Added memory cooling duct information, added section on BIOS event
March 2003 1.1
April 2004 1.2 New graphics for Mechanical Changes.
log, incorporated Technology Leadership terminology, and corrected
miscellaneous minor technical details.
Revision 1.2
ii
Intel part number C32194-002
Intel® Server Board SE7505VB2 Disclaimers
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The SE7505VB2 server system may contain design defects or errors known as errata that may
cause the product to deviate from published specifications. Current characterized errata are
available on request.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
The Intel® Server Board SE7505VB2 Technical Product Specification (TPS) provides technical
details for the server board’s functional architecture and feature set. It also provides a high-level
detail of some of the board’s functional sub-systems.
This document is intended to be the technical reference for this board. Updates to this
document will be made via the Specification Update published monthly from the date of product
launch. Please refer to the Intel Server Board SE7505VB2 support website for any updates to
this document: http://support.intel.com/support/motherboards/server/se7505vb2
.
Revision 1.2 Intel part number C32194-002
13
SE7505VB2 Server Board Overview Intel® Server Board SE7505VB2
2. SE7505VB2 Server Board Overview
The Intel® Server Board SE7505VB2 is a monolithic printed circuit board with features that were
designed to support the general purpose, pedestal server market and meet the needs of a high
end workstation system as well. The architecture is based around the Intel
is capable of supporting one or two Intel
®
Xeon™ processors with 512KB L2 cache and up to
8GB of memory.
2.1 Intel® Server Board SE7505VB2 Feature Set
The Intel Server Board SE7505VB2 supports the following feature set:
Processor/FSB support
- Dual Intel Xeon processors with 512KB L2 cache using the 604-pin FCPGA
processor package
- 533 MHz FSB or 400 MHz FSB support
- 4.2 GB/sec Bus Bandwidth
- One version 9.1 compliant VRD to supply CPU core voltage
Intel E7505 chipset components
- MCH memory controller
- P64H2 64-bit I/O Hub
- ICH4 I/O controller
- FWH Firmware Hub
Glue4-PAL
Support for up to four DDR266 compliant ECC DDR DIMMs providing up to 8 GB of
memory
Three separate and independent PCI buses:
- Segment A: Two PCI 32-bit/33-MHz, 5 V connectors supporting full length PCI add-in
cards and three embedded devices:
• 2D/3D graphics controller: ATI Rage XL video controller with 8 MB of SDRAM
• One Intel 10/100 82550PM Fast Ethernet Controller
• Dual port Serial ATA controller: Silicon Image 3112A
- Segment B: Two PCI-X 64-bit/100-MHz, 3.3 V slots supporting full length PCI / PCI-X
add-in cards
- Segment C: One PCI 64-bit/66-MHz, 3.3 V slot supporting full length PCI add-in
cards and one embedded component:
LPC (Low Pin Count) bus segment with two embedded devices:
- Super I/O (sIO) controller chip, Winbond* 83627HF, providing all PC-compatible I/O
(floppy, serial, keyboard, mouse, parallel) and integrated hardware monitoring
- Flash ROM device for system BIOS: Intel 8 megabit N82802AC Flash ROM
®
E7505 chipset and
Revision 1.2
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Intel part number C32194-002
Intel® Server Board SE7505VB2 SE7505VB2 Server Board Overview
Graphic AGP 3.0 Pro50 watt support
- Support 2X, 4X and 8X AGP protocol
- AGP Pro50 supported by additional power pins in 4X and 8X mode
- Support 1.5V signal levels only
- Maximum of 2.03 GB/sec Bus Bandwidth
Three external Universal Serial Bus (USB) ports with an additional internal header
providing one optional USB ports for front panel support.
Two IDE connectors, supporting up to four ATA-100 compatible devices
Support for up to four system fans and two processor fans
SSI-compliant connectors for SSI interface support: front panel and power connectors.
The following figure below shows the functional blocks of the server board and the plug-in
modules that it supports.
