Intel DP55WB - Media Series P55 micro-ATX Core i7 i5 LGA1156 Desktop Motherboard, BOXDP55WB Specification
Intel® Desktop Board
DP55WB
Technical Product Specification
September 2009
Order Number: E70716-001US
The Intel® Desktop Board DP55WB may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DP55WB Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP55WB Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DP55WB with BIOS
identifier WBIBX10J.86A.
Changes to this specification will be published in the Intel Desktop Board DP55WB Specification
Update before being incorporated into a revision of this document.
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®
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September 2009
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DP55WB.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DP55WB and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DP55WB
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DP55WB Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 13
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
1.6 Intel® P55 Express Chipset ............................................................... 18
1.6.1 USB ................................................................................... 18
1.6.2 SATA Interfaces ................................................................... 19
1.7 Real-Time Clock Subsystem .............................................................. 20
1.8 Audio Subsystem............................................................................. 20
1.8.1 Audio Subsystem Software .................................................... 21
1.8.2 Audio Connectors and Headers ............................................... 21
1.8.3 6-Channel (5.1) Audio Subsystem........................................... 21
1.9 LAN Subsystem ............................................................................... 22
1.9.1 Intel® 82578DC Gigabit Ethernet Controller.............................. 22
1.9.2 LAN Subsystem Software....................................................... 23
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 23
1.10 Hardware Management Subsystem .................................................... 24
1.10.1 Hardware Monitoring and Fan Control...................................... 24
1.10.2 Fan Monitoring..................................................................... 24
1.10.3 Chassis Intrusion and Detection.............................................. 24
1.10.4 Thermal Monitoring .............................................................. 25
1.11 Power Management ......................................................................... 26
1.11.1 ACPI................................................................................... 26
1.11.2 Hardware Support ................................................................ 28
1.11.3 ENERGY STAR*, E-Standby, and ErP Compliance ...................... 33
2 Technical Reference
2.1 Memory Resources .......................................................................... 35
2.1.1 Addressable Memory............................................................. 35
2.1.2 Memory Map........................................................................ 37
2.2 Connectors and Headers................................................................... 37
2.2.1 Back Panel Connectors .......................................................... 38
2.2.2 Component-side Connectors and Headers ................................ 39
2.3 Jumper Block .................................................................................. 49
2.4 Mechanical Considerations ................................................................ 51
2.4.1 Form Factor......................................................................... 51
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Intel Desktop Board DP55WB Technical Product Specification
2.5 Electrical Considerations ................................................................... 52
2.5.1 Power Supply Considerations ................................................. 52
2.5.2 Fan Header Current Capability................................................ 53
2.5.3 Add-in Board Considerations .................................................. 53
2.6 Thermal Considerations .................................................................... 53
2.7 Reliability ....................................................................................... 56
2.8 Environmental ................................................................................ 56
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 57
3.2 BIOS Flash Memory Organization ....................................................... 58
3.3 Resource Configuration .................................................................... 58
3.3.1 PCI Autoconfiguration ........................................................... 58
3.4 System Management BIOS (SMBIOS)................................................. 59
3.5 Legacy USB Support ........................................................................ 59
3.6 BIOS Updates ................................................................................. 60
3.6.1 Language Support ................................................................ 60
3.6.2 Custom Splash Screen .......................................................... 61
3.7 BIOS Recovery................................................................................ 61
3.8 Boot Options................................................................................... 62
3.8.1 CD-ROM Boot ...................................................................... 62
3.8.2 Network Boot....................................................................... 62
3.8.3 Booting Without Attached Devices........................................... 62
