Intel S9200WK Series Setup And Service Manual

Intel® Server Products and Solutions

Intel® Server System
S9200WK
Product Family

Setup and Service Guide

Initial system setup instructions and procedures for
the installation and replacement of system components
and available Intel accessories

Rev 1.0

July 2019

S9200WK

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Document Revision History

Date

Revision

Changes

July 2019

1.0

Initial release.

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Disclaimers

Intel technologies’ features and benefits depend on system configuration and may require enabled

hardware, software, or service activation. Learn more at Intel.com, or from the OEM or retailer.

You may not use or facilitate the use of this document in connection with any infringement or other legal
analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free
license to any patent claim thereafter drafted which includes subject matter disclosed herein.

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.

The products described may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. Current characterized errata are available on request.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a purpose, and non-infringement, as well as any warranty arising from course of
performance, course of dealing, or usage in trade.

Copies of documents which have an order number and are referenced in this document may be obtained by
calling 1-800-548-4725 or by visiting www.intel.com/design/literature.htm.

Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.

*Other names and brands may be claimed as the property of others.

© Intel Corporation

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Warnings

Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.

System power on/off: The power buttons located on the front panel of each compute module DO NOT turn
off the server chassis AC power. To remove power from the server chassis, you must unplug the AC power
cord from the wall outlet. Make sure the AC power cord is unplugged before you open the server chassis.

To service a compute module it is not necessary to power down the entire system. Power off only the
compute module requiring servicing before attempting to remove it from the server chassis.

Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the compute module and disconnect all telecommunications
systems, networks, and modems attached to it before removing it from the server chassis. Otherwise,
personal injury or equipment damage can result.

Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.

Electrostatic Discharge (ESD)

Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.

Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.

• Where available, all system integration and/or service should be performed at a properly equipped ESD

workstation.

• Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive

shoes.

• Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.

• Remove all jewelry.

• Disconnect all power cables and cords before opening the Sever Chassis

• Power down the Compute Module and remove it from the Server Chassis, remove power feed from the

Server Board before performing any integration or service

• Touch any unpainted metal surface of the chassis before performing any integration or service.

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• Hold all circuit boards and other electronic components by their edges only.

• After removing electronic devices from the system or from their protective packaging, place them

component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.

Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.

Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.

This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.

Liquid cooling safety guidelines:

• Make sure there are no leaks and/or damaged parts before operating the liquid cooling system.

• Do not to energize system or compute module if liquid cooling system is compromised.

• Do not attempt to perform any service before removing power to the liquid compute module, turn off

and disconnect power before disconnecting the liquid cooling quick disconnects tube connectors.

• To reduce the risk of damage to the cooling system, use care when installing or removing the liquid

compute modules.

• Avoid excessive force when connecting and disconnecting quick disconnect couplings.

• Keep liquid cooling tubing clear of pinch points when sliding server nodes.

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Important Safety Certification Standards and Transition Support Information

The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).

Intel® server systems identified in this document are certified to:

• The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.

• The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new

standard.

During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:

• In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions

apply beyond the standard intended application use requirements.

• In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access

locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.

Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.

Explanation of temporary restricted access location measures

The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Table of Contents

1. Introduction ............................................................................................................................................................... 15

1.1 The Intel® Server System S9200WK Product Family .................................................................................. 15

1.2 About This Document ........................................................................................................................................... 15

1.3 System Overview and Feature Identification ................................................................................................. 15

2. System Setup............................................................................................................................................................. 18

2.1 Requirements for liquid cooled systems ........................................................................................................ 18

2.2 Installing the System Into a Rack ....................................................................................................................... 19

2.2.1 Installing the Fixed Rail Kit ................................................................................................................................... 19

2.2.2 Installing the Chassis Into a Rack ...................................................................................................................... 20

2.3 Connecting the System to a Liquid Coolant Supply .................................................................................... 21

2.4 Updating System Firmware ................................................................................................................................. 21

3. Optional Accessory Kit Integration and Service ................................................................................................ 22

3.1 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key – IPC VROCSTANMOD ................................. 23

3.1.1 Installing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key ................................................... 23

3.1.2 Removing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key ................................................. 23

3.2 Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key – iPC AXXRMM4LITE2 ............ 24

3.2.1 Installing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key ............................. 24

3.2.2 Removing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key ............................ 24

3.3 PCIe* Add-In Card ................................................................................................................................................... 25

3.3.1 Installing a PCIe* Add-In Card ............................................................................................................................ 25

3.3.2 Removing a PCIe* Add-In Card ........................................................................................................................... 25

3.4 Ethernet Management Port Module (EMP Module) – iPC AXXFCEMP................................................... 26

3.4.1 Installing the EMP Module ................................................................................................................................... 26

3.4.2 Removing the EMP Module ................................................................................................................................. 27

4. System Service .......................................................................................................................................................... 28

4.1 System Component Identification .................................................................................................................... 29

4.2 Compute Module Replacement ......................................................................................................................... 33

4.2.1 Compute Module Removal .................................................................................................................................. 33

4.2.2 Compute Module Installation ............................................................................................................................. 34

4.3 Riser Assembly Replacement .............................................................................................................................. 35

4.3.1 Riser Assembly Removal ...................................................................................................................................... 35

4.3.2 Riser Assembly Installation ................................................................................................................................. 36

4.4 Drive Carrier Extraction, Assembly, and Installation ................................................................................... 36

4.4.1 Drive Carrier Extraction ......................................................................................................................................... 37

4.4.2 Drive Carrier Assembly .......................................................................................................................................... 37

4.4.3 Drive Carrier Installation ....................................................................................................................................... 39

4.5 M.2 SSD Replacement ........................................................................................................................................... 39

4.5.1 M.2 Heat Sink Removal ......................................................................................................................................... 40

4.5.2 M.2 SSD Removal .................................................................................................................................................... 40

4.5.3 M.2 SSD Installation ............................................................................................................................................... 41

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4.5.4 M.2 Heat Sink Installation .................................................................................................................................... 41

4.6 System Battery Replacement .............................................................................................................................. 42

4.7 Liquid Cooling Loop Replacement (Liquid Cooled Compute Modules Only) ..................................... 43

4.7.1 Liquid Cooling Loop Removal ............................................................................................................................. 43

4.7.2 Liquid Cooling Loop Installation ........................................................................................................................ 45

4.8 Air Duct Replacement (Air Cooled Compute Modules Only) .................................................................... 46

4.8.1 Air Duct Removal..................................................................................................................................................... 46

4.8.2 Air Duct Installation ................................................................................................................................................ 46

4.9 Processor Heat Sink Replacement (Air Cooled Compute Modules Only) ............................................ 47

4.9.1 Processor Heat Sink Removal ............................................................................................................................. 47

4.9.2 Processor Heat Sink Installation ........................................................................................................................ 48

4.10 Memory (DIMM) Replacement ............................................................................................................................ 49

4.10.1 Air Cooled Compute Module DIMM Replacement ....................................................................................... 49

4.10.2 Liquid Cooled Compute Module DIMM Replacement ................................................................................ 50

4.11 Memory Heat Spreader Thermal Pad Replacement (Liquid Cooled Compute Modules only) ...... 53

4.11.1 Thermal Pad Removal ........................................................................................................................................... 53

4.11.2 Thermal Pad Installation ...................................................................................................................................... 54

4.12 Power Supply Replacement ................................................................................................................................ 54

4.12.1 Power Supply Removal ......................................................................................................................................... 54

4.12.2 Power Supply Installation .................................................................................................................................... 55

4.13 System Fan Replacement ..................................................................................................................................... 56

4.13.1 System Fan Removal ............................................................................................................................................. 57

4.13.2 System Fan Installation ......................................................................................................................................... 57

4.14 Chassis Plumbing Assembly Replacement (Liquid Cooled Systems Only).......................................... 58

4.14.1 Chassis Plumbing Assembly Removal ............................................................................................................. 58

4.14.2 Chassis Plumbing Assembly Installation ........................................................................................................ 61

4.15 Power Distribution Board (PDB) Assembly Replacement .......................................................................... 64

4.15.1 Power Distribution Board Assembly Removal .............................................................................................. 64

4.15.2 Power Distribution Board Assembly Installation .......................................................................................... 67

4.16 Internal Chassis Rail Replacement .................................................................................................................... 70

4.16.1 Internal Chassis Rail Removal ............................................................................................................................. 70

4.16.2 Internal Chassis Rail Installation ........................................................................................................................ 71

5. System Packaging Assembly Instructions .......................................................................................................... 72

Appendix A. Getting Help .......................................................................................................................................... 77

Appendix B. General Memory Population Rules .................................................................................................. 78

Appendix C. System Status LED State Definitions ............................................................................................... 81

Appendix D. POST Code Diagnostic LED Decoder ............................................................................................... 83

Appendix E. POST Code Errors ................................................................................................................................ 90

Appendix F. Safety Instructions ............................................................................................................................. 100

Appendix G. Additional References ...................................................................................................................... 110

Appendix H. Glossary ............................................................................................................................................... 111

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List of Figures

Figure 1. Liquid cooled system back view ................................................................................................................................ 15

Figure 2. Air cooled system back view ...................................................................................................................................... 15

Figure 3. Compute module identification – 4 node system with 1U compute modules ........................................... 16

Figure 4. Compute module identification – 2 node systems with 2U compute modules ......................................... 16

Figure 5. 1U compute module front panel feature identification ..................................................................................... 16

Figure 6. 2U compute module front panel feature identification ..................................................................................... 17

Figure 7. Front control panel features ....................................................................................................................................... 17

Figure 8. I/O breakout cable connector identification ......................................................................................................... 17

Figure 9. Securing the front of the rack rail ............................................................................................................................. 19

Figure 10. Securing the back of the rail ..................................................................................................................................... 20

Figure 11. Installing the chassis into the rack ......................................................................................................................... 20

Figure 12. Liquid cooling supply and return connections................................................................................................... 21

Figure 13. Installing the Intel® VROC Upgrade Key ............................................................................................................... 23

Figure 14. Removing the Intel® VROC Upgrade Key .............................................................................................................. 23

Figure 15. Installing the Intel® RMM4 Lite Key ........................................................................................................................ 24

Figure 16. Removing the Intel® RMM4 Lite Key ...................................................................................................................... 24

Figure 17. Installing an add-in card ............................................................................................................................................ 25

Figure 18. Removing an add-in card .......................................................................................................................................... 25

Figure 19. Removing the EMP Bay Filler Blank ....................................................................................................................... 26

Figure 20. Installing the EMP module/blank ........................................................................................................................... 26

Figure 21. Removing the EMP module/blank .......................................................................................................................... 27

Figure 22. Server chassis component identification ............................................................................................................. 29

Figure 23. 1U liquid cooled compute module component identification ...................................................................... 30

Figure 24. 2U liquid cooled compute module component identification ...................................................................... 31

Figure 25. 2U air cooled compute module component identification ............................................................................ 32

Figure 26. Removing a compute module .................................................................................................................................. 33

Figure 27. Installing a compute module ................................................................................................................................... 34

Figure 28. Removing a riser assembly ....................................................................................................................................... 35

Figure 29. Installing a riser assembly ......................................................................................................................................... 36

Figure 30. Drive carrier extraction from the chassis.............................................................................................................. 37

Figure 31. 2.5” drive carrier assembly – drive/drive blank removal ................................................................................ 37

Figure 32. 2.5” drive carrier assembly – drive installation into the carrier .................................................................... 38

Figure 33. 2.5” drive carrier assembly – alignment features .............................................................................................. 38

Figure 34. Drive carrier installation into the chassis ............................................................................................................. 39

Figure 35. Removing the M.2 heat sink ..................................................................................................................................... 40

Figure 36. Removing the M.2 SSD ............................................................................................................................................... 40

Figure 37. Installing the M.2 SSD................................................................................................................................................. 41

Figure 38. Removing the M.2 heat sink ..................................................................................................................................... 41

Figure 39. Removing the system battery .................................................................................................................................. 42

Figure 40. Installing the system battery .................................................................................................................................... 42

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Figure 41. Removing the cross head screws ............................................................................................................................ 43

Figure 42. Removing the T-20 screws ....................................................................................................................................... 43

Figure 43. Removing the liquid cooling loop ........................................................................................................................... 44

Figure 44. Securing the cross head screws .............................................................................................................................. 45

Figure 45. Securing the T-20 screws .......................................................................................................................................... 45

Figure 46. Removing the air duct................................................................................................................................................. 46

Figure 47. Installing the air duct .................................................................................................................................................. 46

Figure 48. Removing the processor heat sink ......................................................................................................................... 47

Figure 49. Installing the processor heat sink ........................................................................................................................... 48

Figure 50. Removing the DIMM in an air cooled system ...................................................................................................... 49

Figure 51. Installing the DIMM in an air cooled system ....................................................................................................... 49

Figure 52. Locating and retrieving the memory replacement tool .................................................................................. 50

Figure 53. Removing the DIMM retention clips....................................................................................................................... 51

Figure 54. Removing the DIMM in a liquid cooled system .................................................................................................. 51

Figure 55. Installing the DIMM in a liquid cooled system .................................................................................................... 52

Figure 56. Installing the DIMM retention clips ........................................................................................................................ 52

Figure 57. Removing a DIMM thermal pad ............................................................................................................................... 53

Figure 58. Installing a DIMM thermal pad ................................................................................................................................. 54

Figure 59. Removing the power supply ..................................................................................................................................... 54

Figure 60. Installing the power supply ...................................................................................................................................... 55

Figure 61. System Fan Configuration - Liquid cooled system ........................................................................................... 56