Revision 1.2 Intel part number C32194-002
Figure 1. The Board Block Diagram
15
Functional Architecture Intel® Server Board SE7505VB2
3. Functional Architecture
This chapter provides a high-level description of the functionality distributed between the
architectural blocks of the Intel
®
Server Board SE7505VB2.
3.1 Processor and Memory Subsystem
The Intel® chipset E7505 provides a 36-bit address, 64-bit data processor host bus interface,
operating at 533 MHz in the AGTL+ signaling environment. The MCH component of the chipset
provides an integrated memory controller, an 8-bit hub interface, and one 16-bit hub interfaces.
The hub interface provides the interface to two 64-bit/100-MHz PCI-X buses and one 64-bit/66MHz PCI bus via the P64H2, and the interface to two 32-bit/33-MHz PCI buses via the ICH4.
The board directly supports up to 8 GB of ECC memory, using four DDR266 compliant ECC
DIMMs. The ECC implementation in the MCH can detect and correct single-bit errors (SBE),
detect multiple-bit errors (MBE), and supports Intel
SDDC) feature with x4 DIMMs.
3.1.1 Processor Support
The Intel Server Board SE7505VB2 supports one or two processors in the 604-pin FCPGA
package. When two processors are installed, all processors must be of identical revision, core
voltage, and bus/core speed. When only one processor is installed, it should be in the socket
labeled CPU1 and the other socket must be empty. The support circuitry on the server board
consists of the following:
®
x4 Single Data Device Correction (Intel x4
Dual 604-pin processor sockets supporting 533MHz FSB Intel Xeon processors.
Processor host bus AGTL+ support circuitry.
Table 1. Processor Support Matrix
Processor Family Package Type Frequency Cache Size Front Side Bus Speed
Intel Xeon FCPGA 3.06GHz 512KB 533
Intel Xeon FCPGA 2.8 GHz 512KB 400 / 533
Intel Xeon FCPGA 2.67 GHz 512KB 400 / 533
Intel Xeon mPGA / FCPGA 2.4 GHz 512KB 400 / 533
Intel Xeon mPGA / FCPGA 2.2 GHz 512KB 400 / 533
Intel Xeon mPGA / FCPGA 2.0GHz 512KB 400 / 533
Intel Xeon mPGA / FCPGA 1.8GHz 512KB 400
Notes:
Processors must be populated in sequential order. Processor socket 1 must be
populated before processor socket 2.
The board is designed to provide up to 65A of current per processor. Processors with
higher current requirements are not supported.
No terminator is required in the second processor socket when using a uni-processor
configuration.
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Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
In addition to the circuitry described above, the processor subsystem contains the following:
Reset configuration logic
Processor module presence detection logic
Server management registers and sensors
3.1.1.1 Processor VRD
The Intel Server Board SE7505VB2 has a single VRD (Voltage Regulator Down) to support two
processors. It is compliant with the VRM 9.1 specification and provides a maximum of
130 AMPs, which is capable of supporting the requirements for two Intel
®
Xeon™ processors.
The board hardware and PMC (Power Management Controller) must read the processor VID
(voltage identification) bits for each processor before turning on the VRD. If the VIDs of the two
processors are not identical, then the PMC will not turn on the VRD.
3.1.1.2 Reset Configuration Logic
The BIOS determines the processor stepping, cache size, etc through the CPUID instruction.
The requirements are as follows:
All processors in the system must operate at the same frequency, have the same cache
sizes, and same VID. No mixing of product families is supported.
Processors run at a fixed speed and cannot be programmed to operate at a lower or
higher speed.
The processor information is read at every system power-on.
Note: The processor speed is the processor power on reset default value. No manual processor
speed setting options exist either in the form of a BIOS setup option or jumpers.
3.1.1.3 Processor Module Presence Detection
Logic is provided on the baseboard to detect the presence and identity of installed processors.
The PMC checks the logic and will not turn on the system DC power unless the VIDs of both the
processors match in a DP configuration.
3.1.1.4 Interrupts and APIC
Interrupt generation and notification to the processors is done by the APICs in the ICH4 and the
P64H2 using messages on the front side bus.
