Intel G03-NF9W-F Technical Manual

Technical Manual

Intel Bay Trail Series CPU

Based Mini-ITX M/B

NO.G03-NF9W-F

Revision: 1.0

Release date: April 7, 2015

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

iii

ENVIRONMENTAL SAFETY INSTRUCTION ...........................................................................iv

USER’S NOTICE .......................................................................................................................v

MANUAL REVISION INFORMATION .......................................................................................v

ITEM CHECKLIST .....................................................................................................................v

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION .........................................................................................................2

1-3 LAYOUT DIAGRAM ....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING .....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................18

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP .....................................................................................................25

3-2 BIOS MENU SCREEN ................................................................................................26

3-3 FUNCTION KEYS .......................................................................................................26

3-4 GETTING HELP ..........................................................................................................27

3-5 MEMU BARS...............................................................................................................27

3-6 MAIN MENU ................................................................................................................28

3-7 ADVANCED MENU .....................................................................................................29

3-8 CHIPSET MENU..........................................................................................................39

3-9 SECURITY MENU .......................................................................................................42

3-10 BOOT MENU...............................................................................................................43

3-11 SAVE & EXIT MENU...................................................................................................44

TABLE OF CONTENT

Environmental Safety Instruction

 Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

 Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

 The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

 Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition April 7, 2015

Item Checklist



Motherboard



User’s Manual



CD for motherboard utilities



Cable(s)

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard



Onboard Intel® Bay Trail Series Processor, with low power consumption never

denies high performance



Support 1* DDR3L 1066/1333 MHz SO-DIMM, up to 8GB



Support full-size Mini-PCIE connector



Support 2 * SATAII device & 2 * SATAIII device



Support USB 3.0 data transport demand



Support LVDS &DVI-I dual display output



Support CPU Over-Temperature protection



Support CPU Over-Current/Under Voltage protection



Support DRAM Over-Current/Under Voltage protection



Amplifier implement to support 3W Speaker



Support CPU Smart FAN



Compliance with ErP standard



Support Watchdog function

1-2 Specification

Spec

Description

Design



6 layers; PCB size: 17x 17 cm

Embedded CPU



Integrated with Intel® Bay Trail-D/M/I series CPU

Memory Slot



1 * DDR3L SODIMM Slot for un-buffered DDR

3L 1066/1333 MHz

SDRAM, expandable to 8GB in total

Expansion Slot



1* Full-size Mini-PCIE slot



1* PCIE x1 slot

LAN Chip



Integrated with Realtek RTL8111G PCI-E Gigabit LAN chip



Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

Storage



2* SATAII port (SATA1/2)



2* SATAIII port (SATA3/4)

BIOS



AMI 64MB Flash ROM

Rear I/O



1* 12V system DC Jack power-in connector



1* USB 3.0 port



3* USB 2.0 port



1* DVI-I port



1* COM1 serial port(COM1 supports RS422/485 function)



1* RJ-45 LAN port



Audio Line Out port x1

Internal I/O



1* 2-Pin DC 12V system power-in connector



1* 2-Pin DC 12V power-out connector



2* SATA Power-out connector



1* CPUFAN header



2* SYSFAN header



1* Front panel audio header



1* SPDIF Out header



1* SPEAK_CON header



1* 4-pin USB 2.0 header (Expansible to 1* USB 2.0 port)



2* 9-pin USB 2.0 header (Expansible to 4* USB 2.0 ports)



1* Front panel header



1* Power LED & speaker header



1* Serial port header



1* GPIO_CON header



1* SMBUS header



1* LAN LED activity header



1* LVDS header



1* LVDS inverter header

1-3 Layout Diagram

Rear IO Panel Diagram:

Warning!

The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V (ATX2P) power connector. User can only connect one type of compatible power supply to one of them to power the system.

Line-

Out Port

USB 2.0 Ports

RJ-45 LAN Port

USB 3.0 Port

USB 2.0 Port

DVI-

I Port

COM1 Port

DC 12V

Power-in

Connector

Motherboard Internal Diagram

Note: The memory module should be DDR3L 1.35V SODIMM and not exceeding 8GB total capacity.

Internal 12V DC-in

Power connector

Intel CPU

PCI Express x1 Slot

Front Panel

Audio Header

Front Panel Header

LVDS Inverter

Serial Port Header

(COM2)

GPIO Header

SATA Hard Disk

Power-Out Connector

Speaker

Connector

USB 2.0 Headers

LVDS Header

SATAII Ports (SATA1/2)

SYSFAN1 Header

LAN_LED1 Header

*DDR3L SODIMM Slot

(SODIMM1)

SMBUS Header

Power LED Header &

Speaker Header

Full-size

Mini-PCIE

Slot (MPE1)

USB 3.0 Port

Over USB 2.0 Port

DVI-I Port

COM1

USB 2.0 Ports

RJ-45 LAN Port

Line-Out Port

USB 2.0 Header

SATAIII Ports (SATA3/4)

CPUFAN Header

SYSFAN2 Header

SPDIF Out Header

MON_PWR

Connector

DC12V

Power-in Connector

Jumper Position:

JP1

JPCOM1

JPLED

JPCOM2

JPLCD

Jumper

Jumper Name Description

JP1 Pin 1-2: Clear ME Function Setting

Pin 3-4: Clear CMOS RAM Function Setting Pin 5-6: ATX Mode & AT Mode Select Pin 7-8: ME Security Measure Function Select Pin 9-10: Case Open Message Display Function

10-Pin Block

JPLED INVERTER Back Light 5V/12V Select 3-Pin Block JPLCD LVDS PVCC 5V/3.3V /12V Select 4-Pin Block JPCOM1 COM1 Port Pin9 Function Select 4-Pin Block JPCOM2 COM2 Header Pin9 Function Select 4-Pin Block

Connectors

Connector

Name

DCIN DC 12V System Power–in Connector ATX2P Internal DC 12V System Power–in Connector MON_PWR DC 12V Power–out Connector SATA1/2 SATAII Port Connector X2 SATA3/4 SATAIII Port Connector X2 SATAPW1/2 SATA Power out Connector X2 CPUFAN CPUFAN Connector SYSFAN1/SYSFAN2 SYSFAN Connector X2 USB1(Top) /USB2 USB 2.0 Port Connector X3 USB1(Bottom) USB 3.0 Port Connector DVI-CRT1 DVI-I Port Connector COM1 Serial Port Connector LAN RJ-45 LAN Port Connector

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 9-pin Block SPDIF SPDIF Out Header 2-pin Block SPEAK_CON Speaker Header 4-pin Block FP_USB1/2 USB 2.0 Header 9-pin Block FP_USB3 USB 2.0 Header 4-pin Block JW_FP1

Front Panel Header(PWR LED/ HDD LED/Power Button /Reset)

9-pin Block

SPK-LED1 Power LED & Speaker Header 7-pin Block COM2 Serial Port Header X1 9-pin Block GPIO_CON1 GPIO Header 10-pin Block SMBUS1 SMBUS Header 5-pin Block LAN_LED1 LAN Activity LED Header 2-pin Block LVDS LVDS Header 30-pin Block INVERTER LVDS Inverter 8-pin Block

Chapter 2

Hardware Installation

2-1 Jumper Setting

Pin 1 & 2 of JP1 (10-pin): Clear ME Function Setting

Pin 1-2 of JP1→ Clear ME

1-2 Closed: Clear ME.

1-2 Open: Normal(Default);

Pin 1

Pin 3 & 4 of JP1 (10-pin): Clear CMOS Setting

Pin 3-4 of JP1→ Clear CMOS

3-4 Closed: Clear CMOS(One Touch).

3-4 Open: Normal(Default);

Pin 1

Pin 5 & 6 of JP1 (10-pin): AT Mode Select

Pin 5-6 of JP1→ AT Mode Select

5-6 Closed: AT Mode Selected.

5-6 Open: ATX Mode Selected(Default);

Pin 1

*ATX Mode Selected: Press power button to power on after power input ready; AT Mode Selected: Directly power on as power input ready.

Pin 7 & 8 of JP1 (10-pin): ME Security Measure Function Select

Pin 7-8 of JP1→ ME Security Function Select

Pin 1

7-8 Closed: Disable Security Measures in the Flash Descriptor(Override).

7-8 Open: Enable Security Measures in the Flash Descriptor(Default);

Pin 1

Pin 9 & 10 of JP1 (10-pin):): Case Open Message Display Function Select

Pin 9-10 of JP1→ Case Open

9-10 Closed: Case Open Function Selected(One Touch).

9-10 Open: Normal(Default);

Pin 1

Pin 9-10 Close: When Case open function pin short to GND, the Case open function

was detected. When Used, needs to enter BIOS and enable ‘Case Open Detect’ function. In this case if your case is removed, next time when you restart your computer, a message will be displayed on screen to inform you of this.

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Intel G03-NF9W-F Technical Manual

Specifications and Main Features

Frequently Asked Questions

User Manual