Figure 62. System Fan Configuration - Air cooled system ................................................................................................. 56

Figure 63. Removing the system fan .......................................................................................................................................... 57

Figure 64. Installing the system fan ............................................................................................................................................ 57

Figure 65. Removing the quick connect fillers ........................................................................................................................ 58

Figure 66. Removing the quick connect screws ..................................................................................................................... 59

Figure 67. Removing quick connect covers ............................................................................................................................. 59

Figure 68. Removing the back cover .......................................................................................................................................... 59

Figure 69. Removing the chassis plumbing assembly .......................................................................................................... 60

Figure 70. Installing the chassis plumbing assembly ........................................................................................................... 61

Figure 71. Installing quick connect covers ............................................................................................................................... 62

Figure 72. Securing the quick connect couplings to the covers ....................................................................................... 62

Figure 73. Installing the quick connect fillers ......................................................................................................................... 63

Figure 74. Securing the back cover............................................................................................................................................. 63

Figure 75. Removing the back cover .......................................................................................................................................... 64

Figure 76. Disconnecting the system fan power cables....................................................................................................... 65

Figure 77. Removing the power distribution board .............................................................................................................. 66

Figure 78. Installing the power distribution board ................................................................................................................ 67

Figure 79. Connecting system fan power cables.................................................................................................................... 68

Figure 80. Securing the back cover............................................................................................................................................. 69

Figure 81. Removing the internal chassis rail .......................................................................................................................... 70

Figure 82. Installing the internal chassis rail ........................................................................................................................... 71

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Figure 83. DIMM population for liquid cooled compute modules with 8 DIMMs of up to 32GB capacity .......... 78

Figure 84. DIMM population for liquid cooled compute modules with 8 DIMMs of 64GB capacity ..................... 79

Figure 85. DIMM population for air cooled compute modules with 8 DIMMs .............................................................. 79

Figure 86. DIMM population for liquid and air cooled compute modules with 16 DIMMs ...................................... 80

Figure 87. POST diagnostic LED identification ....................................................................................................................... 83

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List of Tables

Table 1. System status LED state definitions .......................................................................................................................... 81

Table 2. POST progress code LED example ............................................................................................................................ 83

Table 3. MRC progress codes ....................................................................................................................................................... 85

Table 4. MRC fatal error codes ..................................................................................................................................................... 86

Table 5. POST progress codes ..................................................................................................................................................... 87

Table 6. POST Error Codes and Messages ............................................................................................................................... 90

Table 7. Product family reference collaterals ...................................................................................................................... 110

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1. Introduction

1.1 The Intel® Server System S9200WK Product Family

The Intel® Server System S9200WK is a density-optimized, rack-mounted, 2U, multi-node product family
that is designed to support high-density, high-performance computing environments in both liquid and air
cooled configurations. Each system within the Intel Server System S9200WK product family includes
independent, pre-configured compute modules that allow for a power-on ready installation.

1.2 About This Document

This setup and service guide provides system integrators and service technicians guidance for the setup,
configuration, upgrade, and future maintenance of the Intel Server System S9200WK product family.

Refer to Appendix G for the complete list of documentation available. For the latest revision of this
document go to http://www.intel.com/support.

1.3 System Overview and Feature Identification

The illustrations on the following pages provide a quick reference identifying the key features of this server
product family.

Figure 1. Liquid cooled system back view

Figure 2. Air cooled system back view

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Figure 3. Compute module identification – 4 node system with 1U compute modules

Figure 4. Compute module identification – 2 node systems with 2U compute modules

Figure 5. 1U compute module front panel feature identification

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Figure 6. 2U compute module front panel feature identification

Figure 7. Front control panel features

Figure 8. I/O breakout cable connector identification

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2. System Setup

Each server system within the Intel® Server System S9200WK product family includes power supplies,
cooling components, rack mounting accessories, and configurable compute modules that include memory,
storage, and network components. Refer to the Intel® Server System S9200WK Product Family Configuration
Guide for a complete list of available options.

This chapter provides service personnel the information necessary to set up the Intel Server System
S9200WK product family. Illustrations identify the system features and procedures to install the system in a
rack environment and prepare it for use. The system comes fully assembled containing all components
necessary to be fully functional, so that once the system is physically set up in the operating environment
and updated to the latest available firmware version, it is ready for use.

Before Setting Up or Servicing the Intel® Server System S9200WK

Before working with this server product, observe the safety and ESD precautions found in the beginning of
this guide.

System Directional Reference

All references to left, right, front, top, and bottom assume the reader is facing the front of the chassis and
front of a compute module.

2.1 Requirements for liquid cooled systems

The liquid cooled systems within the Intel® Server System S9200WK product family are designed to operate
while being connected to a non-Intel coolant distribution unit that supports Staubli* SCG 06 quick connect
couplings.

Server Chassis

Compute Module

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2.2 Installing the System Into a Rack

Before following the instructions in this section, remove all compute modules from the server chassis (see
Section 4.2.1). If the rail kit is already installed, proceed to Section 2.2.2.

2.2.1 Installing the Fixed Rail Kit

The Intel® Server System S9200WK product family includes a fixed rail kit that serves as a shelf for the
system upon installation into the rack. When a system is installed onto the fixed rails, it can be secured to
both the rail and the rack through a pair of thumbscrews on the front of the system.

Figure 9. Securing the front of the rack rail

1. Remove the chassis rail kit from the packaging. Locate the rail, either left or right, and align the rail

guides with the slots in the front of the rack (see Letter A).

2. Insert the rail guides into their respective rack slots while pressing on the clip (see Letter B).

3. Release the clip once the guides are fully inserted into the rack (see Letter C).

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Figure 10. Securing the back of the rail

4. Extend and align the rear guides with their slots in the back of the rack (see Letter D).

5. Insert the rail guides into their respective rack slots while pressing on the clip (see Letter E).

6. Release the clip once the guides are fully inserted into the rack (see Letter F).

7. Repeat this process with the opposite rail.

2.2.2 Installing the Chassis Into a Rack

Important Safety Note: Due to the weight of a fully configured system, Intel® recommends using a

mechanical lift to aid with the installation of the system into the rack, and/or to use at least two people to
install the system into the rack, or remove all installed compute modules from the system before attempting
to install the system into the rack.

Figure 11. Installing the chassis into the rack

1. Insert the chassis onto the rails and slide it back to the rear of the rack (see Letter A).

2. Tighten the thumbscrews located on the chassis handles to secure the chassis to the rack (see Letter

B).

3. If removed, install the compute modules into the chassis (see Section 4.2).

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2.3 Connecting the System to a Liquid Coolant Supply

The liquid cooled systems within the Intel® Server System S9200WK product family include Staubli* SCG O6
quick connect couplings on the back of the chassis. When integrating a liquid cooled system into an
operating environment, it must be connected to the facility’s liquid coolant supply.

Figure 12. Liquid cooling supply and return connections

1. Locate the two quick connect couplings in the rear of the chassis as shown in Figure 12.

2. Attach the liquid supply to the quick connect coupling marked with a blue ring.

3. Attach the liquid return to the quick connect coupling marked with a red ring.

2.4 Updating System Firmware

Each compute module within the Intel® Server System S9200WK product family includes a software stack
that includes a BIOS, BMC firmware, Intel® Management Engine (Intel® ME) firmware, and both FRU and SDR
data. A full software stack is installed during the system manufacturing process, but may not be the latest
available version. Intel highly recommends updating the full system software stack on each installed
compute module to the latest available version for optimal performance and system reliability. A System
Update Package (SUP) containing the latest available system software stack can be downloaded from the
following Intel web site: http://downloadcenter.intel.com.

To ensure that the embedded platform management subsystem is configured properly, the latest FRU and
SDR data for each compute module must be installed after updating the full system software stack. Updated
FRU and SDR data allows the platform management subsystem to monitor the specific system sensors used
to determine appropriate system cooling, optimal performance, and accurate error reporting. FRU and SDR
data is loaded by using the FRUSDR utility which is included with the System Update Package (SUP).

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3. Optional Accessory Kit Integration and Service

This chapter provides installation and removal instructions for supported optional accessory kits.

Before Beginning

Before working with the server product, observe the safety and ESD precautions found in the Warnings
section at the beginning of this guide.

Ensure the compute module is powered off before removing it from the system chassis

Required Tools and Supplies

1. Anti-static wrist strap and conductive foam pad (recommended)

System Reference

All references to left, right, front, top, and bottom assume the reader is facing the front of the server chassis
or compute module.

Server Chassis

Compute Module

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3.1 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key – IPC VROCSTANMOD

3.1.1 Installing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key

Figure 13. Installing the Intel® VROC Upgrade Key

1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface (see Section 4.2.1)

2. Remove the right riser assembly from Riser Slot 2. (see Section 0)

3. Remove the Intel® VROC Upgrade Key from its packaging.

4. Locate the white 4-pin key connector near the right edge of the server board

5. Place the key over the connector and confirm that the orientation of the key matches that of the

connector.

6. Press the key down onto the connector.

3.1.2 Removing the Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key

Figure 14. Removing the Intel® VROC Upgrade Key

1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface (see Section 4.2.1)

2. Remove the right riser assembly from Riser Slot 2. (see Section 0)

3. Using the key pull tab, carefully pull the key up until it disengages from the connector.

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3.2 Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key – iPC

AXXRMM4LITE2

3.2.1 Installing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key

Figure 15. Installing the Intel® RMM4 Lite Key

1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface (see Section 4.2.1)

2. Remove the right riser assembly from Riser Slot 2. (see Section 0)

3. Remove the Intel RMM4 Lite Key from its packaging.

4. Locate the Intel RMM4 Lite key connector near the right edge of the server board behind the RJ45

Management Port connector.

5. Match the orientation of the Intel RMM4 Lite key to the onboard connector.

6. Press the Intel RMM4 Lite key down into the connector until fully engaged.

3.2.2 Removing the Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) Key

Figure 16. Removing the Intel® RMM4 Lite Key

1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface(see Section 4.2.1)

2. Remove the right riser assembly from Riser Slot 2. (see Section 0)

3. Carefully grasp the Intel® RMM4 Lite key and pull it up until disengaged from the connector.

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3.3 PCIe* Add-In Card

The following procedures are identical for both 1U and 2U riser card assemblies

3.3.1 Installing a PCIe* Add-In Card

Figure 17. Installing an add-in card

1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface (see Section 4.2.1)

2. Remove the selected riser assembly from the compute module (see Section 0)

3. If present, carefully remove the rear metal filler plate from the metal frame of the riser assembly (see

Letter A).

4. Align the rear bracket of the add-in card to the rear opening of the riser assembly

5. Carefully push the add-in card down into the PCIe slot (see Letter B).

6. Ensure the add-in card is fully seated

7. Re-install the riser card assembly into the compute module (see Section 4.3)

3.3.2 Removing a PCIe* Add-In Card

Figure 18. Removing an add-in card

1U riser card assembly shown**

1U Riser assembly shown **

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1. Remove the compute module to be serviced from the server chassis and place it on to an anti-static

work surface (see Section 4.2.1)

2. Remove the selected riser assembly from the compute module (see Section 0)

3. Carefully remove the add-in card from the PCIe slot (see Letter A).

4. Carefully install the metal filler plate over the opening on the metal frame of the riser assembly (see

Letter B).

5. Re-install the riser card assembly into the compute module (see Section 4.3)

3.4 Ethernet Management Port Module (EMP Module) – iPC AXXFCEMP

Your system may or may not come preconfigured with an Ethernet Management Port Module. This section
provides instruction for the installation and removal of this accessory option. The EMP module is hot-swap
capable. It can be installed or removed without powering down the system or any of its compute modules.

3.4.1 Installing the EMP Module

Figure 19. Removing the EMP Bay Filler Blank

1. If present, remove the EMP Bay Filler blank from the back of the server chassis by pulling it out from

the chassis as shown in Figure 19.

Figure 20. Installing the EMP module/blank

2. Install the EMP module, by sliding it into the open EMP bay until it locks into place (see Letter A).

A

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3.4.2 Removing the EMP Module

1. Locate the EMP module on the back of the chassis.

Figure 21. Removing the EMP module/blank

2. Remove the EMP module by pushing down on the Green latch (see Letter A) and then pulling it out

from the chassis (see Letter B).

Note: To keep the system operating within its thermal limits, the EMP module bay must be populated with
either an EMP module or EMP blank when any of the installed compute modules are operational.

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4. System Service

This chapter provides instructions for removing and installing system components considered field
replaceable (field-replaceable units, or FRUs). The Intel® Server System S9200WK product family features a
modular design, allowing for servicing of system fans, power supply modules, compute modules and
Ethernet Management Port module (EMP module) without having to power off the entire system.

System components that do require that the full system be powered off and AC power cords disconnected
from the system include the following:

For air cooled configurations:

• Power distribution board

For liquid cooled configurations:

• Power distribution board

• Chassis plumbing assembly

When service is necessary for any of the individual compute modules within the server system, it is
necessary to power off the selected compute module before removing it from the server chassis.

Before Setting Up or Servicing the Intel® Server System S9200WK

Before working with this server product, observe the safety and ESD precautions found at the beginning of
this guide.

System Directional Reference

All references to left, right, front, top, and bottom assume the reader is facing the front of the server chassis
or the front of the compute module.

Server Chassis

Compute Module

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4.1 System Component Identification

The following illustrations provide a quick reference to identify system components that are considered field
serviceable. Refer to the Intel® Server System S9200WK product family Configuration Guide for a complete
list of available spares.

