Intel E7520 User Manual
Dual-Core Intel® Xeon® processor LV
with Intel
®
E7520 Chipset and Intel®
6300ESB ICH Development Kit
User’s Manual
April 2007
Order Number: 311 274-009
Lega l Li nes and Discl a imers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Intel may make changes to specifications and product descriptions at any time, without notice.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
present e d subject matter. The furn i shi ng o f do c um ent s and other mate rial s and information do es not pr ovi d e a n y lic e n se , e xp res s o r impli ed, by es topp el
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility w h atsoever for conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate featur es within each processor family, not across different
processor families. See http://www.intel.com/products/processor_number for details.
The Dual-Core Intel® Xeon® processor LV with Intel® E7520 Chipset and Intel® 6300ESB ICH may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized errata are availab l e on request.
Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting HT Technology and a HT Technology enabled
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products/ht/Hyperthreading_more.htm for additional information.
This User’s Manual as well as the software descr ibed in it is furnished under licens e and may only be used or copied in accordance with the terms of the
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commitment by In tel C orpor atio n. Intel Cor por atio n assum es no r esponsib ilit y o r l iabili ty f or a ny err ors or in a ccur ac ies that may appear in thi s document
or any software that may be provided in association with this document.
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means without the exp ress written consent of Intel Corporation.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents w hich have an order number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Celeron, Intel, Intel Centrino, Intel logo, Intel NetBurst, Intel NetStructure, Intel Xeon, Intel XScale, Pentium, Pentium II Xeon, Pentium III Xe on and
VTune ar e trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other na m es and bra nds may be claimed as t he pro perty of othe rs.
Copyright © 2007, Intel Corporation. All Rights Reserved.
Dual-Core Intel® Xeon® processor LV with Intel® E7520 C hipset and Intel® 6300ESB ICH
User’s Manual April 2007
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Contents
1.0 About This Ma nual .....................................................................................................7
1.1 Content Overview.......................... ......................................................................7
1.2 Text Conventions ................................................................................... .............7
1.3 Technical Support................................................................................................9
1.3.1 Electronic Support Systems .......................................................................9
1.3.2 Online Documents....................................................................................9
1.3.3 Additional Technical Support......................................................................9
1.4 Product Literature .............................................................................................10
1.5 Related Documents ...........................................................................................10
2.0 Getting Started ........................................................................................................11
2.1 Overview .........................................................................................................11
2.2 Evaluation Board Features..................................................................................12
2.3 Included Hardware ............................................................................................12
2.4 Software Key Features.......................................................................................12
2.4.1 AMIBIOS* for the Development Kit...........................................................13
2.5 Before You Begin...............................................................................................13
2.6 Setting up the Evaluation Board .......................................................................... 13
2.6.1 Safety ..................................................................................................14
2.6.2 Package Contents................................................................................... 14
2.6.3 Installed Hardware.................................................................................15
2.6.4 Installing the Heatsinks for CPU(s) and MCH ..............................................15
2.6.5 CPU Heatsink I nstallation ........................................................................16
2.6.6 MCH Heatsink Installation........................................................................20
2.6.7 Installing Memory ..................................................................................22
2.6.8 Installing Storage Devices....................................................................... 22
2.6.9 Connect the Video Card and Monitor.........................................................23
2.6.10 Connect the Keyboard and Mouse.............................................................24
2.6.11 Connect the Power Supply.......................................................................24
2.6.12 Power up the System......................................................... .....................24
2.7 Configuring the BIOS.........................................................................................24
3.0 Theory of Operati on.................................................................................................25
3.1 Block Diagram ..................................................................................................25
3.2 Thermal Management ........................................................................................25
3.3 System Features ...............................................................................................26
3.3.1 Dual-Core Intel
3.3.2 Intel
®
E7520 MCH and Intel® 6300ESB ICH Chipset ...................................27
3.3.3 Memory Subsystem................................................................................28
3.3.4 Supported DIMM Module Types ................................................................28
3.3.5 Memory Population Rules and Configurations .............................................28
3.3.6 Intel
®
82802AC Firmware Hub (FWH).......................................................29
3.3.7 Boot ROM..............................................................................................29
3.3.8 In-Target Probe (ITP) .............................................................................29
3.3.9 Power Diagram......................................................................................30
3.3.10 Clock Generation....................................................................................31
3.3.11 Platform Resets......................................................................................32