3.1.2 Memory Subsystem
The baseboard supports up to four DIMM slots for a maximum memory capacity of 8 GB. The
DIMM organization is x72, which includes eight ECC check bits. The memory interface runs at
266MT/s. The memory controller supports memory scrubbing, single-bit error correction and
multiple-bit error detection and Intel x4 SDDC support with x4 DIMMs. Memory can be
implemented with either single sided (one row) or double-sided (two row) DIMMs.
Revision 1.2 Intel part number C32194-002
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Functional Architecture Intel® Server Board SE7505VB2
The figure below provides a block diagram of the memory sub-system implemented on the
board.
Figure 2. Memory Sub-system Block Diagram
3.1.2.1 Memory DIMM Support
The board supports DDR266-compliant ECC DIMMS operating at 266MT/s. Only DIMMs tested
and qualified by Intel or a designated memory test vendor are supported on this board. A list of
qualified DIMMs is available at http://support.intel.com/support/motherboards/server/se7505vb2
Note that all DIMMs are supported by design, but only fully qualified DIMMs will be supported on
the board.
The minimum supported DIMM size is 128 MB. Therefore, the minimum main memory
configuration is 1 x 128 MB or 128 MB. The largest size DIMM supported is a 2 GB registered
DDR266 ECC DIMM based on 512 megabit technology. Therefore the maximum main memory
configuration is 4 x 2 GB or 8 GB.
Only registered DDR266 compliant, ECC, DDR memory DIMMs will be supported
ECC single-bit errors (SBE) will be corrected and multiple-bit error (MBE) will be
detected.
Intel server board also supports Intel x4 SDDC with x4 DIMMs.
The maximum memory capacity is 8 GB
The minimum memory capacity is 128 MB
.
Revision 1.2
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Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
3.1.2.2 Memory Configuration
The memory interface between the MCH and the DIMMs is 144-bits wide (72-bits for each
bank).
There are two banks of DIMMs, labeled 1 and 2. Bank 1 contains DIMM socket locations 1A and
1B. Bank 2 contains 2A and 2B. The sockets associated with each bank are located next to
each other and the DIMM socket identifiers are marked on the baseboard silkscreen, near the
DIMM socket.
For designs that require a lower price point, a single 128 MB DIMM can be populated in the
DIMM1A socket. When a single DIMM is installed, interleaving and Intel x4 SDDC are not
available. Bank 2 will only operate with two DIMMs installed.
The baseboard’s signal integrity and cooling are optimized when memory banks are populated
in order. Before populating either DIMM socket in bank 2, both DIMMs in bank 1 must be
populated. No empty DIMM sockets are allowed between populated DIMMs.
DIMM and memory configurations must adhere to the following:
The SE7505VB2 server board supports DDR memory in a variety of sizes and densities (see
Table 4). Due to the specific orientation of the memory on the SE7505VB2 server board,
certain memory densities and configurations are more difficult to cool in chassis that provide
traditional front to back airflow such as the Intel SC5200 and SC5250-E server chassis. To
ensure the memory used with this board has sufficient thermal margin to operate within
specifications, Intel has designed a memory cooling duct specifically for the SE7505VB2 server
board. Intel’s testing has shown only 2GB and stacked 1GB (low profile) DIMMs are thermally
at risk. If your specific design uses either of these size memory parts, contact Intel Customer
Support and request the SE7505VB2 server board memory cooling duct, part number C28482-
001.
Revision 1.2 Intel part number C32194-002
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Functional Architecture Intel® Server Board SE7505VB2
Table 2. Memory Bank Labels
Memory DIMM Bank
J9H1 (DIMM 1A), J9H2 (DIMM 1B) 1
J9J1 (DIMM 2A), J9J2 (DIMM 2B) 2
J9H1 J9H2 J9J1 J9J2
Revision 1.2
20
1A 2A1B2B
Bank 2
Figure 3. Memory Bank Label Definition
Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
2
3.1.2.4 I
2
The I
C bus is used by the system BIOS to retrieve DIMM information needed to program the
C Bus
MCH memory registers, which are required to boot the system.