Number

Name

1

Server Chassis

2

Chassis back cover

3

System fan assemblies

4

Power supplies

5

EMP module

6

Chassis plumbing assembly (Liquid cooled systems only)

7

Power distribution board

Figure 22. Server chassis component identification

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Number

Name

1

Compute module tray with server board

2

Liquid cooling loop

3

DIMM retention clips

4

Riser assemblies

Figure 23. 1U liquid cooled compute module component identification

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Number

Name

1

Compute module tray with server board

2

Liquid cooling loop

3

DIMM retention clips

4

Riser assemblies

Figure 24. 2U liquid cooled compute module component identification

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Number

Name

1

Compute module tray with server board

2

CPU Heat sinks

3

Air duct

4

Riser assemblies

Figure 25. 2U air cooled compute module component identification

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4.2 Compute Module Replacement

All installed compute modules within an Intel® Server System S9200WK are independent from each other.
Servicing a compute module does not require having to power down the full server system. Only the
compute module to be serviced must be powered down before being removed from the server chassis.

Replacement of compute modules (spare or warranty replacement) will include the following:

• Compute Module Tray

• Server Board with processors

• Riser Card Assemblies

• Liquid Cooling Loop (liquid cooled compute modules only)

• Processor Heat Sinks (air cooled compute modules only)

• Air Duct (2U air cooled compute modules only)

When returning a compute module for warranty replacement, the following components must be removed
before shipment (if present) :

• Memory (DIMMs)

• DIMM retention clips

• PCIe* add-in cards

• Add-on storage devices (M.2 SSD, U.2 SSD)

• Intel® RMM4 Lite key

• Intel® VROC upgrade key

Note: Processors are soldered to the server board, they are not removable. Processors are included when
ordering a spare or warranty replacement compute module. Refer to the Intel® Server System S9200WK
Product Family Configuration Guide for available spares.

The following procedures are identical for both 1U and 2U compute modules.

4.2.1 Compute Module Removal

1. Power down the compute module using the Power Button located on the front panel of the

compute module to be serviced.

Figure 26. Removing a compute module

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2. Press the green latch inward (see Letter A) and lower the lever in front of the compute module (see

Letter B).

3. Grasp the lever and pull out the compute module from the chassis (see Letter C).

Note: To keep the system operating within its thermal limits, compute module bays must be populated
with either a compute module or blank when any of the installed compute modules are operational.

4.2.2 Compute Module Installation

Replacement compute modules can be re-installed into a server chassis without impacting the operation or
functionality of other operational compute modules.

•

Figure 27. Installing a compute module

1. Ensure the lever in front of the compute module is lowered. If not, press the green latch inward and

lower the lever.

2. Align the compute module to its corresponding bay and push it into the chassis until the key pins in

the lever are inside the chassis inner wall key hole.

3. Raise the lever to secure the compute module. (see Letter B)

2U Compute Module shown **

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4.3 Riser Assembly Replacement

Before following the instructions in this section, remove the Intel® compute module (see Section 4.2.1)
needing service. This procedure applies to both 1U and 2U compute modules.

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Phillips head screwdriver

4.3.1 Riser Assembly Removal

Figure 28. Removing a riser assembly

1. Remove the three screws that secure the riser assembly to the compute module (see Letter A).

2. Carefully remove the riser assembly by lifting it up away from the compute module (see Letter B).

If the riser assembly is going to be shipped as part of a warranty replacement, remove all installed add-in
cards and/or storage SSDs.

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4.3.2 Riser Assembly Installation

Figure 29. Installing a riser assembly

1. Align the riser card edge connector to the riser slot on the server board (see Letter A).

2. Carefully push down on the riser assembly until the riser card is securely seated into the riser slot.

3. Ensure the three screw holes of the riser assembly are aligned and flush with the mounting holes of

the compute module.

4. With three screws, secure the riser assembly to the compute module using 8 lbs. of torque on each

(see Letter B).

4.4 Drive Carrier Extraction, Assembly, and Installation

The 2U compute modules of the Intel® Server System S9200WK product family have support for up to two
hot-swap 2.5” form factor U.2 Solid State Drives (SSDs). Each drive installed to a tool-less drive carrier. This
section provides instructions for drive extraction from the chassis, drive assembly, and drive installation into
the chassis.

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

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4.4.1 Drive Carrier Extraction

Figure 30. Drive carrier extraction from the chassis

1. Press the button on the carrier face plate to release the lever (see Letter A).

2. Using the lever, pull the carrier from the drive bay (see Letter B).

4.4.2 Drive Carrier Assembly

Important: The S9200WK server product family is designed and tested to support 2.5” U.2 NVMe* Solid

State Drives only.

Figure 31. 2.5” drive carrier assembly – drive/blank removal

1. Remove the drive (or drive blank) from the carrier by gently rotating the top edge of a carrier rail

outwards while simultaneously pushing the drive up from the bottom as shown in .

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Figure 32. 2.5” drive carrier assembly – drive installation into the carrier

2. Carefully unpack the new drive, taking care not to touch any of the connector pins located on the

back side of the drive.

3. With the rear drive connector positioned toward the back of the drive carrier, align and position the

mounting holes on one side of the drive over the mounting tabs located on the drive carrier side rail
(see Letter A).

4. Lower the other side of the drive into the carrier (see Letter B) and press down on the drive until all

mounting tabs are locked in place.

Figure 33. 2.5” drive carrier assembly – alignment features

Note: The 2.5” drive blank and drive carrier each have alignment features (shown in ) ensuring proper

assembly. When re-installing a drive blank into the drive carrier ensure the features are aligned prior to
installation, as failure to properly install a drive blank may result in the carrier assembly not fitting properly
into the drive bay.

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4.4.3 Drive Carrier Installation

Figure 34. Drive carrier installation into the chassis

1. Align the drive assembly with the open drive bay.

2. With the lever in the open position, insert the drive assembly into the drive bay (see Letter A) and

push forward until the drive makes contact with the internal backplane.

3. Complete the drive installation by closing the drive assembly lever until it locks into place (see Letter

B).

4.5 M.2 SSD Replacement

Before following the instructions in this section, remove the selected compute module (see Section 4.2.1)
from the server chassis and then remove the selected riser assembly from the compute module (see Section

0).

This procedure applies to both 1U and 2U riser assemblies with illustrations showing differences where
applicable.

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Phillips head screwdriver

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4.5.1 M.2 Heat Sink Removal

The riser assembly includes an M.2 heat sink that must be removed prior to servicing any M.2 SSD.

Figure 35. Removing the M.2 heat sink

1. Locate the heat sink on the left side of the riser assembly and remove the screw (see Letter A).

2. Slide the heat sink in the direction shown to remove it (see Letter B).

4.5.2 M.2 SSD Removal

Figure 36. Removing the M.2 SSD

1. Remove the screw from the M.2 mounting stand-off on the left side of the riser assembly (see Letter

A).

2. Carefully rotate outward the free end of the M.2 SSD away from the riser assembly (see Letter B).

3. Grasp the M.2 SSD by its edges and gently remove it from the connector in the direction shown (see

Letter C).

If no SSD is being installed:

4. Return the previously removed screw to the M.2 mounting stand-off.

5. Re-Install the M.2 heat sink on to the riser assembly (see Section 4.5.4).

1U Riser Assembly

2U Riser Assembly

1U Riser Assembly

2U Riser Assembly

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4.5.3 M.2 SSD Installation

Figure 37. Installing the M.2 SSD

1. If present, remove the screw from the M.2 mounting stand-off on the left side of the riser assembly.

2. Align the notch within the SSD edge connector with the key in the M.2 connector and insert the SSD

into the connector (see Letter A).

3. Push the free edge of the SSD towards the riser assembly (see Letter B) and secure the SSD to the M.2

mounting stand-off with the previously removed screw (see Letter C).

4. Install the M.2 Heat Sink (see Section 4.5.4)

4.5.4 M.2 Heat Sink Installation

Figure 38. Removing the M.2 heat sink

1. If installing a new heatsink, peel off the protective film from the thermal interface material.

2. Align the heat sink to the riser assembly and slide into place in the direction shown (see Letter A).

3. Ensure the screw holes are properly aligned then secure the heat sink to the riser assembly with a

screw (see Letter B).

1U Riser Assembly

2U Riser Assembly

1U Riser Assembly

2U Riser Assembly

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4.6 System Battery Replacement

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

Before following the instructions in this section, remove the select compute module from the server chassis
(see Section 4.2.1), and then remove the riser assemblies from the compute module (see Section 4.3.1).

Figure 39. Removing the system battery

1. Locate the battery on the server board. See Figure 39.

2. Gently pull the metal clip to release the battery (see Letter A).

3. Remove the old battery from the plastic socket (see Letter B).

4. Dispose of the battery according to local laws.

5. Remove the new lithium battery from its package.

6. Orient the battery so the positive pole is facing towards the left side of the compute module.

Figure 40. Installing the system battery

7. Insert the battery into the battery socket. See Figure 40.

8. Use the <F2> BIOS Setup Utility to restore BIOS Settings and reset the system time and date.

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4.7 Liquid Cooling Loop Replacement (Liquid Cooled Compute Modules Only)

Before following the instructions in this section, remove the selected compute module from the server
chassis (see Section 4.2.1).

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Phillips head screwdriver

• Torx* T-20 screwdriver

4.7.1 Liquid Cooling Loop Removal

Figure 41. Removing the cross head screws

1. Remove the ten screws indicated in Figure 41 with a phillips head screwdriver.

Figure 42. Removing the T-20 screws

2. Remove the eight screws indicated in Figure 42 with a Torx* T-20 screwdriver.

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Figure 43. Removing the liquid cooling loop

3. Carefully lift the liquid cooling loop assembly up and away from the compute module. See Figure 43.

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4.7.2 Liquid Cooling Loop Installation

1. Carefully unpack the new liquid cooling loop.

2. Carefully place the liquid cooling loop assembly into the compute module, ensuring that both the

DIMM cooling assembly and processor cold plates are properly aligned with the mounting screw
holes.

Figure 44. Securing the cross head screws

3. Place and secure the ten phillips head screws indicated in Figure 44 with a phillips head screwdriver

using 8 lbs. of torque.

Figure 45. Securing the T-20 screws

4. Using a cross pattern for each cooling plate, place and secure the eight Torx* head screws as

indicated in Figure 45 with a Torx* T-20 screwdriver using 8 lbs. of torque

2 3 4

3

2 4 1

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4.8 Air Duct Replacement (Air Cooled Compute Modules Only)

4.8.1 Air Duct Removal

Figure 46. Removing the air duct

1. Remove the compute module to be serviced from the server chassis (see Section 4.2.1).

2. Press the latches located on both sides of the compute module inwards (see Letter A).

3. Carefully lift the front edge of the air duct away from the compute module (see Letter B).

4. Pull the air duct away from the compute module (see Letter C).

4.8.2 Air Duct Installation

Figure 47. Installing the air duct

1. Align and attach the hinge slots located on the back end of the air duct with the hinge posts located

on both sides of the compute module (see Letter A).

2. Lower the air duct down until both the left and right side latches snap into place (see Letter B).

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4.9 Processor Heat Sink Replacement (Air Cooled Compute Modules Only)

Due to possible damage to the server board while attempting to remove/install the processor heat sink, Intel
does NOT recommend removing the processor heat sink outside of the following:

• The processor heat sink is damaged and needs to be replaced

• The processor heat sink is faulty and needs to be replaced

Before following the instructions in this section, remove the compute module to be serviced from the server
chassis (see Section 4.2.1) and remove the air duct (see Section 4.8.1).

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Torx* T-20 screwdriver

4.9.1 Processor Heat Sink Removal

Figure 48. Removing the processor heat sink

Note: Extreme care should be taken when removing the heat sink from a fixed mounted processor.

• Care should be taken not to accidentally bend or knock off any components mounted on the server

board while attempting to remove the heat sink or clean the top side of the processor.

1. Using a Torx* T-20 screwdriver, loosen all captive (non-removable) processor heat sink screws until

each is free from the server board (see Letter A). No specific order is required.

2. It will be necessary to break the thermal interface bond that has formed between the processor and

the heat sink. To break the bond and remove the heat sink, carefully rotate the heat sink in a short
back and forth pattern while at the same time carefully lifting the heat sink away from the processor
(see Letter B).

3. Using a commercially available isopropyl alcohol cleaning pad or other similar cleaning tool, carefully

clean away all Thermal Interface Material (TIM) residue from both the bottom of the heatsink and the
top of the processor.

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• No excess cleaning agent should flow from the top side of the processor onto any part of the server

board

4.9.2 Processor Heat Sink Installation

Figure 49. Installing the processor heat sink

Note: Replacement processor heat sinks will include thermal interface material (TIM) on the bottom side of
the heat sink. If present, remove the protective film from the TIM before installing the heat sink onto the
processor.

1. Align and place the heat sink on top of the processor. No specific heat sink fin orientation is required.

2. Secure the screws indicated in Figure 49 with a Torx* T-20 screwdriver using 8 lbs. of torque, in an X

pattern, alternating between screws until all are tight.

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4.10 Memory (DIMM) Replacement

This section documents the procedure to follow when replacement of a faulty DIMM is necessary. The DIMM
replacement procedure for a liquid cooled compute module and an air cooled cooled compute module is
different. Refer to the appropriate sub-section for your specific compute module configuration.

For memory population rules, refer to Appendix B.

4.10.1 Air Cooled Compute Module DIMM Replacement

1. Remove the select compute module from the server chassis (see Section 4.2.1)

2. Remove the air duct from the computer module (see Section 4.8.1).

4.10.1.1 DIMM Removal

Figure 50. Removing the DIMM in an air cooled system

3. Identify and locate the faulty DIMM. Ensure that the ejection tabs of adjacent DIMM slots are closed.

4. Open the DIMM ejection tabs at both ends of the selected DIMM slot (see Letter A). The DIMM will

slightly lift up from the slot.