3.8.4 Changing the Default Boot Device During POST ........................ 62
3.9 Adjusting Boot Speed....................................................................... 63
3.9.1 Peripheral Selection and Configuration..................................... 63
3.9.2 BIOS Boot Optimizations ....................................................... 63
3.10 BIOS Security Features .................................................................... 64
3.11 BIOS Performance Features .............................................................. 65
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 67
4.2 BIOS Beep Codes ............................................................................ 67
4.3 Front-panel Power LED Blink Codes .................................................... 68
4.4 BIOS Error Messages ....................................................................... 68
4.5 Port 80h POST Codes ....................................................................... 69
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement................ 76
5.1.3 Product Ecology Statements................................................... 77
5.1.4 EMC Regulations .................................................................. 81
5.1.5 Product Certification Markings (Board Level)............................. 82
5.2 Battery Disposal Information............................................................. 83
vi
Contents
Figures
1 Major Board Components.................................................................. 11
2 Block Diagram ................................................................................ 13
3 Memory Channel and DIMM Configuration ........................................... 17
4 Back Panel Audio Connectors ............................................................ 21
5 LAN Connector LED Locations............................................................ 23
6 Thermal Sensors and Fan Headers ..................................................... 25
7 Location of the Standby Power LED .................................................... 32
8 Detailed System Memory Address Map ............................................... 36
9 Back Panel Connectors ..................................................................... 38
10 Component-side Connectors and Headers ........................................... 39
11 Connection Diagram for Front Panel Header ........................................ 45
12 Connection Diagram for Front Panel USB Headers ................................ 47
13 Connection Diagram for Front Panel USB Header (with Intel Z-U130
USB Solid-State Drive, or Compatible Device, Support)......................... 47
14 Connection Diagram for IEEE 1394a Header ........................................ 48
15 Location of the Jumper Block............................................................. 49
16 Board Dimensions ........................................................................... 51
17 Localized High Temperature Zones..................................................... 54
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. Audio Jack Support.......................................................................... 20
5. LAN Connector LED States................................................................ 23
6. Effects of Pressing the Power Switch .................................................. 26
7. Power States and Targeted System Power........................................... 27
8. Wake-up Devices and Events ............................................................ 28
9. System Memory Map ....................................................................... 37
10. Component-side Connectors and Headers Shown in Figure 10................ 40
11. IEEE 1394a Header.......................................................................... 41
12. Front Panel Audio Header for Intel HD Audio........................................ 41
13. Front Panel Audio Header for AC ’97 Audio .......................................... 41
14. SATA Connectors............................................................................. 42
15. S/PDIF Header ................................................................................ 42
16. Chassis Intrusion Header.................................................................. 42
17. Processor, Front, and Rear Chassis (4-Pin) Fan Headers....................... 42
18. Processor Core Power Connector........................................................ 43
19. Main Power Connector...................................................................... 44
20. Front Panel Header .......................................................................... 45
21. States for a One-Color Power LED...................................................... 46
22. States for a Two-Color Power LED...................................................... 46
23. BIOS Setup Configuration Jumper Settings.......................................... 50
24. Recommended Power Supply Current Values ....................................... 52
25. Fan Header Current Capability........................................................... 53
vii
Intel Desktop Board DP55WB Technical Product Specification
26. Thermal Considerations for Components ............................................. 55
27. Environmental Specifications............................................................. 56
28. BIOS Setup Program Menu Bar.......................................................... 58
29. BIOS Setup Program Function Keys.................................................... 58
30. Acceptable Drives/Media Types for BIOS Recovery ............................... 61
31. Boot Device Menu Options ................................................................ 62
32. Supervisor and User Password Functions............................................. 64
