Intel® G35 Express Chipset
Thermal and Mechanical Design Guidelines
— For the Intel® 82G35 Graphics and Memory Controller Hub
(GMCH)
August 2007
Document Number: 317609-001
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended
for use in medical, life saving , or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Intel 82G35 Graphics and Memory Controller Hub (GMCH) may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product o rder.
Intel, Pentium, and the Intel logo are trademarks or regist ered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.
2 Thermal and Mechanical Design Guidelines
Contents
1 Introduction.....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9
2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Definition...............................................................................13
2.4.2 Methodology...........................................................................14
2.4.3 Specifications .........................................................................14
2.4.4 T
2.5 Non-Critical to Function Solder Balls........................................................15
Limit..........................................................................14
CONTROL
3 Thermal Metrology..........................................................................................17
3.1 Case Temperature Measurements...........................................................17
3.1.1 Thermocouple Attach Methodology.............................................17
3.2 Airflow Characterization ........................................................................19
4 Reference Thermal Solution..............................................................................21
4.1 Operating Environment .........................................................................21
4.1.1 ATX Form Factor Operating Environment ....................................21
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................
4.2 Reference Design Mechanical Envelope....................................................23
4.3 Thermal Solution Assembly....................................................................23
4.4 Environmental Reliability Requirements...................................................25
Appendix A Enabled Suppliers ...........................................................................................27
Appendix B Mechanical Drawings.......................................................................................29
22
Thermal and Mechanical Design Guidelines 3
Figures
Figure 1. GMCH Non-Grid Array ........................................................................12
Figure 2. Nominal Package Height ....................................................................13
Figure 3. Non-Critical to Function Solder Balls.....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale) ......................................................
Figure 6. Airflow andTemperature Measurement Locations....................................19
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on an ATX Platform ............................................................................
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on a Balanced Technology Extended (BTX) Platform................................
Figure 9. ATX GMCH Heatsink - Installed on Board...............................................24
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board25
Figure 11. GMCH Package Drawing....................................................................30
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms.....................................31
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX)
Platforms........................................................................................
Figure 14. GMCH Reference Heatsink for ATX Platforms – Sheet 1..........................33
Figure 15. GMCH Reference Heatsink for ATX Platforms – Sheet 2..........................34
Figure 16. GMCH Heatsink for ATX Platforms – Anchor .........................................35
Figure 17. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ....36
Figure 18. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ....37
Figure 19. GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip.............38
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms .......................................................................................
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ..............................................................................
18
22
23
32
39
40
Tables
Table 1. Package Loading Specifications............................................................12
Table 2. Thermal Specifications.......................................................................14
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) ...................................................................................
Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level) ..........................
Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel® G35
Express Chipset ................................................................................
Table 6. Balanced Technology Extended (BTX) Intel® Reference Heatsink
Enabled Suppliers for Intel
Table 7. Supplier Contact Information ..............................................................28
4 Thermal and Mechanical Design Guidelines
®
G35 Express Chipset ..................................27
25
26
27
Revision History
Revision
Number
-001 • Initial release. August 2007
Description Date
§
Thermal and Mechanical Design Guidelines 5
6 Thermal and Mechanical Design Guidelines
Introduction
1 Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component.
This document is for the following device:
®
• Intel
G35 Express Chipset GMCH (82G35 GMCH)
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the GMCH. Properly designed solutions provide
adequate cooling to maintain the GMCH case temperature at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the case to local-ambient thermal
resistance. By maintaining the GMCH case temperature at or below those
recommended in this document, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note: Unless otherwise specified the information in this document applies to all
configurations of the Intel
®
G35 Express Chipset. The Intel® G35 Express Chipset will
be available with integrated graphics and associated SDVO and analog display ports.
The Intel® G35 Express Chipset is a Graphics Memory Controller Hub (GMCH) targeted
for use with the Intel
processor family in the LGA775 Land Grid Array Package and the Intel
®
Core™2 Duo processor family and Intel® Core™2 Quad
®
ICH8 in
desktop platforms.
Note: In this document the use of the term chipset refers to the combination of the GMCH
and the Intel ICH8. For the ICH8 thermal details, refer to the Intel
®
I/O Controller Hub
8 (ICH8) Thermal Design Guidelines.
Thermal and Mechanical Design Guidelines 7
1.1 Terminology
Term Description
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel® ICH8 Intel® I/O Controller Hub 8. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
GMCH Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics core.
TA The local ambient air temperature at the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive
heatsink or at the fan inlet for an active heatsink.
TC The case temperature of the GMCH component. The measurement is made at
the geometric center of the die.
Introduction
T
The maximum value of T
C-MAX
T
The minimum valued of T
C-MIN
TDP Thermal Design Power is specified as the maximum sustainable power to be
dissipated by the GMCH. This is based on extrapolations in both hardware and
software technology. Thermal solutions should be designed to TDP.
TIM Thermal Interface Material: thermally conductive material installed between
two surfaces to improve heat transfer and reduce interface contact resistance.
Ψ
Case-to-ambient thermal solution characterization parameter (Psi). A measure
CA
of thermal solution performance using total package power. Defined as
– TA) / Total Package Power. Heat source size should always be specified for
(T
C
Ψ measurements.
.
C
.
C
8 Thermal and Mechanical Design Guidelines
Introduction
1.2 Reference Documents
Document Location
Intel® G35 Express Chipset Datasheet http://www.intel.com/
Intel® I/O Controller Hub 8 (ICH8) Family Thermal Design Guidelines http://www.intel.com/
design/chipsets/datas
hts/317607.htm
design/chipsets/desig
nex/313058.htm
Intel® Core™2 Duo Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines
Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad
Processor Thermal and Mechanical Design Guidelines
Balanced Technology Extended (BTX) Interface Specification http://www.formfacto
Various System Thermal Design Suggestions http://www.formfacto
Various Chassis Thermal and Mechanical Design Suggestions http://www.formfacto
http://www.intel.com
/design/processor/spe
cupdt/313279.htm
http://www.intel.com
/design/processor/des
ignex/315594.htm
rs.org
rs.org
rs.org
§
Thermal and Mechanical Design Guidelines 9
Introduction
10 Thermal and Mechanical Design Guidelines
Product Specifications
2 Product Specifications
2.1 Package Description
The GMCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1226 solder balls. The die size is currently 11.83 mm
[0.466in] x 10.52 mm [0.414in] and is subject to change. A mechanical drawing of
the package is shown in
2.1.1 Non-Grid Array Package Ball Placement
The GMCH package uses a “balls anywhere” concept. Minimum ball pitch is 0.8 mm
[0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should
ensure correct ball placement when designing for the non-grid array pattern. For exact
ball locations relative to the package, contact your Intel Field Sales Representative.
Figure 11.