5. Holding the DIMM by its edges, lift it away from the slot (see Letter B).

4.10.1.2 DIMM Installation

Figure 51. Installing the DIMM in an air cooled system

1. Locate the DIMM slot for installation. Ensure that the DIMM ejection tabs at both ends of the DIMM

slot are pushed outward to the open position (see Letter A).

2. Carefully unpack the replacement DIMM, taking care to only handle the device by its outer edges.

3. Align the notch at the bottom edge of the DIMM with the key in the DIMM slot (see Letter B).

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4. Insert the DIMM into the slot (see Letter C) pushing down on the DIMM, until the ejection tabs snap

into place (see Letter D). Ensure that the ejection tabs are firmly in place (see Letter E).

4.10.2 Liquid Cooled Compute Module DIMM Replacement

The DIMM replacement procedure for a liquid cooled compute module requires removal, replacement, and
re-installation of several components. The documented procedure should be followed in the order specified
with little or no deviation.

1. Remove the select compute module from the server chassis (see Section 4.2.1)

2. Remove the air duct from the computer module (see Section 4.8.1).

4.10.2.1 DIMM Removal

The liquid cooled compute modules within the Intel® Server System S9200WK product family include a
memory replacement tool located on top of the cold plates of the liquid cooling loop. This tool can be used
to remove the DIMM retainer clips in memory configurations that require them, and to open the DIMM
ejection tabs.

Figure 52. Locating and retrieving the memory replacement tool

1. Locate the memory replacement tool on top of the CPU0 cold plate.

2. Remove the tool from one of its sides first (see Letter A) and then lift it away (see Letter B).

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If the compute module does not have DIMM retention clips installed, skip to step 6.

Figure 53. Removing the DIMM retention clips

3. Identify and locate the faulty DIMM

4. Use the memory removal tool as a lever and position one end between the DIMM retention clip and

the liquid cooling loop (see Letter A).

5. Lift the DIMM retention clip from the liquid cooling loop (see Letter B).

Figure 54. Removing the DIMM in a liquid cooled system

6. Using the memory replacement tool, open the DIMM ejection tabs at both ends of the DIMM slot (see

Letter A and Letter B). The DIMM will slightly lift up from the slot.

7. Hold the DIMM by its edges and lift it away from the slot (see Letter C).

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4.10.2.2 DIMM Installation

Figure 55. Installing the DIMM in a liquid cooled system

1. Locate the DIMM slot for installation. Ensuring that the DIMM ejection tabs at both ends of the DIMM

slot are pushed outward to the open position (see Letter A). Use the provided tool if the DIMM
ejection tabs are in the closed position (see Section 4.10.2.1).

2. Carefully unpack the replacement DIMM, taking care to only handle the device by its outer edges.

3. Align the notch at the bottom edge of the DIMM with the key in the DIMM slot (see Letter B).

4. Insert the DIMM into the slot (see Letter C) pushing down on the DIMM, until the ejection tabs snap

into place (see Letter D). Ensure that the ejection tabs are firmly in place (see Letter E).

Figure 56. Installing the DIMM retention clips

5. If the replacement DIMM is 64GB in capacity, re-install the DIMM retention clip over the select DIMM

pair and heat spreader as shown in Figure 56. Ensure the clip is securely in place.

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Memory Heat Spreader Thermal Pad Replacement (Liquid Cooled Compute
Modules only)

In liquid cooled compute module configurations, the heat generated from installed DIMMs is drawn out of
the compute module by means of an array of memory heat spreaders that are interconnected to the internal
plumbing of the liquid cooling loop. Each heat spreader is positioned in between two DIMMs. Thermal pads
are affixed to both sides of a heat spreader to ensure efficient heat dissipation from the DIMMs to the heat
spreader.

Should a thermal pad become damaged while installing or removing a DIMM, or become damaged or worn
for other reasons, the following sections provide the instructions necessary to remove and replace a heat
spreader thermal pad.

Note: To maintain optimal performance of the liquid cooling loop, Intel recommends replacing ALL thermal
pads at once.

4.11.1 Thermal Pad Removal

1. Remove the select compute module from the server chassis (see Section 4.2.1).

2. Remove all DIMMs from the compute module (see Section 4.10.2.1).

Figure 57. Removing a thermal pad

3. Carefully peel away the thermal pads from both sides of all heat spreaders.

4. Using isopropyl alcohol and a lint free cloth, carefully clean the surface of each heat spreader,

ensuring that no thermal pad residue remains.

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4.11.2 Thermal Pad Installation

Figure 58. Installing a thermal pad

1. Apply a new thermal pad to the heat spreader by aligning the thermal pad’s cutout edges with the

heat spreader’s shape (see Letter A).

2. Fold the thermal pad to the opposite side of the heat spreader (see Letter B).

3. Use a plastic tweezer (or the included DIMM removal tool) to apply pressure along the thermal pad

from one side to the other, ensuring that no air bubbles remain between the thermal pad and the
heat spreader.

4. Install the previously removed DIMMs (see Section 1.1).

4.12 Power Supply Replacement

Power supply modules are hot swappable when the system is configured in a redundant (2+1) power supply
configuration. In this configuration, should a power supply fail, it can be removed and replaced without
powering down the full system.

4.12.1 Power Supply Removal

Figure 59. Removing the power supply

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1. Identify the faulty power supply.

2. Detach the power cord from the power supply to be removed.

3. While pushing the green latch in the shown direction (see Letter A), use the handle to pull the power

supply module from the system fan assembly (see Letter B).

4.12.2 Power Supply Installation

Figure 60. Installing the power supply

1. (If present) Remove the power supply filler from the power supply bay.

2. Insert the power supply module into the system fan assembly (see Letter A).

3. Push the power supply module into the system fan assembly until it locks into place.

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4.13 System Fan Replacement

The Intel® Server System S9200WK product family supports two system fan configurations, one for Liquid
Cooled configurations and one for Air Cooled configurations, as shown in the following illustrations.

Figure 61. System Fan Configuration - Liquid cooled system

Figure 62. System Fan Configuration - Air cooled system

The system is designed to support fan redundancy. Should a single fan rotor fail, system management will
engage various system thermal controls to maintain system thermals below maximum limits. Depending on
the system configuration, the system fans are designed to be hot swappable.

In air cooled configurations, the two outer 80mm system fans are hot swappable.

In liquid cooled and air cooled system configurations, three 60mm system fans share the same assembly
housing as a power supply module. The power supply module must be removed from the fan assembly
before removing the assembly housing from the chassis. Hot swapping these system fans can only be
supported when the system is configured to support 2 + 1 power supply redundancy. Attempting to hot
swap one of these fans with power redundancy lost will cause the entire system to shut down unless the
failed fan is in the same assembly as a failed power supply.

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4.13.1 System Fan Removal

Figure 63. Removing the system fan

1. If present, remove the power supply (see Section 4.12.1) from the system fan assembly to be

removed.

2. While pushing the green latch in the shown direction (see Letter A), use the handle to pull the system

fan assembly out of the bay (see Letter B).

4.13.2 System Fan Installation

Figure 64. Installing the system fan

1. Ensure no power supply is pre-installed in the system fan assembly.

2. Insert the system fan assembly into the open fan assembly bay (see Letter A)

Note: 80 mm fans on the sides (air cooled system only), 60 mm fans in the three center bays.

3. Push in the system fan assembly until it locks into place.

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4.14 Chassis Plumbing Assembly Replacement (Liquid Cooled Systems Only)

Select system configurations within the Intel® Server System S9200WK product family support liquid cooling
on the installed compute modules through an integrated liquid cooling loop.

The coolant flow for the liquid cooling loop is supported through liquid cooling plumbing connections
installed in the back of the server chassis. Should the chassis plumbing or plumbing connections become
damaged or worn out, the following sections provide the instructions necessary to remove and replace the
chassis plumbing assembly.

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Phillips head screwdriver

4.14.1 Chassis Plumbing Assembly Removal

1. Power the system down, remove it from the rack and place it on a flat surface.

Important Safety Note: Due to the weight of a fully configured system, Intel® recommends using a
mechanical lift to aid with the removal of the system from the rack, and/or to use at least two people to
remove the system from the rack, or remove all installed compute modules from the system before
attempting to remove the system from the rack.

2. Remove the power supplies (see Section 4.12.1).

3. Remove the system fans (see Section 4.13.1).

4. Remove the EMP module / EMP module blank (see Section 3.4).

Figure 65. Removing the quick connect fillers

1. Remove the fillers located above the quick connect couplings in the back of the chassis.

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Figure 66. Removing the quick connect screws

2. Using a phillips head screwdriver, remove the four screws that secure each of the quick connect

couplings to the covers.

Figure 67. Removing quick connect covers

3. Pull the quick connect covers upwards, then out.

Figure 68. Removing the back cover

4. Locate the chassis back cover and remove the four screws with a phillips head screwdriver (see Letter

A).

5. Slide the cover towards the back and lift it up (see Letter B).

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Figure 69. Removing the chassis plumbing assembly

6. Using a phillips head screwdriver remove the six screws on the top brace of the plumbing assembly

and loosen the four captive screws on the sides of the brace (see Letter A).

7. Carefully pull towards the front of the chassis and then up to remove the plumbing assembly (see

Letter B).

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4.14.2 Chassis Plumbing Assembly Installation

Figure 70. Installing the chassis plumbing assembly

1. Lower the plumbing assembly inside the chassis and slide the quick connect couplings into their

respective bays (see Letter A).

2. Align and secure the plumbing assembly to the chassis using a phillips head screwdriver and the six

screws provided on the top brace, and tighten the four captive screws on the sides of the brace (see
Letter B).

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Figure 71. Installing quick connect covers

3. Install the quick connect covers by sliding them into the chassis and then pressing downwards.

Figure 72. Securing the quick connect couplings to the covers

4. Align and secure the quick connect couplings to the covers using a phillips head screwdriver and the

four screws provided for each.

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Figure 73. Installing the quick connect fillers

5. Insert the fillers above the quick connect couplings in the back of the chassis.

6. Install the system fans (see Section 4.13.2).

7. Install the power supplies (see Section 4.12.2).

Figure 74. Securing the back cover

8. Place the back cover on top of the chassis slide it towards the front (see Letter A).

9. Secure the back cover with a phillips head screwdriver and the four screws provided (see Letter B).

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4.15 Power Distribution Board (PDB) Assembly Replacement

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Phillips head screwdriver

4.15.1 Power Distribution Board Assembly Removal

1. Power the system down and remove it from the rack.

Important Safety Note: Due to the weight of a fully configured system, Intel® recommends using a
mechanical lift to aid with the removal of the system from the rack, and/or to use at least two people to
remove the system from the rack, or remove all installed compute modules from the system before
attempting to remove the system from the rack.

Figure 75. Removing the back cover

2. Locate the chassis back cover and remove the four screws with a phillips head screwdriver (see Letter

A).

3. Slide the cover towards the back and lift it up (see Letter B).

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Figure 76. Disconnecting the system fan power cables

4. Locate and disconnect the system fan power cables from the power distribution board by pressing

inwards on each clip and lifting them up.

5. Remove the power supplies (see Section 4.12.1).

6. Remove the system fans (see Section 4.13.1).

7. Remove the EMP module or EMP module blank if installed (see Section 3.4).

8. If the system is liquid cooled, remove the chassis plumbing (see Section 4.14.1).

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Figure 77. Removing the power distribution board

9. Remove the screws securing the power distribution board to the chassis with a phillips head

screwdriver (see Letter A).

10. Remove the PDB by lifting it upwards, tilting up the front side of the PDB, and then lifting the board

out. (see Letter B).

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4.15.2 Power Distribution Board Assembly Installation

Figure 78. Installing the power distribution board

1. Lower the PDB into the chassis, tilting down the back side and then sliding the board to the front (see

Letter A).

2. Secure the power distribution board using a phillips head screwdriver and the provided screws (see

Letter B).

3. If the system is liquid cooled, install the chassis plumbing (see Section 4.14.2).

4. Install the EMP module if available, or an EMP module blank (see Section 3.4).

5. Install the system fan assemblies (see Section 4.13.2).

6. Install the power supplies (see Section 4.12.2).

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Figure 79. Connecting system fan power cables

7. Locate and connect the system fan cables by pressing inwards on each clip and pressing them down

into the appropriate connector.

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Figure 80. Securing the back cover

8. Place the back cover over the top of the chassis and slide it towards the front (see Letter A).

9. Secure the back cover with a phillips head screwdriver and the four screws provided (see Letter B).

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4.16 Internal Chassis Rail Replacement

The systems within the Intel® Server System S9200WK product family include internal rails to support 1U
compute modules in the upper part of the inner walls of the chassis. Should the internal rails become
damaged or worn out, the following sections provide the instructions necessary to remove and replace them.

Required Tools and Supplies:

• Anti-static wrist strap and conductive foam pad (recommended)

• Flat head screwdriver

Note: To maintain optimal performance of the system Intel recommends replacing ALL internal rails at once.

4.16.1 Internal Chassis Rail Removal

1. Power the system down, remove it from the rack and place it on a flat surface.

Important Safety Note: Due to the weight of a fully configured system, Intel® recommends using a

mechanical lift to aid with the removal of the system from the rack, and/or to use at least two people to
remove the system from the rack, or remove all installed compute modules from the system before
attempting to remove the system from the rack.