33. BIOS Beep Codes ............................................................................ 67
34. Front-panel Power LED Blink Codes.................................................... 68
35. BIOS Error Messages ....................................................................... 68
36. Port 80h POST Code Ranges.............................................................. 69
37. Port 80h POST Codes ....................................................................... 70
38. Typical Port 80h POST Sequence........................................................ 73
39. Safety Standards............................................................................. 75
40. Lead-Free Board Markings ................................................................ 80
41. EMC Regulations ............................................................................. 81
42. Product Certification Markings ........................................................... 82
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio 5.1+2-channel audio subsystem using the Realtek* ALC888-VC2-GR audio codec
Peripheral
Interfaces
BIOS
Instantly Available
PC Technology
LAN Support
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
®
• Intel
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Intel
Controller Hub (PCH)
• Fourteen USB 2.0 ports:
• Six internal Serial ATA (SATA) 3.0 Gb/s interfaces through Intel P55 Express
• Two IEEE 1394a ports:
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, and USB ports
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Ethernet Controller
Core™ i7 and Core i5 processors in an LGA1156 socket
― One PCI Express* 2.0 x16 Graphics interface
― Integrated memory controller with dual channel DDR3 memory support
memory technology
®
P55 Express Chipset consisting of the Intel
― Eight ports are implemented with stacked back panel connectors
― Six front panel ports implemented through three internal headers; one
header supports an Intel
device)
Chipset with Intel Matrix Storage Technology RAID support
― One port via a back panel connector
― One port via an internal header for front panel cabling
®
BIOS resident in the SPI Flash device
and SMBIOS
®
Z-U130 USB Solid-State Drive (or compatible
®
P55 Express Platform
®
82578DC Gigabit
continued
9
Intel Desktop Board DP55WB Technical Product Specification
Table 1. Feature Summary (continued)
Expansion
Capabilities
Hardware Monitor
Subsystem
• One PCI Express 2.0 x16 bus add-in card connector
• Two PCI Express 2.0 x1 bus add-in card connectors
• One PCI conventional bus connector
• Hardware monitoring and fan control ASIC Heceta 6P
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers using Heceta 6P fan speed control
• Three fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers front, rear, and
processor) with selectable support in BIOS for 3 wire fans
• Support for Platform Environmental Control Interface (PECI)
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP55WB.
Figure 1. Major Board Components
11
Intel Desktop Board DP55WB Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A PCI Conventional bus add-in card connector
B Front panel audio header
C PCI Express x1 bus add-in card connector
D PCI Express x1 bus add-in card connector
E PCI Express x16 bus add-in card connector
F Back panel connectors
G Rear chassis fan header
H Processor fan header
I Processor core power connector (2 x 2)
J LGA1156 processor socket
K DIMM Channel A sockets (2)
L DIMM Channel B sockets (2)
M +5 V Standby Power Indicator LED
N Main power connector (2 x 12)
O Front panel header
P Front chassis fan header
Q Battery
R Alternate front panel power LED header
S BIOS Setup configuration jumper block
T Piezo Speaker
U SATA connectors
V Front panel USB headers (3)
W Intel P55 Express Chipset
X Chassis intrusion header
Y IEEE 1394a front panel header
Z S/PDIF out header
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No serial port connector or header
• No PS/2 connectors
• No PATA connector
13
Intel Desktop Board DP55WB Technical Product Specification
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP55WB http://www.intel.com/products/motherboard/DP55WB/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board DP55WB
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://support.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://www.intel.com/products/motherboard/DP55WB/index.htm
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7 and Core i5 processors in an
LGA1156 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W Thermal Design Power (TDP). The
processors listed above are only supported when falling within the wattage
requirements of the Intel Desktop Board DP55WB. See the Intel web site listed below
for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 52 for information on power supply requirements for this board.
14
Product Description
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• Support for 1.35V Low Voltage DDR3 (New JEDEC Specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 35 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
SDRAM
Density
DIMM
Capacity Configuration
512MB SS 1 Gbit 64M x 16/empty 4
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB SS 2 Gbit 256 M x 8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x 8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
(Note)
SDRAM Organization
Front-side/Back-side
CS-025414.htm
Number of SDRAM
Devices
15
Intel Desktop Board DP55WB Technical Product Specification
1.5.1 Memory Configurations
The Intel Core i7 and Core i5 processors in the LGA1156 socket support the following
types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel P55 Express Chipset requires memory to be populated in the Channel A,
DIMM 0 socket.
For best memory performance always install memory into the blue DIMM memory
sockets if only installing two DIMMs in your configuration.