3.3.12 SMBus..................................................................................................33
3.3.13 Platform IRQ Routing..............................................................................34
3.3.14 VRD VID Headers...................................................................................35
3.4 Battery Requirements........................................................................................36
4.0 Platform Management .............................................................................................37
®
Xeon® processor LV.......................................................27
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
4.1 Power Button....................................................................................................37
4.2 Sleep States Supported......................................................................................37
4.2.1 S0 State................................................................................................37
4.2.2 S1 State................................................................................................37
4.2.3 S2 State................................................................................................37
4.2.4 S3 State................................................................................................37
4.2.5 S4 State................................................................................................38
4.2.6 S5 State................................................................................................38
4.2.7 Wake-Up Events.....................................................................................38
4.2.8 Wake from S1 Sleep State .......................................................................38
4.2.9 Wake from S3 State................................................................................38
4.2.10 Wake from S5 State................................................................................39
4.3 PCI PM Support.................................................................................................39
4.4 Platform Management ........................................................................................39
4.4.1 Processor Thermal Management ...............................................................39
4.5 System Fan Operation........................................................................................39
5.0 Driver and OS Support .............................................................................................40
6.0 Hardware Reference ................................................................................................41
6.1 Chipset Components ..........................................................................................42
6.2 Expansion Slots and Sockets...............................................................................42
6.2.1 PCI Express* Connector...........................................................................42
6.2.2 32-Bit PCI Connector...............................................................................44
6.2.3 PCI-X Connector.....................................................................................45
6.2.4 Processor Sockets...................................................................................48
6.2.5 Firmware Hub (FWH) BIOS Socket............................................................48
6.2.6 Battery..................................................................................................48
6.3 On-Board Connectors.........................................................................................48
6.3.1 SATA Connector .....................................................................................49
6.3.2 IDE Connector........................................................................................49
6.3.3 Floppy Drive Connector ...........................................................................50
6.3.4 Front Panel Connector.............................................................................50
6.4 Jumpers...........................................................................................................51
6.5 SMBUS Headers................................................................................................. 53
6.6 Back Panel Connectors .......................................................................................53
6.6.1 PS/2-Style Mouse and Keyboard Connectors...............................................53
6.6.2 Parallel Port...........................................................................................53
6.6.3 Serial Ports............................................................................................54
6.6.4 Dual Stacked USB Connectors ..................................................................54
6.6.5 Video Port..............................................................................................55
7.0 Board Setup Checklist..............................................................................................56
8.0 Debug Proce d ure .....................................................................................................57
8.1 Level 1 Debug (Port80/BIOS) ..............................................................................57
8.2 Level 2 Debug (Power Sequence).........................................................................57
8.3 Level 3 Debug (Voltage References).....................................................................58
Figures
1 Board before Installing Additional Hardware.................................................................14
2 Location for the CPU and MCH for Heatsink Installation..................................................16
3 CPU Heatsink Top and Bottom View ............................................................................17
4 Processor in Socket and Package Secured....................................................................17
5 Clean Top of Processor Die ........................................................................................18
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Dual-Core Intel
User’s Manual April 2007
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
6 Back Plate i n Place...................................................................................................19
7 Heatsink Mounted on CPU ......................................................................................... 19
8 Screw Tightening Order ............................................................................................20
9 MCH Heatsink Top View ............................................................................................20
10 Clean Top of MCH Die...............................................................................................21
11 Hook Heatsink Clip to First Anchor................... ........................................................... 21
12 Hook Heatsink Clip to Second Anchor.......................................................................... 22
13 Block Diagram of Layout...........................................................................................25