2. Remove the compute modules from the bays selected for service (see Section 4.2.1)

Figure 81. Removing the internal chassis rail

3. Using a flat head screwdriver, release the rail latch (see Letter A).

4. Slide the rail towards the front of the chassis to remove it (see Letter B).

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4.16.2 Internal Chassis Rail Installation

Figure 82. Installing the internal chassis rail

1. Place the rail inside the chassis aligning the keying pins of the rail with the chassis inner wall.

2. Slide the rail into the chassis inner wall towards the back of the chassis until it locks into place.

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5. System Packaging Assembly Instructions

The original Intel packaging is designed to provide protection to a fully configured system and tested to
meet ISTA (International Safe Transit Association) Test Procedure 3A (2008). The packaging is also designed
to be re-used.

The original packaging includes two layers of boxes – an inner box and the outer shipping box – and various
protective inner packaging components. The boxes and packaging components are designed to function
together as a protective packaging system. When reused, all the original packaging material must be used,
including both boxes and each inner packaging component. In addition, all inner packaging components
must be reinstalled in the proper location to ensure adequate protection of the system for subsequent
shipment.

Note: The design of the inner packaging components does not prevent improper placement within the
packaging assembly. There is only one correct packaging assembly that will allow the package to meet the
ISTA (International Safe Transit Association) Test Procedure 3A (2008) limits.

Failure to follow the specified packaging assembly instructions may result in damage to the system during
shipment.

1. Place two foam inserts into the inner box as shown. Note foam insert orientation.

2. Place the Accessory Kit box between the end foam insert and the end wall of the inner box as shown.

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3. Wrap the red foam sheet around the system.

4. Install the red front foam in the front of the system (left piece in the illustration below) and the red

rear foam in the rear of the system (right piece in the illustration below).

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5. Carefully place the system into the shipping bag and tape the bag shut.

6. Carefully lower the system into the inner shipping box as shown.

7. Put the front foam on the left top and the rear foam on the right top.

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8. Place the accessory box in the middle as shown.

9. Fold the top flaps of the inner box closed, end flaps first, followed by side flaps.
a. By design, the two side flaps will not meet. Do not tape side flaps shut.

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10. Fold the top flaps of the outer box closed, end flaps first, followed by the side flaps.

11. Tape the outer box using an H-pattern. Across the center first, followed by both ends.

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Appendix A. Getting Help

To obtain support for an issue with the server system, follow these steps:

1. Visit the following Intel support web page: http://www.intel.com/support/

This web page provides 24x7 support when you need it to get the latest and most complete technical
support information on all Intel® Enterprise Server and Storage Platforms. Information available at the
support site includes:

— Latest BIOS, firmware, drivers and utilities

— Product documentation, setup and service guides

— Full product specifications, technical advisories and errata

—Compatibility documentation for memory, hardware add-in cards, and operating systems

— Server and chassis accessory parts list for ordering upgrades or spare parts

— A searchable knowledgebase to search for product information throughout the support site

2. If a solution cannot be found at Intel’s support site, send an email to Intel’s technical support center

using the online form available at:

http://www.intel.com/p/en_US/support/contactsupport

3. Lastly, contact an Intel support representative using one of the support phone numbers available at

http://www.intel.com/support/feedback.htm?group=server (charges may apply).

Intel also offers Channel Program members around-the-clock 24x7 technical phone support on Intel® server
boards, server chassis, server RAID controller cards, and Intel® Server Management at:

http://www.intel.com/reseller/.

Note: Access to the 24x7 number requires a login to the reseller site.

Warranty Information

To obtain warranty information, visit http://www.intel.com/p/en_US/support/warranty.

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Appendix B. General Memory Population Rules

• Only multiples of 8 DIMMs are supported to be installed on a compute module (8,16,24).

• On the compute module, each DIMM slot is labeled by CPU #, die #, memory channel, and slot # such as

CPU0_0_DIMM_A1.

• Mixing DIMMs of different frequencies and latencies is not supported within or across processors. If a

mixed configuration is encountered, the BIOS attempts to operate at the highest common frequency and
the lowest latency possible.

• Mixing of DDR4 DIMM Types (RDIMM, LRDIMM) within the processor attached DIMM slots or across

processors is not supported. This is a Fatal Error Halt in Memory Initialization.

• DIMMs should be populated evenly across memory controllers within a processor.

• Memory channels should be populated in alphabetical order.

• For liquid cooled compute modules with DIMMs of 64GB capacity, DIMMs must be populated in pairs to

each side of the memory heat spreaders within the liquid cooling loop, and a DIMM retention clip must
be installed to secure them to the DIMM heat spreader.

Figure 83. DIMM population for liquid cooled compute modules with 8 DIMMs of up to 32GB capacity

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Figure 84. DIMM population for liquid cooled compute modules with 8 DIMMs of 64GB capacity

Figure 85. DIMM population for air cooled compute modules with 8 DIMMs

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Figure 86. DIMM population for liquid and air cooled compute modules with 16 DIMMs

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Appendix C. System Status LED State Definitions

The server board includes a bi-color system status LED. The system status LED on the server board is tied
directly to the system status LED on the front panel. This LED indicates the current health of the server.
Possible LED states include solid green, blinking green, blinking amber, and solid amber.

When the server is powered down (transitions to the DC-off state or S5), the BMC is still on standby power
and retains the sensor and front panel status LED state established before the power-down event.

When AC power is first applied to the system, the status LED turns solid amber and then immediately
changes to blinking green to indicate that the BMC is booting. If the BMC boot process completes with no
errors, the status LED changes to solid green.

Table 1. System status LED state definitions

LED State

System State

BIOS Status Description

Off

System is not operating.

System AC power is off.
System is in EuP Lot6 off mode.
System is in S5 soft-off state.

Solid green

System is operating normally.

System is running (in S0 State) and its status is healthy. The system is not

exhibiting any errors. AC power is present and BMC has booted and
manageability functionality is up and running.

After a BMC reset, and in conjunction with the chassis ID solid on, the BMC is

booting Linux*. Control has been passed from BMC uBoot to BMC Linux*
itself. It is in this state for roughly 10-20 seconds.

Blinking green

System is operating in a
degraded state although still
functioning, or system is
operating in a redundant
state but with an impending
failure warning.

Redundancy loss such as power-supply or fan. Applies only if the associated

platform sub-system has redundancy capabilities.

Fan warning or failure when the number of fully operational fans is less than

the minimum number needed to cool the system.

Non-critical threshold crossed – Temperature (including HSBP temp), voltage,

input power to power supply, output current for main power rail from power
supply and Processor Thermal Control (Therm Ctrl) sensors.

Power supply predictive failure occurred while redundant power supply

configuration was present.
Unable to use all the installed memory (more than 1 DIMM installed).
Correctable Errors over a threshold and migrating to a spare DIMM (memory

sparing). This indicates that the system no longer has spared DIMMs (a

redundancy lost condition). Corresponding DIMM LED lit.
In mirrored configuration, when memory mirroring takes place and system

loses memory redundancy.
Battery failure.
BMC executing in uBoot. (Indicated by Chassis ID blinking at 3Hz). System in

degraded state (no manageability). BMC uBoot is running but has not

transferred control to BMC Linux*. Server will be in this state 6-8 seconds

after BMC reset while it pulls the Linux* image into flash.
BMC Watchdog has reset the BMC.
Power Unit sensor offset for configuration error is asserted.
HDD HSC is off-line or degraded.

Blinking amber

System is operating in a
degraded state with an
impending failure warning,
although still functioning.
System is likely to fail.

Critical threshold crossed – Voltage, temperature (including HSBP temp), input

power to power supply, output current for main power rail from power

supply and PROCHOT (Therm Ctrl) sensors.
VRD Hot asserted.
Minimum number of fans to cool the system not present or failed.
Hard drive fault.
Power Unit Redundancy sensor – Insufficient resources offset (indicates not

enough power supplies present).
In non-sparing and non-mirroring mode if the threshold of correctable errors

is crossed within the window.

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LED State

System State

BIOS Status Description

Solid amber

Critical/non-recoverable –
system is halted. Fatal alarm –
system has failed or shut
down.

CPU CATERR signal asserted.
MSID mismatch detected (CATERR also asserts for this case).
CPU 1 is missing.
CPU Thermal Trip.
No power good – power fault.
DIMM failure when there is only 1 DIMM present and hence no good memory

present.
Runtime memory uncorrectable error in non-redundant mode.
DIMM Thermal Trip or equivalent.
SSB Thermal Trip or equivalent.
CPU ERR2 signal asserted.
BMC/Video memory test failed. (Chassis ID shows blue/solid-on for this

condition.)
Both uBoot BMC firmware images are bad. (Chassis ID shows blue/solid-on for

this condition.)
240 VA fault.
Fatal Error in processor initialization:

o Processor family not identical
o Processor model not identical
o Processor core/thread counts not identical
o Processor cache size not identical
o Unable to synchronize processor frequency
o Unable to synchronize QPI link frequency

Uncorrectable memory error in a non-redundant mode.

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Appendix D. POST Code Diagnostic LED Decoder

As an aid to assist in troubleshooting a system hang that occurs during a system’s Power-On Self-Test
(POST) process, the server board includes a blank of eight POST Code Diagnostic LEDs on the back edge of
the server board as shown in the Figure below.

Figure 87. POST diagnostic LED identification

During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of
memory initialization and platform configuration processes, each of which is assigned a specific hex POST
code number.

As each routine is started, the given POST code number is displayed to the POST Code Diagnostic LEDs on
the back edge of the server board.

During a POST system hang, the displayed post code can be used to identify the last POST routine that was
run prior to the error occurring, helping to isolate the possible cause of the hang condition.

Each POST code is represented by eight LEDs; four green and four amber. The POST codes are divided into
two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic
LEDs and the lower nibble bits are represented by Green Diagnostics LEDs. If the bit is set in the upper and
lower nibbles, the corresponding LED is lit. If the bit is clear, the corresponding LED is off.

Note: Diagnostic LEDs are best read and decoded when viewing the LEDs from the front of the system.

In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are
decoded as shown in Table 2.

Table 2. POST progress code LED example

Binary Value
LED State

Upper Nibble AMBER LEDs

Lower Nibble GREEN LEDs

MSB

LSB 1 0 1 0 1 1 0 0

ON

OFF

ON

OFF

ON

ON

OFF

OFF

Hex Value

8h

4h

2h

1h

8h

4h

2h

1h

Hex Result

Ah

Ch

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Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh

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Early POST Memory Initialization MRC Diagnostic Codes

Memory initialization at the beginning of POST includes multiple functions, including: discovery, channel
training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other
hardware settings, and initialization of applicable RAS configurations.

The MRC Progress Codes are displayed to the Diagnostic LEDs that show the execution point in the MRC
operational path at each step.

Table 3. MRC progress codes

Checkpoint

Diagnostic LED Decoder

Description

1 = LED On, 0 = LED Off

Upper Nibble

(Amber)

Lower Nibble

(Green)

MSB

LSB

8h

4h

2h

1h

8h

4h

2h

1h

MRC Progress Codes

B0h

1 0 1 1 0 0 0 0 Detect DIMM population

B1h

1 0 1 1 0 0 0 1 Set DDR4 frequency

B2h

1 0 1 1 0 0 1 0 Gather remaining SPD data

B3h

1 0 1 1 0 0 1 1 Program registers on the memory controller level

B4h

1 0 1 1 0 1 0 0 Evaluate RAS modes and save rank information

B5h

1 0 1 1 0 1 0 1 Program registers on the channel level

B6h

1 0 1 1 0 1 1 0 Perform the JEDEC defined initialization sequence

B7h

1 0 1 1 0 1 1 1 Train DDR4 ranks

B8h

1 0 1 1 1 0 0 0 Initialize CLTT/OLTT

B9h

1 0 1 1 1 0 0 1 Hardware memory test and init

BAh

1 0 1 1 1 0 1 0 Execute software memory init

BBh

1 0 1 1 1 0 1 1 Program memory map and interleaving

BCh

1 0 1 1 1 1 0 0 Program RAS configuration

BFh

1 0 1 1 1 1 1 1 MRC is done

Should a major memory initialization error occur, preventing the system from booting with data integrity, the
MRC will display a fatal error code on the diagnostic LEDs, and a system halt command is executed. Fatal
MRC error halts do NOT charge the state of the System Status LED, and they do NOT get logged as SEL
events. The following table lists all MRC fatal errors that are displayed to the Diagnostic LEDs.

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Table 4. MRC fatal error codes

Checkpoint

Diagnostic LED Decoder

Description

1 = LED On, 0 = LED Off

Upper Nibble

(Amber - Read 1st)

Lower Nibble

(Green - Read 2nd)

MSB

LSB

8h

4h

2h

1h

8h

4h

2h

1h

MRC Fatal Error Codes

E8h

1 1 1 0 1 0 0

0

No usable memory error
01h = No memory was detected from SPD read, or invalid config that

causes no operable memory.
02h = Memory DIMMs on all channels of all sockets are disabled due to

hardware memtest error.
03h = No memory installed. All channels are disabled.

E9h

1 1 1 0 1 0 0

1

Memory is locked by Intel Trusted Execution Technology and is
inaccessible

EAh

1 1 1 0 1 0 1

0

DDR4 channel training error
01h = Error on read DQ/DQS (Data/Data Strobe) init
02h = Error on Receive Enable
03h = Error on Write Leveling
04h = Error on write DQ/DQS (Data/Data Strobe

EBh

1 1 1 0 1 0 1

1

Memory test failure
01h = Software memtest failure.
02h = Hardware memtest failed.