The following table provides the I
Table 3. I2C Addresses for Memory Module SMB
2
C addresses for each DIMM slot.
Device Address
DIMM 1A 0xA0
DIMM 1B 0xA2
DIMM 2A 0xA4
DIMM 2B 0xA6
3.1.2.5 DRAM ECC
The ECC used for DRAM provides Intel x4 SDDC technology for x4 SDRAMs. DRAMs that are
x8 use the same algorithm but will not have Intel x4 SDDC technology, since at most only four
bits can be corrected with this ECC.
The method provides more ECC bits so each ECC word can correct more than a single-bit
failure. This is possible because different mathematical algorithms provide multiple-bit
correction with the right number of data bits and ECC bits. For example, a 144-bit ECC word
that consists of 128 data bits and 16 ECC bits can be used to correct up to 4 bit errors within
certain bit fields of data. These four bits must be adjacent, not random. Even though the ratio of
the ECC bits to data bits is the same as the previous example (16/128 vs. 8/64), the longer ECC
word allows for a correction and detection algorithm that is more efficient.
3.2 The Intel® E7505 Chipset
The Intel Server Board SE7505VB2 is designed around the Intel E7505 chipset. The chipset
provides an integrated I/O bridge and memory controller, and a flexible I/O subsystem core (PCI
/ PCI-X) . This is targeted for multiprocessor systems and standard high-volume servers. The
chipset consists of three components:
MCH: Memory Control Hub. The MCH accepts access requests from the host
(processor) bus and directs those accesses to memory or to one of the PCI buses. The
MCH monitors the host bus, examining addresses for each request. Accesses may be
directed to a memory request queue for subsequent forwarding to the memory
subsystem, or to an outbound request queue for subsequent forwarding to one of the
PCI buses. The MCH also accepts inbound requests from the P64H2 and the ICH4. The
MCH is responsible for generating the appropriate controls to control data transfer to and
from memory.
P64H2: PCI-X 64bit Hub 2.0 I/O Bridge. The P64H2 provides the interface for two PCI-
X buses capable of 133MHz operation. The P64H2 is both master and target on both
buses.
Revision 1.2 Intel part number C32194-002
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Functional Architecture Intel® Server Board SE7505VB2
ICH4: I/O Controller Hub 4. The ICH4 controller has several components. It provides
the interface for a 32-bit/33-MHz PCI bus. The ICH4 can be both a master and a target
on that PCI bus. The ICH4 also includes a USB 2.0 controller and an IDE controller. The
ICH4 is also responsible for much of the power management functions, with ACPI
control registers built in. The ICH4 also provides a number of GPIO pins and has the
LPC bus to support low speed legacy I/O.
The MCH, P64H2, and ICH4 chips provide the pathway between processor and I/O systems.
The MCH is responsible for accepting access requests from the host (processor) bus, and
directing all I/O accesses to one of the PCI buses or legacy I/O locations. If the cycle is directed
to one of the 64-bit PCI segments, the MCH communicates with the P64H2 through a private
interface called the HI (Hub Interface). If the cycle is directed to the ICH4, the cycle is output
on the MCH’s 8-bit HI 1.5 bus. The P64H2 translates the HI 2.0 bus operation to a 64-bit PCI
signaling environment operating between 133 MHz and 33 MHz.
The HI 2.0 bus is 16 bits wide and operates at 66 MHz with 512MT/s, providing over 1 GB per
second of bandwidth.
All I/O for the board, including PCI and PC-compatible I/O, is directed through the MCH and
then through either the P64H2 or the ICH4 provided PCI buses.
The ICH4 provides one 32-bit/33-MHz PCI bus hereafter called P32-A.
The P64H2 provides one 64-bit/100-MHz PCI-X bus, hereafter called P64-B, and one
64bit/66MHz PCI bus, hereafter called P64-C.
This independent bus structure allows all three PCI buses to operate independently and
concurrently providing additional bandwidth to the system.
3.2.1 MCH Memory Architecture Overview
The MCH supports a 144-bit wide memory sub-system that can support a maximum of 8 GB of
DDR266 memory using 2 GB DIMMs. This configuration needs external registers for buffering
the memory address and control signals. The four chip selects are registered inside the MCH
and need no external registers for chip selects.