Thermal and Mechanical Design Guidelines 11
Figure 1. GMCH Non-Grid Array
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Product Specifications
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2.2 Package Loading Specifications
Table 1 provides static load specifications for the package. This mechanical maximum
load limit should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Also, any mechanical system or component testing should not
exceed the maximum limit. The package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal and mechanical solution.
Table 1. Package Loading Specifications
Parameter Maximum Notes
Static
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
package.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the package.
3. These specif ications are based on limited testing for design characterization. Loading limits
are for the package only.
12 Thermal and Mechanical Design Guidelines
15 lbf
1,2,3
Product Specifications
To ensure the package static load limit is not exceeded, the designer should
understand the post reflow package height. The following figure shows the nominal
post-reflow package height assumed for calculation of a heatsink clip preload of the
reference design. Refer to the package drawing in
analysis.
Figure 2. Nominal Package Height
Top of (G)MCH
Appendix B to perform a detailed
2.38 mm
Solder Ball
2.3 Thermal Specifications
To ensure proper operation and reliability of the GMCH, the temperature must be at or
below the maximum case temperature specified in
System and component level thermal enhancements are required to dissipate the heat
generated and maintain the GMCH within specifications. Chapter 0 provides the
thermal metrology guidelines for case temperature measurements.
The GMCH should also operate above the minimum case temperature specification
listed in
Table 2.
2.4 Thermal Design Power (TDP)
2.4.1 Definition
Thermal design power (TDP) is the estimated power dissipation of the GMCH based on
normal operating conditions including V
power intensive applications. This value is based on expected worst-case data traffic
patterns and usage of the chipset and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in GMCH current consumption due to silicon process variation, processor speed, DRAM
capacitive bus loading and temperature. However, since these variations are subject
to change, the TDP cannot guarantee that all applications will not exceed the TDP
value.
The system designer must design a thermal solution for the GMCH such that it
maintains T
the T
C-MAX
that the case temperature must be maintained at temperatures less than T
operating at power levels less than TDP. This temperature compliance is to ensure
component reliability over its useful life. The TDP value can be used for thermal design
if the thermal protection mechanisms are enabled. The GMCH incorporate a hardwarebased fail-safe mechanism to keep the product temperature in specification in the
event of unusually strenuous usage above the TDP power.
below T
C
specification is a requirement for a sustained power level equal to TDP, and
for a sustained power level equal to TDP. Please note that
C-MAX
and T
CC
C-MAX
PCB
Table 2 when operating at TDP.
while executing real worst-case
C-MAX
when
Thermal and Mechanical Design Guidelines 13
2.4.2 Methodology
2.4.2.1 Pre-Silicon
To determine TDP for pre-silicon products in development, it is necessary to make
estimates based on analytical models. These models rely on knowledge of the past
GMCH power dissipation behavior along with knowledge of planned architectural and
process changes that may affect TDP. Knowledge of applications available today and
their ability to stress various aspects of the GMCH is also included in the model. The
projection for TDP assumes GMCH operation at T
for normal manufacturing process variation.
2.4.2.2 Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.
Product Specifications
. The TDP estimate also accounts
C-MAX
2.4.3 Specifications
The data in Table 2 is based on post-silicon power measurements of the GMCH. The
system configuration is: two (2) DIMMs per channel, DDR2, FSB operating at the top
speed allowed by the chipset with a processor operating at that system bus speed. FCBGA packages have poor heat transfer capability into the board and have minimal
thermal capability without thermal solutions. Intel requires that system designers plan
for an attached heatsink when using the GMCH.
Table 2. Thermal Specifications
Component System
Intel® 82G35 GMCH 1333 MHz 800 MHz 0 °C 97°C 11 W 28 W
NOTES:
1. Ther mal specifications assume an attached heatsink is present.
2. Max Idle Power is the worst case idle power in system booted to Windows* with no
background applications running.
3. When an external graphics card is installed in a system with the Intel
Chipset, the TDP for this part will drop to approximately 19 W. The GMCH will detect the
presence of the graphics card and disable the on-board graphics resulting in the lower
GMCH TDP.
2.4.4 T
CONTROL
Limit
Bus Speed
Memory
Frequency
T
MIN
T
C-
Max
C-MAX
Power
®
G35 Express
Idle
TDP
Value
Intel® Quiet System Technology (Intel® QST) monitors an embedded thermal sensor.
The maximum operating limit when monitoring this thermal sensor is T
CONTROL
. For the
GMCH this value has been defined as 95 °C. This value should be programmed into
the appropriate fields of Intel QST as the maximum sensor temperature for operation
of the Intel 82G35 GMCH.
14 Thermal and Mechanical Design Guidelines
Product Specifications
2.5 Non-Critical to Function Solder Balls
Intel has defined selected solder joints of the GMCH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The GMCH signals
at NCTF locations are typically redundant ground or non-critical reserved, so the loss
of the solder joint continuity at end of life conditions will not affect the overall product
functionality.
Figure 3. Non-Critical to Function Solder Balls
Figure 3 identifies the NCTF solder joints of the GMCH package.
13 957 11
13 957 11
13 957 11
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AD34
AC32
AC32
AC32
AC34
AC34
AC34
AC35
AC35
AC35
AC31
AC31
AC31
AC33
AC33
AC33
AA31
AA35
AA31
AA35
AA31
AA35
AA33
AA33
AA33
AA34
AA34
AA34
AA32
AA32
AA32
Y32
Y31
Y35
Y32
Y31
Y35
Y32
Y31
Y35
Y34Y33
Y34Y33
Y34Y33
V31
V31
V31
V32
V32
V32
V34
V33
V34
V33
V34
V33
V35
V35
V35
U31
U31
U31
U34
U33
U34
U33
U34
U33
U32
U35
U32
U35
U32
U35
R32
R31
R32
R31
R32
R31
R34
R33
R35
R34
R33
R35
R34
R33
R35
N32
N31
N32
N31
N32
N31
N34
N33
N35
N34
N33
N35
N34
N33
N35
M31
M31
M31
M33
M33
M33
M34
M35
M34
M35
M34
M35
L32
L32
L32
L31
L31
L31
L33
L33
L33
L35
L35
L35
K32
K32
K32
K31
K31
K31
J32
J32
J32
J31
J31
J31
J33
J33
J33
J35
J35
J35
H32
H32
H32
H33
H33
H33
H31
H31
H31
G32
G32
G32
G33
G33
G33
G31
G35
G31
G35
G31
G35
F32
F32
F32
F33
F33
F33
F31
F35
F31
F35
F31
F35
E32
E32
E32
E33
E33
E33
E31
E35
E31
E35
E31
E35
D33
D33
D33
D31
D31
D31
D32
D32
D32
C30
C30
C30
C34
C34
C34
C33
C33
C33
C31
C31
C31
B32
B32
B32
B30
B34
B30
B34
B30
B34
B33
B33
B33
B31
B31
B31
A32
A32
A32
A30
A34
A30
A34
A30
A34
33 35
33 35
33 35
3230
34
3230
34
3230
34
§
Thermal and Mechanical Design Guidelines 15
Product Specifications
16 Thermal and Mechanical Design Guidelines
Thermal Metrology
3 Thermal Metrology
The system designer must measure temperatures in order to accurately determine the
thermal performance of the system. Intel has established guidelines for proper
techniques of measuring GMCH component case temperatures.