EDh

1 1 1 0 1 1 0

1

DIMM configuration population error
01h = Different DIMM types (RDIMM, LRDIMM) are detected installed in

the system.
02h = Violation of DIMM population rules.
03h = The 3rd DIMM slot cannot be populated when QR DIMMs are

installed.
04h = UDIMMs are not supported.
05h = Unsupported DIMM Voltage.

EFh

1 1 1 0 1 1 1

1

Indicates a CLTT table structure error

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BIOS POST Progress Codes

The following table provides a list of all POST progress codes.

Table 5. POST progress codes

Checkpoint

Diagnostic LED Decoder

Description

1 = LED On, 0 = LED Off

Upper Nibble

(Amber - Read 1st)

Lower Nibble

(Green - Read 2nd)

MSB

LSB

8h

4h

2h

1h

8h

4h

2h

1h

SEC Phase

01h

0 0 0 0 0 0 0 1 First POST code after CPU reset

02h

0 0 0 0 0 0 1 0 Microcode load begin

03h

0 0 0 0 0 0 1 1 CRAM initialization begin

04h

0 0 0 0 0 1 0 0 EI Cache When Disabled

05h

0 0 0 0 0 1 0 1 SEC Core at Power on Begin

06h

0 0 0 0 0 1 1 0 Early CPU initialization during Sec Phase.

UPI RC (Fully leverage without platform change)

A1h

1 0 1 0 0 0 0 1 Collect info such as SBSP, Boot Mode, Reset type etc.

A3h

1 0 1 0 0 0 1 1 Setup minimum path between SBSP & other sockets

A7h

1 0 1 0 0 1 1 1 Topology discovery and route calculation

A8h

1 0 1 0 1 0 0 0 Program final route

A9h

1 0 1 0 1 0 0 1 Program final IO SAD setting

AAh

1 0 1 0 1 0 1 0 Protocol layer and other uncore settings

ABh

1 0 1 0 1 0 1 1 Transition links to full speed operation

ACh

1 0 1 0 1 1 0 0 Phy layer setting

ADh

1 0 1 0 1 1 0 1 Link layer settings

AEh

1 0 1 0 1 1 1 0 Coherency settings

AFh

1 0 1 0 1 1 1 1 UPI initialization done

07h

0 0 0 0 0 1 1 1 Early SB initialization during Sec Phase.

08h

0 0 0 0 1 0 0 0 Early NB initialization during Sec Phase.

09h

0 0 0 0 1 0 0 1 End Of Sec Phase.

0Eh

0 0 0 0 1 1 1 0 Microcode Not Found.

0Fh

0 0 0 0 1 1 1 1 Microcode Not Loaded.

PEI Phase

10h

0 0 0 1 0 0 0 0 PEI Core

11h

0 0 0 1 0 0 0 1 CPU PEIM

15h

0 0 0 1 0 1 0 1 NB PEIM

19h

0 0 0 1 1 0 0 1 SB PEIM

MRC Progress Codes

31h

0 0 1 1 0 0 0 1 Memory Installed

32h

0 0 1 1 0 0 1 0 CPU PEIM (CPU Init)

33h

0 0 1 1 0 0 1 1 CPU PEIM (Cache Init)

4Fh

0 1 0 0 1 1 1 1 Dxe IPL started

DXE Phase

60h

0 1 1 0 0 0 0 0 DXE Core started

61h

0 1 1 0 0 0 0 1 DXE NVRAM Init

62h

0 1 1 0 0 0 1 0 DXE Setup Init

63h

0 1 1 0 0 0 1 1 DXE CPU Init

65h

0 1 1 0 0 1 0 1 DXE CPU BSP Select

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Checkpoint

Diagnostic LED Decoder

Description

1 = LED On, 0 = LED Off

Upper Nibble

(Amber - Read 1st)

Lower Nibble

(Green - Read 2nd)

MSB

LSB

8h

4h

2h

1h

8h

4h

2h

1h

66h

0 1 1 0 0 1 1 0 DXE CPU AP Init

68h

0 1 1 0 1 0 0 0 DXE PCI Host Bridge Init

69h

0 1 1 0 1 0 0 1 DXE NB Init

6Ah

0 1 1 0 1 0 1 0 DXE NB SMM Init

70h

0 1 1 1 0 0 0 0 DXE SB Init

71h

0 1 1 1 0 0 0 1 DXE SB SMM Init

72h

0 1 1 1 0 0 1 0 DXE SB devices Init

78h

0 1 1 1 1 0 0 0 DXE ACPI Init

79h

0 1 1 1 1 0 0 1 DXE CSM Init

80h

1 0 0 0 0 0 0 0 DXE BDS Started

81h

1 0 0 0 0 0 0 1 DXE BDS connect drivers

82h

1 0 0 0 0 0 1 0 DXE PCI Bus begin

83h

1 0 0 0 0 0 1 1 DXE PCI Bus HPC Init

84h

1 0 0 0 0 1 0 0 DXE PCI Bus enumeration

85h

1 0 0 0 0 1 0 1 DXE PCI Bus resource requested

86h

1 0 0 0 0 1 1 0 DXE PCI Bus assign resource

87h

1 0 0 0 0 1 1 1 DXE CON_OUT connect

88h

1 0 0 0 1 0 0 0 DXE CON_IN connect

89h

1 0 0 0 1 0 0 1 DXE SIO Init

8Ah

1 0 0 0 1 0 1 0 DXE USB start

8Bh

1 0 0 0 1 0 1 1 DXE USB reset

8Ch

1 0 0 0 1 1 0 0 DXE USB detect

8Dh

1 0 0 0 1 1 0 1 DXE USB enable

91h

1 0 0 1 0 0 0 1 DXE IDE begin

92h

1 0 0 1 0 0 1 0 DXE IDE reset

93h

1 0 0 1 0 0 1 1 DXE IDE detect

94h

1 0 0 1 0 1 0 0 DXE IDE enable

95h

1 0 0 1 0 1 0 1 DXE SCSI begin

96h

1 0 0 1 0 1 1 0 DXE SCSI reset

97h

1 0 0 1 0 1 1 1 DXE SCSI detect

98h

1 0 0 1 1 0 0 0 DXE SCSI enable

99h

1 0 0 1 1 0 0 1 DXE verifying SETUP password

9Bh

1 0 0 1 1 0 1 1 DXE SETUP start

9Ch

1 0 0 1 1 1 0 0 DXE SETUP input wait

9Dh

1 0 0 1 1 1 0 1 DXE Ready to Boot

9Eh

1 0 0 1 1 1 1 0 DXE Legacy Boot

9Fh

1 0 0 1 1 1 1 1 DXE Exit Boot Services

C0h

1 1 0 0 0 0 0 0 RT Set Virtual Address Map Begin

C2h

1 1 0 0 0 0 1 0 DXE Legacy Option ROM init

C3h

1 1 0 0 0 0 1 1 DXE Reset system

C4h

1 1 0 0 0 1 0 0 DXE USB Hot plug

C5h

1 1 0 0 0 1 0 1 DXE PCI BUS Hot plug

C6h

1 1 0 0 0 1 1 0 DXE NVRAM cleanup

C7h

1 1 0 0 0 1 1 1 DXE ACPI Enable

Intel® Server System S9200WK Product Family Setup and Service Guide

89

Checkpoint

Diagnostic LED Decoder

Description

1 = LED On, 0 = LED Off

Upper Nibble

(Amber - Read 1st)

Lower Nibble

(Green - Read 2nd)

MSB

LSB

8h

4h

2h

1h

8h

4h

2h

1h

0h

0 0 0 0 0 0 0 0 Clear POST Code

S3 Resume

40h

0 1 0 0 0 0 0 0 S3 Resume PEIM (S3 started)

41h

0 1 0 0 0 0 0 1 S3 Resume PEIM (S3 boot script)

42h

0 1 0 0 0 0 1 0 S3 Resume PEIM (S3 Video Repost)

43h

0 1 0 0 0 0 1 1 S3 Resume PEIM (S3 OS wake)

BIOS Recovery

46h

0 1 0 0 0 1 1 0 PEIM which detected forced Recovery condition

47h

0 1 0 0 0 1 1 1 PEIM which detected User Recovery condition

48h

0 1 0 0 1 0 0 0 Recovery PEIM (Recovery started)

49h

0 1 0 0 1 0 0 1 Recovery PEIM (Capsule found)

4Ah

0 1 0 0 1 0 1 0 Recovery PEIM (Capsule loaded)

E8h

1 1 1 0 1 0 0 0 No Usable Memory Error:

E9h

1 1 1 0 1 0 0

1

Memory is locked by Intel® Trusted Execution Technology and is
inaccessible.

EAh

1 1 1 0 1 0 1 0 DDR4 Channel Training Error:

EBh

1 1 1 0 1 0 1 1 Memory Test Failure

EDh

1 1 1 0 1 1 0 1 DIMM Configuration/Population Error

EFh

1 1 1 0 1 1 1 1 Indicates a CLTT table structure error

B0h

1 0 1 1 0 0 0 0 Detect DIMM population

B1h

1 0 1 1 0 0 0 1 Set DDR4 frequency

B2h

1 0 1 1 0 0 1 0 Gather remaining SPD data

B3h

1 0 1 1 0 0 1 1 Program registers on the memory controller level

B4h

1 0 1 1 0 1 0 0 Evaluate RAS modes and save rank information

B5h

1 0 1 1 0 1 0 1 Program registers on the channel level

B6h

1 0 1 1 0 1 1 0 Perform the JEDEC defined initialization sequence

B7h

1 0 1 1 0 1 1 1 Train DDR4 ranks

B8h

1 0 1 1 1 0 0 0 Initialize CLTT/OLTT

B9h

1 0 1 1 1 0 0 1 Hardware memory test and init

BAh

1 0 1 1 1 0 1 0 Execute software memory init

BBh

1 0 1 1 1 0 1 1 Program memory map and interleaving

BCh

1 0 1 1 1 1 0 0 Program RAS configuration

BFh

1 0 1 1 1 1 1 1 MRC is done

Intel® Server System S9200WK Product Family Setup and Service Guide

90

Appendix E. POST Code Errors

Most error conditions encountered during POST are reported using POST Error Codes. These codes
represent specific failures, warnings, or are informational. POST Error Codes may be displayed in the Error
Manager Display screen, and are always logged to the System Event Log (SEL). Logged events are available to
System Management applications, including Remote and Out of Band (OOB) management.

There are exception cases in early initialization where system resources are not adequately initialized for
handling POST Error Code reporting. These cases are primarily Fatal Error conditions resulting from
initialization of processors and memory, and they are handed by a Diagnostic LED display with a system halt.

The following table lists the supported POST Error Codes. Each error code is assigned an error type which
determines the action the BIOS will take when the error is encountered. Error types include Minor, Major, and
Fatal. The BIOS action for each is defined as follows:

▪ Minor: The error message is displayed on the screen or on the Error Manager screen, and an error is
logged to the SEL. The system continues booting in a degraded state. The user may want to replace the
erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect on this error.
▪ Major: The error message is displayed on the Error Manager screen, and an error is logged to the SEL.
The POST Error Pause option setting in the BIOS setup determines whether the system pauses to the Error
Manager for this type of error so the user can take immediate corrective action or the system continues
booting.

Note that for 0048 “Password check failed”, the system halts, and then after the next reset/reboot will
display the error code on the Error Manager screen.

▪ Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error found.
System will not boot until the error is resolved” and “Press <F2> to enter setup”. The POST Error Pause
option setting in the BIOS setup does not have any effect with this class of error.

When the operator presses the F2 key on the keyboard, the error message is displayed on the Error Manager
screen, and an error is logged to the SEL with the error code. The system cannot boot unless the error is
resolved. The user needs to replace the faulty part and restart the system.

Table 6. POST Error Codes and Messages

Error Code

Error Message

Action message

Response

0012

System RTC date/time not set

Major

0048

Password check failed

Please put right password.

Major

0140

PCI component encountered a PERR error

Major

0141

PCI resource conflict

Major

0146

PCI out of resources error

Please enable Memory Mapped I/O
above 4 GB item at SETUP to use
64bit MMIO.

Major

0191

Processor core/thread count mismatch detected

Please use identical CPU type.

Fatal

0192

Processor cache size mismatch detected

Please use identical CPU type.

Fatal

0194

Processor family mismatch detected

Please use identical CPU type.

Fatal

0195

Processor Intel(R) UPI link frequencies unable to
synchronize

Fatal
0196

Processor model mismatch detected

Please use identical CPU type.

Fatal

0197

Processor frequencies unable to synchronize

Please use identical CPU type.

Fatal

5220

BIOS Settings reset to default settings

Major

5221

Passwords cleared by jumper

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

91

Error Code

Error Message

Action message

Response

5224

Password clear jumper is Set

Recommend to remind user to install
BIOS password as BIOS admin
password is the master keys for
several BIOS security features.

Major

8130

Processor 01 Die 0 disabled

Major

8131

Processor 01 Die 1 disabled

Major

8132

Processor 02 Die 0 disabled

Major

8133

Processor 02 Die 1 disabled

Major

8160

Processor 01 Die 0 unable to apply microcode update

Major

8161

Processor 01 Die 1 unable to apply microcode update

Major

8162

Processor 02 Die 0 unable to apply microcode update

Major

8163

Processor 02 Die 1 unable to apply microcode update

Major

8170

Processor 01 Die 0 failed Self Test (BIST)

Major

8171

Processor 01 Die 1 failed Self Test (BIST)

Major

8172

Processor 02 Die 0 failed Self Test (BIST)

Major

8173

Processor 02 Die 1 failed Self Test (BIST)

Major

8180

Processor 01 Die 0 microcode update not found

Minor

8181

Processor 01 Die 1 microcode update not found

Minor

8182

Processor 02 Die 0 microcode update not found

Minor

8183

Processor 02 Die 1 microcode update not found

Minor

8190

Watchdog timer failed on last boot.

