Intel E8501 User Manual

Intel® E8500/E8501 Chip set North
Bridge (NB) and eXternal Memory
Bridge (XMB)

Thermal/Mechanical Design Guide

May 2006

Document Number 306749-002

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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “un defined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

®

The Intel
may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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Copyright © 2005-2006, Intel Corporation.

E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) may co ntain design defects or errors known as errata which

2 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Contents

1 Introduction.........................................................................................................................7

1.1 Design Flow................................ .................................... ... ..................................................7

1.2 Definition of Terms...............................................................................................................8

1.3 Reference Documents.................................................................. ... ....................................9

2 Packaging Technology.... .... .............................................................................................11

2.1 Package Mechanical Requirements ..................................................................................14

3 Thermal Specifications........ .......................................... ... ... .......................................... ...15

3.1 Thermal Design Power (TDP)............................................................................................15

3.2 Die Case Temperature Specifications ...............................................................................15

4 Thermal Simulation ................ ... ... ... .... ... ... ... .... ... .......................................... ... ... .............17

5 Thermal Metrology .............. ... ... ... ... .... .......................................... ... ... .............................19

5.1 Die Case Temperature Measurements..............................................................................19

5.2 Power Simulation Software................................................................................................21

6 NB Reference Thermal Solution #1..................................................................................23

6.1 Operating Environment......................................................................................................23

6.2 Heatsink Performance .......................................................................................................23

6.3 Mechanical Design Envelope.............................................................................................24

6.4 Board-Level Components Keepout Dimensions................................................................25

6.5 First NB Heatsink Thermal Solution Assembly ..................................................................26

6.5.1 Heatsink Orientation............................................................................................27

6.5.2 Extruded Heatsink Profiles..................................................................................27

6.5.3 Mechanical Interface Material..............................................................................27

6.5.4 Thermal Interface Material...................................................................................27

6.5.5 Heatsink Retaining Fastener ...............................................................................28

6.6 Reliability Guidelines..........................................................................................................29

7 NB Reference Thermal Solution #2..................................................................................31

7.1 Operating Environment......................................................................................................31

7.2 Heatsink Performance .......................................................................................................31

7.3 Mechanical Design Envelope.............................................................................................32

7.4 Board-Level Components Keepout Dimensions................................................................33

7.5 Second NB Heatsink Thermal Solution Assembly.............................................................33

7.5.1 Heatsink Orientation............................................................................................34

7.5.2 Extruded Heatsink Profiles..................................................................................34

7.5.3 Mechanical Interface Material..............................................................................34

7.5.4 Thermal Interface Material...................................................................................34

7.5.5 Heatsink Retaining Fastener ...............................................................................34

7.6 Reliability Guidelines..........................................................................................................35

8 XMB Reference Thermal Solution....................................................................................37

8.1 Operating Environment......................................................................................................37

8.2 Heatsink Performance .......................................................................................................37

8.3 Mechanical Design Envelope.............................................................................................38

8.4 Board-Level Components Keepout Dimensions................................................................38

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 3
Bridge (XMB) Thermal/Mechanical Design Guide

8.5 XMB Heatsink Thermal Solution Assembly.......................................................................38

8.5.1 Heatsink Orientation...........................................................................................39

8.5.2 Extruded Heatsink Profiles .................................................................................40

8.5.3 Mechanical Interface Material............................................................................. 40

8.5.4 Thermal Interface Material.................................................................................. 40

8.5.5 Heatsink Retaining Fastener ..............................................................................40

8.6 Reliability Guidelines......................................................................................................... 41

A Thermal Solution Component Suppliers ..........................................................................43

B Mechanical Drawings.......................................................................................................47

Figures

1-1 Thermal Design Process.......................................................... .. ..................................... ... .8

2-1 NB Package Dimensions (Top View)................................................................................11

2-2 NB Package Dimensions (Side View)...............................................................................11

2-3 NB Package Dimensions (Bottom View)........................................................................... 12

2-4 XMB Package Dimensions (Top View) .............................................................................13