3.1 Case Temperature Measurements
To ensure functionality and reliability of the GMCH the TC must be maintained at or
below the maximum temperature listed in
at the geometric center of the die corresponds to T
care to ensure an accurate temperature reading.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce error in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple bead and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, or contact between the thermocouple cement and the heatsink
base (if a heatsink is used). To minimize these measurement errors a thermocouple
attach with a zero-degree methodology is recommended.
Table 2. The surface temperature measured
. Measuring TC requires special
C
3.1.1 Thermocouple Attach Methodology
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole
to one edge of the heatsink. The slot should be in the direction parallel to the
heatsink fins (see
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead.
The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller K-type thermocouple bead to the center of the top
surface of the die using cement with high thermal conductivity. During this step,
make sure no contact is present between the thermocouple cement and the
heatsink base because any contact will affect the thermocouple reading. It is
critical that the thermocouple bead makes contact with the die (see
Figure 4).
6. Attach heatsink assembly to the GMCH, and route thermocouple wires out through
the milled slot.
Figure 5).
Thermal and Mechanical Design Guidelines 17
Thermal Metrology
Figure 4. 0° Angle Attach Methodology (top view, not to scale)
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)
18 Thermal and Mechanical Design Guidelines
Thermal Metrology
3.2 Airflow Characterization
Figure 6 shows the recommended location for air temperature measurements
measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.
Figure 6. Airflow andTemperature Measurement Locations
Airflow velocity can be measured using sensors that combine air velocity and
temperature measurements. Typical airflow sensor technology may include hot wire
anemometers.
which should be the same as used for temperature measurement. These locations are
for a typical JEDEC test setup and may not be compatible with chassis layouts due to
the proximity of the processor to the GMCH. The user may have to adjust the
locations for a specific chassis. Be aware that sensors may need to be aligned
perpendicular to the airflow velocity vector or an inaccurate measurement may result.
Measurements should be taken with the chassis fully sealed in its operational
configuration to achieve a representative airflow profile within the chassis.
Thermal and Mechanical Design Guidelines 19
Figure 6 provides guidance for airflow velocity measurement locations
§
Thermal Metrology
20 Thermal and Mechanical Design Guidelines
Reference Thermal Solution
4 Reference Thermal Solution
The design strategy for the reference component thermal solution for the Intel® G35
Express Chipset in ATX platforms reuses the ramp retainer, extrusion design and
anchors from the Intel
material and a wire preload clip are being redesigned to meet the Intel G35 Express
Chipset thermal requirements.
The Balanced Technology Extended (BTX) reference design for the Intel G35 Express
Chipset includes a new extrusion, clip with higher preload and a new thermal interface
material. A slightly larger motherboard keep out zone than used by the Intel 945G
Express Chipset thermal solution has been defined, see
This chapter provides detailed information on operating environment assumptions,
heatsink manufacturing, and mechanical reliability requirements for the GMCH.
®
945G Express Chipset thermal solution. The thermal interface
Figure 13.
4.1 Operating Environment
The operating environment of the GMCH will differ depending on system configuration
and motherboard layout. This section defines operating environment boundary
conditions that are typical for ATX and Balanced Technology Extended (BTX) form
factors. The system designer should perform analysis on platform operating
environment to assess impact to thermal solution selection.
4.1.1 ATX Form Factor Operating Environment
In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed be present
25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal
solution. The local ambient air temperature, T
platform is assumed to be 47 °C. The system integrator should note that board layout
may be such that there will not be 25 mm [1in] between the processor heatsink and
the GMCH. The potential for increased airflow speeds may be realized by ensuring that
airflow from the processor heatsink fan exhausts in the direction of the GMCH
heatsink. This can be achieved by using a heatsink providing omni directional airflow,
such as a radial fin or “X” pattern heatsink. Such heatsink can deliver airflow to both
the GMCH and other areas like the voltage regulator, as shown in
addition, GMCH board placement should ensure that the GMCH heatsink is within the
air exhaust area of the processor heatsink.
Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm]
airflow speed will be achieved. The system integrator should use analytical or
experimental means to determine whether a system design provides adequate airflow
speed for a particular GMCH heatsink.
, at the GMCH heatsink in an ATX
A
Figure 7. In
The thermal designer must carefully select the location to measure airflow to get a
representative sampling. ATX platforms need to be designed for the worst-case
thermal environment, typically assumed to be 35 °C ambient temperature external to
the system.
Thermal and Mechanical Design Guidelines 21
Reference Thermal Solution
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink on an
ATX Platform
Airflow Direction
GMCH Heatsink
GMCH Heatsink
Airflow Direction
Airflow Direction
Airflow Direction
Airflow Directi on
Airflow Directi on
Omni Directional Flow
Omni Directional Flow
Processor Heatsink
Processor Heatsink
(Fan not Shown)
(Fan not Shown)
Airflow Direction
Airflow Direction
TOP VIEW
TOP VIEW
Other methods exist for providing airflow to the GMCH heatsink, including the use of
system fans and/or ducting, or the use of an attached fan (active heatsink).
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment
This section provides operating environment conditions based on what has been
exhibited on the Intel micro-BTX reference design. On a BTX platform, the GMCH
obtains in-line airflow directly from the processor thermal module. Since the processor
thermal module provides lower inlet temperature airflow to the processor, reduced
inlet ambient temperatures are also often seen at the GMCH as compared to ATX. An
example of how airflow is delivered to the GMCH on a BTX platform is shown in
Figure 8.
The local ambient air temperature, TA, at the GMCH heatsink in the Intel micro-BTX
reference design is predicted to be ~45 °C. The thermal designer must carefully select
the location to measure airflow to get a representative sampling. These environmental
assumptions are based on a 35 °C system external temperature measured at sea
level.
Note: The local ambient air temperature is based on the power for a 2005 platform,
processor with a TDP up to 130 W.
Note: The risk of the solder ball fracture can be minimized with good chassis structure
design on a BTX platform, refer to the Balanced Technology Extended (BTX) Chassis
Design Guide (or Balanced Technology Extended (BTX) System Design Guide) for
detailed chassis mechanical design.