Major

8198

OS boot watchdog timer failure.

Major

8300

Baseboard Management Controller failed self test.

Major

8305

Hot Swap Controller failure

Major

83A0

Management Engine (ME) failed self test.

Major

83A1

Management Engine (ME) Failed to respond.

Major

84F2

Baseboard management controller failed to respond

Major

84F3

Baseboard Management Controller in Update Mode.

Major

84F4

Baseboard Management Controller Sensor Data Record
empty.

Please update right SDR.

Major

84FF

System Event Log full

Please clear SEL through EWS or
SELVIEW utility.

Minor

85FC

Memory component could not be configured in the
selected RAS mode

Major
8501

Memory Population Error

Please plug DIMM at right population.

Major

8520

Memory failed test/initialization CPU0_0_DIMM_A1

please remove the disabled DIMM.

Major

8521

Memory failed test/initialization CPU0_0_DIMM_A2

please remove the disabled DIMM.

Major

8522

Memory failed test/initialization CPU0_0_DIMM_A3

please remove the disabled DIMM.

Major

8523

Memory failed test/initialization CPU0_0_DIMM_B1

please remove the disabled DIMM.

Major

8524

Memory failed test/initialization CPU0_0_DIMM_B2

please remove the disabled DIMM.

Major

8525

Memory failed test/initialization CPU0_0_DIMM_B3

please remove the disabled DIMM.

Major

8526

Memory failed test/initialization CPU0_0_DIMM_C1

please remove the disabled DIMM.

Major

8527

Memory failed test/initialization CPU0_0_DIMM_C2

please remove the disabled DIMM.

Major

8528

Memory failed test/initialization CPU0_0_DIMM_C3

please remove the disabled DIMM.

Major

8529

Memory failed test/initialization CPU0_0_DIMM_D1

please remove the disabled DIMM.

Major

852A

Memory failed test/initialization CPU0_0_DIMM_D2

please remove the disabled DIMM.

Major

852B

Memory failed test/initialization CPU0_0_DIMM_D3

please remove the disabled DIMM.

Major

852C

Memory failed test/initialization CPU0_0_DIMM_E1

please remove the disabled DIMM.

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

92

Error Code

Error Message

Action message

Response

852D

Memory failed test/initialization CPU0_0_DIMM_E2

please remove the disabled DIMM.

Major

852E

Memory failed test/initialization CPU0_0_DIMM_E3

please remove the disabled DIMM.

Major

852F

Memory failed test/initialization CPU0_0_DIMM_F1

please remove the disabled DIMM.

Major

8530

Memory failed test/initialization CPU0_0_DIMM_F2

please remove the disabled DIMM.

Major

8531

Memory failed test/initialization CPU0_0_DIMM_F3

please remove the disabled DIMM.

Major

8532

Memory failed test/initialization CPU0_0_DIMM_G1

please remove the disabled DIMM.

Major

8533

Memory failed test/initialization CPU0_0_DIMM_G2

please remove the disabled DIMM.

Major

8534

Memory failed test/initialization CPU0_0_DIMM_G3

please remove the disabled DIMM.

Major

8535

Memory failed test/initialization CPU0_0_DIMM_H1

please remove the disabled DIMM.

Major

8536

Memory failed test/initialization CPU0_0_DIMM_H2

please remove the disabled DIMM.

Major

8537

Memory failed test/initialization CPU0_0_DIMM_H3

please remove the disabled DIMM.

Major

8538

Memory failed test/initialization CPU0_1_DIMM_A1

please remove the disabled DIMM.

Major

8539

Memory failed test/initialization CPU0_1_DIMM_A2

please remove the disabled DIMM.

Major

853A

Memory failed test/initialization CPU0_1_DIMM_A3

please remove the disabled DIMM.

Major

853B

Memory failed test/initialization CPU0_1_DIMM_B1

please remove the disabled DIMM.

Major

853C

Memory failed test/initialization CPU0_1_DIMM_B2

please remove the disabled DIMM.

Major

853D

Memory failed test/initialization CPU0_1_DIMM_B3

please remove the disabled DIMM.

Major

853E

Memory failed test/initialization CPU0_1_DIMM_C1

please remove the disabled DIMM.

Major

853F
(Go to 85C0)

Memory failed test/initialization CPU0_1_DIMM_C2

please remove the disabled DIMM.

Major
8540

Memory disabled.CPU0_0_DIMM_A1

please remove the disabled DIMM.

Major

8541

Memory disabled.CPU0_0_DIMM_A2

please remove the disabled DIMM.

Major

8542

Memory disabled.CPU0_0_DIMM_A3

please remove the disabled DIMM.

Major

8543

Memory disabled.CPU0_0_DIMM_B1

please remove the disabled DIMM.

Major

8544

Memory disabled.CPU0_0_DIMM_B2

please remove the disabled DIMM.

Major

8545

Memory disabled.CPU0_0_DIMM_B3

please remove the disabled DIMM.

Major

8546

Memory disabled.CPU0_0_DIMM_C1

please remove the disabled DIMM.

Major

8547

Memory disabled.CPU0_0_DIMM_C2

please remove the disabled DIMM.

Major

8548

Memory disabled.CPU0_0_DIMM_C3

please remove the disabled DIMM.

Major

8549

Memory disabled.CPU0_0_DIMM_D1

please remove the disabled DIMM.

Major

854A

Memory disabled.CPU0_0_DIMM_D2

please remove the disabled DIMM.

Major

854B

Memory disabled.CPU0_0_DIMM_D3

please remove the disabled DIMM.

Major

854C

Memory disabled.CPU0_0_DIMM_E1

please remove the disabled DIMM.

Major

854D

Memory disabled.CPU0_0_DIMM_E2

please remove the disabled DIMM.

Major

854E

Memory disabled.CPU0_0_DIMM_E3

please remove the disabled DIMM.

Major

854F

Memory disabled.CPU0_0_DIMM_F1

please remove the disabled DIMM.

Major

8550

Memory disabled.CPU0_0_DIMM_F2

please remove the disabled DIMM.

Major

8551

Memory disabled.CPU0_0_DIMM_F3

please remove the disabled DIMM.

Major

8552

Memory disabled.CPU0_0_DIMM_G1

please remove the disabled DIMM.

Major

8553

Memory disabled.CPU0_0_DIMM_G2

please remove the disabled DIMM.

Major

8554

Memory disabled.CPU0_0_DIMM_G3

please remove the disabled DIMM.

Major

8555

Memory disabled.CPU0_0_DIMM_H1

please remove the disabled DIMM.

Major

8556

Memory disabled.CPU0_0_DIMM_H2

please remove the disabled DIMM.

Major

8557

Memory disabled.CPU0_0_DIMM_H3

please remove the disabled DIMM.

Major

8558

Memory disabled.CPU0_1_DIMM_A1

please remove the disabled DIMM.

Major

8559

Memory disabled.CPU0_1_DIMM_A2

please remove the disabled DIMM.

Major

855A

Memory disabled.CPU0_1_DIMM_A3

please remove the disabled DIMM.

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

93

Error Code

Error Message

Action message

Response

855B

Memory disabled.CPU0_1_DIMM_B1

please remove the disabled DIMM.

Major

855C

Memory disabled.CPU0_1_DIMM_B2

please remove the disabled DIMM.

Major

855D

Memory disabled.CPU0_1_DIMM_B3

please remove the disabled DIMM.

Major

855E

Memory disabled.CPU0_1_DIMM_C1

please remove the disabled DIMM.

Major

855F
(Go to 85D0)

Memory disabled.CPU0_1_DIMM_C2

please remove the disabled DIMM.

Major

8560

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_A1

Major

8561

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_A2

Major

8562

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_A3

Major

8563

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_B1

Major

8564

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_B2

Major

8565

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_B3

Major

8566

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_C1

Major

8567

Memory encountered a Serial Presence Detection (SPD)
failure.CPU0_0_DIMM_C2

Major

8568

Memory encountered a Serial Presence Detection (SPD)
failure.CPU0_0_DIMM_C3

Major

8569

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_D1

Major

856A

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_D2

Major

856B

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_D3

Major

856C

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_E1

Major

856D

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_E2

Major

856E

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_E3

Major

856F

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_F1

Major

8570

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_F2

Major

8571

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_F3

Major

8572

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_G1

Major

8573

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_G2

Major

8574

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_G3

Major

8575

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_H1

Major

8576

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_H2

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

94

Error Code

Error Message

Action message

Response

8577

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_0_DIMM_H3

Major

8578

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_A1

Major

8579

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_A2

Major

857A

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_A3

Major

857B

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_B1

Major

857C

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_B2

Major

857D

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_B3

Major

857E

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_C1

Major

857F
(Go to 85E0)

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_C2

Major
85C0

Memory failed test/initialization CPU0_1_DIMM_C3

please remove the disabled DIMM.

Major

85C1

Memory failed test/initialization CPU0_1_DIMM_D1

please remove the disabled DIMM.

Major

85C2

Memory failed test/initialization CPU0_1_DIMM_D2

please remove the disabled DIMM.

Major

85C3

Memory failed test/initialization CPU0_1_DIMM_D3

please remove the disabled DIMM.

Major

85C4

Memory failed test/initialization CPU0_1_DIMM_E1

please remove the disabled DIMM.

Major

85C5

Memory failed test/initialization CPU0_1_DIMM_E2

please remove the disabled DIMM.

Major

85C6

Memory failed test/initialization CPU0_1_DIMM_E3

please remove the disabled DIMM.

Major

85C7

Memory failed test/initialization CPU0_1_DIMM_F1

please remove the disabled DIMM.

Major

85C8

Memory failed test/initialization CPU0_1_DIMM_F2

please remove the disabled DIMM.

Major

85C9

Memory failed test/initialization CPU0_1_DIMM_F3

please remove the disabled DIMM.

Major

85CA

Memory failed test/initialization CPU0_1_DIMM_G1

please remove the disabled DIMM.

Major

85CB

Memory failed test/initialization CPU0_1_DIMM_G2

please remove the disabled DIMM.

Major

85CC

Memory failed test/initialization CPU0_1_DIMM_G3

please remove the disabled DIMM.

Major

85CD

Memory failed test/initialization CPU0_1_DIMM_H1

please remove the disabled DIMM.

Major

85CE

Memory failed test/initialization CPU0_1_DIMM_H2

please remove the disabled DIMM.

Major

85CF

Memory failed test/initialization CPU0_1_DIMM_H3

please remove the disabled DIMM.

Major

85D0

Memory disabled.CPU0_1_DIMM_C3

please remove the disabled DIMM.

Major

85D1

Memory disabled.CPU0_1_DIMM_D1

please remove the disabled DIMM.

Major

85D2

Memory disabled.CPU0_1_DIMM_D2

please remove the disabled DIMM.

Major

85D3

Memory disabled.CPU0_1_DIMM_D3

please remove the disabled DIMM.

Major

85D4

Memory disabled.CPU0_1_DIMM_E1

please remove the disabled DIMM.

Major

85D5

Memory disabled.CPU0_1_DIMM_E2

please remove the disabled DIMM.

Major

85D6

Memory disabled.CPU0_1_DIMM_E3

please remove the disabled DIMM.

Major

85D7

Memory disabled.CPU0_1_DIMM_F1

please remove the disabled DIMM.

Major

85D8

Memory disabled.CPU0_1_DIMM_F2

please remove the disabled DIMM.

Major

85D9

Memory disabled.CPU0_1_DIMM_F3

please remove the disabled DIMM.

Major

85DA

Memory disabled.CPU0_1_DIMM_G1

please remove the disabled DIMM.

Major

85DB

Memory disabled.CPU0_1_DIMM_G2

please remove the disabled DIMM.

Major

85DC

Memory disabled.CPU0_1_DIMM_G3

please remove the disabled DIMM.

Major

85DD

Memory disabled.CPU0_1_DIMM_H1

please remove the disabled DIMM.

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

95

Error Code

Error Message

Action message

Response

85DE

Memory disabled.CPU0_1_DIMM_H2

please remove the disabled DIMM.

Major

85DF

Memory disabled.CPU0_1_DIMM_H3

please remove the disabled DIMM.

Major

85E0

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_C3

Major

85E1

Memory encountered a Serial Presence Detection (SPD)
failure. CPU0_1_DIMM_D1

Major

85E2

Memory encountered a Serial Presence Detection (SPD)
failure.CPU0_1_DIMM_D2

Major

85E3

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_D3

Major

85E4

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_E1

Major

85E5

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_E2

Major

85E6

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_E3

Major

85E7

Memory encountered a Serial Presence Detection (SPD)
failure.CPU0_1_DIMM_F1

Major

85E8

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_F2

Major

85E9

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_F3

Major

85EA

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_G1

Major

85EB

Memory encountered a Serial Presence Detection(SPD)
failure. CPU0_1_DIMM_G2

Major

85EC

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_G3

Major

85ED

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_H1

Major

85EE

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_H2

Major

85EF

Memory encountered a Serial Presence Detection(SPD)
failure.CPU0_1_DIMM_H3

Major
8604

POST Reclaim of non-critical NVRAM variables

Minor

8605

BIOS Settings are corrupted

Major

8606

NVRAM variable space was corrupted and has been
reinitialized

Major

8607

Recovery boot has been initiated.
Note: The Primary BIOS image may be corrupted or the
system may hang during POST. A BIOS update is required.