2-5 XMB Package Dimensions (Side View)............................................................................ 13

2-6 XMB Package Dimensions (Bottom View)........................................................................ 14

5-1 Thermal Solution Decision Flowchart................................................................................ 20

5-2 Zero Degree Angle Attach Heatsink Modifications............................................................ 20

5-3 Zero Degree Angle Attach Methodology (Top View)......................................................... 20

6-1 First NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity............................................................................................................. 24

6-2 First NB Reference Heatsink Volumetric Envelope........................................................... 25

6-3 First NB Heatsink Board Component Keepout.................................................................. 26

6-4 First NB Heatsink Assembly.............................................................................................. 27

6-5 First NB Heatsink Extrusion Profile................................................................................... 28

7-1 Second NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity............................................................................................................. 32

7-2 Second NB Reference Heatsink Volumetric Envelope ..................................................... 33

7-3 Second NB Heatsink Assembly ........................................................................................34

8-1 XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity.......... 37

8-2 XMB Reference Heatsink Volumetric Envelope................................................................ 38

8-3 XMB Heatsink Board Component Keepout....................................................................... 39

8-4 XMB Heatsink Assembly............................................................ .......................................39

8-5 XMB Heatsink Extrusion Profile........................................................................................ 41

B-1 NB Heatsink #1 Assembly Drawing .................................................................................. 48

B-2 NB Heatsink #1 Drawing................................................................................................... 49

B-3 NB Heatsink #2 Assembly Drawing .................................................................................. 50

B-4 NB Heatsink #2 Drawing................................................................................................... 51

B-5 XMB Heatsink Assembly Drawing.....................................................................................52

B-6 XMB Heatsink Drawing ..................................................................................................... 53

4 Intel® E8500/8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Tables

3-1 Intel® E8500 Chipset NB Thermal Specifications ..............................................................15

3-2 Intel

3-3 Intel® E8500 Chipset XMB Thermal Specifications...........................................................16

3-4 Intel

6-1 Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure.....28

6-2 Reliability Guidelines..........................................................................................................29

A-1 NB Heatsink Thermal Solution #1......................................................................................43

A-2 NB Heatsink Thermal Solution #2......................................................................................44

A-3 XMB Heatsink Thermal Solution........................................................................................45

B-1 Mechanical Drawing List....................................................................................................47

®

E8501 Chipset NB Thermal Specifications ..............................................................16

®

E8501 Chipset XMB Thermal Specifications...........................................................16

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 5
Bridge (XMB) Thermal/Mechanical Design Guide

Revision History

Document

Number

306749 001 • Initial release of this document March 2005
306749 002 • Added Intel® E8501 chipset specific information and re-titled document

Revision

Number

Description Date

May 2006

• Added updated Intel® E8500 Chipset eXternal Memory Bridge (XMB)
thermal specification in Section 3.2

§

6 Intel® E8500/8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to
improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the

®

E8500/E8501 chipset North Bridge (NB) component and the Intel® E8500/E8501

Intel
chipset eXternal Memory Bridge (XMB) component.

• Describe two reference thermal solutions that meet the specification of the E8500/E8501

chipset NB component.

• Describe a reference thermal solution that meets the specification of the E8500/E8501 chipset

XMB component.

Properly designed thermal solutions provide adequate cooling to maintain the E8500/E8501
chipset die temperatures at or below thermal specifications. This is accomplished by providing a
low local-ambient temperature, ensuring adequate local airflow, and minimizi ng the di e to local­ambient thermal resistance. By maintaining the E8500/E8501 chipset die temperature at or below
the specified limits, a system designer can ensure the proper functionality , performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance
and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling
is required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.

This document addresses thermal design and specifications for the E8500/E8501 chipset NB and
XMB components only. For thermal design information on other chipset components, refer to the
respective component datasheet. For the Intel

®

Intel

6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the

®

Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the
system designer. Figure 1-1 illustrates the design process impl icit to this document and the tools
appropriate for each step.