22 Thermal and Mechanical Design Guidelines
Reference Thermal Solution
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink on a
Balanced Technology Extended (BTX) Platform
BTX Thermal
Airflow Directio n
GMCH
Module Assembly
over processor
Top View
4.2 Reference Design Mechanical Envelope
The motherboard component keep-out restrictions for the GMCH for an ATX platform
are included in Appendix B,
restrictions for the GMCH on a BTX platform are included in Appendix B,
Figure 12. The motherboard component keep-out
4.3 Thermal Solution Assembly
The reference thermal solution for the GMCH for an ATX chassis is shown in Figure 9
and is an aluminum extruded heatsink that uses two ramp retainers, a wire preload
clip, and four motherboard anchors. Refer to Appendix B for the mechanical drawings.
The heatsink is attached to the motherboard by assembling the anchors into the
board, placing the heatsink over the GMCH and anchors at each of the corners, and
securing the plastic ramp retainers through the anchor loops before snapping each
retainer into the fin gap. The wire preload clip should be left loose in the extrusion
during the wave solder process. The assembly is then sent through the wave process.
Post wave, the wire preload clip is assembled using the hooks on each of the ramp
retainers. The clip provides the mechanical preload to the package. The mechanical
preload is necessary to provide both sufficient pressure to minimize thermal contact
resistance and to improve solder ball joint reliability. The mechanical stiffness and
orientation of the extruded heatsink also provides protection to reduce solder ball joint
reliability. A thermal interface material (Honeywell* PCM45F) is pre-applied to the
heatsink bottom over an area which contacts the package die.
Note: The ATX design is similar in appearance to the Intel
solution, but two critical items have been changed.
• A higher performance TIM
• A clip with a higher preload to meet the TIM preload requirements.
Figure 13.
®
945G Express Chipset thermal
The combination of the two new items provides the performance increase to meet the
GMCH thermal requirements.
Thermal and Mechanical Design Guidelines 23
Reference Thermal Solution
The reference thermal solution for the GMCH in a BTX chassis is shown in Figure 10.
The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is secured to
the system motherboard via two solder down anchors around the GMCH. The clip
helps to provide a mechanical preload to the package via the heatsink. A thermal
interface material (Honeywell* PCM45F) is pre-applied to the heatsink bottom over an
area in contact with the package die.
Note: To minimize solder ball joint reliability risk, the BTX Z-clip heatsink is intended to be
used with the Support Retention Mechanism (SRM) described in the Balanced
Technology Extended (BTX) Interface Specification. For additional information on
designing the BTX chassis to minimize solder ball joint reliability, refer to the Balanced
Technology Extended (BTX) Chassis Design Guide.
Figure 9. ATX GMCH Heatsink - Installed on Board
24 Thermal and Mechanical Design Guidelines
Reference Thermal Solution
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board
4.4 Environmental Reliability Requirements
The environmental reliability requirements for the reference thermal solution are
shown in
Table 3 and Table 4. These should be considered as general guidelines.
Validation test plans should be defined by the user based on anticipated use
conditions and resulting reliability requirements.
The ATX testing will be performed with the sample board mounted on a test fixture
and includes a processor heatsink with a mass of 550g. The test profiles are
unpackaged board level limits.
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level)
Test1 Requirement Pass/Fail
Mechanical
Shock
Random
Vibration
Unbiased
Humidity
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
• 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
• Profile: 50 G, Trapezoidal waveform, 4.3 m/s
[170 in/s] minimum velocity change
• Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• 85 % relative humidity / 55 °C, 576 hours Visual Check
Criteria
Visual\Electrical
Check
Visual/Electrical
Check
2
Thermal and Mechanical Design Guidelines 25
Reference Thermal Solution
Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level)
Test1 Requirement Pass/Fail
Mechanical
5
Shock
Random
Vibration
Power
Cycling
Unbiased
Humidity
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
3. Mechanical Shock minimum velocity change is based on a system weight of 20 to 29 lbs.
4. For the chassis level testing the system will include: 1 HD, 1 ODD, 1 PSU, 2 DIMMs and the
5. BTX reference solution testing for shock and vibration is to mount the sample board in a
5
different lots of material.
I/O shield.
BTX chassis in with a thermal module assembly (TMA) having a maximum mass of 900g.
• 2 drops for + and - directions in each of 3
perpendicular axes (i.e., total 12 drops).
• Profile: 25g, Trapezoidal waveform, 5.7 m/s
[225 in/sec] minimum velocity change.
• Duration: 10 min/axis, 3 axes
• Frequency Range: .001 g2/Hz @ 5Hz, ramping to
.01 g2/Hz @20 Hz, .01 g2/Hz @ 20 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 2.20 g RMS
• 7500 cycles (on/off) of minimum temperature 27 °C /
maximum temperature 96 °C
• 1400 cycles (on/off) of minimum temperature 35 °C /
maximum temperature 96 °C
• A 15 second dwell at high / low temperature for both
test cycles.
• 85 % relative humidity / 55 °C, 576 hours Visual Check
Criteria2
Visual\Electrical
Check
Visual/Electrical
Check
Thermal
Performance
§
26 Thermal and Mechanical Design Guidelines
Enabled Suppliers
Appendix A Enabled Suppliers
Enabled suppliers for the GMCH reference thermal solution are listed in Table 5 and
Table 6. The supplier contact information is listed in Table 7.
Note: These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality, or compatibility of these devices. This list
and/or these devices may be subject to change without notice.
Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel
®
G35 Express
Chipset
ATX
Items
Heatsink &
TIM
Plastic Clip C85370-
Wire Clip D29082-
Anchor C85376-
Intel PN AVC CCI Foxconn Wieson
D31682-
001 S902Y10001 335I833301A 2Z802-032
334C863501A
001 P109000024
A20800023
001
001
3 334I833301A 3KS02-155
2Z802-015
3EE77-002
G2100C888-143
Table 6. Balanced Technology Extended (BTX) Intel® Reference Heatsink Enabled
Suppliers for Intel® G35 Express Chipset
BTX
Items
Heatsink
assembly
(HS/TIM &
Wire Clip)
Anchor
(Lead
Free)
Intel PN AVC CCI Foxconn Wieson
D34258-
001
A13494-
008 HB9703E-DW
S905Y0000
1 00I833201A 2ZQ99-066
G2100C888-
064H
Thermal and Mechanical Design Guidelines 27
Table 7. Supplier Contact Information
Supplier Contacts Phone Email
Enabled Suppliers
Components)
Technology)
Technologies
David Chao +886-2-2299-6930 ext.
7619
Raichel Hsu +886-2-2299-6930 ext.