17
Intel Desktop Board DP55WB Technical Product Specification
1.6 Intel
Intel P55 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, PCI, PCIe interfaces. The
Intel P55 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P55 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
P55 Express Chipset
1.6.1 USB
The board supports up to 14 USB 2.0 ports, via two Enhanced Host Controller
Interface (EHCI) host controllers that support USB high-speed signaling. High-speed
USB 2.0 allows data transfers up to 480 Mb/s which is 40 times faster than full-speed
USB.
The Intel P55 Express Chipset provides the USB controller for all ports. The port
arrangement is as follows:
• Eight ports are implemented with stacked back panel connectors
• Six front panel ports implemented through three internal headers
All 14 USB ports are high-speed, full-speed, and low-speed capable.
NOTES
One of the front panel USB headers supports an Intel Z-U130 USB Solid-State Drive
(or compatible device).
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 38
The location of the front panel USB headers Figure 10, page 39
18
Product Description
1.6.2 SATA Interfaces
The board provides six internal SATA connectors through the Intel P55 Express
Chipset, which support one device per connector.
The Intel P55 Express Chipset provides independent SATA ports with a theoretical
maximum transfer rate of 3 Gb/s per port. One device can be installed on each port
for a maximum of six SATA devices. A point-to-point interface is used for host to
device connections, unlike Parallel ATA (PATA) IDE which supports a master/slave
configuration and two devices per channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller can operate in both legacy and native modes. In legacy
mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native
mode, standard PCI Conventional bus resource steering is used. Native mode is the
preferred mode for configurations using the Windows* XP and Windows Vista* and
Windows* 7 operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 39
.
1.6.2.1 SATA RAID
The board supports Intel Matrix Storage Technology which provides the following RAID
(Redundant Array of Independent Drives) levels via the Intel P55 Express Chipset:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also,
during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
19
Intel Desktop Board DP55WB Technical Product Specification
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
1.8 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC888-VC2-GR audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• 3-port analog audio out stack
• Internal S/PDIF out
• Windows Vista Premium and Windows 7 certification
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack
Front panel – Green Default Ctrl panel
Front panel – Pink Default
Back panel – Blue Default Ctrl panel
Back panel – Green Ctrl panel Default
Back panel – Pink Default Ctrl panel
Microphone
Head-
phones
Front
Speaker
(Main
Stereo)
Line In
Rear
Surround
(Stereo 2)
Center/Sub
(Stereo 3)
20
Product Description
1.8.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors)
• S/PDIF audio header (1 x 4-pin header)
1.8.3 6-Channel (5.1) Audio Subsystem
The 6-channel (5.1) audio subsystem includes the following:
• Intel P55 Express Chipset
• Realtek ALC888-VC2-GR audio codec
• A signal-to-noise (S/N) ratio of 97 dB
• Microphone input that supports a single dynamic, condenser, or electret
microphone
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connectors
21
Intel Desktop Board DP55WB Technical Product Specification
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 39
The signal names of the front panel audio header and S/PDIF header Section 2.2.2.1, page 41
The back panel audio connectors Section 2.2.1, page 38
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel P55 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.9.1 Intel
The Intel 82578DC Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
®
82578DC Gigabit Ethernet Controller
22
Product Description
1.9.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
23
Intel Desktop Board DP55WB Technical Product Specification
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors provided by the Hardware Monitoring
and Fan Control ASIC
• Thermal sensor in the processor, the Hardware Monitoring ASIC and a remote
thermal diode
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 V, +Vsm, and +V
to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
CCP)
1.10.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.11.2.2, page 29
1.10.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 39
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1.10.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Product Description
Item Description
A Rear chassis fan header
B Processor fan header
C Thermal diode, located on the processor die
D Hardware Monitoring ASIC
E Front chassis fan header
F Remote thermal diode
Figure 6. Thermal Sensors and Fan Headers
25
Intel Desktop Board DP55WB Technical Product Specification
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ PCI Express WAKE# signal support
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 28)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
dependi
ng on how ACPI i
s configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this
state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power switch is
pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than six seconds Fail safe power-off
Less than four seconds Wake-up
More than six seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
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