14 DDR2-400 Memory—DIMM Ordering...........................................................................29
15 ITP location.............................................................................................................30
16 Power Distribution Block Diagram...............................................................................31
17 Clock Block Diagram.................................................................................................32
18 Platform Reset Diagram......................................................... ...................................33
19 SMBus Block Diagram...............................................................................................34
20 IRQ Routing Diagram................................................................................................35
21 Evaluation Board......................................................................................................41
22 Jumper Locations.....................................................................................................52
23 Back Panel Connectors..............................................................................................53
Tables
1 Related Documents ..................................................................................................10
2 Additional Hardware................................................................................................. 13
3 Heatsink Information................................................................................................15
4 Supported DIMM Module Types..................................................................................28
5 Processor VRD Settings.............................................................................................36
6 Chipset Components................................................................................................. 42
7 Expansion Slots and Socket....................................................................... ................42
8 PCI Express* Connector Pinout ..................................................................................42
9 32-Bit 5 V PCI Connector Pinout................................................................................. 44
10 PCI-X Connector Pinout.............................................................................................45
11 On-Board Connector.................................................................................................48
12 SATA Connector Pinout.............................................................................................49
13 IDE Connector Pinout ...............................................................................................49
14 Floppy Drive Connector Pinout...................................................................................50
15 Front Panel Connector Pinout.....................................................................................50
16 Jumpers and Jumper Functions..................................................................................51
17 SMBUS 3.3 V STBY Pinout.........................................................................................53
18 PS/2-Style Mouse and Keyboard Pinout.......................................................................53
19 Parallel Port Connector Pinout....................................................................................54
20 Serial Port Connector Pinout......................................................................................54
21 USB Connector Pinout...............................................................................................54
22 Video Port Connector Pinout......................................................................................55
23 Level 1 Debug (Port80/BIOS) ....................................................................................57
24 Level 2 Debug (Power Sequence) ...............................................................................57
25 Level 3 Debug (Voltage Reference).............................................................................58
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Revision History
Date Revision Description
Section 2.6.9 updated to clarify that video card is not included in the kit.
April 2007 009
March 2007 008 Updates to Chap ter 2.0, “Getting Started” to include safety warnings.
February 2007 007 Minor updates.
December 2006 006 Update for Intel® Celeron® 1.83 GHz processor launch.
December 2006 005 Update for Dual-Core Intel® Xeon® processor LV 2.16 GHz (dual-processor capable) launch.
October 2006 004 Update for product launch.
May 2006 003 Chapter 6: changed jumper descriptions/comments
March 2006 001 Initial public release.
Section 2.3 updated to remove the reference to the Blue stand and add the standoffs.
Section 2.6.11 added safety warning.
Section 3 updated with correct part number for CPU heat sink fan.
®
Dual-Core Intel
User’s Manual April 2007
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Xeon® processor LV with Intel® E7520 C hipset and Intel® 6300ESB ICH
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
1.0 About This Manual
This manual describes how to set up and use the evaluation board and other
components included in your Dual-Core Intel
Chipset and Intel
®
6300ESB ICH Development Kit.
1.1 Content Overvie w
Chapter 1.0, “Ab out Thi s Manual ” – Des cript io n of con v enti ons used in this manua l and
instructions for obtaining literature and contacting customer support.
Chapter 2.0, “Getting Started” – Complete instructions on how to configure the
evaluation board and processor assembly by setting jumpers, connecting peripherals,
providing power, and configuring the BIOS.
Chapter 3.0, “Theory of Operation” – Information on the system design.
Chapter 4.0, “Platform Management” – Description of jumper settings and functions,
and pinout information for each connector.
Chapter 5.0, “Driver and OS Support” – List of supported drivers and operating
systems.
Chapter 6.0, “Hardware Reference” – Re ference information on the hardw are, including
locations of evaluation board components, co nnector pinout information, and jumper
settings.
Chapter 7.0, “Board Setup Checklist” – Checklist of items to ensure proper functionality
of the evaluation board.
Chapt er 8.0, “Debu g Pr oced ur e” – Debu g pro cedu re t o det erm in e base li ne fu nct iona l ity
for the Development Kit.
®
Xeon® processor LV with Intel® E7520
1.2 Tex t Convent ion s
The following notations may be used throughout this manual:
# - The pound symbol (#) appended to a signal name indicates that the signal is active
low.
Variables - Variables are shown in italics. Variables must be replaced with correct
values.
Instructions - Instruction mnemonics are shown in uppercase. When you are
programming, instructions are not case-sensiti ve. You may use either upper- or
lowercase.
Numbers - Hexadecimal numbers are represented by a string of hexadecimal digits
followed by the character “h”. A zero prefix is added to numbers that begin with A
through F. For example, FF is shown as 0FFh. Decimal and binary numbers are
represented by their customary notations. That is, 255 is a decimal number and 1111
1111 is a binary number. In some cases, the character “b” is added for clarity.