The memory interface runs at 266MT/s. The memory interface supports a 72-bit or 144-bit wide
memory array. It uses fifteen address lines (BA [1:0] and MA [12:0]) and supports 64 Mb,
128 Mb, 256 Mb, 512 Mb DRAM densities. The DDR DIMM interface supports memory
scrubbing, single-bit error correction, and multiple bit error detection and Intel x4 SDDC with x4
DIMMs.
Revision 1.2
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Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
3.2.1.1 DDR Configurations
The DDR interface supports up to 8 GB of main memory and supports single- and doubledensity DIMMs. The DDR can be any industry-standard DDR. The following table shows the
DDR DIMM technology supported.
Table 4. Supported DDRs
DIMM
Capacity
128MB 16M x 72 128Mbit 16M x 8 9/1/4 12/2/10
256MB 32M x 72 64Mbit 16M x 4 36/2/4 12/2/10
256MB 32M x 72 128Mbit 32M x 4 18/1/4 12/2/11
256MB 32M x 72 128Mbit 16M x 8 18/2/4 12/2/10
256MB 32M x 72 256Mbit 32M x 8 9/1/4 13/2/10
512MB 64M x 72 256Mbit 64M x 4 18/1/4 13/2/11
512MB 64M x 72 256Mbit 32M x 8 18/2/4 13/2/10
512MB 64M x 72 512Mbit 64M x 8 9/1/4 13/2/11
1GB 128M x 72 256Mbit 64M x 4 36/2/4 13/2/11
1GB 128M x 72 512Mbit 64M x 8 18/2/4 13/2/11
1GB 128M x 72 512Mbit 128M x 4 18/1/4 13/2/12
2GB 256M x 72 512Mbit 128M x 4 36/2/4 13/2/12
DIMM
Organization
SDRAM Density
SDRAM
Organization
# SDRAM Devices /
Rows / Banks
# Address Bits
Rows / Banks /
Column
3.2.2 Memory Controller Hub (MCH)
The MCH is a 1005-ball FC-BGA device and uses the proven components of previous
generations like the Intel Xeon processor bus interface unit, the hub interface unit, and the DDR
memory interface unit. In addition, the MCH incorporates a hub interface (HI) . The HI interface
allows the MCH to directly interface with the P64H2. The MCH also increases the main memory
interface bandwidth and maximum memory configuration with a 144-bit wide memory interface.
The MCH integrates the following main functions:
An integrated high performance main memory subsystem.
An HI 2.0 bus which provides an interface to the P64H2
An HI 1.5 bus which provides an interface to the ICH4
AGP pro slot: Video controller with 3D/2D graphics accelerator
Other features provided by the MCH include the following:
Full support of ECC on the processor bus
Full support of Intel x4 SDDC on the memory interface with x4 DIMMs
Twelve deep in-order queue, two deep defer queue
Full support of registered DDR266 ECC DIMMs.
Support for 2 GB DDR memory modules
Memory scrubbing
Revision 1.2 Intel part number C32194-002
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Functional Architecture Intel® Server Board SE7505VB2
3.2.2.1 AGP 8X Bus
The AGP 8X bus features include the following:
Single AGP device
AGP interface asynchronously coupled to core
AGP 3.0 specification compliant
AGP 8X / 4X / 2X at 1.5V
0.8V and 1.5V AGP electrical. No 3.3V support
Isochronous support for AGP 8X, non-snooped
32 deep AGP request queue
32-bit upstream address support for inbound AGP and PCI cycles
32-bit downstream address support for outbound PCI and fast write cycles
3.2.3 P64H2
The P64H2 is a 567-ball FC-BGA device that provides an integrated I/O bridge for a highperformance data flow path between the HI 2.0 bus and the 64-bit I/O subsystem. This
subsystem supports peer 64-bit PCI-X segments. Because it has two PCI interfaces, the P64H2
can provide large and efficient I/O configurations. The P64H2 functions as the bridge between
the HI 2.0 interface and the two 64-bit PCI-X I/O segments. The HI interface can support 1GB/s
of data bandwidth.
