots

One shared PCI/ISA slot

13

Motherboard Features

Power Management

The motherboard supports two types of power management — Advanced Power Management (APM) and Advanced Configuration and Power Interface (ACPI).

Advanced Power Management (APM)

APM’s energy saving standby mode can be initiated in the following ways:

Specify a time-out period in Setup

Press the suspend/resume switch connected to the front panel sleep connector

Use an operating system option, such as the Suspend menu item in Windows 95

In standby mode, the motherboard can reduce power consumption by spinning down hard drives, and reducing power to or turning off VESADPMS-compliant monitors. Power-management mode can be enabled or disabled in Setup (see Chapter 3).

While in standby mode, the system retains the ability to respond to external interrupts and service requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the system out of standby mode and immediately restores power to the monitor.

The BIOS enables APM by default; but the operating system must support an APM driver for the power-management features to work. For example, Windows 95 supports the power-management features upon detecting that APM is enabled in the BIOS.

Advanced Configuration and Power Interface (ACPI)

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. ACPI requires an ACPI-aware operating system. ACPI features include:

Plug and Play (including bus and device enumeration) and APM functionality normally contained in the BIOS

Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video monitor, and hard disk drives

Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping state, and less than 5-watt system operation in the Suspend to Disk sleeping state

A Soft-off feature that enables the operating system to power off the computer

Support for multiple wake up events

Support for a front panel power and sleep mode switch

Battery

A battery on the motherboard keeps the clock and the values in CMOS RAM current when your computer is turned off. To replace the battery, see Chapter 2.

14

SE440BX Motherboard Product Guide

Wake on Ring

Wake on Ring enables the computer to wake from sleep or soft-off mode when a call is received on a telephony device, such as a modem, configured for operation on COM1. The first incoming call powers up the computer. A second call must be made to access the computer. To access this feature use the Wake on Ring connector. See Chapter 5 for the location and pinouts of the Wake on Ring connector.

Wake on LAN Technology (Optional)

Wake on LAN technology enables remote wakeup of the computer through a network. Wake on LAN technology requires a PCI add-in network interface card (NIC) with remote wakeup capabilities. The remote wakeup connector on the NIC must be connected to the onboard Wake on LAN technology connector. The NIC monitors network traffic at the MII interface; upon detecting a Magic Packet, the NIC asserts a wakeup signal that powers up the computer. To access this feature use the Wake on LAN technology connector. See Chapter 5 for the location and pinouts of the Wake on LAN technology connector.

CAUTION

For Wake on LAN, the 5-V standby line for the power supply must be capable of delivering +5 V

± 5 % at 720 mA. Failure to provide adequate standby current when implementing Wake on LAN, can damage the power supply.

Hardware Monitor (Optional)

The optional hardware monitor subsystem provides low-cost instrumentation capabilities. The features of the hardware monitor subsystem include:

Support for an optional chassis intrusion connector

An integrated ambient temperature sensor

Fan speed sensors that monitor the fan 1 and fan 2 connectors (see Figure 15 for the location of these connectors on the motherboard)

Power supply voltage monitoring to detect levels above or below acceptable values

When suggested ratings for temperature, fan speed, or voltage are exceeded, an interrupt is activated. The hardware monitor component connects to the system management (SM) bus.

Audio Subsystem (Optional)

The optional audio subsystem consists of the following:

Crystal Semiconductor CS4236B audio codec

Crystal Semiconductor CS4611 PCI audio accelerator

Back panel and onboard audio connectors

15

Motherboard Features

Crystal Semiconductor CS4236B Audio Codec

The CS4236B audio codec’s features include:

Compatibility with Sound Blaster, Sound Blaster Pro, and Windows Sound System

MPU-401 compatible MIDI and joystick interfaces

Advanced MPC3-compliant input and output mixer

Crystal Semiconductor CS4611 PCI Audio Accelerator

The CS4611’s PCI bus interface enables burst mode transfers of audio data between the system bus and the device’s internal DMA engine and stream processor. Other features include:

A RAM-based Digital Signal Processor optimized for digital audio processing

A bus mastering PCI bus interface that complies with PCI Local Bus Specification, Revision 2.1

Acceleration of DirectSound, DirectSound3D, DirectInput, and ActiveMovieAPIs

General MIDI Wavetable Synthesis with Reverb and Chorus

Audio Connectors

The audio connectors include the following:

Back panel connectors: stereo line-level output (Line Out), stereo line-level input (Line In), and Mic In

CD audio header (black)

Telephony (green)

Stereo Line In (natural/white)

See Chapter 5 for the location and pinouts of the audio connectors.

Speaker (Optional)

A piezoelectric speaker is mounted on the motherboard. The speaker provides audible error code (beep code) information during the POST.

The motherboard also has a front panel connector for an offboard speaker.

16

2Installing and Replacing Motherboard Components

This chapter describes the following:

How to install and remove the motherboard

How to install a processor

How to prepare the motherboard for a boxed Pentium II processor

How to install and remove memory

How to replace the battery

How to use the configuration jumper to set processor speed and clear passwords

Before You Begin

CAUTION

Before you install this motherboard in a chassis, see Appendix B for regulatory requirements and precautions.

Always follow the steps in each procedure in the correct order.

Set up a log to record information about your computer, such as model, serial numbers, installed options, and configuration information.

Use an antistatic wrist strap and a conductive foam pad when working on the motherboard.

WARNINGS

The procedures in this chapter assume familiarity with the general terminology associated with personal computers and with the safety practices and regulatory compliance required for using and modifying electronic equipment.

Disconnect the computer from its power source and from any telecommunications links, networks, or modems before performing any of the procedures described in this chapter. Failure to disconnect power, telecommunications links, networks, or modems before you open the computer or perform any procedures can result in personal injury or equipment damage. Some circuitry on the motherboard can continue to operate even though the front panel power button is off.

CAUTION

Electrostatic discharge (ESD) can damage components. Perform the procedures described in this chapter only at an ESD workstation. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

17

Installing and Replacing Motherboard Components

How to Install and Remove the Motherboard

Refer to your chassis manual for instructions on installing and removing the motherboard. The motherboard is secured to the chassis by seven screws. Figure 3 shows the locations of the mounting screw holes.

NOTES

You will need a Phillips (#2 bit) screwdriver.

Refer to Appendix B for regulatory requirements and installation instructions and precautions.

WARNING

This procedure should be done only by qualified technical personnel. Disconnect the computer from its power source before doing the procedures described here. Failure to disconnect the power before you open the computer can result in personal injury or equipment damage.

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Figure 3. Mounting Screw Holes

How to Install a Processor

To install a processor, in brief you must:

1.Install the retention mechanism.

2.Install the processor.

3.Set the processor speed.

Detailed instructions follow for each of these procedures.

NOTE

If you are installing a boxed Intel Pentium II processor, see the instructions on page 23.

18

SE440BX Motherboard Product Guide

Install the Retention Mechanism

To install the retention mechanism, follow these steps:

1.Observe the precautions in “Before You Begin” (see page 17).

2.Find the Slot 1 connector on the motherboard (see Figure 4).

C

A

B

D

 

 

 

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A

Retention bracket

C

Fastener retainer pins

B

Press-fit fasteners

D

Slot 1 connector

 

 

 

 

Figure 4. Installing the Processor Retention Mechanism

3.Orient the retention bracket so the tab of the Slot 1 connector matches the corresponding cutout in the retention bracket, then position the retention bracket on the motherboard.

4.Push each of the four fasteners through its mounting hole in the retention bracket, and then through the motherboard mounting hole until you feel it snap into place.

5.Push a fastener retainer pin into the through hole of fastener until it is fully seated against the top of the fastener. Repeat this step for each of the four fasteners.

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