Signal Names - Signal names are shown in uppercase. When several signals share a
common name, an individual signal is represented by the signal name followed by a
number, while the group is represented by the signal name followed by a variable (n).
For example, the lower chip-select signals are named CS0#, CS1#, CS2#, and so on;
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
they are collectively called CSn#. A pound symbol (#) appended to a signal name
identifies an active-low signal. Port pins are represented by the port abbreviation, a
period, and the pin number (e.g., P1.0).
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Dual-Core Intel
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Units of Measure The following abbreviations are used to represent units of measure:
A amps, amperes
GB GByte, gigabytes
GHz gigahertz
KB KByte, kilobytes
ΚΩ kilo-ohms
mA milliamps, milliamperes
MB MByte, megabytes
MHz megahertz
ms milliseconds
mW milliwatts
ns nanoseconds
pF picofarads
W watts
V volts
μA microamps, microamperes
μF microfarads
μs microseconds
μW microwatts
1.3 Technical Support
Support Services for your hardware and software are provided through the secure
®
Intel
Premier Support Web site at https://premier.intel.com. After you log on, you can
obtain technical support, review “What’s New,” and download any items required to
maintain the platform.
1.3.1 Electronic Support Systems
Intel’s site on the World Wide Web (http://www.intel.com/) provides up-to-date
technical information and product support.
1.3.2 Online Document s
Product documentation is provided online in a variety of web-friendly formats at:
http://www.intel.com/hardwaredesign/solutions/index.htm
1.3.3 Additional Technical Support
If you require additional technical support, please contact your field sales
representative or local distributor.
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1.4 Product Literature
You can order product literature from the following Intel literature centers.
U.S. and Canada 1-800-548-4725
U.S. (f rom overseas) 708-296-9333
Europe (U.K.) 44(0)1793-43 1155
Germany 44(0)1793-421333
France 44(0)1793-421777
Japan (fax only) 81(0)120-47-88-32
1.5 Related Documents
Table 1 is a partial list of the available collateral. For the full lists, contact your local
Intel representative.
Table 1. Related Documents
Document Document Number
®
Intel
6300ESB I/O Controll er Hub (ICH) Datasheet
Intel® E7520 Me mory Controller Hub (M CH) Datasheet
®
Dual-Core Intel
Intel® E7520 Memory Controller Hub (MCH) Specification
Intel® E7520 Memory Controller Hub (MCH) Specifications Addendum
®
E7520 Memory Controller Hub (MCH) Specifications Embedded
Intel
Addendum
Embedded Voltage Regulator-D own (EmVRD) 11 .0
Xeon® Processor LV and ULV Datasheet
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Contact your Intel field
representative for access .
®
Dual-Core Intel
User’s Manual April 2007
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
2.0 Getting Started
This chapter identifies the Dual-Core Intel® Xeo n® processor LV with Intel® E7520
Chipset and Intel
®
6300ESB ICH Development Kit’s key components , features and
specifications. It also describes how to set up the board for operation.
Note: This manual assumes you are familiar with basic concepts involved with installing and
configuring hardware for a PC or server system.
2.1 Overview
The Development Kit contains a baseboard with two Dual-Core Intel Xeon processors
LV, Intel
connectors. Various software and documentation are also included in the kit.
In addition to the included Dual-Core Intel
the following processors are also supported with this Development Kit:
• Dual-Core In tel
• Dual-Core In tel
• Celeron
• Celeron
If you wish to use one of these options instead of the included processors, please
contact y our In te l s ale s re pr esen tat iv e. You will be sent new p roc es so r(s) and w ill ne ed
to download the latest microcode updates and BIOS revision specific to your new
processor(s). There are currently two versions of BIOS. One version supports the LV
and ULV versions, while the other version supports Celeron version.
®
E7520 MCH, 6300ESB, and other system board components and peripheral
®
Xeon® processors LV 2.0 GHz processors,
®
Xeon® processor LV 1.66 GHz (dual-processor capable)
®
Xeon® processor ULV 1.66 GHz (dual-processor capable)
®
processor 1.66 GHz (uni-processor only)
®
processor 1.83 GHz (uni-processor only)
Note: The evaluation board is shipped as an open system with standoffs allowing for
maximum flexibility in changing hardware configuration and peripherals in a lab
environment. Since the board is not in a protective chassis, the user is required to
observe extra precautions when handling and operating the system. Some assembly is
required before use.