3.2.3.1 PCI Bus P64-B I/O Subsystem
P64-B supports two 184-pin, 3.3-volt keyed, 64-bit PCI expansion slot connectors running at
100MHz. Both of the slots support 184-pin, 3.3V keyed, 64-bit PCI-X expansion cards. Both
slots support full-length PCI-X or PCI add-in cards.
The BIOS is responsible for setting the bus speed of P64-B. The bus speed runs at the speed of
the slowest card installed.
3.2.3.2 PCI Bus P64-C I/O Subsystem
P64-C supports the following embedded devices and connectors:
One 184-pin, 3.3-volt keyed, 64-bit PCI expansion slot connector running at 66MHz. This
slot is capable of supporting a full-length add-in PCI card
One integrated Intel
®
82540EM fast Ethernet gigabit (10/100/1000) controller
The BIOS is responsible for setting the bus speed of P64-C. The bus speed runs at the speed
of the slowest card installed.
3.2.4 ICH4
The ICH4 is a multi-function device, housed in a 421-pin BGA device, providing a HI 1.5 to PCI
bridge, a PCI IDE interface, a PCI USB controller, and a power management controller. Each
function within the ICH4 has its own set of configuration registers. Once configured, each
appears to the system as a distinct hardware controller sharing the same PCI bus interface.
Revision 1.2
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Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
The primary role of the ICH4 is to provide the gateway to all PC-compatible I/O devices and
features. The board uses the following the ICH4 features:
PCI bus interface
LPC bus interface
IDE interface, with Ultra DMA 100 capability
Universal Serial Bus (USB) 2.0 interface
PC-compatible timer/counter and DMA controllers
APIC and 8259 interrupt controller
Power management
System RTC
General purpose I/O (GPIO)
The following are the descriptions of how each supported feature is used on the board .
3.2.4.1 PCI Bus P32-A I/O Subsystem
The ICH4 provides a legacy 32-bit PCI subsystem and acts as the central resource on this PCI
interface. P32-A supports the following embedded devices and connectors:
An ATI Rage XL video controller with 3D/2D graphics accelerator
Silicon Image 3112A dual channel SATA controller
One Intel
Two expansion slots capable of supporting full length PCI add-in cards operating at 33 MHz
®
82550PM network controller
3.2.4.2 PCI Bus Master IDE Interface
The ICH4 acts as a PCI-based Ultra DMA 100 IDE controller that supports programmed I/O
transfers and bus master IDE transfers. The ICH4 supports two IDE channels, supporting two
drives each (drives 0 and 1). The baseboard provides two 40-pin (2x20) IDE connectors to
access the IDE functionality.
The IDE interface supports Ultra DMA 100 Synchronous DMA Mode transfers on each 40-pin
connector.
3.2.4.3 USB Interface
The ICH4 contains three USB 2.0 controllers and four USB hubs. The USB controller moves
data between main memory and up to six USB connectors. All ports function identically and with
the same bandwidth. The SE7505VB2 server board implements four ports on the board.
The baseboard provides three external USB ports on the back of the server board. The triplestack USB connector is located within the standard ATX I/O panel area next to the keyboard
and mouse housing. The USB specification defines the external connectors.
The fourth USB port is optional and can be accessed by cabling from an internal 9-pin
connector located on the baseboard to an external USB port located either in front or the rear of
a given chassis.
Revision 1.2 Intel part number C32194-002
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Functional Architecture Intel® Server Board SE7505VB2
3.2.4.4 Compatibility Interrupt Control
The ICH4 provides the functionality of two 82C59 PIC devices for ISA-compatible interrupt
handling.
3.2.4.5 APIC
The ICH4 integrates an I/O APIC capability with 24 interrupts.
3.2.4.6 General Purpose Input and Output Pins
The ICH4 provides a number of general purpose input and output pins. Many of these pins have
alternate functions, and thus all are not available. The following table lists the GPI and GPO
pins used on the board and gives a brief description of their function.