7630
Monica Chih +886-2-2995-2666 monica_chih@ccic.com.tw CCI(Chaun Choung
Harry Lin (714) 739-5797 hlinack@aol.com
Jack Chen (408) 919-6121 jack.chen@foxconn.com Foxconn
Wanchi Chen (408) 919-6135
Chary Lee +886-2-2647-1896 ext.
6684
Henry Liu +886-2-2647-1896 ext.
6330
david_chao@avc.com.tw AVC (Asia Vital
raichel_hsi@avc.com.tw
wanchi.chen@foxconn.com
chary@wieson.com Wieson
henry@wieson.com
§
28 Thermal and Mechanical Design Guidelines
Mechanical Drawings
Appendix B Mechanical Drawings
The following table lists the mechanical drawings available in this document.
Drawing Name Page
GMCH Package Drawing 29
GMCH Keep-Out Restrictions for ATX Platforms 31
GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms 32
GMCH Reference Heatsink for ATX Platforms – Sheet 1 33
GMCH Reference Heatsink for ATX Platforms – Sheet 2 34
GMCH Heatsink for ATX Platforms – Anchor 35
GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 36
GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 37
GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip 38
GMCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms 39
GMCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms –
Clip
Number
40
NOTE: Unless otherwise specified, all figur es in this appendix are dimensioned in millimeters.
Dimensions shown in brackets are in inches.
Thermal and Mechanical Design Guidelines 29
Mechanical Drawings
Figure 11. GMCH Package Drawing
30 Thermal and Mechanical Design Guidelines
D
C
13
5.27.04 CJK
.345[]
4X 8.76
REVISION HIS T ORY
C72156 1 2
COMP HEIGHT TO 38.1MM
KEEPOUT WIDTH TO 60.6MM
PRELIMINARY RELEASE 03/01/04
1 ROLLED REVISION 7.16.04 CJK
2 ADDED KEEPOUT FOR HS ASSEMBLY 9.27.04
0.4
0.1
DWG. NO SHT. REV
***
B4
D6
ZONE REV DESCRIPTION DATE APP ROVED
B-C
7&5
NO COMPONENTS THIS AREA
.345[]
4X 8.76
.200[]
4X 5.08
DETAIL A
SCALE 8
.072[]
4X 1.84
4
2.9134[]
DETAIL A
74
B
0.97 .038[]
8X 1.42[.056] TRACE KEEPOUT
8X PLATED THRU HOLE
EAST
COMPONENT CENTER
MAX 1.27 [.050]
NOTES:
A
2
REVDRAWING NUMBERCAGE CODE
12345678
2200 MISSION CO LL E G E BL V D .
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
DESCRIPTIONPART NUMBER
TMD
DEPARTMENT
TITLE
PARTS LIST
4.30.04C BERMENSOLO
DATECHECKED BY
DATEDESIGNED BY
ATX LAKEPORT MCH HEAT SINK KEEP OUTC72156TOP
1 HOLE PLACEMENT FABRICATION
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
38.1MM ABOVE MOTHERBOARD SURFACE.
MAX 25 [1.000]
COMPONENT HEIGHT
COMPONENT HEIGHT
(NON-MCH COMPONE N TS )
ITEM NO
-001-002-003
QTY PER ASSY
UNLE SS OTHERWISE SPECI FIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENS IONS ARE IN MIL LIMETERS
TOLERANCES:
LINEAR 0.1MM
SHEET 1 OF 1
C72156 D
DO NOT SCALE DRAWING
HEAT SINK KEEP OUT
ATX LAKEPORT MCH
SCALE: NONE
SIZE
5.27.04
DATEAPPROVED BY DATECHECKED BY
NA
FINISH:NAMATERIAL:
C KOEPSELL
THIRD ANGLE PROJECTION
2.398[]
60.92
.1575[]
4
5678
135
1.85[]
47
A
2.386[]
60.6
1.055[]
1.890[]
26.79
48
NORTH
1.803[]
45.79
2.638[]
67
3.189[]
81
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
D
C
B
Mechanical Drawings
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms
Thermal and Mechanical Design Guidelines 31
.225[]
2X 5.72
B
.130[]
2X 3.3
.090[]
2X 2.29
DETAIL B
SCALE 6
.100[]
2X 2.54
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
DESCRIPTIONPART NUMBER
TMI
BROADWATER BTX KEEP OUT ZONE
DEPARTMENT
TITLE
1 HOLE PLACEMENT FABRICATION
NOTES:
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
34.3MM ABOVE MOTHERBOARD SURFACE.
MAX 1.78 [.070] COMPONENT HEIGHT
PARTS LIST
mm/dd/yyKG TAN
DATEDRAWN BY
DATEDESIGNED BY
D24866TOP
ITEM NO
-001-002-003
QTY PER ASSY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
06/01/05KG TAN
mm/dd/yyDANA GRINDLE
mm/dd/yyX
DATEAPPROVED BY
DATECHECKED BY
THIRD ANGLE PROJECTION
TOLERANCES:
LINEAR TOL 0.1
0.4D24866 D
REVDRAWING NUMBERCAGE CODE
123
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 4
SIZE
NA
FINISH:NAMATERIAL:
4
D
C
1345678
.345[]
Mechanical Drawings
REVISION HISTORY
D24866 1 0.4
.165[]
4X 4.19
DWG. NO SHT. REV
*** 0.1 PRELIMINARY RELEASE mm/dd/yy X
ZONE REV DESCRIPTION DATE APPROVED
B6,C6 0.4 CHANGE MAX COMP HEIGHT FROM 1.27MM TO 1.55MM 06/24/05
4X D PLATED THRU HOLE
4X 1.42[.056] TRACE KEEPOUT
4X 8.76
.200[]
4X 5.08
NO COMPONENTS THIS AREA
.082[]
4X 2.095
SEE DETAIL A
DETAIL A
SCALE 8
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
51.4
D
2.024[]
MAX 1.55 [.060]
COMPONENT CENTER
COMPONENT HEIGHT
C
(NON-MCH COMPONENTS)
1.732[]
44
2.200[]
55.88
2.440[]
61.98
MAX 1.27 [.050]
COMPONENT HEIGHT
(NON-MCH COMPONENTS)
5678
1.900[]
48.26
SEE DETAIL B
B
A
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
32 Thermal and Mechanical Design Guidelines
D31682 1 A
DWG. NO SHT. REV
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
H
A INITIAL RELEASE 09/08/05 -
G
1.398[]
TYP 35.5
F
.005[]
.148
TYP 63.75 0.15
FULL ROUND
14X EQUAL
SPACING
E
NOTES: 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
1.201[]
30.5
.157[]
4
D
5 MARK PART WITH INTEL P/N AND REVISION APPROX
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
16X 61.2 0.15
6 CRITICAL TO FUNCTION DIMENSION
TOLERANCES:
LINEAR 0.25
ANGULAR 1
3. MATERIAL: 6063-T5 ALUMINUM
4. FINISH: CHEMICAL ETCH
WHERE SHOWN PER INTEL MARKING STANDARD 164997
7. EDGES SHOWN AS SHARP R 0.1 MAX.
8. TOOLING REQUIRED TO MAKE THIS PART SHALL BE THE
PROPERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED
SEE DETAIL B
SEE DETAIL B
.005[]
.047
C
WITH INTEL'S NAME AND APPROPRIATE PART NUMBER.
9. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
10. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
11. REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R CORP.
DESCRIPTIONPART NUMBER
HSNK,EXTD,FBGA,16,ALD31682-001TOP
12 . APPLY HONEYWELL TIM PCM45F (STD SIZE 20mm x 20mm) AT
OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE
REQUIRED TO MEET UL1439 TEST.
HEAT SINK BASE
ITEM NO
QTY
HS, PWSH, BROADWATER, ATX
TMI
DEPARTMENT
TITLE
PARTS LIST
09/08/05C BERMENSOLO
DATECHECKED BY
08/10/05KG TAN
DATEDRAWN BY
09/10/04C BERMENSOLO
DATEDESIGNED BY
ANGLES ± 0.5
DIMENSIONS ± 0.1
ALL UNTOLERANCED LINEAR
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
IN ACCORDANCE WITH ASME Y14.5M-1994
INTERPRET DIMENSIONS AND TOLERANCES
A
2
OF
1
SHEET
DO NOT SCALE DRAWING
2
SIZE DRAWING NUMBER REV
A1 D31682 A
SCALE:
SEE NOTESSEE NOTES
FINISHMATERIAL
09/08/05DANA GRINDLE
DATEAPPROVED BY
09/08/05DANA GRINDLE
SEE DETAIL A
SEE DETAIL A
ALL FINS IN OUTER COLUMN
MUST BE INLINE OR CONVEX
TO MIDDLE FINS
AA
.005[]
2.334
2X 659.28 0.15
8 7 6 5 4 3 2
2.307[]
1.850[]
2X 58.6
47
3.150[]
2X 80
TO MIDDLE FINS
ALL FINS IN OUTER COLUMN
MUST BE INLINE OR CONVEX
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H
Mechanical Drawings
Figure 14. GMCH Reference Heatsink for ATX Platforms – Sheet 1
G
F
E
.005[]
1.890
2X 648 0.15
D
.005[]
.106
2.7 0.15
1.417[]
36
C
SPACING
7X EQUAL
8 7 6 5 4 3 2 1
B
A
Thermal and Mechanical Design Guidelines 33
H
D31682 2 A
G
F
E
D
C
B
A
2
OF
2
SHEET
Mechanical Drawings
DWG. NO SHT. REV
60.6
.024[]
TYP 135
.020[]
R0.5
TYP 4
66.72 0.15
NO BURR ALL AROUND
.005[]
.265
DETAIL B
.157[]
SCALE 5
.005[]
.108
TYP 62.75 0.15
61.5 0.15
.005[]
.059
TYP DETAIL A
SCALE 5
.039[]
TYP R 1
DO NOT SCALE DRAWING
2
SIZE DRAWING NUMBER REV
A1 D31682 A
SCALE:
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R CORP.
TMI
DEPARTMENT
Figure 15. GMCH Reference Heatsink for ATX Platforms – Sheet 2
0.1 [.00]
G
.532[]
13.5
.787[]
20
20
66
F
8 7 6 5 4 3 2
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H
23
.787[]
2.598[]
E
.906[]
D
5 4X 45 X 1 [.039]
12
BOTTOM VIEW
C
8 7 6 5 4 3 2 1
B
A
34 Thermal and Mechanical Design Guidelines
2X CHAMFER ALL AROUND
CONTACT TO INSULATOR INTERFACE
AT SUPPLIERS OPTION
+. 000
-.002
0
-0.07
.025
0.64
[]
.003[]
.030
2X 60.77 0.1
.005[]
.300
7.62 0. 15
NOTES: 1. THIS DRA W ING T O B E USE D IN CO NJUNCT IO N W IT H SUP PLIED 3D
DAT ABA SE F ILE. A LL DIMENS IO NS A ND TO LERA NCES O N TH IS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APP LICABLE A T P ART F REE, UNCO NS TRA INED S TA T E UNLES S
INDICAT ED O T HERW I SE.
2. TO LERANCE S O N DIM E NSIO NED A ND UNDIM ENS IO NED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENS IO NS A RE IN M ILLIMET ERS.
FOR F EATURE SIZES < 10MM: LINEAR .07
45 X 0. 2 M IN
2X 45 2
.005[]
.098
2.5 0.15
2X 3.94 0.15
FOR F EATURE SIZES > 10MM: LINEAR .08
ANGLES: 0.5
3. M A T E RI ALS :
.005[]
.155
.001[]
.020
2X 0. 5 0.05
6 CRITI CAL TO F UNCT IO N DIM ENS IO N
INSULATOR: POLYCARBONATE T HERMOPLASTIC, UL 94V-0, BLACK (739)
(REF . G E LEX AN 3412R-739)
CONTACT: BRASS OR EQ UIVALENT UPON INTEL APPROVAL
CO NT A CT F I NIS H: . 000050u" MI N. NI CK EL U NDE R P LA TI NG ;
SO LD ER T AI LS, 0. 000100" MI N T IN O NLY SO LD ER (LEA D F RE E ).
5. MARK W IT H INT EL P/N A ND REV ISIO N P ER INT EL M ARKING
STANDARD 164997; PER SEC 3.8 (POLYETHYLENE BAG)
7. ALL DIMENSIONS SHOW N SHALL BE MEASURED FOR F AI
8. NOTE RE MO VE D
9. DEG AT E: F LUSH T O 0.35 BELOW STR UCTURA L THICK NES S
(GA TE W ELL O R G AT E RE CESS ACCEP TA BLE)
10. FLA S H: 0. 15 M AX .
11. SI NK: 0.25 M A X.
12. EJECTOR MARKS: FLUSH TO -0.25
13. PARTING LINE MISMATCH NOT T O EXCEED 0.25.
14. EJECTION PIN BOSSES, GATING, AND TO OLING INSERTS REQUIRE
INTEL'S APPRO VAL PRIOR TO T OO L CONSTRUCT IO N.
ALL EJECTION PIN BOSSES AND GATE F EATURES SHOW N
ARE F O R REF E RENCE O NLY.
15. EDGES SHOW N AS SHARP R 0.1 MAX.
16. TOO LING REQUIRED TO MAKE T HIS PART SHALL B E THE
PROPERTY O F INTEL, AND SHALL BE PERMANENTLY MARKED
WIT H INTEL'S NAME AND APPROPRIATE PART NUMBER.