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
2.2 Evalua ti on Bo ard Feat u re s
The evaluation board features are summarized below:
•CPU
— Two Dual-Core Intel Xeon processors LV capable of 667 MHz Front Side Bus
— On-board processor voltage regulators compatible with EmVRM11 Design Guide
®
•Intel
•System I/O
• ITP-XDP debug port
• Port 80 7-segment LEDs
• Board Form Factor - 13.3” x 14” for benchtop use
E7520 MCH and Intel® 6300ESB ICH
— Supports three PCI Express x8 slots
— Four DDR2–400 DIMMs on two channels (8 slots total)
— From 6300ESB
1 PCI 2.2 32/33 Slot
2 PCI-X 66 MHz slots
1 IDE connector
2 Serial ATA connectors
2 Serial ports
4 USB 2.0 po rt s
— Super I/O via LPC bus from the 6300ESB
1 Flopp y po rt
1 Parallel port
1 Serial port
1 PS/2 por t
2.3 Included Hardware
The following hardware is included in the Development Kit:
• Two Dual-Core Intel Xeon processors LV capable of 667 MHz Front Side Bus
• Two CPU heatsinks (pre-installed)
•One ATX Power Supply
• Pre -inst alled jum per s
• Two 512 Mbytes DDR2-400 DIMMs
• Unformatted SATA Hard Drive
•SATA cable
• Intel Network Interface Card
• Standoffs for board
• FWH mounted and flashed with the BIOS
2.4 Software Key Features
The software in the Development Kit was chosen to facilitate development of real-time
applicati ons base d on th e com pone nts use d in the ev a lu ation boar d. The so ftwa re tools
included are described in this section.
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Drivers included:
Windows
Chipset INF Install Utility version 7.0.0.1019
Optional Intel 6300ESB ICH chipset driver updates
Linux Driver Packages
RedHat* Enterprise Linux 3.0 Server driver updates
Note: Software in the kit is provided free by the vendor and is only licensed for evaluation
purposes.
Refer to the documentation in your Development Kit for further details on any terms
and conditions that may be applicable to the granted licenses. Customers using tools
that work with other third party products must have licensed those products. Any
targets created by those tools should also have appropriate licenses. Software included
in the kit is subject to change.
Refer to http://developer.intel.com/design/intarch/devkits for details on additional
software from other third party vendors.
2.4.1 AMIBIOS* for the Development Kit
The evaluation board is pre-installed and licensed with a copy of AMIBIOS* from
American Megatrends*.
2.5 Before You Begin
Table 2 presents the additional hardware you may need for your Development Kit.
Warning: Do not install the power supply until all other installation steps have been completed.
Table 2. Additional Hardware
VGA Card and Monitor You can use any st and ar d VGA or greater reso luti on monitor us ing a VGA card.
Keyboard You can use a keyboard with a PS/2 style connector or adapter as well as USB.
Mouse You can use a mouse with a PS/2 style connector or adapter as well as USB.
Hard Drives You can connect up to two IDE and two SATA devices to the evaluation board.
Floppy Drive
(optional)
Other Devices and
Adapters
You can connect a floppy drive to the connector on the evaluation board. No floppy
drives or cables are included in the Development Kit.
The evaluation board behaves much like a standard PC motherboard. Many PCcompatible peripherals can be attached and configured to work with the evaluation
board. For example, you may want to install a sound card or additional network
adapters. You are responsible for procuring and installing any drivers required for
additional devices.
2.6 Setting up the Evaluation Board
Once you have gathered the hardware described in Section 2.5, follow the steps below
to set up your Development Kit. This manual assumes you are familiar with basic
concepts involved with installing and configuring hardware for a PC or server system.
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Figure 1. Board before Installing Additional Hardware
2.6.1 Safety
Ensure a safe wor k envi r on ment. Make sure you are in a static-free environment
before removing any components from their anti-static packaging. The evaluation
board is susceptible to electrostatic discharge, which may cause product failure or
unpredictable operation.