®

6700PXH 64-bit PCI Hub, refer to the

Intel® E8500 /E8501Chipset North Bridge (NB) and eXternal Memory 7
Bridge (XMB) Thermal/Mechanical Design Guide

Introduction

Figure 1-1. Thermal Design Process

1.2 Definition of Terms

BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a

die is mounted, bonded and encapsulated in molding compound. The primary
electrical interface is an array of solder balls attached to the substrate opposite
the die and molding compound.

001239

BLT Bond line thickness. Final settled thickness of the thermal interface material

after installation of heatsink.

ICH5 I/O controller hub. The chipset component that contains the primary PCI

interface, LPC interface, USB, S-ATA, and other legacy functions.

IHS Integrated Heat Spreader, Integral part of the NB package. It enhances

dissipation of heat generated by the NB die and provides interface surface
between NB die and cooling solution.

IMI Independent memory Interfaces. Port connecting the NB to the XMB

Intel® 6700PXH
64-bit PCI Hub

The chipset component that performs PCI bridging functions between the PCI
Express* interface and the PCI Bus. It contains two PCI bus interfaces that can
be independently configured to operate in PCI (33 or 66 MHz) or PCI-X*
mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.

T

case_max

Maximum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.

T

case_min

Minimum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.

TDP Thermal design power. Thermal solutions should be designed to dissipate this

target power level. TDP is not the maximum power that the chipset can
dissipate.

TIM Thermal interface material. Thermally conductive material installed between

two surfaces to improve heat transfer and reduce interface contact resistance.

NB Intel

®

E8500/E8501 chipset North Bridge Component. The chipset component
that provides the interconnect to the processors, XMBs and various I/O
components.

8 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Intel® E8500/E8501 chipset eXternal Memory Bridge Component. The chipset

component that bridges the IMI and DDR interfaces.

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the
following documents:

®

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Intel

• Dual-Core Intel

• 64-bit Intel

• 64-bit Intel

• 64-bit Intel

• 64-bit Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide

®

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Datasheet

®

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

®

6700PXH 64-bit PCI Hub and Intel® 6702PXH 64-bit PCI Datasheet

®

E8501 Chipset North Bridge (NB) Datasheet

®

E8501 Chipset North Bridge (NB) Specification Update

®

E8501 Chipset eXternal Memory Bridge (XMB) Datasheet

®

E8501 Chipset eXternal Memory Bridge (XMB) Specification Update

®

E8500 Chipset North Bridge (NB) Datasheet

®

E8500 Chipset North Bridge (NB) Specification Update

®

E8500 Chipset eXternal Memory Bridge (XMB) Datasheet

®

E8500 Chipset eXternal Memory Bridge (XMB) Specification Update

®

Xeon® Processor 7000 Sequence Datasheet

®

Xeon™ Processor MP with up to 8MB L3 Cache Datasheet

®

Xeon™ Processor MP with up to 8MB L3 Cache Thermal/Mechanical Design

Guidelines

®

Xeon™ Processor MP with 1MB L2 Cache Datasheet

®

Xeon™ Processor MP with 1MB L2 Cache Thermal/Mechanical Design

Guidelines

Introduction

• BGA/OLGA Assembly Development Guide

• Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales

representative. Some documents may not be available at this time.

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 9
Bridge (XMB) Thermal/Mechanical Design Guide

Introduction

10 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

2 Packaging Technology

0.20 –C–

IHS

Substrate

0.435 ± 0.025 mm
See Note 3

Seating Plane

2.44 ± 0.071 mm

See Note 1

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow

0.20

See Note 4

3.79 ± 0.144 mm

4.23 ± 0.146 mm

The E8500/E8501 chipsets consist of four individual components: the NB, the XMB, the

®

6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5R). The E8500/E8501 chipset

Intel
NB component use a 42.5 mm squared, 12-layer flip chip ball grid array (FC-BGA) package (see