17. ALL SECONDA RY UNIT DIM ENS IO NS A RE F O R REF E RENCE O N LY.
.004[]
.399
2X 10.13 0.12
+.000
-.002
0
-0.07
.025
0.64
[]
65.08 0. 12
.004[]
.200
.157[]
2X 4
.030[]
2X 0.75
65.21 0. 12
.004[]
.205
.004[]
.308
4X 67.83 0.12
Mechanical Drawings
Figure 16. GMCH Heatsink for ATX Platforms – Anchor
Thermal and Mechanical Design Guidelines 35
Mechanical Drawings
5 M ARK PAR T W ITH IN TE L P/N, RE VIS IO N, CA VIT Y NUMB ER
NO TE S: 1. THIS DRA W ING T O B E USE D IN CO NJUNCT IO N W IT H SU PPLIED 3D
DAT AB AS E F ILE. ALL DIM ENS IO NS AND T O LERA NCES O N T HIS
670.49
DRAWING TAK E PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICAT E D O T HERW I SE.
2. TO LERANCES O N DIM ENSIO NED A ND UNDIMENS IONE D
FE AT URES UNLESS O T HE RW ISE SP ECIF IED:
DIMENSIONS ARE IN MILLIMETERS.
FOR FEAT URE SIZES < 10MM: LINEAR .07
2.775[]
661.51
2.422[]
FOR FEAT URE SIZES BETW EEN 10 AND 25 MM: LINEAR .08
FOR FEAT URE SIZES BETW EEN 25 AND 50 MM: LINEAR .10
FOR FEAT URE SIZES > 50MM: LINEAR .18
ANG LES: 0.5
3. MAT ERIA L:
A) TY PE : ENVIRO NM E NTA LLY CO MP LIANT THE RMO P LAST IC O R
EQ UIV ALENT UPO N INT EL A PPRO V AL (REF . G E LEX AN 500ECR-739)
B) CRITI CAL ME CHANICA L MAT ERIA L PRO PE RT IES
FO R EQ UIVA LENT MA TE RIAL SE LECT IO N:
TE NSILE Y IELD ST RENG T H (AS TM D638) > 57 MPa
TE NSILE E LONG A TIO N AT BREA K (AS TM D638) >= 46%
F LEX URA L M O D ULUS (AS T M D638) 3116 MP a 10%
SO F T ENING T EM P (VIC AT , RAT E B ): 154 C
C) COLOR: APPROXIMATING BLACK, (REF G E 739)
6 CRITICAL T O FUNCT IO N DIME NSIO N
D) REG RIND: 25% PERM IS SIBLE.
E) VO LUME - 1.73e+03 CUBIC-MM (REF )
W E IG HT - 2.16 GRA MS (REF )
AND DA TE CO DE APP RO X W HE RE S HO W N P ER INT E L MA RKING
STA NDARD 164997
7. ALL DIME NSIO NS SHO W N SHA LL BE M EA SURE D FO R FA I
8. NOT E REM O V ED
9. DEG AT E: FLUS H TO 0.35 BE LO W ST RUCT URA L THI CKNE SS
(G AT E W E LL OR G A TE RECES S A CCEPT AB LE)
10. F LA S H: 0.15 M A X .
11. S IN K: 0.25 M A X .
12. EJECTO R MARKS: FLUSH TO -0.25
13. PARTING LINE MISM AT CH NO T T O EX CEED 0.25.
14. EJECTIO N PIN BO S SES , G AT ING , A ND T O O LING INSERT S RE Q UIRE
INTE L'S APPRO V AL PRIO R T O T O O L CO NST RUCT IO N.
ALL EJECTION PIN BOSSE S AND GAT E FEAT URES SHOW N
ARE F O R REF ERENCE O NLY.
15. EDGES SHOW N AS SHARP R 0.1 MAX.
16. TO O LING REQ UIRED T O M AK E T HIS P ART SHA LL BE T HE
PROPERTY OF INTEL, AND SHALL BE PERM ANENTLY MARKED
W ITH INTEL'S NAME AND APPROPRIATE PA RT NUMBER.
17. ALL SECO NDA RY UNIT DIM E NSIO NS ARE F O R REF E RENCE O NLY.
Figure 17. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1
5
62 0.05
SEE DETAIL C
SEE DETAIL C
1.100[]
.118[]
3
2X 27. 95
1.225[]
2X 31.1
.001[]
.079
SEE DETAIL ASEE DETAIL A
36 Thermal and Mechanical Design Guidelines
.157[]
4
65.56
.219[]
DET AIL C
SCALE 10
.114[]
2X 62.9
.252[]
6.4
.227[]
2X 65.76
SECTION B-B
.047[]
1.19
60.5
61.75
.020[]
.069[]
63.15
.108[]
.124[]
2.75
B
64. 7 5
.187[]
.205[]
5.2
2X DETA IL A
SCALE 20
6.55
.118[]
3
B
.258[]
Mechanical Drawings
Figure 18. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2
Thermal and Mechanical Design Guidelines 37
H
D29082 1 A
G
F
E
D
C
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R CORP.
Mechanical Drawings
DWG. NO SHT. REV
REVISION HISTORY
- A INITIAL RELEASE 09/06/05 -
ZONE REV DESCRIPTION DATE APPROVED
.110[]
4 2.8
NOTES: 1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
.071[]
4X R 1.8
4 CRITICAL TO FUNCTION DIMENSION
TOLERANCES: LINEAR 0.25
ANGLES: 3
3. MATERIAL:
TYPE: ASTM A228 MUSIC WIRE 1.8 0.1MM 4
PLATING: ELECTRO-LESS NICKEL OR EQUIVALENT UPON
INTEL APPROVAL.
