Intel H61, G03-NMF92-F User Manual

USER'S MANUAL
Of
Intel H61 Express Chipset
Based
No. G03-NMF92-F
Rev: 1.0
Release date: February 6, 2012
Trademark:
* Specifications and Information contained in this documentation a re furnis hed for i nforma tion use only , a nd are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
ENVIRONMENTAL PROTECTION ANNOUCEMENT..............................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 SPECIFICATION.........................................................................................................1
1-2 LAYOUT DIAGRAM....................................................................................................2
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................5
2-2 CONNECTORS AND HEADERS................................................................................8
2-2-1 REAR I/O BACK PANEL CONNECTORS....................................................8
2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................9
2-2-3 HEADER PIN DEFINITION ...........................................................................11
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................17
3-2 BIOS MENU SCREEN ................................................................................................17
3-3 FUNCTION KEYS .......................................................................................................18
3-4 GETTING HELP ..........................................................................................................18
3-5 MAIN BAR...................................................................................................................19
3-6 MAIN MENU................................................................................................................19
3-7 ADVANCED MENU.....................................................................................................20
3-8 CHIPSET MENU..........................................................................................................27
3-9 BOOT MENU...............................................................................................................29
3-10 SECURITY MENU.......................................................................................................30
3-11 SAVE & EXIT MENU...................................................................................................30
TABLE OF CONTENT
iii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERI ES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS M ANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition February 6, 2012
Item Checklist
5
Motherboard
5
User’s Manual
5
DVD for motherboard utilities
5
Cable(s)
5
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Specification
Spec Description
Design
z
Micro-ATX form factor, PCB Size: 24.5 x 24.5 cm
Chipset
z
Intel H61 Express Chipset
CPU Socket
(LGA1155 )
z
Support Intel® Core™ i7 Processor, Intel® Core™ i5
Processor, Intel® Core™ i3 Processor in the LGA 1155 Socket
* for detailed CPU support information please visit our website
Memory Slot
z
240-pin DDRIII RAM module slot x 2 supporting two DDRIII
1066-1333MHz RAM Module expandable to 16GB
z
Support dual-channel function
Expansion Slot
z
1 pcs* PCI-Express 2.0 x16 slot by 16 lane
z
1 pcs PCI-Express 2.0 x1 slot by 1 lane
z
2 pcs *32-bit PCI slot
z
1 pcs* Mini-PCIE/MSATA slot
(When this slot works as MSATA slot by connecting compatible MSATA hard disk, SATA4 port will be disabled)
SATA2
z
Support four serial ATA2 ports
Dual LAN Chip
z
Integrated dual RTL8111E PCI-E Gigabit LAN chip
z
Supports Fast Ethernet LAN function provide10/100/ 1000Mbps
data transfer rate
Audio Chip
z
Realtek ALC662 6-channel Audio Codec integrated
z
Audio driver and utility included
BIOS
z
32M DIP Flash ROM
Multi I/O
z
HDMI port connector x1
z
Serial port connector x2
z
VGA port connector x1
z
DVI-D port connector x1
z
USB 2.0 port connector x6
z
RJ-45 LAN connector x2
z
Audio connector x3
z
Front panel audio header x1
z
Serial port header x 8
z
RS422/RS485 header x1
z
Speaker header x1
z
PWRLED header x1
z
CIR header x1
z
4-pin USB 2.0 header x1
z
9-pin USB 2.0 header x2
z
PS/2 keyboard & mouse header x1
z
Front panel header x1
z
LANLED header x2
z
HDMI_SPDIF header x1
z
SM_BUS header x1
z
GPIO header x1
z
TPM 1.2 header x1
z
Parallel header x1
2
1-2 Layout Diagram
Rear IO Diagram
Motherboard Internal Diagram
*Note: MPE_SA slot can work as Mini-PCIE slot or MSATA slot. In the case that user connects compatible
MSATA hard disk to this slot, SATA4 port will be disabled.
RJ-45 LAN Ports
Line-IN
Line-OUT
MIC-IN
USB Ports
Serial Port
VGA Port
ATX 12V Power
Connecto
r
Front Panel
Header
ATX Powe
r
Connector
CPU Socket
DDRIII DIMMx2
32-bit PCI Slot
USB 2.0 Ports
Over
HDMI Port
Front Panel
Audio Heade
r
LAN Chip
CPU FAN Heade
r
PCI E x16 Slot
Intel H61Chipset
USB Headers
Audio
Connecto
r
SATAII Ports
SYS FAN2 Heade
r
Serial Port Headers
(COM3/4/5/6)
GPIO Heade
r
TX-RX COM Header
TPM Header
PCIE x1 Slot
Serial Port Headers
COM7/8
RJ-45 Port
Ove
r
USB 2.0 Ports
Mini-PCIE
/MSATA Slot*
(
MPE SA Slot)
SYSFAN1 Heade
r
HDMI S/PDIF Header
DVI-D Port
Serial Port
HDMI Port
USB Ports
Serial Ports
DVI-D Port
Over
VGA Port
RJ-45 Port
Ove
r
USB 2.0 Ports
Parallel Heade
r
SpeakerHeade
r
CIR Header
USB Header
PS/2 KBMS
Heade
r
Serial Port Headers
COM9/10
LAN Chip
PWRLED
Header
SM_BUS
Heade
r
3
Motherboard Jumper Position
Jumper
Jumper Name Description
JBAT CMOS RAM Clear Function Setting 3-pin Block JP1 COM1 Pin9 Function Select 6-pin Block JP2 Mini PCI-E Power VCC3.3V/3.3V SB 3-pin Block JP3 COM3 RS232/485/422 Function Select 6-pin Block JP5 COM7 Pin9 Function Select 6-pin Block JP6 COM8 Pin9 Function Select 6-pin Block JP7 COM9 Pin9 Function Select 6-pin Block JP8 COM10 Pin9 Function Select 6-pin Block CASE_OPEN Case Open Message Display Function 2-pin Block
JBAT
J
P5
J
P1
CASE_OPEN
JP3
J
P2
J
P8
JP6
JP7
4
Connectors
Connector Name Description
ATXPWR ATX Power Connector 24-pin Block ATX12V ATX 12V Power Connector 8-pin Block SATA1/SATA2/ SATA3/SATA4
SATAII Connectors 7-pin Connector
HDMI High-Definition Multimedia Interface 19-pin Connector COM1 Serial Port COM Connector x 2 9-pin Connector DVI DVI-D Port Connector 24-pin Connector VGA Video Graphic Attach Connector 15-pin Female USB from USB1/ UL1/UL2
USB Port Connector 4-pin Connector
LAN from UL1/UL2 RJ-45 LAN Connector 8-pin Connector AUDIO1 Audio Connector 3-phone Jack
Headers
Header Name Description
FP_AUDIO Front panel audio Header 9-pin block COM3/4/5/6/7/8/9/10 Serial Port Header 9-pin Block TX-RXCOM RS 232/422/485 port headers 4-pin block SPEAK Speaker Header 4-pin Block PWRLED Power LED 3-pin Block CIR CIR module Header 7-pin Block USB2 USB Header 4-pin Block USB3 USB Header 9-pin Block KBMS PS2 Keyboard & Mouse Header 6-pin Block JW_FP (Front Panel Header)
PWR LED/ HD LED/ /Power Button
/Reset
9-pin Block
SYSFAN1 FAN Speed Header 3-pin Block CPUFAN,SYSFAN2 FAN Speed Header 4-pin Block LAN1LED/LAN2LED LAN LED header 2-pin block HDMI_SPDIF SPDIF Out header 2-pin Block SM_BUS SMBUS header 4-pin Block GPIO_CON GPIO Header 10-pin Block TPM TPM Header 19-pin Block PARALLEL Parallel Header 25-pin Bloc k
5
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JBAT (3-pin): Clear CMOS
CMOS RAM Cle ar Setting
2-3 Closed: Clear CMOS
JBATJBAT
1-2 Close d: N or ma l;
(2)JP1 (6-pin): COM1 Pin9 function select
3-4 closed : +12V;
JP1
1-2 closed: RS232;
1
5-6 closed : +5V
1
1
(3) JP2 (3-pin): Mini PCI-E Power VCC 3V/ 3 VSB Function Select
2-3 Closed: MINI PCI-E VCC= 3VSB Select
JP2
1-2 Closed: MINI PCI-E VCC= 3V Select
3
1
3
1
JP2
6
(4) JP3 (6-pin): COM3 Port RS232/485/422 Function Select
3-4 closed : RS485;
JP3
1
1-2 closed: RS232;
1 1
5-6 closed : RS422
(5) JP5 (6-pin): COM7 Pin9 function select
3-4 closed : +12V;
JP5
1-2 closed: RS232;
1
5-6 closed : +5V
1
1
(6) JP6 (6-pin): COM8 Pin9 function select
3-4 closed : +12V;
JP6
1-2 closed: RS232;
1
5-6 closed : +5V
1
1
7
(7) JP7 (6-pin): COM9 Pin9 function select
3-4 closed : +12V;
JP7
1-2 closed: RS232;
1
5-6 closed : +5V
1
1
(8) JP8 (6-pin): COM10 Pin9 function select
3-4 closed : +12V;
JP8
1-2 closed: RS232;
1
5-6 closed : +5V
1
1
(9)CASE_OPEN (2-pin): Case Open Message Display function select
Case Open Display Function
1-2 Short Case Open
COPEN
1-2 Open Normal
Pin 1-2 shorted: Case open display function enabled. In this case if you case is removed, next time when you restart your computer a message will be displayed onscreen to inform you of this.
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