Figure 2-1 through Figure 2-3). The E8500/E8501 chipset XM B compo nent uses a 37.5 mm

squared, 10-layer FB-BGA package (see Figure 2-4 through Figure 2-6). For information on the
Intel 6700PXH 64-bit PCI Hub package, refer to the Intel

Thermal/Mechanical Design Guide. For information on the ICH5 package, refer to the

®

Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

Figure 2-1. NB Package Dimensions (Top View)

Handling

Exclusion

Area

38.5 mm

®

6700PXH 64-bit PCI Hub

Figure 2-2. NB Package Dimensions (Side View)

NB

TNB

IHS

IHS

42.5 mm

42.5 mm38.5 mm

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 11
Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-3. NB Package Dimensions (Bottom View)

AV

A
U

AT

A
R

AP

A
N

AM

AL

AK

AJ

A
H

AG

AF

AE

A

A

D

C

AB

AA

Y

W

V

U

T

R

P

N

M

20.202

37X 1.092

L

K

J

H

G

F

E

D

C

B

A

11 252321191715139753127293733 3531

37X 1.092

2822 26242018161412108642 36343230 38

42.5 + 0.05

A

20.202

42.5 + 0.05

NOTES:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

CA0.2

B

12 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure 2-4. XMB Package Dimensions (Top View)

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation befor e reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow

0.20

–C–

Die

Substrate

0.435 ± 0.025 mm
See Note 3

Seating Plane

2.100 ± 0.121 mm

See Note 1

Decoup

Cap

0.7 mm Max

2.535 ± 0.123 mm

0.84 ± 0.05 mm

0.20

See Note 4

Handling

Exclusion

Area

8.88mm.

14.02mm.

Packaging Tech no lo gy

Die

Keepout

Area

6.65mm.11.73mm.

XMB

Die

23.50mm.

27.50mm.

37.50mm.

Figure 2-5. XMB Package Dimensions (Side View)

37.50mm.27.50mm.23.50mm.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 13
Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

5

Figure 2-6. XMB Package Dimensions (Bottom View)

AV

A
U

AT

A
R

AP

A
N

AM

AL

AK

AJ

A

H

AG

AF

AE

A

A

D

C

AB

AA

Y

W

V

U

T

R

P

N

M

20.202

37X 1.092

L

K

J

H

G

F

E

D

C

B

A

37X 1.092

11 252321191715139753127293733 3531

2822 26242018161412108642 36343230 38

42.5 + 0.0

A

20.202

42.5 + 0.05
CA0.2

2.1 Package Mechanical Requirements

The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die
which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the bare die.
These mechanical load limits must not be exceeded during heatsink installation, mechanical stress
testing, standard shipping conditions and/or any other use condition.

Notes:

1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.

3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only

§

B

14 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

3 Thermal Specifications

3.1 Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500/E8501 chipset NB/XMB
components to consume maximum power dissipation for sustained time periods. Therefore, in
order to arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting power
consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that
the thermal solutions should be designed to. TDP is no t th e maxi mu m power that the chipset can
dissipate.

For TDP specifications, see Table 3-1 for the E8500 chipset NB component, Table 3-2 for the
E8501 chipset NB component, Table 3-3 for the E8500 chipset XMB component and Table 3-4 for
the E85001 chipset XMB component FC-BGA packages have poor heat transfer capability into the
board and have minimal thermal capability without a thermal solution. Intel recommends that
system designers plan for one or more heatsinks when using the E8500/E8501 chipsets NB/XMB
components.

3.2 Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500/E8501 chipset NB/XMB components, the
die temperatures must be at or between the maximum/minimum operating temperature ranges as
specified in Table 3-1, Table 3-2, Table 3-3 and Table 3-4. System and/or component level thermal
solutions are required to maintain these temperature specifications. Refer to Section 5 for
guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® E8500 Chipset NB Thermal Specifications

Parameter Value Notes

T

case_max

T

case_min

TDP

with 1 XMB attached

TDP

with 2 XMBs attached

TDP

with 3 XMBs attached

TDP

with 4 XMBs attached

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.