5. MARK WITH INTEL P/N AND REVISION PER INTEL MARKING
DESCRIPTIONPART NUMBER
SPRING, HSS, 8.00 LBI, 65.00MMD29082-001TOP
STANDARD 164997; PER SEC 3.8 (POLYETHYLENE BAG)
6. REMOVE ALL SHARP EDGES AND BURRS.
7. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
8. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
ITEM NO
QTY
PRELOAD, PWSH, BW, ATX
TMI
DEPARTMENT
TITLE
PARTS LIST
09/06/05DANA GRINDLE
09/06/05C.BERMENSOLO
DATECHECKED BY
08/08/05KGTAN
DATEDRAWN BY
07/10/05KGTAN
DATEDESIGNED BY
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
IN ACCORDANCE WITH ASME Y14.5M-1994
INTERPRET DIMENSIONS AND TOLERANCES
A
1
OF
1
SHEET
DO NOT SCALE DRAWING
3
SIZE DRAWING NUMBER REV
A1 D29082 A
SCALE:
SEE NOTESSEE NOTES
FINISHMATERIAL
09/06/05DANA GRINDLE
DATEAPPROVED BY
8 7 6 5 4 3 2
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H
G
Figure 19. GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip
.019[]
.760
19.3 0.5
.019[]
1.075
27.3 0.5
.019[]
0.5
1.835
46.6
F
A
8 7 6 5 4 3 2 1
38 Thermal and Mechanical Design Guidelines
A
64.3
2X 90
E
4 128.6 3
1.445[]
2X 4 36.7
D
C
B
D29080 1 A
D29080 1 A
DWG. NO SHT. REV
DWG. NO SHT. REV
REVISION HISTORY
REVISION HISTORY
- A INITIAL RELEASE 09/06/05 -
- -
ZONE REV DESCRIPTION DATE APPROVED
ZONE REV DESCRIPTION DATE APPROVED
H
G
F
E
NOTES: 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
D
5 MARK PART WITH INTEL P/N AND REVISION APPROX
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
6 CRITICAL TO FUNCTION DIMENSION
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR 0.25
ANGULAR 1
3. MATERIAL: 6063-T5 ALUMINUM
4. FINISH: NONE
WHERE SHOWN PER INTEL MARKING STANDARD 164997
7. EDGES SHOWN AS SHARP R 0.1 MAX.
8. TOOLING REQUIRED TO MAKE THIS PART SHALL BE THE
C
12 . APPLY HONEYWELL TIM PCM45F (STD SIZE 20MM x 20MM) AT
PROPERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED
WITH INTEL'S NAME AND APPROPRIATE PART NUMBER.
9. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
10. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
11. REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER
OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE
REQUIRED TO MEET UL1439 TEST.
HEAT SINK BASE WITH AN ASSEMBLY POSITIONAL TOLERANCE OF
1.0MM TOLERANCE
B
HTSNK,EXTD,FBGA,15,ALD29080-001TOP
HTSNK,EXTD,FBGA,15,ALD29080-001TOP
DESCRIPTIONPART NUMBER
DESCRIPTIONPART NUMBER
PARTS LIST
PARTS LIST
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
R CORP.
R CORP.
DEPARTMENT
DEPARTMENT
DATEDESIGNED BY
DATEDESIGNED BY
SANTA CLARA, CA 95052-8119
SANTA CLARA, CA 95052-8119
TMI
TMI
BROADWATER MCH BTX HEAT SINK
BROADWATER MCH BTX HEAT SINK
TITLE
TITLE
09/06/05DANA GRINDLE
09/06/05C BERMENSOLO
DATECHECKED BY
08/12/05KG TAN
DATEDRAWN BY
08/08/05KGTAN
DATECHECKED BY
DATEDRAWN BY
KGTAN
A
1
1
OF
OF
1
1
SHEET
SHEET
DO NOT SCALE DRAWING
DO NOT SCALE DRAWING
3:1
3:1
SIZE DRAWING NUMBER REV
SIZE DRAWING NUMBER REV
A1 D29080 A
A1 D29080 A
SCALE:
SCALE:
SEE NOTESSEE NOTES
FINISHMATERIAL
09/06/05DANA GRINDLE
DATEAPPROVED BY
SEE NOTESSEE NOTES
FINISHMATERIAL DATEAPPROVED BY
8 7 6 5 4 3 2
1.732[]
44
3
B
14 X EQUAL SPACES
.118[]
15X FULL ROUND
1.232[]
31.3
R0 TO FULL
THIRD ANGLE PROJECTION
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
ITEM NO
ITEM NO
IN ACCORDANCE WITH ASME Y14.5M-1994
INTERPRET DIMENSIONS AND TOLERANCES
QTY
0.25 [.00] B C
0.1 [.003]
12 HONEYWELL TIM-PCM45F
QTY
5
.007[]
.118
6 3 0.2
A
.142[]
3.6
8 7 6 5 4 3 2 1
2.110[]
.787[]
53.6
20
2.000[]
50.8
.787[]
20
.039[]
15 X 1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H
Mechanical Drawings
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms
G
F
E
.012[]
R0.3
.118[]
3
D
.276[]
7
C
C
B
A
Thermal and Mechanical Design Guidelines 39
H
D29081 1 A
G
F
Mechanical Drawings
DWG. NO SHT. REV
REVISION HISTORY
- A INITIAL RELEASE 09/06/05 -
ZONE REV DESCRIPTION DATE APPROVED
.189[]
4 4.8
E
.071[]
4X R 1.8
D
NOTES: 1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D
C
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
4 CRITICAL TO FUNCTION DIMENSION
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES: LINEAR 0.25
ANGLES: 3
3. MATERIAL:
TYPE: ASTM A228 MUSIC WIRE 1.8 0.1MM 4
PLATING: ELECTRO-LESS NICKEL OR EQUIVALENT UPON
INTEL APPROVAL.
5. MARK WITH INTEL P/N AND REVISION PER INTEL MARKING
STANDARD 164997; PER SEC 3.8 (POLYETHYLENE BAG)
6. REMOVE ALL SHARP EDGES AND BURRS.
7. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
8. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R CORP.
DESCRIPTIONPART NUMBER
TMI
DEPARTMENT
PARTS LIST
DATEDRAWN BY
08/08/05KGTAN
DATEDESIGNED BY
WIRE CLIP, MCH, BW, BTXD29081-001TOP
UNLESS OTHERWISE SPECIFIED
ITEM NO
IN ACCORDANCE WITH ASME Y14.5M-1994
INTERPRET DIMENSIONS AND TOLERANCES
QTY
BROADWATER MCH BTX Z-CLIP
TITLE
O9/06/05C BERMENSOLO
DATECHECKED BY
08/12/05KGTAN
THIRD ANGLE PROJECTION
DIMENSIONS ARE IN MILLIMETERS
A
1
OF
1
SHEET
DO NOT SCALE DRAWING
4:1
SIZE DRAWING NUMBER REV
A1 D29081 A
SCALE:
SEE NOTESSEE NOTES
FINISHMATERIAL
09/06/05DANA GRINDLE
DATEAPPROVED BY
09/06/05DANA GRINDLE
8 7 6 5 4 3 2
.8[]
21.3
1.075[]
27.3
1.625[]
41.3
.019[]
0.5
2.465
62.6
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H
G
.315[]
8
F
E
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Clip
10.0
WITHIN
WIRE TERMINATION
.161[]
2X 4.1
.283[]
2X 7.2
C
4 132.6 3
2X 90
D
.051[]
2X R 1.3
2X 90
A
8 7 6 5 4 3 2 1
40 Thermal and Mechanical Design Guidelines
A
66.3
.930[]
2X 4 23.63
B
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