Table 5. ICH4 GPIO Usage Table
Pin Name
(Powe Well)
GPI0 / REQA#
(Core)
GPI1 / REQB#
(Core)
GPI2 / PIRQE#
(Core)
GPI3 / PIRQF#
(Core)
GPI4 / PIRQG#
(Core)
GPI5 / PIRQH#
(Core)
GPI6
(Core)
GPI7
(Core)
GPI8
(Resume)
GPI9 ~ GPI10 N/A
GPI11
(Resume)
Used As GPI /
GPO /
Function
BUS P1 Parity
DETECT
(P1_PERR#)
BUS P2/ICH4 Parity
DETECT
(P2_PERR#)
PIRQ_E GPIO:R00h[2]=0 (PIRQ_E)
PIRQ_F GPIO:R00h[3]=0 (PIRQ_F)
PIRQ_G GPIO:R00h[4]=0 (PIRQ_G)
PIRQ_H GPIO:R00h[5]=0 (PIRQ_H)
IDE ATA66/100
Detect (IDES_DET)
IDE ATA66/100
Detect (IDEP_DET)
CPU_HOT# GPI (GPIO:R04h[8] always = 1)
NC GPI GPIO:R00h[11]=1 (GPIO)
GPI GPIO:R00h[0]=1 (GPIO)
GPI GPIO:R00h[1]=1 (GPIO)
GPI (GPIO:R04h[6] always = 1)
GPI (GPIO:R04h[7] always = 1)
Function Select Data. Pin Description
PM:R2Eh[0] 1: Normal
(GPIO:R04h[0] always = 1)
GPIO:R2Ch[0]=1 (Active
Low)
PM:R2Eh[1] 1: Normal
(GPIO:R04h[1] always = 1)
GPIO:R2Ch[1]=1 (Active
Low)
PM:R2Eh[6] 1: ATA33
GPIO:R2Ch[6]=0 (Active
High)
PM:R2Eh[7] 1: ATA33
GPIO:R2Ch[7]=0 (Active
High)
PM:R2Eh[8] 1: Normal
GPIO:R2Ch[8]=1 (Active
Low)
PM:R2Eh[11]
(GPIO:R04h[11] always = 1)
GPIO:R2Ch[11]=0 (Active
High)
0: SMI or SCI or
Wakeup event
0: SMI or SCI or
Wakeup Event
0: ATA66/100
0: ATA66/100
0: SMI or SCI or
Wakeup Event
Revision 1.2
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Functional Architecture Intel® Server Board SE7505VB2
Pin Name
(Powe Well)
GPIO37 /
USBLED_F#
(Core)
GPIO38 /
USBLED_G#
(Core)
GPIO39 /
USBLED_H#
GPIO40 /
USBLED_I#
GPIO41 /
USBLEDJ
GPIO42 /
USBLED_K#
(Core)
GPIO43 /
USBLED_L#
(Core)
Used As GPI /
GPO /
Function
NC GPO GPIO:R30h[5]=1
RASERR# GPI GPIO:R30h[6]=1
PWR_Alert# GPI GPIO:R30h[7]=1b
AGP_PRST#2 (bit2) GPI GPIO:R30h[8]=1b
AGP_PRST#1 (bit1) GPI GPIO:R30h[9]=1b
DIS_NIC1 GPO GPIO:R30h[10]=1b
NC GPO GPIO:R30h[11]=1b
Function Select Data. Pin Description
GPIO:R38h[5] 0:Disabled
GPIO:R34h[5]=0
GPIO:R38h[5] 0: Disabled
GPIO:R34h[6]=1
GPIO:R38h[7]
GPIO:R34h[7]=1b
GPIO:R38h[8]
GPIO:R34h[8]=1b
GPIO:R38h[9]
GPIO:R34h[9]=1b
GPIO:R38h[10] 0: Disabled
GPIO:R34h[10]=0b
GPIO:R38h[11]
GPIO:R34h[11]=0b
1:Enable
1: Enabled
1: Enabled
3.2.4.7 Power Management
One of the embedded functions of the ICH4 is a power management controller. This is used to
implement ACPI-compliant power management features. The baseboard does support sleep
states S0, S1, S4, and S5.