104°C

17.9W

19.8W

22.4W

24.5W

5°C

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 15
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Specifications

Table 3-2. Intel

®

E8501 Chipset NB Thermal Specifications

Parameter Value Notes

T

case_max

T

case_min

TDP

with 1 XMB attached

TDP

with 2 XMBs attached

TDP

with 3 XMBs attached

TDP

with 4 XMBs attached

104°C

5°C

26.0 W

28.2 W

30.4 W

32.6 W

Table 3-3. Intel® E8500 Chipset XMB Thermal Specifications

Parameter Value Notes

T
T

TDP

case_max
case_min

dual channel

105°C

5°C

11.1W DDR2-400

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.

Table 3-4. Intel® E8501 Chipset XMB Thermal Specifications

Parameter Value Notes

T
T

TDP

case_max
case_min

dual channel

105°C

5°C

12.1W DDR2-400

§

16 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

4 Thermal Simulation

Intel provides thermal simulation models of the E8500/E8501 chipset NB/XMB component s and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact yo ur Intel field sales representative to order the thermal models and
user's guides.

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 17
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Simulation

18 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques to measure the
NB/XMB die temperatures. Section 5.1 provides guidelines on how to accurately measure the
NB/XMB die temperatures. Section 5.2 contains information on running an application program
that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers
useful guidelines for thermal performance and evaluation.

5.1 Die Case Temperature Measurements

T o ensure functionality and reliability, the T
the maximum/minimum operating range of the temperature specification as noted in Table 3-1 and

Table 3-3. The surface temperature at the geometric center of the die corresponds to T

Measuring T
Temperature differences between the temperature of a surface and the surrounding local ambient

air can introduce errors in the measurements. The measurement errors could be due to a poor
thermal contact between the thermocouple junction and the surface of the package, heat loss by
radiation and/or convection, conduction through thermocouple leads, and/or contact between the
thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement
accuracy, only the 0° thermocouple attach approach is recommended.

Zero Degree Angle Attach Methodology

1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0 .06 in.) deep hole centered on the bottom of
the heatsink base.

2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.0 2 in.) deep slot from the cent e red hole to one
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).

3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

4. Cut out portions of the TIM to make room for the thermocoup le wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using a high thermal conductivity cement. During this step, ensure no
contact is present between the thermocouple cement and the heatsink base because any contact
will affect the thermocouple reading. It is critical that the thermocouple bead makes
contact with the die (see Figure 5-3).

requires special care to ensure an accurate temperature measurement.

case

of the NB/XMB must be maintained at or between

case

.

case

6. Attach heatsink assembly to the NB /XMB and route thermocouple wires out through the
milled slot.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 19
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Metrology

Figure 5-1. Thermal Solution Decision Flowchart

Figure 5-2. Zero Degree Angle Attach Heatsink Modifications

001240

NOTE: Not to scale.

Figure 5-3. Zero Degree Angle Attach Methodology (Top View)

Die

Thermocouple

NOTE: Not to scale.

20 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Wire

Cement +
Thermocouple Bead

Substrate

001321

Bridge (XMB) Thermal/Mechanical Design Guide

5.2 Power Simulation Software

The power simulation software is a utility designed to dissipate the thermal design power on an
E8500/E8501 chipset NB component or XMB component when used in conjunction with the
64-bit Intel
combination of the above mentioned processor and the higher bandwidth capability of the
E8500/E8501 chipsets enable higher levels of system performance. To assess the thermal
performance of the chipset thermal solution under “worst-case realistic application” conditions,
Intel is developing a software utility that operates the chipset at near worst-case thermal power
dissipation.

The power simulation software being developed should only be used to test thermal solutions at or
near the thermal design power. Figure 5-1 shows a decision flowchart for determining thermal
solution needs. Real world applications may exceed the thermal design power limit for transient
time periods. For power supply current requirements under these transient conditions, please refer
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact
your Intel field sales representative to order the power utility software and user's guide.