Fatal

9500

Memory disabled.CPU1_0_DIMM_A1

please remove the disabled DIMM.

Major

9501

Memory disabled.CPU1_0_DIMM_A2

please remove the disabled DIMM.

Major

9502

Memory disabled.CPU1_0_DIMM_A3

please remove the disabled DIMM.

Major

9503

Memory disabled.CPU1_0_DIMM_B1

please remove the disabled DIMM.

Major

9504

Memory disabled.CPU1_0_DIMM_B2

please remove the disabled DIMM.

Major

9505

Memory disabled.CPU1_0_DIMM_B3

please remove the disabled DIMM.

Major

9506

Memory disabled.CPU1_0_DIMM_C1

please remove the disabled DIMM.

Major

9507

Memory disabled.CPU1_0_DIMM_C2

please remove the disabled DIMM.

Major

9508

Memory disabled.CPU1_0_DIMM_C3

please remove the disabled DIMM.

Major

9509

Memory disabled.CPU1_0_DIMM_D1

please remove the disabled DIMM.

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

96

Error Code

Error Message

Action message

Response

950A

Memory disabled.CPU1_0_DIMM_D2

please remove the disabled DIMM.

Major

950B

Memory disabled.CPU1_0_DIMM_D3

please remove the disabled DIMM.

Major

950C

Memory disabled.CPU1_0_DIMM_E1

please remove the disabled DIMM.

Major

950D

Memory disabled.CPU1_0_DIMM_E2

please remove the disabled DIMM.

Major

950E

Memory disabled.CPU1_0_DIMM_E3

please remove the disabled DIMM.

Major

950F

Memory disabled.CPU1_0_DIMM_F1

please remove the disabled DIMM.

Major

9510

Memory disabled.CPU1_0_DIMM_F2

please remove the disabled DIMM.

Major

9511

Memory disabled.CPU1_0_DIMM_F3

please remove the disabled DIMM.

Major

9512

Memory disabled.CPU1_0_DIMM_G1

please remove the disabled DIMM.

Major

9513

Memory disabled.CPU1_0_DIMM_G2

please remove the disabled DIMM.

Major

9514

Memory disabled.CPU1_0_DIMM_G3

please remove the disabled DIMM.

Major

9515

Memory disabled.CPU1_0_DIMM_H1

please remove the disabled DIMM.

Major

9516

Memory disabled.CPU1_0_DIMM_H2

please remove the disabled DIMM.

Major

9517

Memory disabled.CPU1_0_DIMM_H3

please remove the disabled DIMM.

Major

9518

Memory disabled.CPU1_1_DIMM_A1

please remove the disabled DIMM.

Major

9519

Memory disabled.CPU1_1_DIMM_A2

please remove the disabled DIMM.

Major

951A

Memory disabled.CPU1_1_DIMM_A3

please remove the disabled DIMM.

Major

951B

Memory disabled.CPU1_1_DIMM_B1

please remove the disabled DIMM.

Major

951C

Memory disabled.CPU1_1_DIMM_B2

please remove the disabled DIMM.

Major

951D

Memory disabled.CPU1_1_DIMM_B3

please remove the disabled DIMM.

Major

951E

Memory disabled.CPU1_1_DIMM_C1

please remove the disabled DIMM.

Major

951F

Memory disabled.CPU1_1_DIMM_C2

please remove the disabled DIMM.

Major

9520

Memory disabled.CPU1_1_DIMM_C3

please remove the disabled DIMM.

Major

9521

Memory disabled.CPU1_1_DIMM_D1

please remove the disabled DIMM.

Major

9522

Memory disabled.CPU1_1_DIMM_D2

please remove the disabled DIMM.

Major

9523

Memory disabled.CPU1_1_DIMM_D3

please remove the disabled DIMM.

Major

9524

Memory disabled.CPU1_1_DIMM_E1

please remove the disabled DIMM.

Major

9525

Memory disabled.CPU1_1_DIMM_E2

please remove the disabled DIMM.

Major

9526

Memory disabled.CPU1_1_DIMM_E3

please remove the disabled DIMM.

Major

9527

Memory disabled.CPU1_1_DIMM_F1

please remove the disabled DIMM.

Major

9528

Memory disabled.CPU1_1_DIMM_F2

please remove the disabled DIMM.

Major

9529

Memory disabled.CPU1_1_DIMM_F3

please remove the disabled DIMM.

Major

952A

Memory disabled.CPU1_1_DIMM_G1

please remove the disabled DIMM.

Major

952B

Memory disabled.CPU1_1_DIMM_G2

please remove the disabled DIMM.

Major

952C

Memory disabled.CPU1_1_DIMM_G3

please remove the disabled DIMM.

Major

952D

Memory disabled.CPU1_1_DIMM_H1

please remove the disabled DIMM.

Major

952E

Memory disabled.CPU1_1_DIMM_H2

please remove the disabled DIMM.

Major

952F

Memory disabled.CPU1_1_DIMM_H3

please remove the disabled DIMM.

Major

9530

Memory failed test/initialization CPU1_0_DIMM_A1

please remove the disabled DIMM.

Major

9531

Memory failed test/initialization CPU1_0_DIMM_A2

please remove the disabled DIMM.

Major

9532

Memory failed test/initialization CPU1_0_DIMM_A3

please remove the disabled DIMM.

Major

9533

Memory failed test/initialization CPU1_0_DIMM_B1

please remove the disabled DIMM.

Major

9534

Memory failed test/initialization CPU1_0_DIMM_B2

please remove the disabled DIMM.

Major

9535

Memory failed test/initialization CPU1_0_DIMM_B3

please remove the disabled DIMM.

Major

9536

Memory failed test/initialization CPU1_0_DIMM_C1

please remove the disabled DIMM.

Major

9537

Memory failed test/initialization CPU1_0_DIMM_C2

please remove the disabled DIMM.

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

97

Error Code

Error Message

Action message

Response

9538

Memory failed test/initialization CPU1_0_DIMM_C3

please remove the disabled DIMM.

Major

9539

Memory failed test/initialization CPU1_0_DIMM_D1

please remove the disabled DIMM.

Major

953A

Memory failed test/initialization CPU1_0_DIMM_D2

please remove the disabled DIMM.

Major

953B

Memory failed test/initialization CPU1_0_DIMM_D3

please remove the disabled DIMM.

Major

953C

Memory failed test/initialization CPU1_0_DIMM_E1

please remove the disabled DIMM.

Major

953D

Memory failed test/initialization CPU1_0_DIMM_E2

please remove the disabled DIMM.

Major

953E

Memory failed test/initialization CPU1_0_DIMM_E3

please remove the disabled DIMM.

Major

953F

Memory failed test/initialization CPU1_0_DIMM_F1

please remove the disabled DIMM.

Major

9540

Memory failed test/initialization CPU1_0_DIMM_F2

please remove the disabled DIMM.

Major

9541

Memory failed test/initialization CPU1_0_DIMM_F3

please remove the disabled DIMM.

Major

9542

Memory failed test/initialization CPU1_0_DIMM_G1

please remove the disabled DIMM.

Major

9543

Memory failed test/initialization CPU1_0_DIMM_G2

please remove the disabled DIMM.

Major

9544

Memory failed test/initialization CPU1_0_DIMM_G3

please remove the disabled DIMM.

Major

9545

Memory failed test/initialization CPU1_0_DIMM_H1

please remove the disabled DIMM.

Major

9546

Memory failed test/initialization CPU1_0_DIMM_H2

please remove the disabled DIMM.

Major

9547

Memory failed test/initialization CPU1_0_DIMM_H3

please remove the disabled DIMM.

Major

9548

Memory failed test/initialization CPU1_1_DIMM_A1

please remove the disabled DIMM.

Major

9549

Memory failed test/initialization CPU1_1_DIMM_A2

please remove the disabled DIMM.

Major

954A

Memory failed test/initialization CPU1_1_DIMM_A3

please remove the disabled DIMM.

Major

954B

Memory failed test/initialization CPU1_1_DIMM_B1

please remove the disabled DIMM.

Major

954C

Memory failed test/initialization CPU1_1_DIMM_B2

please remove the disabled DIMM.

Major

954D

Memory failed test/initialization CPU1_1_DIMM_B3

please remove the disabled DIMM.

Major

954E

Memory failed test/initialization CPU1_1_DIMM_C1

please remove the disabled DIMM.

Major

954F

Memory failed test/initialization CPU1_1_DIMM_C2

please remove the disabled DIMM.

Major

9550

Memory failed test/initialization CPU1_1_DIMM_C3

please remove the disabled DIMM.

Major

9551

Memory failed test/initialization CPU1_1_DIMM_D1

please remove the disabled DIMM.

Major

9552

Memory failed test/initialization CPU1_1_DIMM_D2

please remove the disabled DIMM.

Major

9553

Memory failed test/initialization CPU1_1_DIMM_D3

please remove the disabled DIMM.

Major

9554

Memory failed test/initialization CPU1_1_DIMM_E1

please remove the disabled DIMM.

Major

9555

Memory failed test/initialization CPU1_1_DIMM_E2

please remove the disabled DIMM.

Major

9556

Memory failed test/initialization CPU1_1_DIMM_E3

please remove the disabled DIMM.

Major

9557

Memory failed test/initialization CPU1_1_DIMM_F1

please remove the disabled DIMM.

Major

9558

Memory failed test/initialization CPU1_1_DIMM_F2

please remove the disabled DIMM.

Major

9559

Memory failed test/initialization CPU1_1_DIMM_F3

please remove the disabled DIMM.

Major

955A

Memory failed test/initialization CPU1_1_DIMM_G1

please remove the disabled DIMM.

Major

955B

Memory failed test/initialization CPU1_1_DIMM_G2

please remove the disabled DIMM.

Major

955C

Memory failed test/initialization CPU1_1_DIMM_G3

please remove the disabled DIMM.

Major

955D

Memory failed test/initialization CPU1_1_DIMM_H1

please remove the disabled DIMM.

Major

955E

Memory failed test/initialization CPU1_1_DIMM_H2

please remove the disabled DIMM.

Major

955F

Memory failed test/initialization CPU1_1_DIMM_H3

please remove the disabled DIMM.

Major

9560

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_A1

Major

9561

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_A2

Major

9562

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_A3

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

98

Error Code

Error Message

Action message

Response

9563

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_B1

Major

9564

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_B2

Major

9565

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_B3

Major

9566

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_C1

Major

9567

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_C2

Major

9568

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_C3

Major

9569

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_D1

Major

956A

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_D2

Major

956B

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_D3

Major

956C

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_E1

Major

956D

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_E2

Major

956E

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_E3

Major

956F

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_F1

Major

9570

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_F2

Major

9571

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_F3

Major

9572

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_G1

Major

9573

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_G2

Major

9574

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_G3

Major

9575

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_H1

Major

9576

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_H2

Major

9577

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_0_DIMM_H3

Major

9578

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_A1

Major

9579

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_A2

Major

957A

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_A3

Major

957B

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_B1

Major

957C

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_B2

Major

Intel® Server System S9200WK Product Family Setup and Service Guide

99

Error Code

Error Message

Action message

Response

957D

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_B3

Major

957E

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_C1

Major

957F

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_C2

Major

9580

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_C3

Major

9581

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_D1

Major

9582

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_D2

Major

9583

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_D3

Major

9584

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_E1

Major

9585

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_E2

Major

9586

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_E3

Major

9587

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_F1

Major

9588

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_F2

Major

9589

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_F3

Major

958A

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_G1

Major

958B

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_G2

Major

958C

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_G3

Major

958D

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_H1

Major

958E

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_H2

Major

958F

Memory encountered a Serial Presence Detection(SPD)
failure. CPU1_1_DIMM_H3

Major
A100

BIOS ACM Error

Major

A421

PCI component encountered a SERR error

Fatal

A5A0

PCI Express component encountered a PERR error

Minor

A5A1

PCI Express component encountered an SERR error

Fatal

A6A0

DXE Boot Services driver: Not enough memory available to
shadow a Legacy Option ROM.

Please disable OpRom at SETUP to
save runtime memory.

Minor

Intel® Server System S9200WK Product Family Setup and Service Guide

100

Appendix F. Safety Instructions

WARNING: English (US)

The power supply in this product contains no user-serviceable parts. There may be more
than one supply in this product. Refer servicing only to qualified personnel.

Do not attempt to modify or use the supplied AC power cord if it is not the exact type
required. A product with more than one power supply will have a separate AC power cord
for each supply.

The power button on the system does not turn off system AC power. To remove AC
power from the system, you must unplug each AC power cord from the wall outlet or
power supply.

The power cord(s) is considered the disconnect device to the main (AC) power. The
socket outlet that the system plugs into shall be installed near the equipment and shall
be easily accessible.

SAFETY STEPS: Whenever you remove the chassis covers to access the inside of the
system, follow these steps:

1. Turn off all peripheral devices connected to the system.

2. Turn off the system by pressing the power button.

3. Unplug all AC power cords from the system or from wall outlets.

4. Label and disconnect all cables connected to I/O connectors or ports on the back of

the system.

5. Provide some electrostatic discharge (ESD) protection by wearing an antistatic wrist

strap attached to chassis ground of the system—any unpainted metal surface—when
handling components.

6. Do not operate the system with the chassis covers removed.

After you have completed the six SAFETY steps above, you can remove the system
covers. To do this:

1. Unlock and remove the padlock from the back of the system if a padlock has been

installed.

2. Remove and save all screws from the covers.

3. Remove the covers.