3.3 Super I/O
The Winbond 83627HF sIO device contains all of the necessary circuitry to control two serial
ports, one parallel port, floppy disk, PS/2-compatible keyboard and mouse and hardware
monitor controller. The baseboard implements the following features:
GPIOs
Two serial ports
Floppy
Keyboard and mouse
Local hardware monitoring
Wake up control
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Intel part number C32194-002
Intel® Server Board SE7505VB2 Functional Architecture
3.3.1 GPIOs
The sIO provides a number of general-purpose input/output pins that the baseboard utilizes.
The following table identifies the pin and the signal name used in the schematic:
Table 6. Super I/O GPIO Usage Table
Pin
Name
Pin No.
GPIO12
(Pin 126)
GPIO13
(Pin 125)
GPIO15
(Pin 123)
GPIO17
(Pin 121)
GPIO20
(Pin 119)
GPIO25
(Pin 88)
GPIO26
(Pin 87)
GPIO35
(Pin 64)
GPI/GPO
Used as
CLRPAS# GPI
FanSlct1# GPO
FanSlct2# GPO
MAG_jmpr GPI
RECRYMD# GPI
Flash_EN# GPO
Btn_dsabl# GPO
Blink_LED SUSLED
/
Function
Function Select Data Description
CR2A<7>=1 & CR2A<4>=1 & LD7
[F0h]<2>=1
CR2A<7>=1 & CR2A<3>=1 & LD7
[F0h]<3>=0
CR2A<7>=1 & LD7 [F0h]<7>=1 LD7[F1h]<7>
CR2A<0>=1 & LD8[F0h]<0>=1 LD8[F1h]<0>
CR2B<3>=1 & LD8[F0h]<5>=0 LD8[F1h]<5>
CR2B<2>=1 & LD8[F0h]<6>=0 LD8[F1h]<6>
CR29h<7>=0
LD7[F1h]<2>
LD7[F1h]<3>
0: Clear Password
1: Normal
0: Factory mode
1: normal
0: Recovery mode
1:Normal
0: Flash ROM
Write En
1: normal
0: Power button
Disabled
1: normal
3.3.2 Serial Ports
The board provides two serial ports, an external serial port, and an internal serial header. The
following sections provide details on the use of the serial ports.
3.3.2.1 Serial A
Serial A is a standard DB9 interface located at the rear I/O panel of the server board, to the left
of the video connector below the parallel port connector. Serial A is designated by as “Serial A”
on the silkscreen. The reference designator is J8A1.
3.3.2.2 Serial B
Serial B is an optional port, accessed through a 9-pin internal header (J1J2). A standard DH-10
to DB9 cable can be used to direct serial B to an external connector on any given chassis. The
serial B interface follows the standard RS232 pinout. The baseboard has a “Serial B” silkscreen
label next to the connector and is located below the floppy connector.
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Functional Architecture Intel® Server Board SE7505VB2
3.3.2.3 Floppy Disk Controller
The floppy disk controller (FDC) in the sIO is functionally compatible with floppy disk controllers
in the DP8473 and N844077. All FDC functions are integrated into the sIO including analog data
separator and 16-byte FIFO. The baseboard provides a standard 34-pin interface for the floppy
disk controller.
3.3.2.4 Keyboard and Mouse
Two external PS/2 ports, located on the back of the baseboard, are provided to access the
keyboard or mouse functions. The two ports are interchangeable and will automatically detect
and configure a keyboard or mouse plugged into either port.
3.3.2.5 Wake-up Control
The sIO contains functionality that allows various events to control the power-on and power-off
the system.
3.3.3 BIOS Flash
The board incorporates an Intel® N82802AC (FWH8) flash memory component. The N82802AC
is a high-performance 8-megabit memory component that provides 1024K x 8 of BIOS and nonvolatile storage space. The flash device is connected through the LPC Bus from the ICH4 from
the sIO.
Revision 1.2
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Intel part number C32194-002
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