®

Xeon® processor MP or Dual-Core Intel® Xeon® processor 7000 sequence. The

§

Thermal Metrology

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 21
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Metrology

22 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

6 NB Reference Thermal Solution #1

Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500/E8501 chipset NB component under operating environments and specifications defined
in this document. This chapter describes the overall requirements for the 1
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the Intel
PCI Hub, refer to thermal specification in the Intel
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
the Intel

(ICH5R) Thermal Design Guide.

®

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

6.1 Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)

®

6700PXH 64-bit PCI Hub

st

NB reference thermal

®

6700PXH 64-bit

The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard

6.2 Heatsink Performance

Figure 6-1 depicts the measured thermal performance of the 1st NB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 23
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity

Ȍ

1.50

1.40

1.30

1.20

1.10

Ȍca (°C/W)

1.00

0.90

0.80
100 200 300 400 500 600 700

Flow Rate (LFM)

6.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset
NB thermal solution are shown in Figure 6-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in

Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 4.14 mm (0.16 in.) in height.

24 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure 6-2. First NB Reference Heatsink Volumetric Envelope

Heatsink

Fin

Heatsink Base

FCBGA + Solder Balls

IHS + TIM2

Motherboard

64.52 mm.

42.50 mm.

NB Reference Thermal Solution #1

55.09 mm.

4 mm.

4.29 mm.

TNB

Heatsink

Heatsink

Fin

42.50 mm.

64.52 mm.

Heatsink Base

6.4 Board-Level Components Keepout Dimensions

The location of hole pattern and keepout zones for the reference thermal solution are shown in

Figure 6-3.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 25
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

6.5 First NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4
shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 6-3. First NB Heatsink Board Component Keepout

4X Ø 5.5mm

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

4.14mm Max Component Height

Heatsink Mounting Ho le

NOTE: All dimensions are in millimeters.

64.500mm.

55.245mm.

42.500mm.

TNB Location

NB Location

42.500mm.

64.500mm.55.245mm.

26 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

6.5.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.

Figure 6-4. First NB Heatsink Assembly

NB Reference Thermal Solution #1

6.5.2 Extruded Heatsink Profiles

The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.

Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other

heatsinks with similar dimensions and increased thermal performance may be available. Full
mechanical drawing of this heatsink is provided in Appendix B.

6.5.3 Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.5.4 Thermal Interface Material

A TIM provides improved conductivity between the die and heatsink. The reference thermal
solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm
(1.5 in. x 1.5 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The

flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it
reaches its phase change temperature.

6.5.4.1 Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled
thickness of the thermal interface material after installation of heatsink. The effect of pressure on

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 27
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1 The
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of

0.17°Cinch

2

/W.

Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure

Pressure (psi) Thermal Resistance (°C × in2)/W

50.37
10 0.30
20 0.21
30 0.17

NOTE:

1. All measured at 50°C.

6.5.5 Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two
NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.

Figure 6-5. First NB Heatsink Extrusion Profile

28 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

6.6 Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in Table 6-2.

Table 6-2. Reliability Guidelines

(1)

Test

Requirement Pass/Fail Criteria

NB Reference Thermal Solution #1

(2)

Mechanical
Shock

Random
Vibration

Temperature Life 85°C, 2000 hours total, checkpoints at 168,

Thermal Cycling –5°C to +70°C, 500 cycles Visual Check
Humidity 85% relative humidity, 55°C, 1000 hours Visual Check

NOTES:

1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.

2. Additional pass/fail criteria may be added at the discretion of the user.

50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical Functional

7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz

500, 1000, and 2000 hours

Test
Visual Check and Electrical Functional

Test
Visual Check

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 29
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

30 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

7 NB Reference Thermal Solution #2

Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500/E8501 chipset NB component under operating environments and specifications defined
in this document. This chapter describes the overall requirements for the 2nd NB reference thermal
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the Intel
PCI Hub, refer to thermal specification in the Intel
Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal
specification in the Intel

Controller Hub 5 R (ICH5R) Thermal Design Guide.

®

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O

7.1 Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to
the local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environmental external
to the system.)