Caution: Connecting the wrong cable or reversing a cable may damage the evaluation board and
may damage the device being connected. Since the board is not in a protective chassis,
use caution when connecting cables to this product.
Note: Review the document provided with the Development Kit titled “Important Safety and
Regul atory In formati on”. This document contains a dditi on safet y warnin gs and ca utions
that must be observed when using this development kit.
2.6.2 Packag e Contents
Verify kit contents. Inspect the c ontents of y our kit, and ensure that everyt hing li sted
in Section 2.3 is included. Check for damage that may have occurred during shipment.
Contact your sales representative if any items are missing or damaged.
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Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Check jumper settings. Verify that the jumpers are set in their default state. Refer to
Section 6.4 for detailed descriptions of all jumpers and their default settings indicated
in bold.
2.6.3 Instal led Hardware
Verify installed hardware. Make sure the following hardware is populated on your
evaluation board:
• Two Dual-Core Intel Xeon processors LV with heatsinks
•BIOS FWH
• Battery in holder
Note: The CPU sockets have a screw locking mechanism. The socket has an indication to
show if the CPU is locked in place.
Caution: The above hardware should have been correctly installed at the factory. If components
are not installed correctly, DO NOT power on the board. Correctly re-install the
components before proceeding. If you suspect that any of the kit components have
been damaged, contact your Intel field sales representative or local distributor for
assistance.
2.6.4 Installing the Heatsinks for CPU(s) and MCH
Heatsink Installation: In order for t h e bo ar d t o o pe r at e pro p er l y, a he atsink must b e
installed o n th e pr oce ssor s and on the E7 520 M CH. DO NOT powe r on bo ar d wi t h out a
CPU thermal solution. Heatsinks may already come pre-installed on both CPU(s) and
MCH. Please refer to this section if you need to remove or re-install the heatsinks.
Tools Needed: Flat head screwdriver and Phillips head screwdriver
Consumable Items Needed: Dispos ab le tow els and iso p ropy l alco h ol
Note: CPU heatsinks may be silver or copper in color.
Table 3. H eatsink Information
Component
®
Dual-Core Intel
®
Xeon
processor LV
E7520 MCH 1 Co o ler Master ECB-000208-0 1 Active heats ink
Quantity Per
Board
2 Cooler Master* P/N EEP-N41CS-I1-GP
Heatsink
Manufacturer
Part Number Comments
Active heatsink +
back plate
April 2007 User’s Manual
Order Nu mber: 311274 - 00 9 15
Dual-Core Intel® Xeon® processor LV with Intel® E7520 Chipset and Intel® 6300ESB ICH
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Figure 2. Location for the CPU and MC H for He atsink Installation
Caution: Applying excess pressure may cause damage to the CPU.
Note: Do not turn power on until the CPU thermal solution has been installed.
2.6.5 CPU Heatsink Installation
This section details how to install the CPU heatsink. This section may not apply if the
CPU heatsink is pre-installed on the board.
Note: If the Thermal Interface Material (TIM) is scratched, scrape it off and replace with new
material. If a replacement is needed, use a TIM with high thermal conductivity such as
thermal grease or a phase change material. The gasket ensures the heatsink is sitting
flat on the package.
®
Dual-Core Intel
User’s Manual April 2007
16 Order Nu mber: 311274 - 00 9
Xeon® processor LV with Intel® E7520 C hipset and Intel® 6300ESB ICH
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
Figure 3. CPU Heatsi n k To p an d Bo tto m V i ew
1. Make certain that the processor is firmly seated in the socket, and the package is
secured using a flathead screwdriver. Note: This shows CPU1 populated. However
for single CPU operation socket 0 should be populated.
Figure 4. Processor in Socket and Package Secured
z
April 2007 User’s Manual
Order Nu mber: 311274 - 00 9 17
Dual-Core Intel® Xeon® processor LV with Intel® E7520 Chipset and Intel® 6300ESB ICH
2. Clean the top surface of the processor die with a clean towel and isopropyl alcohol
(IPA).
Figure 5. Clean Top of Processor Die
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
®
Dual-Core Intel
User’s Manual April 2007
18 Order Nu mber: 311274 - 00 9
Xeon® processor LV with Intel® E7520 C hipset and Intel® 6300ESB ICH
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