®

6700PXH 64-bit PCI Hub

®

6700PXH 64-bit

The fastener for this reference thermal solution is intended to be used on motherboard with
thickness between 0.085” and 0.093”.

7.2 Heatsink Performance

Figure 7-1 depicts the measured thermal performance of the 2nd NB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 31
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-1. Second NB Reference Heatsink Measu red Thermal Performance vs.

Approach Velocity

2.3
2

1.7

1.4

1.1

Ȍca (°C/W)

0.8

0.5

0 100 200 300 400 500 600

Flow Rate (LFM)

7.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset
NB thermal solution are shown in Figure 7-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,
any motherboard components placed between the heatsink and motherboard cannot exceed

4.14 mm (0.16 in.) in height.

32 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-2. Second NB Reference Heatsink Volumetric Envelope

Heatsink

Fin

Heatsink Base

FCBGA

IHS + TIM2

Motherboard

64.52 mm.

42.50 mm.

4 mm.

55.09 mm.

4.29 mm.

Heatsink Base

Heatsink

Fin

64.52 mm.

40.50 mm.

7.4 Board-Level Components Keepout Dimensions

Please refer to Section 6.4 for detail.

7.5 Second NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3
shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 33
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-3. Second NB Heatsink Asse mbly

7.5.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.

7.5.2 Extruded Heatsink Profiles

Please refer to Section 6.5.2 for detail.

7.5.3 Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.4 Thermal Interface Material

Please refer to Section 6.5.4 for detail.

7.5.4.1 Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

7.5.5 Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with
either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the
fastener.

34 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

7.6 Reliability Guidelines

Please refer to Section 6.6 for detail.

NB Reference Thermal Solution #2

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 35
Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

36 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

8 XMB Reference Thermal Solution

2.5

3

3.5

4

4.5

5

5.5

0 100 200 300 400 500 600

Flow Rate (LFM)

Ȍca (°C/W)

Intel has developed one different reference thermal solution designed to meet the cooling needs of
the E8500/E8501 chipset XMB component under operating environments and specifications
defined in this document. This chapter describes the overall requirements for the XMB reference
thermal solution including critical-to-function dimensions, operating envi ronment, and validation
criteria. Other chipset components may or may not need attached thermal solutions, depending on
your specific system local-ambient operating conditions. For information on the Intel
64-bit PCI Hub, refer to thermal specification in the Intel
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
the Intel

(ICH5R) Thermal Design Guide.

®

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

8.1 Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of
57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)

®

6700PXH 64-bit PCI Hub

®

6700PXH

The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard.

8.2 Heatsink Performance

Figure 8-1 depicts the measured thermal performance of the XMB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.

Figure 8-1. XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity

Intel® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memory 37
Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

8.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width and depth constraints typically placed on the E8500/E8501 chipset
XMB thermal solution are showing in Figure 8-2.

When using heatsinks that extend beyond the XMB reference heatsink envelope shown in

Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 2.48 mm (0.10 in.) in height.

Figure 8-2. XMB Reference Heatsink Volumetric Envelope

Heatsink Fin

Heatsink Base

Motherboard

FCBGA + Solder Balls

Die + TIM

4.5 mm.

2.60 mm.

26.60 mm.

63.50mm.

Heatsink Fin

30.26 mm.

45.50mm.

48.26 mm.

8.4 Board-Level Components Keepout Dimensions

The locations of holes pattern and keepout zones for the reference thermal solution are shown in

Figure 8-3.

8.5 XMB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset XMB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4
shows the reference thermal solution assembly and associated components.

38 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 8-3. XMB Heatsink Board Component Keepou t

63.500mm.

55.250mm.

37.500mm.

37.5mm

XMB Reference Thermal Solution

4X Ø 5.5mm

4X Ø 2.95 ± 0.0254mm

8.5.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.

Figure 8-4. XMB Heatsink Assembly

XMB Location

No Component Keep Out Area

2.48mm Max Component Height

Heatsink Mounting Hole

38.097mm. 48.260mm.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 39
Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

8.5.2 Extruded Heatsink Profiles

The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.

Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other

heatsinks with similar dimensions and increased thermal performance may be available. A full
mechanical drawing of this heatsink is provided in Appendix B.

8.5.3 Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

8.5.4 Thermal Interface Material

A TIM provides improved conductivity between the die and the heatsink. The reference thermal
solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm
(0.7 in. x 0.7 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch
after it reaches its phase change temperature.

8.5.4.1 Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

8.5.5 Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B
for a mechanical drawing of the fastener.

40 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure 8-5. XMB Heatsink Extrusion Profile

XMB Reference Thermal Solution

8.6 Reliability Guidelines

Please refer to Section 6.6 for details.

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 41
Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

42 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

A Thermal Solution Component

Suppliers

Table A-1. NB Heatsink Thermal Solution #1

Part Intel Part Number

Heatsink Assembly includes:

• Unidirectional Fin Heatsink

• Thermal Interface Material

• Retaining Fastener

Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)

Thermal Interface
(T710)

Retaining Fastener - ITW Fastex*

C23120-001 CCI/ACK Harry Lin (USA)

C19221-001 CCI/ACK Harry Lin (USA)

689850-001 Chomerics

Supplier

(Part Number)

(69-12-21937-T710)

(8034-00-9909)

Contact Information

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

Todd Sousa (USA)
360-606-8171

[e-mail]
Ron Schmidt (USA)

847-299-2222

[e-mail]

Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
[e-mail]

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 43
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Solution Component Suppliers

Table A-2. NB Heatsink Thermal Solution #2

Part

Heatsink Assembly includes:

• Unidirectional Fin Heatsink

• Thermal Interface Material

• Retaining Fastener

Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)

Thermal Interface
(T710)

Retaining Fastener - ITW Fastex*

Intel Part Number

C44148-001 CCI/ACK Harry Lin (USA)

C44147-001 CCI/ACK Harry Lin (USA)

689850-001 Chomerics

Supplier

(Part Number)

(69-12-21937-T710)

(8047-00-9909)

Contact Information

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

Todd Sousa (USA)
360-606-8171

[e-mail]
Ron Schmidt (USA)

847-299-2222

[e-mail]

Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
[e-mail]

44 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Table A-3. XMB Heatsink Thermal Solution

Thermal Solution Component Suppliers

Part Intel Part Number

Heatsink Assembly includes:

• Unidirectional Fin Heatsink

• Thermal Interface Material

• Retaining Fastener

Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)

Thermal Interface
(T-710)

Retaining Fastener - ITW Fastex*

C23124-001 CCI/ACK Harry Lin (USA)

C19222-001 CCI/ACK Harry Lin (USA)

689850-001 Chomerics

Supplier

(Part Number)

(69-12-22000-T710)

(8034-00-9909)

Contact Information

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

714-739-5797

[e-mail]

Monica Chih (Taiwan)
866-2-29952666, x131
[e-mail]

Todd Sousa (USA)
360-606-8171

[e-mail]
Ron Schmidt (USA)

847-299-2222

[e-mail]

Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
[e-mail]

NOTE: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of

component availability.

§

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 45
Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Solution Component Suppliers

46 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

B Mechanical Drawings

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

NB Heatsink #1 Assembly Drawing Figure B-1
NB Heatsink #1 Drawing Figure B-2
NB Heatsink #2 Assembly Drawing Figure B-3
NB Heatsink #2 Drawing Figure B-4
XMB Heatsink Assembly Drawing Figure B-5
XMB Heatsink Drawing Figure B-6

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 47
Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-1. NB Heatsink #1 Assembly Drawing

48 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure B-2. NB Heatsink #1 Drawing

Mechanical Drawings

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 49
Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-3. NB Heatsink #2 Assembly Drawing

50 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure B-4. NB Heatsink #2 Drawing

Mechanical Drawings

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 51
Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-5. XMB Heatsink Assembly Drawing

52 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure B-6. XMB Heatsink Drawing

Mechanical Drawings

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 53
Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

§

54 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide